JP7240882B2 - Manufacturing method for multilayer ceramic electronic component - Google Patents

Description

The present invention relates to a method of manufacturing a laminated ceramic electronic component such as a laminated ceramic capacitor.

As a method of manufacturing a multilayer ceramic electronic component such as a multilayer ceramic capacitor, the end face of the ceramic body on which the external electrode is formed is polished from the viewpoint of improving poor connection between the internal electrode and the external electrode laminated in the ceramic body. A method to do so is proposed.

For example, Patent Literature 1 describes a method of dry barrel polishing a substrate in which a plurality of dielectric layers and internal electrodes are laminated. Patent Literature 2 describes a method of wet barrel polishing a ceramic sintered body in which a plurality of internal electrodes are laminated via ceramic layers. Patent Document 3 describes a method of polishing a ceramic substrate by sandblasting. Patent Document 4 describes a method of polishing the end face of a chip-type element with a polishing brush.

JP-A-2003-53656 JP-A-2001-6964 JP 2005-101257 A Japanese translation of PCT publication No. 2009/125631

However, in the methods described in Patent Documents 1 to 4, the internal electrodes cannot be sufficiently exposed at the end surfaces, and connection failures between the internal electrodes and the external electrodes may occur. In particular, when stress is applied between the internal electrode and the external electrode on the end surface due to temperature change, poor connection is likely to occur, making it difficult to obtain sufficient connection reliability.

SUMMARY OF THE INVENTION In view of the circumstances as described above, an object of the present invention is to provide a method of manufacturing a multilayer ceramic electronic component capable of improving connection reliability between internal electrodes and external electrodes.

In order to achieve the above object, a method for manufacturing a multilayer ceramic electronic component according to one aspect of the present invention includes: internal electrodes laminated in a first direction; end surfaces facing in a second direction perpendicular to the first direction; including a step of firing a ceramic body having
By etching the end face of the fired ceramic body using a treatment liquid, the end of the internal electrode in the second direction protrudes from the end face.
By physically polishing the end face of the fired ceramic body, the oxide formed on the end is removed.
External electrodes are formed on the etched and physically polished end faces.

In this configuration, by selectively etching the ceramic portion of the end face with the processing liquid, the end of the internal electrode, which tends to shrink and recede from the end face during firing, can be made to protrude from the end face. Also, by physically polishing the end faces, oxides that may be formed on the ends of the internal electrodes can be removed. As a result, the end portions of the internal electrodes where oxide is not formed can be reliably connected to the external electrodes, and the connection reliability between the internal electrodes and the external electrodes can be improved.

The oxide may be removed by etching the end face of the fired ceramic body with the treatment liquid and then physically polishing the end face.
As a result, the end portion of the internal electrode can be physically polished after protruding from the end face, and the oxide can be removed more reliably. In addition, since the oxide is polished while protruding from the end face, the polishing time can be shortened. As a result, productivity can be maintained and damage to the ceramic body can be reduced.

Furthermore, the end face from which the oxide has been removed may protrude from the end face by etching the end face with the treatment liquid and then physically polishing the end face.
As a result, the internal electrodes are connected to the external electrodes with the ends protruding from the end faces. Therefore, the connection between the internal electrode and the external electrode can be further strengthened, and the connection between the internal electrode and the external electrode can be maintained even when stress is applied to the end surface due to temperature changes after manufacturing, bending of the mounting board, or the like. can be maintained.

The physical polishing method may specifically include a barrel polishing method or a blasting method.

As described above, according to the present invention, it is possible to provide a method for manufacturing a multilayer ceramic electronic component capable of improving connection reliability between internal electrodes and external electrodes.

1 is a perspective view of a laminated ceramic capacitor according to a first embodiment of the invention; FIG. FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor taken along line AA' in FIG. 1; 2 is a cross-sectional view of the multilayer ceramic capacitor taken along line BB' of FIG. 1; FIG. 3 is an enlarged cross-sectional view showing the vicinity of the end surface of FIG. 2 of the laminated ceramic capacitor; FIG. 4 is a flow chart showing a method for manufacturing the laminated ceramic capacitor. It is a perspective view which shows the manufacturing process of the said laminated ceramic capacitor. It is a perspective view which shows the manufacturing process of the said laminated ceramic capacitor. FIG. 4 is an enlarged cross-sectional view showing a manufacturing process of the laminated ceramic capacitor; FIG. 4 is an enlarged cross-sectional view showing a manufacturing process of the laminated ceramic capacitor; FIG. 4 is an enlarged cross-sectional view showing a manufacturing process of the laminated ceramic capacitor; 4 is a flow chart showing a method for manufacturing the laminated ceramic capacitor. FIG. 4 is an enlarged cross-sectional view showing a manufacturing process of the laminated ceramic capacitor; FIG. 4 is an enlarged cross-sectional view showing a manufacturing process of the laminated ceramic capacitor;

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
The drawings show mutually orthogonal X, Y and Z axes where appropriate. The X-axis, Y-axis, and Z-axis are common in all drawings.

