JP7282712B2 - Silicone composition for die bonding, cured product thereof, and optical semiconductor device - Google Patents

Description

TECHNICAL FIELD The present invention relates to a silicone composition for die bonding, a cured product thereof, and an optical semiconductor device using the cured product.

Silicone resins with good durability are used for sealing materials and die-bonding materials for light-emitting diode (hereinafter referred to as "LED") elements because heat generation of the elements has increased due to improvements in the brightness of the LED elements (patent References 1, 2). Particularly in the die bonding material, if the resin is too soft, bonding will not be possible in the wire bonding process performed after the die bonding process.

In addition, LED devices have been miniaturized in recent years, and there is a demand for a die bonding material with higher adhesiveness. If the adhesive strength of the die-bonding material is insufficient, there will be fatal problems in terms of manufacturing, such as peeling of the chip during the wire-bonding process in LED manufacturing. Conventional silicone die-bonding materials are excellent in durability, but their adhesiveness is insufficient, and materials with higher die shear strength are desired.

While a silicone composition having an epoxy group (Patent Document 3) is used as an effective adhesive functional group for a die bonding material that exhibits high die shear strength, under actual use conditions, it can be used for a long time such as 3 to 4 hours at 150 ° C. Therefore, there is a demand for a die-bonding material that develops strong adhesion in a short time of thermal curing.

Japanese Patent Application Laid-Open No. 2006-342200 JP-A-2000-234060 JP 2010-285571 A

SUMMARY OF THE INVENTION It is an object of the present invention to provide a silicone composition for die bonding that gives a cured product with excellent hardness and die shear strength even after curing for a short period of time.

（式中、Ｒ^１は、それぞれ同一又は異なっていてもよい、アルケニル基を含まない置換または非置換の一価炭化水素基であり、Ｒ^２は、それぞれ同一又は異なっていてもよいアルケニル基である。ａ、ｂ、ｃ、ｄ、ｅ、ｆ、ｇおよびｈは、それぞれ、ａ≧０、ｂ≧０、ｃ≧０、ｄ≧０、ｅ≧０、ｆ≧０、ｇ≧０およびｈ≧０を満たす数であり、ただし、ｂ＋ｃ＞０、ｆ＋ｇ＋ｈ＞０かつａ＋ｂ＋ｃ＋ｄ＋ｅ＋ｆ＋ｇ＋ｈ＝１を満たす数である。）

（式中、Ｒ^１は前記と同じであり、ｉ及びｊは、０．７≦ｉ≦２．１、０．００１≦ｊ≦１．０、かつ０．８≦ｉ＋ｊ≦３．０を満たす数である。）

（式中、Ｒ³は、それぞれ同一又は異なっていてもよい、置換基を有していてもよい炭素数１～１０の１価炭化水素基、又は水素原子を表し、Ｒ⁴は、それぞれ同一又は異なっていてもよい、非置換もしくは置換の炭素数１～２０のアルキル基、非置換もしくは置換の炭素数６～１０のアリール基、炭素数７～１０のアラルキル基、非置換もしくは置換の炭素数２～１０のアルケニル基、又は非置換もしくは置換の炭素数１～２０のアルコキシ基であり、Ｒ⁵は、それぞれ同一又は異なっていてもよい、非置換もしくは置換の炭素数１～１０のアルキル基、又は非置換もしくは置換の炭素数６～１０のアリール基であり、ｎは１～３の整数であり、ｍは１～１２の整数である。） In order to achieve the above problems, in the present invention,
(A) an organopolysiloxane containing two or more alkenyl groups in one molecule and having a viscosity of 100 mPa·s or less at 25°C;
(B) a three-dimensional network organopolysiloxane represented by the following average compositional formula (1), which is waxy or solid at 23° C.: 60 to 95 parts by mass per 100 parts by mass of components (A) and (B); part,
(C) Organohydrogenpolysiloxane represented by the following average compositional formula (2) and having at least two silicon-bonded hydrogen atoms per molecule: all silicon atoms in components (A) and (B) The amount that the number of hydrogen atoms bonded to silicon atoms in component (C) is 0.5 to 5.0 times the total number of alkenyl groups bonded to
(D) an organopolysiloxane containing one or more epoxy groups per molecule: 1 to 25 parts by mass per 100 parts by mass of components (A), (B), and (C);
(E) platinum group metal-based catalyst: 1 to 500 ppm in terms of mass of platinum group metal element with respect to the total mass of components (A), (B) and (C);
(F) Hydrolyzable organosilane compound represented by the following general formula (3): 10 to 10,000 ppm based on the total mass of components (A), (B) and (C)
Provided is a die bonding silicone composition comprising:

(In the formula, each R ¹ is a substituted or unsubstituted monovalent hydrocarbon group which may be the same or different and does not contain an alkenyl group, and each R ² is an alkenyl group which may be the same or different. a, b, c, d, e, f, g and h are respectively a≧0, b≧0, c≧0, d≧0, e≧0, f≧0, g≧0 and h ≧0, provided that b+c>0, f+g+h>0, and a+b+c+d+e+f+g+h=1.)

(Wherein, R ¹ is the same as above, i and j satisfy 0.7 ≤ i ≤ 2.1, 0.001 ≤ j ≤ 1.0, and 0.8 ≤ i + j ≤ 3.0 number.)

(In the formula, each R ³ is the same or different and represents an optionally substituted monovalent hydrocarbon group having 1 to 10 carbon atoms or a hydrogen atom, and each R ⁴ is the same or optionally different, unsubstituted or substituted alkyl group having 1 to 20 carbon atoms, unsubstituted or substituted aryl group having 6 to 10 carbon atoms, aralkyl group having 7 to 10 carbon atoms, unsubstituted or substituted carbon 2 to 10 alkenyl groups or unsubstituted or substituted alkoxy groups having 1 to 20 carbon atoms, and R ⁵ may be the same or different, unsubstituted or substituted alkyl having 1 to 10 carbon atoms or an unsubstituted or substituted aryl group having 6 to 10 carbon atoms, n is an integer of 1 to 3, and m is an integer of 1 to 12.)

The silicone composition for die bonding of the present invention is excellent in curability and can give a cured product with excellent hardness and die shear strength.

In addition, it is preferable that 80 mol % or more of all ^R1 's contained in the silicone composition are methyl groups.

When 80 mol % or more of all R ¹ in the composition is a methyl group, the silicone composition for die bonding has heat resistance, light resistance (ultraviolet resistance), and discoloration due to stress such as heat and ultraviolet rays. It is possible to give a cured product excellent in resistance to deterioration of.

Further, (G) preferably contains fumed silica having a BET specific surface area of 100 to 400 m ² /g.

