JP7177623B2 - A method for producing a resin molded article, a resin molded article, and its use. - Google Patents

Description

TECHNICAL FIELD The present invention relates to a method for producing a resin-molded article, and more specifically to a method for producing a resin-molded article such as a resin-encapsulated semiconductor element by compression molding using a process release film.

In the method of manufacturing a semiconductor element, etc., a method of resin-molding a semiconductor chip or the like involves placing the semiconductor chip or the like in a predetermined position in a mold and filling the mold with a curable resin. A method of curing by transfer molding or compression molding is known (see, for example, Patent Document 1).
In recent years, large-capacity NAND flash memories are increasing. This type of element has a large overall thickness because memory chips are stacked in multiple stages. Therefore, the cavities of the molds for manufacturing them are also getting deeper. When the release film is used in the compression molding method, the release film placed on the surface of the mold is stretched once and then contracted. The problem of wrinkles becomes more pronounced as the cavity of the mold becomes deeper, and in some cases, a phenomenon occurs in which the wrinkled release film bites into the curable resin and does not release from the mold. That is, in the process of manufacturing thick devices such as large-capacity NAND-type flash memories, peeling defects and poor appearance due to wrinkles are more serious problems, and solutions to these problems have been strongly desired.
As a countermeasure for preventing delamination defects and appearance defects when resin-molding a semiconductor chip or the like, it has been proposed to improve the mold design (see, for example, Patent Document 2). However, this countermeasure complicates the structure of the mold and limits the degree of freedom in mold design, so there are limits to applicable processes and materials.
In addition, with regard to prevention of wrinkles during expansion and contraction, it has been proposed to use an ethylene-tetrafluoroethylene copolymer film having specific physical properties as a process release film (see, for example, Patent Document 3). However, there is still room for further improvement in terms of preventing poor peeling.
Also, in the case of resin-molding articles other than semiconductor chips by compression molding, the same problem occurs when molding articles with a large thickness, and effective countermeasures against delamination failure have been desired.

JP-A-2004-74461 JP-A-2005-225133 International Publication No. 2018/008562 A1 Pamphlet

In view of the limitations of the prior art described above, the present invention provides a method for manufacturing a resin-molded product by resin-molding an article such as a semiconductor chip by compression molding. To provide a method for producing a resin-molded product, which can be easily released without depending on a mold release agent or the like, and can obtain a molded product without appearance defects such as wrinkles and resin chipping. .

As a result of intensive studies, the present inventors have found that the inner surface of the cavity recess provided in the lower mold is covered with a mold release film for processing, and the cavity recess is supplied with a resin for molding, and the upper mold and the lower mold A method of manufacturing a resin-molded product in which the product is clamped and compression-molded, or the inner surface of the cavity recess provided in the upper mold is covered with a release film for processing, and the resin for molding and the product to be molded in the lower mold In the method of manufacturing a resin molded product in which the product is clamped between the upper mold and the lower mold while the product is being supplied and compression molding is performed, by using a release film for processing that has specific physical properties, peeling can be achieved. The inventors have found that defects and appearance defects can be effectively suppressed, and have completed the present invention.
That is, the first aspect of the present invention is
[1]
In a state in which the inner surface of the cavity recess provided in the lower mold is covered with a process release film and the mold resin is supplied to the cavity recess, the article to be molded is clamped between the upper mold and the lower mold. A method for manufacturing a resin molded product by compression molding,
The release film for process, the resin for molding, and the article to be molded are set in a mold, and the release film for process is sucked from the lower mold side to follow the inner surface of the cavity recess. the step of adsorbing;
Optionally, in a state in which the upper mold and the lower mold are brought into contact with each other to form a cavity air-sealed with the outside, the cavity is evacuated by an air suction mechanism through a flow path provided in communication with the cavity. and a step of clamping the upper mold and the lower mold to a compression molding position, curing the molding resin, and compression molding the molded product in this order,
The tensile strength in at least one direction of the process release film is 1.0 MPa to 10.0 MPa when stretched 37.5% at 100 mm / min at a temperature of 175 ° C.,
And the process release film was stretched by 37.5% in at least one direction under the same conditions, then rested for 2 minutes, and then returned to the origin direction at 100 mm / min in the compression direction. The method for producing the resin molded product, wherein the recovery rate (%) obtained from a certain return value according to the following formula (1) is 30 to 80 (%).
Return value/extension length×100=restoration rate % (1).

In addition, the second aspect of the present invention is such that the roles of the upper mold and the lower mold in the first aspect are almost interchanged, and more specifically,
[2]
In a state in which the inner surface of the cavity recess provided in the upper mold is covered with a process release film, and the resin for molding and the article to be molded are supplied to the lower mold, the upper mold and the lower mold are used to perform the molding. A method for manufacturing a resin molded product by clamping and compression molding the product,
The release film for process, the resin for the mold, and the article to be molded are set in a mold, and the release film for process is sucked from the upper mold side to follow the inner surface of the cavity recess. the step of adsorbing;
Optionally, in a state in which the upper mold and the lower mold are brought into contact with each other to form a cavity air-sealed with the outside, a vacuum is drawn from the cavity by an air suction mechanism through a flow path provided communicating with the cavity. a step of evacuating, and a step of clamping the upper mold and the lower mold to a compression molding position, curing the molding resin, and compression molding the molded product in this order,
The tensile strength in at least one direction of the process release film is 1.0 MPa to 10.0 MPa when stretched 37.5% at 100 mm / min at a temperature of 175 ° C.,
And the process release film was stretched by 37.5% in at least one direction under the same conditions, then rested for 2 minutes, and then returned to the origin direction at 100 mm / min in the compression direction. The method for producing the resin-molded product, wherein the recovery rate (%) obtained from a certain return value according to the above formula (1) is 30 to 80 (%).

Furthermore, the following [3] to [12] are all preferable aspects or embodiments of the present invention.
[3]
The molding resin is supplied to the process release film outside the mold, and the molding resin is carried into the mold together with the process release film to perform resin molding. The method for producing a resin molded product according to [1] or [2].
[4]
The method for producing a resin-molded article according to any one of [1] to [3], wherein the article to be molded includes a semiconductor chip.
[5]
The method for producing a resin-molded article according to any one of [1] to [3], wherein the article to be molded is a substrate on which a plurality of semiconductor chips are mounted, a semiconductor wafer, or a lead frame.
[6]
The difference in the depth of the cavity before and after the step of clamping the upper mold and the lower mold to a compression molding position, curing the molding resin, and compression molding the molded product is 1.0 mm or more. The method for producing a resin molded product according to any one of [1] to [5].
[7]
The cavity depth after the step of clamping the upper mold and the lower mold to a compression molding position, curing the molding resin, and compression molding the molded product is 0.5 mm or more. , The method for producing a resin molded product according to any one of [1] to [6].
[8]
The maximum temperature in the step of clamping the upper mold and the lower mold to a compression molding position, curing the molding resin, and compression molding the molded product is 110 to 190° C. [1] The method for producing a resin molded product according to any one of [7].
[9]
The resin according to any one of [1] to [8], wherein the molding resin contains at least one resin selected from the group consisting of epoxy resins, polyimide resins, and silicone resins. A method of manufacturing a molded product.
[10]
The method for producing a resin molded product according to any one of [1] to [9], wherein the contact angle of water on at least one surface of the process release film is from 90 ° to 130 °. 11]
A resin-encapsulated semiconductor device manufactured by the manufacturing method according to any one of [1] to [10].
[12]
An electric/electronic device or transport machine, comprising the resin-encapsulated semiconductor according to [11].

In addition, the above-mentioned problem is solved by the manufacturing method described in [1] or [2] above, wherein the release film for process includes at least a release layer A and a heat-resistant resin layer B, and the heat-resistant resin layer B At a temperature of 175 ° C., after stretching 37.5% in at least one direction at 100 mm / min, after resting for 2 minutes, when returning to the origin direction at 100 mm / min in the compression direction, the return is the displacement until the load becomes 0. From the values, it can also be solved by a method in which the recovery rate (%) obtained according to the following formula (1) is 30 to 80 (%).
Return value/extension length x 100 = recovery rate % (1)
More specifically, the problem can also be solved by the manufacturing method of [13] or [14] below.
[13]
In a state in which the inner surface of the cavity recess provided in the lower mold is covered with a process release film and the mold resin is supplied to the cavity recess, the article to be molded is clamped between the upper mold and the lower mold. A method for manufacturing a resin molded product by compression molding,
The release film for process, the resin for molding, and the article to be molded are set in a mold, and the release film for process is sucked from the lower mold side to follow the inner surface of the cavity recess. the step of adsorbing;
Optionally, in a state in which the upper mold and the lower mold are brought into contact with each other to form a cavity air-sealed with the outside, the cavity is evacuated by an air suction mechanism through a flow path provided in communication with the cavity. and a step of clamping the upper mold and the lower mold to a compression molding position, curing the molding resin, and compression molding the molded product in this order,
The process release film includes at least a release layer A and a heat-resistant resin layer B, and after elongation of the heat-resistant resin layer B by 37.5% in at least one direction at a temperature of 175 ° C. and 100 mm / min, After resting for 2 minutes, when returning to the origin direction at 100 mm / min in the compression direction, the return value, which is the displacement until the load becomes 0, is obtained according to the following formula (1). The recovery rate (%) is 30. Method for manufacturing the above resin molded product, which is ~80 (%) Return value/elongation length×100=restoration rate % (1).
[14]
In a state in which the inner surface of the cavity recess provided in the upper mold is covered with a process release film, and the resin for molding and the article to be molded are supplied to the lower mold, the upper mold and the lower mold are used to perform the molding. A method for manufacturing a resin molded product by clamping and compression molding the product,
The release film for process, the resin for the mold, and the article to be molded are set in a mold, and the release film for process is sucked from the upper mold side to follow the inner surface of the cavity recess. the step of adsorbing;
Optionally, in a state in which the upper mold and the lower mold are brought into contact with each other to form a cavity air-sealed with the outside, a vacuum is drawn from the cavity by an air suction mechanism through a flow path provided communicating with the cavity. a step of evacuating, and a step of clamping the upper mold and the lower mold to a compression molding position, curing the molding resin, and compression molding the molded product in this order,
The process release film includes at least a release layer A and a heat-resistant resin layer B, and after elongation of the heat-resistant resin layer B by 37.5% in at least one direction at a temperature of 175 ° C. and 100 mm / min, After resting for 2 minutes, when returning to the origin direction at 100 mm / min in the compression direction, the return value, which is the displacement until the load becomes 0, is obtained according to the following formula (1). The recovery rate (%) is 30. Method for manufacturing the above resin molded product, which is ~80 (%) Return value/elongation length×100=restoration rate % (1).
In addition, as preferred aspects and embodiments of the production method of [13] or [14] above, the production method of [13] or [14] is added to the technical matters of [1] to [12] above. Appropriately added at least part of the can be mentioned.

