JP7283825B1 - SOLDER REMOVAL JIG AND SOLDER REMOVAL METHOD - Google Patents

Abstract

A desoldering jig for removing solder from a surface mount type IC package that has been removed from a substrate and has solder remaining. A solder removal jig (1) includes a mounting section (3) on which a surface mount type IC package (2) is mounted, and a fixing device (1) for fixing the mounting section (3) at a position capable of transmitting heat from a heating device (H). a part 4; An upper surface 31 of the mounting portion 3 is formed with a first fitting hole 32 into which the surface mount type IC package 2 is fitted with the solder surface 21 facing upward. In order to allow the user to move the melted solder S to the upper surface 31 of the mounting portion 3 using the squeegee T, the surface mount type IC package 2 is fitted in the first fitting hole 32, The first end portion 22 of the solder surface 21 and the second end portion 34 of the upper surface 31 of the mounting portion 3 adjacent to the first end portion 22 are flush with each other. [Selection drawing] Fig. 2

Description

The present invention relates to a desoldering jig for removing solder from a surface-mounted IC package that has been removed from a substrate and has solder remaining thereon, and a desoldering method using the desoldering jig.

Conventionally, in order to remove excess solder remaining on the electrodes on the printed wiring board after removing the semiconductor device, the printed wiring board is heated to a temperature close to the melting point of the solder, and then a thin stainless steel scraper or the like is used. A scraping method has been proposed (see, for example, Patent Document 1).

JP-A-2002-57453

However, since the above method does not consider how to dispose of the scraped solder, it is necessary to use a solder wicking wire, a solder wick, or the like to dispose of the solder that has been scraped into one place on the printed wiring board. Become.

Moreover, when a solder wicking wire or a solder wicking device is used, the printed wiring board is locally overheated, and the printed wiring board is damaged. Therefore, when the purpose is to reuse the printed wiring board, it is not preferable to remove the solder using a solder sucking wire or a solder sucker.

Accordingly, the present invention uses a solder removal jig capable of easily removing solder from a surface mount IC package while suppressing damage to the surface mount IC package, and the solder removal jig. It is an object of the present invention to provide a method for removing solder that has been damaged.

The present invention comprises a mounting section on which a surface mount type IC package which has been removed from a substrate and has solder remaining thereon is mounted, and a fixing section for fixing the mounting section to a position capable of transmitting heat from a heating device. and a first fitting hole for fitting the surface mount type IC package is formed in the upper surface of the mounting portion with the solder surface facing upward. The solder on the solder surface of the surface mount type IC package fitted in the fitting hole can be melted by the heat transmitted through the mounting portion, and the user can melt the solder using a squeegee. a first end of the solder surface in a state in which the surface mount type IC package is fitted in the first fitting hole, and The solder removal jig is characterized in that the first end and the adjacent second end of the upper surface of the mounting portion are flush with each other.

According to such a configuration, since the first end and the second end are flush with each other, the squeegee can be used to easily move the melted solder from the solder surface to the upper surface of the mounting portion. , the surface-mounted IC package can be restored to a reusable state. At this time, since the melted solder can be moved by a weak force of stroking with a squeegee, the pattern and resist of the surface mount type IC package are less damaged, and the surface mount type IC package is restored to a state suitable for reuse. becomes possible. In addition, since there is no need to directly heat the surface-mounted IC package using a soldering iron or the like, the surface-mounted IC package is prevented from being locally excessively heated. It is possible to restore the package to a state suitable for reuse. Moreover, when using a solder wicking wire, the flux flows out from the solder wicking wire, so it is necessary to clean the surface mount type IC package after removing the solder. Further, mounting portions having first fitting holes corresponding to various shapes of surface mount type IC packages are prepared, and all of these mounting portions are attached to the second mounting portion of the fixing portion. By making it possible to fit into the fitting hole, it is possible to universally support various shapes of surface mount type IC packages.

According to another aspect of the present invention, there is provided a mounting portion on which a surface mount type IC package with solder remaining after being removed from a substrate is mounted, and a front portion positioned to transmit heat from a heating device. a fixing portion for fixing the mounting portion, and a first fixing portion for fitting the surface mount type IC package on the upper surface of the mounting portion with the solder surface facing upward. A fitting hole is formed, and the solder on the solder surface of the surface mount type IC package fitted in the first fitting hole can be melted by heat transferred from the mounting portion. , in a state in which the surface mount type IC package is fitted in the first fitting hole, a first end of the solder surface and an upper surface of the mounting portion adjacent to the first end; A method for removing the solder on the solder surface using a solder removal jig that is flush with the second end, wherein the surface mount type IC package is mounted with the solder surface facing upward. After the step of fitting into the first fitting hole and the solder on the solder surface being melted by the heat transmitted through the mounting portion, the melted solder is removed by using a squeegee. and a step of moving from the first end side to the second end side.

