JP7358196B2 - Wiring simulation device, wiring simulation system, wiring simulation method - Google Patents

Description

The present technology relates to a wiring simulation device, a wiring simulation system, and a wiring simulation method.

A wiring board is generally constructed by laminating a mesh-like fibrous body, a synthetic resin, and a signal wiring. With such a configuration, the wiring board can withstand, for example, physical impact and heat.

However, the dielectric constant of the fibrous body is generally higher than that of the synthetic resin. Therefore, in a wiring board, a signal propagation delay tends to be small in an area where there are few fibers, and a signal propagation delay tends to be large in an area where there are many fibers.

In order to solve this problem, for example, in Patent Document 1, ``a computer creates a first wiring board internal structure model for the basic wiring length including one sheet of first glass cloth above a pair of first differential wirings. Three-dimensional electromagnetic field analysis is performed on each of a plurality of first position patterns in which the relative positions of the first differential wiring and the first glass cloth are changed, and the In addition to calculating the first skew that occurs between the pair of first differential wirings, a second wiring board internal structure model for the basic wiring length including one sheet of second glass cloth below the pair of second differential wirings A three-dimensional electromagnetic field analysis is performed on each of a plurality of second position patterns in which the relative positions of the second differential wiring and the second glass cloth are changed, and in each of the plurality of second position patterns, a plurality of first combination patterns in which a second skew occurring between the pair of second differential wirings is calculated and the plurality of first position patterns of the first wiring board internal structure model are combined for a certain wiring length; a plurality of second combination patterns in which the plurality of second position patterns of the second wiring board internal structure model are combined for a certain wiring length; and a plurality of first combinations for each of the plurality of wiring board patterns in which The first skew of each of the plurality of first position patterns constituting each of the patterns is added together, and the second skew of each of the plurality of second position patterns constituting each of the plurality of second combination patterns is added. "A simulation method characterized by performing each process of adding up skews to calculate a total skew, and obtaining a skew distribution in a wiring board having a certain wiring length based on the calculated total skew." Disclosed. This patent document 1 describes a simulation method that can obtain a skew (propagation delay time difference between wirings) distribution.

Japanese Patent Application Publication No. 2014-229071

However, in the technique described in Patent Document 1, the range in which electromagnetic field analysis is performed is extremely narrow. Therefore, when the analysis results are added together to obtain an electromagnetic field analysis result for the entire wiring board, errors may also be added.

Therefore, the main purpose of the present technology is to provide a wiring simulation device, a wiring simulation system, and a wiring simulation method that can obtain highly accurate relative permittivity distribution information on a wiring board.

The present technology includes a design information input unit that prompts input of design information of a wiring board configured by laminating a mesh-like fibrous body, a synthetic resin, and a signal wiring; A wiring simulation device is provided, which includes at least a distribution information deriving unit that derives distribution information of relative permittivity in a wiring board.
The design information includes information regarding the fibrous body, a relative dielectric constant of the entire wiring board, a resin content ratio indicating a ratio of the content of the synthetic resin in the wiring board, and a length of the wiring board in the depth direction. may be included.
The information regarding the fibrous body may include fiber identification information for identifying the fibrous body, or information regarding the weaving density of the warp and weft of the fibrous body.
The wiring simulation device further includes a signal characteristic deriving section, and the signal characteristic deriving section can derive signal characteristic information based on the relative dielectric constant distribution information and wiring layout information.
The wiring simulation device further includes an equal-length wiring derivation unit, and the equal-length wiring derivation unit calculates signal wirings having equal lengths based on the distribution information of the relative dielectric constant and the signal wiring information. Wiring layout information including information can be derived.
The signal wiring information may include at least one of type information of the signal wiring and usage information of the signal wiring.
The signal wiring may be a single-ended wiring or a differential wiring.
The fibrous body may be made of glass fiber.
Furthermore, this technology is realized via an information communication network, and design information that prompts the input of design information for a wiring board that is composed of a laminated network of fibers, synthetic resin, and signal wiring. A wiring simulation system is provided, which includes at least an input section and a distribution information derivation section that derives distribution information of relative permittivity in the wiring board based on the design information.
Furthermore, the present technology prompts the input of design information of a wiring board configured by laminating a mesh fibrous body, a synthetic resin, and a signal wiring, and based on the design information, the wiring board Provided is a wiring simulation method that includes at least deriving distribution information of a relative dielectric constant in a wiring simulation method.

