JP7266061B2 - Suction cup foreign object detection system - Google Patents

Description

TECHNICAL FIELD The present invention relates to a sucker foreign matter detection system, and more particularly to a sucker foreign matter detection that irradiates a light source at a low angle onto a wafer sucker, acquires a scattered light image, and analyzes whether or not there is a foreign matter on the wafer sucker by image recognition. Regarding the system.

In the field of semiconductor manufacturing, with the progress of semiconductor manufacturing technology, the tolerance for the size of external contaminants is becoming more stringent. The appearance of contaminants will reduce the process yield rate or cause irreversible and destructive damage to the chip, greatly increasing the manufacturing cost.

In the semiconductor process, the main technological development is the shrinking of transistor size in order to integrate more transistors on the wafer, so the machinery and equipment required for transistor size exposure, etching and other processes are constantly being upgraded. However, in the cutting equipment that cuts the wafer into chips, the size of the chips does not change greatly, so there is no need for improvement, so the optical detection module is put away and optical detection is performed on parts such as suction cups that come into contact with the wafer. . However, many existing optical sensing modules just have an illumination source and a lens. In the general lighting method, bright bands are easily generated on the suction cup, and defects caused by contaminants are hidden by the bright bands. And for the existing dicing process, better suggestions are needed to avoid wafer contamination during the dicing process and adversely affect the manufacturing quality and yield of the semiconductor process. Become.

In the background art, in order to improve the efficiency of semiconductors, the existing technology is mainly to improve the mechanical equipment of processes such as exposure and etching, so that more transistors can be arranged on the same size wafer. Cutting equipment that cuts wafers has not changed significantly, and there are few requests for improvements to the machines themselves, so most users arbitrarily install optical detection modules to detect suction cups that come into contact with wafers. do. However, existing optical detection modules generally simply attach a light source and a lens. adversely affect. SUMMARY OF THE INVENTION Therefore, it is a primary object of the present invention to provide a suction cup foreign matter detection system that can effectively detect contamination of the suction cups.

In order to solve the problems of the background art, the present invention provides a suction cup foreign matter detection system installed in a wafer processing apparatus, the wafer processing apparatus includes a wafer processing apparatus main body and a wafer suction cup, and the wafer suction cup is a wafer. Installed in one work station of the processing apparatus body, at least one wafer is put into the work station from the first side of the wafer sucker and taken out from the work station through the second side of the wafer sucker. The suction cup foreign object detection system includes a first lighting module, a second lighting module, an image capture module, a control unit and an image recognition unit.

A first lighting module is installed in the work station so as to be located on a third side different from the first side and the second side of the wafer sucker. A second lighting module is installed at a fourth side working station different from the first, second and third sides of the wafer sucker.

An image capture module is installed at the work station to capture an image of the wafer suction cup from above the wafer suction cup. The control unit is electrically connected to the first lighting module, the second lighting module, and the image capturing module, and sequentially causes the first lighting module and the second lighting module to emit light based on the detection timing, and captures the image. Control the module to acquire multiple low-light reflectance images based on sense timing.

The image recognition unit is electrically connected to the image capture module and analyzes the low light reflectance image to recognize if there are any foreign matter on the wafer suction cup.

As described above, in the sucker foreign matter detection system according to the present invention, the first lighting module and the second lighting module are mainly connected to the infeed side (first side) and the take-out side (second side) of the wafer sucker, respectively. By controlling the first lighting module and the second lighting module, which are installed on different third and fourth sides and have different detection timings, to project a light beam at a low angle onto the wafer suction cup, the image can be obtained. A capture module can acquire a low-light reflectance image of the wafer suction cup so that the low-light reflectance image of the wafer suction cup can be used to recognize if there is contaminants on the surface of the wafer suction cup.

Specific embodiments of the present invention will be described in more detail with reference to the following embodiments and drawings.

