JP7349185B2 - Multi-energy field nano-lubricant microscale bone grinding measurement system - Google Patents

Multi-energy field nano-lubricant microscale bone grinding measurement system Download PDF

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JP7349185B2
JP7349185B2 JP2022124226A JP2022124226A JP7349185B2 JP 7349185 B2 JP7349185 B2 JP 7349185B2 JP 2022124226 A JP2022124226 A JP 2022124226A JP 2022124226 A JP2022124226 A JP 2022124226A JP 7349185 B2 JP7349185 B2 JP 7349185B2
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grinding
bone
ultrasonic
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measurement system
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JP2023079156A (en
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楊玉瑩
李長河
周宗明
劉波
陳云
楊敏
張彦彬
趙緒峰
張乃慶
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Qingdao University of Technology
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/02Frames; Beds; Carriages
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Surgical Instruments (AREA)
  • Lubricants (AREA)

Description

本発明は、研削加工の技術分野に関し、特にマルチエネルギー場ナノ潤滑剤マイクロスケール骨研削加工測定システムに関する。 The present invention relates to the technical field of grinding, and more particularly to a multi-energy field nano-lubricant microscale bone grinding measurement system.

臨床手術における全膝関節置換のマイクロ研削の冷却能力の不足及び手術領域の可視性の悪さ等の問題に対して、微量潤滑研削加工技術、ナノ粒子ジェット微量潤滑技術、帯電噴霧技術等が徐々に出現している。しかし、本発明者らは、従来の骨研削技術、例えば超音波振動アシストマイクロ研削、ナノ流体微量潤滑マイクロ研削又はナノ流体微量潤滑帯電噴霧結合マイクロ研削などが実際の生産加工における要件を満たすことが困難であることを発見した。 Micro-lubrication grinding technology, nanoparticle jet micro-lubrication technology, charged spray technology, etc. are gradually being developed to address problems such as insufficient cooling capacity and poor visibility of the surgical area in micro-grinding for total knee joint replacement in clinical surgery. It is appearing. However, the inventors believe that conventional bone grinding techniques, such as ultrasonic vibration-assisted micro-grinding, nanofluidic microlubrication micro-grinding or nanofluidic microlubrication charged spray-coupled micro-grinding, can meet the requirements in actual production processing. I found it difficult.

(1)超音波振動アシストマイクロ研削は、研削力による損傷、熱による損傷及び研削工具の目詰まりを効果的に低減できるが、加工中に研削手術の可視性の低さや対流熱交換能力の不足などの臨床上の問題が発生しやすい。(2)ナノ流体微量潤滑マイクロ研削は、研削領域の対流熱交換能力及び手術領域の可視性が低いというボトルネックを解決できるが、加工中に微小液滴が飛散するという問題が発生しやすい。(3)ナノ流体微量潤滑帯電噴霧結合マイクロ研削は、臨床マイクロ研削手術における可視性の低さ、対流熱交換能力の不足及び微小液滴の飛散などの問題を良好に解決するが、該装置は研削屑の排出及び研削工具の深刻な目詰まりの問題を考慮していない。 (1) Ultrasonic vibration-assisted micro-grinding can effectively reduce grinding force damage, thermal damage and clogging of grinding tools, but the visibility of the grinding operation during processing is low and the convective heat exchange ability is insufficient. Clinical problems such as these are likely to occur. (2) Nanofluidic microlubrication micro-grinding can solve the bottlenecks of the convective heat exchange ability of the grinding area and the low visibility of the surgical area, but it is prone to the problem of microdroplet scattering during processing. (3) Nanofluid micro-lubricated charged spray coupled micro-grinding can successfully solve the problems such as low visibility, lack of convective heat exchange ability and micro-droplet scattering in clinical micro-grinding surgery, but the device It does not take into account the problem of grinding waste discharge and serious clogging of the grinding tool.

超音波振動、ナノ潤滑剤、帯電噴霧及びマイクロ研削加工技術を組み合わせて、音響-電気-力のマルチエネルギー場ナノ潤滑剤マイクロスケール骨研削加工技術を形成することにより、上記問題を効果的に解決できる。しかし、どのように加工パラメータを正確に制御し、音響-電気-力のマルチエネルギー場結合加工プロセスを実現するかは常に該技術を悩ませる中心的な問題である。また、従来技術は、マルチエネルギー場ナノ潤滑剤マイクロスケール骨研削の研削力、研削温度及びナノ粒子微小液滴のリアルタイムオンライン検出に欠けている。 The above problems are effectively solved by combining ultrasonic vibration, nano-lubricant, charged spray and micro-grinding processing technology to form an acoustic-electric-force multi-energy field nano-lubricant micro-scale bone grinding processing technology. can. However, how to precisely control the machining parameters and realize the acoustic-electrical-force multi-energy field coupled machining process is always the central problem plaguing the technology. Moreover, the prior art lacks the real-time online detection of the grinding force, grinding temperature and nanoparticle microdroplet of multi-energy field nanolubricant microscale bone grinding.

中国実用新案第204671221号明細書China Utility Model No. 204671221 中国実用新案第209060230号明細書China Utility Model No. 209060230

アトゥール・バッバル(Atul Babbar) 他2名,『骨研削中に超音波作動を用いた熱発生の軽減:CEM43°Cとアレニウスモデルを用いたハイブリッドアプローチ(Thermogenesis mitigation using ultrasonic actuation during bone grinding:a hybrid approach using CEM43°C and Arrhenius model)』,Journal of the Brazilian Society of Mechanical Sciences and Engineering,(2019)41:401Atul Babbar and 2 others, ``Thermogenesis mitigation using ultrasonic actuation during bone grinding: A hybrid approach using CEM 43°C and Arrhenius model'' ringing: a hybrid approach using CEM43°C and Arrhenius model), Journal of the Brazilian Society of Mechanical Sciences and Engineering, (2 019) 41:401 楊敏 他5名,『神経外科用頭蓋骨研削温度場予測の新しいモデル』,機械工学ジャーナル(JOURNAL OF MECHANICAL ENGINEERING),2018年12月,第54巻,第23号,215~222頁Yang Min and 5 others, “A new model for predicting the temperature field of skull grinding for neurosurgery”, JOURNAL OF MECHANICAL ENGINEERING, December 2018, Volume 54, No. 23, pp. 215-222 張麗輝 他3名,『脳神経外科骨研削におけるミスト冷却(Mist cooling in neurosurgical bone grinding)』,エルゼビア(ELSEVIER),2013年,第62巻,第1号,367頁~370頁Lihui Zhang and 3 others, "Mist cooling in neurosurgical bone grinding", Elsevier, 2013, Vol. 62, No. 1, pp. 367-370 アルバート・J・シー(Albert J. Shih) 他4名,『頭蓋底脳神経外科における骨研削温度の予測(Prediction of bone grinding temperature in skull base neurosurgery)』,エルゼビア(ELSEVIER),2012年,第61巻,第1号,307頁~310頁Albert J. Shih and 4 others, "Prediction of bone grinding temperature in skull base neurosurgery", Elsevier (ELSEVIER) , 2012, Volume 61 , No. 1, pp. 307-310 楊敏 他4名,『ナノ流体エアロゾル冷却を用いた骨マイクロ研削における対流熱伝達係数の予測モデル(Predictive model of convective heat transfer coefficient in bone micro-grinding using nanofluid aerosol cooling)』,エルゼビア(ELSEVIER),2021年6月,第125巻,105317Yang Min et al., ``Predictive model of convective heat transfer coefficient in bone micro-grinding using nanofluid aerosol cooling'' Nofluid Aerosol Cooling”, Elsevier, June 2021, Volume 125, 105317

従来技術の欠点に対し、本発明の目的は、超音波振動、ナノ流体、帯電噴霧の結合作用を総合的に考慮し、ナノ粒子微小液滴、研削温度及び研削力をリアルタイムにオンラインで検出でき、臨床マイクロ研削手術における可視性の低さ、対流熱交換能力の不足及び微小液滴の飛散などの問題を解決する、マルチエネルギー場ナノ潤滑剤マイクロスケール骨研削加工測定システムを提供することである。 In view of the shortcomings of the prior art, the purpose of the present invention is to comprehensively consider the combined effects of ultrasonic vibration, nanofluid, and charged spray, and to detect nanoparticle microdroplets, grinding temperature, and grinding force online in real time. The purpose of the present invention is to provide a multi-energy field nano-lubricant microscale bone grinding measurement system that solves problems such as low visibility, lack of convective heat exchange ability and scattering of microdroplets in clinical microgrinding surgery. .

上記目的を達成するために、本発明は、以下の技術的解決手段によって実現される。 In order to achieve the above object, the present invention is realized by the following technical solutions.

