JP7302423B2 - X-ray generator, X-ray device, structure manufacturing method and structure manufacturing system - Google Patents

Description

The present invention relates to an X-ray generator, an X-ray device, a structure manufacturing method, and a structure manufacturing system.

As a device for nondestructively acquiring information on the inside of an object, for example, as disclosed in the following patent document, it has an X-ray source that irradiates the object with X-rays, and detects transmitted X-rays that have passed through the object. X-ray devices are known which have detectors for

U.S. Patent Application Publication No. 2009/0268869

According to the first aspect of the present invention, an X-ray generator includes an electron emitting portion that emits electrons, an X-ray emitting portion that emits X-rays upon being irradiated with electrons from the electron emitting portion, and an X-ray emitting a housing having an emission section through which X-rays are emitted from the X-ray emission section; At least part of it contains an element with a small atomic number.
According to a second aspect of the present invention, an X-ray apparatus comprises the X-ray generator according to the first aspect, a stage for holding an object to be measured irradiated with X-rays emitted from the emitting section, and and a detector for detecting X-rays irradiated and transmitted through the object.
According to a third aspect of the present invention, a method for manufacturing a structure comprises: a design step of creating design information regarding the shape of the structure; a forming step of creating the structure based on the design information; and a created structure. The method includes a step of measuring the shape of an object using the X-ray apparatus according to the second aspect, and an inspection step of comparing the shape information obtained in the measuring step and the design information.
According to a fourth aspect of the present invention, a structure manufacturing system includes: a design device that creates design information regarding the shape of a structure; a forming device that creates a structure based on the design information; and an inspection device for comparing shape information and design information regarding the shape of the structure obtained by the X-ray device.

It is a schematic block diagram which shows an example of the inspection apparatus which concerns on this embodiment. It is a schematic block diagram which shows an example of the inspection apparatus which concerns on this embodiment. It is a schematic diagram of the shield which concerns on this embodiment. FIG. 4 is a diagram showing an example of an image when X-rays pass through a shield; 1 is a schematic cross-sectional view of an X-ray generator according to this embodiment; FIG. It is a typical expanded sectional view of the stowage part concerning this embodiment. FIG. 2 is a schematic diagram for explaining generation of X-rays; FIG. 2 is a schematic diagram for explaining generation of X-rays; It is a figure explaining the calculation result by simulation of the intensity|strength of the X-ray which reaches a detector. 4 is a graph for explaining calculation results by simulation of the intensity of X-rays reaching a detector; FIG. 4 is a schematic cross-sectional view showing another example of the X-ray generator; It is a schematic diagram which shows the structure of the system which has an inspection apparatus. 1 is a block configuration diagram of a manufacturing system; FIG. It is the flowchart which showed the flow of the process by a manufacturing system.

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In addition, components in the following embodiments include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those that fall within a so-called equivalent range. Furthermore, the constituent elements disclosed in the following embodiments can be combined as appropriate.

In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is the Z-axis direction, a direction perpendicular to the Z-axis direction in the horizontal plane is the X-axis direction, and a direction perpendicular to both the Z-axis direction and the X-axis direction (that is, the vertical direction) is the Y-axis direction. Also, the rotation (inclination) directions about the X-axis, Y-axis, and Z-axis are defined as θX, θY, and θZ directions, respectively.

1 and 2 are schematic configuration diagrams showing an example of an inspection apparatus according to this embodiment. An inspection apparatus 100 as an X-ray apparatus according to the present embodiment irradiates an object S to be measured with X-rays and detects transmitted X-rays that have passed through the object S to be measured. X-rays are electromagnetic waves with a wavelength of about 1 pm to 30 nm, for example. The x-rays include at least one of ultra-soft x-rays of about 50 eV, soft x-rays of about 0.1-2 keV, x-rays of about 2-20 keV, and hard x-rays of about 20-1000 eKV. Inspection devices using X-rays, for example, JP-A-60-210087, JP-A-7-308313, JP-A-2013-113798, JP-A-2013-174495, JP-A-2017-22054 This is disclosed in Japanese Patent Laid-Open Publication No. 2018-536978.

In this embodiment, the inspection apparatus 100 irradiates the object S with X-rays, detects the transmitted X-rays that have passed through the object S, and obtains information on the inside of the object S (for example, the internal structure). It includes an X-ray CT inspection device that acquires non-destructively. In this embodiment, the measurement object S includes, for example, mechanical parts, electronic parts, and other industrial parts. X-ray CT inspection systems include industrial X-ray CT inspection systems that irradiate industrial parts with X-rays to inspect the industrial parts.

In FIG. 1, an inspection apparatus 100 includes a measurement apparatus 1 that irradiates an object S with X-rays and detects transmitted X-rays, and a control apparatus 7 that controls the overall operation of the inspection apparatus 100 including the measurement apparatus 1. I have. The measurement apparatus 1 includes an X-ray generator 2 that emits X-rays XL, a shielding device 3 that shields at least part of the X-rays, a stage device 4 that can hold and move an object S, and an X-ray source. 2 and a detector 5 for detecting transmitted X-rays that have passed through an object S held by the stage device 4 .

In this embodiment, the X-ray generator 2 and the shielding device are arranged such that the optical axis of the X-ray XL emitted from the X-ray generator 2 toward the detector 5 through the shielding device 3 is along the Z-axis. A device 3 and a detector 5 are installed. A detection surface of the detector 5 is set parallel to a plane (XZ plane) perpendicular to the optical axis of the X-ray XL. In this embodiment, the X-ray generator 2 and the shielding device 3 are arranged on the pedestal B. As shown in FIG.

In this embodiment, the inspection apparatus 100 also includes a chamber member 6 that forms an internal space SP in which the X-rays XL emitted from the X-ray generator 2 travel. In this embodiment, the X-ray generator 2, the shielding device 3, the stage device 4, the detector 5, and the pedestal B are arranged in the internal space SP.

In this embodiment the chamber member 6 is arranged on the support surface FR. The support surface FR includes the floor surface of a factory or the like. The chamber member 6 is supported by a plurality of support members 6S. The chamber member 6 is arranged on the support surface FR via the support member 6S. In this embodiment, the support member 6S separates the lower surface of the chamber member 6 from the support surface FR. That is, a space is formed between the lower surface of the chamber member 6 and the support surface FR. Note that at least a portion of the lower surface of the chamber member 6 may contact the support surface FR.

In this embodiment, the chamber member 6 contains lead. The chamber member 6 suppresses leakage of the X-rays XL in the internal space SP to the external space RP of the chamber member 6 .

In this embodiment, the inspection apparatus 100 has a member 6</b>D attached to the chamber member 6 and having a lower thermal conductivity than the chamber member 6 . In this embodiment, the member 6D is arranged on the outer surface of the chamber member 6. As shown in FIG. The member 6D suppresses the temperature of the internal space SP from being affected by the temperature (temperature change) of the external space RP. That is, the member 6D functions as a heat insulating member that suppresses the heat of the outer space RP from being transferred to the inner space SP. Member 6D includes, for example, plastic. In this embodiment, the member 6D contains foamed polystyrene, for example.

The X-ray generator 2 irradiates the measurement object S with X-rays XL. The X-ray generator 2 has an emission section 50B that emits X-rays XL. The X-ray generator 2 forms a point X-ray source. In this embodiment, the X-ray generator 2 includes a point X-ray source (X-ray generation point). The X-ray generator 2 irradiates the object S with conical X-rays (so-called cone beam). The X-ray generator 2 may be able to adjust the intensity of the emitted X-rays XL. When adjusting the intensity of the X-rays XL emitted from the X-ray generator 2, it may be based on the X-ray absorption characteristics of the measurement object S or the like. Further, the shape in which the X-rays emitted from the X-ray generator 2 spread is not limited to a conical shape, and may be, for example, fan-shaped X-rays (a so-called fan beam). Alternatively, for example, linear X-rays (so-called pencil beam) may be used.

