JP7270267B2 - テラヘルツ反射撮像システム - Google Patents
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- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
- G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
- G01N21/3581—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light using far infrared light; using Terahertz radiation
- G01N21/3586—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light using far infrared light; using Terahertz radiation by Terahertz time domain spectroscopy [THz-TDS]
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/05—Detecting, measuring or recording for diagnosis by means of electric currents or magnetic fields; Measuring using microwaves or radio waves
- A61B5/0507—Detecting, measuring or recording for diagnosis by means of electric currents or magnetic fields; Measuring using microwaves or radio waves using microwaves or terahertz waves
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
- G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
- G01N21/3563—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing solids; Preparation of samples therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
- G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
- G01N21/3581—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light using far infrared light; using Terahertz radiation
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Description
Claims (11)
- 半導体技術において一体的に実現可能なテラヘルツ撮像システム用センサであって、前記センサは、
分析領域(12)と、
前記分析領域(12)からある距離に位置する、テラヘルツ放射線を通す半導体材料の平坦基板(60)であって、前記基板と前記分析領域との間にはレンズが全く間挿されていない、平坦基板(60)と、
前記基板上のアレイ(10)内に配置された複数のテラヘルツ放射線受信機と、
前記基板上に配置されたテラヘルツ放射線の少なくとも1つのコヒーレントスポット光源であって、前記基板と前記分析領域との間の距離は、放射円錐(C)に従って前記送信機によって放射された放射線が、ホログラムである円板に従って前記受信機のアレイ上で前記分析領域によって反射されるようなものである、コヒーレントスポット光源と、
前記受信機のアレイによって受信されたホログラムに逆フーリエ変換を施すための手段と、
を備える、センサ。 - 前記アレイのピッチは、前記基板内の放射線の波長の少なくとも1/2であり、前記コヒーレントスポット光源は、前記アレイ内の受信機と置き換えられる、請求項1に記載のセンサ。
- 前記受信機は、同じ局部発振器上で同期されたヘテロダイン受信機であり、そのことにより、各々の受信機は、前記コヒーレントスポット光源からの前記受信放射線の伝播距離を表す位相情報を提供する、請求項1に記載のセンサ。
- 前記受信機および前記コヒーレントスポット光源は、六角形構成を有し、ハニカムマトリクス内に配置される、請求項2に記載のセンサ。
- 各コヒーレントスポット光源が複数の受信機によって最も近い隣接するコヒーレントスポット光源から分離されるように前記アレイ内に均等に分布している複数のコヒーレントスポット光源を備える、請求項2に記載のセンサ。
- 分析する対象物に当てられ、前記対象物から一定の距離に前記センサを維持するように構成された管状支持体(16)を備える、請求項2に記載のセンサ。
- 前記基板は、前記基板内のテラヘルツ放射線の波長の1/2以下の厚さを有し、
金属層を含む活性面と、
前記分析領域に向けて配向されるように構成された背面と、
を備え、
前記受信機および前記コヒーレントスポット光源の各々は、
前記活性面の金属層に形成された環状アンテナ(50)であって、前記基板内のテラヘルツ放射線の波長の少なくとも1/2の平均円周を有する環状アンテナ(50)と、
複数の金属層で積層された金属パターンから形成された、前記受信機または前記コヒーレントスポット光源の周辺で前記アンテナを囲むガードリング(52)と、
を含む、請求項2に記載のセンサ。 - 前記ガードリング(52)は、導体トラックと、前記受信機および前記コヒーレントスポット光源を制御するための電子部品とを収容するキャビティ(62)を形成するように構成された金属パターンを備える、請求項7に記載のセンサ。
- 請求項5に記載のセンサを使用するレンズレス反射テラヘルツ撮像方法であって、
前記コヒーレントスポット光源を順に1つずつ作動させて、異なる角度から前記分析領域の同じ領域を照射するステップと、
前記センサによって受信された周波数領域内の結果として得られた画像を収集するステップと、
前記周波数領域内の結果として得られた画像を処理して、拡張空間領域画像を生成するステップと、
を含む、方法。 - 前記結果として得られた画像は、前記受信機によって提供された振幅情報のみを使用して、タイコグラフィー技術によって処理される、請求項9に記載の方法。
- 前記結果として得られた画像は、前記受信機によって提供された振幅情報および位相情報を使用して、合成開口顕微鏡技術によって処理される、請求項9に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1851025 | 2018-02-07 | ||
FR1851025A FR3077641B1 (fr) | 2018-02-07 | 2018-02-07 | Systeme d'imagerie terahertz a reflexion |
PCT/FR2019/050254 WO2019155156A1 (fr) | 2018-02-07 | 2019-02-05 | Système d'imagerie térahertz à réflexion |
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JP2021513751A JP2021513751A (ja) | 2021-05-27 |
JP7270267B2 true JP7270267B2 (ja) | 2023-05-10 |
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JP2020565019A Active JP7270267B2 (ja) | 2018-02-07 | 2019-02-05 | テラヘルツ反射撮像システム |
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US (1) | US11497410B2 (ja) |
EP (1) | EP3749949B1 (ja) |
JP (1) | JP7270267B2 (ja) |
CN (1) | CN111971548B (ja) |
FR (1) | FR3077641B1 (ja) |
WO (1) | WO2019155156A1 (ja) |
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US11804068B2 (en) * | 2022-04-04 | 2023-10-31 | Rovi Guides, Inc. | Systems and methods for image feature recognition using a lensless camera |
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2018
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2019
- 2019-02-05 EP EP19710449.0A patent/EP3749949B1/fr active Active
- 2019-02-05 CN CN201980012170.2A patent/CN111971548B/zh active Active
- 2019-02-05 JP JP2020565019A patent/JP7270267B2/ja active Active
- 2019-02-05 WO PCT/FR2019/050254 patent/WO2019155156A1/fr unknown
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JP2014219224A (ja) | 2013-05-02 | 2014-11-20 | キヤノン株式会社 | 画像取得装置 |
JP2014235146A (ja) | 2013-06-05 | 2014-12-15 | セイコーエプソン株式会社 | テラヘルツ波検出装置、カメラ、イメージング装置および計測装置 |
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FR3077641B1 (fr) | 2020-02-21 |
EP3749949B1 (fr) | 2023-09-13 |
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US11497410B2 (en) | 2022-11-15 |
CN111971548A (zh) | 2020-11-20 |
FR3077641A1 (fr) | 2019-08-09 |
JP2021513751A (ja) | 2021-05-27 |
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