本発明の実施例は、マルチエネルギー場ナノ潤滑剤マイクロスケール骨研削加工測定システムを提供し、ワークをクランプするための治具が載置された3次元変位作業台と、導線を介して接続された超音波発生器及び超音波電動スピンドルを含み、超音波電動スピンドルのホーンにワークを研削するための研削工具が取り付けられた超音波振動装置と、帯電噴霧ノズル及び超音波発生器に接続された複数の超音波振動棒を含み、各超音波振動棒は異なる媒体の容器内に配置され、各容器はいずれも混合室に接続され、前記混合室と帯電噴霧ノズルとの間に微量潤滑ポンプが接続された流体帯電噴霧装置と、治具と3次元変位作業台との間に設けられた研削力測定部、治具の側面に設けられた微小液滴測定部及び研削温度測定部を備えた測定装置と、を含む。 Embodiments of the present invention provide a multi-energy field nano-lubricant microscale bone grinding measurement system, which is connected via a conductive wire to a three-dimensional displacement worktable on which a jig for clamping a workpiece is mounted. an ultrasonic vibrating device, which includes an ultrasonic generator and an ultrasonic electric spindle, and a grinding tool for grinding the workpiece is attached to the horn of the ultrasonic electric spindle, and is connected to the charged spray nozzle and the ultrasonic generator. It includes a plurality of ultrasonic vibrating rods, each ultrasonic vibrating rod is placed in a container of a different medium, each container is connected to a mixing chamber, and a micro-lubrication pump is provided between the mixing chamber and the charged spray nozzle. Equipped with a connected fluid charging spray device, a grinding force measuring section provided between the jig and the three-dimensional displacement workbench, a micro droplet measuring section and a grinding temperature measuring section provided on the side of the jig. and a measuring device.

さらなる実施形態として、前記研削力測定部は順次接続された研削力測定器、増幅器、情報収集器及びデータ分析器を含み、治具は、研削力測定器によって3次元変位作業台の上方に設置される。 In a further embodiment, the grinding force measuring unit includes a grinding force measuring device, an amplifier, an information collector, and a data analyzer connected in sequence, and the jig is installed above a three-dimensional displacement workbench by the grinding force measuring device. be done.

さらなる実施形態として、前記治具は制限シート及びストッパを含み、制限シート内にワークを配置するための制限溝が設けられ、ストッパは制限溝内に設けられ、クランプボルトと協働してワークを制限する。 In a further embodiment, the jig includes a restriction sheet and a stopper, a restriction groove is provided in the restriction sheet for placing the workpiece, and the stopper is provided in the restriction groove and cooperates with a clamp bolt to place the workpiece. Restrict.

さらなる実施形態として、前記制限シートの頂部に平板が取り外し可能に接続され、平板上に間隔が調整可能な複数の押さえ板が取り付けられ、押さえ板はワークの高さ方向を制限するために用いられる。 In a further embodiment, a flat plate is removably connected to the top of the restriction sheet, and a plurality of holding plates whose intervals are adjustable are attached to the flat plate, and the holding plates are used to limit the height direction of the workpiece. .

さらなる実施形態として、前記超音波発生器は2つの超音波振動棒に接続され、そのうちの1つの超音波振動棒は生理食塩水を収容する容器内に配置され、もう1つの超音波振動棒はナノ粒子を収容する容器内に配置され、2つの容器はそれぞれホースを介して混合室の入口に接続される。 In a further embodiment, the ultrasound generator is connected to two ultrasonic vibrating rods, one of which is placed in a container containing saline, and the other ultrasonic vibrating rod is It is placed in a container containing the nanoparticles, and the two containers are each connected to the inlet of the mixing chamber via a hose.

さらなる実施形態として、前記帯電噴霧ノズルとワークとの間に高圧直流電源が接続される。 In a further embodiment, a high voltage DC power source is connected between the charged spray nozzle and the workpiece.

さらなる実施形態として、前記研削温度測定部はワーク内に挿入可能な熱電対を含み、前記熱電対は情報収集器及びデータ分析器に順次接続される。 In a further embodiment, the grinding temperature measurement unit includes a thermocouple insertable into the workpiece, the thermocouple being connected in turn to an information collector and a data analyzer.

さらなる実施形態として、前記微小液滴測定部はワーク研削画像を取得するためのカメラを含み、前記カメラは情報収集器及びデータ分析器に順次接続される。 In a further embodiment, the microdroplet measuring unit includes a camera for acquiring images of workpiece grinding, and the camera is sequentially connected to an information collector and a data analyzer.

さらなる実施形態として、前記3次元変位作業台の底部にさらに空気浮上プラットフォーム装置が設けられ、空気浮上プラットフォーム装置は台板、空気浮上防振器及び支持アセンブリを含み、空気浮上防振器は台板と支持アセンブリとの間に取り付けられる。 In a further embodiment, an air levitation platform device is further provided at the bottom of the three-dimensional displacement work platform, the air levitation platform device including a bed plate, an air levitation vibration isolator and a support assembly, the air levitation vibration isolator comprising a bed plate. and the support assembly.

さらなる実施形態として、前記台板の上表面に透磁性パネルが設けられ、台板の内部にハニカムコア板が設けられる。 In a further embodiment, the upper surface of the bedplate is provided with a magnetically permeable panel and the interior of the bedplate is provided with a honeycomb core plate.

本発明の有益な効果は以下のとおりである。
(1)本発明は従来のマイクロ研削加工プロセスにおける研削工具の目詰まり、研削屑の融着、対流熱交換能力の不足及び微小液滴の飛散などの問題に対して、超音波振動、医療用ナノ流体潤滑、帯電噴霧を統合することにより、生体骨の低損傷抑制マイクロ研削を実現する。
(2)本発明の測定装置は研削力測定部、治具の側面に設けられた微小液滴測定部及び研削温度測定部を含み、ナノ粒子微小液滴、研削力及び研削温度をリアルタイムにオンラインで検出することができ、時間を節約するだけでなく、複数回の組み立てによる加工誤差も避ける。
(3)本発明の研削工具は超音波ホーンに接続され、研削工具は加工要件を満たすことができる振動を発生させ、研削工具ヘッドの振動はピストンの往復運動に類似しており、超音波振動アシストマイクロ研削により、研削領域の冷却液は研削工具の超音波振動を受けて高周波、交互の正負油圧衝撃波を発生させ、研削区間によりポンピングしやすく、研削区間内の冷却液の更新を加速し、冷却媒体の対流熱交換能力を大幅に強化し、且つ砕屑の排出を促進し、研削工具の目詰まりを避ける。
(4)本発明は、空気浮上光学プラットフォーム装置を設置し、空気浮上防振器の防振エアバッグを基礎として、制振液及び高減衰小孔空気と協働して防振を行い、良好な防振性能を有し、入口で調整弁を設置することにより、反応時間を短縮し、空気浮上光学プラットフォーム装置に高さ調整機構が設置され、地面の凹凸によるブラケットの歪みや変形などの問題を解決することができる。
(5)本発明の研削力測定部に治具が取り付けられ、情報取得の精度を保証するために、治具によってワークを3方向に制限する。
The beneficial effects of the present invention are as follows.
(1) The present invention solves problems such as clogging of grinding tools, fusion of grinding debris, lack of convective heat exchange ability, and scattering of minute droplets in the conventional micro-grinding process by using ultrasonic vibration, medical By integrating nanofluid lubrication and charged spray, we realize micro-grinding of biological bone with low damage control.
(2) The measuring device of the present invention includes a grinding force measuring section, a microdroplet measuring section provided on the side of the jig, and a grinding temperature measuring section, and measures nanoparticle microdroplets, grinding force, and grinding temperature online in real time. can be detected, which not only saves time but also avoids machining errors caused by multiple assemblies.
(3) The grinding tool of the present invention is connected to the ultrasonic horn, the grinding tool generates vibration that can meet the processing requirements, the vibration of the grinding tool head is similar to the reciprocating motion of the piston, and the ultrasonic vibration With assisted micro-grinding, the cooling fluid in the grinding area is subjected to the ultrasonic vibration of the grinding tool to generate high frequency, alternating positive and negative hydraulic shock waves, which is easier to pump in the grinding zone, accelerating the renewal of the cooling fluid in the grinding zone, Greatly enhances the convective heat exchange ability of the cooling medium, and promotes the discharge of debris and avoids clogging of the grinding tool.
(4) The present invention installs an air levitation optical platform device, and based on the vibration isolation airbag of the air levitation vibration isolator, cooperates with vibration damping liquid and high-damping small hole air to perform vibration isolation. It has excellent anti-vibration performance, and by installing an adjustment valve at the entrance, the reaction time is shortened, and a height adjustment mechanism is installed in the air floating optical platform device, which eliminates problems such as distortion and deformation of the bracket due to uneven ground. can be solved.
(5) A jig is attached to the grinding force measurement unit of the present invention, and the jig restricts the workpiece in three directions in order to ensure accuracy of information acquisition.

本発明の一部を構成する明細書の図面は本発明のさらなる理解を提供するために用いられ、本発明の例示的な実施例及びその説明は本発明を解釈するために用いられ、本発明を不当に限定するものではない。 The drawings of the specification forming part of the invention are used to provide a further understanding of the invention, the illustrative embodiments of the invention and the description thereof are used to interpret the invention, and the drawings of the specification form part of the invention. shall not be unduly limited.

