JP7320793B2 - UV curable resin composition, organic EL light emitting device, and touch panel - Google Patents

Description

The present disclosure provides an ultraviolet curable resin composition, an organic EL light emitting device and a touch panel. Specifically, the present disclosure provides an ultraviolet curable resin composition suitable for producing a sealing material for an organic EL light emitting device, an organic EL light emitting device comprising the sealing material, and a touch panel comprising the organic EL light emitting device. Regarding.

In a top emission type organic EL light emitting device, for example, an organic EL element is arranged on a supporting substrate, a transparent substrate is arranged so as to face the supporting substrate, and a transparent sealing material is provided between the supporting substrate and the transparent substrate. be filled. The sealing material is produced, for example, by an inkjet method.

Patent Literature 1 discloses an example of an ultraviolet curable resin composition that is used to produce a sealing material for an organic EL light emitting device and that is molded by an inkjet method. Specifically, Patent Document 1 discloses an ink composition containing a polyethylene glycol di(meth)acrylate monomer, a mono(meth)acrylate monomer, a polyfunctional (meth)acrylate cross-linking agent, and a cross-linkable photopolymerization initiator. things are disclosed.

WO2017/39857

In recent years, organic EL light-emitting devices have been applied to displays (touch panels) equipped with touch sensors. In a touch panel, for example, a touch sensor is arranged on a transparent substrate of an organic EL light emitting device. When using a touch panel, the touch sensor may malfunction. The inventors have found that the high dielectric constant of the sealing material causes malfunction.

An object of the present disclosure is to provide an ultraviolet curable resin composition, an organic EL light-emitting device, and a touch panel that facilitate the reduction of the dielectric constant of the cured product.

An ultraviolet curable resin composition according to one aspect of the present disclosure includes an acrylic compound and a photopolymerization initiator (B). The UV-curable resin composition has a cured product with a dielectric constant of 3.0 or less at a frequency of 100 kHz. The ultraviolet curable resin composition is for encapsulating an organic EL element.

An organic EL light-emitting device according to an aspect of the present disclosure includes an organic EL element and a sealing material that covers the organic EL element, and the sealing material is a cured product of the ultraviolet-curable resin composition.

A touch panel according to an aspect of the present disclosure includes the above organic EL light emitting device and a touch sensor.

Advantageous Effects of Invention According to the present disclosure, it is possible to provide an ultraviolet curable resin composition, an organic EL light emitting device, and a touch panel that facilitate the reduction of the dielectric constant of a cured product.

FIG. 1A is a schematic cross-sectional view showing a first example of an organic EL light-emitting device according to one embodiment of the present disclosure. FIG. 1B is a schematic cross-sectional view showing a second example of the same organic EL light emitting device. FIG. 2 is a schematic cross-sectional view showing a touch panel according to an embodiment of the present disclosure;

1. Overview An ultraviolet curable resin composition for organic EL sealing according to an embodiment of the present disclosure (hereinafter also referred to as resin composition (X)) includes an acrylic compound (A) and a photopolymerization initiator (B). Resin composition (X) has a dielectric constant of 3.0 or less when cured at a frequency of 100 kHz. The resin composition (X) is molded by an inkjet method. When the cured product of the resin composition (X) has a dielectric constant of 3.0 or less, the cured product of the resin composition (X) can have a low dielectric constant. Thereby, malfunction of the touch sensor provided with the sealing material made of the cured product of the resin composition (X) can be suppressed.

In the present embodiment, the acrylic compound (A) is at least one compound selected from the group consisting of a compound having an isobornyl skeleton, a compound having a dicyclopentanyl skeleton, and a compound having a 3,3,5-trimethylcyclohexyl skeleton. It preferably contains the component compound (z). By including the compound (z) in the acrylic compound (A), the cured product of the resin composition (X) can be easily made to have a low dielectric constant. can be In addition, since the dielectric constant of the cured product can be lowered by the compound (z) in the acrylic compound (A), the viscosity of the resin composition (X) is less likely to increase even when the dielectric constant of the cured product is lowered, and the resin composition ( X) is easily molded by the inkjet method.

2. Details Hereinafter, the organic EL light-emitting device 1, the method for manufacturing the organic EL light-emitting device 1, the touch panel 100, and the ultraviolet curable resin composition for organic EL sealing according to the present embodiment will be described in detail.

2-1. Organic EL Light Emitting Device The organic EL light emitting device 1 of the first example shown in FIG. 1A and the organic EL light emitting device 1 of the second example shown in FIG. Prepare. This sealing material 5 is formed from the resin composition (X). The configurations of the organic EL light-emitting device 1 of the first example and the organic EL light-emitting device 1 of the second example will be described below.

(1) Organic EL Light Emitting Device of First Example The configuration of an organic EL light emitting device 1 of a first example will be described with reference to FIG. 1A.

The organic EL light emitting device 1 of the first example is of the top emission type. The organic EL light emitting device 1 of the first example includes a supporting substrate 2, a transparent substrate 3 facing the supporting substrate 2 with a gap therebetween, an organic EL element 4 on the surface of the supporting substrate 2 facing the transparent substrate 3, and A sealing material 5 filled between the support substrate 2 and the transparent substrate 3 is provided. Further, the organic EL light emitting device 1 of the first example includes a passivation layer 6 that covers the surface of the support substrate 2 facing the transparent substrate 3 and the organic EL elements 4 .

The support substrate 2 is made of, for example, a resin material or glass, but the material of the support substrate 2 is not particularly limited. The support substrate 2 may be plate-like or film-like.

The transparent substrate 3 is made of a translucent material. The transparent substrate 3 is made of glass or transparent resin, for example, but the material of the support substrate 2 is not particularly limited. The transparent substrate 3 may be plate-like or film-like.

The organic EL element 4 is also called an organic light emitting diode. The organic EL element 4 includes, for example, a pair of electrodes and an organic light-emitting layer between the electrodes.

The sealing material 5 is formed from the resin composition (X). The thickness of the sealing material 5 is, for example, 5 μm or more and 50 μm or less.

Passivation layer 6 is preferably made of silicon nitride or silicon oxide.

(2) Organic EL Light Emitting Device of Second Example The configuration of an organic EL light emitting device 1 of a second example will be described with reference to FIG. 1B. Elements common to those in the first example shown in FIG. 1A are assigned the same reference numerals as those in FIG. 1A, and detailed description thereof will be omitted as appropriate.

The organic EL light emitting device 1 of the second example is also of the top emission type. The organic EL light emitting device 1 of the second example includes a support substrate 2, a transparent substrate 3 facing the support substrate 2 with a gap therebetween, an organic EL element 4 on the surface of the support substrate 2 facing the transparent substrate 3, and A sealing material 5 covering the organic EL element 4 is provided. Further, the organic EL light-emitting device 1 of the second example includes a passivation layer 6 covering the organic EL elements 4 .

The organic EL element 4 has a pair of electrodes 41 and 43 and an organic light emitting layer 42 between the electrodes 41 and 43 . The organic light emitting layer 42 includes, for example, a hole injection layer 421, a hole transport layer 422, a light emitting layer 423 and an electron transport layer 424, and these layers are laminated in the order described above.

In the organic EL light emitting device 1 of the second example, a plurality of organic EL elements 4 form an array 9 (hereinafter also referred to as an element array 9) on the support substrate 2. As shown in FIG. The element array 9 has partition walls 7 . The partition wall 7 is located on the support substrate 2 and partitions between two adjacent organic EL elements 4 . The partition wall 7 is produced by, for example, molding a photosensitive resin material by a photography method. The element array 9 also includes connection wirings 8 that electrically connect the electrodes 43 and the electron transport layers 424 of the adjacent organic EL elements 4 to each other. The connection wiring 8 is provided on the partition wall 7 .

Passivation layer 6 includes a first passivation layer 61 and a second passivation layer 62 . The first passivation layer 61 covers the organic EL elements 4 by covering the element array 9 while being in direct contact with the element array 9 . The second passivation layer 62 is arranged on the side opposite to the element array 9 with respect to the first passivation layer 61, and a space is provided between the second passivation layer 62 and the first passivation layer 61. ing.

A sealing material 5 is filled between the first passivation layer 61 and the second passivation layer 62 . That is, the first passivation layer 61 is interposed between the organic EL element 4 and the sealing material 5 covering the organic EL element 4 . The sealing material 5 can be formed from the resin composition (X).

A second sealing material 52 is filled between the second passivation layer 62 and the transparent substrate 3 . The second sealing material 52 is made of, for example, a transparent resin material. The material of the second sealing material 52 is not particularly limited. The material of the second sealing material 52 may be the same as or different from that of the sealing material 5 .

