JP7170246B2 - UV-Curable Resin Composition, Method for Manufacturing Light-Emitting Device, and Light-Emitting Device - Google Patents

Description

The present disclosure relates to an ultraviolet curable resin composition, a method for manufacturing a light emitting device, and a light emitting device. More specifically, an ultraviolet curable resin composition containing a polymerizable compound and a polymerization initiator, and a light emitting device using the same. The present invention relates to a manufacturing method and a light emitting device.

Patent Literature 1 describes a sealant for organic EL display elements. This sealing agent for an organic EL display element contains a polymerizable compound and a polymerization initiator, has a viscosity of 5 to 50 mPa·s at 25°C, and has a surface tension of 15 to 35 mN/m at 25°C. The cured product has a Poisson's ratio of 0.28 to 0.40 at 25°C. Moreover, it is described that the sealing agent for organic EL display elements of patent document 1 can be easily apply|coated by the inkjet method.

WO2018/074506

A sealant for an organic EL display element that is applied by an inkjet method has a problem of storage stability. That is, the sealant for organic EL display elements may be stored for a long period of time in the inkjet apparatus due to the convenience of the process of sealing the organic EL display element, for example, about 6 months in the inkjet apparatus. After storage, it may be used for sealing the organic EL display element. Therefore, there is a demand for a sealant for organic EL display elements whose properties do not change during storage.

The present disclosure has been made in view of the above reasons, and an object of the present disclosure is to provide an ultraviolet curable resin composition whose properties are less likely to change during storage. Another object of the present disclosure is to provide a method for manufacturing a light-emitting device and a light-emitting device using an ultraviolet curable resin composition whose properties are less likely to change during storage.

An ultraviolet curable resin composition according to an aspect of the present disclosure is an ultraviolet curable resin composition containing a polymerizable compound and a polymerization initiator, and a coating film of the ultraviolet curable resin composition having a thickness of 10 μm, When ultraviolet rays with a peak wavelength of 395 nm are irradiated within the range of an integrated light amount of 800 mJ/cm ² or more and 4000 mJ/cm ² or less, the irradiation intensity of the ultraviolet rays is 1 W/cm ² or less, and the polymerizability in the coating film The reaction rate of the compound is less than 70%.

A method for manufacturing a light-emitting device according to an aspect of the present disclosure is a method for manufacturing a light-emitting device including a light source and an optical component that transmits light emitted by the light source, and the ultraviolet-curable resin composition is molded by an inkjet method. After that, the ultraviolet curable resin composition molded by the inkjet method is irradiated with ultraviolet rays to be cured, thereby producing an optical component.

A light-emitting device according to an aspect of the present disclosure includes a light source and an optical component that transmits light emitted by the light source, and the optical component includes a cured product of the ultraviolet-curable resin composition.

According to the present disclosure, there is an advantage that it is possible to provide an ultraviolet curable resin composition whose properties are less likely to change during storage.

FIG. 1 is a schematic cross-sectional view showing one embodiment of a light emitting device according to the present disclosure. FIG. 2 is a schematic cross-sectional view showing one embodiment of a light emitting device according to the present disclosure.

[Ultraviolet curable resin composition]
The ultraviolet curable resin composition (hereinafter sometimes referred to as composition (X)) according to this embodiment contains a polymerizable compound and a polymerization initiator. Composition (X) is cured by being irradiated with ultraviolet rays. That is, when the composition (X) is irradiated with ultraviolet rays, the polymerizable compound initiates a polymerization reaction due to the action of the polymerization initiator, and the polymerizable compound undergoes a polymerization reaction to generate a compound having a large molecular weight and cure. do. The polymerizable compound contains, for example, at least one component selected from the group consisting of monomers, oligomers and prepolymers. The polymerization initiator may contain a curing catalyst.

The polymerizable compound contains, for example, at least one of a radically polymerizable compound and a cationic polymerizable compound. When the polymerizable compound contains a radically polymerizable compound, the composition (X) further contains a photoradical initiator as a polymerization initiator. When the polymerizable compound contains a cationic polymerizable compound, the composition (X) further contains a photocationic initiator (cationic curing catalyst) as a polymerization initiator.

[Radical polymerizable compound]
The radical polymerizable compound (Y1) reacts by radical polymerization. That is, the radical photoinitiator generates active radicals and attacks the radically polymerizable compound (Y1), thereby proceeding the reaction of the radically polymerizable compound (Y1).

When the polymerizable compound (Y) contains the radically polymerizable compound (Y1), the radically polymerizable compound (Y1) preferably contains the acrylic compound (A). The acrylic compound (A) has one or more (meth)acryloyl groups in one molecule. In addition, "(meth)acry" means at least one of "acry" and "methacry".

The viscosity of the entire acrylic compound (A) at 25° C. is preferably 50 mPa·s or less. In this case, the acrylic compound (A) can particularly lower the viscosity of the composition (X). The viscosity of the acrylic compound (A) as a whole is more preferably 30 mPa·s or less, even more preferably 25 mPa·s or less, and particularly preferably 20 mPa·s or less. Moreover, the viscosity of the acrylic compound (A) as a whole is, for example, 3 mPa·s or more.

It is also preferable that the viscosity of the entire acrylic compound (A) at 40° C. is 50 mPa·s or less. In this case, the acrylic compound (A) can particularly reduce the viscosity of the composition (X) when heated. The viscosity of the acrylic compound (A) as a whole is more preferably 30 mPa·s or less, more preferably 25 mPa·s or less, and particularly preferably 20 mPa·s or less. Moreover, the viscosity of the acrylic compound (A) as a whole is, for example, 3 mPa·s or more. The viscosity in the present disclosure is measured using a rheometer under conditions of a shear rate of 100 s ⁻¹ . As a rheometer, model number DHR-2 manufactured by Anton Paar Japan, for example, can be used.

The acrylic compound (A) preferably contains a polyfunctional acrylic compound (A) having two or more (meth)acryloyl groups in one molecule. In this case, the polyfunctional acrylic compound (A1) can increase the glass transition temperature of the cured product, and therefore can increase the heat resistance of the cured product (sealant). The amount of the polyfunctional acrylic compound (A1) is, for example, 50% by mass or more and 100% by mass or less with respect to the entire acrylic compound (A). The acrylic compound (A) may contain only the polyfunctional acrylic compound (A1).

The polyfunctional acrylic compound (A1) includes, for example, 1,3-butylene glycol di(meth)acrylate, 1,4-butanediol oligoacrylate, diethylene glycol diacrylate, 1,6-hexanediol oligoacrylate, neopentyl glycol diacrylate, Triethylene glycol diacrylate, tripropylene glycol diacrylate, dipropylene glycol diacrylate, cyclohexanedimethanol diacrylate, tricyclodecanedimethanol diacrylate, bisphenol A polyethoxy diacrylate, bisphenol F polyethoxy diacrylate, pentatriestol tetra Acrylates, propoxylated (2) neopentyl glycol diacrylate, trimethylolpropane triacrylate, tris(2-hydroxyethyl) isocyanurate triacrylate, pentaerythritol triacrylate, ethoxylated (3) trimethylolpropane triacrylate, propoxylated ( 3) glyceryl triacrylate, pentaerythritol tetraacrylate, ditrimethylolpropane tetraacrylate, ethoxylated (4) pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, 2-(2-ethoxyethoxy)ethyl acrylate, hexadiol diacrylate, polyethylene glycol diacrylate, polyethylene glycol dimethacrylate, tripropylene glycol triacrylate, bispentaerythritol hexaacrylate, ethylene glycol diacrylate, 1,6-hexanediol diacrylate, ethoxylated 1,6-hexanediol diacrylate, polypropylene glycol diacrylate Acrylates, 1,4-butanediol diacrylate, 1,9-nonanediol diacrylate, tetraethylene glycol diacrylate, 2-n-butyl-2-ethyl-1,3-propanediol diacrylate, neopentyl hydroxypivalate Glycol diacrylate, hydroxypivalic acid trimethylolpropane triacrylate, ethoxylated phosphoric acid triacrylate, ethoxylated tripropylene glycol diacrylate, neopentyl glycol-modified trimethylolpropane diacrylate, stearic acid-modified pentaerythritol diacrylate, tetramethylolpropane triacrylate Chestnut tetramethylolmethane triacrylate, caprolactone-modified trimethylolpropane triacrylate, propoxylate glyceryl triacrylate, tetramethylolmethane tetraacrylate, ethoxylated pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate, caprolactone-modified dipentaerythritol hexaacrylate, di Pentaerythritol hydroxypentaacrylate, neopentyl glycol oligoacrylate, trimethylolpropane oligoacrylate, pentaerythritol oligoacrylate, ethoxylated neopentyl glycol di(meth)acrylate, propoxylated neopentyl glycol di(meth)acrylate, tripropylene glycol di( It contains at least one compound selected from the group consisting of meth)acrylate, ethoxylated trimethylolpropane triacrylate, and propoxylated trimethylolpropane triacrylate. In addition, the component which a polyfunctional acrylic compound (A1) may contain is not restricted above.

The acrylic equivalent of the polyfunctional acrylic compound (A1) is preferably 150 g/eq or less, more preferably 90 g/eq or more and 150 g/eq or less. The weight average molecular weight of the polyfunctional acrylic compound (A1) is, for example, 100 or more and 1000 or less, more preferably 200 or more and 800 or less.

The polyfunctional acrylic compound (A1) may contain a compound having at least one of a benzene ring, an alicyclic ring and a polar group. A polar group is, for example, at least one of an OH group and an NHCO group. In this case, shrinkage during curing of the composition (X) can be particularly reduced. Furthermore, the adhesiveness between the cured product and the member made of the inorganic material can be enhanced. The polyfunctional acrylic compound (A1) is at least selected from the group consisting of tricyclodecane dimethanol diacrylate, bisphenol A polyethoxy diacrylate, bisphenol F polyethoxy diacrylate, trimethylolpropane triacrylate and pentatriestol tetraacrylate. It may contain one compound. These compounds can particularly reduce shrinkage when the composition (X) is cured. Furthermore, these compounds can also enhance the adhesion between the cured product and the member made of an inorganic material.

The polyfunctional acrylic compound (A1) particularly preferably contains a compound (A11) having a structure represented by formula (1) below.

_CH2 =CR1 _- COO-(R3 ^- O) _n -CO-CR2= ^CH2 ( ¹ )
In formula (1), each of R ¹ and R ² is hydrogen or a methyl group, n is an integer of 1 or more, R ³ is an alkylene group having 3 or more carbon atoms, and when n is 2 or more, A plurality of R ³ may be the same or different.

Compound (A11) has a structure represented by formula (1), in particular, the number of carbon atoms of R ³ in formula (1) is 3 or more, so that it can be used as a sealing material (cured product of composition (X)) It is difficult to increase the affinity with water. Therefore, the sealing material is less likely to be deteriorated by water. The carbon number of R ³ is, for example, 3 or more and 15 or less. Further, the compound (A11) has a structure represented by the formula (1), in particular, has two (meth)acryloyl groups in one molecule, so that the glass transition temperature of the cured product can be increased. Therefore, the heat resistance of the cured product (sealing material) can be enhanced. Also, n in formula (1) is an integer of 1 or more and 12 or less, for example.

The percentage ratio of compound (A11) to acrylic compound (A) is preferably 50% by mass or more. In this case, it is particularly difficult to increase the affinity of the sealing material for water. The percentage ratio of the compound (A11) to the acrylic compound (A) is, for example, 100% by mass or less, or 95% by mass or less, preferably 80% by mass or less.

Compound (A11) particularly preferably contains compound (A12) having a boiling point of 270° C. or higher. That is, the acrylic compound (A) preferably contains a compound (A12) having a structure represented by formula (1) and a boiling point of 270°C or higher. In this case, the acrylic compound (A) is less likely to volatilize from the composition (X) during storage and when the composition (X) is heated. Therefore, the storage stability of composition (X) is less likely to be impaired. Further, even if the compound (A12) remains unreacted in the cured product of the composition (X), outgassing due to the compound (A12) is less likely to occur from the cured product. Therefore, voids due to outgassing are less likely to occur in the sealing material. If there is a gap in the sealing material, moisture may enter the sealing material through this gap. The boiling point is the boiling point under normal pressure obtained by converting the boiling point under reduced pressure, and can be determined, for example, by the method shown in Science of Petroleum, Vol. II. P.1281 (1938). More preferably, the boiling point of compound (A12) is 280° C. or higher.

