JP7296861B2 - Lid body, electronic component storage package, and electronic device - Google Patents

Description

The present invention relates to a lid, an electronic component storage package, and an electronic device.

Conventionally, in electronic component storage packages for mounting electronic components such as semiconductor elements and piezoelectric elements, in order to reduce the emission of unnecessary radio waves to the outside, an electric resistor layer with radio wave absorption is provided on the lid. There is a thing (patent document 1).

JP 2005-51112 A

However, depending on the position of the electrical resistor layer of the lid, the operating frequency of the electronic components may be affected, causing malfunction of the electronic components. As a countermeasure, increasing the physical distance between the electronic component and the electrical resistor layer may increase the size of the electronic device.
In addition, it is conceivable that dielectric resonance may occur inside the lid, which is a dielectric.

A lid body according to the present invention is a lid body for an electronic component storage package,
a dielectric layer;
a conductor positioned on the lower surface of the dielectric layer, positioned on the periphery of the lower surface of the dielectric layer and having at least one through hole extending in the vertical direction;
and an electrical resistor positioned in the through hole,
The electrical resistor and the conductor are electrically connected to each other, and the opening of the through-hole on the lower surface of the conductor is ring-shaped when viewed from above .

The electronic component storage package according to the present invention includes the lid,
and an electronic component storage substrate having an upper outer peripheral portion joined to the outer peripheral portion of the lower surface of the lid on the outer periphery of the electronic component mounting portion to store the electronic component.

An electronic device according to the present invention includes the electronic component storage package and an electronic component mounted on the mounting portion.

According to the present invention, the electrical resistor layer in the lid body reduces the emission of unnecessary radio waves to the outside and the dielectric resonance inside the lid body, and the dielectric layer reduces the influence on electronic parts. Electronic parts can be stably operated.

1 is a longitudinal sectional view showing an electronic device according to an embodiment of the invention; FIG. However, the lid is shown in a separated state. It is a bottom view of an example of a lid. FIG. 4 is a cross-sectional view of an example of an end portion of a lid; FIG. 11 is a cross-sectional view of another example of the end portion of the lid; FIG. 10 is a cross-sectional view of still another example of the end portion of the lid; FIG. 11 is a bottom view of another example of the lid; FIG. 10 is a bottom view of still another example of the lid;

Hereinafter, each embodiment of the present invention will be described in detail with reference to the drawings. Regarding the lid, the surface facing the inside of the package is called the “lower surface”, and the opposite surface facing the outside is called the “upper surface”. It does not specify the vertical direction.

As shown in FIG. 1, the electronic component storage package 1 of this embodiment includes a lid 2 and an electronic component storage substrate 3 .
The lid 2 is flat and has an upper surface 21 and a lower surface 22 . The lower surface 22 corresponds to the inner surface of the package and includes the lower surfaces of conductors 25 to be described later.
The electronic component storage substrate 3 has a container shape having a bottom surface portion 31 and an outer peripheral wall portion 32 to form a storage space 33 . It has a mounting portion 34 . Further, the electronic component housing substrate 3 has a predetermined wiring pattern for drawing out the electrodes of the electronic component 4 .
The upper end surface of the outer peripheral wall portion 32 is an upper outer peripheral portion 32 a that joins the seal area 23 b of the lid 2 .
The electronic component 4 is mounted on the mounting portion 34, and the seal area 23b of the lid 2 is joined to the outer peripheral portion 32a of the upper surface of the electronic component storage base 3 by brazing material or the like, so that the electronic component 4 is hermetically sealed in the storage space 33. Then, the electronic device 10 is constructed.

The insulating base material of the lid body 2 and the electronic component housing base 3 is, for example, a ceramic such as an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, a mullite sintered body, or a glass ceramics sintered body. It is a dielectric made of material.

The lid 2 of the electronic component storage package 1 as described above has a dielectric layer 23 , a conductor 25 and an electric resistor 24 . The lower surface of the dielectric layer 23 has a lower surface central portion 23a and a seal area (lower surface outer peripheral portion) 23b on the periphery thereof. Note that the central portion 23a of the lower surface refers to a region including the center of the lower surface of the dielectric layer 23 in plan see-through. The conductor 25 is located on the lower surface of the dielectric layer 23, is located at least on the lower surface outer peripheral portion 23b corresponding to the outer periphery of the electronic component housing package 1, and has at least one through hole 25H (25H1, 25H2). are doing. The electric resistor 24 is located in the through holes 25H (25H1, 25H2).
The lid 2 has an electrical resistor 24 and a conductor 25 located on the underside of the dielectric layer 23 . The conductor 25 is composed of a first conductor 25a and a second conductor 25b.
On the other hand, the electrical resistor 24 is positioned in a portion not selected as the region in which the first conductor 25a and the second conductor 25b are positioned.

