JP7265945B2 - Base film for dicing - Google Patents

Description

TECHNICAL FIELD The present invention relates to a dicing substrate film that is used by adhering and fixing a semiconductor wafer or a semiconductor package into chips when dicing them.

As a method of manufacturing semiconductor chips, there is a method of manufacturing a semiconductor wafer with a large area in advance, then dicing (cutting and separating) the semiconductor wafer into chips, and finally picking up the diced chips.

A semiconductor package (chip type package) is manufactured by subjecting a semiconductor wafer to polyimide coating, wiring formation, post formation, resin encapsulation, resin polishing, and terminal formation in sequence, and finally cutting it into individual chips. be done. A semiconductor package is generally manufactured by bonding a semiconductor chip to a glass epoxy substrate or a lead frame, collectively molding with a package mold resin, and then affixing the hardened product to a semiconductor processing tape and dicing it with a dicing blade. (Patent Documents 1 and 2).

JP 2012-119468 Patent No. 5053455

An object of the present invention is to provide a substrate film for dicing in which the generation of shavings is well suppressed and the occurrence of deformation (bank) on the side of a cut groove is well suppressed during dicing. .

The present inventor has conducted extensive research to solve the above problems.

The present inventors have found that a specific base film for dicing can solve the above problems, and have completed the present invention.

The present invention provides the following base film for dicing.

Section 1.
A base film for dicing,
The base film for dicing is laminated at least in the order of A layer/B layer,
The A layer is the side to be diced, and is made of a resin composition containing methyl methacrylate-acrylonitrile-butadiene-styrene (MABS) resin and polyolefin resin,
The layer B is made of a resin composition containing a polyolefin resin and/or a vinyl aromatic hydrocarbon resin,
Base film for dicing.

Section 2. 2. The base film for dicing according to item 1, wherein the layer A further contains a vinyl aromatic resin.

Item 3.
3. The substrate film for dicing according to item 1 or 2, wherein the layer located on the surface contains an antistatic agent.

Section 4.
4. The base film for dicing according to any one of items 1 to 3, which is used in a step of dicing a semiconductor package.

The base film for dicing of the present invention is a base film for dicing that satisfactorily suppresses the generation of shavings during dicing and satisfactorily suppresses the occurrence of deformation (bank) on the sides of cut grooves.

The present invention relates to a base film for dicing.

The present invention further relates to a dicing substrate film used in the process of dicing semiconductor packages.

(1) Base film for dicing The base film for dicing of the present invention is laminated at least in the order of A layer/B layer.

In the base film for dicing of the present invention, the layer A is the side to be diced.

In the base film for dicing of the present invention, the layer A is made of a resin composition containing a methyl methacrylate-acrylonitrile-butadiene-styrene (MABS) resin and a polyolefin resin.

In the base film for dicing of the present invention, the layer A may further contain a vinyl aromatic hydrocarbon resin.

In the base film for dicing of the present invention, the layer B is made of a resin composition containing a polyolefin resin and/or a vinyl aromatic hydrocarbon resin.

In the base film for dicing of the present invention, the layer located on the surface preferably contains an antistatic agent.

The dicing base film of the present invention is preferably used in a step of dicing a semiconductor package.

Each layer constituting the base film for dicing of the present invention will be described in detail below.

(1-1) Layer A In the base film for dicing of the present invention, the layer A is made of a resin composition containing a methyl methacrylate-acrylonitrile-butadiene-styrene (MABS) resin and a polyolefin (PO) resin.

In the base film for dicing of the present invention, the layer A is the side to be diced, and when it is made into a dicing film, it is the layer in contact with the pressure-sensitive adhesive layer.

In the base film for dicing of the present invention, the A layer is made of a resin composition containing a MABS resin and a PO-based resin. It exhibits the effect of not deforming (banking) or suppressing the deformation satisfactorily.