本発明の1つ以上の実施形態に係る全体構造概略図である。1 is an overall structural schematic diagram according to one or more embodiments of the invention; FIG. 本発明の1つ以上の実施形態に係る超音波電動スピンドルの断面図である。1 is a cross-sectional view of an ultrasonic motorized spindle in accordance with one or more embodiments of the invention. FIG. 本発明の1つ以上の実施形態に係る超音波振動マイクロ研削プロセスにおける断続切削によるマイクロクラックの生成プロセスの概略図である。1 is a schematic illustration of the process of creating microcracks by interrupted cutting in an ultrasonic vibration microgrinding process according to one or more embodiments of the present invention; FIG. 本発明の1つ以上の実施形態に係る超音波振動マイクロ研削プロセスにおける断続切削によるマイクロクラックの生成プロセスの概略図である。1 is a schematic illustration of the process of creating microcracks by interrupted cutting in an ultrasonic vibration microgrinding process according to one or more embodiments of the present invention; FIG. 本発明の1つ以上の実施形態に係る超音波振動マイクロ研削プロセスにおける断続切削によるマイクロクラックの生成プロセスの概略図である。1 is a schematic illustration of the process of creating microcracks by interrupted cutting in an ultrasonic vibration microgrinding process according to one or more embodiments of the present invention; FIG. 本発明の1つ以上の実施形態に係る超音波振動マイクロ研削プロセスにおける断続切削によるマイクロクラックの生成プロセスの概略図である。1 is a schematic illustration of the process of creating microcracks by interrupted cutting in an ultrasonic vibration microgrinding process according to one or more embodiments of the present invention; FIG. 本発明の1つ以上の実施形態に係る研削屑体積の換算の概略図である。FIG. 3 is a schematic illustration of grinding debris volume conversion in accordance with one or more embodiments of the present invention. 本発明の1つ以上の実施形態に係るナノ粒子微量潤滑帯電噴霧構造の概略図である。1 is a schematic diagram of a nanoparticle microlubrication charged spray structure according to one or more embodiments of the present invention. FIG. 本発明の1つ以上の実施形態に係るナノ粒子微小液滴、研削力及び研削温度の測定装置の概略図である。1 is a schematic diagram of a nanoparticle microdroplet, grinding force, and grinding temperature measurement device according to one or more embodiments of the invention; FIG. 本発明の1つ以上の実施形態に係るマイクロ研削力測定器の取り付け並びにワーク位置決め及びクランプ装置の概略図である。1 is a schematic illustration of a micro-grinding force meter installation and workpiece positioning and clamping apparatus according to one or more embodiments of the invention; FIG. 本発明の1つ以上の実施形態に係るワークの位置決めの概略図である。1 is a schematic diagram of positioning a workpiece in accordance with one or more embodiments of the invention; FIG. 本発明の1つ以上の実施形態に係るワークの断面図及び温度測定装置の接続概略図である。FIG. 2 is a cross-sectional view of a workpiece and a schematic diagram of a connection of a temperature measuring device according to one or more embodiments of the present invention. 本発明の1つ以上の実施形態に係るセルフレベリング空気浮上防振光学プラットフォームである。1 is a self-leveling air-levitation anti-vibration optical platform in accordance with one or more embodiments of the present invention. 本発明の1つ以上の実施形態に係るハニカム台板構造の概略図である。1 is a schematic illustration of a honeycomb bedplate structure in accordance with one or more embodiments of the present invention; FIG. 本発明の1つ以上の実施形態に係る単一自由度防振システムの概略図である。1 is a schematic diagram of a single degree of freedom vibration isolation system in accordance with one or more embodiments of the invention; FIG.

実施例1: Example 1:

本実施例は、マルチエネルギー場ナノ潤滑剤マイクロスケール骨研削加工測定システムを提供し、図1に示すように、超音波振動装置I、流体帯電噴霧装置II、測定装置III、空気浮上プラットフォーム装置IV、3次元変位作業台を含み、空気浮上プラットフォーム装置IVは3次元変位作業台の底部に設置され、3次元変位作業台上に治具II-1によってワークII-2をクランプする。 This embodiment provides a multi-energy field nanolubricant microscale bone grinding measurement system, as shown in Fig. 1, ultrasonic vibration device I, fluid charged spray device II, measurement device III, air floating platform device IV. , a three-dimensional displacement workbench, and an air floating platform device IV is installed at the bottom of the three-dimensional displacement workbench, and clamps a workpiece II-2 by a jig II-1 on the three-dimensional displacement workbench.

本実施例では、試料材料として牛の長骨を選択し、牛の長骨の研削力が大きく、加工中に脆性破壊によるクラックが発生しやすいという特徴に対し、超音波振動装置Iを用いて超音波アシストマイクロ研削プロセスによって加工する。 In this example, bovine long bones were selected as the sample material, and ultrasonic vibrator I was used to solve the problem that bovine long bones have a large grinding force and are prone to cracking due to brittle fracture during processing. Processed by ultrasonic assisted micro-grinding process.

図2に示すように、超音波振動装置Iは超音波発生器I-1及び超音波電動スピンドルI-2を含み、超音波電動スピンドルI-2の超音波トランスデューサI-3と超音波発生器I-1は導線を介して接続され、超音波発生器I-1の交流電流は超音波トランスデューサI-3に高周波電気振動信号を供給する。 As shown in FIG. 2, the ultrasonic vibration device I includes an ultrasonic generator I-1 and an ultrasonic electric spindle I-2, and an ultrasonic transducer I-3 and an ultrasonic generator of the ultrasonic electric spindle I-2. I-1 is connected via a conductive wire, and the alternating current of the ultrasonic generator I-1 supplies a high frequency electrical vibration signal to the ultrasonic transducer I-3.

超音波電動スピンドルI-2のハウジングは角度調整装置に接続されて研削角度を調整し、同時に、角度調整装置も3次元変位作業台に取り付けられ、且つX方向、Y方向、Z方向に移動する。前記角度調整装置は従来技術であり、ここでは説明を省略する。 The housing of the ultrasonic electric spindle I-2 is connected to an angle adjustment device to adjust the grinding angle, and at the same time, the angle adjustment device is also attached to the three-dimensional displacement workbench and moves in the X direction, Y direction, and Z direction. . The angle adjustment device is a conventional technology, and its explanation will be omitted here.

研削工具I-5は超音波振動装置IのホーンI-4に接続されており、研削工具I-5は加工要件を満たす振動を発生させることができる。研削工具I-5が骨材料に接近すると、研削工具/骨ギャップの容積が減少し、冷却液がギャップから排出され、熱及び骨研削屑を運び去り、研削工具I-5が骨材料から離れると、ギャップの容積が増加し、新鮮な冷却液が運び込まれる。前記超音波振動装置Iはスピンドルに取り付けられ、それと共に回転し、超音波振動アシストマイクロ研削により、研削領域の冷却液は研削工具の超音波振動を受けて高周波の交互の正負油圧衝撃波を発生させることができ、研削区間によりポンピングしやすく、研削区間内の冷却液の更新を加速し、冷却媒体の対流熱交換能力を大幅に強化し、且つ砕屑の排出を促進し、研削工具I-5の目詰まりを避ける。 The grinding tool I-5 is connected to the horn I-4 of the ultrasonic vibration device I, and the grinding tool I-5 can generate vibrations that meet the processing requirements. As the grinding tool I-5 approaches the bone material, the volume of the grinding tool/bone gap decreases and the cooling fluid is discharged from the gap, carrying away heat and bone grinding debris, and the grinding tool I-5 moves away from the bone material. , the volume of the gap increases and fresh coolant is brought in. The ultrasonic vibration device I is attached to the spindle and rotates with it, and through ultrasonic vibration assisted micro-grinding, the cooling fluid in the grinding area is subjected to the ultrasonic vibration of the grinding tool to generate high-frequency alternating positive and negative hydraulic shock waves. It is easier to pump the grinding section, accelerates the renewal of the coolant in the grinding section, greatly enhances the convective heat exchange ability of the cooling medium, and promotes the discharge of debris, making it easier to pump the grinding tool I-5. Avoid clogging.

図3(a)に示すように、研削粒子の瞬間的な切削厚さhが最小未変形切り屑厚さhminより小さい場合、加工済みの表面に対して耕起と摺擦作用を発揮するだけで、研削粒子が未加工表面材料に切り込まれていないことを示す。図3(b)~図3(c)に示すように、hの増加に伴い、h=hminの場合、研削粒子が未加工表面にちょうど接触して切り込まれ、材料が徐々に塑性変形し、且つ塑性変形の底部に残留応力が存在し、hが最小未変形の切り屑の厚さhminを超える場合、材料は塑性せん断の作用下で切り屑を形成し、この時、材料は塑性的に除去される。 As shown in Fig. 3(a), when the instantaneous cutting thickness h of the abrasive particles is smaller than the minimum undeformed chip thickness h min , it will exert plowing and rubbing action on the machined surface. alone, indicating that the abrasive particles are not cutting into the raw surface material. As shown in Fig. 3(b) to Fig. 3(c), with the increase of h, when h=h min , the abrasive particles just contact and cut into the raw surface, and the material gradually undergoes plastic deformation. If, and there is residual stress at the bottom of the plastic deformation, and h exceeds the minimum undeformed chip thickness h min , the material will form a chip under the action of plastic shear, and at this time the material will removed plastically.