When the composition contains such fumed silica, the silicone composition for die bonding of the present invention is excellent in thixotropy and workability.

（式中、ｓは１～６の整数であり、破線は結合手を表す。） Moreover, in the component (D), the epoxy group is preferably a group represented by the following general formula (9).

(Wherein, s is an integer of 1 to 6, and the dashed line represents a bond.)

When the epoxy group-containing compound is contained, the resulting cured product is superior in adhesiveness and die shear strength.

The present invention also provides a cured silicone product, which is a cured product of the silicone composition for die bonding described above.

Such cured silicone products are excellent in hardness and die shear strength and have high adhesion to substrates, LED chips, etc., and are particularly useful as die bonding materials for die bonding of LED elements and the like.

Furthermore, the present invention provides an optical semiconductor device in which an optical semiconductor element is die-bonded with the above silicone cured product.

Such an optical semiconductor device has excellent hardness and die shear strength, and uses the cured silicone product of the present invention as a die-bonding material that has high adhesion to substrates, LED chips, etc., and therefore has high reliability. .

As described above, the silicone composition for die bonding of the present invention provides a silicone cured product having excellent hardness and die shear strength even after curing for a short period of time (for example, 150° C., 2 hours). It is particularly useful as a die bonding material used for die bonding. In the wire bonding process performed after the die bonding process, problems such as chip peeling and bonding failure are unlikely to occur, and the optical semiconductor device in which the optical semiconductor element is die-bonded with this silicone cured product has high reliability. , its productivity also increases.

As described above, there has been a demand for the development of a silicone composition for die bonding that gives a silicone cured product with excellent hardness and die shear strength even after curing for a short period of time.

As a result of intensive studies on the above problems, the inventors of the present invention have found a silicone composition for die bonding containing components (A), (B), (C), (D), (E) and (F) described later. Then, the inventors have found that the above problems can be achieved, and completed the present invention.

（式中、Ｒ^１は、それぞれ同一又は異なっていてもよい、アルケニル基を含まない置換または非置換の一価炭化水素基であり、Ｒ^２は、それぞれ同一又は異なっていてもよいアルケニル基である。ａ、ｂ、ｃ、ｄ、ｅ、ｆ、ｇおよびｈは、それぞれ、ａ≧０、ｂ≧０、ｃ≧０、ｄ≧０、ｅ≧０、ｆ≧０、ｇ≧０およびｈ≧０を満たす数であり、ただし、ｂ＋ｃ＞０、ｆ＋ｇ＋ｈ＞０かつａ＋ｂ＋ｃ＋ｄ＋ｅ＋ｆ＋ｇ＋ｈ＝１を満たす数である。）

（式中、Ｒ^１は前記と同じであり、ｉ及びｊは、０．７≦ｉ≦２．１、０．００１≦ｊ≦１．０、かつ０．８≦ｉ＋ｊ≦３．０を満たす数である。）

（式中、Ｒ³は、それぞれ同一又は異なっていてもよい、置換基を有していてもよい炭素数１～１０の１価炭化水素基、又は水素原子を表し、Ｒ⁴は、それぞれ同一又は異なっていてもよい、非置換もしくは置換の炭素数１～２０のアルキル基、非置換もしくは置換の炭素数６～１０のアリール基、炭素数７～１０のアラルキル基、非置換もしくは置換の炭素数２～１０のアルケニル基、又は非置換もしくは置換の炭素数１～２０のアルコキシ基であり、Ｒ⁵は、それぞれ同一又は異なっていてもよい、非置換もしくは置換の炭素数１～１０のアルキル基、又は非置換もしくは置換の炭素数６～１０のアリール基であり、ｎは１～３の整数であり、ｍは１～１２の整数である。） That is, the present invention
(A) an organopolysiloxane containing two or more alkenyl groups in one molecule and having a viscosity of 100 mPa·s or less at 25°C;
(B) a three-dimensional network organopolysiloxane represented by the following average compositional formula (1), which is waxy or solid at 23° C.: 60 to 95 parts by mass per 100 parts by mass of components (A) and (B); part,
(C) Organohydrogenpolysiloxane represented by the following average compositional formula (2) and having at least two silicon-bonded hydrogen atoms per molecule: all silicon atoms in components (A) and (B) The amount that the number of hydrogen atoms bonded to silicon atoms in component (C) is 0.5 to 5.0 times the total number of alkenyl groups bonded to
(D) an organopolysiloxane containing one or more epoxy groups per molecule: 1 to 25 parts by mass per 100 parts by mass of components (A), (B), and (C);
(E) platinum group metal-based catalyst: 1 to 500 ppm in terms of mass of platinum group metal element with respect to the total mass of components (A), (B) and (C);
(F) Hydrolyzable organosilane compound represented by the following general formula (3): 10 to 10,000 ppm based on the total mass of components (A), (B) and (C)
A die-bonding silicone composition comprising:

(In the formula, each R ¹ is a substituted or unsubstituted monovalent hydrocarbon group which may be the same or different and does not contain an alkenyl group, and each R ² is an alkenyl group which may be the same or different. a, b, c, d, e, f, g and h are respectively a≧0, b≧0, c≧0, d≧0, e≧0, f≧0, g≧0 and h ≧0, provided that b+c>0, f+g+h>0, and a+b+c+d+e+f+g+h=1.)

(Wherein, R ¹ is the same as above, i and j satisfy 0.7 ≤ i ≤ 2.1, 0.001 ≤ j ≤ 1.0, and 0.8 ≤ i + j ≤ 3.0 number.)

(In the formula, each R ³ is the same or different and represents an optionally substituted monovalent hydrocarbon group having 1 to 10 carbon atoms or a hydrogen atom, and each R ⁴ is the same or optionally different, unsubstituted or substituted alkyl group having 1 to 20 carbon atoms, unsubstituted or substituted aryl group having 6 to 10 carbon atoms, aralkyl group having 7 to 10 carbon atoms, unsubstituted or substituted carbon 2 to 10 alkenyl groups or unsubstituted or substituted alkoxy groups having 1 to 20 carbon atoms, and R ⁵ may be the same or different, unsubstituted or substituted alkyl having 1 to 10 carbon atoms or an unsubstituted or substituted aryl group having 6 to 10 carbon atoms, n is an integer of 1 to 3, and m is an integer of 1 to 12.)

Although the present invention will be described in detail below, the present invention is not limited thereto.

[Silicone composition for die bonding]
The die bonding silicone composition of the present invention contains components (A) to (F) described below.
Each component will be described in detail below.

<(A) Component>
Component (A) is an organopolysiloxane containing two or more alkenyl groups per molecule and having a viscosity of 100 mPa·s or less at 25°C.

