JP7219400B2 - WORK INSPECTION METHOD AND APPARATUS AND WORK MACHINING METHOD - Google Patents

Description

The present invention relates to a work inspection method and apparatus, and a work processing method, and more particularly to a technique for cutting a work having a laser processing area inside the work.

Conventionally, there is a laser dicing machine that irradiates a laser beam along a processing line with a focal point aligned with the inside of a work such as a silicon wafer, thereby forming a laser processing area that serves as a starting point for cutting inside the work along the processing line. Are known. The work on which the laser-processed region has been formed is then split along the planned cutting line by a splitting process such as expanding or breaking into individual chips.

JP 2018-064049 A

When forming a laser processing area inside the work, internal structures of the work (e.g., defects (e.g., scratches, voids, etc.), particles such as impurities, processing marks, cracks inside the work caused by laser processing) etc.), part of the laser light may be scattered in a sputter-like manner or may leak to the side opposite to the laser light incident surface. Such scattered light causes defects (for example, point-like defects, hereinafter referred to as splash damage) inside the workpiece (see, for example, Patent Document 1). Splash damage may damage the workpiece and the device formed on the workpiece, and is a factor in degrading the quality of the device, so it is desired to suppress its occurrence.

By the way, it is common for an operator to visually inspect a workpiece for defects using a device such as a microscope that is different from the laser dicing device. However, since device patterns and the like are formed on the work, visual inspection is hindered by the device patterns and the like. Also, the splash damage may be scattered to a position distant from the incident position of the laser beam (near the laser processing area). For this reason, it is difficult to completely detect splash damage, which is a fine point-like defect.

In addition, there are cases where defects, impurities, etc. are included in the workpiece before the laser processing area is formed. It is difficult to distinguish between and detect defects during processing including splash damage caused by laser processing.

Patent Document 1 discloses an inspection wafer for inspecting leakage light during laser processing, but it does not completely detect splash damage by distinguishing it from defects before laser processing. In addition, Patent Document 1 prevents damage caused by irradiation of a device with leakage light of a laser beam from a condensed point, and prevents scattered light scattered at a position away from the incident position of the laser beam. It was not intended to detect the defects caused. Therefore, it has not been possible to accurately evaluate the effect of splash damage on device quality and to appropriately set processing conditions for laser processing.

The present invention has been made in view of such circumstances, and it is possible to accurately detect defects caused by scattering of laser light, etc., and to accurately evaluate the effect of laser processing on the quality of the device. It is an object of the present invention to provide a workpiece inspection method and apparatus, and a workpiece machining method that can appropriately set machining conditions for laser machining.

In order to solve the above problems, a work inspection method according to a first aspect of the present invention includes a step of capturing an image of an inspection range of a work before and after laser processing of the work using an imaging device; A detection process of analyzing the images of the inspection range of the workpiece before and after to detect defects during processing formed by scattered light during laser processing, and a setting process of setting processing conditions according to the detection results of defects during processing. Prepare.

In the workpiece inspection method according to the second aspect of the present invention, the detection step of the first aspect is a step of analyzing an image of an inspection range of the workpiece before laser processing and detecting a defective portion in the inspection range of the workpiece. Then, the defect detected from the image of the inspection range of the work after laser processing is analyzed, and the defect candidate is detected from the inspection range of the work. and excluding laser-processed areas and shadows of the laser-processed areas to identify machining defects.

A workpiece inspection method according to a third aspect of the present invention includes steps of obtaining map data including information on a defective portion included in a workpiece before laser processing, and analyzing an image of an inspection range of the workpiece after laser processing. Then, defect candidates are detected from the inspection range of the workpiece, and from the defect candidates, the missing part, the laser processing area formed in the workpiece by laser processing, and the shadow of the laser processing area are excluded, and the scattering during laser processing The method includes a detection step of detecting a processing defect formed by light, and a setting step of setting processing conditions according to the detection result of the processing defect.

A work inspection method according to a fourth aspect of the present invention, in the second or third aspect, further comprises a step of calculating a correction amount for the laser processing position based on the position of the laser processing region.

