JP7252603B2 - Thermoelectric conversion module and method for manufacturing thermoelectric conversion module - Google Patents

Description

The present invention relates to a thermoelectric conversion module and a method for manufacturing a thermoelectric conversion module.

A thermoelectric conversion module described in Patent Document 1 includes a flexible substrate. A flexible substrate has a plurality of slits. Therefore, the thermoelectric conversion module 24 easily bends against curved surfaces such as exhaust heat pipes and cooling water pipes. As a result, the thermoelectric conversion module can be easily attached to curved surfaces such as exhaust heat pipes and cooling water pipes.

JP 2016-207995 A

However, in the thermoelectric conversion module described in Patent Literature 1, the plurality of slits extends only in one direction (hereinafter referred to as "direction D"). Therefore, the thermoelectric conversion module can be curved such that the curved surface of the flexible substrate is parallel to the direction D. However, it is difficult for the thermoelectric conversion module to bend such that the curved surface of the flexible substrate is parallel to the direction orthogonal to the direction D.

In other words, the deformation of the thermoelectric conversion module described in Patent Document 1 depends on the direction D in which the slit extends. Therefore, there is a possibility that the desired deformation cannot be achieved.

An object of the present invention is to provide a thermoelectric conversion module that can be flexibly deformed by suppressing the dependence of deformation on a specific direction, and a method for manufacturing the thermoelectric conversion module.

According to one aspect of the present invention, a thermoelectric conversion module includes multiple thermoelectric elements, multiple first substrate elements, multiple first electrodes, and multiple second electrodes. A plurality of first substrate elements are arranged corresponding to the plurality of thermoelectric elements, respectively. A plurality of first electrodes are arranged corresponding to the plurality of thermoelectric elements, respectively. Each of a plurality of second electrodes is positioned opposite the first electrode with respect to the thermoelectric element. The plurality of thermoelectric elements are electrically connected via the plurality of first electrodes and the plurality of second electrodes. In each of the plurality of thermoelectric elements, the first substrate element is positioned on the first electrode. The plurality of thermoelectric elements are spaced apart from each other. The plurality of first electrodes are spaced apart from each other. The plurality of first substrate elements are spaced apart from each other.

The thermoelectric conversion module of the present invention preferably further includes a substrate on which the plurality of second electrodes are arranged. The substrate is preferably a flexible substrate or a stretchable substrate.

Preferably, the thermoelectric conversion module of the present invention further comprises a plurality of second substrate elements. Preferably, a plurality of second substrate elements are arranged respectively corresponding to the plurality of second electrodes and are separated from each other. Preferably, the plurality of second electrodes are respectively arranged on the plurality of second substrate elements.

In the thermoelectric conversion module of the present invention, it is preferable that the thermal conductivity of the second substrate element is higher than that of the synthetic resin.

In the thermoelectric conversion module of the present invention, it is preferable that the thermal conductivity of the first substrate element is higher than that of the synthetic resin.

According to another aspect of the present invention, a method for manufacturing a thermoelectric conversion module having a plurality of thermoelectric elements includes the steps of fabricating a structure, and forming the structure along a second direction that intersects with a first direction. cutting to divide the structure into a plurality of segmented structures; and processing each of the plurality of segmented structures to fabricate each of the plurality of thermoelectric elements. The structure includes a plurality of N-type thermoelectric units, a plurality of P-type thermoelectric units, a plurality of first junctions, and a plurality of second junctions. Each of the N-type thermoelectric units is composed of an N-type thermoelectric material and extends along the first direction. Each of the plurality of P-type thermoelectric units is made of a P-type thermoelectric material and extends along the first direction. Each of the plurality of first joined bodies extends along the first direction. Each of the plurality of second joined bodies extends along the first direction. The N-type thermoelectric units and the P-type thermoelectric units are alternately arranged along the second direction. The first bonded bodies and the second bonded bodies are alternately arranged along the second direction. The first joint body joins the N-type thermoelectric unit and the P-type thermoelectric unit. The second joint joins the P-type thermoelectric unit and the N-type thermoelectric unit.

A method for manufacturing a thermoelectric conversion module according to the present invention includes steps of cutting an N-type semiconductor wafer along the first direction to fabricate the plurality of N-type thermoelectric units; cutting along to fabricate said plurality of P-type thermoelectric units.

A method for manufacturing a thermoelectric conversion module according to the present invention includes steps of bonding an N-type semiconductor wafer and a P-type semiconductor wafer with a bonding body to fabricate a wafer structure; cutting to fabricate a plurality of structural units. Each of the plurality of structure units includes the N-type thermoelectric unit formed by cutting the N-type semiconductor wafer, the P-type thermoelectric unit formed by cutting the P-type semiconductor wafer, and the junction It is preferable to include the first joined body formed by cutting a body. In the structure, it is preferable that the structure units and the second bonded bodies are alternately arranged along the second direction.

It is preferable that the method for manufacturing a thermoelectric conversion module of the present invention further includes the step of forming a first conductor layer on one of a pair of main surfaces of the structure in the third direction. Preferably, the third direction is orthogonal to the first direction and the second direction.

The method for manufacturing a thermoelectric conversion module according to the present invention includes: forming a second conductor layer on the other main surface of the pair of main surfaces of the structure; forming notches along the first direction in a plurality of portions respectively corresponding to the first bonded bodies of the .

ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the thermoelectric conversion module which suppresses that a deformation|transformation depends on a specific direction and can deform|transform flexibly, and a thermoelectric conversion module can be provided.

