JP7202590B2 - Circular saw processing thickness measurement method and circular saw adjustment method - Google Patents

Description

The present invention relates to a method for measuring the processed thickness of a circular saw such as a tipped saw or a metal saw, and a method for adjusting a circular saw in a biaxial cutting device.

A cutting device having a circular saw, such as a chipped saw or a metal saw, is used to cut workpieces such as steel and wood. A general cutting device is provided with one circular saw, and cutting is performed by relatively moving the workpiece with respect to the circular saw rotated in one direction. However, in the case of such a cutting method (single-axis cutting method), the blade of the circular saw penetrates only one side of the workpiece, so the opposite side, that is, the side where the circular saw comes off, has burrs. Chipping is likely to occur.

On the other hand, a cutting method (biaxial cutting method) using a cutting device having two circular saws, a circular saw for hair pulling and a circular saw for cutting, is known (see Patent Document 1). In this biaxial cutting method, first, a groove is formed on one side of the workpiece (the side where the circular saw for cutting comes off) with a circular saw for hair pulling, and then the material is cut along the groove with a circular saw for cutting. This method cuts the material to be processed. In this case, since the blade of the circular saw penetrates into both sides of the workpiece, there is no side to come off. Therefore, burrs and chipping unlike the uniaxial cutting method are less likely to occur, and defective products can be suppressed and the repair process can be reduced.

JP-A-2000-15601

The biaxial cutting method described above is particularly used for the processing of luxury home kitchens, washstands, furniture, commercial display fixtures, and the like. In recent years, along with the demand for higher quality, high-precision processing by cutting is required. In the case of the biaxial cutting method, the grooves formed by the hair pulling circular saw remain as steps in the workpiece after cutting. Therefore, in order to improve the quality of products, it is desirable to control the size of the step with high accuracy. Since this step is caused by the difference in thickness between the sawing circular saw and the cutting circular saw, it is necessary to manage the thickness of each circular saw.

However, little is known about how to measure the machining thickness of a circular saw. For example, it is conceivable to use a projector to measure the machining thickness from the projected image of the circular saw, but the measurement requires time and effort, which is not preferable in terms of workability.

Moreover, in recent years, in addition to quality improvement, there is an increasing demand for cost reduction by grinding (reusing) circular saws. However, when the two blades used in the biaxial cutting device are ground, the thickness of each blade tends to be out of balance, and the permissible amount of distortion is limited. .

SUMMARY OF THE INVENTION It is an object of the present invention to provide a measuring method capable of quickly and accurately measuring the machining thickness of a circular saw, and a method of adjusting a circular saw in a biaxial cutting device. and

The method for measuring the processed thickness of a circular saw according to the present invention is a method using a laser device having an irradiating section for irradiating a laser and a light receiving section arranged opposite to the irradiating section. A circular saw having a plurality of formed blades is placed so that the tips of the blades of the circular saw are positioned in a laser irradiation region between the irradiation unit and the light receiving unit, and the laser is irradiated. The machining thickness of the circular saw is measured while rotating the circular saw.

In the present invention, the "processing thickness" of a circular saw includes not only the thickness of the blade of the circular saw (blade thickness), but also the misalignment between each blade (relative mounting error between each blade) and the distortion that occurs in the saw. This value includes blade runout caused by , and indicates the maximum width of the circular saw during rotation. For example, if the cutting device is normal, grooves having a width equal to the processing thickness of the circular saw are formed when grooving the workpiece.

The measuring method is characterized in that a dial gauge is brought into contact with a position near the outer periphery of the lower surface of the circular saw placed horizontally, and the circular saw is rotated while the dial gauge is in contact.

The circular saw is rotated 1 round to 1.5 rounds at a rotational speed of 10 min ⁻¹ to 100 min ⁻¹ .

It is characterized in that the blade of the circular saw is rotated while being heated.

A method for adjusting a circular saw according to the present invention is a circular cutting device in a biaxial cutting device in which a groove is formed on one side of a work material by a circular saw for hair pulling, and the work material is cut along the groove by a circular saw for cutting. A method for adjusting a saw, comprising: a measuring step of respectively measuring the processed thickness of the circular saw for hair pulling and the processed thickness of the circular saw for cutting; and an adjustment step of adjusting the distortion or blade thickness of the circular saw and the circular saw for cutting, and the measuring step is the method of measuring the processed thickness of the circular saw according to the present invention.