A work inspection method according to a fifth aspect of the present invention, in the setting step of any one of the first to fourth aspects, calculates an evaluation value of the defect during processing, and the evaluation value of the defect during processing is an error limit value or more. In this case, the machining conditions are set.

A work inspection method according to a sixth aspect of the present invention is such that the evaluation value of the fifth aspect is at least one of the number and size of defects during processing and the distance from the laser processing line.

A work processing method according to a seventh aspect of the present invention performs laser processing of a work to be processed based on the processing conditions set by the work inspection method according to any one of the first to sixth aspects. It is.

A workpiece inspection apparatus according to an eighth aspect of the present invention includes an imaging device that captures an image of an inspection range of a workpiece before and after laser processing of the workpiece, and an image of the inspection range of the workpiece before and after laser processing. A detection unit for detecting processing defects formed by scattered light during laser processing, and a setting unit for setting processing conditions according to the detection results of the processing defects.

A work inspection apparatus according to a ninth aspect of the present invention includes a map data acquisition unit that acquires map data including information on a defective portion included in a work before laser processing, and an inspection range of the work after laser processing. Analyze the image to detect defect candidates from the inspection range of the work, remove the missing part, the laser processing area formed in the work by laser processing, and the shadow of the laser processing area from the defect candidates, and perform laser processing a detection unit for detecting defects during processing formed by scattered light; and a setting unit for setting processing conditions according to the detection result of the defects during processing.

According to the present invention, it is possible to accurately detect defects caused by scattering of laser light or the like. Furthermore, according to the present invention, it is possible to accurately evaluate the effect of laser processing on the quality of the device according to the results of detection of defects during processing, and appropriately set processing conditions for laser processing.

FIG. 1 is a diagram showing an overview configuration of a laser dicing apparatus. FIG. 2 is a view (plan view (top view) and cross-sectional view) showing a test machining work. FIG. 3 is a flowchart showing a method of setting processing conditions for laser dicing. FIG. 4 is a flow chart showing the process of detecting defects during processing. FIG. 5 is a flow chart showing a process for evaluating defects during processing. FIG. 6 is a flow chart showing a process for setting processing conditions.

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of a workpiece inspection method and apparatus and a workpiece machining method according to the present invention will be described below with reference to the accompanying drawings.

In this embodiment, the laser dicing apparatus 1 is used to process the work CW for test processing. Then, using images of the inspection range of the test machining work CW before and after machining (for example, the inside, surface (upper surface and lower surface) of the machining work CW, etc.), the defect existing before laser machining and the laser machining It is detected by distinguishing it from defects during processing including splash damage caused by

Next, the processing conditions are evaluated based on the detection result of the defects during processing, and it is determined whether or not the processing conditions need to be changed. Then, when it is determined that the machining conditions need to be changed, the machining conditions are reset. Thereby, it becomes possible to set the machining conditions of the workpiece W appropriately.

(laser dicing machine)
First, the laser dicing apparatus 1 will be described with reference to FIG. FIG. 1 is a diagram showing a schematic configuration of a laser dicing apparatus 1. As shown in FIG.

As shown in the figure, the laser dicing apparatus 1 of this embodiment includes a workpiece moving section 11, an optical system unit (laser engine) 40, a control section 50, and the like. The optical system unit 40 includes a laser optical section 20 and an observation optical section 30 .

The control unit 50 includes a CPU (Central Processing Unit), a memory, an input/output circuit unit, etc., and controls the operation of each unit of the laser dicing apparatus 1 .

The work moving unit 11 includes a suction stage 13 that sucks and holds the work W to be processed, and an XYZθ table 12 that is provided on the main body base 16 of the laser dicing apparatus 1 and moves the suction stage 13 precisely in the XYZθ directions. there is The work moving unit 11 precisely moves the work W in the XYZ.theta.

A back grind (BG) tape B having an adhesive material is attached to one surface of the work W, and the work W is placed on the suction stage 13 so that the back surface faces upward.