The viscosity of component (A) is 100 mPa·s or less, preferably 60 mPa·s or less, as measured by a rotational viscometer at 25°C. If it exceeds 100 mPa·s, the viscosity of the silicone composition for die bonding increases, making it difficult to handle in the process of applying the composition to an LED substrate with a die bonder. In addition, unless otherwise specified below, the viscosity is a value measured by a rotational viscometer at 25°C. Although the rotational viscometer is not particularly limited, for example, BL type, BH type, BS type, and cone plate type can be used.

The alkenyl group contained in component (A) is not particularly limited, but is preferably an alkenyl group having 2 to 10 carbon atoms such as vinyl group, allyl group, ethynyl group, and 2 carbon atoms. An alkenyl group of ∼6 is more preferred, and a vinyl group is even more preferred.

Component (A) can contain a substituted or unsubstituted monovalent hydrocarbon group containing no alkenyl group. Substituted or unsubstituted monovalent hydrocarbons having 1 to 8 carbon atoms are preferred. Examples of the monovalent hydrocarbon include alkyl groups such as methyl group, ethyl group, propyl group and butyl group; cycloalkyl groups such as cyclohexyl group and cyclopentyl group; aryl groups such as phenyl group, tolyl group and xylyl group; and benzyl group. , an aralkyl group such as a phenylethyl group, a halogenated hydrocarbon group such as a chloromethyl group, a chloropropyl group, a chlorocyclohexyl group, and the like. An alkyl group is preferred, and a methyl group is more preferred.

（式中、Ｒ^１はそれぞれ同一又は異なっていてもよい、アルケニル基を含まない置換または非置換の一価炭化水素基であり、Ｒ^２はそれぞれ同一又は異なっていてもよいアルケニル基である。ｏ、ｐ、ｑ、ｒは、それぞれ、ｑ≧０、ｒ≧０，ｏ≧０、ｐ≧０を満たす数であり、ただし、ｑ＋ｒ＞０、ｒ＋ｏ＞０、ｏ＋ｐ＞０、かつ、ｏ＋ｐ＋ｑ＋ｒ＝１を満たす数である。） Component (A) may be linear or branched, and is preferably an organopolysiloxane represented by the following average compositional formula (4).

(In the formula, each R ¹ is a substituted or unsubstituted monovalent hydrocarbon group which may be the same or different and does not contain an alkenyl group, and each R ² is an alkenyl group which may be the same or different. o, p, q, and r are numbers satisfying q≧0, r≧0, o≧0, and p≧0, respectively, provided that q+r>0, r+o>0, o+p>0, and o+p+q+r= It is a number that satisfies 1.)

The substituted or unsubstituted monovalent hydrocarbon group containing no alkenyl group represented by R ¹ is not particularly limited as long as it does not contain an alkenyl group. or unsubstituted monovalent hydrocarbons are preferred. Examples of the monovalent hydrocarbon include alkyl groups such as methyl group, ethyl group, propyl group and butyl group; cycloalkyl groups such as cyclohexyl group and cyclopentyl group; aryl groups such as phenyl group, tolyl group and xylyl group; and benzyl group. , an aralkyl group such as a phenylethyl group, a halogenated hydrocarbon group such as a chloromethyl group, a chloropropyl group, a chlorocyclohexyl group, and the like. An alkyl group is preferred, and a methyl group is more preferred.

Although the alkenyl group represented by R ² is not particularly limited, it is preferably an alkenyl group having 2 to 10 carbon atoms such as vinyl group, allyl group, ethynyl group, and 2 to 6 carbon atoms. is more preferably an alkenyl group, and still more preferably a vinyl group.

Specific examples of the branched organopolysiloxane of component (A) include those represented by the following formulas.

Component (A) may be an organopolysiloxane having a linear molecular structure.
Specific examples of linear organopolysiloxanes include those represented by the following formulas.

（上記式中、括弧内のシロキサン単位の配列順は任意であってもよい。）

(In the above formula, the siloxane units in parentheses may be arranged in any order.)

(A) component may be used individually by 1 type, or may use 2 or more types together.

<(B) Component>
Component (B) is represented by the following average compositional formula (1) and is a three-dimensional network organopolysiloxane that is waxy or solid at 23°C. Component (B) is a component for _obtaining reinforcing properties while maintaining the transparency _of the cured product. It is a three-dimensional network organopolysiloxane resin containing at least one of and is an important component for obtaining die shear strength. Here, "waxy" means a gum-like (raw rubber-like) that has a viscosity at 23° C. of 10,000,000 mPa·s or more, particularly 100,000,000 mPa·s or more, and hardly exhibits self-fluidity. means that

（式中、Ｒ^１は、それぞれ同一又は異なっていてもよい、アルケニル基を含まない置換または非置換の一価炭化水素基であり、Ｒ^２は、それぞれ同一又は異なっていてもよいアルケニル基である。ａ、ｂ、ｃ、ｄ、ｅ、ｆ、ｇおよびｈは、それぞれ、ａ≧０、ｂ≧０、ｃ≧０、ｄ≧０、ｅ≧０、ｆ≧０、ｇ≧０およびｈ≧０を満たす数であり、ただし、ｂ＋ｃ＞０、ｆ＋ｇ＋ｈ＞０かつａ＋ｂ＋ｃ＋ｄ＋ｅ＋ｆ＋ｇ＋ｈ＝１を満たす数である。）

(In the formula, each R ¹ is a substituted or unsubstituted monovalent hydrocarbon group which may be the same or different and does not contain an alkenyl group, and each R ² is an alkenyl group which may be the same or different. a, b, c, d, e, f, g and h are respectively a≧0, b≧0, c≧0, d≧0, e≧0, f≧0, g≧0 and h ≧0, provided that b+c>0, f+g+h>0, and a+b+c+d+e+f+g+h=1.)

Examples of R ¹ include those exemplified for component (A), preferably an alkyl group having 1 to 8 carbon atoms, more preferably a methyl group.

Examples of R ² include those exemplified for component (A), preferably an alkenyl group having 2 to 10 carbon atoms, more preferably an alkenyl group having 2 to 6 carbon atoms, and a vinyl group. is more preferred.

a is 0 to 0.65, b is 0.1 to 0.65, c is 0 to 0.65, d is 0 to 0.5, e is 0 to 0.5, f is 0 to 0.8, It is preferable that g is a number from 0 to 0.8 and h is a number from 0 to 0.6. f+g+h is preferably 0.05 or more, more preferably 0.1 to 0.9, more preferably 0.2 to 0.6.

The content of silicon-bonded alkenyl groups in component (B) is preferably in the range of 0.01 to 1 mol, preferably in the range of 0.05 to 0.5 mol, per 100 g of component (B). is more preferred. When the content is in the range of 0.01 to 1 mol, the cross-linking reaction proceeds sufficiently to obtain a cured product with higher hardness.

