JP2016152540A - Adjustment method of oscillation circuit, oscillation circuit, electronic apparatus and mobile - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adjustment method of an oscillation circuit capable of reducing increase in the capacity of a storage section.SOLUTION: An adjustment method of an oscillation circuit 2 having a circuit 10 for oscillation connected electrically with a vibrator 3 and oscillating the vibrator 3, an output circuit 20 receiving a signal outputted from the circuit 10 for oscillation and outputting an oscillation signal, and a storage section 60 storing the data for controlling at least one of the circuit 10 for oscillation and the output circuit 20, includes a step (S110) for storing first data in the storage section 60, a step (S120) for controlling oscillation circuit 2 based on the first data, and a step (S150) for erasing the first data from the storage section 60, and storing second data.SELECTED DRAWING: Figure 12

Description

  The present invention relates to a method for adjusting an oscillation circuit, an oscillation circuit, an electronic device, and a moving object.

  In Patent Document 1, a storage unit that stores data corresponding to an operation mode selected from a plurality of operation modes prepared in advance, and an operation mode is determined based on the data stored in the storage unit An oscillator is disclosed that includes a determination unit that performs, and a current source that operates based on the operation mode determined by the determination unit, a current source switch, an inverter switch, and a temperature compensation unit switch.

JP 2009-290381 A

  However, in the oscillator described in Patent Document 1, for example, when at least one of a plurality of operation modes is a mode (inspection mode) used for inspection of the oscillator, the storage unit is necessary for normal operation of the oscillator. In addition to the capacity for storing data, a capacity for storing data corresponding to an unnecessary inspection mode is also required during normal operation of the oscillator, which increases the capacity of the storage unit.

  The present invention has been made in view of the above problems, and according to some aspects of the present invention, an oscillation circuit adjustment method and an oscillation that can reduce an increase in the capacity of a storage unit A circuit can be provided. In addition, according to some embodiments of the present invention, it is possible to provide an electronic device and a moving body using the oscillation circuit.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following aspects or application examples.

[Application Example 1]
An oscillation circuit adjustment method according to this application example includes an oscillation circuit that is electrically connected to a vibrator and oscillates the vibrator, and a signal output from the oscillation circuit is input to output an oscillation signal An oscillation circuit adjustment method comprising: an output circuit; and a storage unit storing data for controlling at least one of the oscillation circuit and the output circuit, wherein the storage unit stores first data A step of storing, the oscillation circuit is controlled based on the first data, a step of adjusting the oscillation circuit, erasing the first data from the storage unit, and second data Memorizing.

  The oscillation circuit may be a part or all of various oscillation circuits such as a Pierce oscillation circuit, an inverter type oscillation circuit, a Colpitts oscillation circuit, and a Hartley oscillation circuit.

For example, the first data operates in the step of adjusting the oscillation circuit, and the first circuit stops operation in the step of oscillation of the adjusted oscillation circuit (for example, during normal operation) (for example, heat generation) Circuit), and the second data may be data for controlling the second circuit that operates in the process in which the adjusted oscillation circuit oscillates. The second circuit may operate or may stop operating in the step of adjusting the oscillation circuit.

  For example, the first data and the second data may each include a plurality of types of data.

  According to the adjustment method of the oscillation circuit according to this application example, after the adjustment is performed in a state where the oscillation circuit is controlled based on the first data stored in the storage unit, the unnecessary first data is Since the necessary second data is erased from the storage unit and stored in the storage unit, an increase in the capacity of the storage unit can be reduced.

[Application Example 2]
In the adjustment method of the oscillation circuit according to the application example, the number of bits of the first data is less than or equal to the number of bits of the second data, and the second data is the first data of the storage unit. It may be written in the written area.

  According to the method for adjusting an oscillation circuit according to this application example, since the area where the first data is written is included in the area where the second data is written, the area necessary for storing the first data is reduced. In addition, it is not necessary to provide an area necessary for storing the second data, and an increase in the capacity of the storage unit can be reduced.

[Application Example 3]
In the method for adjusting an oscillation circuit according to the application example, the oscillation circuit includes a first characteristic adjustment circuit that adjusts a characteristic of the oscillation circuit, and the second data is the first characteristic adjustment circuit. It may be data for controlling.

  The first characteristic adjustment circuit may be a frequency adjustment circuit that adjusts (finely adjusts) the frequency of the oscillation circuit based on the second data.

  According to the adjustment method of the oscillation circuit according to this application example, after adjusting the oscillation circuit based on the first data stored in the storage unit, the unnecessary first data is erased from the storage unit, Since the second data necessary for adjusting the characteristics of the oscillation circuit is stored in the storage unit, an increase in the capacity of the storage unit can be reduced.

[Application Example 4]
In the adjustment method of the oscillation circuit according to the application example, the oscillation circuit includes a temperature-sensitive element, and a second characteristic adjustment circuit that adjusts a characteristic of the oscillation circuit based on a signal output from the temperature-sensitive element. In the step of adjusting the oscillation circuit, the characteristics of the oscillation circuit may be adjusted using the output signal of the second characteristic adjustment circuit.

  According to the method for adjusting an oscillation circuit according to this application example, the oscillation circuit can be adjusted based on the first data stored in the storage unit, and the first data that is no longer necessary after the adjustment is stored. Since the necessary second data is stored in the storage unit and deleted from the storage unit, an increase in the capacity of the storage unit can be reduced.

[Application Example 5]
In the method for adjusting an oscillation circuit according to the application example, the second characteristic adjustment circuit may be a temperature compensation circuit.

According to the method for adjusting an oscillation circuit according to this application example, it is possible to adjust the frequency temperature characteristic of the oscillation circuit based on the first data stored in the storage unit, and it is not necessary after the adjustment. Is deleted from the storage unit and the necessary second data is stored in the storage unit, so that an increase in the capacity of the storage unit can be reduced.

[Application Example 6]
An oscillation circuit according to this application example includes an oscillation circuit that is electrically connected to a vibrator and causes the vibrator to oscillate, an output circuit that receives the signal output from the oscillation circuit and outputs an oscillation signal, and A storage unit storing data for controlling at least one of the oscillation circuit and the output circuit, and a predetermined region of the storage unit and the first circuit block are electrically connected, The predetermined area of the storage unit and the second circuit block are electrically connected.

  For example, the first circuit block includes a first circuit (for example, a heat generation circuit) that operates in the first mode and stops operation in the second mode, and includes the predetermined area of the storage unit and the first circuit The circuit may be electrically connected. Further, for example, the second circuit block includes a second circuit (for example, the first characteristic adjustment circuit) that operates in the second mode, and the predetermined area of the storage unit and the second circuit And may be electrically connected. The second circuit may operate or stop operating in the first mode. For example, the first mode is an operation mode for adjusting the oscillation circuit, and the second mode is an operation mode (for example, a normal operation mode) in which the oscillation circuit adjusted in the first mode oscillates. It may be.

  According to the oscillation circuit according to this application example, the data stored in the predetermined area of the storage unit is shared by the circuit included in the first circuit block and the circuit included in the second circuit block. After adjusting the oscillation circuit while one circuit is operating based on the data, the other circuit can operate based on the data. Therefore, according to the oscillation circuit according to this application example, an increase in the capacity of the storage unit can be reduced.

[Application Example 7]
An electronic apparatus according to this application example includes any one of the oscillation circuits described above.

