JP7214257B1 - Production of end electrodes of multilayer ceramic capacitors and method of printing internal electrode protective layers over the entire area - Google Patents

Abstract

Kind Code: A1 The present invention provides a method for fabricating end electrodes of a multilayer ceramic capacitor and printing an internal electrode protective layer over the entire area. Applied to multi-layer ceramic capacitors (MLCC), the thickness of the thin dielectric ceramic layer and the deposition of multiple layers of nickel internal electrodes provide a high density electrode-to-ceramic ratio end edge. and side edges to achieve the purpose of high capacitance. As a result, the present invention can improve the yield of laminated ceramic capacitors and reduce the cost by producing low internal stress laminated ceramic capacitor end electrodes and insulating protective layers using ultra-low temperature electrochemical deposition coating technology. . [Selection drawing] Fig. 1

Description

The present invention relates to a method for manufacturing end electrodes of a multilayer ceramic capacitor and printing an internal electrode protective layer over the entire area, in particular, by ultra-low temperature electrochemical deposition coating technology, end electrodes and insulating protective layers of multilayer ceramic capacitors with low internal stress. It is possible to improve the yield of laminated ceramic capacitors and to reduce the cost by manufacturing the

FIG. 10 shows the structure of the low-density nickel internal electrodes of the terminal edge and side edge, and Table 3 shows the manufacturing principle and method of conventional low-density nickel multilayer ceramic capacitors (MLCC) terminal electrodes. There is, in the fabrication of the end electrodes of the existing multilayer ceramic capacitor 5, the end electrodes are formed by immersion plating process using thick-film copper paste with glass, and nitrogen Under the protection of a gas atmosphere, the copper electrode 53 is sintered and formed by heat treatment, and the copper and the internal electrode 52 form an alloy ohmic contact, thereby connecting the internal electrode 52 in parallel, The purpose of low loss and high capacitance value is achieved, and the glass in copper paste is used to connect the dielectric ceramics 51 and the copper electrode 53 .

As can be seen from Table 3, the existing technology utilizes thick-film conductive copper paste, cast by immersion plating process, and heat-treated under nitrogen gas reducing atmosphere at 750-900°C for about 1 hour. By doing so, the laminated ceramic capacitor copper electrodes are sintered. However, in the end electrode process of the multilayer ceramic capacitor in a high-temperature reducing atmosphere, the high-temperature heat treatment causes release of high internal stress in the multilayer ceramic capacitor, resulting in severe defects such as element cracks.

In addition, when the multilayer ceramic capacitor 5 has a high capacitance, not only should the thickness of the dielectric ceramic layer 51 between the internal electrodes 52 be reduced, but also more It becomes necessary to deposit the number of layers of the internal electrode 52, so that the electrode density in the center is easily much higher than the electrode density on both sides having only the dielectric ceramic layer 51, and furthermore, the high temperature firing If this is done, the Maillard reaction is easily formed, and as shown in FIG. 11, irregular bumps are generated above and below the multilayer ceramic capacitor. When fabricating the above-mentioned high-capacitance multilayer ceramic capacitor, due to the deposition of a thin conductive layer and a large number of internal electrodes, the density between the center where the electrodes are located and the side edges where there are no electrodes is very different. , The existing technology reduces the density difference between the center with the electrode and the two sides without the electrode by printing the ceramic on both sides without the electrode part. On both sides, extra high-temperature ceramic insulating protective layers are produced, so the extra ceramic insulating layers are printed and sintered under ultra-high temperature reducing atmosphere protection, so that the multilayer ceramic capacitor and the protective layer are Replenish the thickness of the nickel internal electrode layer so that it is tightly coupled. However, the multilayer ceramic capacitor has severe defects such as element cracks due to release of high internal stress due to the high temperature heat treatment in the extra high temperature ceramic insulating protective layer process.

The existing multilayer ceramic capacitor end electrode process is sintering in a high-temperature reducing atmosphere, and after the high-capacitance multilayer ceramic capacitor is sintered, the center where many electrodes are deposited and the blank ceramic layer without electrodes Due to the difference in density between the two sides of the ridge, Maillard reaction occurs, so the quality problem caused by the internal stress of the high-capacitance multilayer ceramic capacitor must be solved, and the development of ultra-low temperature end electrode technology is required. Therefore, the general conventional one cannot be said to be practical.

In order to solve the above-mentioned drawbacks, the present inventors have conducted careful research and applied scientific theory to propose the present invention, which can effectively overcome the above-mentioned drawbacks and has a rational design.