Component (B) essentially has a branched structure consisting of SiO _4/2 units and/or SiO _3/2 units, and further includes SiO _2/2 (SiO) units such as methylvinylsiloxy units and dimethylsiloxy units, dimethyl It may contain SiO _1/2 units such as vinylsiloxy units, trimethylsiloxy units and the like. The content of SiO _4/2 units and/or SiO _3/2 units is preferably 5 mol % or more, more preferably 10 mol to 90 mol %, of all siloxane units in the organopolysiloxane resin of component (B), Particularly preferably, it is 20 to 60 mol %.

The content of component (B) is 60 to 95 parts by mass, preferably 70 to 90 parts by mass, per 100 parts by mass of components (A) and (B). If the amount of component (B) is less than 60 parts by mass, the adhesion may be poor and a hardened product with high hardness may not be obtained. When the composition is used as a die-bonding material, it becomes difficult to handle.

Specific examples of the three-dimensional network organopolysiloxane of component (B) include the following.

(B) component may be used individually by 1 type, or may use 2 or more types together.

（式中、Ｒ^１は前記と同じであり、ｉ及びｊは、０．７≦ｉ≦２．１、０．００１≦ｊ≦１．０、かつ０．８≦ｉ＋ｊ≦３．０を満たす数である。） <(C) Component>
Component (C) acts as a cross-linking agent that cross-links the alkenyl groups contained in components (A) and (B) through a hydrosilylation reaction. Component (C) is an organohydrogenpolysiloxane represented by the following average compositional formula (2) and having at least two silicon-bonded hydrogen atoms (ie, Si—H groups) per molecule.

(Wherein, R ¹ is the same as above, i and j satisfy 0.7 ≤ i ≤ 2.1, 0.001 ≤ j ≤ 1.0, and 0.8 ≤ i + j ≤ 3.0 number.)

Examples of R ¹ include those exemplified for component (A), preferably an alkyl group having 1 to 8 carbon atoms, more preferably a methyl group.

The ratio of methyl groups to the total number of all monovalent hydrocarbon groups bonded to silicon atoms other than alkenyl groups represented by R ¹ in the composition of the present invention is 80 mol% or more (that is, the above-mentioned It is preferable that 80 mol% or more of R ¹ in components (A) to (C) and component (D) described later is a methyl group, and in particular, 90 mol% or more is good for heat resistance and light resistance. It is preferable because it is excellent in durability (ultraviolet resistance) and resistance to deterioration such as discoloration due to stress such as heat and ultraviolet rays.

Component (C) has at least two silicon-bonded hydrogen atoms (Si—H groups) in one molecule, preferably 2 to 200, more preferably 3 to 100, still more preferably 4 to 50 pieces.

From the viewpoint of cross-linking balance, the amount of component (C) to be blended should be determined based on the total number of alkenyl groups bonded to all silicon atoms in components (A) and (B). The amount is such that the number of hydrogen atoms (Si—H groups) formed is 0.5 to 5.0 times, preferably 0.7 to 3.0 times. If the number of hydrogen atoms is less than 0.5 times the total number of alkenyl groups, cross-linking will not proceed sufficiently, and a cured product with excellent hardness will not be obtained. If the number of hydrogen atoms is more than 5.0 times the total number of alkenyl groups, the crosslinked structure becomes uneven, and the cured silicone product may lose flexibility or become brittle.

The viscosity of component (C) at 25° C. is not particularly limited, but is preferably 100 mPa·s or less, more preferably in the range of 5 to 100 mPa·s.

(C) Component organohydrogenpolysiloxanes include 1,1,3,3-tetramethyldisiloxane, 1,3,5,7-tetramethylcyclotetrasiloxane, tris(hydrogendimethylsiloxy)methylsilane, tris (Hydrogendimethylsiloxy)phenylsilane, methylhydrogencyclopolysiloxane, methylhydrogensiloxane/dimethylsiloxane cyclic copolymer, both ends trimethylsiloxy group-blocked methylhydrogenpolysiloxane, both ends trimethylsiloxy group-blocked dimethylsiloxane/methyl Hydrogensiloxane copolymer, both terminal dimethylhydrogensiloxy group-blocked dimethylpolysiloxane, both terminal dimethylhydrogensiloxy group-blocked methylhydrogenpolysiloxane, both terminal dimethylhydrogensiloxy group-blocked dimethylsiloxane/methylhydrogensiloxane copolymer Coalescence, both terminal trimethylsiloxy group-blocked methylhydrogensiloxane/diphenylsiloxane copolymer, both terminal trimethylsiloxy group-blocked methylhydrogensiloxane/diphenylsiloxane/dimethylsiloxane copolymer, both terminal trimethylsiloxy group-blocked methylhydrogensiloxane/ Methylphenylsiloxane/dimethylsiloxane copolymer, dimethylhydrogensiloxy group-blocked methylhydrogensiloxane/dimethylsiloxane/diphenylsiloxane copolymer at both ends, dimethylhydrogensiloxy group-blocked methylhydrogensiloxane/dimethylsiloxane/methylphenyl at both ends a siloxane copolymer, a copolymer consisting of (CH ₃ ) ₂ HSiO _1/2 units, (CH ₃ ) ₃ SiO _1/2 units and SiO _4/2 units, (CH ₃ ) ₂ HSiO _1/2 units; SiO _4/2 units, copolymers consisting of (CH ₃ ) ₂ HSiO _1/2 units, SiO _4/2 units and (C ₆ H ₅ ) ₃ SiO _1/2 units, and the like. and those represented by the following general formula (5) or (6).

（式中、Ｒ^１は前記のとおりであり、ｔは２～４０、好ましくは８～３５の整数であり、ｕは６～８の整数である。また、（６）は環状である。）

(Wherein, R ¹ is as described above, t is an integer of 2 to 40, preferably 8 to 35, u is an integer of 6 to 8, and (6) is cyclic.)

（式中、ｔは前記のとおりである。Ｍｅはメチル基（以下同じ）である。） Specific examples of component (C) include those represented by the following formula (7).

(Wherein, t is as described above. Me is a methyl group (same below).)

Specific examples of the component (C) also include those represented by the following formula.

（上記式中、括弧内のシロキサン単位の配列順は任意である。）

(In the above formula, the order of arrangement of the siloxane units in parentheses is arbitrary.)

The (C) component organohydrogenpolysiloxane may be used alone or in combination of two or more.