2-2. Method for Manufacturing Organic EL Light Emitting Device As described above, the organic EL light emitting device 1 includes the organic EL element 4 and the encapsulant 5 made of the resin composition (X). For example, the encapsulant 5 can be produced by molding the resin composition (X) by an inkjet method and then curing the resin composition (X) by irradiating it with ultraviolet rays.

In order for the resin composition (X) to be molded by an inkjet method, it is preferable that the resin composition (X) has a sufficiently low viscosity at room temperature. Specifically, the viscosity of the resin composition (X) at 25° C. is preferably 50 mPa · s or less. In this case, the resin composition (X) is easily molded by an inkjet method.

(1) Manufacturing Method of Organic EL Light Emitting Device of First Example A manufacturing method of the organic EL light emitting device 1 of the first example shown in FIG. 1A will be described.

First, the support substrate 2 is prepared.

Next, the organic EL element 4 is arranged on one surface of the support substrate 2 . The organic EL element 4 can be produced by a coating method such as an inkjet method. The organic EL element 4 has the configuration of the first example shown in FIG. 1A.

A passivation layer 6 is then deposited. The passivation layer 6 is formed so as to cover one surface of the support substrate 2 and the organic EL elements 4 . The passivation layer 6 can be produced by vapor deposition, for example.

Next, the resin composition (X) is molded by an inkjet method so as to cover one surface of the support substrate 2 and the organic EL elements 4 . In this embodiment, the resin composition (X) is molded so as to cover the passivation layer 6 . By performing both molding of the organic EL element 4 and application of the resin composition (X) by an inkjet method, the manufacturing efficiency of the organic EL light emitting device 1 can be improved.

Next, the transparent substrate 3 is overlaid on the molded resin composition (X).

Next, the transparent substrate 3 is irradiated with ultraviolet rays from the outside. The ultraviolet rays transmitted through the transparent substrate 3 reach the resin composition (X). A radical polymerization reaction proceeds in the resin composition (X) by the ultraviolet rays, the resin composition (X) is cured, and the encapsulant 5 made of a cured product of the resin composition (X) is produced. .

Through the above steps, the organic EL light emitting device 1 of the first example can be produced.

(2) Method for Manufacturing Organic EL Light Emitting Device of Second Example A method for manufacturing the organic EL light emitting device 1 of the second example shown in FIG. 1B will be described.

First, the support substrate 2 is prepared.

Next, a partition wall 7 is produced on one surface of the support substrate 2 . The partition wall 7 can be produced by, for example, a photography method using a photosensitive resin material.

Next, a plurality of organic EL elements 4 are arranged on one surface of the support substrate 2 . The plurality of organic EL elements 4 can be produced, for example, by a vapor deposition method or a coating method, and can be produced by an inkjet method among the coating methods. An element array 9 is composed of the plurality of organic EL elements 4 .

Next, a first passivation layer 61 is placed over the device array 9 . The first passivation layer 61 can be produced, for example, by a vapor deposition method such as a plasma CVD method.

Next, a coating film of the resin composition (X) is formed on the first passivation layer 61 . This coating film can be produced, for example, by an inkjet method. By performing both molding of the organic EL element 4 and application of the resin composition (X) by an inkjet method, the manufacturing efficiency of the organic EL light emitting device 1 can be improved. The encapsulant 5 made of the cured resin composition (X) can be produced by irradiating this coating film with ultraviolet rays to cure it.

A second passivation layer 62 is then placed on the encapsulant 5 . The second passivation layer 62 can be produced, for example, by a vapor deposition method such as a plasma CVD method.

Next, after disposing an ultraviolet curable resin material so as to cover the second passivation layer 62, the transparent substrate 3 is placed on the resin material.

Next, the transparent substrate 3 is irradiated with ultraviolet rays from the outside. The ultraviolet rays pass through the transparent substrate 3 and reach the ultraviolet-curing resin material. The resin material is cured by the ultraviolet rays, and the second sealing material 52 made of a cured resin material is produced.

Through the steps described above, the organic EL light-emitting device 1 of the second example shown in FIG. 1B is manufactured.

2-3. Touch Panel The configuration of the touch panel 100 of this embodiment will be described with reference to FIG.

A touch panel 100 includes an organic EL light-emitting device 1 and a touch sensor 10 . The organic EL light emitting device 1 is, for example, a display device. A touch sensor 10 is arranged on the organic EL light emitting device 1 . The touch panel 100 further includes a polarizing plate 11 and a protective layer 12 . In the touch panel 100, the organic EL light emitting device 1, the touch sensor 10, the polarizing plate 11 and the protective layer 12 are laminated in this order.

The organic EL light-emitting device 1 is not particularly limited as long as it contains the sealing material 5 made of the resin composition (X). For example, the organic EL light-emitting device 1 may be the organic EL light-emitting device 1 of the first example or the organic EL light-emitting device 1 of the second example. A touch panel 100 shown in FIG. 2 includes the organic EL light-emitting device 1 of the second example.

A touch sensor 10 is arranged on the organic EL light emitting device 1 . Therefore, the touch sensor 10 is arranged on the transparent substrate 3 included in the organic EL light emitting device 1 . The touch sensor 10 may be capacitive or pressure sensitive. In the present embodiment, by reducing the dielectric constant of the resin composition (X), malfunction of the touch sensor 10 can be easily suppressed. In particular, when the touch sensor 10 is of the capacitance type, it is easy to suppress malfunction of the touch sensor 10 .

A polarizing plate 11 is arranged on the touch sensor 10 . The polarizing plate 11 can improve the visibility of the touch panel 100 . The polarizing plate 11 may be plate-like or film-like. As the polarizing plate 11, a known polarizing plate used for displays can be used. Although the material of the polarizing plate 11 is not particularly limited, it is made of resin, for example.

A protective layer 12 is arranged on the polarizing plate 11 . The protective layer 12 can protect the polarizing plate 11 . The protective layer 12 may be plate-like or film-like. Although the material of the protective layer 12 is not particularly limited, it is made of resin or glass, for example.

The touch panel 100 can be produced, for example, by stacking the touch sensor 10, the polarizing plate 11 and the protective layer 12 on the organic EL light emitting device 1 in this order.

2-4. Ultraviolet Curable Resin Composition for Organic EL Sealing Details of the resin composition (X) according to the present embodiment will be described.

The resin composition (X) contains an acrylic compound (A) and a photopolymerization initiator (B). Moreover, the resin composition (X) can contain components other than the acrylic compound (A) and the photopolymerization initiator (B).

In the following description, "(meth)acry" is a generic term for "acry" and "methacry".

(1) acrylic compound (A)
Acrylic compound (A) is a compound having a (meth)acryloyl group.

The acrylic compound (A) is a compound (z ) is preferably contained. Since the compounds having these skeletons have low polarity, the inclusion of the compound (z) in the resin composition (X) facilitates the reduction of the dielectric constant of the cured product of the resin composition (X).

The compound having an isobornyl skeleton can contain, for example, one or more compounds selected from the group consisting of isobornyl acrylate and isobornyl methacrylate.

Compounds having a dicyclopentanyl skeleton include, for example, dicyclopentanyl acrylate, dicyclopentanyl methacrylate, dicyclopentanyl diacrylate, dicyclopentanyl dimethacrylate, dicyclopentenyl acrylate, dicyclopentenyloxy It can contain one or more compounds selected from the group consisting of ethyl acrylate and dicyclopentenyloxyethyl methacrylate. In addition, in this specification, a dicyclopentenyl skeleton is also included in the dicyclopentanyl skeleton.

The compound having a 3,3,5-trimethylcyclohexyl skeleton can contain, for example, one or more compounds selected from the group consisting of 3,3,5-tricyclohexyl acrylate and 3,3,5-trimethylcyclohexyl methacrylate. .

Compound (z) is a monofunctional acrylic compound (z1) having only one (meth)acryloyl group in one molecule and a polyfunctional acrylic compound (z2) having multiple (meth)acryloyl groups in one molecule. At least one of them can be contained.

Among the monofunctional acrylic compounds (z1), compounds having a particularly high glass transition temperature and a low viscosity are preferred. When the acrylic compound (A) contains such a compound, it becomes easy to mold the resin composition (X) by an inkjet method. Such compounds include isobornyl acrylate and dicyclopentanyl acrylate. That is, the acrylic compound (A) preferably contains at least one of isobornyl acrylate and dicyclopentanyl acrylate.

