JP7423919B2 - electronic equipment - Google Patents

Description

The disclosure herein relates to electronic devices.

Patent Document 1 discloses a printed circuit board that can suppress performance deterioration of a bypass circuit and effectively remove electromagnetic noise by forming mutual inductance through magnetic coupling in power supply wiring. Here, the printed circuit board is a multilayer printed circuit board having a plurality of wiring layers. The contents of the prior art documents are incorporated by reference as explanations of technical elements in this specification.

JP 2017-34501 Publication

The structure of the prior art document discloses an example of forming mutual inductance in power wiring, but does not disclose a method of forming mutual inductance in ground wiring. Therefore, when a noise current flows to the ground side, the external power supply and circuit elements may be affected by the noise current. Further improvements in electronic devices are required in the above-mentioned respects and in other respects not mentioned.

One object of the disclosure is to provide an electronic device that can easily suppress the effects of noise current.

One electronic device disclosed herein includes an electrical load (20), an external connector (27) for conducting with an external power source, a positive electrode part (61p) on the power supply side that is conducting with the external connector, and an external connector. The power supply side negative electrode part (61n) is electrically connected to the load side negative electrode part (61n), the load side positive electrode part (62p) is electrically connected to the electrical load, the load side negative electrode part (62n) is electrically connected to the electrical load, and the load side negative electrode part (62n) is electrically connected to the electrical load. and a negative electrode side having a negative electrode side first coil part (65n, 365n) and a negative electrode side second coil part (75n, 375n) that are provided in electrical continuity with the power supply side negative electrode part and generate mutual inductance by magnetic coupling. a noise reduction section (105n, 305n); a first coil section (65p, 265p, 365p) on the positive side, which is provided in electrical continuity with the positive electrode section on the load side and the positive electrode section on the power source side, and generates mutual inductance through magnetic coupling; A positive side noise reduction section (105p, 205p, 305p) having a positive side second coil section (75p, 275p, 375p), a negative side first coil section, a negative side second coil section, and a positive side first coil section. It has a plurality of electrode layers (60, 70) in which a negative electrode side first coil portion and a negative electrode side second coil portion are provided, and the negative electrode side first coil portion and the negative electrode side second coil portion face each other with an insulating layer (55) in between. The first coil part on the positive electrode side and the second coil part on the positive electrode side are electrically connected to the multilayer substrate (50) in which the first coil part on the positive electrode side and the second coil part on the negative electrode side are stacked facing each other with an insulating layer interposed therebetween. , a negative electrode side noise conductive part (59n) that guides the noise current flowing through the load side negative electrode part to a part other than the power supply side negative electrode part, and a positive electrode side noise reduction part are provided in electrical continuity to reduce the noise current flowing through the load side positive electrode part. It is equipped with a positive noise conductive part (59p) that leads to parts other than the positive electrode part on the power supply side, and the length of the negative electrode part on the power supply side from the negative noise reduction part to the external connector is equal to It is shorter than the length of the negative electrode part on the load side, and the length of the positive electrode part on the power supply side from the positive noise reduction part to the external connector is shorter than the length of the positive electrode part on the load side from the electrical load to the positive noise reduction part. .
Another electronic device disclosed herein includes an electric load (20), an external connector (27) for electrical connection with an external power source, a power supply side positive electrode part (61p) electrically connected to the external connector, The power supply side negative electrode part (61n) is connected to the external connector, the load side positive electrode part (62p) is connected to the electric load, the load side negative electrode part (62n) is connected to the electric load, and the load side negative electrode part (62n) is connected to the electric load. It has a negative pole side first coil part (65n, 365n) and a negative pole side second coil part (75n, 375n) that are provided in electrical continuity with the negative pole part and the power supply side negative pole part and generate mutual inductance by magnetic coupling. A first coil section (65p, 265p, 365p) is provided to be electrically connected to the negative side noise reduction section (105n, 305n), the load side positive section, and the power source side positive section, and generates mutual inductance through magnetic coupling. ) and a positive-side second coil section (75p, 275p, 375p); It has a plurality of electrode layers (60, 70) in which a coil portion and a second positive coil portion are provided, and the first coil portion on the negative side and the second coil portion on the negative side sandwich an insulating layer (55). The multilayer substrate (50) is electrically connected to the negative noise reduction section and the multilayer substrate (50), in which the first coil section on the positive electrode side and the second coil section on the positive electrode side are stacked facing each other with an insulating layer in between. A negative electrode side noise conductive part (59n) is provided to conduct the noise current flowing through the load side negative electrode part to a part other than the power supply side negative electrode part, and a negative electrode side noise conductive part (59n) is provided to conduct with the positive electrode side noise reduction part to conduct the noise current flowing through the load side positive electrode part. A positive noise conducting part (59p) that guides current to a part other than the positive electrode part on the power supply side, a negative noise conducting part including a negative grounding capacitor (56n), and a positive noise conducting part having a positive electrode side grounding. The mutual inductance of the negative side noise reduction section is larger than the equivalent series inductance of the negative side grounded capacitor, and the mutual inductance of the positive side noise reduction section is greater than the equivalent series inductance of the positive side grounded capacitor. It's also big.
Yet another electronic device disclosed herein includes an electric load (20), an external connector (27) for conducting with an external power source, and a positive electrode part (61p) on the power source side that is conducting with the external connector. , the power supply side negative electrode part (61n) which is electrically connected to the external connector, the load side positive electrode part (62p) which is electrically connected to the electrical load, the load side negative electrode part (62n) which is electrically electrically connected to the electrical load, and the load side negative electrode part (62n) which is electrically connected to the electrical load. A negative electrode side first coil portion (65n, 365n) and a negative electrode side second coil portion (75n, 375n) are provided in electrical continuity with the side negative electrode portion and the power source side negative electrode portion and generate mutual inductance through magnetic coupling. a negative-side noise reduction section (105n, 305n) having a negative-side noise reduction section (105n, 305n), a positive-side first coil section (65p, 265p, 365p) and a positive-side second coil section (75p, 275p, 375p); a negative-side first coil section, a negative-side second coil section, and a positive-side second coil section; It has a plurality of electrode layers (60, 70) in which a first coil section and a second positive coil section are provided, and the first coil section on the negative side and the second coil section on the negative side have an insulating layer (55). A multilayer substrate (50) which faces each other and is laminated with a first positive coil part and a second positive coil part facing each other with an insulating layer in between is electrically connected to the negative noise reduction part. A negative electrode side noise conductive part (59n) is provided to conduct the noise current flowing through the load side negative electrode part to a part other than the power supply side negative electrode part, and is provided to be electrically connected to the positive electrode side noise reduction part, so that the noise current flows through the load side positive electrode part. The multilayer board includes a first coil layer on which a negative first coil section and a first positive coil section are provided. (60), a second coil layer (70) in which a negative electrode side second coil part and a positive electrode side second coil part are provided, and a large negative electrode part (82n) having a larger area than the load side negative electrode part. The first coil layer has a power-side positive electrode part, a power-side negative electrode part, a load-side positive electrode part, and a load-side negative electrode part, and the large negative electrode part has a load-side negative electrode part. It is electrically connected to the negative electrode part, but not electrically connected to the negative electrode part on the power supply side .