1 is a three-dimensional conceptual diagram of a suction cup foreign matter detection system applied to a wafer processing apparatus according to a better embodiment of the present invention; FIG. 1 is a three-dimensional exploded conceptual view of part of a sucker foreign matter detection system applied to a wafer processing apparatus according to a better embodiment of the present invention; FIG. 1 is a system conceptual diagram of a suction cup foreign matter detection system according to a better embodiment of the present invention; FIG. In a preferred embodiment of the present invention, the control unit of the sucker foreign object detection system controls the first lighting module to emit light according to the detection timing, and the image capture module to capture the image of the wafer sucker. It is a plane conceptual diagram when controlling to acquire. In a preferred embodiment of the present invention, the control unit of the suction cup foreign object detection system controls the second lighting module to emit light according to the detection timing, and the image capturing module to transmit the image of the wafer suction cup. It is a plane conceptual diagram when controlling to acquire. According to a better embodiment of the present invention, the control unit of the sucker foreign matter detection system controls the first lighting component to emit light according to the detection timing, and the image capture module captures the image of the wafer sucker. It is a plane conceptual diagram when controlling to acquire. In a preferred embodiment of the present invention, the control unit of the suction cup foreign matter detection system controls the second lighting component to emit light according to the detection timing, and the image capturing module to transmit the image of the wafer suction cup. It is a plane conceptual diagram when controlling to acquire. According to a better embodiment of the present invention, the control unit of the sucker foreign matter detection system controls the third lighting component to emit light according to the detection timing, and the image capture module captures the image of the wafer sucker. It is a plane conceptual diagram when controlling to acquire. In a preferred embodiment of the present invention, the control unit of the suction cup foreign object detection system controls the first lighting component and the fourth lighting component to emit light according to the detection timing, and the image capturing module to FIG. 4 is a conceptual plan view when controlling to acquire an image of a wafer sucker; In a preferred embodiment of the present invention, the control unit of the suction cup foreign object detection system controls the second lighting component and the third lighting component to emit light according to the detection timing, and the image capturing module to FIG. 4 is a conceptual plan view when controlling to acquire an image of a wafer sucker;

Referring to FIGS. 1 to 3, FIG. 1 is a three-dimensional conceptual diagram of a suction cup foreign matter detection system applied to a wafer processing apparatus according to a better embodiment of the present invention, and FIG. FIG. 3 is a partially exploded three-dimensional conceptual diagram of a suction cup foreign matter detection system applied to a wafer processing apparatus of a better embodiment, FIG. 3 is a system conceptual diagram of a better embodiment of a suction cup foreign matter detection system according to the present invention; .

As shown in FIGS. 1-3, the suction cup foreign object detection system (not shown) includes an external installation frame 1, a first illumination module 2, a second illumination module 3, an image acquisition module 4, and a control module 5. , a first illumination module 6 , a second illumination module 7 and an image capture module 8 .

According to this embodiment, the suction cup foreign matter detection system is installed in a wafer processing apparatus 200, and the wafer processing apparatus 200 includes a wafer processing apparatus main body 201, a wafer suction cup 202, and a wafer suction cup 203. has a storage area 2011 , a work zone 2012 , a work zone 2013 and a protection frame 2014 .

A storage area 2011 stores wafers (not shown in the figure) awaiting processing. In work zone 2012, which communicates with storage area 2011, wafers are pre-fixed prior to cutting, and wafers are sent to the cutting zone (not shown in the figure) for cutting, and then work zone 2012. A storage space 20121 is provided in the storage space 20121, and parts for fixing the wafer are installed in the storage space 20121. FIG.

In a work zone 2013 communicating with the work zone 2012, the cut wafers are cleaned, and a storage space 20131 is provided in the work zone 2013. The storage space 20131 is a cleaning tank filled with a wafer cleaning liquid. is.

A protective frame 2014 traverses the work zones 2012, 2013 and is provided with transparent glass to protect the working environment of the work zones 2012, 2013.

The wafer sucker 202 is installed in the storage space 20121 and exposed to the storage space 20121 to hold the wafer by suction and move it to the cutting zone, where the wafer sucker 202 is located on the first side. 202a, second side 202b, third side 202c and fourth side 202d. The first side 202a is located near the storage area 2011 and corresponds to the infeed side of the work zone 2012, and the second side 202b is located near the cutting zone and corresponds to the withdrawal side of the work zone 2012. Also, a second side 202b is positioned adjacent to the first side 202a, a third side 202c is positioned opposite the second side 202b, and a fourth side 202d is positioned adjacent to the first side 202a. Located on opposite sides, i.e., the first side 202a and the fourth side 202d are located between the second side 202b and the third side 202c, respectively, and the second side 202b and the third side 202c, respectively. , between the first side 202a and the fourth side 202d. In operation, wafers in the storage area 2011 enter the work zone 2012 from the first side 202a and are removed from the work zone 2012 via the second side 202b into the cutting zone.

