JP7281622B2 - SUBSTRATE HOLDING DEVICE AND SUBSTRATE HOLDING METHOD - Google Patents

Description

The present invention relates to a substrate holding device and a substrate holding method for clamping and holding a substrate conveyed by a conveyor.

Mounting equipment installed in a component mounting line that manufactures mounting boards by mounting electronic components on boards has a board holding device that clamps and holds the board carried into each facility while a predetermined operation is being performed. is provided. In this type of substrate holding apparatus, a lifting member lifts a substrate carried in by a conveyor, clamps it between a receiving member positioned above, and clamps the substrate after the work is performed together with the lifting member. The unclamping operation of lowering and returning to the conveyor is repeatedly performed. In order to improve the productivity of a component mounting facility equipped with such a substrate holding device, it is necessary to shorten the time required for the clamping operation and the clamp releasing operation to improve the operating efficiency of the substrate holding device. For this reason, conventionally, various technologies have been incorporated into component mounting equipment such as surface mounters for the purpose of improving the efficiency of clamping the substrate (see Patent Documents 1 and 2, for example).

In the prior art disclosed in Patent Document 1, in a structure in which a clamp plate that pushes up a substrate is pushed up by a cylinder that is driving means, the lifting speed is switched during the rising process of the clamp plate. As a result, the rising speed when the clamp plate comes into contact with the substrate can be reduced to mitigate the impact on the substrate, and otherwise the speed can be increased to shorten the cycle time. Further, in the prior art disclosed in Patent Document 2, at the timing when it is detected that the lift plate reaches a predetermined height position in the upward process, the camera starts repeatedly recognizing the reference mark formed on the substrate. , based on this recognition result, it is determined whether or not the substrate has been lifted. As a result, the clamping completion time can be detected with high accuracy, and the next work operation can be quickly performed.

JP-A-2003-8290 JP-A-2006-4973

However, the conventional techniques, including the examples of the above-mentioned patent documents, have the following problems in pursuit of further improvement in the efficiency of work operations including clamping of substrates. That is, in the clamping and unclamping operations of the substrate, in order to reduce the impact load when the substrate is lowered and placed on the belt of the conveyor, and to perform the clamping and unclamping operations as efficiently as possible, a lift is used to push up the substrate. The lifting speed of the member is switched between high speed and low speed. Conventionally, this switching of the lifting speed is performed by setting a timer incorporated in a control device, and after assuming a substrate to be used as a reference in advance, a timer value considered appropriate for this substrate is set.

By the way, there are many substrates to be worked on by the same apparatus, which have different factors such as weight and tolerance to impact load. For this reason, it is desirable that the appropriateness of the timer setting in the substrate clamping operation and the clamp releasing operation is determined after considering these factors. However, the timer value used for switching the lifting speed in the conventional technology is a fixed value that is uniquely determined corresponding to a predetermined substrate. A situation occurred in which the clamp releasing operation was not realized.

For example, when a substrate that is lighter than a substrate used as a reference is targeted, the lifting speed of the lift member in the clamping operation is faster than the assumed speed for the substrate as the reference because the weight of the substrate, which is the lifting load, is small. Velocity patterns are possible. However, if a timer for switching the elevation speed is set for the substrate used as a reference, an inefficient speed pattern with a longer slow rise time than the originally possible speed pattern is obtained. Such absurdity also occurs when a substrate heavier than the substrate used as a reference is used when the lift member is lowered in the clamp release operation. As described above, in the prior art, there is a problem that the improvement of the operation efficiency of the substrate clamping operation and the clamp releasing operation is restricted due to the setting of the timer value for switching the lifting speed of the lift member between high speed and low speed. there were.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a substrate holding device and a substrate holding method capable of improving the operating efficiency of the substrate clamping operation and the clamp releasing operation while alleviating the impact on the substrate.

In the substrate holding device of the present invention, a substrate conveyed by a conveyor is lifted by a lift member driven up and down by a cylinder, and clamped by being sandwiched between the lift member and a clamp receiving member positioned above the substrate. In a substrate holding device in which a predetermined operation is performed on the substrate in a clamped state, and the lift member is lowered by the cylinder after the operation to release the clamp, the lift member is driven up and down by the cylinder. A direction switching unit that switches the driving direction between ascending and descending, and a flow rate of the fluid supplied to the cylinder, thereby setting the ascending/descending speed of the lift member to a first speed and lower than the first speed. a speed setting unit for setting any one of the second speeds; and a control unit for controlling the direction switching unit and the speed setting unit, wherein the control unit switches the direction while the substrate is clamped. The speed setting unit sets the ascending/descending speed to the second speed until a preset variable low-speed movement time elapses after the driving direction is switched to descending by the unit and a descending signal is output. The speed setting unit sets the lifting speed to the first speed after the low speed movement time has elapsed , and the control unit causes the direction switching unit to shift the driving direction downward during the low speed movement time. The low-speed movement time is set based on the time required for the substrate to reach the upper surface of the conveyor and for the lift member to reach a lowered position spaced apart from the substrate after switching and a lowering signal is issued. It is set based on the weight of the substrate .
Further, in the substrate holding device of the present invention, a substrate transported by a conveyor is lifted by a lift member that is vertically driven by a cylinder, and clamped by being sandwiched between the lift member and a clamp receiving member positioned above the substrate. A substrate holding device in which a predetermined operation is performed on the substrate while the substrate is clamped, and after the operation, the lift member is lowered by the cylinder to release the clamp, wherein the lift member is raised and lowered by the cylinder. A direction switching unit that switches the driving direction of the drive between ascending and descending, and a flow rate of the fluid supplied to the cylinder, thereby setting the ascending/descending speed of the lift member to a first speed and lower than the first speed. and a control unit for controlling the direction switching unit and the speed setting unit, wherein the control unit controls the speed while the substrate is clamped. After the direction switching unit switches the driving direction to the downward direction and a descending signal is issued, the speed setting unit sets the ascending/descending speed to the second speed until a preset variable low-speed movement time elapses. and the speed setting unit sets the lifting speed to the first speed after the low-speed movement time has elapsed, and the control unit sets the driving direction to the first speed by the direction switching unit during the low-speed movement time. It is set based on the time required for the substrate to reach the upper surface of the conveyor and the lift member to reach the lowered position spaced apart from the substrate after switching to descending and a descending signal is issued, and the cylinder moves downward. A support block supports the lift member, and the slow movement time is set based on the weight of the lower support block.
Further, in the substrate holding device of the present invention, a substrate transported by a conveyor is lifted by a lift member that is vertically driven by a cylinder, and clamped by being sandwiched between the lift member and a clamp receiving member positioned above the substrate. A substrate holding device in which a predetermined operation is performed on the substrate while the substrate is clamped, and after the operation, the lift member is lowered by the cylinder to release the clamp, wherein the lift member is raised and lowered by the cylinder. A direction switching unit that switches the driving direction of the drive between ascending and descending, and a flow rate of the fluid supplied to the cylinder, thereby setting the ascending/descending speed of the lift member to a first speed and lower than the first speed. and a control unit for controlling the direction switching unit and the speed setting unit, wherein the control unit controls the speed while the substrate is clamped. After the direction switching unit switches the driving direction to the downward direction and a descending signal is issued, the speed setting unit sets the ascending/descending speed to the second speed until a preset variable low-speed movement time elapses. , and the speed setting unit sets the lifting speed to the first speed after the low-speed movement time elapses, and the low-speed movement time is set by the component mounting apparatus equipped with the substrate holding device. is set based on the type of the component mounted on the substrate or the type of the component mounted on the board by the component mounting device in the previous process of the component mounting device.