[Application Example 8]
The moving body according to this application example includes any one of the oscillation circuits described above.

  According to these application examples, since the oscillation circuit capable of reducing the increase in the capacity of the storage unit is used, for example, it is possible to realize a low-cost and highly reliable electronic device and moving body. .

The perspective view of the oscillator of this embodiment. 2A is a cross-sectional view of the oscillator, and FIG. 2B is a bottom view of the oscillator. The functional block diagram of the oscillator of this embodiment. The figure which shows the structural example of the circuit for oscillation. The figure which shows the structural example of an output signal generation circuit. The figure which shows the structural example of an amplitude control circuit. The figure which shows an example of the relationship between the setting value of an output level adjustment register, the output voltage of a D / A converter, and a clip voltage. The figure which shows an example of the output waveform of a clipped sine wave. The figure which shows the relationship between each register | resistor and the data memorize | stored. The top view which shows typically the layout structure of an oscillation circuit. The flowchart figure which shows an example of the procedure of the adjustment method of the oscillator (oscillation circuit) of this embodiment. The flowchart figure which shows an example of the procedure of the adjustment process of the frequency temperature characteristic of the oscillator of this embodiment. FIG. 3 is a functional block diagram illustrating an example of a configuration of an electronic apparatus according to the embodiment. 1 is a diagram illustrating an example of an appearance of an electronic apparatus according to an embodiment. The figure which shows an example of the mobile body of this embodiment.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. The embodiments described below do not unduly limit the contents of the present invention described in the claims. Also, not all of the configurations described below are essential constituent requirements of the present invention.

1. Oscillator [Configuration of oscillator]
1 and 2 show the structure of the oscillator according to this embodiment. FIG. 1 is a perspective view of the oscillator according to the present embodiment, and FIG. 2A is a cross-sectional view taken along the line AA ′ of FIG. FIG. 2B is a bottom view of the oscillator according to the present embodiment.

  As shown in FIGS. 1 and 2A, an oscillator 1 according to this embodiment includes an electronic component 9, an oscillator 3, a package 4, a lid 5, an external terminal (external electrode) including an oscillation circuit 2 shown in FIG. 6) The sealing member 8 is included.

  As the resonator 3, for example, a SAW (Surface Acoustic Wave) resonator, an AT cut crystal resonator, an SC cut crystal resonator, a tuning fork crystal resonator, other piezoelectric resonators, and a MEMS (Micro Electro Mechanical Systems) resonator are used. Etc. can be used. As a substrate material of the vibrator 3, a piezoelectric single crystal such as crystal, lithium tantalate, or lithium niobate, a piezoelectric material such as piezoelectric ceramics such as lead zirconate titanate, or a silicon semiconductor material can be used. As the excitation means of the vibrator 3, one using a piezoelectric effect may be used, or electrostatic driving using a Coulomb force may be used. The vibrator 3 according to the present embodiment is a chip-shaped element in which the substrate material is singulated. However, the present invention is not limited to this, and a vibrating device in which the chip-shaped element is sealed in a container may be used. .

  The package 4 is a container for housing the electronic component 9 and the vibrator 3. Specifically, the package 4 is provided with two recesses on the opposing surfaces. By covering one recess with the lid 5, the package 4 becomes the accommodation chamber 7 a and by covering the other recess with the sealing member 8. It becomes the accommodation chamber 7b. The vibrator 3 is housed in the housing chamber 7a, and the electronic component 9 is housed in the housing chamber 7b. Not shown for electrically connecting two terminals of the oscillation circuit 2 (XO terminal and XI terminal in FIG. 3 described later) and two terminals of the vibrator 3 to the inside of the package 4 or the surface of the recess. Wiring is provided. In addition, wiring (not shown) for electrically connecting each terminal of the oscillation circuit 2 and each corresponding external terminal 6 is provided inside the package 4 or on the surface of the recess.

  As shown in FIG. 2B, the oscillator 1 according to the present embodiment has signals for controlling the external terminal VDD1, which is a power supply terminal 1, the external terminal VSS1, which is a ground terminal, and the electronic component 9, on the bottom surface (the back surface of the package 4). Four external terminals 6 including an external terminal VC1 that is an input terminal and an external terminal OUT1 that is an output terminal are provided. A power supply voltage is supplied to the external terminal VDD1, and the external terminal VSS1 is grounded.

FIG. 3 is a functional block diagram of the oscillator of this embodiment. As shown in FIG. 3, the oscillator 1 of the present embodiment is an oscillator including an oscillation circuit 2 and a vibrator 3, and the oscillation circuit 2 and the vibrator 3 are housed in a package 4.

  The oscillation circuit 2 is a connection terminal for a VDD terminal as a power supply terminal, a VSS terminal as a ground terminal, an OUT terminal as an output terminal, a VC terminal as a terminal for inputting a frequency control signal, and the vibrator 3. An XI terminal and an XO terminal are provided. The VDD terminal, the VSS terminal, the OUT terminal, and the VC terminal are exposed on the surface of the electronic component 9 (see FIG. 1) that is an IC chip, and are external terminals VDD1, VSS1, OUT1, and VC1 provided in the package 4, respectively. Connected with. The XI terminal is connected to one end (one terminal) of the vibrator 3, and the XO terminal is connected to the other end (the other terminal) of the vibrator 3.

  In this embodiment, the oscillation circuit 2 includes an oscillation circuit 10, an output circuit 20, a frequency adjustment circuit 30, an AFC (Automatic Frequency Control) circuit 32, a temperature compensation circuit 40, a temperature sensor 42, a regulator circuit 50, a storage unit 60, A switch circuit 70 and a serial interface (I / F) circuit 80 are included. Note that the oscillation circuit 2 of the present embodiment may have a configuration in which some of these elements are omitted or changed, or other elements are added.

  The regulator circuit 50 generates a constant voltage Vreg as a power supply voltage or a reference voltage for the oscillation circuit 10, the temperature compensation circuit 40, and the output circuit 20 based on the power supply voltage VDD (positive voltage) supplied from the VDD terminal.

  The storage unit 60 includes a register 62 and a nonvolatile memory 64, and is configured to be able to read / write the register 62 or the nonvolatile memory 64 from an external terminal via the serial interface circuit 80. In the present embodiment, since the oscillation circuit 2 connected to the external terminal of the oscillator 1 has only four terminals, VDD, VSS, OUT, and VC, the serial interface circuit 80 has, for example, a voltage at the VDD terminal lower than the threshold value. When it is high, it receives the clock signal SCLK input from the VC terminal and the data signal DATA input from the OUT terminal, and reads / writes data to / from the register 62 or the nonvolatile memory 64.

  Data for controlling at least one of the oscillation circuit 10 and the output circuit 20 is stored in the storage unit 60. In the present embodiment, the register 62 controls the oscillation stage current adjustment data IOSC_ADJ <3: 0> (controls the oscillation circuit 10 to adjust and select the oscillation stage current of the oscillation circuit 10 according to the frequency of the vibrator 3. An oscillation stage current adjustment register for storing an example of data to be performed. The register 62 controls the frequency division switching data DIV (which controls the output circuit 20) for selecting whether or not to divide and output the oscillation signal by the frequency dividing circuit provided in the output signal generation circuit 24. Output level adjustment data VOUT_ADJ <1: 0> (output circuit for adjusting the amplitude level of the oscillation signal of the clipped sine wave output from the frequency division switching register and the amplitude control circuit 22) 20 includes an output level adjustment register that stores (an example of data for controlling 20).

