JP7250150B2 - Integrated power system - Google Patents

Description

The present invention relates to power systems.

A missile guidance set (MGS) for a tube-launched, optically-tracked, wire-guided (TOW) missile system requires power to operate. need a system. A power system typically includes several such as two battery assemblies, a battery charger, a battery charger monitoring unit, a battery power regulator, a vehicle power regulator, at least two primary batteries, a battery case, and a TVPC. components, which together can weigh in excess of 170 pounds (77.11 kg). Additionally, conventional battery assemblies utilize nickel-cadmium battery technology.

However, the list of problems with this legacy battery system continues to grow. For example, the system itself is heavy and cumbersome to transport on the battlefield, and when the system is deployed, the nickel-cadmium battery has actually failed to fire the expected number of TOW missiles. . Additionally, charging and discharging the battery is inefficient because the battery must be recharged using a non-mobile AC charging unit. If night vision operation is required, traditional battery systems cannot support night vision and therefore additional battery devices are required to operate the night vision. Additionally, nickel-cadmium supplies are dwindling and one or more components of conventional battery systems are obsolete. Accordingly, the cost of replacing one or more of these components continues to increase.

There is a need to provide improved battery systems for providing power efficiently and cost effectively.

FIELD OF THE DISCLOSURE The present disclosure relates generally to power systems and, more particularly, to integrated power systems using improved battery technology and having higher energy capacity than legacy battery systems.

In one or more embodiments, the disclosed technology includes a chassis configured to house a first substrate, a second substrate, and a third substrate; , and a power system in which the third substrate is electrically coupled to each other. In some embodiments, the first substrate is configured to receive power and output power at a first voltage and a second voltage. In some embodiments, the second substrate receives power from the first substrate or from at least one internal battery electrically coupled to the second substrate and uses at least two voltages to power the power. is configured to output In some embodiments, the third substrate is configured to receive power from the second substrate and output power at two voltages. In some embodiments, the first substrate, the second substrate, and the third substrate each include one or more converters configured to convert received power to respective output power. include. In some embodiments, one or more transducers thermally interact with one or more portions of the chassis to conduct heat to the respective portions of the chassis.

In some embodiments, the disclosed technology includes a chassis configured to house a first substrate and a second substrate, the first substrate and the second substrate electrically coupled together. related to the power system. In some embodiments, the first substrate is configured to receive input power and output power at first and second voltages. In some embodiments, the second substrate receives power from the first substrate or from at least one internal battery electrically coupled to the second substrate and uses at least two voltages to power the power. is configured to output In some embodiments, the first substrate and the second substrate each include one or more converters configured to convert received power to respective output power. In some embodiments, one or more transducers thermally interact with one or more portions of the chassis to conduct heat to the respective portions of the chassis.

Various additional aspects will be described in the description below. This aspect can relate to individual features and combinations of features. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only, and are not limiting of the broad inventive concepts on which the embodiments disclosed herein are based. .

The following figures depict certain embodiments of the disclosure and therefore do not limit the scope of the disclosure. The figures are not to scale and are intended to be used with the illustrations in the detailed description below.

1 is a perspective view illustrating an example integrated power system; FIG. 1B is a perspective view illustrating the interior of the integrated power system of FIG. 1A; FIG. 1B is a perspective view illustrating the integrated power system of FIG. 1A in an unassembled configuration; FIG. 1B is an interconnection diagram of the integrated power system of FIG. 1A; FIG. Figure 3 schematically illustrates a current sensor of the interconnection diagram of Figure 2; Figure 3 schematically illustrates a voltage converter and capacitor circuit of the interconnection diagram of Figure 2;

In the discussion that follows, conventional features of power systems that are apparent to those skilled in the art are omitted or only briefly described. Various embodiments have been described in detail with reference to the figures, in which it should be noted that like reference numerals represent like parts and assemblies throughout the several views. Reference to various embodiments does not limit the scope of the claims appended hereto. Additionally, any examples given herein are intended to be non-limiting and merely describe some of the many possible embodiments of the appended claims. Moreover, certain features described herein can be used in combination with other described features in each of the various possible combinations and permutations.

Unless otherwise indicated herein, the broadest possible interpretation is intended to include the meaning implied from the specification, as well as the meaning understood by those skilled in the art and/or defined in dictionaries, treatises, etc. should be given to all terms. As used in the specification and appended claims, the singular forms "a," "an," and "the" include plural references unless otherwise indicated, and as used herein " The terms comprise, include" and/or "comprise, include" indicate the presence of the mentioned feature, element, and/or component but not one or more other features, steps, acts, It should also be noted that the presence or addition of elements, components and/or groups thereof is not excluded.

Embodiments of the present disclosure relate generally to power systems, and more particularly to integrated power systems that use improved battery technology and have higher energy capacity than legacy power systems. Embodiments of the power system are described below with reference to FIGS. 1A-4.

FIG. 1 illustrates a perspective view of an exemplary integrated power system 100, in accordance with one or more embodiments of the present disclosure.

Integrated power system 100 (hereinafter “system 100”) includes chassis 102 that houses the components of system 100 . Chassis 102 may include a handle 104 that connects to a wall, such as top wall 103 of chassis 102 . In one or more embodiments, handle 104 is secured to chassis 102 . In one or more embodiments, handle 104 is fixed to a portion of top wall 103 and is rotatable on chassis 102 . As a result, handle 104 can move to an up position perpendicular to the horizontal plane of top wall 103 of chassis 102 or to a down position parallel to the horizontal plane of top wall 103 of chassis 102 . In some embodiments, chassis 102 is manufactured from a metal such as aluminum. In some embodiments, chassis 102 is manufactured from a cast alloy, such as cast aluminum A356. The walls of chassis 102 are configured to transfer heat from the internal components of chassis 102 to the outside environment through thermal conduction and convection. In some embodiments, system 100 is configured to receive a maximum input at or about 200W of DC power and is configured to generate a maximum output of 190W or about 190W. In some embodiments, the system 100 is configured to produce 34W of heat with an average efficiency of 88%.