The emission part 50B of the X-ray generator 2 faces the +Z direction. In this embodiment, at least part of the X-rays XL emitted from the emission part 8 travel in the +Z direction in the internal space SP. The configuration of the X-ray generator 2 will be described later.

The shielding device 3 is arranged on the +Z direction side of the X-ray generator 2 . The shielding device 3 includes a shield 3A and a moving part 3M. FIG. 3 is a schematic diagram of a shield according to this embodiment. The shield 3A is irradiated with the X-rays XL emitted from the X-ray generator 2 . The shield 3A transmits part of the X-rays XL emitted from the X-ray generator 2 and shields (absorbs) the other part. As shown in FIG. 3, the shield 3A includes a transmission member 3B and a shielding portion 3C. The transmissive member 3B is a member such as acrylic that allows the X-rays XL to pass through, and is a plate-like member in this embodiment. The shielding part 3C is a member capable of shielding X-rays, and is made of, for example, tungsten carbide. A plurality of shielding portions 3C are provided in the transparent member 3B. The shielding portions 3C are arranged at predetermined intervals, here equal intervals, in the transmission member 3B in the X-axis direction and the Y-axis direction. The shielding part 3C is a shaft-shaped member in this embodiment, and is arranged on the transmitting member 3B so as to face radially outward in the +Z direction. Here, the term "outside in the radial direction" refers to a direction away from the optical axis _AXL of the X-ray XL when the optical axis AXL is the center. In addition, the shielding part 3C is not limited to a shaft-shaped member, and may be, for example, spherical. In this case, for example, the transmissive member 3B is provided with a plurality of openings facing outward in the radial direction along the +Z direction, and spherical shielding portions 3C are arranged in the respective openings.

The shielding body 3A can be said to be a member in which the shielding portions 3C are provided in a grid pattern. The shield 3A shields (absorbs) the X-rays XL in the region where the shielding part 3C is provided, and transmits the X-rays XL in the region where the shielding part 3C is not provided.

The moving part 3M is a mechanism for moving the shield 3A. The moving unit 3M moves the shield 3A so that the shield 3A overlaps the emitting unit 50B of the X-ray generator 2 in the direction Z, and the shield 3A overlaps the X-ray generator 2 in the direction Z. 2 and the non-superimposed state at a position not overlapping with the second output section 50B. In this embodiment, as shown in FIG. 2, the moving unit 3M moves the shield 3A along the direction X to switch between the superimposed state and the non-superimposed state. For example, the moving unit 3M moves the shield 3A by driving the driving unit that moves the shield 3A by the control device 7 .

The shielding device 3 is used to calculate the scattered light intensity of the X-rays XL. FIG. 4 is a diagram showing an example of an image when X-rays pass through a shield. An image P1 shown in FIG. 4A shows an example of an image of transmitted X-rays that have passed through the object S in the superimposed state. That is, the image P1 is an image of transmitted X-rays transmitted through the measurement object S when the X-ray generator 2 irradiates the measurement object S with the X-rays XL while the shield 3A is superimposed by the moving unit 3M. is. In the superimposed state, the shield 3A is located at a position overlapping the emission part 50B of the X-ray generator 2, so the object S is irradiated with the X-rays XL that have passed through the shield 3A. Since the shield 3A does not transmit X-rays in the region where the shield 3C is provided, the image P1 in the superimposed state includes not only the image _PS of the object S but also the image _PC of the shield 3C. On the other hand, an image P2 shown in FIG. 4B shows an example of an image of transmitted X-rays that have passed through the measurement object S in the non-superimposed state. That is, the image P2 is the transmission X-ray transmitted through the measurement object S when the shield 3A is set in a non-superimposed state by the moving unit 3M and the X-ray generator 2 irradiates the measurement object S with the X-rays XL. is a statue. In the non-superimposed state, the shield 3A is positioned so as not to overlap the emitting part 50B of the X-ray generator 2, so that the X-rays XL from the X-ray generator 2 reach the object S without passing through the shield 3A. be irradiated. Therefore, the image P2 in the non-superimposed state does not include the image _PC of the shielding portion 3C, but includes the image _PS of the measurement object S.

Here, since the shielding portion 3C does not transmit the X-ray XL, the brightness of the image PC of the shielding portion _3C in the image P1 should be zero. However, since scattered light is actually included, the brightness in the image _PC of the shielding portion 3C does not become zero. Therefore, the intensity (luminance) of the scattered light can be calculated from the luminance of the image _PC of the shielding portion 3C in the image P1. By subtracting the intensity (brightness) of the scattered light calculated based on the image P1 from the image P2, it is possible to generate an image of the measurement object S from which the scattered light is removed.

As shown in FIG. 1, the stage device 4 includes a stage 9 capable of holding and moving an object S, and a drive system 10 that moves the stage 9 .

In this embodiment, the stage 9 includes a table 12 having a holding portion 11 that holds the reference object 48 and the measurement object S, a first movable member 13 that movably supports the table 12, and a first movable member 13 that moves. It has a second movable member 14 that movably supports the second movable member 14 and a third movable member 15 that movably supports the second movable member 14 .

The table 12 is rotatable while holding the measurement object S on the holding portion 11 . The table 12 can move (rotate) in the θY direction. The first movable member 13 is movable in the X-axis direction. When the first movable member 13 moves in the X-axis direction, the table 12 moves in the X-axis direction together with the first movable member 13 . The second movable member 14 is movable in the Y-axis direction. When the second movable member 14 moves in the Y-axis direction, the first movable member 13 and the table 12 move in the Y-axis direction together with the second movable member 14 . The third movable member 15 is movable in the Z-axis direction. When the third movable member 15 moves in the Z-axis direction, the second movable member 14, the first movable member 13, and the table 12 move in the Z-axis direction together with the third movable member 15.

In this embodiment, the drive system 10 includes a rotary drive device 16 that rotates the table 12 on the first movable member 13 around the Y-axis, and a rotation drive device 16 that moves the first movable member 13 on the second movable member 14 in the X-axis direction. a first driving device 17 that moves the second movable member 14 in the Y-axis direction; and a third driving device 19 that moves the third movable member 15 in the Z-axis direction.

The second driving device 18 includes a threaded shaft 20B arranged on the nut of the second movable member 14, and an actuator 20 that rotates the threaded shaft 20B. The screw shaft 20B is rotatably supported around the Y-axis by bearings 21A and 21B. In this embodiment, the screw shaft 20B is supported by bearings 21A and 21B so that the axis of the screw shaft 20B and the Y-axis are substantially parallel. In this embodiment, balls are arranged between the nut of the second movable member 14 and the screw shaft 20B. That is, the second drive device 18 includes a so-called ball screw drive mechanism.

The third driving device 19 includes a threaded shaft 23B arranged on the nut of the third movable member 15, and an actuator 23 that rotates the threaded shaft 23B. The screw shaft 23B is rotatably supported by bearings 24A and 24B. In this embodiment, the screw shaft 23B is supported by bearings 24A and 24B so that the axis of the screw shaft 23B and the Z-axis are substantially parallel. In this embodiment, a ball is arranged between the nut of the third movable member 15 and the screw shaft 23B. That is, the third drive device 19 includes a so-called ball screw drive mechanism.

The third movable member 15 has a guide mechanism 25 that guides the second movable member 14 in the Y-axis direction. The guide mechanism 25 includes rail-shaped guide members 25A and 25B extending in the Y-axis direction. At least part of the second driving device 18 including bearings 21A and 21B supporting the actuator 20 and the screw shaft 20B is supported by the third movable member 15 . As the actuator 20 rotates the screw shaft 20B, the second movable member 14 moves in the Y-axis direction while being guided by the guide mechanism 25 .