The wafer sucker 203 is installed in the storage space 20131 to suck and fix the cut wafer, and the wafer is immersed in the wafer cleaning liquid for cleaning. Among them, according to the present embodiment, the feed side and the take-out side in the working area 2013 are located above the wafer suction cups 203, so that the wafer suction cups 203 are relatively installed outside the upper side. There is a side 203c and a fourth side 203d, with the third side 203c located near the work center 2012 and the fourth side 203d located away from the work center 2012.

In addition, the wafer processing apparatus 200 further includes two pick-up mechanisms (not shown in the figure). One pick-up mechanism moves wafers waiting to be cut, and the other moves cut wafers.

The external installation frame 1 has a first installation section 11 and a second installation section 12, the first installation section 11 extending along the first direction D1, and the second installation section 12 extending along the first direction D1. extending along a second direction D2 different from that, integrally connected to the first installation partition 11, wherein the external installation frame 1 is detachably installed in the opening of the storage space 20121, which Accordingly, the first installation partition 11 and the second installation partition 12 are positioned on the third side 202c and the fourth side 202d, respectively. Also, according to this embodiment, the first direction D1 and the second direction D2 are perpendicular to each other.

The first lighting module 2 includes a first lighting component 21 and a second lighting component 22, the first lighting component 21 and the second lighting component 22 are fixedly installed in the first installation partition 11, respectively, and A light beam is projected onto the wafer sucker 202 . The second lighting module 3 includes a third lighting component 31 and a fourth lighting component 32, the third lighting component 31 and the fourth lighting component 32 are fixedly installed in the second installation partition 12, respectively, and A light beam is projected onto the wafer sucker 202 . According to this embodiment, the first installation partition 11 and the second installation partition 12 are positioned above the wafer suction cup 202, so that the first lighting component 21, the second lighting component 22, the third lighting component 31 and the fourth lighting component The lighting component 32 is positioned above the wafer suction cup 202 . As a result, foreign substances on the surface of the wafer sucker 202 can be detected, so that the first lighting component 21, the second lighting component 22, the third lighting component 31, and the fourth lighting component 32 are positioned at a low angle to the wafer sucker 202. Project a beam of light.

Taking the first lighting component 21 as an example, for the sake of explanation, a parallel projection axis T1 and an oblique projection axis T2 are first defined. A normal line N1 perpendicular to the surface, and an oblique projection axis T2 has an inclination angle θ with respect to the parallel projection axis T1, and the inclination angle is in the range of 5 degrees to 30 degrees, whereby The first lighting component 21 projects a light beam onto the surface of the wafer suction cup 202 at a low angle along the inclined projection axis T2, and the light beam projected from the first lighting component 21 both emits at an angle of , that is, the light beam has a projection range (not shown in the figure) and projects onto the surface of the wafer suction cup 202 . In addition, the projection direction of the light beam of the first lighting component 21 is only an example and is not limited by it. Similarly, the second lighting component 22 and the third lighting component 31 and the fourth lighting component 32 all project light beams onto the surface of the wafer sucker 202 at a low angle, similar to the first lighting component 21. do.

In addition, since the first installation section 11 is located on the third side 202c and the second installation section 12 is located on the fourth side 202d, the first lighting module 2 can be located on the third side 202c in the work section 2012. and the second lighting module 3 is installed in the working area 2012 on the fourth side 202d.

The image capture module 4 has an extension bracket 41 and two image capture devices 42 , 43 . The extension bracket 41 is fixed to the protective frame 2014, and the two image capture devices 42 and 43 are fixed to the protective frame 2014, respectively, so that they are positioned above the wafer sucker 202 in the work station 2012, and Two image capture devices 42, 43 capture images of the wafer suction cup 202 corresponding to the two halves of the wafer suction cup 202, respectively.

The control module 5 is electrically connected to the first lighting module 2 , the second lighting module 3 and the image capturing module 4 , and includes a control unit 51 , an image recognition unit 52 and a warning unit 53 . The control unit 51 incorporates a plurality of detection timings 511 (only one is shown in the figure), and causes the first lighting module 2 and the second lighting module 3 to emit light in turn according to the detection timings. , and controls the image capture module 4 to acquire multiple low-light reflectance images based on the sensing timing.

