JP7384748B2 - Substrate processing method and substrate processing apparatus - Google Patents

Description

The present application relates to a substrate processing method and a substrate processing apparatus.

Conventionally, in the manufacturing process of semiconductor devices, etc., various processing solutions such as pure water, photoresist solution, and etching solution are supplied to the substrate to perform various processing such as cleaning processing, resist coating processing, and etching processing. Substrate processing is in progress. As an apparatus for processing a substrate using these processing liquids, a substrate processing apparatus that discharges the processing liquid from a nozzle onto the surface of the substrate while rotating the substrate in a horizontal position is widely used.

In this substrate processing apparatus, the nozzle is connected to a processing liquid supply source via piping, and the piping is provided with a valve. The valve is controlled by a control section, and when the control section outputs an open signal, the valve opens, and when the control section outputs a close signal, the valve closes. When the valve opens, the processing liquid is discharged from the nozzle, and when the valve closes, the discharge of the processing liquid from the nozzle is stopped.

In such a substrate processing apparatus, it has been proposed to provide an imaging means such as a camera to monitor the discharge of the processing liquid from the nozzle (Patent Documents 1 and 2). The imaging means sequentially images an imaging region including the tip of the nozzle to obtain image data. The image processing unit receives the image data and determines whether or not the processing liquid is ejected from the nozzle based on pixel values in a determination area set below the nozzle in the image data.

Patent No. 2008-135679 Patent No. 2015-173148

By closing the valve, discharge of the processing liquid from the nozzle is stopped. When this ejection is stopped, droplets of the processing liquid may fall from the nozzle. This kind of droplet falling is also called dripping. Furthermore, due to a valve malfunction or the like, a thin processing liquid may continue to flow down from the nozzle. Such a downstream flow of the processing liquid is also called an outflow.

In order to detect such leakage of processing liquid (including dripping and outflow), it is conceivable to monitor the nozzle even after outputting a close signal to the valve.

By the way, the nozzle may be moved after outputting a close signal to the valve. When the nozzle moves, the position of the nozzle also changes within the image data acquired by the imaging means. If the position of the nozzle changes within the image data, the processing liquid from the nozzle may shift from the determination area within the image data. In this case, it is not possible to monitor ejection abnormalities such as dripping or overflow based on the pixel values within the determination area, and liquid leakage cannot be detected.

Further, the substrate processing apparatus may be provided with a plurality of nozzles. For example, after the first nozzle finishes discharging the processing liquid, the second nozzle may start discharging the processing liquid while moving the first nozzle. In this case, if the processing liquid from the second nozzle enters the determination area in the image data, the processing liquid may be erroneously detected as a liquid leak.

Therefore, the present application was made in view of the above problems, and aims to provide a technology that can appropriately monitor liquid leakage from a nozzle even after outputting a closing signal to the valve. .

A first aspect of the substrate processing method includes a holding step of holding the substrate, and outputting an open signal to a valve provided in a supply pipe to remove the main part of the substrate from the tip of a first nozzle connected to the supply pipe. a first discharging step of discharging the processing liquid onto the surface; a moving step of moving the first nozzle after outputting a close signal to the valve to end the first discharging step; an imaging step in which a camera sequentially images a predetermined area including the tip of the first nozzle during movement of the first nozzle in the movement step after outputting a close signal to obtain a plurality of image data; and detecting the position of the first nozzle in each of the plurality of image data acquired while the first nozzle is moving with a close signal being output to the valve, and determining the determination area by determining the position of the first nozzle in each of the plurality of image data. a setting step of setting the determination area below the tip of the first nozzle by following a change in the position of the first nozzle during the time; a liquid leak monitoring step of monitoring the presence or absence of processing liquid falling from the tip of the first nozzle based on pixels within the determination area in each of the plurality of image data acquired during movement of the first nozzle; Be prepared.

A second aspect of the substrate processing method is the substrate processing method according to the first aspect, in which the first nozzle is raised in the moving step.

A third aspect of the substrate processing method is the substrate processing method according to the second aspect, comprising: discharging a processing liquid from a second nozzle onto the main surface of the substrate while the first nozzle is raised. further comprising two discharge steps, in the liquid leakage monitoring step, setting the determination area in accordance with the rise of the first nozzle in the image data acquired by the camera in the second discharge step; Then, the determination area is set while avoiding the processing liquid from the tip of the second nozzle to the main surface of the substrate.

In an embodiment of the substrate processing apparatus, a substrate holding part that holds a substrate is connected to a supply pipe provided in a valve, and the processing liquid supplied through the supply pipe is supplied to the main body of the substrate held by the substrate holding part. A nozzle that discharges onto a surface, a moving mechanism that moves the nozzle, a camera that images a predetermined area including the tip of the nozzle, and an opening signal that outputs an opening signal to the valve to move the nozzle from the tip to the main surface of the substrate After the time when the processing liquid is discharged to the valve and the discharging of the processing liquid is ended by outputting a close signal to the valve, the nozzle is moved by the moving mechanism, and at least after the time when a close signal is output to the valve. While the nozzle is moving , the position of the nozzle in each of the plurality of image data sequentially acquired by the camera is detected, and the determination area is made to follow the change in the position of the nozzle between the plurality of image data. , the determination area is set below the tip of the nozzle, and the presence or absence of processing liquid falling from the tip of the nozzle is monitored based on pixels within the determination area in each of the plurality of image data. A control unit.

According to the substrate processing method and substrate processing apparatus, liquid leakage can be appropriately detected.

1 is a diagram schematically showing an example of the overall configuration of a substrate processing apparatus. FIG. 2 is a plan view schematically showing an example of the configuration of a processing unit. FIG. 2 is a side view schematically showing an example of the configuration of a processing unit. FIG. 3 is a plan view schematically showing an example of a nozzle movement path. FIG. 2 is a functional block diagram showing an example of an internal configuration of a control unit. 3 is a flowchart illustrating an example of the operation of a processing unit. It is a flowchart which shows an example of a specific process of a processing liquid process. It is a flowchart which shows a specific example of monitoring processing. FIG. 3 is a diagram schematically showing an example of captured image data. FIG. 3 is a diagram schematically showing an example of captured image data. FIG. 3 is a diagram schematically showing an example of captured image data. FIG. 3 is a diagram schematically showing an example of captured image data. FIG. 3 is a diagram schematically showing an example of how droplets of a processing liquid fall. FIG. 3 is a diagram schematically showing an example of captured image data.

Embodiments will be described below with reference to the accompanying drawings. Note that the drawings are shown schematically, and for convenience of explanation, structures are omitted or simplified as appropriate. Further, the sizes and positional relationships of the structures shown in the drawings are not necessarily accurately described and may be changed as appropriate.

In addition, in the following description, similar components are shown with the same reference numerals, and their names and functions are also the same. Therefore, detailed descriptions thereof may be omitted to avoid duplication.