Among the polyfunctional acrylic compounds (z2), compounds having particularly low viscosity are preferred. When the acrylic compound (A) contains such a compound, it becomes easy to mold the resin composition (X) by an inkjet method. Such compounds include dicyclopentanyl diacrylate and dicyclopentanyl dimethacrylate. That is, the acrylic compound (A) preferably contains at least one of dicyclopentanyl diacrylate and dicyclopentanyl dimethacrylate.

The acrylic compound (A) may contain an acrylic compound (y) other than the compound (z). The acrylic compound (y) includes a monofunctional acrylic compound (y1) having only one (meth)acryloyl group in one molecule and a polyfunctional acrylic compound (y2) having multiple (meth)acryloyl groups in one molecule. can contain at least one of

The monofunctional acrylic compound (y1) is, for example, dicyclopentenyloxyethyl (meth)acrylate, 4-tert-butylcyclohexyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, 2-hydroxyethyl (meth)acrylate. , 4-hydroxybutyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, isooctyl (meth) acrylate, 2-methoxyethyl (meth) acrylate, methoxytriethylene glycol (meth) acrylate, 2- ethoxyethyl (meth) acrylate, 3-methoxybutyl (meth) acrylate, ethoxyethyl (meth) acrylate, butoxyethyl (meth) acrylate, ethoxydiethylene glycol (meth) acrylate, methoxydixylethyl (meth) acrylate, ethyl diglycol ( meth) acrylate, cyclic trimethylolpropane formal mono (meth) acrylate, imide (meth) acrylate, isoamyl (meth) acrylate, ethoxylated succinic acid (meth) acrylate, trifluoroethyl (meth) acrylate, ω-carboxy polycaprolactone mono (Meth)acrylate, cyclohexyl (meth)acrylate, 2-(2-ethoxyethoxy)ethyl (meth)acrylate, stearyl (meth)acrylate, diethylene glycol monobutyl ether (meth)acrylate, lauryl (meth)acrylate, isodecyl (meth)acrylate , isooctyl (meth)acrylate, octyl/decyl (meth)acrylate, tridecyl (meth)acrylate, caprolactone (meth)acrylate, ethoxylated (4) nonylphenol (meth)acrylate, methoxypolyethylene glycol (350) mono (meth)acrylate, Methoxy polyethylene glycol (550) mono (meth) acrylate, phenoxyethyl (meth) acrylate, cyclohexyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, benzyl (meth) acrylate, methylphenoxyethyl (meth) acrylate, caprolactone-modified tetrahydro Furfuryl (meth)acrylate, tribromophenyl (meth)acrylate, ethoxylated tribromophenyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, ethylene oxide adduct of 2-phenoxyethyl (meth)acrylate, 2- Propylene oxide adduct of phenoxyethyl (meth)acrylate, phenoxydiethylene glycol (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, 3-methacryloyloxymethylcyclohexene oxide, and 3-(meth)acryloyloxymethylcyclohexene It contains at least one compound selected from the group consisting of oxides.

The monofunctional acrylic compound (y1) preferably contains a compound having an alicyclic structure. Compounds having an alicyclic structure include, for example, cyclohexyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, caprolactone-modified tetrahydrofurfuryl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate and 4-tertiary It contains at least one compound selected from the group consisting of butylcyclohexyl (meth)acrylates.

The monofunctional acrylic compound (y1) also preferably contains a compound (y11) represented by the following formula (10). In this case, it is easy to reduce the viscosity of the resin composition (X), and the sealing material 5 produced from the resin composition (X) is easily imparted with adhesion to a member made of an inorganic material such as the passivation layer 6. . In addition, the compound (y11) has a property of being difficult to volatilize in spite of having a low viscosity. Therefore, even if the resin composition (X) is stored, the composition of the resin composition (X) is unlikely to change due to volatilization of the monofunctional acrylic compound (y1).

In formula (10), R ⁰ is H or a methyl group. X is a single bond or a divalent hydrocarbon group. Each of R ¹ to R ¹¹ is H, an alkyl group or -R ¹² -OH, R ¹² is an alkylene group and at least one of R ¹ to R ¹¹ is an alkyl group or -R ¹² -OH. R ¹ to R ¹¹ are not chemically bonded to each other.

In formula (10), when X is a divalent hydrocarbon group, the number of carbon atoms in X is preferably 1 or more and 5 or less, more preferably 1 or more and 3 or less. Divalent hydrocarbon radicals are, for example, methylene, ethylene or propylene radicals. It is particularly preferred if X is a single bond or a methylene group. In this case, there is an advantage that the compound (A31) has a small molecular weight and a low viscosity.

In formula (10), when at least one of R ¹ to R ¹¹ is an alkyl group, the alkyl group preferably has 1 to 8 carbon atoms. Alkyl is, for example, methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl or octyl. Alkyl groups may be linear or branched. That is, for example, when the alkyl group is a butyl group, the butyl group may be a t-butyl group, an n-butyl group, or a sec-butyl group. When the alkyl group is a hexyl group, the hexyl group may be a t-hexyl group, an n-hexyl group, or a sec-hexyl group. If the alkyl group is an octyl group, the octyl group can be, for example, a t-octyl group. It is particularly preferred if the alkyl group is methyl or t-butyl. In this case, there is an advantage that the compound (y11) has a small molecular weight and a low viscosity.

In formula (10), an alkyl group or -R ¹² -OH is preferably connected only to the 4-position of the cyclohexane ring. That is, of R ¹ to R ¹¹ , it is preferred that at least one of R ⁶ and R ⁷ is an alkyl group or -R ¹² -OH and each of the remaining is H. Of R ¹ to R ¹¹ , it is particularly preferred that only R ⁶ is an alkyl group or -R ¹² -OH and each of the remainder is H. In this case, the compound represented by the formula (10) can have good reactivity, and it is particularly easy to provide the sealing material 5 with adhesion to members made of an inorganic material. This is because the cyclohexane ring in the compound represented by formula (10) has a boat-shaped conformation, and the bulky alkyl group or —R ¹² —OH at the 4-position tends to be positioned at the pseudoequatorial position. it is conceivable that. It is believed that the compound represented by formula (10) having such a structure enhances the reactivity of the (meth)acryloyl group in the compound represented by formula (10). Moreover, when the compound represented by formula (10) has such a structure, the compound represented by formula (10) can increase the free volume in the sealing material 5 . Therefore, it is considered that the interfacial free energy between the sealing material 5 and the member made of the inorganic material tends to decrease, and the adhesion between the sealing material 5 and the member made of the inorganic material tends to increase. The bulkier the alkyl group or —R ¹² —OH, the more likely it ^is to be positioned in the pseudoequatorial position. From this point of view, the alkyl group or -R ¹² -OH preferably has as many carbon atoms as possible, and the alkyl group or -R ¹² -OH preferably has a branch. For example, an alkyl group or --R ¹² --OH is preferably a t-butyl group.

In formula (10), it is also preferred that an alkyl group or -R ¹² -OH is attached only to each of the 3- and 5-positions of the cyclohexane ring. That is, among R ¹ to R ¹¹ , at least one of R ⁴ and R ⁵ is an alkyl group or -R ¹² -OH, at least one of R ⁸ and R ⁹ is an alkyl group or -R ¹² -OH, It is preferred that each of the remaining is H. Of R ¹ to R ¹¹ , only one of R ⁴ and R ⁵ is an alkyl group or -R ¹² -OH, at least one of R ⁸ and R ⁹ is an alkyl group or -R ¹² -OH, and the remaining More preferably each is H. Of R ¹ to R ¹¹ , at least one of R ⁴ and R ⁵ is an alkyl group or -R ¹² -OH, only one of R ⁸ and R ⁹ is an alkyl group or -R ¹² -OH, and the remaining It is also more preferred that each is H. Also in this case, the compound represented by the formula (10) can have good reactivity, and it is particularly easy to provide the sealing material 5 with adhesion to members made of an inorganic material. This is because the cyclohexane ring in the compound shown in formula (10) has a boat-shaped conformation, and the bulky alkyl groups or —R ¹² —OH at each of the 3- and 5-positions are located in the pseudoequatorial position. This is probably because it is easy. For this reason, the reactivity of the ( ^meth )acryloyl group in the compound represented by formula (10) is enhanced, and It is considered that the adhesion between the sealing material 5 and the member made of the inorganic material tends to be high. The bulkier the alkyl group or —R ¹² —OH, the more likely it ^is to be positioned in the pseudoequatorial position. From this point of view, the alkyl group or -R ¹² -OH preferably has as many carbon atoms as possible, and the alkyl group or -R ¹² -OH preferably has a branch. For example, an alkyl group or --R ¹² --OH is preferably a t-butyl group.