The image recognition unit 52 is electrically connected to the image capture module 4 and analyzes the low light reflectance image to recognize if there is foreign matter on the wafer suction cup 202 . The warning unit 53 is electrically connected to the image recognition unit 52 and issues an alarm when the image recognition unit 52 recognizes that there is foreign matter on the wafer sucker 202 .

4 and 5, FIG. 4 shows that the control unit of the suction cup foreign matter detection system according to the preferred embodiment of the present invention causes the first lighting module to emit light according to the detection timing. FIG. 5 is a schematic plan view when controlling and controlling the control image acquisition module to acquire an image of a wafer sucker, FIG. FIG. 4 is a schematic plan view of when the unit controls the second lighting module to emit light and the image capturing module to capture the image of the wafer suction cup according to the detection timing;

As shown in FIGS. 1 to 5, according to the suction cup foreign matter detection system, the detection timing 511 includes, for example, a first detection timing and a second detection timing, and at the first detection timing, the control unit 51 , the first lighting component 21 and the second lighting component 22 are simultaneously controlled to project low-angle light beams onto the wafer suction cup 202, within the two detection areas IA1 and IA2 of the wafer suction cup 202, generating a low light reflectance image and controlling the image capture device 42 to acquire a low light reflectance image of the sensing area IA1 within one image capture area 42a of the image capture device 42; and The device 43 is controlled to acquire a low-light reflectance image of the detection area IA2 within one image capture area 43a of the image capture device 43, and at the second detection timing, the control unit 51 activates the third illumination component. 31 and the fourth illumination component 32 are simultaneously projected onto the wafer sucker 202 with a light beam at a low angle, so that a low light reflection image is produced in the two detection areas IA1 and IA2 of the wafer sucker 202. and control the image capture devices 42, 43 to acquire low light reflectance images within the two sensing areas IA1, IA2, respectively. Thereby, the image recognition unit 52 acquires low-light reflectance images under the illumination of different light sources by the image capture devices 42, 43, and by image contrast, the contaminants on the surface of the wafer sucker 202 are detected. recognize what

Further, according to the present embodiment, the detection timing 511 is the first detection timing and the second detection timing, respectively, using the first lighting module 2, the second lighting module 3, and the image capturing module 4, so that different angles are detected. to acquire a low-light reflectance image of, but not limited to, according to another embodiment, the first lighting module 2 and the second lighting module 3 are illuminated simultaneously so that the image capture module 4 captures the first When the illumination module 2 and the second illumination module 3 emit light at the same time, a low-light reflection image of the wafer suction cup 202 can be obtained, or formed by the illumination of the first illumination module 2 and the second illumination module 3 respectively. A low-light reflectance image can be acquired and recognized based thereon.

In addition, according to this embodiment, the wafer sucker 202 is, for example, a ceramic sucker, and since the ceramic sucker leaves less polishing marks than the metal sucker, the wafer sucker 202 can be used with the first lighting module 2 or the second lighting module 3 202 can be illuminated to obtain a low-light reflection image, but if the wafer suction cup 202 is a metal suction cup, the control unit 51 controls the first lighting component 21 and the second lighting component 21 of the first lighting module 2 respectively. By controlling the light emission of the lighting component 22, or respectively controlling the light emission of the third lighting component 31 and the fourth lighting component 32 of the second lighting module 3, each area of the surface of the wafer suction cup 202 has low light reflection . Generate an image.

Referring to FIGS. 6 to 8, FIG. 6 shows a control unit of a sucker foreign matter detection system according to a better embodiment of the present invention, which controls the first lighting component to emit light according to the detection timing. FIG. 7 is a schematic plan view of when the image capture module is controlled to capture the image of the wafer sucker, FIG. 8 is a schematic plan view of controlling the second lighting component to emit light according to the detection timing, and controlling the image capturing module to capture the image of the wafer sucker; FIG. In a preferred embodiment of the invention, the control unit of the suction cup foreign matter detection system controls the third lighting component to emit light according to the detection timing, and the image capturing module captures the image of the wafer suction cup. It is a plane conceptual diagram when controlling to make it.

1-3 and 6-8, according to another embodiment of the present invention, the wafer suction cup 202 is, for example, a metal suction cup, and the second lighting module 3 is provided with a third lighting When the component 31 is included but the fourth lighting component 32 is not included, the detection timing 511 includes a first detection timing, a second detection timing, and a third detection timing.

