JP7130382B2 - ARTICLE, METAL-RESIN JOINT, METHOD FOR MANUFACTURING METAL-RESIN JOINT, COLD PLATE, AND COOLING DEVICE - Google Patents

Description

The present invention relates to an article, a metal-resin bonded body, a method for manufacturing a metal-resin bonded body, a cold plate, and a cooling device.

Various cooling devices have been proposed in which a coolant is circulated inside and thermally connected to a heating element to cool the heating element.
For example, in a cooling device for an electronic device, the heat of electronic components such as a CPU is radiated by circulating a coolant through a cold plate that is thermally connected to electronic components such as a CPU on a system board. Of the cold plates, the base plate and heat radiation fins are preferably made of a metal with high thermal conductivity such as copper. However, the case parts other than the base plate and the radiating fins, and the piping connecting the adjacent cold plates are not required to have thermal conductivity as a material characteristic. Therefore, in order to reduce the weight, it is being studied to replace the material of the case and piping parts with resin.

In conventional cold plates, mechanical fastening means using screws and bolts have been used for the joints between the metal base plate and the resin case. However, such mechanical joining requires the manufacture of a large number of parts such as screws and bolts, and the number of joining steps increases, resulting in a problem of high cost.

Here, as a method for joining a resin member and a metal member, for example, Patent Document 1 (Japanese Patent Application Laid-Open No. 2010-158885), Patent Document 2 (International Publication No. 2016/076264) and Patent Document 3 (Japanese Patent Application Laid-Open No. 2017 -510477).

In Patent Document 1, after superimposing a resin member and a metal member, a rotated rotating tool is pressed from the metal member side, and the resin member is melted by frictional heat to separate the resin member and the metal member. A method for joining a resin member and a metal member is described.

Patent Document 2 discloses a bonded body of copper and resin, wherein the copper is bonded to the resin, and the base surface is a triazine thiol derivative or a triazine thiol derivative and a silane coupling agent. A silane coupling agent is bonded to each oxide film formed on a part of the bonded body, and the copper and the resin are molecularly bonded.

Patent Document 3 describes a resin-metal composite comprising a metal layer, a resin layer, and a specific adhesive layer provided between the metal layer and the resin layer.

JP 2010-158885 A WO2016/076264 JP 2017-510477 A

However, according to the studies of the present inventors, the bonded bodies of resin members and metal members (especially copper members and copper alloy members) obtained by the methods disclosed in Patent Documents 1 to 3 are It has been found that the bonding strength is insufficient, and the content (for example, coolant, etc.) may leak from the bonding portion between the resin member and the metal member.
In particular, coolant leakage in cooling devices is a serious problem, and in order to reduce the weight of cooling devices, there is a demand for a metal-resin joint that is tightly bonded to prevent coolant leakage.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a joined body of metal and resin in which the metal member and the resin member are firmly joined together and which is excellent in strength and reliability.

The inventors of the present invention have made intensive studies to provide a metal-resin bonded body having excellent bondability between a resin member and a metal member (particularly a copper member and a copper alloy member). As a result, by bonding the resin member having translucency in at least a part and the metal member through the cured body of the photocurable layer, the metal member having excellent bondability between the resin member and the metal member can be obtained. The inventors have arrived at the present invention by discovering that a resin bonded body can be obtained.

That is, according to the present invention, there are provided an article, a metal-resin bonded body, a method for manufacturing a metal-resin bonded body, a cold plate, and a cooling device, which are described below.

