JP7233289B2 - Manufacturing method of holding device - Google Patents

Description

The technology disclosed in this specification relates to a method for manufacturing a holding device that holds an object.

For example, an electrostatic chuck is used as a holding device for holding a wafer when manufacturing semiconductor devices. The electrostatic chuck includes a ceramic member, a base member made of, for example, metal, a joining portion that joins the ceramic member and the base member, and a chuck electrode provided inside the ceramic member. (hereinafter referred to as "suction surface") holds the wafer by suction.

If the temperature of the wafer held on the attraction surface of the electrostatic chuck does not reach the desired temperature, the precision of each process (film formation, etching, etc.) on the wafer may decrease. The ability to control the distribution is required. Therefore, when the electrostatic chuck is used, the temperature distribution of the attraction surface of the ceramic member can be controlled (and thus the temperature of the wafer held on the attraction surface) by cooling by supplying the coolant to the coolant flow path formed in the base member. distribution control) is performed.

When bonding the ceramic member and the base member, for example, first, a bonding material (for example, a paste-like adhesive material) is applied to the surface of the base member so that the overall thickness is substantially the same. A pre-joining joint portion (a member that serves as a joint portion and is in a state before joining the ceramic member and the base member) is formed. Next, a laminate including a ceramic member, a base member, and a pre-bonding joint disposed between the ceramic member and the base member is produced, and the laminate is pressurized to press the pre-bonding joint. crush. As a result, an electrostatic chuck including a ceramic member, a base member, and a joint portion formed from the pre-joining joint portion is manufactured (see, for example, Patent Document 1).

JP 2018-067682 A

In the above-described conventional electrostatic chuck manufacturing method, the pre-bonding portions having substantially the same overall thickness are used. Therefore, in the process of crushing the pre-joining joint portion by pressurization and joining the ceramic member and the base member, the outer peripheral portion of the pre-joining joint portion (when viewed in a direction substantially orthogonal to the surface of the base member, the pre-joining joint portion A portion positioned on the outer periphery) has a space for escaping when the outer peripheral portion is pinched and crushed between the ceramic member and the base member, but there is no such space on the inner side.

In addition, in the same process (the process of crushing the pre-joining joint portion by pressurization and joining the ceramic member and the base member), the dimensional error of the ceramic member, the base member, or the pre-joining joint portion (error from the design value) ) and the performance of the pressurizing means that pressurizes the pre-joining joint, among the pre-joining joints, one end of the pre-joining joint when viewed in a direction substantially orthogonal to the surface of the member on which the pre-joining joint is arranged This pressure and the pressure applied to the other end may vary.

Since there is a space outside the outer peripheral portion of the pre-joining joint to escape when the outer peripheral portion is crushed, the pressure is biased to one end of the pre-joining joint, and the pressure is limited to a certain extent. If it is too large, one end of the pre-joining joint may be crushed, causing the ceramic member and the base member to tilt relative to each other. Here, since there is no escape space inside the outer peripheral portion of the pre-joining joint, after one end of the pre-joining joint is crushed, the other end is crushed and crushed in the opposite direction (that is, the ceramic member and the base member). It is difficult for these members to tilt in the direction in which the relative tilt with Therefore, only one end of the pre-joining joint is crushed, and an electrostatic chuck is likely to be produced in which the ceramic member and the base member remain relatively tilted.

In an electrostatic chuck having a structure in which the ceramic member and the base member are relatively inclined, the ceramic member and the base member are not joined at the side where the pre-joining joint portion is not crushed (the other end side). In this state, the heat conductivity between the ceramic member and the base member is lowered. Therefore, cooling by supplying the coolant to the coolant channel formed in the base member may not be sufficiently performed. As a result, the uniformity of the temperature distribution on the attraction surface of the ceramic member (that is, the surface on which the object (for example, wafer) is held) is impaired, and the uniformity of the temperature distribution of the object held by the attraction surface is impaired. may be damaged.

In addition, as the pre-bonding joint, when the inner part of the pre-bonding joint (the part inside the outer peripheral part of the pre-bonding joint) protrudes from the outer peripheral part, when a convex one is used. In addition to the above reasons, since the pre-joining joint portion is convex, naturally the ceramic member and the base member tend to be relatively inclined. Therefore, even when such a convex pre-joining joint is used, the uniformity of the temperature distribution on the adsorption surface of the ceramic member is impaired, and the uniformity of the temperature distribution of the object held by the adsorption surface is thus impaired. is damaged.

In addition, such a problem can be solved when the pre-bonding joint is formed by disposing the bonding material on the surface of the ceramic member, or when the bonding material is disposed on both the surface of the base member and the surface of the ceramic member. This is a common problem when forming the front joint portion. In addition, such a problem is not limited to an electrostatic chuck that includes a ceramic member, a base member made of metal, and a joint that joins the ceramic member and the base member. and a joint for joining the first member and the second member, and is a common problem in general holding devices that hold an object on the surface of the first member. Further, the holding device is not limited to the holding device in which the cooling means (for example, the coolant flow path) is formed in the second member, and the holding device in which the heating means (for example, the heater electrode) is formed in the second member. This is a common issue. In this specification, the holding device is not limited to a device having a function of attracting or fixing an object, and is simply a device that does not have a function of attracting or fixing an object and is simply placed on the surface of the device. It includes a device for holding an object.

This specification discloses a technology capable of solving the above-described problems.

The technology disclosed in this specification can be implemented, for example, in the following forms.

