JP7434920B2 - power converter - Google Patents

Description

The disclosure described in this specification relates to a power converter device including a heat dissipation member.

A semiconductor module has a semiconductor element, a resin sealing part, an insulating member, and a conductor member. The resin sealing portion seals the semiconductor element. The surface of the resin sealing portion is covered with an insulating member. A conductor member is provided on the outer surface of the insulating member. Cooling fins are fixed to this conductor member.

Japanese Patent Application Publication No. 2013-105884

An adhesive for fixing the conductor member and the cooling fin is provided between the surface of the conductor member and the surface of the cooling fin. These two surfaces have a flat shape. Therefore, the thickness of the adhesive is uniform between the conductive member of the semiconductor module and the cooling fin. If stress concentration occurs at the end of this adhesive (heat dissipation member), there is a possibility that this end (outer circumferential portion) will be damaged.

Therefore, an object of the disclosure described in this specification is to provide a power conversion device in which the outer circumferential portion of the heat dissipation member is less likely to be damaged.

One of the disclosures is
An electronic element (320), a mounting part (340, 350) having a mounting surface (340a, 350a) on which the electronic element is mounted, and a part of the mounting part and the electronic element are sealed, and the back side of the mounting surface is sealed. an electronic module (310) comprising a sealing member (330) exposing an exposed surface (340b, 350b);
a heat dissipation member (700) provided on the module surface (310a, 310b) side of the electronic module, including the exposed surface and the main surface (330a, 330b) of the sealing member continuous with the exposed surface;
a cooling body (630) connected to the heat dissipation member in the direction in which the electronic elements and the mounting portion are lined up;
The heat dissipation member is an adhesive that adheres to the cooling surface (640a, 650b), the exposed surface, and the main surface of the cooling body,
The central portion (711, 721) of the heat dissipation member overlaps a part of the exposed surface in the arrangement direction,
In the heat dissipation member, an outer peripheral portion (712, 722) separated from the central portion in a direction orthogonal to the alignment direction overlaps the rest of the exposed surface and the main surface in the alignment direction,
The thickness of the outer peripheral part in the alignment direction is thicker than the thickness of the central part in the alignment direction,
The surface roughness of at least one of the first outer surface (712a, 722a) and the second outer surface (712b, 722b) arranged apart in the arrangement direction in the outer peripheral region is the same as that of the third outer surface arranged in a row spaced apart in the arrangement direction in the central region. The surface roughness is rougher than that of at least one of the outer surface (711a, 721a) and the fourth outer surface (711b, 721b).

According to this, the shear stress caused by the thermal expansion of the electronic module (310) and the cooling body (630) acting on the outer peripheral portion (712, 722) tends to be small because it is inversely proportional to the thickness of the heat dissipation member (700). It has become. Therefore, the outer peripheral portions (712, 722) are less likely to be damaged.

Note that the reference numbers in parentheses above merely indicate correspondence with the configurations described in the embodiments described later, and do not limit the technical scope in any way.

It is a block diagram representing an in-vehicle system. FIG. 3 is a side view of the power module. 3 is a sectional view taken along line III-III in FIG. 2. FIG. It is a sectional view for explaining a modification. It is a sectional view for explaining a modification. It is a sectional view for explaining a modification.

Hereinafter, embodiments will be described based on the drawings.

(First embodiment)
An in-vehicle system 100 provided with a power conversion device 500 will be described based on FIG. 1. The in-vehicle system 100 constitutes a system for electric vehicles. In-vehicle system 100 includes a battery 200, a power converter 500, a motor 400, and a plurality of ECUs 800.

The plurality of ECUs 800 mutually transmit and receive signals via bus wiring. The plurality of ECUs 800 cooperate to control the electric vehicle. Under the control of the plurality of ECUs 800, regeneration and power running of the motor 400 are controlled according to the SOC of the battery 200. ECU800 is an abbreviation for electronic control unit. SOC is an abbreviation for state of charge.

Battery 200 includes a plurality of secondary batteries. These plurality of secondary batteries constitute a battery stack connected in series. The SOC of this battery stack corresponds to the SOC of the battery 200. As the secondary battery, a lithium ion secondary battery, a nickel hydride secondary battery, an organic radical battery, etc. can be employed.