[1]
An article capable of forming a cold plate,
An article comprising a resin member (A) at least partially translucent, a photocurable layer (B), and a metal member (C) having a fine uneven structure on at least a portion of the surface,
At least a portion of the translucent portion of the resin member (A) and at least a portion of the fine uneven structure of the metal member (C) are in contact with each other through the photocurable layer (B). ,
An article having a hollow portion between the resin member (A) and the metal member (C) .
[2]
In the article described in [1] above,
An article in which the metal member (C) includes at least one selected from an aluminum member, an aluminum alloy member, a copper member and a copper alloy member.
[3]
In the article described in [1] or [2] above,
The article, wherein the resin member (A) having translucency at least in part thereof contains a transparent resin .
[4]
In the article according to any one of [1] to [3] above,
An article in which the resin member (A) contains a polycarbonate-based resin .
[5]
In the article according to any one of [1] to [4] above,
An article in which the photocurable layer (B) is composed of a photocurable adhesive.
[6]
A metal-resin bonded body obtained by curing the photocurable layer (B) in the article according to any one of the above [1] to [5] ,
At least a portion of the translucent portion of the resin member (A) and at least a portion of the fine uneven structure of the metal member (C) pass through the cured body of the photocurable layer (B). Bonded metal-resin joint.
[7]
A manufacturing method for manufacturing the metal-resin bonded body according to [6] above,
A step of preparing the article according to any one of [1] to [5] ;
a step of curing the photocurable layer (B) by irradiating the article with light;
A method for producing a metal-resin joined body.
[8]
A cold plate comprising the metal-resin joined body according to [6] above.
[9]
In the cold plate described in [8] above,
The cold plate includes a metal plate and a resin case provided on the metal plate,
The resin case is provided on the metal plate so as to form a space through which a coolant can flow, and at least a portion thereof is translucent,
The metal plate is the metal member (C) ,
The resin case is the resin member (A) ,
A cold plate in which the space through which the coolant can flow is the hollow portion .
[10]
In the cold plate described in [9] above,
The cold plate, wherein the metal plate includes at least one selected from an aluminum plate, an aluminum alloy plate, a copper plate and a copper alloy plate.
[11]
A cooling device comprising the cold plate according to any one of [8] to [10] above.
[12]
In the cooling device according to [11] above,
further comprising a heating element, said heating element being thermally connected to said cold plate;
A cooling device having a structure in which a coolant flows or circulates within the cold plate.

ADVANTAGE OF THE INVENTION According to this invention, a metal member and a resin member can join firmly, and it can provide the joined body of a metal and resin excellent in intensity|strength and reliability.
Furthermore, according to the present invention, it is possible to provide a metal-resin joined body, a cold plate, and a cooling device which are lightweight and capable of preventing leakage of contents.

1 is an external view schematically showing an example of the structure of an article, a metal-resin joined body, or a cold plate according to an embodiment of the present invention; FIG. BRIEF DESCRIPTION OF THE DRAWINGS It is the external view which showed typically an example of the structure of the cooling device of embodiment which concerns on this invention.

An embodiment of the present invention will be described below with reference to the drawings. In addition, in all the drawings, the same constituent elements are denoted by the same reference numerals, and the explanation thereof is omitted as appropriate. In addition, unless otherwise specified, "~" between numbers in the text represents the following from the above.

FIG. 1 is an external view schematically showing an example of the structure of an article 10, a metal-resin joined body 20, or a cold plate 30 according to an embodiment of the present invention. FIG. 2 is an external view schematically showing an example of the structure of the cooling device 100 according to the embodiment of the invention.
The article 10 according to the present embodiment includes a resin member (A) having translucency in at least a portion thereof, a photocurable layer (B), and a metal member (C) having a fine uneven structure 11 on at least a portion of its surface. , wherein at least a portion of the light-transmitting portion of the resin member (A) and at least a portion of the fine uneven structure 11 portion of the metal member (C) include the photocurable layer (B). connected through
In addition, the metal-resin bonded body 20 according to the present embodiment is obtained by curing the photocurable layer (B) in the article 10 according to the present embodiment and forming at least a portion of the light-transmitting portion of the resin member (A). , and at least a portion of the fine uneven structure 11 portion of the metal member (C), and the cured body (B′) of the photocurable layer (B).

According to the metal-resin bonded body 20 according to the present embodiment, the resin member (A) having translucency at least partially and the metal member (C) are combined into the cured body (B′) of the photocurable layer (B). ), the bondability between the resin member (A) and the metal member (C) is improved, and the strength and reliability can be improved.
Further, in the metal-resin bonded body 20 according to the present embodiment, as shown in FIG. 1, a hollow portion 13 is provided between the resin member (A) and the metal member (C), thereby facilitating visual recognition of the contents. It can also be a hollow article.
Furthermore, by using the metal-resin joined body 20 according to the present embodiment, the cold plate 30 can achieve a strong joint between the metal plate and the resin case, is lightweight, and can effectively prevent refrigerant leakage. can be obtained.
Furthermore, by using such a cold plate 30, it is possible to obtain a cooling device 100 that does not leak refrigerant over a long period of time, that is, a cooling device 100 with high reliability. Further, according to the cooling device 100 according to the present embodiment, by imparting transparency to the resin case and using a colored coolant, the cooling device can be easily detected visually in the unlikely event that the coolant leaks. can also

Hereinafter, resin members (A), photocurable layers (B) and metal members (C), metal-resin bonded bodies 20, and cold plates constituting the article 10, the metal-resin bonded body 20, and the cold plate 30 according to the present embodiment are described below. 30 and the cooling device 100 will be described in order.

1. Resin member (A)
The resin member (A) according to this embodiment will be described below.
The resin member (A) contains, for example, a translucent resin (A1). Furthermore, the resin member (A) contains other compounding agents as necessary.

