JP2020119949A - Manufacturing method of multilayer ceramic electronic component - Google Patents

Abstract

To provide a manufacturing method of a multilayer ceramic electronic component capable of improving the connection reliability between an internal electrode and an external electrode.SOLUTION: A manufacturing method of a multilayer ceramic electronic component includes a step of firing a ceramic body having internal electrodes stacked in a first direction and an end face facing in a second direction orthogonal to the first direction. When the end face of the fired ceramic body is etched with a treatment liquid, the end portion of the internal electrode in the second direction is projected from the end face. When the end face of the fired ceramic body is physically polished, an oxide formed at the end is removed. An external electrodes is formed on the end face that have been etched and physically polished.SELECTED DRAWING: Figure 5

Description

The present invention relates to a method for manufacturing a monolithic ceramic electronic component such as a monolithic ceramic capacitor.

As a method for manufacturing a monolithic ceramic electronic component such as a monolithic ceramic capacitor, from the viewpoint of improving the connection failure between the internal electrode and the external electrode laminated in the ceramic element body, the end surface of the ceramic element body on which the external electrode is formed is polished. The method to do is proposed.

For example, Patent Document 1 describes a method of dry barrel polishing a substrate in which a plurality of dielectric layers and internal electrodes are laminated. Patent Document 2 describes a method of wet barrel polishing a ceramic sintered body in which a plurality of internal electrodes are laminated via ceramic layers. Patent Document 3 describes a method of polishing a ceramic substrate by a sandblast method. Patent Document 4 describes a method of polishing an end surface of a chip-type element with a polishing brush.

JP, 2003-53656, A JP 2001-6964 A JP, 2005-101257, A Special table 2009/125631 gazette

However, according to the methods described in Patent Documents 1 to 4, the internal electrodes cannot be sufficiently exposed at the end faces, which may result in defective connection between the internal electrodes and the external electrodes. In particular, when stress is applied between the internal electrode and the external electrode on the end face due to temperature change, poor connection is likely to occur and it is difficult to obtain sufficient connection reliability.

In view of the above circumstances, it is an object of the present invention to provide a method for manufacturing a monolithic ceramic electronic component capable of improving the connection reliability between the internal electrode and the external electrode.

In order to achieve the above object, a method for manufacturing a monolithic ceramic electronic component according to an aspect of the present invention includes an internal electrode that is laminated in a first direction, and an end surface that is oriented in a second direction orthogonal to the first direction. Including the step of firing the ceramic body having
By etching the end face of the fired ceramic body with a treatment liquid, the end portion of the internal electrode in the second direction is projected from the end face.
By physically polishing the end face of the fired ceramic body, the oxide formed at the end is removed.
External electrodes are formed on the end faces that have been etched and physically polished.

In this configuration, the ceramic portion of the end face is selectively etched by the treatment liquid, so that the end portion of the internal electrode, which is likely to contract during firing and recede from the end face, can be projected from the end face. Further, by physically polishing the end faces, it is possible to remove the oxide that may be formed at the end portions of the internal electrodes. As a result, it is possible to reliably connect the end of the internal electrode where the oxide is not formed and the external electrode, and improve the connection reliability between the internal electrode and the external electrode.

The oxide may be removed by etching the end surface of the fired ceramic element body using the treatment liquid and then physically polishing the end surface.
Thereby, after the end portion of the internal electrode is projected from the end surface, it can be physically polished, and the oxide can be removed more reliably. Moreover, since the oxide is polished in a state of protruding from the end face, the polishing time can be shortened. This makes it possible to maintain productivity and reduce damage to the ceramic body.

Furthermore, the end surface from which the oxide has been removed may be made to protrude from the end surface by physically polishing the end surface after etching the end surface using the treatment liquid.
As a result, the internal electrode is connected to the external electrode with the end portion protruding from the end face. Therefore, the connection between the internal electrode and the external electrode can be further strengthened, and the connection between the internal electrode and the external electrode can be made even when stress is applied to the end surface due to temperature change after manufacturing or bending of the mounting substrate. Can be maintained.

