JP7346698B2 - Large-area high-density plasma processing chamber for flat panel displays - Google Patents

Description

[0001] Embodiments of the present disclosure generally relate to process chambers, such as plasma enhanced chemical vapor deposition (PECVD) chambers. In particular, embodiments of the present disclosure relate to lid assemblies for process chambers.

[0002] In the manufacture of solar panels and flat panel displays, thin films are deposited onto substrates such as semiconductor substrates, solar panel substrates, and liquid crystal display (LCD) and/or organic light emitting diode (OLED) substrates. A number of processes have been employed to form electronic devices thereon. Deposition is generally accomplished by introducing a precursor gas into a chamber with a substrate disposed on a temperature-controlled substrate support. The precursor gas is typically directed through a gas distribution plate located near the top of the chamber. Precursor gases within the chamber are energized (e.g., excitation). The excited gas reacts to form a layer of material on the surface of the substrate disposed on the temperature controlled substrate support.

[0003] The size of substrates for forming electronic devices today typically exceeds one square meter in surface area. Achieving film thickness uniformity across these substrates is difficult. Film thickness uniformity becomes more difficult as the size of the substrate increases. Traditionally, a plasma is generated in a conventional chamber to ionize gas atoms and generate deposition gas radicals. They are useful for depositing film layers on substrates of this size using capacitively coupled electrode configurations. Recently, interest in inductively coupled plasma configurations, which have historically been utilized in deposition on round substrates or wafers, has been explored for use in deposition processes for these large substrates. However, inductive coupling utilizes dielectric materials as structural support components. These dielectric materials are used in conventional chambers for these larger substrates, such that atmospheric pressure is present on one side of the large-area structural portion of the chamber, which is the atmospheric side, and on the other side. does not have the structural strength to withstand the structural loads caused by the presence of reduced pressure conditions. Therefore, inductively coupled plasma systems are being developed for plasma processing of large area substrates. However, process uniformity, eg, uniformity of deposition thickness over large substrates, is not as desired.

[0004] Accordingly, what is needed in the art is a chamber lid assembly for use with large area substrates that is configured to improve film thickness uniformity across the deposition surface of the substrate.

[0005] Embodiments described herein provide a chamber lid plate for independently controlling plasma density and gas distribution within the interior space of the chamber. In one embodiment, the lid assembly includes a gas distribution assembly with a plurality of diffuser plates, a portion of the diffuser plates are separated by a dielectric plate, and each of the plurality of diffuser plates is formed in a first plane. a groove and one or more orifice holes formed between a surface of the groove and a second surface opposite the first surface.

[0006] In another embodiment, a lid plate includes a gas distribution assembly comprising a plurality of diffuser plates, a portion of the plurality of diffuser plates is separated by a plurality of dielectric plates and a plurality of separation plates, and a plurality of Each of the diffuser plates includes a groove formed in a first surface and one or more orifice holes formed between a surface of the groove and a second surface opposite the first surface.

[0007] In yet another embodiment, the lid plate includes a gas distribution assembly comprising a plurality of diffuser plates, the plurality of diffuser plates including a plurality of inner diffuser plates and an outer diffuser plate on opposite sides of the plurality of inner diffuser plates. a plurality of inner diffuser plates separated by one or more dielectric plates and a plurality of separation plates, each of the plurality of diffuser plates having a groove formed in a first surface and a surface of the groove; and a second surface opposite the first surface.

[0008] In order that the features of the present disclosure described above may be understood in detail, a more specific description of the present disclosure briefly summarized above may be obtained by reference to the embodiments, and some embodiments. are illustrated in the accompanying drawings. It should be noted, however, that the accompanying drawings depict only exemplary embodiments and therefore should not be considered as limiting the scope of the disclosure, as other equally valid embodiments may also be tolerated.