Methyl methacrylate acrylonitrile butadiene styrene (MABS) resin
MABS (Methyl Methacrylate-Acrylonitrile-Butadiene-Styrene, methyl methacrylate-acrylonitrile-butadiene-styrene) resin is also called transparent ABS resin, and is usually a resin obtained by adding a methyl methacrylate component to ABS (acrylonitrile-butadiene-styrene).

The transparent ABS resin is modified with methyl methacrylate and achieves transparency by specific rubber particle size and its ratio. Such transparent ABS resins are obtained by copolymerizing methyl methacrylate monomer with acrylonitrile and styrene, and by uniformly melting and mixing high rubber content ABS copolymer with MAS copolymer (methyl methacrylate-acrylonitrile-styrene copolymer). and the like.

In the base film for dicing of the present invention, the layer A (the resin composition that constitutes the layer) contains MABS resin, so that the generation of shavings is well suppressed during dicing, and the side of the diced groove is It exhibits the effect of not deforming (banking) or suppressing the deformation satisfactorily.

In the base film for dicing of the present invention, the MABS resin contains about 48% to 70% by weight of methyl methacrylate (M) units, about 1% to 5% by weight of acrylonitrile (A) units, and about 1% to 5% by weight of butadiene (B) units. It is preferable that the content is about 2% to 20% by weight and the styrene (S) unit is about 25% to 50% by weight.

The density of MABS is preferably about 1,000 Kg/m ³ to 1,200 Kg/m ³ , more preferably about 1,050 Kg/m ³ to 1,150 Kg/m ³ . Density of MABS was determined according to ISO 1183-1:2004.

The MFR (melt flow rate) measured at a temperature of 200°C and a load of 49 N in accordance with MABS ISO 1133 is preferably 1.0 g/10 minutes to 10.0 g/10 minutes, and 1.5 g/10 minutes to 5.5 g/10 minutes. degree is more preferred. By setting the MFR of MABS within the above range, stable film formation becomes possible.

Polyolefin (PO)-Based Resin In the base film for dicing of the present invention, the layer A (the resin composition constituting the layer) contains a PO-based resin, so that the generation of shavings during dicing can be suppressed satisfactorily. , the side of the diced groove is not deformed (banked), or the deformation is well suppressed. In the base film for dicing of the present invention, since the layer A contains a PO-based resin, it is not too hard, and chipping and chipping do not occur during the dicing process.

In the base film for dicing of the present invention, since the A layer contains a PO-based resin, chipping or flying of the semiconductor wafer or semiconductor package (chip) does not occur during the dicing process. It has the effect of not breaking wafers and semiconductor package wafers.

PO-based resins are preferably, for example, branched low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE), polyethylene (PE)-based resins such as high-density polyethylene, and polypropylenes such as polypropylene (PP). (PP)-based resins, propylene-α-olefin copolymers, and the like are exemplified, and one type can be used, or two or more types can be used in combination as appropriate. Or a mixture thereof can be exemplified.

Examples of the α-olefin preferably include α-olefins having 2 or more carbon atoms (excluding carbon atoms of 3), and more preferably, for example, ethylene, 1-butene, 1-pentene, 1 -Hexene, 1-octene, 1-decene and the like can be exemplified. These α-olefins can be used singly or in combination of two or more of the above components.

Ethylene homopolymers, copolymers of ethylene and C3-8 olefin monomers, or copolymers of ethylene and (meth)acrylic acid alkyl ester monomers can be used as PE resins. Yes, preferably.

The PE resin may be a polymer mainly composed of polyethylene units, such as an ethylene homopolymer (ethylene homopolymer), a copolymer of ethylene and an olefin monomer having 3 to 8 carbon atoms, or , copolymers of ethylene and (meth)acrylic acid alkyl ester monomers, and the like can be suitably used.

When a copolymer is used as the PE resin, it preferably contains 80% by weight or more of polyethylene units, more preferably 90% by weight or more.