In this embodiment, the inspection device 100 has a base member 26 . A base member 26 is supported by the chamber member 6 . In this embodiment, the base member 26 is supported by the inner wall (inner surface) of the chamber member 6 via a support mechanism. The position of the base member 26 is fixed at a predetermined position.

The base member 26 has a guide mechanism 27 that guides the third movable member 15 in the Z-axis direction. The guide mechanism 27 includes rail-shaped guide members 27A and 27B extending in the Z-axis direction. At least part of the third driving device 19 including bearings 24A and 24B supporting the actuator 23 and the screw shaft 23B is supported by the base member 26 . As the actuator 23 rotates the screw shaft 23B, the third movable member 15 moves in the Z-axis direction while being guided by the guide mechanism 27 .

Although not shown, in this embodiment, the second movable member 14 has a guide mechanism that guides the first movable member 13 in the X-axis direction. The first drive device 17 includes a ball screw mechanism capable of moving the first movable member 13 in the X-axis direction. The rotation drive device 16 includes a motor capable of moving (rotating) the table 12 in the θY direction.

In this embodiment, a reference object 48 is placed on the table 12 and the measurement object S is placed on the reference object 48 . The reference object 48 and the workpiece S held on the table 12 can be moved by the drive system 10 in four directions of X-axis, Y-axis, Z-axis and θY direction.

The drive system 10 may move the workpiece S held on the table 12 in six directions of the X-axis, Y-axis, Z-axis, θX, θY, and θZ directions. Moreover, in the present embodiment, the drive system 10 includes a ball screw drive mechanism, but may include, for example, a voice coil motor. For example, drive system 10 may include a linear motor or a planar motor.

In this embodiment, the stage 9 is movable in the internal space SP. The stage 9 is arranged on the +Z side of the injection section 8 . The stage 9 is movable in the space on the +Z side of the injection section 8 in the internal space SP. At least part of the stage 9 can face the injection section 8 . The stage 9 can arrange the held measurement object S at a position facing the injection section 8 . The stage 9 can place the measurement object S on the path through which the X-rays XL emitted from the emission part 8 pass. The stage 9 can be arranged within the irradiation range of the X-rays XL emitted from the emission part 8 .

In this embodiment, the inspection apparatus 100 has a measurement system 28 that measures the position of the stage 9 . In this embodiment, measurement system 28 includes an encoder system.

The measurement system 28 includes a rotary encoder 29 that measures the amount of rotation of the table 12 (position in the θY direction), a linear encoder 30 that measures the position of the first movable member 13 in the X-axis direction, and a second movable member 13 in the Y-axis direction. It has a linear encoder 31 that measures the position of the member 14 and a linear encoder 32 that measures the position of the third movable member 15 in the Z-axis direction.

In this embodiment, the rotary encoder 29 measures the amount of rotation of the table 12 with respect to the first movable member 13 . The linear encoder 30 measures the position of the first movable member 13 with respect to the second movable member 14 (position in the X-axis direction). The linear encoder 31 measures the position of the second movable member 14 with respect to the third movable member 15 (position in the Y-axis direction). The linear encoder 32 measures the position of the third movable member 15 with respect to the base member 26 (position in the Z-axis direction).

The rotary encoder 29 includes, for example, a scale member 29A arranged on the first movable member 13, and an encoder head 29B arranged on the table 12 and detecting the scale of the scale member 29A. The scale member 29A is fixed to the first movable member 13. As shown in FIG. Encoder head 29B is fixed to table 12 . The encoder head 29B can measure the amount of rotation of the table 12 with respect to the scale member 29A (first movable member 13).

The linear encoder 30 includes, for example, a scale member 30A arranged on the second movable member 14, and an encoder head 30B arranged on the first movable member 13 and detecting the scale of the scale member 30A. The scale member 30A is fixed to the second movable member 14. As shown in FIG. The encoder head 30B is fixed to the first movable member 13. As shown in FIG. The encoder head 30B can measure the position of the first movable member 13 with respect to the scale member 30A (second movable member 14).

The linear encoder 31 includes a scale member 31A arranged on the third movable member 15 and an encoder head 31B arranged on the second movable member 14 to detect the scale of the scale member 31A. The scale member 31A is fixed to the third movable member 15. As shown in FIG. The encoder head 31B is fixed to the second movable member 14. As shown in FIG. The encoder head 31B can measure the position of the second movable member 14 with respect to the scale member 31A (third movable member 15).

The linear encoder 32 includes a scale member 32A arranged on the base member 26, and an encoder head 32B arranged on the third movable member 15 and detecting the scale of the scale member 32A. The scale member 32A is fixed to the base member 26. As shown in FIG. The encoder head 32B is fixed to the third movable member 15. As shown in FIG. The encoder head 32B can measure the position of the third movable member 15 with respect to the scale member 32A (base member 26).

The detector 5 is arranged on the +Z side of the X-ray generator 2 and the stage 9 in the internal space SP. The position of detector 5 is fixed at a predetermined position. Note that the detector 5 may be movable. The stage 9 can move in the space between the X-ray generator 2 and the detector 5 in the internal space SP.

The detector 5 includes a scintillator section 34 having an incident surface 33 on which X-rays XL from the X-ray generator 2 including transmitted X-rays transmitted through the object S are incident, and a light receiving section 34 for receiving the light generated in the scintillator section 34. a portion 35; An incident surface 33 of the detector 5 can face the object S held on the stage 9 .

The scintillator section 34 contains a scintillation substance that generates light with a wavelength different from that of the X-rays when hit by the X-rays. The light receiving section 35 includes a photomultiplier tube. A photomultiplier tube includes a phototube that converts light energy into electrical energy by the photoelectric effect. The light receiving section 35 amplifies the light generated in the scintillator section 34, converts it into an electrical signal, and outputs it.

The detector 5 has a plurality of scintillator sections 34 . A plurality of scintillator units 34 are arranged in the XY plane. The scintillator units 34 are arranged in an array. The detector 5 has a plurality of light receiving sections 35 connected to each of the plurality of scintillator sections 34 . The detector 5 may directly convert the incident X-rays into electrical signals without converting them into light.

The moving mechanism 46 movably supports the detector 5 . The moving mechanism 46 includes a driving device that moves the detector 5 at least in the Z-axis direction (the direction in which it advances and retreats with respect to the X-ray generator 2 and the stage 9). The moving mechanism 46 may be a mechanism for moving the detector 5 in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θY direction, similarly to the stage 9 .

Next, the structure of the X-ray generator will be described. FIG. 5 is a schematic cross-sectional view of the X-ray generator according to this embodiment. As shown in FIG. 5, the X-ray generator 2 according to the present embodiment includes a housing 50, an electron emission section 52, a storage section 54, an X-ray emission section 56, a decompression section 58, a power supply 60, 62, a wiring housing portion 64, and wirings L1 and L2. The housing 50 is a housing that houses the storage section 54 and the X-ray emitting section 56 inside. The housing 50 has a surface 50A on the +Z direction side, and an emission section 50B is provided. The emission part 50B is not an opening in the surface 50A but a closed part in the surface 50A, but has a smaller thickness than the surroundings. However, the shape of the output portion 50B is arbitrary, and it is not limited to being thinner than the surroundings. Since the housing 50 is made of a light element member such as aluminum, the emission section 50B is also made of a light element member such as aluminum. The light element member is a member containing an element having an atomic number smaller than that of the X-ray emitting portion 56 (for example, tungsten), which will be described later, and is more preferably aluminum.

