JP7291416B2 - game machine - Google Patents

Description

The present disclosure relates to a game machine provided with a control board for controlling games.

Conventionally, as this type of game machine, there is known one in which mounted components are mounted on a control board (see, for example, Patent Document 1).

JP 2012-095879 A (paragraph [0032] etc.)

In the above-described conventional gaming machine, development of a control board to which a plurality of types of mounted components can be applied is required.

The game machine of the present disclosure is a game machine in which mounted parts having a plurality of connecting parts arranged in two rows are mounted on a control board that controls games, and the connecting parts of the mounted parts are soldered one by one. possible special conductors arranged in two rows, each said special conductor having a first mounting region to which said connecting portion of said first mounting component can be soldered, and said The game machine has a second mounting area where the second mounting component can be soldered and the spacing between the rows of connection portions is large, and the second mounting region is arranged in a direction orthogonal to the rows of the special conductor portions .

According to the gaming machine according to the present disclosure, it is possible to apply multiple types of mounted components to one control board.

Front view of gaming machine according to one embodiment of the present disclosure Block diagram showing the electrical configuration of the game machine Top view of ROM socket mounting part where ROM socket is mounted Perspective view of ROM and ROM socket Side sectional view of ROM socket mounted on control board Top view of ROM socket mounting part (A) Perspective view of conversion board (B) Bottom view of conversion board Plan view of conventional ROM socket mounting part Side cross-sectional view of conversion board with ROM socket fixed to control board

A gaming machine 10 according to a first embodiment of the present disclosure will be described below with reference to FIGS. 1 to 7. FIG. As shown in FIG. 1, the game machine 10 of the present embodiment is a pachinko game machine, the front side of which is covered with a front frame 10Z, and the game board 11 is viewed through a glass window 10W formed in the front frame 10Z. The game area R1 is visible. Speakers 25S are provided at both corners above the glass window 10W. In the following description, the side of the gaming machine 10 closer to the player is called the "front side" and the opposite side is called the "rear side". "Left side" is simply referred to as "right side" and "left side."

An upper tray 26 and a lower tray 27 are provided in two stages below the glass window 10W in the front frame 10Z, and an operation handle 28 is provided on the right side of the lower tray 27. - 特許庁When the operation handle 28 is rotated, the game balls contained in the upper tray 26 are ejected toward the game area R1.

The game area R1 is formed by being surrounded on all sides by guide rails 12 projecting from the front surface of the game board 11 . A game board display window 11H is formed through the center of the game area R1, and the display device 13 faces the game board display window 11H from the back side of the game board 11. - 特許庁The display device 13 is composed of, for example, a liquid crystal module, and its front surface is a display screen 13G for performing game-related effects. Various effects related to the game are displayed on the display screen 13G. In addition, sounds such as music and sound effects are generated from the speaker 25S in accordance with various effects related to the game, and the accessory decoration lamps mounted on the accessories (not shown) are lit.

A display decoration frame 23 is attached to the front center of the game board 11 so as to surround the display screen 13G. The display decoration frame 23 is fitted into the game board display window 11H from the front side of the game board 11, projects inside the game board display window 11H, and protrudes from the front surface of the game board 11.例文帳に追加A game ball flowing down the game area R1 is configured not to pass through the front side of the display decoration frame 23 and enter the inside of the display decoration frame 23. - 特許庁

Below the display device 13 in the game area R1, the first and second start winning openings 14A and 14B and the big winning opening 15 are arranged in order from the top with an interval therebetween. In addition, a plurality of general winning openings 20 are provided along the guide rails 12 on both left and right sides of the winning openings 14A, 14B, 15. As shown in FIG. All the game balls that have not won any of the winning holes 14A, 14B, 15, 20 are taken into the out hole 16 arranged at the lower end of the game area R1. A starting gate 18 is provided on the left side of the display device 13 . Also, a large number of obstacle nails are planted in the game area R1.

The general prize winning opening 20 has a so-called pocket structure, and opens upward to a size that allows just one game ball to enter. When game balls win in the general winning hole 20, a predetermined number of game balls are provided as prize balls.

