JP7222659B2 - Exposure apparatus and article manufacturing method - Google Patents

Description

The present invention relates to an exposure apparatus and an article manufacturing method, for example, an exposure apparatus that exposes a substrate in a state in which the original plate or substrate is tilted with respect to the image plane of a projection optical system, and an article manufactured using the same. It relates to a manufacturing method.

A FLEX (Focus Latitude Enhancement Exposure) method is known as a technique for increasing the depth of focus in an exposure apparatus, in which a mask pattern is imaged at different positions in the optical axis direction. When exposure is performed by the FLEX method in a scanning exposure apparatus, the substrate or mask is driven to scan while being tilted with respect to the image plane of the projection optical system. In exposure by the FLEX method, in order to obtain the effect of expanding the depth of focus uniformly over the entire image plane of the projection optical system, the aperture (slit) area of the illumination field stop of the illumination optical system must be aligned in the direction orthogonal to the scanning direction. It should be symmetrical about a straight line. Since the substrate stage is tilted in exposure by the FLEX method, if the slit area is asymmetrical, the defocus amount changes at each position in the direction perpendicular to the scanning direction, resulting in the effect of increasing the uniform depth of focus within the shot area. is not obtained.

Japanese Patent Application Laid-Open No. 2002-200000 discloses that when a mask or substrate is tilted, the effect of increasing the depth of focus within a shot area is achieved by controlling coma aberration that occurs due to the change in telecentricity between the near side and the far side of the slit. Methods for uniformity have been proposed.

JP 2009-164296 A

At present, the effect of expanding the depth of focus when performing exposure by the FLEX method with a scanning exposure apparatus is not sufficient, and improvement is desired.

According to one aspect of the present invention, an illumination optical system that illuminates an original and a projection optical system that projects a pattern of the original onto a substrate are provided, and the original or the substrate is tilted with respect to an image plane of the projection optical system. An exposure apparatus that exposes the substrate while scanning the original and the substrate in a state of being tilted, comprising: an adjusting unit that adjusts the inclination of the original or the substrate with respect to the image plane; and a control unit that controls the adjusting unit and a first error that is an error of a latent image formed on the shot area when the shot area of the substrate is exposed without tilting the original or the substrate. a second error, which is an error of a latent image formed on the shot area caused by the inclination of the original or the substrate in the first direction when the shot area is exposed; Caused by the inclination of the latent image formed on the shot area when the shot area is exposed while the original or the substrate is inclined in a second direction opposite to the first direction and tilting the original or the substrate in a direction determined so as to reduce the error of the latent image formed on the shot area based on a third error , which is an error. An apparatus is provided.

INDUSTRIAL APPLICABILITY According to the present invention, for example, in an exposure apparatus that scans and exposes an original plate or substrate with respect to the image plane of a projection optical system, an advantageous technique is provided for obtaining an enlarged depth of focus.

1 is a diagram showing the configuration of a scanning exposure apparatus according to an embodiment; FIG. The figure explaining the exposure by FLEX method. FIG. 5 is a diagram showing the relationship between the shape of a slit region and the amount of defocus; FIG. 5 is a diagram for explaining a method of calculating a defocus coefficient; 4 is a flow chart showing processing for determining the tilt direction of the substrate during FLEX exposure according to the embodiment. FIG. 5 is a diagram for explaining a process of determining the tilt direction of a substrate during FLEX exposure according to the embodiment; 4 is a flow chart showing processing for determining the tilt direction of the substrate during FLEX exposure according to the embodiment. FIG. 5 is a diagram for explaining a process of determining the tilt direction of a substrate during FLEX exposure according to the embodiment; 7 is a graph showing an example of aberration with respect to each of a plurality of tilt amounts of the substrate; FIG. 10 is a diagram showing an example of distortion caused by tilting the substrate for each of a plurality of tilt amounts of the substrate; FIG. 4 is a diagram illustrating the arrangement of a plurality of shot areas on a substrate and the order of exposure;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. It should be noted that the following embodiments merely show specific examples of implementation of the present invention, and the present invention is not limited to the following embodiments. Also, not all combinations of features described in the following embodiments are essential for solving the problems of the present invention.