(1) The method for manufacturing a holding device disclosed in this specification has a first surface substantially orthogonal to a first direction and a second surface opposite to the first surface. The second member having a first member and a third surface, the third surface being positioned on the second surface side of the first member, wherein heating or cooling is performed a second member formed with a temperature adjusting means for performing temperature control, and the first member and the third A method for manufacturing a holding device for holding an object on the first surface of the first member, the holding device comprising a joining portion that joins two members, the member serving as the joining portion, At least one of the second surface of the first member and the third surface of the second member is defined as a pre-bonding portion, which is a member in a state before the first member and the second member are bonded. between the first step, the first member, the second member, and the second surface of the first member and the third surface of the second member, wherein At least one of the pre-bonding joints arranged, wherein the at least one pre-bonding joint is spaced apart from an outer peripheral line of the pre-bonding joint when viewed in a second direction substantially orthogonal to the specific surface. A recess that is recessed in the second direction is formed at a position, and the thickness of the outer peripheral portion, which is a portion other than the recess and includes the entire outer peripheral line, of the pre-bonding joint portion is At least one of the pre-bonding joints having a predetermined thickness greater than the thickness of the portion where the recess is formed is produced, and the laminate is added. The joint portion formed from the first member, the second member, and the pre-joining joint portion by pressing to equalize the height from the specific surface of the pre-joining joint portion; and a second step of making a holding device comprising:

Since the method for manufacturing the holding device includes the above items, the temperature at the first surface of the first member caused by the relative tilting of the first member and the second member and the unbonded state A decrease in distribution uniformity can be suppressed.

(2) In the method for manufacturing the holding device, the first step includes a preparing step of preparing the pre-bonding joint portion in which the recess is formed; and an arranging step of arranging the . According to the manufacturing method of the present holding device, it is possible to easily manufacture the holding device that achieves the above-described effect of being able to suppress the deterioration of the uniformity of the temperature distribution of the object.

(3) In the method for manufacturing the holding device, the pre-joining joint in the first step is in an uncured or semi-cured state, and in the second step, the first member and the second member are and said pre-bonding joint disposed between said second surface of said first member and said third surface of said second member, and pressing said laminate. Thus, after uniformizing the height of the pre-joining joint from the specific surface, the pre-joining joint is hardened, so that the first member, the second member, and the pre-joining joint are cured. and the joint portion formed from According to the manufacturing method of the present holding device, it is possible to easily manufacture the holding device that achieves the above-described effect of being able to suppress the deterioration of the uniformity of the temperature distribution of the object.

(4) In the method for manufacturing the holding device, in the second step, the recess may overlap the center of the specific surface when viewed from the second direction. According to the manufacturing method of the holding device, it is possible to prevent the first member and the second member from being joined together around the recess formed so as to overlap with the center of the specific surface. In other words, it is possible to suppress non-bonding of the first member and the second member in the outer peripheral portion of the specific surface as viewed in the second direction.

(5) In the method for manufacturing the holding device, the first member has heating means for heating, the temperature adjusting means formed in the second member has a cooling function, and the second member has a cooling function. Prior to step 1, the portion of the first surface of the first member is heated by the heating means and the temperature distribution of the first surface of the first member is measured, and , a temperature measuring step of identifying a high-temperature portion that is a portion having a relatively higher temperature than other portions on the first surface of the first member, wherein in the first step, viewed from the second direction, The recess may be formed so as not to overlap the center of the specific surface and overlap the high temperature portion. According to the manufacturing method of the holding device, it is possible to further improve the uniformity of the temperature distribution on the first surface of the first member. It is possible to further improve the uniformity of the temperature distribution of the object.

(6) In the method for manufacturing the holding device, the first step may include a concave portion forming step of forming the concave portion in the pre-bonding joint portion by pressurizing the pre-bonding joint portion. According to the manufacturing method of the holding device, it is possible to reliably form the concave portion capable of suppressing the relative inclination between the first member and the second member in the pre-bonding joint portion. It is possible to reliably suppress the deterioration of the uniformity of temperature distribution on the first surface of the first member and the deterioration of the uniformity of temperature distribution of the object.

The technology disclosed in this specification can be implemented in various forms, for example, in the form of a holding device such as an electrostatic chuck and a method for manufacturing the same.

1 is a perspective view schematically showing an appearance configuration of an electrostatic chuck 100 according to a first embodiment; FIG. It is an explanatory view showing roughly the XZ section composition of electrostatic zipper 100 in a 1st embodiment. 4 is a flow chart showing a method for manufacturing the electrostatic chuck 100 according to the first embodiment; 4A to 4C are explanatory diagrams showing an outline of a method for manufacturing the electrostatic chuck 100 according to the first embodiment; FIG. 4A to 4C are explanatory diagrams showing an outline of a method for manufacturing the electrostatic chuck 100 according to the first embodiment; FIG. It is explanatory drawing which shows the outline|summary of the manufacturing method of electrostatic chuck 100X1 of a comparative example. It is explanatory drawing which shows the outline|summary of the manufacturing method of electrostatic chuck 100X2 of a comparative example. 6 is a flow chart showing a method of manufacturing the electrostatic chuck 110 according to the second embodiment. It is explanatory drawing which shows roughly the XY cross-sectional structure of the electrostatic chuck 110 in 2nd Embodiment. FIG. 11 is an explanatory diagram showing an outline of a method for manufacturing the electrostatic chuck 110 according to the second embodiment; FIG. 11 is an explanatory diagram showing an outline of a method for manufacturing the electrostatic chuck 110 according to the second embodiment;

