JP7243229B2 - Oscillators, electronic devices and moving bodies - Google Patents

Description

The present invention relates to oscillators, electronic devices, and mobile bodies.

In Patent Document 1, since the output circuit stops operating when the temperature compensation circuit is adjusted, a current equivalent to the current that flows through the output circuit during normal operation is passed through the heating circuit, thereby temperature compensation is performed in a state close to normal operation. A temperature compensated oscillator is described which allows circuit tuning.

JP 2015-126286 A

In general, when a power supply voltage is applied to a temperature-compensated oscillator, the integrated circuit that oscillates the oscillator operates and generates heat. Stable thermal equilibrium is reached. The temperature-compensated oscillator described in Patent Document 1 can reduce the frequency deviation by performing temperature compensation in such a thermal equilibrium state. However, immediately after the oscillator is started, the integrated circuit becomes a heat source, so the temperature of the vibrator changes with a delay following the temperature change of the integrated circuit. That is, when the oscillator is started, the temperature of the oscillator changes with a delay with respect to the temperature change of the temperature sensor provided in the integrated circuit, so that thermal equilibrium is lost and the frequency of the oscillation signal deviates from the frequency of the thermal equilibrium state. may increase the frequency deviation.

One aspect of the oscillator according to the present invention is
an oscillator;
an integrated circuit;
The integrated circuit comprises:
an oscillation circuit for oscillating the vibrator;
a temperature sensor;
a temperature compensation circuit that compensates for the temperature characteristics of the vibrator based on the output signal of the temperature sensor;
an output circuit that receives a signal output from the oscillation circuit and outputs an oscillation signal;
a heating circuit;
The heat generating circuit is
A current flows and heats up in a first period after the supply of power supply voltage from the outside is started, and no current flows in a second period after the first period ends.

In one aspect of the oscillator,
The output circuit is
stop operating during the first period and operate during the second period;
Power consumed per unit time by the heat generation circuit during the first period may be greater than power consumed per unit time by the output circuit during the second period.

One aspect of the oscillator is
A current flowing through the heating circuit during the first period may be variable.

In one aspect of the oscillator,
The length of the first period may be variable.

In one aspect of the oscillator,
The integrated circuit comprises:
an amplitude detection circuit that detects the amplitude of the signal output from the oscillation circuit and outputs a detection signal;
The first period may be set based on the detection signal.

In one aspect of the oscillator,
The integrated circuit has a plurality of external connection terminals including a first external connection terminal electrically connected to one end of the vibrator and a second external connection terminal electrically connected to the other end of the vibrator. death,
Among the plurality of external connection terminals, the first external connection terminal or the second external connection terminal may be closest to the heating circuit.

In one aspect of the oscillator,
Among the plurality of external connection terminals, the first external connection terminal or the second external connection terminal may be farthest from the temperature sensor.

One aspect of the oscillator according to the present invention is
an oscillator;
an integrated circuit;
The integrated circuit comprises:
generating heat with a first heat value per unit time in a first period after the supply of the power supply voltage from the outside is started;
In a second period after the first period ends, heat is generated with a second calorific value per unit time,
The first calorific value is greater than the second calorific value.

One aspect of the electronic device according to the present invention is
It comprises one aspect of the oscillator.

One aspect of the moving object according to the present invention is
It comprises one aspect of the oscillator.

1 is a perspective view of an oscillator according to this embodiment; FIG. Sectional drawing of the oscillator of this embodiment. 3 is a functional block diagram of the oscillator of the first embodiment; FIG. FIG. 4 is a diagram showing a configuration example of an oscillation circuit; FIG. 4 is a diagram showing a configuration example of an output circuit; FIG. 4 is a diagram showing a configuration example of an amplitude control circuit; FIG. 5 is a diagram showing an example of the operation of the oscillator of the comparative example; 4A and 4B are diagrams showing an example of the operation of the oscillator according to the first embodiment; FIG. FIG. 2 is a plan view of a semiconductor substrate of an integrated circuit; The functional block diagram of the oscillator of 2nd Embodiment. FIG. 4 is a diagram showing a configuration example of an amplitude control circuit; FIG. 10 is a diagram showing an example of the operation of the oscillator according to the second embodiment; The functional block diagram of the oscillator of 3rd Embodiment. The figure which shows an example of the operation|movement of the oscillator of 3rd Embodiment. FIG. 2 is a functional block diagram of the electronic device according to the embodiment; 1A and 1B are diagrams illustrating an example of an appearance of an electronic device according to an embodiment; FIG. The figure which shows an example of the moving body of this embodiment.

Preferred embodiments of the present invention will be described in detail below with reference to the drawings. It should be noted that the embodiments described below do not unduly limit the content of the present invention described in the claims. Moreover, not all the configurations described below are essential constituent elements of the present invention.

1. Oscillator 1-1. First Embodiment FIGS. 1 and 2 are diagrams showing an example of the structure of an oscillator 1 according to this embodiment. 1 is a perspective view of the oscillator 1, and FIG. 2 is a cross-sectional view taken along line AA of FIG.

The oscillator 1 of this embodiment is a temperature-compensated oscillator, and includes an integrated circuit 2, an oscillator 3, a package 4, a lid 5, and a plurality of external terminals 6, as shown in FIGS. In this embodiment, the oscillator 3 is a crystal oscillator using crystal as a substrate material, such as an AT cut crystal oscillator or a tuning fork type crystal oscillator. The oscillator 3 may be a SAW (Surface Acoustic Wave) resonator or a MEMS (Micro Electro Mechanical Systems) oscillator. As the substrate material of the vibrator 3, in addition to crystal, piezoelectric single crystals such as lithium tantalate and lithium niobate, piezoelectric materials such as piezoelectric ceramics such as lead zirconate titanate, silicon semiconductor materials, and the like are used. be able to. As an excitation means for the vibrator 3, a piezoelectric effect may be used, or an electrostatic drive using a Coulomb force may be used. The integrated circuit 2 is a circuit that oscillates the vibrator 3 and outputs an oscillation signal.

The package 4 accommodates the integrated circuit 2 and the vibrator 3 in the same space. Specifically, the package 4 is provided with a recess, and the recess is covered with the lid 5 to form the storage chamber 7 . Inside the package 4 or on the surface of the recess, two terminals of the integrated circuit 2, specifically, an XI terminal and an XO terminal shown in FIG. Wiring (not shown) is provided for electrical connection. Wiring (not shown) for electrically connecting each terminal of the integrated circuit 2 and each external terminal 6 provided on the bottom surface of the package 4 is provided inside the package 4 or on the surface of the recess. . Note that the package 4 is not limited to a configuration in which the integrated circuit 2 and the vibrator 3 are housed in the same space. For example, it may be a so-called H-shaped package in which the integrated circuit 2 is mounted on one surface of the substrate of the package and the vibrator 3 is mounted on the other surface.