The control unit 51 controls the first lighting component 21 to project a light beam at a low angle onto the wafer suction cup 202 at the first detection timing, so that the first detection area IA1a of the wafer suction cup 202 has low light reflection . An image is formed, also forming a high light reflectance image of the two first non-sensing areas GA1, GA2, and then with the image capture device 42 a low light reflectance image of the first sensing area IA1a of the image capture area 42a. Earn.

The control unit 51 controls the second lighting component 22 to project a light beam at a low angle onto the wafer suction cup 202 at the second detection timing, so that the second detection area IA2a of the wafer suction cup 202 has low light reflection . An image is formed and also a high light reflectance image of the two second non-sensing areas GA3 and GA4 is formed, and then the image capture device 43 produces a low light reflectance image of the second sensing area IA2a of the image capture area 43a. Earn.

The control unit 51 controls the third lighting component 31 to project a light beam at a low angle onto the wafer sucker 202 at the third detection timing, so that the third detection area IA3a of the wafer sucker 202 has low light reflection . An image is formed and a high light reflectivity image is also formed of the two third non-sensing areas GA5 and GA6, and then with the image capture devices 42, 43 a third sensing area across the image capture areas 42a and 43a, respectively. A low-light reflectance image of IA3a is acquired. Among them, the low light reflection images of the first detection area IA1a, the second detection area IA2a and the third detection area IA3a include the entire surface of the wafer suction cup 202, and the control unit 51 detects the first detection area according to the detection timing. By controlling the lighting component 21, the second lighting component 22 and the third lighting component 31 to project light beams onto the surface of the wafer sucker 202, respectively, and obtain images with the image capture devices 42 and 43, The image recognition unit 52 can accurately recognize whether there is contaminants on the surface of the wafer sucker 202 .

As described above, since the wafer suction cup 202 of this embodiment is a metal suction cup and has polishing marks, the control unit 51 controls the first lighting component 21 and the second lighting component 22 based on the detection timing 511. and the third illumination component 31 to sequentially illuminate, so that the image capturing module 4 can respectively acquire images of a large number of different low light reflection areas, and the image recognition unit 52 can recognize those images can be analyzed to recognize whether there are any defects on the surface of the wafer sucker 202, and the image recognition unit 52 can also provide the user with a defect distribution map for reference. However, if the wafer suction cup 202 of this embodiment is a non-marking ceramic suction cup, it is not necessary to sequentially illuminate and acquire images of multiple different low light reflectance areas.

Referring to FIGS. 9 and 10, FIG. 9 shows that the control unit of the suction cup foreign matter detection system according to the preferred embodiment of the present invention emits light to the first lighting component and the fourth lighting component according to the detection timing. FIG. 10 is a schematic plan view of controlling the image capturing module to acquire an image of the wafer sucker when controlling to acquire an image of the wafer sucker, FIG. FIG. 4 is a schematic plan view of the unit controlling the second lighting component and the third lighting component to emit light according to the detection timing, and controlling the image capturing module to capture the image of the wafer sucker;

1 to 3 and 9 and 10, the first lighting module 6 includes a first lighting component 61 and a second lighting component 62 installed on the third side 203c within the work station 2013. , a first lighting component 61 and a second lighting component 62 project light beams onto the wafer sucker 203, respectively.

The second lighting module 7 includes a third lighting component 71 and a fourth lighting component 72 installed on the fourth side 203d in the work zone 2013, the third lighting component 71 and the fourth lighting component 72 respectively , project a light beam onto the wafer sucker 203 . Among them, the first lighting component 61 and the second lighting component 62, the third lighting component 71 and the fourth lighting component 72 are all fixed to the inner wall of the storage space 20131, and the surface of the wafer sucker 203 is the storage space. 20131, the first lighting component 61 and the second lighting component 62, the third lighting component 71 and the fourth lighting component 72 are located on the surface of the wafer sucker 203 in the same way as the first lighting component 21 above. It projects an oblique light beam onto the surface of the wafer sucker 203 at a slightly higher height.

The image capture module 8 includes an extension bracket 81 and two image capture devices 82,83. The extension bracket 81 is fixed to the protective frame 2014, and the two image capturing devices 82, 83 are fixed to the protective frame 2014, respectively, so that they are respectively positioned above the wafer suction cups 203 in the work station 2013. Also, two image capture devices 82, 83 capture images of the wafer suction cup 203 corresponding to the two halves of the wafer suction cup 203, respectively.