図3(d)に示すように、研削粒子が未加工の表層材料に切り込まれると、研削粒子の瞬間的な切削厚さは0から増加し、hが臨界値まで増加すると、最終加工面に横方向クラック及び中間クラックを含むマイクロクラックが発生し、研削プロセスは塑性領域除去から脆性領域除去に変化し、hが徐々に減少すると、研削粒子は再び未加工表面材料から離れ、0になる。したがって、単一の研削粒子の瞬間的な切削厚さという観点から、超音波振動マイクロ研削において断続研削を実現できる。 As shown in Fig. 3(d), when the abrasive particle cuts into the raw surface material, the instantaneous cutting thickness of the abrasive particle increases from 0, and when h increases to a critical value, the final machined surface Micro-cracks including transverse cracks and intermediate cracks occur in , the grinding process changes from plastic region removal to brittle region removal, and as h gradually decreases, the grinding particles separate from the raw surface material again and reach 0. . Therefore, interrupted grinding can be realized in ultrasonic vibration micro-grinding in terms of the instantaneous cutting thickness of a single grinding particle.

超音波振動メカニズム: Ultrasonic vibration mechanism:

超音波とは、人間の聴覚反応を引き起こすことができない、可聴周波数が20kHz以上の振動波である。超音波振動は、トランスデューサを介して超音波電源から送信された高周波信号を高周波振動に変換し、さらに超音波ホーンを介して振動を超音波カッタに伝達し、軸方向の超音波振動振幅の重畳により研削粒子の瞬間的な切削深さも周期的に変化する。 Ultrasound is a vibration wave with an audible frequency of 20 kHz or higher that cannot cause a human auditory response. The ultrasonic vibration converts the high frequency signal sent from the ultrasonic power source into high frequency vibration through the transducer, and further transmits the vibration to the ultrasonic cutter through the ultrasonic horn, and superimposes the ultrasonic vibration amplitude in the axial direction. The instantaneous cutting depth of the grinding particles also changes periodically.

超音波振動は、研削屑の最大未変形切削厚さ及び研削屑の平均厚さを変えることができ、材料除去率を向上させ、ナノ流体を砥石車及びワークにより十分に浸潤させるため、冷却潤滑効果及びナノ流体の利用率を大幅に向上させ、研削時の研削屑体積の換算の概略図は図4に示すとおりであり、関連計算は以下のとおりである。 Ultrasonic vibration can change the maximum undeformed cutting thickness of the grinding chips and the average thickness of the grinding chips, improve the material removal rate, and infiltrate the nanofluid more fully into the grinding wheel and workpiece, thereby increasing cooling lubrication. The efficiency and utilization rate of nanofluid are greatly improved, and the schematic diagram of the conversion of the volume of grinding debris during grinding is as shown in Fig. 4, and the related calculations are as follows.

体積一定の原理によれば、研削未変形研削屑の最大厚さは、

Figure 0007349185000001
であり、ここで、
Figure 0007349185000002
は研削工具の単位面積あたりの有効研削刃数であり、Cは研削屑の幅と研削屑の厚さの比、即ち
Figure 0007349185000003
である。 According to the principle of constant volume, the maximum thickness of undeformed grinding chips is:
Figure 0007349185000001
and here,
Figure 0007349185000002
is the effective number of grinding teeth per unit area of the grinding tool, and C is the ratio of the width of the grinding chips to the thickness of the grinding chips, i.e.
Figure 0007349185000003
It is.

同様の矩形の六面体で魚状体の研削屑を代替すると、

Figure 0007349185000004
であり、式中、
Figure 0007349185000005
は各研削粒子の体積であり、
Figure 0007349185000006
は研削除去されたワーク材料の体積である。 If a similar rectangular hexahedron is used to replace the fish-shaped grinding waste,
Figure 0007349185000004
and in the formula,
Figure 0007349185000005
is the volume of each grinding particle,
Figure 0007349185000006
is the volume of workpiece material removed by grinding.

式(2)は、

Figure 0007349185000007
と書くことができ、式中、
Figure 0007349185000008
は研削屑の平均幅であり、
Figure 0007349185000009
(Cは比例係数であり、研削粒子の歯先円すい角の大きさに関連している)であり、
Figure 0007349185000010
は研削屑の平均厚さであり、
Figure 0007349185000011
であり、
Figure 0007349185000012
は未変形研削屑の長さであり、その数値は幾何学的接触長さの式に応じて求めることができ、即ち
Figure 0007349185000013
であり、
Figure 0007349185000014
は研削工具の研削幅である。 Formula (2) is
Figure 0007349185000007
can be written, and in the formula,
Figure 0007349185000008
is the average width of the grinding chips,
Figure 0007349185000009
(C is a proportionality coefficient and is related to the size of the tip cone angle of the grinding particles),
Figure 0007349185000010
is the average thickness of the grinding chips,
Figure 0007349185000011
and
Figure 0007349185000012
is the length of the undeformed grinding chip, whose value can be determined according to the geometric contact length formula, i.e.
Figure 0007349185000013
and
Figure 0007349185000014
is the grinding width of the grinding tool.

式(3)から、

Figure 0007349185000015
が得られ、最大未変形切り屑厚さは、
Figure 0007349185000016
である。 From formula (3),
Figure 0007349185000015
is obtained, and the maximum undeformed chip thickness is
Figure 0007349185000016
It is.

超音波振動アシスト研削メカニズム: Ultrasonic vibration assisted grinding mechanism:

マイクロ研磨プロセスにおいて、加工メカニズムは主に研削粒子の半径と未変形切り屑厚さの比に影響され、研削粒子の半径と未変形切り屑厚さが同じスケールであるため、未変形切り屑厚さの微小な変化量が加工メカニズムに大きな影響を与える。サイズ効果、最小切り屑厚さの原理などの総合的な作用を考慮すると、その材料除去メカニズムは従来の加工方法と異なる。動的衝撃荷重下で、材料の動的破壊靭性は静的破壊靭性に比べて70%以上低下する。したがって、静的破壊靭性KICの代わりに、超音波振動下で脆性材料の動的破壊靭性KIDを計算し、即ち、

Figure 0007349185000017
である。 In the micro-grinding process, the machining mechanism is mainly influenced by the ratio of the radius of the grinding particles and the undeformed chip thickness, and since the radius of the grinding particles and the undeformed chip thickness are on the same scale, the undeformed chip thickness A small amount of change in the thickness has a large impact on the processing mechanism. Considering the comprehensive effects such as size effect, minimum chip thickness principle, etc., its material removal mechanism is different from traditional machining methods. Under dynamic impact loading, the dynamic fracture toughness of the material decreases by more than 70% compared to the static fracture toughness. Therefore, instead of the static fracture toughness K IC , we calculate the dynamic fracture toughness K ID of the brittle material under ultrasonic vibration, i.e.
Figure 0007349185000017
It is.

したがって、超音波振動端面のマイクロ研削において、従来の端面のマイクロ研削に比べて、超音波振動の追加により、研削粒子と材料の間の相対速度及び加速度が大きくなり、研削粒子と材料の間の動的衝撃作用が大きくなり、この動的衝撃作用を考慮すると、超音波振動端面のマイクロ研削で塑性領域の研削をより容易に実現し、塑性領域研削を前提として、より大きな材料除去率を達成できる。 Therefore, in ultrasonic vibration end face micro-grinding, compared to conventional end face micro-grinding, the addition of ultrasonic vibration increases the relative velocity and acceleration between the grinding particles and the material, and the The dynamic impact effect becomes larger, and considering this dynamic impact effect, the micro-grinding of the ultrasonic vibration end face can more easily realize the grinding of the plastic region, and on the premise of the plastic region grinding, achieve a larger material removal rate. can.