According to the method for producing a resin-molded article of the present invention, a resin-molded article such as a resin-encapsulated semiconductor element can be easily released from the mold without depending on the mold structure, release agent, etc. It is possible to obtain a molded article free from appearance defects such as chipping, which is a remarkable technical effect of high practical value.

It is a schematic diagram which shows an example of the resin sealing process of a semiconductor chip using the manufacturing method of the resin mold molding of this invention. FIG. 3 is a schematic diagram showing a test method for the peeling state after molding, etc., in Examples/Comparative Examples of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows preferable one Embodiment of the manufacturing method of the resin mold molding of this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows the test method of the return value evaluation of the film tensile test and film elongation in the Example/comparative example of this invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of a film tensile test and film elongation return value evaluation in Examples/Comparative Examples of the present invention.

In a first aspect of the present invention, the inner surface of a cavity recess provided in a lower mold is covered with a process release film, and the cavity recess is covered with an upper mold and a lower mold in a state in which a molding resin is supplied to the cavity recess. A method for manufacturing a resin molded product by clamping and compression molding a molded product,
A step of setting the release film for process, the resin for molding, and the article to be molded in a mold, and sucking the release film for process from the lower mold side to follow the inner surface of the cavity recess,
Optionally, in a state in which the upper mold and the lower mold are brought into contact with each other to form a cavity air-sealed with the outside, a step of evacuating the cavity from the cavity by an air suction mechanism through a flow path provided in communication with the cavity; and a step of clamping the upper mold and the lower mold to a compression molding position, curing the resin, and compression molding the molded product in this order,
The tensile strength in at least one direction of the process release film is 1.0 MPa to 10.0 MPa when stretched 37.5% at 100 mm / min at a temperature of 175 ° C.,
And the process release film was stretched by 37.5% in at least one direction under the same conditions, then rested for 2 minutes, and then returned to the origin direction at 100 mm / min in the compression direction. The method for producing the resin molded product, wherein the recovery rate (%) obtained from a certain return value according to the following formula (1) is 30 to 80 (%).
Return value/extension length x 100 = recovery rate % (1)

In the second aspect of the present invention, the roles of the upper mold and the lower mold in the first aspect are almost interchanged. It is a method of manufacturing a resin-molded product in which the product is covered with a mold film and the product is clamped between an upper mold and a lower mold in a state in which the resin for molding and the product to be molded are supplied to the lower mold, and then compression-molded. hand,
A step of setting the process release film, the resin for the mold, and the article to be molded in the mold, sucking air from the upper mold side of the process release film to follow the inner surface of the cavity recess,
Optionally, in a state in which the upper mold and the lower mold are brought into contact with each other to form a cavity air-sealed with the outside, a step of evacuating the cavity from the cavity by means of an air suction mechanism through a channel provided in communication with the cavity. , and a step of clamping the upper mold and the lower mold to a compression molding position, curing the resin, and compression molding the molded product in this order,
The tensile strength in at least one direction of the process release film is 1.0 MPa to 10.0 MPa when stretched 37.5% at 100 mm / min at a temperature of 175 ° C.,
And the process release film was stretched by 37.5% in at least one direction under the same conditions, then rested for 2 minutes, and then returned to the origin direction at 100 mm / min in the compression direction. In the method for producing a resin-molded product, the recovery rate (%) obtained from a certain returned value according to the above formula (1) is 30 to 80 (%).

Release Film for Processing As described above, the method for producing a resin-molded article of the present invention uses a release film for processing having specific physical properties.
More specifically, the process release film used in the method for producing a resin molded product of the present invention has a tensile strength in at least one direction when stretched 37.5% at 100 mm / min at a temperature of 175 ° C. strength is from 1.0 MPa to 10.0 MPa,
And the process release film was stretched by 37.5% in at least one direction under the same conditions, then rested for 2 minutes, and then returned to the origin direction at 100 mm / min in the compression direction. A restoration rate (%) obtained from a certain return value according to the following formula (1) is 30 to 80 (%).

As described above, the process release film used in the present invention has a tensile strength of 1.0 MPa to 10.0 MPa when stretched 37.5% at 100 mm / min at a temperature of 175 ° C. in at least one direction. is.
When the process release film has a tensile strength within the above range, problems such as breakage and wrinkles in the resin sealing process can be effectively suppressed in the method for producing a resin molded product of the present invention using the same. .
The upper limit of the tensile strength of the process release film used in the present invention in at least one direction at a temperature of 175 ° C. and 37.5% elongation at 100 mm / min is preferably 9.0 MPa. 0 MPa is more preferred. In addition, the lower limit of the tensile strength of the process release film used in the present invention in at least one direction at a temperature of 175° C. and 37.5% elongation at 100 mm/min is preferably 2.0 MPa. , 4.0 MPa, and even more preferably 6.0 MPa.
Furthermore, the process release film used in the present invention has a tensile strength in the MD direction (film flow direction) at a temperature of 175 ° C. and when stretched 37.5% at 100 mm / min. Especially preferred. In the method for producing a resin molded product of the present invention, the process release film is often stretched in the MD direction (film flow direction) due to the supply of the film. direction) satisfies the above conditions.
Furthermore, it is more preferable to satisfy the above condition both in the MD direction and in the TD direction perpendicular to the MD direction.
The tensile strength of the process release film can be measured by a method conventionally known in the art, for example, by the method described in the examples of the present specification.
The tensile strength of the process release film used in the present invention can be adjusted by appropriately setting the film material, thickness, production conditions, especially stretching and heat treatment conditions. Moreover, when the release film for processing of the present invention is a multilayer film, it can be adjusted by appropriately combining the material, thickness, production conditions, etc. of the films constituting each layer.

Also as described above, the process release film used in the present invention is stretched in at least one direction at a temperature of 175° C. at 100 mm/min for 37.5%, then rested for 2 minutes, and then stretched at 100 mm/min in the compression direction. The recovery rate (%) obtained according to the following formula (1) is 30 to 80 (%) from the return value, which is the displacement until the load becomes 0 when the load is returned to the origin direction at .
Return value/extension length×100=restoration rate % (1).
Since the recovery rate satisfies the above conditions, in the method for producing a resin molded product of the present invention using this, it is possible to effectively suppress problems such as breakage in the resin sealing process and poor appearance of the molded product while releasing the mold. It is possible to effectively prevent peeling failure due to film biting.
The recovery rate is preferably 43% or more, particularly preferably 45% or more.
Furthermore, it is preferable that the process release film used in the present invention has the above-mentioned recovery ratio in the MD direction (the flow direction of the film) satisfying the above-mentioned conditions. In the method for producing a resin molded product of the present invention, the process release film is often stretched in the MD direction (film flow direction) due to the supply of the film. direction) satisfies the above conditions.
Furthermore, it is more preferable to satisfy the above condition both in the MD direction and in the TD direction orthogonal to the MD direction.

FIG. 4 schematically shows a method of measuring the return value.
First, a film to be measured is set in a testing machine capable of performing a tensile test such as a Tensilon universal testing machine with a distance between chucks of _L0 (Fig. 4(a)).
Next, a tensile stress is applied between the chucks at a temperature of 175° C., and the chuck is elongated by 37.5% at 100 mm/min (elongation ΔL ₁ =L ₀ ×0.375) (FIG. 4(b)).
After remaining still for 2 minutes, the displacement at which the load becomes 0 when returned in the compression direction (opposite direction to the extension) at 100 mm/min was defined as the return value ΔL ₂ (Fig. 4(c)).
From the above measurement results, the recovery rate is calculated according to the following formula.
Recovery rate (%) = 100 × ΔL ₂ / ΔL ₁

In the method for producing a resin molded article of the present invention, the mechanism by which the recovery rate of the release film used is within the above range to effectively prevent peeling failure due to the release film being caught is not necessarily clear. However, it is presumed that there is some relationship with the resin sealing process as shown in FIG. 2, for example.
More specifically, after the vacuum adsorption step (FIG. 2(b)), the release film for process is less than immediately after it is placed on the lower mold (FIG. 2(a)). The film is in the stretched state by twice the initial cavity depth (2xa ₁ ).
After that, when mold clamping and compression are performed, the release film for process is returned to the compression direction (the direction opposite to the extension). It is compressed to about 1/3 compared to . At this time, if the restoration rate is extremely small compared to the reduction rate of the cavity depth (a ₁ −a ₂ )/a ₁ , wrinkles are likely to occur in the release film on the side of the cavity. It is presumed that there is some relationship with the fact that it can act in a direction that tends to cause biting between.

The recovery rate of the process release film used in the present invention can be adjusted by appropriately setting the film material, thickness, production conditions, especially stretching and heat treatment conditions. In addition, when the release film for processing of the present invention is a multilayer film, it can be adjusted by appropriately combining the material, thickness, manufacturing conditions, etc. of the films constituting each layer.

Further, the process release film used in the present invention preferably has a contact angle with water on at least one surface of 90° to 130°. Since the contact angle of at least one surface with respect to water is within the above range, the process release film of the present embodiment is even more excellent in releasability from the sealing resin.
The contact angle of at least one surface of the process release film of the present embodiment with respect to water is preferably 95° to 120°, more preferably 98° to 115°, still more preferably 100° to 110°. be.
The contact angles with water on both surfaces of the process release film used in books preferably satisfy the above conditions. When the contact angles with respect to water on both sides satisfy the above conditions, it is possible to realize a process release film that is excellent in releasability from both the sealing resin and the mold.
The contact angle of the film surface to water may be measured by a common method in the technical field, for example, it can be measured by the method described in the Examples of the present application.

The process release film used in the present invention is composed of a resin such as a fluororesin, 4-methyl-1-pentene, etc. that satisfies the above conditions for the contact angle for water on at least one surface so that the contact angle for water satisfies the above conditions. It is preferable to contain a resin selected from the group consisting of (co)polymers and polystyrene resins, or to consist of such a resin. Further, when the process release film used in the present invention is a multilayer film, the layer constituting at least one surface contains a fluororesin, a 4-methyl-1-pentene (co)polymer, and a polystyrene resin. It is also preferred to use a resin selected from the group consisting of

The process release film used in the present invention may be a single-layer film or a multilayer film as long as it has the above-mentioned required properties. From the point of view of providing it appropriately, it is preferable to use a multilayer film with a high degree of freedom in design.
In the case of a multilayer film, the film structure is not particularly limited, but a laminated film containing a release layer A having releasability from a molded product or a mold, and a heat-resistant resin layer B supporting the release layer A. is preferably In this embodiment, it is preferable that at least one surface of the process release film having a contact angle with water of 90° to 130° is composed of the release layer A.
If desired, the process release film of this form may further have a release layer A'. At this time, the release layer A, the heat-resistant resin layer B, and the release layer A' It is preferable to laminate in this order. Furthermore, at this time, the contact angle of the release layer A' to water is also preferably from 90° to 130°.