SUMMARY OF THE INVENTION The main object of the present invention is to solve the above-mentioned conventional problems by using ultra-low-temperature electrochemical deposition coating technology to produce end electrodes and insulating protective layers of laminated ceramic capacitors with low internal stress. Provided are a method for producing end electrodes of a laminated ceramic capacitor and a method for printing an internal electrode protective layer over the entire area, which can improve the yield of and reduce the cost.

In order to achieve the above objects, the present invention provides a method for manufacturing end electrodes of a multilayer ceramic capacitor and a method for printing an internal electrode protective layer over the entire area, at least the multilayer ceramic capacitor has a multi-layer thin film. It is constructed by mutually depositing a layered dielectric ceramic layer and multiple layers of internal electrodes, wherein the internal electrodes of the multilayer ceramic capacitor are printed on the entire area, and the terminal edges of the multilayer ceramic capacitor are densely packed with internal electrodes. Step A of preparing a multilayer ceramic capacitor with electrodes and without end electrodes after sintering, and dipping the multilayer ceramic capacitor in a metal solution with a temperature lower than 80°C by wet chemical dip coating method. Then, a step B in which a metal coating film is slowly formed on the internal electrode surface by electrochemical deposition, and a metal coating film is continuously formed on the internal electrode surface after deposition for 1 to 2 hours. a step C in which metal coating end electrodes are formed to form and connect integrally to the end edges of the multilayer ceramic capacitor to serve as connection surfaces.

According to the above embodiments of the present invention, the wet chemical immersion coating is realized by general metal plating or metal chemical plating, including metal displacement chemical plating.

According to the above embodiments of the present invention, the ratio between the internal electrodes and the dielectric ceramic layers of the multilayer ceramic capacitor is greater than 1:50.

According to the above embodiment of the present invention, the material of the electrochemically deposited metal-coated end electrode is the same metal material as the internal electrode, which can be used as an ohmic contact, or is alloyed with the internal electrode. It is the metal material that is formed.

According to the above embodiments of the present invention, the metal coating end electrode is a copper end electrode, a nickel end electrode, a copper nickel alloy end electrode, a manganin alloy end electrode or a nickel chromium silicon alloy end electrode.

According to the above embodiments of the present invention, the metal solution is copper sulfate, nickel sulfate, manganese sulfate, chromium sulfate, a silicon compound, or a combination thereof.

According to the above embodiment of the present invention, the metal coating end electrodes on both sides of the end edge of the multilayer ceramic capacitor are further oxidized into metal oxides by low temperature heat treatment at 200-300° C. to provide insulation. Step D is included as a protective layer.

According to the above embodiment of the present invention, the bonding strength between the metal coating end electrode and the dielectric ceramic layer is the bonding strength between the metal coating end electrode and the dielectric ceramic layer, and the bonding strength between the metal coating end electrode and the dielectric ceramic layer, and the internal electrode. It includes the bonding force with the metal coating end electrode.

In order to achieve the above object, the present invention provides a method for producing end electrodes of a multilayer ceramic capacitor and printing an internal electrode protective layer over the entire area, at least the multilayer ceramic capacitor is formed by thinning multiple layers. The internal electrodes of the multilayer ceramic capacitor are printed on the entire area, and high-density internal electrodes are formed on the terminal edges of the multilayer ceramic capacitor. Step A1 of preparing a multilayer ceramic capacitor having no end electrodes after being sintered, and subjecting the multilayer ceramic capacitor to immersion plating and low-temperature firing and heat treatment at a temperature lower than 200°C, Step B1 in which an aluminum end electrode is formed on the surface of the internal electrode, and a wet chemical dip coating method is used to immerse the multilayer ceramic capacitor with the aluminum end electrode in a metal solution at 60 to 80 ° C for 10 to 60 minutes. After soaking, a step C1 of converting the aluminum end electrodes of the multilayer ceramic capacitor into metal coated end electrodes corresponding to the metal solution by chemical oxidation-reduction substitution reaction.

Hereinafter, the features and technical content of the present invention will be described in detail with reference to the drawings, but the drawings and the like are for reference and explanation, and the present invention is not limited thereby.

