JP7376978B2 - Photosensitive resin composition, method for producing cured product, and method for producing display device - Google Patents

Description

The present invention relates to a photosensitive resin composition, a cured product thereof, and a display device including the cured product.

When forming (film forming) a coating film of a photosensitive resin composition on a substrate, a coating device such as a spin coater, slit & spin coater, slit coater, roll coater, bar coater, etc. may be used. However, as liquid crystal panels have become larger in recent years, problems such as coating unevenness and striations have arisen in the above method. In order to deal with this problem, attempts have been made to reduce coating unevenness by lowering the viscosity of the photosensitive resin composition and lowering the rotational speed of spin coaters, etc., but at the cost of obtaining a high-quality coating film, productivity The problem is that it is getting worse. In addition, when forming the second layer and subsequent layers during color filter manufacturing, if the film is formed on a patterned and uneven substrate, if it is applied with a spin coater, the formed unevenness will cause the film to form on the coated surface. In some cases, a coating defect called striae, in which radial streaks appear on the surface of the coating, may occur. In order to solve these problems, photosensitive resin compositions for suppressing the occurrence of uneven coating and striations have been disclosed.

For example, Patent Document 1 describes the use of a mixed solvent containing a compound having a specific structure, which provides a smooth coating surface with good coating properties even when using a liquid-saving coater such as a spinless coater. Disclosed is a colored photosensitive resin composition characterized by: Further, Patent Document 2 discloses a photosensitive resin composition that suppresses the occurrence of striae by using two or more types of mutually different solvents.

Japanese Patent Application Publication No. 2004-126549 Japanese Patent Application Publication No. 2010-152336

However, although Patent Document 1 describes that the occurrence of shaggy spots is suppressed by adjusting the surface tension of a colored photosensitive resin composition with a surfactant, it does not mention whether or not striations are improved. It has not been. Further, the photosensitive resin composition disclosed in Patent Document 2 describes that the occurrence of striae is suppressed by using two different types of solvents in the photosensitive resin composition. , there is no mention of whether coating unevenness is improved.

The present invention has been made in view of the above, and includes a photosensitive resin composition capable of suppressing the occurrence of uneven coating and striae and forming a uniform thin film, a cured product thereof, and the cured product. The purpose is to provide a display device.

The photosensitive resin composition according to the present invention is
(A) an alkali-soluble resin containing a polymerizable unsaturated group;
(B) a photopolymerizable monomer having at least two ethylenically unsaturated bonds;
(C) an epoxy compound;
(D) a photopolymerization initiator;
(E) a surfactant;
(F) three or more types of solvents;
Component (F) contains a first solvent having a vapor pressure of less than 100 Pa at 20°C and a boiling point of less than 200°C in a proportion of 10 to 10% of the total component (F). All (F ) contains 20 to 60% of the total component (F), and contains 10 to 60% of the total component (F) of a third solvent which is propylene glycol monomethyl ether acetate;
When the surface tension of the photosensitive resin composition is σ, and the surface tension of the photosensitive resin composition obtained by removing the component (E) from the photosensitive resin composition is σ ₀ , 0.85≦σ/σ ₀ ≦1.

The cured product according to the present invention is composed of the photosensitive resin composition described above.

The display device according to the present invention includes the above-mentioned cured product as a component.

According to the present invention, it is possible to provide a photosensitive resin composition that suppresses the occurrence of coating unevenness and striations and can form a uniform thin film, a cured product thereof, and a display device including the cured product.

The present invention will be explained in detail below.

((A) component)
The alkali-soluble resin containing a polymerizable unsaturated group, which is the component (A) in the photosensitive resin composition, can be used without particular limitation as long as it has a polymerizable unsaturated group and an acidic group in the molecule. Here, a typical example of the polymerizable unsaturated group is an acrylic group or a methacryl group, and a typical example of the acidic group is a carboxyl group.

The preferable weight average molecular weight (Mw) and acid value range of this polymerizable unsaturated group-containing alkali-soluble resin vary depending on the skeleton of the resin, but usually the Mw is 2000 to 50000 and the acid value is 30 to 120 mgKOH/g. It is preferable that If Mw is less than 2,000, the adhesion of the pattern during alkali development may decrease, and if Mw exceeds 50,000, the developability will significantly decrease, making it difficult to obtain a photosensitive resin composition with an appropriate development time. There is a risk that you will not be able to obtain the In addition, if the acid value is less than 30, residues tend to remain during alkaline development, and if the acid value is greater than 120, the alkaline developer penetrates too quickly and the desired solution development cannot be achieved. Both are unfavorable because peeling development occurs instead. Note that it is more preferable that the Mw is 2000 to 25000 and the acid value is 40 to 110 mgKOH/g. Note that the polymerizable unsaturated group-containing alkali-soluble resin of component (A) may be used alone or in combination of two or more.

A first example of the polymerizable unsaturated group-containing alkali-soluble resin as component (A) that can be preferably applied includes a compound having two or more epoxy groups and (meth)acrylic acid (this is "acrylic acid and/or methacrylic acid"). ''), and the resulting epoxy (meth)acrylate compound having a hydroxy group is reacted with (a) dicarboxylic acid or tricarboxylic acid monoanhydride and/or (b) tetracarboxylic dianhydride. It is an epoxy (meth)acrylate acid adduct obtained by reacting. Compounds having two or more epoxy groups that can be converted into epoxy (meth)acrylate acid adducts include bisphenol-type epoxy compounds and novolac-type epoxy compounds.