FIG. 1 is a configuration diagram showing an embodiment of a wiring simulation device according to the present technology. 3 is a display screen showing an embodiment of a design information input unit according to the present technology. FIG. 2 is a diagram illustrating an embodiment of a database held by a design information input unit according to the present technology. 3 is a display screen showing an embodiment of a design information input unit according to the present technology. 3 is a display screen showing an embodiment of a design information input unit according to the present technology. FIG. 2 is a schematic plan view showing an example of a fibrous body constituting a wiring board. FIG. 2 is a diagram illustrating an example of characteristics of signals communicating through signal wiring. FIG. 3 is a diagram illustrating an example of signal characteristic information according to the present technology. FIG. 3 is a diagram illustrating an example of signal characteristic information according to the present technology. FIG. 2 is a perspective view of a three-dimensional model of relative permittivity distribution information according to the present technology. FIG. 3 is a plan view of a three-dimensional model of relative dielectric constant distribution information according to the present technology. FIG. 1 is a configuration diagram showing an embodiment of a wiring simulation device according to the present technology. FIG. 2 is a schematic plan view showing an embodiment of wiring layout information according to the present technology. FIG. 3 is a diagram illustrating an example of signal characteristic information according to the present technology. FIG. 3 is a schematic plan view showing the arrangement relationship of differential wiring. FIG. 3 is a schematic plan view showing the arrangement relationship of differential wiring. FIG. 1 is a configuration diagram showing an embodiment of a wiring simulation device according to the present technology. FIG. 3 is a diagram illustrating an embodiment of signal wiring information according to the present technology. 3 is a display screen showing an embodiment of a design information input unit according to the present technology. FIG. 1 is a hardware configuration diagram showing an embodiment of a wiring simulation device according to the present technology. 1 is a conceptual diagram showing an embodiment of a wiring simulation system according to the present technology. 3 is a flowchart of an example of a wiring simulation method according to the present technology.

Hereinafter, a preferred form for implementing the present technology will be described. The embodiment described below shows an example of a typical embodiment of the present technology, and the scope of the present technology is not interpreted narrowly thereby. In addition, unless otherwise specified, in the drawings, "top" means the upper direction or upper side of the drawing, "bottom" means the lower direction or lower side of the drawing, and "left" means the upper direction or the upper side of the drawing. "Right" means the left direction or the left side in the figure, and "right" means the right direction or right side in the figure. Furthermore, in the drawings, the same or equivalent elements or members are denoted by the same reference numerals, and redundant explanations will be omitted.

The present technology will be explained in the following order.
1. Configuration of wiring board 2. First embodiment according to the present technology (Example 1 of wiring simulation device)
3. Second embodiment according to the present technology (Example 2 of wiring simulation device)
4. Third embodiment according to the present technology (Example 3 of wiring simulation device)
5. Hardware configuration 6. Fourth embodiment according to the present technology (wiring simulation system)
7. Fifth embodiment according to the present technology (wiring simulation method)

[1. Configuration of wiring board]
For example, the structure of a wiring board such as a printed circuit board will be explained with reference to FIG. FIG. 6 is a schematic plan view showing an example of a fibrous body constituting a wiring board. As shown in FIG. 6, the fibrous body F is woven in a mesh pattern (lattice pattern) with warp threads F1 arranged in the vertical direction and weft threads F2 arranged in the horizontal direction. The structure of the fibrous body F is not limited to this plain weave, and may be, for example, a twill weave, a satin weave, a leno weave, a patterned gauze weave, a diagonal weave, a double weave, or the like.

The fibrous body F has a region H where the warp F1 and the weft F2 exist, a region M where either one of the warp F1 and the weft F2 exists, and a region L where neither the warp F1 nor the weft F2 exists. are doing.

Although not shown, the fibrous body F is constructed by laminating synthetic resin. In other words, synthetic resin exists in region L.

Signal wirings W1 and W2 are laminated on this fibrous body F. Note that the signal wirings W1 and W2 may be, for example, single-ended wiring or differential wiring.

Generally, the dielectric constant of a fibrous body made of, for example, glass fiber is higher than that of a synthetic resin. Therefore, the dielectric constant of region H is higher than that of region M. Further, the dielectric constant of the region M is higher than that of the region L.

Generally, the higher the dielectric constant, the greater the propagation delay of signals communicating through signal wiring. As shown in FIG. 6, the relative dielectric constant of the region where the signal wiring W1 exists is higher than the relative dielectric constant of the region where the signal wiring W2 exists. Therefore, the propagation delay of the signal communicating through the signal wiring W1 is greater than the propagation delay of the signal communicating through the signal wiring W2. As a result, a propagation delay time difference occurs between the signal communicating through the signal wiring W1 and the signal communicating through the signal wiring W2.

The problem caused by the propagation delay time difference will be explained with reference to FIG. 7. FIG. 7 is a diagram illustrating an example of characteristics of signals communicating through signal wiring. Let C1 be the characteristic of a signal communicating through the signal wiring W1, and C2 be the characteristic of a signal communicating through the signal wiring W2. As shown in FIG. 7, the higher the frequency on the horizontal axis, the larger the propagation delay time difference (phase difference) between the signal C1 and the signal C2. For example, when the frequency is 36 GHz, the phase difference between the signal C1 and the signal C2 is about 180 degrees.

Here, it is assumed that the signal wiring W1 and the signal wiring W2 are a pair of differential wirings. The propagation mode of differential wiring is classified into differential mode and common mode. The differential mode is a mode in which the signals communicating through a pair of differential wirings are in opposite directions. The common mode is a mode in which each signal communicating through a pair of differential wirings is in the same direction.