A dicing sheet having an adhesive material is attached to one surface of the work W, and the work W may be placed on the suction stage 13 in a state of being integrated with the frame through the dicing sheet. In this case, it is placed on the suction stage 13 so that the surface faces upward. In the following description, the surface of the work W exposed to the optical system unit 40 side is the upper surface, and the surface to which the BG tape B is attached is the lower surface. Note that the workpiece W may be directly attracted to the attraction stage 13 .

The laser optical unit 20 includes a laser oscillator 21, a collimating lens 22, a half mirror 23, a condensing lens (condensing lens) 24, driving means 25 for finely moving the laser beam parallel to the workpiece W, and the like. As a light source of the laser oscillator 21, for example, a semiconductor laser-excited Nd:YAG (Yttrium Aluminum Garnet) laser is used. A laser beam oscillated from a laser oscillator 21 is focused on an inspection range of a workpiece W through an optical system such as a collimator lens 22, a half mirror 23, a condensing lens 24, and the like. The Z-direction position of the focal point is adjusted by finely moving the condensing lens 24 in the Z-direction.

The observation optical unit 30 includes an observation light source 31, a collimating lens 32, a half mirror 33, a condensing lens 34, an imaging device (camera, such as a CCD (Charge Coupled Device) camera) 35, an image processing unit 38, a monitor 36, and the like. I'm in. The control unit 50 and the observation optical unit 30 are an example of a work inspection device.

In the observation optical unit 30 , the illumination light emitted from the observation light source 31 irradiates the work W through an optical system such as a collimate lens 32 , a half mirror 33 and a condensed lens 24 . Reflected light from the work W passes through the condensed lens 24, the half mirrors 23 and 33, and the condensed lens 34, and is incident on the camera 35 as observation means, and an image of the work W is captured.

This imaging data is input to the image processing unit 38 and used for alignment of the workpiece W. FIG. Also, this imaging data is displayed on the monitor 36 via the control unit 50 .

The observation optical unit 30 is capable of imaging defects in the inspection range of the work W. FIG. In this case, illumination light having a longer wavelength than visible light is used. If the workpiece W is a silicon wafer, for example, infrared light is used. The illumination light applied to the work W passes through the inspection range of the work W and is reflected by the lower surface of the work W. As shown in FIG. The reflected light from the lower surface of the work W enters the camera 35 via the condensed lens 24, the half mirrors 23 and 33, and the condensed lens 34, and an image including defects in the inspection range of the work W is captured.

This imaging data is input to the image processing unit 38 and used to detect defects in the inspection range of the workpiece W. FIG. An image of the inspection range of the workpiece W is displayed on the monitor 36 together with the defect detection result. As a result, the operator can check the defect detection results and make corrections while viewing the monitor 36 .

In the present embodiment, images including defects in the inspection range of the workpiece W are captured before and after processing for forming a laser processing region using laser light. This makes it possible to distinguish and detect defects existing before laser processing and processing defects including splash damage caused by laser processing.

In this embodiment, the laser optical unit 20 and the observation optical unit 30 are used to capture an image of the workpiece W, but the present invention is not limited to this. For example, an optical system of a microscope and a camera installed for alignment of the work W may be used to capture an image of the inspection range of the work W. FIG.

When forming a laser processing area on the workpiece W, the laser beam L is emitted from the laser oscillator 21, and the laser beam L passes through an optical system such as a collimator lens 22, a half mirror 23, and a condensed lens 24, and the inspection range of the workpiece W. is irradiated to The Z-direction position of the focal point of the irradiated laser light L is accurately set at a predetermined position within the inspection range of the work W by the Z-direction position adjustment of the work W by the XYZθ table 12 and the position control of the condensation lens 24. be.

In this state, the XYZθ table 12 is processed and fed in the X direction, which is the dicing direction. As a result, one line of the laser processing region R1 is formed in the inspection range of the work W along the processing line of the work W. As shown in FIG. Then, when one line of the laser processing area R1 is formed along the processing line, the XYZθ table 12 is indexed and fed by one pitch in the Y direction, and the laser processing area R1 is also formed on the next processing line. Next, when the laser processing regions R1 are formed along all the X-direction processing lines, the XYZθ table 12 is rotated by 90° around the Z-axis, and the X-direction processing lines after rotation are similarly laser-processed. A processed region R1 is formed.