In addition, in the description below, even if ordinal numbers such as "first" or "second" are used, these terms are used to make it easier to understand the content of the embodiments. They are used for convenience and are not limited to the order that can occur based on these ordinal numbers.

Expressions indicating relative or absolute positional relationships (e.g., "in one direction," "along one direction," "parallel," "perpendicular," "centered," "concentric," "coaxial," etc.) are used unless otherwise specified. It does not only strictly represent the positional relationship, but also represents the state of relative displacement in terms of angle or distance within a range where tolerance or the same level of function can be obtained. Unless otherwise specified, expressions indicating equal states (e.g., "same," "equal," "homogeneous," etc.) do not only mean quantitatively strictly equal states, but also mean that tolerances or functions of the same degree can be obtained. It also represents a state in which a difference exists. Unless otherwise specified, expressions that indicate a shape (e.g., "quadrangular shape" or "cylindrical shape") do not only strictly represent the shape geometrically, but also include, to the extent that the same degree of effect can be obtained, e.g. Shapes with irregularities, chamfers, etc. are also represented. The expressions "comprising," "comprising," "comprising," "containing," or "having" one component are not exclusive expressions that exclude the presence of other components. The expression "at least one of A, B, and C" includes only A, only B, only C, any two of A, B, and C, and all of A, B, and C.

<Overall configuration of substrate processing equipment>
FIG. 1 is a schematic plan view for explaining an example of the internal layout of a substrate processing apparatus 100 according to the present embodiment. As an example is shown in FIG. 1, the substrate processing apparatus 100 is a single-wafer processing apparatus that processes one substrate W to be processed one by one.

The substrate processing apparatus 100 according to the present embodiment performs a cleaning process on a substrate W, which is a silicon substrate having a circular thin plate shape, using a chemical solution and a rinsing liquid such as pure water, and then performs a drying process.

As the above chemical solution, for example, a mixed solution of ammonia and hydrogen peroxide solution (SC1), a mixed solution of hydrochloric acid and hydrogen peroxide solution (SC2), or DHF solution (diluted hydrofluoric acid) is used.

In the following description, chemical solutions, rinsing solutions, organic solvents, and the like will be collectively referred to as "processing solutions." Note that the "processing liquid" includes not only a cleaning process but also a chemical liquid for removing an unnecessary film, a chemical liquid for etching, and the like.

The substrate processing apparatus 100 includes a plurality of processing units 1, a load port LP, an indexer robot 102, a main transfer robot 103, and a control section 9.

As the carrier, a FOUP (Front Opening Unified Pod) that stores the substrate W in a closed space, a SMIF (Standard Mechanical Interface) pod, or an OC (Open Cassette) that exposes the substrate W to the outside air may be adopted. Further, the transfer robot transfers the substrate W between the carrier and the main transfer robot 103.

The processing unit 1 performs liquid processing and drying processing on one substrate W. In the substrate processing apparatus 100 according to this embodiment, twelve processing units 1 having a similar configuration are arranged.

Specifically, four towers each including three processing units 1 stacked vertically are arranged to surround the main transfer robot 103.

In FIG. 1, one of the three stacked processing units 1 is schematically shown. Note that the number of processing units 1 in the substrate processing apparatus 100 is not limited to 12, and may be changed as appropriate.

The main transfer robot 103 is installed at the center of four towers in which the processing units 1 are stacked. The main transfer robot 103 carries the substrate W to be processed received from the indexer robot 102 into each processing unit. Further, the main transfer robot 103 carries out the processed substrate W from each processing unit 1 and transfers it to the indexer robot 102 . The control unit 9 controls the operation of each component of the substrate processing apparatus 100.

Hereinafter, one of the 12 processing units 1 installed in the substrate processing apparatus 100 will be described, but the other processing units 1 also have the same configuration except that the arrangement of the nozzles is different.

<Processing unit>
Next, the processing unit 1 will be explained. Hereinafter, one of the twelve processing units 1 installed in the substrate processing apparatus 100 will be explained. FIG. 2 is a plan view schematically showing an example of the configuration of the processing unit 1. As shown in FIG. Further, FIG. 3 is a vertical cross-sectional view schematically showing an example of the configuration of the processing unit 1. As shown in FIG.

The processing unit 1 includes, in the chamber 10, a spin chuck 20, which is an example of a substrate holding section, a nozzle 30, a nozzle 60, a nozzle 65, a fixed nozzle 80, a processing cup 40, and a camera 70.

The chamber 10 includes a side wall 11 extending in the vertical direction, a ceiling wall 12 closing the upper side of a space surrounded by the side wall 11, and a floor wall 13 closing the lower side. A space surrounded by side walls 11, ceiling wall 12, and floor wall 13 becomes a processing space. In addition, a part of the side wall 11 of the chamber 10 is provided with a carry-in/out port through which the main transfer robot 103 carries in and out the substrate W, and a shutter for opening/closing the carry-in/out port (both not shown).

A fan filter unit (FFU) 14 is attached to the ceiling wall 12 of the chamber 10 for further purifying the air in the clean room in which the substrate processing apparatus 100 is installed and supplying the purified air to the processing space in the chamber 10. . The fan filter unit 14 includes a fan and a filter (for example, a HEPA (High Efficiency Particulate Air) filter) for taking in air in the clean room and sending it into the chamber 10. Form a flow. In order to uniformly disperse the clean air supplied from the fan filter unit 14, a punching plate having a large number of blowing holes may be provided directly under the ceiling wall 12.

The spin chuck 20 holds the substrate W in a horizontal position. The horizontal posture is a posture in which the normal line of the substrate W is along the vertical direction. The spin chuck 20 includes a disk-shaped spin base 21 fixed in a horizontal position to the upper end of a rotating shaft 24 extending in the vertical direction. A spin motor 22 that rotates a rotating shaft 24 is provided below the spin base 21 . The spin motor 22 rotates the spin base 21 in a horizontal plane via a rotation shaft 24. Further, a cylindrical cover member 23 is provided to surround the spin motor 22 and the rotating shaft 24.

The outer diameter of the disk-shaped spin base 21 is slightly larger than the diameter of the circular substrate W held by the spin chuck 20. Therefore, the spin base 21 has an upper surface 21a that faces the entire lower surface of the substrate W to be held.

A plurality of (four in this embodiment) chuck pins 26 are provided upright on the peripheral edge of the upper surface 21a of the spin base 21. The plurality of chuck pins 26 are spaced at equal intervals along the circumference corresponding to the periphery of the circular substrate W (if there are four chuck pins 26 as in this embodiment, they are spaced at 90° intervals). It is located. Each chuck pin 26 is provided so as to be movable between a holding position in which it contacts the periphery of the substrate W and an open position away from the periphery of the substrate W. The plurality of chuck pins 26 are driven in conjunction with each other by a link mechanism (not shown) housed within the spin base 21. By stopping the plurality of chuck pins 26 at their contact positions, the spin chuck 20 can hold the substrate W in a horizontal position above the spin base 21 and close to the upper surface 21a (Fig. 3 ), the holding of the substrate W can be released by stopping the plurality of chuck pins 26 at their respective open positions.

