JP7359458B2 - Adhesive body - Google Patents
Adhesive body Download PDFInfo
- Publication number
- JP7359458B2 JP7359458B2 JP2021193354A JP2021193354A JP7359458B2 JP 7359458 B2 JP7359458 B2 JP 7359458B2 JP 2021193354 A JP2021193354 A JP 2021193354A JP 2021193354 A JP2021193354 A JP 2021193354A JP 7359458 B2 JP7359458 B2 JP 7359458B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- base material
- rubber
- molecular
- compounds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000853 adhesive Substances 0.000 title claims description 187
- 230000001070 adhesive effect Effects 0.000 title claims description 187
- 239000000463 material Substances 0.000 claims description 136
- -1 aluminate compounds Chemical class 0.000 claims description 52
- 229920001971 elastomer Polymers 0.000 claims description 52
- 239000005060 rubber Substances 0.000 claims description 52
- 239000000758 substrate Substances 0.000 claims description 31
- 229920001577 copolymer Polymers 0.000 claims description 22
- 239000007787 solid Substances 0.000 claims description 22
- 229920001973 fluoroelastomer Polymers 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 244000043261 Hevea brasiliensis Species 0.000 claims description 16
- 238000010894 electron beam technology Methods 0.000 claims description 16
- 229920003052 natural elastomer Polymers 0.000 claims description 16
- 229920001194 natural rubber Polymers 0.000 claims description 16
- 150000001875 compounds Chemical class 0.000 claims description 15
- 125000000524 functional group Chemical group 0.000 claims description 14
- 229920002050 silicone resin Polymers 0.000 claims description 14
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical class [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 12
- 239000000919 ceramic Substances 0.000 claims description 12
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 11
- 239000011521 glass Substances 0.000 claims description 10
- 229920002379 silicone rubber Polymers 0.000 claims description 10
- 239000004945 silicone rubber Substances 0.000 claims description 9
- 239000004593 Epoxy Chemical class 0.000 claims description 8
- 229920003051 synthetic elastomer Polymers 0.000 claims description 8
- 239000005061 synthetic rubber Substances 0.000 claims description 8
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 claims description 7
- 239000011737 fluorine Substances 0.000 claims description 7
- 229910052731 fluorine Inorganic materials 0.000 claims description 7
- 229920003049 isoprene rubber Polymers 0.000 claims description 7
- 239000002952 polymeric resin Substances 0.000 claims description 7
- 229920003002 synthetic resin Polymers 0.000 claims description 7
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims description 6
- 229920002943 EPDM rubber Polymers 0.000 claims description 6
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 6
- VHOQXEIFYTTXJU-UHFFFAOYSA-N Isobutylene-isoprene copolymer Chemical compound CC(C)=C.CC(=C)C=C VHOQXEIFYTTXJU-UHFFFAOYSA-N 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 5
- 230000005855 radiation Effects 0.000 claims description 5
- 229920006172 Tetrafluoroethylene propylene Polymers 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- 150000004819 silanols Chemical class 0.000 claims description 4
- 229920005989 resin Polymers 0.000 description 25
- 239000011347 resin Substances 0.000 description 25
- 229920001296 polysiloxane Polymers 0.000 description 19
- 238000003851 corona treatment Methods 0.000 description 17
- 239000000203 mixture Substances 0.000 description 13
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- 238000000034 method Methods 0.000 description 10
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- 230000000052 comparative effect Effects 0.000 description 7
- 150000002739 metals Chemical class 0.000 description 7
- 230000005251 gamma ray Effects 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
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- 239000010949 copper Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000011777 magnesium Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 description 4
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- KEAYESYHFKHZAL-UHFFFAOYSA-N Sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- UMHKOAYRTRADAT-UHFFFAOYSA-N [hydroxy(octoxy)phosphoryl] octyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OP(O)(=O)OCCCCCCCC UMHKOAYRTRADAT-UHFFFAOYSA-N 0.000 description 3
- 229920000800 acrylic rubber Polymers 0.000 description 3
- 229910052793 cadmium Inorganic materials 0.000 description 3
- 239000011575 calcium Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
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- 239000000835 fiber Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 229920001778 nylon Polymers 0.000 description 3
- 150000002978 peroxides Chemical class 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 229920000058 polyacrylate Polymers 0.000 description 3
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- 238000012545 processing Methods 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 229910000861 Mg alloy Inorganic materials 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910001069 Ti alloy Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229910001297 Zn alloy Inorganic materials 0.000 description 2
- HZEWFHLRYVTOIW-UHFFFAOYSA-N [Ti].[Ni] Chemical compound [Ti].[Ni] HZEWFHLRYVTOIW-UHFFFAOYSA-N 0.000 description 2
- 231100000987 absorbed dose Toxicity 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- WDJHALXBUFZDSR-UHFFFAOYSA-M acetoacetate Chemical compound CC(=O)CC([O-])=O WDJHALXBUFZDSR-UHFFFAOYSA-M 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- 229910052790 beryllium Inorganic materials 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
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- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
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- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 229920001038 ethylene copolymer Polymers 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 2
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- 229920002480 polybenzimidazole Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
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- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
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- 235000007586 terpenes Nutrition 0.000 description 1
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- VYAMDNCPNLFEFT-UHFFFAOYSA-N trihydroxy(propyl)silane Chemical compound CCC[Si](O)(O)O VYAMDNCPNLFEFT-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
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- 239000010937 tungsten Substances 0.000 description 1
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- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
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Landscapes
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Description
本発明は、接着し難い樹脂製やゴム製の接着基材表面を処理して異種の被接着基材と接着して一体化している接着体に関するものである。 The present invention relates to an adhesive body in which the surface of an adhesive base material made of resin or rubber, which is difficult to adhere to, is treated to adhere and integrate with a different type of base material to be adhered.
フッ素樹脂やフッ素ゴムで形成されたフッ素含有高分子材料、シリコーン樹脂やシリコーンゴムで形成されたシリコーン材料、エチレン-プロピレン-ジエン共重合体のようなゴムで形成された接着基材と、高分子樹脂、天然ゴム、合成ゴム、架橋ゴム、金属、ガラス、又はセラミックスのような異種の材料で形成された被接着基材とは、物理化学的性質が大きく異なったり何れも粘着性や接着性を有しなかったりするため、単に接触させただけでは、接着や粘着ができない。流動性の硬化性接着剤を使用して接着した場合でも、その接着力は分子間力によるため非常に弱い。さらに、基材の材料が異なれば適切な接着剤も変わるため、最適な接着剤の選定は、試行錯誤により行わなければならず、大変な手間がかかっていた。 Fluorine-containing polymer materials made of fluororesin or fluororubber, silicone materials made of silicone resin or silicone rubber, adhesive base materials made of rubber such as ethylene-propylene-diene copolymer, and polymers. Adhesive substrates made of different materials such as resin, natural rubber, synthetic rubber, cross-linked rubber, metal, glass, or ceramics may have significantly different physicochemical properties or may exhibit tackiness or adhesion. Therefore, adhesion or adhesion cannot be achieved simply by making contact. Even when bonding is performed using a fluid curable adhesive, the adhesive force is very weak due to intermolecular forces. Furthermore, since the appropriate adhesive changes depending on the material of the base material, selecting the most suitable adhesive has to be done through trial and error, which takes a lot of time and effort.
中でも、フッ素含有高分子材料で形成された固体基材は、それが有する非常に低い誘電率、低い表面張力、優れた化学安定性、低い溶媒吸収性・水分吸収性、及び優れた熱安定性のために、耐薬品性や耐熱性が求められる箇所でのパッキン等として、単独で汎用されているが、非常に低い表面張力のために、他の部材との接着・複合化・一体化が極めて困難である。 Among them, solid substrates made of fluorine-containing polymeric materials have extremely low dielectric constant, low surface tension, excellent chemical stability, low solvent absorption/water absorption, and excellent thermal stability. Because of this, it is commonly used alone as packing in places where chemical resistance and heat resistance are required, but due to its extremely low surface tension, it cannot be bonded, composited, or integrated with other materials. It is extremely difficult.
表面を活性化して接着、印刷、塗装を容易にした固体基材の表面改質方法として、特許文献1に、シラン原子、チタン原子またはアルミニウム原子を含み沸点が10~100℃である改質剤化合物を含む燃料ガスの火炎を、シリコーンゴム、フッ素ゴム、天然ゴム等のゴム類である固体物質の表面に対して、全面または部分的に吹き付け処理することが、開示されている。しかし、単なる接着、印刷、塗装では表面の分子間力に依存しているに過ぎず、固体基材と他の基材との十分な接着強度を示せないばかりか、固体基材の表面を火炎処理で劣化させたり精密加工ができなかったりするという問題がある。 As a surface modification method for a solid base material that activates the surface to facilitate adhesion, printing, and painting, Patent Document 1 describes a modifier containing a silane atom, a titanium atom, or an aluminum atom and having a boiling point of 10 to 100°C. It has been disclosed that the surface of a solid material, which is a rubber such as silicone rubber, fluororubber, or natural rubber, is completely or partially sprayed with a flame of fuel gas containing a compound. However, simple adhesion, printing, and painting only rely on intermolecular forces on the surface, and not only do they fail to show sufficient adhesive strength between the solid base material and other base materials, but also the surface of the solid base material is exposed to flame. There are problems in that it deteriorates during processing and cannot be precisely processed.
そこで、加硫接着による複合化が主に行われている。例えば、特許文献2に、フッ素ゴムとトリアジンチオールの第4級アンモニウム塩誘導体とからなる加硫性ゴム組成物と、フッ素ゴム以外の加硫性ゴム組成物とを加硫接着したゴム積層体が開示されている。しかし、耐熱性が低い部材とは接着できないこと、寸法ばらつきが大きいこと、表面の微細構造を侵食してしまうという欠点がある。 Therefore, composites using vulcanization adhesives are mainly used. For example, Patent Document 2 discloses a rubber laminate in which a vulcanizable rubber composition consisting of fluororubber and a quaternary ammonium salt derivative of triazinethiol and a vulcanizable rubber composition other than fluororubber are vulcanized and bonded together. Disclosed. However, it has the disadvantages of not being able to adhere to members with low heat resistance, large dimensional variations, and eroding the fine structure of the surface.
