JP7157345B2 - light emitting module - Google Patents

Description

The present disclosure relates to a light-emitting device, a light-emitting module, and a method for manufacturing a light-emitting module.

Light-emitting devices with multiple light-emitting surfaces are known. For example, Patent Literature 1 discloses a light source unit in which 24 light emitting diodes are arranged on a substrate in four rows.

JP 2018-81832 A

There is room for further improvement in the structure of arranging a plurality of light emitting surfaces with high density and accuracy.
An object of the embodiments of the present disclosure is to provide a light-emitting device and a light-emitting module capable of arranging a plurality of light-emitting surfaces with high density and accuracy, and a method for manufacturing the light-emitting module.

A light-emitting device according to an embodiment of the present disclosure is an element structure including a substrate, a light-emitting element mounted on the substrate, and a translucent member disposed on the light-emitting element, comprising at least a plurality of element structures arranged along one direction; a first covering member covering side surfaces of the substrate, the light emitting element, and the translucent member of each of the element structures; and a supporting member that covers the side surface of one covering member, is arranged along the sides of the plurality of element structures in the one direction, and has higher rigidity than the first covering member.

A light-emitting module according to an embodiment of the present disclosure includes the light-emitting device described above and a module substrate on which the light-emitting device is mounted so that the substrates face each other.

A method for manufacturing a light-emitting module according to an embodiment of the present disclosure includes the steps of preparing the light-emitting device described above, and placing the light-emitting device so that the substrate faces a module substrate, and The substrate has holes at positions where the through holes of the supporting member face each other, and in the mounting step, the positions of the through holes of the supporting member and the holes of the module substrate are aligned to form the light emitting device. is placed on the module substrate.

The light-emitting device of the embodiment according to the present disclosure can arrange a plurality of light-emitting surfaces at high density and at desired positions with high accuracy.
The light-emitting module of the embodiment according to the present disclosure can arrange a plurality of light-emitting surfaces at high density and at desired positions with high accuracy.
The method for manufacturing a light-emitting module according to the embodiment of the present disclosure enables a plurality of light-emitting surfaces to be arranged at desired positions with high density and accuracy.

1 is a perspective view schematically showing an example of a light-emitting module provided with a light-emitting device according to an embodiment; FIG. BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows typically an example of the light emitting module provided with the light emitting device which concerns on embodiment. FIG. 1C is a schematic cross-sectional view along the IC-IC line in FIG. 1B; FIG. 1B is a schematic cross-sectional view along the ID-ID line in FIG. 1B; BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows typically an example of the light-emitting device which concerns on embodiment. It is a bottom view which shows typically an example of the light-emitting device which concerns on embodiment. 1 is a schematic plan view schematically showing an example of a support member of a light emitting device according to an embodiment; FIG. 4 is a flow chart of a method for manufacturing a light emitting device according to an embodiment; 4 is a flow chart of a method for manufacturing a light emitting module according to an embodiment; 1A to 1D are cross-sectional views schematically showing an example of a method for manufacturing a light emitting device according to an embodiment; 1A to 1D are cross-sectional views schematically showing an example of a method for manufacturing a light emitting device according to an embodiment; 1A to 1D are cross-sectional views schematically showing an example of a method for manufacturing a light emitting device according to an embodiment; 1A to 1D are cross-sectional views schematically showing an example of a method for manufacturing a light emitting device according to an embodiment; 1A to 1D are cross-sectional views schematically showing an example of a method for manufacturing a light emitting device according to an embodiment; It is a top view which shows typically an example of the manufacturing method of the light-emitting device which concerns on embodiment. 1A to 1D are cross-sectional views schematically showing an example of a method for manufacturing a light emitting device according to an embodiment; 1A to 1D are cross-sectional views schematically showing an example of a method for manufacturing a light emitting device according to an embodiment; 1A to 1D are cross-sectional views schematically showing an example of a method for manufacturing a light emitting device according to an embodiment; 1A to 1D are cross-sectional views schematically showing an example of a method for manufacturing a light emitting device according to an embodiment; It is a sectional view showing typically an example of a manufacturing method of a light emitting module concerning an embodiment. FIG. 10 is a plan view schematically showing an example of a light-emitting module provided with a light-emitting device according to a first modified example; FIG. 11 is a plan view schematically showing an example of a light emitting module provided with a light emitting device according to a second modified example; FIG. 11 is a plan view schematically showing an example of a light emitting module provided with a light emitting device according to a third modified example; FIG. 11 is a plan view schematically showing an example of a light emitting module provided with a light emitting device according to a fourth modified example; FIG. 11 is a plan view schematically showing an example of a light emitting module provided with a light emitting device according to a fifth modified example; FIG. 20 is a plan view schematically showing an example of a light-emitting module including a light-emitting device according to a sixth modified example; FIG. 21 is a plan view schematically showing an example of a light-emitting module including a light-emitting device according to a seventh modified example; FIG. 21A is a cross-sectional view schematically showing an example of a method for manufacturing a light-emitting module according to an eighth modified example; FIG. 20 is a plan view schematically showing an example of a light-emitting module provided with a light-emitting device according to a ninth modification; It is a bottom view which shows typically an example of the light-emitting device which concerns on a 9th modification. 6B is a schematic cross-sectional view taken along line VIC-VIC of FIG. 6A; FIG. FIG. 21 is a plan view schematically showing an example of a module substrate used in a light emitting module according to a ninth modification; FIG. 6D is a plan view schematically showing an enlarged part of an example of a light emitting module according to a ninth modification, and is a plan view showing the positional relationship between the module substrate in FIG. 6D and the light emitting device in FIG. 6A. FIG. 21 is a plan view schematically showing an example of a module substrate used in a light emitting module according to a tenth modified example; FIG. 6F is a plan view schematically showing an enlarged part of an example of a light emitting module according to a tenth modification, and is a plan view showing the positional relationship between the module substrate of FIG. 6F and the light emitting device of FIG. 6A. FIG. 21 is a plan view schematically showing an example of a light-emitting module including a light-emitting device according to Modification 11; FIG. 21 is a bottom view schematically showing an example of a light emitting device according to an eleventh modified example; FIG. 21 is a plan view schematically showing an example of a module substrate used in a light emitting module according to Modification 11; FIG. 7C is a plan view schematically showing an enlarged part of an example of a light emitting module according to an eleventh modification, and is a plan view showing the positional relationship between the module substrate of FIG. 7C and the light emitting device of FIG. 7A. FIG. 21 is a plan view schematically showing an example of a module substrate used in a light emitting module according to Modification 12; 7C is a plan view schematically showing an enlarged part of an example of a light emitting module according to a twelfth modification, and showing the positional relationship between the module substrate of FIG. 7E and the light emitting device of FIG. 7A. FIG. 5 is a flow chart of another method for manufacturing the light emitting device according to the embodiment;

Embodiments are described below with reference to the drawings. However, the embodiments shown below exemplify the light-emitting device and the light-emitting module for embodying the technical idea of the present embodiment, and the manufacturing method of the light-emitting module, and are not limited to the following. In addition, unless there is a specific description, the dimensions, materials, shapes, relative arrangements, etc. of the components described in the embodiments are not intended to limit the scope of the present invention, but are merely examples. It's nothing more than Note that the sizes and positional relationships of members shown in each drawing may be exaggerated or simplified for clarity of explanation. As a cross-sectional view, an end view showing only a cut surface may be used. In addition, each member such as a light-emitting element, an element structure, a support, etc. shown in each figure is illustrated with a set number as an example to facilitate understanding of the configuration. Further, in the embodiments, the term "coating" is not limited to the case of direct contact, but also includes the case of indirect covering, for example, via another member.

<<Embodiment>>
FIG. 1A is a perspective view schematically showing an example of a light-emitting module provided with a light-emitting device according to an embodiment; FIG. 1B is a plan view schematically showing an example of a light-emitting module including the light-emitting device according to the embodiment; FIG. 1C is a schematic cross-sectional view taken along line IC--IC in FIG. 1B. FIG. 1D is a schematic cross-sectional view along the ID-ID line in FIG. 1B. FIG. 1E is a cross-sectional view schematically showing an example of the light emitting device according to the embodiment. FIG. 1F is a bottom view schematically showing an example of the light emitting device according to the embodiment; 1G is a schematic plan view schematically showing an example of a support member of the light emitting device according to the embodiment; FIG.

The light emitting module 200 includes a light emitting device 100 and a module substrate 80 on which the light emitting device 100 is mounted.

[Light emitting device]
First, the light emitting device 100 will be described.
The light-emitting device 100 has a plurality of light-emitting surfaces on its upper surface.
The light emitting device 100 is an element structure 15 including a substrate 10, a light emitting element 20 mounted on the substrate 10, and a translucent member 30 disposed on the light emitting element 20. At least three are arranged along one direction X, a first covering member 51 covering the side surfaces of the substrate 10, the light emitting element 20 and the translucent member 30 of each element structure 15; and a supporting member 60 that covers the side surface of the first covering member 51 , is arranged along the side of the plurality of element structures 15 in the one direction X, and has higher rigidity than the first covering member 51 .

The light emitting device 100 mainly includes an element structure 15 , a first covering member 51 and a supporting member 60 .
The element structure 15 mainly includes a substrate 10, a light emitting element 20, a protective element 25, a translucent member 30, a light guide member 40, a third covering member 53, and a second covering member 52. I have. The external shape of the element structure 15 is, for example, a substantially rectangular parallelepiped. The upper surface of the element structure 15 includes the upper surface of the translucent member 30 and the upper surface of the second covering member 52 surrounding the upper surface of the translucent member 30 . The side surface of the element structure 15 includes the side surface of the second covering member 52 and the side surface of the substrate 10 . The bottom surface of device structure 15 includes the bottom surface of substrate 10 . In addition, in the element structure 15 , the light emitting element 20 and the translucent member 30 are included in the substrate 10 when viewed from above in a direction perpendicular to the upper surface of the translucent member 30 . Furthermore, it is preferable that one of the light emitting element 20 and the translucent member 30 is included in the other.
Since each of the plurality of element structures 15 includes the light emitting element 20 in the light emitting device 100 , the light emitting element 20 can be individually driven for each of the plurality of element structures 15 .
Each configuration of the light emitting device 100 will be described below.