A bisphenol type epoxy compound is an epoxy compound having two glycidyl ether groups obtained by reacting bisphenols with epichlorohydrin. Since this reaction generally involves oligomerization of the diglycidyl ether compound, it contains an epoxy compound containing two or more bisphenol skeletons. Examples of bisphenols used in this reaction include bis(4-hydroxyphenyl)ketone, bis(4-hydroxy-3,5-dimethylphenyl)ketone, bis(4-hydroxy-3,5-dichlorophenyl)ketone, Bis(4-hydroxyphenyl)sulfone, bis(4-hydroxy-3,5-dimethylphenyl)sulfone, bis(4-hydroxy-3,5-dichlorophenyl)sulfone, bis(4-hydroxyphenyl)hexafluoropropane, bis(4-hydroxyphenyl)hexafluoropropane (4-hydroxy-3,5-dimethylphenyl)hexafluoropropane, bis(4-hydroxy-3,5-dichlorophenyl)hexafluoropropane, bis(4-hydroxyphenyl)dimethylsilane, bis(4-hydroxy-3, 5-dimethylphenyl)dimethylsilane, bis(4-hydroxy-3,5-dichlorophenyl)dimethylsilane, bis(4-hydroxyphenyl)methane, bis(4-hydroxy-3,5-dichlorophenyl)methane, bis(4- Hydroxy-3,5-dibromophenyl)methane, 2,2-bis(4-hydroxyphenyl)propane, 2,2-bis(4-hydroxy-3,5-dimethylphenyl)propane, 2,2-bis(4-dimethylphenyl)propane -Hydroxy-3,5-dichlorophenyl)propane, 2,2-bis(4-hydroxy-3-methylphenyl)propane, 2,2-bis(4-hydroxy-3-chlorophenyl)propane, bis(4-hydroxyphenyl) ) ether, bis(4-hydroxy-3,5-dimethylphenyl) ether, bis(4-hydroxy-3,5-dichlorophenyl) ether, 9,9-bis(4-hydroxyphenyl)fluorene, 9,9-bis (4-hydroxy-3-methylphenyl)fluorene, 9,9-bis(4-hydroxy-3-chlorophenyl)fluorene, 9,9-bis(4-hydroxy-3-bromophenyl)fluorene, 9,9-bis (4-hydroxy-3-fluorophenyl)fluorene, 9,9-bis(4-hydroxy-3-methoxyphenyl)fluorene, 9,9-bis(4-hydroxy-3,5-dimethylphenyl)fluorene, 9, 9-bis(4-hydroxy-3,5-dichlorophenyl)fluorene, 9,9-bis(4-hydroxy-3,5-dibromophenyl)fluorene, 4,4'-biphenol, 3,3'-biphenol, etc. included. Among these, bisphenols having a fluorene-9,9-diyl group are particularly preferred.

(a) The acid monoanhydride of dicarboxylic acid or tricarboxylic acid to be reacted with the epoxy (meth)acrylate is the acid monoanhydride of chain hydrocarbon dicarboxylic acid or tricarboxylic acid, the acid monoanhydride of alicyclic dicarboxylic acid or tricarboxylic acid, Anhydrides, acid monoanhydrides of aromatic dicarboxylic acids or tricarboxylic acids, etc. are used. Here, examples of acid monoanhydrides of chain hydrocarbon dicarboxylic acids or tricarboxylic acids include succinic acid, acetylsuccinic acid, maleic acid, adipic acid, itaconic acid, azelaic acid, citralic acid, malonic acid, glutaric acid, These include acid monoanhydrides such as citric acid, tartaric acid, oxoglutaric acid, pimelic acid, sebacic acid, suberic acid, and diglycolic acid. Furthermore, acid monoanhydrides of dicarboxylic acids or tricarboxylic acids into which arbitrary substituents have been introduced are included. Furthermore, examples of acid monoanhydrides of alicyclic dicarboxylic acids or tricarboxylic acids include acid monoanhydrides such as cyclobutanedicarboxylic acid, cyclopentanedicarboxylic acid, hexahydrophthalic acid, tetrahydrophthalic acid, and norbornanedicarboxylic acid. . Furthermore, acid monoanhydrides of dicarboxylic acids or tricarboxylic acids into which arbitrary substituents have been introduced are also included. Furthermore, examples of acid monoanhydrides of aromatic dicarboxylic acids or tricarboxylic acids include acid monoanhydrides such as phthalic acid, isophthalic acid, and trimellitic acid. Furthermore, acid monoanhydrides of dicarboxylic acids or tricarboxylic acids into which arbitrary substituents have been introduced are included.

In addition, as the acid dianhydride of (b) tetracarboxylic acid to be reacted with epoxy (meth)acrylate, acid dianhydride of chain hydrocarbon tetracarboxylic acid, acid dianhydride of alicyclic tetracarboxylic acid, or aromatic Acid dianhydrides of group tetracarboxylic acids are used. Here, examples of acid dianhydrides of chain hydrocarbon tetracarboxylic acids include acid dianhydrides such as butanetetracarboxylic acid, pentanetetracarboxylic acid, hexanetetracarboxylic acid, etc., and furthermore, any substituted This includes acid dianhydrides of tetracarboxylic acids into which groups have been introduced. Examples of acid dianhydrides of alicyclic tetracarboxylic acids include acid dianhydrides such as cyclobutanetetracarboxylic acid, cyclopentanetetracarboxylic acid, cyclohexanetetracarboxylic acid, cycloheptanetetracarboxylic acid, and norbornanetetracarboxylic acid. Further, it includes acid dianhydrides of tetracarboxylic acids into which arbitrary substituents have been introduced. Further, examples of acid dianhydrides of aromatic tetracarboxylic acids include acid dianhydrides such as pyromellitic acid, benzophenonetetracarboxylic acid, biphenyltetracarboxylic acid, and biphenyl ethertetracarboxylic acid, and furthermore, any This includes acid dianhydrides of tetracarboxylic acids into which substituents have been introduced.

The molar ratio (a)/(b) of (a) dicarboxylic acid or tricarboxylic acid anhydride and (b) tetracarboxylic acid dianhydride to be reacted with epoxy (meth)acrylate is 0.01 to 10. It is preferably .0, and more preferably 0.02 or more and less than 3.0. If the molar ratio (a)/(b) deviates from the above range, it is not preferable because the optimum molecular weight for producing a photosensitive resin composition having good photopatterning properties cannot be obtained. Note that the smaller the molar ratio (a)/(b), the larger the molecular weight and the lower the alkali solubility.

The epoxy (meth)acrylate acid adduct can be produced by a known method, for example, the method described in JP-A-8-278629, JP-A-2008-9401, and the like. First, as an example of a method of reacting (meth)acrylic acid with an epoxy compound, (meth)acrylic acid in an amount equimolar to the epoxy group of the epoxy compound is added to a solvent, and a catalyst (triethylbenzylammonium chloride, 2,6 -diisobutylphenol, etc.), the reaction is carried out by heating and stirring at 90 to 120°C while blowing air. Next, an example of a method for reacting an acid anhydride with the hydroxyl group of an epoxy acrylate compound, which is a reaction product, is to add a predetermined amount of an epoxy acrylate compound, an acid dianhydride, and an acid monoanhydride into a solvent, and then There is a method in which the reaction is carried out by heating and stirring at 90 to 130°C in the presence of (tetraethylammonium bromide, triphenylphosphine, etc.). The epoxy acrylate acid adduct obtained by this method has the skeleton of general formula (1).