A. First embodiment:
A-1. Configuration of electrostatic chuck 100:
FIG. 1 is a perspective view schematically showing the external configuration of an electrostatic chuck 100 according to the first embodiment, and FIG. 2 is an explanatory view schematically showing the XZ cross-sectional configuration of the electrostatic chuck 100 according to the first embodiment. is. Each figure shows mutually orthogonal XYZ axes for specifying directions. In this specification, for the sake of convenience, the positive direction of the Z-axis is referred to as the upward direction, and the negative direction of the Z-axis is referred to as the downward direction. may be

The electrostatic chuck 100 is a device that attracts and holds an object (for example, a wafer W) by electrostatic attraction, and is used, for example, to fix the wafer W within a vacuum chamber of a semiconductor manufacturing apparatus. The electrostatic chuck 100 includes a ceramic member 10 and a base member 20 arranged side by side in a predetermined arrangement direction (vertical direction (Z-axis direction) in the first embodiment). The ceramic member 10 and the base member 20 are arranged such that the lower surface of the ceramic member 10 (hereinafter referred to as "ceramic side bonding surface S2") and the upper surface of the base member 20 (hereinafter referred to as "base side bonding surface S3") They are arranged so as to face each other in the arrangement direction with the joint portion 30 interposed therebetween. That is, the base member 20 is arranged such that the base-side joint surface S3 of the base member 20 is located on the ceramic-side joint surface S2 side of the ceramic member 10 . The electrostatic chuck 100 further includes a joint portion 30 arranged between the ceramic-side joint surface S<b>2 of the ceramic member 10 and the base-side joint surface S<b>3 of the base member 20 . The electrostatic chuck 100 corresponds to a holding device in claims.

The ceramic member 10 is, for example, a circular planar plate-like member and is made of ceramics. The diameter of the ceramic member 10 is, for example, approximately 50 mm to 500 mm (usually approximately 200 mm to 350 mm), and the thickness of the ceramic member 10 is, for example, approximately 1 mm to 10 mm.

Various ceramics can be used as the material for forming the ceramic member 10. From the viewpoint of strength, wear resistance, plasma resistance, etc., aluminum oxide (alumina, Al ₂ O ₃ ) or aluminum nitride (AlN), for example, can be used. It is preferable to use ceramics containing as a main component. In addition, in this specification, the main component means the component with the highest content ratio (weight ratio).

A pair of internal electrodes 40 made of a conductive material (such as tungsten or molybdenum) are provided inside the ceramic member 10 . When a voltage is applied to the pair of internal electrodes 40 from a power source (not shown), electrostatic attraction is generated, and the electrostatic attraction causes the wafer W to move to the upper surface of the ceramic member 10 (hereinafter referred to as "attraction surface S1"). It is adsorbed and fixed. The ceramic member 10 corresponds to the first member in the claims. The adsorption surface S1 of the ceramic member 10 corresponds to the first surface in the claims, the ceramics-side joint surface S2 of the ceramic member 10 corresponds to the second surface in the claims, and the base member 20 The base-side joint surface S3 corresponds to the third surface in the claims. The arrangement direction (Z-axis direction) described above corresponds to the first direction in the claims.

Further, inside the ceramic member 10, a heater electrode 50 is provided which is composed of a resistance heating element containing a conductive material (for example, tungsten, molybdenum, etc.). When a voltage is applied to the heater electrode 50 from a power supply (not shown), the heater electrode 50 generates heat, thereby warming the ceramic member 10 and warming the wafer W held on the suction surface S1 of the ceramic member 10 . Thereby, the temperature control of the wafer W is realized. The heater electrode 50 corresponds to heating means in the claims.

The base member 20 is, for example, a circular planar plate member having the same diameter as the ceramic member 10 or having a larger diameter than the ceramic member 10, and is made of metal (aluminum, aluminum alloy, etc.), for example. The diameter of the base member 20 is, for example, about 220 mm to 550 mm (usually about 220 mm to 350 mm), and the thickness of the base member 20 is, for example, about 20 mm to 40 mm.

A coolant channel 21 is formed inside the base member 20 . The base member 20 is cooled when a coolant (for example, fluorine-based inert liquid, water, or the like) is supplied to the coolant channel 21 . When the base member 20 is cooled together with the heating of the ceramic member 10 by the heater electrode 50 described above, the heat transfer between the base member 20 and the ceramic member 10 via the joint portion 30 causes the ceramic member 10 to be adsorbed. The temperature of wafer W held on surface S1 is kept constant. The base member 20 corresponds to the second member in the claims, and the coolant channel 21 corresponds to the temperature adjustment means in the claims. Therefore, in this embodiment, the second member is provided with a temperature adjusting means having a cooling function.

The joint portion 30 joins the ceramic member 10 and the base member 20 . The joint portion 30 contains a resin material (adhesive material). In this embodiment, the joint 30 is made of an adhesive material containing a resin material as a main component. Various resin materials such as silicone resin, fluororesin, acrylic resin, and epoxy resin can be used as the resin material contained in the joint portion 30. Silicone resin, which is a highly heat-resistant and flexible resin material, can be used. or fluororesin is preferably used. Also, the joint portion 30 may contain, for example, a ceramic filler in addition to the resin material.

A-2. Manufacturing method of electrostatic chuck 100:
Next, a method for manufacturing the electrostatic chuck 100 according to the first embodiment will be described. FIG. 3 is a flow chart showing a method of manufacturing the electrostatic chuck 100 according to the first embodiment. 4 and 5 are explanatory diagrams showing an overview of the method of manufacturing the electrostatic chuck 100 according to the first embodiment.

First, the ceramic member 10 and the base member 20 are prepared (S110). Since the ceramic member 10 and the base member 20 can be manufactured by a known manufacturing method, the description of the manufacturing method is omitted here.