The substrate 10 is a member on which the light emitting element 20 and the protective element 25 are placed. The substrate 10 has, for example, a substantially rectangular plate shape in a plan view. Thereby, in the light-emitting device 100, the plurality of element structures 15 can be arranged close to each other.
The substrate 10 includes a substrate 1 and wiring on the top surface, bottom surface, and inside of the substrate 1 for electrically connecting to the light emitting element 20 and an external power source. Examples of materials for the wiring include metals such as Fe, Cu, Ni, Al, Ag, Au, Pt, Ti, W, and Pd, and alloys containing at least one of these.
As the substrate 10, for example, a top surface wiring 2 connected to the light emitting element 20 is provided on the top surface on which the light emitting element 20 is mounted, and an external power supply is electrically connected to the bottom surface opposite to the top surface on which the light emitting element 20 is mounted. One having an external connection electrode 3 (for example, an anode electrode 3a and a cathode electrode 3b) to be connected is exemplified. In this case, the upper surface wiring 2 and the external connection electrodes 3 may have vias 4 extending over both the upper surface and the lower surface, that is, penetrating the substrate 1 . Thereby, the upper wiring 2 and the external connection electrode 3 are electrically connected. The substrate 1 may consist of a single layer, or may consist of a plurality of layers. When the substrate 1 is composed of a plurality of layers, the upper surface wiring 2 and the lower surface external connection electrodes 3 may be electrically connected via inner layer wiring in which vias passing through each layer are arranged between the layers.

As the substrate 1, it is preferable to use an insulating material, and it is preferable to use a material that does not easily transmit light emitted from the light emitting element 20, external light, and the like. For example, alumina, aluminum nitride, ceramics such as mullite, PA (polyamide), PPA (polyphthalamide), PPS (polyphenylene sulfide), thermoplastic resin such as liquid crystal polymer, epoxy resin, silicone resin, modified epoxy resin , urethane resin, or resin such as phenol resin can be used. Among them, it is preferable to use ceramics which are excellent in heat dissipation.

In the light emitting device 100, the distance L1 between adjacent element structures 15 is preferably 0.01 mm or more and 0.15 mm or less. Thereby, the thickness of the first covering member 51 arranged between the element structures 15 can be set to 0.01 mm or more and 0.15 mm or less, and the adjacent element structures 15 can be brought close to each other and joined. Further, in the light-emitting device 100 including a plurality of element structures 15, each of the plurality of element structures 15 includes the substrate 10, and the first covering member 51 is arranged between the substrates 10, whereby each element structure It is possible to suppress the influence of thermal stress due to expansion or contraction of the substrate 10 caused by heat generated in the body 15 and thermal history during mounting of the light emitting device.

The light emitting element 20 is placed on the substrate 10 . The shape, size, etc. of the light emitting element 20 can be selected arbitrarily. The planar view shape of the light emitting element 20 is, for example, a rectangular shape. Further, for example, in order to realize a high-output light emitting device, the vertical and horizontal dimensions of the light emitting element 20 in plan view are preferably 600 μm or more, more preferably 800 μm or more. Moreover, from the viewpoint of uniformity of emission intensity, ease of mounting, etc., the vertical and horizontal dimensions are preferably 1500 μm or less.
As the emission color of the light-emitting element 20, one having an arbitrary wavelength can be selected according to the application. For example, as the light emitting element 20 for blue (light with a wavelength of 430 to 500 nm) and green (light with a wavelength of 500 to 570 nm), a nitride semiconductor (In _X Al _Y Ga _1-XY N, 0≦X , 0≤Y, X+Y≤1), GaP or the like can be used. GaAlAs, AlInGaP, etc. can be used as the light-emitting element 20 for red (light with a wavelength of 610 to 700 nm) in addition to the nitride-based semiconductor element.

The light emitting element 20 preferably has positive and negative element electrodes on one surface, so that it can be flip-chip mounted on the wiring on the substrate 10 with the conductive adhesive 8 . As the conductive adhesive 8, for example, eutectic solder, conductive paste, bumps, or the like may be used.

A Zener diode, for example, can be used as the protection element 25 . The protective element 25 has positive and negative element electrodes on one surface, and is flip-chip mounted on the wiring on the substrate 10 with the conductive adhesive 8 . Note that the light emitting device may not include the protection element 25 . The planar view shape of the protective element 25 is, for example, a rectangular shape.

The translucent member 30 is arranged on the light emitting element 20 and is a member that transmits the light emitted from the light emitting element 20 and emits it to the outside. The translucent member 30 transmits 60% or more of the light from the light emitting element 20 and/or the light obtained by converting the wavelength of the light from the light emitting element 20 (for example, light in the wavelength range of 320 nm to 850 nm). and preferably transmit 70% or more of the light.
The translucent member 30 is a plate-shaped member having an upper surface that serves as a main light-emitting surface of the individual element structures 15 and the light-emitting device 100 and a lower surface facing the upper surface. The translucent member 30 is made of, for example, glass, ceramics, inorganic materials such as sapphire, silicone resins, modified silicone resins, epoxy resins, modified epoxy resins, acrylic resins, phenolic resins, and fluorine resins. It may be made of any organic material such as hybrid resin. The translucent member 30 is arranged on the light emitting element 20 . The translucent member 30 preferably has an upper surface and/or a lower surface wider than the upper surface of the light emitting element 20, and is preferably arranged so as to enclose the light emitting element 20 in plan view.

On the upper surface of the light emitting device 100, the distance L2 between the adjacent translucent members 30 is preferably 0.2 mm or less. As a result, for example, when the light emitting device 100 is used as a light source for a variable light distribution type headlight of a vehicle, the light source can be made smaller, and the size of the headlight lens can be made smaller.
In other words, on the upper surface of the light emitting device 100, the space between the adjacent translucent members 30 (that is, between the adjacent light emitting surfaces) is a non-light emitting region. Dark areas may occur in the area. For this reason, it is necessary to optimize the configuration of the optical system, for example, by adjusting the focal positions of the plurality of light emitting surfaces using a primary lens, so as not to produce a dark portion in the irradiated area. On the other hand, in the light-emitting device 100 according to this embodiment, the distance L2 between the adjacent light-emitting surfaces (that is, the upper surface of the translucent member 30) can be reduced to 0.2 mm or less. Therefore, it is possible to simplify the configuration and reduce the size of the lamp as a whole, including the optical system such as lenses, by omitting the primary lens in the optical system. Also, by omitting the lens, the loss of light when passing through the optical system can be reduced.
The distance L2 between adjacent translucent members 30 is more preferably 0.1 mm or less. The distance L2 between the translucent members 30 may be, for example, 0.02 mm or more from the viewpoint of facilitating manufacture of the element structure 15 and the light emitting device 100 .

The planar shape of the translucent member 30 is, for example, a rectangular shape. As a result, a plurality of light emitting surfaces can be arranged close to each other with high density. Among others, a shape similar to the planar shape of the light emitting element 20 is more preferable. It is preferable that the area of the lower surface of the translucent member 30 is about 0.8 to 1.5 times the area of the upper surface of the light emitting element 20 . The thickness of the translucent member 30 may be uniform over the entire area, or may be thin or thick in part. The thickness of the translucent member 30 can be, for example, in the range of 50 μm or more and 300 μm or less.

Translucent member 30 may contain a phosphor capable of wavelength-converting at least part of incident light. The phosphor-containing translucent member 30 may be, for example, a sintered body of phosphor or a phosphor-containing material described above. Further, the translucent member 30 may include a phosphor layer such as a phosphor-containing resin layer or a phosphor-containing glass layer on the surface of a molding made of resin, glass, ceramic, or the like. Moreover, the translucent member 30 may contain a filler such as a diffusing material, depending on the purpose. When a filler such as a diffusing material is contained, the translucent member 30 may be made of the material described above containing a filler, or may be a resin, glass, ceramic, or other molded body containing a filler on its surface. A diffusing material layer such as a glass layer containing a layer or a filler may be provided.

As the phosphor, one known in the art can be used. For example, phosphors emitting green light include yttrium _- aluminum-garnet-based phosphors (e.g., Y3(Al, Ga) _5O12 :Ce), lutetium-aluminum-garnet-based phosphors (e.g., _{Lu3 (} Al, Ga ) ₅ O ₁₂ :Ce), terbium-aluminum-garnet-based phosphors (e.g. Tb ₃ (Al, Ga) ₅ O ₁₂ :Ce ), silicate-based phosphors (e.g. (Ba, Sr) ₂ SiO ₄ :Eu), Chlorosilicate-based phosphors (eg, Ca ₈ Mg(SiO ₄ ) _{4 Cl2} :Eu), β-sialon-based phosphors (eg, Si _6-z Al _z O _z N _8-z : Eu (0<z<4.2 )), SGS-based phosphors (for example, SrGa ₂ S ₄ :Eu), and the like. Examples of phosphors that emit yellow light include α-sialon-based phosphors (for example, Mz(Si, Al) ₁₂ (O, N) ₁₆ (where 0<z≦2, and M is Li, Mg, Ca, Y, and Lanthanide elements other than La and Ce) ) ) and the like. In addition, among the phosphors that emit green light, there is also a phosphor that emits yellow light.

Further, for example, the yttrium-aluminum-garnet-based phosphor can shift the emission peak wavelength to the long wavelength side by substituting part of Y with Gd, and can emit yellow light. Among these, there are also fluorescent materials capable of emitting orange light. Examples of phosphors that emit red light include nitrogen-containing calcium aluminosilicate (CASN or SCASN) phosphors (eg (Sr, Ca)AlSiN ₃ :Eu), BSESN phosphors (eg (Ba, Sr, Ca) ₂ Si ₅ N ₈ :Eu) and the like. In addition, a manganese-activated fluoride-based phosphor (a phosphor represented by the general formula (I) A ₂ [M _{1-a Mna} F ₆ ]) (wherein in the above general formula (I), A is is at least one element selected from the group consisting of K, Li, Na, Rb, Cs and NH4, M is at least one element selected from the group consisting of Group ₄ elements and Group 14 elements, a is satisfying 0<a<0.2)). A representative example of this manganese-activated fluoride-based phosphor is a manganese-activated potassium fluorosilicate phosphor (for example, K ₂ SiF ₆ :Mn).

As the diffusing material, those known in the art can be used. For example, silica, alumina, barium titanate, titanium oxide, etc. can be used.
When a resin is used as a binder for the phosphor layer and the diffusing material layer, examples of the resin include thermosetting resins such as epoxy resins, modified epoxy resins, silicone resins, and modified silicone resins.