（式（１）中、Ｒ_１、Ｒ_２、Ｒ_３及びＲ_４は、それぞれ独立して水素原子、炭素数１～５のアルキル基、ハロゲン原子又はフェニル基を表し、Ｒ_５は、水素原子又はメチル基を表し、Ａは、－ＣＯ－、－ＳＯ_２－、－Ｃ（ＣＦ_３）_２－、－Ｓｉ（ＣＨ_３）_２－、－ＣＨ_２－、－Ｃ（ＣＨ_３）_２－、－Ｏ－、フルオレン－９，９－ジイル基又は直結合を表し、Ｘは４価のカルボン酸残基を表し、Ｙ_１及びＹ_２は、それぞれ独立して水素原子又は－ＯＣ－Ｚ－（ＣＯＯＨ）_ｍ（但し、Ｚは２価又は３価カルボン酸残基を表し、ｍは１又は２の数を表す）を表し、ｎは１～２０の整数を表す。）

(In formula (1), R ₁ , R ₂ , R ₃ and R ₄ each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, a halogen atom or a phenyl group, and R ₅ is a hydrogen atom. or represents a methyl group, A is -CO-, -SO ₂ -, -C(CF ₃ ) ₂ -, -Si(CH ₃ ) ₂ -, -CH ₂ -, -C(CH ₃ ) ₂ -, -O-, fluorene-9,9-diyl group or direct bond, X represents a tetravalent carboxylic acid residue, Y ₁ and Y ₂ each independently represent a hydrogen atom or -OC-Z-( COOH) _m (where Z represents a divalent or trivalent carboxylic acid residue, m represents a number of 1 or 2), and n represents an integer from 1 to 20.)

Another example of a resin preferable as the polymerizable unsaturated group-containing alkali-soluble resin that is component (A) is a copolymer of (meth)acrylic acid, (meth)acrylic acid ester, etc., which has a (meth)acrylic group and a carboxyl group. Includes resins with groups. The above resin is, for example, a copolymer obtained by copolymerizing (meth)acrylic acid esters containing glycidyl (meth)acrylate in a solvent in the first step, and (meth)acrylic acid in the second step. This is an alkali-soluble resin containing a polymerizable unsaturated group obtained by reacting the resin and, in the third step, reacting the anhydride of dicarboxylic acid or tricarboxylic acid. For examples that can be preferably used among these copolymers, those specifically shown in Japanese Patent Application No. 2017-33662 can be referred to. Another method for obtaining such a resin (copolymer) having (meth)acrylic groups and carboxyl groups involves co-coating (meth)acrylic acid and (meth)acrylic ester in a solvent as the first step. It is also possible to react the copolymer obtained by polymerization with glycidyl (meth)acrylate in the second step and react with dicarboxylic acid or tricarboxylic acid anhydride in the third step.

Another example includes a polyol compound having an ethylenically unsaturated bond in the molecule as a first component, a diol compound having a carboxyl group in the molecule as a second component, and a diisocyanate compound as a third component. This includes urethane compounds obtained by reacting. As this type of resin, those shown in JP-A No. 2017-76071 can be referred to.

((B) component)
Examples of the photopolymerizable monomer having at least two ethylenically unsaturated bonds in component (B) include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, and tetraethylene glycol di(meth)acrylate. Ethylene glycol di(meth)acrylate, tetramethylene glycol di(meth)acrylate, glycerol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, pentaerythritol di(meth)acrylate, Pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol tetra(meth)acrylate, glycerol tri(meth)acrylate, sorbitol penta(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipenta (Meth)acrylic acid esters such as erythritol hexa(meth)acrylate, sorbitol hexa(meth)acrylate, alkylene oxide-modified hexa(meth)acrylate of phosphazene, caprolactone-modified dipentaerythritol hexa(meth)acrylate, ethylenic double bonds Examples of compounds having this include dendritic polymers having (meth)acrylic groups, and the like. One type of these monomers may be used alone, or two or more types may be used in combination. In addition, the photopolymerizable monomer having at least two ethylenically unsaturated bonds can play the role of crosslinking the molecules of the alkali-soluble resin contained therein, and in order to exhibit this function, photopolymerization is required. It is preferable to use one having three or more functional groups. Further, the acrylic equivalent obtained by dividing the molecular weight of the monomer by the number of (meth)acrylic groups in one molecule is preferably 50 to 300, and more preferably 80 to 200. Note that component (B) does not have a free carboxyl group.

Examples of dendritic polymers having (meth)acrylic groups as compounds having ethylenic double bonds that can be included in the composition as component (B) include (meth)acrylate groups of polyfunctional (meth)acrylate compounds. An example is a dendritic polymer obtained by adding a polyvalent mercapto compound to a part of the carbon-carbon double bonds in. Specifically, it includes a dendritic polymer obtained by reacting a (meth)acrylate of a polyfunctional (meth)acrylate compound of general formula (2) with a polyvalent mercapto compound of general formula (3).

Here, R ₆ represents a hydrogen atom or a methyl group, R ₇ represents the remainder after donating l hydroxyl groups among the k hydroxyl groups of R ₈ (OH) _k to the ester bond in the formula, Preferred R ₈ (OH) _k is a polyhydric alcohol based on a non-aromatic straight-chain or branched hydrocarbon skeleton having 2 to 8 carbon atoms, or a polyhydric alcohol in which multiple molecules of the polyhydric alcohol are dehydrated. It is a polyhydric alcohol ether connected via an ether bond by condensation, or an ester of these polyhydric alcohols or polyhydric alcohol ethers and a hydroxy acid. k and l independently represent integers from 2 to 20, with k≧l.

Here, R ₉ is a single bond or a divalent to hexavalent C1 to C6 hydrocarbon group, m is 2 when R ₉ is a single bond, and R ₉ is a divalent to hexavalent group. Time represents an integer from 2 to 6.