The physical polishing method may specifically include a barrel polishing method or a blast method.

As described above, according to the present invention, it is possible to provide a method for manufacturing a monolithic ceramic electronic component capable of improving the connection reliability between the internal electrode and the external electrode.

1 is a perspective view of a monolithic ceramic capacitor according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view of the laminated ceramic capacitor taken along the line AA′ in FIG. 1. 2 is a cross-sectional view of the monolithic ceramic capacitor taken along line BB′ of FIG. 1. FIG. It is sectional drawing which expands and shows the edge surface vicinity of FIG. 2 of the said monolithic ceramic capacitor. 3 is a flowchart showing a method for manufacturing the above-mentioned laminated ceramic capacitor. FIG. 6 is a perspective view showing a manufacturing process of the above-mentioned multilayer ceramic capacitor. FIG. 6 is a perspective view showing a manufacturing process of the above-mentioned multilayer ceramic capacitor. It is an expanded sectional view which shows the manufacturing process of the said multilayer ceramic capacitor. It is an expanded sectional view which shows the manufacturing process of the said multilayer ceramic capacitor. It is an expanded sectional view which shows the manufacturing process of the said multilayer ceramic capacitor. 3 is a flowchart showing a method for manufacturing the above-mentioned laminated ceramic capacitor. It is an expanded sectional view which shows the manufacturing process of the said multilayer ceramic capacitor. It is an expanded sectional view which shows the manufacturing process of the said multilayer ceramic capacitor.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In the drawings, an X axis, a Y axis, and a Z axis which are orthogonal to each other are shown as appropriate. The X-axis, Y-axis, and Z-axis are common to all the drawings.

<First Embodiment>
[Structure of Multilayer Ceramic Capacitor 10]
1 to 3 are views showing a monolithic ceramic capacitor 10 according to the first embodiment of the present invention. FIG. 1 is a perspective view of a monolithic ceramic capacitor 10. FIG. 2 is a sectional view of the monolithic ceramic capacitor 10 taken along the line AA′ in FIG. FIG. 3 is a sectional view of the monolithic ceramic capacitor 10 taken along line BB′.

The monolithic ceramic capacitor 10 includes a ceramic body 11 and two external electrodes 14. The ceramic body 11 has two end faces 11a facing the X-axis direction, two side faces 11b facing the Y-axis direction, and two main faces 11c facing the Z-axis direction. Each surface may be flat or curved, and for example, the ridges connecting the respective surfaces of the ceramic body 11 are rounded.

Although the size of the monolithic ceramic capacitor 10 is not particularly limited, for example, the dimension in the X-axis direction is 1.0 mm or more and 4.5 mm or less, and the dimension in the Y-axis direction and the Z-axis direction is 0.5 mm or more and 3.2 mm or less. The dimensions of the monolithic ceramic capacitor 10 are the dimensions of the largest portion in each direction.

The external electrode 14 is formed on the end surface 11a of the ceramic body 11 and faces the X-axis direction with the ceramic body 11 interposed therebetween. The external electrode 14 extends from the end surface 11a of the ceramic body 11 to the main surface 11c and the side surface 11b. As a result, in the external electrode 14, both the cross section parallel to the XZ plane and the cross section parallel to the XY plane are U-shaped. The shape of the external electrode 14 is not limited to that shown in FIG.

The external electrode 14 is formed of a good electric conductor. Examples of good electrical conductors that form the external electrodes 14 include copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), silver (Ag), and gold (Au). Examples of the metal or alloy are the main components.

The ceramic body 11 has a capacitance forming portion 16, a side margin portion 17, and a cover portion 18. The side margin portion 17 is provided outside the capacitance forming portion 16 in the Y-axis direction. The cover portion 18 is provided outside the capacitance forming portion 16 in the Z-axis direction. The side margin portion 17 and the cover portion 18 mainly have a function of protecting the periphery of the capacitance forming portion 16 and ensuring the insulating properties of the internal electrodes 12 and 13.