The electrical resistor 24 , the first conductor 25 a and the second conductor 25 b are located on the bottom surface 22 of the lid 2 . A first conductor 25a and a second conductor 25b are joined to the lower surface of the dielectric layer 23, and the electric resistor 24, the first conductor 25a and the second conductor 25b are electrically connected to each other.
The first electrical resistor 24a is located in a region corresponding to the inner surface of the electronic component housing package 1, that is, in the central portion 23a of the lower surface. The second conductor 25b is also located in the lower central portion 23a.
The first conductor 25a is located in a lower surface outer peripheral portion (seal area) 23b corresponding to the outer periphery of the inner surface of the electronic component storage package 1 .

A bottom view of the lid 2 is shown in FIG.
As shown in FIG. 2, if the electrical resistor 24 is ring-shaped in plan view and is referred to as a first electrical resistor 24a, the ring-shaped first electrical resistor 24a is divided into an outer side and an inner side to form a first conductor 25a. A second conductor 25b is located. The first conductor 25a is located outside the ring-shaped first electrical resistor 24a, and the second conductor 25b is located inside the ring-shaped first electrical resistor 24a.
The ring-shaped first electrical resistor 24a is in contact with the lower surface outer peripheral portion 23b. Therefore, of the inner surface of the electronic component storage package 1 constituted by the lid body 2, the outer peripheral edge portion of the lower central portion 23a is constituted by the first electrical resistor 24a. The inside of the first electrical resistor 24a is configured by the second conductor 25b.

Dielectric layer 23 overlies electrical resistor 24 and conductor 25 and extends to upper surface 21 .
The first electrical resistor 24a can reduce cavity resonance with the housing space 33 as the resonance space. In addition, the second conductor 25b can reduce the emission of unnecessary radio waves to the outside.
The width Hw1 of the opening Ho1 of the ring-shaped through hole 25H1 is λ/4 or more and λ/2 or less, where λ is the radio wave wavelength at which the electronic component operates. If the width Hw1 of the opening Ho1 is λ/2 or less, it is possible to satisfactorily reduce the emission of unnecessary radio waves to the outside. If the width Hw1 of the opening Ho1 is λ/4 or more, cavity resonance can be favorably reduced.
The line width 24w of the ring-shaped first electrical resistor 24a is λ/4 or more and λ/2 or less, where λ is the radio wave wavelength at which the electronic component operates. If the line width 24w is λ/2 or less, it is possible to satisfactorily reduce the emission of unnecessary radio waves to the outside. If the line width 24w is λ/4 or more, a region of the first electrical resistor 24a capable of satisfactorily reducing cavity resonance can be secured.
At this time, the through hole 25H1 may also be ring-shaped in plan view. The first electric resistor 25a is preferably positioned along the opening surface of the opening Ho1 of the through-hole 25H1 when seen from above. However, where λ is the radio wave wavelength at which the electronic component operates, it is preferably λ/4 or more and λ/2 or less.