The vibrator 3 has metal excitation electrodes 3a and 3b on its front and back surfaces, respectively, and oscillates at a desired frequency according to the shape and mass of the vibrator 3 including the excitation electrodes 3a and 3b.

FIG. 3 is a functional block diagram of the oscillator 1 of the first embodiment. As shown in FIG. 3, oscillator 1 of the first embodiment includes integrated circuit 2 and oscillator 3 . The integrated circuit 2 has a VDD terminal, a GND terminal, an OUT terminal, a VC terminal, an XI terminal and an XO terminal as external connection terminals. A VDD terminal, a GND terminal, an OUT terminal, and a VC terminal are electrically connected to terminals T1 to T4, which are a plurality of external terminals 6 of the oscillator 1 shown in FIG. The XI terminal is electrically connected to one end of the vibrator 3 and the terminal XO is electrically connected to the other end of the vibrator 3 .

In this embodiment, the integrated circuit 2 includes an oscillation circuit 10, an amplitude control circuit 20, an output circuit 30, a temperature compensation circuit 40, a temperature sensor 42, a regulator circuit 50, a memory 60, a switch circuit 70, a serial interface circuit 80, an amplitude It includes a detection circuit 90 and a heating period control circuit 92 . The integrated circuit 2 of this embodiment may have a configuration in which some of these elements are omitted or changed, or other elements are added.

The oscillation circuit 10 is a circuit that causes the vibrator 3 to oscillate, and amplifies the output signal of the vibrator 3 and feeds it back to the vibrator 3 . The oscillation circuit 10 outputs an oscillation signal VOSC based on oscillation of the vibrator 3 .

The temperature sensor 42 detects the temperature of the integrated circuit 2 and outputs a temperature signal having a voltage corresponding to the temperature, and is realized by, for example, a circuit utilizing the temperature characteristics of a bandgap reference circuit.

The temperature compensating circuit 40 is a circuit that compensates for the temperature characteristics of the vibrator 3 based on the output signal of the temperature sensor 42 . In this embodiment, the temperature compensation circuit 40 calculates the temperature compensation voltage based on the temperature signal output from the temperature sensor 42 and the coefficient value corresponding to the frequency temperature characteristic of the vibrator 3 stored in the memory 60. Generate VCOMP. This temperature-compensated voltage VCOMP is applied to one end of a variable capacitance element (not shown) functioning as a load capacitance of the oscillation circuit 10 to control the oscillation frequency. The temperature compensation circuit 40 is a circuit that compensates for the temperature characteristics of the vibrator 3 by converting the frequency of the oscillation signal VOSC output from the oscillation circuit 10 according to the temperature characteristics of the vibrator 3. good too. Such a circuit is implemented by, for example, a fractional N-PLL circuit.

The output circuit 30 receives an oscillation signal VOSC, which is a signal output from the oscillation circuit 10, and outputs an oscillation signal VOUT. For example, when the oscillator 1 is used as an oscillator for GPS used in cellular, etc., a high frequency temperature compensation accuracy of ±0.5 ppm, for example, is required. Therefore, in the present embodiment, the output voltage amplitude of the output circuit 30 is stabilized by the regulator circuit 50, and from the viewpoint of low current consumption, the output circuit 30 suppresses the output amplitude of the clipped sine waveform oscillation signal VOUT. to output

The amplitude control circuit 20 is a circuit for controlling the amplitude of the oscillation signal VOUT output by the output circuit 30 .

The regulator circuit 50 generates a constant voltage Vreg as a power supply voltage or a reference voltage for the oscillation circuit 10, the temperature compensation circuit 40, the output circuit 30, etc., based on the power supply voltage supplied from the VDD terminal.

The memory 60 has a register (not shown) and a non-volatile memory such as a MONOS (Metal Oxide Nitride Oxide Silicon) type memory or an EEPROM (Electrically Erasable Programmable Read-Only Memory). , through a serial interface circuit 80, read/write to a non-volatile memory or register is possible. In this embodiment, since there are only four terminals, VDD, GND, OUT, and VC, of the integrated circuit 2 connected to the external terminal 6 of the oscillator 1, the serial interface circuit 80 is designed so that, for example, the voltage of the VDD terminal is higher than the threshold. When the voltage is high, a clock signal externally input from the VC terminal and a data signal externally input from the OUT terminal may be received, and data may be read/written to a nonvolatile memory (not shown) or an internal register. . The serial interface circuit 80 may be, for example, a two-wire bus interface circuit such as an I ² C (Inter-Integrated Circuit) bus, a three-wire bus such as an SPI (Serial Peripheral Interface) bus, or a It may be a four-wire bus interface circuit.

The switch circuit 70 is a circuit for switching electrical connection between the temperature compensation circuit 40 and the OUT terminal electrically connected to the output side of the output circuit 30 .

In this embodiment, in the inspection process before shipment of the oscillator 1, the test signal TP of low level or high level can be input to the VC terminal. fixed to the level. When the test signal TP input to the VC terminal is low level, the switch circuit 70 does not electrically connect the temperature compensation circuit 40 and the OUT terminal, and the oscillation signal VOUT output from the output circuit 30 is output to the OUT terminal. be done. When the test signal TP is at high level, the switch circuit 70 electrically connects the temperature compensation circuit 40 and the OUT terminal, the output of the oscillation signal VOUT from the output circuit 30 is stopped, and the temperature compensation voltage VCOMP is output. output to the terminal.

The memory 60 stores oscillation stage current adjustment data IADJ for adjusting and selecting the oscillation stage current of the oscillation circuit 10 according to the frequency of the vibrator 3 . The memory 60 also stores frequency division switching data DIV for selecting whether or not to divide the frequency of the oscillation signal VOSC by a frequency dividing circuit provided inside the output circuit 30 and output it. The memory 60 also stores output level adjustment data VADJ for adjusting the amplitude level of the clipped sine wave oscillation signal VOUT output by the output circuit 30 .

These data are stored in the non-volatile memory of the memory 60 during the manufacturing process of the oscillator 1 . In the manufacturing process of the oscillator 1, the non-volatile memory also stores 0th-order, 1st-order, and 3rd-order coefficient values (not shown) corresponding to the frequency-temperature characteristics of the oscillator 3. FIG. Each data stored in the nonvolatile memory is written from the nonvolatile memory to each register immediately after the oscillator 1 is activated, that is, immediately after the supply of the power supply voltage to the VDD terminal is started.

The amplitude detection circuit 90 detects the amplitude of the oscillation signal VOSC, which is the signal output from the oscillation circuit 10, and outputs a detection signal VDET. In this embodiment, the detection signal VDET is low level when the amplitude of the oscillation signal VOSC is smaller than a predetermined threshold, and is high level when the amplitude of the oscillation signal VOSC is larger than the threshold.

