JP7250616B2 - Thermosetting composition containing polythiol compound - Google Patents
Thermosetting composition containing polythiol compound Download PDFInfo
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- JP7250616B2 JP7250616B2 JP2019095396A JP2019095396A JP7250616B2 JP 7250616 B2 JP7250616 B2 JP 7250616B2 JP 2019095396 A JP2019095396 A JP 2019095396A JP 2019095396 A JP2019095396 A JP 2019095396A JP 7250616 B2 JP7250616 B2 JP 7250616B2
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- polybutadiene
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- 239000000203 mixture Substances 0.000 title claims description 52
- 229920001187 thermosetting polymer Polymers 0.000 title claims description 52
- 150000001875 compounds Chemical class 0.000 title claims description 21
- 229920006295 polythiol Polymers 0.000 title claims description 18
- 229920002857 polybutadiene Polymers 0.000 claims description 53
- 239000005062 Polybutadiene Substances 0.000 claims description 52
- 239000004925 Acrylic resin Substances 0.000 claims description 11
- 229920000178 Acrylic resin Polymers 0.000 claims description 11
- 238000001723 curing Methods 0.000 description 34
- 230000000977 initiatory effect Effects 0.000 description 14
- -1 thiol compound Chemical class 0.000 description 11
- 239000000126 substance Substances 0.000 description 7
- JOBBTVPTPXRUBP-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS JOBBTVPTPXRUBP-UHFFFAOYSA-N 0.000 description 6
- 239000011342 resin composition Substances 0.000 description 6
- 239000007983 Tris buffer Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 4
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 4
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 125000003396 thiol group Chemical group [H]S* 0.000 description 4
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 229920000058 polyacrylate Polymers 0.000 description 3
- 229920000193 polymethacrylate Polymers 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 1
- HNHFTARXTMQRCF-UHFFFAOYSA-N 1,3,5-tris(3-sulfanylpropyl)-1,3,5-triazinane-2,4,6-trione Chemical compound SCCCN1C(=O)N(CCCS)C(=O)N(CCCS)C1=O HNHFTARXTMQRCF-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- IMQFZQVZKBIPCQ-UHFFFAOYSA-N 2,2-bis(3-sulfanylpropanoyloxymethyl)butyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(CC)(COC(=O)CCS)COC(=O)CCS IMQFZQVZKBIPCQ-UHFFFAOYSA-N 0.000 description 1
- OXBLVCZKDOZZOJ-UHFFFAOYSA-N 2,3-Dihydrothiophene Chemical compound C1CC=CS1 OXBLVCZKDOZZOJ-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- QSOFJLDXOMMNNK-UHFFFAOYSA-N 2-(hydroxymethyl)-2-methylpropane-1,3-diol 3-sulfanylbutanoic acid Chemical compound CC(S)CC(O)=O.CC(S)CC(O)=O.CC(S)CC(O)=O.OCC(C)(CO)CO QSOFJLDXOMMNNK-UHFFFAOYSA-N 0.000 description 1
- SPSNALDHELHFIJ-UHFFFAOYSA-N 2-[(1-cyano-1-cyclopropylethyl)diazenyl]-2-cyclopropylpropanenitrile Chemical compound C1CC1C(C)(C#N)N=NC(C)(C#N)C1CC1 SPSNALDHELHFIJ-UHFFFAOYSA-N 0.000 description 1
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 1
- YIJYFLXQHDOQGW-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis(2-prop-2-enoyloxyethyl)-1,3,5-triazinan-1-yl]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCN1C(=O)N(CCOC(=O)C=C)C(=O)N(CCOC(=O)C=C)C1=O YIJYFLXQHDOQGW-UHFFFAOYSA-N 0.000 description 1
- AGEXUCKZTAUZJM-UHFFFAOYSA-N 2-[4,6-bis[2-(2-methylprop-2-enoyloxy)ethyl]-1,3,5-triazin-2-yl]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC1=NC(CCOC(=O)C(C)=C)=NC(CCOC(=O)C(C)=C)=N1 AGEXUCKZTAUZJM-UHFFFAOYSA-N 0.000 description 1
- WBEKRAXYEBAHQF-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;3-sulfanylbutanoic acid Chemical compound CC(S)CC(O)=O.CC(S)CC(O)=O.CC(S)CC(O)=O.CCC(CO)(CO)CO WBEKRAXYEBAHQF-UHFFFAOYSA-N 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- 238000006596 Alder-ene reaction Methods 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- LELOWRISYMNNSU-UHFFFAOYSA-N Hydrocyanic acid Natural products N#C LELOWRISYMNNSU-UHFFFAOYSA-N 0.000 description 1
- 239000004609 Impact Modifier Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- JUDXBRVLWDGRBC-UHFFFAOYSA-N [2-(hydroxymethyl)-3-(2-methylprop-2-enoyloxy)-2-(2-methylprop-2-enoyloxymethyl)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(CO)(COC(=O)C(C)=C)COC(=O)C(C)=C JUDXBRVLWDGRBC-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- VTLHIRNKQSFSJS-UHFFFAOYSA-N [3-(3-sulfanylbutanoyloxy)-2,2-bis(3-sulfanylbutanoyloxymethyl)propyl] 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCC(COC(=O)CC(C)S)(COC(=O)CC(C)S)COC(=O)CC(C)S VTLHIRNKQSFSJS-UHFFFAOYSA-N 0.000 description 1
- YAAUVJUJVBJRSQ-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2-[[3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propoxy]methyl]-2-(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS YAAUVJUJVBJRSQ-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- BXIQXYOPGBXIEM-UHFFFAOYSA-N butyl 4,4-bis(tert-butylperoxy)pentanoate Chemical compound CCCCOC(=O)CCC(C)(OOC(C)(C)C)OOC(C)(C)C BXIQXYOPGBXIEM-UHFFFAOYSA-N 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- SPTHWAJJMLCAQF-UHFFFAOYSA-M ctk4f8481 Chemical compound [O-]O.CC(C)C1=CC=CC=C1C(C)C SPTHWAJJMLCAQF-UHFFFAOYSA-M 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000012796 inorganic flame retardant Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000005634 peroxydicarbonate group Chemical group 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- SUVIGLJNEAMWEG-UHFFFAOYSA-N propane-1-thiol Chemical compound CCCS SUVIGLJNEAMWEG-UHFFFAOYSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
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- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は、ポリブタジエンとポリチオール化合物を含有する熱硬化性組成物に関する。 The present invention relates to thermosetting compositions containing polybutadiene and polythiol compounds.
