JP7422713B2 - How to dispose of electronic/electrical equipment parts waste - Google Patents
How to dispose of electronic/electrical equipment parts waste Download PDFInfo
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- JP7422713B2 JP7422713B2 JP2021154785A JP2021154785A JP7422713B2 JP 7422713 B2 JP7422713 B2 JP 7422713B2 JP 2021154785 A JP2021154785 A JP 2021154785A JP 2021154785 A JP2021154785 A JP 2021154785A JP 7422713 B2 JP7422713 B2 JP 7422713B2
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- 239000002699 waste material Substances 0.000 title claims description 29
- 239000000758 substrate Substances 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 26
- 239000007921 spray Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 229920003002 synthetic resin Polymers 0.000 claims description 9
- 239000000057 synthetic resin Substances 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 5
- 229910052755 nonmetal Inorganic materials 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- 238000001514 detection method Methods 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 11
- 239000003086 colorant Substances 0.000 description 10
- 150000002739 metals Chemical class 0.000 description 10
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 238000007873 sieving Methods 0.000 description 3
- -1 ICs Substances 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 150000002843 nonmetals Chemical class 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 239000011435 rock Substances 0.000 description 2
- 238000003723 Smelting Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Landscapes
- Sorting Of Articles (AREA)
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
- Discharge Of Articles From Conveyors (AREA)
Description
本発明は、電子・電気機器部品屑の処理方法に関し、特に、使用済み電子・電気機器のリサイクル処理に好適な電子・電気機器部品屑の処理方法に関する。 TECHNICAL FIELD The present invention relates to a method for disposing of electronic/electrical equipment part scraps, and more particularly to a processing method for electronic/electrical equipment part scraps suitable for recycling used electronic/electrical equipment.
近年の資源保護の観点から、廃家電製品・PCや携帯電話等の電子・電気機器部品屑から、有価金属を回収することがますます盛んになってきており、その効率的な回収方法が検討されている。電子・電気機器部品屑には種々の部品が含まれていることが知られており、手選別による選別が最も精度が高いが、労力がかかり、現実的ではないという問題がある。そこで、種々の選別装置を用いて、電子・電気機器部品屑の中から所望の部品を効率良く選別するための装置の開発が求められている。 In recent years, from the perspective of resource conservation, the recovery of valuable metals from discarded home appliances and electronic/electrical equipment parts scraps such as PCs and mobile phones has become increasingly popular, and efficient methods of recovery are being considered. has been done. It is known that electronic and electrical equipment parts scraps contain various parts, and manual sorting has the highest accuracy, but there is a problem in that it is labor-intensive and impractical. Therefore, there is a need for the development of a device that can efficiently sort desired parts from electronic and electrical equipment component scraps using various sorting devices.
例えば、特開2017-83348号公報(特許文献1)には、鉱石の良品又は不良品を選別するための鉱石選別方法及び装置が記載されており、ベルト状搬送体上に搬送された岩石粉砕物を撮像器具により撮像し、判別装置により良品及び不良品を判別し、良品及び不良品の各移動軌跡を異ならせるように、吹付対象物に向けて空気を吹き付ける空気吹付器具を備えた鉱石選別装置の例が記載されている。 For example, Japanese Patent Application Laid-open No. 2017-83348 (Patent Document 1) describes an ore sorting method and apparatus for sorting out good ore good ore, and crushes rock transported on a belt-like conveyor. An ore sorter equipped with an air blowing device that images objects with an imaging device, distinguishes between good and defective products with a discrimination device, and blows air toward the object so that the movement trajectories of the good and defective products are different. Examples of devices are described.
しかしながら、特許文献1に記載された発明は、岩石粉砕物に着目した選別方法であり、基板、IC、プラスチック、フィルム粉状物等の種々の材料を含む電子・電気機器部品屑を適切に選別することができるとはいえない。 However, the invention described in Patent Document 1 is a sorting method that focuses on crushed rock, and appropriately sorts electronic and electrical equipment parts scraps containing various materials such as substrates, ICs, plastics, and film powder. It cannot be said that it is possible to do so.
本開示は、電子・電気機器部品屑を適切且つ効率的に選別することが可能な電子・電気機器部品屑の処理方法を提供する。 The present disclosure provides a method for processing electronic/electrical equipment parts scraps that can appropriately and efficiently sort electronic/electrical equipment parts scraps.