<First Embodiment>
[Structure of Multilayer Ceramic Capacitor 10]
1 to 3 are diagrams showing a multilayer ceramic capacitor 10 according to a first embodiment of the invention. FIG. 1 is a perspective view of a laminated ceramic capacitor 10. FIG. FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor 10 taken along line AA' in FIG. FIG. 3 is a cross-sectional view of the multilayer ceramic capacitor 10 taken along line BB'.

A multilayer ceramic capacitor 10 includes a ceramic element body 11 and two external electrodes 14 . The ceramic body 11 has two end surfaces 11a facing in the X-axis direction, two side surfaces 11b facing in the Y-axis direction, and two main surfaces 11c facing in the Z-axis direction. Each surface may be flat or curved. For example, the ridges connecting the surfaces of the ceramic body 11 are rounded.

Although the size of the laminated ceramic capacitor 10 is not particularly limited, for example, the dimension in the X-axis direction is 1.0 mm or more and 4.5 mm or less, and the dimension in the Y-axis direction and the Z-axis direction is 0.5 mm or more and 3.2 mm or less. Each dimension of the multilayer ceramic capacitor 10 is the dimension of the largest portion in each direction.

The external electrodes 14 are formed on the end face 11a of the ceramic body 11 and face each other in the X-axis direction with the ceramic body 11 interposed therebetween. The external electrode 14 extends from the end surface 11a of the ceramic body 11 to the main surface 11c and the side surface 11b. As a result, the external electrode 14 has a U-shaped cross section parallel to the XZ plane and a cross section parallel to the XY plane. The shape of the external electrodes 14 is not limited to that shown in FIG.

The external electrode 14 is made of a good electrical conductor. Good electrical conductors forming the external electrodes 14 include, for example, copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), silver (Ag), and gold (Au). A metal or alloy as a main component can be mentioned.

The ceramic body 11 has a capacitance forming portion 16 , a side margin portion 17 and a cover portion 18 . The side margin portion 17 is provided outside the capacitance forming portion 16 in the Y-axis direction. The cover portion 18 is provided outside the capacitance forming portion 16 in the Z-axis direction. The side margin portion 17 and the cover portion 18 mainly have the function of protecting the periphery of the capacitance forming portion 16 and ensuring the insulation of the internal electrodes 12 and 13 .

The capacitance forming portion 16 has a plurality of ceramic layers 15, a plurality of first internal electrodes 12, and a plurality of second internal electrodes 13, and has a structure in which these are laminated.

The internal electrodes 12 and 13 are alternately arranged along the Z-axis direction between a plurality of ceramic layers 15 laminated in the Z-axis direction. The first internal electrode 12 is drawn out to one end face 11a and separated from the other end face 11a. The second internal electrode 13 is separated from the end face 11a from which the first internal electrode 12 is drawn, and is drawn to the other end face 11a.

The internal electrodes 12 and 13 are typically composed mainly of nickel (Ni) and function as internal electrodes of the multilayer ceramic capacitor 10 . Note that the internal electrodes 12 and 13 may be made mainly of copper (Cu), silver (Ag), palladium (Pd), or the like, other than nickel.

The ceramic layer 15 is made of dielectric ceramics. The ceramic layer 15 is made of dielectric ceramics with a high dielectric constant in order to increase the capacitance of the capacitance forming portion 16 .
As the dielectric ceramics having a high dielectric constant, polycrystals of barium titanate (BaTiO ₃ )-based materials, that is, polycrystals having a perovskite structure containing barium (Ba) and titanium (Ti) are used. Thereby, a multi-layer ceramic capacitor 10 with a large capacity is obtained.
The ceramic layer 15 is made of strontium titanate (SrTiO ₃ ), calcium titanate (CaTiO ₃ ), magnesium titanate (MgTiO ₃ ), calcium zirconate (CaZrO ₃ ), calcium zirconate titanate (Ca (Zr, Ti)O ₃ ) system, barium zirconate (BaZrO ₃ ) system, titanium oxide (TiO ₂ ) system, or the like.