The capacitance forming portion 16 has a plurality of ceramic layers 15, a plurality of first internal electrodes 12, and a plurality of second internal electrodes 13, and has a configuration in which these are stacked.

The internal electrodes 12 and 13 are alternately arranged along the Z-axis direction between the plurality of ceramic layers 15 stacked in the Z-axis direction. The first internal electrode 12 is drawn to one end surface 11a and is separated from the other end surface 11a. The second internal electrode 13 is separated from the end surface 11a from which the first internal electrode 12 is drawn, and is drawn to the other end surface 11a.

The internal electrodes 12 and 13 are typically composed mainly of nickel (Ni) and function as internal electrodes of the monolithic ceramic capacitor 10. The internal electrodes 12 and 13 may contain copper (Cu), silver (Ag), palladium (Pd), or the like as a main component in addition to nickel.

The ceramic layer 15 is made of dielectric ceramics. The ceramic layer 15 is formed of a dielectric ceramic having a high dielectric constant in order to increase the capacity of the capacity forming unit 16.
As the dielectric ceramic having a high dielectric constant, a polycrystal of barium titanate (BaTiO ₃ ) material, that is, a polycrystal of perovskite structure containing barium (Ba) and titanium (Ti) is used. As a result, a large capacity monolithic ceramic capacitor 10 is obtained.
The ceramic layer 15 includes strontium titanate (SrTiO ₃ ) based, calcium titanate (CaTiO ₃ ) based, magnesium titanate (MgTiO ₃ ) based, calcium zirconate (CaZrO ₃ ) based, calcium zirconate titanate (Ca). It may be formed of (Zr,Ti)O ₃ ) system, barium zirconate (BaZrO ₃ ) system, titanium oxide (TiO ₂ ) system, or the like.

The side margin portion 17 and the cover portion 18 are also made of dielectric ceramics. The material for forming the side margin portion 17 and the cover portion 18 may be an insulating ceramic, but by using a dielectric ceramic similar to the ceramic layer 15, the internal stress in the ceramic body 11 is suppressed.

[Detailed Configuration of Multilayer Ceramic Capacitor 10]
FIG. 4 is an enlarged view of a part of FIG. 2, showing an example of a connection mode between the first internal electrode 12 and the external electrode 14 on the end face 11a. The end surface 11a on the side from which the second internal electrode 13 is drawn out is similarly configured.

In the present embodiment, the internal electrode 12 has an end portion 12a protruding from the end surface 11a. That is, the end 12 a is configured to bite into the external electrode 14.

In the present embodiment, the end portion 12a is made of a conductive material such as nickel and has no insulating oxide. As a result, electrical connection between the end 12a and the external electrode 14 can be ensured.

That is, in the present embodiment, the ends 12a and 13a made of a conductive material project toward the external electrode 14, so that the external electrode 14 can be reliably connected. As a result, a connection failure between the end portions 12a and 13a and the external electrode 14 can be prevented, and an ESR (equivalent series resistance) failure and a decrease in electrostatic capacitance can be prevented.

Furthermore, since the end portions 12a and 13a and the external electrode 14 are joined to each other on a plurality of surfaces, it is possible to increase the joining area of both and to join in a plurality of directions. After manufacturing the monolithic ceramic capacitor 10, the external electrode 14 and the internal electrodes 12, 13 are separated from each other due to a temperature change caused by heat generation during mounting or use, or a bending of a substrate on which the monolithic ceramic capacitor 10 is mounted. Directional stress may be applied. Even in such a case, according to the above configuration, the external electrode 14 and the internal electrodes 12, 13 can be easily maintained in the bonded state. Therefore, it is possible to obtain a highly reliable multilayer ceramic capacitor 10 that can withstand an environment with a large load.