本発明の実施の形態に係る電子・電気機器部品屑の処理方法は一側面において、識別部、エアーバルブ、コンベアを備える選別機を用いて、電子・電気機器部品屑を選別する電子・電気機器部品屑の処理方法であって、識別部が識別した電子・電気機器部品屑中の識別対象物又は非識別対象物のいずれかに対して、エアーバルブの穴から識別対象物又は非識別対象物までのスプレー距離において、エアーバルブから噴出される気体の広がり幅の最大直径が、識別対象物又は非識別対象物の最小直径よりも小さくなるように識別対象物又は非識別対象物に気体を吹き付けて撃ち落とすことにより、識別対象物又は非識別対象物を分離除去する工程を含む電子・電気機器部品屑の処理方法である。 In one aspect, a method for processing electronic/electrical equipment parts waste according to an embodiment of the present invention includes sorting electronic/electrical equipment parts waste using a sorter including an identification unit, an air valve, and a conveyor. A method for disposing of parts scraps, in which either an identified object or a non-identified object in electronic/electrical equipment parts identified by an identification unit is processed through a hole in an air valve. Spray the gas onto the identified object or non-identified object so that the maximum diameter of the spread of the gas ejected from the air valve is smaller than the minimum diameter of the identified object or non-identified object at the spray distance up to This method includes the step of separating and removing identified objects or non-identified objects by shooting them down.
本開示によれば、電子・電気機器部品屑を適切且つ効率的に選別することが可能な電子・電気機器部品屑の処理方法が提供できる。 According to the present disclosure, it is possible to provide a method for processing electronic/electrical equipment parts scraps that can appropriately and efficiently sort electronic/electrical equipment parts scraps.
(処理対象)
本発明の実施の形態において処理される「電子・電気機器部品屑」とは、廃家電製品・PCや携帯電話等の電子・電気機器を破砕した屑であり、回収された後、適当な大きさに破砕されたものを指す。本発明では、電子・電気機器部品屑とするための破砕は、処理者自身が行ってもよいが、市中で破砕されたものを購入等したものでもよい。
(Processing object)
The "electronic/electrical equipment parts scraps" that are processed in the embodiment of the present invention are scraps obtained by crushing electronic/electrical equipment such as discarded home appliances, PCs, and mobile phones. Refers to something that has been crushed into pieces. In the present invention, the crushing to produce electronic/electrical equipment part scraps may be carried out by the processor himself, but it may also be crushed pieces purchased on the market.
破砕方法として、特定の装置には限定されず、せん断方式でも衝撃方式でも構わないが、できる限り、部品の形状を損なわない破砕がのぞましい。したがって、細かく粉砕することを目的とする粉砕機のカテゴリーに属する装置は含まれない。 The crushing method is not limited to a specific device, and may be a shearing method or an impact method, but it is preferable to use crushing that does not damage the shape of the parts as much as possible. Therefore, devices belonging to the category of crushers whose purpose is to grind finely are not included.
以下に限定されるものではないが、本実施形態では、電子・電気機器部品屑は、最大直径が100mm以下程度、更には50mm以下程度に破砕されているものが好ましい。さらに、本実施形態に係る電子・電気機器部品屑の原料を予め粗破砕することにより、コンデンサ、プラスチック、基板、線屑、IC、コネクタ、メタル等の形態で単体分離しておくことが好ましい。 Although not limited to the following, in the present embodiment, it is preferable that the electronic/electrical equipment component scraps be crushed into pieces with a maximum diameter of about 100 mm or less, more preferably about 50 mm or less. Furthermore, it is preferable to roughly crush the raw material of the electronic/electrical device parts scrap according to this embodiment in advance to separate them into individual pieces in the form of capacitors, plastics, substrates, wire scraps, ICs, connectors, metals, etc.
本実施形態に係る電子・電気機器部品屑は、基板、パーツ、筐体などに使われる合成樹脂類(プラスチック)、線屑、メタル、フィルム状部品屑、破砕や粉砕によって生じる粉状物、その他からなる部品屑に分類することができ、処理目的に応じて更に細かく分類することができる。以下に限定されるものではないが、本実施形態では部品屑として単体分離されている割合が重量比で70%以上の電子・電気機器部品屑を好適に処理することができる。 The electronic/electrical device parts scraps according to this embodiment include synthetic resins (plastics) used for circuit boards, parts, housings, etc., wire scraps, metals, film-like parts scraps, powdery materials generated by crushing and crushing, and others. It can be classified into scrap parts, which can be further classified depending on the purpose of processing. Although not limited to the following, in this embodiment, it is possible to suitably process electronic/electrical equipment part scraps whose proportion by weight is 70% or more that is separated into single parts as part scraps.