Specific examples of the polyfunctional (meth)acrylate compound represented by general formula (2) include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, and ethylene oxide-modified trimethylol. Propane tri(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, caprolactone-modified pentaerythritol tri(meth)acrylate (meth)acrylic acid esters such as These compounds may be used alone or in combination of two or more.

Specific examples of the polyvalent mercapto compound represented by the general formula (3) include trimethylolpropane tri(mercaptoacetate), trimethylolpropane tri(mercaptopropionate), pentaerythritol tetra(mercaptoacetate), and pentaerythritol tri(mercaptoacetate). mercaptoacetate), pentaerythritol tetra (mercaptopropionate), dipentaerythritol hexa (mercaptoacetate), dipentaerythritol hexa (mercaptopropionate), and the like. These compounds may be used alone or in combination of two or more.

((C) component)
(C) Examples of epoxy compounds include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol fluorene type epoxy compounds, phenol novolak type epoxy compounds, cresol novolac type epoxy compounds, phenol aralkyl type epoxy compounds, and naphthalene skeletons. Phenol novolak compounds (e.g. "NC-7000L" manufactured by Nippon Kayaku Co., Ltd.), naphthol aralkyl type epoxy compounds, trisphenolmethane type epoxy compounds, tetrakisphenolethane type epoxy compounds, glycidyl ethers of polyhydric alcohols, glycidyl polyhydric carboxylic acids ester, a copolymer of monomers having a (meth)acrylic group containing glycidyl (meth)acrylate as a unit, such as a copolymer of methacrylic acid and glycidyl methacrylate, 3',4'-epoxycyclohexylmethyl 3, Alicyclic epoxy compounds represented by 4-epoxycyclohexane carboxylate, polyfunctional epoxy compounds having a dicyclopentadiene skeleton (for example, "HP-7200 series" manufactured by DIC Corporation), 2,2-bis(hydroxymethyl)-1 -1,2-epoxy-4-(2-oxiranyl)cyclohexane adduct of butanol (e.g. "EHPE3150" manufactured by Daicel), epoxidized polybutadiene (e.g. "NISSO-PB/JP-100" manufactured by Nippon Soda), silicone This includes epoxy compounds having a skeleton. As these components, compounds having an epoxy equivalent of 50 to 500 g/eq are preferred. Furthermore, it is more preferable to use an epoxy compound having two or more epoxy groups in one molecule. In addition, (C) component may be used individually by 1 type, and may use 2 or more types together.

((D) component)
(D) Examples of the photopolymerization initiator include acetophenones such as acetophenone, 2,2-diethoxyacetophenone, p-dimethylacetophenone, p-dimethylaminopropiophenone, dichloroacetophenone, trichloroacetophenone, and p-tert-butylacetophenone. benzophenones such as benzophenone, 2-chlorobenzophenone, and p,p'-bisdimethylaminobenzophenone; benzoin ethers such as benzyl, benzoin, benzoin methyl ether, benzoin isopropyl ether, and benzoin isobutyl ether; 2-methyl-1[ α-Aminoalkylphenones such as 4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1; 2 -(o-chlorophenyl)-4,5-phenylbiimidazole, 2-(o-chlorophenyl)-4,5-di(m-methoxyphenyl)biimidazole, 2-(o-chlorophenyl)-4,5-diphenyl Biimidazole compounds such as biimidazole, 2-(o-methoxyphenyl)-4,5-diphenylbiimidazole, 2,4,5-triarylbiimidazole; 2-trichloromethyl-5-styryl-1,3 ,4-oxadiazole, 2-trichloromethyl-5-(p-cyanostyryl)-1,3,4-oxadiazole, 2-trichloromethyl-5-(p-methoxystyryl)-1,3,4 - Halomethylthiazole compounds such as oxadiazole; 2,4,6-tris(trichloromethyl)-1,3,5-triazine, 2-methyl-4,6-bis(trichloromethyl)-1,3, 5-triazine, 2-phenyl-4,6-bis(trichloromethyl)-1,3,5-triazine, 2-(4-chlorophenyl)-4,6-bis(trichloromethyl)-1,3,5- Triazine, 2-(4-methoxyphenyl)-4,6-bis(trichloromethyl)-1,3,5-triazine, 2-(4-methoxynaphthyl)-4,6-bis(trichloroR-methyl)-1 , 3,5-triazine, 2-(4-methoxystyryl)-4,6-bis(trichloromethyl)-1,3,5-triazine, 2-(3,4,5-trimethoxystyryl)-4, Halomethyl-S-triazine systems such as 6-bis(trichloromethyl)-1,3,5-triazine and 2-(4-methylthiostyryl)-4,6-bis(trichloromethyl)-1,3,5-triazine Compounds; 1,2-octanedione, 1-[4-(phenylthio)phenyl]-,2-(O-benzoyloxime), 1-(4-phenylsulfanylphenyl)butane-1,2-dione-2- Oxime-O-benzoate, 1-(4-methylsulfanylphenyl)butan-1,2-dione-2-oxime-O-acetate, 1-(4-methylsulfanylphenyl)butan-1-one oxime-O-acetate O-acyloxime compounds such as benzyl dimethyl ketal, thioxanthone, 2-chlorothioxanthone, 2,4-diethylthioxanthone, 2-methylthioxanthone, 2-isopropylthioxanthone and other sulfur compounds; - Anthraquinones such as ethyl anthraquinone, octamethyl anthraquinone, 1,2-benzanthraquinone, 2,3-diphenylanthraquinone; organic peroxides such as azobisisobutylnitrile, benzoyl peroxide, cumene peroxide, 2-mercaptobenzimidazole , 2-mercaptobenzoxazole, 2-mercaptobenzothiazole, and other thiol compounds; and tertiary amines such as triethanolamine and triethylamine. Among these, O-acyl oxime compounds (including ketoxime) are preferred, especially when forming a photosensitive resin composition containing a colorant. Further, one type of these photopolymerization initiators may be used alone, or two or more types may be used in combination. Note that the term "photopolymerization initiator" as used in the present invention is used to include a sensitizer.