The percentage ratio of compound (A12) to acrylic compound (A) is preferably 50% by mass or more. In this case, the storage stability of composition (X) is effectively enhanced, outgassing from the encapsulant is effectively reduced, and the affinity of the encapsulant for water is particularly difficult to increase. The percentage ratio of the compound (A12) to the acrylic compound (A) is, for example, 100% by mass or less, or 95% by mass or less, preferably 80% by mass or less.

The viscosity of compound (A12) at 25° C. is preferably 25 mPa·s or less. In this case, compound (A12) can lower the viscosity of composition (X). The viscosity of compound (A12) at 25° C. is more preferably 25 mPa·s or less, still more preferably 20 mPa·s or less, and particularly preferably 15 mPa·s or less. The viscosity of compound (A12) at 25° C. is, for example, 1 mPa·s or more, preferably 3 mPa·s or more, and more preferably 5 mPa·s or more.

The compound (A12) is, for example, a group consisting of an alkylene glycol di(meth)acrylate, a polyalkylene glycol di(meth)acrylate, and an alkylene oxide-modified alkylene glycol di(meth)acrylate. contains at least one compound selected from

Di(meth)acrylic acid ester of alkylene glycol is a compound in which n is 1 in formula (1). In this case, R ³ in formula (1) preferably has 4 to 12 carbon atoms. R ³ may be linear or branched. In particular, di(meth)acrylic acid esters of alkylene glycols are 1,4-butanediol diacrylate, 1,3-butylene glycol diacrylate, neopentyl glycol diacrylate, 1,6-hexanediol diacrylate, 1,9 - nonanediol diacrylate, 1,10-decanediol diacrylate, 1,4-butanediol dimethacrylate, 1,3-butylene glycol dimethacrylate, neopentyl glycol dimethacrylate, 1,6-hexanediol dimethacrylate, 1, It preferably contains at least one compound selected from the group consisting of 9-nonanediol dimethacrylate, 1,10-decanediol dimethacrylate, and 1,12-dodecanediol dimethacrylate. In addition, the di(meth)acrylic acid ester of alkylene glycol is manufactured by Sartomer, product number SR213, Osaka Organic Chemical Industry Co., Ltd. product number V195, Sartomer product number SR212, Sartomer product number SR247, Kyoei Chemical Industry Co., Ltd. Product name Light acrylate NP-A, product number SR238NS manufactured by Sartomer, product number V230 manufactured by Osaka Organic Chemical Industry Co., Ltd., product number HDDA manufactured by Daicel, product number 1,6HX-A manufactured by Kyoei Chemical Industry Co., Ltd., Osaka Organic Chemical Industry Co., Ltd. product number V260 manufactured by Kyoei Chemical Industry Co., Ltd., product number 1,9-ND-A manufactured by Shin-Nakamura Chemical Industry Co., Ltd., product number A-NOD-A manufactured by Sartomer, product number CD595 manufactured by Sartomer, product number SR214NS manufactured by Sartomer, Shin-Nakamura Product number BD manufactured by Kagaku Kogyo Co., Ltd. Product number SR297 manufactured by Sartomer Co., Ltd. Product number SR248 manufactured by Sartomer Co., Ltd. Product name Light Ester NP manufactured by Kyoei Chemical Industry Co., Ltd. Product number SR239NS manufactured by Sartomer Co., Ltd. Product name Light Ester 1 manufactured by Kyoei Chemical Industry Co., Ltd. , 6HX, product number HD-N manufactured by Shin-Nakamura Chemical Industry Co., Ltd., product name Light Ester 1, 9ND manufactured by Kyoei Chemical Industry Co., Ltd., product number NOD-N manufactured by Shin-Nakamura Chemical Industry Co., Ltd., product name Light Ester 1 manufactured by Kyoei Chemical Industry Co., Ltd. , 10DC, product number DOD-N manufactured by Shin-Nakamura Chemical Co., Ltd., and product number SR262 manufactured by Sartomer.

Di(meth)acrylic acid ester of polyalkylene glycol is a compound in which n is 2 or more in formula (1). n is, for example, 2 to 10, preferably 2 to 7, more preferably 2 to 6, and more preferably 2 to 3. The carbon number of R ³ is, for example, 2-5. As the number of carbon atoms increases, the hydrophobicity of the cured product and the color resist 1 increases, and the color resist 1 becomes less permeable to moisture. Di(meth)acrylic acid esters of polyalkylene glycols are in particular diethylene glycol diacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, hexaethylene glycol dimethacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate. It preferably contains at least one compound selected from the group consisting of acrylates, tripropylene glycol dimethacrylate and tritetramethylene glycol diacrylate. In addition, the di(meth)acrylic acid ester of polyalkylene glycol is particularly available from Sartomer under the product number SR230, from Sartomer under the product number SR508NS, from Daicel under the product number DPGDA, from Sartomer under the product number SR306NS, and from Daicel under the product number TPGDA. , Product number V310HP manufactured by Osaka Organic Chemical Industry Co., Ltd. Product number APG200 manufactured by Shin-Nakamura Chemical Industry Co., Ltd. Product name Light acrylate PTMGA-250 manufactured by Kyoei Chemical Industry Co., Ltd. Product number SR231NS manufactured by Sartomer Co., Ltd. Product name Light manufactured by Kyoei Chemical Industry Co., Ltd. Ester 2EG, product number SR205NS manufactured by Sartomer, product name Light Ester 3EG manufactured by Kyoei Chemical Industry, product number SR210NS manufactured by Sartomer, product name Light Ester 4EG manufactured by Kyoei Chemical Industry, product name Acryester HX manufactured by Mitsubishi Chemical Corporation, and new It is preferable to contain at least one compound selected from the group consisting of product number 3PG manufactured by Nakamura Chemical Co., Ltd.

The di(meth)acrylic acid ester of alkylene oxide-modified alkylene glycol contains, for example, propylene oxide-modified neopentyl glycol. Further, the di(meth)acrylic acid ester of alkylene oxide-modified alkylene glycol contains, for example, product number EBECRYL145 manufactured by Daicel.

It is preferable that the percentage of components having a boiling point of 270° C. or higher in the acrylic compound (A) is 80 mass % or higher. When the acrylic compound (A) contains the compound (A12), the percentage of components having a boiling point of 270° C. or higher, including the compound (A12), in the acrylic compound (A) is 80% by mass or more. is preferred. In this case, the storage stability of the composition (X) is particularly unlikely to be impaired, and outgassing is particularly unlikely to occur from the cured product. More preferably, the percentage of components having a boiling point of 280° C. or higher in the acrylic compound (A) is 80 mass % or higher.

Compound (A11) may contain compound (A13) other than compound (A12).

The polyfunctional acrylic compound (A1) may contain a compound (A14) having three or more (meth)acryloyl groups in one molecule. That is, the acrylic compound (A) may contain the compound (A14). In this case, compound (A14) can contain, for example, at least one selected from the group consisting of trimethylolpropane triacrylate and trimethylolpropane trimethacrylate. When the acrylic compound (A) contains the compound (A14), the compound (A14) can particularly increase the glass transition temperature of the cured product, and therefore can particularly increase the heat resistance of the encapsulant.

When the acrylic compound (A) contains the compound (A14), the percentage of the compound (A14) to the acrylic compound (A) is preferably more than 0% by mass and 25% by mass or less. More preferably, the percentage of compound (A14) is 10% by mass or more. In this case, the glass transition temperature of the cured product can be particularly increased. Further, when the compound (A14) is 25% by mass or less, the increase in viscosity of the composition (X) due to the compound (A14) is less likely to occur. If the percentage of compound (A14) is 20% by mass or less, the increase in viscosity of composition (X) is particularly difficult to occur.

The acrylic compound (A) may contain a monofunctional acrylic compound (A2) having only one (meth)acryloyl group in one molecule. The monofunctional acrylic compound (A2) can suppress shrinkage during curing of the composition (X). Moreover, the monofunctional acrylic compound (A2) can contribute to reducing the viscosity of the composition (X). When the acrylic compound (A) contains the monofunctional acrylic compound (A2), the ratio of the monofunctional acrylic compound (A2) to the total amount of the acrylic compound (A) is preferably more than 0% by mass and 70% by mass or less. . When the percentage of the monofunctional acrylic compound (A2) is more than 0% by mass, the shrinkage of the composition (X) during curing can be suppressed by the monofunctional acrylic compound (A2). More preferably, the percentage of the monofunctional acrylic compound (A2) is 5% by mass or more. When the percentage of the monofunctional acrylic compound (A2) is 70% by mass or less, outgassing due to the monofunctional acrylic compound (A2) is less likely to occur from the composition (X) and the cured product. In addition, if the amount of the monofunctional acrylic compound (A2) is 70% by mass or less, the amount of the polyfunctional component in the acrylic compound (A) can be ensured. can improve. The percentage of the monofunctional acrylic compound (A2) is more preferably 50% by mass or less, even more preferably 40% by mass or less, and particularly preferably 30% by mass or less.

The monofunctional acrylic compound (A2) is, for example, isobornyl (meth)acrylate, dicyclopentanyl (meth)acrylate, 3,3,5-trimethylcyclohexyl (meth)acrylate, 4-tert-butylcyclohexyl (meth) Acrylate, dicyclopentenyloxyethyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, isobutyl (meth)acrylate, t-butyl ( meth) acrylate, isooctyl (meth) acrylate, 2-methoxyethyl (meth) acrylate, methoxytriethylene glycol (meth) acrylate, 2-ethoxyethyl (meth) acrylate, 3-methoxybutyl (meth) acrylate, ethoxyethyl (meth) acrylate ) acrylate, butoxyethyl (meth) acrylate, ethoxydiethylene glycol (meth) acrylate, methoxydixylethyl (meth) acrylate, ethyl diglycol (meth) acrylate, cyclic trimethylolpropane formal mono (meth) acrylate, imide (meth) acrylate , isoamyl (meth)acrylate, ethoxylated succinic acid (meth)acrylate, trifluoroethyl (meth)acrylate, ω-carboxypolycaprolactone mono (meth)acrylate, cyclohexyl (meth)acrylate, 2-(2-ethoxyethoxy)ethyl (meth)acrylate, stearyl (meth)acrylate, diethylene glycol monobutyl ether (meth)acrylate, lauryl (meth)acrylate, isodecyl (meth)acrylate, isooctyl (meth)acrylate, octyl/decyl (meth)acrylate, tridecyl (meth)acrylate , caprolactone (meth)acrylate, ethoxylated (4) nonylphenol (meth)acrylate, methoxypolyethylene glycol (350) mono (meth)acrylate, methoxypolyethylene glycol (550) mono (meth)acrylate, phenoxyethyl (meth)acrylate, cyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, benzyl (meth)acrylate, methylphenoxyethyl (meth)acrylate, caprolactone-modified tetrahydrofurfuryl (meth)acrylate lylate, tribromophenyl (meth)acrylate, ethoxylated tribromophenyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, ethylene oxide adduct of 2-phenoxyethyl (meth)acrylate, 2-phenoxyethyl (meth) from the group consisting of propylene oxide adducts of acrylates, phenoxydiethylene glycol (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, 3-methacryloyloxymethylcyclohexene oxide, and 3-(meth)acryloyloxymethylcyclohexene oxide It contains at least one selected compound. In addition, the component which a monofunctional acrylic compound (A2) may contain is not restricted above.

The monofunctional acrylic compound (A2) preferably contains a compound having an alicyclic structure. Compounds having an alicyclic structure include, for example, cyclohexyl (meth)acrylate, dicyclopentanyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, caprolactone-modified tetrahydrofurfuryl (meth)acrylate, isobornyl (meth)acrylate, di It contains at least one compound selected from the group consisting of cyclopentenyloxyethyl (meth)acrylate, 3,3,5-trimethylcyclohexyl (meth)acrylate and 4-tert-butylcyclohexyl (meth)acrylate. In addition, the components that the compound having an alicyclic structure may contain are not limited to those described above.

The monofunctional acrylic compound (A2) also preferably contains a compound (A21) represented by the following formula (10). In this case, the viscosity of the composition (X) can be easily lowered, and an optical component such as a sealing material produced from the composition (X) can easily be provided with adhesion to a member made of an inorganic material. In addition, the compound (A21) has a property of being difficult to volatilize in spite of having a low viscosity. Therefore, even when the composition (X) is stored, the composition (X) is unlikely to change in composition due to volatilization of the monofunctional acrylic compound (A2).

In formula (10), R ⁰ is H or a methyl group. X is a single bond or a divalent hydrocarbon group. Each of R ¹ to R ¹¹ is H, an alkyl group or -R ¹² -OH, R ¹² is an alkylene group and at least one of R ¹ to R ¹¹ is an alkyl group or -R ¹² -OH. R ¹ to R ¹¹ are not chemically bonded to each other.