The problem caused by the increase in the propagation delay time difference between differential wiring lines will be explained with reference to FIGS. 8 and 9. FIG. 8 is a diagram illustrating an example of signal characteristic information in differential mode. In FIG. 8, the horizontal axis indicates frequency. The vertical axis indicates the magnitude of the signal. To explain more specifically, the vertical axis represents, for example, in a pair of differential wirings made up of two signal wirings, the magnitude of the differential signal input from the input/output section of one signal wiring is taken as 1. . At this time, it shows how much the differential signal was transmitted to the input/output section of the other signal wiring. The closer this magnitude is to 0 dB, the smaller the signal loss is.

As shown in FIG. 8, the loss of the signal whose frequency is around 0 Hz is small. However, as the frequency increases, the signal loss increases; for example, when the frequency reaches 36 GHz, the signal magnitude is around -120 dB. In other words, when the frequency becomes 36 GHz, the input signal becomes 1/1,000,000 in size and is output. This is because the phase difference between one signal and the other signal is approximately 180 degrees, and the signals cancel each other out.

FIG. 9 is a diagram showing an example of signal characteristic information in common mode. In FIG. 9, the horizontal axis indicates frequency. The vertical axis indicates the magnitude of the signal. To explain more specifically, the vertical axis represents, for example, in a pair of differential wirings made up of two signal wirings, the magnitude of the differential signal input from the input/output section of one signal wiring is taken as 1. . At this time, it shows how much common signal the differential signal has transmitted to the input/output section of the other signal wiring. The closer this magnitude is to 0 dB, the more the differential signal is converted into the common signal.

As shown in FIG. 9, the loss of the signal whose frequency is around 0 Hz is small. However, as the frequency increases, the signal loss increases, and for example, at a frequency of 36 GHz, the total loss is close to 0 dB. That is, when the frequency reaches 36 GHz, most of the differential signals input from the input/output section of one signal wiring are converted into common signals and transmitted to the input/output section of the other signal wiring.

Conventionally, because the signal frequency was low, the influence of propagation delay time differences on signal wiring design was small.

However, with the increase in frequencies in recent years, the influence of the propagation delay time difference on the design of signal wiring is increasing. Therefore, there is a great need to acquire distribution information of propagation delay time differences in wiring boards.

For example, Patent Document 1 describes a simulation method for acquiring distribution information of propagation delay time differences. However, this simulation method has an extremely narrow range of electromagnetic field analysis. Therefore, when the analysis results are added together to obtain an electromagnetic field analysis result for the entire wiring board, errors may also be added. Furthermore, in order to obtain the electromagnetic field analysis results for the entire wiring board, there is a possibility that a lot of analysis time is required. Furthermore, there is also the problem that it is difficult to take into account the effects of crosstalk outside the analysis range.

The wiring simulation device according to the present invention can solve this problem.

[2. First embodiment according to the present technology (Example 1 of wiring simulation device)]
The configuration of a wiring simulation device according to a first embodiment of the present technology will be described with reference to FIG. 1. FIG. 1 is a configuration diagram showing an embodiment of a wiring simulation device according to the present technology. As shown in FIG. 1, the wiring simulation device 9 includes at least a design information input section 1 and a distribution information derivation section 2.

[Design information input section]
The design information input unit 1 prompts the user to input design information of the wiring board. This design information includes information about the fibrous body, the dielectric constant of the entire wiring board, the resin content ratio indicating the ratio of the synthetic resin content in the wiring board, and the length in the depth direction (thickness) of the wiring board. ) and may be included at least.

The information regarding the fibrous body may include, for example, information regarding the weaving density of the warp and weft of the fibrous body. Weaving density is the number of warp F1 or weft F2 per inch (in).

The design information that the design information input unit 1 prompts the user to input will be described with reference to FIG. 2. FIG. 2 is a display screen showing one embodiment of the design information input section. As shown in FIG. 2, the design information input unit 1 inputs, as design information, the weave density of the warp of the fibrous body, the weave density of the weft of the fibrous body, the dielectric constant of the entire wiring board, and the resin content ratio, Prompt the user to input the thickness of the wiring board.

Note that the relative permittivity of the entire wiring board is the relative permittivity of a mixture of the fibrous body and the synthetic resin.

The information regarding the fibrous body may include fiber identification information for identifying the fibrous body in addition to information regarding the weaving density. This fiber identification information will be explained with reference to FIG. 3. FIG. 3 is a diagram showing an embodiment of a database held by the design information input section. This database may hold information regarding fibrous bodies standardized by the IPC (American Institute of Electronics Circuits), for example. As shown in Figure 3, fiber identification information, wiring board shape information (IPC style), weaving density, relative dielectric constant of the entire wiring board, resin content ratio, and wiring board thickness are associated with each other. It is being From this, it can be seen that, for example, the weaving density of the warp yarns of the fiber body whose fiber identification information is "A01" is 60 yarns/in.

The design information input unit 1 may prompt the user to input this fiber identification information. This will be explained with reference to FIG. 4. FIG. 4 is a display screen showing one embodiment of the design information input section. As shown in FIG. 4, the design information input unit 1 prompts the user to input fiber identification information as design information. The user can specify any fiber identification information from the fiber identification information list.

The design information input unit 1 can search the database shown in FIG. 3 using the specified fiber identification information as a search key.