ポリブタジエンを含む熱硬化性組成物は、熱硬化することにより、耐水性、耐熱性、絶縁性、基材との密着性などに優れた硬化物を製造することができる。そのため、電子材料の封止材用途、防湿コーティング用途、絶縁膜用途などの幅広い分野で利用されている。 A thermosetting composition containing polybutadiene can be thermally cured to produce a cured product excellent in water resistance, heat resistance, insulation, adhesion to a substrate, and the like. Therefore, it is used in a wide range of fields such as sealing materials for electronic materials, moisture-proof coatings, and insulating films.
ポリブタジエンを含む様々な硬化性組成物が提案されている。例えば、特許文献１では、エポキシ基とウレタン構造を有するポリブタジエン樹脂、及びチオール系硬化剤を含有する樹脂組成物であって、樹脂組成物の固形分全体を１００質量％とした場合、エポキシ基とウレタン構造を有するポリブタジエン樹脂が５０～９５質量％であることを特徴とする樹脂組成物が提案されている。この樹脂組成物は低温硬化性、柔軟性、印刷性に優れるようである。 Various curable compositions containing polybutadiene have been proposed. For example, in Patent Document 1, a resin composition containing a polybutadiene resin having an epoxy group and a urethane structure, and a thiol-based curing agent, when the total solid content of the resin composition is 100% by mass, the epoxy group and There has been proposed a resin composition characterized by containing 50 to 95% by mass of a polybutadiene resin having a urethane structure. This resin composition seems to be excellent in low-temperature curability, flexibility and printability.
特許文献２では、アクリル樹脂と、チオール化合物と、潜在性硬化剤と、ラジカル重合禁止剤と、アニオン重合抑制剤と、２つ以上の２重結合を有するアクリル樹脂以外の化合物を含有する光及び加熱硬化性樹脂組成物が提案されている。また、２つ以上の２重結合を有するアクリル樹脂以外の化合物としては、ポリブタジエンであってもよいことが記載されている。この硬化性樹脂組成物は、十分に長いポットライフを有するようである。 In Patent Document 2, an acrylic resin, a thiol compound, a latent curing agent, a radical polymerization inhibitor, an anionic polymerization inhibitor, and a compound other than an acrylic resin having two or more double bonds. A thermosetting resin composition has been proposed. Moreover, it is described that the compound other than the acrylic resin having two or more double bonds may be polybutadiene. This curable resin composition appears to have a sufficiently long pot life.
従来から知られている熱硬化性組成物は、熱硬化の際に高温を必要とする場合があった。また、十分に熱硬化するまでに長時間かかってしまう場合があった。そのため、より低い温度で、または、より短い時間で硬化することができる熱硬化性組成物が求められていた。 Conventionally known thermosetting compositions sometimes require high temperatures for thermosetting. In addition, it may take a long time to sufficiently heat-cure. Therefore, a thermosetting composition that can be cured at a lower temperature or in a shorter time has been desired.
本発明者らは、上記した課題を解決するために鋭意検討を重ねた結果、ポリブタジエン（Ａ）と、ポリチオール化合物（Ｂ）と、熱ラジカル発生剤（Ｃ）と、を含む熱硬化性組成物を見出し、本発明を完成するに至った。 The present inventors have made intensive studies to solve the above problems, and as a result, a thermosetting composition containing a polybutadiene (A), a polythiol compound (B), and a thermal radical generator (C) and completed the present invention.
即ち、本発明は、以下の発明に関する。
（１）ポリブタジエン（Ａ）と、ポリチオール化合物（Ｂ）と、熱ラジカル発生剤（Ｃ）と、を含む熱硬化性組成物（ただし、前記熱硬化性組成物は、実質的にアクリル樹脂（Ｄ）を含まない）。
（２）ポリブタジエン（Ａ）１００重量部に対し、ポリチオール化合物（Ｂ）を０．１～１０重量部含有する（１）に記載の熱硬化性組成物。
（３）ポリブタジエン（Ａ）が、式（Ｉ）で表される繰り返し単位と式（II）で表される繰り返し単位からなり、主鎖および末端が変性されていないポリブタジエンである（１）または（２）に記載の熱硬化性組成物。
（５）ポリブタジエン（Ａ）の数平均分子量（Ｍｎ）が５００～１０，０００である（１）～（４）のいずれか１つに記載の熱硬化性組成物。
（６）（１）～（５）のいずれか１つに記載の熱硬化性組成物を硬化してなる硬化物。
That is, the present invention relates to the following inventions.