When X is a divalent hydrocarbon group, X preferably has 1 to 5 carbon atoms, more preferably 1 to 3 carbon atoms. Divalent hydrocarbon radicals are, for example, methylene, ethylene or propylene radicals. It is particularly preferred if X is a single bond or a methylene group. In this case, there is an advantage that the compound (A21) has a small molecular weight and a low viscosity.

When at least one of R ¹ to R ¹¹ is an alkyl group, the alkyl group preferably has 1 to 8 carbon atoms. Alkyl is, for example, methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl or octyl. Alkyl groups may be linear or branched. That is, for example, when the alkyl group is a butyl group, the butyl group may be a t-butyl group, an n-butyl group, or a sec-butyl group. When the alkyl group is a hexyl group, the hexyl group may be a t-hexyl group, an n-hexyl group, or a sec-hexyl group. If the alkyl group is an octyl group, the octyl group can be, for example, a t-octyl group. It is particularly preferred if the alkyl group is methyl or t-butyl. In this case, there is an advantage that the compound (A21) has a small molecular weight and a low viscosity.

In formula (10), an alkyl group or -R ¹² -OH is preferably connected only to the 4-position of the cyclohexane ring. That is, of R ¹ to R ¹¹ , it is preferred that at least one of R ⁶ and R ⁷ is an alkyl group or -R ¹² -OH and each of the remaining is H. It is particularly preferred that of R ¹ to R ¹¹ only R ⁶ is an alkyl group or -R ¹² -OH and each of the remaining is H. In this case, the compound represented by the formula (10) can have good reactivity, and it is particularly easy to give the color resist 1 adhesion to members made of an inorganic material. This is because the cyclohexane ring in the compound represented by formula (10) has a boat-shaped conformation, and the bulky alkyl group or —R ¹² —OH at the 4-position tends to be located at the pseudoequatorial position. it is conceivable that. It is believed that the compound represented by formula (10) having such a structure enhances the reactivity of the (meth)acryloyl group in the compound represented by formula (10). Further, when the compound represented by formula (10) has such a structure, the compound represented by formula (10) can increase the free volume in the optical component. Therefore, it is thought that the interfacial free energy between the optical component and the inorganic material member tends to decrease, and as a result, the adhesion between the optical component and the inorganic material member tends to increase. The ^{bulkier the alkyl group or —R 12 —OH} , the more likely it is to be positioned in the pseudoequatorial position. From this point of view, the alkyl group or -R ¹² -OH preferably has as many carbon atoms as possible, and the alkyl group or -R ¹² -OH preferably has a branch. For example, it is preferred that the alkyl group or -R ¹² -OH is a t-butyl group.

In formula (10), it is also preferred that an alkyl group or —R ¹² —OH is attached only to each of the 3- and 5-positions of the cyclohexane ring. That is, among R ¹ to R ¹¹ , at least one of R ⁴ and R ⁵ is an alkyl group or -R ¹² -OH, at least one of R ⁸ and R ⁹ is an alkyl group or -R ¹² -OH, It is preferred that each of the remaining is H. Of R ¹ to R ¹¹ , only one of R ⁴ and R ⁵ is an alkyl group or -R ¹² -OH, at least one of R ⁸ and R ⁹ is an alkyl group or -R ¹² -OH, and the remaining More preferably each is H. Of R ¹ to R ¹¹ , at least one of R ⁴ and R ⁵ is an alkyl group or -R ¹² -OH, only one of R ⁸ and R ⁹ is an alkyl group or -R ¹² -OH, and the remaining It is also more preferred that each is H. Also in this case, the compound represented by the formula (10) can have good reactivity, and particularly easily imparts adhesion to the inorganic material member to the optical component. This is because the cyclohexane ring in the compound shown in formula (10) has a boat-shaped conformation, and the bulky alkyl groups or —R ¹² —OH at each of the 3- and 5-positions are located in the pseudoequatorial position. This is probably because it is easy. For this reason, the reactivity of the (meth)acryloyl group in the compound represented by formula ( ¹⁰ ) is enhanced, and It is considered that the adhesion between the optical component and the member made of the inorganic material tends to be high. The ^{bulkier the alkyl group or —R 12 —OH} , the more likely it is to be positioned in the pseudoequatorial position. From this point of view, the alkyl group or -R ¹² -OH preferably has as many carbon atoms as possible, and the alkyl group or -R ¹² -OH preferably has a branch. For example, it is preferred that the alkyl group or -R ¹² -OH is a t-butyl group.

When at least one of R ¹ to R ¹¹ is —R ¹² —OH, R ¹² preferably has 1 to 5 carbon atoms, more preferably 1 to 3 carbon atoms. R ¹² is, for example, a methylene, ethylene or propylene group. It is particularly preferred if R ¹² is a methylene group. In this case, there is an advantage that the compound (A21) has a small molecular weight and a low viscosity.

In formula (10) it is particularly preferred if each of R ¹ to R ¹¹ is H or an alkyl group and at least one of R ¹ to R ¹¹ is an alkyl group. In this case, the compound of formula (10) can have a particularly low viscosity, so that composition (X) can have a particularly low viscosity. Therefore, the composition (X) can be particularly easily molded by an inkjet method.

The compound (A21) preferably contains at least one compound selected from the group consisting of a compound represented by the following formula (11), a compound represented by the following formula (12), and a compound represented by the following formula (13).

It is particularly preferable if the monofunctional acrylic compound (A2) contains at least one of the compound represented by formula (11) and the compound represented by formula (12). In this case, it is particularly easy to lower the viscosity of the composition (X), to increase the glass transition temperature of the optical component, and to increase the adhesion between the optical component and the inorganic material member. In addition, since the compound represented by the formula (11) and the compound represented by the formula (12) are difficult to volatilize, the storage stability of the composition (X) is likely to be improved.

The monofunctional acrylic compound (A2) also preferably contains a compound having a cyclic ether structure. The number of ring members of the cyclic ether structure in the compound having the cyclic ether structure is preferably 3 or more, more preferably 3 or more and 4 or less. The number of carbon atoms contained in the cyclic ether structure is preferably 2 or more and 9 or less, more preferably 2 or more and 6 or less. The compound having a cyclic ether structure contains, for example, at least one compound selected from the group consisting of 3-methacryloyloxymethylcyclohexene oxide and 3-acryloyloxymethylcyclohexene oxide.

The monofunctional acrylic compound (A2) preferably contains at least one compound having a viscosity of 20 mPa·s or less at 25°C. In this case, the viscosity of composition (X) can be lowered.

The monofunctional acrylic compound (A2) preferably contains at least one compound having a glass transition temperature of 80°C or higher. In this case, the cured product of composition (X) can have a high glass transition temperature. The monofunctional acrylic compound (A2) more preferably contains at least one compound having a glass transition temperature of 90°C or higher, and more preferably contains at least one compound having a glass transition temperature of 100°C or higher.

The monofunctional acrylic compound (A2) preferably contains at least one compound having a boiling point of 200°C or higher. In this case, the monofunctional acrylic compound (A2) hardly deteriorates the storage stability of the composition (X). More preferably, the monofunctional acrylic compound (A2) contains at least one compound having a boiling point of 250° C. or higher.

It is particularly preferable if the monofunctional acrylic compound (A2) contains at least one compound having a viscosity at 25° C. of 20 mPa·s or less and a glass transition temperature of 80° C. or more. It is also preferred that the monofunctional acrylic compound (A2) contains at least one compound having a viscosity at 25°C of 20 mPa·s or less and a boiling point of 200°C or more. It is also preferred that the monofunctional acrylic compound (A2) contains at least one compound having a glass transition temperature of 80°C or higher and a boiling point of 200°C or higher. If the monofunctional acrylic compound (A2) contains at least one compound having a viscosity at 25° C. of 20 mPa·s or less, a glass transition temperature of 80° C. or higher, and a boiling point of 200° C. or higher, Especially preferred.

In particular, the monofunctional acrylic compound (A2) includes isobornyl (meth)acrylate, dicyclopentanyl (meth)acrylate, 3,3,5-trimethylcyclohexyl (meth)acrylate and 4-tertbutylcyclohexyl (meth)acrylate. It preferably contains at least one compound selected from the group consisting of acrylates. Isobornyl (meth)acrylate, dicyclopentanyl (meth)acrylate, 3,3,5-trimethylcyclohexyl (meth)acrylate and 4-tertbutylcyclohexyl (meth)acrylate have high glass transition temperature, low viscosity and Due to its high boiling point, the properties of the composition (X) and optical parts can be particularly enhanced.

The acrylic compound (A) is selected from the group consisting of a compound (A41) having silicon in the molecular skeleton, a compound (A42) having phosphorus in the molecular skeleton, and a compound (A43) having nitrogen in the molecular skeleton. It is preferred to further contain at least one compound. In this case, the adhesion between the optical component and the member made of the inorganic material is improved. Therefore, it is difficult for a gap to form between the optical component and the light emitting element, and it is difficult for moisture to enter the optical component through this gap.

The compounds (A41), (A42) and (A43) are defined by the types of atoms in the molecular skeleton. Therefore, the compounds contained in each of the polyfunctional acrylic compound (A1) and the monofunctional acrylic compound (A2) overlap with the compounds contained in each of the compound (A41), the compound (A42) and the compound (A43). sell.

The compound (A41) is, for example, 3-(trimethoxysilyl)propyl acrylate (for example, product number KBM5103 manufactured by Shin-Etsu Chemical Co., Ltd.) and a (meth)acrylic group-containing alkoxysilane oligomer (for example, product number KR-513 manufactured by Shin-Etsu Chemical Co., Ltd. ) contains at least one compound selected from the group consisting of However, since the boiling point of 3-(trimethoxysilyl)propyl acrylate is 260° C., when acrylic compound (A) contains 3-(trimethoxysilyl)propyl acrylate, acrylic acid to acrylic compound (A) The percentage of 3-(trimethoxysilyl)propyl should be 10% by weight or less.

Compound (A42) includes acid phosphooxy (meth)acrylates, such as acid phosphooxy polyoxypropylene glycol monomethacrylate.

Compound (A43) includes, for example, at least one compound selected from the group consisting of acryloylmorpholine, diethylacrylamide, dimethylaminopropylacrylamide and pentamethylpiperidyl methacrylate.

When acrylic compound (A) contains at least one compound selected from the group consisting of compound (A41), compound (A42) and compound (A43), compound (A41) and compound (A42) for acrylic compound (A) ) and compound (A43) is preferably 0.5% by mass or more and 20% by mass or less, more preferably 1% by mass or more and 15% by mass or less.

The radical polymerizable compound (Y1) may contain a radical polymerizable compound (E) other than the acrylic compound (A). The radically polymerizable compound (E) includes a polyfunctional radically polymerizable compound (E1) having two or more radically polymerizable functional groups per molecule and a monofunctional radically polymerizable compound having only one radically polymerizable functional group per molecule. Either one or both of the radically polymerizable compound (E2) can be contained. The amount of the radically polymerizable compound (E) with respect to the total amount of the acrylic compound (A) and the radically polymerizable compound (E) is, for example, 10% by mass or less. The polyfunctional radically polymerizable compound (E1) is, for example, a group consisting of aromatic urethane oligomers, aliphatic urethane oligomers, epoxy acrylate oligomers, polyester acrylate oligomers and other special oligomers having two or more ethylenic double bonds in one molecule. It may contain at least one compound selected from In addition, the components that the polyfunctional radically polymerizable compound (E1) may contain are not limited to those described above. Monofunctional radically polymerizable compounds (E2) include, for example, N-vinylformamide, vinylcaprolactam, vinylpyrrolidone, phenyl glycidyl ether, p-tert-butylphenyl glycidyl ether, butyl glycidyl ether, 2-ethylhexyl glycidyl ether, allyl glycidyl ether, 1,2-butylene oxide, 1,3-butadiene monoxide, 1,2-epoxidedecane, epichlorohydrin, 1,2-epoxydecane, styrene oxide, cyclohexene oxide, 3-vinylcyclohexene oxide, 4-vinylcyclohexene It contains at least one compound selected from the group consisting of oxide, N-vinylpyrrolidone and N-vinylcaprolactam. In addition, the components that the monofunctional radically polymerizable compound (E2) may contain are not limited to those described above.

