JP7411140B2 - 撮像素子ユニット、および撮像装置 - Google Patents

撮像素子ユニット、および撮像装置 Download PDF

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Publication number
JP7411140B2
JP7411140B2 JP2023502082A JP2023502082A JP7411140B2 JP 7411140 B2 JP7411140 B2 JP 7411140B2 JP 2023502082 A JP2023502082 A JP 2023502082A JP 2023502082 A JP2023502082 A JP 2023502082A JP 7411140 B2 JP7411140 B2 JP 7411140B2
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JP
Japan
Prior art keywords
conductive member
heat conductive
image sensor
sheet
sensor unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023502082A
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English (en)
Japanese (ja)
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JPWO2022180977A1 (https=
JPWO2022180977A5 (https=
Inventor
卓朗 阿部
亘平 粟津
雄大 阿部
優太 渡邉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of JPWO2022180977A1 publication Critical patent/JPWO2022180977A1/ja
Publication of JPWO2022180977A5 publication Critical patent/JPWO2022180977A5/ja
Priority to JP2023217367A priority Critical patent/JP7680521B2/ja
Application granted granted Critical
Publication of JP7411140B2 publication Critical patent/JP7411140B2/ja
Priority to JP2025078036A priority patent/JP2025114732A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
    • H04N23/682—Vibration or motion blur correction
    • H04N23/685—Vibration or motion blur correction performed by mechanical compensation
    • H04N23/687—Vibration or motion blur correction performed by mechanical compensation by shifting the lens or sensor position
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Studio Devices (AREA)
  • Cameras Adapted For Combination With Other Photographic Or Optical Apparatuses (AREA)
  • Adjustment Of Camera Lenses (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023502082A 2021-02-24 2021-12-01 撮像素子ユニット、および撮像装置 Active JP7411140B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023217367A JP7680521B2 (ja) 2021-02-24 2023-12-22 撮像素子ユニット、および撮像装置
JP2025078036A JP2025114732A (ja) 2021-02-24 2025-05-08 撮像素子ユニット、および撮像装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021027338 2021-02-24
JP2021027338 2021-02-24
PCT/JP2021/044149 WO2022180977A1 (ja) 2021-02-24 2021-12-01 撮像素子ユニット、および撮像装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023217367A Division JP7680521B2 (ja) 2021-02-24 2023-12-22 撮像素子ユニット、および撮像装置

Publications (3)

Publication Number Publication Date
JPWO2022180977A1 JPWO2022180977A1 (https=) 2022-09-01
JPWO2022180977A5 JPWO2022180977A5 (https=) 2023-11-08
JP7411140B2 true JP7411140B2 (ja) 2024-01-10

Family

ID=83047970

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2023502082A Active JP7411140B2 (ja) 2021-02-24 2021-12-01 撮像素子ユニット、および撮像装置
JP2023217367A Active JP7680521B2 (ja) 2021-02-24 2023-12-22 撮像素子ユニット、および撮像装置
JP2025078036A Pending JP2025114732A (ja) 2021-02-24 2025-05-08 撮像素子ユニット、および撮像装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2023217367A Active JP7680521B2 (ja) 2021-02-24 2023-12-22 撮像素子ユニット、および撮像装置
JP2025078036A Pending JP2025114732A (ja) 2021-02-24 2025-05-08 撮像素子ユニット、および撮像装置

Country Status (4)

Country Link
US (1) US20230396864A1 (https=)
JP (3) JP7411140B2 (https=)
CN (1) CN116868576A (https=)
WO (1) WO2022180977A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024104942A (ja) * 2023-01-25 2024-08-06 キヤノン株式会社 像振れ補正機構および撮像装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020202811A1 (ja) 2019-03-29 2020-10-08 ソニー株式会社 像ぶれ補正装置及び撮像装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101808191B (zh) 2009-02-16 2013-03-20 鸿富锦精密工业（深圳）有限公司 防震相机模组

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020202811A1 (ja) 2019-03-29 2020-10-08 ソニー株式会社 像ぶれ補正装置及び撮像装置

Also Published As

Publication number Publication date
WO2022180977A1 (ja) 2022-09-01
JP2024038063A (ja) 2024-03-19
JPWO2022180977A1 (https=) 2022-09-01
CN116868576A (zh) 2023-10-10
US20230396864A1 (en) 2023-12-07
JP7680521B2 (ja) 2025-05-20
JP2025114732A (ja) 2025-08-05

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