The inverter included in the power conversion device 500 has three or more phase legs connected in parallel between a P bus bar electrically connected to the positive electrode of the battery 200 and an N bus bar electrically connected to the negative electrode of the battery 200. It is equipped with Each phase leg includes a plurality of switch elements 320 connected in series between the P bus bar and the N bus bar. Switch element 320 corresponds to an electronic element.

Further, these plurality of switch elements 320 are sealed with a sealing member 330, and constitute a plurality of electronic modules 310 that are thin in the y direction shown in FIG. The plurality of switch elements 320 are PWM-controlled by the MGECU of the plurality of ECUs 800.

By subjecting the power conversion device 500 to PWM control, DC power supplied from the battery 200 is converted to AC power. This AC power is supplied to motor 400. Furthermore, AC power generated by the motor 400 is converted into DC power by the power conversion device 500. This DC power is supplied to the battery 200 and other in-vehicle equipment (not shown). In addition to the inverter, the power conversion device 500 may include a converter that increases or decreases the voltage level of the input DC power.

<Configuration of power converter>
Next, the configuration of power conversion device 500 will be explained. In the following, three orthogonal directions are referred to as an x direction, a y direction, and a z direction. The y direction corresponds to the alignment direction.

As shown in FIGS. 2 and 3, power conversion device 500 includes a cooler 600, a first heat radiating member 710, and a second heat radiating member 720 in addition to the circuit components described above. Although not shown, the power conversion device 500 includes a case and a board.

The electronic module 310, cooler 600, first heat radiating member 710, second heat radiating member 720, and substrate are housed in this case. The power module 300 is configured by the electronic module 310, the cooler 600, the first heat radiating member 710, and the second heat radiating member 720. Hereinafter, the first heat radiating member 710 and the second heat radiating member 720 will be collectively referred to as a heat radiating member 700 as appropriate.

<Electronic module>
The electronic module 310 includes a first mounting section 340 and a second mounting section 350 in addition to the switch element 320 and the sealing member 330 described above.

The switch element 320 has a flat shape with a thin thickness in the y direction. The switch element 320 has a first heat radiation surface 320a and a second heat radiation surface 320b spaced apart in the y direction.

The first mounting section 340 and the second mounting section 350 are made of a metal material with high thermal conductivity, such as copper or its alloy, and have a flat shape with a thin thickness in the y direction. The first mounting portion 340 has a first mounting surface 340a and a first exposed surface 340b that are spaced apart in the y direction. The second mounting portion 350 has a second mounting surface 350a and a second exposed surface 350b that are spaced apart in the y direction. Note that the first mounting section 340 and the second mounting section 350 do not need to be made of metal material.

The switch element 320 is aligned with the first mounting portion 340 in the y direction such that the first heat radiation surface 320a faces the first mounting surface 340a. The switch element 320 is aligned with the second mounting portion 350 in the y direction such that the second heat dissipation surface 320b faces the second mounting surface 350a. The switch element 320 is connected to the first mounting portion 340 and the second mounting portion 350 via solder or the like (not shown). These switch elements 320 and a portion of the first mounting section 340 and the second mounting section 350 are sealed by a sealing member 330.

The sealing member 330 is made of resin and has a flat shape with a thin thickness in the y direction while sealing the switch element 320 and a portion of the first mounting section 340 and the second mounting section 350. The sealing member 330 has a first main surface 330a and a second main surface 330b that are spaced apart in the y direction. A first exposed surface 340b is exposed from the first main surface 330a. A second exposed surface 350b is exposed from the second main surface 330b.

The electronic module 310 configured in this manner has a flat shape with a thin thickness in the y direction. The electronic module 310 has a first module surface 310a and a second module surface 310b spaced apart in the y direction. The first module surface 310a has a first exposed surface 340b and a first main surface 330a. The first exposed surface 340b is surrounded by the first main surface 330a around the y direction. The first exposed surface 340b and the first main surface 330a are flush with each other in a direction perpendicular to the y direction.