[Cationically polymerizable compound]
The cationic polymerizable compound (Y2) reacts by cationic polymerization. That is, the photocationic initiator generates an acid by ultraviolet irradiation, and this acid attacks the cationically polymerizable compound (Y2), so that the process of addition polymerization or ring-opening polymerization of the cationically polymerizable compound (Y2) is sequential. proceed to

When the polymerizable compound (Y) contains the cationically polymerizable compound (Y2), the cationically polymerizable compound (Y2) is, for example, a polyfunctional cationically polymerizable compound (C1) and a monofunctional cationically polymerizable compound (C2). contains at least one of

The polyfunctional cationically polymerizable compound (C1) is one or both of a polyfunctional cationically polymerizable compound (C11) having no siloxane skeleton and a polyfunctional cationically polymerizable compound (C12) having a siloxane skeleton. can contain

The polyfunctional cationically polymerizable compound (C11) does not have a siloxane skeleton and has two or more cationically polymerizable functional groups per molecule. The number of cationically polymerizable functional groups per molecule of the polyfunctional cationically polymerizable compound (C11) is preferably 2 to 4, more preferably 2 to 3.

The cationic polymerizable functional group is, for example, at least one group selected from the group consisting of epoxy group, oxetane group and vinyl ether group.

The polyfunctional cationically polymerizable compound (C11) is, for example, a group consisting of polyfunctional alicyclic epoxy compounds, polyfunctional heterocyclic epoxy compounds, polyfunctional oxetane compounds, alkylene glycol diglycidyl ethers, and alkylene glycol monovinyl monoglycidyl ethers. contains at least one compound selected from In addition, the components that the polyfunctional cationically polymerizable compound (C11) may contain are not limited to those described above.

The polyfunctional alicyclic epoxy compound contains, for example, one or both of a compound represented by the following formula (20) and a compound represented by the following formula (30).

In formula (20), each of R ¹ to R ¹⁸ is independently a hydrogen atom, a halogen atom, or a hydrocarbon group. The number of carbon atoms in the hydrocarbon group is preferably within the range of 1-20. The hydrocarbon group is, for example, an alkyl group having 1 to 20 carbon atoms such as a methyl group, an ethyl group, or a propyl group; an alkenyl group having 2 to 20 carbon atoms such as a vinyl group or an allyl group; or an ethylidene group or a propylidene group. 20 alkylidene groups. The hydrocarbon group may contain an oxygen atom or a halogen atom. Each of R ¹ to R ¹⁸ is independently preferably a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms, more preferably a hydrogen atom or a methyl group, most preferably a hydrogen atom.

In formula (20), X is a single bond or a divalent organic group, and the organic group is, for example, -CO-O-CH ₂ -.

Examples of the compound represented by formula (20) include the compound represented by formula (20a) below and the compound represented by formula (20b) below. In addition, the components that the compound represented by the formula (20) may contain are not limited to those described above.

In formula (30), each of R ¹ to R ¹² is independently a hydrogen atom, a halogen atom, or a hydrocarbon group having 1 to 20 carbon atoms. Halogen is, for example, fluorine, chlorine, bromine or iodine. The hydrocarbon group having 1 to 20 carbon atoms is, for example, an alkyl group having 1 to 20 carbon atoms such as a methyl group, an ethyl group and a propyl group; an alkenyl group having 2 to 20 carbon atoms such as a vinyl group and an allyl group; or an ethylidene group and a propylidene group. It is an alkylidene group having 2 to 20 carbon atoms such as a group. The hydrocarbon group having 1 to 20 carbon atoms may contain an oxygen atom or a halogen atom.

Each of R ¹ to R ¹² is independently preferably a hydrogen atom or a hydrocarbon group having 1 to 20 carbon atoms, more preferably a hydrogen atom or a methyl group, most preferably a hydrogen atom.

Examples of compounds represented by formula (30) include tetrahydroindene diepoxide represented by formula (30a) below.

A polyfunctional heterocyclic epoxy compound contains, for example, a trifunctional epoxy compound represented by the following formula (42).

A polyfunctional oxetane compound contains, for example, a bifunctional oxetane compound represented by the following formula (43).

Alkylene glycol diglycidyl ether contains, for example, at least one compound selected from the group consisting of compounds represented by the following formulas (44) to (47).

Alkylene glycol monovinyl monoglycidyl ether contains, for example, a compound represented by the following formula (48).

More specifically, the polyfunctional cationic polymerizable compound (C11) is, for example, Celoxide 2021P and Celoxide 8010 manufactured by Daicel, TEPIC-VL manufactured by Nissan Chemical, OXT-221 manufactured by Toagosei, and 1, manufactured by Yokkaichi Gosei. It can contain at least one component selected from the group consisting of 3-PD-DEP, 1,4-BG-DEP, 1,6-HD-DEP, NPG-DEP and butylene glycol monovinyl monoglycidyl ether.

The polyfunctional cationically polymerizable compound (C11) preferably contains a polyfunctional alicyclic epoxy compound. In this case, the composition (X) can have a particularly high cationic polymerization reactivity.

The polyfunctional alicyclic epoxy compound preferably contains one or both of the compound represented by formula (20) and the compound represented by formula (30). In this case, composition (X) can have higher cationic polymerization reactivity.

When the polyfunctional alicyclic epoxy compound contains the compound represented by formula (20), the compound represented by formula (20) preferably contains the compound represented by formula (20a). In this case, the composition (X) can have a higher cationic polymerization reactivity and a particularly low viscosity.

In particular, since the compound represented by formula (30) has a low viscosity, when the compound represented by formula (30) is contained, the composition (X) can have good ultraviolet curability, It can have a particularly low viscosity. Furthermore, the compound represented by formula (30) has a property of being difficult to volatilize in spite of having a low viscosity. Therefore, even if the composition (X) contains the compound represented by the formula (30), the composition (X) is unlikely to change in composition due to volatilization of the compound represented by the formula (30). Therefore, by containing the compound represented by formula (30), the composition (X) can have a low viscosity without impairing the storage stability.

The compound represented by formula (30) can be synthesized, for example, by oxidizing a cyclic olefin compound having a tetrahydroindene skeleton using an oxidizing agent.

The compound of formula (30) can contain four stereoisomers based on the configuration of the two epoxy rings. Compounds of formula (30) may include any of the four stereoisomers. That is, the compound represented by formula (30) can contain at least one component selected from the group consisting of four stereoisomers. In the compound represented by the formula (30), the ratio of the total amount of the exo-endo form and the endo-endo form among the four stereoisomers is 10% by mass or less with respect to the entire epoxy compound (A1). is preferred, and 5% by mass or less is more preferred. In this case, the heat resistance of the cured product can be improved. The ratio of specific stereoisomers in the compound represented by formula (30) can be determined based on the peak area ratio appearing in the chromatogram obtained by gas chromatography.

In order to reduce the amounts of the exo-endo form and the endo-endo form in the compound represented by the formula (30), a method of precision distillation of the compound represented by the formula (30), a column chromatography using silica gel as a packing material, etc. Any suitable method can be applied, such as a method applying graphics.

When the composition (X) contains the polyfunctional cationically polymerizable compound (C11), the ratio of the polyfunctional cationically polymerizable compound (C11) to the cationically polymerizable compound (Y2) is within the range of 5 to 95% by mass. Preferably. If the proportion of the polyfunctional cationically polymerizable compound (C11) is 5% by mass or more, the composition (X) can have particularly excellent reactivity during the cationic photopolymerization reaction, and thereby the cured product is high. It can have strength (hardness). Further, if the proportion of the polyfunctional cationically polymerizable compound (C11) is 95% by mass or less, when the composition (X) contains the moisture absorbent (F), the moisture absorbent (F ) can be particularly easily dispersed uniformly. The proportion of the polyfunctional cationically polymerizable compound (C11) is more preferably 12% by mass or more, more preferably 15% by mass or more, even more preferably 20% by mass or more, and even more preferably 25% by mass or more. is particularly preferred. The proportion of this polyfunctional cationically polymerizable compound (C11) is more preferably 85% by mass or less, and even more preferably 60% by mass or less. For example, it is preferable that the proportion of the polyfunctional cationically polymerizable compound (C11) is within the range of 20 to 60% by mass.

When the polyfunctional cationically polymerizable compound (C11) contains a polyfunctional alicyclic epoxy compound, the polyfunctional alicyclic epoxy compound may be a part of the polyfunctional cationically polymerizable compound (C11), or the entire may be The ratio of the polyfunctional alicyclic epoxy compound to the polyfunctional cationically polymerizable compound (C11) is preferably in the range of 15 to 100% by mass. When this proportion is 15% by mass or more, the polyfunctional alicyclic epoxy compound can particularly contribute to improving the ultraviolet curability of the composition (X).

The polyfunctional cationically polymerizable compound (C12) has a siloxane skeleton and two or more cationically polymerizable functional groups per molecule. The number of cationically polymerizable functional groups per molecule of the polyfunctional cationically polymerizable compound (C12) is preferably 2 to 6, more preferably 2 to 4. The polyfunctional cationically polymerizable compound (C12) can contribute to improving the cationic polymerization reactivity of the composition (X), and can contribute to improving the resistance to heat discoloration of the cured product (optical component). In addition, the polyfunctional cationically polymerizable compound (C12) can also contribute to lowering the elastic modulus of the cured product, and therefore can impart flexibility to the cured product.

The polyfunctional cationically polymerizable compound (C12) is preferably liquid at 25°C. In particular, the viscosity at 25° C. of the polyfunctional cationic polymerizable compound (C12) is preferably in the range of 10 to 300 mPa·s. In this case, an increase in the viscosity of composition (X) can be suppressed.

The cationically polymerizable functional group possessed by the polyfunctional cationically polymerizable compound (C12) is, for example, at least one group selected from the group consisting of an epoxy group, an oxetane group and a vinyl ether group.

The siloxane skeleton of the polyfunctional cationically polymerizable compound (C12) may be linear, branched, or cyclic. The number of Si atoms in the siloxane skeleton is preferably within the range of 2-14. In this case, composition (X) can have a particularly low viscosity. The number of Si atoms is more preferably within the range of 2-10, more preferably within the range of 2-7, and particularly preferably within the range of 3-6.

The polyfunctional cationically polymerizable compound (C12) contains, for example, at least one of the compound represented by formula (50) and the compound represented by formula (51).

R in each of formulas (50) and (51) is a single bond or a divalent organic group, preferably an alkylene group. Y is a siloxane skeleton, which may be linear, branched, or cyclic, and the number of Si atoms is preferably within the range of 2 to 14, preferably within the range of 2 to 10. is more preferable, more preferably in the range of 2 to 7, and particularly preferably in the range of 3 to 6. n is an integer of 2 or more, preferably in the range of 2-4.

More specifically, for example, the polyfunctional cationically polymerizable compound (C12) contains a compound represented by the following formula (50a).

R in formula (50a) is a single bond or a divalent organic group, preferably an alkylene group having 1 to 4 carbon atoms. n in the formula (50a) is an integer of 0 or more. n is preferably in the range of 0 to 12, more preferably in the range of 0 to 8, still more preferably in the range of 0 to 5, and particularly in the range of 1 to 4 preferable.

The compound represented by formula (50a) preferably contains a compound represented by formula (60) below. That is, the polyfunctional cationically polymerizable compound (C12) preferably contains a compound represented by the following formula (60).

In formula (60), n is an integer of 0 or more, preferably in the range of 0 to 12, more preferably in the range of 0 to 8, and further if in the range of 0 to 5 Preferably, it is in the range of 1 to 4, particularly preferably.

Examples of compounds represented by formula (60) include compounds represented by formula (60a-1) below.

The polyfunctional cationically polymerizable compound (C12) is represented by the following formulas (50b) to (50d) and (51a) to (51b) in place of the compound represented by the formula (50a), or together with the compound represented by the formula (50a). It may contain at least one compound among the compounds shown in .

R in formula (50d) is a single bond or a divalent organic group, preferably an alkylene group having 1 to 4 carbon atoms. n in the formula (50d) is an integer of 0 or more. m in the formula (50d) is an integer of 2 or more.

R in formula (51a) is a single bond or a divalent organic group, preferably an alkylene group having 1 to 4 carbon atoms. n in the formula (51a) is an integer of 0 or more, preferably in the range of 8-80. m in the formula (51a) is an integer of 2 or more, preferably in the range of 2-6.

R in formula (51b) is a single bond or a divalent organic group, preferably an alkylene group having 1 to 4 carbon atoms. n in the formula (51b) is an integer of 0 or more, preferably in the range of 8-80.