[Distribution information derivation unit]
The distribution information deriving unit 2 derives distribution information of relative permittivity in the wiring board based on the design information. This relative permittivity distribution information is obtained, for example, by the following formula.
{abs(f(x))+abs(f(y))}×(εr−εrR)+εrR

The function f(x) can be expressed by the length H2 of one pitch of the weft (see FIG. 6). The function f(y) can be expressed by the length V2 of one pitch of the warp (see FIG. 6). Pitch is a unit that includes a region where fibers are present and a region where fibers are not present in the vertical or horizontal direction. εr is the dielectric constant of the entire wiring board. εrR is the relative dielectric constant of the synthetic resin.

In addition, in FIG. 6, V1 is the length (thickness) of the warp in the width direction. H1 is the length (thickness) of the weft in the width direction.

Note that the function f(x) and the function f(y) can be expressed by, for example, a sine wave (trigonometric function), a triangular wave, a rectangular wave, a sawtooth wave, or the like. For example, the design information input unit 1 may prompt the user to input information regarding the waveform used by the distribution information derivation unit 2.

This will be explained with reference to FIG. 5. FIG. 5 is a display screen showing one embodiment of the design information input section. As shown in FIG. 5, the design information input section 1 prompts the user to specify the waveform used by the distribution information derivation section 2. The user can specify any waveform from the list of waveforms.

The distribution information deriving unit 2 can derive distribution information of the relative permittivity based on the designated waveform.

Hereinafter, the derivation of the relative dielectric constant distribution information will be specifically explained. This will be explained using the design information associated with the fiber identification information "A02" in FIG. 3. As shown in FIG. 3, the weaving density of the warp yarns of this fibrous body is 60 yarns/in, and the weaving density of the weft yarns is 48 yarns/in.

First, calculation of the length of one pitch of the fibrous body will be explained. The length of one pitch is calculated based on the weave density. Since 1 inch is 25.4 mm, the length of 1 pitch is determined by the following formula.
Length of 1 pitch [mm] = 25.4 [mm] ÷ Weaving density [pieces/in]

The length V2 of one pitch of the warp is determined by the following formula.
V2=25.4÷60≒4.23

The length H2 of one pitch of the weft is determined by the following formula.
H2=25.4÷48≒5.29

Next, calculation of the dielectric constant εrR of the synthetic resin will be explained. The relative permittivity εrR of the synthetic resin is calculated based on the relative permittivity εr of the entire wiring board, the resin content ratio, the thickness of the wiring board, and the relative permittivity εrR of the fibrous body.

Here, the relative permittivity εr of the entire wiring board is determined by the following formula. Note that the fiber content ratio indicates the content ratio of fiber bodies in the wiring board.
Relative permittivity εr of the entire wiring board = Relative permittivity εrR of synthetic resin x Resin content ratio + Relative permittivity εrG of fibrous body x Fiber content ratio

The relative permittivity εrR of the synthetic resin and the relative permittivity εrG of the fibrous body are determined by combining a plurality of examples. For example, in Example 1, it is assumed that the relative dielectric constant εr of the entire wiring board is 4.0, the resin content ratio is 67%, and the fiber content ratio is 33%. Further, in Example 2, it is assumed that the relative dielectric constant εr of the entire wiring board is 4.4, the resin content ratio is 51%, and the fiber content ratio is 49%. By applying the respective values of the plurality of examples to the above equation, two simultaneous equations are obtained. By solving these simultaneous equations, it is determined that the relative permittivity εrR of the synthetic resin is 3.175, and the relative permittivity εrG of the fibrous body is 5.675.

Therefore, the relative dielectric constant distribution information can be obtained, for example, by the following formula.
{abs(f(x))+abs(f(y))}×(4-3.175)+3.175
= {abs(f(x))+abs(f(y))}×0.825+3.175

The function (f(x)) can be expressed by, for example, a sine wave using the length of one warp pitch of 423×10 ⁻⁶ meters. The function (f(y)) can be expressed by, for example, a sine wave using the length of one weft pitch of 529×10 ⁻⁶ meters.

FIGS. 10 and 11 are models in which the distribution information of the relative dielectric constant is expressed in three dimensions when the above equation is expressed as a sine wave. FIG. 10 is a perspective view of a three-dimensional model of relative dielectric constant distribution information. FIG. 11 is a plan view showing a three-dimensional model of relative permittivity distribution information. As shown in FIGS. 10 and 11, in the wiring board, regions with a high relative permittivity and regions with a low relative permittivity are clearly expressed. Note that the length in the Z-axis direction can be expressed based on the thickness of the wiring board acquired by the design information input unit 1. Alternatively, the length in the Z-axis direction may be obtained from the database shown in FIG. 3.

Conventionally, relative permittivity distribution information has been obtained by measuring an actual wiring board. Therefore, wiring design was performed after the actual wiring board was manufactured. This has caused a problem in that, for example, the wiring design must be reviewed or the wiring board must be remanufactured.

By using the wiring simulation device 9 according to the present technology, accurate relative permittivity distribution information can be obtained and wiring can be designed before manufacturing a wiring board. Moreover, distribution information of relative permittivity can be acquired using information regarding a wide variety of fibrous bodies as shown in FIG. This enables high-quality wiring design.