Among PE resins, branched low density polyethylene (LDPE), linear low density polyethylene (LLDPE), ethylene-vinyl acetate copolymer (EVA), ethylene-methyl acrylate copolymer (EMA), ethylene- Ethyl acrylate copolymers, ethylene-butyl acrylate copolymers, ethylene-methyl methacrylate copolymers (EMMA) and ethylene-methacrylic acid copolymers (EMAA) are preferred. Among these, LDPE, LLDPE, etc. are particularly suitable. One of these components can be used for the PE-based resin, and two or more components can also be used.

The density of LDPE is preferably about 915 Kg/m ³ to 937 Kg/m ³ , more preferably about 917 Kg/m ³ to 935 Kg/m ³ . LDPE densities are determined according to ISO 1183-1:2004.

The melting point of LDPE is preferably about 100°C to 130°C.

The MFR (melt flow rate) measured at a temperature of 190°C and a load of 21.18N in accordance with ISO 1133 of LDPE is preferably about 0.3g/10 minutes to 20g/10 minutes, and about 0.5g/10 minutes to 10g/10 minutes. is more preferred. By setting the MFR of LDPE within the above range, stable film formation is possible.

Examples of PP-based resins include propylene homopolymers (homo PP) and copolymers of propylene and other α-olefins (random copolymer PP, block copolymer PP).

Examples of the α-olefin other than propylene include α-olefins other than propylene having 2 to 20 carbon atoms. Specifically, for example, ethylene, 1-butene, 1-pentene, 1-hexene, 4-methyl-1-pentene, 3-methyl-1-pentene, 1-octene, 3-methyl-1-butene, 1 -decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicosene, cyclopentene, cycloheptene, norbornene, 5-ethyl-2-norbornene, tetracyclododecene, 2-ethyl-1,4, 5,8-dimethano-1,2,3,4,4a,5,8,8a-octahydronaphthalene. Among them, those having 2 to 4 carbon atoms, such as ethylene and butene, are preferred, and ethylene is more preferred. These α-olefins other than propylene may be used singly or in combination of two or more.

Specific examples of copolymers of propylene and other α-olefins include propylene-ethylene copolymers, propylene-butene copolymers, and propylene-ethylene-butene copolymers. . Among these, propylene-ethylene copolymers and propylene-ethylene-butene copolymers are preferred, and propylene-ethylene copolymers are more preferred.

As copolymers of propylene and other α-olefins, random copolymer PP of propylene and ethylene, block copolymer PP containing homopolypropylene (homoPP) and polyethylene (PE), and the like are preferable.

The density of PP is preferably about 850 Kg/m ³ to 950 Kg/cm ³ , more preferably about 860 Kg/m ³ to 920 Kg/m ³ . Density of PP was determined according to ISO 1183-1:2004.

The melting point of PP is preferably about 120°C to 160°C.

The MFR (melt flow rate) of PP measured at a temperature of 230°C and a load of 21.18N according to ISO 1133 is preferably about 1.0g/10 minutes to 15.0g/10 minutes, and 4.0g/10 minutes to 13.0g/10 minutes. Minutes are more preferred. By setting the MFR of PP within the above range, stable film formation becomes possible.

Vinyl Aromatic Hydrocarbon Resin In the base film for dicing of the present invention, the layer A (resin composition constituting the layer) may contain a vinyl aromatic hydrocarbon resin. In the base film for dicing of the present invention, the vinyl aromatic hydrocarbon-based resin functions as a compatibilizer between the MABS resin and the PO-based resin contained in the A layer.

In the base film for dicing of the present invention, the layer A is a vinyl aromatic hydrocarbon-based resin as a vinyl aromatic hydrocarbon-based resin, a hydrogenated product of a copolymer of a vinyl aromatic hydrocarbon and a conjugated diene hydrocarbon, a vinyl It is preferable to use a copolymer of an aromatic hydrocarbon and a conjugated diene hydrocarbon, a copolymer of a vinyl aromatic hydrocarbon and an aliphatic unsaturated carboxylic acid ester, or the like. It is particularly preferred to use a hydrogenated product of a copolymer with.