According to the disclosed electronic device, the negative electrode side noise conductive portion is provided in electrical continuity with the negative electrode side noise reduction portion and guides the noise current flowing through the load side negative electrode portion to a portion other than the power source side negative electrode portion. Furthermore, the positive electrode side noise conductive portion is provided in electrical continuity with the positive electrode side noise reduction portion and guides the noise current flowing through the load side positive electrode portion to a portion other than the power source side positive electrode portion. Therefore, the noise current flowing through the negative electrode part on the load side is suppressed from propagating to the negative electrode part on the power supply side and affecting the power supply side, and the noise current flowing through the positive electrode part on the load side is prevented from propagating to the positive electrode part on the power supply side. It is possible to suppress the influence on the power supply side. Therefore, it is possible to provide an electronic device that can easily suppress the influence of noise current.

The multiple aspects disclosed in this specification employ different technical means to achieve their respective objectives. The claims and the reference numerals in parentheses described in this section exemplarily indicate correspondence with parts of the embodiment described later, and are not intended to limit the technical scope. The objects, features, and advantages disclosed in this specification will become more apparent by reference to the subsequent detailed description and accompanying drawings.

FIG. 1 is an exploded perspective view showing the configuration of an electronic device. FIG. 3 is a plan view showing the configuration of a first coil layer. It is a top view which shows the structure of a 2nd coil layer. FIG. 2 is a plan view showing the configuration of a large negative electrode layer. FIG. 3 is a plan view showing the configuration of a signal line layer. FIG. 2 is a side view showing the configuration of a multilayer board. FIG. 2 is an exploded perspective view showing the configuration of a multilayer board. FIG. 2 is a circuit diagram showing an equivalent circuit of a multilayer board. FIG. 3 is a diagram showing changes in S-parameters with respect to the frequency of noise current. FIG. 7 is a circuit diagram showing an equivalent circuit of a multilayer board in a second embodiment. FIG. 7 is a circuit diagram showing an equivalent circuit of a multilayer board in a third embodiment.

A plurality of embodiments will be described with reference to the drawings. In embodiments, functionally and/or structurally corresponding and/or related parts may be provided with the same reference numerals or with reference numerals that differ by hundreds or more. Descriptions of other embodiments can be referred to for corresponding and/or related parts. In the following, three mutually orthogonal directions are referred to as an X direction, a Y direction, and a Z direction.

First Embodiment An electronic device 1 is a device that includes a load and a circuit for electrically controlling the load. The electronic device 1 is, for example, a mechanically and electrically integrated rotating electric machine device in which a motor as a driving component and a control board for electrically controlling the motor are integrally configured. In the following, a case where the electronic device 1 is a mechanical and electrical integrated rotating electric machine device will be described as an example.

In FIG. 1, the electronic device 1 includes a motor device 20, a storage case 40, and a multilayer board 50. The motor device 20 is a brushless motor including a rotor 21, a stator 22, a shaft 23, and a center piece 25. The rotor 21 includes a plurality of permanent magnets and a magnet holding section that holds the permanent magnets. At least a portion of the rotor 21 is made of metal. The plurality of permanent magnets have a substantially annular shape as a whole. The stator 22 includes a stator winding and a winding holding portion that holds the stator winding. At least a portion of the stator 22 is made of metal.

The rotor 21 and stator 22 are arranged such that the permanent magnets and stator windings face each other with a predetermined air gap in between. The motor device 20 is an outer rotor type motor in which a rotor 21 is located outside a stator 22. However, as the motor device 20, an inner rotor type motor may be adopted. Rotor 21 provides an example of a load metal part. Stator 22 provides an example of a load metal part. Motor device 20 provides an example of an electrical load.

The shaft 23 is a component that forms a rotation axis when the rotor 21 rotates. The rotor 21 and the stator 22 are coaxial components with the shaft 23 as an axis. The external connector 27 is a terminal for connecting the multilayer board 50 and an external power source. The external connector 27 has two terminals, a positive electrode and a negative electrode. External connector 27 is also called a connector terminal.

The center piece 25 is a metal plate-shaped component. However, instead of the center piece 25 being entirely made of metal, a portion thereof may be made of a non-metal material such as resin. The centerpiece 25 is a component for fixing the rotor 21, stator 22, shaft 23, and external connector 27 and determining the relative positional relationship of each component. Not only the parts constituting the motor device 20 such as the rotor 21 but also the parts of the storage case 40 and the multilayer board 50 are fixed to the center piece 25. In other words, each component constituting the electronic device 1 is fixed at an appropriate position on the center piece 25, so that the relative positions of the components are maintained appropriately with the center piece 25 as a reference. Centerpiece 25 provides an example of a load metal part.

The storage case 40 is a case member for storing the multilayer board 50. The storage case 40 is a component for protecting the multilayer board 50 from foreign substances such as dust and water, and from impacts caused by external forces. The storage case 40 has a box shape in which the center portion is recessed compared to the peripheral portion. The storage case 40 is made of metal such as aluminum, for example. However, instead of the entire storage case 40 being made of metal, a part of it may be made of a non-metal material such as resin.

The multilayer board 50 is a circuit board for controlling the drive of the motor device 20. The multilayer substrate 50 has a plurality of layers formed on one substrate. The plurality of layers constituting the multilayer substrate 50 include electrode layers having various shapes of electrode patterns and electronic components mounted thereon, and an insulating layer 55 having insulation properties. The electrode pattern of the electrode layer is made of a conductive member such as copper foil.

A multilayer substrate 50 is fixed to the centerpiece 25 on the opposite side to the side on which the stator 22 and the like are fixed. Furthermore, the storage case 40 is fixed to the same side of the center piece 25 as the side to which the multilayer board 50 is fixed. In the electronic device 1 , the multilayer substrate 50 is housed inside a storage space formed by the storage case 40 and the center piece 25 . In other words, one surface of the multilayer substrate 50 faces the center piece 25, and the other surface of the multilayer substrate 50 faces the storage case 40.

In FIG. 2, the first coil layer 60 is provided with a power-side positive electrode portion 61p, a power-side negative electrode portion 61n, a load-side positive electrode portion 62p, and a load-side negative electrode portion 62n. The power source side positive electrode section 61p, the power source side negative electrode section 61n, the load side positive electrode section 62p, and the load side negative electrode section 62n are electrode patterns having high conductivity. The power source side positive electrode portion 61p and the power source side negative electrode portion 61n are connected to an external power source via an external connector 27. The load-side positive electrode portion 62p and the load-side negative electrode portion 62n are connected to the motor device 20.

The power source side positive electrode portion 61p and the power source side negative electrode portion 61n are connected via the power source side capacitor 51. The load-side positive electrode portion 62p and the load-side negative electrode portion 62n are connected via the load-side capacitor 52. The power supply side capacitor 51 and the load side capacitor 52 are electrolytic capacitors. The power supply side positive electrode part 61p and the load side positive electrode part 62p are connected via an inductance element 53.

The first coil layer 60 is provided with a negative first coil portion 65n. The negative electrode side first coil portion 65n is an electrode pattern formed in a rectangular ring shape. However, the negative electrode side first coil portion 65n does not have a perfect annular shape, and the starting end and the terminal end of the annular portion of the negative electrode side first coil portion 65n are at positions shifted from each other. It is provided. In other words, the negative electrode side first coil portion 65n is a partially interrupted annular electrode pattern.