When at least one of R ¹ to R ¹¹ is —R ¹² —OH, R ¹² preferably has 1 to 5 carbon atoms, more preferably 1 to 3 carbon atoms. R ¹² is, for example, methylene, ethylene or propylene. It is particularly preferred if R ¹² is a methylene group. In this case, there is an advantage that the compound (y11) has a small molecular weight and a low viscosity.

In formula (10) it is particularly preferred if each of R ¹ to R ¹¹ is H or an alkyl group and at least one of R ¹ to R ¹¹ is an alkyl group. In this case, the compound represented by formula (10) can have a particularly low viscosity, so that the resin composition (X) can have a particularly low viscosity. Therefore, it becomes particularly easy to mold the resin composition (X) by an inkjet method.

The compound (y11) preferably contains at least one compound selected from the group consisting of a compound represented by the following formula (11), a compound represented by the following formula (12), and a compound represented by the following formula (13).

It is particularly preferable if the monofunctional acrylic compound (y1) contains at least one of the compound represented by formula (11) and the compound represented by formula (12). In this case, it is particularly easy to reduce the viscosity of the resin composition (X), to increase the glass transition temperature of the sealing material 5, and to increase the adhesion between the sealing material 5 and the member made of an inorganic material. In addition, since the compound represented by formula (11) and the compound represented by formula (12) are difficult to volatilize, the storage stability of the resin composition (X) can be easily improved.

The monofunctional acrylic compound (y1) also preferably contains a compound having a cyclic ether structure. The number of ring members of the cyclic ether structure in the compound having the cyclic ether structure is preferably 3 or more, more preferably 3 or more and 4 or less. The number of carbon atoms contained in the cyclic ether structure is preferably 2 or more and 9 or less, more preferably 2 or more and 6 or less. The compound having a cyclic ether structure contains, for example, at least one compound selected from the group consisting of 3-methacryloyloxymethylcyclohexene oxide and 3-acryloyloxymethylcyclohexene oxide.

The monofunctional acrylic compound (y1) preferably contains at least one compound having a viscosity of 20 mPa·s or less at 25°C. In this case, the viscosity of the resin composition (X) can be lowered.

The monofunctional acrylic compound (y1) preferably contains at least one compound having a glass transition temperature of 80°C or higher. In this case, the cured product of resin composition (X) can have a high glass transition temperature. The monofunctional acrylic compound (y1) more preferably contains at least one compound having a glass transition temperature of 90°C or higher, and more preferably contains at least one compound having a glass transition temperature of 100°C or higher.

The monofunctional acrylic compound (y1) preferably contains at least one compound having a boiling point of 200° C. or higher. In this case, the monofunctional acrylic compound (y1) does not easily deteriorate the storage stability of the resin composition (X). More preferably, the monofunctional acrylic compound (y1) contains at least one compound having a boiling point of 250° C. or higher.

It is particularly preferable if the monofunctional acrylic compound (y1) contains at least one compound having a viscosity at 25° C. of 20 mPa·s or less and a glass transition temperature of 80° C. or more. It is also preferred that the monofunctional acrylic compound (y1) contains at least one compound having a viscosity at 25°C of 20 mPa·s or less and a boiling point of 200°C or more. It is also preferred that the monofunctional acrylic compound (y1) contains at least one compound having a glass transition temperature of 80°C or higher and a boiling point of 200°C or higher. If the monofunctional acrylic compound (y1) contains at least one compound having a viscosity at 25° C. of 20 mPa·s or less, a glass transition temperature of 80° C. or higher, and a boiling point of 200° C. or higher, Especially preferred.

In particular, the monofunctional acrylic compound (y1) preferably contains at least one compound selected from the group consisting of dicyclopentenyloxyethyl (meth)acrylate and 4-tert-butylcyclohexyl (meth)acrylate. Since dicyclopentenyloxyethyl (meth)acrylate and 4-tert-butylcyclohexyl (meth)acrylate have high glass transition temperature, low viscosity and high boiling point, they are The properties of the material 5 can be particularly enhanced.

The polyfunctional acrylic compound (y2) is a compound (y20) having two (meth)acryloyl groups in one molecule and a compound (y21) having three or more (meth)acryloyl groups in one molecule. At least one of them can be contained.

Compound (y20) is, for example, 1,3-butylene glycol di(meth)acrylate, diethylene glycol diacrylate, neopentyl glycol diacrylate, triethylene glycol diacrylate, tripropylene glycol diacrylate, dipropylene glycol diacrylate, cyclohexane diacrylate. Methanol diacrylate, tricyclodecanedimethanol diacrylate, bisphenol A polyethoxy diacrylate, bisphenol F polyethoxy diacrylate Propoxylation (2) Neopentyl glycol diacrylate, 2-(2-ethoxyethoxy) ethyl acrylate, hexadiol Diacrylate, polyethylene glycol diacrylate, polyethylene glycol dimethacrylate, ethylene glycol diacrylate, 1,6-hexanediol diacrylate, ethoxylated 1,6-hexanediol diacrylate, polypropylene glycol diacrylate, 1,4-butanediol diacrylate Acrylates, 1,9-nonanediol diacrylate, tetraethylene glycol diacrylate, 2-n-butyl-2-ethyl-1,3-propanediol diacrylate, neopentyl glycol hydroxypivalate diacrylate, tripropylene glycol ethoxylate diacrylate, neopentyl glycol-modified trimethylolpropane diacrylate, stearic acid-modified pentaerythritol diacrylate, ethoxylated neopentyl glycol di(meth)acrylate, propoxylated neopentyl glycol di(meth)acrylate, and tripropylene glycol di(meth) ) can contain at least one compound selected from the group consisting of acrylates;

Compound (21) is, for example, 1,4-butanediol oligoacrylate, 1,6-hexanediol oligoacrylate, pentatriestol tetraacrylate, trimethylolpropane triacrylate, tris(2-hydroxyethyl)isocyanurate triacrylate, Pentaerythritol triacrylate, ethoxylated (3) trimethylolpropane triacrylate, propoxylated (3) glyceryl triacrylate, pentaerythritol tetraacrylate, ditrimethylolpropane tetraacrylate, ethoxylated (4) pentaerythritol tetraacrylate, dipentaerythritol penta acrylates, tripropylene glycol triacrylate, bispentaerythritol hexaacrylate, trimethylolpropane hydroxypivalate triacrylate, ethoxylated phosphoric acid triacrylate, tetramethylolpropane triacrylate, tetramethylolmethane triacrylate, caprolactone-modified trimethylolpropane triacrylate, Propoxylate glyceryl triacrylate, tetramethylolmethane tetraacrylate, ethoxylated pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate, caprolactone-modified dipentaerythritol hexaacrylate, dipentaerythritol hydroxypentaacrylate, neopentyl glycol oligoacrylate, trimethylolpropane oligo It can contain at least one compound selected from the group consisting of acrylates, pentaerythritol oligoacrylates, ethoxylated trimethylolpropane triacrylates, and propoxylated trimethylolpropane triacrylates.

Among the monofunctional acrylic compounds (y1), compounds having a particularly high glass transition temperature and a low viscosity are preferred. By including such a compound in the acrylic compound (A), the resin composition (X) is easily molded by an inkjet method. Such compounds include 4-t-butylcyclohexyl acrylate. That is, the acrylic compound (A) preferably contains 4-t-butylcyclohexyl acrylate.

Among polyfunctional acrylic compounds (y2), compounds having particularly low viscosity are preferred. By including such a compound in the acrylic compound (A), the resin composition (X) is easily molded by an inkjet method. Such compounds include polyethylene glycol diacrylate, polyethylene glycol dimethacrylate, pentaerythritol tetraacrylate, and trimethylolpropane triacrylate. That is, the acrylic compound (A) preferably contains one or more selected from the group consisting of polyethylene glycol diacrylate, polyethylene glycol dimethacrylate, pentaerythritol tetraacrylate, and trimethylolpropane triacrylate.