Similarly, the second module surface 310b has a second exposed surface 350b and a second main surface 330b. The second exposed surface 350b is surrounded by the second main surface 330b around the y direction. The second exposed surface 350b and the second main surface 330b are flush with each other in the direction perpendicular to the y direction.

<Cooler>
As shown in FIGS. 3 to 6, the cooler 600 has a supply pipe 610, a discharge pipe 620, and a plurality of relay pipes 630. The supply pipe 610 and the discharge pipe 620 are connected via a plurality of relay pipes 630. When the refrigerant is supplied to the supply pipe 610, the refrigerant flows from the supply pipe 610 to the discharge pipe 620 via the plurality of relay pipes 630.

The supply pipe 610, the discharge pipe 620, and the plurality of relay pipes 630 are made of a metal material with high thermal conductivity such as aluminum. The linear thermal expansion coefficients of the supply pipe 610, the discharge pipe 620, and the plurality of relay pipes 630 are larger than those of the first mounting section 340 and the second mounting section 350. The relay pipe 630 corresponds to a cooling body.

The supply pipe 610 and the discharge pipe 620 extend in the y direction. The supply pipe 610 and the discharge pipe 620 are spaced apart from each other in the x direction. Each of the plurality of relay pipes 630 extends along the x direction from the supply pipe 610 toward the discharge pipe 620. The plurality of relay pipes 630 are spaced apart from each other in the y direction.

In order to simplify the explanation below, the relay pipes 630 that are arranged next to each other will be referred to as a first relay pipe 640 and a second relay pipe 650. The first relay pipe 640 has a first cooling surface 640a facing the second relay pipe 650. The second relay pipe 650 has a second cooling surface 650b facing the first relay pipe 640.

<Power module>
As shown in FIG. 3, a gap is formed between a plurality of adjacent first relay pipes 640 and second relay pipes 650. A first heat radiating member 710 and a second heat radiating member 720 are arranged in each of these gaps together with the electronic module 310. The electronic module 310 is provided between the first relay pipe 640 and the second relay pipe 650 via the first heat radiation member 710 and the second heat radiation member 720.

The first heat radiating member 710 is provided between the first relay pipe 640 and the electronic module 310 in such a manner that it contacts the first cooling surface 640a and the first module surface 310a, respectively. The second heat radiating member 720 is provided between the second relay pipe 650 and the electronic module 310 in such a manner that it contacts the second module surface 310b and the second cooling surface 650b, respectively.

The first heat radiating member 710 and the second heat radiating member 720 are members containing a resin material such as silicone or epoxy. The first heat radiating member 710 and the second heat radiating member 720 may include a conductive filler such as alumina oxide or silver. The first heat radiating member 710 and the second heat radiating member 720 may or may not have adhesive properties. Further, the first heat radiating member 710 and the second heat radiating member 720 may or may not have curability. The first heat radiating member 710 and the second heat radiating member 720 may be gel-like.

Unintended surface irregularities are formed on the first module surface 310a, the second module surface 310b, the first cooling surface 640a, and the second cooling surface 650b. When the heat dissipation member 700 is compressed in the y direction, the heat dissipation member 700 tends to come into positive contact with the surface irregularities. Therefore, the heat generated in the electronic module 310 is easily radiated efficiently to the relay pipe 630 via the heat radiating member 700.

Further, the power module 300 is arranged in the case and spaced apart from the board in the z direction. Parts of the gate terminal and sensor terminal connected to the switch element 320 are exposed from the sealing member 330 of the electronic module 310. The above-mentioned MGECU is mounted on the board. These terminals extend toward the substrate and are electrically and mechanically connected to the substrate.

<Configuration of the first relay pipe and the second relay pipe>
The first relay pipe 640 has a first base 641 , a first peripheral portion 642 connected to the first base 641 , and a first protrusion 643 . The first base portion 641 has a flat shape with a thin thickness in the y direction. The first peripheral portion 642 extends away from the end of the first base portion 641 in an orthogonal direction perpendicular to the y direction. The first protrusion 643 extends from the first base 641 toward the electronic module 310 in the y direction.