In the method for producing a resin-molded product of the present invention, the process release film of this embodiment is placed on the inner surface of the mold when the product to be molded is compression-molded inside the mold. At this time, it is preferable to dispose the release layer A of the release film (if the release layer A' is present, it may be the release layer A') on the side of the article to be molded. By arranging the release film of this embodiment, a resin-encapsulated semiconductor element or the like can be easily released from the mold.
The contact angle of the release layer A with respect to water is usually 90° to 130°. With such a contact angle, the release layer A has low wettability and adheres to the cured encapsulating resin and the mold surface. The molded product can be easily released from the mold without
The contact angle of the release layer A with water is preferably from 95° to 120°, more preferably from 98° to 115°, still more preferably from 100° to 110°.

Release layer A
The release layer A constituting the process release film used in the preferred embodiment has a contact angle with water of usually 90° to 130°, preferably 95° to 120°, more preferably 98°. to 115°, more preferably 100° to 110°. It is preferable to include a resin selected from the group consisting of fluororesins, 4-methyl-1-pentene (co)polymers, and polystyrene-based resins in view of the excellent releasability of molded articles and the ease of availability.

The fluororesin that can be used for the release layer A may be a resin containing structural units derived from tetrafluoroethylene. It may be a homopolymer of tetrafluoroethylene, or a copolymer with other olefins. Examples of other olefins include ethylene. A preferred example is a copolymer containing tetrafluoroethylene and ethylene as monomer structural units. The proportion of structural units derived from is preferably 0 to 45% by mass.

The 4-methyl-1-pentene (co)polymer that can be used in the release layer A may be a homopolymer of 4-methyl-1-pentene, and 4-methyl-1-pentene and Copolymers with other olefins having 2 to 20 carbon atoms (hereinafter referred to as "olefins having 2 to 20 carbon atoms") may also be used.

In the case of a copolymer of 4-methyl-1-pentene and an olefin having 2 to 20 carbon atoms, the olefin having 2 to 20 carbon atoms to be copolymerized with 4-methyl-1-pentene is 4-methyl -1-Pentene can impart flexibility. Examples of C2-C20 olefins include ethylene, propylene, 1-butene, 1-hexene, 1-heptene, 1-octene, 1-decene, 1-tetradecene, 1-hexadecene, 1-heptadecene, 1 -octadecene, 1-eicosene, and the like. These olefins may be used alone or in combination of two or more.

In the case of a copolymer of 4-methyl-1-pentene and an olefin having 2 to 20 carbon atoms, the ratio of structural units derived from 4-methyl-1-pentene is 96 to 99% by mass, and other The ratio of structural units derived from olefins having 2 to 20 carbon atoms is preferably 1 to 4% by mass. By reducing the content of structural units derived from olefins having 2 to 20 carbon atoms, the copolymer can be hardened, that is, the storage elastic modulus E' can be increased, and the occurrence of wrinkles in the sealing process etc. can be suppressed. It is advantageous to On the other hand, by increasing the content of structural units derived from olefins having 2 to 20 carbon atoms, the copolymer can be made soft, that is, the storage elastic modulus E' can be lowered, and mold followability can be improved. It is advantageous to

4-Methyl-1-pentene (co)polymers can be produced by methods known to those skilled in the art. For example, it can be produced by a method using known catalysts such as Ziegler-Natta catalysts and metallocene catalysts. The 4-methyl-1-pentene (co)polymer is preferably a highly crystalline (co)polymer. The crystalline copolymer may be either a copolymer having an isotactic structure or a copolymer having a syndiotactic structure. In particular, it should be a copolymer having an isotactic structure. is preferable from the viewpoint of physical properties, and is easily available. Furthermore, the 4-methyl-1-pentene (co)polymer can be molded into a film, and if it has strength to withstand the temperature and pressure during mold molding, the stereoregularity and molecular weight are also limited. not. The 4-methyl-1-pentene copolymer may be a commercially available copolymer such as TPX (registered trademark) manufactured by Mitsui Chemicals, Inc.

Polystyrene-based resins that can be used for the release layer A include styrene homopolymers and copolymers, and the styrene-derived structural units contained in the polymer are at least 60% by weight or more. It is preferably 80% by weight or more, more preferably 80% by weight or more.
The polystyrene-based resin may be either isotactic polystyrene or syndiotactic polystyrene, but isotactic polystyrene is preferable from the viewpoint of transparency, availability, etc., and mold releasability, heat resistance, etc. From the viewpoint of, syndiotactic polystyrene is preferred. One type of polystyrene may be used alone, or two or more types may be used in combination.

The release layer A preferably has heat resistance that can withstand the maximum temperature of the mold during compression molding (typically 110 to 190°C). From this point of view, the release layer A preferably contains a crystalline resin having a crystalline component, and the melting point of the crystalline resin is preferably 190° C. or higher, more preferably 200° C. or higher and 300° C. or lower.
In order to bring crystallinity to the release layer A, for example, the fluorine resin preferably contains at least a structural unit derived from tetrafluoroethylene, and the 4-methyl-1-pentene (co)polymer contains 4-methyl-1 It preferably contains at least structural units derived from -pentene, and preferably contains at least syndiotactic polystyrene in polystyrene resins. Since the resin constituting the release layer A contains a crystalline component, wrinkles are less likely to occur in the resin sealing process, etc., and are suitable for suppressing the appearance defects caused by the transfer of wrinkles to the molded product. .

The resin containing the crystalline component that constitutes the release layer A has a crystal melting heat quantity of 15 J/g or more and 60 J/g or less in the first heating step measured by differential scanning calorimetry (DSC) according to JISK7221. and more preferably 20 J/g or more and 50 J/g or less. When it is 15 J/g or more, it is possible to more effectively exhibit heat resistance and releasability that can withstand hot press molding in a resin sealing process, etc., and also to suppress the dimensional change rate. Therefore, the occurrence of wrinkles can also be prevented. On the other hand, when the heat of crystal fusion is 60 J/g or less, the release layer A has an appropriate hardness, so that the film can be sufficiently conformed to a mold in a compression molding process or the like. There is no risk of damage to the

The release layer A may contain other resins in addition to the fluororesin, 4-methyl-1-pentene copolymer, and/or polystyrene resin. In this case, it is preferable that the hardness of the other resin is relatively high. Examples of other resins include polyamide-6, polyamide-66, polybutylene terephthalate, polyethylene terephthalate. In this way, even when the release layer A contains a large amount of soft resin (for example, a large amount of olefin having 2 to 20 carbon atoms in a 4-methyl-1-pentene copolymer), the hardness is relatively low. By further including a high-grade resin, the release layer A can be hardened, which is advantageous in suppressing the occurrence of wrinkles in the compression molding process or the like.

The content of these other resins is preferably, for example, 3 to 30% by mass based on the resin component constituting the release layer A. By setting the content of the other resin to 3% by mass or more, the effect of addition can be made substantial. be able to.

In addition to the fluororesin, 4-methyl-1-pentene copolymer, and/or polystyrene resin, the release layer A contains a heat stabilizer, Known additives generally blended in film resins, such as weather stabilizers, rust inhibitors, copper damage-resistant stabilizers, and antistatic agents, may also be included. The content of these additives can be, for example, 0.0001 to 10 parts by weight with respect to 100 parts by weight of the fluororesin, 4-methyl-1-pentene copolymer, and/or polystyrene resin.

The thickness of the release layer A is not particularly limited as long as it has sufficient releasability from the resin molded product, but it is usually 1 to 50 μm, preferably 5 to 30 μm.

The surface of the release layer A may have an uneven shape as necessary, thereby improving the releasability. There is no particular limitation on the method for imparting unevenness to the surface of the release layer A, but a general method such as embossing can be employed.

Release layer A'
In addition to the release layer A and the heat-resistant resin layer B, the process release film used in the preferred embodiment may further have a release layer A'. That is, the process release film of the present embodiment may be a process release film that is a laminated film including a release layer A, a heat-resistant resin layer B, and a release layer A′ in this order.
The contact angle with water of the release layer A′ that may constitute the process release film used in the preferred embodiment is usually 90° to 130°, preferably 95° to 120°, more preferably is 98° to 115°, more preferably 100° to 110°. The preferred material, structure, physical properties, etc. of the release layer A' are the same as those described for the release layer A above.

The release layer A and the release layer when the process release film used in the preferred embodiment is a laminated film containing the release layer A, the heat-resistant resin layer B, and the release layer A' in this order. A′ may be a layer having the same structure or a layer having a different structure.
From the viewpoint of prevention of warping and ease of handling by having the same releasability on both sides, it is preferable that the release layer A and the release layer A' have the same or substantially the same configuration. Preferably, the release layer A and the release layer A' are optimally designed in relation to the process using them. From the viewpoint of making the layer A' excellent in releasability from the molding, it is preferable that the release layer A and the release layer A' have different structures.
When the release layer A and the release layer A' have different structures, the release layer A and the release layer A' may be made of the same material and have different structures such as thickness. However, the materials and other configurations may be different.

Heat-resistant resin layer B
The heat-resistant resin layer B constituting the process release film used in the above embodiment supports the release layer A (and the release layer A′ in some cases) and has the function of suppressing the occurrence of wrinkles due to mold temperature and the like. It is preferable to have

In the process release film used in this embodiment, the heat-resistant resin layer B is stretched at a temperature of 175 ° C. by 37.5% at 100 mm / min, then rests for 2 minutes, and then moves to the origin direction at 100 mm / min in the compression direction. It is preferable that the recovery rate (%) obtained from the return value, which is the displacement until the load becomes 0 when returned, according to the following formula (1) is 30 (%) or more.
Return value/extension length×100=restoration rate % (1).
When the recovery rate of the heat-resistant resin layer B satisfies the above conditions, it becomes easy for the process release film used in the present embodiment to have a predetermined recovery rate, and the process release film can be resin-sealed. It becomes easier to prevent peeling defects caused by the mold release film getting caught while effectively suppressing problems such as breakage in the process and poor appearance of the molded product.
The recovery rate of the heat-resistant resin layer B is preferably 40% or more, more preferably 45% or more, and particularly preferably 50% or more.
In the preferred release film for process use, it is preferable that the recovery rate satisfies the above conditions in at least one direction of the heat-resistant resin layer B, and the recovery is achieved in the direction corresponding to the MD direction (flow direction of the film) of the release film for process use. More preferably, the rate satisfies the above conditions. More preferably, the above conditions are satisfied in both the MD direction and the TD direction.

Any resin layer can be used for the heat-resistant resin layer B, including non-stretched films and stretched films.

Among non-stretched films, a resin having elastomeric properties is preferable from the viewpoint of the above-mentioned recovery rate. Examples of elastomeric resins include thermoplastic elastomers and silicones. These may use only 1 type and may use 2 or more types together. Among these, those having thermoplasticity are preferred, and thermoplastic elastomers are particularly preferred.

The thermoplastic elastomer may consist of a block copolymer having a hard segment and a soft segment, or may consist of a polymer alloy of a hard polymer and a soft polymer, and has the properties of both. good too.