1 is a perspective view showing a thermoelectric conversion module according to Embodiment 1 of the present invention; FIG. 1 is a plan view showing a thermoelectric conversion module according to Embodiment 1. FIG. 1 is a cross-sectional view showing a thermoelectric conversion module according to Embodiment 1. FIG. 4 is a diagram showing step S1 of the method for manufacturing the thermoelectric conversion module according to Embodiment 1. FIG. 4 is a diagram showing step S2 of the method for manufacturing the thermoelectric conversion module according to Embodiment 1. FIG. 4 is a diagram showing step S3 of the manufacturing method according to Embodiment 1. FIG. 4 is a diagram showing step S4 of the manufacturing method according to Embodiment 1. FIG. 5 is a diagram showing step S5 of the manufacturing method according to Embodiment 1. FIG. 4 is a diagram showing step S6 of the manufacturing method according to Embodiment 1. FIG. 4 is a diagram showing step S7 of the manufacturing method according to Embodiment 1. FIG. 4 is a diagram showing step S8 of the manufacturing method according to Embodiment 1. FIG. 4 is a diagram showing step S9 of the manufacturing method according to Embodiment 1. FIG. 4 is a diagram showing step S10 of the manufacturing method according to Embodiment 1. FIG. 4 is a diagram showing step S11 of the manufacturing method according to Embodiment 1. FIG. 4 is a diagram showing step S12 of the manufacturing method according to Embodiment 1. FIG. 4 is a diagram showing step S13 of the manufacturing method according to Embodiment 1. FIG. 4 is a diagram showing step S14 of the manufacturing method according to Embodiment 1. FIG. 4 is a diagram showing step S15 of the manufacturing method according to Embodiment 1. FIG. 4 is a diagram showing step S16 of the manufacturing method according to Embodiment 1. FIG. 4 is a diagram showing step S17 of the manufacturing method according to Embodiment 1. FIG. 4 is a diagram showing step S18 of the manufacturing method according to Embodiment 1. FIG. 4 is a diagram showing step S19 of the manufacturing method according to Embodiment 1. FIG. 1 is a schematic cross-sectional view showing a thermoelectric conversion module manufactured by a manufacturing method according to Embodiment 1; FIG. 5 is a diagram showing step S51 included in step S5 of the manufacturing method according to Embodiment 1. FIG. 5 is a diagram showing step S52 included in step S5 of the manufacturing method according to Embodiment 1. FIG. FIG. 10 is a diagram showing step S101 of the method for manufacturing a thermoelectric conversion module according to Embodiment 2 of the present invention; FIG. 10 is a diagram showing step S102 of the method for manufacturing a thermoelectric conversion module according to Embodiment 2; FIG. 10 is a diagram showing step S103 of the method for manufacturing a thermoelectric conversion module according to Embodiment 2; FIG. 3 is a cross-sectional view showing a thermoelectric conversion module according to Embodiment 3 of the present invention; (a) And (b) is a figure which shows process S201 of the manufacturing method of the thermoelectric conversion module based on Embodiment 3. FIG. FIG. 10 is a diagram showing step S202 of the manufacturing method according to Embodiment 3; FIG. 10 is a diagram showing step S203 of the manufacturing method according to Embodiment 3; FIG. 10 is a diagram showing step S204 of the manufacturing method according to Embodiment 3; FIG. 10 is a diagram showing step S205 of the manufacturing method according to Embodiment 3; FIG. 11 is a perspective view showing a thermoelectric conversion module according to Embodiment 4 of the present invention; FIG. 11 is a plan view showing a thermoelectric conversion module according to Embodiment 4; FIG. 11 is a cross-sectional view showing a thermoelectric conversion module according to Embodiment 4; FIG. 11 is a cross-sectional view showing step S301 of the method for manufacturing a thermoelectric conversion module according to Embodiment 4; FIG. 5 is a cross-sectional view showing a thermoelectric conversion module according to Embodiment 5 of the present invention;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, description will be made using a three-dimensional orthogonal coordinate system including an X-axis, a Y-axis, and a Z-axis that are orthogonal to each other. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and description thereof will not be repeated. Also, for simplification of the drawings, oblique lines indicating cross sections may be omitted as appropriate.

(Embodiment 1)
A thermoelectric conversion module 100 according to Embodiment 1 of the present invention and a method for manufacturing the thermoelectric conversion module 100 will be described with reference to FIGS. 1 to 25. FIG. The thermoelectric conversion module 100 functions, for example, as a power generation module that converts heat (temperature difference) into electric power.

FIG. 1 is a perspective view showing a thermoelectric conversion module 100 according to Embodiment 1. FIG. FIG. 2 is a plan view showing the thermoelectric conversion module 100. FIG. As shown in FIGS. 1 and 2, the thermoelectric conversion module 100 includes multiple thermoelectric elements 1, multiple first substrate elements 3, and a substrate SB.

A plurality of thermoelectric elements 1 are arranged apart from each other. A plurality of thermoelectric elements 1 are arranged in a matrix, for example. However, the arrangement of the plurality of thermoelectric elements 1 is not particularly limited, and can be changed as appropriate according to the shape of the object to which the thermoelectric conversion module 100 is attached, for example.

Each of the plurality of thermoelectric elements 1 has an N-type thermoelectric element N1, a P-type thermoelectric element P1, and an intermediate body M1. The N-type thermoelectric element N1 is an element made of an N-type thermoelectric material. N-type thermoelectric materials are materials in which electrons are carriers. The N-type thermoelectric element N1 is, for example, an N-type thermoelectric semiconductor element. The P-type thermoelectric element P1 is an element made of a P-type thermoelectric material. A P-type thermoelectric material is a material in which holes are carriers. The P-type thermoelectric element P1 is, for example, a P-type thermoelectric semiconductor element.

As the thermoelectric conversion material, bismuth-tellurium system (Bi-Te system: from normal temperature to about 500K), lead-tellurium system (Pb-Te system: from normal temperature to about 800K), or silicone-germanium system (Si-Ge system: normal temperature to about 1000K) is used. Intermediate M1 is an insulator. The intermediate M1 is arranged between the N-type thermoelectric element N1 and the P-type thermoelectric element P1.

The plurality of first substrate elements 3 are arranged corresponding to the plurality of thermoelectric elements 1, respectively. The plurality of first substrate elements 3 are spaced apart from each other.

FIG. 3 is a cross-sectional view showing the thermoelectric conversion module 100. As shown in FIG. As shown in FIG. 3 , the thermoelectric conversion module 100 further includes multiple first electrodes 5 and multiple second electrodes 7 .

As shown in FIG. 3, the plurality of first electrodes 5 are arranged corresponding to the plurality of thermoelectric elements 1, respectively. The plurality of first electrodes 5 are arranged apart from each other. In each of the plurality of thermoelectric elements 1 a first substrate element 3 is arranged on a first electrode 5 . The surface roughness of the first substrate element 3 is preferably smaller than the surface roughness of the first electrode 5 . In this preferred example, since the surface of the thermoelectric conversion module 100 is smooth, it is convenient for mounting.

The material of the first substrate element 3 is not particularly limited. For example, the material of the first substrate element 3 may be an insulator, an organic material, or an inorganic material. In embodiment 1, the first substrate element 3 is an insulator. For example, the material of the first substrate element 3 is polyimide, which is an insulator and an organic material. Polyimide is an example of a synthetic resin. The thermal conductivity of polyimide is 0.28 to 0.34 [W/m·K] and less than 1.0 [W/m·K].