In one or more embodiments, chassis 102 is configured to receive one or more fasteners 110 on top wall 103 of chassis 102 . One or more fasteners 110 can be positioned to align with fastener receivers on the MGS MGS battery receptacle. As the user inserts the integrated system 100 into the MGS battery receptacle, a fastener receiver can be inserted over each one or more fasteners 110 . The user can then tighten one or more fasteners 110 to the MGS, thereby securing the system 100 to the MGS. In one or more embodiments, one or more fasteners 110 may be a rotation lock fastener, butterfly fastener, screw, or any other type of fastener known by those skilled in the art. In some embodiments, the rotation lock fastener may be a military rotation lock fastener, NSN 5325-01-148-8601 or equivalent.

In one or more embodiments, system 100 includes input 122 and at least one of first interface 120 and second interface 116 . In some embodiments, input 122 and second interface 116 are provided on top wall 103 of chassis 102 . In some embodiments, first interface 120 is provided outwardly from at least one of input 122 and second interface 116 . In some embodiments, rear wall 105 and either side wall 107a or side wall 107b form cutout wall portion 109 . The cutout wall 109 can surround at least two sides of the first interface 120 where the first interface 120 is positioned on one wall of the cutout wall 109 .

In some embodiments, input 122, first interface 120, and second interface 116 each include cap 118a and terminal 118b. For example, the cap of input 122 may be a D38999/33W15N cap and the corresponding terminal of the input may be D38999/24WD97PN. In another example, cap 118a for each of first interface 120 and second interface 116 may be cap MS3181-12N and cap for each of first interface 120 and second interface 116 Terminal 118b may be terminal MS3124E12-10S. In some examples, the cap can connect to the terminal and can include a mounting ring. In other embodiments, each of input 122, first interface 120, and second interface 116 includes only terminal 118b. Terminal 118b can have one or more pins for receiving and sending various signals and/or voltages and currents. Cap 118a is removably connected to terminal 118b to protect one or more pins of terminal 118b from damage from sources such as dust, water, or impact from objects in the environment outside chassis 102. configured to protect against Terminal 118b may be a female terminal. In some embodiments, terminals 118 b of each of input 122 , first interface 120 , and second interface 116 are interconnected by cables with input 122 , first interface 120 , or second interface 116 . are configured to interconnect with cables to supply or receive power, depending on For example, the terminals of input 122 are configured to be interconnected with a cable to receive voltage and current from an external power source. In another example, the terminals of the second interface are configured to interconnect with cables to supply voltage and current to night vision 222 . In one or more embodiments, system 100 weighs 15-25 pounds (6.8-11.34 kg). In one or more embodiments, system 100 is configured to interact with the M220 TOW 2 weapon system. In other embodiments, system 100 is configured to interact with other weapon systems.

In one or more embodiments, input 122 is configured to receive power from an alternating current (AC) power source, such as an AC power outlet, and/or a direct current (DC) power source, such as a car cigarette lighter receptacle. connector. In some embodiments, AC power received from an AC power source is converted to DC power prior to entering system 100 . For example, AC power can be connected to input 122 via an AC to DC adapter, where the AC to DC adapter converts the power from AC power to DC power prior to entering system 100 . The AC-DC adapter may be, for example, a commercial off-the-shelf (COTS) AC/DC adapter. The COTS AC/DC adapter is configured to convert 100V-240V AC power at 50-60Hz to 24V regulated DC power prior to entering chassis 102 .

In one or more embodiments, first interface 120 is a connector configured to provide power to the MGS. The first interface 120 may consist of three outputs, each configured to provide power having a different voltage to the MGS. The first output can provide power at, or about, twenty-four volts (V). For example, the first output may provide power at 24V with a line regulation of +/-2.4V at full load. A second output can provide power at, or about, plus 50V. For example, the second output may provide power at plus 50V and may vary between 48V and 56V at full load. A third output can provide power at, or about, minus 50V. For example, the third output may provide power at -50V and may vary between -48V and -56V at full load. In one or more embodiments, the three outputs of first interface 120 are configured to provide power at their respective voltages simultaneously. In other embodiments, the three outputs of first interface 120 are configured to provide power at their respective voltages based on MGS operation.

In one or more embodiments, second interface 116 is a connector configured to provide power to night vision. The second interface 116 can be configured with two outputs, each configured to provide power having a different voltage to the night vision. The first output can provide power at, or about 16.8V. For example, the first output may provide power at 16.8V and may swing between 17.1V and 16.1V at full load. A second output may provide power at or about 4.8V. For example, the second output may provide power at 4.8V with a line regulation of +/- 0.3V at full load. In one or more embodiments, the two outputs of second interface 116 are configured to provide power at their respective voltages simultaneously. In other embodiments, the two outputs of the second interface 116 are configured to provide power at their respective voltages based on night vision operation.