The properties related to the recovery rate of the heat-resistant resin layer B can be controlled by adjusting these components. That is, it can be controlled by adjusting the type of resin, the proportions of resins when a plurality of types of resins are contained, and the molecular structure (ratio of hard segment and soft segment) of the polymer constituting the resin.

Thermoplastic elastomers include polyester-based thermoplastic elastomers (thermoplastic polyester elastomers), polyamide-based thermoplastic elastomers (thermoplastic polyamide elastomers), styrene-based thermoplastic elastomers (thermoplastic styrene elastomers), olefin-based thermoplastic elastomers (thermoplastic polyolefin elastomer), vinyl chloride thermoplastic elastomer (thermoplastic vinyl chloride elastomer), polyimide thermoplastic elastomer {thermoplastic polyimide elastomer, polyimide ester thermoplastic elastomer (thermoplastic polyimide ester elastomer), polyimide urethane thermoplastic elastomer ( thermoplastic polyimide urethane elastomer), etc.), polyurethane thermoplastic elastomer (thermoplastic polyurethane elastomer), and the like. These may use only 1 type and may use 2 or more types together.
Among these, polyester-based thermoplastic elastomers, polyamide-based thermoplastic elastomers, polyimide-based thermoplastic elastomers, and polyurethane-based thermoplastic elastomers are preferred, and polyester-based thermoplastic elastomers, polyamide-based thermoplastic elastomers, and polyurethane-based thermoplastic elastomers are preferred. Elastomers are particularly preferred.

The polyester-based thermoplastic elastomer may have any structure as long as it has a polyester component as a hard segment. Polyesters, polyethers, polyetheresters, and the like can be used as soft segments. These may use only 1 type and may use 2 or more types together. The polyester component constituting the hard segment may contain structural units derived from monomers such as dimethyl terephthalate. On the other hand, the components constituting the soft segment may contain constitutional units derived from monomers such as 1,4-butanediol and poly(oxytetramethylene)glycol. More specific examples include PBT-PE-PBT type polyester thermoplastic elastomers. PBT and PE in the above description of "PBT-PE-PBT" mean polybutylene terephthalate and polyether, respectively.

The polyamide-based thermoplastic elastomer may have any configuration as long as it has a polyamide component as a hard segment. Polyesters, polyethers, polyetheresters, and the like can be used as soft segments. These may use only 1 type and may use 2 or more types together. Polyamide components constituting the hard segment include polyamide 6, polyamide 11, polyamide 12, and the like. These may use only 1 type and may use 2 or more types together. Various lactams and the like can be used as monomers for these polyamide components. On the other hand, the component that constitutes the soft segment may contain structural units derived from monomers such as dicarboxylic acids and polyether polyols. Among these polyether polyols, polyether diols are preferable, and examples thereof include poly(tetramethylene) glycol and poly(oxypropylene) glycol. These may use only 1 type and may use 2 or more types together. More specifically, polyether amide type polyamide type thermoplastic elastomers, polyester amide type polyamide type thermoplastic elastomers, polyether ester amide type polyamide type thermoplastic elastomers, and the like can be mentioned.

The thermoplastic polyurethane elastomer may have any configuration as long as it has a polyurethane component as a hard segment. Polyesters, polyethers and polyetheresters, polycarbonates and the like can be used as soft segments. These may use only 1 type and may use 2 or more types together.
The polyurethane component constituting the hard segment may contain structural units derived from polyurethane obtained by reaction of short-chain glycol (low-molecular-weight polyol) and isocyanate. Here, polyurethane is a general term for compounds having urethane bonds (--NHCOO--) obtained by polyaddition reaction (urethanization reaction) of isocyanate (--NCO) and alcohol (--OH). More specific examples include polyester-type polyurethane-based thermoplastic elastomers, polyether-type polyurethane-based thermoplastic elastomers, and polycarbonate-type polyurethane-based thermoplastic elastomers.

The stretched film can be used as a film substrate that exhibits stretchability using the restoring force due to elasticity by stretching the film in the in-plane direction, so the restoration rate is 30 (%) or more. can be suitably used as the heat-resistant resin layer B because it is relatively easy to realize the preferable properties of

The stretched film may be a uniaxially stretched film or a biaxially stretched film. In the case of a uniaxially stretched film, it may be longitudinally stretched or transversely stretched.
The method and apparatus for obtaining the stretched film are not particularly limited, and stretching may be performed by a method known in the art. For example, it can be stretched with a heating roll or a tenter-type stretching machine.

As the stretched film, it is preferable to use a stretched film selected from the group consisting of a stretched polyester film, a stretched ethylene-vinyl alcohol copolymer film, a stretched polyamide film, a stretched polyethylene film, and a stretched polypropylene film. These stretched films are particularly suitable as the stretched film in the heat-resistant resin layer B because their mechanical properties are suitable for the use of the present invention, and they are available at low cost and relatively easily.

As the stretched polyester film, a stretched polybutylene terephthalate (PBT) film and a stretched polyethylene terephthalate (PET) film are preferable, and a biaxially stretched polybutylene terephthalate (PBT) film is particularly preferable.
Polyamide constituting the stretched polyamide film is not particularly limited, but polyamide-6, polyamide-66 and the like can be preferably used.
As the stretched polyethylene film, a uniaxially stretched polyethylene film, a biaxially stretched polyethylene film, or the like can be preferably used.
As the oriented polypropylene film, a uniaxially oriented polypropylene film, a biaxially oriented polypropylene film, or the like can be preferably used.
The draw ratio is not particularly limited, and an appropriate value may be appropriately set in order to appropriately control the thermal dimensional change rate and achieve suitable mechanical properties. A range of up to 10.0 times is preferred.

The heat-resistant resin layer B has heat resistance that can withstand the maximum temperature of the mold during compression molding (typically 110 to 190 ° C.) from the viewpoint of controlling the strength of the film and its thermal dimensional change rate within an appropriate range. It is preferred to have From this point of view, the heat-resistant resin layer B preferably contains a crystalline resin having a crystalline component, and the melting point of the crystalline resin is preferably 100° C. or higher, more preferably 140° C. or higher and 300° C. or lower. It is preferably from 150 to 270°C, and particularly preferably from 170 to 240°C. The melting point does not necessarily need to be higher than the maximum temperature of the mold during molding. Also, the melting point can be measured by a thermal analysis method (DSC method). When multiple melting peaks are detected, the melting point is determined from the highest melting peak.

As described above, the heat-resistant resin layer B preferably contains a crystalline resin having a crystalline component. As the crystalline resin contained in the heat-resistant resin layer B, for example, a crystalline resin such as a polyester resin, an ethylene-vinyl alcohol copolymer resin, a polyamide resin, a polyethylene resin, or a polypropylene resin can be used partially or wholly. Specifically, polyester resins are polybutylene terephthalate or polyethylene terephthalate, polyamide resins are polyamide 6 and polyamide 66, polyethylene resins are high-density polyethylene, low-density polyethylene, linear low-density polyethylene, ultra-high molecular weight polyethylene, and polypropylene. Isotactic polypropylene is preferably used as the resin. It is particularly preferable to contain at least one resin selected from the group consisting of polybutylene terephthalate and ethylene-vinyl alcohol copolymer.
By including the crystalline component of the crystalline resin in the heat-resistant resin layer B, it is more advantageous for the release film for process use to achieve the predetermined tensile strength and recovery rate of the present invention. In addition, wrinkles are less likely to occur in a resin encapsulation step or the like, which is more advantageous in suppressing the occurrence of poor appearance due to wrinkles being transferred to the molded product.

The thickness of the heat-resistant resin layer B is not particularly limited as long as the film strength can be ensured.

As another means for solving the problem of the present application, in the above-described method for producing a resin molded product, the release film for process includes at least a release layer A and a heat-resistant resin layer B, and the heat-resistant resin layer B A process release film (second process release film) having a recovery rate (%) of 30 to 80 (%) can also be used.
Here, the recovery rate of the heat-resistant resin layer B is that the heat-resistant resin layer B alone (not laminated) is stretched by 37.5% in at least one direction at 100 mm/min at a temperature of 175° C., rests for 2 minutes, and is then compressed. It is obtained according to the following formula (1) from the return value, which is the displacement until the load becomes 0 when returning to the origin direction at 100 mm/min in the direction.
Return value/extension length x 100 = recovery rate % (1)
The recovery rate of the heat-resistant resin layer B is preferably 40% or more, more preferably 45% or more, and particularly preferably 50% or more.
The heat-resistant resin layer B constituting the second process release film has a tensile strength of It is preferably from 1.0 MPa to 30.0 MPa. The tensile strength is more preferably 5.0 MPa to 25.0 MPa, particularly preferably 10.0 MPa to 20.0 MPa.

The second process release film may or may not meet the requirements described above for the process release film used in the present invention. For example, the MD direction recovery rate of the entire laminate film may be within the range of 30 to 80 (%), or may be outside the range. Moreover, the tensile strength in the MD direction of the entire laminated film may be within the range of 1.0 MPa to 10.0 MPa, or may be outside the range.
From the viewpoint of efficiently solving the problems of the present application, the second process release film preferably satisfies at least part of the requirements for the process release film used in the present invention. It is particularly preferred to have all of the requirements for a process release film used in .

In addition, the second process release film may or may not have some or all of the preferred technical features described herein for the process release film used in the present invention. good.
From the viewpoint of efficiently solving the problems of the present application, the second process release film has at least a part of the preferred technical features described herein for the process release film used in the present invention. preferably.

Other Layers The process release film used in this embodiment may have layers other than the release layer A, the heat-resistant resin layer B, and the release layer A′ as long as they do not contradict the purpose of the present invention. . For example, between the release layer A (or the release layer A') and the heat-resistant resin layer B, an adhesive layer or a cushion layer may be provided as necessary. The material used for the adhesive layer is not particularly limited as long as it can firmly bond the release layer A and the heat-resistant resin layer B and does not separate in the resin sealing process and the release process. The material used for the cushion layer is not particularly limited as long as it can smoothly follow the irregularities on the mold or molded article without breaking the film.

For example, when the release layer A (or the release layer A′) contains a 4-methyl-1-pentene copolymer, the adhesive layer is modified 4-methyl-1 graft-modified with an unsaturated carboxylic acid or the like. -Pentene-based copolymer resin, olefin-based adhesive resin composed of 4-methyl-1-pentene-based copolymer and α-olefin-based copolymer, and the like are preferable. When the release layer A (or the release layer A') contains a fluororesin, the adhesive layer is preferably made of a polyester-based, acrylic-based, fluororubber-based adhesive, or the like. The thickness of the adhesive layer is not particularly limited as long as the adhesiveness between the release layer A (or the release layer A') and the heat-resistant resin layer B can be improved.
Further, for example, the cushion layer is preferably made of polyethylene resin, polypropylene resin, α-olefin copolymer, polyester, acrylic, fluororubber, or the like. The thickness of the cushion layer is not particularly limited as long as the desired level conformability can be obtained, but is preferably 10 to 250 μm, for example.