The starting gate 18 has a portal structure through which game balls can pass. Then, when the game ball passes through the starting gate 18, normal symbol suitability determination is performed, and the determination result is displayed in the normal symbol display section (not shown).

Both of the first and second start winning openings 14A and 14B have a pocket structure in which an upper surface of a member protruding from the game board 11 is provided with an opening. The first start winning opening 14A arranged on the upper side has an opening width that allows only one game ball to enter. The second starting prize-winning port 14B arranged on the lower side is arranged directly below the first starting prize-winning port 14A, and the left and right sides of the opening are provided with movable wing pieces 14C. Both of these movable winglets 14C are always in an upright state, and the space above the second starting prize-winning opening 14B is always formed by the members constituting the first starting prize-winning opening 14A and the movable winglets 14C. It is surrounded so that game balls cannot enter (state shown in FIG. 1). Then, when the above-mentioned normal symbol suitability determination results in a win, the movable wing piece 14C is laid down over a predetermined period. Then, the upper space of the second starting prize winning port 14B opens laterally, and the game ball that has passed through both sides of the first starting winning prize port 14A is caught by the movable wing pieces 14C and is opened to the second starting prize winning port 14B. will be guided to

When a game ball wins in each of the start winning openings 14A and 14B, a predetermined number of game balls are provided as prize balls, and special symbol suitability determination is performed. The determination result is displayed on the display screen 13G of the display device 13 as a combination of the special symbols 13A, 13B and 13C.

Specifically, as shown in FIG. 1, three left, middle and right special symbols 13A, 13B, and 13C are normally stopped and displayed side by side on the display screen 13G. Each of these special symbols 13A, 13B, 13C is composed of, for example, a plurality of types representing numbers "0" to "11". Kind of a stop display. Then, when the game ball wins the first and second start winning openings 14A, 14B, these three special symbols 13A, 13B, 13C are vertically scroll displayed, and after a predetermined time, for example, left, The special symbols 13A, 13B, and 13C are stopped and displayed in the order of right and middle. Then, when the determination result is a hit (hereinafter referred to as "big hit"), the special patterns 13A, 13B, 13C are all stopped and displayed with the same pattern (double number), and the game shifts to a "big win game state". . On the other hand, when the determination result is out, a combination other than doubles is stopped and displayed, and the normal game state, which is not the "jackpot game state", continues.

The big winning opening 15 is open to the front surface of the game board 11 and has a horizontally long shape, and is always closed by a movable door 15T. When the ``jackpot game state'' is reached as described above, the movable door 15T falls forward to open the big winning opening 15, and the game ball can enter the big winning opening 15 with the movable door 15T as a guide. When the game balls enter the big winning hole 15, a predetermined number of game balls are provided as prize balls.

FIG. 2 shows an electrical configuration of the gaming machine 10. As shown in FIG. In the figure, reference numeral 50 denotes a main control board 50, which comprises a microcomputer having a CPU 50A, a RAM 50B, a ROM 50C and a plurality of counters, and an input/output circuit connecting the microcomputer and a sub control board 52; A relay circuit to which the 1st start prize sensor, the 2nd start prize sensor, the gate sensor, the general prize sensor, the big prize sensor, etc. are connected, and the touch sensor of the operation handle 28, the payout sensor that detects the prize balls paid out, etc. are connected. It also has an input/output circuit connected to the payout control board, and performs main control related to the game. The CPU 50A includes a success/fail determination unit, a control unit, a calculation unit, various counters, various registers, various flags, etc., and in addition to performing arithmetic control, it also generates random numbers related to special figure determination and general figure determination, and sub-controls the control signal. It is configured such that it can be output (transmitted) to the substrate 52 or the like. The RAM 50B includes a storage area for various random values generated by the CPU 50A, a storage area and flags for temporarily storing various data, and a work area for the CPU 50A. The ROM 50C is written with control data, symbol variation data relating to variation display of special symbols and normal symbols, and the like.