The acrylic compound (A) may contain a cross-linking agent having a (meth)acrylate group. Also in this case, the dielectric constant of the cured product of the resin composition (X) can be lowered. Furthermore, the adhesiveness (adhesive force) of the resin composition (X) can be improved, and the glass transition temperature (Tg) of the resin composition (X) can be improved. Crosslinkers with (meth)acrylate groups are, for example, from alkyl (meth)acrylates, tricyclodecanol (meth)acrylates, fluorene (meth)acrylates and isocyanurate (meth)acrylates, trimethylolpropane (meth)acrylates It can contain one or more selected from the group consisting of:

The acrylic compound (A) may contain an acrylic compound having a cationic polymerizable functional group. In this case, the cross-linking of the acrylic compound having a cationic polymerizable functional group facilitates securing a high glass transition temperature of the cured product of the resin composition (X). Examples of acrylic compounds having cationic polymerizable functional groups include 3,4-epoxycyclohexylmethyl methacrylate and the like. Commercially available acrylic compounds having a cationic polymerizable functional group include, for example, CYCLOMER M100 manufactured by DAICEL CORPORATION.

The acrylic compound (A) contains a monofunctional acrylic compound (A1) having only one (meth)acryloyl group in one molecule, and the monofunctional (meth)acrylic compound (A1) relative to the total amount of the acrylic compound (A). The proportion is preferably 50% by mass or more. The monofunctional acrylic compound (A1) is a compound comprising at least one of the monofunctional acrylic compound (z1) and the monofunctional acrylic compound (y1). That is, the acrylic compound (A) contains at least one of the monofunctional acrylic compound (z1) and the monofunctional acrylic compound (y1), and the sum of the monofunctional acrylic compound (z1) and the monofunctional acrylic compound (y1) The percentage of the amount is preferably 50% by mass or more with respect to the total amount of the acrylic compound (A). In this case, the amount of carbonyl groups in the resin composition (X) can be reduced, and the dielectric constant of the cured product of the resin composition (X) can be reduced. Moreover, the ratio of the monofunctional (meth)acrylic compound (A1) to the total amount of the acrylic compound (A) is preferably 85% by mass or less, more preferably 80% by mass or less. In this case, the glass transition temperature of the cured product of the resin composition (X) can be improved.

The acrylic compound (A) can also contain a polyfunctional acrylic compound (A2) having a plurality of (meth)acryloyl molecules in one molecule. The polyfunctional acrylic compound (A2) is a compound comprising at least one of the polyfunctional acrylic compound (z2) and the polyfunctional acrylic compound (y2).

The monofunctional acrylic compound (A1) preferably contains a compound (a1) having a methacryloyl group. The compound (a1) is a compound consisting of at least one of a compound classified as the compound (z1) having a methacryloyl group and a compound classified as the compound (y1) having a methacryloyl group. be. That is, it is preferable that the compound (z) contains the compound (z1) and the compound (z1) contains a compound having a methacryloyl group. It is also preferable that the acrylic compound (A) contains the compound (y), the compound (y) contains the compound (y1), and the compound (y1) contains a compound having a methacryloyl group. Compound (a1) is, for example, isobornyl methacrylate, cyclohexyl methacrylate, dicyclopentanyl methacrylate, tetrahydrofurfuryl methacrylate, 3-methacryloyloxymethylcyclohexene oxide, 3,3,5-trimethylcyclohexyl methacrylate, and 4-t-butyl It can contain one or more selected from the group consisting of cyclohexyl methacrylate. The percentage ratio of the compound (a1) to the total amount of the acrylic compound (A) is preferably 25% by mass or more and 60% by mass or less. In this case, the dielectric constant of the cured product of the resin composition (X) can be easily lowered. As a result, the dielectric constant of the encapsulating material 5 made from the resin composition (X) can be easily reduced, and malfunction of the touch sensor can be easily suppressed in the touch panel provided with the organic EL light-emitting device 1 including the encapsulating material 5 .

(2) Photoinitiator (B)
The photopolymerization initiator (B) preferably contains a radical polymerization initiator that is a compound that generates radical species when irradiated with ultraviolet rays. The photopolymerization initiator (B) includes, for example, aromatic ketones, acylphosphine oxide compounds, α-hydroxyalkylphenone compounds, aromatic onium salt compounds, organic peroxides, thio compounds (thioxanthone compounds, thiophenyl group-containing compounds, etc.). , a hexaarylbiimidazole compound, a ketoxime ester compound, a borate compound, an azinium compound, a metallocene compound, an active ester compound, a compound having a carbon-halogen bond, and an alkylamine compound. .

The photopolymerization initiator (B) preferably contains an acylphosphine oxide compound. Photoinitiator (B) can include, for example, one or both of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide and 2,4,6-trimethylbenzoyl-diphenylphosphinate. The photopolymerization initiator (B) may contain a commercially available acylphosphine oxide compound. Examples of commercially available acylphosphine oxide compounds include Irgacure TPO, Irgacure TPO-L and Irgacure 819 from BASF.

The photopolymerization initiator (B) preferably contains an α-hydroxyalkylphenone compound. The photoinitiator (B) includes 1-hydroxycyclohexylphenyl ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, and 2-benzyl-2-( dimethylamino)-4'-morpholinobtyrophenone. The photopolymerization initiator (B) may contain a commercially available α-hydroxyalkylphenone compound. Examples of commercially available α-hydroxyalkylphenone compounds include Irgacure 184, Irgacure 907, and Irgacure 369, Irgacure 369E from BASF.

It is particularly preferred that the photopolymerization initiator (B) contains both an acylphosphine oxide compound and an α-hydroxyalkylphenone. In this case, the resin composition (X) can be easily cured when the resin composition (X) is irradiated with ultraviolet rays.

The photopolymerization initiator (B) also preferably contains a component having photobleaching properties. The component having photobleaching property preferably contains a compound having photobleaching property among acylphosphine oxide compounds, and also preferably contains a compound having photobleaching property among oxime ester compounds.

The photopolymerization initiator (B) also preferably contains a component having a sensitizer skeleton in the molecule. The sensitizer skeleton includes, for example, at least one of a 9H-thioxanthen-9-one skeleton and an anthracene skeleton. That is, the photopolymerization initiator (B) preferably contains a component having at least one of a 9H-thioxanthene-9-one skeleton and an anthracene skeleton.

From the viewpoint of improving the curability of the resin composition (X) and making it difficult for outgassing to occur from the cured product of the resin composition (X), the photopolymerization initiator (B) is used regardless of the presence or absence of photobleaching properties. It is also preferable to contain an oxime ester compound.

The oxime ester-based compound is aromatic, in order to make the resin composition (X) and production equipment less likely to be contaminated by decomposed products from the resin composition (X), and to further make outgassing less likely to occur from the cured product. It preferably contains a compound having a ring, more preferably contains a compound having a condensed ring containing an aromatic ring, and further preferably contains a compound having a condensed ring containing a benzene ring and a hetero ring.

Oxime ester compounds include, for example, 1,2-octadione-1-[4-(phenylthio)-, 2-(o-benzoyloxime)], and ethanone, 1-[9-ethyl-6-(2-methylbenzoyl )-9H-carbazol-3-yl]-,1-(o-acetyloxime), as well as JP-A-2000-80068, JP-A-2001-233842, JP-T-2010-527339, JP-T-2010-527338, It can contain at least one compound selected from the group consisting of oxime ester compounds described in JP-A-2013-041153 and JP-A-2015-93842. The oxime ester compounds are commercially available products having a carbazole skeleton, Irgacure OXE-02 (manufactured by BASF), Adeka Arcules NCI-831, N-1919 (manufactured by ADEKA) and TR-PBG-304 (Changzhou Powerful Electronic New Material Co., Ltd.), Irgacure OXE-01 having a diphenyl sulfide skeleton, ADEKA Arkles NCI-930 (ADEKA Co., Ltd.), TR-PBG-345 and TR-PBG-3057 (manufactured by Changzhou Tenryu Denshi New Materials Co., Ltd.), and It may contain at least one compound selected from the group consisting of TR-PBG-365 (manufactured by Changzhou Tenryu Electric New Materials Co., Ltd.) and SPI-04 (manufactured by Sanyang) having a fluorene skeleton. In particular, when the oxime ester compound contains a compound having a diphenyl sulfide skeleton or a fluorene skeleton, it is preferable in that the cured product is less likely to be colored by photobleaching. It is also preferable that the oxime ester-based compound contains a compound having a carbazole skeleton, since the exposure sensitivity tends to increase.

It is also preferred that the oxime ester compound contains two or more compounds. In this case, for example, when the oxime ester compound contains two or more compounds with different exposure sensitivities, it is possible to reduce the amount of the photopolymerization initiator (B) while maintaining good exposure sensitivity. Outgassing from the cured product of the resin composition (X) can be further suppressed.

The ratio of the photopolymerization initiator (B) to 100 parts by mass of the resin composition (X) is, for example, 1 part by mass or more and 10 parts by mass or less. In this case, the resin composition (X) can be sufficiently cured.