また、特許文献3に、フッ素樹脂にシリコーン樹脂が接着された樹脂複合体を製造する方法であって、フッ素樹脂のシリコーン樹脂との接着面に表面処理を施し、この接着面に上記シリコーン樹脂として、反応性ラジカルを発生する化合物又は過酸化物を添加した付加反応硬化型シリコーン樹脂組成物又は縮合反応硬化型シリコーン樹脂組成物を積層して架橋接着する樹脂複合体の製造方法が、開示されている。しかし、組成物を積層して架橋するものであるから、固体同士を接着するものではなく、汎用性に乏しい。 Further, Patent Document 3 discloses a method for manufacturing a resin composite in which a silicone resin is bonded to a fluororesin, in which a surface treatment is applied to the adhesive surface of the fluororesin to the silicone resin, and the adhesive surface is treated with the silicone resin. , a method for producing a resin composite in which addition reaction-curing silicone resin compositions or condensation reaction-curing silicone resin compositions to which a reactive radical-generating compound or peroxide is added is laminated and crosslinked and bonded is disclosed. There is. However, since the composition is laminated and crosslinked, it does not adhere solid objects together, and therefore lacks versatility.
本発明は前記の課題を解決するためになされたもので、接着し難い樹脂製やゴム製の固体の接着基材表面を処理して異種で固体の被接着基材と接着して簡易に一体化しており汎用性の高い接着体を提供することを目的とする。 The present invention was made in order to solve the above-mentioned problem, and the surface of a solid adhesive base material made of resin or rubber, which is difficult to adhere to, is treated and bonded to a different solid base material to be easily integrated. The purpose is to provide a highly versatile adhesive body.
本発明に係る接着体は、フッ素樹脂、フッ素ゴム、シリコーン樹脂、シリコーンゴム、エチレン-プロピレン-ジエンゴム、エチレン-プロピレン-ジエン-メチレンゴム、イソブチレン-イソプレン共重合ゴム、イソプレンゴム、及び天然ゴムから選ばれる何れかで形成され、かつ分子接着剤が付された固形の接着基材の電子線照射処理表面又はγ線照射処理表面の表面の活性基を介してグラフト共重合された前記分子接着剤の分子と、高分子樹脂、天然ゴム、合成ゴム、架橋ゴム、金属、ガラス、及びセラミックスから選ばれる何れかで形成された固形の被接着基材の表面に有する官能性基とによる共有結合によって、前記接着基材と前記被接着基材とが、接着して一体化していることを特徴とするものである。
具体的には、本発明は、フッ素樹脂、フッ素ゴム、シリコーン樹脂、シリコーンゴム、エチレン-プロピレン-ジエンゴム、エチレン-プロピレン-ジエン-メチレンゴム、イソブチレン-イソプレン共重合ゴム、イソプレンゴム、及び天然ゴムから選ばれる何れかで形成され、かつシラノール化合物、アルミネート化合物、チタネート化合物、トリアジン環含有化合物、チオール化合物、エポキシ化合物、及びアミン化合物から選ばれる何れかの分子接着剤が付された固形の接着基材の電子線照射処理表面又はγ線照射処理表面の遊離基を介してグラフト共重合された前記分子接着剤の分子と、高分子樹脂、天然ゴム、合成ゴム、架橋ゴム、金属、ガラス、及びセラミックスから選ばれる何れかで形成された固形の被接着基材のコロナ処理表面、紫外線処理表面、エキシマ処理表面、及びイトロ処理表面から選ばれる少なくとも何れかに有する官能性基としてのヒドロキシ基、或いは前記被接着基材の分子接着剤処理表面の官能性基とによる共有結合によって、前記接着基材と前記被接着基材とが、接着して一体化していることを特徴とする接着体である。
The adhesive according to the present invention is selected from fluororesin, fluororubber, silicone resin, silicone rubber, ethylene-propylene-diene rubber, ethylene-propylene-diene-methylene rubber, isobutylene-isoprene copolymer rubber, isoprene rubber, and natural rubber. The above-mentioned molecular adhesive is graft-copolymerized via active groups on the electron beam irradiation-treated surface or the γ-ray irradiation treated surface of a solid adhesive base material to which the molecular adhesive is attached. Through a covalent bond between a molecule and a functional group on the surface of a solid substrate made of one selected from polymer resins, natural rubber, synthetic rubber, crosslinked rubber, metals, glass, and ceramics, The adhesive base material and the adhered base material are bonded and integrated.
Specifically, the present invention provides fluororesin, fluororubber, silicone resin, silicone rubber, ethylene-propylene-diene rubber, ethylene-propylene-diene-methylene rubber, isobutylene-isoprene copolymer rubber, isoprene rubber, and natural rubber. A solid adhesive base formed of any selected material and attached with any molecular adhesive selected from silanol compounds, aluminate compounds, titanate compounds, triazine ring-containing compounds, thiol compounds, epoxy compounds, and amine compounds. Molecules of the molecular adhesive graft copolymerized via free radicals on the electron beam irradiation treated surface or γ ray irradiation treated surface of the material, polymer resin, natural rubber, synthetic rubber, crosslinked rubber, metal, glass, and A hydroxyl group as a functional group on at least one selected from a corona-treated surface, an ultraviolet-treated surface, an excimer-treated surface, and an intro-treated surface of a solid substrate to be adhered formed of any selected from ceramics, or The adhesive body is characterized in that the adhesive base material and the adhesive base material are bonded and integrated by a covalent bond with a functional group on the molecular adhesive-treated surface of the adhesive base material. .
この接着体は、前記遊離基が、前記接着基材の表面に有し及び/又は生じているものであるというものであってもよい。 This adhesive body may be one in which the free radicals are present and/or generated on the surface of the adhesive base material.
この接着体は、前記接着基材が、例えば、フッ化ビニリデン重合体、四フッ化エチレン-プロピレン共重合体、及び四フッ化エチレン-パーフルオロアルキルビニルエーテル共重合体から選ばれる何れかである前記フッ素樹脂又は前記フッ素ゴムで形成されたフッ素含有接着基材とするというものである In this adhesive body, the adhesive base material is, for example, one selected from vinylidene fluoride polymer, tetrafluoroethylene-propylene copolymer, and tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer. A fluorine-containing adhesive base material made of fluororesin or fluororubber is used.
この接着体は、前記被接着基材の分子接着剤処理表面が、シラノール化合物、アルミネート化合物、チタネート化合物、トリアジン環含有化合物、チオール化合物、エポキシ化合物、及びアミン化合物から選ばれる何れかの分子接着剤処理表面であるというものである。 In this adhesive body, the molecular adhesive-treated surface of the substrate to be adhered is treated with any molecular adhesive selected from a silanol compound, an aluminate compound, a titanate compound, a triazine ring-containing compound, a thiol compound, an epoxy compound, and an amine compound. The surface is treated with a chemical agent .
この接着体は、前記分子接着剤が、例えば、ビニル基含有アルコキシシロキサンであるというものである。 In this adhesive body, the molecular adhesive is, for example, a vinyl group-containing alkoxysiloxane .
この接着体は、前記接着基材が、可撓性のフィルム状、非可撓性の板状、又は固形の立体状であり、被接着基材が、可撓性のフィルム状、非可撓性の板状、又は固形の立体状であることが好ましい。 In this adhesive body, the adhesive base material is a flexible film shape, a non-flexible plate shape, or a solid three-dimensional shape, and the adhered base material is a flexible film shape, a non-flexible plate shape, or a solid three-dimensional shape. It is preferably in the form of a solid plate or a solid three-dimensional shape.
本発明の接着体は、フッ素樹脂、フッ素ゴム、シリコーン樹脂、シリコーンゴム、エチレン-プロピレン-ジエンゴム、エチレン-プロピレン-ジエン-メチレンゴム、イソブチレン-イソプレン共重合ゴム、イソプレンゴム、及び天然ゴムから選ばれる何れかで形成された接着基材と、高分子樹脂、天然ゴム、合成ゴム、架橋ゴム、金属、ガラス、及びセラミックスから選ばれる何れかで被接着基材とを、グラフト共重合された分子接着剤の分子を介した共有結合である分子接着により、接着している。それによって、硬化性接着剤を用いなくとも、これら接着基材と、同種又は異種の被接着基材とが、夫々の素材や物性等に依らず、また表面の凹凸の程度に依らず、直接的な共有結合によって強固に架橋して接着されたものである。 The adhesive of the present invention is selected from fluororesin, fluororubber, silicone resin, silicone rubber, ethylene-propylene-diene rubber, ethylene-propylene-diene-methylene rubber, isobutylene-isoprene copolymer rubber, isoprene rubber, and natural rubber. Molecular bonding made by graft copolymerization of an adhesion base material made of any one of them and a base material to be adhered made of any one selected from polymer resins, natural rubber, synthetic rubber, crosslinked rubber, metals, glass, and ceramics. They are attached by molecular adhesion, which is a covalent bond between the molecules of the agent. As a result, even without using a curable adhesive, these adhesive base materials can be directly bonded to the same or different type of adhered base material, regardless of their respective materials or physical properties, or the degree of surface unevenness. It is strongly cross-linked and bonded by covalent bonds.
この接着体は、共有結合により、流動性の硬化性接着剤の分子間力による接着よりも、遥かに強く確りと、両基材を接着している。 This adhesive adheres the two base materials by covalent bonding much more strongly and reliably than the adhesion by the intermolecular force of the fluid curable adhesive.
この接着体は、接着基材が接着し難い樹脂又はゴム製、とりわけ表面張力が小さなフッ素樹脂及びフッ素ゴムのようなフッ素含有高分子材料、又はシリコーン樹脂、シリコーンゴムのようなシリコーン製高分子材料であっても、若しくは架橋接着し難いエチレン-プロピレン-ジエン-メチレンゴム、イソブチレン-イソプレン共重合ゴム、イソプレンゴム、天然ゴム等であっても、被接着基材と、分子接着剤の分子を介した共有結合によって強固に架橋した接着が可能である。 The adhesive base material is made of resin or rubber that is difficult to adhere to, especially fluorine-containing polymeric materials such as fluororesins and fluororubbers that have low surface tension, or silicone polymeric materials such as silicone resins and silicone rubber. Even if it is ethylene-propylene-diene-methylene rubber, isobutylene-isoprene copolymer rubber, isoprene rubber, natural rubber, etc., which are difficult to cross-link and bond, it is possible to bond the substrate and the molecular adhesive through the molecules. Strong cross-linked adhesion is possible through covalent bonds.