The heat generation period control circuit 92 outputs the heat generation control signal HTCTL based on the detection signal VDET output from the amplitude detection circuit 90 . In this embodiment, when the detection signal VDET is at low level, the heat generation control signal HTCTL is at low level. Also, in synchronization with the timing at which the detection signal VDET changes from low level to high level, the heat generation control signal HTCTL changes from low level to high level. That is, the low level period of the heat generation control signal HTCTL is set based on the detection signal VDET. For example, immediately after the detection signal VDET changes from low level to high level, the heat generation control signal HTCTL may change from low level to high level. As time elapses, the heat generation control signal HTCTL may change from low level to high level. Since the amplitude of the oscillation signal VOSC is smaller than the threshold immediately after the oscillator 1 is started, the detection signal VDET is at low level and the heat control signal HTCTL is also at low level. After that, when the amplitude of the oscillation signal VOSC becomes larger than the threshold, the detection signal VDET changes from low level to high level, and as a result, the heat generation control signal HTCTL also changes from low level to high level.

As will be described later, the amplitude control circuit 20 has a heat generation circuit, and heat generation of the heat generation circuit is controlled based on the heat generation control signal HTCTL and the test signal TP. In this embodiment, the heat generating circuit is controlled to generate heat when the heat generation control signal HTCTL is at low level or the test signal is at high level.

[Structure of Oscillation Circuit]
FIG. 4 is a diagram showing a configuration example of the oscillation circuit 10 of FIG. Although the oscillation stage current adjustment data IADJ is 4 bits in FIG. 4, it may be 2 bits or less, or may be 5 bits or more. As shown in FIG. 4, the oscillation circuit 10 includes an oscillation section 11 and a current source circuit 12 . The oscillator 11 is connected to the vibrator 3 to form a Pierce-type oscillator circuit. In the oscillator 11, varicap diodes VCD1 and VCD2, which are variable capacitance elements, are connected in series in parallel with the vibrator 3. When a temperature compensation voltage VCOMP is applied to the varicap diodes VCD1 and VCD2, the temperature changes. On the other hand, the capacitance value of the oscillator 11 changes, and an oscillation signal VOSC in which the frequency temperature characteristic of the vibrator 3 is compensated is output.

The current source circuit 12 generates a current Iref that serves as a reference for the oscillation stage current Iosc by means of a current adjusting section in which a differential amplifier AMP1, a PMOS transistor M2, a bipolar transistor Q2, and a resistor R1 and a plurality of resistors R2 are connected in parallel. do. The reference current Iref is adjusted by oscillation stage current adjustment data IADJ. The size of the gate width of the PMOS transistor M1 and the size of the gate width of the PMOS transistor M2 have a ratio of 10:1, for example. The gate width size of the PMOS transistor M3 and the gate width size of the PMOS transistor M4 also have a similar size ratio. For example, if Iref=20 μA, 200 μA, which is ten times as large, is supplied to the oscillator 11 as the oscillation stage current Iosc. A circuit composed of a differential amplifier AMP2, a PMOS transistor M4, a current source for passing a bias current Ibias, and PMOS transistors M5 and M6 further reduces the power supply dependence of the oscillation stage current Iosc flowing through the cascode-connected PMOS transistors M1 and M3. It is a circuit for suppressing. This circuit is a gain-enhanced cascode circuit that further reduces the power supply dependency of the current output by the current source in a TCXO that requires high frequency accuracy, compared to the cascode circuit. This cascode circuit monitors the source voltage of the PMOS transistor M4 on the reference side, and when the power supply voltage supplied from the VDD terminal fluctuates, the gate voltages of the PMOS transistors M3 and M4 are controlled by the differential amplifier AMP2, It further suppresses the change in the potential difference between the source and drain of the PMOS transistors M1 and M2. The output resistance of the current source circuit 12 is further increased by the gain times the differential amplifier AMP2. The oscillation stage current Iosc is stabilized with respect to fluctuations in the power supply voltage, and fluctuations in the oscillation frequency of the oscillator 11 can be suppressed.

[Configuration of output circuit]
FIG. 5 is a diagram showing a configuration example of the output circuit 30 of FIG. As shown in FIG. 5, the output circuit 30 is supplied with the output voltage Vreg of the regulator circuit 50 and the clipped voltage Vclip for obtaining the clipped sine wave output generated by the amplitude control circuit 20 . The output circuit 30 includes a frequency dividing circuit, and the frequency dividing circuit determines whether or not to divide the oscillation signal VOSC output from the oscillation circuit 10 by two based on the value of the frequency division switching data DIV. configured to be selectable. In this embodiment, when the value of the frequency division switching data DIV is 0, the oscillation signal VOSC is not frequency-divided, but its polarity is inverted by the inverter composed of the MOS transistors M1 to M4, and the signal at the node VBUF1 is transferred to the NOR circuit NOR1. to On the other hand, when the frequency division switching data DIV has a value of 1, the oscillation signal VOSC is frequency-divided into 1/2 by the frequency dividing circuit, and the signal of the node VBUF1 is transmitted to the NOR circuit NOR1.

As described above, since the heat generation control signal HTCTL is at low level immediately after the oscillator 1 is started, the MOS transistors M2 and M3 are turned off, and the output node VBUF2 of the NOR circuit NOR1 and the output node VBUF3 of the NOR circuit NOR2 are both at the ground potential. , and the NMOS transistors M5 and M6 are both turned off. As a result, the output circuit 30 becomes inoperative. After that, when the heat generation control signal HTCTL changes from low level to high level, the output circuit 30 becomes operable, and the oscillation signal VOSC is clipped at the voltage amplitude level determined by the clip voltage Vclip and output as the oscillation signal VOUT.

Further, in the manufacturing process of the oscillator 1, when adjusting the temperature compensating circuit 40 of FIG. 3, the test signal TP is set to high level. As a result, the MOS transistors M2 and M3 are turned off, the output node VBUF2 of the NOR circuit NOR1 and the output node VBUF3 of the NOR circuit NOR2 are both grounded, and the NMOS transistors M5 and M6 are both turned off. As a result, the output circuit 30 becomes inoperative.

[Configuration of Amplitude Control Circuit]
FIG. 6 is a diagram showing a configuration example of the amplitude control circuit 20 of FIG. As shown in FIG. 6, the amplitude control circuit 20 includes a heating circuit 21, a replica circuit 22 and a decoder 23. In FIG. 6, NMOS transistors M1, M2 and M3 are depletion type MOS transistors, and the other MOS transistors are enhancement type MOS transistors.