The photoinitiator (B) may contain a sensitizer. The sensitizer can promote the radical generation reaction of the photopolymerization initiator (B), improve the reactivity of radical polymerization, and improve the crosslink density. Sensitizers are, for example, 9,10-dibutoxyanthracene, 9-hydroxymethylanthracene, thioxanthone, 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2-chlorothioxanthone, 2,4-diethylthioxanthone, anthraquinone, 1,2- dihydroxyanthraquinone, 2-ethylanthraquinone, 1,4-diethoxynaphthalene, p-dimethylaminoacetophenone, p-diethylaminoacetophenone, p-dimethylaminobenzophenone, p-diethylaminobenzophenone, 4,4′-bis(dimethylamino)benzophenone, It can contain at least one compound selected from the group consisting of 4,4'-bis(diethylamino)benzophenone, p-dimethylaminobenzaldehyde, and p-diethylaminobenzaldehyde.

When the photoinitiator (B) contains a sensitizer, the content of the sensitizer in the resin composition (X) is, for example, 0.00 per 100 parts by mass of the solid content of the resin composition (X). It is 1 part by mass or more and 5 parts by mass or less, preferably 0.1 part by mass or more and 3 parts by mass or less. In this case, the resin composition (X) can be cured in the air, eliminating the need to cure the resin composition (X) in an inert atmosphere such as a nitrogen atmosphere.

(3) Components other than the acrylic compound (A) and the photopolymerization initiator (B) As described above, the resin composition (X) contains components other than the acrylic compound (A) and the photopolymerization initiator (B). be able to.

The resin composition (X) may contain, for example, a radically polymerizable compound (C) other than the acrylic compound (A). The radically polymerizable compound (C) includes a polyfunctional radically polymerizable compound (C1) having two or more radically polymerizable functional groups per molecule and a monofunctional radically polymerizable compound having only one radically polymerizable functional group per molecule. Either one or both of the radically polymerizable compound (C2) may be included. The amount of the radically polymerizable compound (C) with respect to the total amount of the acrylic compound (A) and the radically polymerizable compound (C) is, for example, 10% by mass or less.

The polyfunctional radically polymerizable compound (C1) is, for example, a group consisting of aromatic urethane oligomers, aliphatic urethane oligomers, epoxy acrylate oligomers, polyester acrylate oligomers and other special oligomers having two or more ethylenic double bonds in one molecule. It may contain at least one compound selected from More specifically, the polyfunctional radically polymerizable compound (C1) is, for example, UV-2000B, UV-2750B, UV-3000B, UV-3010B, UV-3200B, UV-3300B manufactured by Nippon Synthetic Chemical Industry Co., Ltd., UV-3700B, UV-6640B, UV-8630B, UV-7000B, UV-7610B, UV-1700B, UV-7630B, UV-6300B, UV-6640B, UV-7550B, UV-7600B, UV-7605B, UV- 7610B, UV-7630B, UV-7640B, UV-7650B, UT-5449, UT-5454; CN902, CN902J75, CN929, CN940, CN944, CN944B85, CN959, CN961E75, CN961H81, CN9 manufactured by Sartomer 62, CN963, CN963A80, CN963B80, CN963E75, CN963E80, CN963J85, CN964, CN965, CN965A80, CN966, CN966A80, CN966B85, CN966H90, CN966J75, CN968, CN969, CN970, CN97 0A60, CN970E60, CN971, CN971A80, CN971J75, CN972, CN973, CN973A80, CN973H85, CN973J75, CN975, CN977, CN977C70, CN978, CN980, CN981, CN981A75, CN981B88, CN982, CN982A75, CN982B88, CN982E75, CN983, CN984, CN985, CN985B88, CN98 6, CN989, CN991, CN992, CN994, CN996, CN997, CN999, CN9001, CN9002, CN9004, CN9005, CN9006, CN9007, CN9008, CN9009, CN9010, CN9011, CN9013, CN9018, CN9019, CN9024, CN9025, CN9026, CN9028, CN9029, CN 9030, CN9060, CN9165, CN9167, CN9178, CN9290, CN9782, CN9783, CN9788, CN9893; EBECRYL210, EBECRYL220, EBECRYL230, EBECRYL270, KRM8200, EBECRYL5129, EBECRYL8210, EBECRYL8301, EBECRYL8804, EBECRYL8 manufactured by Daicel Cytec Co., Ltd. Japan B-1000 and B-2000 manufactured by Soda Co., Ltd. It contains at least one compound selected from the group consisting of B-3000. When the resin composition (X) contains a polyfunctional radically polymerizable compound (C1), the polyfunctional radically polymerizable compound (C1) preferably contains B-1000 manufactured by Nippon Soda Co., Ltd. In this case, the dielectric constant of the resin composition (X) is easily lowered.

Monofunctional radically polymerizable compounds (C2) include, for example, N-vinylformamide, vinylcaprolactam, vinylpyrrolidone, phenyl glycidyl ether, p-tert-butylphenyl glycidyl ether, butyl glycidyl ether, 2-ethylhexyl glycidyl ether, allyl glycidyl ether, 1,2-butylene oxide, 1,3-butadiene monoxide, 1,2-epoxidedecane, epichlorohydrin, 1,2-epoxydecane, styrene oxide, cyclohexene oxide, 3-vinylcyclohexene oxide, 4-vinylcyclohexene It can contain at least one compound selected from the group consisting of oxide, N-vinylpyrrolidone and N-vinylcaprolactam.

The radically polymerizable compound (C) contains one or more compounds (C3) selected from the group consisting of divinylbenzene, polybutadiene, and compounds having a basic skeleton of divinylbenzene or polybutadiene and having a (meth)acrylate group. You can stay. By including the compound (C3) in the resin composition (X), the dielectric constant of the cured product of the resin composition (X) can be lowered. However, when the molecular weight of the compound (C3) is large, the viscosity of the resin composition (X) tends to be high, and when the molecular weight of the compound (C) is small, the volatility tends to be high. Therefore, in order to lower the dielectric constant of the cured product of the resin composition (X) and to lower the viscosity of the resin composition (X), it is more preferable that the resin composition (X) contains the compound (z). preferable.

The resin composition (X) may contain a polymerization accelerator (D). The polymerization accelerator (D) can promote the radical polymerization reaction of the resin composition (X). The polymerization accelerator (D) is, for example, ethyl p-dimethylaminobenzoate, 2-ethylhexyl p-dimethylaminobenzoate, methyl p-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, and p-dimethyl It can contain one or more components selected from the group consisting of butoxyethyl aminobenzoate and the like.

The resin composition (X) may contain a moisture absorbent (E). The hygroscopic agent (E) can impart hygroscopicity to the cured product of the resin composition (X). The hygroscopic agent (E) is preferably hygroscopic inorganic particles. The moisture absorbent (E) can contain, for example, one or more components selected from the group consisting of zeolite particles, silica gel particles, calcium chloride particles and titanium oxide nanotube particles. The moisture absorbent (E) preferably contains zeolite particles, particularly preferably zeolite particles having an average particle size of 200 nm or less. Such zeolite particles preferably contain sodium ions. For that purpose, the zeolite particles are preferably produced from zeolite containing sodium ions, and produced from at least one material selected from the group consisting of A-type zeolite, X-type zeolite and Y-type zeolite among sodium ions. more preferably. It is particularly preferred that the zeolite particles are produced from 4A-type zeolite among A-type zeolites. In these cases, the zeolite particles have a crystal structure suitable for moisture adsorption. The ratio of the moisture absorbent (E) to the total amount of the resin composition (X) is preferably 1% by mass or more and 20% by mass or less. When the proportion of the hygroscopic agent (E) is 1% by mass or more, the cured product of the resin composition (X) can have high hygroscopicity. When the proportion of the moisture absorbent (E) is 20% by mass or less, the viscosity of the resin composition (X) can be reduced, and the resin composition (X) can be easily molded by an inkjet method.

The resin composition (X) may contain an inorganic filler (F). For example, the resin composition (X) can contain nano-sized high refractive index particles as the inorganic filler (F). In this case, the refractive index of the cured product of the resin composition (X) can be increased while maintaining good transparency of the cured product. Therefore, when the encapsulating material 5 is produced from the resin composition (X), the extraction efficiency of light passing through the encapsulating material 5 and emitted to the outside can be improved. Nano-sized high refractive index particles are, for example, zirconia particles.