特に、本実施形態に係る選別機の処理対象物としては、上述の電子・電気機器部品屑に対して風力選別を実施し、粉状物とフィルム状部品屑を除去した後の物質を処理することが好ましい。風力選別によって電子・電気機器部品屑中から粉状物とフィルム状部品屑等の軽量物を予め取り除いておくことにより、後述する識別部10を有する選別機1Aにおいて粉状物とフィルム状部品屑等が舞い上がり、視界不良となることによって、選別機1Aが備える識別部10の識別能力の低下を抑制することができる。 In particular, as the object to be processed by the sorting machine according to the present embodiment, the above-mentioned electronic/electrical equipment parts waste is subjected to wind sorting, and the material after powdery material and film-like parts waste is removed is processed. It is preferable. By previously removing light materials such as powdery materials and film-like component waste from electronic/electrical equipment component waste by wind sorting, the powdery materials and film-like component waste are separated in a sorting machine 1A having an identification section 10, which will be described later. etc. flying up and causing poor visibility, it is possible to suppress a decline in the identification ability of the identification unit 10 included in the sorting machine 1A.
また、風力選別によって電子・電気機器部品屑中から粉状物とフィルム状部品屑等の軽量物を予め取り除いておくことにより、合成樹脂類、メタル、基板、IC、コンデンサなどの金属を含有する部品屑の含有比率を高くすることができる。 In addition, by removing light objects such as powder and film-like parts from waste electronic and electrical equipment parts using wind sorting, metals such as synthetic resins, metals, circuit boards, ICs, and capacitors can be removed. The content ratio of parts scraps can be increased.
風力選別は少なくとも2段階で行われることが好ましい。まず、第1段階目の風力選別において、本実施形態に係る選別機での選別能力に悪影響を与える可能性のある粉状物とフィルム状部品屑(樹脂、アルミ箔等)を除去することができる。第1段階目の風力選別工程は、例えば、風量を5~20m/s、より好ましくは5~12m/s、更には5~10m/s程度、更には6~8m/sで設定することができる。 Preferably, wind sorting is carried out in at least two stages. First, in the first stage of wind sorting, it is possible to remove powdery substances and film-like part waste (resin, aluminum foil, etc.) that may have a negative effect on the sorting ability of the sorting machine according to this embodiment. can. In the first stage of wind sorting process, the air volume may be set at, for example, 5 to 20 m/s, more preferably 5 to 12 m/s, further 5 to 10 m/s, and even 6 to 8 m/s. can.
2段階目の風力選別は、紛状物とフィルム状部品屑が除去された電子・電気機器部品屑から、合成樹脂類及び基板を濃縮することを目的とした選別が行われることが好ましい。例えば、2段階目の風力選別の風量を5~20m/s、より好ましくは10~18m/s、更には15~18m/s、更には16~17m/s程度で設定することができる。 It is preferable that the second stage of wind sorting is carried out for the purpose of concentrating synthetic resins and substrates from electronic/electrical equipment parts scraps from which powders and film-like parts scraps have been removed. For example, the air flow rate for the second stage of wind selection can be set to about 5 to 20 m/s, more preferably 10 to 18 m/s, furthermore 15 to 18 m/s, and even more preferably about 16 to 17 m/s.
第1段階目の風力選別と第2段階目の風力選別との間にスリット状の篩を有する篩別機を用いて篩別処理を更に行うことが更に好ましい。第1段階目の風力選別の後に篩別処理を行うことにより、紛状物とフィルム状部品屑が除去された電子・電気機器部品屑から、線屑などの線状の部品屑を取り除くことができるため、第2段階目の風力選別において、処理対象物中の合成樹脂類及び基板の含有率をより高めることができるとともに、線屑の混入による後段の選別処理の負荷を低減することができる。 It is further preferable that a sieving process is further performed using a sieving machine having a slit-shaped sieve between the first stage of wind sorting and the second stage of wind sorting. By performing a sieving process after the first stage of wind sorting, wire scraps such as wire scraps can be removed from electronic and electrical equipment parts scraps from which powder and film-like parts scraps have been removed. Therefore, in the second stage of wind sorting, it is possible to further increase the content of synthetic resins and substrates in the object to be processed, and it is also possible to reduce the load on the subsequent sorting process due to the contamination of wire scraps. .