(Resin (A1))
The translucent resin (A1) is not particularly limited as long as it does not interfere with the conditions for curing the photocurable adhesive, but is preferably a resin having UV transparency, more preferably only UV. It is a so-called transparent resin that transmits not only visible light but also visible light.
The light-transmitting resin (A1) is not particularly limited as long as it is a resin capable of obtaining a resin member (A) having light-transmitting properties at least partially. Examples include polyolefin resins, cyclic polyolefin resins, and polyvinyl chloride. , polyvinylidene chloride, polystyrene resins, acrylonitrile-styrene (AS) resins, acrylonitrile-butadiene-styrene (ABS) resins, polyester resins, poly(meth)acrylic resins, polyvinyl alcohol, polycarbonate resins, polyamide resins, Polyimide resin, polyether resin, polyacetal resin, fluorine resin, polysulfone resin, polyphenylene sulfide resin, polyketone resin, phenol resin, melamine resin, urea resin, polyurethane resin, epoxy resin, unsaturated polyester resin, etc. is mentioned. These resins may be used individually by 1 type, and may be used in combination of 2 or more types.

Among these, a transparent resin is preferable as the translucent resin (A1), and from the viewpoint of being able to effectively obtain a resin member (A) having an excellent balance between transparency and mechanical strength, a polycarbonate resin is used. preferable.

(Other compounding agents)
The resin member (A) may contain other compounding agents for the purpose of imparting individual functions. Such compounding agents include fillers, heat stabilizers, antioxidants, pigments, weathering agents, flame retardants, plasticizers, dispersants, lubricants, release agents, antistatic agents, and the like.

2. Photocurable layer (B)
The photocurable layer (B) according to this embodiment will be described below.
The photocurable layer (B) is composed of, for example, a photocurable adhesive.
Although the photocurable adhesive according to the present embodiment is not particularly limited, for example, an ultraviolet (UV) curable adhesive can be used. UV curable adhesives may be sensitive to visible light.

Examples of UV curable adhesives include, but are not limited to, acrylate UV curable polymers, cyanoacrylate UV curable polymers, urethane UV curable polymers, urethane (meth)acrylate UV curable polymers, and silane UV curable polymers. Known UV-curable polymers such as curable polymers, silicone-based UV-curable polymers, epoxy-based UV-curable polymers, epoxy (meth)acrylate-based UV-curable polymers, triethylene glycol diacetate, vinyl ether-based UV-curable polymers, etc. can be used.
Specific examples of these UV curable polymers include aliphatic acrylate oligomers, aromatic acrylate oligomers, acrylate epoxy monomers, acrylate epoxy oligomers, aliphatic epoxy acrylates, aliphatic urethane acrylates, aliphatic urethane methacrylates, alkyl methacrylates, amine-modified Oligoether acrylate, amine-modified polyether acrylate, aromatic acid acrylate, aromatic epoxy acrylate, aromatic urethane methacrylate, butylene glycol acrylate, stearyl acrylate, alicyclic epoxide, cyclohexyl methacrylate, ethylene glycol dimethacrylate, epoxy methacrylate, epoxy soy Acrylate, glycidyl methacrylate, hexanediol dimethacrylate, isodecyl acrylate, isooctyl acrylate, oligoether acrylate, polybutadiene diacrylate, polyester acrylate monomer, polyester acrylate oligomer, polyethylene glycol dimethacrylate, stearyl methacrylate, triethylene glycol diacetate, vinyl ether, etc. is mentioned.
Alternatively, a commercially available UV curable adhesive may be used. Commercially available UV curable adhesives include, for example, UV curable adhesives typified by Dymax.

Although the thickness of the photocurable layer (B) according to this embodiment is not particularly limited, it is, for example, 0.001 mm to 1 mm, preferably 0.01 to 0.1 mm.

3. Metal member (C)
The metal member (C) according to this embodiment will be described below.
The metal member (C) according to this embodiment has a fine uneven structure 11 on at least part of the surface.
The metal constituting the metal member (C) is not particularly limited, but for example, iron, copper, nickel, gold, silver, platinum, cobalt, zinc, lead, tin, titanium, chromium, aluminum, magnesium, manganese, or these Alloys (for example, stainless steel, brass, phosphor bronze, etc.) and the like are included. These metals may be used alone or in combination of two or more. Among these, aluminum-based metals are preferable, and aluminum alloys are more preferable, because of their light weight and high strength.
Also, the metal member (C) may be provided with plating, a vapor deposition film, a coating film, or the like.

When the metal-resin joined body 20 is used for the cold plate 30, the metal member (C) is selected from aluminum members, aluminum alloy members, copper members, and copper alloy members from the viewpoint of excellent thermal conductivity. At least one kind is preferable, and copper members and copper alloy members are particularly preferable.

