JP7144330B2 - Welding equipment - Google Patents

Description

The present invention relates to a joining device.

Japanese Patent Application Laid-Open No. 2016-117100 (Patent Document 1) discloses a bonding apparatus that bonds metal members together or a metal member and an inorganic member by sonic vibration or ultrasonic vibration.

Japanese Unexamined Patent Application Publication No. 2016-117100 JP-A-2005-142537

In the bonding apparatus disclosed in Japanese Patent Application Laid-Open No. 2016-117100 (Patent Document 1), in order to bond metal members together or a metal member and an inorganic member, vibration in a lateral direction perpendicular to the pressing direction is applied to the first resonator. and applied from the second resonator to the part to be welded.

On the other hand, depending on the material of the members to be joined, it may be easier to join them by applying vertical vibration along the pressing direction. For example, Japanese Unexamined Patent Application Publication No. 2005-142537 (Patent Document 2) discloses a bonding apparatus that applies longitudinal vibration.

Therefore, in order to join members made of various materials, it is preferable to have a joining device that joins by lateral vibration and a joining device that joins by vertical vibration. However, preparing two bonding devices is not preferable from the point of view of installation area and cost.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and an object thereof is to provide a bonding apparatus capable of applying longitudinal vibration and lateral vibration by itself. .

In summary, the present invention is a joining device for joining a first member and a second member, comprising: a first horn arranged on the side of the first member; a second horn arranged on the side of the second member; A pressurizing device that applies pressure between the first horn and the second horn so as to narrow the space between the first horn and the second horn; A first vibrating device that applies to the horn and a second vibrating device that applies vibration in a direction parallel to the pressurizing direction of the pressurizing device to the second horn, wherein the first member is made of metal and the second member is made of a material containing resin.

With such a configuration, it is possible to apply horizontal vibration and vertical vibration to the member to be welded by a single welding apparatus. Furthermore, it is possible to realize a joining apparatus capable of joining a metal material and a material containing resin.
Preferably, the contact area of the second horn with the second member is larger than the contact area of the first horn with the first member.
In another aspect, the present invention provides a joining device for joining a first member and a second member, comprising a first horn arranged on the first member side and a second horn arranged on the second member side. , a pressurizing device that applies pressure between the first horn and the second horn so as to narrow the space between the first horn and the second horn, and vibration in a direction perpendicular to the pressurizing direction of the pressurizing device Equipped with a first vibrating device that applies to the first horn and a second vibrating device that applies vibration in a direction parallel to the pressurizing direction of the pressurizing device to the second horn, and the contact of the second horn with the second member The area is larger than the contact area of the first horn to the first member. When the surface hardness of the first member with which the first horn contacts differs from the surface hardness of the second member with which the second horn contacts, the pressure applied to the contact surface between the horn and the member causes the member with the smaller surface hardness to The contact surface on the side is easily scratched. Therefore, the area of contact of the second horn, which is the side of the member with low hardness, with the second member is made larger than the area of contact of the first horn, which is the side of the member with high hardness, with the first member. As a result, it is possible to form a joining joint while minimizing damage to the contact surface between the horn and the member.

Preferably, the bonding device further includes a control device that controls the first vibrating device and the second vibrating device. The bonding apparatus has a first mode and a second mode as operation modes. The control device operates the first vibrating device with the second vibrating device stopped in the first mode, and operates the second vibrating device with the first vibrating device stopped in the second mode. Let

Since such operation modes are provided, materials that are easily bonded by vibration in the lateral direction are bonded in the first mode, and materials that are easily bonded by vibration in the vertical direction are bonded in the second mode. Bonding can be handled by a single bonding device.

More preferably, the bonding apparatus further has a third mode as an operation mode. The control device operates the first vibrating device and also the second vibrating device during one bonding operation in the third mode.

By operating in the third mode, the possibility of good bonding between materials that are easily bonded by lateral vibration and materials that are easily bonded by vertical vibration is increased.

According to the bonding apparatus of the present invention, both bonding by longitudinal vibration and bonding by lateral vibration can be performed with one apparatus.

It is a figure which shows the structure of the joining apparatus which concerns on this Embodiment. FIG. 4 is a waveform diagram for explaining control by the control device 100 when lateral vibration is applied to an object to be joined (first mode); FIG. 5 is a waveform diagram for explaining control by the control device 100 when vertical vibration is applied to the object to be welded (second mode). FIG. 5 is a waveform diagram for explaining control by the control device 100 when vertical vibration and horizontal vibration are applied to a bonding object during one bonding operation (third mode).