A substrate holding apparatus according to the present invention is a substrate holding apparatus in which a substrate transported by a conveyor is lifted by a lift member that is vertically driven by a cylinder, and clamped by being sandwiched between the lift member and a clamp receiving member positioned above the substrate. a direction switching unit for switching a driving direction of the lifting member by the cylinder between ascending and descending; and a second speed that is lower than the first speed; and a control unit that controls the direction switching unit and the speed setting unit. After the direction switching unit switches the driving direction to upward in a state in which the lift member is separated from the substrate, and an upward signal is output, until a preset variable high-speed movement time elapses, the speed is increased. The setting unit sets the ascending/descending speed to the first speed, and when the high-speed movement time elapses, the speed setting unit sets the ascending/descending speed to the second speed , and the high-speed movement time is is set based on the required time from when the control unit switches the driving direction to the upward direction by the direction switching unit and an upward signal is issued until the substrate reaches the upward position where the substrate is in contact with the lift member; The fast moving time is set based on the weight of the substrate.
Further, in the substrate holding device of the present invention, a substrate conveyed by a conveyor is lifted by a lift member that is vertically driven by a cylinder, and the substrate is clamped by being sandwiched between the lift member and a clamp receiving member positioned above the substrate. In the device, a direction switching unit for switching a driving direction of the lifting member by the cylinder between upward and downward directions and a flow rate of the fluid supplied to the cylinder are switched to set the lifting speed of the lift member to a first speed. and a second speed that is lower than the first speed; and a control unit that controls the direction switching unit and the speed setting unit, wherein the control unit is a period from when the direction switching unit switches the driving direction to upward in a state in which the lift member is separated from the substrate and an upward signal is issued until a preset variable high-speed movement time elapses, The speed setting unit sets the lifting speed to the first speed, and when the high-speed movement time elapses, the speed setting unit sets the lifting speed to the second speed, and the high-speed movement time is set based on the required time from when the control unit switches the driving direction to the upward direction by the direction switching unit and an upward signal is issued until the substrate reaches the upward position where the substrate abuts against the lift member. and the cylinder supports the lift member via a lower receiving block, and the high speed movement time is set based on the weight of the lower supporting block.
Further, in the substrate holding device of the present invention, a substrate conveyed by a conveyor is lifted by a lift member that is vertically driven by a cylinder, and the substrate is clamped by being sandwiched between the lift member and a clamp receiving member positioned above the substrate. In the device, a direction switching unit for switching a driving direction of the lifting member by the cylinder between upward and downward directions and a flow rate of the fluid supplied to the cylinder are switched to set the lifting speed of the lift member to a first speed. and a second speed that is lower than the first speed; and a control unit that controls the direction switching unit and the speed setting unit, wherein the control unit is a period from when the direction switching unit switches the driving direction to upward in a state in which the lift member is separated from the substrate and an upward signal is issued until a preset variable high-speed movement time elapses, The speed setting unit sets the lifting speed to the first speed, and when the high-speed movement time elapses, the speed setting unit sets the lifting speed to the second speed, and the high-speed movement time is set based on the type of component mounted on the board by a component mounting apparatus in the previous process of the component mounting apparatus equipped with the board holding apparatus.

In the substrate holding method of the present invention, a substrate transported by a conveyor is lifted by a lift member driven up and down by a cylinder, clamped by being sandwiched between the lift member and a clamp receiving member positioned above the substrate, and the substrate is clamped. A substrate holding method in which a predetermined operation is performed on the substrate in a clamped state, and after the operation, the lift member is lowered by the cylinder to release the clamp, wherein the lift member is driven up and down by the cylinder. A direction switching step for switching the driving direction between ascending and descending; a speed setting step of setting one of the second speeds, wherein the direction switching step is executed with the substrate clamped to switch the driving direction to downward and a downward signal is output; The speed setting step is executed to set the ascending/descending speed to the second speed until a preset variable low-speed movement time elapses, and the speed setting is performed after the low-speed movement time elapses. performing a step to set the ascending/descending speed to the first speed, and the low speed moving time is the time when the substrate reaches the upper surface of the conveyor after the driving direction is switched to descending and a descending signal is issued; The time required for the lift member to reach a lowered position separated from the substrate is set, and the slow movement time is set based on the weight of the substrate.

A substrate holding method according to the present invention is a substrate holding method in which a substrate conveyed by a conveyor is lifted by a lift member that is vertically driven by a cylinder, and clamped by being sandwiched between the lift member and a clamp receiving member positioned above the substrate. a direction switching step of switching a driving direction of the lifting member by the cylinder between upward and downward; and a second speed lower than the first speed, wherein the direction switching step is performed while the lift member is separated from the substrate to perform the driving. The speed setting step is executed to set the ascending/descending speed to the first speed during a period from when the direction is switched to ascending and an ascending signal is output until a preset variable high-speed movement time elapses. the speed setting step is executed to set the ascending/descending speed to the second speed after the high-speed moving time has passed; After being lifted, the time required for the substrate to reach the raised position where it abuts against the lift member is set, and the high-speed movement time is set based on the weight of the substrate.