The light guide member 40 is arranged between the translucent member 30 and the light emitting element 20 and/or on the side surface of the light emitting element 20 . The light guide member 40 is a member that facilitates the extraction of light from the light emitting element 20 and guides the light from the light emitting element 20 to the translucent member 30 . The light guide member 40 is, for example, an adhesive member that joins the light emitting element 20 and the translucent member 30 together. The light guide member 40 that joins the light-emitting element 20 and the light-transmitting member 30 preferably extends from between the light-transmitting member 30 and the light-emitting element 20 and is also arranged on the side surface of the light-emitting element 20 . As a result, the light emitted from the side surface of the light emitting element 20 can be guided to the translucent member 30, and the light extraction efficiency from the light emitting element 20 can be improved.

The light guide member 40 has a shape that is inclined to widen from the lower surface side of the light emitting element 20 (that is, the bonding surface side with the substrate 10 ) toward the translucent member 30 in a cross-sectional view. With such a configuration, the light traveling in the horizontal direction from the light emitting element 20 is more likely to be reflected upward, thereby further improving the light extraction efficiency. However, the cross-sectional shape of the outer surface of the light guide member 40 may be linear or curved. For example, when the outer surface of the light guide member 40 in cross section has a curved shape, the curved shape may be a curved shape recessed toward the third covering member 53 side or a curved shape recessed toward the light emitting element 20 side.

The light guide member 40 may cover the region including the light emitting portion in the side surface of the light emitting element 20, but from the viewpoint of improving the light extraction efficiency, it is preferable to cover substantially the entire side surface of the light emitting element 20. more preferred.
As the light guide member 40, for example, translucent resin can be used. Further, the light guide member 40 may be made of, for example, the resin used for the translucent member 30 described above. Moreover, the diffusion material described above may be contained. As a result, light can be more uniformly incident on the translucent member 30, and color unevenness of the light-emitting device 100 can be suppressed.

The third covering member 53 is provided around the light emitting element 20 on the substrate 10 . The third covering member 53 covers the side surface of the light emitting element 20 and extends from the side surface of the light emitting element 20 to the upper surface of the substrate 10 . The third covering member 53 can increase the adhesion between the substrate 10 and the light emitting element 20 . The third covering member 53 covers the side surface of the light emitting element 20 via the light guide member 40 here.
The third covering member 53 is formed in a fillet shape along the side surface of the light emitting element 20 from the translucent member 30 side toward the substrate 10 side. In other words, the cross-sectional shape of the outer surface of the third covering member 53 has an inclined shape such that the member width widens from the translucent member 30 side toward the substrate 10, for example. The cross-sectional shape of the outer surface of the third covering member 53 may be linear or curved. For example, when the outer surface of the third covering member 53 in cross section has a curved shape, the curved shape of the third covering member 53 may be a curved shape that is recessed toward the second coating member 52 side, or a curved shape that is recessed toward the light emitting element 20 side. It may have a curved shape.

Resin is preferably used for the third covering member 53 . The third covering member 53 can be made of, for example, a white resin having light reflectivity.
As the third covering member 53, for example, a translucent resin containing a reflective material can be used. Examples of the resin used for the third covering member 53 include epoxy resin, modified epoxy resin, silicone resin, and modified silicone resin. In particular, it is preferable to use a silicone resin that is excellent in light resistance and heat resistance. Reflective materials include, for example, titanium oxide, silica, alumina, zirconium oxide, magnesium oxide, potassium titanate, zinc oxide, silicon nitride, and boron nitride. Among them, it is preferable to use titanium oxide, which has a relatively high refractive index, from the viewpoint of light reflection.

The third covering member 53 may cover at least part of the side surface of the light emitting element 20 . Preferably, the third covering member 53 covers the entire side surface of the light emitting element 20 . More preferably, it extends from the side surface of the light emitting element 20 to cover at least a portion of the side surface of the translucent member 30 . As a result, in each element structure 15, leakage of light emitted from the side surface of the light emitting element 20 in the lateral direction can be suppressed. In addition, in the light emitting device 100 including a plurality of element structures 15, the light leakage to the adjacent element structures 15 is suppressed, and the light emitting device 100 with less light emission unevenness can be obtained. Further, by covering the side surface of the translucent member 30 with the third covering member 53, it becomes easier to grasp the chromaticity coordinates of the element structure 15 when measuring the optical characteristics of the element structure 15. can be easily measured. In addition, as will be described later, when performing the sorting process after the individual element structures 15 are separated, it becomes easier to grasp the chromaticity coordinates of the element structures 15 .

The third covering member 53 is preferably arranged also between the light emitting element 20 and the substrate 10 . Accordingly, the light traveling downward from the light emitting element 20 is reflected by the third covering member 53, and the light extraction efficiency of the light emitting device 100 can be further improved.

Since the light-emitting device 100 includes a plurality of element structures 15 and each of the plurality of element structures 15 includes the third covering member 53 that covers the side surface of the light-emitting element 20, the light emitted from the light-emitting element 20 does not travel in the lateral direction. can suppress light leakage to the As a result, the plurality of element structures 15 can be arranged closer to each other without lowering the light extraction efficiency of each element structure 15 .

The second covering member 52 is a member that covers the side surface of the light emitting element 20 and the side surface of the translucent member 30 on the substrate 10 . The second covering member 52 covers the side surface of the light emitting element 20 and the side surface of the translucent member 30 via the light guide member 40 and the third covering member 53 .
By providing the second covering member 52 , the element structure 15 can have a substantially rectangular parallelepiped appearance. Accordingly, in the light-emitting device 100 , the first covering member 51 can be arranged with substantially the same width from the lower surface to the upper surface of the element structures 15 between the element structures 15 .

Resin is preferably used for the second covering member 52 . The second covering member 52 can be made of, for example, a white resin having light reflectivity. The second covering member 52 covers the side surface of the light emitting element 20 and the side surface of the translucent member 30 . Examples of the resin used for the second covering member 52 include those exemplified as the resins used for the third covering member 53 . Examples of the reflective material contained in the resin used for the second covering member 52 include those exemplified as the reflective material used for the third covering member 53 .

The first covering member 51 is a member provided around the plurality of element structures 15 . Resin is preferably used for the first covering member 51 . The first covering member 51 can be made of, for example, a white resin in which a translucent resin contains a reflective material. The first covering member 51 covers the side surface of the element structure 15 . That is, the first covering member 51 covers the side surface of the substrate 10 , covers the side surface of the light emitting element 20 via the light guide member 40 , the third covering member 53 and the second covering member 52 , and the second covering member 52 covers the side surface of the light emitting element 20 . covers the side surface of the translucent member 30 via the . The first covering members 51 are also provided between the element structures 15 adjacent to each other, exposing the upper surfaces of the element structures 15 and covering the side surfaces of the plurality of element structures 15 .

Examples of the resin used for the first covering member 51 include those exemplified as the resins used for the third covering member 53 . As the reflecting material contained in the resin used for the first covering member 51, for example, the reflecting material used for the third covering member 53 may be used.

The first covering member 51 may be a colored resin other than white. Examples of colored resins include black resins and gray resins. Black resin and gray resin have higher light absorptance than white resin. Therefore, by providing the first covering member 51 made of black resin or gray resin between the element structures 15, light leakage in the lateral direction between the element structures 15 can be effectively suppressed. Note that when black resin or gray resin is used as the first covering member 51, the element structure 15 is arranged with the second covering member so that the black resin or gray resin and the translucent member 30 are spaced apart from each other. 52 is preferred. As a result, the effect of light absorption due to the use of black resin or gray resin between the element structures 15 can be suppressed. Therefore, it is possible to suppress a decrease in the light extraction efficiency of the light-emitting surface, and to provide a light-emitting device with a high contrast between the light-emitting region and the non-light-emitting region when individually lit, and having good "clearance". Examples of black resins and gray resins include resins containing black pigments such as carbon black and graphite. By combining the black pigment and the white pigment such as the reflector described above and adjusting the amount of each added, it is possible to adjust the density of colors such as black and gray. Moreover, by combining pigments such as red, blue, and green, it may be colored black, gray, or any other desired color.
The light emitting device 100 has a plurality of element structures 15 each having a light emitting surface held by a first covering member 51 . Since the element structures 15 can be held in a desired arrangement by the first covering member 51, a plurality of light emitting surfaces can be arranged with high density.

The support member 60 is a member that covers the side surface of the first covering member 51 and is arranged along the side of the plurality of element structures 15 in the one direction X. As shown in FIG. The support member 60 has a side parallel to the one direction X, which side faces the plurality of element structures 15 . For example, the support member 60 may be a frame-shaped member that surrounds the multiple element structures 15 . Here, the support member 60 is provided as a frame surrounding the plurality of element structures 15 and supporting the first covering member 51 . The support member 60 has, for example, a substantially rectangular frame shape in plan view, and is provided around the plurality of element structures 15 .

The support member 60 is formed of a member or structure having higher rigidity than the first covering member 51 . Specifically, the support member 60 has a rigidity higher than the stress value (rigidity) that causes the first covering member 51 to warp. Here, "rigidity" indicates resistance to deformation against bending or tensile force, and is represented by the force (load/deformation amount) required to cause unit deformation (bending or pulling). The stiffness of members is compared by comparing the magnitude of the force required to cause the member to be compared to undergo the same amount of deformation within the range that can be regarded as elastic deformation. Stiffness is increased by using materials with high elastic modulus, such as Young's modulus (tensile modulus). Further, if the plate thickness can be changed even with the same material, the rigidity can be increased by increasing the plate thickness. Even in composite materials, the stiffness is compared by the magnitude of the force (load/deformation amount) required to cause unit deformation (bending or tension). For example, in a bending test, the stresses at bending strains of 0.05% and 0.25% can be obtained according to JIS K 7171:2016, and the rigidity can be compared.

Since the light-emitting device 100 has the support member 60 having higher rigidity than the first covering member 51, warping of the first covering member 51 is suppressed, thereby suppressing warping of the light-emitting device 100. . As a result, the mounting surface of the light-emitting device 100 becomes flat, and the light-emitting device 100 can be placed at a desired position on the module substrate 80 with high accuracy. The light emitting device 100 has a plurality of element structures 15 connected by a first covering member 51 . Therefore, when resin is used for the first covering member 51 , the light emitting device 100 may warp due to shrinkage of the resin during curing. However, by using a material having higher rigidity than the first covering member 51, for example, a non-flexible material, for the support member 60, the occurrence of warping can be suppressed. As a result, the light-emitting device 100 can be easily mounted on the module substrate 80, and the light-emitting device 100 having a plurality of light-emitting surfaces arranged at a high density can be arranged at a desired position on the module substrate 80 with high accuracy.