  Further, in the present embodiment, the register 62 adjusts the gain of the AFC circuit 32, which is a reference frequency adjustment register that stores reference frequency adjustment data F0_ADJ <3: 0> for adjusting and selecting the output voltage of the frequency adjustment circuit 30. An AFC adjustment register that stores AFC adjustment data AFC_ADJ <3: 0> for selection, and a temperature compensation register that stores temperature compensation data TC <15: 0> for adjusting and selecting the output voltage of the temperature compensation circuit 40 including.

At the time of manufacturing (inspecting) the oscillation circuit 2, data is written to each register from the external terminal via the serial interface circuit 80, and each data adjusted and selected so that the oscillator 1 satisfies desired characteristics is nonvolatile. It is written in the memory 64. Each data stored in the nonvolatile memory 64 is written from the nonvolatile memory 64 to each register when the oscillation circuit 2 is turned on (when the voltage at the VDD terminal rises from 0 V to a desired voltage).

  In the present embodiment, the oscillation circuit 2 can be switched to either the normal operation mode or the temperature compensation adjustment mode from an external terminal, and the interface (I / F) circuit 80 is switched to the normal operation mode. A mode switching signal TP indicating which of the temperature compensation adjustment modes is output. In the present embodiment, the oscillation circuit 2 operates in the normal operation mode when the mode switching signal TP is at a low level, and operates in the temperature compensation adjustment mode when the mode switching signal TP is at a high level.

  The oscillation circuit 10 is a circuit for causing the vibrator 3 to oscillate, and amplifies the output signal of the vibrator 3 and feeds it back to the vibrator 3. The oscillation circuit 10 outputs an oscillation signal based on the oscillation of the vibrator 3.

  The frequency adjustment circuit 30 is one of characteristic adjustment circuits for adjusting the characteristics of the oscillation circuit 10 (an example of a first characteristic adjustment circuit), and reference frequency adjustment data F0_ADJ <3 stored in the reference frequency adjustment register. :> 0> (an example of data for controlling the first characteristic adjustment circuit) The reference frequency adjustment voltage VF0 is generated. The reference frequency adjustment voltage VF0 is applied to one end of a variable capacitance element (not shown in FIG. 3) that functions as a load capacitance of the oscillation circuit 10, and a predetermined temperature (for example, 25 ° C.) and a voltage at the VC terminal are predetermined. Is controlled (finely adjusted) so that the oscillation frequency (reference frequency F0) of the oscillation circuit 10 under the condition of the voltage (for example, VDD / 2) becomes a desired frequency.

  The AFC circuit 32 is one of characteristic adjustment circuits for adjusting the characteristics of the oscillation circuit 10 and generates a frequency control voltage VAFC corresponding to the voltage at the VC terminal. The frequency control voltage VAFC is applied to one end of a variable capacitance element (not shown in FIG. 3) that functions as a load capacitor of the oscillation circuit 10 to control the oscillation frequency of the oscillation circuit 10. The AFC circuit 32 is controlled so that the gain becomes a desired value based on the AFC adjustment data AFC_ADJ <3: 0> stored in the AFC adjustment register.

  The temperature sensor 42 is a temperature-sensitive element that outputs a signal (for example, a voltage corresponding to the temperature) corresponding to the temperature around the temperature sensor 42.

  The temperature compensation circuit 40 is one of characteristic adjustment circuits (an example of a second characteristic adjustment circuit) that adjusts the characteristics of the oscillation circuit 10. An output signal from the temperature sensor 42 is input, and the temperature is used as a variable. A temperature compensation voltage VTC for compensating the frequency temperature characteristic of the vibrator 3 determined by the temperature compensation data TC <15: 0> stored in the temperature compensation register is generated. The temperature compensation data TC <15: 0> may include, for example, 0th, 1st and 3rd order coefficient values (4th order and 5th order coefficient values corresponding to the frequency temperature characteristics of the vibrator 3. Or data defining a correspondence relationship between the temperature and the temperature compensation voltage VTC. The temperature compensation voltage VTC is applied to one end of a variable capacitance element (not shown) that functions as a load capacitor of the oscillation circuit 10 and is controlled so that the oscillation frequency of the oscillation circuit 10 is constant regardless of the temperature.

  The output circuit 20 includes an amplitude control circuit 22 and an output signal generation circuit 24.

  The output signal generation circuit 24 receives the oscillation signal from the oscillation circuit 10 and generates and outputs an oscillation signal for external output.

  The amplitude control circuit 22 is a circuit for controlling the amplitude of the oscillation signal output from the output signal generation circuit 24. The amplitude control circuit 22 includes an amplitude control unit that controls the amplitude of the oscillation signal output from the output signal generation circuit 24 and a heat generation unit. In a temperature compensation adjustment mode, which will be described later, reference frequency adjustment data F0_ADJ <3: 0> stored in the reference frequency adjustment register is heat generation current adjustment data IHT_ADJ <3: for adjusting / selecting a current flowing through the heat generation unit. 0>, and the heat generating portion generates heat with a heat generation amount corresponding to the heat generation current adjustment data IHT_ADJ <3: 0>.

  The switch circuit 70 is a circuit for switching the electrical connection between the temperature compensation circuit 40 and the OUT terminal electrically connected to the output side of the output circuit 20 (output signal generation circuit 24).

  In the present embodiment, when the mode switching signal TP is at a low level (in the normal operation mode), the switch circuit 70 electrically connects the output signal generation circuit 24 and the OUT terminal, and outputs from the output signal generation circuit 24. The oscillation signal is output to the OUT terminal. Further, when the mode switching signal TP is at a low level, the operation of the heat generating portion of the amplitude control circuit 22 is stopped.

  On the other hand, when the mode switching signal TP is at a high level (in the temperature compensation adjustment mode), the switch circuit 70 electrically connects the temperature compensation circuit 40 and the OUT terminal, and outputs an output signal (temperature) from the temperature compensation circuit 40. Compensation voltage VTC) is output to the OUT terminal. When the mode switching signal TP is at a high level, the output of the oscillation signal from the output signal generation circuit 24 is stopped, and the heat generating portion of the amplitude control circuit 22 is set to the heat generation current adjustment data IHT_ADJ <3: 0>. Based on this, the input DC current is controlled.

  When used as a TCXO (Temperature Compensated Crystal Oscillator) for GPS used for cellular or the like, a high frequency temperature compensation accuracy of, for example, ± 0.5 ppm is required. Therefore, in the present embodiment, the regulator circuit 50 stabilizes the output voltage amplitude of the output circuit 20, and from the viewpoint of reducing current consumption, the output circuit 20 outputs a clipped sine waveform with the output amplitude suppressed. In the present embodiment, the amplitude control circuit 22 can adjust the output amplitude of the output signal generation circuit 24 within a range of, for example, 0.8 to 1.2 Vpp. Also has a small heat generating part built-in.

[Configuration of oscillation circuit]
FIG. 4 is a diagram illustrating a configuration example of the oscillation circuit 10 of FIG. As shown in FIG. 4, the oscillation circuit 10 includes an oscillation unit 11 and a current source circuit 12. The oscillation unit 11 is connected to the vibrator 3 to constitute a Pierce type oscillation circuit. In the oscillating unit 11, varicap diodes VCD 1 and VCD 2, which are variable capacitance elements, are connected in series with the vibrator 3, and a temperature compensation voltage VTC is applied to one end of the varicap diode VCD 1. A reference frequency adjustment voltage VF0 is applied to the other end of the diode VCD1. A frequency control voltage VAFC is applied to one end of the varicap diode VCD2. The capacitance value of the oscillation unit 11 is changed by these applied voltages, the frequency temperature characteristic of the vibrator 3 is compensated, and an oscillation signal having a frequency corresponding to the voltage at the VC terminal is output.