The material of the first substrate element 3 is preferably a highly thermally conductive material. This is because the temperature difference between both ends of the thermoelectric element 1 can be increased, and the thermoelectric conversion efficiency can be increased. A high thermal conductivity material is a material having a thermal conductivity of 1.0 [W/m·K] or higher. The high thermal conductivity material is preferably a material having a thermal conductivity of 10.0 [W/mK] or higher, and a material having a thermal conductivity of 20.0 [W/mK] or higher. is more preferred.

The thermal conductivity of the first substrate element 3 is preferably higher than that of the synthetic resin. Alternatively, the thermal conductivity of the first substrate element 3 is preferably higher than that of the insulating organic material. In these preferred examples, the temperature difference between both ends of the thermoelectric element 1 can be increased, and the thermoelectric conversion efficiency can be increased. For example, the material of the first substrate element 3 is ceramic. Ceramics are insulators. The ceramic is, for example, an alumina ceramic (eg 92% alumina content) or silicon nitride. The thermal conductivity of alumina ceramic is, for example, 16.0 to 18.0 [W/m·K]. The thermal conductivity of silicon nitride is, for example, 27.0 [W/m·K].

Each of the plurality of second electrodes 7 is arranged on the opposite side of the thermoelectric element 1 from the first electrodes 5 . The plurality of second electrodes 7 are arranged apart from each other. A plurality of second electrodes 7 are formed on the surface of the substrate SB. That is, the plurality of second electrodes 7 are arranged on the substrate SB.

In embodiment 1, the substrate SB is an insulator. For example, the material of the substrate SB is polyimide, which is an insulator and an organic material.

The material of the substrate SB is not particularly limited as long as it is an insulator. For example, the material of the substrate SB may be an organic material or an inorganic material. For example, the material of the substrate SB is polyimide, which is an insulator and an organic material.

The material of the substrate SB is preferably a highly thermally conductive material. This is because the temperature difference between both ends of the thermoelectric element 1 can be increased, and the thermoelectric conversion efficiency can be increased. The thermal conductivity of the substrate SB is preferably higher than that of the synthetic resin. Alternatively, the thermal conductivity of the substrate SB is preferably higher than that of the organic material that is an insulator. In these preferred examples, the temperature difference between both ends of the thermoelectric element 1 can be increased, and the thermoelectric conversion efficiency can be increased.

For example, if the temperature difference TD between the end surface of the thermoelectric element 1 on the first substrate element 3 side and the end surface on the substrate SB side is increased n times, the thermoelectric conversion efficiency can be increased by ⁿ² times. Therefore, by forming the first substrate element 3 and/or the substrate SB from a high thermal conductive material, the temperature difference TD can be increased and the thermoelectric conversion efficiency can be increased. Therefore, the higher the thermal conductivity of the first substrate element 3 and the substrate SB, the better.

For example, if the cooling side of the first substrate element 3 and the substrate SB has m times the thermal conductivity, then m times the cooling efficiency can be achieved. For example, if the heating side of the first substrate element 3 and the substrate SB has m times the thermal conductivity, m times the heating efficiency can be achieved. Therefore, the higher the thermal conductivity of the first substrate element 3 and the substrate SB, the better.

A plurality of thermoelectric elements 1 are electrically connected via a plurality of first electrodes 5 and a plurality of second electrodes 7 . The N-type thermoelectric element N1 has a first N-type end surface FN and a second N-type end surface SN. The second N-type end surface SN faces the first N-type end surface FN. The P-type thermoelectric element P1 has a first P-type end surface FP and a second P-type end surface SP. The second P-type end surface SP faces the first P-type end surface FP.

In each of the thermoelectric elements 1, the first electrode 5 connects the first N-type end surface FN and the first P-type end surface FP. Each of the one or more second electrodes 7 among the plurality of second electrodes 7 is connected to the second N-type end surface SN of one thermoelectric element 1 and the second P-type end surface SN of the other thermoelectric element 1 of the thermoelectric elements 1 adjacent to each other. end face SP.

Each of the multiple second electrodes 7 includes an electrode element 71 and a junction element 73 . Electrode elements 71 are formed on substrate SB. A joining element 73 joins the electrode element 71 to the thermoelectric element 1 . The joining element 73 functions as an electrically conductive electrode. The joining element 73 is made of, for example, a conductive paste.

The distance L2 between the thermoelectric elements 1 adjacent to each other is longer than the distance L1 between the N-type thermoelectric element N1 and the P-type thermoelectric element P1 of the thermoelectric element 1 (that is, the thickness of the intermediate M1). big. For example, the distance L1 is several micrometers to several tens of micrometers, and the distance L2 is, for example, 100 micrometers to several hundred micrometers. A distance L3 between the second electrodes 7 adjacent to each other is preferably longer than the distance L1. This is to avoid conduction between the second N-type end surface SN and the second P-type end surface SP.

As described above with reference to FIGS. 1 to 3, according to Embodiment 1, the plurality of first substrate elements 3 are separated from each other. Therefore, it is possible to prevent the first board element 3 from being mechanically interfered with by another first board element 3 . As a result, the deformation of the thermoelectric conversion module 100 can be suppressed from being dependent on a specific direction, and can be deformed flexibly. If the thermoelectric conversion module 100 can be flexibly deformed, the thermoelectric conversion module 100 can be easily attached to attachment bodies having various shapes. The wearable object is an object or an animal (including humans). Specifically, in the first embodiment, the thermoelectric conversion module 100 is mounted on the mounting body by mounting the substrate SB on the mounting body.

Especially in Embodiment 1, the substrate SB is preferably a flexible substrate or a stretchable substrate. The thermoelectric conversion module 100 can be deformed more flexibly, and the thermoelectric conversion module 100 can be more easily attached to attachment bodies having various shapes. For example, the thermoelectric conversion module 100 can be deformed three-dimensionally. A flexible substrate is a substrate that can bend. A stretchable substrate is a substrate that can be stretched. For similar reasons, the first substrate element 3 is preferably a flexible or stretchable substrate.

Moreover, if the thermoelectric conversion module 100 can be flexibly deformed, there are the following advantages. For example, since the contact area when the thermoelectric conversion module 100 is mounted on the mounting body becomes large, thermoelectric conversion can be effectively performed even when the thermoelectric conversion module 100 is miniaturized. For example, it is possible to easily mount the thermoelectric conversion module 100 on the mounting body while suppressing the restriction by the shape of the mounting body. For example, the thermoelectric conversion module 100 can be wound around a straight pipe, attached to a bent joint (elbow), or attached to a spherical surface. For example, it is suitable for wearable devices. For example, the mechanical reliability of the thermoelectric conversion module 100 can be improved. For example, the thermoelectric conversion module 100 can be easily attached to animals other than humans. For example, the thermoelectric conversion module 100 can be used as a power source for grazing livestock management or a power source for animal ecology management.