Here, the laser processing region R1 is a region where the physical properties such as density, refractive index, mechanical strength, etc. inside the workpiece W become different from the surroundings due to the irradiation of the laser beam, and the strength is lower than the surroundings. Say. Laser-processed region R1 includes, for example, a crack region. The work W on which the laser-processed region is formed is transported to a grinding device (not shown), and the back surface of the work W is ground to remove the laser-processed region R1. Then, when the expanding tape is attached to the back side of the work W and stretched, the work W is split by the cracks extending from the laser processing region R1 to the front side of the work W. As a result, the workpiece W is separated into individual chips.

(workpiece for test machining)
Next, the test machining work CW will be described with reference to FIG. FIG. 2(A) is a plan view (top view) of a work for test machining, and FIG. 2(B) is a cross-sectional view along BB in FIG. 2(A).

As shown in FIG. 2B, the test machining work CW according to this embodiment includes a work layer WL and a detection layer DL formed on the lower surface of the work layer WL. The work layer WL is made of silicon or the like, for example. The detection layer DL is formed by vapor-depositing a low-melting-point metal (such as tin), a low-melting-point alloy, or the like on the work layer WL. Note that the detection layer DL may be formed of a film such as resin.

The test machining work CW is sucked and held in the laser dicing apparatus 1 with the detection layer DL facing downward. The test machining work CW shown in FIG. 2 includes a defective portion P1 containing impurities (particles). Note that FIG. 2 shows only one missing portion P1 for simplification of the drawing. In this embodiment, the camera 35 is used to image the work CW for test machining before machining. Then, the control unit 50 detects the missing portion P1 by analyzing this image.

When laser processing is performed on the test processing work CW, a laser processing region R1 (see FIG. 2(B)) is formed along the processing line L1 (see FIG. 2(A)) in the inspection range of the work layer WL. is formed.

During laser processing, part of the laser light is scattered in the inspection range of the work layer WL or leaks to the lower surface side of the work layer WL. When this scattered light and leaked light reach the detection layer DL on the lower surface of the work layer WL, the detection layer DL is partially melted. This changes the reflectance of the interface between the work layer WL and the detection layer DL when the test machining work CW is irradiated with irradiation light (for example, infrared light). The control unit 50 uses the image processing unit 38 to analyze the image of the test machining work CW after machining, and detects defects based on the change in reflectance.

In the example shown in FIG. 2, splash damage SD1 to SD3 formed by scattered light and damage BD formed by leaked light leaked to the lower surface side of the laser processing region R1 (hereinafter referred to as direct damage) are shown. ing. The splash damages SD1 to SD3 are point-like defects formed by sputter-like scattering of part of the laser light by structures within the inspection range of the work layer WL. The direct damage BD is a defect formed by a part of the laser beam leaking to the lower surface side of the laser processing region R1, and is formed along the processing line L1.

In this embodiment, the camera 35 is used to image the test machining work CW after machining, with the interface between the work layer WL and the detection layer DL as the focus plane FP (focus plane). As shown in FIG. 2, the image of the test machining work CW after machining includes the defective portion P1 and the direct damage BD in addition to the splash damages SD1 to SD3. Reference symbol R2 in FIG. 2 denotes a shadow caused by part of the irradiation light from the camera 35 being blocked by the laser processing region R1. This shadow R2 is imaged along the processing line L1.

In the present embodiment, the control unit 50 uses the image processing unit 38 to analyze the image of the test machining workpiece CW before machining to detect the defective part P1, and to provide information on its position and shape (for example, coordinates, etc.). ). Next, the control unit 50 uses the image processing unit 38 to select all candidates for processing defects (hereinafter referred to as defect candidates) including splash damage SD1 to SD3 from the image of the test processing work CW after processing. detect defects in The defect candidates may include the missing portion P1, the direct damage BD, and the shadow R2 of the laser processing region R1 in addition to the splash damages SD1 to SD3. Then, the control unit 50 excludes the defective portion P1 detected in advance from the defect candidates. Further, the control unit 50 detects the direct damage BD and the shadow R2 along the machining line L1 from the image of the test machining work CW after machining, and excludes them from the defect candidates. As a result, the splash damages SD1 to SD3 are detected as machining defects.

