JP7256799B2 - プロピレンベースポリマーをベースとするホットメルト接着剤組成物及びそれを使用する方法 - Google Patents
プロピレンベースポリマーをベースとするホットメルト接着剤組成物及びそれを使用する方法 Download PDFInfo
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- JP7256799B2 JP7256799B2 JP2020525954A JP2020525954A JP7256799B2 JP 7256799 B2 JP7256799 B2 JP 7256799B2 JP 2020525954 A JP2020525954 A JP 2020525954A JP 2020525954 A JP2020525954 A JP 2020525954A JP 7256799 B2 JP7256799 B2 JP 7256799B2
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Description
本出願は、35U.S.C.§119の下、2017年11月10日に出願された米国特許出願第62/584,412号明細書の利益を主張するものである。
a.半晶質でLMWのSSC-Cryst-PPポリマー;本質的に非晶質でLMWのSSC-Amorp-PPポリマー;及び本質的に非晶質でHMWのSSC-Amorp-PPポリマーを含むポリマー組成物(それらのすべては、好ましくは、SSC触媒を使用することにより調製されたホモポリプロピレン又はプロピレンとα-オレフィンコモノマーとのコポリマーのいずれかである)。シングルサイト触媒によって作成される代替として、本明細書において使用されるポリマーの1つ又は複数は、約1~約4、好ましくは約1.7~約3.3の多分散性指数を有し得る;
b.重量により且つホットメルト接着剤組成物の合計重量を基準にして約15重量%~約75重量%、好ましくは約30%~約65%、最も好ましくは約35%~約60%の量の、共存させることが可能な粘着付与剤;
c.重量により且つホットメルト接着剤組成物の合計重量を基準にして約1%~約35%、好ましくは約2%~約25%、最も好ましくは約3%~約20%の可塑剤;
d.重量により且つホットメルト接着剤組成物の合計重量を基準にして約0.1%~約3%、好ましくは約0.2%~約2%の、安定剤又は抗酸化剤;及び
e.任意選択的に、約0重量%~約20重量%、好ましくは約0重量%~約15重量%のワックス。
(a)ASTM法E28-58Tによって測定されて10℃~150℃の環球式軟化点を有する、脂肪族及び脂環族石油系炭化水素樹脂(後者の樹脂は、主として脂肪族及び/又は脂環族のオレフィン及びジオレフィンからなるモノマーを重合させることにより得られたものである);さらに含まれるのは、水素化された脂肪族及び脂環族石油系炭化水素樹脂である;C5オレフィン留分をベースとする市販されているそのような樹脂の例は、Piccotac 95粘着付与性樹脂(Eastman Chemicals販売)及びEscorez 1310LC(ExxonMobil Chemical Company販売)であり、シクロペンタジエンをベースとする水素化された脂環族石油系炭化水素樹脂の例は、Escorez 5400(Exxonmobil製)及びResinall R1095S(Resinall Corporation製)である;
(b)芳香族石油系炭化水素樹脂及びそれらの水素化誘導体;水素化芳香族炭化水素樹脂の例は、Arkon P-115(Arakawa Chemicals製)である;
(c)脂肪族/芳香族の石油から誘導された炭化水素樹脂及びそれらの水素化誘導体;
(d)芳香族変性脂環族樹脂及びそれらの水素化誘導体;
(e)約10℃~約140℃の軟化点を有するポリテルペン樹脂、後者のポリテルペン樹脂は、一般的には、テルペン炭化水素、例えばピネンとして知られるモノテルペンをフリーデル・クラフツ触媒の存在下において比較的低温で重合させることによって得られたものである;水素化されたポリテルペン樹脂も同様に含まれる;