The method for measuring the processed thickness of a circular saw according to the present invention is a method using a laser device. Since the circular saw is rotated while irradiating the laser to measure the processed thickness of the circular saw, the measurement can be performed more quickly than, for example, a measuring method using a projector. In addition, by rotating the circular saw while irradiating the laser, that is, by continuously passing each blade edge through the laser irradiation area and measuring it, in addition to the blade thickness, the thickness unevenness of the side of the blade and the thickness of the circular saw Since it is possible to take into account the deviation of the brazing position of the blade caused by impact during use and the blade runout due to the distortion of the saw, it is possible to perform more accurate thickness control.

Since the circular saw is rotated while the dial gauge is in contact with the lower surface of the circular saw placed horizontally, it can be judged as a measurement failure when an abnormal value is detected, and the reliability of the processed thickness is increased. can increase For example, if a temporary excessive displacement is detected during the measurement, the measurement can be taken again.

Since the circular saw is rotated 1 to 1.5 times at a rotational speed of 10 min ^-1 to 100 min ^-1 , it is possible to secure safety while enabling quick measurement.

By rotating the blade of the circular saw while heating it, the dust and dirt adhering to the blade of the circular saw can be removed and the thickness of the saw can be measured with high accuracy.

The method for adjusting a circular saw according to the present invention includes a measuring step of measuring the processed thickness of a circular saw for hair pulling and the processed thickness of a circular saw for cutting by the measuring method of the present invention, and the difference between the measured processed thicknesses. and an adjustment process for adjusting the distortion or blade thickness of the circular saw for hair pulling and the circular saw for cutting based on the above, so that the circular saw can be reused in a biaxial cutting device that requires more accurate thickness control. , contribute to cost reduction.

FIG. 2A is a plan view of a circular saw, which is an object of the measuring method of the present invention; It is a top view for demonstrating the schematic structure of the measuring method of this invention. 3A and 3B are views of the schematic configuration of FIG. 2 as viewed from the side; It is a figure for demonstrating the processing thickness in this invention. It is a figure for demonstrating schematic structure of a biaxial cutting device. 6 is a cross-sectional view taken along the line AA of FIG. 5 and the like.

An example of a circular saw to be measured in the present invention will be described with reference to FIG. FIG. 1(a) shows a plan view of the entire circular saw, and FIG. 1(b) shows an enlarged view around the blade of the circular saw. As shown in FIG. 1( a ), the circular saw 1 has a substantially disk-shaped substrate 2 and a plurality of blades 4 formed on the outer peripheral edge of the substrate 2 . A mounting hole 3 is formed in the center of the circular saw 1 (substrate 2), and the circular saw shaft (not shown) of the cutting device is inserted into this mounting hole 3. As shown in FIG. The outer diameter D of the circular saw 1 is not particularly limited, and is, for example, 100 mm to 800 mm, preferably 100 mm to 400 mm.

In the circular saw 1, a plurality of blades 4 are provided at a predetermined pitch in the circumferential direction. A circular saw 1 in FIG. The hard tip has excellent wear resistance, and is made of, for example, cermet or cemented carbide obtained by sintering tungsten carbide and cobalt. Note that the object to be measured in the present invention is not limited to the tipped saw, and may be a metal saw.

As shown in FIG. 1(b), each blade 4 has a rake face 4a from which chips flow out during cutting, and a flank face 4b substantially perpendicular to the rake face 4a. Each blade 4 is fixed to a blade chamber at the outer peripheral edge of the substrate 2 with silver brazing or the like.