As the support member 60, for example, a conductive member such as a metal or an alloy, or an insulating member such as ceramic can be used. As the conductive member, for example, metals such as Fe, Cu, Ni, Al, Ti, and W, and at least metals such as Fe, Cu, Ni, Al, Ag, Au, Pt, Ti, W, and Pd. An alloy containing one type is mentioned. Examples of the insulating member include ceramics such as aluminum oxide and aluminum nitride, and resin moldings such as phenol resin, epoxy resin, silicone resin, polyimide resin, BT resin, and polyphthalamide. When a resin is used, inorganic fillers such as glass fiber, silicon oxide, titanium oxide, and aluminum oxide may be mixed with the resin, if necessary. Also, a composite of these materials may be used as the support member, such as a support member in which a metal member is embedded in a resin molding.

The support member 60 is preferably a frame-shaped member that surrounds the plurality of element structures 15 . Further, the support member 60 has a substantially rectangular shape in a plan view including two sides parallel to the direction X sandwiching the plurality of element structures 15 and two sides perpendicular to the direction X sandwiching the plurality of element structures 15 . A frame-like shape having an opening is more preferable. As a result, all the side surfaces of the first covering member 51 that are in contact with the supporting member 60 can be fixed by the supporting member 60, so that warping can be more effectively suppressed.

The height H from the top surface to the bottom surface of the support member 60 is preferably lower than the height from the top surface to the bottom surface of the element structure 15 . Accordingly, in the light emitting device 100, the upper surface of the support member 60 can be arranged at a position lower than the upper surface of the element structure 15 (that is, on the lower surface side of the light emitting device 100). By adopting such a configuration, the first covering member 51 is suppressed from creeping up onto the upper surface of the translucent member 30 during manufacturing of the light emitting device 100 .
The height H of the support member 60 is preferably 0.1 mm or more and 1.0 mm or less. If the height H of the support member 60 is 0.1 mm or more, the rigidity of the support member 60 itself is ensured, and the effect of suppressing warping of the light emitting device 100 is enhanced, so that it can be arranged at a desired position with higher accuracy. can. On the other hand, if the height H of the support member 60 is 1.0 mm or less, the light emitting device 100 can be made lighter and more compact.
It is preferable that the support member 60 has a width W of 0.5 mm or more and 2.0 mm or less at a portion arranged over the sides of the plurality of element structures 15 . Here, the width W is the shortest length in the direction orthogonal to the one direction X of the side of the support member 60 parallel to the one direction X and arranged to face the element structure 15 . means. If the width W is 0.5 mm or more, the rigidity of the support member 60 itself is ensured, the effect of suppressing warping of the light emitting device 100 is enhanced, and the desired position can be arranged with higher accuracy. On the other hand, if the width W is 2.0 mm or less, the light emitting device 100 can be made lighter and more compact.

The support member 60 preferably has through holes to facilitate mounting on the module substrate 80 . For example, the support member 60 is a frame having a substantially rectangular opening in plan view, including two sides parallel to the one direction X and two sides perpendicular to the one direction X, which is perpendicular to the one direction X. It is preferable to have through holes 60a1 and 60a2 at positions respectively corresponding to the two sides. The through holes 60a1 and 60a2 are provided here on extensions of the columns of the element structures 15 arranged in one row along the one direction X. As shown in FIG. Since the support member 60 has the through holes 60a1 and 60a2, when the light emitting device 100 is mounted on the module substrate 80, the through holes 60a1, the holes 80a1 of the module substrate 80, and the through holes 60a2, as will be described later. By aligning the positions of the holes 80a2 of the module substrate 80, misalignment is suppressed and mounting accuracy is improved. This makes it easier to mount the light emitting device 100 on the module substrate 80 . Further, for example, when the module substrate 80 on which the light emitting device 100 is mounted is further used for a vehicle lamp such as a headlight, the holes 80a1 and 80a2 of the module substrate 80 can be aligned with the positioning pins provided on the lamp side. , misalignment can be prevented. This makes it easier to mount the light-emitting module 200 on the vehicle lamp.
Moreover, it is preferable that one through-hole 60a1 and the other through-hole 60a2 are different in size, for example, in diameter. By having the through holes 60a1 and 60a2 with different sizes, in the manufacturing process of the light emitting device 100, when arranging the element structure 15 in each of the plurality of support members 60 arranged two-dimensionally, the right and left sides of the support member 60 can be arranged. Misrecognition of the direction can be prevented.

The shape of the through-holes 60a1 and 60a2 is not limited to circular, but may be oval, triangular, quadrangular or other polygonal shape. In addition, the through holes 60a1 and 60a2 may be separated from the side surface of the support member in plan view, or may be open to the side surface. In other words, the through hole may have a shape obtained by notching a part of the outer edge of the support member in a semicircular shape, a semielliptical shape, or the like in plan view. In other words, as shown in FIG. 5C, through holes 60b1 and 60b2 opening on the side surface of the supporting member may be provided. Also, the sizes of the through holes 60a1 and 60a2 may be appropriately adjusted according to the size of the support member 60 and the like. For example, the diameter of the through hole 60a1 is 1.5 mm or more and 2.5 mm or less, and the diameter of the through hole 60a2 is 0.5 mm or more and 1.5 mm or less. If the sizes of the through holes 60a1 and 60a2 are within this range, the through holes 60a1 and 60a2 are appropriately large, which facilitates alignment with the holes 80a1 and 80a2 of the module substrate 80, and also allows the through holes 60a1 and 60a2 to be easily aligned. The strength of the support member 60 can be enhanced by making it moderately small.

Further, the support member 60 has an opening 60a3 for arranging the element structure 15 and the first covering member 51 in the center. The planar shape of the opening 60a3 is, for example, a substantially rectangular shape elongated in the one direction X. As shown in FIG. The size of the opening 60a3 is preferably such that the distance between the plurality of element structures 15 arranged in the opening 60a3 along the one direction X and the inner side surface of the opening 60a3 is at least 0.4 mm or more. This facilitates the arrangement of the element structure 15 and the first covering member 51 in the opening 60a3. In addition, it is preferable that the opening 60 a 3 penetrates the support member 60 . As a result, the upper surface of the element structure 15 (that is, the upper surface of the translucent member 30) and the lower surface (that is, the lower surface of the substrate 10) are exposed from the support member 60 and the first covering member 51, and the light emitting surface of the light emitting device 100 is exposed. and an external electrode surface.

The light emitting device 100 includes multiple element structures 15 . Here, eleven element structures 15 arranged in one row along one direction X are held by the first covering member 51 . However, the light-emitting device may be provided with 10 or less element structures 15, or may be provided with 12 or more. However, the light-emitting device 100 arranges at least three element structures 15 along one direction X. FIG. In the light-emitting device, when three or more element structures 15 are arranged along one direction X without providing the support member 60, the resin shrinks at a plurality of locations during curing of the first covering member 51. FIG. As the number of joints by the first covering member 51 in the one direction X increases, the problem of warping of the light emitting device becomes more likely to occur. Moreover, shrinkage of the resin may be caused by heat history when the cured light-emitting device is mounted on the module substrate, and if the light-emitting device is warped during mounting, mounting becomes difficult. Since the light-emitting device 100 of the present embodiment has the support member 60, even when three or more element structures 15 are arranged along one direction X, the occurrence of warping of the light-emitting device 100 is suppressed. It can be arranged at a desired position with high accuracy. Also, the element structures 15 may be arranged in a plurality of rows along the one direction X. FIG. In this embodiment, the one direction X is the row direction, and the direction perpendicular to the one direction X is the column direction.

Arranging the element structures 15 along the one direction X means arranging the plurality of element structures 15 in parallel such that the upper and lower side surfaces of the plurality of element structures 15 are aligned in a straight line in a plan view, and also when the element structures 15 adjacent to each other are arranged. It also includes the case where the upper and lower sides of the are displaced from each other. That is, in the light emitting device, a part of each element structure 15 may be arranged on a straight line in the one direction X in plan view. Preferably, substantially the center of the upper surface of each element structure 15 is arranged on a straight line in one direction X. FIG. As will be described later, even when the element structures 15 are arranged in a plurality of rows, part of each element structure 15 may be arranged on each of a plurality of straight lines in the one direction X. FIG. Preferably, the upper surfaces of the translucent members 30 of the element structure 15 are arranged in a matrix along one direction.
In addition, since the light-emitting device 100 includes a plurality of element structures 15, a plurality of light-emitting surfaces are arranged at high density and at desired positions of the light-emitting device 100 with high precision.

[Light emitting module]
Next, the light emitting module 200 is described.
The light-emitting module 200 includes the light-emitting device 100 having the configuration already described, and a module substrate 80 on which the light-emitting device 100 is mounted so that the substrate 10 of the light-emitting device 100 faces each other.
If the light-emitting device 100 does not have the protection element 25, it is preferable to have the protection element 25 on the module substrate 80 side. Further, the module substrate 80 may be configured to include electronic components other than the protection element 25, such as a connector for supplying power to the light emitting device 100. FIG.

The light emitting device 100 is as described above.
The module substrate 80 is a member on which the light emitting device 100 is mounted, and electrically connects the light emitting device 100 to the outside. The module substrate 80 is, for example, substantially rectangular in plan view. The module substrate 80 includes a base portion 6 and wiring portions 7 arranged on the surface of the base portion 6 .
Examples of the material of the base portion 6 include the materials exemplified as the materials used for the base 1 of the substrate 10 . Examples of the material of the wiring portion 7 include the materials exemplified as the materials used for the wiring of the substrate 10 .

The module substrate 80 has holes 80a1 and 80a2 penetrating through the module substrate 80 at positions facing the through holes 60a1 and 60a2 of the support member 60, respectively. The hole 80a1 has substantially the same shape and size as the through hole 60a1 in plan view, and the hole 80a2 has substantially the same shape and size as the through hole 60a2 in plan view.
Light emitting device 100 is mounted on the upper surface of module substrate 80 such that through holes 60a1 and 60a2 overlap with holes 80a1 and 80a2, respectively. Further, the light emitting device 100 is mounted on the upper surface of the module substrate 80 so that the external connection electrodes 3 and the wiring portions 7 are bonded via the conductive adhesive 9 . Examples of the conductive adhesive 9 include those exemplified for the conductive adhesive 8 described above.