As a hydrogenated product of a copolymer of a vinyl aromatic hydrocarbon and a conjugated diene hydrocarbon, a hydrogenated product of a random copolymer of a styrene-based monomer and a diene-based monomer, and a styrene-based monomer and There are hydrogenated products of block copolymers with diene monomers. These are also called hydrogenated random copolymers or hydrogenated block copolymers. A random copolymer is suitable for the base film for dicing of the present invention in terms of flexibility, transparency, and the like.

Specific examples of the hydrogenated random copolymer include _a styrene _- based monomer unit represented by _the formula: -CH( _C6H5 ) _CH2- and a formula: _{-CH2CH2CH2CH2- .} ethylene units and butylene units represented by _the formula: -CH( _C2H5 ) _CH2- are randomly bonded.

The hydrogenated block copolymer has a vinyl aromatic hydrocarbon-derived block segment at one end or both ends of the copolymer, and further has a conjugated diene hydrocarbon-derived block segment, or a blend thereof. A hydrogen additive etc. are mentioned. As a specific example of the block copolymer or hydrogenated block copolymer, at one end _of the copolymer, a block derived from a styrene-based monomer represented by the formula: -CH( _C6H5 ) _CH2- segments, in the middle of which are ethylene units of _the formula _{-CH2CH2CH2CH2- and} /or _butylene units of _the formula -CH( _C2H5 ) _CH2- has a block segment containing The block copolymer or _hydrogenated block _copolymer has, as a specific example, a segment containing an ethylene unit represented by the formula: _{-CH2CH2CH2CH2-} at the other end of the _copolymer .

In the base film for dicing of the present invention, layer A comprises a vinyl aromatic hydrocarbon resin as a vinyl aromatic hydrocarbon resin and a hydrogenated block copolymer as a block copolymer of styrene/ethylene butylene/olefin crystals (SEBC). and styrene-ethylene-butylene-styrene block copolymers (SEBS) are particularly preferred.

The density of the vinyl aromatic hydrocarbon resin (SEBS, etc.) is preferably about 850 Kg/m ³ to 1,100 Kg/m ³ , more preferably about 900 Kg/m ³ to 1,050 Kg/m ³ . The density of the vinyl aromatic hydrocarbon resin is determined according to ISO 1183-1:2004.

The MFR (melt flow rate) of vinyl aromatic hydrocarbon resin (SEBS, etc.) measured at a temperature of 230°C and a load of 21.18N according to ISO 1133 is preferably about 1.0g/10 minutes to 20.0g/10 minutes. About 3.0 g/10 minutes to 15.0 g/10 minutes is more preferable. By setting the MFR of the vinyl aromatic hydrocarbon resin within the above range, stable film formation is possible.

Antistatic Agent In the substrate film for dicing of the present invention, the layer located on the surface (resin composition constituting the layer) such as layer A preferably contains an antistatic agent.

In the base film for dicing of the present invention, since the layer located on the surface contains an antistatic agent, when the semiconductor chip is peeled off, the peeling electrification does not occur and the circuit of the chip is not damaged.

In the base film for dicing of the present invention, it is preferable to use at least one component selected from the group consisting of polyetheresteramide resin (PEEA resin) and hydrophilic polyolefin resin (hydrophilic PO resin) as an antistatic agent. .

The content of the antistatic agent in the layer (in the resin composition constituting the layer) is based on 100 parts by weight of MABS resin and PO resin, or MABS resin, PO resin and vinyl aromatic hydrocarbon About 10 parts by weight to 30 parts by weight is preferable, and about 15 parts by weight to 25 parts by weight is more preferable with respect to 100 parts by weight of the resin. By blending the antistatic agent within the above range, the generated static electricity can be effectively and quickly eliminated without impairing the properties of the film of the present invention.

Polyester ether amide resin (PEEA resin)
A polyether ester amide resin (PEEA resin) is a polymer composed of a polyether ester, which is a main unit component for imparting hydrophilicity, and a polyamide unit. As the PEEA resin, a commercially available one can be used, or it can be easily produced by a known method. Examples of PEEA resins include Perestat NC6321 manufactured by Sanyo Chemical Industries, Ltd., and the like.