この接着体は、予め形成された接着基材及び被接着基材が、接着基材の表面の活性基と被接着基材の表面に有する官能性基との間で、分子接着剤の分子を介した共有結合によって接着している。 In this adhesive body, a pre-formed adhesive base material and a bonded base material bind molecular adhesive molecules between an active group on the surface of the adhesive base material and a functional group on the surface of the bonded base material. They are attached by covalent bonds.
接着体は、共有結合である化学結合により、接着基材と、同種若しくは異種の天然ゴム、合成ゴム、樹脂、金属、半金属、合金、ガラス、及びセラミックスから選ばれる被接着基材とを共有結合によって強固に接着しているから、撓みや過酷な温度変化によっても剥離を生じない。また、接着体は、流動性の硬化性接着剤に依らずに、接着基材と被接着基材との間で、直接結合を介するだけで接着しているので、その接着面でそれらの混合物がはみ出たりそれの硬化物層で剥離したりする恐れがない。しかも接着基材と被接着基材とが、平面であっても凹凸を有する複雑な立体形状であっても、表面の微細構造を侵食することなく、均等かつ強固に接着されている。 The bonded body shares the adhesive base material with the adhered base material selected from the same or different types of natural rubber, synthetic rubber, resin, metal, semimetal, alloy, glass, and ceramics through a chemical bond that is a covalent bond. Because it is strongly bonded, it will not peel off even if it is bent or subjected to severe temperature changes. In addition, since the adhesive body does not rely on a fluid curable adhesive and adheres only through direct bonding between the adhesive base material and the adhered base material, the mixture of them is bonded on the adhesive surface. There is no risk of the adhesive extruding or peeling off due to the cured layer. Moreover, even if the adhesive base material and the adhered base material are flat or have a complex three-dimensional shape with unevenness, they are evenly and firmly adhered without corroding the fine structure of the surface.
そのため接着体は、接着界面が直接的な共有結合だけで接着したものであるから、接着界面での熱劣化が小さく耐熱性に優れ、とりわけ表面張力が小さなフッ素樹脂及びフッ素ゴムのようなフッ素含有高分子材料であってさえ、引張られても剥がれたり裂けたりしない。 Therefore, since the adhesive interface is bonded only by direct covalent bonds, the adhesive interface has little thermal deterioration and has excellent heat resistance, and especially fluorine-containing materials such as fluororesins and fluororubbers that have low surface tension. Even polymeric materials will not peel or tear under tension.
以下、本発明を実施するための形態を詳細に説明するが、本発明の範囲はこれらの形態に限定されるものではない。 Hereinafter, embodiments for carrying out the present invention will be described in detail, but the scope of the present invention is not limited to these embodiments.
本発明の接着体の好ましい実施の一形態は、フッ素ゴム製の接着基材の表面の活性基を介してグラフト共重合された分子接着剤の分子と、金属製の被接着基材の表面に有する官能性基とによる共有結合によって、接着基材と被接着基材とが、接着して一体化しているというものである。 In a preferred embodiment of the adhesive of the present invention, molecules of a molecular adhesive graft copolymerized via active groups on the surface of a fluororubber adhesive substrate and the surface of a metal substrate to be bonded are bonded to each other. The adhesive base material and the adhered base material are bonded and integrated by a covalent bond formed by the functional group.
接着基材と被接着基材とは、予め形成されたもので、例えば可撓性のフィルム状である。 The adhesive base material and the adhered base material are formed in advance, and are, for example, in the form of a flexible film.
この接着体は、分子接着剤が含有された組成物で接着基材に塗布、塗工、噴霧、又は浸漬し電子線処理した接着基材の表面に、又は接着基材に電子線処理してから分子接着剤が含有された組成物で塗布、塗工、噴霧、又は浸漬した接着基材の表面に、被接着基材の接着すべき面が接触されることで、フッ素ゴム製の接着基材の表面の活性基にグラフト共重合された分子接着剤の分子と金属製の被接着基材の表面に有する官能性基との共有結合によって、接着基材と被接着基材とが、接着して一体化している。 This adhesive body is applied to the surface of an adhesive base material that has been coated, coated, sprayed, or dipped with a composition containing a molecular adhesive and then treated with an electron beam, or the adhesive base material is subjected to an electron beam treatment. The surface of the adhesive substrate that has been coated, coated, sprayed, or dipped in a composition containing a molecular adhesive is brought into contact with the surface of the adhesive substrate to be adhered, thereby forming a fluororubber adhesive base. The adhesive base material and the adhered base material are bonded together by the covalent bond between the molecular adhesive molecules graft-copolymerized to the active groups on the surface of the material and the functional groups on the surface of the metal base material. and are integrated.
分子接着剤が含有された組成物で接着基材に塗布、塗工、噴霧、又は浸漬し電子線処理した接着基材の表面に、被接着基材を接触させ、接着基材と被接着基材とが、接着して一体化していることが好ましい。接着基材の表面に分子接着剤が付されてから電子線処理すると、電子線処理によって生じた不安定な活性基が直ぐに分子接着剤の分子と反応しグラフト共重合するから、反応効率や生産効率が高い。 A bonding substrate is brought into contact with the surface of the bonding substrate, which has been coated, coated, sprayed, or immersed with a composition containing a molecular adhesive and then treated with an electron beam. It is preferable that the materials are bonded and integrated. When a molecular adhesive is applied to the surface of an adhesive base material and then subjected to electron beam treatment, the unstable active groups generated by the electron beam treatment immediately react with molecules of the molecular adhesive and graft copolymerize, which reduces reaction efficiency and production. High efficiency.
接着基材のフッ素ゴムは化学的に極めて安定であるから、その接着基材の表面は、通常コロナ放電やエキシマ処理を施してもエネルギーが足りず活性化できない。しかし、フッ素ゴムに電子線処理を施すと、表面が酸化されて水酸基を生じたり、フッ素-炭素結合が開裂しフッ化水素が脱離したりフッ素ラジカルが脱離し遊離基を生じたりするような推定反応機構により、接着基材の表面に、活性基を生じる。この活性基に分子接着剤の分子が反応して共有結合する。接着基材に化学的に結合している分子接着剤の分子は、被接着基材の表面に有する官能性基と反応して共有結合する。これによって、接着基材と被接着基材とが、分子接着剤の分子を介して、共有結合し、接着されることとなる。このような接着基材への分子接着剤の分子の化学結合は、グラフト共重合となるのであるから、接着基材の各活性基の一つの基に対して結合した分子接着剤の一分子が、被接着基材の官能性基の一つの基に反応して、共有結合によって、接着基材と被接着基材とが、接着して一体化する。 Since the fluororubber used as the adhesive base material is chemically extremely stable, the surface of the adhesive base material cannot normally be activated due to insufficient energy even when subjected to corona discharge or excimer treatment. However, when fluororubber is subjected to electron beam treatment, it is estimated that the surface will be oxidized to produce hydroxyl groups, fluorine-carbon bonds will be cleaved and hydrogen fluoride will be released, and fluorine radicals will be released and free radicals will be produced. The reaction mechanism produces active groups on the surface of the adhesive substrate. The molecules of the molecular adhesive react with this active group and form a covalent bond. The molecules of the molecular adhesive chemically bonded to the adhesive substrate react with functional groups on the surface of the adhered substrate to form a covalent bond. As a result, the adhesive base material and the adhered base material are covalently bonded and adhered to each other via the molecules of the molecular adhesive. Such chemical bonding of molecules of the molecular adhesive to the adhesive substrate results in graft copolymerization, so one molecule of the molecular adhesive bonded to one group of each active group of the adhesive substrate , reacts with one of the functional groups of the adhesive base material, and the adhesive base material and the adhesive base material are bonded and integrated by a covalent bond.
接着体は、分子接着剤の分子が、あたかも櫛のように接着基材の表面に生成し、分子接着剤の一分子で一共有結合を形成しつつ分子接着剤の多数の分子で単分子膜層を形成して、接着基材と被接着基材とが、接着して一体化したものである。 Adhesives are created by molecular adhesive molecules forming on the surface of an adhesive substrate like a comb, forming a single covalent bond with one molecule of molecular adhesive, and forming a monomolecular film with many molecules of molecular adhesive. The adhesive base material and the adhered base material are bonded and integrated by forming a layer.
グラフト共重合させるのに、電子線処理を施す例で説明したが、接着基材の表面を活性化し分子接着剤の分子を結合し易くするものであれば、γ線処理であってもよく、これらの何れかの複数の処理を施してもよい。 Although the example has been explained in which electron beam treatment is applied to perform graft copolymerization, γ-ray treatment may also be used as long as it activates the surface of the adhesive base material and makes it easier to bond molecules of the molecular adhesive. A plurality of any of these processes may be performed.
そのようなグラフト共重合した接着基材の表面が、グラフト共重合の前及び/又は後で、コロナ処理、紫外線処理、エキシマ処理、及び/又はイトロ処理されていてもよい。 The surface of such a graft copolymerized adhesive base material may be subjected to corona treatment, ultraviolet treatment, excimer treatment, and/or intro treatment before and/or after graft copolymerization.
被接着基材の官能性基は、被接着基材の表面にコロナ処理、紫外線処理、エキシマ処理、又はイトロ処理を施すことによって新たに生じ又は増幅したものであってもよく、被接着基材の原料成分に由来し表面に元々露出しているものであってもよい。 The functional groups of the substrate to be adhered may be newly generated or amplified by subjecting the surface of the substrate to corona treatment, ultraviolet treatment, excimer treatment, or intro treatment, and It may be derived from raw material components and originally exposed on the surface.