Next, the measuring method of the present invention will be described with reference to FIG. This measurement method uses a laser device to measure the thickness of a circular saw. FIG. 2 is a view of the laser device and the circular saw to be measured from above in the vertical direction. As shown in FIG. 2, the circular saw 1 is placed horizontally with the rotary shaft 8a of the turntable inserted through the mounting hole 3. As shown in FIG. The laser device 5 has an irradiation section 6 for irradiating a laser and a light receiving section 7 for receiving the irradiated laser. The irradiating section 6 is arranged so as to irradiate a laser beam in a direction perpendicular to the axial direction of the circular saw 1 (horizontal direction in FIG. 2). In other words, the irradiating section 6 irradiates the laser in a direction parallel to the rotating direction of the circular saw 1 .

In FIG. 2, the circular saw 1 is placed so that the tip of the blade 4 is positioned within the laser irradiation region R. As shown in FIG. The laser device 5 is a light transmission sensor, and detects a portion where the laser emitted from the irradiation unit 6 is blocked by the tip of the blade 4 as a step. In this case, a predetermined range from the tip of each blade 4 may be irradiated, for example, a portion of 1 mm to 3 mm from the tip of each blade 4 may be irradiated. As the laser device, for example, a two-dimensional high-speed dimension measuring device TM-3000 manufactured by Keyence Corporation can be used.

In the present invention, as shown in FIG. 2, the circular saw 1 is rotated in the direction X while irradiating the laser. At this time, the circular saw 1 may be rotated manually, or may be rotated by a motor whose rotation is controllable. Further, the rotation speed of the circular saw 1 is not particularly limited as long as it rotates continuously, not intermittently. From the viewpoint of quickness and safety, the rotation speed is preferably 10 min ^-1 to 100 min ^-1 , more preferably 30 min ^-1 to 100 min ^-1 .

At the time of measurement, the circular saw 1 may be rotated one turn or more, preferably one to 1.5 turns. Further, by rotating the blade 4 of the circular saw 1 while heating it, it is possible to remove dust and dirt from the blade 4 of the circular saw 1, which is preferable. As a heating method, a method of directly heating the blade immediately before entering the laser irradiation region R with a gas burner or the like can be adopted. Moreover, as shown in FIG. 2, it is preferable to rotate the circular saw 1 in a direction (direction X) opposite to the direction of rotation during cutting from the standpoint of safety.

2, the dial gauge 9 is brought into contact with the lower surface 2a (see FIG. 3) of the base plate 2 at a position near the outer periphery while the circular saw 1 is rotating during measurement. The position closer to the outer periphery means a position closer to the outer periphery than the central position between the inner edge of the substrate 2 (the boundary with the mounting hole 3 ) and the tip of the blade 4 in the radial direction of the circular saw 1 . That is, the dial gauge 9 is arranged outside the imaginary circle C in FIG.

FIG. 3A shows a side view of the schematic configuration of FIG. 2 as seen from the light receiving section side. As shown in FIG. 3A, the measuring pin 9a of the dial gauge 9 is brought into contact with the lower surface 2a of the base plate 2 to measure deflection (displacement) of the circular saw 1 during rotation. The dimension by which the substrate 2 moves in the thickness direction due to the vibration of the circular saw 1 is measured by moving the measuring pin 9a along with the substrate 2 in the thickness direction. For example, when the circular saw 1 is mounted on the turntable 8, the circular saw 1 may be tilted. Even in such a case, by separately detecting the vibration of the circular saw during rotation with the dial gauge 9, it is possible to judge that the measurement is defective and re-measure the thickness when an abnormal value is detected. can. Thereby, the reliability of the measured processed thickness can be improved. Furthermore, by arranging the dial gauge 9 near the outer circumference, which is susceptible to rotational vibration caused by the inclination of the circular saw, such defects can be detected more easily.

FIG. 3(b) is a view of the blade of the circular saw viewed from the rake face side. The blade 4 in FIG. 3(b) is a D-type blade defined in JIS B4805. The blade thickness t of the blade 4 is the distance between the upper end portion 4c and the lower end portion 4d of the rake face 4a, and corresponds to the maximum thickness of the blade 4. The blade thickness t is, for example, 1 mm to 5 mm. The laser is irradiated at least to the tip of the blade 4 (a portion including the maximum thickness portion of the blade 4 from the tip). In addition to the D type, the blade shape of the blade 4 may be B type (flat blade), C type (alternating blade), A type (combination of alternating blade and flat blade), or the like.