In some embodiments, system 100 includes switch 108 . Switch 108 may be, for example, an on/off switch such as a toggle switch. configuring the switch 108 to cause both the first interface 120 and the second interface 116 to provide power at their respective output voltages to the MGS and Night Vision, respectively, when the switch 108 is on; can be done. When switch 108 is off, switch 108 can be configured to cause both first interface 120 and second interface 116 to stop providing power to the MGS and night vision, respectively. In some embodiments, system 100 automatically begins charging battery packs 124a and 124b of system 100 when input 122 is connected to either an AC or DC external power source. Battery packs 124a and 124b may be rechargeable lithium-ion batteries. Battery packs 124a and 124b, in a non-limiting example, are configured in parallel such that two charging chips, such as charging chips 226a, 226b, 228a, and 228b, are provided for each battery pack 124a and 124b. It may be a BB-2590 type battery with two 14.4V nominal sections each. System 100 is configured to charge battery packs 124a and 124b using either AC or DC external power sources. In some embodiments, system 100 charges battery packs 124a and 124b at or about 100W. In other embodiments, the system 100 charges the battery packs 124a and 124b with power values based on the system 100 design. In some embodiments, system 100 is configured to charge battery packs 124a and 124b at different increments. For example, the system 100 can be set in a trickle charge or float charge setting, where the system 100 charges the battery packs 124a and 124b using a low current value and charges the battery packs 124a and 124b. Stop the charging process when the charging state is full capacity. In another example, system 100 can be set in a normal charge setting, where system 100 charges battery packs 124a and 124b using a typical current value for charging battery packs. . In yet another example, system 100 can be set in a fast charge setting, where system 100 charges battery packs 124a and 124b using high current values. In some examples, charging settings for system 100 may be set via switch 114 .

In some embodiments, system 100 includes display 112 and switch 114 . Display 112 may be a state of charge display (SOC) for displaying the status of system 100 . Display 112 can display the amount of power remaining in one or more battery cells of system 100, e.g., battery cell 124a and battery cell 124b, or display 112 can display the power remaining in one or more battery cells of rechargeable battery packs 124a and 124b. An average of four columns of capacity levels can be displayed. In another example, display 112 may display a "no fault" state, which indicates that system 100 is operating without errors. In other examples, the display 112 may display an indication that the battery packs 124a and 124b are ready for charging, an indication of the internal temperature of the system 100 and/or the voltage of one or more battery strings. In some embodiments, switch 114 is configured to provide one or more functions of system 100 . For example, when switch 114 receives a press-type input from a user, display 112 can display the state of system 100 . In another example, if switch 114 receives a press-and-hold type input from the user, display 112 may cycle through various brightness levels for the user to select. In yet another example, if the switch 114 receives a press-and-hold type input from the user for a predefined amount of time, such as 15 seconds, the system 100 can reset.

FIG. 1B illustrates a perspective view of interior 129 of system 100 of FIG. 1A, in accordance with one or more embodiments of the present disclosure. FIG. 1C illustrates a perspective view of system 100 of FIG. 1A in an unassembled configuration, in accordance with one or more embodiments of the present disclosure.

In some embodiments, system 100 includes heat sink 106 on top wall 103 of chassis 102 . Heat sink 106 is configured to transfer heat out of chassis 102 by thermal conduction and convection, where heat can be generated by one or more components within interior 129 of chassis 102 . have a nature. A heat sink 106 may be positioned near the center of the top wall 103 . In one or more embodiments, heat sink 106 includes multiple heat sink protrusions 133 . In other embodiments, the heat sink 106 includes multiple heat sink protrusions 133 and handle risers 131 . In some embodiments, the plurality of heat radiating protrusions 133 and handle risers 131 are cast with the chassis 102 such that the plurality of heat radiating protrusions 133 and handle risers 131 are integrally formed with the chassis 102 . The handle risers 131 may be connected by a crossbar, where the handle risers 131 and crossbar form the handle 104 . In some embodiments, the radiator 106 has an overall size of 6.75 inches wide by 3 inches long (17.145 cm wide by 7.62 cm long), or about 6.75 inches wide by 3 inches long. . In one or more embodiments, when the chassis 102 is inserted into the chassis receptacle of the MGS, the chassis receptacle covers each wall of the chassis 102 except for the top wall 103 which is exposed to the outside environment. can be done. For example, top wall 103 is exposed to moving air. In some embodiments, heat generated by various components of interior 129 travels through radiator 106 and out to the outside environment.

Each of the plurality of heat dissipation protrusions 133 extends away from the top wall 103 . Radiator fins, such as radiator 133a, can be sized 3 inches long by 0.5 inches high by 0.09 inches thick, or about 3 inches long by 0.5 inches high by 0.09 inches thick. The plurality of heat dissipating protrusions 133 can be spaced apart by 0.22 inches or about 0.22 inches on center. In some embodiments, heat sink 106 includes 27 heat sinks 133a. A set of two heat sinks 133 a can be positioned outside each of the handle risers 131 and the remaining 23 heat sinks 133 a can be positioned between both handle risers 131 . In one or more embodiments, night vision and/or MGS are discharging system 100 or input 122 regulates and converts power to 24V to charge battery packs 124a and 124b and/or The heat sink 106 transfers an amount of heat ranging from 6 Watts (W), or about 6 W, to 42 W, or about 42 W, based on whether power is supplied to the first interface 120 and/or the second interface. Configured.

In one or more embodiments, access cover 136 forms a removably connected wall of chassis 102 . Access cover 136 may be secured to chassis 102 with fasteners 138, such as screws. In some embodiments, fasteners 138 are captive fasteners such that fasteners 138 remain with access cover 136 when fasteners 138 are removed from chassis 102 . A user can remove access cover 136 to access interior 129 of chassis 102 . In one or more embodiments, interior 129 of chassis 102 includes first substrate 130, second substrate 132, third substrate 134, and one or more battery packs, such as battery pack 124a and battery pack 124b. at least one of A first substrate 130 can be disposed on the top wall 103 . A second substrate 132 can be placed on the rear wall 105 . A third substrate 134 can be positioned on either sidewall 107a or sidewall 107b. For purposes of discussion, the embodiments discussed herein will be discussed in terms of third substrate 134 disposed on sidewall 107b, but these features will not be apparent if third substrate 134 is on sidewall 107a. Note that it is equally applicable for the case placed in . The boards can each be secured to their respective walls via fasteners, such as fasteners that mount to the printed circuit board.