接着基材がフッ素ゴム製で、被接着基材が金属製である例を示したが、接着基材が、フッ化ビニリデン重合体、四フッ化エチレン-プロピレン共重合体、及び四フッ化エチレン-パーフルオロアルキルビニルエーテル共重合体のようなフッ素樹脂又はフッ素ゴム;モノオルガノシロキシ単位であるT単位、前記シロキシ単位であるQ単位、R3SiO1/2単位(オルガノ基Rは、同一又は異なり、アルキル基、フェニル基、又は架橋性官能基に由来する基である)からなるトリオルガノシロキシ単位であるM単位、及び/又はR2SiO単位(Rは前記と同じ)からなるジオルガノシロキシ単位であるD単位を含み、それらの単位を有しているMQ樹脂/ゴム、MDQ樹脂/ゴム、MTQ樹脂/ゴム、MDTQ樹脂/ゴム、TD樹脂/ゴム、TQ樹脂/ゴム、及びTDQ樹脂/ゴムで例示されもので、例えばポリジメチルシリコーン、ポリジフェニルシリコーン、その変成シリコーンのようなシリコーン樹脂製やシリコーンゴム製、より具体的には、Pt触媒存在下で合成したビニルメチルシロキサン/ポリジメチルシロキサンコポリマー(分子量:50万~90万)、ビニル末端ポリジメチルシロキサン(分子量:1万~20万)、ビニル末端ジフェニルシロキサン/ポリジメチルシロキサンコポリマー(分子量:1万~10万)、ビニル末端ジエチルシロキサン/ポリジメチルシロキサンコポリマー(分子量:1万~5万)、ビニル末端トリフロロプロピルメチルシロキサン/ポリジメチルシロキサンコポリマー(分子量:1万~10万)、ビニル末端ポリフェニルメチルシロキサン(分子量:0.1万~1万)、ビニルメチルシロキサン/ジメチルシロキサンコポリマー、トリメチルシロキサン基末端ジメチルシロキサン/ビニルメチルシロキサン/ジフェニルシロキサンコポリマー、トリメチルシロキサン基末端ジメチルシロキサン/ビニルメチルシロキサン/ジトリフロロプロピルメチルシロキサンコポリマー、トリメチルシロキサン基末端ポリビニルメチルシロキサンなどのビニル基含有ポリシロキサンと、H末端ポリシロキサン(分子量:0.05万~10万)、メチルHシロキサン/ジメチルシロキサンコポリマー、ポリメチルHシロキサン、ポリエチルHシロキサン、H末端ポリフェニル(ジメチルHシロキシ)シロキサン、メチルHシロキサン/フェニルメチルシロキサンコポリマー、メチルHシロキサン/オクチルメチルシロキサンコポリマーのようなH基含有ポリシロキサンを含有する組成物の硬化物製;エチレン-プロピレン-ジエンゴム製:エチレン-プロピレン-ジエン-メチレンゴム(EPDM)製;イソブチレン-イソプレン共重合ゴム製;イソプレンゴム製;天然ゴム製;のようなものを挙げることができる。 An example in which the adhesive base material is made of fluororubber and the adhered base material is made of metal is shown, but the adhesive base material may be vinylidene fluoride polymer, tetrafluoroethylene-propylene copolymer, or tetrafluoroethylene - Fluororesin or fluororubber such as perfluoroalkyl vinyl ether copolymer; T unit which is a monoorganosiloxy unit, Q unit which is the siloxy unit, R 3 SiO 1/2 unit (organo group R is the same or different) , an alkyl group, a phenyl group, or a group derived from a crosslinkable functional group), and/or a diorganosiloxy unit consisting of an R 2 SiO unit (R is the same as above). MQ resins/rubbers, MDQ resins/rubbers, MTQ resins/rubbers, MDTQ resins/rubbers, TD resins/rubbers, TQ resins/rubbers, and TDQ resins/rubbers that contain and have D units that are For example, silicone resins and silicone rubbers such as polydimethylsilicone, polydiphenylsilicone, and modified silicones thereof, and more specifically, vinylmethylsiloxane/polydimethylsiloxane copolymers synthesized in the presence of a Pt catalyst. (molecular weight: 500,000-900,000), vinyl-terminated polydimethylsiloxane (molecular weight: 10,000-200,000), vinyl-terminated diphenylsiloxane/polydimethylsiloxane copolymer (molecular weight: 10,000-100,000), vinyl-terminated diethylsiloxane/polymer Dimethylsiloxane copolymer (molecular weight: 10,000 to 50,000), vinyl-terminated trifluoropropylmethylsiloxane/polydimethylsiloxane copolymer (molecular weight: 10,000 to 100,000), vinyl-terminated polyphenylmethylsiloxane (molecular weight: 01,000 to 1 10,000), vinylmethylsiloxane/dimethylsiloxane copolymer, trimethylsiloxane-terminated dimethylsiloxane/vinylmethylsiloxane/diphenylsiloxane copolymer, trimethylsiloxane-terminated dimethylsiloxane/vinylmethylsiloxane/ditrifluoropropylmethylsiloxane copolymer, trimethylsiloxane-terminated polyvinylmethyl Vinyl group-containing polysiloxane such as siloxane, H-terminated polysiloxane (molecular weight: 0,050,000 to 100,000), methyl H-siloxane/dimethylsiloxane copolymer, polymethyl H-siloxane, polyethyl H-siloxane, H-terminated polyphenyl (dimethyl H-siloxane) ) siloxane, methyl H siloxane/phenylmethyl siloxane copolymer, methyl H siloxane/octyl methyl siloxane copolymer, and other H group-containing polysiloxane-containing compositions made of cured products; ethylene-propylene-diene rubber: ethylene-propylene-diene - Methylene rubber (EPDM); isobutylene-isoprene copolymer rubber; isoprene rubber; and natural rubber.
被接着基材が、天然ゴム、合成ゴム、架橋ゴム、高分子樹脂、金属、ガラス、及びセラミックスから選ばれる何れかであってもよい。 The substrate to be adhered may be any one selected from natural rubber, synthetic rubber, crosslinked rubber, polymer resin, metal, glass, and ceramics.
被接着基材の素材の天然ゴム、合成ゴム、架橋ゴム、高分子樹脂として、
付加架橋型シリコーン;ビニルメチルシリコーン(VMQ)、メチルフェニルシリコーン(PVMQ)、フルオロメチルシリコーン(FVMQ)、及びジメチルシリコーン(MQ)のようなシリコーン、パーオキサイド架橋型シリコーン、縮合架橋型シリコーン、紫外線架橋型シリコーン、電子線架橋型シリコーンゴムで例示されるシリコーン、これらのシリコーンとオレフィンとの共ブレンド物のようなシリコーン系高分子樹脂;
ポリ塩化ビニル、ポリスチレン、s‐ポリスチレン、-ブタジエン-スチレン共重合体;ポリアミド;ポリメタクリアクリロニトリルル酸メチル;ポリフェニレンスルフィド;ポリエチレンテレフタレート、ポリブチレンテレフタレート;ポリカーボネート、シクロオレフィンポリマー、ポリエステル(メタ)アクリレート、エポキシ(メタ)アクリレート、ウレタン(メタ)アクリレート、ポリエーテル(メタ)アクリレート、およびシリコーン(メタ)アクリレート、及びペンタエリスリトールテトラ(メタ)アクリレートのような(メタ)アクリル樹脂、エポキシ樹脂、セルロース及びその誘導体、ヒドロキシエチルセルロース、デンプン、二酢酸セルロース、表面ケン化酢酸ビニル樹脂、低密度ポリエチレン、高密度ポリエチレン、i-ポリプロピレン、石油樹脂、クマロン・インデン樹脂、テルペン樹脂、スチレン・ジビニルベンゼン共重合体、ABS樹脂、ポリアクリル酸メチル、ポリアクリル酸エチル、ポリアクリルニトリル、ポリメタクリル酸メチル、ポリメタクリル酸エチル、ポリシアノアクリレート、ポリ酢酸ビニル、ポリビニルアルコール、ポリビニルホルマール、ポリビニルアセタール、ポリ塩化ビニル、塩化ビニル・酢酸ビニル共重合体、塩化ビニル・エチレン共重合体、ポリフッ化ビニリデン、フッ化ビニリデン・エチレン共重合体、フッ化ビニリデン・プロピレン共重合体、1,4‐トランスポリブタジエン、ポリオキシメチレン、ポリエチレングリコール、ポリプロピレングリコール、フェノール・ホルマリン樹脂、クレゾール・フォルマリン樹脂、レゾルシン樹脂、メラミン樹脂、キシレン樹脂、トルエン樹脂、グリプタル樹脂、変性グリプタル樹脂、不飽和ポリエステル樹脂、アリルエステル樹脂、6-ナイロン、6,6-ナイロン、6,10-ナイロン、ポリイミド、ポリアミド、ポリベンズイミダゾール、ポリアミドイミド、ケイ素樹脂、シリコーンゴム、シリコーン樹脂、フラン樹脂、ポリウレタン樹脂、ポリフェニレンオキサイド、ポリジメチルフェニレンオキサイド、ポリフェニレンオキサイドまたはポリジメチルフェニレンオキサイドとトリアリルイソシアヌルブレンド物、(ポリフェニレンオキサイドまたはポリジメチルフェニレンオキサイド、トリアリルイソシアヌル、パーオキサイド)ブレンド物、ポリキシレン、ポリフェニレンスルファイド、ポリスルホン、ポリエーテルスルホン、ポリエーテルエーテルケトン、ポリイミド、ポリテトラフルオロエチレン、液晶樹脂、ケブラー繊維、炭素繊維、天然ゴム、ブタジエンゴム、1,4-シスブタジエンゴム、イソプレンゴム、イソブチレン-イソプレンゴム、ポリクロロプレン、スチレン・ブタジエン共重合ゴム、水素添加スチレン・ブタジエン共重合ゴム、アクリロニトリル・ブタジエン共重合ゴム、水素添加アクリロニトリル・ブタジエン共重合ゴム、ポリブテンゴム、ポリイソブチレンゴム、エチレン・プロピレンゴム、エチレン-プロピレン-ジエンゴム、エチレンオキサイド-エピクロロヒドリン共重合体ゴム、塩素化ポリエチレンゴム、クロルスルフォン化ポリエチレンゴム、アルキル化クロルスルフォン化ポリエチレンゴム、クロロプレンゴム、アクリルゴム、塩素化アクリルゴム、臭素化アクリルゴム、フッ化ビニリデン系やテトラフルオロエチレン-プロピレン系やテトラフルオロエチレン-パープルオロビニルエーテル系のようなフッ素ゴム、エピクロルヒドリンとその共重合ゴム、塩素化エチレンプロピレンゴム、塩素化ブチルゴム、臭素化ブチルゴム、テトラフロロエチレン、ヘキサフロロプロピレン、フッ化ビニリデン及びテトラフルオロエチレンなどの単独重合体ゴム及びこれらの二元及び三元共重合体ゴム、エチレン/テトラフルオロエチレン共重合ゴム、プロピレン/テトラフルオロエチレン共重合ゴム、エチレンアクリルゴム、エポキシゴム、ウレタンゴム;
が挙げられる。
As natural rubber, synthetic rubber, crosslinked rubber, and polymer resin for the base material to be adhered,
Addition crosslinked silicones; silicones such as vinyl methyl silicone (VMQ), methylphenyl silicone (PVMQ), fluoromethyl silicone (FVMQ), and dimethyl silicone (MQ), peroxide crosslinked silicones, condensation crosslinked silicones, UV crosslinked silicone type silicone, silicone exemplified by electron beam cross-linked silicone rubber, and silicone-based polymer resins such as co-blends of these silicones and olefins;