The first coil layer 60 is provided with a positive-side first coil portion 65p. The positive electrode side first coil portion 65p is an electrode pattern formed in a rectangular ring shape. However, the positive electrode side first coil portion 65p does not have a perfect annular shape, and the starting end and the terminal end of the annular portion of the positive electrode side first coil portion 65p are at positions shifted from each other. It is provided. In other words, the positive electrode side first coil portion 65p is a partially interrupted annular electrode pattern.

The first coil layer 60 is provided with a negative noise conductive pattern 57n. The negative noise conductive pattern 57n is an electrode pattern located at a corner of the rectangular multilayer substrate 50. A fixing screw 58 is provided so as to pass through a portion where the negative noise conductive pattern 57n is formed. The fixing screw 58 is made of metal and is electrically connected to the negative noise conductive pattern 57n. The fixing screw 58 is a component for fixing the multilayer board 50 at an appropriate position with respect to the center piece 25. The fixing screws 58 are provided at each of four corners of the rectangular multilayer substrate 50.

The first coil layer 60 is provided with a positive noise conductive pattern 57p. The positive noise conductive pattern 57p is an electrode pattern located at a corner of the rectangular multilayer substrate 50. A fixing screw 58 is provided so as to pass through the portion where the positive noise conductive pattern 57p is formed. The fixing screw 58 is made of metal and is electrically connected to the positive noise conductive pattern 57p.

The negative electrode side first coil portion 65n is connected to the power source side negative electrode portion 61n. The negative first coil portion 65n is connected to the negative noise conductive pattern 57n via a negative grounded capacitor 56n. The negative-side grounded capacitor 56n causes a high-frequency component of the current flowing through the negative-side first coil portion 65n to flow through the negative-side noise conductive pattern 57n. The negative electrode side grounding capacitor 56n, the negative electrode side noise conductive pattern 57n, and the fixing screw 58 constitute a negative electrode side noise conductive portion 59n that guides the noise current to a portion other than the power source side negative electrode portion 61n.

The positive electrode side first coil portion 65p is connected to the power source side positive electrode portion 61p. The first coil portion 65p on the positive side is connected to the noise conductive pattern 57p on the positive side via the grounded capacitor 56p on the positive side. The positive-side grounded capacitor 56p causes a high-frequency component of the current flowing through the positive-side first coil portion 65p to flow through the positive-side noise conductive pattern 57p. The positive-side grounded capacitor 56p, the positive-side noise conductive pattern 57p, and the fixing screw 58 constitute a positive-side noise conductive portion 59p that guides the noise current to a portion other than the power source-side positive electrode portion 61p.

In FIG. 3, the second coil layer 70 is provided with a negative second coil portion 75n. The negative electrode side second coil portion 75n is formed in a rectangular ring shape. However, the negative electrode side second coil portion 75n does not have a perfect annular shape, and the starting end and the terminal end of the annular portion of the negative electrode side second coil portion 75n are at positions shifted from each other. It is provided. In other words, the negative electrode side second coil portion 75n is a partially interrupted annular electrode pattern. The negative electrode side second coil portion 75n is provided at a position where more than half overlaps with the negative electrode side first coil portion 65n in the stacking direction of each layer of the multilayer substrate 50.

The starting end of the negative second coil section 75n is connected to the load side negative electrode section 62n of the first coil layer 60 via a via hole. The terminal end of the second negative coil section 75n is connected to the starting end of the first negative coil section 65n of the first coil layer 60 via a via hole. In summary, the load side negative electrode section 62n and the power source side negative electrode section 61n are electrically connected via the negative electrode side second coil section 75n and the negative electrode side first coil section 65n.

The second coil layer 70 is provided with a positive-side second coil portion 75p. The positive electrode side second coil portion 75p is formed in a rectangular ring shape. However, the positive electrode side second coil portion 75p does not have a perfect annular shape, and the starting end and the terminal end of the annular portion of the positive electrode side second coil portion 75p are at positions shifted from each other. It is provided. In other words, the positive electrode side second coil portion 75p is a partially interrupted annular electrode pattern. The positive electrode side second coil portion 75p is provided at a position where more than half of the positive electrode side first coil portion 65p overlaps with the positive electrode side first coil portion 65p in the stacking direction of each layer of the multilayer substrate 50.

The starting end portion of the second positive electrode side coil portion 75p is connected to the load side positive electrode portion 62p of the first coil layer 60 via a via hole. The terminal end of the second positive coil portion 75p is connected to the starting end of the first positive coil portion 65p of the first coil layer 60 via a via hole. In summary, the load-side positive electrode section 62p and the power-side positive electrode section 61p are electrically connected via the positive-side second coil section 75p and the positive-side first coil section 65p.

The second coil layer 70 is provided with a small negative electrode portion 72n. The small negative electrode portion 72n has a rectangular electrode pattern. The small negative electrode portion 72n is electrically connected to the load side negative electrode portion 62n of the first coil layer 60 through a plurality of via holes. The area of the small negative electrode portion 72n is equal to the area of the load side negative electrode portion 62n of the first coil layer 60. The small negative electrode portion 72n is provided at a position overlapping the load side negative electrode portion 62n in the stacking direction of each layer of the multilayer substrate 50. The small negative electrode section 72n is provided at a position that does not overlap with the power supply side negative electrode section 61n, the negative electrode side first coil section 65n, and the positive electrode side first coil section 65p in the stacking direction of each layer of the multilayer substrate 50.

In FIG. 4, the large negative electrode layer 80 is provided with a large negative electrode portion 82n. The large negative electrode portion 82n is an electrode pattern with an area larger than the combined area of the two electrode patterns of the load side positive electrode portion 62p and the load side negative electrode portion 62n. The large negative electrode part 82n is provided at a position where more than half of the load side positive electrode part 62p and the load side negative electrode part 62n overlap in the stacking direction of each layer of the multilayer substrate 50. The large negative electrode portion 82n is provided at a position that does not overlap the power source side positive electrode portion 61p and the power source side negative electrode portion 61n in the stacking direction of each layer of the multilayer substrate 50. The large negative electrode part 82n overlaps the negative first coil part 65n, the negative second coil part 75n, the positive first coil part 65p, and the positive second coil part 75p in the stacking direction of each layer of the multilayer substrate 50. It is located in a position where it should not be used.

In FIG. 5, a signal line section 93 is provided in the signal line layer 90. The signal line section 93 includes, for example, a signal line for sending a signal of a transistor switching command. The signal line section 93 includes, for example, a sensor line for transmitting a signal output from a sensor used to control the electronic device 1. No via hole is provided in the signal line layer 90. In other words, the signal line layer 90 is not connected to the electrode layers of the first coil layer 60, the second coil layer 70, and the large negative electrode layer 80. However, the signal line layer 90 may be provided with via holes so as to be connected to other electrode layers. Furthermore, some signal lines may be formed in electrode layers other than the signal line layer 90. Alternatively, an electrode pattern functioning as a negative electrode, such as the large negative electrode portion 82n, may be formed on the signal line layer 90. The signal line portion 93 overlaps the negative first coil portion 65n, the negative second coil portion 75n, the positive first coil portion 65p, and the positive second coil portion 75p in the stacking direction of each layer of the multilayer substrate 50. It is located in a position where it should not be used.