(f)天然テルペンのコポリマー及びターポリマー、例えばスチレン/テルペン、α-メチルスチレン/テルペン及びビニルトルエン/テルペン;
(g)天然及び変性ロジン、例えば、例としてガムロジン、ウッドロジン、トール油ロジン、蒸留ロジン、水素化ロジン、二量化ロジン及びポリマー化ロジン;
(h)天然及び変性ロジンのグリセロールエステル及びペンタエリスリトールエステル、例えばペールウッドロジンのグリセロールエステル、水素化ロジンのグリセロールエステル、ポリマー化ロジンのグリセロールエステル、ペールウッドロジンのペンタエリスリトールエステル、水素化ロジンのペンタエリスリトールエステル、トール油ロジンのペンタエリスリトールエステル及びロジンのフェノール変性ペンタエリスリトールエステル;及び
(i)フェノール変性テルペン樹脂、例えばテルペン及びフェノールの酸性媒体中での縮合によって得られる樹脂生成物。
1.低分子量(すなわち数平均分子量(Mn)500~6000g/mole)のポリエチレンであって、約0.1~120の、ASTM法D-1321によって測定された硬度値を有し、約65℃~140℃のASTM軟化点を有するポリエチレン;
2.石油ワックス、例えば約50℃~80℃の融点を有するパラフィンワックス及び約55℃~100℃の融点を有する微結晶ワックス(後者の融点は、ASTM法D127-60によって測定される);
3.一酸化炭素と水素とを重合させることによって製造される合成ワックス、例えばフィッシャー・トロプシュワックス;及び
4.ポリオレフィンワックス。本明細書で使用するとき、「ポリオレフィンワックス」という用語は、オレフィン性モノマー単位から構成されるポリマー性又は長鎖のエンティティのものを指す。このタイプの物質は、Westlake Chemical corporation(Houston,Tx)から商品名「Epolene」として、及びHoneywell Corporation(Morristown,NJ)から商品名「A-C」として市販されている。本発明の組成物で使用するのに好ましい物質は、約100℃~170℃の環球式軟化点を有する。理解されるべきあるように、これらのワックス希釈剤のそれぞれは、室温で固体である。
1,3,5-トリメチル-2,4,6-トリス(3-5-ジ-tert-ブチル-4-ヒドロキシベンジル)ベンゼン;
ペンタエリスリトールテトラキス-3(3,5-ジ-tert-ブチル-4-ヒドロキシフェニル)プロピオネート;
n-オクタデシル-3(3,5-ジ-tert-ブチル-4-ヒドロキシフェニル)プロピオネート;
4,4’-メチレンビス(4-メチル-6-tertブチルフェノール);
2,6-ジ-tert-ブチルフェノール;
6-(4-ヒドロキシフェノキシ)-2,4-ビス(n-オクチルチオ)-1,3,5-トリアジン;
2,3,6-トリス(4-ヒドロキシ-3,5-ジ-tert-ブチル-フェノキシ)-1,3,5-トリアジン;
ジ-n-オクタデシル-3,5-ジ-tert-ブチル-4-ヒドロキシベンジルホスホネート;
2-(n-オクチルチオ)エチル-3,5-ジ-tert-ブチル-4-ヒドロキシベンゾエート;及び
ソルビトールヘキサ-3(3,5-ジ-tert-ブチル-4-ヒドロキシ-フェニル)プロピオネート。
1.ホットメルト接着剤において使用するためのポリマー組成物であって、
(a)少なくとも1種の半晶質で低分子量(LMW)のSSCプロピレンベースポリマー;
(b)少なくとも1種の本質的に非晶質で高分子量(HMW)のSSCプロピレンベースポリマー;及び
(c)少なくとも1種の本質的に非晶質でLMWのSSCプロピレンベースポリマー
を含むポリマー組成物。
(a)少なくとも1種の半晶質で低分子量(LMW)のプロピレンベースポリマー;
(b)少なくとも1種の本質的に非晶質で高分子量(HMW)のプロピレンベースポリマー;及び
(c)少なくとも1種の本質的に非晶質でLMWのプロピレンベースポリマー
を含み、前記プロピレンベースポリマーのそれぞれは、約1~約5、好ましくは約1.7~3.3のPDIを有する、ポリマー組成物。
少なくとも1種の本質的に非晶質でHMWのSSCプロピレンベースポリマーは、100,000g/モルより大きい分子量、2~20%(好ましくは8~16%、より好ましくは10~15%)のエチレン及び25J/g未満のDSC溶融エンタルピーを有し;及び