Polyvinyl chloride, polystyrene, s-polystyrene, -butadiene-styrene copolymer; polyamide; polymethacryacrylonitrile methyl lunate; polyphenylene sulfide; polyethylene terephthalate, polybutylene terephthalate; polycarbonate, cycloolefin polymer, polyester (meth)acrylate, epoxy (meth)acrylic resins, epoxy resins, cellulose and derivatives thereof, such as (meth)acrylates, urethane (meth)acrylates, polyether (meth)acrylates, and silicone (meth)acrylates, and pentaerythritol tetra(meth)acrylate; Hydroxyethyl cellulose, starch, cellulose diacetate, surface saponified vinyl acetate resin, low density polyethylene, high density polyethylene, i-polypropylene, petroleum resin, coumaron/indene resin, terpene resin, styrene/divinylbenzene copolymer, ABS resin, Polymethyl acrylate, polyethyl acrylate, polyacrylonitrile, polymethyl methacrylate, polyethyl methacrylate, polycyanoacrylate, polyvinyl acetate, polyvinyl alcohol, polyvinyl formal, polyvinyl acetal, polyvinyl chloride, vinyl chloride/vinyl acetate Copolymer, vinyl chloride/ethylene copolymer, polyvinylidene fluoride, vinylidene fluoride/ethylene copolymer, vinylidene fluoride/propylene copolymer, 1,4-trans polybutadiene, polyoxymethylene, polyethylene glycol, polypropylene glycol , phenol/formalin resin, cresol/formalin resin, resorcinol resin, melamine resin, xylene resin, toluene resin, gliptal resin, modified gliptal resin, unsaturated polyester resin, allyl ester resin, 6-nylon, 6,6-nylon, 6,10-nylon, polyimide, polyamide, polybenzimidazole, polyamideimide, silicone resin, silicone rubber, silicone resin, furan resin, polyurethane resin, polyphenylene oxide, polydimethylphenylene oxide, polyphenylene oxide or polydimethylphenylene oxide and triallyl Isocyanuric blends, (polyphenylene oxide or polydimethylphenylene oxide, triallylisocyanuric, peroxide) blends, polyxylene, polyphenylene sulfide, polysulfone, polyether sulfone, polyether ether ketone, polyimide, polytetrafluoroethylene, liquid crystal resin , Kevlar fiber, carbon fiber, natural rubber, butadiene rubber, 1,4-cis-butadiene rubber, isoprene rubber, isobutylene-isoprene rubber, polychloroprene, styrene-butadiene copolymer rubber, hydrogenated styrene-butadiene copolymer rubber, acrylonitrile, Butadiene copolymer rubber, hydrogenated acrylonitrile-butadiene copolymer rubber, polybutene rubber, polyisobutylene rubber, ethylene-propylene rubber, ethylene-propylene-diene rubber, ethylene oxide-epichlorohydrin copolymer rubber, chlorinated polyethylene rubber, Chlor Sulfonated polyethylene rubber, alkylated chlorosulfonated polyethylene rubber, chloroprene rubber, acrylic rubber, chlorinated acrylic rubber, brominated acrylic rubber, vinylidene fluoride, tetrafluoroethylene-propylene, and tetrafluoroethylene-purple orovinyl ether. Homopolymer rubbers such as fluororubber, epichlorohydrin and its copolymer rubber, chlorinated ethylene propylene rubber, chlorinated butyl rubber, brominated butyl rubber, tetrafluoroethylene, hexafluoropropylene, vinylidene fluoride and tetrafluoroethylene; Binary and ternary copolymer rubber, ethylene/tetrafluoroethylene copolymer rubber, propylene/tetrafluoroethylene copolymer rubber, ethylene acrylic rubber, epoxy rubber, urethane rubber;
can be mentioned.
被接着基材の素材の金属・合金として、金属分類上は通常の金属、機能性金属、アモロファス金属、繊維強化金属ブロック、形状記憶合金、超弾性合金などからなり、金属形状分類上は板、シート、フィルム、角棒、丸棒、球、半球、繊維、網、網線布、フィルム、シート及びこれらの複雑回路形状、打抜き及び切削加工成形品を含み、周期律表上はベリリウム、マグネシウム、カルシウム、ストロンチウム、バリウム、ラジウム、スカンジウム、イットリウム、チタン、ジルコニウム、バナジウム、ニオブ、タンタル、クロム、モリブデン、タングステン、マンガン、鉄、コバルト、ロジウム、イリジウム、ニッケル、パラジウム、プラチナ、銅、銀、金、亜鉛、カドミウム、水銀、アルミニウム、ゲルマニウム、スズ、鉛、アンチモン、ビスマス、ネオジムの何れかであり、合金組成上は鉄合金(鋼(スチール)、炭素鋼、鋳鉄)、銅合金(りん青銅、黄銅、キュプロニッケル、ベリリウム銅、チタン銅)、アルミニウム合金(銅、マンガン、珪素、マグネシウム、亜鉛、ニッケル合金など)、マグネシウム合金(Mg/Zn合金、Mg/Ca合金など)、亜鉛合金、錫及び錫合金、ニッケル合金、金合金、銀合金、白金合金、パラジウム合金、鉛合金、チタン合金(α型、β型及びα+β型合金)、カドミウム、ジルコニウム合金、コバルト合金、クロム合金、モリブデン合金、タングステン合金、マンガン合金、フェライト系ステンレス、マルテンサイト系ステンレス、オースチナイト系ステンレス、析出強化型ステンレス、ニッケル-チタン合金、鉄-マンガン-チタン合金、超弾性合金(ニッケル-チタン合金)などの材料が、挙げられる。 Metals and alloys for the base material to be adhered include ordinary metals, functional metals, amorphous metals, fiber-reinforced metal blocks, shape memory alloys, superelastic alloys, etc., and metal shape classifications include plates, Includes sheets, films, square bars, round bars, spheres, hemispheres, fibers, nets, mesh wire cloth, films, sheets, complex circuit shapes, punching and cutting products, and on the periodic table are beryllium, magnesium, Calcium, strontium, barium, radium, scandium, yttrium, titanium, zirconium, vanadium, niobium, tantalum, chromium, molybdenum, tungsten, manganese, iron, cobalt, rhodium, iridium, nickel, palladium, platinum, copper, silver, gold, Zinc, cadmium, mercury, aluminum, germanium, tin, lead, antimony, bismuth, neodymium, and the alloy composition includes iron alloys (steel, carbon steel, cast iron), copper alloys (phosphor bronze, brass). , cupronickel, beryllium copper, titanium copper), aluminum alloys (copper, manganese, silicon, magnesium, zinc, nickel alloys, etc.), magnesium alloys (Mg/Zn alloys, Mg/Ca alloys, etc.), zinc alloys, tin and tin Alloys, nickel alloys, gold alloys, silver alloys, platinum alloys, palladium alloys, lead alloys, titanium alloys (α type, β type and α + β type alloys), cadmium, zirconium alloys, cobalt alloys, chromium alloys, molybdenum alloys, tungsten alloys , manganese alloys, ferritic stainless steels, martensitic stainless steels, austinitic stainless steels, precipitation-strengthened stainless steels, nickel-titanium alloys, iron-manganese-titanium alloys, and superelastic alloys (nickel-titanium alloys). .
被接着基材の素材の半金属として、シリコン板が挙げられる。 A silicon plate is an example of the metalloid material of the base material to be adhered.
被接着基材の素材のガラスとして、石英、硼珪酸ガラス、無アルカリガラスが挙げられる。 Examples of the glass material of the substrate to be adhered include quartz, borosilicate glass, and alkali-free glass.
被接着基材の素材のセラミックスとして、陶磁器、ガラス、セメント、石膏及びほうろうなど高温で固めたものであり、組成上は元素系(ダイヤモンド、C)、酸化物系(アルミナ、Al2O3)、ジルコニア系、水酸化物系(ハイドロキシアパタイト)、炭化物系(炭化ケイ素、SiC)、炭酸塩系、窒化物系(窒化ケイ素)(7ハロゲン化物系(蛍石)、リン酸塩系(アパタイト)も含み、具体的にはチタン酸バリウム、Bi2Sr2Ca2Cu3O10、高温超伝導セラミックス、窒化ホウ素、フェライト、チタン酸ジルコン酸鉛、炭化ケイ素、窒化ケイ素、ステアタイト(MgOSiO2)、YBa2Cu3O7-δ、高温超伝導セラミックス、酸化亜鉛、チッ化アルミニウム(AlN)、炭化ケイ素(SiC)、チッ化ケイ素(Si3N4)、フォルステライト(2MgO・SiO2)、ステアタイト(MgO・SiO2)、コーディエライト(2MgO・2Al2O3・5SiO2)、サイアロン(Si3N4・Al2O3)、マシナブルセラミックス、ジルコン(ZrO2・SiO2)、チタン酸バリウム(BaTiO3)、チタン酸ジルコン酸鉛(Pb(Zr,Ti)O3)、フェライト(M2O・Fe2O3)、ムライト(3Al2O3・2SiO2)などが挙げられ、Mg,Ti,Be,Ca,Li,Al,Mn,Zn,Cr,Ga,Fe,Cd,In,Ta,Co,Ni,Sn,Sb,Bi,Pb,Cu,及びAgなど金属材料の焼結体、これらの金属材料の二元合金の酸化物の焼結体、三元合金の酸化物の焼結体、多元合金の酸化物の焼結体であってもよく、ブロック、板、シート、フィルム、角棒、丸棒、球、半球、繊維、網などの形状や、繊維強化セラミックス及び炭素繊維強化炭素などの複合材料も含む。 Ceramics of the base material to be bonded include ceramics, glass, cement, plaster, and enamel, which are hardened at high temperatures, and the composition is elemental (diamond, C) or oxide-based (alumina, Al 2 O 3 ). , zirconia type, hydroxide type (hydroxyapatite), carbide type (silicon carbide, SiC), carbonate type, nitride type (silicon nitride) (7 Halide type (fluorite), phosphate type (apatite) Also includes barium titanate, Bi 2 Sr 2 Ca 2 Cu 3 O 10 , high temperature superconducting ceramics, boron nitride, ferrite, lead zirconate titanate, silicon carbide, silicon nitride, steatite (MgOSiO 2 ). , YBa 2 Cu 3 O 7-δ , high-temperature superconducting ceramics, zinc oxide, aluminum nitride (AlN), silicon carbide (SiC), silicon nitride (Si 3 N 4 ), forsterite (2MgO・SiO 2 ), steatite (MgO・SiO 2 ), cordierite (2MgO・2Al 2 O 3・5SiO 2 ), sialon (Si 3 N 4・Al 2 O 3 ), machinable ceramics, zircon (ZrO 2・SiO 2 ), Examples include barium titanate (BaTiO 3 ), lead zirconate titanate (Pb(Zr,Ti)O 3 ), ferrite (M 2 O・Fe 2 O 3 ), mullite (3Al 2 O 3・2SiO 2 ), etc. , Mg, Ti, Be, Ca, Li, Al, Mn, Zn, Cr, Ga, Fe, Cd, In, Ta, Co, Ni, Sn, Sb, Bi, Pb, Cu, and Ag. It may be a sintered body of an oxide of a binary alloy of these metal materials, a sintered body of an oxide of a ternary alloy, a sintered body of an oxide of a multi-component alloy, and a block, plate, or sheet. It also includes shapes such as films, square bars, round bars, spheres, hemispheres, fibers, and nets, as well as composite materials such as fiber-reinforced ceramics and carbon fiber-reinforced carbon.