In FIG. 6, the multilayer substrate 50 includes four electrode layers: a first coil layer 60, a second coil layer 70, a large negative electrode layer 80, and a signal line layer 90. The multilayer substrate 50 includes an insulating layer 55 between the four electrode layers. The insulating layer 55 is a base material with high electrical insulation. As the material constituting the insulating layer 55, a resin material such as epoxy resin, alumina, or the like can be used.

The multilayer substrate 50 has a seven-layer structure including four electrode layers and three insulating layers 55. The first electrode layer located on the surface of the multilayer substrate 50 is the first coil layer 60 . The second electrode layer is the second coil layer 70. The first coil layer 60 and the second coil layer 70 are adjacent to each other with one insulating layer 55 in between. The third electrode layer is the large negative electrode layer 80. The fourth electrode layer located on the back surface of the multilayer substrate 50 is the signal line layer 90. In other words, the signal line layer 90 is the electrode layer provided at the farthest position from the first coil layer 60. The second coil layer 70, which is the second electrode layer, and the large negative electrode layer 80, which is the third electrode layer, are inner layers formed inside the multilayer substrate 50.

The configuration of the multilayer substrate 50 is not limited to the above example. For example, the first electrode layer may be the first coil layer 60, the second electrode layer may be the large negative electrode layer 80, and the third electrode layer may be the second coil layer 70. In this case, two insulating layers 55 and a large negative electrode layer 80 are interposed between the first coil layer 60 and the second coil layer 70. Further, the multilayer substrate 50 only needs to have two or more electrode layers, and may have five or more electrode layers.

Each electrode layer is provided to overlap in the stacking direction of the multilayer substrate 50. The stacking direction of the multilayer substrate 50 corresponds to the Z direction. The fixing screws 58 penetrate the four electrode layers and the three insulating layers 55. The penetrating direction of the fixing screw 58 is the same direction as the stacking direction of the multilayer substrate 50.

In FIG. 7, electrode patterns formed on each electrode layer are shown, but electrical elements such as the inductance element 53 and parts such as the fixing screws 58 are not shown. The first negative coil section 65n and the second negative coil section 75n overlap in the stacking direction of the multilayer substrate 50. On the other hand, the negative-side first coil portion 65n does not overlap with any electrode pattern other than the negative-side second coil portion 75n. In other words, the small negative electrode part 72n, the large negative electrode part 82n, and the signal line part 93 are located at positions that avoid the projected positions of the negative electrode side first coil part 65n and the negative electrode side second coil part 75n in the stacking direction of the multilayer board 50. It is formed.

The first negative coil portion 65n and the second negative coil portion 75n create mutual inductance due to magnetic coupling. A magnetic field is generated by current flowing in the first negative coil section 65n and the second negative coil section 75n. This generated magnetic field acts strongly in the stacking direction of the multilayer substrate 50, which is the direction in which the first negative coil portion 65n and the second negative coil portion 75n overlap. If an electrode pattern is formed at the projected position of the negative first coil section 65n and the second negative coil section 75n in the stacking direction of the multilayer substrate 50, the first negative coil section 65n and the second negative coil section An induced current will flow through the electrode pattern under the influence of the magnetic field generated at the portion 75n. Therefore, by forming the electrode pattern while avoiding the projected position of the first negative coil part 65n and the second negative coil part 75n in the stacking direction of the multilayer substrate 50, the first coil part 65n of the negative electrode side and the second negative coil part 75n can be formed. The influence that the electrode pattern receives from the magnetic field generated by the second coil portion 75n can be reduced.

Similar to the negative first coil section 65n and the second negative coil section 75n, the first positive coil section 65p and the second positive coil section 75p create mutual inductance due to magnetic coupling. In order to prevent the magnetic field generated from the positive-side first coil portion 65p and the positive-side second coil portion 75p from acting strongly, the positive-side first coil portion 65p has an electrode pattern other than the positive-side second coil portion 75p. It is located in a position that does not overlap with the In other words, the small negative electrode part 72n, the large negative electrode part 82n, and the signal line part 93 are located at positions that avoid the projected positions of the positive electrode side first coil part 65p and the positive electrode side second coil part 75p in the stacking direction of the multilayer board 50. It is formed.

The small negative electrode section 72n and the large negative electrode section 82n are formed at positions that avoid the projected position of the power supply side negative electrode section 61n in the stacking direction of the multilayer substrate 50. If the large negative electrode part 82n is provided at a position overlapping the power supply side negative electrode part 61n, by forming a via hole extending to the large negative electrode layer 80 in the power supply side negative electrode part 61n, the power supply side negative electrode part 61n and the large negative electrode part 82n will be connected. In other words, both the electrode patterns of the power supply side negative electrode part 61n and the load side negative electrode part 62n can be connected to the large negative electrode part 82n. When both the electrode patterns of the power supply side negative electrode part 61n and the load side negative electrode part 62n are connected to the large negative electrode part 82n, the load side negative electrode part 62n and the power supply side negative electrode part 61n are connected to each other via the large negative electrode part 82n. is conducting. In other words, the noise current applied to the load-side negative electrode section 62n does not flow through the negative-side first coil section 65n and the negative-side second coil section 75n, but instead flows through the large-sized negative electrode section 82n and reaches the power supply-side negative electrode section 61n. It is possible.

The small negative electrode portion 72n and the large negative electrode portion 82n are formed at positions that avoid the projected position of the power source side positive electrode portion 61p in the stacking direction of the multilayer substrate 50. The small negative electrode portion 72n is formed at a position away from the projected position of the load side positive electrode portion 62p in the stacking direction of the multilayer substrate 50. The large negative electrode portion 82n is formed at a position that overlaps the projected position of the load side positive electrode portion 62p in the stacking direction of the multilayer substrate 50. However, the large negative electrode part 82n is connected only to the load side negative electrode part 62n and the small negative electrode part 72n using a plurality of via holes, and is not connected to the load side positive electrode part 62p.

In FIG. 8, an inductance element 53 is provided between the power supply side positive electrode part 61p and the load side positive electrode part 62p. A first negative coil portion 65n and a second negative coil portion 75n are provided in series between the power source negative electrode portion 61n and the load negative electrode portion 62n. The first negative coil section 65n and the second negative coil section 75n constitute a negative noise reduction section 105n. A power supply capacitor 51 is provided between the power supply positive electrode part 61p and the power supply negative electrode part 61n. A load-side capacitor 52 is provided between the load-side positive electrode portion 62p and the load-side negative electrode portion 62n. The power supply capacitor 51, the load capacitor 52, and the inductance element 53 constitute a so-called π-type filter. Thereby, a noise current with a high frequency among the currents flowing through the power source side positive electrode section 61p and the load side positive electrode section 62p can be caused to flow into the power source side negative electrode section 61n and the load side negative electrode section 62n.

The negative electrode side first coil section 65n and the negative electrode side second coil section 75n are connected to a power source side negative electrode connection point 63n, which is a connection point between the power source side capacitor 51 and the power source side negative electrode section 61n, and a load side capacitor 52 and the load side negative electrode. It is located between the load-side negative electrode connection point 64n, which is the connection point with the section 62n. By providing the negative-side first coil section 65n and the negative-side second coil section 75n between the power supply-side negative connection point 63n and the load-side negative connection point 64n, good high-frequency characteristics can be achieved. In other words, it is easier to reduce the influence of noise current more effectively than when the first negative coil section 65n and the second negative coil section 75n are provided at other locations.