As for the defective portion P1, the region including the defective portion P1 detected in advance may be masked to be excluded from detection targets of defect candidates. Here, the mask area is an area defined by the contour of the defective portion P1 and a margin of repetition accuracy such as a transfer error of the test machining work CW. By defining the mask area in this way, the mask area can be minimized, so that the area to be detected for defects during processing can be maximized, and failure to detect defects during processing can be prevented. .

Furthermore, by generating a pattern on the detection layer DL of the test machining work CW and detecting this pattern using an alignment camera or the like, the test machining work CW is aligned, thereby correcting the conveyance error. is also possible. In this case, since it is possible to further reduce the transfer error of the test machining work CW, it is possible to further reduce the mask area. As a result, it is possible to further increase the area to be detected for defects during processing, and it is possible to more reliably prevent omissions in detection of defects during processing.

Note that the test machining work CW is not limited to one on which the detection layer DL is formed. may be used. Splash damage and the like can be detected even in the test machining workpiece CW whose lower surface is processed to have a high reflectance, because the reflectance of the lower surface changes (decreases) due to scattering and leakage of laser light.

In the present embodiment, a coaxial epi-illumination system (bright-field illumination system) for observing the test machining work CW by irradiating illumination light onto the test machining work CW from the imaging surface side of the camera 35 is used. The invention is not limited to this. It is also possible to observe the work CW for test machining using a dark field illumination system instead of the bright field illumination system.

When using a dark field illumination system, for example, test light emitted from a ring illumination arranged around the test machining work CW, or light converted into a ring shape using a conical lens (dark field illumination light). The workpiece CW for processing is irradiated. Then, by observing the scattered light from the test machining work CW, the defective portion P1, the direct damage BD, and the laser machining region R1 are detected.

Here, the defective portion P1, the direct damage BD, and the laser processing region R1 are detected as a black image region in the image of the test processing workpiece CW when the bright field illumination system shown in FIG. 2 is used, but the dark field illumination When using the system, it is detected as a white image area. Therefore, when using the dark-field illumination system, by inverting black and white by image processing, it is possible to obtain an image equivalent to that obtained when using the bright-field illumination system.

When using the dark field illumination system, the shadow R2 of the laser processing region R1 does not occur. For this reason, when using the bright field illumination system, it is possible to detect defects during processing by using the dark field illumination system even for the region that is the shadow R2 of the laser processing region R1. There is an advantage that the detectable area of is expanded.

(How to set processing conditions)
Next, a method for setting processing conditions according to this embodiment will be described with reference to FIGS. 3 to 6. FIG. FIG. 3 is a flowchart showing a method of setting processing conditions for laser dicing.

First, a work CW for test machining is carried into the laser dicing apparatus 1 (processing section) and held by the adsorption stage 13 (step S10). Then, the observation optical unit 30 irradiates the test machining work CW with illumination light, and the camera 35 captures an image of the test machining work CW before machining (step S12). Note that the test machining work CW may be held by suction on the suction stage 13 via the BG tape B, or may be directly suctioned on the suction stage 13 .

Next, the test machining work CW is processed by the laser dicing apparatus 1 to form a laser machining area R1 in the inspection range of the test machining work CW (step S14). Then, an image of the test machining work CW after machining is taken by the observation optical unit 30, camera 35, etc. (step S16).

Next, the control unit 50 compares the images of the test machining work CW before and after machining, and detects machining defects including splash damage formed by laser machining (step S18). Here, the control section 50 and the image processing section 38 function as the detection section of the present invention. Then, the control unit 50 evaluates the detected defect during processing according to the detection result of the defect during processing (step S20). The control unit 50 determines whether or not to change the machining conditions based on the evaluation result of the defects during machining.