The total thickness of the process release film used in the present invention is not particularly limited, but is preferably 10 to 300 μm, more preferably 30 to 150 μm. When the total thickness of the release film is in the above range, it is preferable because the handling property when used as a roll is good and the amount of waste of the film is small.

Method for Producing Process Release Film The process release film used in the present invention can be produced by any method.
When the process release film used in the present invention is a single-layer film, it can be produced by a conventionally known film production method such as an extrusion method or a stretching method.
Further, when the process release film used in the present invention is a multilayer film, for example, a multilayer film containing a release layer A and a heat-resistant resin layer B, for example, 1) the release layer A and the heat-resistant resin layer B are co-extruded. A method of manufacturing a process release film by molding and laminating (co-extrusion method); A method of manufacturing a process release film by coating and drying, or by coating and drying a resin solution obtained by dissolving a resin for the release layer A or an adhesive layer in a solvent (coating method), 3) A method of manufacturing a release film for a process by pre-manufacturing a film to be the release layer A and a film to be the heat-resistant resin layer B, and laminating these films (lamination method), etc. can be adopted.

In the method 3), as a method for laminating each resin film, various known lamination methods can be employed, such as an extrusion lamination method, a dry lamination method, a heat lamination method, and the like.
In the dry lamination method, each resin film is laminated using an adhesive. As the adhesive, one known as an adhesive for dry lamination can be used. For example, polyvinyl acetate-based adhesives; homopolymers or copolymers of acrylic esters (ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, etc.), or acrylic esters and other monomers (methacrylic acid cyanoacrylate-based adhesives; ethylene and other monomers (vinyl acetate, ethyl acrylate, acrylic acid, methacrylic acid) Ethylene copolymer adhesives made of copolymers, etc.) Cellulose adhesives Polyester adhesives Polyamide adhesives Polyimide adhesives Amino resins made of urea resin or melamine resin Adhesives; Phenolic resin adhesives; Epoxy adhesives; Polyurethane adhesives crosslinked with polyols (polyether polyols, polyester polyols, etc.) and isocyanates and/or isocyanurates; Reactive (meth)acrylic adhesives rubber adhesives such as chloroprene rubber, nitrile rubber and styrene-butadiene rubber; silicone adhesives; inorganic adhesives such as alkali metal silicates and low-melting glass; and other adhesives. As the resin film to be laminated by the method of 3), a commercially available one may be used, or one produced by a known production method may be used. The resin film may be subjected to surface treatment such as corona treatment, atmospheric pressure plasma treatment, vacuum plasma treatment, and primer coating treatment. The method for producing the resin film is not particularly limited, and known production methods can be used.

1) The co-extrusion molding method is preferable in that defects such as foreign matter being caught between the resin layer serving as the release layer A and the resin layer serving as the heat-resistant resin layer B and warping of the release film are less likely to occur. . 3) The lamination method is a suitable manufacturing method when a stretched film is used for the heat-resistant resin layer B. In this case, it is preferable to form an appropriate adhesive layer on the interface between the films as necessary. In order to improve the adhesiveness between the films, the interface between the films may be subjected to surface treatment such as corona discharge treatment, if necessary.

The coating means in the above 2) coating method is not particularly limited, but various coaters such as a roll coater, a die coater, and a spray coater are used. The melt extrusion means is not particularly limited, but for example, an extruder having a T-type die or an inflation type die is used.

The process release film may optionally be uniaxially or biaxially stretched to increase the film strength of the film.

Method for producing a resin-molded article The method for producing a resin-molded article according to the present invention involves a process of resin sealing by compression molding.
[1] In a state in which the inner surface of the cavity recess provided in the lower mold is covered with the specific release film for process, and the cavity recess is supplied with the molding resin, the upper mold and the lower mold are used for molding. A method for manufacturing a resin molded product by clamping and compression molding the product,
A step of setting the release film for process, the resin for molding, and the article to be molded in a mold, and sucking the release film for process from the lower mold side so as to follow the inner surface of the recessed portion of the cavity.
Optionally, in a state in which the upper mold and the lower mold are brought into contact with each other to form a cavity air-sealed with the outside, a step of evacuating the cavity from the cavity by an air suction mechanism through a flow path provided in communication with the cavity; and the step of clamping the upper mold and the lower mold to a compression molding position, curing the resin, and compression molding the molded product in this order, or [2] The inner surface of the cavity recess provided in the upper mold is covered with the above-mentioned specific process release film, and the lower mold is covered with the upper mold and the lower mold in a state in which the resin for molding and the article to be molded are supplied. A method for manufacturing a resin molded product by clamping and compression molding a molded product,
A step of setting the release film for process, the resin for molding, and the article to be molded in a mold, and sucking the release film for process from the upper mold side so as to follow the inner surface of the recessed portion of the cavity.
Optionally, in a state in which the upper mold and the lower mold are brought into contact with each other to form a cavity air-sealed with the outside, a step of evacuating the cavity from the cavity by means of an air suction mechanism through a channel provided in communication with the cavity. and a step of clamping the upper mold and the lower mold to a compression molding position, curing the resin, and compression molding the molded product, in this order.

In the manufacturing method of the present invention, when a semiconductor chip or the like is placed in a mold and a molding resin (sealing resin) is compression-molded, the process release film having the specific physical properties described above is applied to the semiconductor chip. By arranging it between the inner surface of the mold and the mold, it is possible to effectively prevent separation failure from the mold and the molded product, generation of burrs, and the like.
The molding resin (sealing resin) used for compression molding in the manufacturing method of the present invention may be either a thermoplastic resin or a thermosetting resin, but thermosetting resins are widely used in the technical field. In particular, it preferably contains at least one resin selected from the group consisting of epoxy resins, polyimide resins, and silicone resins.

In the method for producing a resin-molded product of the present invention, there is no particular limitation on the method of supplying the mold-like resin and the process release film, but the process release film is coated with the mold resin outside the mold. is supplied, and the resin for molding is carried into the mold together with the mold release film for the process for resin molding.
Further, in the method of manufacturing a resin-molded article of the present invention, the article to be molded preferably includes a semiconductor chip. A frame is particularly preferred.

Hereinafter, a resin sealing process for a semiconductor chip, which is a preferred embodiment of the method for manufacturing a resin molded article of the present invention, will be described with reference to FIG. In this embodiment, 1. shown in FIG. to 9. are carried out in this order.

First, in the "1. Film cutting" step, the process release film 11 is pulled out from the roll, spread on the XY stage 13, and cut into a predetermined size. Although there is no particular limitation on the predetermined size of the process release film 11, it covers the entire surface of the cavity 19c provided in the lower mold 19 used for resin molding, and further comprises the clamper 19b and the upper mold 19. It is preferable that the size includes a fixing margin for clamping the film 11 between the molds 15 .

Next, in the step of “2. Frame mold installation”, the frame 14 having a shape substantially overlapping the fixing margin is developed on the XY stage 13, and the process release film 11 cut to a predetermined size. It is installed on top so as to substantially overlap with the fixed margin.

Next, in the "3. Resin weighing" step, a predetermined amount of molding resin 18 is placed on the process release film 11 and within the frame 14 while being weighed. The amount of the molding resin 18 is not particularly limited, but it is desirable that the amount is substantially the same as the volume of the cavity 19c after the "8. Compression" step described later.

Next, in the “4. resin + film transport” step, while the mold release film 11 for process is adhered to the frame 14, together with the mold resin 18 placed on the release film 11, the XY stage is carried out. It is separated from 13, conveyed, and placed on a lower mold 19 for resin sealing. At this time, the process release film 11 covers the cavity 19c provided in the lower mold 19, and the mold resin 18 placed on the process release film 11 is positioned above the cavity 19c. It is preferable to place the

Next, in the "5. Vacuum adsorption" step, while clamping the fixing margin of the process release film 11 between the frame 14 and the clamper 19b constituting the lower mold 19, Air is removed from the suction holes provided in the cavity 19c, and the process release film 11 is sucked and supported along the inner surface of the cavity 19c. At this time, the fixing margin of the mold release film 11 for process may be fixed by suction to suction holes provided in the peripheral portion of the lower mold 19 .
By being supported by suction along the inner surface of the cavity 19c while fixing the fixing margin on the film peripheral portion, the release film for process is stretched by a length substantially corresponding to the depth of the cavity. The (initial) depth of the cavity 19c in this step can be appropriately set according to the thickness of the resin-encapsulated semiconductor element produced by the resin encapsulation process of this embodiment. The (initial) depth of the cavity 19c in this step is usually 1.0 to 10.0 mm, but is not limited to this.
In this step, it is preferable that the process release film 11 has flexibility to be easily adsorbed and supported along the inner surface of the cavity 19 c and has heat resistance to withstand the heating temperature of the molds 15 and 19 . . Moreover, it is preferable that it can be easily released from the mold 19 after being sealed with resin and can be easily peeled off from the molding resin 18 .

Next, in the step of "6. Base installation", the substrate 16 on which the semiconductor chip 17 (and circuit components if necessary) is mounted is sucked to the upper die 15 so that the semiconductor chip 17 faces downward, and the semiconductor is The upper mold 15 is moved and aligned so that the chip 17 is positioned substantially in the center of the cavity 19c in the lower mold 19. Then, as shown in FIG.

Next, in the "7. Mold clamping" step, while maintaining the initial space of the cavity 19c (the cavity block 19a in the lower mold 19 remains at the initial position), the upper mold 15 and the lower mold 19 are brought into contact, Close the mold.

Next, in the "8. Compression" step, the cavity block 19a is raised to the compression molding position, and the molding resin 18 in the cavity 19c is compression molded. As a result, the semiconductor chip 17 (and circuit components if necessary) on the substrate 16 is sealed with the molding resin 18 .
The difference between the initial depth of the cavity 19c and the final depth of the cavity 19c after compression molding is preferably 1.0 mm or more, more preferably 1.3 mm or more, and preferably 1.6 mm or more. Especially preferred. When a semiconductor chip 17 having a large thickness such as a large-capacity NAND flash memory is resin-sealed, the difference between the initial depth of the cavity 19c and the final depth of the cavity 19c after compression molding tends to increase. Even in such a case, according to the method of manufacturing a resin-molded article of the present invention using a specific mold release film, the semiconductor chip 17 having a large thickness can be properly formed while effectively suppressing problems such as poor peeling. can be resin-sealed.

Further, the final depth of the cavity 19c (resin thickness after compression molding) is preferably 0.5 mm or more, more preferably 0.7 mm or more, and particularly preferably 1.0 mm or more. By setting the final depth of the cavity 19c to 0.5 mm or more, it is possible to manufacture a resin-molded product in which a thick semiconductor chip 17 such as a large-capacity NAND flash memory is appropriately resin-sealed.
In compression molding, it is preferable to heat the molding resin 18 to a temperature at which it exhibits appropriate fluidity. It is preferable to heat at a temperature and time at which it hardens to . For example, the maximum temperature in the resin sealing process can be set to 110 to 190°C, more preferably 120 to 180°C.
There are no particular limitations on the molding pressure and curing ^time at that time, and preferable conditions may be appropriately set according to the type of molding resin 18 and the sealing temperature. More preferably 70 to 150 kN/cm ² , curing time 1 to 60 minutes, more preferably 2 to 10 minutes can be appropriately set.