The housing 50 is connected to the decompression section 58 . The decompression unit 58 is a device that evacuates the space SP in the housing 50 and evacuates the space SP. The decompression unit 58 is, for example, an exhaust pump. The housing 50 maintains the space SP in a vacuum state by discharging internal gas to the decompression unit 58 . However, the inside of the space SP is not limited to being a vacuum, and the partial pressure of a gas such as oxygen may be lower than that of the atmosphere. That is, the housing 50 maintains the internal space SP in a reduced pressure or a vacuum.

The electron emission unit 52 is a mechanism that emits an electron beam E (electrons). The electron emitter 52 includes an electron source housing 52A, an electron source 52B, and an intermediate electrode 52C. 52 A of electron source housing|casings are housing|casings which accommodate the electron source 52B inside. 52 A of electron source housing|casings are connected to the housing|casing 50, and internal space SP1 is connecting with space SP of the housing|casing 50. FIG. Therefore, the space SP<b>1 inside the electron source housing 52</b>A is also kept at a reduced pressure or a vacuum by the pressure reducing section 58 . In this embodiment, the electron emitter 52 (electron source housing 52A) is connected to the surface 50C of the housing 50 on the +Y direction side. That is, the electron emitting portion 52 is connected to a surface 50C different from the surface 50A on which the emitting portion 50B of the housing 50 is provided. However, the electron emitting portion 52 is not limited to the surface 50C and may be provided at any position.

The electron source 52B is a mechanism that emits electron beams E, and is a filament in this embodiment. The electron source 52B is made of a material containing tungsten, for example, and is configured to have a sharp tip toward the X-ray emitting portion 56 . The intermediate electrode 52C is arranged on the side where the X-ray emitting portion 56 is provided, that is, on the -Y direction side in this case, with respect to the electron source 52B. 52 C of intermediate electrodes are provided with opening 52D which penetrates from the surface by the side of the electron source 52B to the surface by the side of the X-ray emission part 56. As shown in FIG.

The housing portion 54 is a member that houses the X-ray emitting portion 56 therein. The storage portion 54 is formed with a space 54C, an incident path 70 and an exit path 72 . In addition, an insertion member 76 and a member 80 at least partly containing a light element are attached to the housing portion 54 . The member 80 is a light element member 80 containing light elements.

FIG. 6 is a schematic enlarged cross-sectional view of the storage portion according to the present embodiment. The storage part 54 is made of a member capable of absorbing the X-rays XL. In this embodiment, the storage portion 54 is made of a material containing tungsten, and more specifically, made of tungsten. A space 54C is formed inside the housing portion 54, and the X-ray emitting portion 56 is housed in the space 54C. The incident path 70 is an opening formed in the housing portion 54 and is provided from one end portion 70A to the other end portion 70B. An end portion 70A of the incident path 70 is formed on the surface 54A of the storage portion 54, and an end portion 70B of the incident path 70 communicates with the space 54C. That is, incident path 70 extends from surface 54A to space 54C. Note that the surface 54A is the surface of the storage section 54 on the electron emission section 52 side, which is the surface on the +Y direction side in this embodiment. Therefore, the incident path 70 can be said to be a path formed between the electron emitting portion 52 and the X-ray emitting portion 56. More specifically, the incident path 70 is arranged inside the housing 50 (inside the storage portion 54) to It can be said that this is the path through which the electron beam E from the emission section 52 reaches the X-ray emission section 56 .

In this embodiment, the incident path 70 is a cylindrical opening with a constant inner diameter from the end 70A to the end 70B. Further, assuming that the central axis of the incident path 70 is the axis AX1, the axis AX1 intersects the Z-axis direction. In this embodiment, the axis AX1 is inclined toward the +Z direction side (direction side from the X-ray emitting portion 56 to the emitting portion 50B) as it goes to the -Y direction side. However, the incident path 70 is not limited to a cylindrical shape, and the direction of the axis AX1 is not limited to that described above.

The exit path 72 is an opening formed in the housing portion 54 and is provided from one end 72A to the other end 72B. An end portion 72A of the output path 72 is formed on the surface 54B of the storage portion 54, and an end portion 72B of the output path 72 communicates with the space 54C. That is, the exit path 72 is provided from the surface 54B to the space 54C. Since the exit path 72 is connected to the end 70A of the incident path 70 at the end 72B, the exit path 72 and the incident path 70 communicate with each other. In addition, the surface 54B is the surface of the housing portion 54 on the output portion 50B side, and in this embodiment, the surface on the +Z direction side. Therefore, the exit path 72 can be said to be a path formed between the X-ray emitting portion 56 and the emitting portion 50B. It can be said that this is the path for the X-ray XL from the emission part 56 to reach the emission part 50B.

In this embodiment, the exit path 72 is an opening formed in a truncated cone shape, and the inner diameter increases toward the end portion 72B, that is, toward the exit portion 50B. In addition, the exit path 72 preferably has an inner diameter smaller than that of the incident path 70 on the side of the end portion 72A. Furthermore, the area of the region of the emission path 72 that does not overlap with the X-ray emitting portion 56 when viewed from the +Z direction side is preferably small, and the area of that region should be smaller than the inner diameter of the incidence path 70 . is preferred. Assuming that the central axis of the output path 72 is the axis AX2, the axis AX2 intersects the axis AX1 of the incident path 70. As shown in FIG. That is, the outgoing path 72 and the incoming path 70 intersect. In this embodiment, the axis AX2 of the output path 72 extends along the Z-axis direction. However, the exit path 72 is not limited to the truncated cone shape, and the direction of the axis AX2 is not limited to that described above.

The X-ray emitting section 56 is provided within the space 54C of the storage section 54 . The X-ray emitting part 56 is a so-called target, and is a member that generates X-rays when electrons collide with it. The X-ray emitting portion 56 is made of a material containing tungsten in this embodiment, and more specifically made of tungsten. The X-ray emitting portion 56 emits X-rays XL by being irradiated with the electron beam E from the electron emitting portion 52 . In the present embodiment, the X-ray emitting portion 56 has a curved surface, and when irradiated with the electron beam E from the incident path 70, the X-rays are emitted toward the exit path 72, that is, in the +Z direction. Emit line XL. However, the shape of the X-ray emitting portion 56 is not limited to a curved surface and may be arbitrary.

The insertion member 76 is a member inserted into the incident path 70 . The insertion member 76 is composed of a member capable of absorbing the X-rays XL. In this embodiment, the insert member 76 is made of a material containing tungsten, more specifically, an alloy of tungsten and copper. The insertion member 76 is a tubular member extending from one end 76A to the other end 76B and is open from the end 76A to the end 76B. The end portion 76A is provided with a flange. By inserting the insertion member 76 into the incident path 70 from the end 76B side, the end 76B is positioned on the end 70B side of the incident path 70, and the end 76A is positioned on the end 70A side of the incident path 70. are doing. However, the end portion 76B of the insertion member 76 is located closer to the end portion 70A than the end portion 70B of the incident path 70, and does not reach the space 54C (X-ray emitting portion 56). A light element member 82, which will be described later, is provided between the end portion 76B of the insertion member 76 and the space 54C (X-ray emitting portion 56).

The light element member 80 is a member arranged in the path of the X-rays XL from the X-ray emitting portion 56 to the emitting portion 50B. The light element member 80 is a member containing an element whose atomic number is smaller than that of the X-ray emitting portion 56 (here, tungsten). The light element member 80 is, for example, aluminum in this embodiment.