The side margin portion 17 and the cover portion 18 are also made of dielectric ceramics. The material forming the side margin portions 17 and the cover portion 18 may be insulating ceramics, but internal stress in the ceramic body 11 can be suppressed by using dielectric ceramics similar to the ceramic layer 15 .

[Detailed Configuration of Multilayer Ceramic Capacitor 10]
FIG. 4 is an enlarged view of a part of FIG. 2 and shows an example of a connection mode between the first internal electrode 12 and the external electrode 14 on the end surface 11a. The end face 11a on the side from which the second internal electrode 13 is drawn is similarly configured.

The internal electrode 12 has an end portion 12a protruding from the end face 11a in this embodiment. That is, the end portion 12 a is configured to bite into the external electrode 14 .

In this embodiment, the end portion 12a is made of a conductive material such as nickel, and is not formed with an insulating oxide. Thereby, the electrical connection between the end portion 12a and the external electrode 14 can be ensured.

That is, in this embodiment, the ends 12a and 13a made of a conductive material protrude toward the external electrodes 14, so that they can be reliably connected to the external electrodes 14. FIG. As a result, connection failure between the ends 12a and 13a and the external electrode 14 can be prevented, and ESR (equivalent series resistance) failure, reduction in capacitance, and the like can be prevented.

Furthermore, since the end portions 12a and 13a and the external electrode 14 are joined at a plurality of surfaces, the joint area between the two can be increased and they can be joined at a plurality of directions. After manufacturing the multilayer ceramic capacitor 10, the external electrode 14 and the internal electrodes 12 and 13 are separated from each other due to temperature changes caused by heat generation during mounting and use, and bending of the substrate on which the multilayer ceramic capacitor 10 is mounted. Directional stress may be applied. Even in such a case, according to the above configuration, the external electrode 14 and the internal electrodes 12 and 13 can be easily maintained in a bonded state. Therefore, it is possible to obtain a highly reliable laminated ceramic capacitor 10 that can withstand an environment with a large load.

[Manufacturing Method of Multilayer Ceramic Capacitor 10]
FIG. 5 is a flow chart showing the manufacturing method of the multilayer ceramic capacitor 10 according to this embodiment. 6 and 7 are diagrams showing the manufacturing process of the laminated ceramic capacitor 10. FIG. Hereinafter, a method for manufacturing the laminated ceramic capacitor 10 will be described along FIG. 5 and with appropriate reference to FIGS. 6 and 7. FIG.
(Step S11: Fabrication of ceramic body 11)
In step S11, the first ceramic sheet 101 and the second ceramic sheet 102 for forming the capacitance forming portion 16, and the third ceramic sheet 103 for forming the cover portion 18 are prepared. Then, as shown in FIG. 6, an unfired ceramic body 111 formed by stacking these ceramic sheets 101, 102, and 103 is fired to produce the ceramic body 11. Next, as shown in FIG.

The ceramic sheets 101, 102, 103 are configured as unfired dielectric green sheets containing dielectric ceramics as a main component.
Unfired first internal electrodes 112 corresponding to the first internal electrodes 12 are formed on the first ceramic sheet 101 , and unfired second internal electrodes 113 corresponding to the second internal electrodes 13 are formed on the second ceramic sheet 102 . is formed. In the ceramic sheets 101 and 102, regions corresponding to the side margin portions 17 where the internal electrodes 112 and 113 are not formed are provided on the Y-axis direction peripheral edges of the internal electrodes 112 and 113. As shown in FIG. No internal electrodes are formed on the third ceramic sheet 103 .

In the unfired ceramic body 111 shown in FIG. 6, the ceramic sheets 101 and 102 are alternately laminated, and the third ceramic sheet 103 corresponding to the cover portion 18 is laminated on the upper and lower surfaces in the Z-axis direction. The unfired ceramic body 111 is integrated by pressing the ceramic sheets 101, 102, 103 together. The number of ceramic sheets 101, 102, 103 is not limited to the example shown in FIG.

Although the unfired ceramic element body 111 corresponding to one ceramic element body 11 has been described above, in reality, a laminated sheet configured as a large-sized sheet that is not singulated is formed, and the ceramic element body is formed. Each body 111 is singulated.