A cover member 23 that covers the spin motor 22 has its lower end fixed to the floor wall 13 of the chamber 10, and its upper end reaches just below the spin base 21. A flange-like member 25 is provided at the upper end of the cover member 23, projecting outward from the cover member 23 substantially horizontally and further bent downward. With the spin chuck 20 holding the substrate W by the plurality of chuck pins 26, the spin motor 22 rotates the rotation shaft 24 to rotate the substrate W around the rotation axis CX along the vertical direction passing through the center of the substrate W. The substrate W can be rotated. Note that the drive of the spin motor 22 is controlled by the control section 9.

The nozzle 30 is configured by attaching a discharge head 31 to the tip of a nozzle arm 32. The base end side of the nozzle arm 32 is fixedly connected to a nozzle base 33. The nozzle base 33 is rotatable around a vertical axis by a motor (not shown). As the nozzle base 33 rotates, the nozzle 30 moves in an arc shape within the space above the spin chuck 20, as indicated by an arrow AR34 in FIG. These nozzle arm 32, nozzle base 33, and motor are an example of a moving mechanism 37 that moves the nozzle 30.

FIG. 4 is a plan view schematically showing an example of the movement path of the nozzle 30. As illustrated in FIG. 4 , the ejection head 31 of the nozzle 30 moves along the circumferential direction around the nozzle base 33 due to the rotation of the nozzle base 33 . The nozzle 30 can be stopped at an appropriate position. In the example of FIG. 4, the nozzle 30 can be stopped at each of a center position P31, a peripheral position P32, and a standby position P33.

The center position P31 is a position where the ejection head 31 faces the center of the substrate W held by the spin chuck 20 in the vertical direction. When the nozzle 30 located at the center position P31 discharges the processing liquid onto the main surface (top surface) of the rotating substrate W, the processing liquid lands on the center of the top surface of the substrate W and is applied to the substrate W by centrifugal force. It spreads over the entire upper surface and scatters outward from the periphery of the substrate W. Thereby, the processing liquid can be supplied to the entire upper surface of the substrate W, and the entire upper surface of the substrate W can be processed.

The peripheral edge position P32 is a position where the ejection head 31 faces the peripheral edge of the substrate W held by the spin chuck 20 in the vertical direction. When the nozzle 30 located at the peripheral edge position P32 discharges the processing liquid onto the upper surface of the rotating substrate W, the processing liquid lands on the peripheral edge of the upper surface of the substrate W and moves toward the peripheral edge of the substrate W under the influence of centrifugal force. and scatters outward from the periphery of the substrate W. Thereby, the processing liquid can be supplied only to the peripheral edge of the upper surface of the substrate W, and only the peripheral edge of the substrate W can be processed (so-called bevel processing).

Further, the nozzle 30 can also discharge the processing liquid onto the upper surface of the rotating substrate W while reciprocating between the center position P31 and the peripheral position P32. Also in this case, the entire upper surface of the substrate W can be processed.

Note that the nozzle 30 does not need to discharge the processing liquid at the peripheral edge position P32. For example, the peripheral position P32 may be a relay position where the nozzle 30 temporarily waits when moving from the center position P31 to the standby position P33.

The standby position P33 is a position where the ejection head 31 does not face the substrate W held by the spin chuck 20 in the vertical direction. A standby pod that accommodates the ejection head 31 of the nozzle 30 may be provided at the standby position P33.

Further, the nozzle 30 can be moved up and down. For example, the nozzle 30 is raised and lowered by a nozzle raising and lowering mechanism (not shown) built into the nozzle base 63. The nozzle elevating mechanism includes, for example, a ball screw structure. The nozzle 30 can also be stopped, for example, at an upper center position P36 located vertically above the center position P31.

As illustrated in FIG. 3, the nozzle 30 is connected to a processing liquid supply source 36 via a supply pipe 34. The supply pipe 34 is provided with a valve 35 . The valve 35 opens and closes the flow path of the supply pipe 34. When the valve 35 opens, the processing liquid from the processing liquid supply source 36 is supplied to the nozzle 30 through the supply pipe 34 and is discharged from the tip of the nozzle 30.

Further, as illustrated in FIG. 2, the processing unit 1 of this embodiment is further provided with a nozzle 60 and a nozzle 65 in addition to the nozzle 30 described above. Nozzle 60 and nozzle 65 of this embodiment have the same configuration as nozzle 30 described above. That is, the nozzle 60 is configured by attaching a discharge head 61 to the tip of a nozzle arm 62. The nozzle 60 uses a nozzle base 63 connected to the base end side of the nozzle arm 62 to move the space above the spin chuck 20 to a central position facing the central part of the substrate W, as shown by an arrow AR64. It is movable in an arc between a standby position outside the substrate W and a standby position.

Similarly, the nozzle 65 is configured by attaching a discharge head 66 to the tip of a nozzle arm 67. The nozzle 65 uses a nozzle base 68 connected to the base end side of the nozzle arm 67 to move the space above the spin chuck 20 to a central position facing the central part of the substrate W, as shown by an arrow AR69. It is movable in an arc between a standby position outside the substrate W and a standby position.

Further, the nozzle 60 and the nozzle 65 may also be provided so as to be movable up and down.

Like the nozzle 30, each of the nozzle 60 and the nozzle 65 is also connected to a processing liquid supply source (not shown) via a supply pipe (not shown). Each supply pipe is provided with a valve (not shown), and supply/stop of the processing liquid is switched by opening and closing the valve. Note that each of the nozzle 60 and the nozzle 65 may be configured to be supplied with a plurality of types of processing liquids including at least pure water.

Further, at least one of the nozzle 30, the nozzle 60, and the nozzle 65 generates droplets by mixing a cleaning liquid such as pure water with pressurized gas, and transfers the mixed fluid of the droplets and the gas to the substrate. A two-fluid nozzle that injects water to W may also be used. Further, the number of nozzles provided in the processing unit 1 is not limited to three, but may be one or more.

In the example of FIGS. 2 and 3, the processing unit 1 is also provided with a fixed nozzle 80. The fixed nozzle 80 is located above the spin chuck 20 and radially outward from the periphery of the spin chuck 20. As a more specific example, the fixed nozzle 80 is provided at a position facing a processing cup 40, which will be described later, in the vertical direction. The ejection opening of the fixed nozzle 80 faces the substrate W, and its opening axis extends, for example, in the horizontal direction. The fixed nozzle 80 also discharges a processing liquid (for example, pure water) onto the upper surface of the substrate W held by the spin chuck 20. The processing liquid discharged from the fixed nozzle 80 lands on the center of the upper surface of the substrate W, for example.