As shown in the following equation (1), the clip voltage Vclip that determines the output amplitude level of the output circuit 30 is obtained by subtracting the gate-source voltage Vgs M2 of the MOS transistor M2 from the output voltage _Vg of the differential amplifier AMP of the replica circuit 22. Subtracted voltage.

The output voltage Vg of the differential amplifier AMP is obtained by the following equation (2) from the analog voltage Vdac D/A-converted by the D/A converter DAC based on the data given by the output level adjustment data VADJ.

By substituting the formula (2) into the formula (1), the relationship of the following formula (3) is established. That is, the clip voltage Vclip is determined by Vdac·(R1/R2+1), which is the voltage obtained by amplifying the output voltage Vdac of the D/A converter DAC by the differential amplifier AMP.

As described above, the waveform of the oscillation signal VOUT output by the output circuit 30 is a clipped sine wave, and the higher the output frequency, the lower the peak value of the clipped sine wave. Adjustment data VADJ is stored in memory 60 .

In the shipped oscillator 1, the test signal TP is fixed at a low level, so the switch circuit SW1 is on and the NMOS switch SW2 is off. As a result, the amplitude control circuit 20 is put into an operating state and outputs the clip voltage Vclip shown by the equation (1).

Further, immediately after the oscillator 1 is started, the heat generation control signal HTCTL is at the low level, so the MOS transistor M3B of the heat generation circuit 21 is turned on, and the heat generation circuit 21 is put into operation. As a result, a DC current Iht flows through the heating circuit 21 to generate heat. Thereafter, when the heat generation control signal HTCTL changes from low level to high level, the MOS transistor M
3B changes from the ON state to the OFF state, and the heat generating circuit 21 is put into a non-operating state. As described above, in the present embodiment, the heating circuit 21 generates heat immediately after the oscillator 1 is started, and the heat is transmitted to the vibrator 3 through the XI terminal and the XO terminal, thereby accelerating the temperature rise of the vibrator 3. After that, the heating circuit 21 stops generating heat, and the temperature rise of the vibrator 3 is suppressed. As a result, it is possible to shorten the time required to reach a thermal equilibrium state in which the temperature of the integrated circuit 2 and the temperature of the vibrator 3 match.

On the other hand, in the manufacturing process of the oscillator 1, the test signal TP is set to high level when the temperature compensation circuit 40 is adjusted. Therefore, the switch circuit SW1 is turned off, the NMOS switch SW2 is turned on, and the NMOS transistor M2 is turned off. Also, the MOS transistor M3B is turned on, and the heating circuit 21 is put into operation.

The decoder 23 controls the DC current Iht flowing through the heating circuit 21 based on the test signal TP, the oscillation stage current adjustment data IADJ, and the frequency division switching data DIV. Specifically, when the test signal TP is at high level, the decoder 23 controls the resistance value of the variable resistor VR according to the oscillation stage current adjustment data IADJ and the frequency division switching data DIV. As a result, the current Iht flowing through the heating circuit 21 when the test signal TP is at high level is interlocked with the value of the oscillation stage current adjustment data IADJ, the value of the division switching data DIV, and the value of the output level adjustment data VADJ. , and approaches the current consumed by the output circuit 30 when the test signal TP is at low level. As a result, the difference between the current consumption of the integrated circuit 2 when the test signal TP is at low level and the current consumption of the integrated circuit 2 when the test signal TP is at high level is reduced. That is, the difference between the current consumption of the integrated circuit 2 when the output circuit 30 is in the operating state and the current consumption of the integrated circuit 2 when the output circuit 30 is in the stopped state is reduced.

Further, the decoder 23 controls the variable resistor VR of the heating circuit 21 to a predetermined resistance value when the test signal TP is at low level. As the resistance value of the variable resistor VR increases, the DC current Iht flowing through the heating circuit 21 when the heat generation control signal HTCTL is at low level increases. The resistance value of the variable resistor VR is preferably set so that the time required for the integrated circuit 2 and vibrator 3 to reach thermal equilibrium is as short as possible. When the test signal TP is at a low level, the variable resistor VR is controlled to have a predetermined resistance regardless of the logic level of the heat generation control signal HTCTL. DC current Iht does not flow.

[Relationship between temperature of integrated circuit and vibrator]
In the oscillator 1 of the present embodiment, the direct current Iht is caused to flow through the heat generating circuit 21 immediately after startup, so that the integrated circuit 2 and the vibrator 3 are more in thermal equilibrium than the oscillator of the comparative example in which the direct current Iht does not flow through the heat generating circuit 21. It can shorten the time to reach the state.

FIG. 7 is a diagram showing an example of the operation of the oscillator of the comparative example. FIG. 8 is a diagram showing an example of the operation of the oscillator 1 of this embodiment. 7 and 8, A1 indicates changes in the power supply voltage supplied to the VDD terminal, A2 indicates the waveform of the oscillation signal VOSC, and A3 indicates the waveform of the oscillation signal VOUT. A4 indicates the power consumption of the integrated circuit 2, A5 indicates the temperature of the integrated circuit 2 and the temperature of the vibrator 3, and A6 indicates the frequency deviation of the oscillation frequency. In A5, the solid line indicates the temperature change of the integrated circuit 2, and the dashed line indicates the temperature change of the vibrator 3. FIG.

As indicated by A1 in FIGS. 7 and 8, at time t0, when the supply of the power supply voltage to the VDD terminal is started, the vibrator 3 oscillates and the amplitude of the oscillation signal VOSC gradually increases, as indicated by A2. grow to Then, when the amplitude of the oscillation signal VOSC becomes larger than the threshold, the oscillation signal VOUT is generated at time t1, as indicated by A3. After that, at time t4, V
Supply of the power supply voltage to the DD terminal ends, and the operation of the oscillator 1 stops.

In the oscillator of the comparative example, as indicated by A4 in FIG. 7, in the first period P1 from time t0 to time t1, the current consumption is I0 because the output circuit 30 stops operating, whereas the consumption current is I0 at time t1. to time t4, the current consumption is I1, which is larger than I0, because the output circuit 30 operates. Therefore, the amount of heat generated in the first period P1 becomes smaller than the amount of heat generated in the second period P2. It rises slowly following the temperature. Then, at time t3 of the second period P2, the integrated circuit 2 and the vibrator 3 are in thermal equilibrium, and the deviation of the oscillation frequency becomes almost zero as indicated by A6.