このようにして得られた合成樹脂類及び基板の含有率が濃縮された処理対象物に対してそのまま例えばメタルソータ等を用いて金属物及び非金属物の選別を行った場合、非金属物が除去されにくく、金属物を高効率で回収できない場合がある。 If the processing target material with a concentrated content of synthetic resins and substrates obtained in this way is sorted into metals and non-metals using a metal sorter, etc., the non-metals will be removed. metal objects may not be collected with high efficiency.
本発明の実施の形態に係る電子・電気機器部品屑の処理方法では、後述する識別部10を備える選別機1Aを用いることにより、合成樹脂類、IC等のパーツ、メタル類、基板の混在する部品屑の中から基板を選択的に取り除くことができる。そして、電子・電気機器部品屑中の基板を除去した後の電子・電気機器部品屑に対し、メタルセンサー、カラーセンサ、エアーバルブ、コンベアを備える選別機(メタルソータ)で処理することにより、金属物の濃縮が容易になるため、電子・電気機器部品屑からの金属の回収効率を向上させることができる。 In the method for processing electronic/electrical equipment parts waste according to the embodiment of the present invention, by using a sorter 1A equipped with an identification section 10 described later, synthetic resins, parts such as ICs, metals, and substrates are mixed. Boards can be selectively removed from component scraps. After removing the substrates from the electronic and electrical equipment parts, the electronic and electrical equipment parts are processed using a sorter (metal sorter) equipped with a metal sensor, a color sensor, an air valve, and a conveyor. Since it becomes easier to concentrate metals, it is possible to improve the efficiency of recovering metals from electronic and electrical equipment parts scraps.
具体的には、図1に示すように、本発明の実施の形態に係る処理方法は、識別部10、エアーバルブ5、コンベア2を備える選別機(カラーソータ1A)を用いて、電子・電気機器部品屑を選別処理することができる。 Specifically, as shown in FIG. 1, the processing method according to the embodiment of the present invention uses a sorter (color sorter 1A) equipped with an identification section 10, an air valve 5, and a conveyor 2 to Equipment parts scrap can be sorted and processed.
識別部10は、電子・電気機器部品屑中の特定の部品を識別対象物とし、その他の部品を非識別対象物と識別するための装置である。識別部10としては、電子・電気機器部品屑が有する色彩に基づいて、識別対象物及び非識別対象物を識別するカラーセンサ3a、3b、電子・電気機器部品屑に赤外光を当て、反射した波長を読み取ることにより識別対象物及び非識別対象物を識別する赤外線センサ6、電子・電気機器部品屑中の金属物と非金属物とを識別するメタルセンサー8などが用いられる。 The identification unit 10 is a device for identifying specific parts in electronic/electrical equipment part scraps as objects to be identified and other parts as objects to be identified. The identification unit 10 includes color sensors 3a and 3b that identify objects to be identified and non-identified objects based on the colors of the electronic and electrical equipment parts, and a color sensor that irradiates infrared light onto the electronic and electrical equipment parts to reflect the An infrared sensor 6 that identifies objects to be identified and objects that are not to be identified by reading the wavelengths detected, a metal sensor 8 that identifies metal objects and non-metal objects in scraps of electronic and electrical equipment parts, and the like are used.
特に、電子・電気機器部品屑中の基板を効率良く選別するためには、識別部10として、電子・電気機器部品屑が有する色彩に基づいて、識別対象物及び非識別対象物の色彩を識別するカラーセンサ3a、3bを備え、カラーセンサ3a、3bが、電子・電気機器部品屑中の基板の色彩を識別するように構成されることが好ましい。 In particular, in order to efficiently sort circuit boards from electronic/electrical equipment parts scraps, the identification unit 10 identifies the colors of objects to be identified and non-identified objects based on the colors of electronic/electrical equipment parts scraps. It is preferable that the color sensors 3a, 3b are configured to identify the color of the board in the electronic/electrical equipment component waste.