Also, in the light emitting module 200 , the support member 60 is bonded to the module substrate 80 via the conductive adhesive 9 . Thereby, heat generated from the light emitting device 100 is radiated to the module substrate 80 via the support member 60 . Therefore, the light-emitting module 200 is more excellent in heat dissipation. Note that the support member 60 may be bonded onto the module substrate 80 via an insulating adhesive instead of the conductive adhesive 9 . Further, the support member 60 may not be fixed to the module substrate 80, but may be arranged on the support member 60 while being separated from or in contact with the support member 60. FIG.

[Light-emitting module operation]
When the light-emitting module 200 is driven, current is supplied from the external power supply to the light-emitting element 20, and the light-emitting element 20 emits light. The light emitted by the light emitting element 20 , which travels upward, is extracted to the outside above the light emitting device 100 via the translucent member 30 . Also, light traveling downward is reflected by the substrate 10 or the third covering member 53 and is extracted to the outside of the light emitting device 100 through the translucent member 30 . Further, the light traveling in the lateral direction is reflected by one or more of the first covering member 51, the second covering member 52, and the third covering member 53, and passes through the translucent member 30 to the light emitting device 100. taken out to the outside. At this time, by narrowing the space between the translucent members 30 (for example, 0.2 mm or less), for example, when the light emitting module 200 is used as a light source of a vehicle headlight, the configuration of the optical system can be made simple and compact. be able to. In addition, the light-emitting module 200 has excellent heat dissipation properties, and the presence of the support member 60 can suppress deformation due to heat.

[Method for manufacturing light-emitting device]
First, an example of a method for manufacturing the light emitting device 100 will be described.
FIG. 2 is a flow chart of a method for manufacturing a light emitting device according to the embodiment.
The manufacturing method of the light emitting device 100 includes an element structure preparation step S101, a support member preparation step S102, an element structure placement step S103, a first covering member formation step S104, and a sheet member removal step S105.
Note that the material, arrangement, etc. of each member are the same as those described in the description of the light emitting device 100 described above, so description thereof will be omitted as appropriate.

(Element structure preparation step)
The element structure preparing step S101 includes the element structure 15 including the substrate 10, the light emitting element 20, the translucent member 30, the light guide member 40, the third covering member 53, and the second covering member 52. is a step of preparing a plurality of
The element structure 15 may be prepared by purchase or the like. It can be prepared by passing through a part or all of each step.

The element structure preparing step S101 includes, for example, an aggregate substrate preparing step S101a, a light emitting element mounting step S101b, a translucent member arranging step S101c, a light guide member arranging step S101d, and a third covering member forming step S101e. , a second covering member forming step S101f and an element structure singulation step S101g.

<Assembly board preparation process>
The aggregate substrate preparation step S101a is a step of preparing the aggregate substrate 11 including a plurality of first regions 12 which will become the substrates 10 after the aggregate substrate 11 is divided.
The collective substrate 11 is a single substrate including a plurality of first regions 12 on which the light emitting elements 20 are mounted. Although FIG. 4A shows the aggregate substrate 11 including two first regions 12 for convenience, the number of first regions 12 may be adjusted as appropriate.

<Light emitting element mounting process>
FIG. 4A is a cross-sectional view schematically showing a step of mounting a light emitting element.
The light emitting element mounting step S101b is a step of mounting the light emitting elements 20 on the plurality of first regions 12 .
In this step S101b, each of the plurality of light emitting elements 20 is mounted on each of the plurality of first regions 12. As shown in FIG. The light emitting element 20 is flip-chip mounted on the upper surface wiring 2 arranged in the first region 12 with the conductive adhesive 8 using the electrode forming surface as the mounting surface.
The light-emitting element 20 can be prepared by going through a part or all of manufacturing processes such as going through processes such as semiconductor growth, or can be prepared by purchasing or the like.

This step S<b>101 b includes a step of placing protective elements 25 on the plurality of first regions 12 . That is, in this step S101b, each of the plurality of protective elements 25 is placed on each of the plurality of first regions 12. As shown in FIG.

<Translucent member placement process>
FIG. 4B is a cross-sectional view schematically showing a step of arranging a translucent member.
The translucent member placement step S101c is a step of arranging the translucent member 30 on each light emitting element 20 .
In this step S101c, for example, a translucent member 30 having a predetermined shape is joined to the upper surface of the light emitting element 20 opposite to the electrode forming surface (that is, the main light extraction surface side).

In this step S101c, for example, the light-transmitting member 30 is placed on the light-emitting element 20 having the light-transmitting adhesive member arranged on the upper surface thereof. As a result, the translucent member 30 is bonded to the upper surface of the light emitting element 20 via the adhesive member. As will be described later, the adhesive member is pressed by the translucent member 30 to form the light guide member 40 with a predetermined thickness. It is preferable that the lower surface of the translucent member 30 is wider than the upper surface of the light emitting element 20 . This makes it easier for the adhesive member to extend to the side surface of the light emitting element 20 . After placing the adhesive member on the translucent member 30 , the translucent member 30 is placed on the light emitting element 20 so that the adhesive member on the translucent member 30 is placed on the upper surface of the light emitting element 20 . may be placed.
When the translucent member 30 is bonded to the light emitting element 20, the direct bonding method may be used without using an adhesive member.

<Light guide member placement process>
The light guide member arranging step S101d is a step of arranging the light guide member 40 on the side surface of each light emitting element 20 .
The light guide member arranging step S101d can be performed as the same step as the translucent member arranging step S101c. By adjusting the amount and viscosity of the adhesive member used in the light-transmitting member placement step S101c, the adhesive member provided between the light-emitting element 20 and the light-transmitting member 30 is extended to the side surface of the light-emitting element 20, and the light-transmitting member 30 is guided. An optical member 40 can be formed.
When the light guide member arranging step S101d is performed after the translucent member arranging step S101c, after the light emitting element 20 and the translucent member 30 are joined using an adhesive member or by a direct joining method, the side surface of the light emitting element 20 is , the light guide member 40 is arranged.

In the light-transmitting member arranging step S101c, when a light-transmitting adhesive member that joins the light-emitting element 20 and the light-transmitting member 30 is used as the light-guiding member 40, the light-transmitting member arranging step and the light-guiding member arranging step are performed. is preferably performed as the same step. Thereby, the process can be simplified.

<Third covering member forming step>
FIG. 4C is a cross-sectional view schematically showing the step of forming the third covering member.
The third covering member forming step S<b>101 e is a step of forming the third covering members 53 covering the side surfaces of the respective light emitting elements 20 on the aggregate substrate 11 .
In this step S101e, a third covering member 53 covering the side surface of each light emitting element 20 via the light guide member 40 provided on the side surface of the light emitting element 20 is formed on the aggregate substrate 11. As shown in FIG. The third covering member 53 may also be arranged between the light emitting elements 20 and the aggregate substrate 11. In this step S101e, the third covering member 53 is formed so as to cover the lower surface of each light emitting element 20. is preferably provided.

In this step S101e, an uncured resin that will be the third covering member 53 is applied onto the aggregate substrate 11 by, for example, potting or spraying. If there is a gap between the light emitting elements 20 and the collective substrate 11, the resin applied to the collective substrate 11 spreads over the gap, and then creeps up and covers the side surfaces of the light emitting elements 20 due to surface tension. After that, the resin is cured to form the third covering member 53 covering the side surface of the light emitting element 20 .

<Second Covering Member Forming Step>
FIG. 4D is a cross-sectional view schematically showing the step of forming the second covering member.
The second covering member forming step S101f is a step of forming on the aggregate substrate 11 the second covering member 52 covering the side surface of each light emitting element 20 and the side surface of each translucent member 30 .
In this step S101f , the side surface of each light emitting element 20 is covered via the light guide member 40 provided on the side surface of the light emitting element 20, and the second covering member 52 that covers the side surface of each translucent member 30 is provided. It is formed on the collective substrate 11 .

In this step S101f, an uncured resin that will become the second covering member 52 is applied onto the aggregate substrate 11 by, for example, potting or spraying. The resin applied on the collective substrate 11 crawls up the side surfaces of the light emitting elements 20 and the side surfaces of the translucent member 30 due to surface tension to cover them. After that, the resin is cured to form the second covering member 52 covering the side surface of the light emitting element 20 and the side surface of the translucent member 30 .
In this step S101f, the second covering member 52 is provided so as to cover the side surfaces of the light emitting element 20 and the side surface of the translucent member 30 and expose the upper surface of the translucent member 30. As shown in FIG. The second covering member 52 may be formed by injection molding, transfer molding, compression molding, or the like using a mold or the like. After the second covering member 52 is provided so as to cover the upper surface of the translucent member 30, a portion of the second covering member 52 is polished, ground, or ground so that the upper surface of the translucent member 30 is exposed. It may be formed by removing by cutting or the like.

<Element structure singulation process>
FIG. 4E is a cross-sectional view schematically showing a step of singulating the element structure.
The element structure singulation step S101g is a step of dividing the aggregate substrate 11 into each first region 12 to obtain a plurality of element structures 15. FIG.
In this step S101g, the collective substrate 11 is divided at predetermined positions to be individualized into a plurality of element structures 15. As shown in FIG.

The manufacturing method of the light-emitting device 100 manufactures by combining a plurality of individualized element structures 15 . That is, since the sorting process can be performed after each element structure 15 is singulated, those having light emission characteristics within a predetermined range are sorted from the singulated element structures 15, and a desired combination is obtained. A light emitting device 100 can be formed. This makes it possible to obtain the light-emitting device 100 that emits light in a desired color with little variation in color.
In addition, when each element structure 15 is provided with the third covering member 53, the emission color of the element structure 15 and the emission color of the light emitting element 20 are different, for example, when the translucent member 30 includes a wavelength conversion member. However, it is possible to easily select those having emission characteristics within a predetermined range.