インデント破壊力学によれば、加工荷重が臨界荷重より小さい場合、生体骨材料は主に塑性的に除去され、加工荷重が臨界荷重より大きい場合、主に脆性破壊によって除去される。超音波作用下での臨界荷重Fmax及び臨界切削厚さhmaxは、

Figure 0007349185000018
であり、式中、αは幾何学的係数であり、βは定数であり、Hは生体骨材料の硬度であり、KIDは動的破壊靭性であり、Kは値が1より大きい影響係数であり、生体骨材料の超音波作用下での硬度変化に関連しており、Eは骨材料の弾性率である。KIDが増加し、Hが減少すると、硬脆材料は脆性状態から塑性状態へ変化しやすく、逆もまた同様である。したがって、超音波振動アシストマイクロ研削プロセスにおいて、超音波振動の導入によりワーク材料を軟化させる効果があり、ワーク材料の硬度Hをある程度低下させ、同時に、超音波振動の導入により、研削工具とワークとの間の弾性反発が低下し、加工プロセスがより安定し、動的衝撃作用が減少し、これは、材料の動的破壊靭性KIDの増加として現れる。したがって、式(7)~(8)から分かるように、超音波振動により臨界荷重及び臨界切削厚さが増加し、臨界切削深さは一般に通常の研削の2~3倍である。 According to indentation fracture mechanics, when the processing load is smaller than the critical load, the biological bone material is mainly removed plastically, and when the processing load is larger than the critical load, it is mainly removed by brittle fracture. The critical load F max and critical cutting thickness h max under ultrasonic action are:
Figure 0007349185000018
, where α is a geometric coefficient, β is a constant, H V is the hardness of the biological bone material, K ID is the dynamic fracture toughness, and K V has a value greater than 1. is the influence factor, which is related to the hardness change of biological bone material under the action of ultrasound, and E is the elastic modulus of the bone material. As K ID increases and H V decreases, hard brittle materials tend to change from brittle state to plastic state and vice versa. Therefore, in the ultrasonic vibration assisted micro-grinding process, the introduction of ultrasonic vibration has the effect of softening the workpiece material, reducing the hardness H V of the workpiece material to a certain extent, and at the same time, the introduction of ultrasonic vibration has the effect of softening the workpiece material. The elastic rebound between is reduced, the processing process is more stable, and the dynamic impact effect is reduced, which is manifested as an increase in the dynamic fracture toughness K ID of the material. Therefore, as can be seen from equations (7)-(8), ultrasonic vibration increases the critical load and critical cutting thickness, and the critical cutting depth is generally two to three times that of normal grinding.

さらに、図5に示すように、流体帯電噴霧装置IIは帯電噴霧ノズルII-6、微量潤滑ポンプII-15、混合室II-13及び超音波振動棒II-10を含み、超音波振動棒II-10は超音波トランスデューサI-3に接続され、超音波振動棒II-10の数は混合対象の媒体の数に応じて決定され、本実施例では、2つの超音波振動棒II-10が設置され、そのうちの1つの超音波振動棒II-10は生理食塩水II-11に対して超音波振動を行うために用いられ、もう1つの超音波振動棒II-10はナノ粒子II-9に対して超音波振動を行うために用いられ、ナノ粒子は超音波振動によって均一に分散される。 Further, as shown in FIG. 5, the fluid charged spraying device II includes a charged spray nozzle II-6, a micro-lubrication pump II-15, a mixing chamber II-13, and an ultrasonic vibration rod II-10. -10 is connected to the ultrasonic transducer I-3, and the number of ultrasonic vibrating rods II-10 is determined according to the number of media to be mixed, and in this example, two ultrasonic vibrating rods II-10 are connected to the ultrasonic transducer I-3. One of the ultrasonic vibration rods II-10 is used to perform ultrasonic vibration on the physiological saline II-11, and the other ultrasonic vibration rod II-10 is used to perform ultrasonic vibration on the nanoparticles II-9. The nanoparticles are uniformly dispersed by the ultrasonic vibration.

ナノ粒子II-9を収容する容器は第1ホースII-8を介して混合室II-13の第1入口に接続され、生理食塩水II-11を収容する容器は第2ホースII-12を介して混合室II-13の第2入口に接続され、生理食塩水II-11及びナノ粒子II-9は混合室II-13内で混合されて低濃度のナノ流体に調製される。混合室II-13の出口は第3ホースII-14を介して微量潤滑ポンプII-15に接続され、微量潤滑ポンプII-15は接続線II-7を介して帯電噴霧ノズルII-6に接続される。 The container containing nanoparticles II-9 is connected to the first inlet of the mixing chamber II-13 via a first hose II-8, and the container containing physiological saline II-11 is connected to a second hose II-12. The saline solution II-11 and the nanoparticles II-9 are mixed in the mixing chamber II-13 to form a nanofluid with a low concentration. The outlet of the mixing chamber II-13 is connected to the micro-lubrication pump II-15 via a third hose II-14, and the micro-lubrication pump II-15 is connected to the charged spray nozzle II-6 via the connection line II-7. be done.

帯電噴霧ノズルII-6は高圧直流電源II-4に接続され、微量潤滑ポンプII-15はナノ流体を帯電噴霧ノズルII-6から噴出した後、高圧直流電源II-4によってナノ流体液滴を帯電噴霧させて帯電微小液滴群を形成し、帯電液滴群は電界力の駆動下で制御可能かつ整然とした方法でワークII-2の表面(ワークII-2は治具II-1によってクランプ及び固定される)に輸送され、研削運動において主に潤滑と冷却の役割を果たす。 The charged spray nozzle II-6 is connected to the high-voltage DC power supply II-4, and the micro-lubrication pump II-15 sprays the nanofluid from the charged spray nozzle II-6, and then the nanofluid droplets are connected to the high-voltage DC power supply II-4. The charged droplets are charged and sprayed to form a group of charged minute droplets, and the charged droplets are moved onto the surface of the workpiece II-2 (the workpiece II-2 is clamped by the jig II-1) in a controllable and orderly manner under the drive of an electric field force. and fixed), and plays mainly the role of lubrication and cooling during the grinding movement.

高圧直流電源II-4はシステムに高圧直流電源を供給し、高圧直流電源II-4の負極電流は帯電噴霧ノズルII-6の導線II-5に輸送され、正極電流は導線を介してワークII-2に輸送され、且つ接地線II-3を介して接地され、ノズルとワークとの間に安定した電界が形成されることを保証する。 The high voltage DC power supply II-4 supplies high voltage DC power to the system, the negative current of the high voltage DC power supply II-4 is transported to the conductor II-5 of the charged spray nozzle II-6, and the positive current is transferred to the workpiece II through the conductor. -2 and grounded via ground wire II-3, ensuring that a stable electric field is formed between the nozzle and the workpiece.

さらに、図6に示すように、測定装置IIIは微小液滴測定部、研削力測定部及び研削温度測定部を含み、ここで、微小液滴測定部は高速カメラIII-8、第3情報収集器III-6及び第3データ分析器III-7を含み、高速カメラIII-8は導線を介して第3情報収集器III-6に接続され、第3情報収集器III-6は導線を介して第3データ分析器III-7に接続される。 Furthermore, as shown in FIG. 6, the measuring device III includes a microdroplet measuring section, a grinding force measuring section, and a grinding temperature measuring section, where the microdroplet measuring section includes a high-speed camera III-8, a third information collecting section, and a third information collecting section. a high-speed camera III-8 is connected to a third information collector III-6 via a conductor, and the third information collector III-6 is connected to a third data analyzer III-6 via a conductor. and is connected to the third data analyzer III-7.

研削工具I-5がワークII-2を研削して研削力を発生させる時、高速カメラIII-8はナノ流体微小液滴のナノ流体気流場、帯電場及び超音波高周波振動衝撃エネルギー場の結合作用下での運動軌跡を収集し、且つ第3情報収集器III-6に伝送し、最後に第3データ分析器III-7に伝送し、さらに研削工具/生体骨拘束界面におけるナノ流体微小液滴のマイクロチャネル毛細管の形成メカニズムを分析することができる。 When the grinding tool I-5 grinds the workpiece II-2 to generate a grinding force, the high-speed camera III-8 detects the combination of the nanofluid airflow field, charging field, and ultrasonic high-frequency vibration impact energy field of the nanofluid microdroplet. The motion trajectory under the action is collected and transmitted to the third information collector III-6, and finally transmitted to the third data analyzer III-7, and then the nanofluid microfluid at the grinding tool/living bone constraint interface. The formation mechanism of droplet microchannel capillaries can be analyzed.

図9に示すように、研削温度測定部は順次接続された熱電対III-10、第1情報収集器III-2及び第1データ分析器III-1を含み、測定信号は第1情報収集器III-2を介して第1データ分析器III-1に伝送され、且つ第1データ分析器III-1によって熱電対III-10の作業端、即ちワークII-2の温度を表示する。 As shown in FIG. 9, the grinding temperature measurement unit includes a thermocouple III-10, a first information collector III-2, and a first data analyzer III-1 connected in sequence, and the measurement signal is transmitted to the first information collector III-1. III-2 to the first data analyzer III-1, and the first data analyzer III-1 displays the temperature of the working end of the thermocouple III-10, ie, the workpiece II-2.