コンベア2は、フィーダから供給される電子・電気機器部品屑を搬送することが可能な装置であれば特に限定されない。エアーバルブ5は、識別部10が除去対象として検出する対象物(識別部10が識別対象として識別した識別対象物の場合もあれば識別部10が識別対象として識別しない非識別対象物の場合もある)に対して、気体(空気)を吹き付け、対象物を除去物側の容器へと撃ち落とす又は撃ち上げることにより、対象物を分離除去する装置である。なお、対象物を撃ち上げて分離する場合は図1の除去物と回収物の配置は反対になる。 The conveyor 2 is not particularly limited as long as it is a device capable of conveying electronic/electrical equipment component scraps supplied from a feeder. The air valve 5 is connected to an object that the identification section 10 detects as a removal target (which may be an identification object that the identification section 10 has identified as an identification object, or a non-identification object that the identification section 10 does not identify as an identification object). This is a device that separates and removes objects by spraying gas (air) onto them and shooting them down or up into a container on the side of the object to be removed. Note that when the object is shot up and separated, the arrangement of the removed object and the recovered object in FIG. 1 is reversed.
エアーバルブ5には、気体を検出対象物に対して吹き付けるための先端部5a(ノズル部分)が所定の形状を有するように構成されている。エアーバルブ5の先端部5aは、コンベア2の搬送方向に垂直な方向に長手方向を有して延びており、図2に示すように長手方向に沿って複数の穴51を備える。穴51はそれぞれ断面積Aを有し、所定のピッチP(隣接する穴51の中心と中心との間の距離)を有して互いに離間している。 The air valve 5 is configured to have a tip portion 5a (nozzle portion) having a predetermined shape for spraying gas onto the object to be detected. The tip portion 5a of the air valve 5 extends longitudinally in a direction perpendicular to the conveyance direction of the conveyor 2, and is provided with a plurality of holes 51 along the longitudinal direction as shown in FIG. The holes 51 each have a cross-sectional area A and are spaced apart from each other at a predetermined pitch P (distance between the centers of adjacent holes 51).
ノズル断面積A及びピッチPは大きすぎると基板以外の部品屑を除去物側へと撃ち落とす恐れがある一方で、小さすぎると部品屑の中から基板を選択的且つ適切に除去物側の容器へと撃ち落とせない場合、或いは各ノズルから噴射する必要空気量が多くなりコンプレッサ等の付帯設備の費用が多く掛かり、経済的でない場合がある。エアーバルブ5のノズル断面積Aは好ましくは0.5~6mm2であり、更に好ましくは1~5mm2である。エアーバルブ5のピッチPは好ましくは2~8mmであり、更に好ましくは3~6mmである。 If the nozzle cross-sectional area A and the pitch P are too large, there is a risk that component waste other than the substrate will be shot down to the object to be removed, while if it is too small, the substrates will be selectively and appropriately dropped from the component waste to the container on the object to be removed. In some cases, the amount of air required to be injected from each nozzle becomes large, which increases the cost of ancillary equipment such as a compressor, which may not be economical. The nozzle cross-sectional area A of the air valve 5 is preferably 0.5 to 6 mm 2 , more preferably 1 to 5 mm 2 . The pitch P of the air valve 5 is preferably 2 to 8 mm, more preferably 3 to 6 mm.
エアーバルブ5を用いて基板を適切に除去物側の容器へ分離させるためには、エアーバルブ5から吹き付けされる気体のスプレー幅が、識別対象物又は非識別対象物の最小直径よりも小さくなるように調節する必要がある。更に、電子・電気機器部品屑中の基板を適切に分離選別するためには、エアーバルブ5から吹きつけされるスプレー距離、即ち、先端部の穴51の中心から識別対象物又は非識別対象物の中心までの距離を5~50mmに調整することが好ましく、より好ましくは5~30mmであり、更に好ましくは5~10mmである。 In order to properly separate the substrate into the container on the removal side using the air valve 5, the spray width of the gas blown from the air valve 5 must be smaller than the minimum diameter of the identified object or non-identified object. You need to adjust it accordingly. Furthermore, in order to properly separate and sort the boards in the electronic/electrical device parts waste, it is necessary to adjust the spray distance from the air valve 5, that is, from the center of the hole 51 at the tip to the identified or non-identified target. The distance to the center is preferably adjusted to 5 to 50 mm, more preferably 5 to 30 mm, and even more preferably 5 to 10 mm.