As described above, the first lighting module 6, the second lighting module 7 and the image capturing module 8 are similar to the above first lighting module 2, the second lighting module 3 and the image capturing module 4 respectively, and the present embodiment , the control module 5 further includes a first lighting module 6 and a second lighting module 7 and an image capturing module 8 in the same connection manner as the first lighting module 2 and the second lighting module 3 and the image capturing module 4. are electrically connected.

In addition, the detection timing 511 of the control unit 51 for the first lighting module 6, the second lighting module 7 and the image capturing module 8 includes, for example, the first detection timing and the second detection timing. When the detection timing is reached, the first lighting component 61 and the fourth lighting component 72 are controlled to project light beams at a low angle onto the wafer suction cup 203, so that the first detection area IA3 of the wafer suction cup 203; Two low light reflectance images are formed in IA4 and high light reflectance images are formed in the two first non-sensing areas GA7, GA8, and then with the image capture device 82, a first sensing in the image capture area 82a. Acquire low-light reflectance images of areas IA3, IA4.

The control unit 51 controls the second lighting component 62 and the third lighting component 71 to project a light beam at a low angle onto the wafer suction cup 203 at the second detection timing, thereby causing the wafer suction cup 203 to Two low light reflectance images are formed in the two second sensing areas IA5, IA6, and two high light reflectance images are formed in the two second non-sensing areas GA9, GA10. , acquire low-light reflection images of the two second sensing areas IA5, IA6 within the image capture area 83a. Among them, the low-light reflection images of the first detection areas IA3, IA4 and the second detection areas IA5, IA6 can cover the entire surface of the wafer sucker 203, so that the control unit 51 can be used to detect the images according to the detection timing. controlling the first lighting component 61 and the second lighting component 62, the third lighting component 71 and the fourth lighting component 72 to respectively project light beams onto the surface of the wafer suction cup 203; By acquiring an image, the image recognition unit 52 can accurately recognize whether there is contaminants on the surface of the wafer sucker 203 .

As described above, the suction cup foreign matter detection system of the present invention mainly uses the first lighting module and the second lighting module as third lighting modules different from the infeed side (first side) and the withdrawal side (second side) of the wafer sucker. side and fourth side, and control the first lighting module or the second lighting module to project a low angle light beam onto the wafer suction cup according to different detection timing, and then the image capturing module. can acquire a low-light reflection image of the wafer suction cup, therefore, the low-light reflection image of the wafer suction cup can be used to recognize whether there is contaminants on the surface of the wafer suction cup, and in the process of wafer cutting, the wafer Compared with the background art without contamination prevention, the suction cup foreign matter detection system of the present invention can not only effectively reduce the contamination risk of the wafer cutting process, but also can be directly applied to the existing wafer cutting equipment. , the benefits of cost reduction can be obtained.

While the invention may actually achieve the intended functions and objectives, and the detailed description will enable those skilled in the art to implement the same accordingly, it is hoped that the features and spirit of the invention can be more clearly described. It is expected and does not limit the scope of the invention. The above-described embodiments are only used to illustrate the invention, and all changes in equivalent construction still do not depart from the scope of the invention.

1 external installation frame 11 first installation partition 12 second installation partition 2 first lighting module 21 first lighting component 22 second lighting component 200 wafer processing apparatus 201 wafer processing apparatus body 2011 storage area 2012, 2013 work area 20121, 20131 Storage space 2014 Protective frame 202, 203 Wafer sucker 202a First side 202b Second side 202c, 203c Third side 202d, 203d Fourth side 3 Second lighting module 31 Third lighting component 32 Fourth lighting component 4, 8 Image Capturing modules 41, 81 Extension brackets 42, 43, 82, 83 Image capturing device 5 Control module 51 Control unit 511 Detection timing 52 Image recognition unit 53 Warning unit 6 First lighting module 61 First lighting component 62 Second lighting component 7 Second lighting module 71 Third lighting component 72 Fourth lighting component D1 First direction D2 Second direction T1 Parallel projection axis T2 Inclined projection axis N1 Normal line θ Tilt angles 42a, 43a, 82a, 83a Image acquisition range IA1, IA2 Detection area IA1a, IA3, IA4 First detection area IA2a, IA5, IA6 Second detection area IA3a Third detection area GA1, GA2, GA7, GA8 First non-detection area GA3, GA4, GA9, GA10 Second non-detection area GA5, GA6 Third non-detection area