A PEEA resin can be produced, for example, by reacting a polydiol component having an ether group in the main chain with a dicarboxylic acid component to convert it into a terminal ester, which is then reacted with an aminocarboxylic acid or a lactam. In the base film for dicing of the present invention, the PEEA resin can be preferably used because it has good compatibility with the acrylic resin and does not cause any phenomenon such as bleeding out.

Hydrophilic polyolefin resin (polyether/polyolefin block copolymer)
In the base film for dicing of the present invention, at least one kind of hydrophilic PO resin (polyether/polyolefin block copolymer), for example, hydrophilic polyethylene (hydrophilic PE), hydrophilic polypropylene (hydrophilic PP), etc. can be preferably used.

Hydrophilic PE and hydrophilic PP resins are basically block-bonded polyethylene or polypropylene chains and polyoxyalkylene chains. Hydrophilic PE and hydrophilic PP can eliminate the accumulation of static electricity because they exhibit high static elimination action. The block bond is formed by an ester group, an amide group, an ether group, a urethane group, or the like. In the base film for dicing of the present invention, the block bond is preferably an ester group or an ether group from the viewpoint of compatibility with the film resin.

Examples of polyether/polyolefin block copolymers include Perestat and Pelectron manufactured by Sanyo Chemical Industries, Ltd.

Resin composition of layer A In the base film for dicing of the present invention, the resin composition of layer A contains a MABS resin, preferably about 5 wt% to 70 wt%, more preferably 10 wt% to 50 wt%. It is more preferable to contain about 15% by weight to 30% by weight.

In the base film for dicing of the present invention, the resin composition of the A layer contains a PO-based resin, preferably about 95% to 30% by weight, more preferably about 90% to 50% by weight, of the PO-based resin. is more preferable, and it is even more preferable to contain about 85% by weight to 70% by weight.

In the base film for dicing of the present invention, the MABS resin and the PO-based resin contained in the A layer have a compounding composition within the above range, so that the generation of cutting waste is suppressed well during dicing, and the diced groove The side of the is not deformed (banked), or the deformation is suppressed satisfactorily.

In the base film for dicing of the present invention, when the resin composition of the layer A further contains a vinyl aromatic hydrocarbon resin (SEBS resin, etc.), the MABS resin is 5% to 70% by weight and the PO resin is 10% by weight. ~90% by weight, preferably containing 5% to 20% by weight of vinyl aromatic hydrocarbon resin, 10% to 50% by weight of MABS resin, 35% to 83% by weight of PO resin, vinyl aromatic It is more preferable to contain about 7% to 15% by weight of hydrocarbon resin, 15% to 30% by weight of MABS resin, 58% to 76% by weight of PO resin, and 9% by weight of vinyl aromatic hydrocarbon resin. % to 12% by weight is more preferable.

(1-2) Layer B In the base film for dicing of the present invention, the layer B is made of a resin composition containing a polyolefin (PO) resin, an ionomer resin, or a vinyl aromatic hydrocarbon resin.

The ionomer resin is a copolymer containing olefin and unsaturated carboxylic acid as structural units. Olefins include ethylene, propylene and the like, and unsaturated carboxylic acids include (meth)acrylic acid, propyl (meth)acrylate, butyl (meth)acrylate, hexyl (meth)acrylate, (meth)acrylic acid, Methacrylic acid alkyl esters such as octyl can be preferably used.

The ionomer resin is a binary copolymer having ethylene and the (meth)acrylic acid as structural units, or a ternary copolymer having ethylene, the (meth)acrylic acid and the (meth)acrylic acid alkyl ester as structural units. polymers. As the ionomer resin, a binary copolymer ionomer resin or a terpolymer ionomer resin in which at least part of the carboxylic acid is neutralized with metal ions can be preferably used.