According to the present invention, it is possible to improve the operation efficiency of the substrate clamping operation and the clamp releasing operation while mitigating the impact on the substrate.

1 is a plan view showing the configuration of a component mounting apparatus incorporating a substrate holding device according to an embodiment of the present invention; FIG. 1 is an explanatory diagram of the configuration of a substrate holding device according to an embodiment of the present invention; FIG. 1 is an explanatory diagram of a pneumatic circuit of a substrate holding device according to an embodiment of the present invention; FIG. 1 is a block diagram showing the configuration of a control system of a component mounting apparatus incorporating a substrate holding apparatus according to an embodiment of the present invention; FIG. FIG. 4 is an explanatory diagram of a timing chart of substrate clamping operation by the substrate holding device according to one embodiment of the present invention; FIG. 4 is an explanatory diagram of a timing chart of substrate clamp releasing operation by the substrate holding device according to the embodiment of the present invention;

Embodiments of the present invention will now be described with reference to the drawings. First, with reference to FIGS. 1 and 2, the overall configuration of a component mounting apparatus 1 incorporating a substrate holding apparatus according to the present embodiment will be described. The component mounting apparatus 1 has a function of holding a component by a suction nozzle attached to a mounting head and mounting the component on a substrate.

In FIG. 1, a substrate transfer mechanism 2 is arranged in the X direction (substrate transfer direction) at the central portion of the base 1a. The substrate transport mechanism 2 has a function of transporting the substrate 3 carried in from the upstream side and positioning it at a mounting work position by the component mounting mechanism described below. have. A substrate holding mechanism 2c is provided in the central portion of the substrate transfer mechanism 2 for receiving and holding the substrate 3 that has been carried in. As shown in FIG.

The substrate holding mechanism 2c performs a substrate holding operation described below. That is, in this substrate holding operation, the substrate 3 transported by the transport conveyor 2a is lifted by the lift member 2e which is vertically driven by the cylinder 20 (see FIGS. 2 and 3), and the lift member 2e and the substrate 3 are positioned above the lift member 2e. The board 3 is sandwiched and clamped with the clamp receiving member 2b, and in the state where the board 3 is clamped, the component mounting work, which is a predetermined work, is performed on the board 3. After the component mounting work, the lift member 2e is lowered by the cylinder 20. to release the clamp.

On both sides of the substrate transfer mechanism 2, component supply units 4 for supplying components to be mounted are arranged. A plurality of tape feeders 5 are arranged in parallel in the component supply section 4 . The tape feeder 5 has a function of pitch-feeding the components held on the carrier tape to a pickup position by the component mounting mechanism described below. A Y-axis moving table 6 is provided on one end of the upper surface of the base 1a in the X direction. Two X-axis moving tables 7 are coupled to the Y-axis moving table 6 so as to be slidable in the Y direction. Mounting heads 8 are mounted on the X-axis moving table 7 so as to be slidable in the X direction.

The mounting head 8 is a multiple head consisting of a plurality of unit holding heads 9, and a part to be mounted is vacuum-sucked from the tape feeder 5 by means of a suction nozzle (not shown) attached to the unit holding head 9 for sucking the part. Hold. By driving the Y-axis moving table 6 and the X-axis moving table 7 , the mounting head 8 moves between the component supply unit 4 and the substrate 3 positioned by the substrate transport mechanism 2 . Thereby, the mounting head 8 mounts the held component on the board 3 . The mounting head 8 and the head moving mechanism for moving the mounting head 8 constitute a component mounting mechanism 13 (see FIG. 4) that picks up a component from the component supply section 4 and mounts it on the board 3 .

A substrate recognition camera 10 that moves integrally with the mounting head 8 is mounted on the lower surface of the X-axis moving table 7 . By driving the head moving mechanism to move the board recognition camera 10 above the board 3 held by the board transfer mechanism 2 , the board recognition camera 10 picks up an image of the recognition mark formed on the board 3 . A component recognition camera 11 and a nozzle storage unit 12 are arranged on the movement path of the mounting head 8 between the component supply unit 4 and the board transfer mechanism 2 . The component recognition camera 11 picks up an image of the component held by the mounting head 8 by performing a scanning operation in which the mounting head 8 picks up the component from the component supply unit 4 and passes over the component recognition camera 11 in a predetermined direction. .

A plurality of suction nozzles to be attached to the unit holding head 9 are stored and held in the nozzle storage section 12 in correspondence with the types of parts. When the mounting head 8 accesses the nozzle storage section 12 and performs a nozzle replacement operation, the suction nozzle mounted on the unit holding head 9 can be replaced according to the purpose and target component type.

The configuration and function of the substrate transfer mechanism 2 will be described with reference to FIG. As shown in FIG. 2, the substrate transport mechanism 2 is composed of two transport conveyors 2a arranged in parallel. Inside the transport conveyor 2a, a conveyor mechanism 2d having a transport belt for transporting the substrate 3 is provided along the transport direction. The substrate 3 is conveyed in the substrate conveying direction by driving the conveyor mechanism 2d with both side ends of the substrate 3 in contact with the conveyor belt of the conveyor mechanism 2d.

A substrate holding mechanism 2c is provided in the central portion of the substrate transport mechanism 2 so as to correspond to the working position of the component mounting mechanism. The substrate holding mechanism 2c has a configuration in which a horizontal plate-shaped lower receiving plate 21 is moved up and down (arrow a) by a cylinder 20. As shown in FIG. On the upper surface of the lower receiving plate 21, two lift members 2e are provided at positions corresponding to the side ends of the substrate 3, and a plurality of lower receiving pins 22 are provided at positions for supporting the substrate 3 from the lower surface side. .

As shown in FIG. 2B, by driving the cylinder 20 to raise the lower receiving plate 21 (arrow b), the substrate 3 is supported by the plurality of lower receiving pins 22 and the substrate 3 is supported. Both side ends are pressed and clamped against the lower surface of the clamp receiving member 2b by the lift member 2e. The component mounting operation by the component mounting mechanism is performed while the substrate 3 is clamped in this manner. After the component mounting work, the lift member 2e and the lower receiving pins 22 are lowered together with the lower receiving plate 21 by the cylinder 20 to release the clamping of the substrate 3 and the lower receiving.