<First embodiment>
FIG. 1 is a diagram showing a schematic configuration of a scanning exposure apparatus 50 according to this embodiment. The scanning exposure apparatus 50 is configured to scan the original (also called mask or reticle) 17 and the substrate 20 while projecting the pattern of the original 17 onto the substrate 20 through the projection optical system PO, thereby scanning and exposing the substrate 20 . ing.

In this specification, directions are indicated in an XYZ orthogonal coordinate system in which the horizontal plane is the XY plane, the axis parallel to the optical axis AX of the projection optical system PO is the Z axis, and the X and Y axes are perpendicular to the Z axis. Take. The directions parallel to the X-axis, Y-axis, and Z-axis are defined as X-direction, Y-direction, and Z-direction, respectively.

The illumination optical system IL, in this embodiment, is composed of elements arranged on the optical path from the light source 1 to the collimator lens 16 . The light source 1 is, for example, an ArF excimer laser with an oscillation wavelength of about 193 nm or a KrF excimer laser with an oscillation wavelength of about 248 nm.

Light emitted from the light source 1 is guided to the diffractive optical element 3 by the guiding optical system 2 . Typically, a plurality of diffractive optical elements 3 are mounted in respective slots of a turret having a plurality of slots, and any diffractive optical element 3 can be placed in the optical path by an actuator 4 .

Light emitted from the diffractive optical element 3 is condensed by a condenser lens 5 to form a diffraction pattern on a diffraction pattern surface 6 . By exchanging the diffractive optical element 3 located in the optical path with the actuator 4, the shape of the diffraction pattern can be changed.

The diffraction pattern formed on the diffraction pattern surface 6 is incident on the mirror 9 after parameters such as the ring rate and the σ value are adjusted by the prism group 7 and the zoom lens 8 . A light beam reflected by the mirror 9 enters an optical integrator 10 . The optical integrator 10 can be configured, for example, as a lens array (fly eye).

The prism group 7 includes, for example, prisms 7a and 7b. If the distance between the prisms 7a and 7b is sufficiently small, the prisms 7a and 7b can be regarded as an integrated glass flat plate. The diffraction pattern formed on the diffraction pattern surface 6 has its σ value adjusted by the zoom lens 8 while maintaining a substantially similar shape, and is imaged on the incident surface of the optical integrator 10 . By separating the positions of the prisms 7a and 7b, the diffraction pattern formed on the diffraction pattern surface 6 can be adjusted in terms of the zonal ratio and aperture angle.

A light flux emitted from the optical integrator 10 is condensed by a condenser lens 11 to form a desired light intensity distribution on a surface 13 conjugate with the original 17 . An illumination field stop (light shielding member) 12 is arranged at a position displaced from a surface 13 conjugated to the surface on which the original 17 is arranged, defines an illumination area of the original 17 by the exposure light, and controls the light intensity distribution in the illumination area. Control. More specifically, the light shielding member 12 controls the light intensity distribution of the exposure light so that the light intensity distribution along the scanning direction of the original 17 and the substrate 20 is trapezoidal. The trapezoidal light intensity distribution is effective in reducing variations in the integrated exposure amount in the scanning direction due to the fact that the light generated by the light source 1 is pulsed light, that is, has discontinuity.

A light beam passing through the aperture (slit) of the illumination field stop 12 illuminates the original 17 via the collimator lens 14 , the mirror 15 and the collimator lens 16 . The pattern of the original 17 is projected onto the substrate 20 held by the substrate stage WS including the tilt stage 19 by the projection optical system PO. Thereby, a latent image pattern is formed on the photosensitive agent on the substrate 20 .

The tilt stage 19 is positioned so that the substrate 20 is scanned while the surface of the substrate 20 held by it is tilted with respect to the image plane of the projection optical system PO. The tilt of the tilt stage 19 (that is, the tilt of the substrate 20) is adjusted by an adjuster 21 including a tilt mechanism. Instead of tilting the substrate 20, the original plate 17 may be tilted, but here, a structure in which the substrate 20 is tilted is adopted. In the example shown in FIG. 1, the scanning direction is along the Y-axis, and the axis controlling the tilt of substrate 20 or master 17 for depth of focus enhancement is rotation about the X-axis (ωX).