[0009] FIG. 2 is a schematic cross-sectional view of a chamber according to one embodiment. [0010] FIG. 2 is a schematic cross-sectional view of a plate according to one embodiment. [0011] FIG. 2 is a schematic perspective view of a plate according to one embodiment. [0012] FIG. 3 is a negative perspective view of a plate according to one embodiment. [0013] FIG. 2 is a schematic bottom view of a plate according to one embodiment. [0014] FIG. 2 is a schematic bottom view of one embodiment of a lid plate. [0015] FIG. 6 is a cross-sectional view of the lid plate of FIG. 5. 6 is a sectional view of the lid plate of FIG. 5. FIG. [0016] FIG. 6B is an enlarged cross-sectional view of the lid plate from FIG. 6A. [0017] FIG. 3 is a plan view of the back side of the diffuser plate. [0018] FIG. 9 is a cross-sectional view from FIG. 8 showing various configurations of the diffuser plate. 9 is a cross-sectional view from FIG. 8 showing various configurations of the diffuser plate; FIG. 9 is a cross-sectional view from FIG. 8 showing various configurations of the diffuser plate; FIG. [0019] FIG. 3 is a schematic bottom view of another embodiment of the lid plate.

[0020] For ease of understanding, where possible, the same reference numbers have been used to refer to the same elements common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated into other embodiments without further description.

[0021] Embodiments described herein provide a chamber lid assembly for independently controlling plasma density and gas distribution within the interior space of the chamber. The lid assembly includes a plasma generation system and a gas distribution assembly. The plasma generation system includes a plurality of dielectric plates having lower surfaces oriented with respect to reduced pressure and upper surfaces operable to be oriented with respect to atmospheric pressure. One or more coils are disposed on or above the plurality of dielectric plates. The gas distribution assembly includes a first diffuser and a second diffuser. The first diffuser includes a plurality of first channels intersecting a plurality of second channels of the second diffuser.

[0022] FIG. 1 is a schematic cross-sectional view of a chamber 100, such as a PECVD chamber, that may benefit from embodiments described herein. Suitable chambers are available from Applied Materials, Inc., Calif., Santa Clara, California. The systems described below are exemplary chambers; other chambers, including chambers from other manufacturers, may be used or modified to implement aspects of the present disclosure. I hope you understand that. Chamber 100 includes a chamber body 104, a lid assembly 106, and a substrate support assembly 108. Lid assembly 106 is located at the upper end of chamber body 104.

[0023] Substrate support assembly 108 is disposed at least partially within the interior space of chamber body 104. Substrate support assembly 108 includes a substrate support 110 and a shaft 112. Substrate support 110 has a support surface 118 for supporting substrate 102. In one embodiment, which may be combined with other embodiments described herein, substrate 102 is a large area substrate, such as a substrate having a surface area of about 1 square meter or more. However, substrate 102 is not limited to any particular size or shape. In one aspect, the term "substrate" refers to any polygonal, square, rectangular, curved, or other non-circular workpiece, such as, for example, a glass or polymer substrate used in the manufacture of flat panel displays.

[0024] Substrate support 110 typically includes a heating element (not shown). Substrate support 110 is movably disposed within the interior space of chamber body 104 by a shaft 112 extending through chamber body 104 . In that case, the shaft 112 is connected to a substrate support drive system 114 that connects the raised processing position (as shown) and the opening 116 formed through the chamber body 104. The substrate support 110 is moved to and from a lowered position that facilitates transfer of the substrate to and from the interior space of the chamber body 104 through the substrate support 110 . In one embodiment that may be combined with other embodiments described herein, substrate support drive system 114 rotates shaft 112 and substrate support 110.

[0025] Lid assembly 106 includes a lid plate 122 located at the upper end of chamber body 104. Lid plate 122 includes a gas distribution assembly 124 and a plasma generation system 126. Gas distribution assembly 124 includes one or more first diffuser inlets 130 for a first diffuser 128 disposed within lid plate 122 . In one embodiment that may be combined with other embodiments described herein, lid plate 122 includes an aluminum-containing material. In one embodiment that may be combined with other embodiments described herein, the gas distribution assembly 124 includes one or more second diffusers coupled to a second diffuser 136 disposed within the lid plate 122. including an inlet (shown in FIGS. 3A and 3B). One or more first diffuser inlets 130 can be coupled to a first gas source 134. Each of the one or more first diffuser inlets 130 is in fluid communication with a first channel (shown in FIG. 3B) of the first diffuser 128. One or more second diffuser inlets (shown in FIGS. 3A and 3B) can be coupled to a second gas source 138. Each of the one or more second diffuser inlets (shown in FIGS. 3A and 3B) is in fluid communication with a second channel (shown in FIG. 3B) of the second diffuser 136. In some embodiments, the gas provided by first gas source 134 is the same as the gas provided by second gas source 138.