The current source circuit 12 generates a current Iref serving as a reference of the oscillation stage current Iosc by the differential amplifier AMP1, the PMOS transistor M2, the bipolar transistor Q2, and the current adjustment unit in which the resistor R1 and the plurality of resistors R2 are connected in parallel. To do. The reference current Iref is adjusted by the oscillation stage current adjustment data IOSC_ADJ <3: 0>. The size of the gate width of the PMOS transistor M1 and the size of the gate width of the PMOS transistor M2 have a ratio of 10: 1, for example. The size of the gate width of the PMOS transistor M3 and the size of the gate width of the PMOS transistor M4 have the same size ratio. For example, if Iref = 20 μA, 10 times 200 μA is supplied to the oscillation unit 11 as an oscillation stage current. The circuit composed of the differential amplifier AMP2, the PMOS transistor M4, the current source for supplying the bias current Ibias, and the PMOS transistors M5 and M6 further suppresses the power supply dependence of the oscillation stage current Iosc flowing in the cascode-connected PMOS transistors M1 and M3. It is a circuit for. This circuit is a gain-enhanced cascode circuit that further reduces the power supply dependence of the current output from the current source in a TCXO that requires a high frequency system, as compared with the cascode circuit. This cascode circuit monitors the source voltage of the PMOS transistor M4 on the reference side, and controls the gate voltages of the PMOS transistors M3 and M4 by the differential amplifier AMP2 when the power supply voltage VDD (voltage at the VDD terminal) fluctuates. Further, changes in the potential difference between the source and drain of the PMOS transistors M1 and M2 are further suppressed. The output resistance of the current source circuit 12 further increases by a gain multiple of the differential amplifier AMP2. The oscillation stage current Iosc is stabilized against fluctuations in the power supply voltage, and fluctuations in the oscillation frequency of the oscillation unit 11 can be suppressed.

[Configuration of output signal generation circuit]
FIG. 5 is a diagram illustrating a configuration example of the output signal generation circuit 24 of FIG. As shown in FIG. 4, the output signal generation circuit 24 receives the output voltage Vreg of the regulator circuit 50 at the Vreg terminal and obtains a clipped sine wave output generated by the amplitude control circuit 22 at the Vclip terminal. The clip voltage Vclip is applied. The output signal generation circuit 24 includes a frequency dividing circuit, and selects whether to divide the signal input to the IN terminal (the oscillation signal output from the oscillation circuit 10) by 2 according to the voltage level of the DIV terminal. It is configured to be possible. In this embodiment, when the frequency division switching data DIV is 0, the DIV terminal is set to a low level, the input signal is not divided, and the polarity is inverted by the inverter composed of the MOS transistors M1 to M4, and the node VBUF1 The signal is transmitted to the NOR circuit NOR1. On the other hand, when the frequency division switching data DIV is 1, the DIV terminal is set to the high level, the input signal is divided by 1/2 by the frequency dividing circuit, and the signal at the node VBUF1 is transmitted to the NOR circuit NOR1.

  The output signal generation circuit 24 is in an operable state when the mode switching signal TP is at a low level, and is in an operation stopped state when the mode switching signal TP is at a high level. In the normal operation mode (when the mode switching signal TP is at a low level), the input signal from the input terminal IN is clipped at a voltage amplitude level determined by Vclip and output from the OUT terminal. In the temperature compensation adjustment mode (when the mode switching signal TP is at a high level), the MOS transistors M2 and M3 are turned off, and the output node VBUF2 of the NOR circuit NOR1 and the output node VBUF3 of the NOR circuit NOR2 are both at the ground potential. The NMOS transistors M5 and M6 are both turned off. As a result, the output signal generation circuit 24 enters an operation stop state.

[Configuration of amplitude control circuit]
FIG. 6 is a diagram illustrating a configuration example of the amplitude control circuit 22 of FIG. In FIG. 6, NMOS transistors M1, M2, and M3 are depletion type MOS transistors, and the other MOS transistors are normal type (enhancement type) MOS transistors. The amplitude control circuit 22 shown in FIG. 6 allows a static current (DC current) Iht to flow in the temperature compensation adjustment mode (when the mode switching signal TP is at a high level), so that it is in the normal operation mode (mode switching signal). Heat corresponding to the heat generated in the output signal generation circuit 24 when TP is at a low level is generated. Thereby, the fluctuation | variation of the emitted-heat amount between the time of normal operation and temperature compensation adjustment is suppressed.

As shown in the following equation (1), the clip voltage Vclip that determines the output amplitude level of the output signal generation circuit 24 is a voltage obtained by subtracting the gate-source voltage Vgs _M2 of the MOS transistor M2 from the output voltage Vg of the differential amplifier AMP. It becomes.

  Vg is obtained from the analog voltage Vdac D / A converted by the D / A converter DAC based on the output level adjustment data VOUT_ADJ <1: 0> by the following equation (2).

  By substituting equation (2) into equation (1), the relationship of the following equation (3) is established. That is, the clip voltage Vclip is determined by Vdac · (R1 / R2 + 1) that is a voltage obtained by amplifying the output voltage Vdac of the D / A converter DAC by the differential amplifier AMP.

  In the normal operation mode (when the mode switching signal TP is at a low level), the switch circuit SW1 is turned on, the NMOS switch SW2 is turned off, the MOS transistor M3B is turned off, and the heat generating circuit 28 is stopped. On the other hand, when the temperature compensation circuit 40 is adjusted, the TP terminal is set to a high level, the switch circuit SW1 is turned off, and the NMOS switch SW2 is turned on, whereby the NMOS transistor M2 is turned off and the NMOS transistor M3 is turned on. The heat generating circuit 28 including the operation state is activated.

The waveform output from the output signal generation circuit 24 is a clipped sine wave as shown in FIG. 8A or FIG. 8B, and the peak value (amplitude) of the clipped sine wave increases as the output frequency increases. Therefore, output level adjustment data VOUT_ADJ <1: 0> is selected in accordance with the output frequency. Normally, the output level adjustment data VOUT_ADJ <1: 0> is selected so that the amplitude of the clipped sine wave can be secured to 0.8 Vpp or more. FIG. 7 shows an example of the relationship between the output level adjustment data VOUT_ADJ <1: 0>, the output voltage Vdac of the D / A converter DAC, and the clip voltage Vclip. FIG. 7 shows an example when the gain of the replica circuit 26 including the differential amplifier AMP is set to about 1.2 times, and the clip voltage Vclip shows a DC voltage value. FIGS. 8A and 8B are diagrams showing examples of output waveforms of clipped sine waves when the output frequencies are 26 MHz and 52 MHz, respectively, and output level adjustment data VOUT_ADJ <1. : 0> is set to "01". As shown in FIG. 7, when the output level adjustment data VOUT_ADJ <1: 0> is set to “01”, the clip voltage Vclip is 0.9V, and the output frequency is 26 MHz as shown in FIG. In this case, the amplitude of the clipped sine wave is about 0.9 Vpp. As shown in FIG. 8B, the amplitude of the clipped sine wave can be secured to about 0.82 Vpp even when the output frequency is 52 MHz. ing. In addition, when the output frequency is 52 MHz, the amplitude of the clipped sine wave may be slightly reduced. The output level adjustment data VOUT_ADJ <1: 0> is set to “10” and the amplitude is increased by 0.1V. It can also be set to 0.92 Vpp. In the present embodiment, a circuit that outputs a clipped sine waveform is illustrated as the output circuit 20, but the present invention is not limited thereto, and a CMOS output circuit may be used as the output circuit 20.