Next, the pre-bonding bonding portion 300 is formed by applying the pre-bonding bonding portion 300 to the sheet member 200 formed of a fluorine-based resin such as tetrafluoroethylene (S120, see column A in FIG. 4). The pre-joining joint portion 300 is an adhesive material portion that becomes the joint portion 30, and is a member in a state before the ceramic member 10 and the base member 20 are joined. The pre-bonding joint 300 is formed in a shape approximately similar to the shape of the joint 30 . The details of the shape of the pre-joining joint portion 300 will be described later. Here, the pre-bonding bonding portion 300 is prepared by mixing an adhesive component (eg, silicone-based resin, acrylic-based resin, epoxy-based resin, etc.) and a powder component (eg, alumina, silica, silicon carbide, silicon nitride, etc.). It is a paste (that is, in an uncured state). Since such a paste-like pre-bonding joint 300 has a relatively high viscosity, it is easy to secure a certain thickness or make the thickness uniform. The step of S120 is performed, for example, by screen printing using a mask 400 (see column A in FIG. 4) in which an opening corresponding to the shape of the pre-bonding joint 300 is formed. Also, the viscosity of the paste-like adhesive material used in the step of S120 is set to such a degree that it can retain its shape after application. Further, in the step of S120, the coating is applied so that the entire thickness of the pre-bonding bonding portion 300 (thickness in the vertical direction; hereinafter, the thickness of the pre-bonding bonding portion 300 is the same) is substantially the same. . It should be noted that the phrase "the total thickness of the pre-bonding joint portion 300 is approximately the same" as used herein means that the difference between the maximum thickness and the minimum thickness of the total thickness of the pre-bonding joint portion 300 is 20 μm or less. It means that there is As a result, the entire thickness of the pre-joining joint portion 300 becomes a predetermined thickness T0, and the surface of the pre-joining joint portion 300 on the side of the sheet member 200 (hereinafter referred to as “sheet member side surface S4”), In the pre-joining joint portion 300, the surface S5 opposite to the sheet member side surface S4 is substantially flat.

Next, the pre-bonding joint 300 is semi-cured by, for example, a curing treatment to be gelled, and then, as shown in column B of FIG. By applying pressure to the joint 300, a concave portion Pc is formed in the pre-joining joint 300 (S130, see column C in FIG. 4). The content of the curing process differs depending on the type of adhesive material used. For example, a process of applying moisture is performed as a hardening process.

As shown in column C of FIG. 4, the recessed portion Pc is the outer peripheral line (both ends in the left-right direction in FIG. 4) of the pre-joint joint 300 when viewed in the vertical direction (vertical direction in FIG. 4). formed at a distance from The recessed portion Pc is formed so as to be recessed downward. Of the pre-joining joint 300, the thickness T1 of the portion 301 in which the recess Pc is formed is the portion other than the recess Pc and including the entire outer peripheral line (the thickness of the pre-joining joint 300 in column C of FIG. 4). It is thinner than the thickness T2 of the inner and left and right end portions (hereinafter referred to as "peripheral portion 302"). In other words, the thickness T2 of the outer peripheral portion 302 is thicker than the thickness T1 of the portion 301 of the pre-bonding bonding portion 300 where the concave portion Pc is formed. The vertical direction corresponds to the second direction in the claims, and the step of S130 corresponds to the recess forming step in the claims, and the series of steps of S120 and S130 (hereinafter referred to as "preparation step"). corresponds to the preparation step in the claims.

Next, the pre-bonding joint portion 300 is arranged on the base-side joint surface S3 of the base member 20 (S140, see column D in FIG. 4). Column E in FIG. 5 shows how the pre-bonding joint 300 is arranged on the base-side joint surface S3 of the base member 20 . As shown in column E of FIG. 5, the recess Pc is formed so as to overlap the center Cp of the base-side joint surface S3 of the base member 20 when viewed from the vertical direction (viewed from the vertical direction in FIG. 5). The base-side joint surface S3 of the base member 20 corresponds to the specific surface in the claims, and the step of S140 corresponds to the arrangement step in the claims, and a series of steps of S120, S130, and S140 (hereinafter referred to as The “pre-bonding step”) corresponds to the first step in the claims.

Next, by placing the ceramic member 10 on the pre-joining joint portion 300, the laminate 101 including the ceramic member 10, the base member 20, and the pre-joining joint portion 300 is produced (see column F in FIG. 5). . By pressurizing the laminate 101, the height H (height in the vertical direction) of the pre-bonding bonding portion 300 from the base-side bonding surface S3 is made uniform (S150, see column G in FIG. 5). By placing the ceramics member 10 on the pre-bonding joint 300, the pre-bonding joint 300 is arranged between the ceramics-side joint surface S2 of the ceramics member 10 and the base-side joint surface S3 of the base member 20. state (see column F in FIG. 5). The step of S150 is performed by pressing the laminated body 101 in a vacuum to crush the pre-bonding bonding portion 300 .

Column G in FIG. 5 shows a state in which the pre-bonding joint portion 300 is crushed by pressing the laminate 101 . Out of the pre-joining joint 300, the outer peripheral portion 302, which is thicker than the portion 301 in which the recess Pc is formed, is crushed relatively large, and as a result, the height of the pre-joining joint 300 from the base-side joint surface S3 is reduced. H becomes uniform. As a result, substantially the entire upper surface (the surface on the side of the ceramic member 10 ) of the pre-joining joint portion 300 is in close contact with the ceramic side joint surface S<b>2 of the ceramic member 10 . This ensures heat transfer between the joint 30 formed by the pre-joining joint 300 and the ceramic member 10 .

In the step of S150, part of the pre-bonding joint 300 may protrude from between the ceramic member 10 and the base member 20 (see column G in FIG. 5). You may perform the process to remove.