Furthermore, there is no need to remanufacture the wiring board as in the past. Therefore, manufacturing costs can be reduced and development turnaround time can be shortened.

[3. Second embodiment according to the present technology (Example 2 of wiring simulation device)]
The configuration of a wiring simulation device 9 according to a second embodiment of the present technology will be described with reference to FIG. 12. FIG. 12 is a configuration diagram showing an embodiment of a wiring simulation device according to the present technology. As shown in FIG. 12, the wiring simulation device 9 includes a design information input section 1, a distribution information derivation section 2, and a signal characteristic derivation section 3.

[Signal characteristic derivation section]
The signal characteristic derivation unit 3 derives signal characteristic information based on the relative dielectric constant distribution information and the wiring layout information.

The relative dielectric constant distribution information is information derived by the distribution information deriving unit 2.

The signal characteristic deriving unit 3 can hold wiring layout information. The wiring layout information will be explained with reference to FIG. 13. FIG. 13 is a schematic plan view showing one embodiment of wiring layout information. As shown in FIG. 13, the wiring layout information is layout information of signal wiring on the wiring board. In FIG. 13, layout information of a signal wiring W1, a signal wiring W2, and a signal wiring W3 is shown as an example. Based on this wiring layout information, signal wiring is laminated and configured on the wiring board. This wiring layout information can be recorded as coordinate data, image data, etc., for example.

The signal characteristic information derived by the signal characteristic deriving unit 3 may include, for example, an input/output signal ratio corresponding to a frequency. Specifically, the signal characteristic information may include information regarding the characteristics of the signal shown in FIG. 8 or 9. The signal characteristic deriving unit 3 gradually changes the frequency of the signal communicating through the signal wiring included in the wiring layout information. The signal characteristic deriving unit 3 can then specify the frequency at which the output signal becomes small.

Further, the signal characteristic information may include information regarding a difference in dielectric constant in a region where a pair of differential wirings are arranged. This will be explained with reference to FIG. 14. FIG. 14 is a diagram illustrating an example of signal characteristic information according to the present technology. In FIG. 14, the vertical axis indicates the difference in dielectric constant between regions where differential wiring is arranged. The horizontal axis shows the arrangement relationship of each differential wiring.

The arrangement relationship of the differential wiring will be further explained with reference to FIG. 15. FIG. 15 is a schematic plan view showing the arrangement of differential wiring. In FIG. 15, the signal wiring P1 and the signal wiring N1 are a pair of differential wirings. Similarly, the signal wiring P2 and the signal wiring N2 are a pair of differential wirings.

The area where the signal wiring P1 is arranged is the same as the area where the signal wiring N1 is arranged. Therefore, the relative dielectric constant of the region where the signal wiring P1 is arranged and the relative dielectric constant of the region where the signal wiring N1 is arranged are almost the same.

Referring again to FIG. 14, when the arrangement relationship of the differential wiring is "pitch shift 2" or "pitch shift 4", the difference in relative permittivity is small. Therefore, the signal wiring P1 and the signal wiring N1 may have an arrangement relationship of "pitch shift 2" or "pitch shift 4".

On the other hand, as shown in FIG. 15, the region where the signal wiring P2 is arranged is different from the region where the signal wiring N2 is arranged. Therefore, the relative dielectric constant of the region where the signal wiring P2 is arranged is different from the relative dielectric constant of the region where the signal wiring N2 is arranged.

Referring to FIG. 14, when the arrangement relationship of the differential wiring is "pitch shift 6", "pitch shift 7", or "pitch shift 8", the difference in dielectric constant becomes large. Therefore, the signal wiring P2 and the signal wiring N2 may have an arrangement relationship of "pitch shift 6", "pitch shift 7", or "pitch shift 8".

The arrangement relationship of the differential wiring will be further explained with reference to FIG. 16. FIG. 16 is a schematic plan view showing the arrangement of differential wiring. In FIG. 16, the signal wiring P3 and the signal wiring N3 are a pair of differential wirings. Information regarding the angle θ between the signal wiring P3 and the signal wiring N3 and the fiber body F may be included in the arrangement relationship of the differential wiring. As shown in FIG. 14, for example, when the angle θ is 40 degrees, the difference in relative permittivity is small.

In this manner, the signal characteristic deriving unit 3 can obtain signal characteristic information corresponding to the relative permittivity distribution information and the wiring layout information. Therefore, high-quality wiring design is possible.

[4. Third embodiment according to the present technology (Example 3 of wiring simulation device)]
The configuration of a wiring simulation device 9 according to a third embodiment of the present technology will be described with reference to FIG. 17. FIG. 17 is a configuration diagram showing an embodiment of a wiring simulation device according to the present technology. As shown in FIG. 17, the wiring simulation device 9 includes a design information input section 1, a distribution information deriving section 2, and an equal length wiring deriving section 4.

[Equal length wiring lead-out part]
Equal-length wiring means that signal wiring is designed so that the lengths of two or more signal wirings are equal. As a result, the signal propagation delays are made equal, resulting in the effect that the propagation delay time difference between the wirings is reduced.

The equal-length wiring deriving unit 4 derives wiring layout information including information regarding signal wirings having equal lengths, based on the relative dielectric constant distribution information and the signal wiring information.