Battery pack 124 a and battery pack 124 b may be positioned on bottom wall 111 of chassis 102 in front of second board 132 and third board 134 . The support bracket 128 b can be staggered over a portion of the second substrate 132 . The support bracket 128b can be secured to the rear wall 105 via fasteners that extend through the support bracket 128b and the second substrate 132 and secure to the rear wall 105 . Support bracket 128 b can have one or more battery pack receiving portions 128 b configured to separate a battery pack, such as battery pack 124 b , from second substrate 132 . Battery pack receiving portion 128b may include one or more battery pack positioning tabs 128d configured to position each battery pack within chassis 102 . The battery pack positioning tab 128d can be positioned at least one of the top, right and left edges of the battery pack receiving portion 128b. Battery pack positioning tabs 128d prevent one or more battery packs from moving within chassis 102, thereby preventing one or more battery packs from moving to first substrate 130, second substrate 132, and/or third substrate 130, and/or third substrate 132. can be configured to protect the substrate 134 from being damaged. In one or more embodiments, battery pack 124 a and battery pack 124 b are electrically coupled to second substrate 132 . A battery connector 126a can connect the second substrate 132 to the battery pack 124a, and a battery connector 126b can connect the second substrate 132 to the battery pack 124b. A battery strap 128a can surround one or more sides of battery pack 124a and/or one or more sides of battery pack 124b. Battery strap 128a can be configured to prevent battery connector 126a from disengaging from battery packs 124a and 124b. Battery strap 128a can be positioned between access cover 136 and battery packs 124a and 124b to prevent the battery strap from dislodging from the battery packs. Battery strap 128a can be configured to be secured to respective battery connectors 126a and 126b that connect to battery cells 124a and 124b, respectively, thereby connecting battery cell 124a and battery cell 124a to battery strap 128a.

In one or more embodiments, first substrate 130 and second substrate 132 are electrically coupled together, and second substrate 132 and third substrate 134 are electrically coupled together. In one or more embodiments, at least two of the first substrate 130, the second substrate 132, and the third substrate 134 include press-fit connectors, where one press-fit connector on one substrate. is configured to mate with a press-fit connector on the other board. For example, the first substrate 130 can include one press-fit connector and the second substrate 132 includes another press-fit connector configured to receive the press-fit connector of the first substrate 130. can be done. In another example, the first substrate 130 has more than one press fit connector, such as two connectors configured to mate with corresponding press fit connectors, such as another two connectors on the second substrate 132 . Can include fit connectors. The press-fit connectors on the first substrate 130 and the second substrate 132 are configured to mate together at right angles. Press-fit connectors can facilitate the transmission of data and electrical signals, such as current and voltage, from one board to another and vice versa. In one or more other embodiments, at least two of the first substrate 130, the second substrate 132, and the third substrate 134 exchange data and/or electrical signals between the at least two substrates. including other connector systems configured to: For example, the second substrate 132 and the third substrate 134 can each have terminals configured to mate with ends of a wiring harness, where wires contained in the wiring harness can be connected via terminals. Data and/or electrical signals are exchanged between the second substrate 132 and the third substrate 134 via the substrate.

FIG. 2 illustrates an interconnection diagram 200 of system 100 of FIG. 1A, in accordance with one or more embodiments of the present disclosure.

In one or more embodiments, first substrate 130, second substrate 132, and third substrate 134 include electrical components that generate heat. Electrical components that generate heat include at least 24V DC/24V DC power converter 204, 24V DC/16.8V DC power converter 206, 24V DC/24V DC power converter 208, 24V DC/4.8V DC At least one charging chip, such as power converter 214, 24V DC/50V DC power converter 218, 24V DC/50V DC power converter 220, charging chip 226a and charging chip 228a for battery pack 124a, and battery pack 124b. at least one charging tip, such as charging tip 226b and charging tip 228b for. In some embodiments, the heat-generating components are positioned on the first substrate 130, the second substrate 132, and the third substrate 134 within the chassis 102 such that the heat-generating components Generated heat is dissipated through radiator 106 or into the walls of chassis 102 .

In one or more embodiments, first board 130 includes 24V DC/24V DC power converter 204 , 24V DC/16.8V DC power converter 206 , and 24V DC/24V DC power converter 208 . In some embodiments, the 24V DC/24V DC power converter 204, the 24V DC/16.8V DC power converter 206, and the 24V DC/24V DC power converter 208 face the heat sink 106 first. It can be positioned on the back side of substrate 130 . First board 130 can be configured to be detached and connected to system 100 . The ability to disconnect and connect to and from system 100 allows first board 130 to be easily replaced when one or more electrical components on first board 130 fail. In other embodiments, the first substrate 130 can include several detachably connected substrates, where one or more detachably connected substrates are connected to the first substrate 130. May include various electrical components and at least one of 24V DC/24V DC power converter 204, 24V DC/16.8V DC power converter 206, and 24V DC/24V DC power converter 208. . For example, the first board 130 may include two detachably connected boards, where one detachably connected board is the 24V DC/24V DC power converter 204 and the 24V DC/ A 16.8V DC power converter 206 is included while the other detachably connected board includes a 24V DC/24V DC power converter 208 . The removably connected substrates can be electrically coupled together, thereby forming a first substrate 130 . Removably connected boards can be configured to be removed and connected to system 100 . The ability to disconnect and connect to system 100 allows easy replacement of power converters when they fail.