接着基材と被接着基材との双方が可撓性のフィルム状である例を示したが、接着基材が、可撓性のフィルム状、非可撓性の板状、又は固形で三次元構造の立体状であり、被接着基材が、可撓性のフィルム状、非可撓性の板状、又は固形で三次元構造の立体状であってもよい。 An example in which both the adhesive base material and the adhered base material are in the form of a flexible film has been shown, but the adhesive base material may be in the form of a flexible film, a non-flexible plate, or a solid tertiary material. The original structure is three-dimensional, and the substrate to be adhered may be a flexible film, a non-flexible plate, or a solid three-dimensional structure.
分子接着剤として、シラノール化合物、アルミネート化合物、チタネート化合物、トリアジン環含有化合物、チオール化合物、エポキシ化合物、及びアミン化合物などが挙げられる。 Examples of molecular adhesives include silanol compounds, aluminate compounds, titanate compounds, triazine ring-containing compounds, thiol compounds, epoxy compounds, and amine compounds.
シラノール化合物は、ビニルトリメトキシシラン、ビニルトリエトキシシラン、γ-アミノプロピルトリエトキシシラン、γ-グリシドキシプロピルトリメトキシシラン、γ-メルカプトプロピルトリメトキシシラン、γ-メタクリロキシプロピルトリメトキシシラン、N-β(アミノエチル)-γ-アミノプロピルトリメトキシシラン、γ-グリシドキシプロピルメチルジメトキシシラン、γ-クロロプロピルトリメトキシシランなどが挙げられる。 Silanol compounds include vinyltrimethoxysilane, vinyltriethoxysilane, γ-aminopropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, N -β(aminoethyl)-γ-aminopropyltrimethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, γ-chloropropyltrimethoxysilane and the like.
アルミネート化合物としては、アセトアルコキシアルミニウムジイソプロピレート、アルミニウムジイソプロボキシモノエチルアセトアセテート、アルミニウムトリスエチルアセトアセテート、アルミニウムトリスアセチルアセトネートなどが挙げられる。 Examples of the aluminate compound include acetoalkoxyaluminum diisopropylate, aluminum diisoproboxymonoethyl acetoacetate, aluminum trisethyl acetoacetate, aluminum trisacetylacetonate, and the like.
チタネート化合物としては、イソプロピルトリステアロイルチタネート、イソプロピルトリス(ジオクチルパイロホスフェート)チタネート、イソプロピルトリ(N-アミノエチル・アミノエチル)チタネート、テトラオクチルビス(ジトリデシルホスフェイト)チタネート、テトラ(2-2-ジアリルオキシメチル-1-ブチル)ビス(ジトリデシル)ホスフェイトチタネート、ビス(ジオクチルパイロホスフェート)オキシアセテートチタネート、ビス(ジオクチルパイロホスフェート)エチレンチタネートなどが挙げられる。 Titanate compounds include isopropyl tristearoyl titanate, isopropyl tris(dioctyl pyrophosphate) titanate, isopropyl tri(N-aminoethyl aminoethyl) titanate, tetraoctyl bis(ditridecyl phosphate) titanate, and tetra(2-2-diallyl). Examples include oxymethyl-1-butyl)bis(ditridecyl)phosphate titanate, bis(dioctylpyrophosphate)oxyacetate titanate, and bis(dioctylpyrophosphate)ethylene titanate.
トリアジン環含有化合物としては、トリエトキシシリルプロピルアミノ-1,3,5-トリアジン-2,4-ジチオール(TES)、アミノエチルアミノプロピルトリメトキシシランのようなアミノ基含有化合物;トリエトキシシリルプロピルアミノ基のようなトリアルコキシシリルアルキルアミノ基とメルカプト基又はアジド基とを有するトリアジン化合物、下記化学式(I)
などが挙げられる。
Examples of triazine ring-containing compounds include amino group-containing compounds such as triethoxysilylpropylamino-1,3,5-triazine-2,4-dithiol (TES) and aminoethylaminopropyltrimethoxysilane; triethoxysilylpropylamino A triazine compound having a trialkoxysilylalkylamino group and a mercapto group or an azide group, such as the following chemical formula (I)
Examples include.
チオール化合物としては、6-アルコキシシリルプロピルアミノ-1,3,5-トリアジン-2,4-ジチオールモノナトリウム、6-ビス(3-アルコキシシリルプロピル)アミノ-1,3,5-トリアジン-2,4-ジチオールモノナトリウム、6-N-シクロヘキシル-N-(3-(トリエトキシシリル)プロピルアミノ)-1,3,5-トリアジン-2,4-ジチオール・モノナトリウム、2,4-ビス(2-アミノエチルアミノ)-6-(3-トリエトキシシリルプロピルアミノ)-1,3,5-トリアジン、2,4-ジヒドラジノ-6-(3-トリエトキシシリルプロピルアミノ)-1,3,5-トリアジン、6-アルコキシシリルプロピルアミノ-1,3,5-トリアジン-2,4-ジチオール、3-メルカプトプロピルトリメトキシシラン、5-(ビシクロヘプチニル)トリエトキシシラン、(3-シクロペンタジダイエンプロピル)トリエトキシシランなどが挙げられる。 Examples of thiol compounds include 6-alkoxysilylpropylamino-1,3,5-triazine-2,4-dithiol monosodium, 6-bis(3-alkoxysilylpropyl)amino-1,3,5-triazine-2, 4-dithiol monosodium, 6-N-cyclohexyl-N-(3-(triethoxysilyl)propylamino)-1,3,5-triazine-2,4-dithiol monosodium, 2,4-bis(2 -aminoethylamino)-6-(3-triethoxysilylpropylamino)-1,3,5-triazine, 2,4-dihydrazino-6-(3-triethoxysilylpropylamino)-1,3,5- Triazine, 6-alkoxysilylpropylamino-1,3,5-triazine-2,4-dithiol, 3-mercaptopropyltrimethoxysilane, 5-(bicycloheptynyl)triethoxysilane, (3-cyclopentadiene) (propyl)triethoxysilane, etc.
エポキシ化合物としては、3-グリシドキシプロピルトリメトキシシラン、3-グリシドキシプロピルメチルジエトキシシラン、3-グリシドキシプロピルトリエトキシシラン、2-(3,4-エポキシシクロヘキシル)エチルトリメトキシシランなどが挙げられる。 Epoxy compounds include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane Examples include.
アミノ化合物としては、6-アルコキシシリルプロピルアミン、6-N-シクロヘキシル-N-(3-(トリエトキシシリル)プロピルアミン)、3-メルカプトプロピルトリメトキシシラン、3-アミノプロピルトリエトキシシラン、4-アミノブチルトリエトキシシラン、m-アミノフェニルトリエトキシシラン、11-アミノウンデシルトリメトキシシラン、N-(2-アミノエチル)-3-アミノプロピルトリメトキシシラン、3-アミノプロピルメチルジエトキシシラン、アミノプロピルシラントリオール、N-(2-アミノエチル)-3-アミノプロピルシラントリオール、(3-シクロペンタジダイエンプロピル)トリエトキシシランなどが挙げられる。 Examples of amino compounds include 6-alkoxysilylpropylamine, 6-N-cyclohexyl-N-(3-(triethoxysilyl)propylamine), 3-mercaptopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 4- Aminobutyltriethoxysilane, m-aminophenyltriethoxysilane, 11-aminoundecyltrimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropylmethyldiethoxysilane, amino Examples include propylsilane triol, N-(2-aminoethyl)-3-aminopropylsilane triol, and (3-cyclopentazidienepropyl)triethoxysilane.
接着基材の接着側表面上に施す電子線処理として、例えばスキャン方式、エリアビーム方式など、どの方式で処理しても良く、加速電圧は300~5MeVにて総吸収線量20~300kGyの条件にて行われる。 The electron beam treatment applied to the adhesion side surface of the adhesive base material may be performed using any method, such as a scanning method or an area beam method, with an accelerating voltage of 300 to 5 MeV and a total absorbed dose of 20 to 300 kGy. will be carried out.