The first peripheral portion 642 has a first parallel surface 642a spaced apart from the first module surface 310a in the y direction. The first protrusion 643 has a second parallel surface 643a arranged in the y direction on the first module surface 310a, and a first connection surface 643b that connects the first parallel surface 642a and the second parallel surface 643a. The first parallel surface 642a, the second parallel surface 643a, and the first connection surface 643b constitute a first cooling surface 640a. In FIGS. 3 to 6, the boundary between the first base portion 641 and the first peripheral portion 642 is shown by a broken line. Further, in FIGS. 3 and 4, the boundary between the first base portion 641 and the first protrusion portion 643 is shown by a chain line.

Similarly, the second relay pipe 650 has a second base 651 , a second peripheral portion 652 connected to the second base 651 , and a second protrusion 653 . The second base portion 651 has a flat shape with a thin thickness in the y direction. The second peripheral portion 652 extends away from the end of the second base portion 651 in a direction perpendicular to the y direction. The second protrusion 653 extends from the second base 651 toward the electronic module 310 in the y direction.

The second peripheral portion 652 has the second module surface 310b and a third parallel surface 652b that is spaced apart and lined up in the y direction. The second protruding portion 653 has a fourth parallel surface 653b lined up in the y direction on the second module surface 310b, and a second connecting surface 653c that connects the third parallel surface 652b and the fourth parallel surface 653b. The third parallel surface 652b, the fourth parallel surface 653b, and the second connection surface 653c constitute a second cooling surface 650b. In FIGS. 3 to 6, the boundary between the second base portion 651 and the second peripheral portion 652 is shown by a broken line. Further, in FIGS. 3 and 4, the boundary between the second base portion 651 and the second protrusion portion 653 is shown by a chain line.

<Parallel surface and module surface>
As shown in FIG. 3, the first module surface 310a is spaced apart from the first parallel surface 642a and the second parallel surface 643a in the y direction. The distance in the y direction between the first parallel surface 642a and the first module surface 310a is longer than the distance in the y direction between the second parallel surface 643a and the first module surface 310a.

Similarly, the second module surface 310b is spaced apart from the third parallel surface 652b and the fourth parallel surface 653b in the y direction. The distance in the y direction between the third parallel surface 652b and the second module surface 310b is longer than the distance in the y direction between the fourth parallel surface 653b and the second module surface 310b.

<Thickness of heat dissipation member>
As described above, the first heat radiating member 710 is provided between the first relay pipe 640 and the electronic module 310 in such a manner that it contacts the first cooling surface 640a and the first module surface 310a. Hereinafter, in order to simplify the explanation, a portion of the first heat radiating member 710 between the first parallel surface 642a and the first module surface 310a will be referred to as a first outer peripheral portion 712. A portion of the first heat radiating member 710 between the second parallel surface 643a and the first module surface 310a is referred to as a first central portion 711. In FIGS. 3 and 4, the boundary between the first central portion 711 and the first outer peripheral portion 712 is shown by a broken line.

The thickness of the first outer peripheral portion 712 in the y direction is greater than the thickness of the first central portion 711 in the y direction.

Similarly, the second heat dissipation member 720 is provided between the second relay pipe 650 and the electronic module 310 in such a manner that it contacts the second cooling surface 650b and the second module surface 310b. A portion of the second heat radiating member 720 between the third parallel surface 652b and the second cooling surface 650b is referred to as a second outer peripheral portion 722. A portion of the second heat radiating member 720 between the fourth parallel surface 653b and the second cooling surface 650b is referred to as a second central portion 721. In FIGS. 3 and 4, the boundary between the second central portion 721 and the second outer peripheral portion 722 is shown by a broken line.

The thickness of the second outer peripheral portion 722 in the y direction is greater than the thickness of the second central portion 721 in the y direction.

Note that the distance between the ends of the first exposed surface 340b in the direction perpendicular to the y direction may be shorter than the distance between the ends of the second parallel surface 643a in the direction perpendicular to the y direction. Similarly, the distance between the ends of the second exposed surface 350b in the direction perpendicular to the y direction may be shorter than the distance between the ends of the fourth parallel surface 653b in the direction perpendicular to the y direction.