Further, the thermoelectric conversion module 100 can be used not only for converting thermal energy into electrical energy, but also for converting electrical energy into thermal energy.

Next, an example of a method for manufacturing the thermoelectric conversion module 100 will be described with reference to FIGS. 4 to 23. FIG. 4 to 22 are diagrams showing a method of manufacturing the thermoelectric conversion module 100. FIG. FIG. 23 is a schematic cross-sectional view showing the thermoelectric conversion module 100 manufactured by the manufacturing method according to Embodiment 1. FIG. As shown in FIGS. 4 to 22, the method for manufacturing the thermoelectric conversion module 100 includes steps S1 to S19.

As shown in FIG. 4, in step S1, an N-type semiconductor wafer WN is prepared. In Embodiment 1, the N-type semiconductor wafer WN is substantially disc-shaped.

As shown in FIG. 5, in step S2, the dicing blade DB cuts the N-type semiconductor wafer WN along the first direction D1 to fabricate a plurality of N-type thermoelectric units 11N. Each of the plurality of N-type thermoelectric units 11N is substantially strip-shaped and extends along the first direction D1. Each of the plurality of N-type thermoelectric units 11N is made of an N-type thermoelectric material. In Embodiment 1, each of the plurality of N-type thermoelectric units 11N is made of an N-type semiconductor material.

As shown in FIG. 6, in step S3, a P-type semiconductor wafer WP is prepared. In Embodiment 1, the P-type semiconductor wafer WP is substantially disc-shaped.

As shown in FIG. 7, in step S4, a dicing blade DB cuts the P-type semiconductor wafer WP along the first direction D1 to fabricate a plurality of P-type thermoelectric units 11P. Each of the plurality of P-type thermoelectric units 11P is substantially strip-shaped and extends along the first direction D1. Each of the plurality of P-type thermoelectric units 11P is made of a P-type thermoelectric material. In Embodiment 1, each of the plurality of P-type thermoelectric units 11P is made of a P-type semiconductor material.

As shown in FIG. 8, in step S5, a structure 13 is produced. The structure 13 includes a plurality of N-type thermoelectric units 11N, a plurality of P-type thermoelectric units 11P, a plurality of first junctions B1, and a plurality of second junctions B2.

In the structure 13, each of the multiple N-type thermoelectric units 11N extends along the first direction D1. In the structure 13, each of the plurality of P-type thermoelectric units 11P extends along the first direction D1. In the structure 13, the multiple first bonded bodies B1 extend along the first direction D1. In the structure 13, the multiple second bonded bodies B2 extend along the first direction D1.

In the structure 13, the N-type thermoelectric units 11N and the P-type thermoelectric units 11P are alternately arranged along the second direction D2. The second direction D2 crosses the first direction D1. In Embodiment 1, the second direction D2 is substantially orthogonal to the first direction D1. In the structure 13, the first bonded bodies B1 and the second bonded bodies B2 are alternately arranged along the second direction D2. In the structure 13, the first joint B1 joins the N-type thermoelectric unit 11N and the P-type thermoelectric unit 11P. In the structure 13, the second joint B2 joins the P-type thermoelectric unit 11P and the N-type thermoelectric unit 11N.

As described with reference to FIGS. 5, 7, and 8, in the first embodiment, the N-type thermoelectric unit 11N and the P-type thermoelectric unit 11P are produced in steps S2 and S4 before step S5. do. Therefore, in step S5, the structure 13 can be easily produced.

As shown in FIG. 9 , in step S<b>6 , the dicing blade DB cuts the structure 13 along the second direction D<b>2 to divide the structure 13 into a plurality of divided structures 15 .

As shown in FIG. 10 , in step S<b>7 , each of the plurality of divided structures 15 is processed to fabricate each of the plurality of thermoelectric elements 1 . In the thermoelectric element 1, the N-type thermoelectric element N1 is composed of part of the N-type thermoelectric unit 11N. In the thermoelectric element 1, the P-type thermoelectric element P1 is composed of a part of the P-type thermoelectric unit 11P. In the thermoelectric element 1, the intermediate M1 is made up of part of the first joint B1.

As described with reference to FIGS. 8 to 10, in Embodiment 1, since each of the plurality of thermoelectric elements 1 is manufactured after the structural bodies 13 and the divided structural bodies 15 are manufactured, the N-type thermoelectric elements and the P-type thermoelectric elements are manufactured. A plurality of thermoelectric elements 1 can be produced in a short period of time as compared with the case where each type thermoelectric element is individually produced to produce thermoelectric elements one by one. For example, in Embodiment 1, since the completed thermoelectric element 1 can be mounted on the substrate SB, compared with the case where the N-type thermoelectric element and the P-type thermoelectric element are separately mounted on the substrate and the thermoelectric elements are manufactured one by one. to double the mount speed.

Specifically, the first bonded body B1 has a high bonding strength and is an insulator. The first bonded body B1 is made of, for example, a bonding agent. The components and properties of the first conjugate B1 are different from those of the second conjugate B2. The second bonded body B2 is made of, for example, a bonding agent. The second bonded body B2 is melted by heat, light, or solvent. The first bonded body B1 is not melted by heat, light, and solvent that melt the second bonded body B2.

Therefore, in step S7, the second bonded bodies B2 are removed from each of the plurality of split structures 15 using heat, light, or a solvent that only melts the second bonded bodies B2. As a result, only the thermoelectric element 1 is separated from each of the multiple divided structures 15 .

For example, the melting point of the first bonded body B1 is higher than the melting point of the second bonded body B2. For example, the first bonded body B1 is not melted by UV irradiation, but the second bonded body B2 is melted by UV irradiation. For example, the first assembly B1 is insoluble in a specific solvent (eg acetone), but the second assembly B2 is soluble in a specific solvent (eg acetone). For example, the first bonded body B1 is composed of an inorganic bonding agent, and the second bonded body B2 is composed of an organic bonding agent. In this case, the first joined body B1 does not dissolve in an organic solvent (eg acetone), but the second joined body B2 dissolves in an organic solvent (eg acetone).

As shown in FIG. 11, in step S8, a plurality of thermoelectric elements 1 are temporarily arranged on the temporary substrate SBX.

On the other hand, as shown in FIG. 12, a thermal foaming adhesive film 23 is adhered onto the glass substrate 21 in step S9. In addition, instead of the thermal foaming adhesive film 23, for example, a UV peeling tape may be used.