また、エアーバルブ5を用いて基板を適切に除去物側の容器へ分離させるためには、エアーバルブ5から噴射されるエアー圧力を0.1~1.0MPaとするように調整することが好ましく、より好ましくは0.3~0.7MPaであり、更に好ましくは0.3~0.5MPaである。なお、図2においてはエアーバルブ5の穴の形状が矩形を有しているが、矩形には限られず、円形や楕円形、スリット状とすることもできる。更に、エアーバルブ5が噴射する流体の断面形状(スプレーパターン)も矩形、円形又は楕円形等に限定されず、環形状や渦巻状等のような断面の内部が部分的に空気を噴出しない形状であってもよい。 Further, in order to properly separate the substrate into the container on the side of the removed material using the air valve 5, it is preferable to adjust the air pressure injected from the air valve 5 to 0.1 to 1.0 MPa. , more preferably 0.3 to 0.7 MPa, still more preferably 0.3 to 0.5 MPa. Although the hole of the air valve 5 has a rectangular shape in FIG. 2, it is not limited to the rectangular shape, and may be circular, oval, or slit-shaped. Further, the cross-sectional shape (spray pattern) of the fluid injected by the air valve 5 is not limited to rectangular, circular, or elliptical shapes, but may also be a shape in which the inside of the cross-section does not eject air partially, such as an annular shape or a spiral shape. It may be.
エアーバルブ5のスプレー距離及びエアー圧力を適切に調節し、エアーバルブ5の穴から吹き付けるスプレー幅、即ち、噴出される気体(空気)が先端部の穴51から識別対象物又は非識別対象物へ到達した距離(スプレー距離)における広がり幅の最大直径を、電子・電気機器部品屑中に含まれる基板の最小直径よりも小さくして、基板に気体を吹き付けることにより、基板以外の電子・電気機器部品屑を巻き込んで気体を吹き付けることを抑制することができ、電子・電気機部品屑からの基板の除去効率をより向上させることができる。 The spray distance and air pressure of the air valve 5 are appropriately adjusted to control the spray width from the hole of the air valve 5, that is, the amount of gas (air) ejected from the hole 51 at the tip toward the identification target or non-identification target. By spraying gas onto the substrate by making the maximum diameter of the spreading width at the reached distance (spray distance) smaller than the minimum diameter of the substrate contained in the electronic and electrical equipment parts waste, electronic and electrical equipment other than the board can be sprayed. It is possible to suppress the blowing of gas that entrains component scraps, and it is possible to further improve the efficiency of removing substrates from electronic/electrical component scraps.
なお、選別機1Aは更に、エアーバルブから噴出させる空気の圧力(エアー圧力)を調整するコントローラ(図示せず)、カラーセンサ3a、3b及び赤外線センサ6の近傍にそれぞれ設けられ、カラーセンサ3a、3b及び赤外線センサ6の視界を照らす照明4a、4b、7等を更に含んでいてもよい。 The sorting machine 1A is further provided near a controller (not shown) that adjusts the pressure of air (air pressure) ejected from the air valve, color sensors 3a, 3b, and infrared sensor 6, respectively. 3b and the infrared sensor 6 may be further included.
選別処理対象物である基板は、表裏両面がソルダーレジストで覆われているものと、片面のみソルダーレジストで覆われているものがある。一般的に、ソルダーレジストで覆われた面は緑色であり、ソルダーレジストで覆われていない面は茶色である。選別機1Aで検出色を緑色に設定することによりソルダーレジストで覆われた面を検出し基板を選択的に除去することができる。 Some substrates, which are objects to be sorted, have both the front and back sides covered with solder resist, and others have only one side covered with solder resist. Generally, the side covered with solder resist is green, and the side not covered with solder resist is brown. By setting the detection color to green in the sorter 1A, the surface covered with the solder resist can be detected and the substrate can be selectively removed.