The large negative electrode portion 82n is directly connected to the load side negative electrode portion 62n, but not directly connected to the power source side negative electrode portion 61n. In other words, the power supply side negative electrode section 61n and the load side negative electrode section 62n are connected via the negative electrode side noise reduction section 105n.

The negative noise conductive pattern 57n and the fixing screw 58 connect the first negative coil section 65n and the second negative coil section 75n to the ground. The negative noise conductive pattern 57n and the fixing screw 58 are part of the negative noise conductive portion 59n. The negative noise conductive portion 59n includes a negative ground capacitor 56n, a negative noise conductive pattern 57n, and a fixing screw 58. The negative noise conductive portion 59n can be expressed by connecting three components in series: a capacitance component 59nC, an inductance component 59nL, and a resistance component 59nR. Here, the capacitance component 59nC includes the capacitance of the negative electrode side grounded capacitor 56n. The inductance component 59nL includes the parasitic inductance of the negative noise conductive pattern 57n and the equivalent series inductance of the negative grounded capacitor 56n. The resistance component 59nR includes the resistance of the negative noise conductive pattern 57n, the fixing screw 58, and the equivalent series resistance of the negative grounding capacitor 56n.

The negative noise reduction section 105n generates a mutual inductance larger than the equivalent series inductance of the negative grounded capacitor 56n that constitutes the inductance component 59nL in the negative noise conductive section 59n. However, when setting the mutual inductance value, it is preferable to consider not only the equivalent series inductance of the negative-side grounded capacitor 56n but also the value of the parasitic inductance of the negative-side noise conductive pattern 57n.

When mutual inductance is formed by magnetic coupling in the negative side noise reduction section 105n, a negative inductance is generated corresponding to the mutual inductance. This negative inductance cancels out the inductance component 59nL in the negative noise conductive section 59n, thereby effectively guiding the noise current from the negative noise conductive section 59n toward the ground.

The positive electrode side first coil section 65p and the positive electrode side second coil section 75p are connected to a power source side positive electrode connection point 63p, which is a connection point between the power source side capacitor 51 and the power source side positive electrode section 61p, and a load side capacitor 52 and the load side positive electrode. It is located between the load-side positive electrode connection point 64p, which is the connection point with the section 62p. The first positive coil portion 65p and the second positive coil portion 75p are connected in parallel to the inductance element 53. By providing the positive-side first coil portion 65p and the positive-side second coil portion 75p between the power-side positive connection point 63p and the load-side positive connection point 64p, high frequency characteristics can be maintained in a good state. In other words, it is easier to reduce the influence of noise current more effectively than when the first positive coil section 65p and the second positive coil section 75p are provided at other locations.

The positive noise conductive pattern 57p and the fixing screw 58 connect the first positive coil portion 65p and the second positive coil portion 75p to the ground. The positive noise conductive pattern 57p and the fixing screw 58 are part of the positive noise conductive portion 59p. The positive noise conductive portion 59p includes a positive ground capacitor 56p, a positive noise conductive pattern 57p, and a fixing screw 58. The positive noise conductive portion 59p can be expressed by connecting three components in series: a capacitance component 59pC, an inductance component 59pL, and a resistance component 59pR. Here, the capacitance component 59pC includes the capacitance of the positive electrode side grounded capacitor 56p. The inductance component 59pL includes the parasitic inductance of the positive side noise conductive pattern 57p and the equivalent series inductance of the positive side grounded capacitor 56p. The resistance component 59pR includes the resistance of the positive noise conductive pattern 57p, the fixing screw 58, and the equivalent series resistance of the positive grounded capacitor 56p.

The positive side noise reduction section 105p generates a mutual inductance larger than the equivalent series inductance of the positive side grounded capacitor 56p that constitutes the inductance component 59pL in the positive side noise conductive section 59p. However, when setting the mutual inductance value, it is preferable to consider not only the equivalent series inductance of the positive side grounded capacitor 56p but also the value of the parasitic inductance of the positive side noise conductive pattern 57p.

When mutual inductance is formed due to magnetic coupling in the positive side noise reduction section 105p, a negative inductance is generated corresponding to the mutual inductance. This negative inductance cancels out the inductance component 59pL in the positive noise conductive portion 59p, thereby effectively guiding the noise current from the positive noise conductive portion 59p toward the ground.

In FIG. 9, the horizontal axis indicates the frequency f of the noise current in logarithmic representation, and the vertical axis indicates the S parameter Scc, which is the ratio of the input power to the output power in the noise current. Here, the S parameter Scc indicates how much power of the input noise current is output. The smaller the value of the S-parameter Scc, the less likely the input noise is to be output. When the S parameter Scc is 0, the input noise is not reduced and is output as is. In summary, the smaller the value of the S parameter Scc, the more the noise current is reduced.

In FIG. 9, the graph of this example is shown by a solid line, and the graph of the comparative example is shown by a broken line. The comparative example is an example in which only the negative noise reduction section 105n is provided and the positive noise reduction section 105p is not provided. In other words, in the comparative example, part of the noise current is propagating from the load side positive electrode part 62p to the power supply side positive electrode part 61p. In contrast, in this example, both the noise current propagating from the load side negative electrode part 62n to the power supply side negative electrode part 61n and the noise current propagating from the load side positive electrode part 62p to the power supply side positive electrode part 61p are suppressed. .

In the frequency region of 10 MHz or higher, the S parameter Scc in this example is a smaller value than in the comparative example. This indicates that in the frequency range of 10 MHz or higher, the positive side noise reduction section 105p and the positive side noise conductive section 59p effectively suppress the noise current from being propagated to the power source side positive side section 61p. ing.

Further, as the frequency of the noise current becomes higher, the value of the equivalent series inductance in the capacitor becomes larger. Therefore, by ensuring a large mutual inductance of the negative noise reduction section 105n in advance, it is possible to cope with an increase in the inductance component 59nL of the negative noise conductive section 59n as the frequency increases. This is the same on the positive side, and by ensuring a large mutual inductance of the positive side noise reduction section 105p in advance, it is possible to cope with an increase in the inductance component 59pL of the positive side noise conductive section 59p due to an increase in frequency. ing.

The frequency band of 10 MHz or higher includes a frequency band called an FM band from 76 MHz to 108 MHz, and a frequency band called a DAB band from 171 MHz to 245 MHz. Therefore, in this example, a higher noise reduction effect can be obtained than in the comparative example with respect to noise current in a frequency band including the FM band and the DAB band.

According to the embodiment described above, the first negative coil part 65n and the second negative coil part 75n are provided to be electrically connected to the negative electrode part 62n on the load side and the negative electrode part 61n on the power source side, and generate mutual inductance through magnetic coupling. It has Further, a negative noise conductive portion 59n is provided that guides the noise current flowing through the load side negative electrode portion 62n to a portion other than the power source side negative electrode portion 61n. Therefore, even if a noise current flows through the load side negative electrode section 62n, the negative electrode side noise reduction section 105n and the negative electrode side noise conductive section 59n prevent the noise current from being propagated to the power supply side negative electrode section 61n. It can be suppressed. Even if a noise current flows through the power supply side negative electrode portion 61n, it is possible to similarly prevent the noise current from propagating to the load side negative electrode portion 62n. Therefore, it is possible to provide the electronic device 1 that can suppress the influence of noise current.