More specifically, the polyfunctional cationic polymerizable compound (C12) is, for example, Shin-Etsu Chemical Co., Ltd. product numbers X-40-2669, X-40-2670, X-40-2715, X-40-2732, Contains at least one component selected from the group consisting of X-22-169AS, X-22-169B, X-22-2046, X-22-343, X-22-163, and X-22-163B is preferred.

The polyfunctional cationically polymerizable compound (C12) preferably has an alicyclic epoxy structure, and it is particularly preferable if the polyfunctional cationically polymerizable compound (C12) contains a compound represented by formula (50a). The compound represented by the formula (50a) can particularly contribute to improving the cationic polymerization reactivity and lowering the viscosity of the composition (X), and can particularly contribute to improving the resistance to heat discoloration and lowering the elastic modulus of the cured product.

When the composition (X) contains the polyfunctional cationically polymerizable compound (C12), the ratio of the polyfunctional cationically polymerizable compound (C12) to the cationically polymerizable compound (Y2) is within the range of 5 to 95% by mass. Preferably. If the proportion of the polyfunctional cationically polymerizable compound (C12) is 95% by mass or less, the composition (X) can have particularly high cationic photopolymerization reactivity, so that the cured product has particularly high strength (hardness). can have The proportion of the polyfunctional cationically polymerizable compound (C12) is more preferably 6% by mass or more, further preferably 13% by mass or more, and particularly preferably 20% by mass or more. Further, the proportion of this polyfunctional cationically polymerizable compound (C12) is more preferably 70% by mass or less, in which case the refractive index of the cured product can be increased. More preferably, the proportion of the polyfunctional cationic polymerizable compound (C12) is 45% by mass or less. For example, it is preferable that the proportion of the polyfunctional cationic polymerizable compound (C12) is within the range of 20 to 70% by mass.

The monofunctional cationically polymerizable compound (C2) has only one cationically polymerizable functional group per molecule. The cationic polymerizable functional group is, for example, at least one group selected from the group consisting of epoxy group, oxetane group and vinyl ether group.

The viscosity of the monofunctional cationic polymerizable compound (C2) at 25° C. is preferably 8 mPa·s or less. In this case, the monofunctional cationic polymerizable compound (C2) can reduce the viscosity of the composition (X) even if the composition (X) does not contain a solvent. In particular, the viscosity at 25° C. of the monofunctional cationic polymerizable compound (C2) is preferably in the range of 0.1 to 8 mPa·s.

The monofunctional cationic polymerizable compound (C2) can contain, for example, at least one compound selected from the group consisting of compounds represented by the following formulas (62) to (67) and limonene oxide.

The monofunctional cationically polymerizable compound (C2) particularly preferably contains a compound represented by the above formula (66). In this case, it is possible to lower the viscosity of the composition (X). Furthermore, the compound represented by formula (66) has a high boiling point and low volatility among the components that can be contained in the monofunctional cationically polymerizable compound (C2). increase can be effectively suppressed. Therefore, even when the composition (X) is stored for a long period of time, it can have good applicability and can maintain good inkjet applicability.

The ratio of the monofunctional cationically polymerizable compound (C2) to the cationically polymerizable compound (Y2) is preferably in the range of 5 to 50% by mass. If the ratio of the monofunctional cationically polymerizable compound (C2) is 5% by mass or more, the viscosity of the composition (X) can be particularly reduced. Further, when the ratio of the monofunctional cationically polymerizable compound (C2) is 50% by mass or less, the composition (X) can have particularly excellent reactivity during the photocationic polymerization reaction, and thereby, the cured product can have high strength (hardness). The proportion of the monofunctional cationically polymerizable compound (C2) is more preferably 10% by mass or more, and even more preferably 15% by mass or more. The proportion of the monofunctional cationically polymerizable compound (C2) is more preferably 40% by mass or less, even more preferably 35% by mass or less, and particularly preferably 30% by mass or less. If the proportion of the monofunctional cationically polymerizable compound (C2) is particularly 35% by mass or less, the amount of volatilization of the components in the composition (X) during storage of the composition (X) can be effectively reduced. Therefore, even if the composition (X) is stored for a long period of time, the properties of the composition (X) are unlikely to be impaired. Furthermore, it is particularly possible to suppress the occurrence of tackiness (adhesiveness) in the cured product. For example, it is preferable that the ratio of the monofunctional cationic polymerizable compound (C2) is within the range of 10 to 35% by mass.

Further, particularly when the composition (X) contains the polyfunctional cationically polymerizable compound (C11) and the polyfunctional cationically polymerizable compound (C12), the cationically polymerizable compound (Y2) is subjected to polyfunctional cationically polymerizable The proportion of the compound (C11) is within the range of 30 to 60% by mass, the proportion of the polyfunctional cationically polymerizable compound (C12) is within the range of 15 to 30% by mass, and the proportion of the monofunctional cationically polymerizable compound (C2) is It is preferably within the range of 15 to 40% by mass. In this case, good storage stability, low viscosity, and good cationic polymerization reactivity of the composition (X) can be achieved in a well-balanced manner. well achievable.

[Photoradical initiator]
When the composition (X) contains the radically polymerizable compound (Y1), the composition (X) preferably further contains a photoradical initiator (B). The photoradical initiator (B) is not particularly limited as long as it is a compound that generates radical species when irradiated with ultraviolet rays. Photoradical initiators (B) include, for example, aromatic ketones, acylphosphine oxide compounds, aromatic onium salt compounds, organic peroxides, thio compounds (thioxanthone compounds, thiophenyl group-containing compounds, etc.), hexaarylbiimidazole compounds. , a ketoxime ester compound, a borate compound, an azinium compound, a metallocene compound, an active ester compound, a compound having a carbon-halogen bond, and an alkylamine compound. The amount of the photoradical initiator (B) relative to 100 parts by mass of the composition (X) is, for example, 1 part by mass or more and 10 parts by mass or less.

The radical photoinitiator (B) may contain a sensitizer as part of the radical photoinitiator (B). The sensitizer can promote the radical generation reaction of the photoradical initiator (B), improve the reactivity of radical polymerization, and improve the crosslink density. Sensitizers are, for example, 9,10-dibutoxyanthracene, 9-hydroxymethylanthracene, thioxanthone, 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2-chlorothioxanthone, 2,4-diethylthioxanthone, anthraquinone, 1,2- dihydroxyanthraquinone, 2-ethylanthraquinone, 1,4-diethoxynaphthalene, p-dimethylaminoacetophenone, p-diethylaminoacetophenone, p-dimethylaminobenzophenone, p-diethylaminobenzophenone, 4,4′-bis(dimethylamino)benzophenone, It can contain at least one compound selected from the group consisting of 4,4'-bis(diethylamino)benzophenone, p-dimethylaminobenzaldehyde, and p-diethylaminobenzaldehyde. In addition, the component which a sensitizer may contain is not restricted to the above.

The content of the sensitizer in the composition (X) is, for example, 0.1 parts by mass or more and 5 parts by mass or less, preferably 0.1 parts by mass with respect to 100 parts by mass of the solid content of the composition (X) part or more and 3 parts by mass or less. If the content of the sensitizer is within this range, the composition (X) can be cured in the air, and it is necessary to cure the composition (X) in an inert atmosphere such as a nitrogen atmosphere. Gone.

The composition (X) may contain a polymerization accelerator in addition to the photoradical initiator (B). Polymerization accelerators include, for example, ethyl p-dimethylaminobenzoate, 2-ethylhexyl p-dimethylaminobenzoate, methyl p-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, butoxy p-dimethylaminobenzoate. Contains amine compounds such as ethyl. In addition, the components that the polymerization accelerator may contain are not limited to those mentioned above.

The radical photopolymerization initiator (B) preferably contains a component having photobleaching properties. The component having photobleaching property preferably contains an acylphosphine oxide photoinitiator, and also preferably contains a compound having photobleaching property among oxime ester photoinitiators.

The radical photopolymerization initiator (B) also preferably contains a component having a sensitizer skeleton in the molecule. The sensitizer skeleton includes, for example, at least one of a 9H-thioxanthen-9-one skeleton and an anthracene skeleton. That is, the radical photopolymerization initiator (B) preferably contains a component having at least one of a 9H-thioxanthene-9-one skeleton and an anthracene skeleton.

The radical photopolymerization initiator (B) preferably contains an oxime ester photoinitiator, regardless of the presence or absence of photobleaching properties, from the viewpoint of improving curability and making outgassing less likely to occur from the cured product.

The oxime ester-based photoinitiator has a fragrance in order to make the composition (X) and production equipment less likely to be contaminated by decomposition products from the composition (X), and to further make outgassing from the cured product less likely to occur. It preferably contains a compound having a ring, more preferably contains a compound having a condensed ring containing an aromatic ring, and further preferably contains a compound having a condensed ring containing a benzene ring and a hetero ring.

Oxime ester photoinitiators include, for example, 1,2-octadione-1-[4-(phenylthio)-, 2-(o-benzoyloxime)] and ethanone, 1-[9-ethyl-6-(2- methylbenzoyl)-9H-carbazol-3-yl]-, 1-(o-acetyloxime), and JP 2000-80068, JP 2001-233842, JP 2010-527339, JP 2010- 527338, JP-A-2013-041153, JP-A-2015-93842, etc. can contain at least one compound selected from the group consisting of oxime ester photoinitiators. The oxime ester-based photoinitiators are commercially available products having a carbazole skeleton, Irgacure OXE-02 (manufactured by BASF), Adeka Arcules NCI-831, N-1919 (manufactured by ADEKA) and TR-PBG-304 (Changzhou Kyokuden Denshi). New Material Co., Ltd.), Irgacure OXE-01 having a diphenyl sulfide skeleton, ADEKA Arkles NCI-930 (ADEKA Co., Ltd.), TR-PBG-345 and TR-PBG-3057 (all of these, Changzhou Tenryu Denshi New Materials Co., Ltd.) , and at least one compound selected from the group consisting of TR-PBG-365 (manufactured by Changzhou Yuan Electronics New Materials Co., Ltd.) and SPI-04 (manufactured by Sanyang) having a fluorene skeleton. In particular, when the oxime ester photoinitiator contains a compound having a diphenyl sulfide skeleton or a fluorene skeleton, it is preferable in that the cured product is less likely to be colored by photobleaching. It is also preferable that the oxime ester-based photoinitiator contains a compound having a carbazole skeleton, since exposure sensitivity tends to increase.

It is also preferred that the oxime ester photoinitiator contains two or more compounds. In this case, for example, the oxime ester photoinitiator contains two or more compounds with different exposure sensitivities, so that the amount of the radical photopolymerization initiator (B) can be reduced while maintaining good exposure sensitivity. Therefore, outgassing from the cured product can be further suppressed.

[Photo cationic initiator]
When the composition (X) contains the cationically polymerizable compound (Y2), the composition (X) preferably further contains a photocationic initiator (cationic curing catalyst) (D). The photocationic initiator (D) is not particularly limited as long as it is a catalyst that generates protonic acid or Lewis acid upon receiving light irradiation. The photocationic initiator (D) can contain at least one of an ionic photoacid-generating photocationic initiator and a nonionic photoacid-generating photocationic initiator.

The ionic photoacid-generating photocationic initiator can contain at least one of onium salts and organometallic complexes. Examples of onium salts include aromatic diazonium salts, aromatic halonium salts, and aromatic sulfonium salts. Examples of organometallic complexes include iron-arene complexes, titanocene complexes, and arylsilanol-aluminum complexes. The ionic photoacid-generating photocationic initiator can contain at least one of these components.

The nonionic photoacid-generating photocationic initiator is at least selected from the group consisting of, for example, nitrobenzyl esters, sulfonic acid derivatives, phosphoric acid esters, phenolsulfonic acid esters, diazonaphthoquinones, and N-hydroxyimidophosphonates. It can contain one component. In addition, the components that the nonionic photoacid-generating photocationic initiator may contain are not limited to those described above.