Similar to the main control board 50, the sub control board 52 includes a microcomputer having a CPU 52A, a RAM 52B, a ROM 52C, and a plurality of counters, an input/output circuit connecting the microcomputer and the main control board 50, a display control board 54, It has an input/output circuit that connects the audio control board 55, the lamp control board 56, and the like. The CPU 52A includes a control unit, a calculation unit, various counters, various registers, various flags, etc., and in addition to performing arithmetic control, outputs (transmits) control signals to the display control board 54, the sound control board 55, the lamp control board 56, etc. configured as possible. The RAM 52B has a storage area for various data and a work area for the CPU 52A. The ROM 52C stores various performance data and the like.

The display control board 54 is provided in the display device 13 and has a CPU, a RAM and a ROM. The CPU of the display control board 54 acquires image data from the ROM based on the control signal output from the sub-control board 52, and displays an image on the display screen 13G based on the image data.

The audio control board 55 is a board that is connected to the speaker 25S and relays an audio control signal output from the control signal output from the sub-control board 52 .

The lamp control board 56 is a board for relaying a lamp control signal output from the sub-control board 52 and connected to a lamp such as a role article decoration lamp mounted on the role article.

In addition, the main control board 50 and the sub-control board 52, and other boards (payout control board, etc.) receive power supply from the power supply board 57 and operate.

A portion of the sub-control board 52 is shown in FIG. The sub-control board 52 is a rectangular wiring board, and mounted components such as the above-described CPU 52A, RAM 52B, and ROM 52C are mounted on its surface. The ROM 52C among various mounted components is connected to the sub-control board 52 via the ROM socket 70. As shown in FIG. Details of the ROM socket 70 and the ROM socket mounting portion 60 provided on the sub-control board 52 for mounting the ROM socket 70 will be described below.

As shown in FIG. 4 , the ROM socket 70 includes a body portion 71 and a plurality of terminals 72 . Specifically, the body portion 71 has a recess 71A extending in the longitudinal direction at its center, which is a so-called groove shape. The centers of the upper surfaces of the protrusions 71B, 71B are opened in the longitudinal direction and serve as receiving portions 71C for receiving the terminal pins 52Ca extending downward from the lower surface of the ROM 52C. A plurality of connection terminals 71C1 to be connected to the terminal pins 52Ca are arranged in the receiving portion 71C (see FIG. 5). A plurality of terminals 72 protrude from side surfaces 71D, 71D on the long sides of the body portion 71 and on the outside of the projecting portion 71B. The terminal 72 has a so-called L-shape, and has a vertical portion 72A that extends vertically downward along the side surface 71D from the middle of the vertical direction of the side surface 71D, and a sub-control terminal that is bent from the lower end of the vertical portion 72A. and a linear portion 72</b>B extending straight along the upper surface of the substrate 52 in a direction away from the body portion 71 . The terminals 72 are arranged symmetrically on both sides 71D, 71D of the main body in the same number (five on each side in this embodiment). That is, in this embodiment, the ROM socket 70 has a plurality of terminals 72 arranged in two rows.

The ROM socket mounting portion 60 provided on the sub-control board 52 has a plurality of special pads 80 arranged corresponding to the two rows of terminals 72 of the ROM socket 70 . Specifically, the plurality of special pads 80 are all rectangles of the same size, and are arranged in parallel in two rows with a certain interval in the center. When the ROM socket 70 is mounted on the sub-control board 52, the lower surfaces of the linear portions 72B of the plurality of terminals 72 protruding sideways from both sides of the ROM socket 70 come into contact with the plurality of special pads 80. touch. As shown in FIG. 5, the ROM socket 70 is surface-mounted on the sub-control board 52 by soldering the terminals 72 of the ROM socket 70 (more specifically, the lower surface of the straight portion 72B of the terminals 72) to the special pads 80. It is