The electronic device 1 includes a negative noise reduction section 105n, a negative noise conduction section 59n, a positive noise reduction section 105p, and a positive noise conduction section 59p. Therefore, it is possible to suppress the noise current of the load-side negative electrode portion 62n from propagating to the power-side negative electrode portion 61n, and to suppress the noise current of the load-side positive electrode portion 62p from propagating to the power-side positive electrode portion 61p. Therefore, it is possible to suppress the influence of noise currents on both the negative electrode side and the positive electrode side.

The length of the power supply side negative electrode section 61n from the negative electrode side noise reduction section 105n to the external connector 27 is shorter than the length of the load side negative electrode section 62n from the motor device 20 to the negative electrode side noise reduction section 105n. Therefore, the path from the noise current being reduced by the negative side noise reduction section 105n to the external power source can be shortened. In other words, it is easier to make the distance from the negative noise reduction section 105n to the external power source shorter than the distance from the negative noise reduction section 105n to the motor device 20. Therefore, it is easy to suppress the influence of noise current on the negative electrode side of the external power supply. Similarly, the length of the power supply side positive electrode section 61p from the positive electrode side noise reduction section 105p to the external connector 27 is shorter than the length of the load side positive electrode section 62p from the motor device 20 to the positive electrode side noise reduction section 105p. Therefore, the distance from the position where noise is removed to the external power source can be shortened. Therefore, it is easy to suppress the influence of noise current on the positive electrode side of the external power supply.

The negative noise conducting section 59n includes a negative grounding capacitor 56n. Therefore, a noise current having a higher frequency than a predetermined frequency can be caused to flow through the negative noise conductive pattern 57n. Similarly, the positive noise conductive section 59p includes a positive grounded capacitor 56p. Therefore, a noise current having a higher frequency than the predetermined frequency can be caused to flow through the positive noise conductive pattern 57p.

The mutual inductance of the negative noise reduction section 105n is larger than the inductance component 59nL of the negative noise conductive section 59n. In other words, the mutual inductance of the negative side noise reduction section 105n is larger than the equivalent series inductance of the negative side grounded capacitor 56n. Therefore, compared to the negative noise reduction section 105n, the negative noise conductive section 59n is more easily brought into a state where current flows easily. Therefore, it is easy to lead the noise current from the negative noise conductive portion 59n to the ground. Similarly, the mutual inductance of the positive side noise reduction section 105p is larger than the equivalent series inductance of the positive side grounded capacitor 56p. Therefore, it is easy to lead the noise current from the positive noise conductive portion 59p to the ground.

The negative electrode side noise conductive portion 59n guides the noise current flowing through the load side negative electrode portion 62n to the metal center piece 25. In other words, the negative electrode side noise conductive portion 59n guides the noise current flowing through the load side negative electrode portion 62n to the load metal portion, at least a portion of which is made of metal. Therefore, the noise current can be processed using the components of the electronic device 1. Therefore, it is easier to set the path through which the noise current flows shorter than when the noise current is caused to flow through parts other than the parts constituting the electronic device 1, such as the vehicle body. Similarly, the positive electrode side noise conductive portion 59p guides the noise current flowing through the load side positive electrode portion 62p to the metal center piece 25. Therefore, it is easier to set the path through which the noise current flows shorter than when the noise current is caused to flow through parts other than the parts constituting the electronic device 1, such as the vehicle body.

The negative electrode side noise conductive portion 59n guides the noise current flowing through the load side negative electrode portion 62n to the center piece 25 via the fixing screw 58. Therefore, the multilayer substrate 50 and the center piece 25 can be fixed by the fixing screws 58, and at the same time, the negative noise conductive pattern 57n and the center piece 25 can be electrically connected. Similarly, the positive electrode side noise conductive portion 59p guides the noise current flowing through the load side positive electrode portion 62p to the center piece 25 via the fixing screw 58. Therefore, the multilayer substrate 50 and the center piece 25 can be fixed by the fixing screws 58, and at the same time, the positive noise conductive pattern 57p and the center piece 25 can be electrically connected.

The multilayer substrate 50 includes a large negative electrode portion 82n having a larger area than the load side negative electrode portion 62n. Therefore, the large negative electrode portion 82n can ensure a large area of the electrode connected to the negative electrode of the motor device 20. In other words, the electrical resistance of the entire electrode pattern on the negative electrode side can be lowered.

The large negative electrode portion 82n is electrically connected to the load side negative electrode portion 62n, but not electrically connected to the power source side negative electrode portion 61n. Therefore, it is possible to prevent noise current from being propagated from the load side negative electrode section 62n to the power source side negative electrode section 61n via the large negative electrode section 82n.

The first coil layer 60 includes an inductance element 53, a power supply capacitor 51, and a load capacitor 52. Therefore, it is easier to more accurately suppress the flow of high-frequency noise current between the power supply side positive electrode part 61p and the load side positive electrode part 62p. In other words, the influence of the noise current on the positive side can be easily suppressed by the two noise countermeasures: the noise countermeasure using the π-type filter and the noise countermeasure using the positive side noise reduction section 105p and the positive side noise conductive section 59p.

The large negative electrode portion 82n is provided at a position that does not overlap with the power source side positive electrode portion 61p in the stacking direction of the multilayer substrate 50. Therefore, it is possible to suppress the propagation of noise caused by the coupling of the two electrode patterns of the power supply side positive electrode part 61p and the large negative electrode part 82n. In other words, crosstalk between the power supply side positive electrode part 61p and the large negative electrode part 82n can be suppressed.

The signal line portion 93 is provided at a position that does not overlap with the first negative coil portion 65n and the second negative coil portion 75n in the stacking direction of the multilayer substrate 50. Therefore, it is easy to suppress the magnetic field generated in the negative first coil section 65n and the negative second coil section 75n from having a large influence on the signal line section 93. Similarly, the signal line portion 93 is provided at a position that does not overlap with the negative first coil portion 65n and the negative second coil portion 75n in the stacking direction of the multilayer substrate 50. Therefore, it is easy to suppress the magnetic field generated in the negative first coil section 65n and the negative second coil section 75n from having a large influence on the signal line section 93.

In the multilayer substrate 50, the first coil layer 60 and the second coil layer 70 are adjacent to each other with one insulating layer 55 in between. Therefore, it is easy to shorten the distance between the first negative coil part 65n and the second negative coil part 75n, which face each other. Therefore, it is easy to reduce leakage magnetic flux in the negative noise reduction section 105n.

Second Embodiment This embodiment is a modification based on the previous embodiment. In this embodiment, the positive noise reduction section 205p is provided between the load-side positive connection point 64p and the positive terminal of the motor device 20.

In FIG. 10, the first positive coil section 265p and the second positive coil section 275p are located between the load-side positive connection point 64p and the positive terminal of the motor device 20. In other words, the positive electrode side noise reduction section 205p is provided in the load side positive electrode section 62p and is connected in series with the inductance element 53.

Third Embodiment This embodiment is a modification based on the previous embodiment. In this embodiment, the positive noise reduction section 305p is provided between the power source positive connection point 63p and the positive terminal of the external power source. Further, a negative noise reduction section 305n is provided between the power source negative connection point 63n and the negative terminal of the external power source.