Also, in the manufacturing process, if some element structures 15 become defective, only the defective element structures 15 can be discarded before the first covering member 51 is arranged. In the case of a light-emitting device in which a plurality of light-emitting elements are mounted on one substrate, it is necessary to discard the entire light-emitting device if a part of the member fails. Therefore, the method for manufacturing a light-emitting device according to this embodiment can reduce the number of members to be discarded when a problem occurs during the process.

(Support member preparation process)
FIG. 4F is a plan view schematically showing the support member assembly in the support member preparation step. FIG. 4G is a cross-sectional view schematically showing a state in which the support member is arranged on the sheet member.
The supporting member preparing step S102 is a step of preparing the supporting member 60. FIG.
As shown in FIG. 4F, the support member 60 can be prepared as a support member assembly 65 in which frame-shaped support members 60 having openings 60a3 are connected in a matrix by connecting portions 61, for example.
As shown in FIG. 4G, the support member assembly 65 is fixed on the sheet member 70, for example, so that the element structure 15 can be placed on the sheet member 70 with the support member 60 as a reference. As a result, the element structure 15 can be placed with high accuracy even on the sheet member 70 having no alignment marks for placing the element structure 15 thereon. Further, by using the support member 60 having the through holes 60a1 and 60a2 with different diameters, misrecognition of the lateral direction of the support member assembly 65 can be prevented. Note that FIG. 4G shows a state in which one support member 60 is arranged on the sheet member 70 for the sake of convenience.

(Element structure placement step)
FIG. 4H is a cross-sectional view schematically showing a step of arranging element structures on a sheet. FIG. 4H shows the element structures 15 arranged with respect to one support member 60 for convenience.
The element structure arranging step S103 is a step of arranging the plurality of element structures 15 on the sheet member 70 so that the substrate 10 of the element structure 15 faces the sheet member 70 .
In this step S102, a plurality of element structures 15 are arranged along one direction X in the openings 60a3 of the frame-shaped support member 60 having the openings 60a3. The plurality of element structures 15 are placed on the sheet member 70 so that the bottom surface of the substrate 10 (that is, the surface opposite to the surface on which the light emitting elements 20 are placed) is in contact with the top surface of the sheet member 70 . The sheet member 70 has an adhesive 72 provided on a support 71 . When the element structure 15 has the external connection electrodes 3 on the bottom surface, the bottom surface of the element structure 15 is pushed into the adhesive 72 so that the external connection electrodes 3 are embedded in the adhesive 72 of the sheet member 70 . It is preferably arranged on the sheet member 70 . As a result, it is possible to suppress the first covering member 51 from wrapping around the surface of the external connection electrode 3 in the first covering member forming step S104, which will be described later.

In this step S102, since the element structures 15 after singulation are arranged on the sheet member 70, for example, when using a blade for singulation, the element structures 15 are arranged at a distance shorter than the width of the blade. can do. Thereby, the light-emitting device 100 having a narrow space between the light-emitting surfaces can be obtained. Further, in this step S102, since the element structures 15 after singulation are arranged on the sheet member 70, the plurality of light emitting surfaces are arranged at high density and at desired positions within the frame of the support member 60 with high accuracy. can be placed.
Examples of the sheet member 70 include those known in the art, such as a heat-resistant resin sheet and a UV curable sheet.

(First covering member forming step)
FIG. 4I is a cross-sectional view schematically showing a step of forming the first covering member.
In the first covering member forming step S104, the first covering member 51 covering the side surfaces of the substrate 10, the light emitting element 20, and the translucent member 30 of each element structure 15 is formed on the sheet member 70 exposed from the opening 60a3. It is a process to do.
In this step S104, for example, by potting or spraying, the first covering member 51 is not formed on the sheet member 70 so that the first covering member 51 is provided up to the side surface of the element structure 15 within the frame of the support member 60. Place the curing resin. The resin placed in the openings 60a3 creeps up between the adjacent element structures 15 due to capillary action. Thereby, the side surface of the translucent member 30 of the element structure 15 can be covered. By setting the height of the upper surface of the support member 60 arranged on the sheet member 70 lower than the upper surface of the element structure 15 , the first covering member 51 crawls up to the upper surface of the translucent member 30 . can be suppressed.

In this step S104, the side surfaces of the element structures 15 (that is, the side surfaces of the substrate 10, the side surfaces of the light emitting elements 20, and the side surfaces of the translucent member 30) are covered, and the upper surface of the translucent member 30 is exposed. A covering member 51 is provided. After the first covering member 51 is provided so as to cover the upper surface of the element structure 15, a part of the first covering member 51 is polished, ground, cut, etc. so that the upper surface of the element structure 15 is exposed. You may form by removing by.
Note that the first covering member 51 may be formed by die molding, printing, or the like.

(Sheet member removal process)
FIG. 4J is a cross-sectional view schematically showing the step of removing the sheet member.
The sheet member removing step S<b>105 is a step of removing the sheet member 70 .
In step S<b>105 , the sheet member 70 on which the element structures 15 and the like are placed is peeled off to form the light emitting device 100 .
In practice, the light emitting devices 100 are connected by the connecting portion 61 of the support member assembly 65, and the individual light emitting devices 100 are obtained by cutting the connecting portion 61. FIG.

In the light-emitting device 100 obtained in this manner, the distance between the light-emitting surfaces is narrow, so it is easy to adjust the light distribution by an optical system such as a lens. In addition, a plurality of light emitting surfaces are arranged at high density and at desired positions of the light emitting device 100 with high precision. In addition, the occurrence of warping of the light emitting device 100 is suppressed, and the light emitting device 100 can be arranged at a desired position on the module substrate 80 with high accuracy.

[Method for manufacturing light-emitting module]
Next, an example of a method for manufacturing the light emitting module 200 will be described.
FIG. 3 is a flow chart of a method for manufacturing a light emitting module according to the embodiment.
The manufacturing method of the light-emitting module 200 includes a light-emitting device preparation step S11 and a light-emitting device mounting step S12.
The module substrate 80 preferably has holes 80a1 and 80a2 at positions where the through holes 60a1 and 60a2 of the support member 60 face each other. Then, in the light emitting device mounting step S12, as shown in FIG. 4K, the through holes 60a1 and 60a2 of the support member 60 are aligned with the holes 80a1 and 80a2 of the module substrate 80, and the light emitting device 100 is mounted on the module substrate 80. Place.
Note that the material, arrangement, etc. of each member are as described in the description of the light-emitting module 200, and therefore the description is omitted here as appropriate.

(Light-emitting device preparation step)
The light emitting device preparation step S11 is a step of preparing the light emitting device 100 described above.
In this step S11, for example, the light emitting device 100 is manufactured by performing the steps S101 to S105 described above.

(Light-emitting device mounting step)
FIG. 4K is a cross-sectional view showing the step of mounting the light emitting device.
The light emitting device mounting step S<b>12 is a step of mounting the light emitting device 100 so that the substrate 10 of the light emitting device 100 faces the module substrate 80 .
In step S<b>12 , the light emitting device 100 is placed on the top surface of the module substrate 80 . The light emitting device 100 is mounted on the upper surface of the module substrate 80 via the conductive adhesive 9 with the substrate 10 side as the mounting surface.
In step S12, the through hole 60a1 of the support member 60 and the hole 80a1 of the module substrate 80, and the through hole 60a2 of the support member 60 and the hole 80a2 of the module substrate 80 are aligned, and the fastener 91a of the positioning jig 90 is passed through. It is inserted into the hole 60a1 and the hole 80a1, and the fastener 91b is inserted into the through hole 60a2 and the hole 80a2. As a result, the light emitting device 100 and the module substrate 80 are aligned, and the light emitting device 100 is placed on the module substrate 80 .

Although the light-emitting device, the light-emitting module, and the method for manufacturing the light-emitting device and the method for manufacturing the light-emitting module have been specifically described above in terms of the modes for carrying out the invention, the gist of the present invention is limited to these descriptions. Instead, it should be interpreted broadly based on the statements in the claims. In addition, various changes and modifications based on these descriptions are also included in the gist of the present invention.

<<Modification>>
FIGS. 5A to 5G are plan views schematically showing examples of light-emitting modules provided with light-emitting devices according to first to seventh modifications, respectively. 5H is a cross-sectional view schematically showing an example of a method for manufacturing a light-emitting module according to an eighth modification; FIG.
In each drawing, the sizes and positional relationships of members are appropriately simplified.

As a first modified example, the light-emitting module 200A and the light-emitting device 100A have a single rod-shaped support member 60A. 60 A of rod-shaped support members are arrange|positioned over the side of the several element structure 15 in the one direction X. As shown in FIG.
As a second modification, the light-emitting module 200B and the light-emitting device 100B have two rod-shaped supporting members 60B. Two supporting members 60B are arranged in parallel along the sides of the plurality of element structures 15 in one direction X, with the plurality of element structures 15 interposed therebetween.
As shown in the first modified example and the second modified example, the light emitting device can be arranged along the sides of the plurality of element structures 15 in the one direction X even when a rod-shaped support member is used. can suppress the occurrence of warping of the light-emitting device. Further, by using a rod-shaped support member, the size of the support member can be reduced, so that the size and weight of the light emitting module 200C and the light emitting device 100C can be reduced. In addition, in the first modification and the second modification, the support member may or may not have a through hole for alignment with the module substrate.

As a third modified example, the light-emitting module 200C and the light-emitting device 100C have through-holes 60b1 formed by cutting out part of the outer edge in a semi-elliptical shape in each of the side surfaces facing the one direction X of the support member 60C. , 60b2. The through holes 60b1 and 60b2 are different in size. By forming the through holes 60b1 and 60b2 that are open on the side surfaces in this way, the length of the supporting member in one direction X can be shortened, so that the size and weight of the light emitting module 200C and the light emitting device 100C can be reduced. be able to. The shape of the through holes 60b1 and 60b2 opening on the side surfaces is not limited to the semielliptical shape, and may be semicircular or rectangular.

As a fourth modification, a light-emitting module 200D and a light-emitting device 100D have a plurality of element structures 15 arranged in a matrix of 2 rows and 11 columns.
As a fifth modified example, a light-emitting module 200E and a light-emitting device 100E have a plurality of element structures 15 arranged in a matrix of 2 rows and 11 columns. Here, the element structures 15 positioned at both ends of each row are arranged such that the distance between adjacent element structures 15 in the row direction is longer than the distance between other element structures 15 in the row direction. .