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. A plurality of embodiments will be described below, but appropriate combinations of the configurations described in the respective embodiments have been planned since the filing of the application. The same or corresponding parts in the drawings are denoted by the same reference numerals, and the description thereof will not be repeated.

FIG. 1 is a diagram showing the configuration of a joining apparatus according to this embodiment. Referring to FIG. 1, the bonding apparatus 1 includes a power source 20, a first vibrating device 30, a first horn 41, a second vibrating device 130, a second horn 141, a pressure device 50, and a control device 100 .

The joining device 1 joins the first member 71 and the second member 72 . The first horn 41 is arranged on the first member 71 side. The second horn 141 is arranged on the second member 72 side.

The first member 71 and the second member 72 are plate members, for example. The first member 71 and the second member 72 are overlapped and sandwiched between the first horn 41 and the second horn 141 .

The pressure device 50 applies pressure between the first horn 41 and the second horn 141 so as to narrow the distance between the first horn 41 and the second horn 141 .

The first vibrating device 30 includes a vibrator 31 that receives a high frequency from a power supply 20 that generates a high-frequency AC voltage for joining from a commercial power supply 10 and vibrates, and an amplifier 32 that amplifies the vibration of the vibrator 31 . The second vibrating device 130 includes a vibrator 131 that vibrates by receiving a high frequency from a power supply 20 that generates a high-frequency AC voltage for joining from a commercial power supply 10 and an amplifier 132 that amplifies the vibration of the vibrator 131 .

The first vibrating device 30 applies vibration to the first horn 41 in a direction orthogonal to the pressing direction of the pressing device 50 . In other words, the first vibrating device 30 applies vibration in a direction parallel to the joint surface to the first horn. The second vibrating device 130 applies vibration to the second horn 141 in a direction parallel to the pressing direction of the pressing device 50 . In other words, the second vibrator 130 applies vibration to the second horn in a direction perpendicular to the joint surface.

With such a configuration, it is possible to apply horizontal vibration and vertical vibration to the members to be welded by one welding apparatus 1 .

For example, it is known that good metal-to-metal bonding can be achieved by placing the objects to be bonded over a fixed anvil and applying pressure from above using a laterally vibrating horn. For CFRP (Carbon Fiber Reinforced Plastics), for example, good bonding can be obtained by placing the object to be bonded on top of a fixed anvil and applying pressure from above using a vertically vibrating horn. Are known.

Therefore, according to the joining apparatus 1, objects to be joined made of various materials can be joined using a single joining apparatus.

When vibration is applied by at least one of the first vibrating device 30 and the second vibrating device 130 , relative motion is generated between the second member 72 and the first member 71 . Due to this relative motion, frictional heat is generated between the second member 72 and the first member 71, and the second member 72 and the first member 71 are welded together.

The bonding apparatus 1 further includes a control device 100 that controls the first vibrating device 30 and the second vibrating device 130 . The bonding apparatus 1 has a first mode and a second mode as operation modes.

When the control signal V1 is turned on, the first vibrating device 30 operates, and when the control signal V1 is turned off, the first vibrating device 30 stops.

When the control signal V2 is turned ON, the second vibrating device 130 is activated, and when the control signal V2 is turned OFF, the second vibrating device 130 is stopped.

The control device 100 transmits a control signal V1 to the first vibrating device 30 and a control signal V2 to the second vibrating device 130, thereby causing the bonding device to operate in the first mode and the second mode. be able to. The control device 100 can be realized by a microcomputer containing a processor and memory. The program stored in the memory is loaded into the processor, and the control device 100 controls the first vibrating device 30 and the second vibrating device 130 so as to correspond to the designated operation mode.

FIG. 2 is a waveform diagram for explaining the control by the control device 100 when lateral vibration is applied to the object to be welded (first mode). As shown from time t1 to t2 in FIG. 2, the control device 100 controls the control signals V1 and V2 so as to operate the first vibrating device 30 while the second vibrating device 130 is stopped in the first mode. are transmitted to the transducers 31 and 131, respectively.

FIG. 3 is a waveform diagram for explaining control by the control device 100 when vertical vibration is applied to the object to be welded (second mode). As shown at times t11 to t12 in FIG. 3, the control device 100 causes the control signals V1 and V2 to operate the second vibrating device 130 while the first vibrating device 30 is stopped in the second mode. are transmitted to the transducers 31 and 131, respectively.

With these operation modes, it is possible to bond materials that are easily bonded by lateral vibration in the first mode, and materials that are easily bonded by vertical vibration in the second mode, thereby bonding multiple materials. can be handled by a single bonding apparatus.

More preferably, the first member 71 is made of metal, and the second member 72 is made of a resin-containing material (for example, CFRP). Therefore, it is possible to realize a joining apparatus capable of joining a metal material and a material containing resin.