((E) component)
As the surfactant component (E), known surfactants such as silicone-based and fluorine-based surfactants can be used without particular limitation. Examples of the silicone surfactant include side chain-modified polydimethylsiloxane, both end-modified polydimethylsiloxane, one-end modified polydimethylsiloxane, and both side-chain end-modified polydimethylsiloxanes. Examples of fluorine-based surfactants include perfluoroalkyl sulfonic acid compounds, perfluoroalkyl carboxylic acid compounds, perfluoroalkyl phosphate ester compounds, perfluoroalkyl ethylene oxide adducts, and polyoxy having a perfluoroalkyl ether group in the side chain. Includes alkylene ether polymer compounds, etc. Further, one type of these surfactants may be used alone, or two or more types may be used in combination. The amount of surfactant to be added will be determined while measuring the surface tension of the photosensitive resin composition as will be explained in detail later, but the range of the amount added is 0.001% in the photosensitive resin composition. ~0.1% by mass, and the range of the amount added varies depending on the type of surfactant; 0.001 to 0.005% by mass for silicone surfactants, and 0.001 to 0.005% by mass for fluorine surfactants. It is usually in the range of 0.01 to 0.1% by mass.

((F) component)
The solvent that is component (F) in the photosensitive resin composition is composed of a first solvent, a second solvent, and a third solvent. The first solvent may be selected from solvents having a vapor pressure of less than 100 Pa at 20°C and a boiling point of less than 200°C. The second solvent may be selected from solvents having a vapor pressure of 100 Pa or higher at 20°C and a boiling point of 120°C or higher (however, the second solvent is a solvent other than propylene glycol monomethyl ether acetate). The third solvent is propylene glycol monomethyl ether acetate.

Examples of first solvents include ethylene glycol (EG), propylene glycol (PG), diethylene glycol ethyl methyl ether (EDM), 3-methoxy-3methyl-1-butyl acetate (MMBA), 3-methoxy-3-methyl -1-Butanol (MMB), propylene glycol diacetate (PGDA), dipropylene glycol monomethyl ether (DPM), diethylene glycol monomethyl ether, diethylene glycol diethyl ether (DEDG), and the like. Examples of second solvents include xylene, cellosolve, methyl cellosolve, ethyl cellosolve, cyclohexanone (ANON), methyl 3-methoxypropionate (MMP), 3-methoxybutylacetate (MBA), 1-methoxy-2-propanol ( PGME), 1-ethoxy-2-propanol, butyl acetate, cellosolve acetate, diethylene glycol dimethyl ether (MDM), ethyl 3-ethoxypropionate (EEP), ethyl lactate (EL), diacetone alcohol (DAA), and the like. In addition, in the present invention, propylene glycol monomethyl ether acetate (PGMEA) is not treated as a second solvent.

Among these, the first solvent is preferably diethylene glycol ethyl methyl ether (EDM), 3-methoxy-3methyl-1-butyl acetate (MMBA), and propylene glycol diacetate (PGDA). In addition, when the photosensitive resin composition of the present invention is applied, for example, after forming RGB pixels of a color filter, it is preferable to avoid using a solvent that easily penetrates into the RGB pixels. In that case, 3-methoxy-3methyl-1-butyl acetate (MMBA) and propylene glycol diacetate (PGDA) are preferred as the first solvent. Further, the second solvent is preferably cyclohexanone (ANON), methyl 3-methoxypropionate (MMP), 3-methoxybutyl acetate (MBA), and 1-methoxy-2-propanol (PGME).

The boiling points and vapor pressures at 20° C. of these solvents are shown in Table 1.

The solvent as component (F) in the photosensitive resin composition is preferably contained in a total amount of 90% by mass or more of the first to third solvents in component (F). Solvents other than the first to third solvents can be included without particular limitation as long as they can be mixed uniformly with the solvent. Examples of these solvents include alcohols, terpenes, ketones, aromatic hydrocarbons, glycol ethers, and acetate esters.

Solvents with high boiling points and low vapor pressures are advantageous in suppressing the generation of striations, but depending on their boiling points and proportions, the solvents may remain in the film, causing poor platemaking and in-plane variations in development. On the other hand, solvents with a low boiling point and high vapor pressure are less likely to remain in the film, but they tend to cause striations during film formation, and can also cause other unevenness such as blur. Therefore, in order to obtain a uniform film without unevenness, it is necessary to combine the first solvent, the second solvent, and the third solvent propylene glycol monomethyl ether acetate (PGMEA), which have boiling points and vapor pressures within the specified ranges, in an appropriate amount. It is important to mix them in the correct ratio. Specifically, the photosensitive resin composition contains 10 to 30% of the first solvent, 20 to 60% of the second solvent, and 10 to 60% of the third solvent in the total (F) component.

Furthermore, the surface tension (σ) of the photosensitive resin composition can be adjusted by adjusting the blending amount of the surfactant (component (E)). At this time, when the surface tension of the photosensitive resin composition is σ, and the surface tension of the photosensitive resin composition obtained by removing the component (E) from the photosensitive resin composition is σ ₀ , 0.85≦σ By adjusting the blending amount of the surfactant so as to satisfy /σ ₀ ≦1, the occurrence of striae can be effectively suppressed. Note that normally, experimentally, σ ₀ is measured before adding component (E), and σ is measured after adding component (E), but σ ₀ is determined by measuring σ 0 in the photosensitive resin composition of the present invention. It is described as the surface tension of the photosensitive resin composition obtained by removing component (E) from the product.

The method for measuring surface tension σ and surface tension σ ₀ is as follows.
(Method of measuring surface tension)
The surface tension was measured using a plate method automatic surface tension meter (Model: CBVP-Z, manufactured by Kyowa Interface Science Co., Ltd.) under conditions of an air temperature of 23° C. and a humidity of 50%.

The photosensitive resin composition of the present invention may contain a curing agent, a curing accelerator, a thermal polymerization inhibitor, an antioxidant, a plasticizer, a filler, a leveling agent, an antifoaming agent, a coupling agent, etc., as necessary. Agents can be added. As the curing agent, known compounds commonly applied to epoxy compounds can be used.

Any curing agent can be used as long as it is used as a curing agent for epoxy compounds, and examples thereof include amine compounds, polycarboxylic acid compounds, phenol resins, amino resins, dicyandiamide, Lewis acid complex compounds, etc. can. Examples of the polycarboxylic acid compound include polycarboxylic acids, anhydrides of polycarboxylic acids, and thermally decomposable esters of polycarboxylic acids.