[Manufacturing Method of Multilayer Ceramic Capacitor 10]
FIG. 5 is a flowchart showing a method for manufacturing the monolithic ceramic capacitor 10 according to this embodiment. 6 and 7 are views showing a manufacturing process of the monolithic ceramic capacitor 10. Hereinafter, a method of manufacturing the monolithic ceramic capacitor 10 will be described with reference to FIGS. 6 and 7 along with FIG.
(Step S11: Preparation of Ceramic Element 11)
In step S11, the first ceramic sheet 101 and the second ceramic sheet 102 for forming the capacitance forming portion 16 and the third ceramic sheet 103 for forming the cover portion 18 are prepared. Then, as shown in FIG. 6, an unfired ceramic element body 111 formed by stacking these ceramic sheets 101, 102, 103 is fired to produce a ceramic element body 11.

The ceramic sheets 101, 102, 103 are configured as unfired dielectric green sheets containing dielectric ceramics as a main component.
An unfired first internal electrode 112 corresponding to the first internal electrode 12 is formed on the first ceramic sheet 101, and an unfired second internal electrode 113 corresponding to the second internal electrode 13 is formed on the second ceramic sheet 102. Are formed. In each of the ceramic sheets 101 and 102, a region corresponding to the side margin portion 17 in which the internal electrodes 112 and 113 are not formed is provided on the peripheral edge of the internal electrodes 112 and 113 in the Y-axis direction. Internal electrodes are not formed on the third ceramic sheet 103.

In the unfired ceramic body 111 shown in FIG. 6, the ceramic sheets 101 and 102 are alternately laminated, and the third ceramic sheet 103 corresponding to the cover portion 18 is laminated on the upper and lower surfaces in the Z-axis direction. The unfired ceramic body 111 is integrated by pressure bonding the ceramic sheets 101, 102, 103. The number of ceramic sheets 101, 102, 103 is not limited to the example shown in FIG.

Although the unfired ceramic element body 111 corresponding to one ceramic element body 11 has been described above, in reality, a laminated sheet configured as a large-sized sheet that is not divided into individual pieces is formed, and the ceramic element body is formed. Individualized for each body 111.

By sintering the unfired ceramic body 111, the ceramic body 11 shown in FIG. 7 is produced.
The firing temperature can be determined based on the sintering temperature of the ceramic body 111. For example, when using a barium titanate-based material as the dielectric ceramics, the firing temperature can be set to about 1000 to 1300°C. The firing can be performed, for example, in a reducing atmosphere or a low oxygen partial pressure atmosphere.

FIG. 8 is a schematic enlarged cross-sectional view showing the end face 11a on the side from which the first internal electrode 12 after firing has been pulled out. At the time of firing, the internal electrodes 112 and 113 made of a metal material shrink more greatly than the ceramic layer 15 made of ceramics and the like due to the difference in thermal shrinkage. As a result, the end 12a of the internal electrode 12 recedes inward from the end surface 11a facing the X-axis direction, and the end 12a is buried from the end surface 11a.

Further, by firing, the oxide 12b of the electrode material is formed on the end portion 12a. As a result, the insulating property of the end portion 12a is enhanced and the electrical continuity with the external electrode 14 becomes unstable.

Similarly to the end portion 12a of the first internal electrode 12 shown in FIG. 8, the end portion 13a of the second internal electrode 13 also recedes inward from the end surface 11a, and an oxide is formed on the end portion 13a.

Therefore, in the present embodiment, the end portions 12a and 13a of the internal electrodes 12 and 13 are processed by the following two steps so as to ensure the conduction with the external electrode 14.

(Step S12: Chemical etching of the end surface 11a)
In step S12, the end surface 11a of the fired ceramic element body 11 is etched using a treatment liquid. As a result, the end portions 12a and 13a of the internal electrodes 12 and 13 are projected from the end surface 11a.

The treatment liquid is not particularly limited as long as it can selectively etch the ceramic of the ceramic body 11. For example, the treatment liquid contains as a main component at least one selected from hydrofluoric acid, hydrochloric acid, nitric acid, sulfuric acid, oxalic acid, and the like. The treatment liquid may further contain an etching accelerator such as an inorganic acid, a surface stabilizer for stabilizing the surface of the end surface 11a after the treatment, and the like.