As illustrated in FIG. 3, the fixed nozzle 80 is connected to a processing liquid supply source 83 via a supply pipe 81. A valve 82 is provided in the supply pipe 81 . The valve 82 opens and closes the flow path of the supply pipe 81. By opening the valve 82, the processing liquid from the processing liquid supply source 83 is supplied to the fixed nozzle 80 through the supply pipe 81, and is discharged from the tip of the fixed nozzle 80.

The processing cup 40 surrounding the spin chuck 20 includes an inner cup 41, a middle cup 42, and an outer cup 43 that can be raised and lowered independently of each other. The inner cup 41 surrounds the spin chuck 20 and has a shape that is substantially rotationally symmetrical with respect to the rotation axis CX passing through the center of the substrate W held by the spin chuck 20. The inner cup 41 includes a bottom portion 44 which is annular in plan view, a cylindrical inner wall portion 45 rising upward from the inner peripheral edge of the bottom portion 44, a cylindrical outer wall portion 46 rising upward from the outer peripheral edge of the bottom portion 44, and an inner wall. A first guide portion 47 rises from between the portion 45 and the outer wall portion 46 and extends diagonally upward toward the center (in a direction approaching the rotational axis CX of the substrate W held by the spin chuck 20) while the upper end portion draws a smooth arc. and a cylindrical inner wall part 48 rising upward from between the first guide part 47 and the outer wall part 46.

The inner wall portion 45 is formed to have a length such that the inner cup 41 is accommodated with an appropriate gap between the cover member 23 and the brim member 25 when the inner cup 41 is in the highest raised state. The inner wall portion 48 is housed with the inner cup 41 and the middle cup 42 closest to each other, with an appropriate gap being maintained between a second guide portion 52 (described later) of the middle cup 42 and a processing liquid separation wall 53. It is formed in such a length that it

The first guide portion 47 has an upper end portion 47b that extends diagonally upward toward the center (in a direction approaching the rotational axis CX of the substrate W) while drawing a smooth arc. Further, between the inner wall portion 45 and the first guide portion 47 is a waste groove 49 for collecting and discarding used processing liquid. Between the first guide portion 47 and the inner wall portion 48 is an annular inner recovery groove 50 for collecting and recovering used processing liquid. Further, between the inner wall portion 48 and the outer wall portion 46 is an annular outer recovery groove 51 for collecting and recovering a different type of processing liquid from the inner recovery groove 50.

A discharge liquid mechanism (not shown) is connected to the waste groove 49 for discharging the processing liquid collected in the waste groove 49 and forcibly exhausting the inside of the waste groove 49. For example, four exhaust liquid mechanisms are provided at equal intervals along the circumferential direction of the waste groove 49. In addition, the inner recovery groove 50 and the outer recovery groove 51 have a recovery mechanism (for recovering the processing liquid collected in the inner recovery groove 50 and the outer recovery groove 51, respectively, into a recovery tank provided outside the processing unit 1). (both not shown) are connected. The bottoms of the inner recovery groove 50 and the outer recovery groove 51 are inclined at a slight angle with respect to the horizontal direction, and the recovery mechanism is connected to the lowest position thereof. Thereby, the processing liquid that has flowed into the inner recovery groove 50 and the outer recovery groove 51 is smoothly recovered.

The middle cup 42 surrounds the spin chuck 20 and has a shape that is substantially rotationally symmetrical with respect to the rotation axis CX passing through the center of the substrate W held by the spin chuck 20. The inner cup 42 integrally includes a second guide portion 52 and a cylindrical processing liquid separation wall 53 connected to the second guide portion 52 .

The second guide part 52 has a lower end part 52a that is coaxial with the lower end of the first guide part 47 and a cylindrical shape on the outside of the first guide part 47 of the inner cup 41, and a smooth arc drawn from the upper end of the lower end part 52a. The upper end portion 52b extends obliquely upward toward the center (in the direction approaching the rotational axis CX of the substrate W), and the folded portion 52c is formed by folding back the tip of the upper end portion 52b downward. The lower end portion 52a is accommodated in the inner collecting groove 50 with an appropriate gap maintained between the first guide portion 47 and the inner wall portion 48, with the inner cup 41 and the middle cup 42 being closest to each other. The upper end portion 52b is provided to vertically overlap the upper end portion 47b of the first guide portion 47 of the inner cup 41, and when the inner cup 41 and the middle cup 42 are closest to each other, the first guide portion 47 It approaches the upper end portion 47b of , keeping a very small distance therebetween. Furthermore, the folded part 52c formed by folding back the tip of the upper end part 52b downward is such that when the inner cup 41 and the middle cup 42 are closest to each other, the folded part 52c is the tip of the upper end part 47b of the first guide part 47. The length is such that they overlap horizontally.

Further, the upper end portion 52b of the second guide portion 52 is formed so that the wall thickness becomes thicker toward the bottom, and the processing liquid separation wall 53 is provided so as to extend downward from the outer peripheral edge of the lower end of the upper end portion 52b. It has a cylindrical shape. The processing liquid separation wall 53 is accommodated in the outer collection groove 51 with the inner cup 41 and the middle cup 42 being closest to each other, with an appropriate gap being maintained between the inner wall portion 48 and the outer cup 43.

The outer cup 43 surrounds the spin chuck 20 on the outside of the second guide portion 52 of the middle cup 42 and is approximately rotationally symmetrical with respect to the rotation axis CX passing through the center of the substrate W held by the spin chuck 20. It has a shape. This outer cup 43 has a function as a third guide section. The outer cup 43 has a lower end portion 43a coaxial with the lower end portion 52a of the second guide portion 52 and a cylindrical shape, and a smooth arc drawn from the upper end of the lower end portion 43a toward the center (in the direction approaching the rotation axis CX of the substrate W). It has an upper end portion 43b extending obliquely upward, and a folded portion 43c formed by folding back the tip of the upper end portion 43b downward.

When the inner cup 41 and the outer cup 43 are closest to each other, the lower end portion 43a maintains an appropriate gap between the processing liquid separation wall 53 of the inner cup 42 and the outer wall portion 46 of the inner cup 41, and is connected to the outer recovery groove. 51. Further, the upper end portion 43b is provided to overlap the second guide portion 52 of the middle cup 42 in the vertical direction, and when the middle cup 42 and the outer cup 43 are closest to each other, the upper end portion 52b of the second guide portion 52 be close to it, keeping a very small distance from it. Furthermore, the folded part 43c formed by folding back the tip of the upper end part 43b downward is such that when the inner cup 42 and the outer cup 43 are closest to each other, the folded part 43c meets the folded part 52c of the second guide part 52. They are formed to overlap in the horizontal direction.

Moreover, the inner cup 41, the middle cup 42, and the outer cup 43 can be raised and lowered independently of each other. That is, each of the inner cup 41, the middle cup 42, and the outer cup 43 is individually provided with a cup elevating mechanism (not shown), so that they are raised and lowered independently. As such a cup elevating mechanism, various known mechanisms such as a ball screw mechanism or an air cylinder can be employed.