In some embodiments, 24V DC/24V DC power converter 204, 24V DC/16.8V DC power converter 206, and 24V DC/24V DC power converter 208 thermally interact with heat sink 106. configured to For example, the baseplate of the DC power converter transfers heat from the DC power converter through the conductive baseplate and into a portion of chassis 102 such as heat sink 106 via a heat transfer paste or pad. The thermally conductive paste or pad can have a thermal conductivity of at least 5 W/mK. That is, heat generated by 24V DC/24V DC power converter 204 , 24V DC/16.8V DC power converter 206 , and 24V DC/24V DC power converter 208 is directed to heat sink 106 . In some embodiments, 24V DC/24V DC power converter 204, 24V DC/16.8V DC power converter 206, and 24V DC/24V DC power converter 208 have the highest potential to generate heat. It is an electrical component that generates heat with For example, the 24V DC/24V DC power converter 204, the 24V DC/16.8V DC power converter 206, and the 24V DC/24V DC power converter 208 generate heat, the highest among the components in the system 100. may result in a temperature of In addition, 24V DC/24V DC power converter 204, 24V DC/16.8V DC power converter 206, and 24V DC/24V DC power converter at full load by having the highest heat generating potential The vessel 208 may generate the maximum amount of heat to dissipate to the outside environment. In some examples, 24V DC/24V DC power converter 204, 24V DC/16.8V DC power converter 206, and 24V DC/24V DC power converter 208 contribute 70% of the total heat generated in system 100. % or about 70%.

In one or more embodiments, second board 132 includes charging chips 226 a , 226 b , 228 a and 228 b and 24V DC/4.8V DC power converter 214 . In some embodiments, charging chips 226 a , 226 b , 228 a , and 228 b are positioned on the back side of second substrate 132 facing rear wall 105 . A second board 132 can be configured to be detached and connected to the system 100 . The ability to disconnect and connect to and from the system 100 allows the second board 132 to be easily replaced when one or more electrical components on the second board 132 fail. In other embodiments, the second substrate 132 can include several detachably connected substrates, where one or more detachably connected substrates are connected to the second substrate 132. Various electrical components and at least one of charging chips 226a, 226b, 228a, and 228b and 24V DC/4.8V DC power converter 214 may be included. For example, the second substrate 132 can include three detachably connected substrates, where one detachably connected substrate includes charging chips 226a and 228a and another detachably connected substrate. A connected board includes charging chips 226 b and 228 b and a third removably connected board includes 24V DC/4.8V DC power converter 214 . The removably connected substrates can be electrically coupled together, thereby forming a second substrate 132 . Removably connected boards can be configured to be removed and connected to system 100 . The ability to disconnect and connect to system 100 allows easy replacement of power converters when they fail.

In one or more embodiments, charging tips 226a, 226b, 228a, and 228b can be configured to thermally interact with rear wall 105 such that charging tips 226a, 226b, 228a, and Heat generated by one or more of 228b is thermally conducted to the chassis 102, particularly to a portion of the rear wall 105 or all of the rear wall 105. FIG. In some examples, each charging chip 226a, 226b, 228a, and 228b may each generate up to 2.5W of heat, thereby generating up to 10W of heat output. In some embodiments, 24V DC/4.8V DC power converter 214 is positioned on the surface of second substrate 132 facing access cover 136 . In some embodiments, 24V DC/4.8V DC power converter 214 is configured to thermally interact with the volume of chassis 102, ie, interior 129 space. The 24V DC/4.8V DC power converter 214 is the heat-producing electrical component with the lowest heat-producing potential.

In one or more embodiments, third board 134 includes 24V DC/50V DC power converter 218 and 24V DC/50V DC power converter 220 . In some examples, 24V DC/50V DC power converter 218 and 24V DC/50V DC power converter 220 may each generate up to 3W of heat. In some embodiments, 24V DC/50V DC power converter 218 and 24V DC/50V DC power converter 220 can be positioned on the back side of third substrate 134 facing either sidewall 107b. . Third board 134 can be configured to be detached and connected to system 100 . The ability to disconnect and connect to and from system 100 allows third board 134 to be easily replaced when one or more electrical components on third board 134 fail. In other embodiments, the third substrate 134 can include several detachably connected substrates, where one or more detachably connected substrates of the third substrate 134 Various electrical components and at least one of 24V DC/50V DC power converter 218 and 24V DC/50V DC power converter 220 may be included. For example, the third board 134 can include two detachably connected boards, where one detachably connected board contains the 24V DC/50V DC power converter 218 and the other includes a 24V DC/50V DC power converter 220 . The removably connected substrates can be electrically coupled together, thereby forming a first substrate 130 . Removably connected boards can be configured to be removed and connected to system 100 . The ability to disconnect and connect to system 100 allows easy replacement of power converters when they fail.

24V DC/50V DC power converter 218 and 24V DC/50V DC power converter 220 may be configured to thermally interact with sidewall 107b, resulting in 24V DC/50V DC power converter 218 and 24V DC/50V DC power converter 220, heat generated by at least one of them conducts to chassis 102, particularly to sidewall 107b. In some examples, the thermal potential generated by 24V DC/50V DC power converter 218 and 24V DC/50V DC power converter 220 is less than the thermal potential generated by charging chips 226a, 226b, 228a, and 228b. .

In one or more embodiments, first substrate 130 is configured to receive DC power from an external power source. In cases where AC power is used as the input power source, AC/DC adapter 202 converts the AC power externally to DC power before entering chassis 102 at input FI 10 . AC/DC adapter 202 may be, for example, a COTS AC/DC adapter. In some embodiments, AC/DC adapter 202 is configured to convert AC power to converted 24V DC power. If DC power is used as the input power supply, the first board 130 is configured to receive 10V to 36V DC power at input FI7. The 24V DC/24V DC power converter 204 on the first board 130 is configured to internally convert 10V to 36V DC power to converted 24V DC power on the first board 130 . In one or more embodiments, input 122 includes both FI10 and input FI7. For example, terminal D38999/24WD97PN of input 122 may include 12 contacts, where 8 contacts are 20 gauge and 4 contacts are 16 gauge. Four contacts at 16 gauge can be used for DC input power and four contacts at 20 gauge are used for input power from the AC/DC adapter. In one or more embodiments, converted AC and DC power is provided to a 24V power bus configured to distribute and receive power to and from second board 132 and third board 134 . In one or more embodiments, the converted AC and DC power can be used to charge battery packs 124a and 124b, power night vision 222, and/or power MGS 224. power can be provided.