接着基材の接着側表面上に施すγ線処理として、たとえばコバルト線源やイリジウム線源、セシウム線源などを用いても良く、線源強度1T~200PBqにて総吸収線量20~300kGyの条件にて行われる。 As the gamma ray treatment applied to the adhesive side surface of the adhesive base material, for example, a cobalt radiation source, an iridium radiation source, a cesium radiation source, etc. may be used, and the total absorbed dose is 20 to 300 kGy at a radiation source strength of 1 T to 200 PBq. It will be held at
接着基材の接着側表面上、又は被接着基材の接着側表面上に施すコロナ放電処理としては、例えば大気圧コロナ表面改質装置(信光電気計測株式会社製、製品名:コロナマスター)を用いて、例えば、電源:AC100V、出力電圧:0~20kV、発振周波数:0~40kHzで0.1~60秒、温度0~60℃の条件で行われる。このようなコロナ放電処理は、水、アルコール類、アセトン類、エステル類等で濡れている状態で、行われてもよい。 As the corona discharge treatment applied to the adhesive side surface of the adhesive base material or the adhesive side surface of the adhered base material, for example, an atmospheric pressure corona surface modification device (manufactured by Shinko Electric Measurement Co., Ltd., product name: Corona Master) can be used. For example, the test is carried out under the following conditions: power source: AC 100 V, output voltage: 0 to 20 kV, oscillation frequency: 0 to 40 kHz, 0.1 to 60 seconds, and temperature of 0 to 60°C. Such corona discharge treatment may be performed in a wet state with water, alcohols, acetones, esters, etc.
接着基材の接着側表面上、又は被接着基材の接着側表面上に施す大気圧プラズマ処理としては、例えば、大気圧プラズマ発生装置(パナソニック株式会社製、製品名:Aiplasma)を用いて、例えば、プラズマ処理速度10~100mm/s、電源:200又は220V AC(30A)、圧縮エア:0.5MPa(1NL/min)、10kHz/300W~5GHz、電力:100W~400W、照射時間:0.1~60秒の条件で行われる。 The atmospheric pressure plasma treatment applied to the adhesion side surface of the adhesion base material or the adhesion side surface of the adhered base material is performed using, for example, an atmospheric pressure plasma generator (manufactured by Panasonic Corporation, product name: Aiplasma), For example, plasma processing speed: 10 to 100 mm/s, power source: 200 or 220 V AC (30 A), compressed air: 0.5 MPa (1 NL/min), 10 kHz/300 W to 5 GHz, power: 100 W to 400 W, irradiation time: 0. It is carried out for 1 to 60 seconds.
接着基材の接着側表面上、又は被接着基材の接着側表面上に施す紫外線照射処理(UV照射によりオゾンを生成させるような一般的なUV処理やエキシマUV処理)としては、エキシマランプ光源(浜松ホトニクス株式会社製、製品名:L11751-01)を用いて、例えば、積算光量:50~1500mJ/cm2で行われる。 For ultraviolet irradiation treatment (general UV treatment or excimer UV treatment that generates ozone by UV irradiation) applied to the adhesive side surface of the adhesive base material or the adhesive side surface of the adhered substrate, an excimer lamp light source is used. (manufactured by Hamamatsu Photonics Co., Ltd., product name: L11751-01) at an integrated light amount of 50 to 1500 mJ/cm 2 , for example.
本発明に係る接着体の製造方法は、上述した固形の接着基材の表面に、分子接着剤を付し、電子線処理、及びγ線処理から選ばれる少なくとも何れかを施して、その表面に有し及び/又は生じた活性基に前記分子接着剤をグラフト共重合させる処理を1回又は複数回行うグラフト共重合工程と、上述した固形の被接着基材の表面に官能性基を有し及び/又はコロナ処理、紫外線処理、エキシマ処理、イトロ処理、及び分子接着剤処理から選ばれる少なくとも何れかで生じさせる工程と、グラフト共重合させた接着基材の表面に、被接着基材の接着すべき表面を接触させる接触工程と、接着基材と被接着基材とを、静置、荷重、加熱、及び減圧から選ばれる少なくとも何れかの条件下で、接着基材の表面にグラフト共重合された分子接着剤の分子と、被接着基材の表面に有する官能性基とによる共有結合によって、接着基材と被接着基材とを、接着させて一体化させる接着工程とを有している。
具体的には、以下のような手順で行われる。先ず、接着基材の表面に、電子線処理、及び/又はγ線処理の処理を施す手順と、その表面に有し及び/又は生じた活性基に分子接着剤をグラフト共重合させる手順とを、行う(グラフト共重合工程)。この工程は、処理を施す手順、グラフト共重合させる手順とを、複数回行ってもよい。
The method for producing an adhesive body according to the present invention includes applying a molecular adhesive to the surface of the solid adhesive base material described above, and subjecting the surface to at least one selected from electron beam treatment and gamma ray treatment. A graft copolymerization step in which the molecular adhesive is graft-copolymerized once or multiple times to the active groups having and/or generated; and and/or a step of causing at least one selected from corona treatment, ultraviolet treatment, excimer treatment, intro treatment, and molecular adhesive treatment, and adhesion of a substrate to be adhered to the surface of the graft copolymerized adhesive substrate. a contact step of bringing the surfaces to be bonded into contact; and graft copolymerization of the adhesive base material and the adhered base material on the surface of the adhesive base material under at least one of conditions selected from standing still, loading, heating, and reduced pressure. an adhesion step in which the adhesive base material and the adhered base material are adhered and integrated by covalent bonding between the molecules of the molecular adhesive and the functional group on the surface of the adhered base material. There is.
Specifically, the procedure is as follows. First, a procedure of subjecting the surface of the adhesive base material to electron beam treatment and/or γ-ray treatment, and a procedure of graft copolymerizing a molecular adhesive to the active groups present and/or generated on the surface. (graft copolymerization step). In this step, the treatment procedure and the graft copolymerization procedure may be performed multiple times.
次いで、グラフト共重合させた接着基材の表面に、被接着基材の接着すべき表面を接触させる(接触工程)。 Next, the surface of the substrate to be bonded is brought into contact with the surface of the graft copolymerized adhesive substrate (contact step).
その後、接着基材と被接着基材とを、静置、10~200kgfの荷重、10~100℃の加熱、及び/又は50torr以下、より具体的には50~10torrの減圧条件、又は10torr未満、より具体的には、10torr未満~1×10-3torr、好ましくは10torr未満~1×10-2torrの条件下で、接着基材の表面にグラフト共重合された分子接着剤の分子と、被接着基材の表面に有する官能性基とによる共有結合を形成させ、それによって、接着基材と被接着基材とを、接着させて一体化させる(接着工程)。
この接触工程の前に、グラフト共重合させた接着基材の表面、及び/又は被接着基材の表面に、コロナ処理、紫外線処理、エキシマ処理、及びイトロ処理の何れかの処理を施してもよい。
Thereafter, the adhesive base material and the adhered base material are left standing, subjected to a load of 10 to 200 kgf, heated to 10 to 100°C, and/or under reduced pressure conditions of 50 torr or less, more specifically, 50 to 10 torr, or less than 10 torr. , more specifically, under conditions of less than 10 torr to 1×10 −3 torr, preferably less than 10 torr to 1×10 −2 torr, with the molecules of the molecular adhesive graft copolymerized on the surface of the adhesive substrate. , a covalent bond is formed with a functional group on the surface of the adhesive base material, whereby the adhesive base material and the adhesive base material are bonded and integrated (adhesion step).
Before this contact step, the surface of the graft copolymerized adhesive base material and/or the surface of the adhered base material may be subjected to any one of corona treatment, ultraviolet treatment, excimer treatment, and intro treatment. good.
以下、本発明を適用する接着体のサンプルを作製した実施例1~2と、本発明を適用外の接着体のサンプルを作製した比較例1~2について、比較評価を行った。 Hereinafter, a comparative evaluation was made of Examples 1 and 2 in which samples of adhesive bodies to which the present invention is applied were prepared, and Comparative Examples 1 and 2 in which samples of adhesive bodies to which the present invention was not applied were prepared.
本発明を適用する実施例の接着体の接着サンプルと、本発明を適用外の比較例の接着体の接着サンプルとを、以下のようにして作製し、その物性について評価した。 An adhesive sample of an adhesive body of an example to which the present invention is applied and an adhesive sample of an adhesive body of a comparative example to which the present invention is not applied were prepared as follows, and their physical properties were evaluated.
(接着材料の作製)
接着材料としてミラブルタイプの加硫剤内部添加フッ素ゴム(FKM):SFM-70A(スリーエムジャパン株式会社製)とミラブルタイプのエチレン-プロピレン-ジエン共重合体(EPDM):EPT4045M(三井化学株式会社製)を用いた。
加硫剤内部添加FKMをオープンロールにて熱入れし、これを金型に入れ、170℃で10分間加圧プレスし、接着材料として1mm×150mm×150mmのシート状のFKM成形体を作製した。
EPDM100部に、有機過酸化物架橋剤:パークミルD-40(日油株式会社製、パークミルは登録商標)を11部配合し、オープンロールにて混合し、これを金型に入れ、170℃で10分間加圧プレスし、接着材料として1mm×150mm×150mmのシート状のEPDM成形体を作製した。
(Preparation of adhesive material)
As adhesive materials, we used a millable-type fluororubber (FKM) with internal vulcanizing agent added: SFM-70A (manufactured by 3M Japan Co., Ltd.) and a millable-type ethylene-propylene-diene copolymer (EPDM): EPT4045M (manufactured by Mitsui Chemicals Co., Ltd.). ) was used.
The vulcanizing agent internally added FKM was heated with an open roll, placed in a mold, and pressed at 170°C for 10 minutes to produce a sheet-like FKM molded body of 1 mm x 150 mm x 150 mm as an adhesive material. .
11 parts of an organic peroxide crosslinking agent: Percmil D-40 (manufactured by NOF Corporation, Perkmil is a registered trademark) was mixed with 100 parts of EPDM, mixed using an open roll, placed in a mold, and heated at 170°C. Pressing was carried out for 10 minutes to produce a sheet-like EPDM molded body of 1 mm x 150 mm x 150 mm as an adhesive material.