（式中、Ｒ^１は前記のとおりであり、Ｒ³はそれぞれ同一又は異なっていてもよい、置換基を有していてもよい炭素数１～１０の１価炭化水素基を表し、Ｒ^６はそれぞれ同一又は異なっていてもよい、エポキシ基を含む基であり、ｖおよびｗはそれぞれ、ｖ＞０、ｗ≧０およびｖ＋ｗ＝１を満たす数であり、ｘは０≦ｘ≦２を満たす数である。） <(D) Component>
Component (D) is an organopolysiloxane containing one or more epoxy groups per molecule. The molecular structure of the component (D) organopolysiloxane may be linear, cyclic, branched or three-dimensional network structure, and examples thereof include those represented by the following formula (8).

(wherein R ¹ is as described above, R ³ represents an optionally substituted monovalent hydrocarbon group having 1 to 10 carbon atoms which may be the same or different, and R ⁶ is a group containing an epoxy group, each of which may be the same or different, v and w are numbers that satisfy v>0, w≧0 and v+w=1, and x satisfies 0≦x≦2 number.)

（式中、Ｒ^１、Ｒ^６は前記のとおりである。） Moreover, the (D) component includes those represented by the following formula.

(In the formula, R ¹ and R ⁶ are as defined above.)

R ³ in the above formula (8) is an optionally substituted monovalent hydrocarbon group having 1 to 10 carbon atoms, preferably an optionally substituted monovalent saturated aliphatic hydrocarbon group groups, optionally substituted monovalent unsaturated aliphatic hydrocarbon groups, optionally substituted monovalent aromatic hydrocarbon groups (including aromatic heterocycles), more preferably Monovalent saturated aliphatic hydrocarbon group optionally having substituent(s), monovalent aromatic hydrocarbon group optionally having substituent(s), particularly preferably monovalent saturated aliphatic hydrocarbon group optionally having substituent(s) It is a hydrogen group.

Specific examples of optionally substituted monovalent saturated aliphatic hydrocarbon groups include linear groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl and octyl groups. Alkyl group, isopropyl group, isobutyl group, tert-butyl group, isopentyl group, branched chain alkyl group such as neopentyl group, cyclopentyl group, cyclohexyl group, cycloalkyl group such as cycloheptyl group, chloromethyl group, 3-chloropropyl group , 3,3,3-trifluoropropyl group, halogen-substituted alkyl group such as bromopropyl group, etc., having 1 to 10 carbon atoms, preferably 1 to 8 carbon atoms, more preferably 1 to 6 carbon atoms. .

Examples of optionally substituted monovalent unsaturated aliphatic hydrocarbon groups include alkenyl groups such as ethenyl group, 1-methylethenyl group and 2-propenyl group, ethynyl group and 2-propynyl group. Those having 2 to 10 carbon atoms, preferably 2 to 8 carbon atoms, more preferably 2 to 6 carbon atoms, such as alkynyl groups.

Specific examples of optionally substituted monovalent aromatic hydrocarbon groups include aryl groups such as a phenyl group and a tolyl group, aralkyl groups such as a benzyl group and a 2-phenylethyl group, and α, α, α. A group having 6 to 10 carbon atoms, preferably 6 to 8 carbon atoms, more preferably 6 carbon atoms, such as a halogen-substituted aryl group such as a trifluorotolyl group and a chlorobenzyl group.

R ³ in the above formula (8) is preferably a methyl group, an ethyl group, a propyl group, a butyl group, a phenyl group, etc. Among them, a methyl group or an ethyl group is more preferable.

（式中、ｓは１～６の整数であり、破線は結合手を表す。） The epoxy group-containing group represented by ^R6 includes a group bonded to a silicon atom via a carbon atom, such as an alicyclic epoxy group and a glycidyl group, and preferably has a glycidyl group. More preferred examples include a group represented by the following formula (9) such as a γ-glycidoxypropyl group, and a β-(3,4-epoxycyclohexyl)ethyl group.

(Wherein, s is an integer of 1 to 6, and the dashed line represents a bond.)

Examples of R ¹ include those exemplified for component (A), preferably an alkyl group having 1 to 8 carbon atoms, more preferably a methyl group.

Component (D) preferably has a molecular weight in the range of 500 to 10,000 from the viewpoint of workability. In formula (8), v and w are preferably numbers satisfying 0<v≦0.9, 0<w≦0.9, and v+w=1. If component (D) falls within such a range, compatibility with components (A), (B) and (C) will be excellent, and the resulting cured product will be excellent in adhesiveness and die shear strength.

Component (D) may be used singly or in combination of two or more.

The amount of component (D) is 1 to 25 parts by mass, preferably 3 to 10 parts by mass, per 100 parts by mass of components (A), (B) and (C). If the amount is less than the lower limit, the intended die shear strength may not be obtained. On the other hand, if the amount exceeds the upper limit, the components may separate in the composition, or the strength of the resulting cured product may decrease.

<(E) Component>
The component (E), the platinum group metal-based catalyst, is a component for advancing and accelerating the hydrosilylation reaction of the components (A) to (C).

The platinum group metal-based catalyst is not particularly limited, and examples thereof include platinum group metals such as platinum, palladium, and rhodium; platinum compounds such as compounds; platinum group metal compounds such as tetrakis(triphenylphosphine)palladium and chlorotris(triphenylphosphine)rhodium; Since it contains almost no chlorine impurities, chloroplatinic acid is preferably modified with silicone.

(E) component may be used individually by 1 type, or may use 2 or more types together.

The amount of component (E) is 1 to 500 ppm, preferably 3 to 100 ppm, and more preferably 5 to 40 ppm in terms of mass of the platinum group metal element with respect to the total mass of components (A) to (C). If the amount of component (E) is less than the lower limit, the resulting die bonding silicone composition will not cure sufficiently. Curing speed does not improve further.

（式中、Ｒ³は、それぞれ同一又は異なっていてもよい、置換基を有していてもよい炭素数１～１０の１価炭化水素基、又は水素原子を表し、Ｒ⁴は、それぞれ同一又は異なっていてもよい、非置換もしくは置換の炭素数１～２０のアルキル基、非置換もしくは置換の炭素数６～１０のアリール基、炭素数７～１０のアラルキル基、非置換もしくは置換の炭素数２～１０のアルケニル基、又は非置換もしくは置換の炭素数１～２０のアルコキシ基であり、Ｒ⁵は、それぞれ同一又は異なっていてもよい、非置換もしくは置換の炭素数１～１０のアルキル基、又は非置換もしくは置換の炭素数６～１０のアリール基であり、ｎは１～３の整数であり、ｍは１～１２の整数である。） <(F) Component>
Component (F) is a hydrolyzable organosilane compound having both a hydrolyzable silyl group and an S—Si bond in one molecule, represented by the following general formula (3), and is the silicone for die bonding of the present invention. It acts as a component for developing adhesiveness in the composition.