When resetting the processing conditions (Yes in step S22), the control unit 50 resets the processing conditions (step S24). On the other hand, if the machining conditions are not reset (No in step S22), the control unit 50 outputs machining defect information including evaluation results of machining defects and images of the test machining work CW before and after machining. Save (step S26). Here, the control section 50 functions as a setting section of the present invention. The defect information during processing saved in step S26 can be viewed by the operator as a quality record.

Next, a process for detecting defects during processing will be described. FIG. 4 is a flow chart showing the process of detecting defects during machining.

First, the control unit 50 detects the defective portion (P1) from the image of the test machining work CW before machining (step S180). Next, the control unit 50 detects defect candidates (BD, R2 and P1 and SD1 to SD3) and the machining line L1 from the image of the test machining work CW after machining (step S182). Then, the control unit 50 excludes the defective portion (P1), the direct damage BD along the processing line L1, and the shadow R2 of the laser processing region R1 from the defect candidates in the image of the test processing work CW after processing, Machining defects SD1 to SD3 are identified (step S184).

In this embodiment, the images of the inspection range of the test machining work CW before and after laser machining are compared to identify defects during machining, but the present invention is not limited to this. For example, map data including information on the position and size of the defective portion in the test machining work CW may be acquired in advance and stored in the control unit 50 (map data acquiring unit). Then, by excluding the missing portion of the map data from the image of the test machining work CW after machining, defects during machining may be specified. In this case, the imaging of the work CW for test machining before laser machining (step S12) and the detection of the defective portion (step S180) are omitted.

Here, the map data may be created by imaging one test machining work CW (for example, a silicon wafer) in the same manner as described above and detecting defective portions. This map data may be used in common, for example, for inspection of silicon wafers cut from the same silicon ingot as the test machining work CW used to create the map data.

Next, a process for evaluating defects during processing will be described. FIG. 5 is a flow chart showing a process for evaluating defects during processing.

First, the control unit 50 calculates an evaluation value of defects during processing (step S200). The evaluation value of defects during processing is the number of defects during processing, their sizes, and the distance from the processing line L1. As for the number of defects during processing, for example, the number of defects during processing per unit area in an area (an area for one chip) surrounded by the processing line L1 may be obtained. Further, the evaluation value of defects during machining may be calculated as a numerical value normalized by the average value of the test machining work CW, for example.

Next, the control unit 50 compares the evaluation value of defects during processing with the error limit value (step S202). In steps S202 to S204, a representative value (for example, maximum value, average value, median value, etc.) of evaluation values of various defects during processing is compared with an error limit value to determine whether or not to reset processing conditions. determine whether

Then, if any of the evaluation values of defects during machining is equal to or greater than the error limit value (Yes in step S204), the control unit 50 outputs an instruction to reset the machining conditions (step S206). On the other hand, if any of the evaluation values of defects during machining is less than the error limit value (No in step S204), the control unit 50 outputs an instruction not to reset the machining conditions (step S208). .

Next, a process for setting processing conditions will be described. FIG. 6 is a flow chart showing a process for setting processing conditions.

First, the control unit 50 identifies the type of evaluation value for machining defects that is equal to or greater than the error limit value (step S240). Next, the control unit 50 displays candidates for changing the machining conditions on the monitor 36 according to the types of evaluation values equal to or greater than the error limit value (step S242).

Next, the control unit 50 receives an instruction input from the operator to select a candidate for processing conditions (step S244), and resets the processing conditions (step S246). Incidentally, the resetting of the processing conditions may be arbitrarily set by the operator.

Here, the processing conditions include, for example, the wavelength of the laser beam, the spot diameter, the output, the repetition frequency, the pulse width, the numerical aperture (NA) of the condensing lens 24, the position of the focal point, the polarization characteristics, the processing feed speed, and the like. there is The spot diameter and the position of the focal point of the laser beam can be adjusted, for example, by moving the condensing lens 24 in the Z direction. Also, the numerical aperture of the condensing lens 24 can be adjusted by, for example, a diaphragm. Also, the polarization properties can be adjusted, for example, by using a wave plate. By adjusting the processing conditions exemplified above, the evaluation values of defects during processing, such as the number of defects during processing, their sizes, and the distance of defects during processing from the processing line L1, are adjusted to be less than the error limit value. .