(接着材料の処理)
大気圧コロナ放電処理機(信光電気計装株式会社製)で、ギャップ長:1.0mm、出力電圧:10kV(表面電圧)、移動速度:4.2m/秒、移動回数:3回の条件で、コロナ放電処理を行った。その後、分子接着剤処理として複数ビニル基含有アルコキシシロキサンとビニル基含有アルコキシシロキサンを各0.1wt%希釈したエタノール溶液を塗布し、加熱オーブンにて温度:80℃、時間:10分間加熱した。電子線照射機2MeV、総照射線量20から200kGyで電子線を照射し、グラフトさせた。
その後大気圧コロナ放電処理機(信光電気計装株式会社製)で、ギャップ長:1.0mm、出力電圧:10kV(表面電圧)、移動速度:4.2m/秒、移動回数:3回の条件で、コロナ放電処理を行った。その後、分子接着剤処理として複数ビニル基含有アルコキシシロキサンとビニル基含有アルコキシシロキサンを各0.1wt%希釈したエタノール溶液を塗布し、加熱オーブンにて温度:80℃、時間:10分間加熱した。その後、処理表面に同様の条件で大気圧コロナ放電処理を行い、接着材料とした。
(Processing of adhesive material)
Atmospheric pressure corona discharge treatment machine (manufactured by Shinko Denki Keiso Co., Ltd.) under the following conditions: gap length: 1.0 mm, output voltage: 10 kV (surface voltage), moving speed: 4.2 m/ s , number of moves: 3 times. , corona discharge treatment was performed. Thereafter, as a molecular adhesive treatment, an ethanol solution in which a plurality of vinyl group-containing alkoxysiloxane and a vinyl group-containing alkoxysiloxane were each diluted by 0.1 wt % was applied, and heated in a heating oven at a temperature of 80 ° C. for a time of 10 minutes. Grafting was performed by irradiating electron beams with an electron beam irradiator of 2 MeV and a total irradiation dose of 20 to 200 kGy.
Then, using an atmospheric pressure corona discharge treatment machine (manufactured by Shinko Denki Keiso Co., Ltd.), the conditions were: gap length: 1.0 mm, output voltage: 10 kV (surface voltage), moving speed: 4.2 m/ s , number of moves: 3 times. Then, corona discharge treatment was performed. Thereafter, as a molecular adhesive treatment, an ethanol solution in which a plurality of vinyl group-containing alkoxysiloxane and a vinyl group-containing alkoxysiloxane were each diluted by 0.1 wt % was applied, and heated in a heating oven at a temperature of 80° C. for a time of 10 minutes. Thereafter, the treated surface was subjected to atmospheric pressure corona discharge treatment under the same conditions to obtain an adhesive material.
(被接着基材の処理)
被接着材料としてSUS430:793423(株式会社ニラコ製)を用いた。
30×60mmに切断したSUSを、アルカリ洗浄、アルコール洗浄を行った。その後大気圧コロナ放電処理機(信光電気計装株式会社製)で、ギャップ長:1.0mm、出力電圧:10kV(表面電圧)、移動速度:4.2m/秒、移動回数:3回の条件で、コロナ放電処理を行った。その後、分子接着剤処理として複数ビニル基含有アルコキシシロキサンとビニル基含有アルコキシシロキサンを各0.1wt%希釈したエタノール溶液を塗布し、加熱オーブンにて温度:80℃、時間:10分間加熱した。その後、処理表面に同様の条件で大気圧コロナ放電処理機処理を行い、被接着材料とした。
(Treatment of adhered base material)
SUS430:793423 (manufactured by Nilaco Co., Ltd.) was used as the material to be adhered.
SUS cut into 30×60 mm was washed with alkaline and alcohol. Then, using an atmospheric pressure corona discharge treatment machine (manufactured by Shinko Denki Keiso Co., Ltd.), the conditions were: gap length: 1.0 mm, output voltage: 10 kV (surface voltage), moving speed: 4.2 m/ s , number of moves: 3 times. Then, corona discharge treatment was performed. Thereafter, as a molecular adhesive treatment, an ethanol solution in which a plurality of vinyl group-containing alkoxysiloxane and a vinyl group-containing alkoxysiloxane were each diluted by 0.1 wt % was applied, and heated in a heating oven at a temperature of 80° C. for a time of 10 minutes. Thereafter, the treated surface was treated with an atmospheric pressure corona discharge treatment machine under the same conditions to obtain a material to be adhered.
(実施例1~2)
上記の処理を行った接着材料と被接着材料の処理表面同士を空気が入らないように貼り合わせた後、加圧加熱プレスにて温度:80℃、時間:15分間、圧力:8.3kgf/cm2にて接着体を作製した。
(Examples 1-2)
After bonding the treated surfaces of the adhesive material and the bonded material that have undergone the above treatment so that no air enters, they are heated using a pressure and heat press at a temperature of 80°C, a time of 15 minutes, a pressure of 8.3 kgf/ A bonded body was produced in cm 2 .
(比較例1)
接着材料の成形体の各々と表面処理を行っていない被接着材料の表面同士を空気が入らないように貼り合わせた後、加圧加熱プレスにて温度:80℃、時間:15分間、圧力:8.3kgf/cm2にて接着体を作製した。
(Comparative example 1)
After bonding each of the molded bodies of the adhesive material and the surface of the adhered material that has not undergone surface treatment so as to prevent air from entering, they were heated using a pressurized heat press at a temperature of 80°C, a time of 15 minutes, and a pressure: An adhesive body was produced at 8.3 kgf/cm 2 .
(比較例2)
接着材料の成形体の各々を大気圧コロナ放電処理機(信光電気計装株式会社製)で、ギャップ長:1.0mm、出力電圧:10kV(表面電圧)、移動速度:4.2m/秒、移動回数:3回の条件で、コロナ放電処理を行った。その後、分子接着剤処理として複数ビニル基含有アルコキシシロキサンとビニル基含有アルコキシシロキサンを各0.1wt%希釈したエタノール溶液を塗布し、加熱オーブンにて温度:80℃、時間:10分間加熱した。その後、処理表面に同様の条件で大気圧コロナ放電処理を行った。その後、表面処理を行った接着材料と被接着材料の処理表面同士を空気が入らないように貼り合わせた後、加圧加熱プレスにて温度:80℃、時間:15分間、圧力:8.3kgf/cm2にて接着体を作製した。
(Comparative example 2)
Each of the adhesive material molded bodies was treated with an atmospheric pressure corona discharge treatment machine (manufactured by Shinko Denki Keiso Co., Ltd.) with a gap length of 1.0 mm, an output voltage of 10 kV (surface voltage), and a moving speed of 4.2 m/ sec . Corona discharge treatment was performed under the conditions of number of movements: 3 times. Thereafter, as a molecular adhesive treatment, an ethanol solution in which a plurality of vinyl group-containing alkoxysiloxane and a vinyl group-containing alkoxysiloxane were each diluted by 0.1 wt % was applied, and heated in a heating oven at a temperature of 80° C. for a time of 10 minutes. Thereafter, the treated surface was subjected to atmospheric pressure corona discharge treatment under the same conditions. After that, the surface-treated adhesive material and the treated surfaces of the bonded material are pasted together to prevent air from entering, and then heated using a pressure press at a temperature of 80°C for 15 minutes and a pressure of 8.3 kgf. / cm2 .
作製した接着体をフォースゲージ:ZP-200N(株式会社イマダ社製)にて速度:50mm/秒にて90度剥試験を行い、それぞれ引剥強度を測定し、引剥面での状態を観察した。引剥試験は初期サンプルと沸騰した水に1時間浸漬したサンプルにて実施した。その結果を表1に示す。 The produced adhesive was subjected to a 90 degree peel test using a force gauge: ZP-200N (manufactured by Imada Co., Ltd.) at a speed of 50 mm/sec to measure the peel strength and observe the condition on the peeled surface. did. Peel tests were conducted on initial samples and samples immersed in boiling water for 1 hour. The results are shown in Table 1.
表1から明らかな通り、比較例1~2では接着しなかった。それに対し、実施例1、2の何れも接着材料であるFKM、EPDMが破壊されたため、強固に接着していることが分かった。さらに、煮沸、アルコール浸漬でもはく離はしていないことから、接着材料と被接着材料が強固に接着していることが分かった。 As is clear from Table 1, no adhesion occurred in Comparative Examples 1 and 2. On the other hand, in both Examples 1 and 2, the adhesive materials FKM and EPDM were destroyed, so it was found that the adhesive was firmly bonded. Furthermore, it was found that the adhesive material and the adhered material were firmly adhered because the adhesive material did not peel off even when boiled or immersed in alcohol.
本発明の接着体は、高い接着強度を有するため、剥離してはならない工業製品や日用品、例えばホース、パッキン、オイルシールや金属との接着物、ダイヤフラム、ガスケット、大型ゴムロール、複写機用ゴムロール、コンベアベルト、補強ベルト、医療用ゴム製品、電気・電子部品用製品、建築用製品、コンピューター製品、自動車製品、バス・トラック製品、飛行機製品など、多くの分野の製品として有用である。 Since the adhesive body of the present invention has high adhesive strength, it can be applied to industrial products and daily necessities that must not be peeled off, such as hoses, packing, oil seals, adhesives with metals, diaphragms, gaskets, large rubber rolls, rubber rolls for copying machines, etc. It is useful as a product in many fields, such as conveyor belts, reinforcing belts, medical rubber products, electrical and electronic parts products, construction products, computer products, automobile products, bus and truck products, and airplane products.
Claims (6)
高分子樹脂、天然ゴム、合成ゴム、架橋ゴム、金属、ガラス、及びセラミックスから選ばれる何れかで形成された固形の被接着基材のコロナ処理表面、紫外線処理表面、エキシマ処理表面、及びイトロ処理表面から選ばれる少なくとも何れかに有する官能性基としてのヒドロキシ基、或いは前記被接着基材の分子接着剤処理表面の官能性基と
による共有結合によって、前記接着基材と前記被接着基材とが、接着して一体化していることを特徴とする接着体。 Made of one selected from fluororesin, fluororubber, silicone resin, silicone rubber, ethylene-propylene-diene rubber, ethylene-propylene-diene-methylene rubber, isobutylene-isoprene copolymer rubber, isoprene rubber, and natural rubber , and Electron beam irradiation treatment surface or γ of a solid adhesive base material to which any molecular adhesive selected from silanol compounds, aluminate compounds, titanate compounds, triazine ring-containing compounds, thiol compounds, epoxy compounds, and amine compounds is attached. Molecules of the molecular adhesive graft copolymerized via free radicals on the radiation-treated surface;
Corona-treated surface, ultraviolet-treated surface, excimer-treated surface, and intro-treated surface of a solid adherend substrate made of one selected from polymer resin, natural rubber, synthetic rubber, crosslinked rubber, metal, glass, and ceramics. The adhesive base material and the adherend base material are bonded together by a covalent bond formed by a hydroxy group as a functional group on at least one selected from the surfaces or a functional group on the molecular adhesive-treated surface of the adherend base material. An adhesive body characterized in that these are bonded and integrated.
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