<Effect>
As described above, the first heat dissipation member 710 is provided between the first relay pipe 640 and the electronic module 310 in such a manner that it contacts the first cooling surface 640a and the first module surface 310a, respectively. The first cooling surface 640a is made of a metal material with high thermal conductivity such as aluminum. The first module surface 310a is made of a metal material with high thermal conductivity, such as copper or its alloy, and a resin material. The linear thermal expansion coefficients of the first relay pipe 640 and the electronic module 310 are different. Therefore, shear stress is generated in the first heat radiating member 710 due to the difference in linear thermal expansion coefficient between the first relay pipe 640 and the electronic module 310.

In particular, the first exposed surface 340b is exposed from the first main surface 330a of the first module surface 310a. The linear thermal expansion coefficient of the first mounting portion 340 including the first exposed surface 340b is smaller than that of the first relay pipe 640 including the first cooling surface 640a. Therefore, shear stress is likely to occur in the first heat dissipation member 710 due to the difference in linear thermal expansion coefficients between the first relay pipe 640 and the first mounting portion 340. The amount of change during thermal expansion is larger in the outer peripheral region than in the central region, and stress concentration is more likely to occur in the outer peripheral region. Therefore, the shear stress at the outer circumferential portion tends to be larger than the shear stress at the central portion.

However, as described above, the thickness of the first outer peripheral portion 712 in the y direction is thicker than the thickness of the first central portion 711 in the y direction. The magnitude of the shear stress has a property that it is inversely proportional to the thickness of the first heat dissipating member 710 in the y direction. Therefore, the shear stress in the first outer circumferential portion 712 tends to be reduced. The first outer peripheral portion 712 is less likely to be damaged.

When the first heat dissipation member 710 is a gel-like member that does not have adhesive properties, the first outer circumferential portion 712 is less likely to leak out from between the first module surface 310a and the first cooling surface 640a. When the first heat dissipation member 710 is a member having adhesive properties, the first outer peripheral portion 712 is difficult to be separated from the first module surface 310a and the first cooling surface 640a.

Further, the thickness of the first central portion 711 in the y direction is thinner than the thickness of the first outer peripheral portion 712 in the y direction. The thermal resistance of the first central portion 711 is lower than the thermal resistance of the first outer peripheral portion 712. Heat is dissipated more easily in the first base portion 641 where the first central portion 711 is provided than in the first peripheral portion 642 where the first outer peripheral portion 712 is provided.

Note that the second heat radiating member 720 also has the same effects as the first heat radiating member 710, so its description will be omitted.

Although the preferred embodiments of the present disclosure have been described above, the present disclosure is not limited to the embodiments described above, and can be implemented with various modifications within the scope of the gist of the present disclosure.

(First modification)
As shown in FIG. 4, there may be a difference in surface roughness between the first parallel surface 642a and the second parallel surface 643a. For example, the first peripheral portion 642 may be anodized, and an anodized film may be formed on the first parallel surface 642a. An anodic oxide film is an oxide film that is formed on an anode when a metal is used as an anode and a current is passed through an aqueous solution containing an electrolyte. When the first peripheral portion 642 is anodized, an oxide film having minute pores is formed on the first parallel surface 642a. That is, an uneven shape is intentionally formed on the surface of the first parallel surface 642a. In addition, an uneven shape may be formed on the surface by laser processing, shot blasting, etc. without forming an anodic oxide film on the first parallel surface 642a.

Due to this uneven shape, the surface roughness of the first parallel surface 642a is larger than the surface roughness of the second parallel surface 643a. The surface roughness of the first opposing surface 712a in contact with the first parallel surface 642a of the first heat dissipating member 710 is greater than the surface roughness of the third opposing surface 711a in contact with the second parallel surface 643a.

The contact area per unit area of the first opposing surface 712a with the first parallel surface 642a is larger than the contact area per unit area of the third opposing surface 711a with the second parallel surface 643a. Therefore, the first outer circumferential portion 712 is difficult to separate from the first circumferential edge portion 642. Further, since the contact area per unit area with the first parallel surface 642a is increased, heat is easily dissipated at the first peripheral edge portion 642.