The projection optical system PO has a driving mechanism 25 that changes the aberration of the projection optical system PO by moving, rotating and/or deforming at least one lens 24 of the plurality of lenses that constitute it. The driving mechanism 25 includes, for example, a mechanism for moving the lens 24 in a direction along the optical axis AX of the projection optical system PO, and a mechanism for moving the lens 24 around axes parallel to two axes (X-axis and Y-axis) perpendicular to the optical axis AX. and a mechanism for rotating lens 24 . The sensitivity of aberration change to driving of the lens 24 may be determined in advance through calculation or actual measurement, and characteristic data (for example, a table) indicating it may be stored in the memory 32 of the controller 30 . The control unit 30 can determine the driving amount of the lens 24 based on the characteristic data, and drive the lens 24 according to the driving amount.

The control section 30 controls each section of the scanning exposure device 50 . The control unit 30 includes a memory 32 for storing programs and data, and performs scanning exposure by executing a control program stored in the memory 32 .

The FLEX method is a technique for improving the contrast and expanding the depth of focus by performing multiple exposures while shifting the focal point. When performing scanning exposure by the FLEX method in the scanning exposure apparatus 50, as shown in FIG. 2, the original plate 17 and the substrate 20 are driven to scan in directions indicated by arrows. In the following description, it is assumed that the substrate 20 is driven for scanning. In that case, when exposing the substrate 20 by the FLEX method, the substrate 20 is scanned and driven so that each point on the substrate 20 is defocused, best focused, and defocused on the image plane side of the projection optical system PO. For example, the substrate stage WS is controlled by the controller 30 so that the point on the surface of the substrate 20 through which the optical axis AX passes coincides with the best focus position of the projection optical system PO. Further, the substrate stage WS is controlled by the control unit 30 so that the substrate 20 is tilted at the target.

Exposure by the FLEX method will be described with reference to FIG. In exposure by the FLEX method, by tilting the traveling direction of the substrate stage with respect to the best focus plane (BF plane), it is possible to continuously perform multiple exposure at a plurality of imaging positions near the BF plane. Here, the tilt amount of the substrate stage and the tilt amount of the substrate stage in the running direction are the same. In such exposure by the FLEX method, in order to obtain the effect of uniform focal depth expansion over the entire image plane of the projection optical system PO, as shown in FIG. It is necessary that the area is approximately rectangular. When the slit area is rectangular, the slit width is the same at each position (i1, i2, i3) in the direction (X direction) orthogonal to the scanning direction. In this case, as shown in FIG. 3A2, even if the substrate is tilted by the tilt amount M by the tilt stage 19, the defocus amount at each position (i1, i2, i3) within the shot area is made uniform. can be generated (Df1=Df2=Df3).

On the other hand, the shape of the slit area may be asymmetrical with respect to a straight line along the direction orthogonal to the scanning direction for correcting uneven illumination. For example, as shown in FIG. 3B1, the slit region has a shape in which the slit width is not the same at each position (i1, i2, i3) (hereinafter also referred to as “slit position”) in the direction orthogonal to the scanning direction. think. In this case, as shown in FIG. 3B2, the tilt of the substrate by the tilt stage 19 changes the defocus amount for each position within the shot area (Df1=Df3≠Df2). In the example of FIG. 3B2, on the +Df side from the center of the tilt axis, the defocus amount at position i2 is +Df2, while the defocus amounts +Df1 and +Df3 at positions i1 and i2 are larger. Therefore, it is not possible to obtain a uniform depth-of-focus effect within the shot area.