Claims (7)

A suction cup foreign matter detection system installed in a wafer processing apparatus, wherein the wafer processing apparatus includes a wafer processing apparatus main body and a wafer suction cup, and the wafer suction cup is installed in one work area of the wafer processing apparatus main body. and at least one wafer is introduced into the work station from a first side of the wafer suction cup and removed from the work station via a second side of the wafer suction cup;
a first lighting module installed in the work station so as to be located on a third side different from the first side and the second side of the wafer sucker, comprising a first lighting component and a second lighting component; and the wafer; a second lighting module installed in the work station to be located on the first side of the suction cup, the second side and a fourth side different from the third side, and comprising a third lighting component and a fourth lighting component; and,
an image capture module installed in the work station overlying the wafer suction cup to capture an image of the wafer suction cup;
electrically connected to the first lighting module, the second lighting module, and the image capturing module, and controlling the first lighting module and the second lighting module to sequentially emit light based on detection timing; a control unit for controlling the image capturing module to acquire a plurality of low-light reflectance images based on the sensing timing;
an image recognition unit electrically connected to the image capture module and analyzing the plurality of low light reflectance images to recognize if the wafer suction cup contains foreign matter;
the first lighting component, the second lighting component, the third lighting component, and the fourth lighting component project light beams onto the wafer suction cup at an inclination angle within the range of 5 degrees to 30 degrees;
A suction cup foreign matter detection system characterized by: further comprising an external installation frame, wherein the first lighting module and the second lighting module are installed in the external installation frame, which is detachably installed in the work zone, thereby The suction cup foreign object detection system of claim 1, wherein one lighting module and the second lighting module are located on the third side and the fourth side, respectively. The external installation frame includes a first installation section and a second installation section, the first installation section is installed on the third side so as to extend along the first direction, and the second installation A partition is installed on the fourth side so as to extend along a second direction different from the first direction, and the first lighting module is installed in the first installation partition to provide the second lighting The suction cup foreign matter detection system according to claim 2, characterized in that the module is installed in the second installation section. The detection timing includes a first detection timing, a second detection timing and a third detection timing in order, and the control unit projects a light beam onto the wafer suction cup at the first detection timing. the image capturing module to control a first lighting component to form a first sensing area and at least one first non-sensing area on the wafer suction cup, and to acquire an image of the first sensing area; and the control unit controls the second lighting component to project a light beam onto the wafer suction cup at the second detection timing, so that the wafer suction cup has at least one detection area and at least one forming two second non-sensing areas and controlling the image capturing module to acquire an image of the second sensing areas; controlling the second illumination module to project a beam to form a third sensing area and at least one third non-sensing area on the wafer suction cup, and acquire an image of the third sensing area; Any two of the first sensing area, the second sensing area and the third sensing area are adjacent to each other. suction cup foreign object detection system. The first lighting component and the fourth lighting component are installed symmetrically about the center of the circle of the wafer sucker, and the second lighting component and the third lighting component are installed on the wafer sucker. The suction cup foreign matter detection system according to claim 1, wherein the suction cup foreign matter detection system is symmetrically installed about the center of the circle. The detection timing sequentially includes a first detection timing and a second detection timing, and the control unit directs the first lighting component to project a light beam onto the wafer sucker at the first detection timing. and the fourth lighting component to form two first detection areas and two first non-detection areas on the wafer suction cup symmetrically about the center of the circle of the wafer suction cup, and , controlling the image capturing module to acquire images of the two first sensing regions, and the control unit, at the second sensing timing, to project a light beam onto the wafer suction cup; By controlling the second lighting component and the third lighting component, two second detection areas and two second non-detection areas are symmetrically formed on the wafer sucker centering on the circle center of the wafer sucker. and controlling the image capturing module to acquire images of the two second detection areas, and wherein the two first detection areas and the two first non-detection areas are arranged in a crosswise arrangement. 6. The sucker foreign matter detection system of claim 5, wherein the two second sensing areas and the two second non-sensing areas are arranged to intersect. The image capture module further includes an extension bracket and at least one image capture device, the extension bracket fixed to the wafer processing apparatus body, and the at least one image capture device fixed to the extension bracket. The suction cup foreign matter detection system according to claim 1, characterized in that:

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