More specific examples of the compound that can contain the photocationic initiator (D), Midori Chemical DPI series (105, 106, 109, 201, etc.), BI-105, MPI series (103, 105, 106, 109 etc.), BBI series (101, 102, 103, 105, 106, 109, 110, 200, 210, 300, 301, etc.), TSP series (102, 103, 105, 106, 109, 200, 300, 1000, etc.) , HDS-109, MDS series (103, 105, 109, 203, 205, 209, etc.), BDS-109, MNPS-109, DTS series (102, 103, 105, 200, etc.), NDS series (103, 105, 155, 165, etc.), DAM series (101, 102, 103, 105, 201, etc.), SI series (105, 106, etc.), PI-106, NDI series (105, 106, 109, 1001, 1004, etc.), PAI series (01, 101, 106, 1001, 1002, 1003, 1004, etc.), MBZ-101, PYR-100, NB series (101, 201, etc.), NAI series (100, 1002, 1003, 1004, 101, 105, 106, 109, etc.), TAZ series (100, 101, 102, 103, 104, 107, 108, 109, 110, 113, 114, 118, 122, 123, 203, 204, etc.), NBC-101, ANC-101 , TPS-Acetate, DTS-Acetate, Di-Boc Bisphinol A, tert-Butyl lithocholate, tert-Butyl deoxycholate, tert-Butyl cholate, BX, BC-2, MPI-103, BDS-105, TPS-103, NAT- 103, BMS-105, and TMS-105;
Cyracure UVI-6970, Cyracure UVI-6974, Cyracure UVI-6990, and Cyracure UVI-950 manufactured by Union Carbide, USA;
Irgacure 250, Irgacure 261 and Irgacure 264 from BASF;
CG-24-61 manufactured by Ciba-Geigy;
Adeka Optomer SP-150, Adeka Optomer SP-151, Adeka Optomer SP-170 and Adeka Optomer SP-171 manufactured by ADEKA Corporation;
DAICAT II manufactured by Daicel Corporation;
UVAC1590 and UVAC1591 manufactured by Daicel Cytec Co., Ltd.;
CI-2064, CI-2639, CI-2624, CI-2481, CI-2734, CI-2855, CI-2823, CI-2758, and CIT-1682 manufactured by Nippon Soda Co., Ltd;
PI-2074, a tetrakis(pentafluorophenyl)borate toluyl cumyl iodonium salt from Rhodia;
FFC509 manufactured by 3M;
CD-1010, CD-1011 and CD-1012 manufactured by Sartomer, USA;
CPI-100P, CPI-101A, CPI-110P, CPI-110A and CPI-210S from Sun-Apro Corporation; and UVI-6992 and UVI-6976 from The Dow Chemical Company. The photocationic initiator (D) can contain at least one compound selected from the group consisting of these compounds.

The ratio of the photocationic initiator (D) to the cationic polymerizable compound (Y2) is preferably in the range of 1 to 4% by mass. When this proportion is 1% by mass or more, the composition (X) can have particularly good cationic polymerization reactivity. In addition, when this ratio is 4% by mass or less, the composition (X) can have good storage stability, and since it does not contain an excessive amount of the photocationic initiator (D), the production cost can be reduced. It is possible.

[Other ingredients]
Composition (X) may further contain a moisture absorbent. When the composition (X) contains a moisture absorbent, even if the cured product of the composition (X) is exposed to moisture, the moisture absorbent absorbs moisture, making the cured product less likely to deteriorate. The average particle size of the moisture absorbent is preferably 200 nm or less. In this case, the cured product can have high transparency. The hygroscopic agent is preferably hygroscopic inorganic particles, and preferably contains at least one component selected from the group consisting of zeolite particles, silica gel particles, calcium chloride particles, and titanium oxide nanotube particles. In addition, the components that the moisture absorbent may contain are not limited to those described above. It is particularly preferred that the absorbent contains zeolite particles.

When the composition (X) contains the cationically polymerizable compound (Y2), the composition (X) preferably further contains a sensitizer. In this case, the composition (X) can have a particularly high cationic polymerization reactivity. The sensitizer contains, for example, one or both of 9,10-dibutoxyanthracene and 9,10-diethoxyanthracene. The ratio of the sensitizer to the cationic polymerizable compound (Y2) is preferably in the range of more than 0% by mass and 1% by mass or less. In this case, the sensitizer is less likely to impair the transparency of the cured product, so that the cured product can have good transparency.

The ultraviolet curable resin composition according to this embodiment can be prepared by mixing the components described above. Composition (X) is preferably liquid at 25°C.

[Physical properties]
When a 10 μm-thick coating film of the UV-curable resin composition according to the present embodiment is irradiated with UV rays having a peak wavelength of 395 nm within the range of an integrated light amount of 800 mJ/cm ² or more and 4000 mJ/cm ² or less, the UV rays is 1 W/cm ² or less, and the reaction rate of the polymerizable compound in the coating film is less than 70%. In other words, a coating film of composition (X) having a thickness of 10 μm is irradiated with ultraviolet rays having a peak wavelength of 395 nm within the range of an integrated light amount of 800 mJ/cm ² or more and 4000 mJ/cm ² or less, and an irradiation intensity of 1 W/cm ² or less. The reaction rate of the polymerizable compound in the coating is less than 70% when irradiated. The above conditions are set at normal temperature (25° C.) and normal pressure (1 MPa). Also, the ultraviolet irradiation is performed in the atmosphere.

Here, in the present disclosure, "ultraviolet rays" means light rays with a wavelength in the range of 200 nm or more and 410 nm or less, but in the composition (X) according to the present embodiment, the wavelength is in the range of 385 nm or more and 405 nm or less. Cures effectively with UV light. In the present disclosure, the peak wavelength of ultraviolet light is preferably 395 nm within the range of 385 nm or more and 405 nm or less. It should be noted that the peak wavelength is the wavelength of light with the highest emission intensity in the light of wavelengths within a predetermined range.

In addition, in the present disclosure, the “integrated amount of light” is the amount of ultraviolet light exposure, and is a value calculated by multiplying the irradiation intensity and the irradiation time (the total amount of ultraviolet light irradiated during the irradiation time). The irradiation intensity is illuminance, and the unit is W/cm ² . The irradiation time is the time during which ultraviolet rays are irradiated, and the unit is seconds (sec).

In addition, in the present disclosure, “reaction rate” indicates the rate of reaction of the polymerizable compound in the coating film due to irradiation with ultraviolet rays. That is, the polymerizable compound in the coating film before irradiation with ultraviolet rays is polymerized and reacted by the irradiation with ultraviolet rays, and is reduced, and the ratio of the reduced polymerizable compound is the reaction rate. Specifically, the reaction rate is calculated by an infrared absorption spectrum method (IR method). That is, first, the coating film before irradiation with ultraviolet rays is measured by an IR method to obtain an IR spectrum derived from the polymerizable compound in the coating film. Next, the coating film is irradiated with ultraviolet rays. As a result, at least part of the polymerizable compound in the coating film reacts, and the amount of unreacted polymerizable compound in the coating film is reduced. Next, the coating film after irradiation with ultraviolet rays is measured by an IR method to obtain an IR spectrum derived from the polymerizable compound in the coating film. Then, the IR spectrum obtained before irradiation with ultraviolet rays is compared with the IR spectrum obtained after irradiation with ultraviolet rays, and the reaction rate is obtained from the rate of peak decrease. That is, in order to convert the change in absorbance to a reaction rate, the initial state before the reaction is defined as a reaction rate of 0, and the state where the reactive functional groups are almost completely consumed and the peak intensity is zero is defined as a reaction rate of 100. Obtained by formula (1) (CMC Publishing, "LED-UV Curing Technology and Curing Material Current Status and Prospects-Ultraviolet Curing Technology Using Light Emitting Diodes-", Chapter 6 Current Status and Prospects of Analysis Methods in UV Curing, 290 page).
Reaction rate (%) = 100 × {1-(A _v ) _t / (A _v ) ₀ } (1)
Here, _Av is the peak intensity of the arbitrary wavenumber, and t is the elapsed time (0 is before the start of the reaction).

In the ultraviolet curable resin composition according to the present embodiment, when a coating film having a thickness of 10 μm is irradiated with ultraviolet rays having a peak wavelength of 395 nm within the range of an integrated light amount of 800 mJ / cm ² or more and 4000 mJ / cm ² or less, the above Since the irradiation intensity of ultraviolet rays is 1 W/cm ² or less and the reaction rate of the polymerizable compound in the coating film is less than 70%, curing hardly progresses. That is, under the above conditions, the polymerization reaction of the polymerizable compound is difficult to progress, and the reaction rate of the polymerizable compound remains low at less than 70%. Therefore, although the composition (X) is somewhat tacky and viscous, it is in a fluid liquid state, is not completely cured, and does not easily change over time. It has excellent storage stability and does not easily change its properties during storage. In particular, when the composition (X) is applied by an inkjet method, clogging of nozzles and hardening that impairs circulation in the inkjet device are less likely to occur, and poor coating and damage to the device are reduced. .

Further, when the coating film of the ultraviolet curable resin composition according to the present embodiment with a thickness of 10 μm is irradiated with ultraviolet rays having a peak wavelength of 395 nm within the range of an integrated light amount of 800 mJ/cm ² or more and 4000 mJ/cm ² or less, When the irradiation intensity of the ultraviolet rays exceeds 1 W/cm ² and the reaction rate of the polymerizable compound in the coating film is 70% or more, particularly when the irradiation intensity of the ultraviolet rays exceeds 5 W/cm ² In addition, it is preferable that the reaction rate of the polymerizable compound in the coating film is 70% or more. In other words, a coating film of composition (X) having a thickness of 10 μm is irradiated with ultraviolet rays having a peak wavelength of 395 nm in an integrated light amount of 800 mJ/cm ² or more and 4000 mJ/cm ² or less, and the irradiation intensity exceeds 5 W/cm ² . In the case of irradiation, the reaction rate of the polymerizable compound in the coating film is preferably 70% or more. In this case, the polymerization reaction of the composition (X) proceeds not so slowly, and the composition (X) can be efficiently cured.

Furthermore, when a 10 μm-thick coating film of the UV-curable resin composition according to the present embodiment is irradiated with UV rays having a peak wavelength of 395 nm within the range of an integrated light amount of 800 mJ/cm ² or more and 4000 mJ/cm ² or less, In particular, when the irradiation intensity of the ultraviolet rays exceeds 8 W/cm ² , it is preferable that the reaction rate of the polymerizable compound in the coating film is 80% or more. In other words, a coating film of composition (X) having a thickness of 10 μm is irradiated with ultraviolet rays having a peak wavelength of 395 nm in an integrated light amount of 800 mJ/cm ² or more and 4000 mJ/cm ² or less, and the irradiation intensity exceeds 8 W/cm ² . In the case of irradiation, the reaction rate of the polymerizable compound in the coating film is preferably 80% or more. In this case, the polymerization reaction of the composition (X) is almost completed and becomes difficult to proceed, and the curing of the composition (X) can be completed.

As described above, the ultraviolet curable resin composition according to the present embodiment is obtained when a coating film having a thickness of 10 μm is irradiated with ultraviolet rays having a peak wavelength of 395 nm in an integrated light amount of 800 mJ / cm ² or more and 4000 mJ / cm ² or less. Second, the reaction rate of the polymerizable compound changes according to the irradiation intensity of the ultraviolet rays. That is, even if the thickness of the coating film is constant and the range of the wavelength of the irradiated ultraviolet rays and the range of the cumulative amount of light are constant, the reaction rate of the polymerizable compound varies depending on the irradiation intensity of the ultraviolet rays to be irradiated. vary and the degree of cure is different. Specifically, a coating film of composition (X) having a thickness of 10 μm is irradiated with ultraviolet rays having a peak wavelength of 395 nm in an integrated light amount of 800 mJ/cm ² or more and 4000 mJ/cm ² or less, and the irradiation intensity is 1 W/cm ² . When irradiated at below, the reaction rate of the polymerizable compound in the coating film is less ^than 70%. % or more and less than 80%, and when the irradiation intensity exceeds 8 W/cm ² , the reaction rate of the polymerizable compound in the coating film is preferably 80% or more.

In the present disclosure, when the integrated light intensity is at least one value within the range of 800 mJ / cm ² or more and 4000 mJ / cm ² or less, the irradiation intensity of ultraviolet rays is 1 W / cm ² or less, and the polymerization in the coating film It suffices if the reaction rate of the organic compound is less than 70%.

In the present disclosure, "curing" refers to a state in which the composition (X) becomes hard and exhibits little fluidity and stickiness (tack). For example, when the tackiness of composition (X) disappears (reaction rate of 80% or more), it can be considered that composition (X) has cured (became a cured product).

In the ultraviolet curable resin composition according to the present embodiment, when a coating film having a thickness of 10 μm is irradiated with ultraviolet rays having a peak wavelength of 395 nm within the range of an integrated light amount of 800 mJ / cm ² or more and 4000 mJ / cm ² or less, the above When the UV irradiation intensity is 1 W/cm ² or less, heat is generated by DSC (differential scanning calorimeter) derived from unreacted components in the cured coating film, and the irradiation intensity exceeds 8 W/cm ² , It is preferable that no heat is generated by DSC due to unreacted components in the cured product of the coating film.