The relative dielectric constant distribution information is information derived by the distribution information deriving unit 2.

The equal length wiring deriving unit 4 can hold signal wiring information. The signal wiring information will be explained with reference to FIG. 18. FIG. 18 is a diagram illustrating an embodiment of signal wiring information. As shown in FIG. 18, the signal wiring information may include, for example, terminal identification information, signal wiring type information, signal wiring usage information, and the like.

The terminal identification information is information for identifying the terminal of the signal wiring.

The signal wiring type information is information indicating the type of signal wiring. Specifically, the signal wiring type information may include information such as whether the signal wiring is a single-ended wiring or a differential wiring. For example, if the two signal wirings are a pair of differential wirings, the two signal wirings can be wired with the same length.

The signal wiring usage information is information indicating the usage of the signal wiring. Specifically, the usage information of the signal wiring may include information such as whether the signal wiring is used for high-speed communication or low-speed communication. For example, if a plurality of signal wirings have the same purpose, the plurality of signal wirings can be wired with the same length.

In the example shown in FIG. 18, the differential wirings "Sig1p" and "Sig1n" can be wired with equal length. Furthermore, "Sig1p", "Sig1n", "Sig2p", and "Sig2n" whose signal wiring uses the same high-speed communication can be wired with equal lengths.

The design information input unit 1 may prompt the user to input this signal wiring information. This will be explained with reference to FIG. 19. FIG. 19 is a display screen showing one embodiment of the design information input section. As shown in FIG. 19, the design information input unit 1 prompts the user to input, for example, terminal identification information, signal wiring type information, or signal wiring usage information as signal wiring information. The user can input terminal identification information, specify arbitrary type information from the signal wiring type information list, and specify arbitrary usage information from the signal wiring usage information list. Note that arbitrary terminal identification information may be specified from the terminal identification information list.

The wiring layout information derived by the equal-length wiring derivation unit 4 may include information regarding signal wirings of equal length. Specifically, the wiring layout information is the wiring layout information shown in FIG. 13.

Thereby, the equal-length wiring deriving unit 4 can automatically perform equal-length wiring based on the relative dielectric constant distribution information. Therefore, high-quality wiring design is possible.

Note that the signal characteristic deriving section 3 may derive the signal characteristic information based on this wiring layout information.

[5. Hardware configuration]
The hardware configuration of the wiring simulation apparatus of the first to third embodiments described above will be explained with reference to FIG. 20. FIG. 20 is a hardware configuration diagram showing an embodiment of a wiring simulation device. As shown in FIG. 20, the wiring simulation device 9 can include a CPU 101, a ROM 102, a RAM 103, a storage section 104, a display section 105, and an acquisition section 106 as components. The respective components are connected, for example, by a bus serving as a data transmission path.

The CPU 101 is realized by, for example, a microcomputer, and controls each component of the wiring simulation device 9. The CPU 101 can function as, for example, the distribution information deriving section 2, the signal characteristic deriving section 3, or the equal length wiring deriving section 4. The distribution information deriving section 2, signal characteristic deriving section 3, or equal length wiring deriving section 4 can be realized by, for example, a program. It can function when the CPU 101 reads this program.

The ROM 102 stores programs used by the CPU 101, control data such as calculation parameters, and the like.

The RAM 103 temporarily stores programs executed by the CPU 101, for example.

Storage unit 104 stores various data. The storage unit 104 can function as a database as shown in FIG. 3, for example. The storage unit 104 can be realized, for example, by using a storage device or the like.

Display unit 105 displays information to the user. The display unit 105 can display, for example, design information as shown in FIG. 2, signal characteristic information as shown in FIG. 8, or relative permittivity distribution information as shown in FIG. 10. Design information as shown in FIG. 2 can be displayed by the design information input section 1 via the display section 105. The display unit 105 can be realized by, for example, an LCD (Liquid Crystal Display) or an OLED (Organic Light-Emitting Diode).

The acquisition unit 106 acquires information etc. from the user. The acquisition unit 106 can be realized by, for example, a microphone, a touch sensor, a keyboard, a mouse, a camera, or the like. The acquisition unit 106 acquires design information as shown in FIG. 2, for example.

Although not shown, the wiring simulation device 9 may further include a communication I/F (interface).

The communication I/F has a function of communicating via an information communication network using communication technologies such as Wi-Fi, Bluetooth (registered trademark), and LTE (Long Term Evolution). For example, the storage unit 104 can record design information obtained from the Internet or the like via a communication I/F.

The wiring simulation device 9 may be, for example, a PC (Personal Computer), a server, a smartphone terminal, a tablet terminal, a mobile phone terminal, a PDA (Personal Digital Assistant), a portable music player, or a wearable terminal (HMD: Head (mounted display, glasses-type HMD, watch-type terminal, band-type terminal, etc.).

A program that implements the distribution information derivation unit 2 and the like may be stored in a computer device or computer system other than the wiring simulation device 9. In this case, the wiring simulation device 9 can use a cloud service that provides the functions that this program has. Examples of this cloud service include SaaS (Software as a Service), IaaS (Infrastructure as a Service), and PaaS (Platform as a Service).