Next, the pre-joining joint 300 is cured to form the joint 30 (S160). As described above, the curing treatment is performed according to the type of the adhesive material used (for example, the treatment of applying heat or the treatment of applying moisture). By the manufacturing method described above, the electrostatic chuck 100 including the ceramic member 10, the base member 20, and the joint portion 30 is manufactured (fabricated). A series of steps of S150 and S160 (hereinafter referred to as "bonding step") corresponds to the second step in the claims.

A-3. Effect of the first embodiment:
As described above, the method for manufacturing the electrostatic chuck 100 of the first embodiment includes the steps of arranging the pre-bonding bonding portion 300 on the base-side bonding surface S3 of the base member 20 (a series of steps of S120, S130, and S140). pre-bonding process). The manufacturing method further includes the ceramic member 10, the base member 20, and at least one pre-joining joint portion disposed between the ceramic-side joint surface S2 of the ceramic member 10 and the base-side joint surface S3 of the base member 20. 300, in at least one pre-joining joint 300, a concave portion Pc recessed downward is formed at a position away from the outer peripheral line of the pre-joining joint 300 in a vertical view, and pre-joining At least one pre-bonding joint 300 in which the thickness T2 of the outer peripheral portion 302 of the portion 300 is a predetermined thickness thicker than the thickness T1 of the portion 301 of the pre-bonding joint 300 in which the recess Pc is formed. and pressurizing the laminate 101 to equalize the height H of the pre-bonding joint 300 from the ceramics-side joint surface S2, so that the ceramic member 10 and the base member 20 and the bonding portion 30 formed from the pre-bonding bonding portion 300 (series of steps S150 and S160; bonding step).

Since the method for manufacturing the electrostatic chuck 100 of the first embodiment has the above-described items, as described below, the ceramics member 10 and the base member 20 are relatively tilted and unbonded. A decrease in the uniformity of the temperature distribution on the attraction surface S1 of the member 10 can be suppressed.

FIG. 6 is an explanatory diagram showing an overview of the method of manufacturing the electrostatic chuck 100X1 of the comparative example. FIG. 6 shows an overview of the steps corresponding to the steps shown in columns F and G of FIG. 5 among the steps of the method of manufacturing the electrostatic chuck 100X1 of the comparative example. The electrostatic chuck 100X1 of the comparative example shown in FIG. 6 differs from the method of manufacturing the electrostatic chuck 100 of the first embodiment shown in FIGS. . Specifically, in the method of manufacturing the electrostatic chuck 100X1 of the comparative example shown in FIG. shape (see column A in FIG. 6).

Since the manufacturing method of the electrostatic chuck 100X1 of the comparative example shown in FIG. There is a space for escaping when the outer peripheral portion is sandwiched between the ceramic member 10 and the base member 20 and crushed, but there is no such space inside.

In addition, in the bonding process, due to the dimensional error (error from the design value) of the ceramic member 10, the base member 20, or the pre-bonding bonding portion 300, the performance of the pressurizing means that presses the pre-bonding bonding portion 300, etc. , the pressure applied to one end of the pre-bonding joint 300 in a direction substantially perpendicular to the vertical direction (the direction substantially perpendicular to the base-side joint surface S3 of the base member 20), and the pressure applied to the other end The applied force may vary.

Outside the outer peripheral portion of the pre-joining joint portion 300, there is a space for escaping when the outer peripheral portion is crushed. Therefore, if the pressure is biased at one end of the pre-bonding joint 300, and if the pressure is of a certain magnitude, one end of the pre-bonding joint 300 will be crushed, and the ceramic member 10 and the base member will be separated from each other. 20 may be relatively tilted (see column B in FIG. 6). Here, since there is no escape space inside the outer peripheral portion of the pre-joining joint portion 300, after one end of the pre-joining joint portion 300 is crushed, the other end is crushed and crushed in the opposite direction (that is, the ceramic member 10 , and the base member 20 are unlikely to tilt in the direction in which the relative tilt between them and the base member 20 is eliminated. Therefore, only one end of the pre-bonding bonding portion 300 is crushed, and the electrostatic chuck 100X1 is likely to be manufactured in which the ceramic member 10 and the base member 20 remain relatively tilted.

In the electrostatic chuck 100X1 in which the ceramic member 10 and the base member 20 are relatively tilted, the ceramic member 10 and the base member 20 are separated from each other on the side where the pre-joining joint portion 300 is not crushed (the other end side). Since the member 20 is in an unbonded state, the heat conductivity between the ceramic member 10 and the base member 20 is lowered. Therefore, cooling by supplying the coolant to the coolant channel 21 formed in the base member 20 may not be sufficiently performed. As a result, the uniformity of the temperature distribution on the attracting surface S1 of the ceramic member 10 (that is, the surface that holds the wafer W) is impaired, and the uniformity of the temperature distribution of the wafer W held by the attracting surface S1 is impaired. Sometimes.

FIG. 7 is an explanatory diagram showing an outline of a method for manufacturing an electrostatic chuck 100X2 of another comparative example. FIG. 7 shows an overview of steps corresponding to the steps shown in columns F and G of FIG. 5 among the steps of the method of manufacturing the electrostatic chuck 100X2 of the comparative example. In the method for manufacturing the electrostatic chuck 100X2 of the comparative example shown in FIG. 7, the shape of the bonding portion 300 before bonding in the bonding step is different from the method for manufacturing the electrostatic chuck 100 of the first embodiment illustrated in FIGS. is different. Specifically, in the method of manufacturing the electrostatic chuck 100X2 of the comparative example, the shape of the pre-bonding bonding portion 300 is a shape in which the concave portion Pc is not formed, and the inner portion of the pre-bonding bonding portion 300 (pre-bonding A portion of the portion 300 that is inside the outer peripheral portion has a convex shape that protrudes upward from the outer peripheral portion.