  In the present embodiment, when the mode switching signal TP is set to the high level, the current Iht flowing through the heat generating circuit 28 changes according to the heating current adjustment data IHT_ADJ <3: 0>, and the mode switching signal TP is set to the low level. Is set to approach the current corresponding to the current consumed by the output signal generation circuit 24. As a result, a differential current which is a difference current between the current consumption of the oscillator 1 when the mode switching signal TP is set to a low level and the current consumption of the oscillator 1 when the mode switching signal TP is set to a high level is obtained. It is small. That is, the difference between the current when the output signal generating circuit 24 is in the operating state and the current when the output signal generating circuit 24 is in the stopped state is reduced to suppress fluctuations in the amount of heat generated in the oscillation circuit 10.

[Relationship between registers and data]
FIG. 9 is a diagram illustrating a relationship between each register included in the register 62 and stored data. As shown in FIG. 9, the data stored in the oscillation stage current adjustment register is used as oscillation stage current adjustment data IOSC_ADJ <3: 0> when the mode switching signal TP is either low level or high level. The data stored in the frequency division switching register is used as the frequency division switching data DIV when the mode switching signal TP is at a low level, and the operation of the output signal generation circuit 24 is stopped when the mode switching signal TP is at a high level. Not used. The data stored in the output level adjustment register is used as the output level adjustment data VOUT_ADJ <1: 0> when the mode switching signal TP is at a low level, and the output signal generation circuit 24 when the mode switching signal TP is at a high level. Is not used because the operation stops. The data stored in the reference frequency adjustment register is used as the reference frequency adjustment data F0_ADJ <3: 0> when the mode switching signal TP is low level, and the heating current adjustment data IHT_ADJ when the mode switching signal TP is high level. Used as <3: 0>. The data stored in the AFC adjustment register is used as AFC adjustment data AFC_ADJ <3: 0> when the mode switching signal TP is either low level or high level. The data stored in the temperature compensation register is used as temperature compensation data TC <15: 0> regardless of whether the mode switching signal TP is low level or high level.

  As described above, the oscillation circuit 2 according to the present embodiment uses the data stored in the reference frequency adjustment register as the reference frequency adjustment data F0_ADJ <3: 0 in the normal operation mode (when the mode switching signal TP is at the low level). >, And in the temperature compensation adjustment mode (when the mode switching signal TP is at a low level), it is used as the heating current adjustment data IHT_ADJ <3: 0>, so that it is not necessary for the normal operation. An increase in the capacity of the storage unit 60 for storing IHT_ADJ <3: 0> is reduced. In the temperature compensation adjustment mode, the oscillation circuit 10 finely adjusts the oscillation frequency based on the heating current adjustment data IHT_ADJ <3: 0>, but the difference from the oscillation frequency in the normal operation mode is Therefore, the difference in the amount of heat generated by the oscillation circuit 10 due to the difference in oscillation frequency between the normal operation mode and the temperature compensation adjustment mode is small. Accordingly, since the temperature compensation data TC with high accuracy can be obtained in the temperature compensation adjustment mode, the oscillator 1 with high frequency accuracy and high frequency stability can be realized.

[Oscillation circuit layout configuration]
FIG. 10 is a plan view schematically showing the layout configuration of the oscillation circuit 2 in the present embodiment. In FIG. 10, the description of a part of the circuit included in the oscillation circuit 2 is omitted.

The oscillation circuit 2 in this embodiment is configured as a semiconductor circuit, and each component (circuit) shown in FIG. The semiconductor substrate 100 is, for example, Si or GaAs.
For example, it is composed of various known semiconductor materials. In the region 110 of the semiconductor substrate 100, some components (circuits) of the oscillation circuit 2 including the first circuit block 111 and the second circuit block 112 are arranged. Another component (circuit) of the oscillation circuit 2 including the part 60 is arranged. Further, the semiconductor substrate 100 is provided with a connection terminal XI, a connection terminal XO, a connection terminal VDD, a connection terminal VSS, a connection terminal OUT, and a connection terminal VC corresponding to each terminal shown in FIG.

  Further, the semiconductor substrate 100 is provided with a wiring 90 connected to the predetermined region 140 of the storage unit 60, and a wiring 91 and a wiring 92 in which the wiring 90 is branched into two. The wiring 90, the wiring 91, and the wiring 92 are made of various known conductive materials such as Al, Cu, polysilicon, or an alloy containing them as a main component.

  The wiring 91 is connected to the first circuit block 111, and the wiring 92 is connected to the second circuit block 112. That is, the predetermined area 140 of the storage unit 60 and the first circuit block 111 are electrically connected by the wiring 90 and the wiring 91, and the predetermined area 140 of the storage unit 60 and the second area are connected by the wiring 90 and the wiring 92. The circuit block 112 is electrically connected.

  In this predetermined area 140, a reference frequency adjustment register included in the register 62 of FIG. 3 is arranged, and the wiring 90 is connected to any one of a plurality of output terminals of the reference frequency adjustment register. Yes. Further, the wiring 91 is connected to the heat generating circuit 28 of FIG. 6 included in the output circuit 20 of FIG. 3, and the wiring 92 is connected to the frequency adjusting circuit 30 of FIG. Although not shown in the example of FIG. 10, the remaining output terminals of the reference frequency adjustment register and the heating circuit 28 or the frequency adjustment circuit 30 are electrically connected to each other in the same manner as the wiring 90, the wiring 91, and the wiring 92. A wiring group for connection is also provided. Then, the data stored in the reference frequency adjustment register is supplied to the heat generation circuit 28 and the frequency adjustment circuit 30 by the wiring 90, the wiring 91, the wiring 92, and a wiring group (not shown).

  As described above, the oscillation circuit 2 in the present embodiment uses the data stored in the reference frequency adjustment register as the reference frequency adjustment data F0_ADJ <3: 0> in the normal operation mode, and uses the temperature compensation adjustment mode. In some cases, the heat generation current adjustment data IHT_ADJ <3: 0> is used to reduce the increase in the capacity of the storage unit 60. In addition, the oscillation circuit 2 according to the present embodiment performs highly accurate temperature compensation adjustment in the nonvolatile memory 64 of the storage unit 60 in a state where fluctuations in the amount of heat generated in the normal operation mode and the temperature compensation adjustment mode are suppressed. The obtained temperature compensation data TC <15: 0> is stored, and the oscillator 1 with high frequency accuracy and high frequency stability can be realized.

  In the example shown in FIG. 10, the connection terminal XO is provided between the region 110 and the region 120 in plan view. In particular, at least a part of the connection terminal XO is arranged so as to bite into the region 110 in the region 130 sandwiched between the regions 110 in a direction away from the region 120 in a plan view.