The etching treatment can be performed by immersing at least the end surface 11a in the treatment liquid using a jig or the like. Alternatively, the etching treatment can be performed by immersing the entire ceramic body 11 in the treatment liquid. At this time, a mask may be provided on a surface other than the end surface 11a to be processed. The amount of protrusion of the end portions 12a and 13a from the end surface 11a can be adjusted by adjusting the etching conditions such as the etching time and the composition of the processing liquid.

FIG. 9 is a schematic enlarged cross-sectional view showing the end face 11a on the side from which the first internal electrode 12 is drawn out after the etching process. After the etching process, the ceramic portion of the ceramic body 11 is etched, so that the buried end portion 12a projects from the end surface 11a. At this point, the oxide 12b cannot be removed, but the etching conditions are adjusted so that the end 12a including the portion where the oxide 12b is formed is sufficiently projected from the end surface 11a.

The process of step S12 is similarly performed on the end surface 11a on the side where the second internal electrode 13 is pulled out. As a result, similarly to the end surface 11a shown in FIG. 9, the end surface 11a on the side where the second internal electrode 13 is pulled out is also in a state in which the end portion 13a of the second internal electrode 13 projects from the end surface 11a.

(Step S13: Physical Polishing of End Face 11a)
In step S13, the end surface 11a after the etching process is physically polished to remove the oxide 12b formed on the end portions 12a and 13a of the internal electrodes 12 and 13.

The physical polishing method is not limited, but includes, for example, a barrel polishing method or a blast method. The barrel polishing method may be, for example, a dry barrel polishing method or a wet barrel polishing method. In the dry barrel polishing method, the ceramic body 11 and a medium (polishing medium) are put into a barrel container, and the barrel container is rotated to perform barrel polishing. In the wet barrel polishing method, liquid such as water is charged into a barrel container in addition to the ceramic body 11 and the medium, and barrel polishing is performed. Examples of the blast method include a sand blast method and a wet blast method. Examples of the above other physical polishing methods include a method using a tool such as a brush or a grindstone.

FIG. 10 is a schematic enlarged cross-sectional view showing the end face 11a on the side from which the first internal electrode 12 is pulled out after the polishing process. After the polishing process, the oxide 12b formed on the end 12a is removed. As a result, the conductive end 12a from which the oxide 12b has been removed is in a state of protruding from the end surface 11a.

The amount of protrusion of the end 12a (13a) in the X-axis direction from the end surface 11a after step S13 is, for example, 0.1 μm or more and 2.0 μm or less. The protrusion amount of the end portions 12a and 13a is, for example, a total of 10 protrusions of the center portion 5 and the outer peripheral portion 5 in the Z-axis direction among the end portions 12a and 13a of the internal electrodes 12 and 13 on the two end surfaces 11a. It can be calculated as an average value of the amount.

The process of step S13 is similarly performed on the end surface 11a on the side where the second internal electrode 13 is pulled out. As a result, similarly to the end surface 11a shown in FIG. 10, the end portion 13a is made of a conductive material and protrudes outward from the end surface 11a.

(Step S14: formation of external electrodes)
In step S14, the external electrode 14 is formed on the end surface 11a of the ceramic body 11 that has been subjected to the etching process and the physical polishing process, so that the multilayer ceramic capacitor 10 shown in FIGS. In step S14, for example, a base film and a plating film that form the external electrode 14 are formed on each of the two end surfaces 11a.

More specifically, first, an unfired electrode material is applied so as to cover the end surface 11a of the ceramic body 11. By baking the applied unsintered electrode material in, for example, a reducing atmosphere or a low oxygen partial pressure atmosphere, a base film of the external electrode 14 is formed on the ceramic body 11.

Then, one or a plurality of plating films formed by a plating method such as electrolytic plating are formed on the base film of the external electrodes 14 baked on the ceramic body 11.