In FIG. 11, the first positive coil portion 365p and the second positive coil portion 375p are located between the power source positive connection point 63p and the positive terminal of the external power source. In other words, the positive electrode side noise reduction section 305p is provided in the power source side positive electrode section 61p and is connected in series with the inductance element 53. Further, the first negative coil portion 365n and the second negative coil portion 375n are located between the power source negative connection point 63n and the negative terminal of the external power source. In other words, the negative electrode side noise reduction section 305n is provided in the power source side negative electrode section 61n.

Other Embodiments The method for guiding the noise current from the negative first coil portion 65n to the ground is not limited to the method using the fixing screw 58. For example, a contact component protruding in the stacking direction of the multilayer substrate 50 may be provided, and the negative electrode side first coil portion 65n and the storage case 40 may be electrically connected using the contact component. According to this, a noise current path can be provided in the stacking direction of the multilayer substrate 50. Therefore, the noise current can be guided to the storage case 40 from a position close to the negative first coil portion 65n. Similarly, the positive electrode side first coil portion 65p and the storage case 40 may be electrically connected using contact parts.

The method of guiding the noise current to the storage case 40 is not limited to contact parts protruding in the stacking direction of the multilayer board 50. For example, the noise current may be guided to the storage case 40 using a terminal component protruding in a direction perpendicular to the stacking direction of the multilayer board 50.

The destination to which the noise current is introduced is not limited to the load metal part such as the centerpiece 25 or the storage case 40. For example, the influence of the noise current on the electronic device 1 may be suppressed by providing a metal housing component that forms the outer wall of the electronic device 1 and guiding the noise current to this housing component. Alternatively, when the electronic device 1 is mounted on a vehicle, the influence of the noise current on the electronic device 1 may be suppressed by guiding the noise current to the body of the vehicle.

Two paths may be provided, one for guiding the noise current to the center piece 25 and the other for guiding the noise current to the storage case 40. According to this, the noise current can be guided to the ground using a plurality of paths. Therefore, even if a problem occurs in one noise current path, the noise current can be guided to the ground from the remaining noise current paths. In other words, it is easy to increase redundancy.

The negative grounding capacitor 56n and the positive grounding capacitor 56p may be omitted. In this case, the negative-side first coil portion 65n and the negative-side noise conductive pattern 57n are connected without interposing the negative-side grounded capacitor 56n. Furthermore, the negative first coil portion 65n and the negative noise conductive pattern 57n are connected without the positive grounded capacitor 56p. Thereby, the number of components mounted on the multilayer board 50 can be reduced.

The two coil parts, the negative first coil part 65n and the positive first coil part 65p, may not be formed on the same electrode layer. For example, the negative first coil section 65n is formed on the first electrode layer located on the front side of the multilayer substrate 50, and the positive first coil section 65p is formed on the final electrode layer located on the back side of the multilayer substrate 50. It may also be formed. Moreover, the two coil parts, the negative electrode side second coil part 75n and the positive electrode side second coil part 75p, may not be formed in the same electrode layer. For example, the negative first coil portion 65n may be formed in the second electrode layer of the multilayer substrate 50, and the positive first coil portion 65p may be formed in the third electrode layer of the multilayer substrate 50. .

The disclosure in this specification, drawings, etc. is not limited to the illustrated embodiments. The disclosure includes the illustrated embodiments and variations thereon by those skilled in the art. For example, the disclosure is not limited to the combinations of parts and/or elements illustrated in the embodiments. The disclosure can be implemented in various combinations. The disclosure may have additional parts that can be added to the embodiments. The disclosure includes those in which parts and/or elements of the embodiments are omitted. The disclosure encompasses any substitutions or combinations of parts and/or elements between one embodiment and other embodiments. The disclosed technical scope is not limited to the description of the embodiments. The technical scope of some of the disclosed technical scopes is indicated by the description of the claims, and should be understood to include equivalent meanings and all changes within the scope of the claims.

The disclosure in the specification, drawings, etc. is not limited by the scope of the claims. The disclosure in the specification, drawings, etc. includes the technical ideas described in the claims, and further extends to a more diverse and broader range of technical ideas than the technical ideas described in the claims. Therefore, various technical ideas can be extracted from the disclosure of the specification, drawings, etc. without being restricted by the claims.

1 electronic device, 20 motor device (electrical load), 21 rotor (load metal part), 22 stator (load metal part), 25 centerpiece (load metal part), 27 external connector, 40 storage case, 50 multilayer board , 51 power supply side capacitor, 52 load side capacitor, 53 inductance element, 55 insulating layer, 56n negative electrode side grounding capacitor, 56p positive electrode side grounding capacitor, 59n negative electrode side noise conducting part, 59p positive electrode side noise conducting part, 60 first coil layer , 61n negative electrode part on power supply side, 61p positive electrode part on power supply side, 62n negative electrode part on load side, 62p positive electrode part on load side, 65n first coil part on negative electrode side, 65p first coil part on positive electrode side, 70 second coil layer, 72n small negative electrode part, 75n negative electrode side second coil part, 75p positive electrode side second coil part, 80 large negative electrode layer, 82n large negative electrode part, 90 signal line layer, 93 signal line part, 105n negative electrode side noise reduction part, 105p positive electrode side noise reduction part, 205p positive electrode side noise reduction section, 265p positive electrode side first coil section, 275p positive electrode side second coil section, 305n negative electrode side noise reduction section, 305p positive electrode side noise reduction section, 365n negative electrode side first coil section, 365p positive electrode side 1st coil part, 375n negative electrode side 2nd coil part, 375p positive electrode side 2nd coil part

Claims (12)