[0026] The first diffuser 128 supplies one or more first gases from the first gas source 134 to the processing region 120 between the lower surface 160 of the lid plate 122 and the substrate support 110. The one or more first gases are introduced into the processing region 120 through a plurality of first holes (shown in FIG. 4) in each first channel (shown in FIG. 3B) of the first diffuser 128. provided to. A flow controller 141 , such as a mass flow control (MFC) device, is disposed between each of the one or more first diffuser inlets 130 and the first gas source 134 to provide direct flow from the first gas source 134 to each first gas source 134 . of the first gas into the channels (shown in FIG. 3B), thus providing independent control of the first gas flow within the processing region 120. The one or more second gases enter the processing region 120 through a plurality of second holes (shown in FIG. 4) in each second channel (shown in FIG. 3B) of the second diffuser 136. provided to. A flow controller 141 is disposed between each of the one or more second diffuser inlets (shown in FIGS. 3A and 3B) and the second gas source 138 to Controls the flow rate of the second gas into the second channel (shown in FIG. 3B), thus providing independent control of the second gas flow within the processing region 120. A pump 155 is in fluid communication with the processing region 120. Pump 155 is operable to control pressure within processing region 120 and pump gases and byproducts from processing region 120 . In one embodiment, each of the first gas and the second gas is the same gas.

[0027] Plasma generation system 126 includes one or more cavities 140 arranged in parallel within lid plate 122. Each of the one or more cavities 140 includes recesses (shown in FIGS. 2-4) for a plurality of dielectric plates 150. Each of the one or more cavities 140 includes one or more coils 142 disposed on or above the plurality of dielectric plates 150. The plurality of dielectric plates 150 are made of a physical material having the structural strength to withstand the structural loads generated by the presence of atmospheric pressure within the one or more cavities 140 and the presence of reduced pressure within the interior space of the chamber body 104. Provide a barrier. Each of the plurality of dielectric plates 150 includes a lower surface 151 and an upper surface 153 oriented opposite the lower surface 151. Lower surface 151 is oriented relative to (ie, toward) processing region 120 . Thereby, the lower surface 151 of each dielectric plate 150 is exposed to a first pressure within the processing region 120, such as a vacuum. Top surface 153 is oriented opposite (ie, away from) processing region 120 . The top surface 153 of each dielectric plate 150 is thereby exposed to a second pressure outside of the processing region 120, such as atmospheric pressure. In one embodiment that may be combined with other embodiments described herein, the first pressure and the second pressure are different.

[0028] In one embodiment that may be combined with other embodiments described herein, the dielectric plate comprises aluminum oxide (Al ₂ O ₃ ), aluminum nitride (AlN), quartz, zirconium dioxide (ZrO ₂ ), zirconium nitride (ZrN), and a glass material. Each coil 142 has an electrical input terminal 144 connected to a power source 152 and an electrical output terminal 146 connected to ground 154. In one embodiment, which may be combined with other embodiments described herein, each coil 142 connects to the power source 152 via a matching box 148 having a matching circuit to adjust electrical characteristics such as the impedance of the coil 142. It is connected to the. Each coil 142 is configured to generate an electromagnetic field that energizes at least one of the one or more first gases and the second gas into an inductively coupled plasma. Independently connecting each coil 142 of each of one or more cavities 140 to a respective power source 152 allows independent control of the power level and frequency provided to each coil 142. Independent control of the power level and frequency provided to each coil 142 allows the density of the inductively coupled plasma to be adjusted to the process zones 156a, 156b, 156c, 156d (collectively referred to as process zones 156) corresponding to each coil 142. ) can be controlled independently. Controller 158 is coupled to chamber 100 and configured to control aspects of chamber 100 during processing.