ワークII-2の底部には、熱電対III-10を挿入するための溝がある。本実施例は2本の熱電対III-10を例とし、それぞれTC1、TC2とマークされ、その作業端はワークII-2の上表面からそれぞれ0.5mm、1mm下に位置し、TC2に近いワークII-2の表面をa面とマークし、TC1に近い一面をb面とマークする。研削ヘッドI-5を矢印方向(a→b)に応じて初めて研削した場合、TC2はまず研削され、第1測定端になり、TC1は第2測定端になる。 At the bottom of workpiece II-2 there is a groove for inserting thermocouple III-10. This example takes two thermocouples III-10 as an example, marked TC1 and TC2, respectively, and their working ends are located 0.5 mm and 1 mm below the upper surface of workpiece II-2, respectively, and are close to TC2. The surface of work II-2 is marked as the a-side, and the surface near TC1 is marked as the b-side. When the grinding head I-5 is ground for the first time in the direction of the arrow (a→b), TC2 is ground first and becomes the first measuring end, and TC1 becomes the second measuring end.

さらに、図6に示すように、研削力測定部は研削力測定器III-9、増幅器III-3、第2情報収集器III-5、第2データ分析器III-4を含み、研削力測定器III-9は治具II-1の下方に取り付けられ、研削力測定器III-9、増幅器III-3、第2情報収集器III-5及び第2データ分析器III-4は導線を介して順次接続される。研削工具I-5がワークII-2を研削して研削力を生成する時、測定信号は増幅器III-3によって増幅された後に第2情報収集器III-5に伝送され、最後に第2データ分析器III-4に伝送され、該データ分析器はディスプレイ付きのプログラマブルコントローラであり、且つ研削力の大きさを表示する。 Furthermore, as shown in FIG. 6, the grinding force measuring section includes a grinding force measuring device III-9, an amplifier III-3, a second information collector III-5, and a second data analyzer III-4, The grinding force measuring device III-9, the amplifier III-3, the second information collector III-5, and the second data analyzer III-4 are connected to each other via conductive wires. connected sequentially. When the grinding tool I-5 grinds the workpiece II-2 to generate grinding force, the measurement signal is amplified by the amplifier III-3 and then transmitted to the second information collector III-5, and finally the second data The data is transmitted to analyzer III-4, which is a programmable controller with a display and displays the magnitude of the grinding force.

本実施例では、図7に示すように、研削力測定器III-9の両側にベースIII-1107が対称的に取り付けられ、ベースIII-1107と研削力測定器III-9はボルトによって接続され、前記ベースIII-1107は透磁性金属材質であり、空気浮上プラットフォーム装置IVの作業台を起動した後、作業台が着磁されて研削力測定器III-9のベースIII-1107をその上に吸着させることができる。 In this embodiment, as shown in FIG. 7, the base III-1107 is symmetrically attached to both sides of the grinding force measuring device III-9, and the base III-1107 and the grinding force measuring device III-9 are connected by bolts. , the base III-1107 is made of a magnetically permeable metal material, and after the workbench of the air floating platform device IV is activated, the workbench is magnetized and the base III-1107 of the grinding force measuring instrument III-9 is placed on it. It can be adsorbed.

さらに、研削力測定器III-9に治具II-1が取り付けられ、図8に示すように、治具II-1は制限シートIII-1110及びストッパIII-1104を含み、制限シートIII-1110は研削力測定器III-9の作業台に固定され、本実施例では、制限シートIII-1110は矩形枠構造であり、制限シートIII-1110内に矩形の制限溝が開けられる。 Furthermore, a jig II-1 is attached to the grinding force measuring device III-9, and as shown in FIG. 8, the jig II-1 includes a limit sheet III-1110 and a stopper III-1104, is fixed to the workbench of the grinding force measuring device III-9, and in this embodiment, the restriction sheet III-1110 has a rectangular frame structure, and a rectangular restriction groove is cut in the restriction sheet III-1110.

理解できるように、他の実施例では、制限シートIII-1110の制限溝がワークII-2の形状に適合している限り、制限シートIII-1110を他の構造に設置してもよい。 As can be appreciated, in other embodiments, the restriction sheet III-1110 may be installed in other structures, as long as the restriction grooves of the restriction sheet III-1110 are adapted to the shape of the workpiece II-2.

ワークII-2は制限溝の一角に貼り合わせて設置され、ワークII-2の片側と制限溝の内壁との間にストッパIII-1104が設置され、ストッパIII-1104は第1クランプボルトIII-1102と協働してワークII-2をX方向に制限する。ストッパIII-1104の片側の表面はワークII-2の側面に貼り合わされ、他側の表面は第1クランプボルトIII-1102の端部に貼り合わされ、第1クランプボルトIII-1102は制限シートIII-1110を貫通する。 The workpiece II-2 is attached and installed in one corner of the restriction groove, and a stopper III-1104 is installed between one side of the workpiece II-2 and the inner wall of the restriction groove, and the stopper III-1104 is attached to the first clamp bolt III- 1102 to limit the workpiece II-2 in the X direction. One surface of the stopper III-1104 is bonded to the side surface of the workpiece II-2, the other surface is bonded to the end of the first clamp bolt III-1102, and the first clamp bolt III-1102 is attached to the limit sheet III- Penetrates 1110.

ワークII-2のY方向は第2クランプボルトIII-1106及び制限シートIII-1110によって制限され、第2クランプボルトIII-1106は制限シートIII-1110を貫通し、且つその端部はワークII-2の端面に貼り合わせることができ、ワークII-2の他の端面を制限溝の側壁に密着させる。 The Y direction of the workpiece II-2 is restricted by the second clamp bolt III-1106 and the restriction sheet III-1110, and the second clamp bolt III-1106 passes through the restriction sheet III-1110, and its end is connected to the workpiece II-2. The other end surface of the workpiece II-2 can be attached to the end surface of the workpiece II-2 in close contact with the side wall of the restriction groove.

ワークII-2のZ方向は複数の押さえ板によって制限され、ワークII-2のX方向の両側にそれぞれ複数の押さえ板が設置される。本実施例では、ワークII-2のX方向の正方向に2つの押さえ板III-1109が設置され、当然ながら、他の実施例では、押さえ板III-1109は他の個数を設置してもよい。 The Z direction of the workpiece II-2 is restricted by a plurality of holding plates, and the plurality of holding plates are installed on both sides of the workpiece II-2 in the X direction. In this embodiment, two holding plates III-1109 are installed in the positive direction of the X direction of the workpiece II-2, and of course, in other embodiments, other numbers of holding plates III-1109 may be installed. good.

さらに、ストッパIII-1104の上表面は第1平板III-1105に取り外し可能に接続され、第1平板III-1105は取り付けボルトIII-1103をねじ込むことによってストッパIII-1104の固定を実現し、ボルトIII-1103とストッパIII-1104との間にガスケットIII-1101が取り付けられる。 Furthermore, the upper surface of the stopper III-1104 is removably connected to a first flat plate III-1105, and the first flat plate III-1105 realizes fixing of the stopper III-1104 by screwing in the mounting bolt III-1103, Gasket III-1101 is installed between III-1103 and stopper III-1104.

ワークII-2の片側に制限シートIII-1110に取り外し可能に接続された第2平板III-1111が設けられ、第2平板III-1111にストリップ状穴が開設され、ストリップ状穴に調整ボルトIII-1108をねじ込むことによって押さえ板III-1109の取り付けを実現し、押さえ板III-1109の位置はストリップ状穴に沿って移動することによって調整できる。 A second flat plate III-1111 is provided on one side of the workpiece II-2 and is removably connected to the restriction sheet III-1110, a strip-shaped hole is opened in the second flat plate III-1111, and an adjustment bolt III is installed in the strip-shaped hole. The holding plate III-1109 is attached by screwing in the -1108, and the position of the holding plate III-1109 can be adjusted by moving it along the strip-shaped hole.

押さえ板III-1109の形状はワークII-2の高さに応じて決定され、押さえ板III-1109の一端がワークII-2の上表面に接触でき,他端が第2平板III-1111の上表面に接触できることを満たせばよい。ワークII-2の長さ・幅・高さの3つの寸法が変化する時、第2クランプボルトIII-1106、第1クランプボルトIII-1102及び押さえ板III-1109によって装置の調整可能性を実現し、ワークII-2の寸法変化の要件を満たす。 The shape of the holding plate III-1109 is determined according to the height of the workpiece II-2, so that one end of the holding plate III-1109 can contact the upper surface of the workpiece II-2, and the other end can contact the upper surface of the second flat plate III-1111. It is only necessary to meet the requirement that the upper surface can be contacted. When the three dimensions of the workpiece II-2, length, width, and height, change, the second clamp bolt III-1106, the first clamp bolt III-1102, and the holding plate III-1109 realize the adjustability of the device. and satisfies the dimensional change requirements of work II-2.

さらに、図10に示すように、空気浮上プラットフォーム装置IVは台板IV-1、空気浮上防振器IV-2及び支持アセンブリを含み、空気浮上防振器IV-2は台板IV-1と支持アセンブリとの間に取り付けられる。本実施例では、支持アセンブリは複数、例えば4つの支持柱IV-3を含み、対向して設置された支持柱IV-3は接続部IV-6を介して接続され、支持柱IV-3の安定性を補強し、さらに台板IV-1の安定性を向上させるために用いられる。 Further, as shown in FIG. 10, the air floating platform apparatus IV includes a bedplate IV-1, an air floating isolator IV-2, and a support assembly, and the air floating isolator IV-2 is connected to the bed plate IV-1. and the support assembly. In this embodiment, the support assembly includes a plurality of, for example four, support columns IV-3, and the oppositely installed support columns IV-3 are connected via a connection IV-6, and the support columns IV-3 are connected via a connection IV-6. It is used to reinforce the stability and further improve the stability of the bedplate IV-1.