Since the manufacturing method of the electrostatic chuck 100X2 of the comparative example shown in FIG. As a result, the ceramic member 10 and the base member 20 naturally tend to tilt relatively. Therefore, even when such a convex pre-bonding bonding portion 300 is used, the uniformity of the temperature distribution on the attracting surface S1 of the ceramic member 10 is impaired. A problem arises that the uniformity of the distribution is impaired.

On the other hand, in the manufacturing method of the electrostatic chuck 100 of the first embodiment shown in FIGS. There is a space not only outside the portion 302 but also inside the outer peripheral portion 302 in the pre-bonding joint 300 to escape when the outer peripheral portion 302 is crushed. Therefore, in the joining process, the outer peripheral portion 302 of the pre-joining joint portion 300 is more likely to be crushed. As a result, in the same process, first, the outer peripheral portion 302, which is a relatively thick portion, of the pre-bonding joint 300 is crushed. However, since the other end of the pre-joining joint portion 300 is also likely to be crushed thereafter, these members are moved relative to each other in the opposite direction (that is, the direction in which the relative inclination between the ceramic member 10 and the base member 20 is eliminated). and the relative inclination of these members tends to be relatively eliminated. Therefore, according to the manufacturing method of the electrostatic chuck 100, it is possible to prevent the ceramic member 10 and the base member 20 from being relatively tilted and unjoined. It is possible to suppress the deterioration of the uniformity of the temperature distribution of the wafer W due to the deterioration of the uniformity of the temperature distribution.

In addition, in the method for manufacturing the electrostatic chuck 100 of the first embodiment, the pre-bonding process (a series of steps of S120, S130, and S140) is a preparation process (a series of steps of S120 and S130. A bonding process in which the concave portion Pc is formed). a step of preparing the pre-bonding portion 300) and a step of S140 (a step of disposing the pre-bonding portion 300 prepared in the preparation step on the base-side bonding surface S3 of the base member 20). Therefore, according to the manufacturing method of the electrostatic chuck 100, it is possible to easily manufacture the electrostatic chuck 100 that achieves the above-described effect of being able to suppress deterioration of the uniformity of the temperature distribution of the wafer W. .

Moreover, in the manufacturing method of the electrostatic chuck 100 of the first embodiment, the pre-bonding joint portion 300 in the pre-bonding step is in an uncured or semi-cured state. In the bonding step, the laminate 101 is produced, and the laminate 101 is pressed to equalize the height of the pre-bonding bonding portion 300 from the base-side bonding surface S3 (specific surface) of the base member 20. By curing the pre-bonding portion 300 , the electrostatic chuck 100 including the ceramic member 10 , the base member 20 , and the bonding portion 30 formed from the pre-bonding portion 300 is manufactured. Therefore, according to the manufacturing method of the electrostatic chuck 100, it is possible to easily manufacture the electrostatic chuck 100 that achieves the above-described effect of being able to suppress deterioration of the uniformity of the temperature distribution of the wafer W. .

In addition, in the method for manufacturing the electrostatic chuck 100 of the first embodiment, in the bonding step, the concave portion Pc overlaps the center Cp of the base-side bonding surface S3 (specific surface) of the base member 20 when viewed from the vertical direction. Therefore, according to the manufacturing method of the electrostatic chuck 100, it is possible to prevent the ceramic member 10 and the base member 20 from being unbonded around the recessed portion Pc formed so as to overlap the center Cp. In other words, it is possible to prevent the ceramic member 10 and the base member 20 from being unbonded in the outer peripheral portion of the base-side bonding surface S3 of the base member 20 when viewed in the vertical direction.

In addition, in the method for manufacturing the electrostatic chuck 100 of the first embodiment, the pre-bonding step includes the step of S130 (the step of forming the concave portion Pc in the pre-bonding bonding portion 300 by pressurizing the pre-bonding bonding portion 300). . Therefore, according to the manufacturing method of the electrostatic chuck 100, the concave portion Pc that can suppress the relative inclination between the ceramic member 10 and the base member 20 can be reliably formed in the pre-bonding bonding portion 300. , it is possible to more reliably suppress the deterioration of the uniformity of the temperature distribution of the wafer W due to the deterioration of the uniformity of the temperature distribution on the attracting surface S1 of the ceramic member 10 .

B. Second embodiment:
FIG. 8 is a flow chart showing a method of manufacturing the electrostatic chuck 110 according to the second embodiment. FIG. 9 is an explanatory diagram showing the relationship between the concave portion Pc formed in the pre-bonding bonding portion 300 and a high-temperature portion HP, which will be described later, in the second embodiment. 10 and 11 are explanatory diagrams showing an overview of the method of manufacturing the electrostatic chuck 110 according to the second embodiment. Columns A to D in FIG. 10 correspond to columns A to D in FIG. 4 in the first embodiment, and columns E to G in FIG. 11 correspond to columns E to G in FIG. 5 in the first embodiment. FIG. 4 is a corresponding diagram; Hereinafter, among the steps of the method for manufacturing the electrostatic chuck 110 according to the second embodiment, the steps having the same content as the steps of the method for manufacturing the electrostatic chuck 100 according to the first embodiment described above are denoted by the same reference numerals. The description is omitted as appropriate by attaching it.