1 to 9 are conceptual diagrams of high-density nickel internal electrodes on end edges and side edges according to the present invention, respectively, and a multilayer ceramic capacitor with high-capacitance high-density nickel internal electrodes according to the present invention and general Conceptual diagram for comparison of oxidation-reduction potential with low-nickel internal electrode multilayer ceramic capacitor, Conceptual diagram for comparison between new terminal electrode process according to the present invention and existing multilayer ceramic capacitor terminal electrode process, High capacitance according to the present invention Conceptual diagram of replacing the high-density nickel electrode on the side edge of the multilayer ceramic capacitor with a copper electrode, optical microscopic structure diagram of the copper electrode after depositing by electroplating according to the present invention, depositing by electroplating according to the present invention. The electron microscopic structure and material analysis diagram of the copper electrode when the Optical microscopic structural view when such high capacitance multilayer ceramic capacitor is immersed in a low temperature copper sulfate solution for 20 minutes to 2 hours, whereby the end electrodes are gradually converted to copper electrodes, lamination according to the present invention Conceptual diagram of when the low-temperature aluminum end electrode of a ceramic capacitor is converted into a copper electrode by oxidation-reduction chemical substitution reaction, when the entire area electrode according to the present invention is printed and then the protective insulation layers on both sides are made. and an optical microscopic structural view of a high-capacitance multi-layer ceramic capacitor with full-area printing and no Maillard reaction fabricated according to the present invention. As shown in the figure, the present invention is a method of manufacturing end electrodes of a multilayer ceramic capacitor and printing an internal electrode protective layer over the entire area, applying a multilayer ceramic capacitor (MLCC) 1, The thickness of the thinned dielectric ceramic layer 11 and the deposition of multiple layers of nickel internal electrodes 12 to produce high density electrode and ceramic ratio end and side edges to achieve the purpose of high capacitance, It is as shown in FIG.

FIG. 2 is an oxidation-reduction potential diagram when measuring a multilayer ceramic capacitor manufactured according to the present invention and a conventional multilayer ceramic capacitor by cyclic voltammetry. Figure (b) is the oxidation-reduction potential of a multi-layer ceramic capacitor with high-density nickel internal electrodes of capacitance, and FIG. As can be seen, apparently, the high capacitance multilayer ceramic capacitor according to the present invention has higher nickel internal electrodes and is made conductive, so the redox potential is higher, so that the end faces and side faces are are readily electrochemically deposited coatings.

Table 1 shows the process principle and method of the high-capacitance high-density nickel internal electrode multilayer ceramic capacitor end electrode according to the present invention, where the high-density nickel internal electrode exists at the end edge of the high-capacitance multilayer ceramic capacitor. Therefore, the end electrode can be fabricated by electrochemical deposition techniques including electroplating and chemical plating, and the material of the electrochemically deposited metal coating end electrode is similar to that of the nickel internal electrode. or a material that forms an ohmic contact with the nickel internal electrode, and the bonding force between the connecting end electrode and the dielectric ceramic layer is the same as that between the electrochemical deposition metal coating end electrode and the dielectric ceramic layer Besides the force, it also includes the bonding force between the high-density nickel internal electrodes of the multilayer ceramic capacitor and the metal-coated end electrodes of the electrochemical deposition.

FIG. 3 is a process comparison diagram of the conventional and novel multilayer ceramic capacitor end electrodes according to the present invention. The conventional process uses thick-film copper paste, forms by immersion plating process, and then forms with high-temperature nitrogen gas. The bottom sintering results in the copper electrode in the portion enclosed by dashed line A in the figure. According to the novel process of the present invention, the copper electrode 13 is obtained by electrochemical deposition dipping.

The above process of obtaining a copper electrode by electrochemical deposition immersion is shown in FIG. 4A, and FIG. A copper electrode 13a is gradually formed by chemical deposition, as shown in FIG. Further, after depositing for a predetermined time, the copper electrodes 13a on the surface of the nickel internal electrodes 12 grow and connect with each other to form the terminal edge copper electrodes 13, as shown in FIG. (c). Among them, the optical microscopic structure of the copper electrode 13 after electroplating deposition according to the present invention is as shown in FIG. 4B, and FIG. be. Electron microscopic observation structure of the copper electrode during electroplating deposition is shown in FIG. , Fig. 4C (b), (c), respectively, from the copper electrode material analysis and the nickel internal electrode material analysis, it can be clearly seen that the copper electrode and the nickel internal electrode have an excellent connection. .

The following examples illustrate the details and intent of the present invention, but the scope of the invention is not limited thereby.