  Further, the region 120 is provided between the outer peripheral portion 101 and the region 110 of the semiconductor substrate 100 and between the outer peripheral portion 101 and the connection terminal XO. In the example shown in FIG. 10, the semiconductor substrate 100 is configured to be rectangular in plan view, and the outer peripheral portion 101 corresponds to one side of the rectangle in plan view. The semiconductor substrate 100 does not have to be completely polygonal in plan view, and may be a substantially polygonal shape having irregularities on the outer periphery in plan view. In this case, the outer peripheral portion 101 may correspond to a portion that can be viewed as one side of a substantially polygon.

As described above, the region 120 is provided on the outer peripheral portion 101 side of the semiconductor substrate 100, and the connection terminal XO is disposed in the region 130 between the region 110 and the region 120, whereby the connection terminal XO is connected to the outer peripheral portion 101 of the semiconductor substrate 100. Compared to the case where the area 120 is provided in the vicinity, a single rectangular area in the area 120 can be made larger. Therefore, for example, even when the size of the semiconductor substrate 100 cannot be increased, the storage capacity of the storage unit 60 can be increased by arranging the storage unit 60 in this rectangular area. In addition, by arranging the storage unit 60 in one block of rectangular area, the wiring of the storage unit 60 is facilitated compared to the case where the storage unit 60 is provided in a plurality of areas, so that the wiring area can be reduced. Since the address designation of the storage unit 60 becomes easy, the size of the read / write control circuit can be reduced.

  In the example shown in FIG. 10, the region 120 is provided along the long side of the semiconductor substrate 100, so that the region 120 is provided along the short side of the semiconductor substrate 100. Thus, the wiring between the storage unit 60 in the region 120 and various circuits included in the region 110 can be shortened.

[Oscillator (oscillator circuit) adjustment method]
FIG. 11 is a flowchart showing an example of the procedure of the adjustment method of the oscillator 1 (oscillation circuit 2) of the present embodiment.

  First, the reference frequency F0 of the oscillator 1 is adjusted (step S10). Specifically, after rewriting the reference frequency adjustment data F0_ADJ <3: 0> stored in the reference frequency adjustment register from the external terminals VC1 and OUT1 at a predetermined temperature (for example, 25 ° C.), the external terminal VC1 has a predetermined value. The process of measuring the frequency of the oscillation signal output from the OUT1 terminal in a state where a voltage (for example, VDD / 2) is applied is repeatedly performed to determine reference frequency adjustment data F0_ADJ <3: 0> from which a desired frequency is obtained. .

  Next, the VC sensitivity of the oscillator 1 is adjusted (step S20). Specifically, at a predetermined temperature (for example, 25 ° C.), after rewriting the AFC adjustment data AFC_ADJ <3: 0> stored in the AFC adjustment register from the external terminals VC1 and OUT1, a predetermined voltage ( For example, the process of measuring the frequency of the oscillation signal output from the OUT1 terminal in a state where 0 V or VDD is applied is repeatedly performed, and AFC adjustment data AFC_ADJ <3: 0> for obtaining a desired VC sensitivity is determined.

  Next, the frequency temperature characteristic of the oscillator 1 is adjusted to determine temperature compensation data TC <15: 0> (step S30). Details of the process of step S30 will be described later.

  Finally, each data is stored in the nonvolatile memory 64 of the storage unit 60 (step S40). Specifically, the reference frequency adjustment data F0_ADJ <3: 0> obtained in step S10, the AFC adjustment data AFC_ADJ <3: 0> obtained in step S20, and the step S30 are obtained from the external terminals VC1 and OUT1. Temperature compensation data TC <15: 0>, oscillation stage current adjustment data IOSC_ADJ <3: 0>, frequency division switching data DIV, and output level adjustment data VOUT_ADJ <1: determined according to the specifications of the oscillator 1. 0> are sequentially written in the nonvolatile memory 64.

FIG. 12 is a flowchart showing an example of the procedure of the frequency temperature characteristic adjustment step (step S30 in FIG. 11) of the oscillator 1 of the present embodiment. At the start of the flowchart of FIG. 12, the register 62 stores the AFC adjustment data AFC_ADJ <3: 0> obtained in step S20 of FIG. 11 and the desired oscillation stage current adjustment data IOSC_ADJ <3: 0>. Assume that frequency division switching data DIV and output level adjustment data VOUT_ADJ <1: 0> are stored. Note that some of steps S100 to S160 in FIG. 12 may be omitted or changed, or other steps may be added. Moreover, you may change the order of each process suitably in the possible range.

  In the example of FIG. 12, first, the mode switching signal TP is set to a high level from the external terminals VC1 and OUT1 (step S100). By this step S10, the oscillation circuit 2 enters the temperature compensation adjustment mode, the output of the oscillation signal from the output signal generation circuit 24 is stopped, and the output terminal and the OUT terminal of the temperature compensation circuit 40 are electrically connected by the switch circuit 70. Connected to. Therefore, the temperature compensation voltage VTC can be monitored from the OUT terminal of the oscillator 1.

  Next, the heating current adjustment data IHT_ADJ <3: 0> (an example of first data) is stored in the register 62 of the storage unit 60 (step S110). Specifically, the heating current adjustment data IHT_ADJ <3: 0> is written to the reference frequency adjustment register from the external terminals VC1 and OUT1. By this step S110, a desired current close to the current consumed by the output signal generation circuit 24 during normal operation flows through the heat generation circuit 28, and the amount of heat generated by the oscillator 1 (oscillation circuit 2) is the same as during normal operation. It will be about.

  Next, while changing the temperature of the oscillator 1, the relationship between the temperature compensation data TC <15: 0> and the temperature compensation voltage VTC is obtained, and the temperature compensation data TC <15: 0> for compensating the frequency temperature characteristics of the vibrator 3 is obtained. Is determined (step S120). In this step S120, the oscillation circuit 2 is controlled based on the heating current adjustment data IHT_ADJ <3: 0>, and the oscillation circuit 2 is adjusted using the output signal (temperature compensation voltage VTC) of the temperature compensation circuit 40. It is a process to do. Specifically, in step S120, the temperature compensation voltage VTC output from the OUT1 terminal is rewritten from the external terminals VC1 and OUT1 while rewriting the temperature compensation data TC <15: 0> at each of a plurality of predetermined temperatures. Obtain the relationship between the temperature compensation data TC <15: 0> and the temperature compensation voltage VTC. Then, based on the relationship between the temperature compensation data TC <15: 0> and the temperature compensation voltage VTC and the frequency temperature characteristic of the vibrator 3 measured in advance, it is optimal for compensating the frequency temperature characteristic of the vibrator 3. Temperature compensation data TC <15: 0> is determined.

  Next, the temperature compensation data TC <15: 0> is stored in the register 62 of the storage unit 60 (step S130). Specifically, the temperature compensation data TC <15: 0> determined in step S120 is written from the external terminals VC1 and OUT1 to the temperature compensation register.

  Next, the mode switching signal TP is set to a low level from the external terminals VC1 and OUT1 (step S140). By this step S140, the oscillation circuit 2 enters the normal operation mode, the oscillation signal is output from the output signal generation circuit 24, and the output terminal and the OUT terminal of the output signal generation circuit 24 are electrically connected by the switch circuit 70. Is done. Accordingly, an oscillation signal is output from the OUT terminal of the oscillator 1.