The metal ions used here include divalent metal ions, trivalent metal ions, and the like. Divalent metal ions include Mg ²⁺ , Ca ²⁺ , Ba ²⁺ , Ni ²⁺ , Zn ²⁺ , Fe ²⁺ , Co ²⁺ , Sn ²⁺ , Pb ²⁺ , Mn ²⁺ and the like. and trivalent metal ions such as Al ³⁺ , Fe ³⁺ , and Cr ³⁺ .

In the base film for dicing of the present invention, the B layer is a layer located next to the A layer and located on the chuck table side. In the base film for dicing of the present invention, the B layer exhibits an effect that it adheres well to the chuck table and the base film for dicing does not move.

In the base film for dicing of the present invention, when the layer B is located on the surface, it preferably contains an antistatic agent.

In the base film for dicing of the present invention, a layer (for example, a C layer) may be provided on the opposite side of the A layer with the B layer interposed therebetween. The C layer is made of a resin composition that can be used in the B layer.

In the base film for dicing of the present invention, when the C layer is located on the surface, it preferably contains an antistatic agent.

In the present invention, the term "layer located on the surface" refers to the outermost layer.

(1-3) Layer structure of base film for dicing The base film for dicing of the present invention is laminated at least in the order of A layer/B layer.

The overall thickness of the base film for dicing of the present invention is preferably about 50 μm to 300 μm, more preferably about 80 μm to 250 μm, even more preferably about 90 μm to 220 μm. By setting the overall thickness of the dicing base film to 50 μm or more, it is possible to protect the semiconductor wafer or semiconductor package from impact when the semiconductor wafer or semiconductor package is diced into chips.

As a specific example of the base film for dicing, a case where the total thickness is about 100 μm to 200 μm will be described.

The thickness of the layer A is preferably about 50 μm to 100 μm, more preferably about 60 μm to 80 μm, even more preferably about 65 μm to 75 μm.

The thickness of the B layer is preferably about 10 μm to 80 μm, more preferably about 20 μm to 60 μm, even more preferably about 30 μm to 50 μm.

(2) Base film for dicing for semiconductor packages The base film for dicing of the present invention is preferably a base film for dicing used in the step of dicing semiconductor packages.

In the process of dicing a semiconductor package, if a conventional dicing film (PP single film, etc.) is used for dicing, chips are likely to be generated and there is a possibility that the package will be contaminated. For example, when a dicing blade is used to dice a semiconductor package with a conventional dicing film, a large amount of chips are generated. In addition, large deformations (banks) were observed on the sides of the diced grooves of the dicing film in those with a large amount of chips. In other words, a phenomenon occurs in which the sides of the groove formed by dicing the dicing film swell. The chips could contaminate the semiconductor package. If the semiconductor package is contaminated, there is a possibility that a pick-up error may occur due to poor conduction, debris being caught, or the like.

The base film for dicing of the present invention is a base film that does not generate chips even when used in the process of dicing semiconductor packages. In addition, the base film for dicing of the present invention is a base film in which the side of the groove obtained by dicing the dicing film is not deformed (bank) or can be deformed to a small degree, and there are few chips.

(3) Manufacturing method of base film for dicing In the present invention, the base film for dicing, which has a three-layer configuration in which at least A layer and B layer are laminated in this order, is obtained by multilayer coextrusion of the resin composition used for each layer of A layer and B layer. It can be manufactured by molding. Specifically, resin compositions for forming each layer can be produced by co-extrusion so that the layers are laminated in the order of A layer/B layer.

The above resins for each layer are supplied to a screw extruder in this order, extruded into a film form from a multi-layer T die at 180 to 240°C, and cooled while being passed through cooling rolls at 30 to 70°C. , withdrawn substantially unstretched. Alternatively, the resin for each layer may be once obtained as pellets and then extruded as described above.

The reason why the film is substantially unstretched at the time of take-off is that there is an advantage in that the film is effectively stretched after dicing. The term "substantially non-stretching" includes non-stretching or slight stretching to the extent that expansion of the dicing film is not adversely affected. Generally, it is enough to stretch the film so that it does not slack when the film is taken over.