By sintering the unfired ceramic body 111, the ceramic body 11 shown in FIG. 7 is produced.
The sintering temperature can be determined based on the sintering temperature of the ceramic body 111 . For example, when a barium titanate-based material is used as the dielectric ceramics, the firing temperature can be about 1000 to 1300.degree. Also, the firing can be performed, for example, in a reducing atmosphere or in a low oxygen partial pressure atmosphere.

FIG. 8 is a schematic enlarged cross-sectional view showing the end face 11a on the side where the first internal electrodes 12 are drawn out after firing. During firing, the internal electrodes 112 and 113 made of metal material shrink more than the ceramic layer 15 made of ceramic due to the difference in thermal shrinkage. As a result, the end portion 12a of the internal electrode 12 retreats inward from the end surface 11a facing the X-axis direction, and the end portion 12a is buried from the end surface 11a.

Furthermore, by firing, an oxide 12b of the electrode material is formed on the end portion 12a. As a result, the insulation of the end portion 12a is enhanced, and the electrical connection with the external electrode 14 becomes unstable.

Similarly to the end portion 12a of the first internal electrode 12 shown in FIG. 8, the end portion 13a of the second internal electrode 13 is recessed inwardly from the end surface 11a, and oxide is formed on the end portion 13a.

Therefore, in the present embodiment, the ends 12a and 13a of the internal electrodes 12 and 13 are treated by the following two processes so as to ensure electrical connection with the external electrodes 14. As shown in FIG.

(Step S12: chemical etching of end surface 11a)
In step S12, the end face 11a of the fired ceramic body 11 is etched using a treatment liquid. As a result, the ends 12a and 13a of the internal electrodes 12 and 13 protrude from the end surface 11a.

The treatment liquid is not particularly limited as long as it can selectively etch the ceramics of the ceramic body 11 . For example, the treatment liquid contains at least one selected from hydrofluoric acid, hydrochloric acid, nitric acid, sulfuric acid, oxalic acid, etc. as a main component. The treatment liquid may further contain an etching accelerator such as an inorganic acid, a surface stabilizer for stabilizing the surface of the end surface 11a after treatment, and the like.

The etching treatment can be performed by immersing at least the end surface 11a in the treatment liquid using a jig or the like. Alternatively, the etching treatment can be performed by immersing the entire ceramic body 11 in the treatment liquid. At this time, a mask may be provided on a surface other than the end surface 11a to be processed. By adjusting the etching conditions such as the etching time and the composition of the treatment liquid, the amount of protrusion of the end portions 12a and 13a from the end surface 11a can be adjusted.

FIG. 9 is a schematic enlarged cross-sectional view showing the end face 11a on the side where the first internal electrode 12 is drawn out after the etching process. After the etching process, the buried end portion 12a protrudes from the end surface 11a by etching the ceramic portion of the ceramic body 11 . Although the oxide 12b cannot be removed at this point, the etching conditions are adjusted so that the end portion 12a including the portion where the oxide 12b is formed protrudes sufficiently from the end surface 11a.

The process of step S12 is similarly performed for the end face 11a on the side where the second internal electrode 13 is drawn. As a result, as with the end face 11a shown in FIG. 9, the end face 11a on the side where the second internal electrode 13 is drawn out is in a state where the end portion 13a of the second internal electrode 13 protrudes from the end face 11a.

(Step S13: Physical Polishing of End Face 11a)
In step S13, the oxide 12b formed on the end portions 12a and 13a of the internal electrodes 12 and 13 is removed by physically polishing the end face 11a after the etching process.

Methods of physical abrasion treatment include, but are not limited to, barrel polishing or blasting, for example. The barrel polishing method may be, for example, a dry barrel polishing method or a wet barrel polishing method. In the dry barrel polishing method, the ceramic body 11, media (polishing media), etc. are put into a barrel container, and barrel polishing is performed by rotating the barrel container. In the wet barrel polishing method, in addition to the ceramic body 11, media, etc., a liquid such as water is put into a barrel container, and barrel polishing is performed. The blasting method includes a sandblasting method, a wet blasting method, and the like. As another physical polishing method, there is a method using a tool such as a brush or a whetstone.

FIG. 10 is a schematic enlarged cross-sectional view showing the end face 11a on the side where the first internal electrode 12 is drawn after polishing. After the polishing process, the oxide 12b formed on the end portion 12a is removed. As a result, the conductive end portion 12a from which the oxide 12b has been removed protrudes from the end surface 11a.