As shown in FIG. 8, in the method for manufacturing the electrostatic chuck 110 of the second embodiment, after the step of S110 and before the step of S120, heating is performed by the heater electrode 50, and the adsorption surface of the ceramic member 10 is heated. By measuring the temperature distribution of S1, the high temperature portion HP on the attraction surface S1 of the ceramic member 10 is specified (S112, see FIG. 9). Here, the high-temperature portion HP is a portion of the attracting surface S1 of the ceramic member 10 that has a relatively higher temperature than other portions. The temperature distribution of the attraction surface S1 of the ceramic member 10 is measured by, for example, measuring the temperature distribution of the attraction surface S1 while power is being supplied to the internal electrode 40 and the heater electrode 50 provided on the ceramic member 10. . By measuring the temperature at a plurality of locations (temperature measurement locations) on the adsorption surface S1, the measured temperature at each temperature measurement location is acquired. The temperature distribution can be measured using a wafer with a thermocouple, an infrared thermography, an infrared radiation thermometer, or other temperature measurement equipment. The step of S112 corresponds to the temperature measurement step in the claims.

In the method for manufacturing the electrostatic chuck 110 of the second embodiment, in the step of S130 (the step of forming the recessed portion Pc in the pre-bonding bonding portion 300), the center Cp of the base-side bonding surface S3 of the base member 20 is and so as to overlap with the high temperature portion HP (see FIG. 8 and column C in FIG. 10).

In the method for manufacturing the electrostatic chuck 110 of the second embodiment, the pre-bonding joint portion 300 in which the concave portion Pc is formed is used. For this reason, the relative inclination between the ceramic member 10 and the base member 20 is relatively eliminated (see column G in FIG. 11), so that deterioration of the uniformity of the temperature distribution can be suppressed.

Here, for the uniformity of the temperature distribution on the attracting surface S1 of the ceramic member 10, it is desirable that the high temperature portion HP of the attracting surface S1 of the ceramic member 10 is cooled more effectively than the other portions.

Therefore, in the method for manufacturing the electrostatic chuck 110 of the second embodiment, the high-temperature portion HP does not overlap with the center Cp of the base-side joint surface S3 of the base member 20 when viewed in the vertical direction (second direction). A concave portion Pc is formed so as to overlap with the . Since the concave portion Pc is formed, in the process of S150, the relative inclination of the ceramic member 10 and the base member 20 is basically suppressed. However, since the position where the recess Pc is formed does not overlap with the center Cp of the base-side joint surface S3 of the base member 20, in the same process, the pre-joining joint 300 has a portion around the recess Pc. As a result, one end of the pre-bonding joint 300 is more easily crushed, and as a result, the ceramics member 10 and the base member 20 are more likely to tilt relative to each other. Here, the position where the concave portion Pc is formed is also a position overlapping the high temperature portion HP when viewed in the vertical direction. Of the pre-joining joint portion 300, the portion located at such a position (the position overlapping with the high temperature portion HP) is crushed, and the ceramic member 10, the ceramic member 10, and the base member 20 are relatively tilted, so that the high temperature portion The heat conductivity of the ceramic member 10 and the base member 20 around the HP is increased compared to other portions. As a result, cooling by the temperature adjusting means of the base member 20 is more effectively performed around the high temperature portion HP. Therefore, according to the manufacturing method of the electrostatic chuck 110, the uniformity of the temperature distribution on the attraction surface S1 of the ceramic member 10 can be further improved. can further improve the uniformity of the temperature distribution.

C. Variant:
The technology disclosed in this specification is not limited to the above-described embodiments, and can be modified in various forms without departing from the scope of the invention. For example, the following modifications are possible.

In the above embodiment, the electrostatic chuck 100 may be provided with the internal electrode 40 in the upper portion of the ceramic member 10 and the heater electrode 50 in the lower portion. In this case, the upper portion and the lower portion of the ceramic member 10 are formed as separate members, and the upper portion and the lower portion of the ceramic member 10 form a joint portion (for example, the joint portion 30). A member formed of the same material as the material) may be joined. In this case, the present invention may be applied to the joint portion 30 that joins the lower portion of the ceramic member 10 and the base member 20 together. Also in this case, the same effect as in the case of the above embodiment can be obtained. Further, the present invention may be applied to the joint portion that joins the upper portion and the lower portion of the ceramic member 10 . Also in this case, the same effect as in the case of the above embodiment can be obtained. In this case, the joint portion that joins the lower portion of the ceramic member 10 and the base member 20 corresponds to the joint portion in the claims.

Further, in the above-described embodiment, the electrostatic chuck 100 includes another heater electrode (hereinafter referred to as an "additional heater electrode") instead of or in addition to the heater electrode 50 on the base member 20 (for example, the base member 20). It may be provided on the upper surface of the member 20). In this case, a voltage is applied to the additional heater electrode from a power supply (not shown), and the additional heater electrode generates heat to warm the base member 20 . The ceramic member 10 is heated by heat transfer between the base member 20 and the ceramic member 10 via the joint portion 30, and the wafer W held on the adsorption surface S1 of the ceramic member 10 is warmed. Thereby, the temperature control of the wafer W is realized. The additional heater electrode corresponds to temperature adjusting means in the claims.

Further, in the above-described embodiment, the pre-bonding joint portion 300 formed on the sheet member 200 (step S120) is arranged on the base-side joint surface S3 of the base member 20 (step S140). Instead, the pre-bonding joint 300 may be arranged directly on the base-side joint surface S3 of the base member 20 .