[0029] FIG. 2 is a schematic cross-sectional view of the lid plate 122. FIG. 2 shows one or more first diffuser inlets 130 of a first diffuser 128 of a gas distribution assembly 124, as well as one or more cavities 140, each coil 142, for a plurality of dielectric plates 150 of a plasma generation system 126. , each electrical input terminal 144, each electrical output terminal 146, and the recess 201 are shown. In one embodiment that may be combined with other embodiments described herein, the lid assembly 106 includes a plurality of fluid channels (as shown in FIG. 3B) that can be coupled to a heat exchanger (not shown). including heat exchange systems. A heat exchanger, such as a cooler, is in fluid communication with each fluid channel via fluid inlet 202 and fluid outlet 204 of the plurality of fluid channels (shown in FIG. 3B). Thereby, the lid plate 122 is maintained at a predetermined temperature. Each coil 142 has one or more turns.

[0030] FIG. 3A is a schematic perspective view of the lid plate 122 without the plurality of dielectric plates 150 and each coil 142. FIG. 3B is a negative perspective view of lid plate 122 without multiple dielectric plates 150 and coils 142. FIG. Lid plate 122 includes a plurality of first channels 302. Each of the first channels 302 is located or formed within the lid plate 122. Each first channel of the plurality of first channels 302 is disposed adjacent one of the recesses 201. Each of the recesses 201 is between two adjacent first channels 302 located within the lid plate 122. Each of the first channels 302 is in fluid communication with at least one first diffuser inlet of the one or more first diffuser inlets 130.

[0031] In one embodiment that may be combined with other embodiments described herein, the lid plate 122 includes a plurality of second channels 304 disposed or formed within the lid plate 122. . Each second channel of the plurality of second channels 304 is disposed between two adjacent cavities 140 of the one or more cavities 140. Each of the second channels 304 is in fluid communication with at least one second diffuser of one or more second diffuser inlets 306 formed within the lid plate 122 . In another embodiment that may be combined with other embodiments described herein, the lid plate 122 includes a plurality of fluid channels 308 of a heat exchange system that can be coupled to a heat exchanger (not shown). . A heat exchanger, such as a cooler, is in fluid communication with the plurality of fluid channels 308 via fluid inlet 202 and fluid outlet 204. A plurality of fluid channels 308 are disposed adjacent one or more cavities 140 and a recess external to recess 201 .

[0032] FIG. 4 is a schematic bottom view of the lid plate 122. As shown in FIG. 4, each of the first channels 302 and each of the second channels 304 intersect. In one embodiment that may be combined with other embodiments described herein, each of the first channels 302 is orthogonal to each of the second channels 304. Each of the dielectric plates 150 is disposed adjacent to the first channel 302 and disposed adjacent to at least one of the second channels 304. Each first channel of the plurality of first channels 302 includes a plurality of first holes 402 extending through the lid plate 122. The flow controller 141 controls the flow rate of the first gas from the first gas source 134 through the plurality of first holes 402 . A first zone 406a, 406b, 406c, 406d, 406e, 406f, 406g of the processing region 120 corresponding to each first channel of the plurality of first channels 302 by controlling the flow rate of the first gas. , 406h, 406i (collectively referred to as first zone 406). In one embodiment having a second diffuser 136, which may be combined with other embodiments described herein, each second channel of the plurality of second channels 304 extends through the lid plate 122. A plurality of second holes 404 are included. Flow controller 141 controls the flow rate of second gas from second gas source 138 through second plurality of holes 404 . By controlling the flow rate of the second gas, the second zones 408a, 408b, 408c (collectively the second The second gas flow within zone 408 (referred to as zone 408) can be independently controlled.

[0033] FIG. 5 is a schematic bottom view of one embodiment of the lid plate 122. The lid plate 122 in FIG. 5 schematically shows the structure of the lower surface 160 of the lid plate 122. As shown in FIG. Although first zone 406 and second zone 408 are not shown, lid plate 122 may include one or more zones as described above.

[0034] Lid plate 122 includes a plurality of diffuser plates, shown as outer diffuser plate 500 and inner diffuser plate 505. Each of the inner diffuser plates 505 is separated by and/or disposed between a dielectric plate 150 and/or a separation plate 510. Each of the outer diffuser plates 500 has a dielectric plate 150 and one or more isolation plates 510 on one side thereof.

[0035] Each of outer diffuser plate 500, inner diffuser plate 505, and separation plate 510 may be made of a conductive material such as aluminum.