(1) A thermosetting composition containing polybutadiene (A), a polythiol compound (B), and a thermal radical generator (C) (wherein the thermosetting composition is substantially an acrylic resin (D ) does not include).
(2) The thermosetting composition according to (1), which contains 0.1 to 10 parts by weight of the polythiol compound (B) per 100 parts by weight of the polybutadiene (A).
(3) The polybutadiene (A) consists of repeating units represented by the formula (I) and repeating units represented by the formula (II), and the main chain and ends are unmodified polybutadiene (1) or ( 2) The thermosetting composition as described in 2).
(5) The thermosetting composition according to any one of (1) to (4), wherein the polybutadiene (A) has a number average molecular weight (Mn) of 500 to 10,000.
(6) A cured product obtained by curing the thermosetting composition according to any one of (1) to (5).
本発明の熱硬化性組成物は、低温硬化性に優れる。また、本発明の熱硬化性組成物は、ポリチオール化合物を含まない組成物よりも硬化時間を短縮することができる。また、本発明の熱硬化性組成物を熱硬化した硬化物は、ポリチオール化合物を含まない組成物を熱硬化した硬化物よりも最大弾性率が向上する。 The thermosetting composition of the present invention is excellent in low-temperature curability. Moreover, the thermosetting composition of the present invention can shorten the curing time as compared with a composition not containing a polythiol compound. In addition, a cured product obtained by thermosetting the thermosetting composition of the present invention has a higher maximum elastic modulus than a cured product obtained by thermosetting a composition containing no polythiol compound.
（熱硬化性組成物）
本発明の熱硬化性組成物は、ポリブタジエン（Ａ成分）と、ポリチオール化合物（Ｂ成分）と、熱ラジカル発生剤（Ｃ成分）を含有するものである。各成分の含有量は特に限定されないが、ポリブタジエン（Ａ）１００重量部に対し、ポリチオール化合物（Ｂ）の含有量を０．１～１０重量部、０．５～１０重量部、０．５～５重量部から選択することができる。熱硬化性組成物において、ポリチオール化合物（Ｂ）は架橋剤として機能するが、その他の機能を奏してもよい。また、ポリブタジエン（Ａ）１００重量部に対し、熱ラジカル発生剤（Ｃ）の含有量を０．１～１０重量部、０．５～１０重量部、０．５～５重量部、１～５重量部から選択することができる。
(Thermosetting composition)
The thermosetting composition of the present invention contains polybutadiene (component A), a polythiol compound (component B), and a thermal radical generator (component C). The content of each component is not particularly limited. It can be selected from 5 parts by weight. In the thermosetting composition, the polythiol compound (B) functions as a cross-linking agent, but may also have other functions. Further, the content of the thermal radical generator (C) is 0.1 to 10 parts by weight, 0.5 to 10 parts by weight, 0.5 to 5 parts by weight, 1 to 5 parts by weight with respect to 100 parts by weight of polybutadiene (A). You can choose from parts by weight.
（ポリブタジエン（Ａ））
本発明の熱硬化性組成物に含まれるポリブタジエンは、ブタジエンを重合した高分子化合物であれば、特に限定されない。すなわち、本発明で用いるポリブタジエンは、式（Ｉ）で表される繰り返し単位と式（II）で表される繰り返し単位からなる。
ポリブタジエン中に含まれる式（Ｉ）で表される繰り返し単位と式（II）で表される繰り返し単位の割合は特に限定されないが、ポリブタジエンの全繰り返し単位中、式（Ｉ）で表される繰り返し単位の割合が７５～９９モル％であるのが好ましい。
(Polybutadiene (A))
Polybutadiene contained in the thermosetting composition of the present invention is not particularly limited as long as it is a polymer compound obtained by polymerizing butadiene. That is, the polybutadiene used in the present invention consists of repeating units represented by formula (I) and repeating units represented by formula (II).
The ratio of the repeating unit represented by formula (I) and the repeating unit represented by formula (II) contained in polybutadiene is not particularly limited, but the repeating unit represented by formula (I) in all the repeating units of polybutadiene The proportion of units is preferably 75 to 99 mol %.
本発明で用いるポリブタジエンの分子量は特に限定されないが、数平均分子量（Ｍｎ）が、５００～１０，０００、５００～８，０００、５００～６，０００、５００～５，０００の範囲を選択することができる。なお、重量平均分子量（Ｍｗ）および数平均分子量（Ｍｎ）は、テトラヒドロフランを溶媒とするゲルパーミエーションクロマトグラフィー（ＧＰＣ）にて測定したデータを標準ポリスチレンの分子量に基づいて換算した値である。 The molecular weight of the polybutadiene used in the present invention is not particularly limited, but the number average molecular weight (Mn) should be selected in the range of 500 to 10,000, 500 to 8,000, 500 to 6,000, 500 to 5,000. can be done. The weight average molecular weight (Mw) and number average molecular weight (Mn) are values obtained by converting data measured by gel permeation chromatography (GPC) using tetrahydrofuran as a solvent based on the molecular weight of standard polystyrene.