Here, with reference to FIG. 3, the operation of the cylinder 20 in the substrate holding mechanism 2c, and the air pressure control equipment and air pressure circuit system used to drive the cylinder 20 with air will be described. By driving the cylinder 20 as described above, the lift member 2e is moved up and down via the lower receiving plate 21 to change the relative position of the substrate 3 in the substrate holding mechanism 2c and the lift member 2e and conveyor mechanism 2d. It is possible. The cylinder 20 is provided with a clamp upper limit sensor SS1, a clamp lower limit sensor SS2, and a substrate transfer sensor SS3 for detecting the protruding/retracting state of the rod.

In the clamped state in which the rod of the cylinder 20 protrudes to the upper limit position and the substrate 3 is pressed against the clamp receiving member 2b, the clamp upper limit sensor SS1 emits a detection signal, and the rod is retracted to the lower limit position and the clamp lower limit sensor SS2 detects it. emit a signal. In the process of lowering the substrate 3 from the clamped state (arrow c), the substrate transfer sensor SS3 detects the timing at which the side edge of the substrate 3 transfers to the conveyor belt of the conveyor mechanism 2d as shown in FIG. That is, the height position detected by the substrate transfer sensor SS3 corresponds to the lowered position where the substrate 3 descends to reach the upper surface of the conveyor belt of the conveyor mechanism 2d and the lift member 2e is separated from the substrate 3.

A pneumatic control device and a pneumatic circuit will be described. Air circuits 29a and 29b are connected to the descending port 20a and the ascending port 20b provided in the cylinder 20, respectively. The air circuits 29a and 29b are connected to a cylinder driving pneumatic circuit supplied from the air supply source 23 via a cylinder up/down valve SV1 and a speed switching valve SV2.

The functions of the cylinder vertical motion valve SV1 and the speed switching valve SV2 will be described. The cylinder vertical movement valve SV1 is a 5-port, 3-position (closed center) double solenoid type valve having two solenoids, a lowering solenoid SL1A and an ascending solenoid SL1B. Here, the descending solenoid SL1A is a solenoid for supplying air to the descending port 20a, and the ascending solenoid SL1B is a solenoid for supplying air to the ascending port 20b. The speed switching valve SV2 is a 3-port, 2-position single solenoid valve provided with a solenoid SL2. The A port of the speed switching valve SV2 is connected to the lowering port 20a of the cylinder 20 via the air circuit 29a.

An air supply pipe 24 leading to an air supply source 23 is connected to the P port at the center position of the cylinder up/down valve SV1, and a muffler 25 is connected to the EA port and the EB port. One B port of the A port and B port of the cylinder vertical movement valve SV1 is connected to the rising port 20b of the cylinder 20 via the air circuit 29b.

An air circuit 28 is connected to the A port of the cylinder up/down valve SV1. Here, the air circuit 28 is branched into a first circuit 28a and a second circuit 28b, and one of the second circuits 28b is configured by combining a plurality of check valves and a variable throttle, and the throttle value can be adjusted. A diaphragm adjustment unit 27 is interposed. The first circuit 28a is connected to the P port of the speed switching valve SV2, and the second circuit 28b is connected to the R port of the speed switching valve SV2.

In this combination of the cylinder vertical movement valve SV1 and the speed switching valve SV2, by switching the cylinder vertical movement valve SV1, the air supplied from the air supply source 23 is switched to either the lowering port 20a or the rising port 20b of the cylinder 20. , the driving direction of the cylinder 20 can be switched between ascending and descending.

That is, by energizing either the descending solenoid SL1A or the ascending solenoid SL1B to switch the cylinder vertical movement valve SV1 from the neutral position shown in FIG. It is possible to switch the driving direction. Therefore, the cylinder vertical motion valve SV1 functions as a direction switching portion 32a (see FIG. 4) that switches the driving direction of the vertical movement of the lift member 2e by the cylinder 20 between upward and downward.

Further, by switching the speed switching valve SV2, the air circuit 29a can be selectively connected to the first circuit 28a or the second circuit 28b in which the throttle adjusting section 27 is interposed. When the second circuit 28b is connected to the air circuit 29a, the circuit configuration is such that the throttle adjusting section 27 is interposed in the air supply circuit from the cylinder up/down valve SV1 to the cylinder 20 via the speed switching valve SV2.

That is, in the lowering operation in which air is supplied to the lowering port 20a through the air circuit 29a to drive the cylinder 20, the above-described air supply circuit is throttled by the throttle adjuster 27. As shown in FIG. By narrowing the air supply circuit in this manner, the flow rate of air, which is the fluid supplied to the cylinder 20, is restricted, and the descending speed of the cylinder 20, in other words, the descending speed of the lift member 2e is reduced.

In the ascending operation in which air is supplied to the ascending port 20b through the air circuit 29b to drive the cylinder 20, the return circuit returning from the descending port 20a to the cylinder vertical movement valve SV1 via the speed switching valve SV2 is controlled by the throttle adjustment unit 27. It becomes a narrowed form. By throttling the return circuit in this way, the flow rate of the air, which is the fluid supplied to the cylinder 20, is restricted in the same manner as in the downward movement, and the upward movement speed of the cylinder 20, in other words, the upward speed of the lift member 2e is reduced. descend.

As described above, in the substrate holding mechanism 2c according to the present embodiment, the lowering speed when the cylinder 20 is lowered without interposing the throttle adjusting portion 27 in the air supply circuit is the first lowering speed ( 1st speed), and the descent speed in the case where the cylinder 20 is moved downward by interposing the throttle adjustment portion 27 in the air supply circuit is the second descent speed (second descent speed) which is lower than the first descent speed speed). The rising speed when the cylinder 20 is caused to move up without interposing the throttle adjusting unit 27 in the return circuit is the first rising speed (first speed), and the throttle adjusting unit 27 is installed in the return circuit. The ascending speed when the cylinder 20 is interposed to perform the ascending operation is the second ascending speed (second speed) lower than the first ascending speed.

In the above configuration, the cylinder up/down valve SV1 switches the flow rate of air, which is the fluid supplied to the cylinder 20, to set the lifting/lowering speed of the lift member 2e between the first speed and a lower speed than the first speed. It functions as a speed setting unit 32b (see FIG. 4) that sets any of the second speeds.