Further, the program can be stored and provided to a computer using various types of non-transitory computer readable media. Non-transitory computer-readable media includes various types of tangible storage media. Examples of non-transitory computer-readable media are magnetic recording media (e.g., flexible disks, magnetic tape, hard disk drives), magneto-optical recording media (e.g., magneto-optical disks), Compact Disc Read Only Memory (CD-ROM), CD- R, CD-R/W, semiconductor memory (e.g., mask ROM, programmable ROM (PROM), erasable PROM (EPROM), flash ROM, random access memory (RAM)). The program may also be provided to the computer via various types of transitory computer readable media. Examples of transitory computer-readable media include electrical signals, optical signals, and electromagnetic waves. The temporary computer-readable medium can provide the program to the computer via wired communication channels such as electric wires and optical fibers, or via wireless communication channels.

In addition to this, the configurations mentioned in the above embodiments can be selected or changed to other configurations as appropriate without departing from the gist of the present technology.

[6. Fourth embodiment according to the present technology (wiring simulation system)]
A wiring simulation system according to the present technology will be described with reference to FIG. 21. FIG. 21 is a conceptual diagram showing an embodiment of a wiring simulation system according to the present technology. As shown in FIG. 21, in a wiring simulation system 90 according to the present technology, a client terminal 10 and a server 20 are connected via an information communication network 30.

The client terminal 10 may include, for example, a design information input section 1. The server 20 can include, for example, a distribution information deriving unit 2.

A design information input unit 1 included in the client terminal 10 prompts a user to input design information of a wiring board. The wiring board is configured by laminating a mesh-like fibrous body, a synthetic resin, and a signal wiring. In the first embodiment, the functions of the design information input section 1 have been explained, so a repeated explanation will be omitted.

The client terminal 10 transmits this design information to the server 20 via the information communication network 30. Server 20 receives this design information.

The distribution information deriving unit 2 included in the server 20 derives distribution information of the relative dielectric constant in the wiring board based on the received design information. In the first embodiment, the functions of the distribution information deriving unit 2 have been explained, so a repeated explanation will be omitted.

The number of servers 20 may be one or multiple. Similarly, the number of client terminals 10 may be one or multiple. Further, not all servers 20 may be connected to the information communication network 30, and all client terminals 10 may not be connected to the information communication network 30.

The client terminal 10 can have some or all of the functions that the server 20 has. For example, the client terminal 10 may include, for example, a distribution information deriving unit 2.

Similarly, the server 20 can have some or all of the functions that the client terminal 10 has. The server 20 can include, for example, the design information input section 1.

Further, the client terminal 10 or the server 20 may include a signal characteristic deriving section 3 or an equal length wiring deriving section 4.

The functions of the client terminal 10 and the server 20 may be stored in other computer devices or computer systems within the wiring simulation system 90. In this case, the client terminal 10 and the server 20 can use a cloud service that provides this function. Examples of this cloud service include SaaS (Software as a Service), IaaS (Infrastructure as a Service), and PaaS (Platform as a Service).

The information communication network 30 is, for example, a wired network such as a LAN (Local Area Network) or a WAN (Wide Area Network), a wireless LAN (WLAN), or a wireless WAN (WWAN) via a base station. This can be realized by a wireless network such as the Internet) or the Internet using a communication protocol such as TCP/IP (Transmission Control Protocol/Internet Protocol).

The design information input unit 1 and the like can be realized using programs and hardware. The hardware configuration of the client terminal 10 and the server 20 may be, for example, the hardware configuration shown in FIG. 20. Therefore, the hardware configurations of the client terminal 10 and the server 20 will not be explained again.

In addition to this, it is possible to select the configurations mentioned in the above embodiments or to change them to other configurations as appropriate, as long as the gist of the present technology is not departed from. Note that this wiring simulation system 90 can utilize the technology described in the first embodiment. The techniques described in the first embodiment will not be explained again.

By using the wiring simulation system 90 according to the present technology, accurate relative dielectric constant distribution information can be obtained and wiring can be designed before manufacturing a wiring board. Moreover, distribution information of relative permittivity can be acquired using information regarding a wide variety of fibrous bodies as shown in FIG. This enables high-quality wiring design.

Furthermore, there is no need to remanufacture the wiring board as in the past. Therefore, manufacturing costs can be reduced and development turnaround time can be shortened.

[7. Fifth embodiment according to the present technology (wiring simulation method)]
A wiring simulation method according to the present technology will be described with reference to FIG. 22. FIG. 22 is a flowchart of an example of a wiring simulation method according to the present technology. As shown in FIG. 22, the wiring simulation method according to the present technology prompts input of design information of a wiring board (S1), and derives relative permittivity distribution information in the wiring board based on the design information. (S2). The wiring board is configured by laminating a mesh-like fibrous body, a synthetic resin, and a signal wiring.

For example, by using the above-mentioned design information input section 1, prompting for input of design information of a wiring board (S1) can be realized. Similarly, for example, by using the distribution information deriving section 2 described above, deriving the distribution information of the relative dielectric constant (S2) can be realized.

The wiring simulation method according to the present technology can be realized by using the wiring simulation device 9 or the wiring simulation system 90 described above.