The molding resin 18 may be a liquid resin or a resin that is solid at room temperature, but a sealing material that becomes liquid when heated during resin sealing can be used as appropriate. Specifically, resin materials for molding are mainly epoxy resins (thermosetting resins that can be cured by forming a crosslinked network with epoxy groups remaining in the polymer, preferably biphenyl type resins). epoxy resin, bisphenol epoxy resin, o-cresol novolac type epoxy resin, etc.) is used, and as a sealing resin other than the epoxy resin, a polyimide resin (a polymer resin having an imide bond in the repeating unit of the main chain, Bismaleimide-based resins are preferred), silicone-based resins (polymeric resins having a siloxane bond in the repeating unit of the main skeleton, preferably thermosetting addition-type resins, etc.), and the like, which are commonly used as molding resins, are suitable. can be used for

Next, in the "9. Mold opening (mold release)" step, the upper mold 15 is separated from the lower mold 19, and the resin-molded product (resin-encapsulated semiconductor chip) is taken out of the mold. At this time, the favorable effect that the molded product can be easily peeled off from the process release film 11 is achieved. In particular, the process release film 11 on the side surface of the cavity 19c can be peeled off without biting into the molded product, which is a desirable effect that has been difficult to achieve with conventional technology. In addition, a favorable effect is also realized that the surface of the molded product after peeling has a good appearance without resin chipping. According to the production method of the present embodiment using the process release film having the above specific physical properties, such preferable results can be easily achieved.

Next, referring to FIG. 3, a semiconductor chip resin encapsulation process, which is another preferred embodiment of the method for manufacturing a resin molded product according to the present invention, will be described. In this embodiment, the upper mold and the lower mold are brought into contact with each other to form a cavity air-sealed with the outside. By having the step of doing, the air remaining in the cavity can be exhausted reliably, and the air contained in the resin can be exhausted at the same time, resulting in a high quality resin without voids. Can be compression molded.
In this embodiment, the steps (a) to (d) shown in FIG. 3 are performed in this order.

In FIG. 3(a), 310 is a lower mold base fixed to a fixed platen of the press device, 312 is a lower mold fixed to the lower mold base 310, and 314 is slidably contacted with the side surface of the lower mold 312 to open and close the mold. It is a lower die clamper that is movably supported on the
The lower mold clamper 314 is formed in a frame shape surrounding the side surface of the lower mold 312 that defines the resin mold region. In this embodiment, the resin mold region is formed in a planar rectangular shape, and the lower mold clamper 314 is therefore formed in a rectangular frame shape. Since the lower mold clamper 314 is formed in accordance with the resin mold region in this manner, for example, when the resin mold region of the molded product is circular, such as a semiconductor wafer, the lower mold clamper 314 is formed in a circular ring shape. formed in

A spring 316 serves as a biasing means for biasing the lower die clamper 314 toward the upper die. The lower die clamper 314 is biased by a spring 316 so that the upper end surface of the lower die clamper 314 projects upward from the resin molding surface of the lower die 312 when the mold is opened. When the lower die clamper 314 protrudes from the resin molding surface of the lower die 312 , a cavity recess is formed in which the resin molding surface of the lower die 312 and the periphery of the lower die 312 are surrounded by the lower die clamper 314 .
A seal 318 provides an air seal between the side surface of the lower mold 312 and the inner surface of the lower mold clamper 314 , and is provided along the entire circumference of the side surface of the lower mold 312 . The seal 318 is provided at a position where it always slides on the inner surface of the lower die clamper 314 when the lower die clamper 314 moves up and down.
A seal 319 is provided on the upper end face of the lower clamper 314 . This seal 319 is provided to air-seal the resin mold region (cavity) from the outside with the upper mold.

In FIG. 3A, reference numeral 320 denotes an upper mold base fixed to the movable platen of the press device, 322 is an upper mold fixed to the upper mold base 320, and 324 is in sliding contact with the side surface of the upper mold 322. This is an upper die clamper that is movably supported in the die opening/closing direction. Similarly to the lower mold clamper 314 , the upper mold clamper 24 is also formed in a frame shape surrounding the side surface of the upper mold 322 .
The upper mold 322 holds the article to be molded during resin molding, clamps the article to be molded between itself and the lower mold 312, and resin molds the article. Accordingly, the upper die 322 is also formed in a planar shape substantially the same as the lower die 312 , and the upper die clamper 324 is also formed in a frame shape substantially the same as the lower die clamper 314 .

The clamping surface of the upper mold 322 is formed slightly larger than the resin-molded area (outer shape) of the lower mold 312 so that the outer peripheral edge of the upper mold 322 contacts the lower mold clamper 314 when the mold is closed. ing. Further, the lower end surface of the upper die clamper 324 is formed into a flat surface and arranged to face the upper end surface of the lower die clamper 314 . The reason why the lower end surface of the upper die clamper 324 is a flat surface and is arranged to face the lower die clamper 314 is that when the upper die clamper 324 contacts the lower die clamper 314, it is surrounded by the upper die and the lower die. This is so that the cavity is air-sealed from the outside by the seal 319 . Accordingly, the seal 319 may be provided on the upper die clamper 324 instead of on the lower die clamper 314 .
In this embodiment, the seal 319 air seals between the upper clamper 324 and the lower clamper 314 . It is also possible to provide a wide width covering up to the area clamped by the upper mold clamper 324 and the lower mold clamper 314 to clamp the release film 350 for air sealing.

326 is a spring as biasing means for normally biasing the upper die clamper 324 toward the lower die side. The upper die clamper 24 is provided so that the lower end surface of the upper die clamper 24 normally protrudes below the clamping surface of the upper die 322 due to the biasing force of the spring 326 . 328 is a seal for air-sealing between the side surface of the upper die 322 and the inner side surface of the upper die clamper 324. It is provided so that the inner surface of the upper mold clamper 324 is in sliding contact.

The method for manufacturing a resin-molded article according to the present embodiment includes the steps of resin-molding using a release film for processing, and performing resin-molding by evacuating the cavity during resin-molding.
Therefore, a flow path 314 a for sucking air from between the inner surface of the lower die clamper 314 and the side surface of the lower die 312 and a flow path for sucking the release film for process on the upper end surface of the lower die clamper 314 are provided. 314b is provided. 330 is an air suction mechanism provided outside the mold in communication with the channels 314a and 314b. Between the inner surface of the lower mold clamper 314 and the side surface of the lower mold 312, a channel (gap) is formed for air suction of the process release film from the lower mold 312 side. The channel does not need to be provided over the entire side surface of the lower mold 312 and the inner surface of the lower clamper 314, and may be a groove-like channel for partially sucking the process release film.

Further, on the upper die side, the upper die clamper 324 is provided with a channel 324a for exhausting air from the cavity. 332 is an air suction mechanism provided outside the mold in communication with the flow path 324a.
In this embodiment, the upper die 322 is on the movable side for opening and closing the mold, but the lower die 312 may be on the movable side.

Concrete processes of the method for manufacturing a resin molded article according to the present embodiment will now be described with reference to FIGS. 3(a) to 3(d).
FIG. 3A shows a state in which a semiconductor chip 340 is supplied to an upper mold 322 and a process release film 350 and a molding resin 352 are supplied to a lower mold 312 .
In this embodiment, the upper die 322 is provided with a support mechanism such as fingers for mechanically supporting the semiconductor chip 340 , and the upper die 322 holds the semiconductor chip 340 and clamps the semiconductor chip 340 .
As a method of supplying the process release film 350 and the molding resin 352 to the lower mold 312 , the process release film 350 having a width covering the upper end surface of the lower mold clamper 314 is supplied to the lower mold 312 . Then, following the inner surface shape of the cavity recess formed by the lower mold 312 and the lower mold clamper 314, the mold resin 352 is supplied to the cavity recess by air-adsorbing the process release film 50. Molding resin 352 is supplied in advance outside the mold to the process release film preformed into a concave shape matching the resin sealing area, and the process release film 350 and the molding resin 352 are carried into the mold. In the case of a resin that does not have high fluidity, the molding resin is supplied to the process release film that has not been preformed in advance, and the process release film and the resin are mixed together. can be carried into the mold and set.

The process release film 350 has the specific physical properties described above. It has a function such as peelability. If the process release film 350 is too flexible to retain the preformed shape as it is, the process release film 350 is supported by a set jig, carried into the mold, and set on the lower mold 312 . do. The method of supplying the molding resin 352 to the process release film 350 outside the mold and then carrying it into the mold for resin molding facilitates accurate weighing of the molding resin. Since the resin starts to be heated from the time when the release film 350 for process and the resin for molding are set inside, there is an advantage that the resin can be uniformly heated.

In FIG. 3B, after the semiconductor chip 340, the process release film 350 and the molding resin 352 are supplied into the mold, the upper mold base 320 is brought into contact with the upper mold clamper 324 and the lower mold clamper 314. It is lowered to the position and the air in the cavity 360 is evacuated.
When the upper die base 320 descends and the upper die clamper 324 and the lower die clamper 314 come into contact with each other, an air seal is formed between the upper die clamper 324 and the lower die clamper 314 via the seal 319, and the die is opened. The open cavity forming part becomes a cavity air-sealed from the outside. Since the channel 324a provided in the upper die clamper 324 is provided at a position communicating with the internal space of the cavity, the air in the cavity can be reliably discharged from the channel 324a.
In the present embodiment, the peripheral edge of the process release film 350 is located inside the contact area between the upper clamper 324 and the lower clamper 314 . It may be clamped by the mold clamper 324 and the lower mold clamper 314, and the process release film 350 is not limited to individual pieces, and may be long.

In this way, the cavity 360 is air-sealed from the outside, and the air is evacuated from the air suction mechanism 332 to exhaust the air from the cavity. Since the process release film 350 is air-adsorbed by the lower clamper 314 , the air is exhausted from the cavity 360 through the flow path 324 a provided in the upper clamper 324 . When the cavity 360 is evacuated by the air suction mechanism 332, the process release film 350 is adsorbed and supported on the lower mold 312 side. 350 is air sucked.
Exhaust from the cavity 360 is performed in a state in which the semiconductor chip 340 does not contact the upper end surface of the lower mold clamper 314 as shown in FIG. 3B. As a result, the space above the molding resin 352 can be reliably exhausted. By this evacuation, residual air in the cavity is exhausted, and air mixed in the molding resin 352 is also exhausted, thereby preventing voids from occurring in the resin during compression molding.

In this embodiment, the semiconductor chip 340 is supported by the upper mold 322 and the cavity 360 is evacuated. It is also possible to evacuate.