  Next, the heating current adjustment data IHT_ADJ <3: 0> is erased from the register 62 of the storage unit 60, and the reference frequency adjustment data F0_ADJ <3: 0> (an example of second data) is stored (step S150). . In the present embodiment, the reference frequency adjustment data F0_ADJ <3: 0> is written in the area in the storage unit 60 where the heat generation current adjustment data IHT_ADJ <3: 0> has been written. Specifically, the reference frequency adjustment data F0_ADJ <3 obtained in step S10 of FIG. 11 is stored in the reference frequency adjustment register in which the heating current adjustment data IHT_ADJ <3: 0> is stored from the external terminals VC1 and OUT1. : Overwrite 0>. Through this step S150, the oscillator 1 (oscillation circuit 2) causes the adjusted reference frequency adjustment data F0_ADJ <3: 0>, AFC adjustment data AFC_ADJ <3: 0>, temperature compensation data TC <15: 0>, and Oscillation is performed in a state where desired oscillation stage current adjustment data IOSC_ADJ <3: 0>, frequency division switching data DIV, and output level adjustment data VOUT_ADJ <1: 0> are set.

  Finally, the frequency temperature characteristic of the oscillator 1 is evaluated (S160). Specifically, the frequency of the oscillation signal output from the external terminal OUT1 is measured in a state where a predetermined voltage (for example, VDD / 2) is applied to the external terminal VC1 at each of a plurality of predetermined temperatures. Thus, the frequency-temperature characteristic of the oscillator 1 is evaluated.

  When the frequency temperature characteristic of the oscillator 1 satisfies a predetermined standard (specification), the process proceeds to step S40 in FIG. 11, and when the frequency temperature characteristic of the oscillator 1 does not satisfy the predetermined standard (specification), FIG. The processes in steps S100 to S150 may be performed again, or the oscillator 1 may be discarded as a rejected product without proceeding to step S40 in FIG.

  As described above, according to the present embodiment, the frequency temperature characteristic is not necessary after the oscillation circuit 2 is controlled based on the heat generation current adjustment data stored in the storage unit 60 while being controlled. The generated current adjustment data for heat generation is erased from the storage unit 60, and the reference frequency adjustment data necessary for normal operation is stored in the storage unit 60. The area where the current adjustment data for heat generation is written is included in the area where the reference frequency adjustment data is written. Therefore, the area necessary for storing the current adjustment data for heat generation is stored in order to store the reference frequency adjustment data. There is no need to provide it separately from the necessary area, and the increase in the capacity of the storage unit 60 can be reduced.

  Further, according to the present embodiment, during temperature compensation adjustment, a desired current close to the current consumed by the output signal generation circuit 24 during normal operation flows through the heat generation circuit 28, and the heat generation of the oscillator 1 (oscillation circuit 2). Since the amount is almost the same as that in the normal operation, the frequency temperature characteristic can be adjusted with high accuracy in a state where the temperature difference from the normal operation is small. In addition, since the heat generation circuit 28 does not use an AC signal (AC current, AC voltage, etc.) as an energy source, the occurrence of voltage or current fluctuations with time changes is reduced. The possibility that the generated signal affects other circuits as noise can be reduced. Further, in the present embodiment, the heat generating circuit 28 is realized by a small circuit having a simple configuration inside the amplitude control circuit 22, thereby enabling a heat generating circuit having a driving capability equivalent to that of the output signal generating circuit 24. A switch circuit between the oscillation circuit 10 and the output signal generation circuit 24 becomes unnecessary, and an increase in circuit scale can be suppressed.

[Modification]
The oscillator 1 (oscillation circuit 2) of the present embodiment can be variously modified.

  For example, in this embodiment, the number of bits of the current adjustment data for heat generation is the same as the number of bits of the reference frequency adjustment data, but the number of bits of the current adjustment data for heat generation is less than the number of bits of the reference frequency adjustment data. Good.

  Further, for example, the register that stores the heat generation current adjustment data is not limited to the reference frequency adjustment register, but may be a frequency division switching register or an output level adjustment register that is not used in the temperature compensation adjustment mode. For example, at least part of the heat generation current adjustment data may be stored in the frequency division switching register or the output level adjustment register.

Further, for example, the oscillator 1 (oscillation circuit 2) is not in the inspection mode in which the external terminal VC1 (VC terminal) is used as an output terminal or the input signal from the external terminal VC1 (VC terminal) is not supplied to the AFC circuit 32 When the inspection modes supplied to the circuit are provided, the frequency control voltage VAFC output from the AFC circuit 32 is not supplied to the oscillation circuit 10 in these inspection modes. Therefore, for example, a voltage that causes the oscillation circuit 2 to generate a plurality of voltages corresponding to the frequency control voltage VAFC when each of a plurality of predetermined voltages (for example, 0 V, VDD / 2, and VDD) is applied to the VC terminal. A generation circuit is provided, and in the inspection mode, control may be performed so that the output voltage of the voltage generation circuit is supplied to the oscillation circuit 10. In this case, voltage selection data for selecting which of the plurality of voltages to be generated by the voltage generation circuit is required. However, this voltage selection data is not necessary in the normal operation mode, like the current adjustment data for heat generation. Therefore, for example, in the inspection mode, the voltage selection data may be stored in at least a part of the reference frequency adjustment register, the frequency division switching register, and the output level adjustment register.

  Further, in the present embodiment, for example, it is assumed that the nonvolatile memory 64 is a memory that can be written only once or the adjustment time of the oscillator 1 (oscillation circuit 2) is shortened, and the register 62 is stored in the storage unit 60. However, if the nonvolatile memory 64 is an EEPROM, flash memory or the like that can be written a plurality of times, and the adjustment time of the oscillator 1 (oscillation circuit 2) does not need to be shortened, the nonvolatile memory 64 is stored in the storage unit 60. The register 62 may not be provided. In this case, various data may be written into the nonvolatile memory 64 in the adjustment of the oscillator 1 (oscillation circuit 2).

2. Electronic Device FIG. 13 is a functional block diagram showing an example of the configuration of the electronic device of the present embodiment. FIG. 14 is a diagram illustrating an example of the appearance of a smartphone that is an example of the electronic apparatus of the present embodiment.

  The electronic device 300 according to the present embodiment includes an oscillator 310, a CPU (Central Processing Unit) 320, an operation unit 330, a ROM (Read Only Memory) 340, a RAM (Random Access Memory) 350, a communication unit 360, and a display unit 370. It is configured. Note that the electronic device of the present embodiment may be configured such that some of the components (each unit) in FIG. 13 are omitted or changed, or other components are added.

  The oscillator 310 includes an oscillation circuit 312 and a vibrator 313. The oscillation circuit 312 oscillates the vibrator 313 and generates an oscillation signal. This oscillation signal is output from the OUT terminal of the oscillator 310 to the CPU 320.

  The CPU 320 performs various calculation processes and control processes using the oscillation signal input from the oscillator 310 as a clock signal in accordance with a program stored in the ROM 340 or the like. Specifically, the CPU 320 performs various processes according to operation signals from the operation unit 330, processes for controlling the communication unit 360 to perform data communication with an external device, and displays various types of information on the display unit 370. The process of transmitting the display signal is performed.

  The operation unit 330 is an input device including operation keys, button switches, and the like, and outputs an operation signal corresponding to an operation by the user to the CPU 320.

  The ROM 340 stores programs, data, and the like for the CPU 320 to perform various calculation processes and control processes.

  The RAM 350 is used as a work area of the CPU 320, and temporarily stores programs and data read from the ROM 340, data input from the operation unit 330, calculation results executed by the CPU 320 according to various programs, and the like.