It is desirable to set the first speed as high as possible within a range in which stable operation is possible, in order to improve the work operation efficiency of the substrate holding mechanism 2c as much as possible. On the other hand, the second speed is intended to maintain the lifting/lowering speed of the substrate 3 in the substrate holding operation by the substrate holding mechanism 2c at a safe speed at which the impact on the substrate 3 can be mitigated. is appropriately set based on the empirical value in

Next, with reference to FIG. 4, the configuration of the control system of the component mounting apparatus 1 in which the board holding device according to the present embodiment is incorporated will be described. 4, the component mounting apparatus 1 includes a control section 30, a storage section 33, a mechanism driving section 37, and an image recognition section . Based on various data stored in the storage unit 33, the control unit 30 controls each unit described below to cause the component mounting apparatus 1 to perform component mounting operations and various work processes.

The control unit 30 has a mounting processing unit 31 and a substrate holding processing unit 32 as internal processing functions. Based on the mounting data 34 stored in the storage unit 33, the mounting processing unit 31 controls the mechanism driving unit 37 to drive the component mounting mechanism 13 and the substrate transport mechanism 2, thereby picking up the components from the component supply unit 4. A component mounting operation for mounting on the board 3 is performed.

Further, the substrate holding processing section 32 includes a direction switching section 32a and a speed setting section 32b. The direction switching unit 32a and the speed setting unit 32b are functions realized by the cylinder vertical movement valve SV1 and the speed switching valve SV2 shown in FIG. That is, the direction switching portion 32a switches the driving direction of the lifting member 2e driven by the cylinder 20 between ascending and descending. In addition, the speed setting unit 32b switches the flow rate of the air, which is the fluid supplied to the cylinder 20, to set the lifting/lowering speed of the lift member 2e between a first speed and a second speed lower than the first speed. Set to either.

The above-described substrate holding operation is performed by the substrate holding processing section 32 controlling the mechanism driving section 37 to drive the substrate holding mechanism 2c. Therefore, the control section 30 that controls the substrate holding mechanism 2c and the substrate holding processing section 32 constitutes a substrate holding device that executes this substrate holding operation. Although this embodiment shows an example in which such a board holding device is incorporated in the component mounting apparatus 1, the present invention is not limited to this example. That is, the present invention can be applied to any configuration in which a substrate conveyed by a conveyor is lifted and held by clamping.

In controlling the mechanism drive unit 37 by the substrate holding processing unit 32, the speed parameter 35 and the high/low speed switching timer value 36 stored in the storage unit 33 are referred to. The speed parameter 35 is a parameter that defines the lifting speed of the lift member 2e in the substrate holding mechanism 2c. Here, two high and low first ascending speeds 35a and second ascending speeds 35b, which respectively define the ascending speed in the ascending operation for lifting and clamping the substrate 3, and the lowering speed in the descending operation for lowering the substrate 3 and releasing the clamp. There are two first descent speeds 35c and second descent speeds 35d defined respectively high and low.

A high/low speed switching timer value 36 is a timer value that defines the timing for switching between these two speeds. Here, the high/low speed switching timer value 36 includes a rising switching timer value T1 and a falling switching timer value T2. The rising time switching timer value T1 defines the switching timing of the rising speed in the rising operation of lifting and clamping the substrate 3, that is, the timing of switching from the high first rising speed 35a to the low second rising speed 35b (Fig. 5). The lowering switching timer value T2 determines the switching timing of the lowering speed in the lowering operation for lowering the substrate 3 to release the clamp, that is, the timing for switching from the low first lowering speed 35c to the high second lowering speed 35d. (Refer to timer value T2 for switching during descent shown in FIG. 6).

In the substrate holding operation executed by the substrate holding processing unit 32 of the control unit 30 controlling the direction switching unit 32a and the speed setting unit 32b, the speed parameter 35 and the high/low speed switching timer value 36 are referred to. That is, in the clamping operation of lifting and clamping the substrate 3, the control unit 30 switches the driving direction to upward by the direction switching unit 32a in a state in which the lift member 2e is separated from the substrate 3, and the upward signal is output. The speed setting unit 32b sets the ascending/descending speed to a high first ascending speed 35a (first speed) until the rising switching timer value T1 (see FIG. 5), which is the variable high-speed movement time, elapses. do. Then, after the rising switching timer value T1 has elapsed, the speed setting unit 32b sets the lifting speed to a low second rising speed 35b (second speed).

In the substrate clamping operation in which the substrate 3 is lowered and the clamp is released, the driving direction is switched to the downward direction by the direction switching unit 32a while the substrate 3 is clamped, and the descending signal is output. The speed setting unit 32b sets the ascending/descending speed to a low second descending speed 35d (second speed) until the descent time switching timer value T2 (see FIG. 6), which is the low-speed movement time, elapses. After the timer value T2 for switching during descent has elapsed, the speed setting unit 32b sets the lifting speed to a high first descent speed 35c (first speed).

Detection outputs from the clamp upper limit sensor SS1, the clamp lower limit sensor SS2, and the substrate transfer sensor SS3 are taken into the control unit 30 and used for sequence control in the substrate holding operation by the substrate holding processing unit 32. In addition, a timer value to be described below is used. It is used for timer value setting processing by the setting unit 39 . The image recognition unit 38 performs recognition processing on the results of imaging by the board recognition camera 10 and the component recognition camera 11 . As a result, the board 3 positioned by the board transfer mechanism 2 and the positions of the mounting points on the board 3 are recognized, and the components held by the unit holding head 9 are identified and their positions are recognized. When the components are mounted on the substrate 3 by the component mounting mechanism 13, the component mounting position is corrected by reflecting the results of these recognition processes.

Next, the process of setting the above switching timer value T1 for rising and the switching timer value T2 for falling will be described. The setting of these timer values is executed by the arithmetic processing function of the timer value setting section 39 provided in the control section 30 . The timer value can be set by various methods, for example, the following method. First, one method is to actually perform the clamping operation and the clamp releasing operation on the substrate 3 to be produced, determine the time required for the substrate 3 to move up and down in these operations, and set a timer based on the required time. It's a way to set the value.