FIG. 3C shows a state in which the upper die base 320 is further lowered after the cavity 360 is evacuated, and the semiconductor chip 340 is brought into contact with the lower die clamper 314 . Actually, the semiconductor chip 340 (substrate) is in contact with the process release film 350 covering the upper end surface of the lower clamper 314 , and the cavity 360 containing the molding resin 352 is the process release film 350 . It becomes a region air-sealed with the semiconductor chip 340 . Also in this clamping operation, vacuum suction is performed by the air suction mechanism 330 through the flow path 314 a so that the process release film 350 is air-sucked according to the shape of the cavity recess of the lower mold 312 .
The biasing force of the spring 326 that biases the upper die clamper 324 is set to be smaller than the biasing force of the spring 316 that biases the lower die clamper 314 , so that the semiconductor chip 340 contacts the upper end surface of the lower die clamper 314 . The spring 326 on the upper die side is compressed until it abuts, and the upper die 322 moves downward relative to the upper die clamper 324 .

By providing an air vent on the substrate of the semiconductor chip 340 or providing an air vent on the upper end surface of the lower die clamper 314 that abuts on the semiconductor chip 340, the air vent can be maintained even after the semiconductor chip 340 abuts on the lower die clamper 314. It is also possible to suck air from the cavity 360 through. When such an air vent is provided, air can be sucked from the cavity even when the mold is clamped to the compression molding position, but the resin may leak onto the substrate surface of the semiconductor chip 340 and onto the mold surface. If it is desired to avoid leakage of the resin, it is better not to provide an air vent.

FIG. 3(d) shows a state in which the upper mold 322 is further lowered and the semiconductor chip 340 is finally compression molded. Compression molding is performed by further lowering the upper die base 320 from the state where the semiconductor chip 340 is in contact with the lower die clamper 314 to the compression molding position. By pushing down the upper mold 322 from the state where the semiconductor chip 340 is in contact with the lower mold clamper 314 , the lower mold clamper 314 is pushed down against the biasing force of the spring 316 , and the semiconductor chip 340 is clamped between the lower mold 312 and the upper mold 322 . It is clamped by and resin-molded. The downward movement of the upper mold 322 stops when the mold clamping force between the lower mold 312 and the upper mold 322 reaches a predetermined value, and in this state, the entire cavity is filled with resin and compression molding is performed.

After the compression molding position is held until the molding resin 352 hardens, the mold is opened and the resin molded product is taken out from the inside of the mold. A resin-molded product is obtained by resin-molding such that one side of the semiconductor chip 340 is collectively sealed with resin. In the case where the semiconductor chip 340 is a product in which a large number of semiconductor chips are mounted on a substrate, individual semiconductor devices can be obtained by cutting the compression-molded product with a dicer.

According to the method for manufacturing a resin molded product of the present embodiment, a preferable effect is achieved in that the resin molded product can be easily separated from the process release film 350 at this time. In particular, the process release film 350 on the side surface of the cavity 360 can be peeled off without biting into the resin molded product, which is a desirable effect that has been difficult to achieve with conventional technology. In addition, a preferable effect is also realized that the surface of the resin molded article after peeling has a good appearance without resin chipping or the like. According to the manufacturing method of the embodiment using the process release film having the specific physical properties, it is easy to achieve such favorable results.
Furthermore, since the parts of the lower mold 312 and the lower mold clamper 314 that are in contact with the resin during resin molding are covered with the process release film 350, the sliding parts of the lower mold clamper 314 and the flow paths 314a and 314b are covered. Resin does not adhere to the lower mold clamper 314, and resin molding can be performed without interfering with the operation of the lower mold clamper 314 or the like.

According to the method for producing a resin molded product of the present invention, which uses a process release film having specific physical properties, including each of the above embodiments, it has characteristics such as a large overall thickness and a high It is possible to manufacture value-added resin molded products with high productivity while suppressing appearance defects and appearance defects due to side bite. Particularly preferably, a method for resin-sealing a semiconductor chip or a method for manufacturing a resin-sealed semiconductor device having such a process, which applies the manufacturing method of the present invention, can be used to produce a memory such as a large-capacity NAND flash memory. It is possible to manufacture a resin-encapsulated semiconductor element, in which a semiconductor chip with a large overall thickness due to multi-layered chips is resin-encapsulated, while suppressing appearance defects and appearance defects due to side bites with high productivity. can.
Resin-molded products such as resin-encapsulated semiconductor elements are not limited to memory-type semiconductors, but also logic-type semiconductors, SiP (System-in-Package), different types of semiconductor packages, and semiconductor chips, which are three-dimensionally stacked. The present invention can also be applied to high-performance semiconductor chips, and can also be applied to resin moldings such as lens moldings used for photoelectric elements, sensor elements, or optical elements.
Resin-molded products in which these high-performance semiconductor chips and the like are resin-encapsulated are excellent resin-encapsulated semiconductor elements in which, for example, high-performance semiconductor chips are appropriately encapsulated in encapsulating resin. Since it has added value and can improve production efficiency, it can be mounted in electrical/electronic equipment, transportation equipment, etc., and contribute to the enhancement of functionality, performance, and cost reduction.

EXAMPLES The present invention will be described in more detail below with reference to Examples, but the present invention is not limited by these Examples.

The physical properties/characteristics of the process release films used in the following Examples/Comparative Examples and the obtained resin molded articles were evaluated by the following methods.

(Contact angle with water (water contact angle))
According to JIS R3257, the water contact angle on the surface of the release layer A or A' of the process release film was measured using a contact angle measuring instrument (Kyowa Interface Science, FACECA-W).

(tensile strength)
Using the process release film produced in each example/comparative example, the initial chuck distance was set to 20 mm, and the film was stretched at 100 mm/min to 7.5 mm (37.5%) at 175 ° C. Load was measured as tensile strength.

(return value, recovery rate)
Using the process release film produced in each example/comparative example, the initial chuck distance was set to 20 mm, and the elongation was 7.5 mm at 100 mm/min in a 175°C environment (elongation ΔL at this time, elongation length ΔL ₁ After that, after holding it as it is for 2 minutes, the displacement (return) of the elongation ΔL when the load becomes 0 when the chuck is returned at 100 mm / min in the opposite direction to the elongation is measured, and the return value ΔL ₂ (mm).
FIG. 4 shows specific expansion and contraction of the film. In FIG. 4(a), the initial film length L ₀ was 20 mm, and in FIG. 4(b) the maximum film elongation ΔL ₁ was 7.5 mm. The return value ΔL ₂ when the load becomes 0 shown in FIG. 4(c) was measured for each sample, and the recovery rate was calculated from ΔL ₁ and ΔL ₂ according to the following formula.

Recovery rate (%) = 100 × ΔL ₂ / ΔL ₁

(Melting point (Tm))
Using Q100 manufactured by TA Instruments as a differential scanning calorimeter (DSC), about 5 mg of polymer sample was accurately weighed, and nitrogen gas flow rate: 50 ml / min. C. to 280.degree. C. at a heating rate of 10.degree.

(Releasability)
A semiconductor chip was resin-encapsulated by the process shown in FIG. 1 using the process release film produced in each example/comparative example.
As the sealing resin, an epoxy lead frame package sealing material (brand name: CEL-9750ZHF10) manufactured by Hitachi Chemical Co., Ltd. was used.
Detailed conditions of "4. resin + film transfer", "5. vacuum adsorption", and "7 mold clamping" and "9. compression" in the process of Fig. 1 are shown in Figs. , as well as (c). In FIG. 2( _a ), the depth a1 of the cavity 29c at the initial stage of mold clamping is 2.4 mm, and in FIG. 2(b), the width of the cavity 29c is 54 mm. The length of the cavity 29c in the direction perpendicular to the paper surface was 221 mm, and the final cavity depth a2 after clamping and compression in FIG. ₂ (c) was 0.8 mm. The mold temperature (molding temperature) was 175° C., the molding pressure was 96 kN, and the molding time was 120 seconds.
After that, as shown in "9. Mold opening (mold release)" in FIG. 1, the upper mold was pulled up, and the resin-sealed semiconductor chip (semiconductor package) was released from the mold release film. The releasability of the release film was evaluated according to the following criteria.
⊚: The release film is naturally peeled off at the same time as the mold is opened.
◯: The release film does not peel off naturally, but can be easily peeled off by hand pulling (applying tension).
x: The release film adhered to the resin sealing surface of the semiconductor package and could not be peeled off by hand.

(mold followability)
The mold followability of the release film when the mold was released in the above steps was evaluated according to the following criteria.
⊚: There is no resin chipping (portion not filled with resin) in the semiconductor package.
◯: There is a slight lack of resin at the edge of the semiconductor package.
x: There are many resin chippings at the edge of the semiconductor package. Alternatively, film tearing occurs during molding.

(Detachment failure due to side jamming)
When the mold was released in the above steps, the peeling failure due to the release film being caught on the side surface was evaluated according to the following criteria.
⊚: There is no trace of entrapment on the side surface of the semiconductor package, and there is no defect in peeling.
◯: There are traces of entrapment on the side surface of the semiconductor package, but there is no defect in peeling.
x: Biting marks were found on the side surface of the semiconductor package, and peeling defects also occurred.

[Example 1]
As the heat-resistant resin layer B, a 15 μm-thick biaxially stretched PBT (polybutylene terephthalate) film (Kohjin Film & Chemicals Co., Ltd., brand name: BOBBLET ST, melting point 223° C.) is used, and release layers A and A′ are used. A non-stretched 4-methyl-1-pentene copolymer resin film was used as the film. Specifically, 4-methyl-1-pentene copolymer resin manufactured by Mitsui Chemicals, Inc. (product name: TPX, brand name: MX022)" is melt-extruded at 270 ° C. to adjust the slit width of the T-type die. A non-stretched film having a thickness of 15 μm was used.
The unstretched 4-methyl-1-pentene copolymer resin film has a water contact angle of 30 ° or less based on JIS R3257 on one film surface, which is the adhesive surface, so that it is 30 or less. Corona treatment was performed from the viewpoint of improving adhesion.

(glue)
Urethane-based adhesive A below was used as the adhesive used in the dry lamination step for laminating each film.
[Urethane adhesive A]
Main agent: Takelac A-616 (manufactured by Mitsui Chemicals, Inc.). Curing agent: Takenate A-65 (manufactured by Mitsui Chemicals). The main agent and the curing agent were mixed so that the mass ratio (main agent:curing agent) was 16:1, and ethyl acetate was used as the diluent.

(Production of release film)
On one side of the biaxially stretched PBT film, urethane-based adhesive A was applied at 1.5 g/m ² by gravure coating, and the corona-treated surface of the unstretched 4-methyl-1-pentene copolymer resin film was coated. After bonding by dry lamination, urethane-based adhesive A was applied at 1.5 g/m ² to the side of the biaxially stretched PBT film surface of this laminate film, and another non-stretched 4- A process in which the corona-treated surface of a methyl-1-pentene copolymer resin film is laminated by dry lamination to form a five-layer structure (release layer A/adhesive layer/heat-resistant resin layer B/adhesive layer/release layer A'). A release film for
Dry lamination conditions were as follows: base material width 900 mm, transport speed 30 m/min, drying temperature 50 to 60° C., lamination roll temperature 50° C., roll pressure 3.0 MPa.