少なくとも1種の本質的に非晶質でLMWのSSCプロピレンベースポリマーは、90,000g/モル未満の分子量、2~20%(好ましくは8~16%、より好ましくは10~15%)のエチレン及び25J/モル未満のDSC溶融エンタルピーを有する、態様1又は2に記載の組成物。
少なくとも1種の本質的に非晶質でHMWのSSCプロピレンベースポリマーは、重量により且つポリマー組成物の合計重量を基準にして約40%~約80%、好ましくは約50%~約70%、最も好ましくは約54%~約65%の量で存在し;及び
少なくとも1種の本質的に非晶質でLMWのSSCプロピレンベースポリマーは、重量により且つポリマー組成物の合計重量を基準にして約5%~約40%、好ましくは約10%~約30%、最も好ましくは約18%~約25%の量で存在する、態様1~4のいずれかに記載の組成物。
(a)少なくとも1種の半晶質でLMWのSSCプロピレンベースポリマー;
(b)少なくとも1種の本質的に非晶質でHMWのSSCプロピレンベースポリマー;
(c)少なくとも1種の本質的に非晶質でLMWのSSCプロピレンベースポリマー;
(d)粘着付与剤;
(e)可塑剤;
(f)安定剤又は抗酸化剤;及び
(g)任意選択的に、約0重量%~約20重量%のワックス
を含むホットメルト接着剤組成物。
(b)少なくとも1種の本質的に非晶質でHMWのSSCプロピレンベースポリマーは、重量により且つホットメルト接着剤組成物の合計重量を基準にして約12%~約40%、好ましくは約15%~約30%、最も好ましくは約18%~約26%の量で存在し;
(c)少なくとも1種の本質的に非晶質でLMWのSSCプロピレンベースポリマーは、重量により且つホットメルト接着剤組成物の合計重量を基準にして約2%~約20%、好ましくは約3%~約15%、最も好ましくは約5%~約12%の量で存在し;
(d)粘着付与剤は、重量により且つホットメルト接着剤組成物の合計重量を基準にして約15%~約75%、好ましくは約30%~約65%、最も好ましくは約35%~約60%の量で存在し:
(e)可塑剤は、重量により且つホットメルト接着剤組成物の合計重量を基準にして約1%~約35%、好ましくは約2%~約25%、最も好ましくは約3%~約20%の量で存在し;及び
(f)安定剤又は抗酸化剤は、重量により且つホットメルト接着剤組成物の合計重量を基準にして約0.1%~約3%、好ましくは約0.2%~約2%の量で存在する、態様6に記載の組成物。
少なくとも1種の本質的に非晶質でHMWのSSCプロピレンベースポリマーは、100,000g/モルより大きい分子量、2~20%のエチレン及び25J/g未満のDSC溶融エンタルピーを有し;及び
少なくとも1種の本質的に非晶質でLMWのSSCプロピレンベースポリマーは、90,000g/モル未満の分子量、2~20%のエチレン及び25J/モル未満のDSC溶融エンタルピーを有する、態様6~14のいずれかに記載の組成物。
溶融状態における、請求項1~15のいずれかに記載のホットメルト接着剤組成物を第一の基材に適用する工程;及び
第二の基材を、第二の基材を接着剤組成物に接触させることによって第一の基材に貼り合わせる工程
の工程を含む方法。
ブルックフィールド粘度は、ASTM D-3236法に従い、162.8℃(325゜F)で試験する。
表1において重量パーセントで示した実施例1~3のホットメルト接着剤は、先に本明細書において説明した成分及び混合手順を用いて調製する。それぞれ合計して2500グラムで作成し、混合は、モーターで駆動されるプロペラ、加熱マントル、温度制御ユニット及び約1ガロンのサイズの容器からなる実験室タイプのミキサー中、窒素雰囲気下において177℃で実施する。HMWのSSC-Amorp-PPポリマーを除いて、表に示した比率に従って計算したそれぞれの成分の適切な量をその容器に添加する。次いで、その容器の温度を上昇させて、内容物を溶融させる。容器中の成分が完全に溶融してから、モーターを起動して、撹拌を始める。次いで、HMWのSSC-Amorp-PPポリマー成分を導入する。ポリマーが完全に溶解して、均質な混合物が形成されるまで混合を続ける。接着剤実施例1~3は、高い凝集力、優れたクリープ抵抗性及び高い剥離強度を示し、加工及び一連の基材での適用に適した粘度を有し、且つ高いクリープ保持率、高い剪断及び高い剥離強度のいずれも必要とされる、不織布衛生物品の多くの用途に特に有用であるが、そのようなものとしては、弾性アタッチメント、ランディングゾーンアタッチメント、ストレッチパネルアタッチメント、ファスナーアタッチメントなどが挙げられるが、それらに限定されるわけではない。