In one or more embodiments, the second board 132 is configured to receive the converted 24V DC power at the output FIO5 from the first board 130 at the input SI3. In some embodiments, the second board 132 uses the converted 24V DC power to charge at least one of the battery strings in the battery pack 124a or 124b, night vision 222 and MGS 224. configured to provide power to operate the

In some embodiments, converted AC and DC power can be used to operate night vision 222 and MGS 224 without using power from battery packs 124a and 124b. To operate night vision 222 and MGS 224 without using power from battery packs 124 a and 124 b , switch 211 a is closed, thereby sending power to night vision 222 and MGS 224 . In one or more embodiments, switch 211a is closed when switch 108 is turned on.

When switch 211a is closed, second board 132 receives converted 24V DC power from output FIO5 at input SI3. The converted 24V DC power goes to the current sensor 210 provided on the second substrate 132 . In one or more embodiments, if first board 130 receives input power on either FI10 or FI7, system 100 provides power to night vision 222 and MGS 224 at the same time battery packs 124a and 124b are powered. A current sensor 210 is provided to avoid charging the . FIG. 3 illustrates a schematic 300 of current sensor 210 of interconnection diagram 200 of FIG. 2, in accordance with one or more embodiments of the present disclosure. When launching a missile, system 100 may not be able to provide power from an external power source to both night vision 222 and MGS 224 and battery cells 124a and 124b at the same time. In some embodiments, current sensor 210 is configured to sense the amount of power output from system 100 . If the amount of power output from system 100 exceeds a threshold, current sensor 210 sends a signal I to microcontroller 302 for a duration corresponding to the length of time required to launch the missile. Disable charging of battery cells 124a and 124b. Microcontroller 302 sends a signal O to charging chips 126a, 126b, 128a, and 128b to disable charging. In some embodiments, system 100 is configured to automatically begin recharging battery packs 124a and 124b after a missile is launched. Microcontroller 302 can send signals to charging chips 126a, 126b, 128a, and 128b to enable charging. In some embodiments, system 100 is configured to disable charging of battery cells 124a and 124b based on the duration between missile launch and impact of the missile on the target.

In one or more embodiments, a first board is configured to provide 16.8V DC power to night vision 222 and a second board is configured to provide 16.8V DC power to night vision 222 to provide the necessary power for night vision 222 . It is configured to provide 4.8V DC power to the field of view 222 . The converted 24V DC power is passed from current sensor 210 to 24V DC/16.8V DC power converter 206, 24V DC/24V DC power converter 208, and 24V DC/4.8V DC power converter 214. move on. In some embodiments, 24V DC/16.8V DC power converter 206 converts the converted 24V DC power provided from 24V DC/24V DC power converter 204 or AC/DC adapter 202 to 16.8V DC power. of DC power. The converted 24V DC power is then converted and the first board 130 provides 16.8V DC for night vision 222 . In some embodiments, 24V DC/4.8V DC power converter 214 converts the converted 24V DC power provided from 24V DC/24V DC power converter 204 or AC/DC adapter 202 to 4.8V DC power. of DC power. The converted 24V DC power is then converted and the second board 132 provides 4.8V DC for night vision 222 .

In one or more embodiments, the first substrate 130 provides 24V DC power to the MGS 224 along with a capacitor circuit 216 provided on the second substrate 132 to provide the necessary power to the MGS 224. The second board 132 provides the converted 24V DC power to a 24V DC/50V DC power converter 218 and a 24V DC/50V DC power converter 220 provided on the third board 134. wherein third board 134 is configured to provide +50V and -50V DC power to MGS 224 .

The converted 24V DC power is passed from the current sensor 210 to the second board 132 to a 24V DC/50V DC power converter 218 and a 24V DC/50V DC power converter 220 provided on the third board 134. and proceed. In some embodiments, 24V DC/50V DC power converter 218 converts the converted 24V DC power provided from 24V DC/24V DC power converter 204 or AC/DC adapter 202 into 50V DC power. configured to transform. The converted 24V DC power is then converted and third board 134 provides 50V DC to MGS 224 . In some embodiments, 24V DC/50V DC power converter 220 converts the converted 24V DC power provided from 24V DC/24V DC power converter 204 or AC/DC adapter 202 into 50V DC power. configured to transform. The converted 24V DC power is then converted and third board 134 provides 50V DC to MGS 224 .

The converted 24V DC power passes from the current sensor 210 through the second board 132 to the 24V DC/24V DC power converter 208 provided on the first board 130 . In one or more embodiments, 24V DC/24V DC power converter 208 may be a switching regulator and/or a 24V DC/24V DC power converter. If the 24V DC/24V DC power converter 208, for example, requires an output time of 20-40 seconds with a current flowing at 2.6A +/- 5% and three 105 ms maximum duration pulses There is That is, the 24V DC/24V DC power converter 208 can operate for about 20-40 seconds while the missile is being launched. During the first pulse there is a current spike of, for example, 14A. At or about 1.5 seconds after the first pulse, a second current spike occurs, for example at 11A. A third spike occurs, for example, at 11A after the second current spike. The 24V DC/24V DC power converter 208 conducts current at different amperages and different durations of maximum duration pulses to accommodate sustained output times shorter and/or longer in duration than 20-40 seconds. Note that it is possible to If the 24V DC/24V DC power converter 208 cannot accommodate the short duration, large current transient spikes required by the MGS during the missile launch sequence, the capacitor circuit 216 stores the power required by the MGS and It can be configured to discharge quickly and restore power for subsequent sequences. In some embodiments, in order to increase the current of the power provided by the 24V DC/24V DC power converter 208, the 24V DC/24V DC power converter 208 uses high current at 24V as required by the MGS 224. is configured to first provide the generated power to the capacitor circuit 216 to increase the . A high current may be, for example, a 14A spike in 105 ms, where the spikes are no longer than 1.5 seconds apart.