Further, although not shown, the uneven shape may not be formed on the surface of the first parallel surface 642a, but an uneven shape may be formed on a portion of the first module surface 310a that faces the first parallel surface 642a in the y direction. In that case, the surface roughness of the second facing surface 712b facing the first facing surface 712a in the y direction may be greater than the surface roughness of the fourth facing surface 711b facing the third facing surface 711a in the y direction. . The first outer peripheral portion 712 is difficult to separate from the electronic module 310.

Note that the surface roughness of the third parallel surface 652b is greater than the surface roughness of the fourth parallel surface 653b because an uneven shape is formed on the third parallel surface 652b by an anodic oxide film, laser processing, shot blasting, etc. Good too. In this case, the surface roughness of the fifth opposing surface 722a in contact with the third parallel surface 652b of the second heat radiating member 720 is greater than the surface roughness of the seventh opposing surface 721a in contact with the fourth parallel surface 653b.

The contact area per unit area of the fifth opposing surface 722a with the third parallel surface 652b is larger than the contact area per unit area of the seventh opposing surface 721a with the fourth parallel surface 653b. Therefore, the second outer circumferential portion 722 is difficult to separate from the second circumferential edge portion 652. Furthermore, since the contact area per unit area with the third parallel surface 652b is increased, heat is easily dissipated at the second peripheral edge portion 652.

Further, although not shown, the uneven shape may not be formed on the surface of the third parallel surface 652b, but the uneven shape may be formed on a portion of the second module surface 310b that faces the third parallel surface 652b in the y direction. In that case, the surface roughness of the sixth opposing surface 722b facing the fifth opposing surface 722a in the y direction may be greater than the surface roughness of the eighth opposing surface 721b facing the seventh opposing surface 721a in the y direction. . The second outer peripheral portion 722 is difficult to separate from the electronic module 310.

Note that the first opposing surface 712a and the fifth opposing surface 722a correspond to the first outer surface. The second opposing surface 712b and the sixth opposing surface 722b correspond to the second outer surface. The third opposing surface 711a and the seventh opposing surface 721a correspond to the third outer surface. The fourth opposing surface 711b and the eighth opposing surface 721b correspond to the fourth outer surface.

(Second modification)
The first outer peripheral portion 712 and the first central portion 711 may have different material compositions. Thereby, the thermal resistance of the first central portion 711 may be lower than the thermal resistance of the first outer peripheral portion 712. For example, the first central portion 711 may include a conductive filler using silver or the like. By including the metal member in the first central portion 711, heat is more easily dissipated in the first central portion 711 more effectively than in the first outer circumferential portion 712. The first outer peripheral portion 712 may include an insulating filler.

Similarly, the thermal resistance of the second central portion 721 may be lower than the thermal resistance of the second outer peripheral portion 722. The second central portion 721 may include a conductive filler using silver or the like. The second outer peripheral portion 722 may include an insulating filler. This allows heat to be dissipated more effectively in the second central portion 721 than in the second outer peripheral portion 722.

Although not shown, an uneven shape may be formed on the first parallel surface 642a. Similarly, an uneven shape may be formed on the third parallel surface 652b.

(Third modification)
As shown in FIG. 5, the first mounting portion 340 may have a first convex portion 341 that locally protrudes in the y direction from the first exposed surface 340b side. The first exposed surface 340b of the first convex portion 341 is flush with the first convex surface 340c at the tip of the first convex portion 341, the first main exposed surface 340d flush with the first principal surface 330a, and the first convex surface 340c and the first main exposed surface 340c. It is divided into a first convex connecting surface 340e that connects the surface 340d.

In that case, the first relay pipe 640 has a first base portion 641 and a first peripheral portion 642. The first base portion 641 and the first peripheral portion 642 are flush with each other in a direction perpendicular to the y direction. A first parallel surface 642a of the first peripheral portion 642 and a fifth parallel surface 641a of the first base portion 641 on the first convex portion 341 side are connected to form a first cooling surface 640a.