As the curing accelerator, known compounds known as curing accelerators, curing catalysts, latent curing agents, etc. for epoxy compounds can be used, such as tertiary amines, quaternary ammonium salts, tertiary phosphines, quaternary phosphonium salts, boron, etc. Examples include acid esters, Lewis acids, organometallic compounds, imidazoles, and the like.

Examples of thermal polymerization inhibitors and antioxidants include hydroquinone, hydroquinone monomethyl ether, pyrogallol, tert-butylcatechol, phenothiazine, hindered phenol compounds, and the like. Examples of plasticizers include dibutyl phthalate, dioctyl phthalate, tricresyl phosphate, and the like. Examples of fillers include nano-sized particles such as silica and titania that do not inhibit the transparency of the coating and can be dispersed in organic solvents. Examples of leveling agents and antifoaming agents include silicone-based, fluorine-based, and acrylic-based compounds. Further, examples of silane coupling agents include 3-acryloxypropyltrimethoxysilane, 3-(glycidyloxy)propyltrimethoxysilane, 3-isocyanatopropyltriethoxysilane, 3-ureidopropyltriethoxysilane, etc. .

The preferred proportions of each component (A) to (E) in the solid content (the solid content includes monomer components that become solid content after curing) of the photosensitive resin composition of the present invention are as follows. .
The blending ratio of component (A) and component (B) [(A)/(B)] is preferably 20/80 to 90/10, more preferably 40/60 to 70/30. preferable. Here, if the blending ratio of component (A) is small, the cured product after the photocuring reaction becomes brittle, and the solubility in an alkaline developer decreases because the acid value of the coating film is low in the unexposed area. A problem arises in that the pattern edges become loose and not sharp. On the other hand, when the proportion of component (A) exceeds the above range, the proportion of photoreactive functional groups in the photoreactive components (component (A) + component (B)) decreases, resulting in the formation of a crosslinked structure due to photocuring reaction. is no longer sufficient.
The amount of component (C) used is preferably in the range of 5 to 40 parts by mass based on the total of 100 parts by mass of components (A) and (B). Here, if the amount of component (C) used is less than 5 parts by mass, the amount of carboxyl groups remaining when forming a cured film after patterning will increase, and there is a concern that moisture resistance reliability may not be ensured. If the amount of the epoxy compound used is more than 40 parts by mass, the amount of photosensitive groups in the resin component in the photosensitive resin composition may decrease, and sufficient sensitivity for patterning may not be obtained.
The amount of component (D) added is preferably 0.1 to 10 parts by mass, and preferably 1 to 5 parts by mass, based on 100 parts by mass of the total amount of components (A) and (B). More preferred. Here, if the amount is less than 0.1 parts by mass, sufficient sensitivity cannot be obtained, and if it exceeds 10 parts by mass, the tapered shape (the shape in the film thickness direction of the cross section of the developed pattern) will not be sharp and will be in a tailed state. Halation becomes more likely to occur, and decomposition gas may be generated when exposed to high temperatures in post-processes.

Component (F) is composed of a first solvent, a second solvent, and a third solvent. The total amount of the first solvent, second solvent, and third solvent varies depending on the viscosity of the target photosensitive resin composition, but the total amount is 70 to 90% by mass in the photosensitive resin composition. It is preferable that Furthermore, the proportion of the first solvent, second solvent, and third solvent in the total component (F) is preferably 10 to 30% for the first solvent, and 20 to 60% for the second solvent. is preferred, and the third solvent is preferably 10 to 60%.

The viscosity of the photosensitive resin composition can be adjusted by adjusting the blending ratio of the first solvent, the second solvent, and the third solvent. Therefore, it is not only easier to increase or decrease the film thickness, but also the speed at which the coating spreads uniformly over the substrate can be adjusted, making it possible to suppress the occurrence of coating unevenness and striations. Furthermore, by combining solvents with different vapor pressures, it is possible to prevent the coating film surface from drying immediately after film formation, or conversely, from slowing down the drying speed. Can be heated evenly. As a result, it is also possible to suppress unevenness in film thickness.

The method for forming a cured film pattern using the photosensitive resin composition in the present invention is a normal photolithography method, which will be explained in detail below. First, a photosensitive resin composition was applied onto a glass substrate, a plastic substrate, etc., and a substrate on which a pixel pattern of a color filter or an electrode pattern for driving pixels such as a TFT was formed, and then the solvent was dried. After (prebaking), the resulting coating film is irradiated with ultraviolet rays through a photomask to cure the exposed areas, and then developed using an alkaline aqueous solution to elute the unexposed areas to form a pattern. This is a method of post-baking (thermal baking).

Methods for applying the solution of the photosensitive resin composition onto these substrates include the well-known solution dipping method and spray method, as well as methods using a roller coater machine, land coater machine, slit coater machine, and spinner machine. method can also be adopted. By these methods, a film is formed by applying the film to a desired thickness and then removing the solvent (prebaking). Prebaking is performed by heating with an oven, hot plate, or the like. The heating temperature and heating time in prebaking are appropriately selected depending on the solvent used, and is carried out, for example, at a temperature of 60 to 110° C. (set so as not to exceed the heat resistant temperature of the substrate) for 1 to 3 minutes.

Exposure performed after prebaking is performed by an ultraviolet exposure device, and by exposing through a photomask, only the portions of the resist corresponding to the pattern are exposed. The exposure device and its exposure irradiation conditions are appropriately selected, and exposure is performed using a light source such as an ultra-high-pressure mercury lamp, a high-pressure mercury lamp, a metal halide lamp, a far-ultraviolet lamp, etc., and the photosensitive resin composition in the coating film is photocured. Preferably, photocuring is performed by irradiating a certain amount of light with a wavelength of 365 nm.

Alkaline development after exposure is performed for the purpose of removing the resist in unexposed areas, and a desired pattern is formed by this development. Examples of developing solutions suitable for this alkaline development include aqueous solutions of carbonates of alkali metals and alkaline earth metals, and aqueous solutions of hydroxides of alkali metals. It is best to develop at a temperature of 23 to 28° C. using a weakly alkaline aqueous solution, and fine images can be precisely formed using a commercially available developer, ultrasonic cleaner, or the like.