It is preferable that the composition (X) does not contain a solvent or has a solvent content of 1% by mass or less. Therefore, outgassing is less likely to occur from the composition (X) and the cured product. Moreover, the storage stability of the composition (X) is further enhanced.

The composition (X) preferably has a viscosity of 1 mPa·s or more and 30 mPa·s or less at 25°C. In this case, the composition (X) can be applied and molded at room temperature by a casting method, an ink jet method, or the like. In particular, when the viscosity is 30 mPa·s or less, when the composition (X) is applied by an ink jet method, the ejection speed of the composition (X) from nozzles is less likely to decrease, and satellites are particularly less likely to occur. This viscosity is more preferably 20 mPa·s or less, and even more preferably 15 mPa·s or less. It is also preferable that this viscosity is 5 mPa·s or more.

The composition (X) preferably has a light transmittance (total light transmittance) of 90% or more when the cured product has a thickness of 10 μm. In this case, if the cured product is applied to an optical component in a light-emitting device, it is possible to particularly improve the extraction efficiency of light transmitted through the optical component and emitted to the outside.

Composition (X) preferably has a surface tension of 20 mN/cm or more and 40 mN/cm or less. In this case, satellites are less likely to occur when the composition (X) is applied by an inkjet method. This is because when the surface tension is 20 mN/cm or more, the droplets of the composition (X) are less likely to form a tail when they leave the nozzle, and when the surface tension is 40 mN/cm or less. It is believed that this is because the droplets of the composition (X) are particularly easily separated from the nozzle.

A composition (X) having such physical properties can be achieved by adjusting the composition of the composition (X). In particular, the reaction rate of the polymerizable compound can be controlled by adjusting the blending ratio of the polymerizable compound and the polymerization initiator. That is, when the total amount of the polymerizable compound and the polymerization initiator is constant, the reaction rate of the polymerizable compound tends to decrease as the mixing ratio of the polymerizable compound increases. That is, when the total amount of the polymerizable compound and the polymerization initiator is constant, the reaction rate of the polymerizable compound tends to increase as the mixing ratio of the polymerization initiator increases. Thus, the composition (X) having desired curing properties can be obtained by adjusting the blending ratio of the polymerizable compound and the polymerization initiator.

[Light emitting device]
A light emitting device 1 according to this embodiment will be described. The light emitting device 1 includes a light source and an optical component that transmits light emitted by the light source. For example, the light-emitting device 1 includes a light-emitting element 4 and a sealing material 5 covering the light-emitting element 4 . In this case, the light emitting element 4 is the light source and the sealing material 5 is the optical component. The sealing material 5 may cover the light emitting element 4 while being in direct contact with the light emitting element 4, or may cover the light emitting element 4 while some layer is interposed between the sealing material 5 and the light emitting element 4. good. The light emitting device 1 may be, for example, a lighting device or a display device (display).

Light emitting element 4 includes, for example, a light emitting diode. Light-emitting diodes include, for example, at least one of organic EL elements (organic light-emitting diodes) and micro light-emitting diodes. When the light-emitting element 4 includes an organic light-emitting diode, the light-emitting device 1 including the light-emitting element 4 is, for example, an organic EL display. If the light emitting element 4 comprises a micro light emitting diode, the light emitting device 1 comprising the light emitting element 4 is, for example, a micro LED display. Note that EL means electroluminescence, and LED means light emitting diode.

A first example of the structure of the light emitting device 1 will be described with reference to FIG. This light emitting device 1 is of a top emission type. The light-emitting device 1 includes a support substrate 2 , a transparent substrate 3 facing the support substrate 2 with a gap therebetween, a light-emitting element 4 on the surface of the support substrate 2 facing the transparent substrate 3 , and the support substrate 2 and the transparent substrate 3 . and a sealing material 5 filled between them. In the first example, the light-emitting device 1 also includes a passivation layer 6 that covers the surface of the support substrate 2 facing the transparent substrate 3 and the light-emitting elements 4 . That is, the passivation layer 6 is interposed between the light emitting element 4 and the sealing material 5 covering the light emitting element 4 .

The support substrate 2 is made of, for example, a resin material, but is not limited to this. The transparent substrate 3 is made of a translucent material. The transparent substrate 3 is, for example, a glass substrate or a transparent resin substrate. When the light-emitting element 4 includes an organic EL element, the organic EL element includes, for example, a pair of electrodes and an organic light-emitting layer between the electrodes. The organic light emitting layer includes, for example, a hole injection layer, a hole transport layer, an organic light emitting layer and an electron transport layer, and these layers are laminated in the order described above. Although only one light-emitting element 4 is shown in FIG. good. Passivation layer 6 is preferably made of silicon nitride or silicon oxide.

A second example of the structure of the light emitting device 1 will be described with reference to FIG. Elements common to those in the first example shown in FIG. 1 are denoted by the same reference numerals in FIG. 2 as those in FIG. 1, and detailed description thereof will be omitted as appropriate. The light emitting device 1 shown in FIG. 2 is also of the top emission type. The light-emitting device 1 includes a support substrate 2, a transparent substrate 3 facing the support substrate 2 with a gap therebetween, a light-emitting element 4 on the surface of the support substrate 2 facing the transparent substrate 3, and a seal covering the light-emitting element 4. Material 5 is provided.

When the light-emitting element 4 includes an organic EL element, the organic EL element includes, for example, a pair of electrodes 41 and 43 and an organic light-emitting layer 42 between the electrodes 41 and 43, as in the first example. The organic light emitting layer 42 includes, for example, a hole injection layer 421, a hole transport layer 422, an organic light emitting layer 423 and an electron transport layer 424, and these layers are laminated in the order described above.

The light-emitting device 1 includes a plurality of light-emitting elements 4 , and the plurality of light-emitting elements 4 form an array 9 (hereinafter referred to as element array 9 ) on the support substrate 2 . The element array 9 also comprises partition walls 7 . The partition wall 7 is located on the support substrate 2 and partitions between the two adjacent light emitting elements 4 . The partition wall 7 is produced by molding a photosensitive resin material by photolithography, for example. The element array 9 also includes connection wirings 8 that electrically connect the electrodes 43 and the electron transport layers 424 of the adjacent light emitting elements 4 to each other. The connection wiring 8 is provided on the partition wall 7 .

The light emitting device 1 also comprises a passivation layer 6 covering the light emitting element 4 . Passivation layer 6 is preferably made of silicon nitride or silicon oxide. Passivation layer 6 includes a first passivation layer 61 and a second passivation layer 62 . The first passivation layer 61 covers the light emitting elements 4 by covering the element array 9 while being in direct contact with the element array 9 . The second passivation layer 62 is arranged on the side opposite to the element array 9 with respect to the first passivation layer 61, and a space is provided between the second passivation layer 62 and the first passivation layer 61. ing. A sealing material 5 is filled between the first passivation layer 61 and the second passivation layer 62 . That is, the first passivation layer 61 is interposed between the light emitting element 4 and the sealing material 5 covering the light emitting element 4 .

Furthermore, a second sealing material 52 is filled between the second passivation layer 62 and the transparent substrate 3 . The second sealing material 52 is made of, for example, a transparent resin material. The material of the second sealing material 52 is not particularly limited. The material of the second sealing material 52 may be the same as or different from that of the sealing material 5 .

The encapsulant 5 in the light-emitting device 1 having the structure exemplified above can be produced from the ultraviolet curable resin composition according to this embodiment. That is, the ultraviolet curable resin composition is used for producing the encapsulant 5 for the light emitting element 4 . In other words, the UV-curable resin composition is preferably a composition for producing a sealing material, a composition for sealing a light-emitting element, or a composition for manufacturing a light-emitting device.

[Method for manufacturing light-emitting device]
A method for producing an optical component using the composition (X) and a method for producing the light-emitting device 1, which is an organic EL light-emitting device, will be described.

In the present embodiment, it is preferable to form the composition (X) by an inkjet method, and then irradiate the composition (X) with ultraviolet rays to cure the composition (X), thereby producing the encapsulant 5, which is an optical component. In this embodiment, the composition (X) can be applied and molded by an inkjet method.

When applying the composition (X) by an inkjet method, when the composition (X) has a sufficiently low viscosity at room temperature, for example, the viscosity at 25° C. is 30 mPa·s or less, particularly 15 mPa·s or less. In some cases, the composition (X) can be molded by applying the composition (X) by an inkjet method without heating.

In the case where the composition (X) has the property of reducing the viscosity when heated, the composition (X) may be heated and then applied by an ink jet method for molding. When the viscosity of the composition (X) at 40° C. is 30 mPa·s or less, particularly 15 mPa·s or less, the viscosity of the composition (X) can be lowered by only slightly heating the composition (X). The resulting composition (X) can be discharged by an inkjet method. The heating temperature of the composition (X) is, for example, 20°C or higher and 50°C or lower.

More specifically, for example, first, the support substrate 2 is prepared. A partition wall is formed on one surface of the support substrate 2 by photolithography using, for example, a photosensitive resin material. Subsequently, a plurality of organic EL elements that are a plurality of light emitting elements 4 are provided on one surface of the support substrate 2 . An organic EL element can be produced by an appropriate method such as a vapor deposition method or a coating method. In particular, it is preferable to produce the organic EL element by a coating method such as an inkjet method. Thus, an element array 9 is produced on the support substrate 2 .

Next, a first passivation layer 61 is provided over the device array 9 . The first passivation layer 61 can be produced by a vapor deposition method such as a plasma CVD method.

Next, the composition (X) is formed on the first passivation layer 61 by, for example, an inkjet method to form a coating film. If the inkjet method is applied to both the formation of the organic EL element and the application of the composition (X), the production efficiency of the light-emitting device 1 can be particularly improved. Subsequently, the coating film is cured by irradiating it with ultraviolet rays, and the encapsulant 5 is produced. The thickness of the sealing material 5 is, for example, 5 μm or more and 50 μm or less.

The thickness of the sealing material 5 is preferably 4 μm or more and 50 μm or less, more preferably 4 μm or more and 15 μm or less. As described above, in the present embodiment, it is easy to form small droplets of the composition (X) at a high density by an ink jet method, so it is easy to realize a thin encapsulant 5 having a thickness of 4 μm or more and 15 μm or less. When the encapsulating material 5 is thinned in this way, tensile stress and compressive stress are less likely to occur in the encapsulating material 5 within the light emitting device 1 . Therefore, it becomes easier to realize a flexible light emitting device 1 .

Next, a second passivation layer 62 is provided on the encapsulant 5 . The second passivation layer 62 can be produced by a vapor deposition method such as a plasma CVD method.

Next, an ultraviolet curable resin material is provided on one surface of the support substrate 2 so as to cover the second passivation layer 62, and the transparent substrate 3 is placed on this resin material. The transparent substrate 3 is, for example, a glass substrate or a transparent resin substrate.

Next, the transparent substrate 3 is irradiated with ultraviolet rays from the outside. Ultraviolet rays pass through the transparent substrate 3 and reach the ultraviolet curable resin material. Thereby, the ultraviolet curable resin material is cured, and the second sealing material 52 is produced.

In the present embodiment, as described above, even if the composition (X) is applied by an inkjet method, satellites are less likely to occur, so the encapsulant 5 can be produced from the composition (X) with high accuracy.

The amount of droplets of the composition (X) ejected by the inkjet method is, for example, 7 pl or more and 10 pl or less, but may be less than this. In the present embodiment, satellites are less likely to occur even if the size of the droplets is reduced, so that the volume of the droplets can be reduced to less than 7 pl. In particular, when droplets of the composition (X) ejected by the inkjet method are small, for example, even when the droplets are 2 pl or more and less than 7 pl, or 2 pl or more and 5 pl or less, satellites are less likely to occur. When the acrylic compound (A) contains a compound having an isobornyl skeleton, it is particularly easy to miniaturize droplets. Therefore, even if droplets of the composition (X) ejected by the inkjet method are made small in order to produce a thin sealing material 5 having a thickness of 2 μm or more and 8 μm or less, for example, the composition (X) can be transferred from the composition (X) to the sealing material 5 can be produced with high precision. That is, by forming small droplets at a high density, it is easy to realize thinning of the sealing material 5 . In addition, in this embodiment, the amount of droplets and the thickness of the sealing material 5 are not limited to the ranges described above. That is, the droplet volume may be greater than 5 pl, and the thickness of the sealing material 5 may be greater than 8 μm.