カラーセンサが処理対象物の表面又は裏面の一方のみの色彩を識別する位置にある従来の装置では、処理対象物の表面及び裏面の両面の色彩を識別するように検出色を設定する必要がある。このような従来のカラーセンサにより片方のみソルダーレジストで覆われている基板を検出する場合は、検出色をソルダーレジストで覆われている面の緑色と、ソルダーレジストで覆われていない面の茶色に設定する必要があるが、茶色や汚れた白色のプラスチック(合成樹脂類)を基板と検知するような誤検知が生じやすい。 In conventional devices where the color sensor is positioned to identify only the color of either the front or back side of the object to be processed, it is necessary to set the detection color to identify the color of both the front and back sides of the object to be processed. . When detecting a board with only one side covered with solder resist using such a conventional color sensor, the detection color is set to green on the side covered with solder resist and brown on the side not covered with solder resist. This setting is necessary, but false detections such as detecting brown or dirty white plastic (synthetic resin) as a board are likely to occur.
一方で、図1に示す選別機1Aのように、カラーセンサ3a、3bが処理対象物の表面及び裏面の両面の色彩を識別する位置にある場合は、処理対象物の表面又は裏面の一方のみの色彩を識別するようにカラーセンサ3a、3bの検出色が設定されれば良い。カラーセンサ3a、3bが、片方のみソルダーレジストで覆われた基板を検出する場合は、検出色をソルダーレジストで覆われている面の緑色に設定することで、プラスチック(合成樹脂類)の誤検知を抑えながら基板を選択的に除去することができる。検出色はソルダーレジストの現在の標準色である緑色とすることが好ましいが、選別する基板の色調に応じて検出色を追加してもよい。例えば、選別する基板の色に応じて、赤色、青色、黒色、白色などを検出色として追加してもよい。 On the other hand, when the color sensors 3a and 3b are positioned to identify the colors of both the front and back surfaces of the object to be processed, as in the sorting machine 1A shown in FIG. The detection colors of the color sensors 3a and 3b may be set so as to identify the colors. When the color sensors 3a and 3b detect a board with only one side covered with solder resist, setting the detection color to the green of the side covered with solder resist will prevent false detection of plastic (synthetic resin). The substrate can be selectively removed while suppressing the damage. The detection color is preferably green, which is the current standard color of solder resist, but additional detection colors may be added depending on the color tone of the substrate to be sorted. For example, red, blue, black, white, etc. may be added as detection colors depending on the color of the substrate to be sorted.
処理対象物の表裏両面の色彩を識別可能な少なくとも2台のカラーセンサ3a、3bを、コンベア2の下方及び上方に配置した選別機1Aを用いることにより、処理対象物それぞれの表裏両面の色彩を検知することが可能となるため、除去対象とする基板以外の誤検知を低減することができる。更に、カラーセンサ3a、3bで検知した電子・電気機器部品屑中の処理対象物、例えば基板に対し、面積0.5~6mm2、ピッチ2~8mmの複数の穴51を備えるエアーバルブ5から気体を吹き付けるように、エアーバルブ5の構成が適正化されているため、電子・電気機器部品屑中の基板をより効率良く分離除去することができる。その結果、本発明の実施の形態に係る電子・電気機器部品屑の処理方法によれば、製錬工程で処理する電子・電気機器部品屑の処理量を増大でき、有価金属を効率的に回収することが可能となる。 By using a sorting machine 1A in which at least two color sensors 3a and 3b capable of identifying the colors of both the front and back sides of the objects to be processed are arranged below and above the conveyor 2, the colors of both the front and back sides of each object to be processed can be distinguished. Since it is possible to detect the substrate, it is possible to reduce false detection of substrates other than the substrate to be removed. Furthermore, an air valve 5 having a plurality of holes 51 with an area of 0.5 to 6 mm 2 and a pitch of 2 to 8 mm is applied to the processing object, for example, a substrate, in the electronic/electrical device parts waste detected by the color sensors 3a and 3b. Since the configuration of the air valve 5 is optimized so as to spray gas, it is possible to more efficiently separate and remove the substrates in the electronic/electrical equipment component waste. As a result, according to the method for processing electronic/electrical equipment parts scraps according to the embodiment of the present invention, the amount of electronic/electrical equipment parts scraps processed in the smelting process can be increased, and valuable metals can be efficiently recovered. It becomes possible to do so.