As a constituent material of the conductor 25, for example, tantalum nitride (TaN or Ta ₂ N) is applied. The conductor 25 has at least a first layer 251 and a second layer 252 in order downward from the lower surface of the dielectric layer 23 .
As the constituent materials of the first conductor 25a and the second conductor 25b, for example, NiCr is applied as the first layer 251 and Au as the second layer 252 shown in FIG.
As another configuration example, TaN or Ta ₂ N is applied as the electric resistor 24, Ti is applied as the first layer 251, Pd or Ni is applied as the second layer 252, and Au is applied as the third layer 253 shown in FIG. be done.
In the configuration shown in FIGS. 3 and 4, a portion of the first conductor 25a and the second conductor 25b are positioned continuously with the electrical resistor 24. In the configuration shown in FIGS. When the first conductor 25a and the second conductor 25b have a plurality of layers, part of the layers and the electrical resistor 24 may be the same layer. At this time, the first layer 251 and the electrical resistor 24 may have the same composition. That is, the electrical resistor 24 is the portion of the metal layer located on the lower surface of the dielectric layer 23 that is located in the through hole 25H1. On the other hand, as shown in FIG. 5, the first conductor 25a, the second conductor 25b, and the first electrical resistor 24a may be stacked so as to select different regions on the lower surface of the dielectric layer 23. As shown in FIG. At this time, the first layer 251 and the electrical resistor 24 may have different compositions. In this case, the conductor 25 consisting of the first conductor 25a and the second conductor 25b has a through hole 25H at the position where the first electrical resistor 24a is arranged, and is located on the lower surface of the dielectric layer 23. . The first electrical resistor 24a is positioned to cover the lower surface 23a of the dielectric layer 23 positioned in the through hole 25H1 of the conductor 25 and the side surfaces 254, 255 of the first and second conductors 25a, 25b. Since the first electric resistor 24a is positioned so as to cover the side surfaces 254 and 255 of the first and second conductors 25a and 25b, the connectivity between the first electric resistor 24a and the first and second conductors 25a and 25b is improved. Good. In addition, since the layer thickness of the first electrical resistor 24a is made thinner than the layer thicknesses of the first and second conductors 25a and 25b, the resistance value of the first electrical resistor 24a is maintained high, and the cavity resonance occurs. The suppressing effect can be improved.
Examples of the constituent material of the configuration shown in FIG. 5 include TaN or Ta ₂ N as the first electrical resistor 24a, Ti as the first layer 251 shown in FIG. Au is applied as the third layer 253 .
Various other materials may be applied, but the sheet resistance value of the first electric resistor 24a (including the second electric resistor 24b described later) is 25Ω/SQ or more, and the sheet of the conductor 25 (25a, 25b) It is preferable that the resistance value is less than 100 mΩ/SQ. If the sheet resistance value of the first electrical resistor 24a is 25Ω/SQ or more, unnecessary radio waves emitted outside can be effectively reduced. Further, if the sheet resistance value of the conductor 25 (25a, 25b) is less than 100 mΩ/SQ, the electrical connection between the electronic component housing substrate 3 and the lid 2 becomes strong, and the unnecessary radio waves absorbed by the lid 2 can be effectively dropped to ground.

Other examples of the layout of the electrical resistors and conductors on the lower surface of the lid 2 include the lid 2C shown in FIG. 6 and the lid 2D shown in FIG.
The second electrical resistor 24b is a circular electrical resistor 24 arranged in the lower central portion 23a. In the cover 2C shown in FIG. 6, only the circular second electric resistor 24b is arranged on the lower surface, and the conductor 25 is positioned around the circular second electric resistor 24b.
A lid body 2D shown in FIG. 7 corresponds to a combination of the layout shown in FIG. 2 and the layout shown in FIG. That is, of the through holes 25H, the first electrical pair antibody 24a is located in the ring-shaped first through hole 25H1, and the second electrical resistor 24b is located in the circular second through hole 25H2. . The lid 2D has a first conductor 25a located in the seal area 23b, a ring-shaped first electrical resistor 24a on the inner peripheral side, and a second conductor 25b on the inner peripheral side. A circular second electrical resistor 24b is arranged in the portion 23a.
That is, in the lid body 2D shown in FIG. 7, a circular second electric resistor 24b and a ring-shaped first electric resistor 24a positioned so as to surround the circular second electric resistor 24b in a plan view are arranged. First and second conductors 25a and 25b are separately located outside and inside the ring-shaped first electric resistor 24a.