The separation distance in the y direction between the first cooling surface 640a and the first integrated surface 310c where the first main exposed surface 340d and the first main surface 330a are integrated is the distance between the first convex surface 340c and the first cooling surface 640a in the y direction. It is longer than the separation distance in the direction. As a result, the thickness in the y direction between the first integrated surface 310c and the first cooling surface 640a in the first heat radiating member 710 is the same as the thickness in the y direction between the first convex surface 340c and the first cooling surface 640a in the first heat radiating member 710. It is thicker than the thickness in the y direction.

Similarly, the second mounting portion 350 may have a second convex portion 351 that locally protrudes in the y direction from the second exposed surface 350b side. The second exposed surface 350b of the second convex portion 351 is flush with the second convex surface 350c at the tip of the second convex portion 351, the second main exposed surface 350d flush with the second main surface 330b, and the second convex surface 350c and the second main exposed surface 350b. It is divided into a second convex connecting surface 350e that connects the surface 350d.

In that case, the second relay pipe 650 has a second base portion 651 and a second peripheral portion 652. The second base portion 651 and the second peripheral portion 652 are flush with each other in a direction perpendicular to the y direction. The third parallel surface 652b of the second peripheral portion 652 and the sixth parallel surface 651b on the second convex portion 351 side of the second base portion 651 are connected to form a second cooling surface 650b.

The separation distance in the y direction between the second integrated surface 310d where the second main exposed surface 350d and the second main surface 330b are integrated and the second cooling surface 650b is the distance between the second convex surface 350c and the second cooling surface 650b in the y direction. It is longer than the separation distance in the direction. As a result, the thickness in the y direction between the second integrated surface 310d and the second cooling surface 650b in the second heat radiating member 720 is the same as the thickness in the y direction between the second convex surface 350c and the second cooling surface 650b in the second heat radiating member 720. It is thicker than the thickness in the y direction.

Note that although not shown, an uneven shape may be formed on the first integrated surface 310c. Similarly, an uneven shape may be formed on the second integrated surface 310d. The uneven shape does not need to be formed on the entire surface of the first integrated surface 310c and the second integrated surface 310d.

Further, the first heat dissipating member 710 interposed between the first convex surface 340c and the first cooling surface 640a and the second heat dissipating member 720 interposed between the second convex surface 350c and the second cooling surface 650b are each made of silver or the like. A conductive filler using a conductive filler may be included. Either the first heat radiating member 710 interposed between the first convex surface 340c and the first cooling surface 640a or the second heat radiating member 720 interposed between the second convex surface 350c and the second cooling surface 650b. A conductive filler may be included.

(Fourth modification)
As shown in FIG. 6, the sealing member 330 may have a first recess 342 that is recessed from the first mounting part 340 side to the second mounting part 350 side at the end side in the orthogonal direction perpendicular to the y direction. The first main surface 330a has a first concave outer surface 340g, a first concave surface 340f, and a first concave outer surface 340g flush with the first concave surface 340f and the first exposed surface 340b of the first concave portion 342. It is divided into a first concave connecting surface 340h.

In that case, the first relay pipe 640 has a configuration similar to that described in the third modification. The distance between the first concave surface 340f on the surface of the first concave portion 342 and the first cooling surface 640a is the same as that between the third integrated surface 310e where the first concave outer surface 340g and the first exposed surface 340b are integrated, and the first cooling surface 640a. The distance between the surface 640a and the surface 640a is longer. As a result, the thickness in the y direction between the first concave surface 340f and the first cooling surface 640a in the first heat dissipation member 710 is greater than the thickness in the y direction between the third integrated surface 310e and the first cooling surface 640a. It's getting thicker.

Similarly, the sealing member 330 may have a second recess 352 recessed from the second mounting part 350 side to the first mounting part 340 side at the end side in the orthogonal direction perpendicular to the y direction. Due to the second recess 352, the second main surface 330b has a second concave outer surface 350g flush with the second concave surface 350f on the surface of the second recess 352 and the second concave outer surface 350g, which are flush with the second concave surface 350f and the second concave outer surface 350g. It is divided into a second concave connecting surface 350h.