In the FLEX method, multiple exposure is continuously performed at a plurality of image forming positions near the best focus plane. Occur. In the exposure apparatus, there are errors that cannot be eliminated even in the optical characteristics of the apparatus (asymmetry of the slit shape, telecentricity, image plane) or in the adjustment state of the apparatus. Furthermore, when performing exposure by the FLEX method, an error may occur in the latent image formed on the shot area due to the tilt of the substrate, and the error may increase. Therefore, the effect of expanding the depth of focus that is originally expected in the FLEX method cannot be obtained. The present embodiment focuses on such problems.

In this embodiment, the controller 30 controls the tilt direction of the substrate 20 between the following cases (A) and (B) so that errors in the latent image formed on the shot area are reduced. is determined, and the adjustment unit 21 is controlled. (A) When the shot area is exposed while the substrate 20 is tilted in the first direction.
(B) When the shot area is exposed while the substrate 20 is tilted in the second direction opposite to the first direction.

A specific example will be described below. Errors in the latent image formed on the shot area can be observed as misalignment of the latent image, distortion, line width error, and the like. Thus, latent image errors can be, for example, latent image misregistration, distortion, or line width errors. In the following, the latent image error is identified by positional deviation of the latent image (hereinafter also referred to as “latent image deviation”).

First, with reference to FIG. 4, a method of calculating a defocus coefficient for calculating the amount of occurrence of positional deviation will be described. The defocus coefficient is a value that depends on the width of each position in the direction perpendicular to the scanning direction of the slit formed by the illumination field stop 12 . In FIG. 4, Ai and Bi represent the distance from the tilt axis center to the slit edge at the slit position i. At this time, a defocus coefficient Ki indicating the ratio of the defocus amount at the slit position i is expressed by the following equation.
Ki = Bi/Ai

Ideally, the projection optical system is expected to have no aberrations, but in reality there are aberrations (adjustment residuals) that cannot be adjusted. The effect of this aberration can be observed as positional deviation of the latent image as shown in FIG. 6A, for example. Such misalignment also appears during normal exposure without tilting the substrate. Furthermore, in exposure by the FLEX method, which is performed with the expectation of expanding the depth of focus (FLEX exposure), depending on the combination of the tilt amount of the substrate and the asymmetry of the slit width as shown in FIG. ) and (D) newly occur. Due to such a positional deviation, the deviation from the ideal imaging increases as if the aberration of the projection optical system increased. Therefore, in the present embodiment, the position of the substrate during FLEX exposure is calculated based on the deviation of the latent image during normal exposure, in which the shot area is exposed without tilting the substrate, and the deviation of the latent image caused by tilting the substrate. Determine the tilt direction.

FIG. 5 shows a flowchart of the substrate tilt amount determination process according to the present embodiment. In S11, the control unit 30 acquires the latent image shift L (first error) in the case of normal exposure. In S12, the control unit 30 adjusts the inclination of the latent image formed on the shot area when the shot area is exposed while the substrate is inclined by α [μrad] in the first direction as the amount of inclination M of the substrate. A resulting deviation Pm1 (second error) is obtained. From the latent image shift Om1 generated by the tilt amount M of the substrate at this time and the defocus coefficient Ki, the latent image shift Pm1 generated in principle by the slit shape is calculated by the following equation.
Pm1=Ki·Om1

Further, the control unit 30 controls the substrate tilt amount M in the case where the shot region is exposed in a state in which the substrate is tilted in a second direction opposite to the first direction by α [μ rad]. A shift Pm2 (third error) caused by the tilt of the latent image is obtained. From the latent image shift Om2 generated by the tilt amount M of the substrate at this time and the defocus coefficient Ki, the latent image shift Pm2 generated in principle by the slit shape is calculated by the following equation.
Pm2=Ki·Om2

FIG. 6B shows a latent image shift Pm1 that occurs when the FLEX exposure is performed with the substrate tilted by α [μrad] in the + direction (first direction). FIG. 6D shows a latent image shift Pm2 that occurs when the FLEX exposure is performed with the substrate tilted by α [μrad] in the − direction (second direction) as the tilt amount M. FIG. In this way, the sign of the deviation of the latent image is reversed depending on the direction in which the substrate is tilted.

