JP7295260B2 - 多層吸収体を備えた極紫外線マスクブランクおよび製造方法 - Google Patents
多層吸収体を備えた極紫外線マスクブランクおよび製造方法 Download PDFInfo
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
- G03F1/24—Reflection masks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/48—Protective coatings
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/52—Reflectors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
- G03F1/58—Absorbers, e.g. of opaque materials having two or more different absorber layers, e.g. stacked multilayer absorbers
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- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Physical Vapour Deposition (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Description
Claims (13)
- 極紫外線(EUV)マスクブランクを製造する方法であって、
複数の反射層対を含む反射層の多層スタックを基板上に形成することと、
反射層の前記多層スタック上にキャッピング層を形成することと、
厚さを調整することにより吸収度を調整するための調整層と吸収体層のスタックを含む吸収体を形成することであって、前記キャッピング層上に前記調整層を形成することを含み、前記調整層が調整層厚さtTLを有する、吸収体を形成することと、
前記キャッピング層上に吸収体層の前記スタックを形成することであって、吸収体層の前記スタックが、厚さtAおよび屈折率nAを有する第1の材料Aならびに厚さtBおよび屈折率nBを有する第2の材料Bの周期的二重層を含み、各二重層が、厚さtP=tA+tBを有する周期を定め、前記第1の材料Aと前記第2の材料Bが、異なる材料であり、nAとnBの大きさの差が、0.01より大きく、吸収体層の前記スタックが、N個の周期を含み、前記吸収体の厚さが、tabs=N*tP+tTLである、吸収体層の前記スタックを形成することと、
を含み、
t abs が、30nm未満である、
方法。 - 前記複数の反射層対が、モリブデン(Mo)含有材料およびケイ素(Si)含有材料から選択される材料から作製され、前記第1の材料Aおよび前記第2の材料Bが、白金(Pt)、亜鉛(Zn)、金(Au)、ニッケル(Ni)、銀(Ag)、イリジウム(Ir)、鉄(Fe)、スズ(Sn)、コバルト(Co)、銅(Cu)、銀(Ag)、アクチニウム(Ac)、テルル(Te)、アンチモン(Sb)、タンタル(Ta)、クロム(Cr)、アルミニウム(Al)、ゲルマニウム(Ge)、マグネシウム(Mg)、タングステン(W)、炭素(C)、ガリウム(Ga)、およびホウ素(B)、ならびにそれらの合金、炭化物、ホウ化物、窒化物、ケイ化物、および酸化物からなる群から選択される材料から作製される、請求項1に記載の方法。
- 前記調整層が、前記第1の材料Aまたは前記第2の材料Bを含み、tAとは異なる厚さを有し、前記厚さを調整することにより、調整可能な吸収度が前記吸収体に提供される、請求項1に記載の方法。
- 前記第1の材料Aが、AgまたはSbを含み、前記第2の材料Bが、Te、Ta、またはGeを含む、請求項1に記載の方法。
- 前記第1の材料Aが、AgまたはGaSbを含み、前記第2の材料Bが、ZnTeを含む、請求項1に記載の方法。
- tAが、1nmから5nmまでの範囲にあり、tBが、1nmから5nmまでの範囲にある、請求項1に記載の方法。
- Nが、1から10までの範囲にある、請求項1に記載の方法。
- 基板、
前記基板上の反射層の多層スタックであって、複数の反射層対を含む反射層の多層スタック、
反射層の前記多層スタック上のキャッピング層、
厚さを調整することにより吸収度を調整するための調整層および吸収体層のスタックを含む吸収体であって、前記キャッピング層上に前記調整層を形成することを含み、前記調整層が、調整層厚さtTLを有する、吸収体、ならびに
厚さtAおよび屈折率nAを有する第1の材料Aならびに厚さtBおよび屈折率nBを有する第2の材料Bの周期的二重層を含む吸収体層の前記スタックであって、各二重層が、厚さtP=tA+tBを有する周期を定め、前記第1の材料Aと前記第2の材料Bが、異なる材料であり、nAとnBの大きさの差が、0.01より大きく、吸収体層の前記スタックが、N個の周期を含み、Nが、1から10までの範囲にあり、前記吸収体の厚さが、tabs=N*tP+tTLである、吸収体層の前記スタック、
を備え、
t abs が、30nm未満である、
極紫外線(EUV)マスクブランク。 - 前記複数の反射層対が、モリブデン(Mo)含有材料およびケイ素(Si)含有材料から選択される材料から作製され、前記第1の材料Aおよび前記第2の材料Bが、白金(Pt)、亜鉛(Zn)、金(Au)、ニッケル(Ni)、銀(Ag)、イリジウム(Ir)、鉄(Fe)、スズ(Sn)、コバルト(Co)、銅(Cu)、銀(Ag)、アクチニウム(Ac)、テルル(Te)、アンチモン(Sb)、タンタル(Ta)、クロム(Cr)、アルミニウム(Al)、ゲルマニウム(Ge)、マグネシウム(Mg)、タングステン(W)、炭素(C)、ガリウム(Ga)、およびホウ素(B)、ならびにそれらの合金、炭化物、ホウ化物、窒化物、ケイ化物、および酸化物からなる群から選択される材料から作製される、請求項8に記載の極紫外線(EUV)マスクブランク。