By using the wiring simulation method according to the present technology, accurate relative dielectric constant distribution information can be obtained and wiring can be designed before manufacturing a wiring board. Moreover, distribution information of relative permittivity can be acquired using information regarding a wide variety of fibrous bodies as shown in FIG. This enables high-quality wiring design.

Furthermore, there is no need to remanufacture the wiring board as in the past. Therefore, manufacturing costs can be reduced and development turnaround time can be shortened.

Note that the effects described in this specification are merely examples and are not limiting, and other effects may also exist.

Note that the present technology can also have the following configuration.
[1]
a design information input unit that prompts input of design information of a wiring board configured by laminating a mesh-like fibrous body, a synthetic resin, and a signal wiring;
at least a distribution information derivation unit that derives distribution information of relative permittivity in the wiring board based on the design information;
Wiring simulation device.
[2]
The design information includes information regarding the fibrous body, a relative dielectric constant of the entire wiring board, a resin content ratio indicating a ratio of the content of the synthetic resin in the wiring board, and a length of the wiring board in the depth direction. contains at least
The wiring simulation device according to [1].
[3]
The information regarding the fibrous body includes fiber identification information for identifying the fibrous body, or information regarding the weaving density of the warp and weft of the fibrous body.
The wiring simulation device according to [1] or [2].
[4]
It further includes a signal characteristic derivation section,
The signal characteristic derivation unit derives signal characteristic information based on the relative dielectric constant distribution information and wiring layout information.
The wiring simulation device according to any one of [1] to [3].
[5]
It is further equipped with an equal length wiring lead-out section,
The equal length wiring deriving unit derives wiring layout information including information regarding signal wirings having equal lengths based on the relative dielectric constant distribution information and signal wiring information.
The wiring simulation device according to any one of [1] to [4].
[6]
The signal wiring information includes at least one of type information of the signal wiring and usage information of the signal wiring.
The wiring simulation device according to [5].
[7]
The signal wiring is a single-ended wiring or a differential wiring,
The wiring simulation device according to any one of [1] to [6].
[8]
the fibrous body is made of glass fiber,
The wiring simulation device according to any one of [1] to [7].
[9]
This is realized through an information and communication network.
a design information input unit that prompts input of design information of a wiring board configured by laminating a mesh-like fibrous body, a synthetic resin, and a signal wiring;
at least a distribution information derivation unit that derives distribution information of relative permittivity in the wiring board based on the design information;
Wiring simulation system.
[10]
prompting the input of design information of a wiring board configured by laminating a mesh-like fibrous body, a synthetic resin, and a signal wiring;
Deriving relative dielectric constant distribution information in the wiring board based on the design information,
Wiring simulation method.

1 Design information input section 2 Distribution information derivation section 3 Signal characteristic derivation section 4 Equal length wiring derivation section 9 Wiring simulation device 101 CPU
102 ROM
103 RAM
104 Storage unit 105 Display unit 106 Acquisition unit F Fibrous body F1 Warp F2 Weft 10 Client terminal 20 Server 30 Information communication network 90 Wiring simulation system S1 Prompting input of design information of wiring board S2 Deriving relative dielectric constant distribution information thing

Claims (10)

a design information input unit that prompts input of design information of a wiring board configured by laminating a mesh-like fibrous body, a synthetic resin, and a signal wiring;
at least a distribution information derivation unit that derives distribution information of relative permittivity in the wiring board based on the design information;
Wiring simulation device. The design information includes information regarding the fibrous body, a relative dielectric constant of the entire wiring board, a resin content ratio indicating a ratio of the content of the synthetic resin in the wiring board, and a length of the wiring board in the depth direction. contains at least
The wiring simulation device according to claim 1. The information regarding the fibrous body includes fiber identification information for identifying the fibrous body, or information regarding the weaving density of the warp and weft of the fibrous body.
The wiring simulation device according to claim 1. It further includes a signal characteristic derivation section,
The signal characteristic derivation unit derives signal characteristic information based on the relative dielectric constant distribution information and wiring layout information.
The wiring simulation device according to claim 1. It is further equipped with an equal length wiring lead-out section,
The equal length wiring deriving unit derives wiring layout information including information regarding signal wirings having equal lengths based on the relative dielectric constant distribution information and signal wiring information.
The wiring simulation device according to claim 1. The signal wiring information includes at least one of type information of the signal wiring and usage information of the signal wiring.
The wiring simulation device according to claim 5. The signal wiring is a single-ended wiring or a differential wiring,
The wiring simulation device according to claim 1. the fibrous body is made of glass fiber,
The wiring simulation device according to claim 1. This is realized through an information and communication network.
a design information input unit that prompts input of design information of a wiring board configured by laminating a mesh-like fibrous body, a synthetic resin, and a signal wiring;
at least a distribution information derivation unit that derives distribution information of relative permittivity in the wiring board based on the design information;
Wiring simulation system. A wiring simulation method using a computer,
a display unit included in the computer prompts for input of design information of a wiring board configured by laminating a mesh fibrous body, a synthetic resin, and a signal wiring;
a CPU included in the computer at least derives relative dielectric constant distribution information in the wiring board based on the design information;
Wiring simulation method.