In that case, the second relay pipe 650 has a configuration similar to that described in the third modification. The distance between the second concave surface 350f and the second cooling surface 650b on the surface of the second concave portion 352 is the same as that between the fourth integrated surface 310f where the second concave outer surface 350g and the second exposed surface 350b are integrated, and the second cooling surface 650b. The distance between the surface 650b and the surface 650b is longer. As a result, the thickness in the y direction between the second concave surface 350f and the second cooling surface 650b in the second heat radiating member 720 is greater than the thickness in the y direction between the fourth integrated surface 310f and the second cooling surface 650b. It's getting thicker.

Note that although not shown in the drawings, an uneven shape may be formed on the first concave surface 340f. Similarly, an uneven shape may be formed on the second concave surface 350f. The uneven shape does not need to be formed on the entire surface of the first concave surface 340f and the second concave surface 350f.

Also, a first heat radiating member 710 interposed between the third integrating surface 310e and the first cooling surface 640a, and a second heat radiating member 720 interposed between the fourth integrating surface 310f and the second cooling surface 650b, respectively. may contain a conductive filler using silver or the like. Either the first heat radiating member 710 interposed between the third integrating surface 310e and the first cooling surface 640a or the second heat radiating member 720 interposed between the fourth integrating surface 310f and the second cooling surface 650b. Either one may contain a conductive filler.

(Fifth modification)
Although not shown, the cooler 600 may include a supply pipe 610, a discharge pipe 620, and one relay pipe 630 connecting these. In this case, either the first module surface 310a or the second module surface 310b of the electronic module 310 comes into contact with the relay pipe 630 via the heat radiating member 700 and is actively cooled.

310... Electronic module, 320... Switch element, 330... Sealing member, 340... First mounting part, 340b... Second exposed surface, 350... Second mounting part, 350b... Second exposed surface, 630... Relay pipe, 700 ...heat dissipation member, 711...first central portion, 711a...third opposing surface, 711b...fourth opposing surface, 712...first outer peripheral portion, 712a...first opposing surface, 712b...second opposing surface, 721...second opposing surface Central portion, 721a...Seventh opposing surface, 721b...Eighth opposing surface, 722...Second outer peripheral portion, 722a...Fifth opposing surface, 722b...Sixth opposing surface

Claims (2)

an electronic element (320); a mounting part (340, 350) having a mounting surface (340a, 350a) on which the electronic element is mounted; a part of the mounting part and the electronic element being sealed; an electronic module (310) comprising a sealing member (330) that exposes the exposed surface (340b, 350b) on the back side of the surface;
a heat dissipation member (700) provided on the module surface (310a, 310b) side of the electronic module, including the exposed surface and the main surface (330a, 330b) of the sealing member continuous with the exposed surface;
a cooling body (630) connected to the heat dissipation member in the direction in which the electronic element and the mounting section are lined up;
The heat dissipation member is an adhesive that adheres to the cooling surface (640a, 650b), the exposed surface, and the main surface of the cooling body,
A central portion (711, 721) of the heat dissipation member overlaps a part of the exposed surface in the alignment direction,
An outer peripheral portion (712, 722) of the heat dissipation member that is spaced apart from the central portion in a direction orthogonal to the alignment direction overlaps the rest of the exposed surface and the main surface with respect to the alignment direction,
The thickness of the outer peripheral portion in the alignment direction is thicker than the thickness of the central portion in the alignment direction ,
The surface roughness of at least one of the first outer surface (712a, 722a) and the second outer surface (712b, 722b) which are spaced apart from each other in the arrangement direction at the outer peripheral region is spaced apart from each other in the arrangement direction at the central region. A power conversion device having a surface roughness that is rougher than at least one of a third outer surface (711a, 721a) and a fourth outer surface (711b, 721b) arranged in a row . The composition of the central portion and the composition of the outer peripheral portion are different,
The power conversion device according to claim 1, wherein a thermal resistance of the central portion is lower than a thermal resistance of the outer peripheral portion.

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