The base film of the external electrode 14 is not limited to the baking film and may be formed by, for example, a sputtering method. As a result, baking is not necessary and a base film having higher adhesion can be formed.

In the present embodiment, the external electrode 14 is connected to the end portions 12a and 13a of the internal electrodes 12 and 13 in a state where the oxide is removed and the electrode is sufficiently exposed. As a result, the external electrode 14 and the internal electrodes 12 and 13 can be reliably connected, and it is possible to prevent ESR (equivalent series resistance) defects, reduction in capacitance, and the like. Furthermore, the resistance of the monolithic ceramic capacitor 10 to the heat load after mounting or after mounting on the substrate, bending of the substrate, and the like can be increased, and the monolithic ceramic capacitor 10 having high reliability can be obtained.

Further, depending on the structure of the monolithic ceramic capacitor 10, the internal electrodes 12 and 13 largely recede inward from the end surface 11a after firing, and it becomes difficult to obtain a good connection with the external electrode 14.
For example, in the highly reliable multilayer ceramic capacitor 10 having a high withstand voltage, the number of layers of the internal electrodes 12 and 13 per unit thickness is small, and the thickness (volume) of the ceramic layer 15 is relative to the internal electrodes 12 and 13. It is composed of In this case, the amount of shrinkage of the internal electrodes 12, 13 relative to the amount of shrinkage of the ceramic layer 15 is relatively increased during firing, and the internal electrodes 12, 13 are likely to recede inward from the end face 11a after firing.
Also in the case of the low-profile type monolithic ceramic capacitor 10, similarly, since the number of layers of the internal electrodes 12 and 13 is small and the volume of the ceramic portion is relatively large, the internal electrodes 12 and 13 and the external electrode 14 are formed. The configuration is likely to cause poor connection.

According to the present embodiment, by performing the etching process after firing, the internal electrodes 12 and 13 can be reliably projected even when the internal electrodes 12 and 13 are largely retracted inward by firing. Further, by performing the polishing treatment after the etching treatment, the polishing treatment can be performed in a state where the oxide is projected to the outside of the end surface 11a, and the oxide 12b of the internal electrodes 12 and 13 can be reliably removed. .. Therefore, even in the monolithic ceramic capacitor 10 having a small number of internal electrodes 12 and 13, and the monolithic ceramic capacitor 10 used in a severe environment with a large heat load, the connection reliability between the external electrode 14 and the internal electrodes 12 and 13 is high. Can be increased.

Further, in the present embodiment, since the polishing process is performed with the oxide 12b protruding from the end surface 11a, the polishing medium or the like used in the polishing process easily hits the protruding oxide 12b. Thereby, the polishing process can be performed efficiently, and the polishing time can be shortened. Therefore, the productivity can be maintained and damage to the ceramic body 11 due to the polishing process can be reduced.

<Second Embodiment>
FIG. 11 is a flowchart showing a method for manufacturing the monolithic ceramic capacitor 10 according to the second embodiment of the present invention. 12 and 13 are views showing a manufacturing process of the monolithic ceramic capacitor 10. Hereinafter, the manufacturing method according to the present embodiment will be described mainly with respect to the differences from the first embodiment.

(Step S21: Preparation of Ceramic Element 11)
In step S21, the ceramic body 11 is manufactured similarly to step S11 of the first embodiment. As a result, the ceramic body 11 having the same appearance as that of the first embodiment shown in FIG. 7 is manufactured.

FIG. 12 is a schematic enlarged view showing the end face 11a on the side from which the first internal electrode 12 after firing has been pulled out. The end face 11a on the side where the second internal electrode 13 is pulled out is similarly configured.

As shown in FIG. 12, depending on the number of layers of the internal electrodes 12 and 13, the relationship between the thickness of the ceramic layer 15 and the internal electrodes 12 and 13, and the like, the end portions 12a and 13a may hardly recede from the end surface 11a. is there. However, even in this case, the oxide 12b of the electrode material is formed on the end portions 12a and 13a. Therefore, when the external electrode 14 is formed on the end surface 11a shown in FIG. 12, a connection failure between the internal electrodes 12 and 13 and the external electrode 14 is likely to occur.