The effect of the latent image shift during actual exposure is a combination of the latent image shift L (first error) due to adjustment residuals and the latent image shift Pm that occurs during FLEX exposure. In actual production, it is necessary to reduce the deviation of the latent image within the shot area. Therefore, in S13, the control unit 30 determines the latent image shift L (first error) due to the adjustment residual and the latent image shift Pm1 (second error) when tilted by α [μ rad] in the first direction. are synthesized to obtain L+Pm1 (first synthesized error) (FIG. 6(C)). Further, the control unit 30 combines the latent image shift L (first error) due to the adjustment residual and the latent image shift Pm2 (second error) when tilted by α [μ rad] in the second direction. L+Pm2 (second combined error) is obtained (FIG. 6(E)). Furthermore, the controller 30 determines the tilt direction of the substrate based on the result of the comparison between the first combined error and the second combined error. For example, the control unit 30 calculates the defocus amount at each image height in the X direction for L+Pm1 (FIG. 6C) and L+Pm2 (FIG. 6E), and determines the deviation of the latent image in the shot area. The tilt direction is determined so that the absolute value is small. In S14, the controller 30 drives the tilt stage 19 according to the determined tilt direction to tilt the substrate.

<Second embodiment>
In the first embodiment, the latent image error is identified by the positional deviation of the latent image formed on the shot area. Identify errors. In the second embodiment, from the viewpoint of distortion, the image height in the X direction is determined by the defocus amount and the telecentric component that occur when FLEX exposure is performed in an exposure apparatus with an asymmetric slit shape as shown in FIG. Consider the shift component that occurs every

Ideally, the lens of the projection optical system is expected to have no distortion, but in reality, there is distortion (adjustment residual) N that cannot be adjusted as shown in FIG. 8(A). . This distortion also appears during normal exposure without tilting the substrate. Furthermore, in FLEX exposure, which is performed with the expectation of expanding the depth of focus, depending on the combination of the tilt amount of the substrate and the asymmetry of the slit width as shown in FIG. A new distortion Qm such as Therefore, in this embodiment, the tilt direction of the substrate during FLEX exposure is determined based on the distortion during normal exposure in which the substrate is not tilted and the distortion caused by tilting the substrate.

FIG. 7 shows a flowchart of the substrate tilt amount determination process according to the present embodiment. In S21, the control unit 30 acquires the distortion N during normal exposure. In S22, the controller 30 calculates the distortion Qm generated in principle by the slit shape from the distortion Rm generated by the tilt amount M of the substrate and the defocus coefficient Ki by the following equation.
Qm = Ki · Rm

FIG. 8B shows the distortion Qm1 that occurs when the FLEX exposure is performed with the tilt amount M of the substrate set to +β [μrad]. FIG. 8D shows the distortion Qm2 that occurs when the FLEX exposure is performed with the tilt amount M of the substrate set to -β [μrad]. Thus, the direction of distortion is reversed depending on the direction in which the substrate is tilted.

The effect of distortion during actual exposure is the sum of the adjustment residual distortion N and the distortion Qm generated during FLEX exposure. In actual production, it is necessary to reduce the distortion within the shot. Therefore, in S23, the control unit 30 calculates the distortion of each of N+Qm1 (FIG. 8C) and N+Qm2 (FIG. 8E), and determines the tilt direction so that the absolute value of the distortion in the shot becomes small. do. In S24, the controller 30 drives the tilt stage 19 according to the determined tilt direction to tilt the substrate.

<Third Embodiment>
FIG. 9 is a graph showing examples of latent image errors caused by tilting the substrate for each of a plurality of tilt amounts of the substrate. In the present embodiment, for example, data according to this graph are pre-stored in the memory 32 of the control unit 30 . From the data stored in the memory 32, the control unit 30 obtains the error Om caused by the set tilt amount M of the substrate. The control unit 30 calculates an error Pm that theoretically occurs due to the shape of the slit from the obtained error Om and the defocus coefficient Ki using the following equation.
Pm = Ki · Om

The control unit 30 adds the calculated error Pm to the aforementioned characteristic data as a lens control parameter. In addition to Pm, lens control parameters may include, for example, the Z position, the amount of tilt about the X axis, the amount of tilt about the Y axis, and the like. Then, the control unit 30 performs FLEX exposure while driving the lens 24 of the projection optical system PO by the drive mechanism 25 so as to correct the error Pm as the lens control parameter.