In the above-described embodiment, the pre-bonding joint 300 is arranged on the base-side joint surface S3 of the base member 20, but the pre-bonding joint 300 may be arranged on the ceramic-side joint surface S2 of the ceramic member 10. . In this case, the ceramics-side joint surface S2 of the ceramics member 10 corresponds to the specific surface in the claims. Also, the pre-bonding joint portion 300 may be arranged on both the base-side joint surface S3 of the base member 20 and the ceramic-side joint surface S2 of the ceramic member 10 . In this case, the base-side bonding surface S3 of the base member 20 and the ceramics-side bonding surface S2 of the ceramics member 10 correspond to the specific surfaces in the claims.

Further, in the above-described embodiment, in the pre-bonding process, the uncured paste-like pre-bonding joint 300 is adopted, but the semi-cured sheet-like pre-bonding joint 300 is adopted. may

In the above embodiment, in the step of S130, the jig 500 is pressed against the pre-bonding joint 300 after the pre-bonding joint 300 is semi-cured and gelled by the curing process. The jig 500 may be pressed against the pre-bonding joint 300 without semi-curing the 300 .

Further, in the above-described embodiment, the recessed portion Pc that is recessed downward is formed, but the recessed portion Pc that is recessed upward may be formed.

In the above embodiment, in the step of S150, the laminate 101 is pressurized in a vacuum to crush the pre-bonding joint portion 300. Part 300 may be crushed.

The material forming each member in the above embodiment is merely an example, and each member may be formed of another material.

Also, the method of manufacturing the electrostatic chucks 100 and 110 in the above embodiments is merely an example, and various modifications are possible.

In addition, the present invention includes a ceramic member 10, a base member 20, a joint portion 30 that joins the ceramic member 10 and the base member 20, and an internal electrode 40, and attracts an object by electrostatic attraction to hold the object in place. It is not limited to the electrostatic chucks 100 and 110 held on the surface of one member. It is equally applicable to other holding devices on which objects are held (eg, heating devices such as susceptors, etc.).

Reference Signs List 10: Ceramic member 20: Base member 21: Coolant flow path 30: Joint 40: Internal electrode 50: Heater electrode 100: Electrostatic chuck 100X1: Electrostatic chuck 100X2: Electrostatic chuck 101: Laminated body 110: Electrostatic chuck 111 : Laminated body 200: Sheet member 300: Pre-joining joint 301: Part of pre-joining joint where concave portion is formed 302: Peripheral portion of pre-joining joint 400: Mask 500: Jig Pc: Concave portion S1: Adsorption Surface S2: Bonding surface on the ceramics side S3: Bonding surface on the base side S4: Sheet member side surface S5: In the bonding portion before bonding, the surface on the side opposite to the sheet member side surface W: Wafer

Claims (6)

a first member having a first surface substantially orthogonal to a first direction and a second surface opposite the first surface;
A second member having a third surface and arranged so that the third surface is located on the second surface side of the first member, the temperature adjusting means for heating or cooling a second member formed;
a joint disposed between the second surface of the first member and the third surface of the second member to join the first member and the second member;
A method for manufacturing a holding device that holds an object on the first surface of the first member, comprising:
A pre-joining joining portion, which is a member to be the joining portion and is a member in a state before joining the first member and the second member, is connected to the second surface of the first member and the second surface of the second member. a first step of disposing on a specific surface that is at least one of the third surfaces of the member;
said first member, said second member, and at least one said pre-bond joint disposed between said second surface of said first member and said third surface of said second member; In at least one of the pre-joining joint portions, a recess recessed in the second direction is provided at a position away from the outer peripheral line of the pre-joining joint portion when viewed in a second direction substantially orthogonal to the specific surface. formed and
In the pre-bonding portion, the thickness of the outer peripheral portion, which is the portion other than the recess and includes the entire outer peripheral line, is greater than the thickness of the portion of the pre-bonding portion where the recess is formed. At least one pre-bonding joint having a thick predetermined thickness is produced, and the laminate is pressed to reduce the height of the pre-bonding joint from the specific surface. a second step of homogenizing to produce a holding device comprising said first member, said second member and said joint formed from said pre-bond joint;
A method of manufacturing a holding device, comprising: In the manufacturing method of the holding device according to claim 1,
The first step is
a preparing step of preparing the pre-bonding joint portion in which the concave portion is formed;
an arranging step of arranging the pre-bonding joint prepared in the preparing step on the specific surface;
A method of manufacturing a holding device, characterized by: In the method for manufacturing a holding device according to claim 1 or 2,
The pre-bonding joint in the first step is in an uncured or semi-cured state,
In the second step, the pre-bonding is arranged between the first member, the second member, and the second surface of the first member and the third surface of the second member. and pressing the laminate to crush the pre-bonding joint and then hardening the pre-bonding joint so that the first member and the second fabricating a holding device comprising two members and the joint formed from the pre-bond joint;
A method of manufacturing a holding device, characterized by: In the method for manufacturing a holding device according to any one of claims 1 to 3,
In the first step, the recess overlaps the center of the specific surface when viewed from the second direction.
A method of manufacturing a holding device, characterized by: In the method for manufacturing a holding device according to any one of claims 1 to 3,
The first member has heating means for heating,
The temperature adjusting means formed on the second member has a cooling function,
Before the first step, by heating with the heating means and measuring the temperature distribution of the first surface of the first member, the portion of the first surface of the first member and a temperature measuring step of identifying a high-temperature portion that is a portion that is relatively hotter than other portions on the first surface of the first member,
In the first step, the recess is formed so as not to overlap the center of the specific surface and overlap the high temperature portion when viewed from the second direction.
A method of manufacturing a holding device, characterized by: In the method for manufacturing a holding device according to any one of claims 1 to 5,
The first step includes a recess forming step of forming the recess in the pre-bonding joint by pressurizing the pre-bonding joint.
A method of manufacturing a holding device, characterized by:

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