(In the formula, each R ³ is the same or different and represents an optionally substituted monovalent hydrocarbon group having 1 to 10 carbon atoms or a hydrogen atom, and each R ⁴ is the same or optionally different, unsubstituted or substituted alkyl group having 1 to 20 carbon atoms, unsubstituted or substituted aryl group having 6 to 10 carbon atoms, aralkyl group having 7 to 10 carbon atoms, unsubstituted or substituted carbon 2 to 10 alkenyl groups or unsubstituted or substituted alkoxy groups having 1 to 20 carbon atoms, and R ⁵ may be the same or different, unsubstituted or substituted alkyl having 1 to 10 carbon atoms or an unsubstituted or substituted aryl group having 6 to 10 carbon atoms, n is an integer of 1 to 3, and m is an integer of 1 to 12.)

When R ³ in the above formula (3) is a monovalent hydrocarbon group having 1 to 10 carbon atoms which may have a substituent, it is preferably a monovalent saturated aliphatic hydrocarbon group which may have a substituent. A hydrogen group, an optionally substituted monovalent unsaturated aliphatic hydrocarbon group, and an optionally substituted monovalent aromatic hydrocarbon group (including an aromatic heterocycle) are more preferred. is a monovalent saturated aliphatic hydrocarbon group optionally having substituents, a monovalent aromatic hydrocarbon group optionally having substituents, particularly preferably a monovalent saturated aliphatic hydrocarbon group optionally having substituents It is a hydrocarbon group.

Specific examples of optionally substituted monovalent saturated aliphatic hydrocarbon groups include linear groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl and octyl groups. Alkyl group, isopropyl group, isobutyl group, tert-butyl group, isopentyl group, branched chain alkyl group such as neopentyl group, cyclopentyl group, cyclohexyl group, cycloalkyl group such as cycloheptyl group, chloromethyl group, 3-chloropropyl group , 3,3,3-trifluoropropyl group, halogen-substituted alkyl group such as bromopropyl group, etc., having 1 to 10 carbon atoms, preferably 1 to 8 carbon atoms, more preferably 1 to 6 carbon atoms. .

Examples of optionally substituted monovalent unsaturated aliphatic hydrocarbon groups include alkenyl groups such as ethenyl group, 1-methylethenyl group and 2-propenyl group, ethynyl group and 2-propynyl group. Those having 2 to 10 carbon atoms, preferably 2 to 8 carbon atoms, more preferably 2 to 6 carbon atoms, such as alkynyl groups.

Specific examples of optionally substituted monovalent aromatic hydrocarbon groups include aryl groups such as a phenyl group and a tolyl group, aralkyl groups such as a benzyl group and a 2-phenylethyl group, and α, α, α. A group having 6 to 10 carbon atoms, preferably 6 to 8 carbon atoms, more preferably 6 carbon atoms, such as a halogen-substituted aryl group such as a trifluorotolyl group and a chlorobenzyl group.

^R3 in the above formula (3) is preferably a methyl group, an ethyl group, a propyl group, a butyl group, a phenyl group, etc. Among them, a methyl group or an ethyl group is more preferable.

Each R ⁴ is independently an unsubstituted or substituted alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aralkyl group having 7 to 10 carbon atoms, or an unsubstituted or substituted alkyl group having 6 to 10 carbon atoms. an alkenyl group of 2 to 10, or an unsubstituted or substituted alkoxy group having 1 to 20 carbon atoms, and the alkyl group for ^R4 includes a methyl group, an ethyl group, a tert-butyl group, an octyl group, a decyl group, and dodecyl. Examples of the aryl group include a phenyl group, a tolyl group, and a xylyl group. Examples of the aralkyl group include a benzyl group. Examples of the alkenyl group include a vinyl group, a propenyl group, a pentenyl group, and the like. Examples of alkoxy groups include methoxy, ethoxy, propoxy, butoxy, octoxy, and dodecoxy groups, and substituted alkyl groups, substituted aryl groups, substituted alkenyl groups, substituted alkoxy groups. Groups include halogen atoms. Among these, ^R4 is preferably a methyl group, an ethyl group, a methoxy group or an ethoxy group, and more preferably at least one is a methoxy group or an ethoxy group.

R ⁵ is an unsubstituted or substituted C 1-10 alkyl group or an unsubstituted or substituted C 6-10 aryl group, and the alkyl group for R ⁵ is a methyl group, an ethyl group, or a propyl group. , a butyl group, etc. Examples of the aryl group include a phenyl group, and examples of the substituent in the substituted alkyl group and the substituted aryl group include a halogen atom. Among these, a methyl group is preferable as ^R5 .

n is an integer of 1 to 3, preferably 3; m is an integer of 1-12, preferably an integer of 1-8.

（式中、Ｒ^３、ｎ、Ｒ^４は上記と同様であり、Ｒ⁸は非置換もしくは置換の炭素数１～２０のアルキル基、非置換もしくは置換の炭素数６～１０のアリール基、炭素数７～１０のアラルキル基、又は非置換もしくは置換の炭素数２～１０のアルケニル基である。） Component (F) is preferably represented by the following general formula (3-2).

(wherein R ³ , n and R ⁴ are the same as above, R ⁸ is an unsubstituted or substituted C 1-20 alkyl group, an unsubstituted or substituted C 6-10 aryl group, a carbon 7-10 aralkyl groups, or unsubstituted or substituted alkenyl groups having 2-10 carbon atoms.)

R ⁸ in the above formula (3-2) is an unsubstituted or substituted alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aralkyl group having 7 to 10 carbon atoms, or an unsubstituted or substituted aryl group. It is an unsubstituted or substituted alkenyl group having 2 to 10 carbon atoms, and examples of the alkyl group for R ⁸ include methyl, ethyl, tert-butyl, octyl, decyl, dodecyl, etc. Examples include a phenyl group, a tolyl group, a xylyl group, and the like; examples of the aralkyl group include a benzyl group; examples of the alkenyl group include a vinyl group, a propenyl group, a pentenyl group, and the like; A halogen atom is mentioned as a substituent in a group, a substituted aryl group, and a substituted alkenyl group. Of these, R ⁸ is preferably a methyl group or an ethyl group.

（式中、Ｒ^３、ｎ、Ｍｅは上記のとおりであり、Ｅｔはエチル基（以下同じ）である。） Component (F) is more preferably those represented by the following general formulas (10) to (15).

(In the formula, R ³ , n, and Me are as described above, and Et is an ethyl group (same below).)

(F) component may be used individually by 1 type, or may use 2 or more types together.

The blending amount of component (F) is 10 to 10,000 ppm, preferably 100 to 5,000 ppm, based on the total weight of components (A), (B) and (C). If the amount is less than 10 ppm, the effect of promoting the adhesion of the silicone composition is poor, and if the amount exceeds 10,000 ppm , the addition reaction of the silicone composition may be inhibited, resulting in a decrease in die shear strength. be.