Next, the processing thickness of the present invention will be described based on FIG. FIG. 4 is an image diagram showing the relationship between the elapsed time during measurement and the displacement of the blade. L1 in the figure represents the displacement of the upper end portion 4c of the blade 4 (see FIG. 3(b)) relative to the reference line L0, and L2 represents the lower end portion 4d of the blade 4 relative to the reference line L0 (FIG. 3(b)). reference). In this case, the distance between L1 and L2 corresponds to the blade thickness t. As shown in FIG. 4, the position of each blade during rotation fluctuates with respect to the reference line L0 due to positional deviation between the blades and blade runout. Considering this, in the present invention, the distance between the highest point P1 of the displacement line L1 and the lowest point P2 of the displacement line L2 is measured as the machining thickness T of the circular saw. This makes it possible to measure the thickness of the circular saw blade during rotation, including the positional deviation and runout between the blades (cutting thickness).

The measuring method of the present invention can be widely applied to circular saws used in general cutting devices. Since the present invention can measure the thickness of the workpiece with high accuracy, it is preferably applied to a circular saw of a cutting apparatus that requires a high degree of dimensional control of the workpiece. For example, it is preferably applied to a circular saw of a biaxial cutting device.

Here, an example of the biaxial cutting device will be described with reference to FIG. As shown in FIG. 5, the biaxial cutting device 10 includes a hair pulling circular saw 11, a cutting circular saw 12, a saw base 13, a rail 14, and a table 16 on which a workpiece 15 is placed. It has Circular saws 11 and 12 are attached to the saw base 13, and they move along the conveying direction Y on the rail 14 together. The hair pulling circular saw 11 is arranged downstream in the conveying direction, and the cutting circular saw 12 is arranged upstream in the conveying direction. Circular saws 11 and 12 are individually rotationally driven by motors (not shown), and both shafts rotate in advantageous rotational directions (opposite directions in FIG. 5) with respect to both surfaces of workpiece 15 .

A biaxial cutting device 10 in FIG. 5 is a so-called running saw or panel saw, and is a device for cutting by moving circular saws 11 and 12 with respect to a workpiece 15 . As the biaxial cutting device, a device in which the positions of the circular saw for hair pulling and the circular saw for cutting are fixed and the workpiece is moved and cut with respect to these circular saws may be used.

Next, FIG. 6(a) shows a cross-sectional view taken along line AA of FIG. As shown in FIG. 6(a), the hair pulling circular saw 11 is arranged so as to slightly protrude above the lower surface 15a of the workpiece 15 so that the blade cuts the hair pulling into the lower surface 15a of the workpiece 15. As shown in FIG. there is A groove 15 b is formed in the workpiece 15 by pulling the workpiece 15 by the preceding circular saw 11 . By moving the circular cutting saw 12 along the center of the groove 15b in the width direction, the workpiece 15 is cut into two.

The workpieces 17 and 18 after cutting are shown in FIG. 6(b). A step 17a remains on one side of the processed material 17 due to hair pulling. The width Wa of the stepped portion 17a is preferably small in terms of appearance, and is preferably about 0.05 mm, for example. That is, in this case, it is preferable that the difference (ΔT) between the processing thickness of the circular saw for pulling and the processing thickness of the circular saw for cutting be about 0.1 mm. On the other hand, if ΔT is made small in order to reduce the width Wa, there is a possibility that one side of the material to be processed is not haired when the position of the circular cutting saw 12 is displaced from the center of the groove. Insufficient hair pulling leads to the occurrence of burrs and chipping. Therefore, the lower limit of ΔT is set to, for example, 0.04 mm.

A method for adjusting a circular saw according to the present invention is a method for adjusting the distortion or blade thickness of a circular saw in a biaxial cutting device. Specifically, a measurement process for measuring the thickness of the circular saw for pulling and the thickness of the circular saw for cutting, and the difference between the measured thicknesses of the circular saw for pulling and the circular saw for cutting. and an adjusting step of adjusting the distortion or blade thickness of the blade. The method for measuring each processed thickness is as described above.