Here, in this embodiment, the special pad 80 is provided with the first mounting area 80A and the second mounting area 80B. Specifically, the surface of the sub-control board 52 is coated with a resist 52R to cover substantially the entire area of the sub-control board 52 . As shown in FIG. 6, the resist 52R is also applied linearly on the surface of the special pad 80 so as to divide the rectangular special pad 80 into two in the long side direction (see FIG. 5). The special pad 80 is separated into a first mounting area 80A and a second mounting area 80B across the 52R. Both the first mounting area 80A and the second mounting area 80B are rectangular, and the long side of the first mounting area 80A is longer than that of the second mounting area 80B. The special pads 80 are arranged in two rows at regular intervals, and the first mounting regions 80A are arranged on the inner sides of the special pads 80, and the second mounting regions 80B are arranged on the outer sides of the special pads 80. . In other words, the first mounting area 80A and the second mounting area 80B of the special pads 80 arranged in two rows are arranged symmetrically across the gap between the two rows.

The ROM socket 70 of this embodiment is mounted in the first mounting area 80A of the special pad 80. As shown in FIG. As shown in FIG. 5, the first mounting area 80A of the special pad 80 is provided at a position where each of the terminals 72 of the ROM socket 70 abuts when the terminals 72 of the ROM socket 70 are fixed to the sub-control board 52. It is The ROM socket 70 is mounted on the sub-control board 52 by soldering the lower surfaces of the linear portions 72B of the plurality of terminals 70 of the ROM socket 70 to the first mounting area 80A.

The configuration of the gaming machine 10 of the present embodiment is as described above. Next, functions and effects of the gaming machine 10 will be described. In the game machine 10 , a ROM 52</b>C is connected to the sub-control board 52 via the ROM socket 70 . The ROM socket 70 is mounted on the sub-control board 52 by soldering, but the ROM 52C is detachably attached to the ROM socket 70, so if the ROM 52C and the number and arrangement of terminals are the same, the ROM socket 70 ROM 52C can be replaced.

By the way, in the conventional sub-control board, when changing ROM specifications for maintenance, etc., or when developing other models, if you try to use a ROM with a different number and arrangement of terminals, you will need different types of ROM sockets and sockets. , a conversion board was required to convert the arrangement of the terminals of the ROM socket, and the ROM socket mounting portion could not be used as it was, so it was necessary to redesign the sub-control board.

Specifically, in order to mount another ROM socket 90 having a terminal arrangement different from that of the ROM socket 70 on the sub-control board 52, in addition to directly mounting the another ROM socket 90, as shown in FIG. Second, it is conceivable to mount the conversion board 100 on the sub-control board 52 by soldering a plurality of terminals 91 of another ROM socket 90 to pads (not shown) provided on the surface of the conversion board 100 . As shown in FIG. 7B, a plurality of pads 100A arranged in two rows are provided on the back surface of the conversion board 100 (that is, the surface opposite to the surface on which another ROM socket 90 is attached). Another ROM socket 90 can be connected to the sub-control board 52 by soldering the plurality of pads 100A and the special pads 80 of the sub-control board 52 .

However, as shown in FIG. 8, the conventional pads 180 of the sub-control board 52 are provided at positions corresponding to the plurality of terminals 72 of the ROM socket 70 . The conversion board 100 is fixed to the sub control board 52 because the width between the two columns of the pads 100A of the conversion board 100 is wider than the width between the two columns of the terminals 72 of the ROM socket 70. Although it was possible to mount the ROM socket 70 on the sub-control board 52 , it was not possible to mount another ROM socket 90 via the conversion board 100 . It is also conceivable to dispose the pads 100A of the conversion board 100 closer to the center and mount them on the conventional pads 180, but there is a problem that the pads become unstable and easily come off.

On the other hand, according to the gaming machine 10 of the present embodiment, as shown in FIG. 6, the plurality of special pads 80 of the ROM socket mounting section 60 have the first mounting area 80A and the second mounting area 80B. are provided. The first mounting area 80A is provided at positions corresponding to the plurality of terminals 72 of the ROM socket 70, and the second mounting area 80B is provided at positions corresponding to the plurality of pads 100A of the conversion substrate 100. It is possible to attach the ROM socket 70 to the control board 52 and to attach the conversion board 100 (that is, another ROM socket 90).