(Step S22: Physical Polishing of End Face 11a)
In step S22, the oxide 12b formed on the end 12a is removed by physically polishing the end surface 11a of the fired ceramic body 11. As the physical polishing method, the same method as in step S13 can be selected.

FIG. 13 is a schematic enlarged cross-sectional view showing the end face 11a on the side from which the first internal electrode 12 is pulled out after the polishing process. After the polishing process, the oxide 12b is removed and the end 12a is made of a conductive material.

After step S22 of the present embodiment, as shown in FIG. 13, the surfaces of the end portions 12a and 13a may be continuously formed with the end surface 11a. Alternatively, the end portions 12a and 13a may be selectively removed and slightly retracted from the end surface 11a.

(Step S23: Chemical etching of the end surface 11a)
In step S23, the end surface 11a of the physically polished ceramic body 11 is etched by using the treatment liquid. As a result, the ceramic portion of the ceramic body 11 is etched, and the end portion 12a projects from the end surface 11a, as in FIG. 10 described in the first embodiment. As the etching method, the same method as in step S12 can be selected.

(Step S24: External electrode formation)
In step S24, the external electrodes 14 are formed on the ceramic body 11 that has been subjected to the etching process and the physical polishing process, so that the monolithic ceramic capacitor 10 shown in FIGS.

Also in this embodiment, the ends 12a and 13a of the internal electrodes 12 and 13 from which the oxide has been removed and which are sufficiently exposed are connected to the external electrode 14. As a result, as in the first embodiment, the connection between the external electrode 14 and the internal electrodes 12, 13 becomes good. Therefore, it is possible to prevent the ESR (equivalent series resistance) defect, the decrease in electrostatic capacitance, and the like, and it is possible to obtain the monolithic ceramic capacitor 10 having high reliability against heat load and the like.

Although the respective embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and it goes without saying that various changes can be made without departing from the scope of the present invention.

For example, FIG. 4 shows a configuration in which the end portion 12a of the first internal electrode 12 projects from the end surface 11a, but the laminated ceramic capacitor 10 includes internal electrodes including the end portions 12a and 13a that do not project from the end surface 11a. It may have 12, 13.

For example, in the above-described embodiment, the monolithic ceramic capacitor has been described as an example of the ceramic electronic component, but the present invention is applicable to all monolithic ceramic electronic components in which internal electrodes are alternately arranged. Examples of such a monolithic ceramic electronic component include a piezoelectric element and the like.

DESCRIPTION OF SYMBOLS 10... Monolithic ceramic capacitor 11... Ceramic body 11a... End surface 111... Unfired ceramic body 12, 13... Internal electrodes 12a, 13a... Ends of the internal electrodes in the Y-axis direction (second direction) 12b... ...External electrodes

Claims (4)

Firing a ceramic body having internal electrodes stacked in the first direction and an end face facing the second direction orthogonal to the first direction,
By etching the end surface of the fired ceramic body with a treatment liquid, the end portion of the internal electrode in the second direction is projected from the end surface,
By physically polishing the end surface of the fired ceramic body, the oxide formed at the end is removed,
A method of manufacturing a multilayer ceramic electronic component, wherein external electrodes are formed on the end faces that have been etched and physically polished. A method for manufacturing a monolithic ceramic electronic component according to claim 1,
A method for manufacturing a multilayer ceramic electronic component, wherein the end face is etched using the treatment liquid and then physically polished to remove the oxide. The method for manufacturing a monolithic ceramic electronic component according to claim 2,
A method of manufacturing a multilayer ceramic electronic component, wherein the end face from which the oxide is removed is projected from the end face by physically polishing the end face using the treatment liquid and then physically polishing the end face. It is a manufacturing method of the multilayer ceramic electronic component according to any one of claims 1 to 3,
The method of physically polishing includes a barrel polishing method or a blast method.

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