Claims (21)
- ホットメルト接着剤において使用するためのポリマー組成物であって、
(a)第1の低分子量(LMW)のSSCプロプレンベースポリマーであって、少なくとも1種の半晶質であり、90,000g/モル以下の重量平均分子量(Mw)を有する、第1のLMWのSSCプロプレンベースポリマーと、
(b)高分子量(HMW)のSSCプロピレンベースポリマーであって、少なくとも1種の本質的に非晶質であり、100,000g/モルより高いMwを有し、かつ0~30J/gのDSC融解エンタルピーを有する、HMWのSSCプロピレンベースポリマーと、
(c)第2のLMWのSSCプロピレンベースポリマーであって、少なくとも1種の本質的に非晶質であり、90,000g/モル以下の重量平均分子量(Mw)を有し、かつ0~30J/gのDSC融解エンタルピーを有する、第2のLMWのSSCプロピレンベースポリマーと
を含むポリマー組成物。 - 前記第1のLMWのSSCプロピレンベースポリマーは、2%~15%のエチレン、及び35J/gより大きいDSC融解エンタルピーを有し、
前記HMWのSSCプロピレンベースポリマーは、2%~20%のエチレン、及び25J/g未満のDSC融解エンタルピーを有し、かつ
前記第2のLMWのSSCプロピレンベースポリマーは、2%~20%のエチレン、及び25J/g未満のDSC融解エンタルピーを有する
請求項1に記載のポリマー組成物。 - 前記プロピレンベースポリマーのそれぞれは、プロピレンとエチレンとのコポリマーを含む、請求項1に記載のポリマー組成物。
- 前記第1のLMWのSSCプロプレンベースポリマーは、重量により、かつ前記ポリマー組成物の合計重量を基準にして10%~40%の量で存在し、
前記HMWのSSCプロピレンベースポリマーは、重量により、かつ前記ポリマー組成物の合計重量を基準にして40%~80%の量で存在し、
前記第2のLMWのSSCプロピレンベースポリマーは、重量により、かつ前記ポリマー組成物の合計重量を基準にして5%~40%の量で存在する
請求項1に記載のポリマー組成物。 - ホットメルト接着剤組成物であって、
(a)第1の低分子量(LMW)のSSCプロプレンベースポリマーであって、少なくとも1種の半晶質であり、90,000g/モル以下の重量平均分子量(Mw)を有する、第1のLMWのSSCプロプレンベースポリマーと、
(b)高分子量(HMW)のSSCプロピレンベースポリマーであって、少なくとも1種の本質的に非晶質であり、100,000g/モルより高いMwを有し、かつ0~30J/gのDSC融解エンタルピーを有する、HMWのSSCプロピレンベースポリマーと、
(c)第2のLMWのSSCプロピレンベースポリマーであって、少なくとも1種の本質的に非晶質であり、90,000g/モル以下の重量平均分子量(Mw)を有し、かつ0~30J/gのDSC融解エンタルピーを有する、第2のLMWのSSCプロピレンベースポリマーと、
(d)粘着付与剤、
(e)可塑剤、
(f)安定化剤、又は抗酸化剤、及び
(g)任意選択的に、0重量%~20重量%のワックス
を含有するホットメルト接着剤組成物。 - (a)前記第1のLMWのSSCプロプレンベースポリマーは、重量により且つ前記ホットメルト接着剤組成物の合計重量を基準にして、2.5%~25%の量で存在し、
(b)前記HMWのSSCプロピレンベースポリマーは、重量により且つ前記ホットメルト接着剤組成物の合計重量を基準にして、12%~40%の量で存在し、
(c)前記第2のLMWのSSCプロプレンベースポリマーは、重量により且つ前記ホットメルト接着剤組成物の合計重量を基準にして、2%~20%の量で存在し、