Then, in the work processing method according to the present embodiment, laser processing is performed on the work W to be processed based on the processing conditions reset by the above steps, and the work W is ground and cleaved. Thereby, the workpiece W is divided into individual chips.

According to the present embodiment, it is possible to accurately detect processing defects caused by scattering of laser light or the like. Furthermore, according to this embodiment, it is possible to accurately evaluate the effect of laser processing on device quality and appropriately set the processing conditions for laser processing according to the results of detection of defects during processing.

Furthermore, in the present embodiment, the control unit 50, based on the detection result of the position of the direct damage BD along the processing line L1 (laser processing area) and the shadow R2 of the laser processing area R1, forms the laser processing area at the target position. You may make it determine whether it is set. Then, when the control unit 50 determines that the laser processing area is not formed at the target position, the control unit 50 may calculate the correction amount of the laser processing position and reset the laser processing conditions.

DESCRIPTION OF SYMBOLS 1... Laser dicing apparatus, 11... Work moving part, 12... XYZ(theta) table, 13... Adsorption stage, 16... Main body base, 20... Laser optical part, 21... Laser oscillator, 22... Collimate lens, 23... Half mirror, 24... Condensed lens (collecting lens) 25 Driving means 30 Observation optical unit 31 Observation light source 32 Collimating lens 33 Half mirror 34 Condensing lens 35 Camera 36 Monitor 38 Image processing section 40... Optical system unit (laser engine) 50... Control section

Claims (9)

a step of capturing images of an inspection range of the workpiece before and after laser processing the workpiece using an imaging device;
A detection step of analyzing an image of an inspection range of the work before and after the laser processing to detect processing defects formed by scattered light during the laser processing;
a setting step of setting processing conditions according to the detection result of the defects during processing;
A workpiece inspection method comprising: The detection step includes
a step of analyzing an image of the inspection range of the work before the laser processing to detect a defective portion in the inspection range of the work;
a step of analyzing defects detected from an image of the inspection range of the work after the laser processing, and detecting defect candidates from the inspection range of the work;
A step of identifying the defect during processing by excluding the missing portion, the laser processing region formed in the work by the laser processing, and the shadow of the laser processing region from the defect candidates;
The workpiece inspection method according to claim 1, comprising: a step of acquiring map data including information on the missing portion included in the workpiece before laser processing;
Analyze the image of the inspection range of the work after the laser processing, detect the defect candidate from the inspection range of the work, and from the defect candidate, the defect part and the defect formed in the work by the laser processing A detection step of detecting defects during processing formed by scattered light during the laser processing by excluding the laser processing region and the shadow of the laser processing region;
a setting step of setting processing conditions according to the detection result of the defects during processing;
A workpiece inspection method comprising: 4. The work inspection method according to claim 2, further comprising the step of calculating a correction amount for the position where the laser processing is performed based on the position of the laser processing region. In the setting step, the evaluation value of the defect during processing is calculated, and if the evaluation value of the defect during processing is equal to or greater than an error limit value, the processing conditions are set.
The work inspection method according to any one of claims 1 to 4. The evaluation value is at least one of the number of defects during processing, the size and the distance from the processing line of the laser processing.
The work inspection method according to claim 5. A work processing method, wherein a work to be processed is laser-processed based on processing conditions set by the work inspection method according to any one of claims 1 to 6. an imaging device that captures images of an inspection range of the workpiece before and after laser processing the workpiece;
a detection unit that analyzes an image of the inspection range of the work before and after the laser processing and detects defects during processing formed by scattered light during the laser processing;
a setting unit for setting processing conditions according to the detection result of the defects during processing;
Work inspection device with a map data acquisition unit that acquires map data including information on a missing portion included in the work before laser processing;
Analyze the image of the inspection range of the work after the laser processing, detect the defect candidate from the inspection range of the work, and from the defect candidate, the defect part and the defect formed in the work by the laser processing A detection unit that excludes a laser processing area and a shadow of the laser processing area and detects defects during processing formed by scattered light during the laser processing;
a setting unit for setting processing conditions according to the detection result of the defects during processing;
Work inspection device with

Images