Note that the light element member 80 is not limited to aluminum, and may be copper.
Further, for example, the light element member 80 may be a light metal material such as aluminum (Al) or titanium (Ti), a ceramic material such as silicon carbide (SiC), or a carbon material such as pyrographite. I do not care. Note that pyrographite is a carbon material produced by depositing a hydrocarbon gas on a graphite or carbon fiber substrate. Also known as pyrolytic graphite or pyrocarbite.
Further, for example, the light element member 80 may be an aluminum alloy or a titanium alloy. In addition, at least part of the member in the path is not limited to the case where it is composed of the above materials (aluminum, aluminum alloy, titanium, titanium alloy, silicon carbide, pyrographite, etc.), but at least one of the above materials or the above materials It may be coated with the material contained in the part.
Further, the light element member 80 may include an X-ray emitting member as long as measurement failure can be suppressed by suppressing generation of secondary X-rays, which will be described later. For example, when the X-ray emitting member is tungsten, the light element member 80 may contain tungsten. For example, when an alloy containing tungsten and aluminum, which is a light element relative to tungsten, is used, tungsten may be contained at 10% by weight. The weight ratio is not limited to this, and may be 5% or 20%. Tungsten or other substances may be contained depending on the extent to which measurement failure should be suppressed.

The light element member 80 includes a first light element member 82 , a second light element member 84 and a third light element member 86 . The first light element member 82 is provided between the incident path 70 and the exit path 72 . Since the end portion 70B of the incident path 70 and the end portion 72B of the output path 72 are connected, the first light element member 82 is located at the connection point between the end portion 70B of the incident path 70 and the end portion 72B of the output path 72. It can be said that it is provided in In addition, since the incident path 70 and the exit path 72 are in communication and intersect each other, it can be said that the first light element member 82 is arranged at the portion 78 where the incident path 70 and the exit path 72 intersect. .

More specifically, the first light element member 82 has a tube portion 82A and a wall portion 82B. The tube portion 82A is a tubular member that is provided in the incident path 70 and opens from one end portion 82Aa to the other end portion 82Ab. The tube portion 82A is provided at the end portion 70B of the incident path 70 and covers the inner peripheral surface of the end portion 70B of the incident path 70 . The tube portion 82A is provided between the insertion member 76 and the space 54C (X-ray emission portion 56), and is located inside the incident path 70 between the insertion member 76 and the space 54C (X-ray emission portion 56). covering the circumference. In this embodiment, the end portion 82Aa of the tube portion 82A contacts the end portion 76B of the insertion member 76. As shown in FIG. The end portion 82Ab of the tube portion 82A is located near the surface of the X-ray emitting portion 56 on the X-ray emitting portion 56 side (−Z direction side), but does not contact the surface of the X-ray emitting portion 56. , away from the surface of the X-ray emitting portion 56 .

The wall portion 82B is a plate-like (wall-like) member and extends from the end portion 82Ab of the pipe portion 82A. The wall portion 82B is not provided over the entire circumference of the end portion 82Ab of the pipe portion 82A, and the portion of the end portion 82Ab on the output path 72 side (+Z direction side) of the entire circumference of the end portion 82Ab of the pipe portion 82A. is provided in The wall portion 82B has an end portion 82Ba connected to a portion on the output path 72 side (+Z direction side) of the end portion 82Ab of the tube portion 82A, and a space 54C (X-ray emitting portion 56 ) side, which is the -Y direction side in this case. Furthermore, the portion of the end portion 82Ab of the tube portion 82A on the output path 72 side (+Z direction side) is located at a portion 78 where the incident path 70 and the output path 72 intersect. Therefore, it can be said that the wall portion 82B extends from the portion 78 where the incident path 70 and the emission path 72 intersect toward the space 54C (X-ray emitting portion 56). Therefore, the wall portion 82B can be said to be provided between the incident path 70 and the exit path 72, is provided at the portion 78 where the incident path 70 and the exit path 72 intersect, and extends from the portion 78 to the space 54C (X-ray emitting portion). 56) side. Since the wall portion 82B is provided at such a position, it overlaps with the output path 72 and blocks at least a portion of the output path 72 when viewed from the Z-axis direction. It can be said that the wall portion 82B is arranged in the path along which the X-rays from the X-ray emitting portion 56 reach the emitting portion 50B.

The extending direction, which is the direction from the end portion 82Aa to the end portion 82Ab of the tube portion 82A, is along the extending direction of the incident path 70, that is, along the axis AX1. On the other hand, it is preferable that the extending direction of the wall portion 82B, which is the direction from the end portion 82Ba to the end portion 82Bb, is inclined with respect to the axis AX1. It is preferable that the wall portion 82B is inclined in the -Z direction (the direction from the emission portion 50B to the X-ray emission portion 56) with respect to the axis AX1 as it goes from the end portion 82Ba to the end portion 82Bb. However, the extending direction, which is the direction from the end 82Ba to the end 82Bb of the wall portion 82B, may also be along the extending direction of the incident path 70, that is, along the axis AX1. Further, in the direction along the axis AX1, when the inner peripheral surface of the insertion member 76 is virtually extended along the axis AX1, the space occupied by the inner peripheral surface of the insertion member 76 is defined as a space AR (Fig. 6 reference). In this case, the wall portion 82B is preferably located outside the space AR without being inside the space AR. That is, the space AR is a space through which the electron beam E from the electron emitting portion 52 passes in the incident path 70, and the wall portion 82B is outside the space AR through which the electron beam E from the electron emitting portion 52 passes in the incident path 70. preferably in

In addition, although the end portion 82Bb of the wall portion 82B is located near the surface of the X-ray emitting portion 56, it does not contact the surface of the X-ray emitting portion 56 and is separated from the surface of the X-ray emitting portion 56. is preferred.

As described above, the first light element member 82 includes the pipe portion 82A and the wall portion 82B, and may include at least one of the pipe portion 82A and the wall portion 82B.

A second light element member 84 is provided in the exit path 72 . Furthermore, the second light element member 84 is a tubular member, is provided on the inner peripheral surface of the output path 72 , and covers the inner peripheral surface of the output path 72 . The second light element member 84 preferably covers the inner peripheral surface of the output path 72 from the end 72A to the end 72B of the output path 72 . In addition, the second light element member 84 is provided from the end 72A of the output path 72 to the portion 78 where the incident path 70 and the output path 72 intersect. It can be said that it is preferable to cover the inner peripheral surface. The diameter of the second light element member 84 increases toward the end portion 72A in conformity with the shape of the emission path 72 .

A third light element member 86 is provided in the exit path 72 . Furthermore, the third light element member 86 is a plate-like (wall-like) member provided at the end portion 72A of the output path 72 . The third light element member 86 is provided so as to overlap the end portion 72A of the emission path 72 when viewed from the Z-axis direction, and overlaps the entire end portion 72A of the emission path 72 when viewed from the Z-axis direction. That is, the third light element member 86 blocks the emission path 72 when viewed from the Z-axis direction. However, the third light element member 86 is not limited to overlapping the entire emission path 72, and may overlap at least a portion of the emission path 72 when viewed from the Z-axis direction.

As shown in FIG. 5, the power supply 60 is connected to the electron source 52B via the wiring L1. Further, the housing 50, the electron source housing 52A, and the intermediate electrode 52C are grounded and held at ground potential. A power supply 60 applies a negative voltage (eg, -225 kV) to the electron source 52B with respect to the intermediate electrode 52C, which is at ground potential. Also, the power supply 62 is connected to the X-ray emitting unit 56 via the wiring L2. The wiring L2 is covered with the wiring housing portion 64 inside the housing 50 . The power supply 62 applies a positive voltage (for example, +225 kV) to the X-ray emitting section 56 with respect to the intermediate electrode 52C, which is ground potential. Therefore, the electron source 52B applies a large negative voltage (eg, -450 kV) to the X-ray emitting section . Note that the storage portion 54 is held at the ground potential by being grounded. Also, since the light element member 80 is in contact with the storage portion 54, it is grounded through the storage portion 54 and held at the ground potential.