ポリブタジエンは、主鎖および末端が変性されたポリブタジエンであってもよいし、主鎖および末端が変性されていないポリブタジエンであってもよい。それらのうち、高い絶縁性を有する硬化物を得るという観点からは、主鎖および末端が変性されていないポリブタジエンを用いるのが好ましい。 The polybutadiene may be a polybutadiene with a modified main chain and terminals, or may be a polybutadiene with an unmodified main chain and terminals. Among them, it is preferable to use polybutadiene whose main chain and terminals are not modified from the viewpoint of obtaining a cured product having high insulating properties.
ポリブタジエンとしては、市販品を用いることができる。市販品のポリブタジエンとしては、ＮＩＳＳＯ－ＰＢ Ｂ－１０００（日本曹達（株）製）、ＮＩＳＳＯ－ＰＢ Ｂ－２０００（日本曹達（株）製）、ＮＩＳＳＯ－ＰＢ Ｂ－３０００（日本曹達（株）製）などを挙げることができる。これらのポリブタジエンは、１種単独でまたは２種以上を組み合わせて使用することができる。 A commercial item can be used as polybutadiene. Examples of commercially available polybutadiene include NISSO-PB B-1000 (manufactured by Nippon Soda Co., Ltd.), NISSO-PB B-2000 (manufactured by Nippon Soda Co., Ltd.), and NISSO-PB B-3000 (manufactured by Nippon Soda Co., Ltd.). ) and the like. These polybutadienes can be used singly or in combination of two or more.
（ポリチオール化合物（Ｂ））
本発明の熱硬化性組成物に含まれるポリチオール化合物は、分子内に２個以上のメルカプト基（－ＳＨで表される基）を有する限り特に限定されないが、２～１０個のメルカプト基を有するポリチオール化合物が好ましく、３～５個のメルカプト基を有するポリチオール化合物がより好ましい。複数のメルカプト基が、ポリブタジエン中の二重結合とチオール・エン反応をおこすことにより、架橋構造が形成される。
ポリチオール化合物として、具体的には、トリス－［（３－メルカプトプロピオニルオキシ）－エチル］－イソシアヌレート（ＴＥＭＰＩＣ）、トリメチロールエタントリス（３－メルカプトブチレート）、トリメチロールプロパントリス（３－メルカプトプロピオネート）（ＴＭＭＰ）、トリメチロールプロパントリス（３－メルカプトブチレート）、ペンタエリスリトールテトラキス（３－メルカプトプロピオネート）（ＰＥＭＰ）、ペンタエリスリトール テトラキス(３－メルカプトブチレート)、ジペンタエリスリトールヘキサキス（３－メルカプトプロピオネート）、トリス(３－メルカプトプロピル)イソシアヌレート、トリス（３－メルカプトブチルオキシエチル）イソシアヌレートなどを挙げることができる。これらは、１種単独でまたは２種以上を組み合わせて使用することができる。
(Polythiol compound (B))
The polythiol compound contained in the thermosetting composition of the present invention is not particularly limited as long as it has two or more mercapto groups (groups represented by —SH) in the molecule, and has 2 to 10 mercapto groups. Polythiol compounds are preferred, and polythiol compounds having 3 to 5 mercapto groups are more preferred. Multiple mercapto groups undergo a thiol-ene reaction with double bonds in polybutadiene to form a crosslinked structure.
Specific examples of polythiol compounds include tris-[(3-mercaptopropionyloxy)-ethyl]-isocyanurate (TEMPIC), trimethylolethane tris (3-mercaptobutyrate), trimethylolpropane tris (3-mercaptopropane (TMMP), trimethylolpropane tris (3-mercaptobutyrate), pentaerythritol tetrakis (3-mercaptopropionate) (PEMP), pentaerythritol tetrakis (3-mercaptobutyrate), dipentaerythritol hexakis (3-mercaptopropionate), tris(3-mercaptopropyl)isocyanurate, tris(3-mercaptobutyloxyethyl)isocyanurate and the like. These can be used individually by 1 type or in combination of 2 or more types.