According to the desoldering jig and desoldering method of the present invention, it is possible to easily remove the solder from the surface mount type IC package while suppressing damage to the surface mount type IC package.

1 is a top view of a solder removing jig according to an embodiment of the present invention; FIG. 1 is a side view of a desoldering jig according to an embodiment of the present invention; FIG. Explanatory drawing of solder removal according to the embodiment of the present invention Flowchart of a desoldering method according to an embodiment of the present invention

A desoldering jig 1 according to an embodiment of the present invention will be described below with reference to FIGS. 1 to 4. FIG.

As shown in FIGS. 1 to 3, a solder removing jig 1 according to the present embodiment is for removing solder S from a surface mount type IC package 2 in which solder S remains after it has been removed from a substrate. A placement portion 3 , a fixing portion 4 , and a solder receiving portion 5 are provided.

In this embodiment, the surface-mounted IC package 2 is of electrode pad type without leads, and the electrode pads (not shown) of the surface-mounted IC package 2 are connected to the pads (not shown) on the substrate. Assume that it is directly soldered.

The mounting portion 3 is for mounting the surface mount type IC package 2 which has been removed from the substrate and has the solder S remaining.

As the mounting portion 3, a material that is not (hardly) joined to solder is preferable, and aluminum and stainless steel, for example, are conceivable.

An upper surface 31 of the mounting portion 3 is formed with a first fitting hole 32 into which the surface mount type IC package 2 is fitted so that the solder surface 21 faces upward.

The first fitting hole 32 has substantially the same shape as the surface-mounted IC package 2 in plan view, leaving a small amount of play that allows the surface-mounted IC package 2 to be attached and detached. .

A pair of clamping holes 33 are also formed in the upper surface 31 so that the surface mount type IC package 2 fitted in the first fitting hole 32 can be removed using tweezers.

Furthermore, as shown in FIG. 2, in a state where the surface mount type IC package 2 is fitted in the first fitting hole 32, the first end 22 of the solder surface 21 and the first end 22 are connected to each other. The second end portion 34 of the upper surface 31 of the adjacent mounting portion 3 is configured to be flush with the second end portion 34 .

Also, the first fitting hole 32 is formed in a shape that conforms to the bottom and side surfaces of the surface mount IC package 2 when the surface mount IC package 2 is fitted.

When removing solder S from surface-mounted IC packages 2 of various shapes, mounting portions 3 each having a first fitting hole 32 corresponding to the shape of each surface-mounted IC package 2 are prepared. It is preferable to keep

The fixing portion 4 is for fixing the mounting portion 3 at a position where heat from the heating device H can be transferred.

In the present embodiment, the heating device H is of a hot plate type, the mounting section 3 is directly arranged on the heating device H, and the mounting section 3 is fixed to the heating device H by the fixing section 4 .

Specifically, as shown in FIG. 2, the fixed portion 4 is formed with a second fitting hole 41 into which the mounting portion 3 is fitted. The mounting portion 3 is fixed to the heating device H by fitting the mounting portion 3 .

With such a configuration, the solder S on the solder surface 21 of the surface mount type IC package 2 fitted in the first fitting hole 32 is melted by the heat transmitted through the mounting portion 3. becomes.

Furthermore, in the present embodiment, the first end portion 22 of the solder surface 21 and the second end portion 34 of the upper surface 31 of the mounting portion 3 adjacent to the first end portion 22 are flush with each other. Therefore, as shown in FIG. 3B, a squeegee T is used to move the melted solder S from the solder surface 21 (first end 22 side) to the upper surface 31 of the mounting portion 3. It can be easily moved to (the second end 34 side).

Further, in the present embodiment, the second fitting hole 41 is open on the second end 34 side, and a first An inclined portion 35 inclined downward on the side opposite to the end portion 22 is provided. In the present embodiment, the inclined portion 35 is made of the same material as the placement portion 3 and is integrally formed.

