JPH03277466A - Processing device - Google Patents
Processing deviceInfo
- Publication number
- JPH03277466A JPH03277466A JP2073115A JP7311590A JPH03277466A JP H03277466 A JPH03277466 A JP H03277466A JP 2073115 A JP2073115 A JP 2073115A JP 7311590 A JP7311590 A JP 7311590A JP H03277466 A JPH03277466 A JP H03277466A
- Authority
- JP
- Japan
- Prior art keywords
- processing
- magnetic abrasive
- abrasive grain
- abrasive grains
- magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006061 abrasive grain Substances 0.000 claims abstract description 63
- 239000002904 solvent Substances 0.000 claims abstract description 30
- 238000003754 machining Methods 0.000 claims description 17
- 239000007788 liquid Substances 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 7
- 238000011084 recovery Methods 0.000 abstract 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000002002 slurry Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は、磁性砥粒を用いた超音波加工機等の加工装
置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a processing device such as an ultrasonic processing machine using magnetic abrasive grains.
以下、説明の便宜上、加工装置として超音波加工機を例
に挙げて説明する。Hereinafter, for convenience of explanation, an ultrasonic processing machine will be described as an example of the processing apparatus.
第２図は浮遊砥粒型の従来の超音波加工機の加工部分及
び砥粒循環部分を示す原理説明図で、図において、（１
）は超音波により振動する超音波加工工具（以下、単に
工具と略称） 、 （２）は被加工物、（３）は工具（
１）と被加工物（２）との加工間隙に供給される砥粒、
（４）はこの加工部分を収納する加工槽、（５）は砥粒
（３）を水等の液体に混ぜてスラリー状にした加工溶剤
を収納する加工溶剤収納手段、（６）は砥粒（３）を含
む加工溶剤を循環させるポンプ等の加工溶剤供給手段、
（７）は加工溶剤を加工間隙に供給するノズルである。Figure 2 is a principle explanatory diagram showing the processing section and abrasive circulation section of a conventional floating abrasive type ultrasonic processing machine.
) is an ultrasonic machining tool that vibrates with ultrasonic waves (hereinafter simply referred to as a tool), (2) is a workpiece, and (3) is a tool (
Abrasive grains supplied to the processing gap between 1) and the workpiece (2),
(4) is a processing tank that stores this processing part, (5) is a processing solvent storage means that stores a processing solvent made by mixing the abrasive grains (3) with a liquid such as water and made into a slurry, and (6) is a processing solvent storage means for storing the abrasive grains. (3) Processing solvent supply means such as a pump that circulates the processing solvent,
(7) is a nozzle that supplies processing solvent to the processing gap.
従来の超音波加工機は上記のように構成されており、次
にその動作について説明する。A conventional ultrasonic processing machine is configured as described above, and its operation will be explained next.
超音波振動している工具（１）と被加工物（２）の間に
、加工溶剤を供給し、工具（１）が加工溶剤を介して被
加工物（２）を細か（破砕することで加工が進行する。A processing solvent is supplied between the ultrasonic vibrating tool (1) and the workpiece (2), and the tool (1) crushes the workpiece (2) into small pieces through the processing solvent. Processing progresses.
又、加工槽（４）にたまった加工溶剤は、加工溶剤収納
手段（５）に回収されて、加工溶剤供給手段（６）にて
ノズル（７）を通して再び加工間隙に供給される。この
ようにして砥粒（３）を含む加工溶剤は循環する。Further, the processing solvent accumulated in the processing tank (4) is collected into the processing solvent storage means (5), and is again supplied to the processing gap by the processing solvent supply means (6) through the nozzle (7). In this way, the processing solvent containing the abrasive grains (3) is circulated.
［発明が解決しようとする課題］
従来の加工装置は以上のように構成されているので、被
加工物〔２）の加工表面の面精度を調整する時、例えば
面精度を良くする等のために、砥粒（３）の粒径を小さ
いものに交換しようとした場合、それまでに使用してい
た粒径の大きい砥粒（３）を残さないために、加工槽（
４）、加工溶剤収納手段（５）、ポンプ（６）等砥粒（
３）が通る部分を水等で清掃するか、砥粒（３）のまわ
りの部品すべてを交換することが必要であり、実際上砥
粒（３）の交換は困難であった。[Problems to be Solved by the Invention] Since the conventional processing device is configured as described above, when adjusting the surface accuracy of the processing surface of the workpiece [2], for example, in order to improve the surface accuracy, etc. When trying to replace the abrasive grains (3) with smaller ones, the processing tank (
4), processing solvent storage means (5), pump (6), etc.