As shown in FIG. 13, in step S10, the plurality of thermoelectric elements 1 temporarily arranged on the temporary substrate SBX in step S8 are adhered to the thermal foaming adhesive film . As a result, the unit UT1 is produced.

On the other hand, as shown in FIG. 14, a substrate SB is prepared in step S11. A plurality of electrode elements 71 are formed on the substrate SB so as to be separated from each other.

On the other hand, as shown in FIG. 15, a thermal foaming adhesive film 27 is adhered onto the glass substrate 25 in step S12. Then, the substrate SB prepared in step S11 is adhered onto the thermal foaming adhesive film 27. As shown in FIG. In addition, it may replace with the heat foaming adhesive film 27, and may use UV peeling tape, for example.

As shown in FIG. 16, in step S13, a conductive paste 29 is applied to each of the plurality of electrode elements 71 formed on the substrate SB. As a result, the unit UT2 is produced. A joining element 73 is constituted by the conductive paste 29 .

As shown in FIG. 17, in step S14, the unit UT1 produced in step S10 is turned upside down and attached to the unit UT2 produced in step S13. As a result, a unit UT3 is produced. Then, the unit UT3 is heated to sinter the conductive paste 29, and the thermoelectric element 1 and the electrode element 71 are joined via the conductive paste 29.

As shown in FIG. 18, in step S15, the glass substrate 21 and the thermal foaming adhesive film 23 are separated from the plurality of thermoelectric elements 1. As shown in FIG. As a result, a unit UT4 is produced. Since the adhesive force of the thermally foamable adhesive film 23 is weakened by the heating in step S14, the glass substrate 21 and the thermally foamable adhesive film 23 can be easily separated from the plurality of thermoelectric elements 1. FIG.

On the other hand, as shown in FIG. 19, a thermal foaming adhesive film 33 is adhered onto the glass substrate 31 in step S16. Then, the substrate 35 is adhered onto the thermal foaming adhesive film 33 . Furthermore, a conductive paste 37 is applied to the substrate 35 . As a result, a unit UT5 is produced. The conductive paste 37 constitutes the first electrode 5 . In addition, instead of the thermal foaming adhesive film 33, for example, a UV peeling tape may be used.

As shown in FIG. 20, in step S17, the unit UT5 produced in step S16 is turned upside down and attached to the unit UT4 produced in step S15. As a result, a unit UT6 is produced. Then, the unit UT6 is heated to sinter the conductive paste 37, and the thermoelectric element 1 and the conductive paste 29 as the first electrode 5 are joined.

As shown in FIG. 21, the glass substrate 31 and the thermal foaming adhesive film 33 are separated from the substrate 35 in step S18. Since the adhesive force of the thermally foamable adhesive film 33 is weakened by the heating in step S17, the glass substrate 31 and the thermally foamable adhesive film 33 can be easily separated from the substrate 35. FIG.

As shown in FIG. 22, in step S19, the substrate 35 is cut by the laser LR. Further, the glass substrate 25 and the thermal foaming adhesive film 27 are separated from the substrate SB by heating.

As a result, the thermoelectric conversion module 100 is completed as shown in FIG. The first substrate element 3 is formed by the substrate 35 after cutting shown in FIG.

Next, step S5 shown in FIG. 8 will be described with reference to FIGS. 24 and 25. FIG. FIG. 24 is a diagram showing step S51 included in step S5 shown in FIG. FIG. 25 is a diagram showing step S52 included in step S5 shown in FIG.

As shown in FIG. 24, in step S51, a first joining jig 40 is prepared. The first joining jig 40 includes a jig body 41 and a cap 43 . The jig body 41 includes multiple recesses 410 . Each of the recesses 410 includes a first groove 411 , a second groove 413 and a protrusion 415 . The convex portion 415 is arranged between the first groove portion 411 and the second groove portion 413 . The N-type thermoelectric unit 11N manufactured in step S2 of FIG. 5 is attached to the first groove portion 411 . On the other hand, the P-type thermoelectric unit 11P manufactured in step S4 of FIG. 7 is attached to the second groove portion 413 .

Then, the cap 43 is attached to the jig main body 41 . Therefore, the convex portion 431 of the cap 43 is inserted between the N-type thermoelectric unit 11N and the P-type thermoelectric unit 11P. As a result, a space SP1 is formed between the N-type thermoelectric unit 11N and the P-type thermoelectric unit 11P.

Then, a first bonding agent for forming a first bonded body B1 is injected into the space SP1 between the N-type thermoelectric unit 11N and the P-type thermoelectric unit 11P. Therefore, the N-type thermoelectric unit 11N and the P-type thermoelectric unit 11P are bonded by the first bonding agent without contacting each other. As a result, the structure unit 45 is produced. Although the jig main body 41 has two recesses 410 in FIG. 24 , it may have three or more recesses 410 to produce three or more structure units 45 .

As shown in FIG. 25, in step S52, a second joining jig 50 is prepared. The second joining jig 50 includes a jig body 51 and a cap 53 . The jig body 51 includes a plurality of first grooves 511 and a plurality of second grooves 513 . Then, the N-type thermoelectric unit 11N of the structure unit 45 is attached to the first groove portion 511. As shown in FIG. The P-type thermoelectric unit 11P of the structural unit 45 is attached to the second groove portion 513. As shown in FIG.

Then, the cap 53 is attached to the jig main body 51 . Therefore, the convex portion 533 of the cap 53 is inserted between the N-type thermoelectric unit 11N and the P-type thermoelectric unit 11P. As a result, a space SP2 is formed between the N-type thermoelectric unit 11N of one structural unit 45 and the P-type thermoelectric unit 11P of the other structural unit 45 of the adjacent structural units 45. FIG.

Then, a second bonding agent for forming a second bonding body B2 is injected into the space SP2 between the N-type thermoelectric unit 11N and the P-type thermoelectric unit 11P. Therefore, the N-type thermoelectric unit 11N and the P-type thermoelectric unit 11P are bonded by the second bonding agent without contacting each other. As a result, the structure 13 is produced. In FIG. 25 , the jig main body 51 has the structure 13 made from the four structural units 45 , but the structure 13 may be made from two or five or more structural units 45 .

(Embodiment 2)
A thermoelectric conversion module 100 according to Embodiment 2 of the present invention and a method for manufacturing the thermoelectric conversion module 100 will be described with reference to FIGS. 26 to 28. FIG. Embodiment 2 differs from Embodiment 1 mainly in that the structure unit 45 is manufactured by a process different from the process S51 shown in FIG. In the following, differences of the second embodiment from the first embodiment will be mainly described.