(d)前記粘着付与剤は、重量により且つ前記ホットメルト接着剤組成物の合計重量を基準にして、15%~17%の量で存在し、
(e)前記可塑剤は、重量により且つ前記ホットメルト接着剤組成物の合計重量を基準にして、1%~35%の量で存在し、
(f)前記安定化剤又は抗酸化剤は、重量により且つ前記ホットメルト接着剤組成物の合計重量を基準にし、て0.1%~3%の量で存在する
請求項5に記載のホットメルト接着剤組成物。 - 前記粘着付与剤は、脂肪族及び脂環族炭化水素樹脂並びにそれらの水素化誘導体、水素化芳香族炭化水素樹脂、芳香族変性された脂肪族又は脂環族樹脂及びそれらの水素化誘導体、ポリテルペン並びにスチレン化ポリテルペン樹脂からなる群から選択される
請求項5に記載のホットメルト接着剤組成物。 - 前記粘着付与剤は、C-5脂肪族炭化水素樹脂、水素化C-5樹脂、水素化C-9樹脂及び水素化DCPD樹脂である
請求項7に記載のホットメルト接着剤組成物。 - 前記粘着付与剤は、芳香族変性されたC-5樹脂、芳香族変性された水素化DCPD樹脂である
請求項8に記載のホットメルト接着剤組成物。 - 前記可塑剤は、鉱油及び液体ポリブテンからなる群から選択される
請求項5に記載のホットメルト接着剤組成物。 - 前記ワックスは、前記ホットメルト接着剤組成物の合計重量を基準にして20重量%までの量で存在する
請求項5に記載のホットメルト接着剤組成物。 - 前記ポリマー組成物は、別のポリマーをさらに含む
請求項1に記載のポリマー組成物。 - 前記HMWのSSCプロピレンベースポリマーの分子量は、前記第1のLMWのSSCプロプレンベースポリマーの分子量、又は前記第2のLMWのSSCプロプレンベースポリマーの分子量のいずれかの分子量の少なくとも3倍である、請求項1に記載のポリマー組成物。
- 前記第1のLMWのSSCプロプレンベースポリマーは、35J/gより大きいDSC融解エンタルピーを有し、
前記HMWのSSCプロピレンベースポリマーは、2%~20%のエチレン、及び25J/g未満のDSC融解エンタルピーを有し、
前記第2のLMWのSSCプロプレンベースポリマーは、2%~20%のエチレン、及び25J/g未満のDSC融解エンタルピーを有する
請求項5に記載のホットメルト接着剤組成物。 - 前記プロピレンベースポリマーのすべての重量は、前記ホットメルト接着剤組成物の合計重量を基準にして30%~80%を占める、請求項5に記載のホットメルト接着剤組成物。
- 積層品を作成する方法であって、
溶融状態における、請求項1に記載のホットメルト接着剤組成物を第一の基材に適用する工程;及び
第二の基材を、前記第二の基材を前記接着剤組成物に接触させることによって前記第一の基材に貼り合わせる工程
を含む方法。 - 前記第一の基材は、弾性ストランドである、請求項16に記載の方法。
- 前記第一の基材は、不織布である、請求項16に記載の方法。
- 前記第二の基材は、ポリエチレンである、請求項17に記載の方法。
- 請求項16に記載の方法によって作成された積層品。
- ホットメルト接着剤において使用するためのポリマー組成物であって、
(a)第1の低分子量(LMW)のSSCプロプレンベースポリマーであって、少なくとも1種の半晶質であり、90,000g/モル以下の重量平均分子量(Mw)を有する、第1のLMWのSSCプロプレンベースポリマーと、
(b)高分子量(HMW)のSSCプロピレンベースポリマーであって、少なくとも1種の本質的に非晶質であり、100,000g/モルより高いMwを有し、かつ0~30J/gのDSC融解エンタルピーを有する、HMWのSSCプロピレンベースポリマーと、
(c)第2のLMWのSSCプロピレンベースポリマーであって、少なくとも1種の本質的に非晶質であり、90,000g/モル以下の重量平均分子量(Mw)を有し、かつ0~30J/gのDSC融解エンタルピーを有する、第2のLMWのSSCプロピレンベースポリマーと、
を含むポリマー組成物であって、
各々のプロピレンベースポリマーは、1~5の多分散性指数(PDI)を有する、
ポリマー組成物。
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