JP7320932B2 - 成膜装置及び部品剥離装置 - Google Patents
成膜装置及び部品剥離装置 Download PDFInfo
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- JP7320932B2 JP7320932B2 JP2018190780A JP2018190780A JP7320932B2 JP 7320932 B2 JP7320932 B2 JP 7320932B2 JP 2018190780 A JP2018190780 A JP 2018190780A JP 2018190780 A JP2018190780 A JP 2018190780A JP 7320932 B2 JP7320932 B2 JP 7320932B2
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
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Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020180136140A KR102176972B1 (ko) | 2017-11-10 | 2018-11-07 | 성막 장치 및 부품 박리 장치 |
CN202110002323.4A CN112831761B (zh) | 2017-11-10 | 2018-11-09 | 成膜装置 |
CN202111090638.5A CN113774320B (zh) | 2017-11-10 | 2018-11-09 | 成膜装置及零件剥离装置 |
CN202110002315.XA CN112795877B (zh) | 2017-11-10 | 2018-11-09 | 成膜装置 |
TW107139753A TWI688037B (zh) | 2017-11-10 | 2018-11-09 | 成膜裝置及零件剝離裝置 |
CN202110002332.3A CN112795878B (zh) | 2017-11-10 | 2018-11-09 | 成膜装置及埋入处理装置 |
CN201811329890.5A CN109763105B (zh) | 2017-11-10 | 2018-11-09 | 成膜装置及零件剥离装置 |
Applications Claiming Priority (2)
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JP2017217787 | 2017-11-10 | ||
JP2017217787 | 2017-11-10 |
Publications (2)
Publication Number | Publication Date |
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JP2019091887A JP2019091887A (ja) | 2019-06-13 |
JP7320932B2 true JP7320932B2 (ja) | 2023-08-04 |
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ID=66837495
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2018190780A Active JP7320932B2 (ja) | 2017-11-10 | 2018-10-09 | 成膜装置及び部品剥離装置 |
Country Status (2)
Country | Link |
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JP (1) | JP7320932B2 (zh) |
TW (1) | TWI688037B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7000129B2 (ja) * | 2017-11-15 | 2022-01-19 | 芝浦メカトロニクス株式会社 | 成膜装置 |
JP6935306B2 (ja) * | 2017-11-16 | 2021-09-15 | 芝浦メカトロニクス株式会社 | 成膜装置 |
US11249008B2 (en) * | 2019-06-28 | 2022-02-15 | Toshiba Mitsubishi-Electric Industrial Systems Corporation | Peeling and grasping apparatus, peeling inspection apparatus, and ultrasonic vibration bonding system |
JP6942908B1 (ja) * | 2020-11-13 | 2021-09-29 | 信越エンジニアリング株式会社 | ワーク粘着チャック装置及びワーク貼り合わせ機 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003179126A (ja) | 2001-09-27 | 2003-06-27 | Toshiba Corp | 粘着性テープの剥離機構、粘着性テープの剥離装置、粘着性テープの剥離方法、半導体チップのピックアップ装置、半導体チップのピックアップ方法、半導体装置の製造方法及び半導体装置の製造装置 |
JP2008135662A (ja) | 2006-11-29 | 2008-06-12 | Nitto Denko Corp | 粘着シートの貼付・剥離方法及び粘着シートの貼付装置並びに粘着シートの剥離装置 |
JP2011187827A (ja) | 2010-03-10 | 2011-09-22 | Mitsubishi Electric Corp | 保護テープ剥離方法および保護テープ剥離装置 |
JP2015167205A (ja) | 2014-03-04 | 2015-09-24 | 株式会社ディスコ | 保護テープ剥離装置及び保護テープ剥離方法 |
JP2016054169A (ja) | 2014-09-02 | 2016-04-14 | リンテック株式会社 | 整列装置および整列方法 |
WO2017033808A1 (ja) | 2015-08-26 | 2017-03-02 | 株式会社アルバック | 電子部品の製造方法および処理システム |
WO2017038466A1 (ja) | 2015-09-02 | 2017-03-09 | 株式会社アルバック | ワーク保持体および成膜装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3504543B2 (ja) * | 1999-03-03 | 2004-03-08 | 株式会社日立製作所 | 半導体素子の分離方法およびその装置並びに半導体素子の搭載方法 |
JP4538242B2 (ja) * | 2004-01-23 | 2010-09-08 | 株式会社東芝 | 剥離装置及び剥離方法 |
JP4485248B2 (ja) * | 2004-04-28 | 2010-06-16 | リンテック株式会社 | 剥離装置及び剥離方法 |
-
2018
- 2018-10-09 JP JP2018190780A patent/JP7320932B2/ja active Active
- 2018-11-09 TW TW107139753A patent/TWI688037B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003179126A (ja) | 2001-09-27 | 2003-06-27 | Toshiba Corp | 粘着性テープの剥離機構、粘着性テープの剥離装置、粘着性テープの剥離方法、半導体チップのピックアップ装置、半導体チップのピックアップ方法、半導体装置の製造方法及び半導体装置の製造装置 |
JP2008135662A (ja) | 2006-11-29 | 2008-06-12 | Nitto Denko Corp | 粘着シートの貼付・剥離方法及び粘着シートの貼付装置並びに粘着シートの剥離装置 |
JP2011187827A (ja) | 2010-03-10 | 2011-09-22 | Mitsubishi Electric Corp | 保護テープ剥離方法および保護テープ剥離装置 |
JP2015167205A (ja) | 2014-03-04 | 2015-09-24 | 株式会社ディスコ | 保護テープ剥離装置及び保護テープ剥離方法 |
JP2016054169A (ja) | 2014-09-02 | 2016-04-14 | リンテック株式会社 | 整列装置および整列方法 |
WO2017033808A1 (ja) | 2015-08-26 | 2017-03-02 | 株式会社アルバック | 電子部品の製造方法および処理システム |
WO2017038466A1 (ja) | 2015-09-02 | 2017-03-09 | 株式会社アルバック | ワーク保持体および成膜装置 |
Also Published As
Publication number | Publication date |
---|---|
TWI688037B (zh) | 2020-03-11 |
JP2019091887A (ja) | 2019-06-13 |
TW201919144A (zh) | 2019-05-16 |
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