Specifically, as shown in FIG. 9, the ROM socket 90 is a rectangular parallelepiped box shape having a recess 91A in the center of the main body 91 (see FIG. 7A). The center of the upper surface of the side wall portions 91B, 91B is opened to form a receiving portion 91C for receiving the terminal pin 152Ca extending downward from the lower surface of the ROM 152C. A plurality of connection terminals 91C1 to be connected to the terminal pins 152Ca are arranged in the receiving portion 91C. A plurality of so-called L-shaped terminals 92 protrude from the outer side surfaces 91D and 91D of the side wall portions 91B and 91B of the body portion 91, and the lower surfaces of the plurality of terminals 92 are pads (not shown) on the surface of the conversion substrate 100. soldered to. A plurality of pads 100A are provided on the rear surface of the conversion board 100 at positions corresponding to the second mounting areas 80B of the sub-control board 52 (see FIG. 7B). The ROM 152C is connected to the sub-control board 52 via the ROM socket 90 and the conversion board 100 by soldering the plurality of pads 100A and the second mounting area 80B of the sub-control board 52 .

Thus, in this embodiment, since the plurality of special pads 80 of the ROM socket mounting portion 60 have the first mounting area 80A and the second mounting area 80B, the sub-control board 52 is newly designed. It is possible to mount both the ROM socket 70 and another ROM socket 90 whose terminal arrangement is different from that of the ROM socket 70 on one sub-control board 52 without modification.

[Other embodiments]
(1) In the above embodiment, the sub control board 52 is provided with the special pad 80 having the first mounting area 80A and the second mounting area 80B as the ROM socket mounting portion 60. 50 , display control board 54 , audio control board 55 , or lamp control board 56 .

(2) In the above embodiment, the ROM socket 70, the separate ROM socket 90, and the conversion board 100 were surface-mounted on the sub-control board 52. It may be an insertion implementation that attaches

(3) In the above embodiment, the ROM socket 70 and the separate ROM socket 90 were mounted on the sub-control board 52 via the conversion board. A ROM socket different from the ROM socket 70 may be directly mounted on the sub-control board 52 by soldering the terminal of the ROM socket provided with the second mounting region 80B.

(4) In the above embodiment, the total number of terminals of the ROM socket 70, the number of terminals of the separate ROM socket 90, and the number of pads on the rear surface of the conversion board 100 are ten in total. It's okay.

(5) In the above embodiment, the spacing between the two rows of terminals 72 of the ROM socket 70 and the spacing between the two rows of pads 100A of the conversion board 100 may be reversed (that is, the conversion board 100 may be fixed and the ROM socket 70 may be fixed to the second mounting area 80B). In this case, when the separate ROM socket 90 is smaller than the ROM socket 70, the conversion board 100 does not have to be made larger than necessary, thereby reducing costs.

(6) In the above embodiment, the shape of the special pad 80 of the sub-control board 52 was a rectangle, but it may be a shape other than the rectangle.

(7) In the above embodiment, the first mounting area 80A is a rectangle with longer sides than the second mounting area 80B, but the second mounting area 80B has longer sides than the first mounting area 80A. can be a long rectangle.

(8) In the above embodiment, the shapes of the first mounting area 80A and the second mounting area 80B are rectangular, but one of them may be rectangular and the other square. Also, other shapes may be used.

(9) In the above embodiment, the ROM socket 70 having the special pads 80 arranged in two rows and the terminals 72 arranged on two sides, or the conversion substrate 100 having the pads 100A arranged in two rows was mounted. , a configuration having two special pad rows arranged in a first direction and two special pad rows arranged in a second direction orthogonal to the first direction can mount a ROM socket with terminals arranged on four sides. good.

(10) In the above embodiment, the ROM socket 90 is mounted on the sub-control board 52 through the conversion board 100, but an IC socket other than the ROM socket may be used, or the IC socket may be directly mounted.