On the other hand, in the oscillator 1 of the present embodiment, a current flows through the heating circuit 21 to generate heat in the first period P1 after the supply of the power supply voltage from the outside is started, and after the first period P1 ends, the heat is generated. No current flows during the second period P2 of . The first period P1 is a period in which the heat generation control signal HTCTL is at low level, and is set based on the detection signal VDET output from the amplitude detection circuit 90 as described above. The output circuit 30 stops operating in the first period P1 and operates in the second period P2. At P2, it is greater than the power consumed by the output circuit 30 per unit time. Therefore, as indicated by A4 in FIG. 8, the current consumption I2 during the first period P1 is greater than the current consumption I1 during the second period P2. As a result, the integrated circuit 2 generates heat with the first heat generation amount per unit time in the first period P1, and heats with the second heat generation amount per unit time in the second period P2 after the first period P1 ends. Heat is generated, and the first calorific value is greater than the second calorific value. Therefore, in the first period P1, the temperature of the integrated circuit 2 sharply rises, and the temperature of the vibrator 3 follows the temperature of the integrated circuit 2 and rises sharply. At time t2, which is earlier than time t3 of the second period P2, the integrated circuit 2 and the resonator 3 are in thermal equilibrium, and the deviation of the oscillation frequency becomes almost zero as indicated by A6. As described above, in the oscillator 1 of the present embodiment, the time required for the integrated circuit 2 and the vibrator 3 to reach a state of thermal equilibrium is shortened as compared with the oscillator of the comparative example.

In the oscillator 1 of the present embodiment, even if the power consumed per unit time by the heating circuit 21 during the first period P1 is smaller than the power consumed per unit time by the output circuit 30 during the second period P2, Since the consumption current I0 in the first period P1 is larger than that of the oscillator of the comparative example, the time required for the integrated circuit 2 and the vibrator 3 to reach thermal equilibrium is shortened.

[Layout of integrated circuit]
In this embodiment, the layout of the integrated circuit 2 is devised so that the heat generated by the integrated circuit 2 can be easily transferred to the vibrator 3 . FIG. 9 is a plan view of a semiconductor substrate 100 on which elements are formed in the integrated circuit 2. As shown in FIG. As shown in FIG. 9, in this embodiment, the shortest distance d1 between the heat generating circuit 21 and the XI terminal is the shortest distance d3 between the heat generating circuit 21 and the VC terminal, the shortest distance d4 between the heat generating circuit 21 and the VDD terminal, the shortest distance d4 between the heat generating circuit 21 and the VDD terminal, It is shorter than the shortest distance d5 between the circuit 21 and the VSS terminal and the shortest distance d6 between the heating circuit 21 and the OUT terminal. Similarly, the shortest distance d2 between the heating circuit 21 and the XO terminal is the shortest distance d3 between the heating circuit 21 and the VC terminal, the shortest distance d4 between the heating circuit 21 and the VDD terminal, and the shortest distance between the heating circuit 21 and the VSS terminal. shorter than d5 and the shortest distance d6 between the heating circuit 21 and the OUT terminal. That is, the heating circuit 21 has the shortest distance from the XI terminal or the XO terminal among the plurality of external connection terminals of the integrated circuit 2 . In other words, of the plurality of external connection terminals of the integrated circuit 2 , the XI terminal or the XO terminal is closest to the heat generating circuit 21 . Therefore, the heat generated by the heat generating circuit 21 is efficiently transmitted to the vibrator 3 through the XI terminal and the XO terminal, speeding up the temperature rise of the vibrator 3 and allowing the integrated circuit 2 and the vibrator 3 to reach thermal equilibrium. time is reduced.

Further, as shown in FIG. 9, in this embodiment, the shortest distance d7 between the temperature sensor 42 and the XI terminal is the shortest distance d9 between the temperature sensor 42 and the VC terminal, and the shortest distance d10 between the temperature sensor 42 and the VDD terminal. , the shortest distance d11 between the temperature sensor 42 and the VSS terminal, and the shortest distance d12 between the temperature sensor 42 and the OUT terminal. Similarly, the shortest distance d8 between the temperature sensor 42 and the XO terminal is the shortest distance d9 between the temperature sensor 42 and the VC terminal, the shortest distance d10 between the temperature sensor 42 and the VDD terminal, and the shortest distance d10 between the temperature sensor 42 and the VSS terminal. d11 and the shortest distance d12 between the temperature sensor 42 and the OUT terminal. That is, the temperature sensor 42 has the longest distance from the XI terminal or the XO terminal among the plurality of external connection terminals of the integrated circuit 2 . In other words, of the plurality of external connection terminals of the integrated circuit 2 , the XI terminal or the XO terminal is the farthest from the temperature sensor 42 . Therefore, since the temperature sensor 42 is distant from the heat generating circuit 21, it detects a temperature lower than the temperature of the heat generating circuit 21, so that the difference between the temperature detected by the temperature sensor 42 and the temperature of the vibrator 3 becomes small. It is possible to reduce the frequency deviation when the output of the oscillation signal VOSC is started.

Also, the shortest distance d1 between the heating circuit 21 and the XI terminal is smaller than the shortest distance d7 between the temperature sensor 42 and the XI terminal. Similarly, the shortest distance d2 between the heating circuit 21 and the XO terminal is smaller than the shortest distance d8 between the temperature sensor 42 and the XO terminal. Therefore, the heat generated by the heating circuit 21 is more easily transmitted to the vibrator 3 via the XI terminal and the XO terminal than the temperature sensor 42, so that the difference between the temperature detected by the temperature sensor 42 and the temperature of the vibrator 3 is small. Become.

The XI terminal is an example of a "first external connection terminal", and the XO terminal is an example of a "second external connection terminal".

[Effect]
As described above, in the oscillator 1 of the first embodiment, the power consumption of the integrated circuit 2 in the second period P2 is is greater than the power consumption of the integrated circuit 2 in the second period P2 after the first period P1. As a result, the amount of heat generated by the integrated circuit 2 during the first period P1 is greater than the amount of heat generated by the integrated circuit 2 during the second period P2, and the heat from the integrated circuit 2 is efficiently transmitted to the vibrator 3. Therefore, the temperature rise of the oscillator 3 is accelerated, the time required for the integrated circuit 2 and the oscillator 3 to reach thermal equilibrium is shortened, and the frequency deviation at the start of outputting the oscillation signal VOSC is reduced. Therefore, according to the oscillator 1 of the first embodiment, it is possible to reduce the frequency deviation of the oscillation signal at startup.

Further, according to the oscillator 1 of the first embodiment, when adjusting the temperature compensating circuit 40, the current flowing through the heating circuit 21 is adjusted in conjunction with the oscillation stage current adjustment data, the output level adjustment data VADJ, and the frequency division switching data DIV. By changing it, a current corresponding to the current consumed by the output circuit 30 during normal operation can be generated with high accuracy, so the reduction in the differential current enables highly accurate frequency temperature compensation. Further, in the oscillator 1 of the first embodiment, the circuit area of the integrated circuit 2 is reduced by using the heating circuit 21 for both the first period P1 and the adjustment of the temperature compensating circuit 40 .

1-2. Second Embodiment Hereinafter, regarding the oscillator 1 of the second embodiment, the same reference numerals are given to the same configurations as in the first embodiment, and the same description as in the first embodiment will be omitted or simplified, and mainly the first embodiment will be described. I will explain the different contents.