[0036] In this embodiment, separation plate 510 and each of outer diffuser plate 500 and inner diffuser plate 505 include a plurality of fasteners 515 and 520, respectively. Each of fasteners 515 and 520 may be made of ceramic or metallic materials. Each of the outer diffuser plate 500 and the inner diffuser plate 505 may be integral (ie, unitary construction), or each of the outer diffuser plate 500 and the inner diffuser plate 505 may include multiple parts. Similarly, dielectric plate 150 may include a single piece of material or may include multiple plates. In embodiments where dielectric plate 150 is a plurality of plates, each dielectric plate 150 may be coupled to lid plate 122 using fasteners (not shown) and/or may be coupled to isolation plate 510 and/or Alternatively, it may be coupled to the outer diffuser plate 500 and the inner diffuser plate 505.

[0037] Each of outer diffuser plate 500 and inner diffuser plate 505 includes one or more orifice holes 525 (eg, first hole 402). Each of the one or more orifice holes 525 is in fluid communication with a corresponding one of the first channels 302 (also shown in FIG. 3B). In some embodiments, each separation plate 510 includes one or more orifice holes 530 (eg, second hole 404). Each of the one or more orifice holes 530 of the separation plate 510 is in fluid communication with a corresponding one of the second channels 304 (also shown in FIG. 3B).

[0038] FIGS. 6A and 6B are cross-sectional views of the lid plate 122 from FIG. 5. In FIG. 6A, a portion of an outer diffuser plate 505 and an inner diffuser plate 500 are shown along with a portion of a separation plate 510 therebetween. In FIG. 6B, one of the inner plates 505 is shown along its length.

[0039] FIG. 7 is an enlarged cross-sectional view of the lid plate 122 from FIG. 6A. One of the inner diffuser plates 505 is shown, as well as a portion of two separation plates 510. Inner diffuser plate 505 includes a groove 700 in fluid communication with one of the plurality of first channels 302 as well as one or more orifice holes 525. Although not shown, other of the inner diffuser plates 505 may be similarly configured. In addition, outer diffuser plate 500 includes a groove 700 as well as one or more orifice holes 525.

[0040] Inner diffuser plate 505 is coupled to body 705 of lid plate 122 by fasteners 520. Each fastener 520 is disposed within a respective countersink 710 on either side of the groove 700 and one or more orifice holes 525. Similarly, separation plate 510 is coupled to body 705 by fasteners 715 (only one shown). Fastener 715 is positioned within countersink 720 . Fasteners 715 and 520 extend within their respective countersinks to a (lower) surface 725A of separation plate 510 and a (lower) surface 725B of inner diffuser plate 505. Surface 725A and surface 725B are planar or flat. The surfaces are thereby coplanar with each other. Additionally, the extensions of fasteners 715 and 520 within their respective countersinks exhibit flat or planar undersides (i.e., no protrusions or depressions). This promotes more uniform plasma formation. Although not shown, each dielectric plate 150 (ie, lower surface 151) is also coplanar with surface 725B.

[0041] Groove 700 and first channel 302 are fluidly sealed by an elastomeric seal 730 disposed within a groove 735 formed within body 705. Resilient seal 730 is sized to surround groove 700 and first channel 302 . Resilient seal 730 may be an elongated O-ring. Resilient seal 730 is compressed against sealing surface 740 of inner diffuser plate 505. Sealing surface 740 is smoother than surface 725B and the remainder of back side 745, as well as other outer surfaces of inner diffuser plate 505. In some embodiments, the sealing surface 740 includes a surface finish of approximately 16 (root mean square (RMS)) or 16 microinches (average surface roughness (Ra)).

[0042] FIG. 8 is a plan view of the back side 745 of the diffuser plate 800. Diffuser plate 800 may be one of outer diffuser plates 500 or one of inner diffuser plates 505.

[0043] Diffuser plate 800 includes a length 805 that is greater than the length or width of a substrate (not shown). In one example, length 805 is about 5 feet to about 6 feet, or longer. A sealing surface 740 is shown surrounding groove 700. Additionally, a plurality of holes 810 are arranged along the length 805 of the diffuser plate 800. Each hole 810 is adapted to receive a fastener 520 (shown in FIG. 7). Hole 810 is formed between edge 815 of diffuser plate 800 and sealing surface 740. Each fastener 520 is a threaded screw having a tool interface, such as a hex head or recessed interface, that can be used with a screwdriver, hex key, driver, etc. that can be used with a bit commercially available under TORX®. Or a bolt.