<Fourth Embodiment>
FIG. 10 is a diagram showing an example of distortion caused by tilting the substrate for each of a plurality of tilt amounts of the substrate. In the present embodiment, for example, distortion data according to this drawing are pre-stored in the memory 32 of the control section 30 . The control unit 30 obtains the distortion Rm generated by the tilt amount M of the substrate from the distortion data stored in the memory 32 . The control unit 30 calculates the distortion Qm, which is theoretically generated by the slit shape, from the obtained distortion Rm and the defocus coefficient Ki using the following equation.
Qm = Ki · Rm

The controller 30 adds the calculated distortion Qm to the aforementioned characteristic data as a lens control parameter. In addition to Qm, lens control parameters may include, for example, the Z position, the amount of tilt about the X axis, the amount of tilt about the Y axis, and the like. Then, the control unit 30 performs FLEX exposure while driving the lens 24 of the projection optical system PO by the drive mechanism 25 so as to correct the distortion Qm as a lens control parameter.

<Fifth Embodiment>
In the above-described embodiment, it has been described that the tilt of the substrate 20 is adjusted so as to reduce the latent image error for one shot area. Therefore, the controller 30 can adjust the tilt of the substrate by the adjuster 21 for each of the plurality of shot areas arranged on the substrate 20 . As a result, the effect of expanding the depth of focus uniformly within each shot area can be obtained, and the exposure accuracy can be improved.

However, adjusting the tilt for each of a plurality of shot areas on the substrate reduces throughput. Therefore, the control unit 30 adjusts the inclination of the substrate by the adjusting unit 21 for each group in which the order of exposure is continuous and the scanning direction is the same among the plurality of shot areas arranged on the substrate 20, The tilt adjustment state may be fixed within each group. For example, in general, a plurality of shot areas are arranged in a matrix on a substrate, and the scanning direction of each shot area, the order of exposure of each shot area, and the movement path of the substrate between shot areas are predetermined as exposure conditions. ing. FIG. 11 shows an example of a plurality of shot areas arranged in a matrix on the substrate. Generally, in scanning exposure, from the viewpoint of throughput, the exposure order is set in a snake shape from the shot area at the edge of the substrate, as shown in FIG. In this case, the shot area group in one row is an example of a group in which the order of exposure is continuous and the scanning direction is the same. As a result, it is possible to suppress the decrease in throughput due to the adjustment of the inclination of the substrate.

In one embodiment, the control unit 30 has user-selectable exposure control modes, for example, an accuracy priority mode that prioritizes exposure accuracy and a throughput priority mode that prioritizes throughput. When the precision priority mode is selected, the adjustment unit 21 adjusts the inclination of the substrate for each of the plurality of shot areas arranged on the substrate 20 . On the other hand, when the throughput priority mode is selected, the tilt of the substrate is adjusted by the adjustment unit 21 for each group in which the order of exposure is continuous and the scanning direction is the same for each group of a plurality of shot areas. The adjustment state of the tilt of the substrate is fixed within the group.

<Embodiment of article manufacturing method>
INDUSTRIAL APPLICABILITY The article manufacturing method according to the embodiment of the present invention is suitable for manufacturing articles such as microdevices such as semiconductor devices and elements having fine structures. The method for manufacturing an article according to the present embodiment includes a step of forming a latent image pattern on a photosensitive agent applied to a substrate using the above exposure apparatus (a step of exposing the substrate), and and developing the substrate. In addition, such manufacturing methods include other well-known steps (oxidation, deposition, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The article manufacturing method of the present embodiment is advantageous in at least one of article performance, quality, productivity, and production cost compared to conventional methods.