Although specific examples of the technology included in the scope of claims are disclosed in the specification and drawings, the technology described in the scope of claims is not limited to these specific examples. It includes various modifications and changes of the examples, and also includes single extracts of specific examples.

<Appendix>
Hereinafter, the features of the group of inventions extracted from each of the above-described embodiments will be described, showing effects and the like as necessary.

The following feature group relates to "a game machine having a control board for controlling a game", and the control board is equipped with a control board like the game machine described in "Patent Document A (Japanese Patent Application Laid-Open No. 2012-095879 (paragraph [0032], etc.). With regard to the background technology that "mounted parts are known to be mounted", it was made with the problem that "the development of a control board that can apply multiple types of mounted parts is required".

[Feature 1]
In a gaming machine (gaming machine 10) in which a mounting component (ROM socket 70) having a plurality of terminals (terminals 72) arranged in two rows is mounted on a control board (sub-control board 52) that controls games,
The control board (sub-control board 52) includes a first mounting area (first mounting area 80A) to which the terminal (terminal 72) of the first mounting component (ROM socket 70) can be soldered; and a second mounting area (second mounting area 80B) to which a second mounting component (conversion board 100) having a width of the terminal row larger than that of the mounting component (ROM socket 70) can be soldered. A game machine (game machine 10) provided with a special conductor portion (special pad 80).

[Feature 2]
The first mounting region (first mounting region 80A) and the second mounting region (second mounting region 80B) in the special conductor portion (special pad 80) are separated by sandwiching a resist (resist 52R). The game machine (game machine 10) according to claim 1.

[Feature 3]
The first mounting component is an IC socket (ROM socket 70),
3. The game machine (game machine 10) according to claim 1 or 2, wherein said second mounted component is a special board (conversion board 100) on which an IC socket (another ROM socket 90) is mounted.

[Feature 4]
While the first IC socket (ROM socket 70) is mounted in the first mounting area (first mounting area 80A),
4. The game machine (game machine 10) according to claim 3, wherein nothing is mounted in the second mounting area (second mounting area 80B).

[Feature 5]
While the special board (conversion board 100) is mounted in the second mounting area (second mounting area 80B),
4. The game machine (game machine 10) according to claim 3, wherein nothing is mounted in said first mounting area (first mounting area 80A).

[Feature 6]
6. The game machine (game machine 10) according to any one of claims 1 to 5, wherein ROMs (ROM 52C, ROM 152C) are installed in said IC sockets (ROM socket 70, another ROM socket 90).

[Feature 7]
7. The gaming machine ( game machine 10).

10 game machine 52 sub-control board 52
70 ROM socket 72 Terminal 80 Special pad 80A First mounting area 80B Second mounting area 100 Conversion board 100A Pad

Claims (7)

In a game machine in which mounted parts having a plurality of connecting parts arranged in two rows are mounted on a control board for controlling a game,
Two rows of special conductors capable of soldering the connection portions of the mounting components one by one,
Each of the special conductors has a first mounting region to which the connecting portion of the first mounting component can be soldered, and a second mounting region in which the interval between rows of the connecting portions is larger than that of the first mounting component. and a second mounting area to which the mounting component can be soldered, arranged in a direction perpendicular to the rows of the special conductors . 2. The gaming machine according to claim 1, wherein said first mounting region and said second mounting region in said special conductor are separated by sandwiching a resist. the first mounting component is a first IC socket,
3. The game machine according to claim 1, wherein said second mounted component is a special board on which a second IC socket is mounted. While the first IC socket is mounted in the first mounting area,
4. The game machine according to claim 3, wherein nothing is mounted in said second mounting area. While the special substrate is mounted in the second mounting area,
4. The game machine according to claim 3, wherein nothing is mounted in said first mounting area. 6. The game machine according to any one of claims 3 to 5, wherein ROMs are installed in said first and second IC sockets. 7. The game machine according to any one of claims 1 to 6, wherein the special conductor portion is a pad for surface-mounting the mounting component.

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