[0044] Although not shown in this figure, an orifice hole 525 is formed within groove 700 at each of a plurality of orifice locations 825. Length 820 indicates where orifice hole 525 begins and ends along groove 700. Length 820 is shorter than length 805. Orifice location 825 is located within length 820. Orifice locations 825 may be at equal or unequal pitches along length 820. The pitch between orifice locations 825 may be about 0.25 inch to about 1 inch.

[0045] FIGS. 9A-9C are cross-sectional views from FIG. 8 showing various configurations of diffuser plate 800. In particular, FIGS. 9A-9C illustrate variations in the profile of groove 700 and/or orifice hole 525.

[0046] In FIG. 9A, a diffuser plate 900A is shown and includes a groove 700 having a semi-circular profile. Additionally, three orifice holes 525 are shown formed between first surface 905 and surface 910 of groove 700. Surface 910 of groove 700 is a radius surface or a curved surface. Although three orifice holes 525 are shown, the number of orifice holes may be from one to five or more at each of the orifice locations 825 shown in FIG.

[0047] The orifice holes 525 shown in FIG. 9A include a central orifice hole 915 and two outer orifice holes 920. The diameters of central orifice hole 915 and outer orifice hole 920 may be the same or different. The diameter of some or all of central orifice hole 915 and outer orifice hole 920 may be about 0.008 inch to about 0.04 inch. The lengths of the outer orifice holes 920 may be the same or substantially equal. On the other hand, the length of the central orifice hole 915 is shorter than that of the outer orifice hole 920.

[0048] Central orifice hole 915 is provided along axis 925 that is at an angle of approximately 90 degrees from first surface 905. Outer orifice hole 920 is formed at an acute angle 930 from axis 925 . Acute angle 930 may be about 20 degrees to about 50 degrees, such as about 35 degrees to about 45 degrees, such as about 40 degrees, from axis 925.

[0049] Although not shown, other orifice holes 525 (FIG. 8) at other orifice locations 825 along length 820 are similar to the central orifice hole 915 and outer orifice holes 920 shown in FIG. 9A. , may be the same or different. Additionally, surface 910 may be constant along length 805 (FIG. 8). However, surface 910 may vary along length 805. For example, the grooves 700 may be deeper along the length 805 in the central portion of the diffuser plate 800 and shallower in the end portions of the diffuser plate 800.

[0050] FIG. 9B shows a diffuser plate 900B that is substantially similar to diffuser plate 900A shown in FIG. 9A with the following exceptions. Groove 700 has a square-shaped profile and outer orifice hole 920 includes a flared portion 935. Flared portion 935 connects outer orifice hole 920 to face 910 of groove 700. Groove 700 includes two sides 940 extending at perpendicular angles from surface 910.

[0051] FIG. 9C shows a diffuser plate 900C that is substantially similar to the diffuser plate 900A shown in FIG. 9A with the following exceptions. Diffuser plate 900C includes a single orifice hole 945 at orifice location 825. The configuration of diffuser plate 900C may be advantageously utilized as outer diffuser plate 500 shown in FIG. The single orifice hole 945 may be angled at an acute angle 930 to direct gas toward the center of the substrate 102 (shown in FIG. 1).

[0052] FIG. 10 is a schematic bottom view of another embodiment of the lid plate 122. Although the outer diffuser plate 500 and the inner diffuser plate 505 are shown as a single integral piece in other figures, the lid plate 122 shown in FIG. 10 includes multiple segmented diffuser plates. They are shown as a first plurality of outer diffuser plates 1000 and a second plurality of inner diffuser plates 1005. A first plurality of outer diffuser plates 1000 and a second plurality of inner diffuser plates 1005 are arranged in a plurality of rows 1010. Each row 1010 is substantially parallel to other rows 1010.

[0053] The first plurality of outer diffuser plates 1000 includes two or more diffuser segments 1015 and the second plurality of inner diffuser plates 1005 includes two or more diffuser segments 1020. Diffuser segment 1015 and diffuser segment 1020 are each similar to diffuser plate 800 shown in FIG. 8 and diffuser plates 900A-900C shown in FIGS. 9A-9C, except that they are shorter in length. may be constructed. The shorter lengths of outer diffuser plate 1000 and inner diffuser plate 1005 can minimize their thermal expansion and contraction effects. Additionally, the flow of gas through each of diffuser segments 1015 and 1020 may be independently controlled.