The configuration of the thermoelectric conversion module 100 according to the second embodiment is the same as the configuration of the thermoelectric conversion module 100 according to the first embodiment described with reference to FIGS. 1 to 3. FIG.

26 to 28 are diagrams showing part of the method for manufacturing the thermoelectric conversion module 100 according to the second embodiment.

As shown in FIG. 26, in step S101, an N-type semiconductor wafer WN, a P-type semiconductor wafer WP, and a bonded body B11 are prepared. The joined body B11 has a plurality of slits 85. As shown in FIG. A plurality of slits 85 are substantially parallel to each other. A plurality of slits 85 are arranged at predetermined intervals. The joined body B11 is formed of, for example, a film. For example, the joined body B11 is a die attach film. The shape and size of the N-type semiconductor wafer WN, the P-type semiconductor wafer WP, and the bonded body B11 are not particularly limited and may not be the same.

As shown in FIG. 27, in step S102, the N-type semiconductor wafer WN and the P-type semiconductor wafer WP are bonded with a bonding body B11. As a result, a wafer structure WC is produced.

As shown in FIG. 28, in step S103, the dicing blade DB cuts the wafer structure WC along the first direction D1 to fabricate a plurality of structure units 45. As shown in FIG. Specifically, the dicing blade DB cuts the wafer structures WC along the first direction D1 so as to pass through the slits 85 to fabricate the plurality of structure units 45 . Both ends of the structure unit 45 (corresponding to the outer edge of the wafer structure WC) are cut off, and the shape of the structure unit 45 is adjusted.

Each of the plurality of structural body units 45 includes an N-type thermoelectric unit 11N, a P-type thermoelectric unit 11P, and a first junction B1. The N-type thermoelectric unit 11N is formed by cutting an N-type semiconductor wafer WN. That is, the N-type thermoelectric unit 11N is configured by part of the N-type semiconductor wafer WN. The P-type thermoelectric unit 11P is formed by cutting a P-type semiconductor wafer WP. That is, the P-type thermoelectric unit 11P is configured by part of the P-type semiconductor wafer WP. The first joined body B1 is formed by cutting the joined body B11. That is, the first joined body B1 is configured by a part of the joined body B11.

In step S52 of FIG. 25, the structure 13 is generated using the plurality of structure units 45 fabricated in step S103 of FIG. As shown in FIG. 25, in the structural body 13, the structural body units 45 and the second bonded bodies B2 are alternately arranged along the second direction D2.

Note that the joined body B11 ( FIG. 26 ) does not have to have the plurality of slits 85 . In this case, similarly to step S103 (FIG. 28), the dicing blade DB cuts the wafer structures WC along the first direction D1 to fabricate a plurality of structure units 45. FIG.

As described above with reference to FIGS. 26 to 28, according to the second embodiment, a plurality of structure units 45 can be manufactured at high speed by manufacturing and cutting wafer structures WC.

(Embodiment 3)
A thermoelectric conversion module 100A according to Embodiment 3 of the present invention and a method for manufacturing the thermoelectric conversion module 100A will be described with reference to FIGS. Embodiment 3 differs from Embodiment 1 mainly in that Embodiment 3 performs metallization. In the following, differences of the third embodiment from the first embodiment will be mainly described.

FIG. 29 is a cross-sectional view showing a thermoelectric conversion module 100A according to Embodiment 3. FIG. As shown in FIG. 29, the thermoelectric conversion module 100A includes a plurality of thermoelectric elements 1, a plurality of first substrate elements 3, a plurality of first electrodes 5A, a plurality of second electrodes 7A, and a substrate SB. .

A step ST1 is formed between the first end surface 81 of the intermediate M1 and the first N-type end surface FN of the N-type thermoelectric element N1. A step ST1 is formed between the first end surface 81 of the intermediate M1 and the first P-type end surface FP of the P-type thermoelectric element P1. On the other hand, a step ST2 is formed between the second end surface 82 of the intermediate M1 and the second N-type end surface SN of the N-type thermoelectric element N1. A step ST2 is formed between the second end surface 82 of the intermediate M1 and the second P-type end surface SP of the P-type thermoelectric element P1. The step ST1 and the step ST2 are substantially equal. In addition, in Embodiment 1, Embodiment 2, and Embodiment 4 which will be described later, the step ST1 and the step ST2 may or may not be provided.

The second electrode 7A further includes an electrode element 74 in addition to the configuration of the second electrode 7 of Embodiment 1 described with reference to FIG. Electrode element 74 has sides 740 . A side portion 740 of the electrode element 74 corresponding to the P-type thermoelectric element P1 is formed along the wall surface of the P-type thermoelectric element P1 within a range equal to or less than the step ST2. A side portion 740 of the electrode element 74 corresponding to the N-type thermoelectric element N1 is formed along the wall surface of the N-type thermoelectric element N1 within a range equal to or less than the step ST2.

Electrode element 74 and electrode element 71 are joined by joining element 73 . The joining element 73 has a rib portion 730 . Rib portion 730 joins the outer surface of side portion 740 of electrode element 74 . As a result, according to the third embodiment, the rib portion 730 can reinforce the P-type thermoelectric element P1 and the N-type thermoelectric element N1. As a result, the reliability of the thermoelectric conversion module 100A can be further improved.

The thermoelectric element 1 has a notch NC. Adjacent electrode elements 74 are separated from each other by notches NC. That is, the notch NC separates the second electrodes 7A adjacent to each other. Therefore, the second electrodes 7A adjacent to each other are not electrically connected.

Next, an example of a method for manufacturing the thermoelectric conversion module 100A will be described with reference to FIGS. 30(a) to 34 are diagrams showing a method of manufacturing the thermoelectric conversion module 100A.

As shown in FIG. 30(a), in step S201, a structure 13A is produced. The structure 13A is fabricated in the same manner as in step S51 shown in FIG. 24 and step S52 shown in FIG.

As shown in FIG. 30(b), in step S201, a step ST1 and a step ST2 are formed. The step ST1 is formed between one of the first end face 811 of the first joined body B1 and the first end face 815 of the second joined body B2 forming the intermediate body M1 and the P-type thermoelectric unit forming the P-type thermoelectric element P1. 11P and the first end surface 611 of the N-type thermoelectric unit 11N constituting the N-type thermoelectric element N1. The step ST1 is the same as the step ST1 shown in FIG.

The step ST2 is formed between either the second end face 821 of the first joined body B1 or the second end face 825 of the second joined body B2 forming the intermediate body M1 and the P-type thermoelectric unit forming the P-type thermoelectric element P1. 11P and the second end surface 631 of the N-type thermoelectric unit 11N constituting the N-type thermoelectric element N1. The step ST2 is the same as the step ST2 shown in FIG.