- 前記調整層が、前記第1の材料Aまたは前記第2の材料Bを含み、tAとは異なる厚さを有し、前記厚さを調整することにより、調整可能な吸収度が前記吸収体に提供される、請求項8に記載の極紫外線(EUV)マスクブランク。
- 前記第1の材料Aが、AgまたはSbを含み、前記第2の材料Bが、Te、Ta、またはGeを含む、請求項8に記載の極紫外線(EUV)マスクブランク。
- 前記第1の材料Aが、AgまたはGaSbを含み、前記第2の材料Bが、ZnTeを含む、請求項8に記載の極紫外線(EUV)マスクブランク。
- tAが、1nmから5nmまでの範囲にあり、tBが、1nmから5nmまでの範囲にあり、Nが、1から10までの範囲にある、請求項8に記載の極紫外線(EUV)マスクブランク。
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US16/801,635 | 2020-02-26 | ||
US16/801,635 US20200278603A1 (en) | 2019-03-01 | 2020-02-26 | Extreme Ultraviolet Mask Blank With Multilayer Absorber And Method Of Manufacture |
PCT/US2020/020034 WO2020180586A1 (en) | 2019-03-01 | 2020-02-27 | Extreme ultraviolet mask blank with multilayer absorber and method of manufacture |
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WO2010113700A1 (ja) | 2009-04-02 | 2010-10-07 | 凸版印刷株式会社 | 反射型フォトマスクおよび反射型フォトマスクブランク |
US20140254001A1 (en) | 2013-03-07 | 2014-09-11 | Globalfoundries Inc. | Fabry-perot thin absorber for euv reticle and a method of making |
JP2015008283A (ja) | 2013-05-31 | 2015-01-15 | Hoya株式会社 | 反射型マスクブランク、反射型マスク及びその製造方法、並びに半導体装置の製造方法 |
WO2018022371A1 (en) | 2016-07-27 | 2018-02-01 | Applied Materials, Inc. | Extreme ultraviolet mask blank with multilayer absorber and method of manufacture |
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FR2884965B1 (fr) * | 2005-04-26 | 2007-06-08 | Commissariat Energie Atomique | Structure de blanc de masque ajustable pour masque euv a decalage de phase |
KR20080001023A (ko) * | 2006-06-29 | 2008-01-03 | 주식회사 에스앤에스텍 | 극자외선 반사형 블랭크 마스크와 포토마스크 및 그제조방법 |
KR101625382B1 (ko) * | 2010-04-29 | 2016-05-30 | (주)에스앤에스텍 | 극자외선용 반사형 블랭크 마스크, 포토마스크 및 그의 제조방법 |
KR20160002332A (ko) * | 2014-06-30 | 2016-01-07 | 주식회사 에스앤에스텍 | 극자외선용 블랭크 마스크 및 이를 이용한 포토마스크 |
US9581889B2 (en) * | 2014-07-11 | 2017-02-28 | Applied Materials, Inc. | Planarized extreme ultraviolet lithography blank with absorber and manufacturing system therefor |
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WO2010113700A1 (ja) | 2009-04-02 | 2010-10-07 | 凸版印刷株式会社 | 反射型フォトマスクおよび反射型フォトマスクブランク |
US20140254001A1 (en) | 2013-03-07 | 2014-09-11 | Globalfoundries Inc. | Fabry-perot thin absorber for euv reticle and a method of making |
JP2015008283A (ja) | 2013-05-31 | 2015-01-15 | Hoya株式会社 | 反射型マスクブランク、反射型マスク及びその製造方法、並びに半導体装置の製造方法 |
WO2018022371A1 (en) | 2016-07-27 | 2018-02-01 | Applied Materials, Inc. | Extreme ultraviolet mask blank with multilayer absorber and method of manufacture |
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US20200278603A1 (en) | 2020-09-03 |
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