In the above adjustment process, first, the difference (ΔT) in the machining thickness of each circular saw is calculated. Then, it is determined whether or not ΔT is within a predetermined range (for example, a range of 0.06 mm to 0.1 mm). At this time, if the difference in processing thickness is appropriate, the distortion of the circular saw or the thickness of the blade is not adjusted. On the other hand, if the processing thickness difference is not appropriate, that is, if ΔT is not within the predetermined range, strain adjustment or blade thickness adjustment is performed. For distortion adjustment, known distortion adjustment means can be employed. For example, hammering is corrected manually or mechanically. Also, if there is no distortion and the difference in processed thickness is not appropriate, regrinding or the like is performed to adjust the blade thickness. In this case, the thickness of the blade can be reduced by polishing the outer peripheral surface of the blade, and the difference in processed thickness can be adjusted within a desired range. In addition, in the method for adjusting a circular saw of the present invention, for example, since the above-described measurement process is performed after polishing (sharpening) the blade, in the case of a non-distorted product that is not appropriate, the correction value based on the processed thickness is again adjusted. Consider and polish.

INDUSTRIAL APPLICABILITY The measuring method of the present invention can be used to measure the machining thickness of a circular saw quickly and accurately, so it can be widely used for measuring the machining thickness of a circular saw. In particular, it is suitable for measuring the processed thickness of a circular saw for hair pulling and a circular saw for cutting of a biaxial cutting device that requires thickness control. In addition, since the distortion of the circular saw is adjusted based on the difference in the processed thickness of the circular saw, the ideal thickness difference of the circular saw in the biaxial cutting device is preserved, and the circular saw is not shipped with distortion, so the circular saw is used. The operator can easily adjust when replacing the blade.

1 Circular saw 2 Board 3 Mounting hole 4 Blade 5 Laser device 6 Irradiating part 7 Light receiving part 8 Rotating table 9 Dial gauge 10 2-axis cutting device 11 Circular saw for hair pulling 12 Circular saw for cutting 13 Saw table 14 Rail 15 Work material 16 table 17 processed material 18 processed material

Claims (4)

A method using a laser device having an irradiation unit for irradiating a laser and a light receiving unit arranged opposite to the irradiation unit,
A circular saw having a substrate and a plurality of blades formed on the outer peripheral edge of the substrate is placed so that the tips of the blades of the circular saw are positioned in a laser irradiation area between the irradiation unit and the light receiving unit. Then, while irradiating the laser, the circular saw is rotated 1 to 1.5 times at a rotational speed of 10 min ^-1 to 100 min ^-1 to measure the processed thickness of the circular saw. Method of measuring the processing thickness of. A method using a laser device having an irradiation unit for irradiating a laser and a light receiving unit arranged opposite to the irradiation unit,
A circular saw having a substrate and a plurality of blades formed on the outer peripheral edge of the substrate is placed so that the tips of the blades of the circular saw are positioned in a laser irradiation area between the irradiation unit and the light receiving unit. and rotating the blade of the circular saw while irradiating it with the laser to measure the thickness of the machined thickness of the circular saw. The measuring method is characterized in that a dial gauge is brought into contact with a position near the outer circumference of the lower surface of the circular saw placed horizontally, and the circular saw is rotated while the dial gauge is in contact with the circular saw. 3. The method for measuring the working thickness of a circular saw according to claim 1 or claim 2 . A method for adjusting a circular saw in a biaxial cutting device in which a groove is formed on one side of a work material by a circular saw for hair pulling and the work material is cut along the groove by a circular saw for cutting,
a measurement step of respectively measuring the processed thickness of the circular saw for hair pulling and the processed thickness of the circular saw for cutting; and an adjusting step of adjusting the distortion or blade thickness of
The measurement step is a method using a laser device having an irradiation unit that irradiates a laser and a light receiving unit that is arranged opposite to the irradiation unit. The hair-pulling circular saw and the cutting circular saw are placed so that the tips of the blades of each circular saw are positioned in the laser irradiation area between the irradiation unit and the light receiving unit, and the laser is A method for adjusting a circular saw , wherein each of the circular saws is rotated while being irradiated to measure the processed thickness of the circular saw for hair pulling and the circular saw for cutting .

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