FIG. 10 is a functional block diagram of the oscillator 1 of the second embodiment. As shown in FIG. 10, in the oscillator 1 of the second embodiment, the memory 60 of the integrated circuit 2 stores heat generation control current adjustment data IADJ2 for adjusting and selecting the current to be supplied to the heat generation circuit 21 in the first period P1. It is The heating control current adjustment data IADJ2 is stored in the non-volatile memory of the memory 60 during the manufacturing process of the oscillator 1 . The heating control current adjustment data IADJ2 stored in the nonvolatile memory is written from the nonvolatile memory to the register immediately after the oscillator 1 is activated, that is, immediately after the supply of the power supply voltage to the VDD terminal is started.

The amplitude control circuit 20 adjusts and selects the current to be supplied to the heating circuit 21 in the first period P1 based on the heating control current adjustment data IADJ2.

FIG. 11 is a diagram showing a configuration example of the amplitude control circuit 20 of FIG. As shown in FIG. 11, in the amplitude control circuit 20, the decoder 23 controls the direct current flowing through the heating circuit 21 based on the test signal TP, the oscillation stage current adjustment data IADJ, the frequency division switching data DIV, and the heat generation control current adjustment data IADJ2. Control the current Iht. Specifically, when the test signal TP is at high level, the decoder 23 controls the resistance value of the variable resistor VR according to the oscillation stage current adjustment data IADJ and the frequency division switching data DIV, as in the first embodiment. .

Further, when the test signal TP is at low level, the decoder 23 adjusts the variable resistor VR of the heating circuit 21 according to the heating control current adjustment data IADJ2 in the first period P1 in which the heating control signal HTCTL is at low level. value control. A DC current Iht corresponding to the resistance value of the variable resistor VR flows through the heating circuit 21 . That is, in the oscillator 1 of the second embodiment, the current flowing through the heating circuit 21 is variable during the first period P1.

FIG. 12 is a diagram showing an example of the operation of the oscillator 1 of the second embodiment. In FIG. 12, B1 indicates changes in the power supply voltage supplied to the VDD terminal, B2 indicates the waveform of the oscillation signal VOSC, and B3 indicates the waveform of the oscillation signal VOUT. B4 indicates the power consumption of the integrated circuit 2, B5 indicates the temperature of the integrated circuit 2 and the temperature of the vibrator 3, and B6 indicates the frequency deviation of the oscillation frequency. In B5, the solid line indicates the temperature change of the integrated circuit 2, and the dashed line indicates the temperature change of the vibrator 3. FIG.

As indicated by B1 in FIG. 12, when supply of the power supply voltage to the VDD terminal is started at time t0, the vibrator 3 oscillates and the amplitude of the oscillation signal VOSC gradually increases, as indicated by B2. . Then, when the amplitude of the oscillation signal VOSC becomes larger than the threshold, the oscillation signal VOUT is generated at time t1, as indicated by B3. After that, at time t4, the supply of the power supply voltage to the VDD terminal ends, and the operation of the oscillator 1 stops.

In the oscillator 1 of the second embodiment, in the first period P1, a current corresponding to the heat generation control current adjustment data IADJ2 flows through the heating circuit 21 to generate heat. does not flow. That is, in this embodiment, as indicated by B4, the consumption current I2 in the first period P1 can be adjusted. The output circuit 30 stops operating in the first period P1 and operates in the second period P2. At P2, it is greater than the power consumed by the output circuit 30 per unit time. Therefore, as indicated by B4, the current consumption I2 during the first period P1 is greater than the current consumption I1 during the second period P2. As a result, the integrated circuit 2 generates heat with the first heat generation amount per unit time in the first period P1, and heats with the second heat generation amount per unit time in the second period P2 after the first period P1 ends. Heat is generated, and the first calorific value is greater than the second calorific value. Therefore, in the first period P1, the temperature of the integrated circuit 2 sharply rises, and the temperature of the vibrator 3 follows the temperature of the integrated circuit 2 and rises sharply. Then, at time t2 of the second period P2, the integrated circuit 2 and the vibrator 3 are in thermal equilibrium, and the deviation of the oscillation frequency becomes almost zero as indicated by B6. Thus, according to the oscillator 1 of the second embodiment, as in the first embodiment, the time required for the integrated circuit 2 and the vibrator 3 to reach a state of thermal equilibrium is shortened compared to the oscillator of the comparative example described above. be done. Furthermore, according to the oscillator 1 of the second embodiment, the current flowing through the heating circuit 21 in the first period P1 can be adjusted according to individual differences in the oscillator 1. Therefore, even if there is an individual difference in the oscillator 1, It is possible to reliably shorten the time until the integrated circuit 2 and the vibrator 3 reach a state of thermal equilibrium.

1-3. Third Embodiment Hereinafter, regarding the oscillator 1 of the third embodiment, the same reference numerals are given to the same configurations as in the first embodiment, and the same description as in the first embodiment will be omitted or simplified, and mainly the first embodiment will be described. I will explain the different contents.

FIG. 13 is a functional block diagram of the oscillator 1 of the third embodiment. As shown in FIG. 13, the oscillator 1 of the third embodiment stores heat generation period adjustment data TADJ for adjusting/selecting the length of the first period P1 in which the current flows through the heat generation circuit 21 in the memory 60 of the integrated circuit 2. is stored. The heating period adjustment data TADJ is stored in the non-volatile memory of the memory 60 during the manufacturing process of the oscillator 1 . The heating period adjustment data TADJ stored in the nonvolatile memory is written from the nonvolatile memory to the register immediately after the oscillator 1 is activated, ie, immediately after the supply of the power supply voltage to the VDD terminal is started.

The heating period control circuit 92 outputs the heating control signal HTCTL based on the detection signal VDET output from the amplitude detection circuit 90 and the heating period adjustment data TADJ. In this embodiment, when the detection signal VDET is at low level, the heat generation control signal HTCTL is at low level. When the time set according to the heat generation period adjustment data TADJ has elapsed from the timing when the detection signal VDET changed from low level to high level, the heat generation control signal HTCTL changes from low level to high level. Specifically, the heat generation period control circuit 92 counts the number of pulses of the oscillation signal VOSC from the timing when the detection signal VDET changes from low level to high level, and when the count value corresponding to the heat generation period adjustment data TADJ is reached. , changes the heat generation control signal HTCTL from low level to high level. Thus, in the oscillator 1 of the third embodiment, the length of the first period P1 is variable.