[0054] In summary, a chamber lid assembly is provided for independently controlling plasma density and gas distribution within an interior space of a chamber. Independently controlling the power level and frequency provided to each coil allows the density of the inductively coupled plasma to be independently controlled within the process zone corresponding to each coil. Controlling the flow rate of the first gas provides independent control of the flow of the first gas within a first zone of the processing region corresponding to each first channel of the plurality of first channels. . Controlling the flow rate of the second gas provides independent control of the flow of the second gas within a second zone of the processing region corresponding to each second channel of the plurality of second channels. . In some embodiments, uniform gas flow across the processing region may be desired. However, in other embodiments, the gas flow across the processing region may not be uniform. Non-uniform gas flow may be desired due to some physical structure(s) and/or geometry of the chamber.

[0055] Although the above description is directed to embodiments of the present disclosure, other embodiments and further embodiments of the present disclosure may be devised without departing from the essential scope of the present disclosure, and the present disclosure The scope of is defined by the following claims.

Claims (16)

A lid plate comprising a gas distribution assembly comprising a plurality of diffuser plates, the lid plate comprising:
A portion of the diffuser plate is separated by a dielectric plate, and each of the plurality of diffuser plates includes a groove formed in a first surface, and a surface opposite the first surface from the groove surface. one or more orifice holes formed between the second surface of the
The lid plate, wherein the one or more orifice holes include orifice holes extending from the surface of the groove in a direction at an angle to a thickness direction of the diffuser plate. The lid plate of claim 1, wherein the plurality of diffuser plates further comprises a plurality of inner diffuser plates and outer diffuser plates on opposite sides of the inner diffuser plates. 3. The lid plate of claim 2, wherein each of the plurality of inner diffuser plates includes a plurality of orifice locations along its length, and each of the plurality of orifice locations has the one or more orifice holes. 4. The lid plate of claim 3, wherein the outer diffuser plate includes a plurality of orifice locations along its length, each of the plurality of orifice locations having a single orifice hole. 3. The lid plate of claim 2, wherein the one or more orifice holes include a central orifice hole and two outer orifice holes on either side of the central orifice hole. 6. The lid plate of claim 5, wherein the two outer orifice holes are angled relative to the central orifice hole. The lid plate of claim 1, wherein the groove includes a semicircular profile. The lid plate of claim 1, wherein the groove includes a rectangular profile. The lid plate of claim 1, wherein the groove includes a depth that varies along its length. A lid plate comprising a gas distribution assembly comprising a plurality of diffuser plates, wherein a portion of the plurality of diffuser plates is separated by a plurality of dielectric plates and a plurality of separation plates, each of the plurality of diffuser plates comprising: , a groove formed in a first surface, and one or more orifice holes formed between a surface of the groove and a second surface opposite the first surface;
The lid plate, wherein the one or more orifice holes include orifice holes extending from the surface of the groove in a direction at an angle to a thickness direction of the diffuser plate. 11. The lid plate of claim 10, wherein each of the plurality of diffuser plates is oriented in a plurality of parallel rows and each of the plurality of separation plates is oriented in a plurality of columns. 11. The lid plate of claim 10, wherein the groove includes a semicircular profile. 11. The lid plate of claim 10, wherein the groove includes a rectangular profile. 11. The lid plate of claim 10, wherein the groove includes a depth that varies along its length. A lid plate comprising a gas distribution assembly comprising a plurality of diffuser plates, the plurality of diffuser plates comprising a plurality of inner diffuser plates and an outer diffuser plate on either side of the inner diffuser plate, the plurality of inner diffuser plates The plates are separated by one or more dielectric plates and a plurality of separation plates , and each of the plurality of diffuser plates has a groove formed in a first plane, and a groove between the groove plane and the first plane. one or more orifice holes formed between the surface and a second surface opposite the surface;
The lid plate, wherein the one or more orifice holes include orifice holes extending from the surface of the groove in a direction at an angle to a thickness direction of the diffuser plate. The lid plate according to any one of claims 1 to 15, wherein the angle is an acute angle.

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