In this way, by applying a negative voltage to the electron source 52B and applying a separate heating current to the electron source 52B, the electron source 52B is heated, and an electron beam E (thermal electrons) is emitted from the tip of the electron source 52B. be done. In other words, the electron source 52B functions as a cathode that emits electron beams E when a high voltage is applied by the power source 60 . As described above, in this embodiment, the cathode uses thermionic electrons generated by heating the filament. However, the electron beam E is emitted by forming a strong electric field around the cathode without heating the cathode. It may be a material, a cathode using the Schottky effect, or the like.

7 and 8 are schematic diagrams for explaining the generation of X-rays. The electron beam E emitted from the electron source 52B travels toward the X-ray emitting portion 56 while being accelerated by the potential difference (for example, 450 kV) between the electron source 52B and the X-ray emitting portion 56 . That is, the electron beam E emitted from the electron source 52B is converged by an electro-optical member (not shown) provided in the electron emitting portion 52, and as shown in FIG. The light enters the incident path 70 of the storage section 54 through the space SP. As shown in FIG. 7, the electron beam E enters the incident path 70 from the end 70A of the incident path 70, passes through the incident path 70, and irradiates the surface of the X-ray emitting portion 56. As shown in FIG. When irradiated with the electron beam E, the X-ray emitting unit 56 generates X-rays XL in the +Z direction. The X-rays XL generated by the X-ray emitting unit 56 enter the output path 72 from the end 72B of the output path 72, travel through the output path 72, and exit the storage unit 54 from the end 72A of the output path 72. , that is, into the space SP of the housing 50, passes through the space SP, and is emitted to the outside of the housing 50 from the emission section 50B. The X-rays XL emitted from the X-ray emitting portion 56 have a so-called cone beam shape. The traveling direction of the electron beam E irradiated to the X-ray emitting portion 56 is along the axis AX1, and the traveling direction of the X-ray XL emitted from the X-ray emitting portion 56 is along the axis AX2. Therefore, in the present embodiment, the traveling direction of the electron beam E incident on the X-ray emitting portion 56 and the traveling direction of the X-ray XL emitted from the X-ray emitting portion 56 are different.

Here, the X-ray emitting unit 56 may reflect part of the irradiated electron beam E. As shown in FIG. The reflected electron beam E collides with the inner peripheral surface of the storage section 54 or the like, and X-rays are generated from the storage section 54 . Further, the electron beam E is also reflected by the housing portion 54, and the reflected electron beam E collides with other portions of the housing portion 54 and the X-ray emitting portion 56, and X-rays may also be generated therefrom. Hereinafter, the X-rays XL emitted from the X-ray emitting portion 56 and transmitted through the emitting portion 50B and the object S to reach the detector 5 are defined as primary X-rays, and X-rays other than the primary X-rays are defined as secondary X-rays. line. That is, the secondary X-rays can be said to be scattered light, and include X-rays generated by the electron beams E reflected by the X-ray emitting portion 56 and the storage portion 54, and the like. Such secondary X-rays may reach the detector 5 through the emission part 50B. Furthermore, the secondary X-rays may reach the detector 5 without passing through the measurement object S, for example, because the X-ray generating portion has a large spread. Since the detector 5 detects not only the primary X-rays that have passed through the measurement object S but also the secondary X-rays that have reached the detector 5 without passing through the measurement object S in this way, there is an error in detecting the measurement object S. may cause Therefore, in order to suppress deterioration in inspection accuracy of the measurement object S, it is effective to suppress secondary X-rays from reaching the detector 5 .

Furthermore, when the reflected electron beam E is directed toward the emitting portion 50B side, the electron beam E hits, for example, the inner peripheral surface of the emitting path 72, and the electron beam E moves from the inner peripheral surface of the emitting path 72 to the emitting portion 50B side, that is, the detection. Secondary X-rays directed toward the device 5 are generated. Therefore, in order to prevent the secondary X-rays from reaching the detector 5, it is important to prevent the electron beam E directed toward the emission section 50B from hitting the inner peripheral surface of the emission path 72. . The X-ray generator 2 according to the present embodiment suppresses generation of secondary X-rays reaching the detector 5 by absorbing the electron beam E directed toward the emitting portion 50B with the light element member 80 . That is, since the light element member 80 has a smaller atomic number than the X-ray emitting portion 56, even if the electron beam E is irradiated, it can absorb the electron beam E without generating X-rays. Furthermore, the light-element member 80 is arranged in the path of the X-rays from the X-ray emitting portion 56 to the emitting portion 50B. Therefore, the light element member 80 can receive and absorb the electron beam E directed toward the emitting portion 50B. Therefore, according to the X-ray generator 2 according to the present embodiment, the electron beam E that causes the secondary X-rays reaching the detector 5 is absorbed to prevent the secondary X-rays from reaching the detector 5. can be suppressed.

Further, light element member 80 includes a first light element member 82 positioned between incident path 70 and exit path 72 . The first light element member 82 shields at least part of the emission path 72 by being arranged between the incident path 70 and the emission path 72 . Therefore, in the X-ray generator 2, the electron beam E directed to the emission path 72, that is, the electron beam E directed to the emission part 50B can be absorbed by the first light element member 82, and the secondary X-rays are emitted to the detector. It is possible to suppress reaching 5. Further, the wall portion 82B of the first light element member 82 is inclined in the −Z direction (direction toward the X-ray emitting portion 56 from the emitting portion 50B) with respect to the axis AX1 toward the end portion 82Bb. there is Therefore, even if the light-element member 80 reflects part of the irradiated electron beam E1 (see FIG. 7), the reflected electron beam E2 (see FIG. 7) can be directed toward the incident path 70 side. is possible, and it is possible to suppress the secondary X-rays from being generated from the X-ray emitting portion 56 by the reflected electron beam E2 being irradiated to the X-ray emitting portion 56 .

Furthermore, the first light element member 82 of the light element member 80 has a tube portion 82A arranged in the incident path 70 . By providing the tube portion 82A in the incident path 70, the electron beam E1 irradiated toward the inner peripheral surface of the incident path 70 can be absorbed by the tube portion 82A. Generation of subsequent X-rays can be suppressed.

Furthermore, the light element member 80 includes a second light element member 84 provided on the inner peripheral surface of the emission path 72 . Therefore, according to the X-ray generator 2 according to the present embodiment, as shown in FIG. It is possible to suppress the secondary X-rays from reaching the detector 5 by suppressing the emission of the secondary X-rays from the . Further, the light element member 80 includes a third light element member 86 provided at the end portion 72A of the emission path 72. As shown in FIG. Therefore, according to the X-ray generator 2 according to the present embodiment, it is possible to absorb the electron beam E1 emitted from the emission path 72, as shown in FIG.

The light element member 80 may include at least one of the first light element member 82, the second light element member 84, and the third light element member 86. of X-rays should be placed in the path leading to the emitting portion 50B. By arranging the light element member 80 on the path of the X-rays from the X-ray emitting part 56 to the emitting part 50B, the electron beam E that causes the secondary X-rays reaching the detector 5 is absorbed. , secondary X-rays can be suppressed from reaching the detector 5 .