  The communication unit 360 performs various controls for establishing data communication between the CPU 320 and an external device.

The display unit 370 is a display device configured by an LCD (Liquid Crystal Display) or the like, and displays various types of information based on a display signal input from the CPU 320. Display unit 37
0 may be provided with a touch panel that functions as the operation unit 330.

  By applying the oscillation circuit 2 of the above-described embodiment as the oscillation circuit 312 or applying the oscillator 1 of the above-described embodiment as the oscillator 310, for example, a highly reliable electronic device can be realized.

  Various electronic devices can be considered as such an electronic device 300, for example, a personal computer (for example, a mobile personal computer, a laptop personal computer, a tablet personal computer), a mobile terminal such as a smartphone or a mobile phone, Digital cameras, inkjet discharge devices (for example, inkjet printers), storage area network devices such as routers and switches, local area network devices, mobile terminal base station devices, televisions, video cameras, video recorders, car navigation devices, real time Clock devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game machines, game controllers, word processors, word processors Station, video phone, security TV monitor, electronic binoculars, POS terminal, medical equipment (eg electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measurements Examples of such devices include instruments, instruments (for example, vehicles, aircraft, and ship instruments), flight simulators, head mounted displays, motion traces, motion tracking, motion controllers, and PDR (pedestrian orientation measurement).

  As an example of the electronic apparatus 300 according to this embodiment, the above-described oscillator 310 is used as a reference signal source, a voltage variable oscillator (VCO), or the like, for example, a terminal base station apparatus that performs wired or wireless communication with a terminal. As a transmission device. The electronic device 300 according to the present embodiment can be applied to, for example, a transmission device that requires high performance and high reliability, which can be used for, for example, a communication base station by applying the oscillator 1 according to the above-described embodiment as the oscillator 310. Can also be applied.

3. FIG. 15 is a diagram (top view) illustrating an example of the moving object according to the present embodiment. A moving body 400 shown in FIG. 15 includes controllers 420, 430, and 440 that perform various controls such as an oscillator 410, an engine system, a brake system, and a keyless entry system, a battery 450, and a backup battery 460. Note that the mobile body of the present embodiment may have a configuration in which some of the components (each unit) in FIG. 15 are omitted or other components are added.

  The oscillator 410 includes an oscillation circuit (not shown) and a vibrator, and the oscillation circuit oscillates the vibrator and generates an oscillation signal. This oscillation signal is output from the external terminal of the oscillator 410 to the controllers 420, 430, and 440, and is used as, for example, a clock signal.

  The battery 450 supplies power to the oscillator 410 and the controllers 420, 430, and 440. The backup battery 460 supplies power to the oscillator 410 and the controllers 420, 430, and 440 when the output voltage of the battery 450 falls below a threshold value.

  By applying, for example, the oscillation circuit 2 of the above-described embodiment as the oscillation circuit included in the oscillator 410, or by applying, for example, the oscillator 1 of the above-described embodiment as the oscillator 410, a highly reliable moving body can be realized. it can.

As such a moving body 400, various moving bodies can be considered, and examples thereof include automobiles (including electric automobiles), aircraft such as jets and helicopters, ships, rockets, and artificial satellites.

  The present invention is not limited to the present embodiment, and various modifications can be made within the scope of the gist of the present invention.

  For example, the oscillator according to the embodiment and the modification described above is an oscillator (VC-TCXO (Voltage Controlled Temperature Compensated Crystal Oscillator) or the like) having a temperature compensation function and a voltage control function (frequency control function). Voltage-controlled oscillators (VCXO (Voltage Controlled Crystal Oscillator) etc.) without temperature compensation function, temperature-compensated oscillators (TCXO (Temperature Compensated Crystal Oscillator) etc.) without voltage control function (frequency control function), temperature Apply to oscillators that do not have both compensation function and voltage control function (frequency control function) (SPXO (SimplePackaged Crystal Oscillator), etc.), oven controlled oscillators (OCXO (Oven Controlled Crystal Oscillator), etc.) Can do.

  The above-described embodiments and modifications are merely examples, and the present invention is not limited to these. For example, it is possible to appropriately combine each embodiment and each modification.

  The present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations that have the same functions, methods, and results, or configurations that have the same objects and effects). In addition, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that exhibits the same operational effects as the configuration described in the embodiment or a configuration that can achieve the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.

DESCRIPTION OF SYMBOLS 1 Oscillator, 2 Oscillator circuit, 3 Oscillator, 4 Package, 5 Cover, 6 External terminal (external electrode), 7a, 7b Storage chamber, 8 Sealing member, 9 Electronic component, 10 Oscillator circuit, 11 Oscillator, 12 Current source circuit, 20 output circuit, 22 amplitude control circuit, 24 output signal generation circuit, 26 replica circuit, 28 heat generation circuit, 30 frequency adjustment circuit, 32 AFC circuit, 40 temperature compensation circuit, 42 temperature sensor, 50 regulator circuit, 60 Storage unit, 62 register, 64 non-volatile memory, 70 switch circuit, 80 serial interface (I / F) circuit, 90, 91, 92 wiring, 100 semiconductor substrate, 111
1st circuit block, 112 2nd circuit block, 300 electronic device, 310 oscillator, 312 oscillation circuit, 313 vibrator, 320 CPU, 330 operation unit, 340 ROM, 350 RAM, 360 communication unit, 370 display unit, 400 moving body , 410 Oscillator, 420, 430, 440 Controller, 450 battery, 460 Backup battery

Claims (8)

An oscillation circuit that is electrically connected to a vibrator and causes the vibrator to oscillate, an output circuit that receives a signal output from the oscillation circuit and outputs an oscillation signal, the oscillation circuit, and the output circuit A storage unit storing data for controlling at least one of the oscillation circuit,
Storing the first data in the storage unit;
Controlling the oscillation circuit based on the first data and adjusting the oscillation circuit;
And a step of erasing the first data from the storage unit and storing the second data.   The number of bits of the first data is less than or equal to the number of bits of the second data, and the second data is written in an area of the storage unit where the first data has been written. The adjustment method of the oscillation circuit described in 1. The oscillation circuit includes a first characteristic adjustment circuit that adjusts a characteristic of the oscillation circuit,
The oscillation circuit adjustment method according to claim 1, wherein the second data is data for controlling the first characteristic adjustment circuit. The oscillation circuit includes a temperature sensing element, and a second characteristic adjustment circuit that adjusts characteristics of the oscillation circuit based on a signal output from the temperature sensing element,
In the step of adjusting the oscillation circuit,
4. The method of adjusting an oscillation circuit according to claim 1, wherein the characteristic of the oscillation circuit is adjusted using an output signal of the second characteristic adjustment circuit. 5.   The oscillation circuit adjustment method according to claim 4, wherein the second characteristic adjustment circuit is a temperature compensation circuit. An oscillation circuit that is electrically connected to a vibrator and oscillates the vibrator;
An output circuit that receives the signal output from the oscillation circuit and outputs an oscillation signal;
A storage unit for storing data for controlling at least one of the oscillation circuit and the output circuit,
The predetermined area of the storage unit and the first circuit block are electrically connected,
An oscillation circuit in which the predetermined area of the storage unit and the second circuit block are electrically connected.   An electronic device comprising the oscillation circuit according to claim 6.   A moving body comprising the oscillation circuit according to claim 6.

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