JP7320932B2 - 成膜装置及び部品剥離装置 - Google Patents

成膜装置及び部品剥離装置 Download PDF

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Publication number
JP7320932B2
JP7320932B2 JP2018190780A JP2018190780A JP7320932B2 JP 7320932 B2 JP7320932 B2 JP 7320932B2 JP 2018190780 A JP2018190780 A JP 2018190780A JP 2018190780 A JP2018190780 A JP 2018190780A JP 7320932 B2 JP7320932 B2 JP 7320932B2
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Japan
Prior art keywords
protective sheet
sheet
component
electronic component
mounting table
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JP2018190780A
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English (en)
Japanese (ja)
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JP2019091887A (ja
Inventor
寿 西垣
端生 鈴木
浩司 吉村
優 神戸
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to KR1020180136140A priority Critical patent/KR102176972B1/ko
Priority to TW107139753A priority patent/TWI688037B/zh
Priority to CN202110002323.4A priority patent/CN112831761B/zh
Priority to CN202111090638.5A priority patent/CN113774320B/zh
Priority to CN202110002315.XA priority patent/CN112795877B/zh
Priority to CN202110002332.3A priority patent/CN112795878B/zh
Priority to CN201811329890.5A priority patent/CN109763105B/zh
Publication of JP2019091887A publication Critical patent/JP2019091887A/ja
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Publication of JP7320932B2 publication Critical patent/JP7320932B2/ja
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Physical Vapour Deposition (AREA)
JP2018190780A 2017-11-10 2018-10-09 成膜装置及び部品剥離装置 Active JP7320932B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
KR1020180136140A KR102176972B1 (ko) 2017-11-10 2018-11-07 성막 장치 및 부품 박리 장치
CN202110002323.4A CN112831761B (zh) 2017-11-10 2018-11-09 成膜装置
CN202111090638.5A CN113774320B (zh) 2017-11-10 2018-11-09 成膜装置及零件剥离装置
CN202110002315.XA CN112795877B (zh) 2017-11-10 2018-11-09 成膜装置
TW107139753A TWI688037B (zh) 2017-11-10 2018-11-09 成膜裝置及零件剝離裝置
CN202110002332.3A CN112795878B (zh) 2017-11-10 2018-11-09 成膜装置及埋入处理装置
CN201811329890.5A CN109763105B (zh) 2017-11-10 2018-11-09 成膜装置及零件剥离装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017217787 2017-11-10
JP2017217787 2017-11-10

Publications (2)

Publication Number Publication Date
JP2019091887A JP2019091887A (ja) 2019-06-13
JP7320932B2 true JP7320932B2 (ja) 2023-08-04

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ID=66837495

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JP2018190780A Active JP7320932B2 (ja) 2017-11-10 2018-10-09 成膜装置及び部品剥離装置

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JP (1) JP7320932B2 (zh)
TW (1) TWI688037B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7000129B2 (ja) * 2017-11-15 2022-01-19 芝浦メカトロニクス株式会社 成膜装置
JP6935306B2 (ja) * 2017-11-16 2021-09-15 芝浦メカトロニクス株式会社 成膜装置
US11249008B2 (en) * 2019-06-28 2022-02-15 Toshiba Mitsubishi-Electric Industrial Systems Corporation Peeling and grasping apparatus, peeling inspection apparatus, and ultrasonic vibration bonding system
JP6942908B1 (ja) * 2020-11-13 2021-09-29 信越エンジニアリング株式会社 ワーク粘着チャック装置及びワーク貼り合わせ機

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003179126A (ja) 2001-09-27 2003-06-27 Toshiba Corp 粘着性テープの剥離機構、粘着性テープの剥離装置、粘着性テープの剥離方法、半導体チップのピックアップ装置、半導体チップのピックアップ方法、半導体装置の製造方法及び半導体装置の製造装置
JP2008135662A (ja) 2006-11-29 2008-06-12 Nitto Denko Corp 粘着シートの貼付・剥離方法及び粘着シートの貼付装置並びに粘着シートの剥離装置
JP2011187827A (ja) 2010-03-10 2011-09-22 Mitsubishi Electric Corp 保護テープ剥離方法および保護テープ剥離装置
JP2015167205A (ja) 2014-03-04 2015-09-24 株式会社ディスコ 保護テープ剥離装置及び保護テープ剥離方法
JP2016054169A (ja) 2014-09-02 2016-04-14 リンテック株式会社 整列装置および整列方法
WO2017033808A1 (ja) 2015-08-26 2017-03-02 株式会社アルバック 電子部品の製造方法および処理システム
WO2017038466A1 (ja) 2015-09-02 2017-03-09 株式会社アルバック ワーク保持体および成膜装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3504543B2 (ja) * 1999-03-03 2004-03-08 株式会社日立製作所 半導体素子の分離方法およびその装置並びに半導体素子の搭載方法
JP4538242B2 (ja) * 2004-01-23 2010-09-08 株式会社東芝 剥離装置及び剥離方法
JP4485248B2 (ja) * 2004-04-28 2010-06-16 リンテック株式会社 剥離装置及び剥離方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003179126A (ja) 2001-09-27 2003-06-27 Toshiba Corp 粘着性テープの剥離機構、粘着性テープの剥離装置、粘着性テープの剥離方法、半導体チップのピックアップ装置、半導体チップのピックアップ方法、半導体装置の製造方法及び半導体装置の製造装置
JP2008135662A (ja) 2006-11-29 2008-06-12 Nitto Denko Corp 粘着シートの貼付・剥離方法及び粘着シートの貼付装置並びに粘着シートの剥離装置
JP2011187827A (ja) 2010-03-10 2011-09-22 Mitsubishi Electric Corp 保護テープ剥離方法および保護テープ剥離装置
JP2015167205A (ja) 2014-03-04 2015-09-24 株式会社ディスコ 保護テープ剥離装置及び保護テープ剥離方法
JP2016054169A (ja) 2014-09-02 2016-04-14 リンテック株式会社 整列装置および整列方法
WO2017033808A1 (ja) 2015-08-26 2017-03-02 株式会社アルバック 電子部品の製造方法および処理システム
WO2017038466A1 (ja) 2015-09-02 2017-03-09 株式会社アルバック ワーク保持体および成膜装置

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TWI688037B (zh) 2020-03-11
JP2019091887A (ja) 2019-06-13
TW201919144A (zh) 2019-05-16

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