（熱ラジカル発生剤（Ｃ））
熱ラジカル発生剤としては、特に限定されない。熱ラジカル発生剤は市販品を用いることができる。熱ラジカル開始剤として、具体的には、ジイソプロピルベンゼンハイドロパーオキサイド（パークミルＰ）、クメンハイドロパーオキサイド（パークミルＨ）、ｔ－ブチルハイドロパーオキサイド（パーブチルＨ）等のハイドロパーオキサイド類や、α，α－ビス（ｔ－ブチルペルオキシ－ｍ－イソプロピル）ベンゼン（パーブチルＰ）、ジクミルパーオキサイド（パークミルＤ）、２，５－ジメチル－２，５－ビス（ｔ－ブチルパーオキシ）ヘキサン（パーヘキサ２５Ｂ）、ｔ－ブチルクミルパーオキサイド（パーブチルＣ）、ジ－ｔ－ブチルパーオキサイド（パーブチルＤ）、２，５－ジメチル－２，５－ビス（ｔ－ブチルパーオキシ）ヘキシン－３（パーヘキシン２５Ｂ）、ｔ－ブチルパーオキシ－２－エチルヘキサノエート（パーブチルＯ）等のジアルキルパーオキサイド類や、ケトンパーオキサイド類や、ｎ－ブチル ４，４－ジ－（ｔ－ブチルパーオキシ）バレレート（パーヘキサＶ）等のパーオキシケタール類や、ジアシルパーオキサイド類や、パーオキシジカーボネート類や、パーオキシエステル類等の有機過酸化物や、２，２’－アゾビスイソブチルニトリル、１，１’－（シクロヘキサンー１－１カルボニトリル）、２，２’－アゾビス（２－シクロプロピルプロピオニトリル）、２，２’－アゾビス（２，４－ジメチルバレロニトリル）等のアゾ化合物等などを挙げることができる。これらは、１種単独でまたは２種以上を組み合わせて使用することができる。
(Thermal radical generator (C))
The thermal radical generator is not particularly limited. A commercially available product can be used as the thermal radical generator. Specific examples of thermal radical initiators include hydroperoxides such as diisopropylbenzene hydroperoxide (Permyl P), cumene hydroperoxide (Permyl H), t-butyl hydroperoxide (Perbutyl H), and α, α-bis(t-butylperoxy-m-isopropyl)benzene (perbutyl P), dicumyl peroxide (percumyl D), 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane (perhexa 25B) ), t-butyl cumyl peroxide (Perbutyl C), di-t-butyl peroxide (Perbutyl D), 2,5-dimethyl-2,5-bis(t-butylperoxy)hexyne-3 (Perhexyne 25B) , dialkyl peroxides such as t-butylperoxy-2-ethylhexanoate (perbutyl O), ketone peroxides, n-butyl 4,4-di-(t-butylperoxy) valerate (perhexa V) and other peroxyketals, diacyl peroxides, peroxydicarbonates, organic peroxides such as peroxyesters, 2,2′-azobisisobutylnitrile, 1,1′- (cyclohexane-1-1 carbonitrile), 2,2′-azobis(2-cyclopropylpropionitrile), 2,2′-azobis(2,4-dimethylvaleronitrile), etc. can be done. These can be used individually by 1 type or in combination of 2 or more types.
（アクリル樹脂（Ｄ））
本発明の熱硬化性組成物は、実質的にアクリル樹脂を含まないものが好ましい。本発明において、「実質的に含まない」とは、アクリル樹脂としての物性が影響するほどの量を含まないという意味であり、影響を与えない程度の微量であれば含んでいてもよいことを意味する。
本発明において、アクリル樹脂とは、アクリル酸エステルモノマー及び／ 又はメタクリル酸エステルモノマーあるいはこれらのオリゴマーのことを意味する。アクリル樹脂として具体的には、トリス（２－ヒドロキシエチル）イソシアヌレートのジアクリレート及び／又はジメタクリレート；トリス（２－ヒドロキシエチル）イソシアヌレートトリアクリレート及び／又はトリメタクリレート；トリメチロールプロパントリアクリレート及び／又はトリメタクリレート、又はそのオリゴマー；ペンタエリスリトールトリアクリレート及び／又はトリメタクリレート、又はそのオリゴマー；ジペンタエリスリトールのポリアクリレート及び／又はポリメタクリレート；トリス（アクリロキシエチル）イソシアヌレート；カプロラクトン変性トリス（アクリロキシエチル）イソシアヌレート；カプロラクトン変性トリス（メタクリロキシエチル）イソシアヌレート；アルキル変性ジペンタエリスリトールのポリアクリレート及び／又はポリメタクリレート；カプロラクトン変性ジペンタエリスリトールのポリアクリレート及び／又はポリメタクリレート等を挙げることができる。これらを、１種単独で用いた場合だけでなく２種以上を組み合わせて用いた場合も、「アクリル樹脂」に包含する。
(Acrylic resin (D))
The thermosetting composition of the present invention preferably contains substantially no acrylic resin. In the present invention, "substantially free" means that it does not contain an amount that affects the physical properties of the acrylic resin. means.
In the present invention, the acrylic resin means acrylic acid ester monomers and/or methacrylic acid ester monomers or oligomers thereof. Specific examples of acrylic resins include tris(2-hydroxyethyl) isocyanurate diacrylate and/or dimethacrylate; tris(2-hydroxyethyl) isocyanurate triacrylate and/or trimethacrylate; trimethylolpropane triacrylate and/or or trimethacrylate, or its oligomer; pentaerythritol triacrylate and/or trimethacrylate, or its oligomer; polyacrylate and/or polymethacrylate of dipentaerythritol; tris(acryloxyethyl) isocyanurate; caprolactone-modified tris(acryloxyethyl ) isocyanurate; caprolactone-modified tris(methacryloxyethyl) isocyanurate; alkyl-modified dipentaerythritol polyacrylate and/or polymethacrylate; caprolactone-modified dipentaerythritol polyacrylate and/or polymethacrylate. These are included in the "acrylic resin" not only when they are used singly but also when they are used in combination of two or more.