As shown in FIG. 31, in step S202, the first conductor layer MT1 is formed on one main surface US of the pair of main surfaces US and LS of the structure 13A in the third direction D3. The third direction D3 is substantially orthogonal to the first direction D1 and the second direction D2. A second conductor layer MT2 is formed on the other main surface LS of the pair of main surfaces US and LS of the structure 13A.

Specifically, in step S202, the first conductor layer MT1 is formed on the main surface US by sputtering. For example, the main surface US is metallized by sputtering. Also, the second conductor layer MT2 is formed on the main surface LS by sputtering. For example, the main surface LS is metallized by sputtering.

As shown in FIG. 32, in step S203, the dicing blade DB cuts the structure 13A along the second direction D2 to divide the structure 13A into a plurality of divided structures 15A.

As shown in FIG. 33, in step S204, the dicing blade DB is oriented in the first direction D1 (FIG. 32) to the plurality of portions PR corresponding to the plurality of first bonded bodies B1 of the second conductor layer MT2. A notch NC is formed along the . Note that in FIG. 33, the divided structure 15A manufactured in step S203 of FIG. 32 is upside down.

Also, the second bonded bodies B2 are removed from each of the plurality of divided structures 15A using heat, light, or a solvent that only melts the second bonded bodies B2. As a result, only the thermoelectric element 1 is separated from each of the multiple divided structures 15A. Since the first conductor layer MT1 and the second conductor layer MT2 are thin, the first conductor layer MT1 and the second conductor layer MT2 are easily separated when the second bonded body B2 is removed. be.

As shown in FIG. 34, in step S205, a plurality of thermoelectric elements 1 are temporarily arranged on the temporary substrate SBX. The first electrode 5A is formed by the first conductor layer MT1. The N-type thermoelectric element N1 is formed by an N-type thermoelectric unit 11N. The P-type thermoelectric element P1 is formed by a P-type thermoelectric unit 11P. The intermediate M1 is formed by the first bonded body B1. The electrode element 74 is formed by the second conductor layer MT2.

The thermoelectric conversion module 100A can be manufactured from a plurality of temporarily arranged thermoelectric elements 1 in the same manner as steps S9 to S19 shown in FIGS. Further, the thermoelectric conversion module 100A may be manufactured by mounting a plurality of temporarily arranged thermoelectric elements 1 on the substrate SB and disposing a plurality of the first substrate elements 3 on the plurality of first electrodes 5A. .

As described above with reference to FIGS. 30 to 34, according to the third embodiment, the first electrode 5A can be easily and quickly formed by forming and cutting the first conductor layer MT1 on the structure 13A. (FIG. 29) can be produced.

Further, in the third embodiment, by forming the second conductor layer MT2 in the structure 13A to form the notch NC, the second electrodes 7A (FIG. 29) adjacent to each other can be easily and easily separated.

(Embodiment 4)
A thermoelectric conversion module 100B according to Embodiment 4 of the present invention and a method for manufacturing the thermoelectric conversion module 100B will be described with reference to FIGS. Embodiment 4 mainly differs from Embodiment 1 in that it has a plurality of second substrate elements 10 . Differences of the fourth embodiment from the first embodiment will be mainly described below.

35 is a perspective view showing a thermoelectric conversion module 100B according to Embodiment 4. FIG. FIG. 36 is a plan view showing the thermoelectric conversion module 100A. FIG. 37 is a cross-sectional view showing the thermoelectric conversion module 100A. As shown in FIGS. 35 to 37, the thermoelectric conversion module 100B includes a plurality of second substrate elements 10 instead of the substrate SB of the thermoelectric conversion module 100 of Embodiment 1 described with reference to FIG. The plurality of second substrate elements 10 are arranged corresponding to the plurality of second electrodes 7, respectively. The plurality of second substrate elements 10 are separated from each other. In other words, there are gaps GP between the plurality of second substrate elements 10 . A plurality of second electrodes 7 are arranged on a plurality of second substrate elements 10 respectively.

The material of the second substrate element 10 is not particularly limited. As the material of the second substrate element 10, the same material as the material of the first substrate element 3 according to the first embodiment can be used. For the same reason that the first substrate element 3 preferably has a higher thermal conductivity, the second substrate element 10 preferably has a higher thermal conductivity.

As described above with reference to FIGS. 35 to 37, according to the fourth embodiment, in addition to the plurality of first substrate elements 3 being separated from each other, the plurality of second substrate elements 10 are separated from each other. isolated. Therefore, it is possible to prevent the first board element 3 from being mechanically interfered by other first board elements 3 and the second board element 10 from being mechanically interfered by other second board elements 10. . As a result, the deformation of the thermoelectric conversion module 100B can be further suppressed from being dependent on a specific direction, and can be deformed more flexibly. The thermoelectric conversion module 100B according to Embodiment 4 can be deformed more flexibly than the thermoelectric conversion module 100 according to Embodiment 1, so that the thermoelectric conversion module 100B can be more easily attached to attachment bodies having various shapes. Specifically, in the fourth embodiment, the thermoelectric conversion module 100B is mounted on the mounting body by mounting the plurality of first board elements 3 or the plurality of second board elements 10 on the mounting body.

Next, an example of a method for manufacturing the thermoelectric conversion module 100B will be described with reference to FIG. FIG. 38 is a diagram showing part of the method for manufacturing the thermoelectric conversion module 100B. As shown in FIG. 38, in step S301, the substrate SB is cut along cut lines CL by a dicing blade DB or laser. As a result, a plurality of second substrate elements 10 are produced. Step S301 is performed, for example, after step S11 shown in FIG. 14 and before step S12 shown in FIG. For example, after the thermoelectric conversion module 100 shown in FIG. 23 is produced, the substrate SB is cut along the cut lines CL (FIG. 38) with a dicing blade DB or laser to produce a plurality of second substrate elements 10. You may

(Embodiment 5)
A thermoelectric conversion module 100C according to Embodiment 5 of the present invention will be described with reference to FIG. Embodiment 5 mainly differs from Embodiment 3 in that it has a plurality of second substrate elements 10 . In the following, differences of the fifth embodiment from the third embodiment will be mainly described.

39 is a cross-sectional view showing a thermoelectric conversion module 100C according to Embodiment 5. FIG. As shown in FIG. 39, a thermoelectric conversion module 100C includes a plurality of second substrate elements 10 similar to those of the fourth embodiment instead of the substrate SB of the thermoelectric conversion module 100A according to the third embodiment described with reference to FIG. Prepare. Therefore, in the fifth embodiment, as in the fourth embodiment, the deformation of the thermoelectric conversion module 100C can be further suppressed from being dependent on a specific direction, and can be deformed more flexibly.