an electrical load (20);
an external connector (27) for conducting with an external power supply;
a power supply side positive electrode part (61p) that is electrically connected to the external connector;
a power supply side negative electrode part (61n) that is electrically connected to the external connector;
a load-side positive electrode part (62p) that is electrically connected to the electrical load;
a load-side negative electrode part (62n) that is electrically connected to the electrical load;
A first negative coil portion (65n, 365n) and a second negative coil portion (75n, 375n) are provided in electrical continuity with the negative electrode portion on the load side and the negative electrode portion on the power source side, and generate mutual inductance through magnetic coupling. ), a negative electrode side noise reduction section (105n, 305n) having
A positive electrode side first coil portion (65p, 265p, 365p) and a positive electrode side second coil portion (75p) are provided to be electrically connected to the load side positive electrode portion and the power source side positive electrode portion and generate mutual inductance through magnetic coupling. , 275p, 375p);
It has a plurality of electrode layers (60, 70) in which the negative electrode side first coil part, the negative electrode side second coil part, the positive electrode side first coil part and the positive electrode side second coil part are provided, The negative electrode side first coil part and the negative electrode side second coil part are opposed to each other with an insulating layer (55) in between, and the positive electrode side first coil part and the positive electrode side second coil part are opposite to each other with an insulating layer (55) in between. A multilayer substrate (50) stacked facing each other with
a negative electrode side noise conductive part (59n) that is provided in electrical continuity with the negative electrode side noise reduction part and guides the noise current flowing through the load side negative electrode part to a part other than the power supply side negative electrode part;
a positive electrode side noise conductive part (59p) that is provided in electrical continuity with the positive electrode side noise reduction part and guides the noise current flowing through the load side positive electrode part to a part other than the power supply side positive electrode part ;
The length of the power supply side negative electrode section from the negative electrode side noise reduction section to the external connector is shorter than the length of the load side negative electrode section from the electrical load to the negative electrode side noise reduction section, and
The length of the power supply side positive electrode section from the positive electrode side noise reduction section to the external connector is shorter than the length of the load side positive electrode section from the electrical load to the positive electrode side noise reduction section. The negative electrode side noise conductive section includes a negative electrode side grounded capacitor (56n),
The electronic device according to claim 1 , wherein the positive side noise conductive section includes a positive side grounded capacitor (56p). The mutual inductance of the negative side noise reduction section is larger than the equivalent series inductance of the negative side grounded capacitor, and
3. The electronic device according to claim 2 , wherein mutual inductance of the positive side noise reduction section is larger than equivalent series inductance of the positive side grounded capacitor. an electrical load (20);
an external connector (27) for conducting with an external power supply;
a power supply side positive electrode part (61p) that is electrically connected to the external connector;
a power supply side negative electrode part (61n) that is electrically connected to the external connector;
a load-side positive electrode part (62p) that is electrically connected to the electrical load;
a load-side negative electrode part (62n) that is electrically connected to the electrical load;
A negative electrode side first coil portion (65n, 365n) and a negative electrode side second coil portion (75n, 375n) are provided to be electrically connected to the load side negative electrode portion and the power source side negative electrode portion and generate mutual inductance through magnetic coupling. ), a negative electrode side noise reduction section (105n, 305n) having
A positive electrode side first coil portion (65p, 265p, 365p) and a positive electrode side second coil portion (75p) are provided to be electrically connected to the load side positive electrode portion and the power source side positive electrode portion and generate mutual inductance through magnetic coupling. , 275p, 375p);
It has a plurality of electrode layers (60, 70) in which the negative electrode side first coil part, the negative electrode side second coil part, the positive electrode side first coil part and the positive electrode side second coil part are provided, The negative electrode side first coil part and the negative electrode side second coil part are opposed to each other with an insulating layer (55) in between, and the positive electrode side first coil part and the positive electrode side second coil part are opposite to each other with an insulating layer (55) in between. A multilayer substrate (50) stacked facing each other with
a negative electrode side noise conductive part (59n) that is provided in electrical continuity with the negative electrode side noise reduction part and guides the noise current flowing through the load side negative electrode part to a part other than the power supply side negative electrode part;
a positive electrode side noise conductive part (59p) that is provided in electrical continuity with the positive electrode side noise reduction part and guides the noise current flowing through the load side positive electrode part to a part other than the power supply side positive electrode part ;
The negative electrode side noise conductive section includes a negative electrode side grounded capacitor (56n),
The positive side noise conductive part includes a positive side grounded capacitor (56p) ,
The mutual inductance of the negative side noise reduction section is larger than the equivalent series inductance of the negative side grounded capacitor, and
The electronic device , wherein mutual inductance of the positive side noise reduction section is larger than equivalent series inductance of the positive side grounded capacitor . The multilayer substrate includes:
a first coil layer (60) in which the negative first coil part and the positive first coil part are provided;
a second coil layer (70) in which the negative electrode side second coil part and the positive electrode side second coil part are provided;
a large negative electrode layer (80) provided with a large negative electrode part (82n) having a larger area than the load side negative electrode part,
The first coil layer has the power source side positive electrode portion, the power source side negative electrode portion, the load side positive electrode portion, and the load side negative electrode portion,
5. The electronic device according to claim 1 , wherein the large negative electrode part is electrically connected to the load side negative electrode part and not electrically connected to the power supply side negative electrode part. an electrical load (20);
an external connector (27) for conducting with an external power supply;
a power supply side positive electrode part (61p) that is electrically connected to the external connector;
a power supply side negative electrode part (61n) that is electrically connected to the external connector;
a load-side positive electrode part (62p) that is electrically connected to the electrical load;
a load-side negative electrode part (62n) that is electrically connected to the electrical load;
A negative electrode side first coil portion (65n, 365n) and a negative electrode side second coil portion (75n, 375n) are provided to be electrically connected to the load side negative electrode portion and the power source side negative electrode portion and generate mutual inductance through magnetic coupling. ), a negative electrode side noise reduction section (105n, 305n) having
A positive electrode side first coil portion (65p, 265p, 365p) and a positive electrode side second coil portion (75p) are provided to be electrically connected to the load side positive electrode portion and the power source side positive electrode portion and generate mutual inductance through magnetic coupling. , 275p, 375p);
It has a plurality of electrode layers (60, 70) in which the negative electrode side first coil part, the negative electrode side second coil part, the positive electrode side first coil part and the positive electrode side second coil part are provided, The negative electrode side first coil part and the negative electrode side second coil part are opposed to each other with an insulating layer (55) in between, and the positive electrode side first coil part and the positive electrode side second coil part are opposite to each other with an insulating layer (55) in between. A multilayer substrate (50) stacked facing each other with
a negative electrode side noise conductive part (59n) that is provided in electrical continuity with the negative electrode side noise reduction part and guides the noise current flowing through the load side negative electrode part to a part other than the power supply side negative electrode part;
a positive electrode side noise conductive part (59p) that is provided in electrical continuity with the positive electrode side noise reduction part and guides the noise current flowing through the load side positive electrode part to a part other than the power supply side positive electrode part ;
The multilayer substrate includes:
a first coil layer (60) in which the negative first coil part and the positive first coil part are provided;
a second coil layer (70) in which the negative electrode side second coil part and the positive electrode side second coil part are provided;
a large negative electrode layer (80) provided with a large negative electrode part (82n) having a larger area than the load side negative electrode part,
The first coil layer has the power source side positive electrode portion, the power source side negative electrode portion, the load side positive electrode portion, and the load side negative electrode portion,
The large negative electrode part is electrically connected to the load side negative electrode part and not electrically connected to the power supply side negative electrode part . The negative electrode side noise conductive section includes a negative electrode side grounded capacitor (56n),
7. The electronic device according to claim 6 , wherein the positive side noise conductive section includes a positive side grounded capacitor (56p). 8. The electronic device according to claim 5, wherein the large negative electrode part is provided at a position that does not overlap with the power supply side positive electrode part in the stacking direction of the multilayer substrate. The first coil layer is
an inductance element (53) electrically connected to the power supply side positive electrode part and the load side positive electrode part;
a power supply side capacitor (51) electrically connected to the power supply side positive electrode part and the power supply side negative pole part;
The electronic device according to any one of claims 5 to 8, further comprising a load-side capacitor (52) electrically connected to the load-side positive electrode portion and the load-side negative electrode portion. A metal storage case (40) that stores the multilayer board,
The negative electrode side noise conductive part guides the noise current flowing through the load side negative electrode part to the storage case, and
10. The electronic device according to claim 1, wherein the positive electrode side noise conductive section guides the noise current flowing through the load side positive electrode section to the storage case. The electric load includes a metal load metal part (21, 22, 25) forming a part of the electric load,
The negative electrode side noise conductive part guides the noise current flowing through the load side negative electrode part to the load metal part, and
10. The electronic device according to claim 1, wherein the positive electrode side noise conductive section guides the noise current flowing through the load side positive electrode section to the load metal section. The multilayer board has a signal line layer (90) provided with a signal line portion (93),
The signal line portion overlaps the negative first coil portion, the negative second coil portion, the positive first coil portion, and the positive second coil portion in the stacking direction of the multilayer substrate. 12. The electronic device according to any one of claims 1 to 11, wherein the electronic device is provided in a position where the electronic device is located at a position where the electronic device is not located.

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