(4) Production of dicing film The dicing film of the present invention can be produced according to known techniques. For example, the adhesive constituting the adhesive layer is dissolved in a solvent such as an organic solvent, the resulting solution is applied onto a base film for dicing, and the solvent is removed to obtain a film having a structure of base film/adhesive layer. can be done.

EXAMPLES The present invention will be described in more detail below using examples, but the present invention is not limited to these examples.

(1) Raw material of base film for dicing Table 1 shows the raw material of the base film for dicing.

[Explanation of abbreviation]
PP-1: Polyolefin resin (polypropylene resin)
PP-2: Polyolefin resin (polypropylene resin)
MABS: Methyl methacrylate, acrylonitrile, butadiene, styrene resin
SEBS-1: Vinyl aromatic hydrocarbon resin (block copolymer of styrene, ethylene butylene, and styrene)
SEBS-2: Vinyl aromatic hydrocarbon resin (block copolymer of styrene, ethylene butylene, and styrene)
PE: Polyolefin resin (branched low-density polyethylene)

(2) Manufacture of base film for dicing of A layer/B layer/C layer A resin composition is blended with each component and composition so that it becomes A layer/B layer/C layer (three layers) shown in Table 2. Then, a base film for dicing was produced.

The resin composition constituting each layer is put into each extruder adjusted to 220°C, extruded with a T-die at 220°C in the order of A layer / B layer / C layer, laminated, and 30°C A flat three-layer film was obtained by co-extrusion on a chill roll through which cooling water was circulated.

(3) Evaluation of substrate film for dicing
(3-1) Bank height evaluation <Evaluation method>
When the film is diced, banks are formed on the sides of the formed grooves. The average height of the bank from the substrate layer surface was measured using a laser microscope (VK-X100) manufactured by Keyence Corporation as a measuring means, and evaluated according to the following criteria (Table 3).

<Evaluation Criteria>
◯: The height of the bank from the substrate layer surface is 45 μm or less. The bank height is low, and chips are not generated or the generation of chips is suppressed.
x: The height of the bank from the surface of the substrate layer exceeds 45 μm. Bank height is high and chips are generated.

(3-2) Chip evaluation <Evaluation method>
Using a dicing machine (DAD-2H/6) manufactured by Disco Co., Ltd., the film is cut into the film substrate using the following blades under the conditions of a depth of cut of 40 μm (cut to layer A) from the surface layer. I put it in.

Blade: DISCO Corporation Blade: 40,000rpm
Cutting speed: 100mm/sec Cut size: 5mm square Cut depth: 40μm

<Evaluation Criteria>
Visual evaluation was performed using a microscope (VHX-100) manufactured by Keyence Corporation (Table 3).
◯: There is no shavings like whiskers.
x: There are chips like whiskers.

In the base film for dicing of the present invention, the layer A is made of a resin composition containing a MABS resin and a PO-based resin. It exhibited the effect of not deforming (banking) or suppressing deformation satisfactorily.

The base film for dicing of the present invention can be evaluated that the generation of shavings is well suppressed during dicing, and that the sides of the diced grooves are not deformed (bank) or the deformation is well suppressed.

Claims (4)

A base film for dicing,
The base film for dicing is laminated at least in the order of A layer/B layer,
The A layer is the side to be diced, and is made of a resin composition containing methyl methacrylate-acrylonitrile-butadiene-styrene (MABS) resin and polyolefin resin,
The layer B is made of a resin composition containing a polyolefin resin and/or a vinyl aromatic hydrocarbon resin,
Base film for dicing. 2. The base film for dicing according to claim 1, wherein said layer A further contains a vinyl aromatic resin. 3. The base film for dicing according to claim 1, wherein the layer located on the surface contains an antistatic agent. 4. The base film for dicing according to claim 1, which is used in a step of dicing a semiconductor package.