The amount of protrusion of the end portion 12a (13a) from the end surface 11a in the X-axis direction after step S13 is, for example, 0.1 μm or more and 2.0 μm or less. The amount of protrusion of the end portions 12a and 13a is, for example, a total of 10 points, 5 points in the central portion and 5 points in the outer peripheral portion of the end portions 12a and 13a of the internal electrodes 12 and 13 on the two end surfaces 11a. It can be calculated as the average value of the amount.

The process of step S13 is similarly performed for the end face 11a on the side where the second internal electrode 13 is drawn out. As a result, similarly to the end surface 11a shown in FIG. 10, the end portion 13a is made of a conductive material and protrudes outward from the end surface 11a.

(Step S14: External electrode formation)
In step S14, the multilayer ceramic capacitor 10 shown in FIGS. 1 to 3 is produced by forming the external electrodes 14 on the end face 11a of the ceramic body 11 which has been etched and physically polished. In step S14, for example, a base film and a plating film that constitute the external electrodes 14 are formed on each of the two end faces 11a.

More specifically, first, an unsintered electrode material is applied so as to cover the end surface 11a of the ceramic body 11 . By baking the applied unfired electrode material in, for example, a reducing atmosphere or a low oxygen partial pressure atmosphere, a base film for the external electrodes 14 is formed on the ceramic body 11 .

Then, one or a plurality of plating films are formed on the underlying film of the external electrodes 14 baked onto the ceramic body 11 by a plating method such as electrolytic plating.

The base film of the external electrodes 14 is not limited to a baked film, and may be formed by, for example, a sputtering method. This eliminates the need for baking and enables formation of a base film with higher adhesion.

In this embodiment, the external electrode 14 is connected to the ends 12a, 13a of the internal electrodes 12, 13 which are sufficiently exposed after the oxide has been removed. As a result, the external electrode 14 and the internal electrodes 12 and 13 can be reliably connected, and ESR (equivalent series resistance) defects, reduction in capacitance, and the like can be prevented. Furthermore, the resistance to heat load and bending of the substrate during and after mounting the multilayer ceramic capacitor 10 on the substrate can be enhanced, and the highly reliable multilayer ceramic capacitor 10 can be obtained.

In addition, depending on the structure of the laminated ceramic capacitor 10, the internal electrodes 12 and 13 may recede significantly inward from the end surfaces 11a after firing, making it difficult to obtain good connection with the external electrodes .
For example, in a multilayer ceramic capacitor 10 with high withstand voltage and high reliability, the number of layers of the internal electrodes 12 and 13 per unit thickness is small, and the thickness (volume) of the ceramic layer 15 is relatively large with respect to the internal electrodes 12 and 13. composed largely of In this case, during firing, the amount of shrinkage of the internal electrodes 12 and 13 increases relative to the amount of shrinkage of the ceramic layer 15, and the internal electrodes 12 and 13 tend to retreat inward from the end surface 11a after firing.
Similarly, in the case of the low-profile multilayer ceramic capacitor 10, the number of layers of the internal electrodes 12 and 13 is small, and the volume of the ceramic portion is relatively large. It becomes the structure which a connection failure tends to generate|occur|produce.

According to the present embodiment, by performing the etching process after firing, the internal electrodes 12 and 13 can be reliably protruded even when the internal electrodes 12 and 13 are largely recessed inward by firing. Further, by performing the polishing process after the etching process, the polishing process can be performed in a state where the oxide protrudes outward from the end face 11a, and the oxide 12b of the internal electrodes 12 and 13 can be reliably removed. . Therefore, even in a multilayer ceramic capacitor 10 having a small number of internal electrodes 12 and 13 and a multilayer ceramic capacitor 10 used in a severe environment such as a large heat load, the connection reliability between the external electrode 14 and the internal electrodes 12 and 13 is high. can increase

Furthermore, in this embodiment, since the polishing process is performed with the oxide 12b protruding from the end face 11a, the polishing medium or the like used in the polishing process easily hits the protruding oxide 12b. Thereby, the polishing process can be efficiently performed, and the polishing time can be shortened. Therefore, productivity can be maintained, and damage to the ceramic body 11 due to polishing can be reduced.

<Second embodiment>
FIG. 11 is a flow chart showing a method of manufacturing the multilayer ceramic capacitor 10 according to the second embodiment of the invention. 12 and 13 are diagrams showing the manufacturing process of the multilayer ceramic capacitor 10. FIG. The manufacturing method of the present embodiment will be described below mainly with respect to the differences from the first embodiment.