Furthermore, as described above, the sealing material 5 made of the cured composition (X) can have good heat resistance. Therefore, when the passivation layer 6 (second passivation layer 62) is formed over the sealing material 5 by vapor deposition such as plasma CVD, even if the temperature of the sealing material 5 rises, the sealing material 5 deteriorates. hard to do. Moreover, even if the temperature of the light emitting device rises during use of the light emitting device, the sealing material 5 is less likely to deteriorate.

Note that the application of the composition (X) according to this embodiment is not limited to the production of the encapsulant 5 for the light emitting element 4 . Composition (X) can be used to produce various optical components that transmit light emitted by a light source. For example, the composition (X) may contain a phosphor, and a color resist for a color filter may be produced from the composition (X). In this case, particularly by using the ink jet method, it is easy to form the color resist in the color filter with high density and accuracy. This color filter can be provided, for example, in a display device such as an organic EL display or a micro LED display, which are light emitting devices.

Compositions of Examples and Comparative Examples were prepared by mixing the components shown in the table below.

The details of the components shown in the table are as follows. The viscosities below are values measured using a rheometer (manufactured by Anton Paar Japan, Model No. DHR-2) under conditions of a temperature of 25° C. and a shear rate of 1000 s ⁻¹ .

(1) Composition (radical polymerizable compound)
PEG200 dimethacrylate: Polyethylene glycol 200 dimethacrylate manufactured by Shin-Nakamura Chemical Co., Ltd., viscosity 14 mPa·s (25°C), glass transition temperature 41°C.

Pentatriestol tetraacrylate: Shin-Nakamura Chemical Co., Ltd., viscosity 200 mPa·s (40°C), glass transition temperature 103°C.

(Cationically polymerizable compound)
Celoxide 8010: manufactured by Daicel, product name Celoxide 8010, compound represented by formula (20a), specific gravity 1.11, viscosity 60 mPa·s, refractive index 1.5071.

OXT-221: manufactured by Toagosei, product number OXT-221, compound represented by formula (43), specific gravity 0.998, viscosity 10 mPa·s, refractive index 1.4538.

Celoxide 2021P: manufactured by Daicel, trade name Celoxide 2021P, compound represented by formula (20b).

X-40-2669: manufactured by Shin-Etsu Chemical Co., Ltd., product number X-40-2669, compound represented by formula (60a-1).

AL-EOX: Yokkaichi Gosei, product name AL-EOX, 3-allyloxymethyl-3-ethyloxetane: Yokkaichi Gosei, compound represented by formula (66), viscosity 2 mPa·s.

(Photo radical initiator)
TPO: 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, manufactured by BASF, product number Irgacure TPO.

(Photo cationic initiator)
CPI-210S: Photo cationic initiator (sulfonium salt) manufactured by San-Apro Co., Ltd., product number CPI-210S.

(sensitizer)
DETX-s: 2,4-diethylthioxanthen-9-one, manufactured by Nippon Kayaku Co., Ltd., product number DETX-s.

UVS1331: 9,10-dibutoxyanthracene, manufactured by Kawasaki Kasei Co., Ltd., product number UVS1331.

(2) Curing characteristics (reaction rate of polymerizable compound)
The reaction rate of the polymerizable compound was measured in the same manner as above. That is, after applying the composition onto a smooth surface (application by an ink jet method), an LED-UV irradiator manufactured by Ushio Co., Ltd. (model number E075IIHD, peak wavelength 395 nm) was used to apply the composition in the atmosphere. Photocuring was performed by irradiating with ultraviolet rays under a predetermined output condition. A film having a thickness of 10 μm was thus produced. The absorbance of this film by the IR method was measured before and after curing, and the reaction rate was obtained from the reduction rate of the peak derived from the polymerizable compound. As a result, "A" when the reaction rate of the polymerizable compound is 80% or more, "B" when the reaction rate of the polymerizable compound is 70% or more and less than 80%, and the reaction rate of the polymerizable compound is less than 70%. was evaluated as "C". As a measuring device used in the IR method, a product number "Agilent Cary 610 FTIR microscope system" manufactured by Agilent Technologies was used. Table 1 shows the irradiation intensity, irradiation time and accumulated light amount of ultraviolet rays.

(3) Evaluation (Light transmittance)
A coating film was prepared by applying the compositions of the above examples and comparative examples, and this coating film was irradiated in the atmosphere using an LED-UV irradiator manufactured by Ushio Corporation (model number E075IIHD, peak wavelength 395 nm). A film with a thickness of 10 μm was produced by photocuring the film by irradiating it with ultraviolet rays under the condition of an integrated light amount of 1.6 J/cm ² . The total light transmittance of this film was measured according to JIS K7361-1.

(viscosity)
The viscosities of the compositions of the above Examples and Comparative Examples were measured using a rheometer (manufactured by Anton Paar Japan, Model No. DHR-2) under conditions of a temperature of 25° C. and a shear rate of 1000 s ⁻¹ .

(storability)
Using an inkjet head "MH5421F/5421MF" manufactured by Ricoh Co., Ltd., a circulation test of the compositions of the above Examples and Comparative Examples was carried out at a flow rate of 10 ml/min. Evaluation is as follows.
A: The ink (composition) can be ejected continuously for 10 minutes without any problem, and the ink (composition) adheres to the inkjet head in a small amount.
B: The ink (composition) can be ejected continuously for 10 minutes without any problem, and much ink (composition) adheres to the inkjet head.
C: A hole occurs in the ink-jet head that prevents ejection for 10 consecutive minutes.

Examples and Comparative Examples have the same integrated light amount ⁽ 1.6 J/cm ² ). is high. On the other hand, in the comparative example, even when the irradiation intensity is 1 W/cm ² , the reaction rate of the polymerizable compound is 80% or more, so the storability is low.

Further, among the examples, Examples 3 to 6 containing a radically polymerizable compound had a higher reaction rate of the polymerizable compound than Examples 1 and 2 containing a cationically polymerizable compound even when the irradiation intensity was increased. It tends to be low and easy to store. In particular, in Examples 5 and 6 in which the blending amount of the photoradical initiator is small (the blending amount is 1% by mass or less with respect to the total amount of the composition), even if the irradiation intensity is increased, the reaction rate of the polymerizable compound is low, It tends to be more storable.

(summary)
As described above, the ultraviolet curable resin composition according to the first aspect is an ultraviolet curable resin composition containing a polymerizable compound and a polymerization initiator. When a coating film of the UV-curable resin composition having a thickness of 10 μm is irradiated with UV rays having a peak wavelength of 395 nm within the range of an integrated light amount of 800 mJ/cm ² or more and 4000 mJ/cm ² or less, the irradiation intensity of the UV rays increases. At 1 W/cm ² or less, the reaction rate of the polymerizable compound in the coating film is less than 70%.

According to this aspect, there are the advantages that the polymerization reaction of the polymerizable compound does not progress easily, the property does not easily change due to storage, and the storage stability is excellent.

In the first aspect, the ultraviolet curable resin composition according to the second aspect is a coating film of the ultraviolet curable resin composition having a thickness of 10 μm, and an ultraviolet ray having a peak wavelength of 395 nm is irradiated with an integrated light amount of 800 mJ / cm ² or more and 4000 mJ. /cm ² or less, the reaction rate of the polymerizable compound in the coating film is 80% or more when the irradiation intensity of the ultraviolet rays exceeds 8 W/cm ² .

According to this aspect, there is an advantage that the polymerization reaction of the polymerizable compound proceeds easily and a cured product is easily obtained.

A UV-curable resin composition according to a third aspect, in the first or second aspect, contains an acrylic compound as the polymerizable compound. A photoradical initiator is included as the polymerizable initiator.

According to this aspect, there is an advantage that a cured product having excellent light transmittance can be easily obtained and can be suitably used for optical system members.

The ultraviolet curable resin composition according to the fourth aspect is used for producing an optical component that transmits light emitted from a light source in the first to third aspects.

According to this aspect, there is an advantage that the transmission of light is less likely to be impaired by the optical component, and the luminous efficiency is less likely to decrease.

The ultraviolet curable resin composition according to the fifth aspect is molded by an inkjet method in the first to fourth aspects.

According to this aspect, there is an advantage that the polymerization reaction of the polymerizable compound is unlikely to proceed and the properties are unlikely to change due to storage, so clogging is unlikely to occur.

In the first to fifth aspects, the ultraviolet curable resin composition according to the sixth aspect has a viscosity of 1 mPa·s or more and 20 mPa·s or less at 25°C.

According to this aspect, there is an advantage that it is easy to apply and mold by an inkjet method.

In the ultraviolet curable resin composition according to the seventh aspect, in the first to sixth aspects, the cured product has a light transmittance of 90% or more.

According to this aspect, there is an advantage that the transmission of light is less likely to be impaired by the cured product, making it easier to apply to optical system members.

A light-emitting device (1) according to an eighth aspect includes a light source and an optical component that transmits light emitted by the light source. The optical component includes a cured product of the ultraviolet curable resin composition.

According to this aspect, there is an advantage that the transmission of light is less likely to be impaired by the optical component, and the luminous efficiency is less likely to decrease.

A method for manufacturing a light-emitting device according to a ninth aspect is a method for manufacturing a light-emitting device (1) including a light source and an optical component that transmits light emitted by the light source. After molding the ultraviolet curable resin composition by an inkjet method, the ultraviolet curable resin composition molded by the inkjet method is irradiated with ultraviolet rays to be cured, thereby producing an optical component.

According to this aspect, the polymerization reaction of the polymerizable compound of the ultraviolet curable resin composition does not progress easily, the property does not easily change due to storage, and the storage stability is excellent. Therefore, there is an advantage that clogging is unlikely to occur and that it is easy to apply and mold by an inkjet method.

1 Light Emitting Device 4 Light Emitting Element 5 Sealing Material

Claims (10)

An ultraviolet curable resin composition containing a polymerizable compound, a polymerization initiator and a sensitizer,
The polymerizable compound contains a radically polymerizable compound,
The polymerization initiator contains a photoradical initiator,
Ultraviolet light with a peak wavelength of 395 nm was applied to the coating film of the ultraviolet curable resin composition having a thickness of 10 μm, and the cumulative light amount was 1.5 nm. When irradiated at 6 J / cm ² , the irradiation intensity of the ultraviolet rays is 1 W / cm ² , and the reaction rate of the polymerizable compound in the coating film is less than 70%.
UV curable resin composition. An ultraviolet curable resin composition containing a polymerizable compound and a polymerization initiator,
The polymerizable compound contains a cationic polymerizable compound,
The polymerization initiator contains a photocationic initiator,
The ratio of the photocationic initiator to the cationic polymerizable compound is in the range of 1 to 4% by mass,
Ultraviolet light with a peak wavelength of 395 nm was applied to the coating film of the ultraviolet curable resin composition having a thickness of 10 μm, and the cumulative light amount was 1.5 nm. When irradiated at 6 J / cm ² , the irradiation intensity of the ultraviolet rays is 1 W / cm ² , and the reaction rate of the polymerizable compound in the coating film is less than 70%.
UV curable resin composition. The amount of the photoradical initiator with respect to 100 parts by mass of the ultraviolet curable resin composition is 1 part by mass or more and 10 parts by mass or less.
The ultraviolet curable resin composition according to claim 1. When a coating film of the UV-curable resin composition having a thickness of 10 μm is irradiated with UV rays having a peak wavelength of 395 nm within the range of an integrated light amount of 800 mJ/cm ² or more and 4000 mJ/cm ² or less, the irradiation intensity of the UV rays increases. When it exceeds 8 W/cm ² and the reaction rate of the polymerizable compound in the coating film is 80% or more,
The UV-curable resin composition according to any one of claims 1 to 3. including an acrylic compound as the polymerizable compound,
Containing a photoradical initiator as the polymerizable initiator,
The ultraviolet curable resin composition according to any one of claims 1 to 4. for making an optical component that transmits light emitted by a light source,
The ultraviolet curable resin composition according to any one of claims 1 to 5. Molded by the inkjet method,
The ultraviolet curable resin composition according to any one of claims 1 to 6. The light transmittance of the cured product is 90% or more,
The ultraviolet curable resin composition according to any one of claims 1 to 7. A light source and an optical component that transmits light emitted by the light source,
The optical component comprises a cured product of the ultraviolet curable resin composition according to any one of claims 1 to 8,
Luminescent device. A method for manufacturing a light-emitting device comprising a light source and an optical component that transmits light emitted by the light source,
After molding the ultraviolet curable resin composition according to any one of claims 1 to 8 by an inkjet method, the ultraviolet curable resin composition molded by the inkjet method is irradiated with ultraviolet rays to be cured. fabricating the optical component with
A method for manufacturing a light-emitting device.

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