In addition, since the second end portion 34 side of the second fitting hole 41 is open, the mounting portion 3 is heated in the first direction X from the first end portion 22 toward the second end portion 34 . It must be fixed relative to device H. Therefore, in the present embodiment, a pair of projections 36 extending in a second direction Y perpendicular to the first direction X are fixed to the mounting portion 3, and a pair of recesses 42 respectively corresponding to the pair of projections 36 are fixed. The mounting portion 3 is fixed to the heating device H also in the first direction X by fitting the pair of protrusions 36 and the pair of recesses 42 provided in the portion 4 .

The solder receiving portion 5 is for receiving the solder S dropped from the mounting portion 3 , and is provided below the inclined portion 35 separately from the mounting portion 3 .

In this embodiment, the inverted triangular solder receiving portion having edges on both sides is partially connected to the fixed portion 4 by screws B, and as shown in FIG. It is arranged at a position capable of receiving the falling solder S.

In other words, the phrase "separately from the mounting portion 3" means that the temperature of the solder receiving portion 5 is lower than that of the mounting portion 3 (inclined portion 35). This can be realized by making the fixing portion 4 more heat insulating than the mounting portion 3 or by partially connecting the solder receiving portion 5 to the fixing portion 4 .

Next, a method for removing the solder S from the surface-mounted IC package 2 using the solder removal jig 1 having the above configuration will be described with reference to FIGS. do.

First, as shown in FIG. 3A, the surface mount type IC package 2 is fitted into the first fitting hole 32 with the solder surface 21 facing upward (S1 in FIG. 4). Heating by the heating device H is started before and after S1 in FIG.

Subsequently, after the solder S on the solder surface 21 is melted by the heat transmitted through the mounting portion 3 (S2 in FIG. 4: YES ), a squeegee T is used as shown in FIG. to move the melted solder S from the solder surface 21 (first end portion 22) to the upper surface 31 (second end portion 34) of the mounting portion 3 (S3 in FIG. 4). Since the heat from the heating device H is transferred to the mounting portion 3, the solder S moved to the upper surface 31 (second end portion 34) of the mounting portion 3 is also maintained in a molten state. Become.

Subsequently, as shown in FIG. 3C, the squeegee T is used to move the melted solder S to the inclined portion 35 (S4 in FIG. 4). Since the heat from the heating device H is transferred to the inclined portion 35, the solder S that has moved to the inclined portion 35 is also maintained in a melted state. Then, the solder S moved to the inclined portion 35 automatically drops onto the solder receiving portion 5. - 特許庁The dropped solder S is cooled by the dropping air and the solder receiving portion 5 which is separate from the mounting portion 3 and solidifies in a short time.

According to an experiment conducted by the inventor of the present application, it took about 7 minutes (soldering removal time: about 5 minutes, cleaning: about 2 minutes) when removing the solder using a soldering iron and a solder wick. When the solder removal work was performed by the method according to this embodiment, it was completed in about 1 minute (solder removal time: about 30 seconds, cleaning: about 30 seconds).

As described above, in the desoldering jig 1 and the desoldering method according to the present embodiment, the surface mount type IC package 2 is fitted in the first fitting hole 32 and the solder surface 21 is The first end portion 22 and the second end portion 34 of the upper surface 31 of the mounting portion 3 adjacent to the first end portion 22 are configured to be flush with each other.

With such a configuration, since the first end portion 22 and the second end portion 34 are flush with each other, the melted solder S is moved from the solder surface 21 to the mounting portion 3 using a squeegee T. It is possible to easily move to the upper surface 31 and restore the surface mount type IC package 2 to a reusable state. At this time, since the melted solder S can be moved with a weak force such as to be stroked by the squeegee T, damage to the pattern and resist of the surface mount IC package 2 is small, and the surface mount IC package 2 is suitable for reuse. state can be restored. In addition, since it is not necessary to directly heat the surface-mounted IC package 2 using a soldering iron or the like, the surface-mounted IC package 2 is prevented from being locally overheated. It is possible to restore the type IC package 2 to a state suitable for reuse. Moreover, when using a solder wicking wire, since flux flows out from the solder wicking wire, it is necessary to clean the surface mount type IC package 2 after removing the solder. . Further, mounting portions 3 having first fitting holes 32 corresponding to the shapes of surface-mounted IC packages 2 of various shapes are prepared respectively, and all of these mounting portions 3 are attached to the fixed portion. 4 can be fitted into the second fitting hole 41, it is possible to universally support surface mount type IC packages 2 of various shapes.