The process release film had a tensile strength of 7.5 MPa, a return value of 3.6 mm, and a recovery rate of 48%.
Table 1 shows the evaluation results of releasability, mold followability, and peeling failure. The release film exhibited good release properties, such as being spontaneously peeled off at the same time as the mold was opened, and exhibited excellent mold followability with no resin chipping on the semiconductor package. In addition, no trace of entrapment was observed on the side surface of the semiconductor package, and no delamination failure was observed. In other words, the semiconductor resin encapsulation process of Example 1 is a method for manufacturing an excellent resin molded product, which has good releasability and mold followability, and effectively suppresses peeling defects due to side jamming. rice field.

[Examples 2-3]
A process release film was produced in the same manner as in Example 1, except that the films listed in Table 1 were used as the release layers A and A' and the heat-resistant resin layer B in the combinations shown in Table 1, sealed, After releasing from the mold, the properties were evaluated. Table 1 shows the results.
In some cases, the suppression of peeling failure due to side jamming was not as good as in Example 1, but the processes of all examples are balanced at a high level of releasability, suppression of wrinkles, and mold followability. It was a method for manufacturing a good resin molded product

The details of each film described in the table are as follows.
(TPX-1) Non-stretched 4MP-1 (TPX) film Mitsui Chemicals, Inc. 4-methyl-1-pentene copolymer resin (product name: TPX, brand name: MX022, melting point: 229 ° C.) was used to make a thickness of 15 μm. A film formed from a non-stretched film.
(TPX-2) Non-stretched 4MP-1 (TPX) film Mitsui Chemicals, Inc. 4-methyl-1-pentene copolymer resin (product name: TPX, brand name: MX022, melting point: 229 ° C.) was used to make a thickness of 50 μm. A film formed from a non-stretched film.
(OPBT1) Biaxially Stretched PBT Film A 15 μm-thick biaxially stretched polybutylene terephthalate film (brand name: Boblet ST, melting point: 223° C., tensile strength: 20.0 MPa) manufactured by Kohjin Film & Chemicals Co., Ltd. was used.
(OPBT2) Biaxially Stretched PBT Film A 25 μm-thick biaxially stretched polybutylene terephthalate film (brand name: Boblet ST, melting point: 223° C., tensile strength: 19.2 MPa) manufactured by Kohjin Film & Chemicals Co., Ltd. was used.
(CPBT1) Unstretched PBT film A 50 μm-thick unstretched monolayer film was formed using a polybutylene terephthalate resin (brand name: 5020, melting point: 223° C.) manufactured by Mitsubishi Engineering-Plastics.
(CPBT2) Non-stretched PBT film Using polybutylene terephthalate resin (brand name: 5020, melting point: 223°C, tensile strength: 2.1 MPa) manufactured by Mitsubishi Engineering-Plastics, a non-stretched monolayer film with a thickness of 20 µm was formed. What I did.
(Unstretched Ny) Unstretched Nylon Film A 20 μm-thick unstretched nylon film manufactured by Mitsubishi Chemical Corporation (trade name: Diamiron C, melting point: 220° C., tensile strength: 1.9 MPa) was used.
(OPET1) Biaxially Stretched PET Film A 13 μm-thick biaxially stretched PET (polyethylene terephthalate) film (product name: Teleflex FT, melting point: 227° C.) manufactured by Teijin Film Solutions Co., Ltd. was used.
(OPET2) Biaxially Stretched PET Film A 13 μm thick biaxially stretched PET (polyethylene terephthalate) film (trade name: Teleflex FW2, melting point: 227° C.) manufactured by Teijin Film Solutions Co., Ltd. was used.
(EVOH) Biaxially stretched EVOH film Biaxially stretched EVOH (ethylene-vinyl alcohol copolymer) film with a thickness of 15 μm manufactured by Kuraray Co., Ltd. (trade name: EVAL EF-XL, melting point: 182° C., tensile strength: 2.2 MPa) was used. used.
Of these films, the return value and recovery rate of the film used as the heat-resistant resin layer B were also measured according to the above-described measurement methods for the film alone (unlaminated state). Table 2 shows the results.

[Comparative Examples 1 and 2]
Alternatively, each of the films shown in Table 1 was used alone as a mold release film for processing, sealing and mold release were performed in the same manner as in Example 1, and the quality of the process was evaluated. Table 1 shows the results.
In any of the processes of the comparative examples, the overall performance was not as good as that of the examples, and in particular, it was not possible to effectively suppress the peeling defect caused by side entrapment.

[Comparative Examples 3 to 6]
A process release film was produced in the same manner as in Example 1 except that the films listed in Table 1 were used as the release layers A and A' and the heat-resistant resin layer B in the combinations shown in Table 1, and sealed. , the mold was released, and the characteristics were evaluated. Table 1 shows the results.
The releasability and mold followability were as good as in the process of the example, but the occurrence of wrinkles could not be suppressed.

The method for producing a resin-molded article of the present invention can easily release a resin-molded article such as a resin-encapsulated semiconductor element or a resin-molded optical element from a mold without depending on a mold structure, a mold release agent, and the like. In addition, it is possible to manufacture molded products with high productivity without appearance defects such as wrinkles and resin chipping, which brings about a technical effect of high practical value, and is widely used in the semiconductor process industry, the optical element manufacturing industry, and other industries. It has high applicability in each field of the industry.

11, 21: release film for process 12: cutter 13: XY stage 14, 24: frame 15, 25: upper mold 16: 26 substrate 17: 27: semiconductor chip 18, 28: molding resin 19, 29: Lower die 19a, 29a: Cavity block 19b, 29b: Clamper 19c, 29c: Cavity 310: Lower die base 312: Lower die 314: Lower die clamper 314a, 314b: Flow path 316, 326: Springs 318, 319, 328: Seal 320: Upper mold base 322: Upper mold 324: Upper mold clamper 324a: Flow path 330, 332: Air suction mechanism 340: Semiconductor chip 350: Release film for process 352: Mold resin 360: Cavity a1: Initial _stage of cavity Depth a ₂ : final cavity depth L ₀ : initial film length ΔL ₁ : maximum film elongation ΔL ₂ : return value

Claims (12)

In a state in which the inner surface of the cavity recess provided in the lower mold is covered with a process release film and the mold resin is supplied to the cavity recess, the article to be molded is clamped between the upper mold and the lower mold. A method for manufacturing a resin molded product by compression molding,
The release film for process, the resin for molding, and the article to be molded are set in a mold, and the release film for process is sucked from the lower mold side to follow the inner surface of the cavity recess. the step of adsorbing;
Optionally, in a state in which the upper mold and the lower mold are brought into contact with each other to form a cavity air-sealed with the outside, the cavity is evacuated by an air suction mechanism through a flow path provided in communication with the cavity. and a step of clamping the upper mold and the lower mold to a compression molding position, curing the molding resin, and compression molding the molded product in this order,
The tensile strength in at least one direction of the process release film is 1.0 MPa to 10.0 MPa when stretched 37.5% at 100 mm / min at a temperature of 175 ° C.,
And the process release film was stretched by 37.5% in at least one direction under the same conditions, then rested for 2 minutes, and then returned to the origin direction at 100 mm / min in the compression direction. From a certain return value, the restoration rate (%) obtained according to the following formula (1) is 30 to 80 (%) ,
A method for producing a resin-molded product , wherein the process release film is stretched and compressed during the compression molding Return value/stretched length×100=restoration rate % (1). In a state in which the inner surface of the cavity recess provided in the upper mold is covered with a process release film, and the resin for molding and the article to be molded are supplied to the lower mold, the upper mold and the lower mold are used to perform the molding. A method for manufacturing a resin molded product by clamping and compression molding the product,
The release film for process, the resin for the mold, and the article to be molded are set in a mold, and the release film for process is sucked from the upper mold side to follow the inner surface of the cavity recess. the step of adsorbing;
Optionally, in a state in which the upper mold and the lower mold are brought into contact with each other to form a cavity air-sealed with the outside, a vacuum is drawn from the cavity by an air suction mechanism through a flow path provided communicating with the cavity. a step of evacuating, and a step of clamping the upper mold and the lower mold to a compression molding position, curing the molding resin, and compression molding the molded product in this order,
The tensile strength in at least one direction of the process release film is 1.0 MPa to 10.0 MPa when stretched 37.5% at 100 mm / min at a temperature of 175 ° C.,
And the process release film was stretched by 37.5% in at least one direction under the same conditions, then rested for 2 minutes, and then returned to the origin direction at 100 mm / min in the compression direction. From a certain return value, the restoration rate (%) obtained according to the following formula (1) is 30 to 80 (%) ,
A method for producing a resin-molded product , wherein the process release film is stretched and compressed during the compression molding Return value/stretched length×100=restoration rate % (1). The molding resin is supplied to the process release film outside the mold, and the molding resin is carried into the mold together with the process release film to perform resin molding. 3. The method for producing a resin molded article according to claim 1 or 2. The method for manufacturing a resin-molded article according to any one of claims 1 to 3, wherein the article to be molded includes a semiconductor chip. 4. The method of manufacturing a resin-molded article according to claim 1, wherein the article to be molded is a substrate on which a plurality of semiconductor chips are mounted, a semiconductor wafer, or a lead frame. The difference in the depth of the cavity before and after the step of clamping the upper mold and the lower mold to a compression molding position, curing the molding resin, and compression molding the molded product is 1.0 mm or more. The method for producing a resin-molded product according to any one of claims 1 to 5, wherein The cavity depth after the step of clamping the upper mold and the lower mold to a compression molding position, curing the molding resin, and compression molding the molded product is 0.5 mm or more. A method for producing a resin molded article according to any one of claims 1 to 6. 2. The maximum temperature in the step of clamping the upper mold and the lower mold to a compression molding position, curing the molding resin, and compression molding the molded product is 110 to 190°C. 8. The method for producing a resin molded product according to any one of 7 above. Resin molding according to any one of claims 1 to 8, wherein the molding resin contains at least one resin selected from the group consisting of epoxy resins, polyimide resins, and silicone resins. method of manufacturing the product. 10. The method for producing a resin-molded product according to any one of claims 1 to 9, wherein the contact angle of water on at least one surface of the process release film is 90° to 130°. A method for manufacturing a resin-encapsulated semiconductor device, comprising a step of manufacturing a resin-molded product by the manufacturing method according to any one of claims 1 to 10. 12. A method of manufacturing an electrical/electronic device or a transportation machine, comprising a step of manufacturing a resin-encapsulated semiconductor by the manufacturing method according to claim 11.

Images