The calculation results of the intensity of X-rays reaching the detector 5 by simulation will be described below. FIG. 9 is a diagram for explaining calculation results by simulation of the intensity of X-rays reaching the detector. As a simulation, a Monte Carlo simulator was used to calculate the two-dimensional distribution of X-ray intensity on the XY plane at the Z coordinate where the axis AX1 and the X-ray emitting portion 56 intersect. An image P in FIG. 9 shows an example of a simulation result of the X-ray intensity distribution on the XY plane at the Z coordinate where the axis AX1 and the X-ray emitting portion 56 intersect, calculated from the X-ray information reaching the detector 5. ing. The center C of the image P indicates the center point of the X-ray, and is the position where the axis AX2 overlaps, for example. As described above, the secondary X-rays have a larger spread of the X-ray generator than the primary X-rays. Therefore, as shown in the image P, when the secondary X-rays reach the detector 5, in addition to the image Pa of the primary X-rays converging near the center C, the detector 5 also receives A certain secondary X-ray image Pb is detected. If the light element member 80 is not provided, the arrival of the secondary X-rays to the detector 5 cannot be suppressed. increase in the proportion of

FIG. 10 is a graph for explaining calculation results by simulation of the intensity of X-rays reaching the detector. The horizontal axis of FIG. 10 indicates the distance from the center C on the XY plane in the Z coordinate where the axis AX1 and the X-ray emitting portion 56 intersect, and the vertical axis indicates the X-ray intensity ratio. That is, FIG. 10 shows the integrated value of the ratio of the X-ray intensity at each distance from the center C to the total value of the X-ray intensity in the entire XY plane. Since the primary X-rays converge closer to the center C than the secondary X-rays, the more the secondary X-rays are suppressed from reaching the detector 5, that is, the smaller the intensity ratio of the secondary X-rays, the more the X-rays The integrated value of the intensity ratio of C is higher on the side closer to the center C. Conversely, if the arrival of the secondary X-rays to the detector 5 is not suppressed, the integrated value of the X-ray intensity ratio will be a low value on the side closer to the center C. FIG. A line segment D in FIG. 10 indicates the X-ray intensity ratio when the light element member 80 is provided as in the present embodiment, and a line segment DX in FIG. 4 shows the intensity ratio of X-rays in the case. As shown by the line segment D, when the light element member 80 is provided, the integrated value of the X-ray intensity ratio is closer to the center C than the line segment DX without the light element member 80. It can be seen that it is higher at That is, it can be said that the simulation has shown that the provision of the light element member 80 suppresses the arrival of the secondary X-rays to the detector 5 .

As described above, the X-ray generator 2 according to the present embodiment includes the electron-emitting portion 52 that emits electrons (electron beam E) and the X-ray emitting portion 52 that is irradiated with electrons from the electron-emitting portion 52 and emits X-rays. A housing 50 having a ray emitting part 56 , an emitting part 50</b>B through which X-rays from the X-ray emitting part 56 are emitted, and a light element member 80 . The light element member 80 is arranged in the emission path 72 of the X-rays from the X-ray emitting portion 56 to the emission portion 50B, and contains at least a part of an element having an atomic number smaller than that of the X-ray emitting portion 56 . In the X-ray generator 2 according to this embodiment, secondary X-rays reaching the detector 5 are can be suppressed from reaching the detector 5 by absorbing the electron beam E that causes . Therefore, according to the X-ray generator 2 according to this embodiment, it is possible to suppress deterioration in inspection accuracy of the object S to be measured.

The X-ray generator 2 also includes a storage section 54 that stores the X-ray emitting section 56 , an emission path 72 is formed in the storage section 54 , and a light element member 80 is arranged in the emission path 72 . In the X-ray generator 2 according to the present embodiment, the light element member 80 can be appropriately arranged in the emission path 72 by providing the emission path 72 inside the storage section 54 .

Also, the light element member 80 (second light element member 82 ) is arranged on the inner peripheral surface of the emission path 72 . By providing the light element member 80 in the emission path 72, it is possible to absorb the electron beam E irradiated toward the inner peripheral surface of the emission path 72 and suppress the generation of secondary X-rays.

In addition, the inner diameter of the exit path 72 increases toward the exit portion 50B. By increasing the inner diameter of the exit path 72 toward the exit portion 50B in this manner, the X-rays XL, which are cone beams, can be appropriately guided to the exit portion 50B.

Further, in the X-ray generator 2 , an incident path 70 is formed in the storage section 54 through which electrons (electron beams E) from the X-ray emission section 56 reach the X-ray emission section 56 . A light element member 80 is provided between the incident path 70 and the exit path 72 . In the X-ray generator 2 according to this embodiment, by providing the light element member 80 between the incident path 70 and the exit path 72, it becomes possible to absorb the electron beam E heading for the exit part 50B, and the secondary It is possible to suppress X-rays from reaching the detector 5 .

In the X-ray generator 2, the light element member 80 is arranged at a portion 78 where the incident path 70 and the emission path 72 intersect. By arranging the light element member 80 at the intersecting portion 78, it becomes possible to absorb the electron beam E directed toward the emission portion 50B, and it is possible to suppress the secondary X-rays from reaching the detector 5. Become.

In addition, the X-ray generator 2 includes an incident path 70 arranged in the housing 50 through which electrons from the electron emission section 52 reach the X-ray emission section 56, and an X-ray emission section from the X-ray emission section 56. and an exit path 72 located within housing 50 leading to 50B. A light element member 80 (first light element member 82 ) is provided between the incident path 70 and the exit path 72 . In the X-ray generator 2 according to this embodiment, by providing the light element member 80 between the incident path 70 and the exit path 72, it becomes possible to absorb the electron beam E heading for the exit part 50B, and the secondary It is possible to suppress X-rays from reaching the detector 5 .

The incident path 70 and the exit path 72 intersect, and the light element member 80 (first light element member 82) is arranged along the extension direction of the incident path 70 (axis AX1). By arranging the light element member 80 along the axis AX1, even when the electron beam E is reflected from the light element member 80, the reflected electron beam E is prevented from being applied to the electron emitting portion 52. , the generation of secondary X-rays can be suppressed.

Also, the light element member 80 (the tube portion 82A of the first light element member 82) is provided in the incident path 70. As shown in FIG. By providing the light element member 80 in the incident path 70, it is possible to absorb the electron beam E irradiated toward the inner peripheral surface of the incident path 70 and suppress the generation of secondary X-rays.

Also, the light element member 80 is a conductive member and is electrically grounded. By grounding the light element member 80, even if the electron beam E is irradiated, charging is suppressed. Further, it is desirable that the light element member 80 is made of a material that emits a small amount of gas in a vacuum state.

Further, the housing 50 maintains the inside in a reduced pressure or a vacuum. By keeping the inside of the housing 50 under reduced pressure or vacuum, the X-rays XL can be appropriately generated.

Further, the inspection apparatus 100 according to the present embodiment includes the X-ray generator 2, the stage 9 that holds the measurement object S irradiated with the X-rays XL emitted from the emission unit 50B, and the X-rays XL emitted from the emission unit 50B. a detector 5 for detecting transmitted X-rays XL. The inspection apparatus 100 can suppress the secondary X-rays from reaching the detector 5 by the X-ray generator 2, thereby suppressing deterioration in the inspection accuracy of the object S to be measured.

Note that the shape of the X-ray emitting portion 56 is not limited to that described above. FIG. 11 is a schematic cross-sectional view showing another example of the X-ray generator. Although the X-ray emitting portion 56 shown in FIG. 5 is cylindrical and does not rotate, as shown in the X-ray emitting portion 56a of FIG. 11, it may be configured to rotate instead of being cylindrical. . For example, the X-ray emitting portion 56a in FIG. 11 has a truncated cone shape and rotates about the central axis of the truncated cone. The X-ray emitting part 56a emits the electron beam E to the side surface of the truncated cone and generates the X-rays XL from the side surface.