It is necessary to clean the part through which the abrasive grains (3) pass with water or the like, or to replace all the parts around the abrasive grains (3), and in practice it is difficult to replace the abrasive grains (3).
又、被加工物（２）を局所的に加工する場合に、砥粒（
３）の位置を制御する機能がなく、例えばノズル（７）
の位置を移動させる手段がとられており、工具（１１の
被加工物（２）の加工面に対する位置を局所的に選択す
ることが不可能であった。In addition, when locally processing the workpiece (2), abrasive grains (
3) There is no function to control the position of the nozzle (7), for example.
It has been impossible to locally select the position of the tool (11) with respect to the workpiece (2) to be machined.
この発明は上記のような課題を解消するためになされた
もので、被加工物（２）の加工表面の面精度を調整する
ような時に、砥粒の交換が容易にできる加工装置を得る
ことを目的とする。This invention was made in order to solve the above-mentioned problems, and provides a processing device that allows easy exchange of abrasive grains when adjusting the surface accuracy of the processing surface of the workpiece (2). With the goal.
又、この発明の別の発明は、被加工物の加工位置を局所
的に選択することのできる加工装置を得ることを目的と
する。Another object of the present invention is to obtain a processing device that can locally select the processing position of a workpiece.
この発明に係る加工装置は、磁性砥粒を液体に混ぜた加
工溶剤から、必要に応じて磁性砥粒のみを回収する磁性
砥粒回収手段を具備するものである。The processing apparatus according to the present invention is equipped with a magnetic abrasive collecting means for collecting only magnetic abrasive grains as necessary from a processing solvent in which magnetic abrasive grains are mixed with a liquid.
又、この発明の別の発明に係る加工装置は、磁性砥粒を
所定個所に集中させることにより、被加工物の加工位置
を局所的に選択できる磁性砥粒集中手段を工具の局所に
装着したものである。Further, a processing device according to another aspect of the present invention is provided with a magnetic abrasive concentration means locally attached to the tool, which can locally select the machining position of the workpiece by concentrating the magnetic abrasive at a predetermined location. It is something.
〔作用１
この発明における加工装置は、砥粒交換時の磁性砥粒の
回収を、磁性砥粒が磁力によって吸着する作用を利用し
て行なう。[Operation 1] The processing device according to the present invention recovers magnetic abrasive grains when replacing the abrasive grains by utilizing the effect that the magnetic abrasive grains are attracted by magnetic force.
又５この発明の別の発明における加工装置は、工具の局
所に磁性砥粒を集中させ、被加工物の加工位置を局所的
に選択して加工を行なう。Further, in the processing device according to another aspect of the present invention, magnetic abrasive grains are concentrated locally on the tool, and the processing position of the workpiece is locally selected to perform processing.
［発明の実施例］
以下、この発明の一実施例として、超音波加工機を例に
挙げた実施例図について説明する。[Embodiments of the Invention] Hereinafter, as an embodiment of the present invention, embodiment diagrams using an ultrasonic processing machine as an example will be described.
第１図において（８）は磁性砥粒で、水等の液体に混ぜ
てスラリー状となっている。（９）は例えば電磁石を用
いた磁性砥粒回収手段で、この磁性砥粒回収手段（９）
は磁性砥粒（３）を含む加工溶剤の収納手段（５）に配
設されている。また（１０）は工具（１）の局所に組込
んだ例えば電磁石を用いた磁性砥粒集中手段である。In FIG. 1, (8) is a magnetic abrasive grain, which is mixed with a liquid such as water to form a slurry. (9) is a magnetic abrasive collecting means using, for example, an electromagnet, and this magnetic abrasive collecting means (9)
is arranged in a processing solvent storage means (5) containing magnetic abrasive grains (3). Further, (10) is a magnetic abrasive concentration means using, for example, an electromagnet, which is incorporated locally in the tool (1).
なお、その他の部分は第２図に示す従来装置と同様であ
り、同一符号を付すことによりその説明を省略する。Note that the other parts are the same as the conventional device shown in FIG. 2, and the explanation thereof will be omitted by giving the same reference numerals.
この発明の一実施例による超音波加工機は上記のように
構成されており、次にその動作について説明する。The ultrasonic processing machine according to an embodiment of the present invention is constructed as described above, and its operation will be explained next.