As a sixth modification, the light-emitting module 200F and the light-emitting device 100F are a combination of element structures 15 having different sizes of light-emitting surfaces. Here, element structures 15 with small light emitting surfaces are arranged in a matrix of 2 rows and 6 columns in the center of the light emitting device 100F. In addition, three element structures 15 with large light emitting surfaces are arranged side by side in the row direction on both sides in the row direction of the assembly of element structures 15 with small light emitting surfaces. Thus, in the light-emitting module 200F and the light-emitting device 100F, a plurality of element structures 15 with different light-emitting surfaces are arranged along one direction. In this way, the light-emitting modules 200 and the light-emitting devices 100 may be arranged in a plurality of rows while the element structures 15 are arranged along one direction. In the light-emitting module 200F and the light-emitting device 100F, by arranging the element structures 15 with small light-emitting surfaces in the central portion, more element structures 15 are arranged in the central portion than in the case of arranging the element structures 15 with large light-emitting surfaces. can be arranged densely. In the light-emitting module 200F and the light-emitting device 100F, the element structures 15 are densely arranged in the central portion. It is possible to irradiate with higher definition.

As a seventh modification, the light-emitting module 200G and the light-emitting device 100G have the element structures 15 arranged in two rows in a zigzag pattern. Here, the element structures 15 in the first row and the elements in the second row are arranged such that the gap in the row direction between the element structures 15 in the first row and the element structures 15 in the second row is 0 or less. The structures 15 are shifted in the row direction. Thus, in the light-emitting module 200G and the light-emitting device 100G, the plurality of element structures 15 are arranged in two rows along one direction. Since the light emitting module 200G and the light emitting device 100G can have a gap of 0 or less in the row direction, for example, when the light emitting module 200G is used as a light source for vehicle headlights, it is possible to illuminate the lateral direction with higher precision.

Thus, the number of rows and the number of columns of the light-emitting module and the light-emitting device are not limited, and the number of element structures in each row and each column may be appropriately adjusted according to the desired light distribution pattern. Further, in the light-emitting module and the light-emitting device, the combination of element structures having different sizes of light-emitting surfaces, the arrangement of the element structures, and the like may be appropriately adjusted according to the light distribution pattern.

In the light-emitting device, the plurality of element structures may include two or more types of element structures with different emission colors. Here, the luminescent color of the element structure means the luminescent color of the light emitted from the upper surface of the translucent member. For example, the emission color of the light emitting element and the emission color of the element structure may be the same. As two or more element structures with different emission colors, for example, by using light emitting elements with different emission colors, element structures with different emission colors can be obtained. In addition, a plurality of element structures using light emitting elements emitting light of the same color are provided with light-transmitting members containing different phosphors, so that a plurality of element structures emitting light of different colors can be obtained.

In the light-emitting device and light-emitting module described above, the second covering member may cover the lower surface of the light-emitting element, or may not cover the lower surface of the light-emitting element.
In addition, each member such as the first covering member, the second covering member, the third covering member, the light guide member, etc., contains additives for obtaining a desired emission color, a desired member surface color, a desired light distribution characteristic, and the like. As agents, various coloring agents, fillers, wavelength conversion members, and the like may be contained.
Further, the substrate and the module substrate may be substantially square in plan view, and the supporting member may also be a substantially square frame in plan view. The substrate, module substrate, and support member may have other shapes. Moreover, when the support member is a frame, the frame may have portions arranged intermittently. Further, the support member may be, for example, a polygon with one side missing (for example, a concave shape), a U-shape, or the like.

As an eighth modification, a light-emitting module 200H includes a light-emitting device 100 and a module substrate 80A. The module substrate 80A has holes 80c1 and 80c2 at positions where the through holes 60a1 and 60a2 of the support member 60 face each other. It also has holes 80d1 and 80d2 for inserting fasteners 91Aa and 91Ab of the positioning jig 90A. In the eighth modified example, the holes 80c1 and 80c2 and the holes 80d1 and 80d2 are holes provided on the upper surface of the module substrate 80A and do not penetrate the module substrate 80A.
Then, in the light emitting device mounting step S12, the positions of the through hole 60a1 of the supporting member 60 and the hole 80c1 of the module substrate 80A, and the positions of the through hole 60a2 of the supporting member 60 and the hole 80c2 of the module substrate 80A are aligned. The fastener 91a is inserted into the through hole 60a1 and the hole 80c1, and the fastener 91b is inserted into the through hole 60a2 and the hole 80c2. Also, the fastener 91Aa is inserted into the hole 80d1, and the fastener 91Ab is inserted into the hole 80d2. As a result, the light emitting device 100 and the module substrate 80A are aligned, and the light emitting device 100 is placed on the module substrate 80A.

FIG. 6A is a plan view schematically showing an example of a light-emitting module provided with a light-emitting device according to a ninth modification. FIG. 6B is a bottom view schematically showing an example of a light emitting device according to a ninth modification. FIG. 6C is a schematic cross-sectional view along line VIC-VIC in FIG. 6A. FIG. 6D is a plan view schematically showing an example of a module substrate used in a light emitting module according to a ninth modification; 6E is a plan view schematically showing an enlarged part of an example of a light emitting module according to a ninth modification, and is a plan view showing the positional relationship between the module substrate of FIG. 6D and the light emitting device of FIG. 6A. be. FIG. 6F is a plan view schematically showing an example of a module substrate used in a light emitting module according to a tenth modification; 6G is a plan view schematically showing an enlarged part of an example of a light emitting module according to a tenth modification, and is a plan view showing the positional relationship between the module substrate of FIG. 6F and the light emitting device of FIG. 6A. be. Figures 6E and 6G show the light emitting device in transparent.

As a ninth modification, the light-emitting module 200I and the light-emitting device 100H are provided with heat dissipation terminals. In the light emitting device 100H, the substrate 10 included in the element structure 15A has the external connection electrode 3A and the first heat dissipation terminal 5 on the lower surface opposite to the upper surface on which the light emitting element 20 is mounted. The substrate 10 has a substantially rectangular parallelepiped shape having a longitudinal direction and a lateral direction in a plan view. A terminal 5 is provided. The first heat radiation terminal 5 faces the positive and negative external connection electrodes (that is, the anode electrode 3Aa and the cathode electrode 3Ab) in the longitudinal direction. Therefore, the light-emitting device 100</b>H includes external connection electrodes 3</b>A that are shorter in length in the longitudinal direction of the substrate 10 than the external connection electrodes 3 of the light-emitting device 100 .
The substrate 10 has a substantially rectangular first heat radiation terminal 5 on the lower surface, and the first heat radiation terminal 5 is arranged directly below the light emitting element 20 in the element structure 15A.
Examples of materials for the first heat radiation terminal 5 include those exemplified as materials used for the external connection electrode 3 . The first heat radiation terminal 5 is insulated from the external connection electrode 3A. That is, the first heat radiation terminal 5 and the light emitting element 20 are insulated.
Further, the light emitting device 100H differs from the light emitting device 100 in the size of the opening 63a of the support member 60D.
Other matters are the same as those of the light emitting device 100 .

The module substrate 80B on which the light emitting device 100H is mounted has the positive and negative wiring portions 7A arranged at positions facing the positive and negative external connection electrodes 3A and the first heat dissipation terminals 5 on the upper surface on which the light emitting device 100H is mounted. and a second heat radiation terminal 17 arranged at a position facing each other.
In the module substrate 80B, the shape and position of the wiring portion 7A joined to the light emitting device 100H are made to match the shape and position of the external connection electrode 3A. Specifically, the module substrate 80B has a wiring portion 7A (anode electrode side wiring portion 7Aa and cathode electrode side wiring portion 7Ab) having a shape substantially matching the shapes of the anode electrode 3Aa and the cathode electrode 3Ab of the light emitting device 100H. have.
The module substrate 80B includes second heat radiation terminals 17 arranged at positions facing the first heat radiation terminals 5 of the plurality of element structures 15A. Each of the second heat radiation terminals 17 is arranged continuously from a position facing the first heat radiation terminal 5 to a position facing the lower surface of the support member 60 in the Y direction perpendicular to the one direction X in plan view. there is Thereby, heat dissipation can be improved more.

As a tenth modification, the light-emitting module 200J differs from the module substrate 80B in the shape of the second heat radiation terminal of the module substrate 80C.
A module substrate 80C on which the light emitting device 100H is mounted has one second heat radiation terminal 17A having a size including a plurality of regions facing the first heat radiation terminals 5 of the plurality of element structures 15A. That is, the module substrate 80C has one second heat radiation terminal 17A that is collectively connected to the plurality of first heat radiation terminals 5 included in the light emitting device 100H. The second heat radiation terminal 17A is arranged continuously from a position facing the first heat radiation terminal 5 to a position facing the lower surface of the support member 60D in the Y direction perpendicular to the one direction X in plan view. Thereby, heat dissipation can be improved more.
Other matters are the same as those of the module substrate 80B.
In the module substrate 80B and the module substrate 80C, the shape and position of the second heat radiation terminals 17 and 17A are different from the shape and position of the first heat radiation terminal 5, but the shape and position of the second heat radiation terminals 17 and 17A are different from those of the first heat radiation terminal 5. may be used with a module substrate conforming to the shape and position of the first heat radiation terminal 5 .

FIG. 7A is a plan view schematically showing an example of a light-emitting module including a light-emitting device according to Modification 11. FIG. FIG. 7B is a bottom view schematically showing an example of a light emitting device according to Modification 11; 7C is a plan view schematically showing an example of a module substrate used in a light emitting module according to Modification 11. FIG. 7D is a plan view schematically showing an enlarged part of an example of a light emitting module according to an eleventh modification, and is a plan view showing the positional relationship between the module substrate of FIG. 7C and the light emitting device of FIG. 7A. be. 7E is a plan view schematically showing an example of a module substrate used in a light emitting module according to Modification 12. FIG. 7F is a partially enlarged plan view schematically showing an example of a light emitting module according to a twelfth modification, and is a plan view showing the positional relationship between the module substrate of FIG. 7E and the light emitting device of FIG. 7A. be. 7D and 7F illustrate the light emitting device through the light.