（その他の成分）
本発明の熱硬化性組成物は、ポリブタジエン（Ａ）と、ポリチオール化合物（Ｂ）と、熱ラジカル発生剤（Ｃ）に加えて、本発明の目的を損なわない範囲でその他の成分を含有してもよい。前記のその他の成分としては、例えば、フィラー、有機樹脂（シリコーン樹脂、エポキシ樹脂、フッ素樹脂など）、溶剤、安定化剤（酸化防止剤、紫外線吸収剤、耐光安定剤など）、難燃剤（リン系難燃剤、ハロゲン系難燃剤、無機系難燃剤など）、難燃助剤、補強材、滑剤、ワックス、可塑剤、離型剤、耐衝撃性改良剤、色相改良剤、流動性改良剤、着色剤（染料、顔料など）、分散剤、消泡剤、脱泡剤、抗菌剤、防腐剤、粘度調整剤、増粘剤等を挙げることができる。これらは、１種を単独で、又は２種以上を組み合わせて使用することができる。
(other ingredients)
The thermosetting composition of the present invention contains, in addition to the polybutadiene (A), the polythiol compound (B) and the thermal radical generator (C), other components within a range that does not impair the object of the present invention. good too. Examples of the other components include fillers, organic resins (silicone resins, epoxy resins, fluorine resins, etc.), solvents, stabilizers (antioxidants, ultraviolet absorbers, light stabilizers, etc.), flame retardants (phosphorus flame retardants, halogen flame retardants, inorganic flame retardants, etc.), flame retardant aids, reinforcing materials, lubricants, waxes, plasticizers, release agents, impact modifiers, color modifiers, fluidity modifiers, Coloring agents (dyes, pigments, etc.), dispersants, antifoaming agents, defoaming agents, antibacterial agents, preservatives, viscosity modifiers, thickeners and the like can be mentioned. These can be used individually by 1 type or in combination of 2 or more types.
本発明の熱硬化性組成物を製造する方法としては特に限定されない。例えば、ポリブタジエン（Ａ）に、ポリチオール化合物（Ｂ）と熱ラジカル発生剤（Ｃ）を添加した後、混練機で混練する方法を挙げることができる。 The method for producing the thermosetting composition of the present invention is not particularly limited. For example, a method of adding the polythiol compound (B) and the thermal radical generator (C) to the polybutadiene (A) and then kneading the mixture with a kneader can be used.
本発明の熱硬化性組成物は、一般的な熱硬化性組成物の硬化方法により、硬化物とすることができる。 The thermosetting composition of the present invention can be cured by a general curing method for thermosetting compositions.
以下実施例を用いて本発明をさらに詳細に説明するが、本発明は実施例の範囲に限定されるものではない。 EXAMPLES The present invention will be described in more detail below using examples, but the present invention is not limited to the scope of the examples.
実施例１
ポリブタジエン１（ＮＩＳＳＯ－ＰＢ、Ｂ－３０００）（日本曹達（株）製）１００重量部と、トリメチロールプロパントリス（３－メルカプトプロピオネート）（ＴＭＭＰ）（東京化成工業（株）製）１重量部と、ジクミルパーオキサイド（ＤＣＰ）２重量部を、スクリュー管に入れ、自転公転攪拌機で撹拌し、熱硬化性組成物を得た。得られた熱硬化性組成物について、レオメーターを用いてレオロジー特性を測定した。温度条件は８０℃から２００℃まで昇温速度を１℃／ｍｉｎとして測定した。測定した硬化開始温度（℃）とＧ’ｍａｘ（Ｍｐａ）と硬化時間（分）の値を表１に示した。なお、本明細書において硬化時間とは、８０℃から昇温を開始した時点から、弾性率がＧ’ｍａｘの８０％に到達するまでの時間（分）を意味する。
Example 1
Polybutadiene 1 (NISSO-PB, B-3000) (manufactured by Nippon Soda Co., Ltd.) 100 parts by weight and trimethylolpropane tris (3-mercaptopropionate) (TMMP) (manufactured by Tokyo Chemical Industry Co., Ltd.) 1 weight and 2 parts by weight of dicumyl peroxide (DCP) were placed in a screw tube and stirred with a rotation-revolution stirrer to obtain a thermosetting composition. The rheological properties of the resulting thermosetting composition were measured using a rheometer. The temperature was measured from 80°C to 200°C at a rate of temperature increase of 1°C/min. Table 1 shows the measured curing initiation temperature (° C.), G'max (Mpa) and curing time (minutes). In this specification, the curing time means the time (minutes) from when the temperature starts rising from 80° C. until the elastic modulus reaches 80% of G′max.
実施例２
ＴＭＭＰを０．５重量部とした以外は、実施例１と同様に熱硬化性組成物を得た。実施例１と同様にレオロジー特性を測定し、測定した硬化開始温度（℃）とＧ’ｍａｘ（Ｍｐａ）と硬化時間（分）の値を表１に示した。
Example 2
A thermosetting composition was obtained in the same manner as in Example 1, except that TMMP was 0.5 parts by weight. The rheological properties were measured in the same manner as in Example 1, and Table 1 shows the measured curing initiation temperature (° C.), G'max (Mpa) and curing time (minutes).