Note that the contact area of the second horn 141 with the second member 72 that imparts suitable longitudinal vibration to resin materials and the like is the contact area of the first horn 41 with the first member 71 that imparts suitable lateral vibration to metal materials and the like. preferably larger than

When the surface hardness of the first member 71 with which the first horn 41 contacts differs from the surface hardness of the second member 72 with which the second horn 141 contacts, the pressure applied to the contact surface between the horn and the member causes the surface hardness to increase. The contact surface on the side of the smaller member is easily scratched. Therefore, the area where the second horn 141 on the side of the member with low hardness contacts the second member 72 is made larger than the area where the first horn 41 on the side of the member with high hardness contacts the first member 71 . As a result, it is possible to form a joining joint while minimizing damage to the contact surface between the horn and the member.

More preferably, the bonding apparatus 1 further has a third mode as an operation mode. The control device 100 operates the first vibrating device 30 and also the second vibrating device 130 during one bonding operation in the third mode.

FIG. 4 is a waveform diagram for explaining control by the control device 100 when vertical vibration and horizontal vibration are applied to the object to be welded during one welding operation (third mode).

As shown at times t31 to t32 in FIG. 4, the control device 100 controls the control signal V1 ( =ON) and V2 (=OFF) to the vibrators 31 and 131, respectively.

Furthermore, as shown at times t32 to t33 in FIG. 4, the control device 100 causes the control signal V1 to operate the second vibration device 130 while the first vibration device 30 is stopped in the second half of the third mode. (=OFF) and V2 (=ON) are transmitted to the vibrators 31 and 131, respectively.

By operating the bonding apparatus 1 in such a third mode, it is possible to achieve good bonding between dissimilar materials (such as metals) that are easily bonded by lateral vibration and materials (such as CFRP) that are easily bonded by vertical vibration. The possibility of being able to join to

Although the first vibrating device 30 is moved first and the second vibrating device 130 is moved later, the order of movement may be reversed. Moreover, the time for moving the first vibrating device 30 and the time for moving the second vibrating device 130 may overlap.

As described above, according to the bonding apparatus 1 of the present embodiment, it is possible to bond metals and resins together with a single apparatus. Therefore, the installation area of the equipment can be reduced in manufacturing with multiple steps. It also increases the possibility of joining dissimilar materials, such as joining metal and resin.

The embodiments disclosed this time should be considered as examples and not restrictive in all respects. The scope of the present invention is indicated by the scope of the claims rather than the description of the above-described embodiments, and is intended to include all modifications within the scope and meaning equivalent to the scope of the claims.

Reference Signs List 1 joining device 10 commercial power source 20 power source 30,130 vibrating device 31,131 vibrator 32,132 amplifier 41 first horn 50 pressure device 71 first member 72 second member 100 Controller, 141 second horn.

Claims (5)

A joining device for joining a first member and a second member,
a first horn arranged on the side of the first member;
a second horn arranged on the second member side;
a pressurizing device that applies pressure between the first horn and the second horn so as to narrow the space between the first horn and the second horn;
a first vibrating device that applies vibration to the first horn in a direction perpendicular to the pressurizing direction of the pressurizing device;
a second vibrating device that applies vibration to the second horn in a direction parallel to the pressurizing direction of the pressurizing device ;
The joining device , wherein the first member is made of metal, and the second member is made of a material containing resin . 2. The bonding apparatus according to claim 1 , wherein a contact area of said second horn to said second member is larger than a contact area of said first horn to said first member. A joining device for joining a first member and a second member,
a first horn arranged on the side of the first member;
a second horn arranged on the second member side;
a pressurizing device that applies pressure between the first horn and the second horn so as to narrow the space between the first horn and the second horn;
a first vibrating device that applies vibration to the first horn in a direction perpendicular to the pressurizing direction of the pressurizing device;
a second vibrating device that applies vibration to the second horn in a direction parallel to the pressurizing direction of the pressurizing device;
The joining device, wherein a contact area of the second horn to the second member is larger than a contact area of the first horn to the first member. further comprising a control device that controls the first vibrating device and the second vibrating device;
The bonding apparatus has a first mode and a second mode as operation modes,
The control device operates the first vibrating device with the second vibrating device stopped in the first mode, and operates the first vibrating device with the first vibrating device stopped in the second mode. The joining device according to any one of claims 1 to 3 , which operates the second vibrating device. The bonding apparatus further has a third mode as the operation mode,
5. The bonding apparatus according to claim 4 , wherein said control device actuates said first vibrating device and also actuates said second vibrating device during one bonding operation in said third mode.

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