As an eleventh modification, a light-emitting module 200K and a light-emitting device 100I have a plurality of element structures 15A arranged along one direction X in a matrix of 2 rows and 11 columns. The plurality of element structures 15A are arranged in two rows so as to be symmetrical about a straight line parallel to the one direction X as an axis of symmetry. In other words, the plurality of element structures 15A are arranged in two rows along one direction X, and arranged so as to be symmetrical with respect to a straight line passing between the rows.
In the light-emitting device 100I, in a plan view, the element structures 15A in the first row and the element structures 15A in the second row are arranged such that the side surfaces on the other end side where the first heat radiation terminals 5 are arranged face each other. It is That is, the first heat radiation terminals 5 provided in the plurality of element structures 15A are arranged inside the external connection electrodes 3A in the direction Y perpendicular to the one direction X in plan view.
Other matters are the same as those of the light emitting device 100H, except that the size of the opening 63a of the supporting member is different.

The module substrate 80D on which the light emitting device 100I is mounted has the positive and negative wiring portions 7A arranged at positions facing the positive and negative external connection electrodes 3A and the first heat dissipation terminals 5 on the upper surface on which the light emitting device 100I is mounted. and a second heat radiation terminal 17B arranged at a position facing each other.
The module substrate 80D includes one second heat radiation terminal 17B having a size including a plurality of areas facing the first heat radiation terminals 5 of the plurality of element structures 15A.
In the module substrate 80D, the second heat radiation terminals 17B are arranged continuously in the one direction X from the position facing the first heat radiation terminals 5 to the position facing the lower surface of the support member 60 in plan view. . At this time, the second heat radiation terminal 17B is provided so as to be separated from the through holes 60a1 and 60a2 in plan view.
That is, the module substrate 80D can collectively mount the plurality of first heat radiation terminals 5 included in the light emitting device 100I, and further extends to a predetermined position facing the lower surface of the support member 60 in the one direction X in plan view. and one second heat radiation terminal 17B. Thereby, heat dissipation can be improved more.
Other matters are the same as those of the module substrate 80B.

As a twelfth modification, the light-emitting module 200L differs from the module substrate 80D in the shape of the second heat radiation terminal of the module substrate 80E.
A light emitting device 100I including a plurality of element structures 15A arranged in a plurality of rows along the one direction X is mounted on the module substrate 80E of the light emitting module 200L of the twelfth modification. The module substrate 80E has a plurality of second heat dissipation terminals 17C corresponding to a plurality of rows in which the element structures 15A are arranged. The first heat radiation terminal 5 is joined to each of the plurality of second heat radiation terminals 17C.
Specifically, the module substrate 80E includes, as the second heat dissipation terminals 17C, the second heat dissipation terminals 17Ca arranged to face the first heat dissipation terminals 5 of the element structures 15A arranged in the first row, and a second heat radiation terminal 17Cb arranged to face the first heat radiation terminal 5 of each element structure 15A arranged in a row.
Further, the module substrate 80E is arranged such that the second heat radiation terminal 17C extends to a position facing the lower surface of the support member 60 in the one direction X in a plan view. Thereby, heat dissipation can be improved more. The second heat dissipation terminal 17C is provided so as to be separated from the through holes 60a1 and 60a2 of the support member 60 in plan view.
Other matters are the same as those of the module substrate 80D.
In the module substrate 80D and the module substrate 80E, the shape and position of the second heat radiation terminals 17B and 17C are different from the shape and position of the first heat radiation terminal 5, but the shape and position of the second heat radiation terminals 17B and 17C are A module substrate matching the shape and position of the first heat radiation terminal 5 may be used.

Further, the method for manufacturing the light-emitting device and the method for manufacturing the light-emitting module may include other steps between or before and after each of the steps as long as they do not adversely affect the steps.
FIG. 8 is a flow chart of another method for manufacturing the light emitting device according to the embodiment.

For example, in the method for manufacturing a light emitting device according to the embodiment, when a thermosetting resin is used for the first covering member 51 in the first covering member forming step S104, the first covering member An adhesive curing step S500, which is a step of curing the adhesive resin of the sheet member 70, that is, the adhesive 72, may be performed before performing the member forming step S104. Due to the heat history when the resin is cured and/or the time elapsed until the resin is cured, it may be difficult to separate the light-emitting device 100 from the sheet member 70, or part of the adhesive 72 of the sheet member 70 may be removed from the light-emitting device 100 after separation. There is a risk that it will adhere to the back surface of the. In particular, when the element structure 15 is provided with the external connection electrodes 3 on the lower surface of the substrate 10, if the adhesive 72 of the sheet member 70 adheres to the surface of the external connection electrodes 3, the electrical connection will not be established at the time of mounting on the module substrate. There is a risk that it will not be possible. For this reason, by curing the adhesive 72 of the sheet member 70 before forming the first covering member 51, the sheet member 70 in the external connection electrode 3 of the light emitting device 100 after removing the sheet member 70 is removed. Adhesive residue can be suppressed. Normally, the curing conditions of the resin are controlled so as not to cause the above problem. .

In the element structure placement step, the element structures are placed on the sheet member 70 so that the external connection electrodes 3 are embedded in the adhesive 72 of the sheet member 70 . However, the element structure may be placed on the sheet member 70 so that the external connection electrodes 3 are not embedded in the adhesive 72 of the sheet member 70 . In this case, the first covering member may cover the lower surface of the substrate 10 and the side surfaces of the external connection electrodes 3 in the step of forming the first covering member.

Further, for example, a foreign matter removing step or the like for removing foreign matter mixed in during manufacturing may be included.
In addition, in the method for manufacturing a light-emitting device and the method for manufacturing a light-emitting module, the order of some steps is not limited, and the order may be changed. For example, in the element structure preparation step, after placing the plurality of light emitting elements 20 on the substrate 10 , the translucent member 30 is provided on each of the light emitting elements 20 . However, after the translucent member 30 is provided on the light emitting element 20, it may be placed on the substrate 10. FIG. Alternatively, the light emitting element 20 and the translucent member 30 may be placed on the substrate 10 after the collective substrate 11 is divided.
Further, for example, in the manufacturing method of the light-emitting device described above, the supporting member preparing step is performed before the element structure arranging step. However, the support member preparation step may be performed after the device structure placement step and before the first covering member formation step. Moreover, the support member preparation process may be performed before the element structure preparation process.

A light-emitting device and a light-emitting module according to embodiments of the present disclosure can be suitably used as a vehicle lamp for a variable light distribution headlight light source. In addition, the light emitting device and light emitting module according to the embodiments of the present disclosure can be used as backlight sources for liquid crystal displays, various lighting fixtures, large displays, various display devices such as advertisements and destination guides, digital video cameras, facsimiles, and copiers. It can be used for an image reading device in a machine, a scanner, etc., a projector device, and the like.

1 substrate 2 upper surface wiring 3, 3A external connection electrodes 3a, 3Aa anode electrodes 3b, 3Ab cathode electrode 4 via 5 first heat radiation terminal 6 substrate portions 7, 7A wiring portion 7Aa anode electrode side wiring portion 7Ab cathode electrode side wiring portion 8 conductive conductive adhesive 9 conductive adhesive 10 substrate 11 collective substrate 12 first regions 15, 15A element structures 17, 17A, 17B, 17C, 17Ca, 17Cb second heat dissipation terminal 20 light emitting element 25 protective element 30 translucent member 40 Light guide member 51 First covering member 52 Second covering member 53 Third covering members 60, 60A, 60B, 60C, 60D Supporting members 60a1, 60a2, 60b1, 60b2 Through hole 60a3 Opening 61 Connecting portion 65 Supporting member assembly 70 Sheet Member 71 Support 72 Adhesive 80, 80A, 80B, 80C, 80D, 80E Module substrate 80a1, 80a2, 80c1, 80c2, 80d1, 80d2 Hole 90, 90A Positioning jig 91a, 91b, 91Aa, 91Ab Fastener 100, 100A, 100B, 100C, 100D, 100E, 100F, 100G, 100H, 100I Light emitting device 200, 200A, 200B, 200C, 200D, 200E, 200F, 200G, 200H, 200I, 200J, 200K, 200L Light emitting module L1 Between adjacent substrates Distance L2 Distance between adjacent translucent members H Height of support member W Width of support member X One direction

Claims (10)

A device structure comprising a substrate, a light emitting device placed on the substrate, and a translucent member placed on the light emitting device, at least three of which are arranged along one direction a plurality of element structures;
a first covering member covering side surfaces of the substrate, the light emitting element, and the translucent member of each of the element structures;
a supporting member that covers the side surface of the first covering member, is arranged along the sides of the plurality of element structures in the one direction, and has higher rigidity than the first covering member ;
a light-emitting device in which the substrate includes upper-surface wiring arranged on an upper surface on which the light-emitting element is mounted, an external connection electrode arranged on a lower surface opposite to the upper surface, and a first heat dissipation terminal ;
a module substrate on which the light emitting device is placed so that the substrates face each other;
The module substrate has a plurality of wiring portions arranged at positions facing the plurality of external connection electrodes and positions facing the plurality of first heat radiation terminals on the upper surface on which the light emitting device is mounted. a plurality of second heat dissipation terminals arranged,
The light emitting module, wherein the second heat radiation terminal extends from a position facing the first heat radiation terminal to a position facing the support member in a direction perpendicular to the one direction . 2. The light- emitting module according to claim 1, wherein two supporting members are arranged across the sides of the plurality of element structures in the one direction, with the plurality of element structures interposed therebetween. 3. The light- emitting module according to claim 1, wherein the support member is a frame-shaped member surrounding the plurality of element structures. 4. The light emitting module according to any one of claims 1 to 3, wherein the support member is a metal, an alloy, or an insulating member. 5. The light emitting module according to any one of claims 1 to 4, wherein the upper surface of the support member is lower than the upper surface of the device structure. 6. The light emission according to any one of claims 1 to 5, wherein the supporting member has a width of 0.5 mm or more and 2.0 mm or less at a portion arranged laterally of the plurality of element structures. module . The light- emitting module according to any one of claims 1 to 6, wherein the plurality of element structures are arranged in multiple rows along the one direction. 8. The light emitting module according to any one of claims 1 to 7, wherein the first covering member is a colored resin. The element structure includes a second covering member covering the side surface of the light emitting element and the side surface of the translucent member on the substrate, and the first covering member emits the light through the second covering member. 9. The light- emitting module according to any one of claims 1 to 8, wherein the side surface of the element and the side surface of the translucent member are covered. The support member has two sides orthogonal to the one direction, and has through holes at positions corresponding to the two sides, respectively, and the through holes have different sizes. 10. The light- emitting module according to any one of 9.

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