<(G) Component>
The die bonding silicone composition of the present invention may contain fumed silica as component (G). Component (G) is a component that imparts suitable thixotropic properties for stable application of the silicone composition for die bonding of the present invention.

From the viewpoint of thixotropy and workability, the BET specific surface area of component (G) is preferably in the range of 100 to 400 m ² /g.

From the viewpoint of thixotropy and workability, the amount of component (G) added is preferably in the range of 3 to 10 parts per 100 parts by mass of components (A) to (F).

Specific examples of the component (G) include Leolosil DM-30 (manufactured by Tokuyama Corp., BET surface area of 300 m ² /g).

<Other ingredients>
In addition to the above components (A) to (G), the composition of the present invention may optionally contain other components exemplified below.

(Reaction inhibitor)
In the silicone composition for die bonding of the present invention, a known reaction inhibitor (reaction control agent) having a curing inhibitory effect on the addition reaction catalyst of component (E) can be used, if necessary. Examples of the reaction inhibitor include phosphorus-containing compounds such as triphenylphosphine; nitrogen-containing compounds such as tributylamine, tetramethylethylenediamine and benzotriazole; sulfur-containing compounds; acetylenic compounds; hydroperoxy compounds; be done.

Since the degree of the curing inhibitory effect of the reaction inhibitor varies greatly depending on the chemical structure of the reaction inhibitor, it is preferable to adjust the amount of the reaction inhibitor to an optimum amount for each reaction inhibitor used. Usually, 0.001 to 5 parts by mass is preferable per 100 parts by mass in total of components (A), (B), (C), (D) and (F).

(filler)
In the silicone composition for die bonding of the present invention, in addition to component (G) fumed silica, inorganic fillers such as crystalline silica, hollow filler, and silsesquioxane; , organochlorosilane compounds, organosilazane compounds, low-molecular-weight siloxane compounds, and other organosilicon compounds that have been surface-hydrophobicized; silicone rubber powders; silicone resin powders; As this component, it is particularly preferable to use a filler capable of imparting thixotropy from the viewpoint of workability.

These other components may be used singly or in combination of two or more.

It is preferable that 80 mol % or more of all ^R1 groups in the silicone composition for die bonding of the present invention are methyl groups. In order to improve workability in die bonding (transfer method), the viscosity of the silicone composition for die bonding of the present invention is preferably 5 to 100 Pa·s, more preferably 20 to 50 Pa·s at 25°C. be.

[Cured product]
Furthermore, the present invention provides a cured silicone product, which is a cured product of a silicone composition for die bonding.

Curing of the silicone composition for die bonding of the present invention may be carried out under known conditions, but curing is preferably carried out at 150° C. for 2 hours or less.

The cured product of the die-bonding silicone composition of the present invention has high adhesion to substrates, LED chips, etc., and is particularly useful as a die-bonding material for die-bonding LED elements and the like. As described above, the cured silicone product of the present invention can be used as an adhesive having high adhesion to substrates, LED chips, and the like.

[Optical semiconductor device]
Furthermore, the present invention provides an optical semiconductor device in which an optical semiconductor element is die-bonded with the above silicone cured product.

As an example of the method of die-bonding an optical semiconductor element using the die-bonding silicone composition of the present invention, a syringe is filled with the die-bonding silicone composition of the present invention, and a dispenser is used to apply the die-bonding silicone composition onto a substrate such as a package. After coating to a thickness of 1 to 10 μm in a dry state, an optical semiconductor element (for example, a light emitting diode) is placed on the coated composition, and the composition is cured to form an optical semiconductor element on the substrate. A method of die-bonding to the Alternatively, the composition may be placed on a squeegee plate and applied to a substrate by stamping while squeegeeing so as to have a thickness of 1 to 10 μm in a dry state. A method of die-bonding the optical semiconductor element onto the substrate by curing the composition may also be used. Curing conditions for the composition may be as described above. In this way, a highly reliable optical semiconductor device in which an optical semiconductor element is die-bonded with the cured silicone product of the present invention can be obtained.

EXAMPLES The present invention will be specifically described below using Examples and Comparative Examples, but the present invention is not limited to these. The molecular weight is the weight average molecular weight in terms of standard polystyrene in gel permeation chromatography (GPC). Viscosity at 25° C. is measured with a rotational viscometer.

The abbreviations of the siloxane units have the following meanings.
M: ( _CH3 ) _{3SiO1 /2}
^MVi : ( _CH2 =CH)( _CH3 )2SiO1 _{/ 2}
^MVi3 : ( _CH2 =CH) _{3SiO1 /2}
D: ( _CH3 ) _{2SiO2 /2}
^DH : H( _CH3 )SiO2 _/2

^D1 :

T: ( _CH3 )SiO3 _/2

^T1 :

^T2 :

^T3 :

^T4 :

Q: SiO _4/2

[Examples 1 to 9, Comparative Examples 1 to 5]
A silicone composition for die bonding was prepared by mixing the following components in the amounts shown in Table 1.

In addition, the numerical value of each component in Table 1 represents a mass part. The [Si-H]/[Si-Vi] value is the hydrogen atoms bonded to silicon atoms in component (C) relative to the total number of alkenyl groups bonded to all silicon atoms in components (A) and (B). It represents the number ratio (molar ratio) of (Si—H groups).

Component ₍ A): linear dimethylpolysiloxane having _an average structure represented by ^MVi2D40 (viscosity at 25°C: 60 mPa·s)

(B) Component:
(B-1 ₎ A three ^- dimensional network organopolysiloxane _{( B-} 2) A three _- dimensional network organopolysiloxane having a structural unit ratio _of ^{MVi30.07M0.4Q0.53} , a solid at 23°C, _and a vinyl group content of 0.246 mol/100g.

(C) Component:
(C-1) Organohydrogenpolysiloxane having an average structure of M ₂ D ^H ₈ (C-2) Organohydrogenpolysiloxane having an average structure of M ₂ D _14.5 D ^H ₃₈

(D) Component:
(D-1) Epoxy group-containing siloxane having a structural unit ratio of T ¹ _0.49 T _0.51 (molecular weight 2,780, viscosity 313 mPa·s)
(D-2) Epoxy group-containing siloxane having a structural unit ratio of T ² _0.47 T _0.53 (molecular weight 2,570, viscosity 138 mPa·s)
(D-3) Epoxy group-containing siloxane having a structural unit ratio of T ³ _0.57 T _0.43 (molecular weight 1,890, viscosity 137 mPa·s)
(D-4) Epoxy group-containing organohydrogenpolysiloxane having a structural unit ratio of M _0.04 D ^H _0.58 D _0.19 D ¹ _0.19 (molecular weight 7,550, viscosity 350 mPa·s)
(D-5) Organopolysiloxane having a structural unit ratio of T ⁴ _0.52 T _0.48 (molecular weight 2,900, viscosity 261 mPa·s)

(E) Component:
The reaction product of hexachloroplatinic acid and 1,3-divinyltetramethyldisiloxane was added to a linear dimethylpolysiloxane represented by M ^Vi ₂ D ₄₀ so that the platinum content was 0.004% by mass. Platinum catalyst prepared by dilution with siloxane (viscosity 60 mPa·s).