After development, heat treatment (post-bake) is preferably performed at a temperature of 80 to 250° C. (set so as not to exceed the heat resistant temperature of the substrate) for 20 to 90 minutes. This post-baking is performed for the purpose of increasing the adhesion between the patterned resin film and the substrate. Similar to pre-baking, this is done by heating with an oven, hot plate, etc. A more preferable range of post-bake heat treatment conditions is a temperature of 180 to 230°C and a heating time of 30 to 60 minutes. The patterned resin film of the present invention is formed through the steps of the photolithography method described above.

The photosensitive composition of the present invention can be used for solder resists, plating resists, etching resists, insulating films for multilayer wiring boards on which semiconductor elements are mounted, gate insulating films for semiconductors, protective films and planarizing films for color filters, organic It is useful for forming barrier rib materials for EL pixel formation (for RGB formation by inkjet method, etc.), insulating films for touch panels, etc., and is useful for forming liquid crystals, organic EL, etc. that contain these resin film patterns as constituent elements. It is possible to use the material for display devices, imaging elements, and touch panels.

EXAMPLES Hereinafter, the present invention will be explained in more detail with reference to Examples, but the present invention is not limited thereto. A preparation example of the photosensitive resin composition of the present invention will be explained, and evaluation results of a coating film formed using the photosensitive resin composition will be explained.

First, a synthesis example of (A) alkali-soluble resin containing a polymerizable unsaturated group will be shown. Evaluation of the resin in the synthesis example was performed as follows.
[Solid content concentration]
1 g of the resin solution obtained in the synthesis example was impregnated into a glass filter [weight: W0 (g)] and weighed [W1 (g)], and the weight after heating at 160 ° C. for 2 hours [W2 (g)] ] from the following formula.
Solid content concentration (wt%) = 100 x (W2-W0)/(W1-W0)

[Acid value]
It was determined by dissolving a resin solution in dioxane and titrating it with a 1/10N-KOH aqueous solution using a potentiometric titration device [manufactured by Hiranuma Sangyo Co., Ltd., trade name COM-1600].

[Molecular weight]
Gelper Music Chromatography (GPC) [Product name made by Higashi So Co., Ltd.: HLC -8220 GPC, solvent: Tetrahydroflan, Colam: TSKGELSUPERH -2000 (2) + TSKGELSUPERH -3000 (1 pc) + TSKGELSUPE + TSKGELSUPE RH -4000 (1) + TSKGELSUPER- H5000 (1 piece) [manufactured by Tosoh Corporation], temperature: 40°C, speed: 0.6ml/min], and the weight average molecular weight (Mw ) was calculated.

Further, the abbreviations used in the synthesis examples are as follows.
BPFE: Bisphenol fluorene type epoxy compound (reaction product of 9,9-bis(4-hydroxyphenyl)fluorene and chloromethyloxirane. Epoxy equivalent: 250 g/eq)
AA: Acrylic acid PGMEA: Propylene glycol monomethyl ether acetate TEAB: Tetraethylammonium bromide BPDA: 3,3',4,4'-biphenyltetracarboxylic dianhydride THPA: Tetrahydrophthalic anhydride MAA: Methacrylic acid MMA: Methacrylic acid Methyl CHMA: cyclohexyl methacrylate AIBN: azobisisobutyronitrile GMA: glycidyl methacrylate TPP: triphenylphosphine TBPC: 2,6-di-tert-butyl-p-cresol

[Synthesis example 1]
114.4 g (0.23 mol) of BPFE, 33.2 g (0.46 mol) of AA, 157 g of PGMEA, and 0.48 g of TEAB were placed in a 500 ml four-necked flask equipped with a reflux condenser and heated at 100 to 105°C. The reaction mixture was stirred for 20 hours. Next, 35.3 g (0.12 mol) of BPDA and 18.3 g (0.12 mol) of THPA were charged into the flask and stirred at 120 to 125°C for 6 hours to form an alkali-soluble resin containing a polymerizable unsaturated group (A )-1 was obtained. The resulting resin solution had a solid content concentration of 56.1% by mass, an acid value (solid content equivalent) of 103 mgKOH/g, and an Mw of 3600 by GPC analysis.

[Synthesis example 2]
In a 1000 ml four-necked flask with a nitrogen inlet tube and a reflux tube, 51.65 g (0.60 mol) of MAA, 36.04 g (0.36 mol) of MMA, 40.38 g (0.24 mol) of CHMA, 5.91 g of AIBN, and 360 g of PGMEA. was charged and polymerized by stirring at 80 to 85°C under a nitrogen stream for 8 hours. Furthermore, 61.41 g (0.43 mol) of GMA, 2.27 g of TPP, and 0.086 g of TBPC were charged into the flask and stirred at 80 to 85°C for 16 hours to obtain the polymerizable unsaturated group-containing alkali-soluble resin (A)-2. Obtained. The solid content concentration of the obtained resin solution was 35.7% by mass, the acid value (solid content equivalent) was 50 mgKOH/g, and the Mw by GPC analysis was 19,600.

Photosensitive resin compositions of Examples 1 to 13 and Comparative Examples 1 to 5 were prepared using the amounts listed in Table 2 (numbers are parts by mass). The ingredients used in the table are as follows.
(A) Polymerizable unsaturated group-containing alkali-soluble resin:
(A)-1: Resin solution obtained in the above Synthesis Example 1 (solid content concentration 56.1% by mass)
(A)-2: Resin solution obtained in Synthesis Example 2 above (solid content concentration 35.7% by mass)
(B) Photopolymerizable monomer:
(B)-1: Mixture of dipentaerythritol pentaacrylate and hexaacrylate (manufactured by Nippon Kayaku Co., Ltd., product name: DPHA)
(C) Epoxy compound:
(C)-1: Bisphenol fluorene type epoxy compound (reaction product of 9,9-bis(4-hydroxyphenyl)fluorene and chloromethyloxirane. Epoxy equivalent: 250 g/eq)
(D) Photopolymerization initiator:
(D)-1: 1,2-octanedione,1-[4-(phenylthio)phenyl]-,2-(O-benzoyloxime) (manufactured by BASF, product name: Irgacure OXE-01)
(E) Surfactant:
(E)-1: Megafac F-556 (manufactured by DIC)
(E)-2: SH3775 (manufactured by Dow Corning Toray)
(F) Solvent:
(first solvent)
PGDA: Propylene glycol diacetate EDM: Diethylene glycol ethyl methyl ether MMBA: 3methoxy-3methyl-1-butyl acetate (secondary solvent)
PGME: 1-methoxy-2-propanol MBA: 3-methoxybutyl acetate MMP: Methyl 3-methoxypropionate ANON: Cyclohexanone EEP: Ethyl 3-ethoxypropionate EL: Ethyl lactate (third solvent)
PGMEA: Propylene glycol monomethyl ether acetate (G) Other additives (G)-1: Coupling agent 3-glycidoxypropyltrimethoxysilane

[evaluation]
The following evaluations were performed using the photosensitive resin compositions of Examples 1 to 13 and Comparative Examples 1 to 5. Table 3 shows the evaluation results of Examples 1 to 13 and Comparative Examples 1 to 5.