The partition plate 15 is provided around the processing cup 40 so as to partition the inner space of the chamber 10 into upper and lower parts. The partition plate 15 may be a single plate-like member surrounding the processing cup 40, or may be a plurality of plate-like members connected together. Further, the partition plate 15 may be formed with a through hole or a notch passing through the thickness direction, and in this embodiment, the nozzle base 33 of the nozzle 30, the nozzle base 63 of the nozzle 60, and the nozzle 65 are A through hole is formed through which a support shaft for supporting the nozzle base 68 passes.

The outer peripheral end of the partition plate 15 is connected to the side wall 11 of the chamber 10. Further, the edge portion of the partition plate 15 surrounding the processing cup 40 is formed into a circular shape having a larger diameter than the outer diameter of the outer cup 43. Therefore, the partition plate 15 does not become an obstacle to the raising and lowering of the outer cup 43.

Further, an exhaust duct 18 is provided in a part of the side wall 11 of the chamber 10 and near the floor wall 13. The exhaust duct 18 is communicatively connected to an exhaust mechanism (not shown). Among the clean air supplied from the fan filter unit 14 and flowing down inside the chamber 10, the air that has passed between the processing cup 40 and the partition plate 15 is discharged from the exhaust duct 18 to the outside of the apparatus.

The camera 70 is installed inside the chamber 10 and above the partition plate 15. The camera 70 includes, for example, a CCD (Charge Coupled Device), which is one of solid-state imaging devices, and an optical system such as a lens. The camera 70 is provided, for example, to monitor the discharge state of the processing liquid from the nozzle 30. The imaging area of the camera 70 includes the substrate W and the space above the substrate W. This imaging area includes, for example, the tip of the nozzle 30 when stopped at the center position P31, and also includes the tip of the nozzle 30 when stopped at the upper center position P36. The camera 70 images the imaging area to obtain captured image data, and sequentially outputs the obtained captured image data to the control unit 9.

As shown in FIG. 3, a lighting section 71 is provided within the chamber 10 at a position above the partition plate 15. When the inside of the chamber 10 is a dark room, the control unit 9 may control the illumination unit 71 so that the illumination unit 71 emits light when the camera 70 captures an image.

The hardware configuration of the control unit 9 provided in the substrate processing apparatus 100 is the same as that of a general computer. That is, the control unit 9 stores a processing unit such as a CPU that performs various calculation processes, a temporary storage medium such as a ROM (Read Only Memory) that is a read-only memory that stores basic programs, and various information. It is configured to include a RAM (Random Access Memory) which is a readable and writable memory, and a non-temporary storage medium such as a magnetic disk that stores control software or data. By the CPU of the control unit 9 executing a predetermined processing program, each operating mechanism of the substrate processing apparatus 100 is controlled by the control unit 9, and processing in the substrate processing apparatus 100 proceeds. Note that the control unit 9 may be realized by a dedicated hardware circuit that does not require software to realize its functions.

FIG. 5 is a functional block diagram schematically showing an example of the internal configuration of the control section 9. As shown in FIG. The control section 9 includes a monitoring processing section 91 , a determination area setting section 92 , and a processing control section 93 .

The processing control section 93 controls each component within the chamber 10 . Specifically, the processing control unit 93 controls the spin motor 22, various valves such as the valves 35 and 82, the motors of the nozzle bases 33, 63, and 68, the nozzle lifting mechanism, the cup lifting mechanism, and the fan filter unit 14. . The processing control section 93 controls these configurations according to a predetermined procedure, so that the processing unit 1 can perform processing on the substrate W.

The monitoring processing unit 91 performs monitoring processing based on captured image data obtained by imaging the inside of the chamber 10 by the camera 70. Specifically, for example, the camera 70 captures an image of a predetermined area including the tip of the nozzle 30 to obtain captured image data, and the monitoring processing unit 91 monitors the processing liquid from the nozzle 30 based on the captured image data. Monitor the discharge status.

The determination area setting unit 92 sets a determination area in the captured image data that is used to determine the discharge state of the processing liquid from the nozzle 30. The determination area will be detailed later.

<Example of substrate processing flow>
<Overall flow>
FIG. 6 is a flowchart showing an example of the flow of substrate processing. First, the main transfer robot 103 carries an unprocessed substrate W into the processing unit 1 (step S1: carrying process). Next, the spin chuck 20 holds the substrate W in a horizontal position (step S2: holding step). Specifically, the plurality of chuck pins 26 hold the substrate W by moving the plurality of chuck pins 26 to their respective contact positions.

Next, the spin motor 22 starts rotating the substrate W (step S3: rotation step). Specifically, the spin motor 22 rotates the spin chuck 20, thereby rotating the substrate W held by the spin chuck 20. Next, the cup elevating mechanism raises the processing cup 40 (step S4: cup elevating step). This causes the processing cup 40 to stop at the upper position.

Next, a processing liquid is sequentially supplied to the substrate W (step S5: processing liquid process). Note that in this processing liquid step (step S5), the cup elevating mechanism changes the cup to be raised as appropriate depending on the type of processing liquid supplied to the substrate W, but this point is not the essence of this embodiment. Since it is different from the above, its explanation will be omitted below.

In the treatment liquid step (step S5), the nozzle 30, the nozzle 60, the nozzle 65, and the fixed nozzle 80 each sequentially discharge a treatment liquid onto the upper surface of the substrate W as necessary. Here, as an example, it is assumed that the fixed nozzle 80 discharges the processing liquid after the nozzle 30 discharges the processing liquid. FIG. 7 is a flowchart showing a specific example of a part of the treatment liquid process. As a specific example, first, the nozzle base 33 moves the nozzle 30 from the standby position P33 to the center position P31 (step S51: first nozzle moving step). Next, the processing control unit 93 outputs an open signal to the valve 35 to open the valve 35 (step S52: first discharge step). As a result, the processing liquid from the processing liquid supply source 36 is supplied to the nozzle 30 through the supply pipe 34, and is discharged onto the upper surface of the substrate W from the tip of the nozzle 30. The processing liquid that has landed on the upper surface of the substrate W spreads under the influence of centrifugal force and scatters outward from the periphery of the substrate W. Thereby, processing depending on the processing liquid can be performed on the upper surface of the substrate W.

For example, when a predetermined period of time has elapsed since the start of discharging the processing liquid from the nozzle 30, the processing control section 93 outputs a close signal to the valve 35, thereby closing the valve 35. As a result, the discharge of the processing liquid from the nozzle 30 is stopped.

Next, the nozzle base 33 raises the nozzle 30 from the center position P31 to the upper center position P36 (step S53: second moving step).