As in the example of FIG. 6 or 7 above, the circular second electric resistor 24b in plan view is preferably located in the lower central portion 23a of the lids 2C and 2D. Unnecessary radio waves generated from the electronic component 4 can be effectively absorbed, and dielectric resonance and cavity resonance can be effectively reduced.
The width (diameter) Hw2 of the opening Ho2 of the circular through hole 25H2 is λ/4 or more and λ/2 or less, where λ is the radio wave wavelength at which the electronic component operates. If the width Hw2 of the opening Ho2 is λ/2 or less, it is possible to satisfactorily reduce the emission of unnecessary radio waves to the outside. If the width Hw2 of the opening Ho2 is λ/4 or more, cavity resonance can be favorably reduced.
When the circular second electric resistor 24b is implemented, the diameter of the circular second electric resistor 24b is preferably λ/4 or more and λ/2 or less, where λ is the radio wave wavelength at which the electronic component operates. If the diameter of the circular second electrical resistor 24b is λ/2 or less, it is possible to satisfactorily reduce the emission of unnecessary radio waves to the outside. If the diameter of the circular second electric resistor 24b is λ/4 or more, a region of the second electric resistor 24b capable of effectively reducing cavity resonance can be secured.
At this time, the through-hole 25H2 may also be circular in planar see-through. The second electrical resistor 25b is preferably positioned along the opening surface of the opening Ho2 of the through hole 25H2 in plan view, and its diameter is λ/4 where λ is the radio wave wavelength at which the electronic component operates. It is preferable that it is more than λ/2 and less than λ/2.

In addition, a metal film electrically connected to the ground wiring is arranged on the outer peripheral portion 32a of the upper surface of the electronic component housing substrate 3. As shown in FIG. When the cover 2 is brazed to the electronic component housing base 3 , the first conductor 25 a is electrically connected to the ground wiring of the electronic component housing base 3 . As a result, the first conductor 25a, the electrical resistor, and the second conductor 25b are electrically connected to the ground.
Therefore, when the electronic device 10 is used, the electric resistor 24 is electrically connected to the ground, and unnecessary radio waves absorbed by the electric resistor 24 are dropped to the ground, thereby stabilizing the high-frequency characteristics.

As described above, by applying the lid 2 of the present embodiment, the emission of unnecessary radio waves to the outside and the dielectric resonance inside the lid 2 are reduced, and the electronic component 4 is less affected and the electronic The component 4 can be stably operated.

<Method for manufacturing electronic component storage package and substrate>
A method of manufacturing the electronic component storage package 1 according to one embodiment of the present invention will be described below. The lid body 2 and the electronic component housing substrate 3 are produced separately as follows.
A mounting board corresponding to the bottom surface portion 31 of the electronic component housing base 3 is manufactured as follows if it is made of, for example, an aluminum oxide sintered body. First, a ceramic green sheet is formed into a rectangular sheet by forming a raw material powder such as aluminum oxide and silicon oxide, an appropriate organic binder and an organic solvent into a sheet. Next, a laminate of ceramic green sheets is produced by laminating a plurality of ceramic green sheets. It should be noted that the laminate does not necessarily have to consist of a plurality of ceramic green sheets, and a single layer may be sufficient as long as there is no problem in terms of mechanical strength as a mounting substrate. After that, these ceramic green sheets are fired at a temperature of 1300 to 1600° C. to produce a mounting substrate.
The frame body corresponding to the outer peripheral wall portion 32 is manufactured in the same manner as the above-described mounting substrate if it is made of, for example, an aluminum oxide sintered body. First, a ceramic green sheet is formed into a rectangular sheet by forming raw material powders such as aluminum oxide and silicon oxide into a sheet with an appropriate organic binder and organic solvent. Next, a laminate of ceramic green sheets is produced by laminating a plurality of ceramic green sheets. Then, the laminated body is formed into a frame shape by forming an opening in the central portion of the laminated body by a punching method. Furthermore, the layered body is provided on the upper surface by printing a metal paste, which will be a metal layer, prepared by mixing tungsten powder, an organic solvent, and an organic binder by a method such as screen printing. After that, the laminate is fired at a temperature of 1300 to 1600° C. to form a frame. Note that the frame does not necessarily have to be formed by laminating a plurality of ceramic green sheets, and may be formed of only one layer as long as there is no problem in terms of the mechanical strength of the frame. Then, the frame is bonded to the upper surface of the mounting board with a bonding material such as a glass bonding material or a resin bonding material. When the frame body is made of an aluminum oxide sintered body similar to the mounting substrate, a frame-shaped ceramic green sheet is laminated on the upper surface of the ceramic green sheet serving as the mounting substrate. It may be integrally formed with the mounting substrate by a method of firing.
For example, if the lid body 2 is made of an aluminum oxide sintered body, the lid body 2 is manufactured as follows. First, a ceramic green sheet is formed into a rectangular sheet by forming a raw material powder such as aluminum oxide and silicon oxide, an appropriate organic binder and an organic solvent into a sheet.
An electrical resistor 24 is deposited on the lower surface of the ceramic green sheet corresponding to the dielectric layer 23, and first and second conductors 25a and 25b are printed on predetermined regions of the lower surface of the electrical resistor layer 24. FIG. Alternatively, when fabricating the lid 2B shown in FIG. 5, a first layer 251, a second layer 252, and After forming the third layer 253 in order, the region where the first electric resistor 24a is arranged is removed by etching, and the first electric resistor 24a is formed in the removed region.
The laminate obtained by laminating the metal material on the ceramic green sheet as described above is fired at a temperature of 1300 to 1600° C. to produce the lid body 2 .