[Implementation Method 1: Multilayer Ceramic Capacitor End Electrodes (I)]
In this new process, the sintered multilayer ceramic capacitor 1 without end electrodes is immersed in a copper sulfate solution 2 at a temperature of 80° C. without using copper paste or a high-temperature sintering and nitriding furnace. First, the copper electrode 13a is gradually formed on the upper end of the nickel internal electrode 12, and the formed copper electrodes 13a and 13a approach each other with the lapse of time. A surface copper electrode 13 is formed. As shown in FIG. 6, a high-capacitance multilayer ceramic capacitor is immersed in a copper sulfate solution at a temperature of 80° C. for 20 minutes to 2 hours. As shown in Table 2, the longer the immersion time, the more complete the copper electrode is formed, and the better the conductive properties of the existing thick-film copper paste. It approaches the properties of copper electrodes sintered under high-temperature nitrogen gas.

[Implementation Method 2: Multilayer Ceramic Capacitor End Electrodes (II)]
As shown in FIG. 7, according to the present invention, the multilayer ceramic capacitor 3 is subjected to immersion plating and low-temperature firing, and through heat treatment at a temperature lower than 200° C., aluminum end electrodes 31 are formed on the surfaces of the internal electrodes. , Also, according to the wet chemical immersion coating method, the multilayer ceramic capacitor 3 having the aluminum terminal electrodes 31 is immersed in a copper sulfate solution 2 at 60 to 80 ° C. for 10 to 60 minutes, and the multilayer ceramic capacitor 3 The aluminum end electrode 31 of the is turned into the copper electrode 32 of the multilayer ceramic capacitor 3 by a chemical oxidation-reduction substitution reaction, and its capacity characteristics are obtained by immersion plating with copper paste and sintering in a high-temperature reducing atmosphere nitrogen gas. Corresponds to the copper electrode of a capacitor.

[Implementation method 3: Multilayer ceramic capacitor insulating protective layer]
In the conventional high-capacitance multilayer ceramic capacitor 5, after sintering, due to the difference in density between the numerous internal electrodes 52 deposited in the center and the blank dielectric ceramic layers 51 on both sides without electrodes, Maillard reaction of protuberances occurs. Appears and looks like FIG. The solution according to the present invention is to print the electrodes on the whole area and then fabricate the insulating protective layer 43 on both sides, as shown in FIG. According to the present invention, by printing the internal electrodes 42 over the entire area, it is possible to eliminate the difference in density between the center having the internal electrodes 42 and both sides not having the internal electrodes 42 . In the production of products, not only the uniformity is high, but also the printing area can be maximized, and the purpose of large area and high capacitance can be achieved. However, the problem is that the insulating protective layers are formed on both sides of the laminated ceramic element.

Referring to FIG. 9, the insulating protective layer is applied to the side edges of both sides after immersing the multilayer ceramic element in a copper sulfate solution at a temperature of 80° C. for 1 hour, similarly to the high-capacitance copper electrode. A copper electrode is produced, as shown in FIGS. 9(a) and 9(b), and furthermore, after baking in the air at a low temperature of 250° C. for half an hour, the copper electrodes on both sides are coated with copper oxide as an insulating protective layer. 9(c), but does not adversely affect the conductivity of the nickel internal electrode. This creates a high capacitance multilayer ceramic capacitor with full area printing and no Maillard reaction.

As described above, the main technical features of the present invention are:
1. The ratio of the internal electrode layer and the dielectric ceramic layer of the multilayer ceramic capacitor is greater than 1:50, which not only increases the conductivity of the side surface of the dielectric ceramic, but also continuously forms end electrodes or side electrodes. be done.
2. The above wet chemical immersion coating technique can be achieved using general metal plating or metal chemical plating, including metal displacement chemical plating.
3. The chemical coating and the internal electrode of the laminated ceramic are copper metal or metal alloyed, so that the internal electrode and the excellent electrode connection ohmic contact are formed.
4. The bonding strength between the metal coating end electrode and the dielectric ceramic layer includes not only the bonding strength between the metal coating film and the dielectric ceramic layer, but also the bonding strength between the internal electrode and the metal coating film.
5. The chemically immersed metal coating on the side edge will be converted into metal oxide under proper heat treatment conditions to form an insulating protective layer.