Moreover, in the solder removing jig 1 according to the present embodiment, the solder receiving portion 5 is provided below the inclined portion 35 separately from the placement portion 3 .

According to such a configuration, the melted solder S automatically falls when it is moved to the inclined portion 35, so that the effort required to clean the upper surface 31 of the mounting portion 3 is reduced. Further, the dropped solder S is cooled by the falling air and the solder receiving portion 5 separate from the mounting portion 3 and solidified in a short time, so that it can be easily discarded.

Also, the first fitting hole 32 is formed in a shape that conforms to the bottom and side surfaces of the surface mount IC package 2 when the surface mount IC package 2 is fitted.

According to such a configuration, the surface mount type IC package 2 except for the solder surface 21 is in contact with the first fitting hole 32, so that the heat from the heating device H is efficiently transferred to the surface mount type IC. The heat can be transferred to the package 2 and excessive local heating of the surface mount IC package 2 is prevented.

The desoldering jig and desoldering method of the present invention are not limited to the above-described embodiments, and various modifications and improvements are possible within the scope of the claims.

For example, in the above embodiment, the mounting section 3 is directly arranged on the hot plate type heating device H, but it may be arranged indirectly. Moreover, the heating device H is not limited to a hot plate type, and may be of a hot air blowing type, for example.

Moreover, the scope of rights of the solder removing jig of the present invention includes those integrated with the heating device H.

In the above embodiment, aluminum and stainless steel are used as materials to which solder is not (hardly) joined. However, for example, when the solder is for lead-free stainless steel, it is preferable to use other metals.

1 Solder removal jig 2 Surface mount type IC package 3 Mounting part 4 Fixing part 5 Solder receiving part 21 Solder surface 22 First end 31 Top surface 32 First fitting hole 33 Pinching hole 34 Second end 35 Inclined portion 36 Protruding portion 41 Second fitting hole 42 Concave portion H Heating device S Solder T Squeegee X First direction Y Second direction

Claims (4)

a mounting section on which the surface mount type IC package, which has been removed from the substrate and has solder remaining thereon, is mounted;
a fixing part for fixing the mounting part to a position capable of transmitting heat from a heating device;
with
A first fitting hole is formed in the upper surface of the mounting portion so that the solder surface faces upward and the surface mount type IC package is fitted therein,
the solder on the solder surface of the surface mount type IC package fitted in the first fitting hole can be melted by heat transmitted through the mounting portion;
In order to allow a user to move the melted solder to the upper surface of the mounting portion using a squeegee, the solder is applied while the surface mount type IC package is fitted in the first fitting hole. A first end of the surface and a second end of the upper surface of the mounting portion adjacent to the first end are configured to be flush with each other. jig. further comprising a solder receiving portion for receiving solder falling from the placement portion;
The fixing portion is formed with a second fitting hole into which the mounting portion is fitted,
The second fitting hole is open on the second end side,
An inclined portion inclined downward and opposite to the first end is provided on the second end side of the upper surface of the mounting portion,
2. The desoldering jig according to claim 1, wherein said solder receiving portion is provided below said inclined portion separately from said mounting portion. 2. The method according to claim 1, wherein said first fitting hole is formed in a shape conforming to a bottom surface and a side surface of said surface mount IC package in a state where said surface mount IC package is fitted. A desoldering jig as described. a mounting portion on which a surface mount type IC package removed from a substrate and having solder remaining is mounted thereon; a fixing portion for fixing the mounting portion to a position capable of transmitting heat from a heating device; and a first fitting hole for fitting the surface mount type IC package is formed on the upper surface of the mounting portion with the solder surface facing upward, and the first The solder on the solder surface of the surface-mounted IC package fitted in the fitting hole can be melted by the heat transferred from the placement portion, and the surface-mounted IC package is mounted on the first surface-mounted IC package. The first end of the solder surface and the second end of the upper surface of the mounting portion adjacent to the first end are flush with each other when fitted into the fitting hole. A method for removing solder on the solder surface using a solder removing jig,
fitting the surface mount type IC package into the first fitting hole with the solder surface facing upward;
After the solder on the solder surface is melted by the heat transferred through the mounting portion, the melted solder is moved from the first end side to the second end side using a squeegee. a step of moving to
A desoldering method comprising:

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