<Evaluation method of radiation unevenness>
As a striation evaluation substrate, a 5-inch square glass substrate on which a 50 μm L&S pattern was formed using black resist with a film thickness of 2.5 μm after curing was prepared. The curable resin composition obtained above was applied to this substrate using a spin coater under conditions such that the film thickness would be 1.2 μm after curing. Thereafter, it was dried under reduced pressure to 100 Pa and dried on a 90° C. hot plate for 2 minutes to form a coating film. The surface condition of the obtained coating film was visually observed under an Na lamp to confirm the presence or absence of striations.
○: Almost no striations were observed. △: Slightly observed striations. ×: Striations were clearly observed.

<Evaluation method for moyamura>
The curable resin compositions obtained in Examples 1 to 13 and Comparative Examples 1 to 5 were applied onto a 4-inch square silicon wafer using a slit coater to prepare a test piece. At this time, the liquid feeding pressure, the distance between the substrate and the coating head, and the coating speed were adjusted to control the thickness of the coating film so that the thickness of the produced film was 1.2 μm. Thereafter, it was dried under reduced pressure to 100 Pa and dried on a 90° C. hot plate for 2 minutes to form a coating film. Further, it was exposed to light at 100 mJ/m2 and baked in a hot air oven at 230°C for 30 minutes to obtain a test piece. The surface condition of the obtained coating film was visually observed under an Na lamp to confirm the presence or absence of any unevenness.
○: Almost no blur was observed. △: Slight blur was observed. ×: Moyamura was clearly observed.

As shown in Comparative Examples 1 and 2 in Table 3, photosensitive resin compositions that do not contain a first solvent and have a surface tension outside the range of 0.85≦σ/σ ₀ ≦1 have no It was found that the occurrence of striations could not be suppressed. In addition, as shown in Comparative Examples 3 and 4 in Table 3, even when all of the first solvent, second solvent, and third solvent are included, 0.85≦σ/σ ₀ ≦1. If the conditions were not satisfied, the blurring was resolved, but the occurrence of striae could not be suppressed. Furthermore, as shown in Comparative Example 5, even if the first solvent is not included, when 0.85≦σ/σ ₀ ≦1 is satisfied, the occurrence of fuzzy spots and striations is slightly suppressed. . From this, it was confirmed that adjusting the surface tension of the photosensitive resin composition is an important factor in suppressing the occurrence of striations.

On the other hand, as shown in Examples 1 to 13, by including all of the first solvent, second solvent, and third solvent and satisfying 0.85≦σ/σ ₀ ≦1, the moyamura and the occurrence of striations could be suppressed.

Claims (5)

(A) an alkali-soluble resin containing a polymerizable unsaturated group;
(B) a photopolymerizable monomer having at least two ethylenically unsaturated bonds;
(C) an epoxy compound;
(D) a photopolymerization initiator;
(E) a surfactant;
(F) three or more types of solvents;
A photosensitive resin composition (excluding those containing a black pigment) comprising:
The component (F) contains 10 to 30% of the total component (F) having a vapor pressure of less than 100 Pa at 20°C and a boiling point of less than 200°C, and the first solvent is diethylene glycol ethylmethyl. At least one member selected from the group consisting of ether, 3-methoxy-3-methyl-1-butyl acetate, and propylene glycol diacetate,
A second solvent having a vapor pressure of 100 Pa or more at 20°C and a boiling point of 120°C or more (however, the second solvent is a solvent other than propylene glycol monomethyl ether acetate) is added to 20% of the total (F) component. ~60%, the second solvent is at least one selected from the group consisting of cyclohexanone, methyl 3-methoxypropionate, 3-methoxybutyl acetate, and 1-methoxy-2-propanol;
Containing a third solvent which is propylene glycol monomethyl ether acetate in an amount of 10 to 60% in the total component (F),
The total amount of the first solvent, second solvent and third solvent in the photosensitive resin composition is 70 to 90% by mass,
When the surface tension of the photosensitive resin composition is σ, and the surface tension of the photosensitive resin composition obtained by removing the component (E) from the photosensitive resin composition is σ0, 0.85≦σ/σ0≦1 A photosensitive resin composition characterized by: The photosensitive resin composition according to claim 1, wherein the component (E) is a fluorosurfactant or a silicone surfactant. The photosensitive resin composition according to claim 1 or 2, wherein the component (A) is an alkali-soluble resin containing a polymerizable unsaturated group represented by general formula (1).

(In formula (1), R ₁ , R ₂ , R ₃ and R ₄ each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, a halogen atom or a phenyl group, and R ₅ is a hydrogen atom. or represents a methyl group, A is -CO-, -SO ₂ -, -C(CF ₃ ) ₂ -, -Si(CH ₃ ) ₂ -, -CH ₂ -, -C(CH ₃ ) ₂ -, -O-, represents a fluorene-9,9-diyl group or a direct bond, X represents a tetravalent carboxylic acid residue, Y1 and Y2 are each independently a hydrogen atom or -OC-Z-(COOH) _m (However, Z represents a divalent or trivalent carboxylic acid residue, m represents the number of 1 or 2, and n represents an integer from 1 to 20.) After applying the photosensitive resin composition according to any one of claims 1 to 3 onto a substrate and drying the solvent, the resulting coating film is irradiated with ultraviolet rays through a photomask to remove exposed areas. After curing, a pattern is formed by performing development using an alkaline aqueous solution to elute the unexposed areas, and then post-baking is performed as post-curing.
Method for producing cured product. A method for manufacturing a display device, comprising manufacturing a display device using a member containing a cured product cured by the manufacturing method according to claim 4.