Also, the differences between the present invention and the existing technology are as follows.
1. This new technology does not require thick-film conductive paste or high-temperature sintering of electrodes in a protective atmosphere. End electrodes are fabricated that are applicable to high capacitance multilayer ceramic capacitors.
2. This new technology can make an extra insulating protective layer on both sides by a low temperature (<300°C) atmospheric heat treatment process, and the bonding strength between the new process and the multilayer ceramic capacitor is mainly internal It is the bonding force between the electrode and the insulation protection layer, and since it is a low-temperature process, it does not require a printing process or a heat treatment process in a high-temperature reducing atmosphere. Excellent.

As mentioned above, the new technology is applicable to the passive device industry and also to commercial products that utilize copper electrodes instead of noble metal electrodes, such as end electrodes of multilayer ceramic capacitors in passive devices, ultra-low It is a resistive chip resistor.

As described above, the manufacturing method of the end electrode of the multilayer ceramic capacitor according to the present invention and the method of printing the internal electrode protective layer on the entire area can effectively solve the conventional defects, and the ultra-low temperature electrochemical deposition coating technology Therefore, the yield of the laminated ceramic capacitor can be improved and the cost can be reduced by producing the laminated ceramic capacitor end electrodes and the insulating protective layer with low internal stress. Therefore, the present invention is more advanced and more practical. , file a patent claim in accordance with the law.

The above is only a better embodiment of the present invention, and the present invention is not limited thereby, equivalent changes and All modifications are included within the scope of the claims of the present invention.

1 is a conceptual diagram of high-density nickel internal electrodes on end and side edges of the present invention; FIG. FIG. 2 is a conceptual diagram for comparison of oxidation-reduction potentials of the high-capacitance high-density nickel internal electrode multilayer ceramic capacitor according to the present invention and a general low-nickel internal electrode multilayer ceramic capacitor; FIG. 4 is a conceptual diagram for comparison between the new terminal electrode process according to the present invention and the existing multilayer ceramic capacitor terminal electrode process; FIG. 4 is a conceptual diagram of replacing the high-density nickel electrode on the side edge of the high-capacitance multi-layer ceramic capacitor with a copper electrode according to the present invention; FIG. 2 is an optical microstructure view of a copper electrode after being electroplated and deposited according to the present invention; FIG. 3 is an electron microscopic structure and material analysis diagram of a copper electrode deposited by electroplating according to the present invention; FIG. 4 is a conceptual diagram of when the high-capacitance multilayer ceramic capacitor according to the present invention is immersed in a low-temperature copper sulfate solution and converted into copper electrodes; FIG. 4 is an optical microscopic view of the high-capacitance multilayer ceramic capacitor according to the present invention being immersed in a low-temperature copper sulfate solution for 20 minutes to 2 hours, so that the end electrodes are gradually converted into copper electrodes; FIG. 4 is a conceptual diagram of when the low-temperature aluminum end electrodes of the multilayer ceramic capacitor according to the present invention are converted into copper electrodes by oxidation-reduction chemical substitution reaction; FIG. 4 is a conceptual diagram of forming protective insulating layers on both sides after printing the entire area electrode according to the present invention; 1 is an optical microscopic structural view of a high-capacitance multi-layer ceramic capacitor with full-area printing and no Maillard reaction fabricated according to the present invention; FIG. 1 is a conceptual diagram of a conventional end edge and side edge low-density nickel internal electrode; FIG. FIG. 2 is a conceptual diagram when a protruding Maillard reaction appears after sintering a conventional high-capacitance multilayer ceramic capacitor;

(part of the invention)
1 laminated ceramic capacitor 11 dielectric ceramic layer 12 internal electrode 13 copper electrode 13a copper electrode 2 copper sulfate solution 3 laminated ceramic capacitor 31 aluminum end electrode 32 copper electrode 4 laminated ceramic capacitor 42 internal electrode 43 insulating protective layer A dashed line (conventional part )
5 laminated ceramic capacitor 51 dielectric ceramic layer 52 internal electrode 53 copper electrode

Claims (9)