That is, for the rising switching timer value T1, which is the high-speed movement time in the clamping operation, after the control unit 30 switches the driving direction to the rising direction by the direction switching unit 32a and the rising signal is output, the substrate 3 hits the lift member 2e. It is set based on the required time to reach the raised position (see substrate contact height Hb* of the lift member shown in FIG. 5). As for the timer value T2 for descent, which is the low-speed movement time in the clamp release operation, after the control unit 30 switches the driving direction to the descent by the direction switching unit 32a and the descent signal is output, the substrate 3 is moved to the conveyer mechanism 2d. It is set based on the time required for the lift member 2e to reach the upper surface and reach the lowered position separated from the substrate 3 (see substrate transfer height Hb shown in FIG. 6).

Specifically, the actual board 3 is lifted and lowered at a low speed, and the time required for the test lift is obtained from the detection results of the clamp upper limit sensor SS1, clamp lower limit sensor SS2, and board transfer sensor SS3. Then, the drive load for raising and lowering the substrate 3 is estimated from the obtained required time, and the optimum high/low speed switching timer value 36 for the drive load is set. At this time, since the cylinder 20 supports the lift member 2e via ancillary motion parts such as the lower receiving plate 21, the driving load when the substrate 3 is moved up and down includes the weight of the lower receiving plate 21. is used.

That is, the rising switching timer value T1, which is the high-speed movement time, and the descent switching timer value T2, which is the low-speed movement time, are set based on the weight of the substrate 3 and the weight of the lower support plate 21 . The process of performing test lifting and setting the timer value may be executed in advance when production data for the board type is created, or may be executed each time automatic operation is started in actual production.

Instead of obtaining the timer value based on the test lifting and lowering of the actual substrate 3 as described above, the tolerance to the impact of the substrate 3 to be produced is ranked in advance, and the substrate is measured based on this ranking. The timing of switching between high and low speeds in the clamping operation and substrate crank releasing operation may be defined. That is, in the case where the substrate 3 is of a rank that does not cause problems such as misalignment of parts even if a certain amount of impact is applied, the high speed movement time is set as long as possible and the low speed movement time is set as long as possible. It is set short so as to improve the operating efficiency of the substrate holding operation.

In this case, since the target of the substrate clamping operation is the substrate 3 newly carried into the substrate holding mechanism 2c, the rank of the above substrate 3 is the pre-process of the component mounting apparatus 1 equipped with the substrate holding mechanism 2c. is defined by the type of component mounted on the board 3 by the component mounting apparatus. That is, the high-speed movement time in the board clamping operation is set based on the type of component mounted on the board 3 by the component mounting apparatus in the preceding process of the component mounting apparatus 1 equipped with the board holding mechanism 2c as the board holding apparatus. .

Further, there is a possibility that the board 3 to be lowered in the board clamp release operation may include components mounted by the component mounting apparatus 1 in addition to the components mounted in the previous process. For this reason, the low-speed movement time in the board clamp release operation is the time required for the component mounted on the board 3 by the component mounting apparatus 1 having the board holding mechanism 2c or the component mounting apparatus in the previous process of the component mounting apparatus 1 to move the component onto the board 3. Set based on the type of component mounted.

Next, a board holding method for holding the board 3 by the board holding mechanism 2c in the component mounting apparatus 1 configured as described above will be described. This substrate holding method is executed by the control unit 30 controlling the mechanism driving unit 37 via the substrate holding processing unit 32, and the substrate 3 conveyed by the conveyer 2a is moved by the cylinder 20 (FIG. 2, FIG. 2). FIG. 3) is lifted by a lift member 2e that is driven up and down, and the substrate is clamped by being sandwiched between the lift member 2e and a clamp receiving member 2b positioned above the substrate 3, and the substrate 3 is clamped. 3 is subjected to a component mounting operation, which is a predetermined operation, and after the component mounting operation, the lift member 2e is lowered by the cylinder 20 to release the clamp.

5 and 6 show timing charts of the substrate clamping operation and the substrate clamping release operation in this substrate holding method, respectively. This substrate holding method includes the operation of lowering the substrate 3 lifted by the lift member 2e in the substrate clamping operation to release the clamp. includes a direction switching step of switching to

Furthermore, since the rising speed is switched from high speed to low speed in the process of lifting the substrate 3, and the lowering speed is switched from low speed to high speed in the process of lowering the substrate 3, the flow rate of the fluid supplied to the cylinder 20 is by switching the lifting speed of the lift member 2e between the first speed (first rising speeds 35a and 35c) and the second speed (second lifting speed 35b, second lowering speed 35d).

In the substrate clamping operation shown in FIG. 5, when the rise signal is output at timing t1, the rise side of the cylinder vertical movement valve SV1 is turned ON, and the fall side is turned OFF. At the same time, the speed switching valve SV2 sets the rising speed to a high speed from the timing t1 to the timing t2 when the preset rising switching timer value T1 elapses. That is, the above-described direction switching step is executed while the lift member 2e is separated from the substrate 3, the driving direction is switched to the upward direction, and the upward switching timer value T1, which is the high-speed movement time, elapses after the upward signal is output. Until then, the speed setting step is executed to set the lifting speed to the first rising speed 35a, which is a high first speed.

As a result, the cylinder 20 starts to move up at high speed without the throttle adjusting portion 27 intervening in the exhaust circuit. At this time, the cylinder 20 starts to move up after a certain amount of start-up delay time has elapsed from timing t1. After that, the speed setting step is executed from timing t2 when the rising switching timer value T1 has elapsed, and the speed switching valve SV2 sets the rising speed of the cylinder 20 to the first rising speed 35a, which is a high first speed. , to the second ascending speed 35b, which is the lower second speed.

As a result, the lift member 2e rises at a low speed, and contacts the lower surface of the substrate 3 when it reaches the substrate contact height Hb* of the lift member 2e at timing t3. After that, the lift member 2e rises while pushing up the substrate 3, and presses and clamps the substrate 3 against the lower surface of the clamp receiving member 2b at its upper limit. At this time, the rising switching timer value T1 is appropriately set, and the rising speed of the lift member 2e is switched to a low speed that does not cause any trouble. As a result, the board 3 receives a small impact when it comes into contact with the lift member 2e and the clamp receiving member 2b, and it is possible to suppress problems such as misalignment of components.

Next, in the substrate clamp releasing operation shown in FIG. 6, when a lowering signal is issued at timing t4, the ascending side of the cylinder up/down valve SV1 is turned OFF and the descending side is turned ON. At the same time, the speed switching valve SV2 sets the descending speed to a low speed from timing t4 to timing t5 when the preset low speed movement time T2 passes.