(Step S21: Fabrication of ceramic body 11)
In step S21, the ceramic body 11 is produced as in step S11 of the first embodiment. As a result, a ceramic body 11 having an appearance similar to that of the first embodiment shown in FIG. 7 is produced.

FIG. 12 is a schematic enlarged view showing the end face 11a on the side where the first internal electrodes 12 are drawn out after firing. The end face 11a on the side from which the second internal electrode 13 is drawn is also configured in the same manner.

As shown in FIG. 12, depending on the number of layers of the internal electrodes 12 and 13, the relationship between the thicknesses of the ceramic layer 15 and the internal electrodes 12 and 13, and the like, the end portions 12a and 13a may hardly recede from the end surface 11a. be. However, even in this case, the oxide 12b of the electrode material is formed on the ends 12a and 13a. Therefore, when the external electrodes 14 are formed on the end surface 11a shown in FIG.

(Step S22: Physical Polishing of End Face 11a)
In step S22, the end face 11a of the fired ceramic body 11 is physically polished to remove the oxide 12b formed on the end portion 12a. A method similar to step S13 can be selected as the physical polishing method.

FIG. 13 is a schematic enlarged cross-sectional view showing the end face 11a on the side where the first internal electrode 12 is drawn out after polishing. After polishing, the oxide 12b is removed and the edge 12a is made of conductive material.

After step S22 of the present embodiment, as shown in FIG. 13, the surfaces of the end portions 12a and 13a may be formed continuously with the end surface 11a. Alternatively, ends 12a and 13a may be selectively removed and slightly recessed from end face 11a.

(Step S23: chemical etching of end surface 11a)
In step S23, the physically polished end face 11a of the ceramic body 11 is etched using a processing liquid. As a result, the ceramic portion of the ceramic body 11 is etched, and the end portion 12a protrudes from the end face 11a, as in FIG. 10 described in the first embodiment. As the etching method, the same method as in step S12 can be selected.

(Step S24: External electrode formation)
In step S24, the multilayer ceramic capacitor 10 shown in FIGS. 1 to 4 is manufactured by forming the external electrodes 14 on the ceramic body 11 which has been etched and physically polished.

Also in this embodiment, the ends 12 a and 13 a of the internal electrodes 12 and 13 from which the oxide has been removed and are sufficiently exposed are connected to the external electrode 14 . As a result, good connection between the external electrode 14 and the internal electrodes 12 and 13 is achieved, as in the first embodiment. Therefore, it is possible to obtain a multilayer ceramic capacitor 10 that can prevent ESR (equivalent series resistance) defects, a decrease in capacitance, and the like, and has high reliability against heat loads and the like.

Although each embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention.

For example, FIG. 4 shows a configuration in which the end portion 12a of the first internal electrode 12 protrudes from the end surface 11a, but the multilayer ceramic capacitor 10 includes internal electrodes including ends 12a and 13a that do not protrude from the end surface 11a. 12, 13 may be included.

For example, in the above embodiments, a multilayer ceramic capacitor was described as an example of a ceramic electronic component, but the present invention is applicable to general multilayer ceramic electronic components in which internal electrodes are alternately arranged. Examples of such laminated ceramic electronic components include piezoelectric elements.

DESCRIPTION OF SYMBOLS 10... Laminated ceramic capacitor 11... Ceramic element body 11a... End face 111... Unfired ceramic element body 12, 13... Internal electrode 12a, 13a... End part in Y-axis direction (second direction) of internal electrode 12b... Oxide 14 …external electrode

Claims (2)

sintering a ceramic body having internal electrodes stacked in a first direction and end faces facing a second direction orthogonal to the first direction;
etching the end face of the fired ceramic body using a treatment liquid to project the end of the internal electrode in the second direction from the end face;
physically polishing the end face of the fired ceramic body to remove the oxide formed on the end,
A method for manufacturing a multilayer ceramic electronic component, comprising forming an external electrode on the etched and physically polished end face, comprising:
After the end face is etched with the treatment liquid, the end face from which the oxide has been removed is made to protrude from the end face by physically polishing the end face.
A method for manufacturing a multilayer ceramic electronic component. A method for manufacturing a multilayer ceramic electronic component according to claim 1 ,
The method of physically polishing includes a barrel polishing method or a blasting method. A method of manufacturing a multilayer ceramic electronic component.

Images