FIG. 14 is a diagram showing an example of the operation of the oscillator 1 of the third embodiment. In FIG. 14, C1 indicates changes in the power supply voltage supplied to the VDD terminal, C2 indicates the waveform of the oscillation signal VOSC, and C3 indicates the waveform of the oscillation signal VOUT. Also, C4 indicates the power consumption of the integrated circuit 2, C5 indicates the temperature of the integrated circuit 2 and the temperature of the vibrator 3, and C6 indicates the frequency deviation of the oscillation frequency. In C5, the solid line indicates the temperature change of the integrated circuit 2, and the dashed line indicates the temperature change of the vibrator 3. FIG.

As indicated by C1 in FIG. 12, when supply of the power supply voltage to the VDD terminal is started at time t0, the vibrator 3 oscillates and the amplitude of the oscillation signal VOSC gradually increases, as indicated by C2. . Then, when the amplitude of the oscillation signal VOSC becomes larger than the threshold, the oscillation signal VOUT is generated at time t1, as indicated by C3. After that, at time t4, the supply of the power supply voltage to the VDD terminal ends, and the operation of the oscillator 1 stops.

In the oscillator 1 of the second embodiment, current flows through the heating circuit 21 to generate heat during the first period P1, and current does not flow during the second period P2 after the first period P1 ends. In this embodiment, the length of the first period P1 can be adjusted as indicated by C4. The output circuit 30 stops operating in the first period P1 and operates in the second period P2. At P2, it is greater than the power consumed by the output circuit 30 per unit time. Therefore, as indicated by C4, the current consumption I2 during the first period P1 is greater than the current consumption I1 during the second period P2. As a result, the integrated circuit 2 generates heat with the first heat generation amount per unit time in the first period P1, and heats with the second heat generation amount per unit time in the second period P2 after the first period P1 ends. Heat is generated, and the first calorific value is greater than the second calorific value. Therefore, in the first period P1, the temperature of the integrated circuit 2 sharply rises, and the temperature of the vibrator 3 follows the temperature of the integrated circuit 2 and rises sharply. Then, at time t2 of the second period P2, the integrated circuit 2 and the resonator 3 are in thermal equilibrium, and the deviation of the oscillation frequency becomes almost zero as indicated by C6. Thus, according to the oscillator 1 of the second embodiment, as in the first embodiment, the time required for the integrated circuit 2 and the vibrator 3 to reach a state of thermal equilibrium is shortened compared to the oscillator of the comparative example described above. be done. Furthermore, according to the oscillator 1 of the second embodiment, the length of the first period P1 during which the temperature of the integrated circuit 2 sharply rises can be adjusted according to the individual difference of the oscillator 1. Even if there are individual differences, the time required for the integrated circuit 2 and the vibrator 3 to reach a state of thermal equilibrium can be reliably shortened.

1-4. Modifications The above-described second embodiment and third embodiment may be combined. That is, in the oscillator 1, both the length of the first period P1 and the current flowing through the heating circuit 21 during the first period P1 may be variable.

Further, in the above-described third embodiment, the first period P1 ends when the time set according to the heating period adjustment data TADJ has elapsed from the timing when the detection signal VDET changed from low level to high level. However, the first period P1 may end when the time set according to the heating period adjustment data TADJ has elapsed immediately after the oscillator 1 is started. For example, the heat generation period control circuit 92 counts the number of pulses of the oscillation signal VOSC immediately after the oscillator 1 is activated, and when the count value corresponding to the heat generation period adjustment data TADJ is reached, the heat generation control signal HTCTL changes from low level to high level. The first period P1 may be ended by changing to .

In each of the above-described embodiments, the heating circuit 21 is used both for adjusting the first period P1 and for adjusting the temperature compensating circuit 40. A heat generating circuit that sometimes generates heat may be provided separately.

In each of the above-described embodiments, the heating circuit 21 generates heat during the first period P1 and during the adjustment of the temperature compensation circuit 40, but the present invention can also be applied to an oscillator that does not generate heat during the adjustment of the temperature compensation circuit 40.

In addition, in each of the above embodiments, the integrated circuit 2 has the heating circuit 21, but instead of the heating circuit 21 or together with the heating circuit 21, an element having a heater function such as a Peltier element is provided, The element may generate heat during the first period P1.

Further, the oscillator 1 in each of the above embodiments is an oscillator having a temperature compensation function such as a TCXO (Voltage Controlled Temperature Compensated Crystal Oscillator). It may be an oscillator with function and frequency control function.

2. Electronic Device FIG. 15 is a functional block diagram showing an example of the configuration of the electronic device of this embodiment. Also, FIG. 16 is a diagram showing an example of the appearance of a smartphone, which is an example of the electronic device of the present embodiment.

The electronic device 300 of this embodiment includes an oscillator 310 , a CPU (Central Processing Unit) 320 , an operation section 330 , a ROM (Read Only Memory) 340 , a RAM (Random Access Memory) 350 , a communication section 360 and a display section 370 . It is configured. Note that the electronic device of this embodiment may have a configuration in which some of the constituent elements in FIG. 15 are omitted or changed, or other constituent elements are added.

Oscillator 310 comprises integrated circuit 312 and oscillator 313 . The integrated circuit 312 oscillates the oscillator 313 to generate an oscillation signal. This oscillation signal is output from the external terminal of the oscillator 310 to the CPU 320 .

The CPU 320 is a processing unit that performs various calculation processes and control processes according to programs stored in the ROM 340 or the like, using the oscillation signal input from the oscillator 310 as a clock signal. Specifically, the CPU 320 performs various processes according to operation signals from the operation section 330, processing for controlling the communication section 360 for data communication with an external device, and display of various information on the display section 370. It performs processing such as transmitting the display signal of .

The operation unit 330 is an input device including operation keys, button switches, and the like, and outputs operation signals to the CPU 320 according to user's operations.

The ROM 340 is a storage unit that stores programs, data, and the like for the CPU 320 to perform various calculation processes and control processes.

The RAM 350 is used as a work area for the CPU 320, and is a storage unit that temporarily stores programs and data read from the ROM 340, data input from the operation unit 330, calculation results executed by the CPU 320 according to various programs, and the like. .

The communication unit 360 performs various controls for establishing data communication between the CPU 320 and an external device.

The display unit 370 is a display device configured by an LCD (Liquid Crystal Display) or the like, and displays various information based on display signals input from the CPU 320 . The display unit 370 may be provided with a touch panel that functions as the operation unit 330 .

By applying, for example, the oscillator 1 of each embodiment described above as the oscillator 310, the frequency deviation of the oscillation signal at startup can be reduced, so that a highly reliable electronic device can be realized.