Next, the processing control unit 93 outputs an open signal to the valve 82 to open the valve 82 (step S54: second discharge step). As a result, the processing liquid from the processing liquid supply source 83 is supplied to the fixed nozzle 80 through the supply pipe 81 and is discharged from the fixed nozzle 80 onto the upper surface of the substrate W. The processing liquid discharged from the fixed nozzle 80 is, for example, a rinsing liquid such as pure water. In this case, the rinsing liquid washes away the processing liquid on the upper surface of the substrate W, and the processing liquid on the upper surface of the substrate W is replaced with the rinsing liquid.

In the example of FIG. 7, the movement of the nozzle 30 is started (step S53) before the discharge of the processing liquid from the fixed nozzle 80 (step S54) is started. Therefore, the possibility that the processing liquid discharged from the fixed nozzle 80 will collide with the nozzle 30 can be reduced.

Then, for example, when a predetermined period of time has elapsed from the start of discharging the processing liquid from the fixed nozzle 80, the processing control section 93 outputs a close signal to the valve 82 to close the valve 82. As a result, the discharge of the processing liquid from the fixed nozzle 80 is stopped.

After step S54, the nozzle 30, nozzle 60, and nozzle 65 may be sequentially moved to predetermined positions as necessary to discharge the processing liquid. Further, the fixed nozzle 80 may also appropriately discharge the processing liquid as necessary. When the discharge of the treatment liquid from the nozzle 30, nozzle 60, nozzle 65, and fixed nozzle 80 is completed, the treatment liquid step (step S5) is completed.

Referring again to FIG. 6, after the processing liquid process (step S5) is completed, the processing unit 1 dries the substrate W (step S6: drying process). For example, the spin motor 22 increases the rotational speed of the substrate W to dry the substrate W (so-called spin drying).

Next, the cup elevating mechanism lowers the processing cup 40 (step S7: cup lowering step).

Next, the spin motor 22 finishes rotating the spin chuck 20 and the substrate W, and the spin chuck 20 releases the holding of the substrate W (step S8: holding release step). Specifically, the holding is released by moving the plurality of chuck pins 26 to their respective open positions.

Next, the main transfer robot 103 carries out the processed substrate W from the processing unit 1 (step S9: carrying out process).

As described above, the substrate W is processed.

<Monitoring>
The monitoring processing unit 91 uses the camera 70 to monitor the discharge state of the treatment liquid in the treatment liquid step (step S5). FIG. 8 is a flowchart showing a specific example of monitoring processing. The camera 70 sequentially captures images in the treatment liquid process (step S5) and sequentially acquires captured image data (step S11: imaging process). For example, the camera 70 acquires moving image data at a predetermined frame rate. In this case, the captured image data corresponds to one frame of moving image data. 9 to 11 are diagrams schematically showing examples of captured image data.

FIG. 9 shows an example of captured image data acquired by the camera 70 when the nozzle 30 stops at the center position P31. In this captured image data, the nozzle 30 has not yet discharged the processing liquid.

FIG. 10 shows an example of captured image data acquired by the camera 70 while the nozzle 30 stopped at the center position P31 is discharging the processing liquid. This captured image data includes a column of processing liquid flowing down from the tip of the nozzle 30.

As can be understood from FIG. 10, the processing liquid discharged from the nozzle 30 is included in a region below the tip of the nozzle 30 in the captured image data. Therefore, by setting the determination region R1 that includes this region, the monitoring processing unit 91 can monitor the discharge state of the processing liquid from the nozzle 30 based on the pixel values within the determination region R1. For example, as can be understood from FIGS. 9 and 10, the pixel values in the determination region R1 are different when the nozzle 30 discharges the treatment liquid and when the nozzle 30 does not discharge the treatment liquid. For example, the sum of pixel values in the determination region R1 when the nozzle 30 is discharging the processing liquid is greater than the sum of the pixel values within the determination region R1 when the nozzle 30 is not discharging the processing liquid. .

Therefore, first, the determination area setting unit 92 sets the above-mentioned determination area R1 (step S12: setting step). Specifically, the determination area setting unit 92 first performs image processing on the captured image data to detect the coordinate position of the nozzle 30. For example, the determination area setting unit 92 performs template matching between the captured image data and the reference image data RI1 including the nozzle 30 (specifically, the ejection head 31) stored in a storage medium in advance. The coordinate position of the nozzle 30 is detected. In the example of FIG. 9, the reference image data RI1 is schematically shown by a virtual line superimposed on the captured image data.

Next, the determination area setting unit 92 sets a determination area R1 according to the coordinate position of the nozzle 30. Specifically, the determination area setting unit 92 sets the determination area R1 so that the determination area R1 includes an area extending downward from the tip of the nozzle 30. In the examples of FIGS. 9 and 10, the determination region R1 has a rectangular shape extending in the vertical direction.

The relative position of the determination region R1 with respect to the coordinate position of the nozzle 30 is set in advance, for example, and is stored in the storage medium as setting information. Further, the shape and size of the determination region R1 are also set in advance, for example, and stored in the storage medium as setting information. The determination area setting unit 92 sets the determination area R1 based on the coordinate position of the nozzle 30 detected by template matching and the setting information stored in the storage medium.

The monitoring processing unit 91 determines the discharge state of the treatment liquid from the nozzle 30 based on the pixel values within the determination region R1 (step S13: monitoring step). Specifically, the monitoring processing unit 91 determines whether the total sum of pixel values within the determination region R1 is equal to or greater than a predetermined ejection reference value, and when the total sum is equal to or greater than the ejection reference value, the nozzle 30 It is determined that the processing liquid is being discharged. Further, the monitoring processing unit 91 determines that the nozzle 30 is not discharging the processing liquid when the total sum is less than the discharge reference value.

Note that the determination of whether or not the processing liquid is ejected based on the pixel values within the determination region R1 is not limited to this, and various methods can be employed. For example, the dispersion of pixel values within the determination region R1 when the nozzle 30 is discharging the processing liquid is larger than the dispersion when the nozzle 30 is not discharging the processing liquid. Therefore, the monitoring processing unit 91 may calculate the dispersion and determine whether or not the processing liquid is ejected based on the magnitude of the dispersion. It is also possible to use standard deviation instead of variance.

The monitoring processing unit 91 performs the above-described processing on each of the captured image data sequentially acquired by the camera 70, thereby determining the start timing at which the nozzle 30 starts discharging the processing liquid, and the timing at which the nozzle 30 starts discharging the processing liquid. It is possible to detect the end timing at which the ejection of the liquid is completed. Furthermore, the monitoring processing unit 91 can calculate the ejection period during which the processing liquid is ejected based on the start timing and the end timing, and monitor whether the ejection period is a specified time.

By the way, in the above example, the nozzle 30 is stopped at the center position P31 during the period in which the nozzle 30 discharges the processing liquid. In this case, since the position of the nozzle 30 does not change, there is no need to change the position of the determination region R1. Therefore, the determination area setting unit 92 may set the determination area R1 in common for a plurality of captured image data acquired while the nozzle 30 is stopped at the center position P31.