従来の超音波加工機と同様に所定の加工を行なった後、
例えば被加工物（２）の加工面を良くしたい場合に、磁
性砥粒（８）を粒径の小さなものに交換して更に加工を
行なう必要がある。この時、磁性砥粒（８）を含む加工
溶剤を循環させたまま磁性砥粒回収手段（９）を動作さ
せ、その電磁力で磁性砥粒（８）を吸着する。After performing the specified processing in the same way as conventional ultrasonic processing machines,
For example, when it is desired to improve the machined surface of the workpiece (2), it is necessary to replace the magnetic abrasive grains (8) with those having a smaller particle size and perform further processing. At this time, the magnetic abrasive collecting means (9) is operated while the processing solvent containing the magnetic abrasive grains (8) is being circulated, and the magnetic abrasive grains (8) are attracted by the electromagnetic force.
一方、加工部分に残った磁性砥粒（８）は、ポンプ等の
加工溶剤供給手段（６）にて送られる磁性砥粒（８）の
なくなった水等が加工部分を洗い流し、すべての磁性砥
粒（８）が磁性砥粒回収手段（９）により回収される。On the other hand, the magnetic abrasive grains (8) remaining in the machining part are washed away by water, etc., in which the magnetic abrasive grains (8) are removed, which is sent by a machining solvent supply means (6) such as a pump, and all the magnetic abrasive grains are removed. The grains (8) are collected by a magnetic abrasive grain collection means (9).
その後、水等だけになった加工溶剤収納手段（５）に、
前の加工に使用した磁性砥粒（８）より粒径の小さい磁
性砥粒（８）を入れることにより砥粒交換することがで
きる。After that, in the processing solvent storage means (5) where only water etc.
The abrasive grains can be replaced by inserting magnetic abrasive grains (8) having a smaller particle size than the magnetic abrasive grains (8) used in the previous processing.
また、超音波加工中に工具（Ｌ）のある部分だけの加工
を促進させたい場合、その部分に設けた耐性砥粒集中手
段（１０）を動作させ、例えば電磁力を用いて磁性砥粒
（８）を工具（１１の局所に集中させることにより、工
具（１）の他の部分より加工主体である磁性砥粒（８）
がその部分に集中しているので、その部分の加工が選択
的に促進される。In addition, when it is desired to accelerate machining of only a certain part of the tool (L) during ultrasonic machining, the resistant abrasive grain concentration means (10) provided in that part is operated, and for example, magnetic abrasive grains ( By concentrating 8) on the local part of the tool (11), the magnetic abrasive grains (8), which are mainly used for machining, are
is concentrated in that area, so processing of that area is selectively promoted.
ここで、磁性砥粒集中手段（１０）を動作させる時期に
ついては、工具（１）の動作と同期をとるか、あるいは
、一定時間間隔で動作させる。これにより、摩滅した磁
性砥粒が加工間隙に長くとどまることなく洗い流され、
新しい磁性砥粒が加工間隙に供給される。Here, the timing at which the magnetic abrasive concentration means (10) is operated is synchronized with the operation of the tool (1), or is operated at regular time intervals. This allows the worn-out magnetic abrasive grains to be washed away without remaining in the machining gap for a long time.
Fresh magnetic abrasive grains are supplied to the machining gap.
なお、上記実施例では砥粒集中手段（ｌＯ）を１箇所に
設けた例を説明したが、これを複数箇所設けて、それら
の砥粒集中手段（１０）を単独もしくは複数箇所動作さ
せることにより所望の超音波加工が行なえる。In addition, in the above embodiment, an example was explained in which the abrasive grain concentration means (lO) was provided at one location, but by providing this at multiple locations and operating these abrasive grain concentration means (10) singly or at multiple locations, Desired ultrasonic processing can be performed.
また、上記説明においては、超音波加工機を例に挙げて
説明したが、この発明は、これに限定されることなく、
例えば、放電加工における加工液中に微細粒子を混濁す
る加工に８いても応用できる。Further, in the above explanation, an ultrasonic processing machine was used as an example, but the present invention is not limited to this.
For example, it can be applied to machining in which fine particles are mixed in machining fluid in electric discharge machining.
［発明の効果］
以上のように、この発明によれば、磁性砥粒を用いて、
磁性砥粒収納手段に磁性砥粒回収手段を設け、砥粒交換
時に磁性砥粒回収手段を動作させることで容易に砥粒が
交換でき、例えば被加工物の荒加工から仕上げ加工をす
るような場合に効果を発揮する。[Effect of the invention] As described above, according to the present invention, using magnetic abrasive grains,
By providing a magnetic abrasive collecting means in the magnetic abrasive storage means and operating the magnetic abrasive collecting means when replacing the abrasive grains, the abrasive grains can be easily replaced. Effective in some cases.