実施例３
ＴＭＭＰを５重量部とした以外は、実施例１と同様に熱硬化性組成物を得た。実施例１と同様にレオロジー特性を測定し、測定した硬化開始温度（℃）とＧ’ｍａｘ（Ｍｐａ）と硬化時間（分）の値を表１に示した。
Example 3
A thermosetting composition was obtained in the same manner as in Example 1, except that TMMP was 5 parts by weight. The rheological properties were measured in the same manner as in Example 1, and Table 1 shows the measured curing initiation temperature (° C.), G'max (Mpa) and curing time (minutes).
実施例４
ＴＭＭＰ１重量部を、ペンタエリスリトールテトラキス（３－メルカプトプロピオネート）（ＰＥＭＰ）（東京化成工業（株）製）１重量部とした以外は、実施例１と同様に熱硬化性組成物を得た。実施例１と同様にレオロジー特性を測定し、測定した硬化開始温度（℃）とＧ’ｍａｘ（Ｍｐａ）と硬化時間（分）の値を表１に示した。
Example 4
A thermosetting composition was obtained in the same manner as in Example 1, except that 1 part by weight of TMMP was replaced by 1 part by weight of pentaerythritol tetrakis(3-mercaptopropionate) (PEMP) (manufactured by Tokyo Chemical Industry Co., Ltd.). . The rheological properties were measured in the same manner as in Example 1, and Table 1 shows the measured curing initiation temperature (° C.), G'max (Mpa) and curing time (minutes).
実施例５
ＴＭＭＰ１重量部を、ペンタエリスリトールテトラキス（３－メルカプトプロピオネート）（ＰＥＭＰ）（東京化成工業（株）製）５重量部とした以外は、実施例１と同様に熱硬化性組成物を得た。実施例１と同様にレオロジー特性を測定し、測定した硬化開始温度（℃）とＧ’ｍａｘ（Ｍｐａ）と硬化時間（分）の値を表１に示した。
Example 5
A thermosetting composition was obtained in the same manner as in Example 1, except that 1 part by weight of TMMP was replaced by 5 parts by weight of pentaerythritol tetrakis(3-mercaptopropionate) (PEMP) (manufactured by Tokyo Chemical Industry Co., Ltd.). . The rheological properties were measured in the same manner as in Example 1, and Table 1 shows the measured curing initiation temperature (° C.), G'max (Mpa) and curing time (minutes).
実施例６
ＴＭＭＰ１重量部を、トリス－[(３－メルカプトプロピオニルオキシ)－エチル]－イソシアヌレート（ＴＥＭＰＩＣ）（東京化成工業（株）製）１重量部とした以外は、実施例１と同様に熱硬化性組成物を得た。実施例１と同様にレオロジー特性を測定し、測定した硬化開始温度（℃）とＧ’ｍａｘ（Ｍｐａ）と硬化時間（分）の値を表１に示した。
Example 6
Thermosetting in the same manner as in Example 1 except that 1 part by weight of TMMP was replaced with 1 part by weight of tris-[(3-mercaptopropionyloxy)-ethyl]-isocyanurate (TEMPIC) (manufactured by Tokyo Chemical Industry Co., Ltd.) A composition was obtained. The rheological properties were measured in the same manner as in Example 1, and Table 1 shows the measured curing initiation temperature (° C.), G'max (Mpa) and curing time (minutes).
実施例７
ＴＭＭＰ１重量部を、トリス－[(３－メルカプトプロピオニルオキシ)－エチル]－イソシアヌレート（ＴＥＭＰＩＣ）（東京化成工業（株）製）５重量部とした以外は、実施例１と同様に熱硬化性組成物を得た。実施例１と同様にレオロジー特性を測定し、測定した硬化開始温度（℃）とＧ’ｍａｘ（Ｍｐａ）と硬化時間（分）の値を表１に示した。
Example 7
Thermosetting in the same manner as in Example 1 except that 1 part by weight of TMMP was replaced with 5 parts by weight of tris-[(3-mercaptopropionyloxy)-ethyl]-isocyanurate (TEMPIC) (manufactured by Tokyo Chemical Industry Co., Ltd.) A composition was obtained. The rheological properties were measured in the same manner as in Example 1, and Table 1 shows the measured curing initiation temperature (° C.), G'max (Mpa) and curing time (minutes).
実施例８
ポリブタジエン１をポリブタジエン２（１，２結合と１，４結合の比が、６６：３４であり、数平均分子量（Ｍｎ）が４３００、分子量分布（Ｍｗ／Ｍｎ）が１．１であるポリブタジエン）とした以外は、実施例１と同様に熱硬化性組成物を得た。実施例１と同様にレオロジー特性を測定し、測定した硬化開始温度（℃）とＧ’ｍａｘ（Ｍｐａ）と硬化時間（分）の値を表１に示した。
Example 8
Polybutadiene 1 and polybutadiene 2 (polybutadiene having a ratio of 1,2 bonds and 1,4 bonds of 66:34, a number average molecular weight (Mn) of 4300, and a molecular weight distribution (Mw/Mn) of 1.1) A thermosetting composition was obtained in the same manner as in Example 1, except that The rheological properties were measured in the same manner as in Example 1, and Table 1 shows the measured curing initiation temperature (° C.), G'max (Mpa) and curing time (minutes).