When the resin composition (X) contains the moisture absorbent (E), the resin composition (X) may contain the dispersant (G). The dispersant (G) is a surfactant that can be adsorbed by the moisture absorbent (E). The dispersant (G) comprises, for example, an adsorptive group that can be adsorbed to the particles of the moisture absorbent (E), and a chain-like or comb-shaped molecule that is attached to the particles of the moisture absorbent (E) by the adsorption group being adsorbed to the particles of the moisture absorbent (E). It has a skeleton and a tail. The dispersant (G) includes, for example, an acrylic dispersant whose tail is an acrylic molecular chain, a urethane dispersant whose tail is a urethane molecular chain, and a polyester dispersant whose tail is a polyester molecular chain. It can contain one or more ingredients selected from the group consisting of agents. The dispersant (G) can satisfactorily disperse the moisture absorbent (E) in the resin composition (X) and in the cured product. Thereby, even if the cured product of the resin composition (X) contains the moisture absorbent (E), it is possible to prevent the transparency of the cured product from being lowered by the moisture absorbent (E). Further, the dispersant (G) can suppress aggregation of the moisture absorbent (E) during storage of the resin composition (X). Therefore, the storage stability of the resin composition (X) can be prevented from being lowered by the moisture absorbent (E). In addition, it is possible to prevent the adhesion between the cured product of the resin composition (X) and silicon nitride and silicon oxide from being lowered by the dispersant (G). It is believed that this is because the dispersant (G) easily adsorbs to the moisture absorbent (E) and hardly affects the interfaces between the cured product and the silicon nitride and silicon oxide. Therefore, when the resin composition (X) contains the dispersant (G), the encapsulant 5 can have high adhesion to the glass substrate. Moreover, the adhesion between the passivation layer 6 made of silicon nitride or silicon oxide and the sealing material 5 can be improved. The ratio of the dispersant (G) to 100 parts by mass of the moisture absorbent (E) is preferably 5% by mass or more and 60% by mass or less. If the amount of the dispersant (G) is 5% by mass or more, the advantage of the dispersant (G) can be particularly exhibited. If the amount of the dispersant (G) is 60% by mass or less, the adhesion between the cured product of the resin composition (X) and silicon nitride and silicon oxide can be improved.

The resin composition (X) may contain a cationically polymerizable compound (H). The cationically polymerizable compound (H) can contain one or both of a monofunctional cationically polymerizable compound and a polyfunctional cationically polymerizable compound. The cationically polymerizable compound (H) includes an alkyl type epoxy compound, a dicyclopentadiene type epoxy compound, a bisphenol F type epoxy compound, a bisphenol A type epoxy compound, a phenol novolak type epoxy compound, a naphthalene type epoxy compound, an oxetane compound, and a biphenyl type epoxy compound. It preferably contains one or more compounds selected from the group consisting of epoxy compounds. These compounds can lower the dielectric constant of the cured product of the resin composition (X). In order to make it easier to lower the dielectric constant of the cured product of the resin composition (X), it is more preferable that the resin composition (X) contains the compound (z). Particularly preferred cationic polymerizable compounds (H) include, for example, 2-(4,4-dimethylpentan-2-yl)-5,7,7-trimethyloctanoate 2,3-epoxypropyl, (3,3′, 4,4′-diepoxy)bicyclohexyl, 3-ethyl-3-{[(3-ethyloxetan-3-yl)methoxy]methyl}oxetane and the like.

When the resin composition (X) contains the cationic polymerizable compound (H), the photopolymerization initiator (B) preferably contains the cationic polymerization initiator (h). The cationic polymerization initiator (h) is not particularly limited as long as it is a catalyst that generates protonic acid or Lewis acid upon exposure to light. The cationic polymerization initiator (h) can contain at least one of an ionic photoacid-generating cationic curing catalyst and a nonionic photoacid-generating cationic curing catalyst. Commercially available cationic polymerization initiators (h) include, for example, Midori Kagaku's product number DTS-200.

In the present embodiment, as described above, the resin composition (X) contains the compound (z), so that the cured product of the resin composition (X) can have a low dielectric constant. Therefore, it is not necessary to blend the resin composition (X) with the inorganic filler (F) in order to lower the dielectric constant of the cured product of the resin composition (X). That is, the resin composition (X) does not need to contain the inorganic filler (F). Further, when the resin composition (X) contains the moisture absorbent (E), the inorganic filler (F) and the dispersant (G), the viscosity of the resin composition (X) tends to increase, and the resin composition ( X) may become difficult to be molded by the inkjet method. Therefore, the resin composition (X) does not need to contain the moisture absorbent (E), the inorganic filler (F) and the dispersant (G).

The compound (z), which is at least one component selected from the group consisting of compounds having an isobornyl skeleton, compounds having a dicyclopentanyl skeleton, and compounds having a 3,3,5-trimethylcyclohexyl skeleton, is the resin composition ( It is difficult to increase the viscosity of X). Therefore, by including the compound (z) in the acrylic compound (A), the viscosity of the resin composition (X) can be lowered even if the resin composition (X) does not contain a solvent, and the resin composition ( An inkjet method can be applied to the molding of X). Therefore, it is also preferable that the resin composition (X) does not contain a solvent. In this case, there is no need to dry the resin composition (X) to volatilize the solvent when producing a cured product from the resin composition (X). In addition, the storage stability of the resin composition (X) can be improved, and the generation of solvent-derived outgas can be suppressed. Moreover, when the resin composition (X) contains a solvent, the ratio of the solvent to the resin composition (X) is preferably 1.0% by mass or less. The proportion of the solvent is more preferably 0.5% by mass or less, even more preferably 0.3% by mass or less, and particularly preferably 0.1% by mass or less. It is particularly preferred that the resin composition (X) does not contain a solvent or contains only a solvent which is unavoidably mixed.

(4) Method for producing an ultraviolet curable resin composition for sealing organic EL, the acrylic compound (A) described above, the photopolymerization initiator (B), and optionally the acrylic compound (A) and the photopolymerization initiator ( The resin composition (X) can be prepared by mixing components other than B).

(5) Properties of UV-curable Resin Composition for Organic EL Sealing The viscosity of the resin composition (X) at 25° C. is preferably 50 mPa·s or less. In this case, the resin composition (X) can be molded more satisfactorily by an inkjet method. The viscosity of the resin composition (X) at 25° C. is more preferably 30 mPa·s or less, still more preferably 25 mPa·s or less, particularly preferably 20 mPa·s or less, and 15 mPa·s or less. is most preferable. The viscosity of the resin composition (X) at 25° C. is preferably 1 mPa·s or more, more preferably 5 mPa·s or more.

It is also preferable that the resin composition (X) has a viscosity at 40° C. of 50 mPa·s or less. In this case, even if the viscosity of the resin composition (X) at room temperature is any value, it is possible to lower the viscosity by slightly heating the resin composition (X). Therefore, if heated, the resin composition (X) can be molded more satisfactorily by the inkjet method. In addition, since the viscosity of the resin composition (X) can be reduced without significantly heating the resin composition (X), the composition of the resin composition (X) is unlikely to change due to volatilization of the components in the resin composition (X). can. The viscosity of the resin composition (X) at 40° C. is more preferably 30 mPa·s or less, more preferably 25 mPa·s or less, particularly preferably 20 mPa·s or less, and may be 15 mPa·s or less. is most preferred. The viscosity of the resin composition (X) at 25° C. is preferably 1 mPa·s or more, more preferably 5 mPa·s or more.

The viscosity of the resin composition (X) is measured using a rheometer at a shear rate of 100 s-1. As a rheometer, model number DHR-2 manufactured by Anton Paar Japan, for example, can be used.

Resin composition (X) has a dielectric constant of 3.0 or less when cured at a frequency of 100 kHz. Accordingly, when the organic EL light-emitting device 1 including the sealing material 5 formed from the resin composition (X) is applied to the touch panel 100, malfunction of the touch sensor 10 can be easily suppressed. The cured product of the resin composition (X) at a frequency of 100 kHz more preferably has a dielectric constant of 2.8 or less, particularly preferably 2.7 or less.

In the present embodiment, the acrylic compound (A) is at least one component selected from the group consisting of compounds having an isobornyl skeleton, compounds having a dicyclopentanyl skeleton, and compounds having a 3,3,5-trimethylcyclohexyl skeleton. By containing the compound (z), the dielectric constant of the cured product of the resin composition (X) can be lowered. Further, since the compound (z) hardly increases the viscosity of the acrylic compound (A), the viscosity of the resin composition (X) can be lowered even if the resin composition (X) does not contain a solvent. However, as long as the cured product of the resin composition (X) can have a dielectric constant of 3.0 or less, the resin composition (X) is not limited to the acrylic compound (A) containing the compound (z). .