Although the inspection apparatus 100 of the above-described embodiment performs processing using one apparatus, a plurality of apparatuses may be combined. FIG. 12 is a schematic diagram showing the configuration of a system having an inspection device. Next, a manufacturing system 300 having an inspection device will be described with reference to FIG. 12 . The manufacturing system 300 has an inspection device 100 , a plurality of (two in FIG. 12 ) inspection devices 100 a , and a programming device 302 . The inspection devices 100 and 100a and the program creation device 302 are connected by a wired or wireless communication line. The inspection device 100 a has the same configuration as the inspection device 100 . The program creation device 302 creates various settings and programs created by the control device of the inspection device 100 described above. The program creation device 302 outputs created programs and data to the inspection devices 100 and 100a. The inspection apparatus 100a acquires the information on the area and range and the inspection program from the inspection apparatus 100 and the program creation apparatus 302, and performs processing using the acquired data and program. The manufacturing system 300 can make effective use of the data and programs created by the inspection device 100 and the data and programs created by the program creation device 302 by performing inspections with the inspection device 100a.

Next, a manufacturing system equipped with the inspection device described above will be described with reference to FIG. FIG. 13 is a block configuration diagram of the manufacturing system. The manufacturing system 200 of this embodiment includes the inspection device 100, the design device 202, the molding device 203, the control device 204, and the repair device 205 as described in the above embodiments. The control device 204 includes an internal structure storage section 210 and a determination section 211 .

The design device 202 creates design information regarding the shape and composition of the object S, and transmits the created design information to the molding device 203 . The design device 202 also stores the created design information in the internal structure storage unit 210 of the control device 204 .

The molding device 203 creates the measured object S based on the design information input from the design device 202 . The inspection apparatus 100 inspects the internal structure of the created measurement object S and transmits inspection results (eg, image data) to the control apparatus 204 .

The internal structure storage unit 210 of the control device 204 stores design information. The determination unit 211 of the control device 204 reads the design information from the internal structure storage unit 210 . The determination unit 211 compares the measurement result of the shape of the object S received from the inspection apparatus 100 with the design information read from the internal structure storage unit 210 . Based on the comparison result, the determination unit 211 determines whether or not the workpiece S has been molded according to the design information. In other words, the judgment unit 211 judges whether or not the created measurement object S is a non-defective product. The determination unit 211 determines whether or not the measurement object S is repairable when the measurement object S is not formed according to the design information. If the measurement object S can be repaired, the determination unit 211 calculates the defective portion and the details of repair based on the comparison result, and transmits information indicating the defective portion and information indicating the details of repair to the repair device 205 .

The repair device 205 repairs the defective portion of the structure based on the information indicating the defective portion and the information indicating the content of repair received from the control device 204 .

FIG. 14 is a flow chart showing the flow of processing by the manufacturing system. In the manufacturing system 200, first, the design device 202 creates design information regarding the workpiece S (step S101). Next, the molding device 203 creates the measured object S based on the design information (step S102). Next, the inspection apparatus 100 inspects (measures) the shape of the created measurement object S (step S103). Next, the determination unit 211 of the control device 204 compares the inspection result obtained by the inspection device 100 with the above design information, thereby inspecting whether or not the workpiece S was created according to the design information (step S104).

Next, the judgment unit 211 of the control device 204 judges whether or not the created measurement object S is a non-defective product (step S105). When the determination unit 211 determines that the created measurement object S is a non-defective product (Yes in step S105), the manufacturing system 200 ends the process. Further, when determining that the created measurement object S is not a non-defective product (No in step S105), the determination unit 211 determines whether or not the created measurement object S can be repaired (step S106).

In the manufacturing system 200, when the determination unit 211 determines that the created measurement object S can be repaired (Yes in step S106), the repair device 205 repairs the measurement object S (step S107), and the process of step S103 is performed. back to When the determination unit 211 determines that the created measurement object S cannot be repaired (No in step S106), the manufacturing system 200 ends the process and collects the defective product. With this, the manufacturing system 200 ends the processing of the flowchart shown in FIG.

In the manufacturing system 200 of the present embodiment, the inspection apparatus 100 of the above-described embodiment can inspect the internal structure of the workpiece S with high accuracy, so that it is possible to determine whether the created workpiece S is a non-defective product. be able to. Moreover, the manufacturing system 200 can repair the measurement object S when the measurement object S is not a non-defective product.

The repair process performed by the repair device 205 in this embodiment may be replaced by a process in which the molding device 203 re-executes the molding process. At that time, if the determination unit 211 of the control device 204 determines that the damage can be repaired, the molding device 203 re-executes the molding process.

Although the preferred embodiments of the present invention have been described above with reference to the accompanying drawings, it goes without saying that the present invention is not limited to such examples. The various shapes, combinations, etc., of the constituent members shown in the above examples are merely examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention. Each component of the above-described embodiments can be combined as appropriate. Also, some components may not be used. In addition, as long as laws and regulations permit, disclosures of all publications relating to inspection devices and the like cited in each of the above-described embodiments are incorporated into the description of the present text. Other embodiments, operation techniques, etc. made by those skilled in the art based on the above-described embodiments are all included in the scope of the present embodiment.

1 measuring device 2 X-ray generator 5 detector 50 housing 50B emission part 52 electron emission part 54 storage part 56 X-ray emission part 54C space 70 incident path 72 emission path 80 light element member (member)
82 First light element member 82A Tube portion 82B Wall portion 84 Second light element member 86 Third light element member 100 Inspection device E Electron beam S Object to be measured XL X-ray

Claims (14)

an electron emitting portion that emits electrons;
an X-ray emitting portion that emits X-rays by being irradiated with electrons from the electron emitting portion;
a storage unit that stores the X-ray emitting unit;
a housing having an emitting portion for emitting X-rays from the X-ray emitting portion;
a member arranged on an emission path for the X-rays from the X-ray emission unit to reach the emission unit;
The storage portion and the member are different members,
the member includes at least a portion of an element having an atomic number smaller than that of the X-ray emitting portion;
The output path is formed in the storage portion, and the member is arranged on an inner peripheral surface of the output path.
X-ray generator. 2. The X-ray generator according to claim 1, wherein said storage unit is a member that emits X-rays when irradiated with said electrons. 3. The X-ray generator according to claim 1 , wherein said emission path has an inner diameter that increases toward said emission portion. an incident path for electrons from the electron emission portion to reach the X-ray emission portion is formed in the storage portion;
The X-ray generator according to any one of claims 1 to 3 , wherein said member is also provided between said incident path and said exit path. 5. The X-ray generator according to claim 4 , wherein said member is arranged also at a portion where said incident path and said exit path intersect. The incident path and the exit path intersect,
5. The X-ray generator according to claim 4 , wherein said member is also arranged along the extending direction of said incident path. The X-ray generator according to any one of claims 4 to 6 , wherein said member is arranged also in said incident path. The X-ray generator according to any one of claims 1 to 7 , wherein said member is a conductive member. The X-ray generator according to any one of claims 1 to 8 , wherein the housing maintains the inside thereof under reduced pressure or vacuum. an X-ray generator according to any one of claims 1 to 9 ;
a stage for holding an object to be measured irradiated with X-rays emitted from the emitting part;
and a detector for detecting X-rays irradiated and transmitted through the object to be measured. A design process for creating design information about the shape of the structure;
a molding step of creating the structure based on the design information;
a measuring step of measuring the shape of the fabricated structure using the X-ray apparatus according to claim 10 ;
and an inspection step of comparing the shape information obtained in the measurement step with the design information. 12. The method of manufacturing a structure according to claim 11 , further comprising a repair step of reworking the structure, which is performed based on the comparison result of the inspection step. 13. The method of manufacturing a structure according to claim 12 , wherein said repair step is a step of re-executing said molding step. a design device that creates design information about the shape of a structure;
a molding device that fabricates the structure based on the design information;
an X-ray apparatus according to claim 10 for measuring the shape of the fabricated structure;
and an inspection device that compares shape information about the shape of the structure obtained by the X-ray device with the design information.

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