(その他の実施の形態)
上述の実施形態では、識別部10として、カラーセンサ3a、3bを備え、カラーセンサ3a、3bによる電子・電気機器部品屑が有する色彩の識別結果に基づいて、エアーバルブ5を駆動させる例を示した。しかしながら、カラーセンサ3a、3bの他に、又はカラーセンサ3a、3bに加えて、赤外線センサ6及びメタルセンサー8の少なくともいずれかの識別結果と組み合わせた識別結果を用いて、エアーバルブ5を稼働させてもよいことは勿論である。
(Other embodiments)
In the above-described embodiment, an example is shown in which the identification unit 10 includes color sensors 3a and 3b, and the air valve 5 is driven based on the identification result of the color of electronic/electrical equipment parts scraps by the color sensors 3a and 3b. Ta. However, in addition to the color sensors 3a and 3b, or in addition to the color sensors 3a and 3b, the air valve 5 is operated using the identification result combined with the identification result of at least one of the infrared sensor 6 and the metal sensor 8. Of course, it is possible.
更には、ここでは図示しないが、電子・電気機器部品屑中から金属物又は非金属物を除去するメタルセンサーを用いた選別機又は選別処理において、メタルセンサーによる識別結果に基づいて、エアーバルブ5が非金属物を除去物側の容器へと撃ち落とし、金属物を回収物側へ送り、非金属物を分離除去するように構成することも可能である。 Furthermore, although not shown here, in a sorting machine or sorting process using a metal sensor to remove metal or non-metallic objects from electronic/electrical device parts waste, an air valve 5 is installed based on the identification result by the metal sensor. It is also possible to configure the container so that the non-metallic objects are shot down into a container on the side of the removed object, the metal objects are sent to the side of the recovered object, and the non-metallic objects are separated and removed.
このように、本発明は上記の実施形態に限定されるものではなく、その要旨を逸脱しない範囲で構成要素を変形して具体化できる。また、上記実施形態に開示されている複数の構成要素の適宜な組み合わせにより、種々の発明を形成できる。例えば、実施形態に示される全構成要素からいくつかの構成要素を削除してもよい。更に、異なる実施形態の構成要素を適宜組み合わせてもよい。 As described above, the present invention is not limited to the above-described embodiments, but can be embodied by modifying the constituent elements without departing from the gist thereof. Moreover, various inventions can be formed by appropriately combining the plurality of components disclosed in the above embodiments. For example, some components may be deleted from all the components shown in the embodiments. Furthermore, components of different embodiments may be combined as appropriate.
1A…選別機
2…コンベア
3a、3b…カラーセンサ
4a…照明
5…エアーバルブ
5a…先端部
6…赤外線センサ
8…メタルセンサー
10…識別部
51…穴
1A... Sorting machine 2... Conveyor 3a, 3b... Color sensor 4a... Lighting 5... Air valve 5a... Tip part 6... Infrared sensor 8... Metal sensor 10... Identification part 51... Hole
Claims (4)
前記濃縮処理後に、識別部、エアーバルブ、コンベアを備えるカラーソーターを用いて、前記電子・電気機器部品屑を選別する工程であって、前記識別部が識別した前記濃縮処理後の前記電子・電気機器部品屑中の基板屑に対して、前記エアーバルブの穴から前記基板屑までのスプレー距離において、前記エアーバルブから噴出される気体の広がり幅の最大直径が、前記基板屑の最小直径よりも小さくなるように前記基板屑に前記気体を吹き付けて撃ち落とすことにより、前記基板屑を分離除去する工程と、
前記基板屑を前記分離除去した後の前記電子・電気機器部品屑を、メタルソータを用いて金属物と非金属物とに選別する工程と、
を含むことを特徴とする電子・電気機器部品屑の処理方法。 At least two stages of wind sorting are carried out on electronic and electrical equipment parts waste, and after removing light materials including powder and film-like parts waste in the first stage wind sorting, the second stage wind wind sorting is carried out. a step of performing a concentration process to increase the content of synthetic resin and substrate contained in the electronic/electrical equipment parts scrap during sorting;
After the concentration process , the electronic/electrical equipment parts scraps are sorted using a color sorter including an identification part, an air valve, and a conveyor, the electronic/electrical equipment parts identified by the identification part after the concentration process. With respect to substrate waste in equipment parts waste, the maximum diameter of the spread width of the gas ejected from the air valve is larger than the minimum diameter of the substrate waste in the spray distance from the hole of the air valve to the substrate waste. separating and removing the substrate debris by spraying the gas onto the substrate debris so as to reduce the size of the substrate debris ;
sorting the electronic/electrical device component scraps after the substrate scraps have been separated and removed into metal objects and non-metal objects using a metal sorter;
A method for processing electronic/electrical equipment parts waste, characterized by comprising:
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