A cured product of the resin composition (X) preferably has a glass transition temperature of 90° C. or higher. That is, the glass transition temperature of the cured product of the resin composition (X) and the glass transition temperature of the sealing material 5 formed from the resin composition (X) are preferably 90° C. or higher. In this case, the heat resistance of the sealing material 5 formed from the resin composition (X) can be improved. Therefore, deterioration of the encapsulant 5 can be easily suppressed when the organic EL light-emitting device 1 is subjected to high-temperature processing. The glass transition temperature of the cured product of the resin composition (X) is more preferably 100°C or higher. When the resin composition (X) contains the polyfunctional acrylic compound (A3), the molecular structure of the cured product of the resin composition (X) tends to be three-dimensional, and the glass transition temperature of the cured product tends to increase.

Specific examples are presented below. However, it is not limited only to these examples.

1. Preparation of Composition Resin compositions of Examples and Comparative Examples were prepared by mixing the components shown in the table below. The details of the components shown in the table are as follows.
SR295NS: Pentaerythritol tetraacrylate from Sartomer, viscosity 350 mPa·s at 25°C. Glass transition temperature 103°C.
• SR351S: Trimethylolpropane triacrylate from Sartomer, viscosity 106 mPa·s at 25°C.
SR506NS: isobornyl acrylate from Sartomer, viscosity at 25°C 8 mPa·s, glass transition temperature 97°C.
• SR423NS: isobornyl methacrylate from Sartomer, viscosity at 25°C of 11 mPa·s, glass transition temperature of 110°C.
- FA513AS: dicyclopentanyl acrylate manufactured by Hitachi Chemical, viscosity at 25°C of 13 mPa·s, glass transition temperature of 120°C.
• CD535: dicyclopentanyl methacrylate from Sartomer, viscosity at 25°C of 17 mPa·s, glass transition temperature of 91°C.
· CD420: 3,3,5-trimethylcyclohexyl acrylate manufactured by Sartomer, viscosity at 25°C of 6 mPa·s, glass transition temperature of 29°C.
• CD421: 3,3,5-trimethylcyclohexyl methacrylate manufactured by Sartomer, viscosity at 25°C of 6 mPa·s, glass transition temperature of 145°C.
TBCHA: 4-t-butylcyclohexyl acrylate manufactured by KJ Chemicals, viscosity at 25°C: 7 mPa·s, glass transition temperature: 77°C.
SR833S: dicyclopentanyl dimethacrylate from Sartomer, viscosity at 25°C 110 mPa·s, glass transition temperature 214°C.
PEGDMA: Polyethylene glycol 200 dimethacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd., viscosity at 25°C: 14 mPa·s, glass transition temperature: 41°C.
PEGDA: Polyethylene glycol 200 diacrylate, manufactured by Osaka Organic Chemical, viscosity at 25°C of 17 mPa·s, glass transition temperature of 41°C.
Cychromer M100: 3,4-epoxycyclohexylmethyl methacrylate, manufactured by Daicel, viscosity at 25° C. of 9 mPa·s.
· B1000: 1,2-polybutadiene homopolymer, manufactured by Nippon Soda Co., Ltd., viscosity at 25°C of 2000 mPa·s.
FOLDI E101: 2-(4,4-dimethylpentan-2-yl)-5,7,7-trimethyloctanoate 2,3-epoxypropyl, manufactured by Nissan Chemical Industries, viscosity at 25° C. 40 mPa·s.
Celoxide 8010: (3,3′,4,4′-diepoxy)bicyclohexyl, manufactured by Daicel, viscosity at 25° C. of 80 mPa·s.
OXT221: 3-ethyl-3-{[(3-ethyloxetan-3-yl)methoxy]methyl}oxetane, manufactured by Toagosei, viscosity at 25°C of 10 mPa. s.
· 184: 1-hydroxy-cyclohexyl-phenyl-ketone, manufactured by BASF, product name Irgacure 184.
· TPO: 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, manufactured by BASF, product name Irgacure TPO.
- DTS-200: Midori Chemical Co., Ltd., product number DTS-200, _{C6H5 - S - C6H4 -} S+( _C6H5 ) _2.B ( _C6F5 ) ₄ .

2. Evaluation Tests The following evaluation tests were conducted for Examples and Comparative Examples. The results are shown in the table.

(1) Viscosity The viscosity of the resin composition was measured using a rheometer (manufactured by Anton Paar Japan, Model No. DHR-2) under conditions of a temperature of 25° C. and a shear rate of 1000 s ⁻¹ .

(2) Glass transition temperature of the cured product A coating film is prepared by applying the resin composition, and the coating film is used with an LED-UV irradiator manufactured by Panasonic Electric Works Co., Ltd. (peak wavelength 365 nm), about 100 mW / A film having a thickness of 100 μm was produced by photocuring by irradiating with ultraviolet rays for 15 seconds under the condition of cm ² .

Using a viscoelastic spectrometer "DMS6100" manufactured by Seiko Instruments Inc., the glass transition temperature of the film obtained above was measured. At this time, dynamic viscoelasticity measurement (DMA) is performed with a tensile module at a frequency of 10 Hz, and the temperature at which tan δ when the temperature is raised from room temperature to 200 ° C. at a temperature increase rate of 5 ° C./min is the glass transition temperature. temperature.

(3) Inkjet property The resin composition is put into a cartridge of an inkjet printer ("MH2420" manufactured by Ricoh Co., Ltd.), and after confirming that the resin composition in the cartridge can be discharged from the nozzle of the inkjet printer, the resin is discharged from the nozzle. A test pattern was continuously printed by ejecting the composition. As a result, "A" indicates that the resin composition could be discharged for 1 hour and the discharge operation was stable, and "B" if the resin composition could be discharged for 1 hour but the discharge operation became intermittent and unstable. ", and the case where the resin composition could not be discharged because the nozzle was clogged before 1 hour from the start of discharge was evaluated as "C".

(4) Dielectric constant A coating film of a resin composition having a thickness of 10 μm was formed on an aluminum substrate having dimensions of 80 mm×40 mm×1 mmt. This coating film was irradiated with ultraviolet rays for 15 seconds at a condition of 100 mW/cm ² to cure the coating film. Using an LCR meter (manufactured by Agilent, "E4980A") and a jig (16034 test fixture), the electrode contact method was used to measure the dielectric constant of the cured coating film at a frequency of 100 kHz.

REFERENCE SIGNS LIST 1 organic EL light emitting device 4 organic EL element 5 sealing material 10 touch sensor 100 touch panel

Claims (9)

Containing an acrylic compound (A) and a photopolymerization initiator (B),
The dielectric constant of the cured product is 3.0 or less when the frequency is 100 kHz,
for encapsulating organic EL elements,
Viscosity at 25 ° C. is 50 mPa s or less,
The acrylic compound (A) contains a monofunctional methacrylate (a1) having only one methacryloyl group in one molecule,
The ratio of the monofunctional methacrylate (a1) to the total amount of the acrylic compound (A) is 25% by mass or more and 60% by mass or less.
UV curable resin composition. The acrylic compound (A) is at least one component selected from the group consisting of compounds having an isobornyl skeleton, compounds having a dicyclopentanyl skeleton, and compounds having a 3,3,5-trimethylcyclohexyl skeleton ( z),
The ultraviolet curable resin composition according to claim 1. The acrylic compound (A) contains a monofunctional (meth)acrylic compound (A1) having only one (meth)acryloyl group in one molecule,
The ratio of the monofunctional (meth)acrylic compound (A1) to the total amount of the acrylic compound (A) is 50% by mass or more.
The ultraviolet curable resin composition according to claim 1 or 2. The acrylic compound (A) contains an acrylic compound having a cationic polymerizable functional group,
The ultraviolet curable resin composition according to any one of claims 1 to 3 . Further containing a cationically polymerizable compound (H),
The UV-curable resin composition according to any one of claims 1-4 . The glass transition temperature of the cured product is 90 ° C. or higher.
The ultraviolet curable resin composition according to any one of claims 1 to 5 . Further containing a radically polymerizable compound (E) other than the acrylic compound (A),
The UV-curable resin composition according to any one of claims 1-6 . An organic EL element and a sealing material covering the organic EL element,
The sealing material is a cured product of the ultraviolet curable resin composition according to any one of claims 1 to 7 ,
Organic EL light emitting device. Equipped with the organic EL light emitting device according to claim 8 and a touch sensor,
touch panel.

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