各支持柱IV-3の頂部と台板IV-1の底面との間にいずれも空気浮上防振器IV-2が接続され、支持柱IV-3の底部に収容溝IV-4が開けられ、収容溝IV-4内に昇降接地ピンIV-5が取り付けられ、昇降接地ピンIV-5によって台板IV-1の高さ及び平坦度を調整する。 An air floating vibration isolator IV-2 is connected between the top of each support column IV-3 and the bottom of the base plate IV-1, and a housing groove IV-4 is opened at the bottom of the support column IV-3. , an elevating ground pin IV-5 is installed in the receiving groove IV-4, and the height and flatness of the base plate IV-1 are adjusted by the elevating ground pin IV-5.

好ましくは、収容溝IV-4の内壁にねじが設けられ、収容溝IV-4は昇降接地ピンIV-5にねじ接続される。さらに、昇降接地ピンIV-5の底部には、台板IV-1の重量を支えるために用いられる耐荷重パッドIV-7が設置される。 Preferably, the inner wall of the receiving groove IV-4 is provided with a screw, and the receiving groove IV-4 is threadedly connected to the lifting ground pin IV-5. Further, a load-bearing pad IV-7 used to support the weight of the base plate IV-1 is installed at the bottom of the lifting ground pin IV-5.

さらに、図11に示すように、前記台板IV-1はハニカム台板であり、それは互いに平行で間隔を置いて設置された2つの支持板IV-105を含み、支持板IV-105の周方向は第1枠板IV-102によって密閉され、第1枠板IV-102の外表面にレザーライニングIV-101が設けられ、内表面に減衰材料の第2枠板IV-103が設けられ、第2枠板IV-103の内側にハニカムコア板IV-106が設けられ、上側に位置する支持板IV-105の頂部に透磁性パネルIV-104が設けられる。 Further, as shown in FIG. 11, the base plate IV-1 is a honeycomb base plate, which includes two support plates IV-105 that are parallel to each other and spaced apart, and the base plate IV-1 includes the direction is sealed by a first frame plate IV-102, the outer surface of the first frame plate IV-102 is provided with a leather lining IV-101, the inner surface is provided with a second frame plate IV-103 of damping material; A honeycomb core plate IV-106 is provided inside the second frame plate IV-103, and a magnetically permeable panel IV-104 is provided on the top of the upper support plate IV-105.

本実施例では、透磁性パネルIV-104は高透磁性ステンレス鋼パネルであり、ハニカムコア板IV-106は正方形のアルミニウム亜鉛めっき鋼板及び強化アルミニウム亜鉛めっき鋼板を用いて互いに接着し、正方形のアルミニウム亜鉛めっき鋼板の内部に凹溝がプレスされ、従来の正方形の薄い鋼板より強度が大きく、液体がハニカム層に浸透することを防止し、且つねじ穴部品でのガスの対流を阻止することができる。 In this example, the magnetically permeable panel IV-104 is a high magnetically permeable stainless steel panel, the honeycomb core plate IV-106 is a square aluminum galvanized steel sheet and a reinforced aluminum galvanized steel sheet that are bonded together, and a square aluminum Concave grooves are pressed inside the galvanized steel plate, which has greater strength than the traditional square thin steel plate, which can prevent liquid from penetrating into the honeycomb layer and prevent gas convection in screw hole parts. .

空気浮上プラットフォーム防振システム理論: Air floating platform vibration isolation system theory:

防振とは振動源と防振対象機器との間に適切な防振器を配置して振動の直接伝達を除去又は抑制することである。図12に示すように、防振装置のそれぞれ独立した自由度はいずれも単一自由度の防振システムに簡略化することができ、ここで、制御対象は1つの剛性質量ブロックであり、防振器は理想的なダンパで並列接続された無質量素子であり、地盤は質量が無限大の剛体である。 Vibration isolation refers to removing or suppressing the direct transmission of vibration by placing an appropriate vibration isolator between the vibration source and the equipment to be vibration-isolated. As shown in Figure 12, each independent degree of freedom of the vibration isolator can be simplified to a single degree of freedom vibration isolation system, where the controlled object is one rigid mass block and the The shaker is a massless element connected in parallel with an ideal damper, and the ground is a rigid body with infinite mass.

単一自由度の防振システムの振動微分方程式は、

Figure 0007349185000019
であり、式中、mは負荷質量であり、kはシステム剛性であり、cはシステム減衰である。 The vibration differential equation for a single degree of freedom isolation system is:
Figure 0007349185000019
, where m is the load mass, k is the system stiffness, and c is the system damping.

Figure 0007349185000020
とすると、
Figure 0007349185000021
である。
Figure 0007349185000020
Then,
Figure 0007349185000021
It is.

Figure 0007349185000022
とし、式中、
Figure 0007349185000023
は該システムの地盤振動伝達関数であり、システムが地盤に対して防振システムを介して絶縁されるシステムの物体に伝達される振動の伝達効果を特徴付ける。図12から分かるように、システムの伝達表現式は同じであれば、
Figure 0007349185000024
である。
Figure 0007349185000022
In the formula,
Figure 0007349185000023
is the ground vibration transfer function of the system, which characterizes the transfer effect of vibrations transferred to the objects of the system from which the system is isolated with respect to the ground via the vibration isolation system. As can be seen from Figure 12, if the system transmission expressions are the same,
Figure 0007349185000024
It is.

Figure 0007349185000025
のモード
Figure 0007349185000026
は地上の単振動干渉下でのシステムの定常状態振幅伝達と呼ばれ、
Figure 0007349185000027
である。
Figure 0007349185000025
mode of
Figure 0007349185000026
is called the steady-state amplitude transfer of the system under simple harmonic interference on the ground,
Figure 0007349185000027
It is.

式中、

Figure 0007349185000028
は防振システムの減衰比であり、
Figure 0007349185000029
は地上干渉振動の振動周波数であり、
Figure 0007349185000030
は防振システムの非減衰固有周波数である。固有周波数とは振動システムの自由振動周波数を指し、固有周波数が低いほどシステムの自由振動周期が長い。以上から分かるように、防振システムの固有周波数を低下させ、システムの減衰比を増加させることは地面に対する大型防振プラットフォームの振動を効果的に向上させることができる。 During the ceremony,
Figure 0007349185000028
is the damping ratio of the vibration isolation system,
Figure 0007349185000029
is the vibration frequency of ground interference vibration,
Figure 0007349185000030
is the undamped natural frequency of the vibration isolation system. Natural frequency refers to the free vibration frequency of a vibrating system; the lower the natural frequency, the longer the free vibration period of the system. As can be seen from the above, reducing the natural frequency of the vibration isolation system and increasing the damping ratio of the system can effectively improve the vibration of the large vibration isolation platform with respect to the ground.

以上の記載は本出願の好ましい実施例に過ぎず、本出願を限定するものではなく、当業者であれば、本出願に対して様々な変更及び変化を行うことができる。本出願の精神及び原則内で行われた任意の修正、同等置換、改善などは、いずれも本出願の保護範囲内に含まれるべきである。 The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and those skilled in the art can make various modifications and changes to the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of this application shall be included within the protection scope of this application.