FIG. 4 illustrates a schematic 400 of the 24V DC/24V DC power converter 208 and capacitor circuit 216 of the interconnection diagram 200 of FIG. 2, in accordance with one or more embodiments of the present disclosure. In one or more embodiments, the first output 412 of the 24V DC/24V DC power converter is provided to capacitor circuit 216 . Capacitor circuit 216 may include current limiting resistor 404 , capacitor 406 , Zener diode 410 and power diode 408 . In some embodiments, current limiting resistor 404 is configured to prevent 24V DC/24V DC power converter 208 from overloading during charging of capacitor bank 414 . In one or more embodiments, capacitors 406 each have sufficient capacitance to provide an upper voltage limit of 2.7-3 volts and the required transient current. In some examples, ten 15 Farad capacitors 406 may be configured in series with each other. In one or more embodiments, Zener diode 410 is configured to protect against overvoltage when capacitor 406 has a different capacitance.

In capacitor circuit 216 , first output 412 goes to current limiting resistor 404 . As capacitor 406 charges, the current through current limiting resistor 404 decreases to or about zero current. As the current decreases to zero or near zero, capacitor bank 414 charges. When capacitor bank 414 is charged, current flows from 24V DC/24V DC power converter 208 to capacitor circuit 216 .

If the capacitors 406 in the capacitor bank are of equal capacity, each capacitor 406 charges to 2.4V DC, or about 2.4V DC, thereby returning 24V DC to the 24V DC/24V DC power converter 208. output. The 24V DC/24V DC power converter 208 then passes power with the converted 24V DC power to the MGS 224 . In some embodiments, second substrate 132 includes areas for routing higher gauge wires through second substrate 132 at input SI5 and output SO7 to MGS 224 . Higher gauge wiring can be used to supply converted 24V DC power from the 24V DC/24V DC power converter 208 to the MGS 224 .

If the capacitance of the capacitor 406 is less than that of the other capacitors 406 in the capacitor bank 414, the voltage will increase faster than the other capacitors 406, so that if the voltage exceeds the upper limit of 2.7V DC, the capacitor 406 will may pose a risk of damage to the When the voltage on capacitor 406 is near the upper limit, current flows through parallel Zener diode 410, thereby limiting capacitor 406 to 2.7V DC while still allowing current to flow through the remaining capacitors in capacitor bank 414. 406 is allowed to flow.

In some embodiments, high transient loads 402 are configured to draw power. In one or more embodiments, when a high transient load 402 draws power, the 24V DC/24V DC power converter 208 reduces the output voltage and based on the capacitor voltage in capacitor bank 414 being higher than the output voltage, Power diode 408 begins to conduct. In some embodiments, power diode 408 is configured to maintain the output voltage of capacitor bank 414 flowing through power diode 408 at or about 24V DC. Thus, in some embodiments, current in capacitor bank 414 does not flow until the output voltage drops to or about 23.5V DC.

In some embodiments, when the output voltage decreases to 23.5V DC, capacitor bank 414 is configured to discharge based on the duration of the transition to the lower voltage. When capacitor bank 414 is discharged, ie, during a discharge transient, current flows from capacitor circuit 216 to 24V DC/24V DC power converter 208 through power diode 408 . Thereafter, capacitor bank 414 is configured to recharge once the transient period has ended.

If input power at either FI10 or FI7 is not available, switch 211b is closed, thereby directing power from battery cells 124a and 124b to night vision 222 and MGS 224. In one or more embodiments, a microcontroller can be used to open and close switches 211a and 211b. In some embodiments, when switch 108 is turned on, a signal is sent to the microcontroller instructing it to close switch 211a and open switch 211b. In some embodiments, when switch 108 is turned off, a signal is sent to the microcontroller instructing it to open switch 211a and close switch 211b. In one or more embodiments, battery packs 124a and 124b are configured to provide the power required for night vision 222 and MGS 224 when switch 211b is closed. In one or more embodiments, power is routed from battery packs 124a and 124b to 24V DC/4.8V DC power converter 214, 24V DC/16.8V DC power converter and then to night vision 222, said power flows in a manner similar to AC or DC power supplied from an external source after passing through current sensor 210 . In one or more embodiments, power is supplied from battery packs 124a and 124b to 24V DC/24V DC power converter 208, capacitor circuit 208, then to MGS 224, 24V DC/50V DC power converter 218, and 24V DC/ The power flows to the 50V DC power converter 220 and then to the MGS 224 in a manner similar to AC or DC power supplied from an external source after the power has passed through the current sensor 210 .