The embodiments of the present invention have been described above with reference to the drawings. However, the present invention is not limited to the above-described embodiments, and can be embodied in various aspects without departing from the scope of the invention. Also, the plurality of constituent elements disclosed in the above embodiments can be modified as appropriate. For example, some of all the components shown in one embodiment may be added to the components of another embodiment, or some configurations of all the components shown in one embodiment may be added. Elements may be deleted from the embodiment.

In addition, the drawings schematically show each component mainly for easy understanding of the invention, and the thickness, length, number, spacing, etc. It may be different from the actual one due to the convenience of Further, the configuration of each component shown in the above embodiment is an example and is not particularly limited, and it goes without saying that various modifications are possible within a range that does not substantially deviate from the effects of the present invention. . Moreover, the order of each step in the manufacturing method may be changed as appropriate, and some of the steps may be omitted without departing from the gist of the present invention.

For example, the order of steps S1 and S2 shown in FIGS. 4 and 5 and steps S3 and S4 shown in FIGS. 6 and 7 may be reversed. For example, the order of steps S9 and S10 shown in FIGS. 12 and 13 and steps S11 to S13 shown in FIGS. 14 to 16 may be reversed. For example, the order of steps S9 to S15 shown in FIGS. 12 to 18 and step S16 shown in FIG. 19 may be reversed. For example, in step S202 shown in FIG. 31, either one of the first conductor layer MT1 and the second conductor layer MT2 may be formed.

INDUSTRIAL APPLICABILITY The present invention provides a thermoelectric conversion module and a method for manufacturing a thermoelectric conversion module, and has industrial applicability.

1 thermoelectric element 3 first substrate element 5 first electrode 7 second electrode 10 second substrate element 11N N-type thermoelectric unit 11P P-type thermoelectric unit 13, 13A structure 15, 15A divided structure SB substrate B1 first joint B2 Second bonded body WN N-type semiconductor wafer WP P-type semiconductor wafer WC Structure unit MT1 First conductor layer MT2 Second conductor layer NC Notch 100, 100A, 100B, 100C Thermoelectric conversion module

Claims (10)

a plurality of thermoelectric elements;
a plurality of first substrate elements respectively arranged corresponding to the plurality of thermoelectric elements;
a plurality of first electrodes respectively arranged corresponding to the plurality of thermoelectric elements;
a plurality of second electrodes, each positioned on an opposite side of the thermoelectric element from the first electrode;
The plurality of thermoelectric elements are electrically connected via the plurality of first electrodes and the plurality of second electrodes,
In each of the plurality of thermoelectric elements, the first substrate element is disposed on the first electrode;
the plurality of thermoelectric elements are spaced apart from each other;
the plurality of first electrodes are spaced apart from each other;
the plurality of first substrate elements are spaced apart from each other;
each of the plurality of thermoelectric elements includes an N-type thermoelectric element and a P-type thermoelectric element spaced apart from the N-type thermoelectric element by a first distance;
In each of the plurality of thermoelectric elements, the N-type thermoelectric element and the P-type thermoelectric element are electrically connected to two different second electrodes among the plurality of second electrodes,
the two second electrodes are spaced apart by a second distance that is greater than the first distance ;
further comprising a substrate having a first major surface and a second major surface opposite the first major surface;
The thermoelectric conversion module , wherein the plurality of second electrodes are arranged on the first principal surface and no conductor is arranged on the second principal surface . 2. The thermoelectric conversion module according to claim 1, wherein said substrate is a flexible substrate or a stretchable substrate. further comprising a plurality of second substrate elements arranged respectively corresponding to the plurality of second electrodes and spaced apart from each other;
2. The thermoelectric conversion module according to claim 1, wherein said plurality of second electrodes are respectively arranged on said plurality of second substrate elements. 4. The thermoelectric conversion module according to claim 3, wherein thermal conductivity of said second substrate element is higher than thermal conductivity of synthetic resin. The thermoelectric conversion module according to any one of claims 1 to 4, wherein thermal conductivity of said first substrate element is higher than thermal conductivity of synthetic resin. A method for manufacturing a thermoelectric conversion module comprising a plurality of thermoelectric elements,
creating a structure;
cutting the structure along a second direction crossing the first direction to divide the structure into a plurality of divided structures;
processing each of the plurality of segmented structures to fabricate each of the plurality of thermoelectric elements;
The structure is
a plurality of N-type thermoelectric units each made of an N-type thermoelectric material and extending along the first direction;
a plurality of P-type thermoelectric units each made of a P-type thermoelectric material and extending along the first direction;
a plurality of first joined bodies each extending along the first direction;
a plurality of second joined bodies each extending along the first direction;
the N-type thermoelectric units and the P-type thermoelectric units are alternately arranged along the second direction;
the first bonded bodies and the second bonded bodies are alternately arranged along the second direction;
the first joint body joins the N-type thermoelectric unit and the P-type thermoelectric unit;
The method of manufacturing a thermoelectric conversion module, wherein the second joined body joins the P-type thermoelectric unit and the N-type thermoelectric unit. cutting an N-type semiconductor wafer along the first direction to fabricate the plurality of N-type thermoelectric units;
7. The method of manufacturing a thermoelectric conversion module according to claim 6, comprising cutting a P-type semiconductor wafer along said first direction to fabricate said plurality of P-type thermoelectric units. a step of bonding an N-type semiconductor wafer and a P-type semiconductor wafer with a bonded body to fabricate a wafer structure;
cutting the wafer structure along the first direction to fabricate a plurality of structure units,
each of the plurality of structure units,
the N-type thermoelectric unit formed by cutting the N-type semiconductor wafer;
the P-type thermoelectric unit formed by cutting the P-type semiconductor wafer;
and the first joined body formed by cutting the joined body,
7. The method of manufacturing a thermoelectric conversion module according to claim 6, wherein in said structure, said structure units and said second joined bodies are alternately arranged along said second direction. further comprising forming a first conductor layer on one of a pair of main surfaces of the structure in a third direction;
The method of manufacturing a thermoelectric conversion module according to any one of claims 6 to 8, wherein said third direction is orthogonal to said first direction and said second direction. forming a second conductor layer on the other main surface of the pair of main surfaces of the structure;
The thermoelectric conversion according to claim 9, further comprising the step of forming cutouts along the first direction in a plurality of portions of the second conductor layer respectively corresponding to the plurality of first joined bodies. How the module is manufactured.

Images