The embodiments of the present invention have been described above. However, the present invention is not limited to the above embodiments. For example, the details shown in the embodiments and drawings, such as the material, shape, and size of each part of the lid or electronic component storage base, can be changed as appropriate without departing from the spirit of the invention.

1 Electronic component storage package 2 Lid 3 Electronic component storage substrate 4 Electronic component 10 Electronic device 21 Upper surface 22 Lower surface 23 Dielectric layer 23a Lower surface central portion 23b Seal area (lower surface outer peripheral portion)
24 electric resistor 24a first electric resistor 24b second electric resistor 25 conductor 25a first conductor 25b second conductor 25H1 first through hole 25H2 second through hole 34 mounting portion

Claims (15)

A lid for an electronic component storage package,
a dielectric layer;
a conductor positioned on the lower surface of the dielectric layer, positioned on the periphery of the lower surface of the dielectric layer and having at least one through hole extending in the vertical direction;
and an electrical resistor positioned in the through hole,
the electrical resistor and the conductor are electrically connected to each other ,
The cover body , wherein the opening of the through-hole in the lower surface of the conductor is ring-shaped when viewed through a plane . 2. The lid according to claim 1, wherein said electrical resistor is in contact with said conductor. 3. The lid according to claim 1 , wherein the width of the opening of the through-hole is λ/4 or more and λ/ 2 or less, where λ is the radio wave wavelength at which the electronic component operates. A lid for an electronic component storage package,
a dielectric layer;
a conductor positioned on the lower surface of the dielectric layer, positioned on the periphery of the lower surface of the dielectric layer and having at least one through hole extending in the vertical direction;
and an electrical resistor positioned in the through hole,
the electrical resistor and the conductor are electrically connected to each other,
The cover body, wherein the opening of the through-hole is circular when viewed through the plane. 5. The lid according to claim 4 , wherein the electrical resistor is positioned at the center of the lower surface of the dielectric layer. The through-hole has a first through-hole having a ring-shaped opening when seen through a plane, and a second through-hole surrounded by the first through-hole and having a circular opening when seen through a plane. , the lid according to any one of claims 1 to 5 . The lid according to claim 6 , wherein the first through hole is in contact with the lower surface outer peripheral portion. 8. The lid according to claim 6 , wherein the width of the opening of the first through hole is λ/4 or more and λ/2 or less, where λ is the radio wave wavelength at which the electronic component operates. 9. The lid according to any one of claims 6 to 8 , wherein the diameter of the opening of the second through hole is λ/4 or more and λ/2 or less, where λ is the radio wave wavelength at which the electronic component operates. body. The conductor has at least a first layer and a second layer positioned in order from the lower surface of the dielectric layer,
10. The lid according to any one of claims 1 to 9 , wherein said electrical resistor has the same composition as said first layer of said conductor. The conductor has at least a first layer and a second layer positioned in order from the lower surface of the dielectric layer,
10. The lid according to any one of claims 1 to 9 , wherein the electrical resistor has a composition different from that of the first layer of the conductor. 10. The lid according to any one of claims 1 to 9 , wherein the electrical resistor covers the lower surface of the dielectric layer and the side surface of the conductor located in the through hole. The lid according to any one of claims 1 to 12 , wherein the electrical resistor has a sheet resistance of 25Ω/SQ or more, and the conductor has a sheet resistance of less than 100mΩ/SQ. a lid according to any one of claims 1 to 13 ;
an electronic component storage substrate comprising: a mounting portion for electronic components; package for. An electronic device comprising the electronic component storage package according to claim 14 and an electronic component mounted on the mounting portion.

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