(F) Component (F-1) Hydrolyzable organosilane compound represented by the following formula (21)

(F-2) Hydrolyzable organosilane compound represented by the following formula (22)

(F-3) Hydrolyzable organosilane compound represented by the following formula (23)

(G) component: fumed silica (manufactured by Tokuyama Corporation, Rheolosil DM30, BET surface area 300 m ² /g)
(H) reaction inhibitor: 1-ethynylcyclohexanol

The silicone compositions for die bonding obtained in Examples 1 to 9 and Comparative Examples 1 to 5 were subjected to the following evaluations, and the results are shown in Table 2.
[hardness]
The above composition was poured into a mold so as to have a thickness of 2 mm and cured under the conditions of 150° C. for 2 hours. The Type D hardness of the cured product was measured according to JIS K 6253-3:2012.

[Die shear strength]
Using a die bonder (manufactured by ASM, AD-830), the above composition is quantitatively transferred by stamping to the silver-plated electrode part of the SMD5730 package (manufactured by I-CHIUN PRECISION INDUSTRY CO., resin part: polyphthalamide). bottom. Further, an optical semiconductor device (EV-B35A, 35 mil, manufactured by SemiLEDs) was mounted thereon. The prepared package was heated in an oven at 150° C. for a certain period of time (2 hours, 4 hours) to cure the composition, and then the die shear strength was measured using a bond tester (Dage, Series 4000).

As shown in Table 2, all of Examples 1 to 9 are excellent in hardness and die shear strength even under short-time curing conditions (150° C.×2 hours).

On the other hand, in Comparative Examples 1 and 3, which do not contain the component (D) of the present invention, the die shear strength is insufficient because they do not contain an epoxy group, and the content of the component (F) is small. In Comparative Example 4, which has a small content of , similarly, the die shear strength under short-time curing conditions (150° C.×2 hours) was insufficient. In addition, in Comparative Example 5 in which the content of component (B) was excessive, the viscosity of the composition was significantly increased, making it difficult to handle as a die bonding material.

As described above, the silicone composition for die bonding of the present invention provides a silicone cured product excellent in hardness and die shear strength even under short curing conditions (150° C.×2 hours), and can be It is particularly useful as a die bond material used for bonding. In particular, due to this feature, in the wire bonding process performed after the die bonding process, problems such as chip peeling and failure to bond are less likely to occur. Reliability is improved, and productivity of the device is also improved. Therefore, the die-bonding silicone composition of the present invention and its cured product are highly useful in the technical field of optical semiconductor devices.

In addition, this invention is not limited to the said embodiment. The above-described embodiment is an example, and any device having substantially the same configuration as the technical idea described in the claims of the present invention and exhibiting the same effect is the present invention. included in the technical scope of

Claims (6)

(A) an organopolysiloxane containing two or more alkenyl groups in one molecule and having a viscosity of 100 mPa·s or less at 25°C;
(B) a three-dimensional network organopolysiloxane represented by the following average compositional formula (1), which is waxy or solid at 23° C.: 60 to 95 parts by mass per 100 parts by mass of components (A) and (B); part,
(C) Organohydrogenpolysiloxane represented by the following average compositional formula (2) and having at least two silicon-bonded hydrogen atoms per molecule: all silicon atoms in components (A) and (B) The amount that the number of hydrogen atoms bonded to silicon atoms in component (C) is 0.5 to 5.0 times the total number of alkenyl groups bonded to
(D) an organopolysiloxane containing one or more epoxy groups per molecule: 1 to 25 parts by mass per 100 parts by mass of components (A), (B), and (C);
(E) platinum group metal-based catalyst: 1 to 500 ppm in terms of mass of platinum group metal element with respect to the total mass of components (A), (B) and (C);
(F) Hydrolyzable organosilane compound represented by the following general formula (3): 10 to 10,000 ppm based on the total mass of components (A), (B) and (C)
A silicone composition for die bonding, comprising:

(In the formula, each R ¹ is a substituted or unsubstituted monovalent hydrocarbon group which may be the same or different and does not contain an alkenyl group, and each R ² is an alkenyl group which may be the same or different. a, b, c, d, e, f, g and h are respectively a≧0, b≧0, c≧0, d≧0, e≧0, f≧0, g≧0 and h ≧0, provided that b+c>0, f+g+h>0, and a+b+c+d+e+f+g+h=1.)

(Wherein, R ¹ is the same as above, i and j satisfy 0.7 ≤ i ≤ 2.1, 0.001 ≤ j ≤ 1.0, and 0.8 ≤ i + j ≤ 3.0 number.)

(In the formula, each R ³ is the same or different and represents an optionally substituted monovalent hydrocarbon group having 1 to 10 carbon atoms or a hydrogen atom, and each R ⁴ is the same or optionally different, unsubstituted or substituted alkyl group having 1 to 20 carbon atoms, unsubstituted or substituted aryl group having 6 to 10 carbon atoms, aralkyl group having 7 to 10 carbon atoms, unsubstituted or substituted carbon 2 to 10 alkenyl groups or unsubstituted or substituted alkoxy groups having 1 to 20 carbon atoms, and R ⁵ may be the same or different, unsubstituted or substituted alkyl having 1 to 10 carbon atoms or an unsubstituted or substituted aryl group having 6 to 10 carbon atoms, n is an integer of 1 to 3, and m is an integer of 1 to 12.) 2. The silicone composition for die bonding according to claim ¹ , wherein 80 mol % or more of all R1 contained in the silicone composition are methyl groups. 3. The silicone composition for die bonding according to claim 1, further comprising (G) fumed silica having a BET specific surface area of 100 to 400 m ² /g. 4. The silicone composition for die bonding according to any one of claims 1 to 3, wherein the component (D) contains the epoxy group as a group represented by the following general formula (9). .

(Wherein, s is an integer of 1 to 6, and the dashed line represents a bond.) A cured silicone product, which is a cured product of the silicone composition for die bonding according to any one of claims 1 to 4. An optical semiconductor device comprising an optical semiconductor element die-bonded to the silicone cured product according to claim 5 .