at least,
A multilayer ceramic capacitor is constructed by mutually depositing multiple layers of thinned dielectric ceramic layers and multiple layers of internal electrodes, and the internal electrodes of the multilayer ceramic capacitor are printed over the entire area, A step A of preparing a multilayer ceramic capacitor having high-density internal electrodes at the end edges of the multilayer ceramic capacitor and having no end electrodes after being sintered ;
immersing the multilayer ceramic capacitor in a metal solution with a temperature lower than 80° C. by a wet chemical dip coating method to slowly form a metal coating on the internal electrode surface by electrochemical deposition; B and
After depositing for 1-2 hours, the surface of the internal electrode is continuously coated with a metal coating to be connected together, and the end edge of the multilayer ceramic capacitor is formed with a metal coating end electrode that serves as a connection surface. a step C being performed ;
Furthermore,
a step D of oxidizing the metal-coated end electrodes on the end edges on both sides of the multilayer ceramic capacitor to metal oxides by low-temperature heat treatment at 200° C. to 300° C. to form insulating protection layers .
A method for producing end electrodes of a laminated ceramic capacitor and printing an internal electrode protective layer over the entire area thereof. In the method of manufacturing the end electrodes of the laminated ceramic capacitor according to claim 1 and printing the internal electrode protective layer over the entire area ,
The wet chemical immersion coating is realized by general metal plating or metal chemical plating including metal substitution chemical plating
A method for producing end electrodes of a laminated ceramic capacitor and printing an internal electrode protective layer over the entire area thereof. In the method of manufacturing the end electrodes of the laminated ceramic capacitor according to claim 1 and printing the internal electrode protective layer over the entire area ,
The ratio of the internal electrodes to the dielectric ceramic layers of the multilayer ceramic capacitor is greater than 1:50.
A method for producing end electrodes of a laminated ceramic capacitor and printing an internal electrode protective layer over the entire area thereof. In the method of manufacturing the end electrodes of the laminated ceramic capacitor according to claim 1 and printing the internal electrode protective layer over the entire area ,
The material of the metal coating end electrode by the electrochemical deposition is the same metal material as the internal electrode, which can be used as an ohmic contact, or is a metal material with which an alloy is formed with the internal electrode.
A method for producing end electrodes of a laminated ceramic capacitor, and printing an internal electrode protective layer over the entire area. In the method for manufacturing the end electrodes of the laminated ceramic capacitor according to any one of claims 1 to 4 and for printing the internal electrode protective layer over the entire area ,
The metal-coated end electrode is a copper end electrode , a nickel end electrode, a copper-nickel alloy end electrode, a manganin alloy end electrode , or a nickel-chromium-silicon alloy end electrode .
A method for producing end electrodes of a laminated ceramic capacitor and printing an internal electrode protective layer over the entire area thereof. In the method of manufacturing the end electrodes of the laminated ceramic capacitor according to claim 1 and printing the internal electrode protective layer over the entire area ,
The metal solution is copper sulfate, nickel sulfate, manganese sulfate, chromium sulfate, silicon compounds , or combinations thereof
A method for producing end electrodes of a laminated ceramic capacitor and printing an internal electrode protective layer over the entire area thereof. In the method of manufacturing the end electrodes of the laminated ceramic capacitor according to claim 1 and printing the internal electrode protective layer over the entire area ,
The bonding strength between the metal coating end electrode and the dielectric ceramic layer is the bonding strength between the metal coating end electrode and the dielectric ceramic layer and the bonding strength between the internal electrode and the metal coating end electrode. power included
A method for producing end electrodes of a laminated ceramic capacitor and printing an internal electrode protective layer over the entire area thereof. at least,
The laminated ceramic capacitor is configured by mutually depositing a plurality of thin dielectric ceramic layers and a plurality of layers of internal electrodes, and the internal electrodes of the laminated ceramic capacitor are printed over the entire area, Step A1 of preparing a multilayer ceramic capacitor having high-density internal electrodes at the end edges of the multilayer ceramic capacitor and having no end electrodes after being sintered;
a step B1 in which the multilayer ceramic capacitor is subjected to immersion plating and low-temperature firing, and after heat treatment at a temperature lower than 200° C. , aluminum end electrodes are formed on the surfaces of the internal electrodes;
Using a wet chemical immersion coating method, the laminated ceramic capacitor with the aluminum end electrodes is immersed in a metal solution at 60 to 80°C for 10 to 60 minutes, and then the aluminum end electrodes of the laminated ceramic capacitor are subjected to chemical oxidation-reduction. a step C1 of converting the metal solution into a corresponding metal coating edge electrode by a substitution reaction;
A method for producing end electrodes of a laminated ceramic capacitor and printing an internal electrode protective layer over the entire area thereof. In the method of manufacturing the end electrodes of the laminated ceramic capacitor according to claim 8 and printing the internal electrode protective layer over the entire area ,
The ratio of the internal electrodes and dielectric ceramic layers of the multilayer ceramic capacitor is greater than 1:50,
A method for producing end electrodes of a laminated ceramic capacitor and printing an internal electrode protective layer over the entire area thereof.

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