That is, the speed setting step is performed during the period from when the above-described direction switching step is executed while the substrate 3 is clamped, the driving direction is switched to the downward direction, and the downward signal is output until the downward switching timer value T2 elapses. Then, the ascending/descending speed is set to the second lowering speed 35d, which is the second lower speed. As a result, the substrate 3 starts to descend together with the lift member 2e from the state clamped by the lift member 2e and the clamp receiving member 2b. At this time, the lift member 2e and the substrate 3 start to descend at a low speed after some start delay time from timing t4.

Here, the lowering switch timer value T2 is set to the time from when the substrate 3 descends to reach the upper surface of the conveyor belt of the conveyor mechanism 2d to when the lift member 2e reaches the lowered position where it is separated from the substrate 3. The lowered position is the substrate transfer height Hb at which the substrate 3 is transferred to the conveyor belt. At a position above the transfer height Hb, the lower surface side of the substrate 3 is supported by the lift member 2e, so until the lift member 2e reaches the transfer height Hb, consideration is given to mitigating the impact on the substrate 3, etc. Descending operation is performed at a low speed.

After that, from timing t5 when the timer value T2 for switching during descent has passed, that is, timing t5 when the substrate 3 descends and reaches the upper surface of the conveyor belt of the conveyor mechanism 2d and reaches the transfer height Hb, the above-described is executed to set the ascending/descending speed to the first lowering speed 35c, which is the first high speed. At this time, since the substrate 3 is transferred to the conveyor belt of the conveyor mechanism 2d at a low speed, the impact on the substrate 3 can be reduced as much as possible. After timing t5, the lift member 2e descends at a high first descending speed 35c and quickly returns to the lower limit position. This makes it possible to improve the operating efficiency of the substrate clamp release operation in the substrate holding method.

As described above, in the present embodiment, the substrate holding device having the above functions is supplied to the cylinder 20 and the direction switching portion 32a for switching the driving direction of the lifting member 2e by the cylinder 20 between ascending and descending. A speed setting unit 32b that sets the lifting speed of the lift member 2e to either a first speed or a second speed that is lower than the first speed by switching the flow rate of the applied fluid, and a direction switching unit 32a and a control unit 30 for controlling the speed setting unit 32b.

In the substrate clamping operation that is started with the lift member 2e separated from the substrate 3, the driving direction is switched to upward by the direction switching unit 32a and the upward signal is output. Until the variable high-speed movement time defined by elapses, the speed setting unit 32b sets the lifting speed to the first high speed, and the substrate 3 is clamped. , the driving direction is switched to the downward direction by the direction switching unit 32a until the variable low-speed movement time specified by the preset downward switching timer value T2 elapses, the speed setting unit 32b sets the ascending/descending speed to a second low speed. As a result, the timing for switching the lifting speed of the lift member 2e between high and low speeds can be appropriately set according to the target substrate 3, and the impact on the substrate can be mitigated, while the operation efficiency of the substrate clamping operation and clamp releasing operation can be improved. can be improved.

INDUSTRIAL APPLICABILITY The substrate holding device and substrate holding method of the present invention have the effect of improving the operating efficiency of the substrate clamping operation and the clamp releasing operation while mitigating the impact on the substrate. It is useful in the field of component mounting that mounts

REFERENCE SIGNS LIST 1 component mounting device 2 substrate transport mechanism 2b clamp receiving member 2d conveyor mechanism 2e lift member 3 substrate 20 cylinder 27 aperture adjustment unit

Claims (8)