Specifically, the determination area setting unit 92 detects the coordinate position of the nozzle 30, as described above, based on one piece of initial captured image data when the nozzle 30 stops at the center position P31. Then, the determination area setting unit 92 sets the determination area R1 based on the coordinate position. The determination area setting unit 92 does not perform the operation of detecting the coordinate position of the nozzle 30 in the subsequently acquired captured image data, and uses the set determination area R1 as it is. By setting the determination region R1 in common for a plurality of pieces of captured image data in this way, the operation of detecting the coordinate position of the nozzle 30 can be avoided, and the processing load on the determination region setting section 92 can be reduced.

<Drop off>
When a predetermined period of time has elapsed since the nozzle 30 started discharging the processing liquid, the processing control unit 93 outputs a close signal to the valve 35 to stop discharging the processing liquid from the nozzle 30 . When the discharge of the processing liquid is stopped, droplets of the processing liquid may fall from the tip of the nozzle 30 (so-called dripping). If such droplets fall onto the upper surface of the substrate W, problems may occur. FIG. 11 shows an example of captured image data acquired by the camera 70 when the nozzle 30 stops discharging the processing liquid. This captured image data includes droplets of the processing liquid falling from the tip of the nozzle 30.

As can be understood from the comparison between FIGS. 9 to 11, the pixel values in the determination region R1 are different when the nozzle 30 is not discharging the processing liquid (FIG. 9) and when the nozzle 30 is discharging the processing liquid. (FIG. 10) and when dripping occurs (FIG. 11) are different. For example, the sum of pixel values in the determination region R1 when dripping occurs is smaller than the sum of pixel values in the determination region R1 when the nozzle 30 is discharging the treatment liquid, and the nozzle 30 This value is larger than the sum of pixel values within the determination area R1 when no liquid is being ejected.

Therefore, the monitoring processing unit 91 can determine whether or not dripping has occurred based on the pixel values within the determination region R1. As a specific example, the monitoring processing unit 91 determines that the nozzle 30 is discharging the processing liquid when the sum of pixel values within the determination region R1 is equal to or greater than a predetermined first reference value, and When the sum of pixel values within R1 is less than the first reference value and greater than or equal to a predetermined second reference value, it is determined that dripping has occurred, and the sum of pixel values within determination area R1 is less than the second reference value. When , it is determined that the nozzle 30 is not discharging the processing liquid.

Note that the determination of the presence or absence of dripping based on the pixel values within the determination region R1 is not limited to this, and various methods can be employed. For example, the presence or absence of dripping may be determined based on the variance or standard deviation within the determination region R1.

Now, in the above-mentioned processing liquid step (step S5), when the valve 35 closes and the nozzle 30 stops discharging the processing liquid, the nozzle base 33 raises the nozzle 30 from the center position P31 to the upper center position P36 (the first 2 movement process: step S53). FIG. 12 shows captured image data acquired by the camera 70 when the nozzle 30 stops at the upper center position P36.

The above-mentioned dripping may also occur while the nozzle 30 is rising from the center position P31 to the upper center position P36. Further, dripping may occur even after the nozzle 30 stops at the upper center position P36. Therefore, the monitoring processing unit 91 monitors the presence or absence of the processing liquid (droplets) falling from the tip of the nozzle 30, both while the nozzle 30 is moving to the upper center position P36 and while it is stopped at the upper center position P36. This is desirable.

Hereinafter, the determination region R1 set according to the coordinate position of the nozzle 30 stopped at the center position P31 will be referred to as a determination region R10. In the example of FIG. 12, the determination region R10 is indicated by a two-dot chain line.

The droplets of the processing liquid fall from the tip of the nozzle 30. Therefore, even if the nozzle 30 rises to the upper center position P36, the droplet can pass through the determination region R10 located below the tip of the nozzle 30. Therefore, it is also conceivable to use the determination region R10 as it is as the determination region R1 (hereinafter referred to as determination region R11) while the nozzle 30 is moving to the upper center position P36 and while it is stopped at the upper center position P36.

However, droplets of the processing liquid may fall obliquely from the tip of the nozzle 30. FIG. 13 is a diagram schematically showing an example of how droplets fall. When a droplet moves vertically downward along the inner wall of the ejection head 31 of the nozzle 30 and falls from the tip of the nozzle 30, the droplet can be ejected diagonally downward. If the distance between the tip of the nozzle 30 and the determination region R10 is large, the droplet may fall without passing through the determination region R10. In this case, the monitoring processing unit 91 cannot detect droplets even if it monitors the determination region R10. In other words, detection of dripping is omitted.

Furthermore, in the above-described example of the treatment liquid step (step S5), after the treatment liquid is discharged from the nozzle 30 (first discharge step: step S52), the fixed nozzle 80 discharges the treatment liquid (second discharge step: step S54). ). FIG. 14 shows an example of captured image data acquired while the fixed nozzle 80 is discharging the processing liquid. In FIG. 14 as well, the determination region R10 is indicated by a two-dot chain line. In the example of FIG. 14, a portion of the processing liquid discharged from the tip of the fixed nozzle 80 is included in this determination region R10. In this case, the monitoring processing unit 91 may erroneously detect the processing liquid as droplets that have fallen from the nozzle 30 (droplets).

Therefore, in the present embodiment, the determination area setting unit 92 makes each captured image data follow the position change of the nozzle 30 between a plurality of captured image data, at least after the close signal is output to the valve 35. In this step, a determination region R11 is set. That is, the determination region setting unit 92 sets the determination region R11 for each of the captured image data sequentially acquired from immediately before the second movement step (step S53) so as to follow the movement of the nozzle 30. .

As a specific example, the determination area setting unit 92 performs a nozzle 30 detection operation on captured image data acquired after a predetermined period has elapsed since the start of ejection of the processing liquid from the nozzle 30 . The specified time is set to be shorter than the ejection period during which the nozzle 30 ejects the processing liquid, and is stored in a storage medium or the like. Thereby, the determination area setting unit 92 can detect the position of the nozzle 30 immediately after the close signal is output to the valve 35.

As a detection operation, the determination area setting unit 92 performs, for example, tracking processing between a plurality of temporally continuous image data. According to the tracking process, the coordinate position of the nozzle 30 can be obtained in each of a plurality of temporally continuous captured image data. Note that, as a method of tracking processing, for example, median flow can be used.

In the median flow, first, a plurality of tracking target points are generated at a specified density within a specified area of initial captured image data. As the initial captured image data, for example, the first captured image data on which the detection operation is performed can be adopted. Further, as the designated area, in the captured image data, for example, an area that matches the reference image data RI1 (that is, an area indicating the nozzle 30) can be adopted. Then, for each tracking target point, the respective positions in the temporally next captured image data are tracked using the Lucas-Kanade Tracker. Furthermore, by Forward-Backward Error, the tracking target point with a large tracking error in the above tracking is removed, and the remaining tracking target point is used to calculate the median (median value) of the amount of change in the position of the tracking target point in the previous and subsequent captured image data. ). Then, based on the median value, the area (that is, the coordinate position) indicating the nozzle 30 is estimated (detected) in the next captured image data.