I 超音波振動装置
II 流体帯電噴霧装置
III 測定装置
IV 空気浮上プラットフォーム装置
I-1 超音波発生器
I-2 超音波電動スピンドル
I-3 超音波トランスデューサ
I-4 ホーン
I-5 研削工具
I-6 内視鏡
II-1 治具
II-2 ワーク
II-3 接地線
II-4 高圧直流電源
II-5 導線
II-6 帯電噴霧ノズル
II-7 接続線
II-8 第1ホース
II-9 ナノ粒子
II-10 超音波振動棒
II-11 生理食塩水
II-12 第2ホース
II-13 混合室
II-14 第3ホース
II-15 微量潤滑ポンプ
III-1 第1データ分析器
III-2 第1情報収集器
III-3 増幅器
III-4 第2データ分析器
III-5 第2情報収集器
III-6 第3情報収集器
III-7 第3データ分析器
III-8 高速カメラ
III-9 研削力測定器
III-10 熱電対
III-1101 ガスケット
III-1102 第1クランプボルト
III-1103 取り付けボルト
III-1104 ストッパ
III-1105 第1平板
III-1106 第2クランプボルト
III-1107 ベース
III-1108 調整ボルト
III-1109 押さえ板
III-1110 制限シート
III-1111 第2平板
IV-1 台板
IV-2 空気浮上防振器
IV-3 支持柱
IV-4 収容溝
IV-5 昇降接地ピン
IV-6 接続部
IV-7 耐荷重パッド
IV-101 レザーライニング
IV-102 第1枠板
IV-103 第2枠板
IV-104 透磁性パネル
IV-105 支持板
IV-106 ハニカムコア板
I Ultrasonic vibration device II Fluid charged spray device III Measuring device IV Air floating platform device I-1 Ultrasonic generator I-2 Ultrasonic electric spindle I-3 Ultrasonic transducer I-4 Horn I-5 Grinding tool I-6 Endoscope II-1 Jig II-2 Work II-3 Ground wire II-4 High voltage DC power supply II-5 Conductor wire II-6 Charged spray nozzle II-7 Connection wire II-8 First hose II-9 Nanoparticles II -10 Ultrasonic vibration rod II-11 Physiological saline II-12 2nd hose II-13 Mixing chamber II-14 3rd hose II-15 Micro-lubrication pump III-1 1st data analyzer III-2 1st information collection Instrument III-3 Amplifier III-4 Second data analyzer III-5 Second information collector III-6 Third information collector III-7 Third data analyzer III-8 High-speed camera III-9 Grinding force measuring instrument III -10 Thermocouple III-1101 Gasket III-1102 1st clamp bolt III-1103 Mounting bolt III-1104 Stopper III-1105 1st flat plate III-1106 2nd clamp bolt III-1107 Base III-1108 Adjustment bolt III-1109 Holder Plate III-1110 Restriction sheet III-1111 2nd flat plate IV-1 Base plate IV-2 Air levitation vibration isolator IV-3 Support column IV-4 Accommodation groove IV-5 Lifting ground pin IV-6 Connection part IV-7 Resistance Load pad IV-101 Leather lining IV-102 First frame plate IV-103 Second frame plate IV-104 Magnetic permeable panel IV-105 Support plate IV-106 Honeycomb core plate

Claims (8)

骨研削加工測定システムであって、
骨材料をクランプするための治具が載置された3次元変位作業台と、
導線を介して接続された超音波発生器及び超音波電動スピンドルを含み、超音波電動スピンドルのホーンに骨材料を研削するための研削工具が取り付けられた超音波振動装置と、
帯電噴霧ノズル及び超音波発生器に接続された2つの超音波振動棒を含み、前記帯電噴霧ノズルと骨材料との間に高圧直流電源が接続され、そのうちの1つの超音波振動棒は生理食塩水を収容する容器内に配置されて生理食塩水に対して超音波振動を行い、もう1つの超音波振動棒はナノ粒子を収容する容器内に配置されてナノ粒子に対して超音波振動を行い、各容器がいずれも混合室に接続され、超音波振動が行われた生理食塩水と超音波振動が行われたナノ粒子が混合室内で混合されてナノ流体が調製され、前記混合室と帯電噴霧ノズルとの間に微量潤滑ポンプが接続され、前記微量潤滑ポンプが前記ナノ流体を前記帯電噴霧ノズルから噴出し、前記高圧直流電源によってナノ流体液滴を帯電噴霧させて帯電微小液滴群を形成する流体帯電噴霧装置と、
治具と3次元変位作業台との間に設けられた研削力測定部、治具の側面に設けられた微小液滴測定部及び研削温度測定部を備えた測定装置と、を含むことを特徴とする
骨研削加工測定システム。
A bone grinding measurement system,
a three-dimensional displacement workbench on which a jig for clamping bone material is placed;
an ultrasonic vibration device including an ultrasonic generator and an ultrasonic electric spindle connected via a conductive wire, and a grinding tool for grinding bone material is attached to a horn of the ultrasonic electric spindle;
It includes two ultrasonic vibrating rods connected to a charged atomizing nozzle and an ultrasonic generator , a high voltage DC power source is connected between the charged atomizing nozzle and the bone material, and one of the ultrasonic vibrating rods is connected to a physiological Another ultrasonic vibration rod is placed in a container containing saline to apply ultrasonic vibrations to the physiological saline, and another ultrasonic vibration rod is placed in a container containing nanoparticles to apply ultrasonic vibrations to the nanoparticles. Each container is connected to a mixing chamber, and the ultrasonic-vibrated physiological saline and the ultrasonic-vibrated nanoparticles are mixed in the mixing chamber to prepare a nanofluid . A micro-lubrication pump is connected between the micro-lubrication pump and the charged spray nozzle, and the micro-lubrication pump jets out the nanofluid from the charged spray nozzle, and the high-voltage DC power source causes the nanofluid droplets to be charged and sprayed to form charged microdroplets. a swarm-forming fluid-charged spray device;
A measuring device including a grinding force measuring section provided between the jig and the three-dimensional displacement workbench, a micro droplet measuring section and a grinding temperature measuring section provided on the side surface of the jig. Bone grinding measurement system.
前記研削力測定部は順次接続された研削力測定器、増幅器、情報収集器及びデータ分析器を含み、
治具は研削力測定器によって3次元変位作業台の上方に設置されることを特徴とする
請求項1に記載の骨研削加工測定システム。
The grinding force measuring unit includes a grinding force measuring device, an amplifier, an information collector, and a data analyzer connected in sequence;
The bone grinding measurement system according to claim 1, wherein the jig is installed above a three-dimensional displacement workbench using a grinding force measuring device.
前記治具は制限シート及びストッパを含み、制限シート内に骨材料を配置するための制限溝が設けられ、制限溝の一角に貼り合わせて設置される骨材料の片側と制限溝の内壁との間にストッパが設置され、ストッパの片側の表面は骨材料の側面に貼り合わされ、ストッパの他側の表面は第1クランプボルトの端部に貼り合わされ、ストッパが第1クランプボルトと協働して骨材料をX方向に制限し、第2クランプボルトの端部が同骨材料の端面に貼り合わされ、第2クランプボルトは同骨材料の他の端面を制限溝の側壁に密着させて同骨材料をY方向に制限することを特徴とする
請求項2に記載の骨研削加工測定システム。
The jig includes a restriction sheet and a stopper, and a restriction groove for arranging the bone material is provided in the restriction sheet, and one side of the bone material to be pasted and installed in one corner of the restriction groove and an inner wall of the restriction groove are provided. A stopper is installed in between, one surface of the stopper is bonded to the side surface of the bone material, the other surface of the stopper is bonded to the end of the first clamp bolt, and the stopper cooperates with the first clamp bolt. The bone material is restricted in the X direction, the end of the second clamp bolt is bonded to the end surface of the bone material, and the second clamp bolt is attached to the bone material by bringing the other end surface of the bone material into close contact with the side wall of the restriction groove. The bone grinding measurement system according to claim 2, characterized in that: is limited in the Y direction .
前記制限シートの頂部に平板が取り外し可能に接続され、平板に間隔が調整可能な複数の押さえ板が取り付けられ、押さえ板は骨材料の高さ方向を制限するために用いられることを特徴とする
請求項3に記載の骨研削加工測定システム。
A flat plate is removably connected to the top of the restriction sheet, a plurality of holding plates whose intervals are adjustable are attached to the flat plate, and the holding plates are used to limit the height direction of the bone material . The bone grinding measurement system according to claim 3.
前記研削温度測定部は骨材料内に挿入可能な熱電対を含み、前記熱電対は情報収集器及びデータ分析器に順次接続されることを特徴とする
請求項1に記載の骨研削加工測定システム。
The bone grinding measurement system according to claim 1, wherein the grinding temperature measuring unit includes a thermocouple that can be inserted into the bone material, and the thermocouple is sequentially connected to an information collector and a data analyzer. .
前記微小液滴測定部は骨材料の研削画像を取得するためのビデオカメラを含み、前記ビデオカメラは情報収集器及びデータ分析器に順次接続されることを特徴とする
請求項1に記載の骨研削加工測定システム。
The bone according to claim 1, wherein the micro droplet measuring unit includes a video camera for acquiring a grinding image of the bone material, and the video camera is sequentially connected to an information collector and a data analyzer. Grinding measurement system.
前記3次元変位作業台の底部にさらに空気浮上プラットフォーム装置が設けられ、空気浮上プラットフォーム装置は台板、空気浮上防振器及び支持アセンブリを含み、空気浮上防振器は台板と支持アセンブリとの間に取り付けられることを特徴とする
請求項1に記載の骨研削加工測定システム。
An air levitation platform device is further provided at the bottom of the three-dimensional displacement work platform, the air levitation platform device including a bed plate, an air levitation vibration isolator and a support assembly, the air levitation vibration isolator comprising a base plate and a support assembly. The bone grinding process measurement system according to claim 1, wherein the bone grinding process measurement system is installed between .
前記台板の上表面に透磁性パネルが設けられ、台板の内部にハニカムコア板が設けられることを特徴とする
請求項1に記載の骨研削加工測定システム。
The bone grinding measurement system according to claim 1, wherein a magnetically permeable panel is provided on the upper surface of the bed plate, and a honeycomb core plate is provided inside the bed plate.
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