又、この発明の別の発明によれば、磁性砥粒を所定個所
に集中させることにより、被加工物の加工位置を局所的
に選択できる効果がある。Further, according to another aspect of the present invention, by concentrating the magnetic abrasive grains at a predetermined location, there is an effect that the processing position of the workpiece can be locally selected.
第１図はこの発明の一実施例による超音波加工機を示す
原理説明図、第２図は従来の超音波加工機を示す原理説
明図である。
図において、（１）は超音波加工工具、（２）は被加工
物、（３）は砥粒、（４）は加工槽、（５）は加工溶剤
収納手段、（６）は加工溶剤供給手段、（８）は磁性砥
粒、（９）は磁性砥粒回収手段、（ｌＯ）は磁性砥粒集
中手段である。
なお、図中、同一符号は同一、又は相当部分を示す。FIG. 1 is a principle explanatory diagram showing an ultrasonic processing machine according to an embodiment of the present invention, and FIG. 2 is a principle explanatory diagram showing a conventional ultrasonic processing machine. In the figure, (1) is an ultrasonic machining tool, (2) is a workpiece, (3) is an abrasive grain, (4) is a machining tank, (5) is a machining solvent storage means, and (6) is a machining solvent supply. (8) is a magnetic abrasive grain, (9) is a magnetic abrasive collection means, and (1O) is a magnetic abrasive concentration means. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (2)
との加工間隙に供給して上記被加工物を加工する加工装
置であって、次の条件を具備する加工装置。 ａ、上記砥粒を磁性砥粒で構成すること。 ｂ、上記加工溶剤を収納する加工溶剤収納手段を有する
こと。 ｃ、上記加工間隙に加工溶剤を供給する加工溶剤供給手
段を、上記加工間隙と加工溶剤供給手段との間に設ける
こと。 ｄ、上記加工溶剤収納手段は、磁力により上記磁性砥粒
を回収する磁性砥粒回収手段を有すること。(1) A processing device that processes a workpiece by supplying a processing solvent containing abrasive grains into a liquid into a processing gap between a tool and a workpiece, and which satisfies the following conditions. a. The abrasive grains are composed of magnetic abrasive grains. b. It has a processing solvent storage means for storing the processing solvent. c. A processing solvent supply means for supplying a processing solvent to the processing gap is provided between the processing gap and the processing solvent supply means. d. The processing solvent storage means has a magnetic abrasive collection means for collecting the magnetic abrasive grains using magnetic force.
上記被加工物を加工する加工装置において、上記砥粒を
磁性砥粒で構成するとともに、上記工具の局所に上記磁
性砥粒を集中させる磁性砥粒集中手段を装着することを
特徴とする加工装置。(2) In a processing device that processes the workpiece by supplying abrasive grains to a machining gap between a tool and a workpiece, the abrasive grains are composed of magnetic abrasive grains, and the magnetic abrasive particles are locally applied to the tool. A processing device characterized by being equipped with a magnetic abrasive concentration means for concentrating abrasive particles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2073115A JPH03277466A (en) | 1990-03-22 | 1990-03-22 | Processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2073115A JPH03277466A (en) | 1990-03-22 | 1990-03-22 | Processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03277466A true JPH03277466A (en) | 1991-12-09 |
Family
ID=13508945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2073115A Pending JPH03277466A (en) | 1990-03-22 | 1990-03-22 | Processing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03277466A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI717609B (en) * | 2017-05-25 | 2021-02-01 | 日商日本磁性技術控股股份有限公司 | Abrasive particle recovery system in ultrasonic processing device |
| AU2022201185B1 (en) * | 2021-11-26 | 2023-05-18 | Ik Gujral Punjab Technical University | Multi-energy field nano-lubricant micro-scale bone grinding processing measuring system |
-
1990
- 1990-03-22 JP JP2073115A patent/JPH03277466A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI717609B (en) * | 2017-05-25 | 2021-02-01 | 日商日本磁性技術控股股份有限公司 | Abrasive particle recovery system in ultrasonic processing device |
| AU2022201185B1 (en) * | 2021-11-26 | 2023-05-18 | Ik Gujral Punjab Technical University | Multi-energy field nano-lubricant micro-scale bone grinding processing measuring system |
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