The determination area setting unit 92 sets the determination area R1 (that is, the determination area R11) in each captured image data based on the coordinate position of the nozzle 30 detected in each captured image data. As described above, the relative positional relationship, size, and shape between the coordinate position of the nozzle 30 and the determination region R11 are set in advance, for example, and stored in the storage medium. Thereby, the determination region R11 is set to follow the movement of the nozzle 30 in each captured image data.

In the example of FIG. 14, the determination region R11 is set according to the coordinate position of the nozzle 30 stopped at the upper center position P36, and is set to avoid the region containing the processing liquid discharged by the fixed nozzle 80. In other words, the determination area setting unit 92 sets the determination area R11 following the rise of the nozzle 30 in the second movement process (step S53), so that the tip of the fixed nozzle 80 in the second discharge process (step S54) The determination region R11 is set while avoiding the region containing the processing liquid from the top surface of the substrate W to the top surface of the substrate W. In other words, the upper center position P36 of the nozzle 30 is set so that the determination region R11 can avoid the region containing the processing liquid from the tip of the fixed nozzle 80 to the upper surface of the substrate W.

As described above, the determination area setting unit 92 detects the coordinate position of the nozzle 30 for each captured image data at least after the close signal is output to the valve 35, and determines the determination area according to the coordinate position of the nozzle 30. Set R1.

Then, the monitoring processing section 91 monitors the presence or absence of the processing liquid falling from the tip of the nozzle 30 based on the pixel values in the determination region R1 of each captured image data set by the determination region setting section 92. Since the determination region R1 is set to follow the movement of the nozzle 30, the monitoring processing unit 91 can appropriately detect dripping. In other words, the possibility of detection failure and false detection occurring can be reduced.

In the above example, the nozzle 30 continues to stop at the upper center position P36 during the stop period from when the nozzle 30 stops at the upper center position P36 until the ejection of the processing liquid from the fixed nozzle 80 ends. In this case, there is no need to change the determination area R11 during this stop period. Therefore, the determination area setting unit 92 may set the determination area R11 in common for a plurality of captured image data acquired during the stop period. In other words, if the determination region R11 is set based on the captured image data when the nozzle 30 stops at the upper center position P36, the determination region R11 is also set based on the captured image data obtained after the nozzle 30 stops at the upper center position P36. Apply. According to this, it is not necessary to perform tracking processing and setting the determination region R11 during the stop period. Therefore, the processing load on the determination area setting section 92 can be reduced.

As mentioned above, although the substrate processing method and the substrate processing apparatus 100 have been explained in detail, the above explanation is an example in all aspects, and the substrate processing apparatus is not limited thereto. It is understood that countless variations not illustrated can be envisioned without departing from the scope of this disclosure. The configurations described in each of the above embodiments and modifications can be appropriately combined or omitted as long as they do not contradict each other.

In the above example, the nozzle 30 is raised from the center position P31 to the upper center position P36 after the discharge of the processing liquid is stopped (second movement step: step S53). However, in this second movement step, the nozzle 30 may be moved from the center position P31 to the peripheral position P32. Even in this case, the determination area setting unit 92 detects the coordinate position of the nozzle 30 in each captured image data at least after the close signal is output to the valve 35, and sets each position so as to follow the movement of the nozzle 30. A determination region R11 is set in the captured image data. Thereby, dripping from the nozzle 30 can be detected with high detection accuracy.

Further, in the above example, attention is paid to dripping, but outflow can also be detected by the above-mentioned monitoring process. Outflow is an abnormality in which a thin liquid processing liquid flows down from the nozzle 30 even though a close signal is output to the valve 35 due to an abnormality in the valve 35 or the like.

Further, in the above example, the discharge of the processing liquid from the nozzle 30 is monitored, but the discharge of the processing liquid from each of the nozzle 60 and the nozzle 65 may be monitored.

1 Processing unit 20 Spin chuck 30, 60, 65 First nozzle (nozzle)
37 Moving mechanism 80 Second nozzle (fixed nozzle)
9 Control unit 70 Camera 100 Substrate processing device S11 Imaging process (step)
S12 Setting process (step)
S13 Liquid leakage monitoring process (step)
S2 Holding process (step)
S52 First discharge process (step)
S53 Movement process (step)
S54 Second discharge process (step)
W board

Claims (4)

a holding step for holding the substrate;
a first discharge step of outputting an open signal to a valve provided on a supply pipe and discharging the processing liquid from the tip of a first nozzle connected to the supply pipe onto the main surface of the substrate;
a moving step of moving the first nozzle after outputting a close signal to the valve to end the first discharge step ;
During the movement of the first nozzle in the movement step at least after outputting a close signal to the valve, a camera sequentially images a predetermined area including the tip of the first nozzle, and collects a plurality of image data. an imaging process to obtain;
The position of the first nozzle in each of the plurality of image data acquired while the first nozzle is moving with a close signal being output to the valve is detected, and a determination area is determined between the plurality of image data. a setting step of setting the determination area below the tip of the first nozzle in accordance with a change in the position of the first nozzle;
It falls from the tip of the first nozzle based on the pixels within the determination area in each of the plurality of image data acquired while the first nozzle is moving with a close signal being output to the valve. A liquid leakage monitoring step for monitoring the presence or absence of processing liquid;
A substrate processing method comprising: The substrate processing method according to claim 1,
A substrate processing method, wherein the first nozzle is raised in the moving step. 3. The substrate processing method according to claim 2,
further comprising a second discharging step of discharging the processing liquid from a second nozzle onto the main surface of the substrate while the first nozzle is raised;
In the liquid leak monitoring step, the determination area is set in accordance with the rise of the first nozzle in the image data acquired by the camera in the second discharge step, so that the determination area of the second nozzle is set. A substrate processing method, wherein the determination area is set while avoiding the processing liquid from the tip to the main surface of the substrate. a substrate holding part that holds the substrate;
a nozzle that is connected to a supply pipe provided in a valve and discharges a processing liquid supplied through the supply pipe onto the main surface of the substrate held by the substrate holder;
a moving mechanism that moves the nozzle;
a camera that images a predetermined area including the tip of the nozzle;
After outputting an open signal to the valve to discharge the processing liquid from the tip of the nozzle onto the main surface of the substrate, and outputting a close signal to the valve to end discharging the processing liquid , The nozzle is moved by a moving mechanism, and the position of the nozzle is detected in each of a plurality of image data sequentially acquired by the camera while the nozzle is moving after at least outputting a close signal to the valve. , the determination area is set below the tip of the nozzle by following the change in the position of the nozzle among the plurality of image data, and the determination area within the determination area in each of the plurality of image data is set below the tip of the nozzle. a control unit that monitors the presence or absence of a processing liquid falling from the tip of the nozzle based on pixels;
A substrate processing apparatus comprising:

Images