Various electronic devices can be considered as such an electronic device 300, for example, personal computers such as mobile type, laptop type, and tablet type, mobile terminals such as smartphones and mobile phones, digital cameras, inkjet printers such as inkjet printers, etc. Storage area network devices such as routers and switches, local area network devices, mobile terminal base station devices, TVs, video cameras, video recorders, car navigation devices, real-time clock devices, pagers, electronic notebooks, electronic dictionaries , calculators, electronic game machines, game controllers, word processors, workstations, videophones, security TV monitors, electronic binoculars, POS terminals, electronic thermometers, sphygmomanometers, blood glucose meters, electrocardiogram measuring devices, ultrasonic diagnostic devices, electronic devices Medical equipment such as scopes, fish finders, various measuring instruments, instruments for vehicles, aircraft, ships, etc., flight simulators, head-mounted displays, motion tracing, motion tracking, motion controllers, pedestrian dead reckoning (PDR: Pedestrian dead Reckoning) device and the like.

An example of the electronic device 300 of this embodiment is a transmission device that functions as a terminal base station device or the like that performs wired or wireless communication with a terminal using the above-described oscillator 310 as a reference signal source. By applying, for example, the oscillator 1 of each embodiment described above as the oscillator 310, the electronic device 300, which can be used for, for example, a communication base station, and which is desired to have high frequency accuracy, high performance, and high reliability, can be manufactured. can also be realized at low cost.

As another example of the electronic device 300 of this embodiment, the communication unit 360 receives an external clock signal, and the CPU 320 controls the frequency of the oscillator 310 based on the external clock signal and the output signal of the oscillator 310. and a frequency control unit that performs the communication. This communication device may be, for example, backbone network equipment such as Stratum 3 or communication equipment used for femtocells.

3. Mobile Object FIG. 17 is a diagram showing an example of a mobile object according to the present embodiment. A moving body 400 shown in FIG. 17 includes an oscillator 410, controllers 420, 430, 440 that perform various controls such as an engine system, a brake system, a keyless entry system, a battery 450, and a backup battery 460. It should be noted that the moving body of this embodiment may have a configuration in which some of the constituent elements shown in FIG. 17 are omitted, or other constituent elements are added.

The oscillator 410 includes an integrated circuit (not shown) and an oscillator, and the integrated circuit oscillates the oscillator to generate an oscillation signal. This oscillation signal is output from the external terminal of the oscillator 410 to the controllers 420, 430 and 440, and used as a clock signal, for example.

Battery 450 powers oscillator 410 and controllers 420 , 430 , 440 . Backup battery 460 supplies power to oscillator 410 and controllers 420, 430, 440 when the output voltage of battery 450 drops below a threshold.

By applying, for example, the oscillator 1 of each embodiment described above as the oscillator 410, the frequency deviation of the oscillation signal at the time of startup can be reduced, so that a highly reliable moving body can be realized.

As such a moving body 400, various moving bodies are conceivable, and examples thereof include automobiles such as electric vehicles, aircraft such as jet planes and helicopters, ships, rockets, and artificial satellites.

The present invention is not limited to this embodiment, and various modifications can be made within the scope of the present invention.

The above-described embodiments and modifications are examples, and the present invention is not limited to these. For example, it is also possible to appropriately combine each embodiment and each modification.

The present invention includes configurations that are substantially the same as the configurations described in the embodiments, for example, configurations that have the same function, method and result, or configurations that have the same purpose and effect. Moreover, the present invention includes configurations obtained by replacing non-essential portions of the configurations described in the embodiments. In addition, the present invention includes a configuration that achieves the same effects or achieves the same purpose as the configurations described in the embodiments. In addition, the present invention includes configurations obtained by adding known techniques to the configurations described in the embodiments.

DESCRIPTION OF SYMBOLS 1... Oscillator 2... Integrated circuit 3... Vibrator 3a... Excitation electrode 3b... Excitation electrode 4... Package 5... Lid 6... External terminal 7... Accommodating chamber 10... Circuit for oscillation 11... oscillator 12
Current source circuit 20 Amplitude control circuit 21 Heat generation circuit 22 Replica circuit 23 Decoder 30 Output circuit 40 Temperature compensation circuit 42 Temperature sensor 50 Regulator circuit 60 Memory 70 Switch circuit 80 Serial interface circuit 90 Amplitude detection circuit 92 Exothermic period control circuit 300 Electronic device 310 Oscillator 312 Integrated circuit 313 Vibrator 320 CPU 330 Operation Unit 340 ROM 350 RAM 360 Communication unit 370 Display unit 400 Moving body 410 Oscillator 420, 430, 440 Controller 450 Battery 460 Backup battery

Claims (9)

an oscillator;
an integrated circuit;
The integrated circuit comprises:
an oscillation circuit for oscillating the vibrator;
a temperature sensor;
a temperature compensation circuit that compensates for the temperature characteristics of the vibrator based on the output signal of the temperature sensor;
an output circuit that receives a signal output from the oscillation circuit and outputs an oscillation signal;
a heating circuit;
The heat generating circuit is
A current flows and heats up in a first period after the supply of the power supply voltage from the outside is started, and no current flows in a second period after the first period ends,
The integrated circuit has a plurality of external connection terminals including a first external connection terminal electrically connected to one end of the vibrator and a second external connection terminal electrically connected to the other end of the vibrator. death,
The oscillator, wherein, of the plurality of external connection terminals, the first external connection terminal or the second external connection terminal is closest to the heat generating circuit . 2. The oscillator according to claim 1 , wherein of said plurality of external connection terminals, said first external connection terminal or said second external connection terminal is the farthest from said temperature sensor. The output circuit is
stop operating during the first period and operate during the second period;
3. The oscillator according to claim 1 , wherein power consumed per unit time by said heat generating circuit during said first period is greater than power consumed per unit time by said output circuit during said second period. an oscillator;
an integrated circuit;
The integrated circuit comprises:
an oscillation circuit for oscillating the vibrator;
a temperature sensor;
a temperature compensation circuit that compensates for the temperature characteristics of the vibrator based on the output signal of the temperature sensor;
an output circuit that receives a signal output from the oscillation circuit and outputs an oscillation signal;
a heating circuit;
The heat generating circuit is
A current flows and heats up in a first period after the supply of the power supply voltage from the outside is started, and no current flows in a second period after the first period ends,
The output circuit is
stop operating during the first period and operate during the second period;
The oscillator, wherein the power consumed per unit time by the heat generation circuit during the first period is greater than the power consumed per unit time by the output circuit during the second period. 5. The oscillator according to any one of claims 1 to 4 , wherein the current flowing through said heating circuit during said first period is variable. 6. An oscillator as claimed in any preceding claim, wherein the length of the first period is variable. The integrated circuit comprises:
an amplitude detection circuit that detects the amplitude of the signal output from the oscillation circuit and outputs a detection signal;
7. The oscillator according to any one of claims 1 to 6 , wherein said first period is set based on said detection signal. An electronic device comprising the oscillator according to claim 1 . A moving object comprising the oscillator according to any one of claims 1 to 7 .

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