The various embodiments described above are provided for illustration only and should not be taken as limiting the claims appended hereto. Those skilled in the art will make various modifications and changes without following the exemplary embodiments and applications shown and described herein and without departing from the true spirit and scope of the following claims. It can be easily understood that

100 integrated power system 102 chassis 103 top wall 104 handle 105 rear wall 106 radiator 107a sidewall 107b sidewall 108 switch 109 notched wall 110 fastener 112 display 114 switch 116 second interface 118a cap 118b terminal 120 first interface 122 Input 124a Battery pack, Battery cell 124b Battery pack, Battery cell 126a Battery connector 126b Battery connector 128a Battery strap 128b Support bracket 128d Battery pack positioning tab 129 Inside 130 First substrate 131 Handle riser 132 Second substrate 133 Heat dissipation protrusion 133a Heatsink 134 Third Board 136 Access Cover 138 Clamp 202 AC/DC Adapter 204 24V DC/24V DC Power Converter 206 24V DC/16.8V DC Power Converter 208 24V DC/24V DC Power Converter 210 Current Sensor 211a switch 211b switch 214 24V DC/4.8V DC power converter 216 capacitor circuit 218 24V DC/50V DC power converter 220 24V DC/50V DC power converter 222 night vision 224 MGS
226a charging chip 226b charging chip 228a charging chip 228b charging chip 302 microcontroller 402 transient load 404 current limiting resistor 406 capacitor 408 power diode 410 zener diode 412 output 414 capacitor bank

Claims (23)

a chassis configured to house a first substrate, a second substrate, and a third substrate and including a heat sink; A power system in which substrates are electrically coupled to each other, comprising:
said first substrate configured to receive power and output power at a first voltage and a second voltage;
such that the second substrate receives power from the first substrate or from at least one internal battery electrically coupled to the second substrate and outputs power using at least two voltages; configured to
said third substrate is configured to receive power from said second substrate and output power at two voltages;
each of the first substrate, the second substrate, and the third substrate including one or more converters configured to convert the received power to the respective output power;
the one or more transducers thermally interact with one or more portions of the chassis to conduct heat to the respective portions of the chassis ;
The power system of claim 1, wherein heat generated from a transducer mounted on said first substrate is directed to said heat sink . 2. The power system of claim 1, wherein said first board is further configured to receive said power from either an AC power source or a DC power source. The first substrate is configured to convert the voltage of input power received from an external power source as well as a first converter configured to convert the voltage of power received from the second substrate. including a second transducer and a third transducer;
wherein the second converter is configured to output power at the first voltage;
2. The power system of claim 1, wherein said third converter is configured to output power at said second voltage. 4. The power system of claim 3, wherein said second converter is configured to output power to night vision at said first voltage. 4. The power system of claim 3, wherein said third converter is configured to output power to a missile guidance set at said second voltage. 4. The power system of claim 3, wherein said third converter is electrically coupled to a capacitor circuit configured to increase the current of said output power provided at said second voltage. 4. The method of claim 3, wherein the first transducer, the second transducer and the third transducer are positioned on the side of the first substrate facing the top wall of the chassis. power system. The first converter, the second converter, and the third converter thermally interact with at least one of a portion of the top wall of the chassis and a radiator in the top wall. 8. The power system of claim 7, wherein: The radiator is configured to transfer heat from at least one of the first converter, the second converter, and the third converter to an external environment by thermal conduction and convection. 9. The power system of claim 8. said first transducer, said second transducer, and said third transducer each provided on said first substrate, said second substrate, and said third substrate; 4. The electric power system of claim 3, having the highest heat generating potential of. 2. The second substrate of claim 1, wherein the second board includes at least one charging chip configured to charge the at least one internal battery and to provide output power to at least one night vision or missile guidance set. power system. said at least one charging chip positioned on a side of said second substrate facing a rear wall of said chassis, said at least one charging chip thermally interacting with said rear wall;
12. The power system of claim 11, wherein a portion of said rear wall is configured to thermally conduct heat from said at least one charging tip. 2. The power system of claim 1, wherein the second board includes a fourth converter positioned on the side of the second board facing the interior of the chassis. 14. The power system of claim 13, wherein the fourth converter is configured to convert voltage of power received from the first substrate. The fourth transducer is configured to thermally interact with the interior space of the chassis such that the fourth transducer conducts heat to the interior space of the chassis. 14. The power system of claim 13, comprising: 14. The method of claim 13, wherein said fourth transducer has the lowest heat generating potential of said transducers provided on said first substrate, said second substrate and said third substrate. Power system as described. a current sensor circuit configured to avoid charging the at least one internal battery while the first substrate, the second substrate, and the third substrate output power; 2. The power system of claim 1, wherein the substrate of . The third board includes a fifth converter and a sixth converter, each of the fifth converter and the sixth converter converting the voltage of the power received from the second board. 2. The power system of claim 1, configured to: 19. The power system of claim 18, wherein the fifth converter and the sixth converter are positioned on the side of the third substrate facing sidewalls of the chassis. the fifth transducer and the sixth transducer configured to thermally interact with sidewalls of the chassis;
19. The power system of claim 18, wherein the sidewalls of the chassis are configured to thermally conduct heat from the fifth converter and the sixth converter. 1. A power system comprising a chassis configured to house a first substrate and a second substrate , the chassis including a heat sink , the first substrate and the second substrate being electrically coupled to each other. hand,
the first substrate configured to receive input power and output power at a first voltage and a second voltage;
such that the second substrate receives power from the first substrate or from at least one internal battery electrically coupled to the second substrate and outputs power using at least two voltages; configured to
each of the first substrate and the second substrate comprising one or more converters configured to convert the received power to the respective output power;
the one or more transducers thermally interact with one or more portions of the chassis to conduct heat to the respective portions of the chassis;
The power system of claim 1, wherein heat generated from a transducer mounted on said first substrate is directed to said heat sink . wherein the chassis is further configured to house a third substrate electrically coupled to the first substrate and the second substrate;
said third substrate is configured to receive power from said second substrate and output power at two voltages;
22. The power system of claim 21, wherein said third board includes at least one converter configured to convert said power received from said second board. 23. The power system of Claim 22, wherein the at least one converter of the third substrate is configured to thermally interact with the one or more portions of the chassis.

Images