IL: illumination optical system, PO: projection optical system, 17: original (reticle), RS: original plate stage, 19: tilt stage, 20: substrate, WS: substrate stage, 30: controller, 32: memory, 50: scanning Exposure device

Claims (11)

An illumination optical system for illuminating an original and a projection optical system for projecting a pattern of the original onto a substrate, wherein the original and the substrate are tilted with respect to an image plane of the projection optical system. An exposure apparatus for exposing the substrate while scanning the
an adjustment unit that adjusts the inclination of the original or the substrate with respect to the image plane;
a control unit that controls the adjustment unit;
The control unit
a first error that is an error of a latent image formed on the shot area when the shot area of the substrate is exposed without tilting the original or the substrate; A second error, which is an error caused by the inclination of the latent image formed on the shot area when the shot area is exposed in an inclined state, and the original or the substrate in the first direction. and a third error, which is an error caused by the inclination of the latent image formed on the shot area when exposing the shot area while the shot area is inclined in the opposite second direction, An exposure apparatus, wherein the original or the substrate is tilted in a direction determined to reduce errors in the latent image formed on the shot area. The control unit
The original or the 2. The exposure apparatus according to claim 1, wherein the tilt direction of the substrate is determined. The illumination optical system includes an illumination field stop that defines an illumination area of the original,
The control unit is formed on the shot area due to a defocus coefficient dependent on the width of each position in the direction orthogonal to the scanning direction of the slit formed by the illumination field stop and the tilt of the substrate. 3. The method according to claim 1, wherein an error of the latent image corresponding to the shape of the slit calculated based on the error of the latent image is obtained as the second error or the third error. Exposure equipment. 4. The exposure apparatus according to claim 2, wherein the control unit performs exposure while driving a lens included in the projection optical system so as to correct the second error or the third error. 5. The method according to claim 4, wherein the control unit obtains the second error and the third error based on error data generated by tilting of the substrate for each of a plurality of tilt amounts of the substrate. exposure equipment. 6. The exposure apparatus according to any one of claims 1 to 5, wherein the controller adjusts the inclination by the adjuster for each of a plurality of shot areas arranged on the substrate. . The control unit adjusts the inclination by the adjusting unit for each group in which the order of exposure is continuous and the scanning direction is the same among a plurality of shot areas arranged on the substrate, and 6. An exposure apparatus according to any one of claims 1 to 5, wherein the adjustment state of said inclination is fixed. The control unit has, as exposure control modes, an accuracy priority mode that prioritizes exposure accuracy and a throughput priority mode that prioritizes throughput. The tilt is adjusted by the adjusting unit for each of the plurality of shot areas, and when the throughput priority mode is selected, the order of exposure of the plurality of shot areas is continuous and the scanning direction is the same. 6. The apparatus according to any one of claims 1 to 5, wherein the tilt adjustment is performed by the adjusting unit for each group in which the tilt is adjusted, and the tilt adjustment state is fixed within each group. . 9. An exposure apparatus according to any one of claims 1 to 8, wherein the latent image error is any one of positional deviation, distortion, and line width error of the latent image. An illumination optical system for illuminating an original and a projection optical system for projecting a pattern of the original onto a substrate, wherein the original and the substrate are tilted with respect to an image plane of the projection optical system. An exposure apparatus for exposing the substrate while scanning the
an adjustment unit that adjusts the inclination of the original or the substrate with respect to the image plane;
a control unit that controls the adjustment unit;
The control unit
acquiring a first error that is an error of a latent image formed on the shot area when the shot area of the substrate is exposed without tilting the original or the substrate;
Obtaining a second error, which is an error caused by the inclination of the latent image formed on the shot area when the shot area is exposed while the original or the substrate is inclined in the first direction,
Caused by the inclination of the latent image formed on the shot area when the shot area is exposed while the original or the substrate is inclined in a second direction opposite to the first direction find the third error, which is an error;
Based on a result of comparison between a first combined error obtained by combining the first error and the second error and a second combined error obtained by combining the first error and the third error, the original plate or the substrate determine the tilt direction of
An exposure apparatus characterized by: exposing a substrate using the exposure apparatus according to any one of claims 1 to 10 ;
developing the exposed substrate in the step;
including
A method for producing an article, comprising producing an article from the developed substrate.

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