実施例９
ポリブタジエン１をポリブタジエン３（１，２結合と１，４結合の比が、１：９９であり、数平均分子量（Ｍｎ）が５３００、分子量分布（Ｍｗ／Ｍｎ）が２．８であるポリブタジエン）とした以外は、実施例１と同様に熱硬化性組成物を得た。実施例１と同様にレオロジー特性を測定し、測定した硬化開始温度（℃）とＧ’ｍａｘ（Ｍｐａ）と硬化時間（分）の値を表１に示した。
Example 9
Polybutadiene 1 and polybutadiene 3 (polybutadiene having a ratio of 1,2 bonds and 1,4 bonds of 1:99, a number average molecular weight (Mn) of 5300, and a molecular weight distribution (Mw/Mn) of 2.8) A thermosetting composition was obtained in the same manner as in Example 1, except that The rheological properties were measured in the same manner as in Example 1, and Table 1 shows the measured curing initiation temperature (° C.), G'max (Mpa) and curing time (minutes).
比較例１
ＴＭＭＰを使用しなかったこと以外は、実施例１と同様に熱硬化性組成物を得た。実施例１と同様にレオロジー特性を測定し、測定した硬化開始温度（℃）とＧ’ｍａｘ（Ｍｐａ）と硬化時間（分）の値を表１に示した。
Comparative example 1
A thermosetting composition was obtained in the same manner as in Example 1, except that TMMP was not used. The rheological properties were measured in the same manner as in Example 1, and Table 1 shows the measured curing initiation temperature (° C.), G'max (Mpa) and curing time (minutes).
比較例２
ＴＭＭＰ１重量部を、トリアリルイソシアヌレート（ＴＡＩＣ）（富士フイルム和光純薬（株）製）１重量部とした以外は、実施例１と同様に熱硬化性組成物を得た。実施例１と同様にレオロジー特性を測定し、測定した硬化開始温度（℃）とＧ’ｍａｘ（Ｍｐａ）と硬化時間（分）の値を表１に示した。
Comparative example 2
A thermosetting composition was obtained in the same manner as in Example 1, except that 1 part by weight of TMMP was replaced by 1 part by weight of triallyl isocyanurate (TAIC) (manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd.). The rheological properties were measured in the same manner as in Example 1, and Table 1 shows the measured curing initiation temperature (° C.), G'max (Mpa) and curing time (minutes).
比較例３
ＴＭＭＰ１重量部を、トリアリルイソシアヌレート（ＴＡＩＣ）（富士フイルム和光純薬（株）製）５重量部とした以外は、実施例１と同様に熱硬化性組成物を得た。実施例１と同様にレオロジー特性を測定し、測定した硬化開始温度（℃）とＧ’ｍａｘ（Ｍｐａ）と硬化時間（分）の値を表１に示した。
Comparative example 3
A thermosetting composition was obtained in the same manner as in Example 1, except that 1 part by weight of TMMP was replaced by 5 parts by weight of triallyl isocyanurate (TAIC) (manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd.). The rheological properties were measured in the same manner as in Example 1, and Table 1 shows the measured curing initiation temperature (° C.), G'max (Mpa) and curing time (minutes).
比較例４
ＴＭＭＰを使用しなかったこと、およびポリブタジエン１をポリブタジエン２（１，２結合と１，４結合の比が、６６：３４であり、数平均分子量（Ｍｎ）が４３００、分子量分布（Ｍｗ／Ｍｎ）が１．１であるポリブタジエン）としたこと以外は、実施例１と同様に熱硬化性組成物を得た。実施例１と同様にレオロジー特性を測定し、測定した硬化開始温度（℃）とＧ’ｍａｘ（Ｍｐａ）と硬化時間（分）の値を表１に示した。
Comparative example 4
TMMP was not used, and polybutadiene 1 was replaced with polybutadiene 2 (the ratio of 1,2 bonds to 1,4 bonds was 66:34, the number average molecular weight (Mn) was 4300, and the molecular weight distribution (Mw/Mn) A thermosetting composition was obtained in the same manner as in Example 1, except that a polybutadiene having a polybutadiene value of 1.1 was used. The rheological properties were measured in the same manner as in Example 1, and Table 1 shows the measured curing initiation temperature (° C.), G'max (Mpa) and curing time (minutes).
比較例５
ＴＭＭＰを使用しなかったこと、およびポリブタジエン１をポリブタジエン３（１，２結合と１，４結合の比が、１：９９であり、数平均分子量（Ｍｎ）が５３００、分子量分布（Ｍｗ／Ｍｎ）が２．８であるポリブタジエン）としたこと以外は、実施例１と同様に熱硬化性組成物を得た。実施例１と同様にレオロジー特性を測定し、測定した硬化開始温度（℃）とＧ’ｍａｘ（Ｍｐａ）と硬化時間（分）の値を表１に示した。
TMMP was not used, and polybutadiene 1 was replaced with polybutadiene 3 (the ratio of 1,2 bonds and 1,4 bonds was 1:99, the number average molecular weight (Mn) was 5300, and the molecular weight distribution (Mw/Mn) was A thermosetting composition was obtained in the same manner as in Example 1, except that polybutadiene with a polybutadiene of 2.8 was used. The rheological properties were measured in the same manner as in Example 1, and Table 1 shows the measured curing initiation temperature (° C.), G'max (Mpa) and curing time (minutes).
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