A substrate transported by a conveyor is lifted by a lift member that is vertically driven by a cylinder, clamped by being sandwiched between the lift member and a clamp receiving member positioned above the substrate, and clamped to the substrate. A substrate holding device that performs a predetermined operation on the substrate, and after the operation, lowers the lift member by the cylinder to release the clamp,
a direction switching unit that switches a driving direction of the lifting member by the cylinder between upward and downward;
a speed setting unit that sets the lifting speed of the lift member to either a first speed or a second speed lower than the first speed by switching the flow rate of the fluid supplied to the cylinder; ,
A control unit that controls the direction switching unit and the speed setting unit,
The control unit
During a period from when the direction switching unit switches the driving direction to the downward direction with the substrate clamped and the downward signal is output until a preset variable low-speed movement time elapses, the speed setting unit setting the lifting speed to the second speed;
setting the ascending/descending speed to the first speed by the speed setting unit after the low-speed movement time has elapsed;
In the low-speed movement time, the substrate reaches the upper surface of the conveyor and the lift member is separated from the substrate after the control unit switches the driving direction to the downward direction by the direction switching unit and a downward signal is output. set based on the time required to reach the lowered position,
The substrate holding device , wherein the low speed movement time is set based on the weight of the substrate . A substrate transported by a conveyor is lifted by a lift member that is vertically driven by a cylinder, clamped by being sandwiched between the lift member and a clamp receiving member positioned above the substrate, and clamped to the substrate. A substrate holding device that performs a predetermined operation on the substrate, and after the operation, lowers the lift member by the cylinder to release the clamp,
a direction switching unit that switches a driving direction of the lifting member by the cylinder between upward and downward;
a speed setting unit that sets the lifting speed of the lift member to either a first speed or a second speed lower than the first speed by switching the flow rate of the fluid supplied to the cylinder; ,
A control unit that controls the direction switching unit and the speed setting unit,
The control unit
During a period from when the direction switching unit switches the driving direction to the downward direction with the substrate clamped and the downward signal is output until a preset variable low-speed movement time elapses, the speed setting unit setting the lifting speed to the second speed;
setting the ascending/descending speed to the first speed by the speed setting unit after the low-speed movement time has elapsed;
In the low-speed movement time, the substrate reaches the upper surface of the conveyor and the lift member is separated from the substrate after the control unit switches the driving direction to the downward direction by the direction switching unit and a downward signal is output. set based on the time required to reach the lowered position,
the cylinder supports the lift member via a lower receiving block;
The substrate holding device, wherein the low-speed movement time is set based on the weight of the lower receiving block. A substrate transported by a conveyor is lifted by a lift member that is vertically driven by a cylinder, clamped by being sandwiched between the lift member and a clamp receiving member positioned above the substrate, and clamped to the substrate. A substrate holding device that performs a predetermined operation on the substrate, and after the operation, lowers the lift member by the cylinder to release the clamp,
a direction switching unit that switches a driving direction of the lifting member by the cylinder between upward and downward;
a speed setting unit that sets the lifting speed of the lift member to either a first speed or a second speed lower than the first speed by switching the flow rate of the fluid supplied to the cylinder; ,
A control unit that controls the direction switching unit and the speed setting unit,
The control unit
During a period from when the direction switching unit switches the driving direction to the downward direction with the substrate clamped and the downward signal is output until a preset variable low-speed movement time elapses, the speed setting unit setting the lifting speed to the second speed;
setting the ascending/descending speed to the first speed by the speed setting unit after the low-speed movement time has elapsed;
The low-speed movement time is set based on the type of component mounted on the board by a component mounting apparatus equipped with the board holding device or the type of component mounted on the board by a component mounting apparatus in a previous process of the component mounting apparatus. substrate holding device. A substrate holding device that lifts a substrate transported by a conveyor by a lift member that is vertically driven by a cylinder, clamps the substrate by clamping the substrate between the lift member and a clamp receiving member positioned above the substrate,
a direction switching unit that switches a driving direction of the lifting member by the cylinder between upward and downward;
a speed setting unit that sets the lifting speed of the lift member to either a first speed or a second speed lower than the first speed by switching the flow rate of the fluid supplied to the cylinder; ,
A control unit that controls the direction switching unit and the speed setting unit,
The control unit
After the direction switching unit switches the driving direction to upward in a state in which the lift member is separated from the substrate, and an upward signal is output, until a preset variable high-speed movement time elapses, the speed is increased. setting the lifting speed to the first speed by a setting unit;
After the high-speed movement time has elapsed, the speed setting unit sets the lifting speed to the second speed ,
The high-speed movement time is the time required from when the control unit switches the driving direction to the upward direction by the direction switching unit and an upward signal is issued until the substrate reaches the upward position where it contacts the lift member. is set based on
The substrate holding device , wherein the high-speed movement time is set based on the weight of the substrate . A substrate holding device that lifts a substrate transported by a conveyor by a lift member that is vertically driven by a cylinder, clamps the substrate by clamping the substrate between the lift member and a clamp receiving member positioned above the substrate,
a direction switching unit that switches a driving direction of the lifting member by the cylinder between upward and downward;
a speed setting unit that sets the lifting speed of the lift member to either a first speed or a second speed lower than the first speed by switching the flow rate of the fluid supplied to the cylinder; ,
A control unit that controls the direction switching unit and the speed setting unit,
The control unit
After the direction switching unit switches the driving direction to upward in a state in which the lift member is separated from the substrate, and an upward signal is output, until a preset variable high-speed movement time elapses, the speed is increased. setting the lifting speed to the first speed by a setting unit;
After the high-speed movement time has elapsed, the speed setting unit sets the lifting speed to the second speed,
The high-speed movement time is the time required from when the control unit switches the driving direction to a rise by the direction switching unit and a rise signal is issued until the substrate reaches a raised position where it abuts on the lift member. is set based on
the cylinder supports the lift member via a lower receiving block;
The substrate holding device, wherein the high-speed movement time is set based on the weight of the lower receiving block. A substrate holding device that lifts a substrate transported by a conveyor by a lift member that is vertically driven by a cylinder, clamps the substrate by clamping the substrate between the lift member and a clamp receiving member positioned above the substrate,
a direction switching unit that switches a driving direction of the lifting member by the cylinder between upward and downward;
a speed setting unit that sets the lifting speed of the lift member to either a first speed or a second speed lower than the first speed by switching the flow rate of the fluid supplied to the cylinder; ,
A control unit that controls the direction switching unit and the speed setting unit,
The control unit
After the direction switching unit switches the driving direction to upward in a state in which the lift member is separated from the substrate, and an upward signal is output, until a preset variable high-speed movement time elapses, the speed is increased. setting the lifting speed to the first speed by a setting unit;
After the high-speed movement time has elapsed, the speed setting unit sets the lifting speed to the second speed,
A board holding apparatus, wherein the high-speed movement time is set based on the type of component mounted on the board by a component mounting apparatus in a previous process of the component mounting apparatus including the board holding apparatus. A substrate transported by a conveyor is lifted by a lift member that is vertically driven by a cylinder, clamped by being sandwiched between the lift member and a clamp receiving member positioned above the substrate, and clamped to the substrate. A substrate holding method in which a predetermined operation is performed on the substrate, and after the operation, the lift member is lowered by the cylinder to release the clamp,
a direction switching step of switching a driving direction of the lifting member by the cylinder between upward and downward;
a speed setting step of setting the lifting speed of the lift member to either a first speed or a second speed lower than the first speed by switching the flow rate of the fluid supplied to the cylinder; , including
After the direction switching step is executed with the substrate clamped to switch the driving direction to the downward direction and the downward signal is output, the speed is changed until a preset variable low speed movement time elapses. performing a setting step to set the elevation speed to the second speed;
After the low-speed movement time has elapsed, the speed setting step is executed to set the lifting speed to the first speed ;
The low-speed movement time is the time required from when the driving direction is switched to downward and a downward signal is issued until the substrate reaches the upper surface of the conveyor and the lift member reaches a lowered position separated from the substrate. is set based on
The substrate holding method , wherein the low speed movement time is set based on the weight of the substrate . A substrate holding method in which a substrate conveyed by a conveyor is lifted by a lift member that is vertically driven by a cylinder, and the substrate is sandwiched and clamped between the lift member and a clamp receiving member positioned above the substrate,
a direction switching step of switching a driving direction of the lifting member by the cylinder between upward and downward;
a speed setting step of setting the lifting speed of the lift member to either a first speed or a second speed lower than the first speed by switching the flow rate of the fluid supplied to the cylinder; , including
A period from when the direction switching step is executed in a state in which the lift member is separated from the substrate, the driving direction is switched to upward and an upward signal is output, and a preset variable high-speed movement time elapses. , executing the speed setting step to set the lifting speed to the first speed;
After the high-speed movement time has passed, the speed setting step is executed to set the lifting speed to the second speed ,
The high-speed movement time is set based on the time required from when the drive direction is switched to the up direction and the rise signal is issued until the substrate reaches the raised position where it abuts on the lift member,
The substrate holding method, wherein the high-speed movement time is set based on the weight of the substrate.

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