Moreover, the metal member (C) according to the present embodiment may have a functional group added on the fine uneven structure 11 . Examples of such functional groups include mercapto group, thiocarbonyl group, cyano group, isocyanate group, amino group, ammonium group, pyridinium group, azinyl group, carboxyl group, benzotriazole group, triazinethiol group and the like. .
When a functional group is added to the fine concave-convex structure 11, the metal member (C) and the resin member (A) are bonded more firmly, and a metal-resin bonded body having even better strength and reliability is obtained. be able to. This makes it possible to obtain a metal-resin joined body, a cold plate, and a cooling device that can further prevent leakage of contents.

The shape of the metal member (C) is not particularly limited as long as it can be joined to the resin member (A). Moreover, the structure which consists of these combinations may be used.
Also, the shape of the surface of the joining portion to be joined to the resin member (A) is not particularly limited, but examples thereof include a flat surface and a curved surface.

The metal member (C) is processed into the above-described predetermined shape by cutting, plastic working such as pressing, punching, cutting, polishing, and thinning such as electric discharge machining. What is done is preferred. In short, it is preferable to use a material processed into a required shape by various processing methods.
Metal member (C) which has been processed into a required shape is preferably polished, chemically treated, or the like to remove the presence of rust, which is an oxide film, on the surface after being left naturally for a long period of time.

The metal member (C) according to this embodiment has a fine uneven structure 11 on at least part of the surface. The fine concavo-convex structure 11 is, for example, a roughened portion obtained by roughening the surface of the metal member (C).
Since the metal member (C) according to the present embodiment has the fine uneven structure 11, the photocurable layer (B) enters the fine uneven structure 11 on the surface of the metal member (C), so the photocurable layer (B) and the metal member (C), and as a result, the bonding strength between the resin member (A) and the metal member (C) can be further improved.

The average hole diameter of the recesses in the fine uneven structure 11 according to the present embodiment is, for example, 5 nm or more and 250 μm or less, preferably 10 nm or more and 150 μm or less, more preferably 15 nm or more and 100 μm or less.
The average pore depth of the recesses in the fine unevenness structure 11 according to the present embodiment is, for example, 5 nm or more and 250 μm or less, preferably 10 nm or more and 150 μm or less, more preferably 15 nm or more and 100 μm or less.
When the average pore diameter and/or average pore depth of the recesses in the fine uneven structure 11 is at least the above lower limit, the photocurable layer (B) can sufficiently enter the recesses of the fine uneven structure 11, and photocuring. The adhesiveness between the adhesive layer (B) and the metal member (C) is further improved, and as a result, the bonding strength between the resin member (A) and the metal member (C) can be further improved. Further, if the average pore diameter and/or average pore depth of the recesses in the fine uneven structure 11 is equal to or less than the above upper limit, the formation of gaps at the metal-resin interface of the resulting metal-resin joined body 20 can be further suppressed. As a result, leakage of the contents can be further suppressed.

Here, the hole diameter and hole depth of the recess can be obtained by using an electron microscope or a laser microscope. Specifically, the surface and cross-section of the surface of the metal member (C) are photographed. For example, 50 arbitrary recesses are selected from the obtained photograph, and the average hole diameter and average hole depth of the recesses can be calculated from the hole diameters and hole depths of the recesses.

Various known methods can be used as a method for forming the fine relief structure 11 in the metal member (C). For example, a method using laser processing as disclosed in Japanese Patent No. _4020957 ; A method of treating a metal member by an anodizing method as disclosed; an acid-based etchant as disclosed in WO 2015-8847, preferably an inorganic acid, ferric ion, cupric Substitution crystallization method of etching with ions and, if necessary, an acidic etchant aqueous solution containing manganese ions, aluminum chloride hexahydrate, sodium chloride, etc.; A method of immersing a metal member in an aqueous solution of one or more selected from hydrazine, ammonia, and a water-soluble amine compound (hereinafter sometimes referred to as the NMT method); as disclosed in JP-A-2008-162115. warm water treatment method; blasting treatment and the like. These etching methods can be arbitrarily selected according to the metal type of the metal material to be used and the hole structure of the fine concave-convex structure 11 .

A functional group may be added to the surface of the fine relief structure 11 in the metal member (C). The functional group addition treatment on the surface of the fine uneven structure 11 in the metal member (C) can be performed simultaneously with the roughening treatment or after the roughening treatment.
The method for adding a functional group to the surface of the fine uneven structure 11 in the metal member (C) may be any known method, and is not particularly limited. A method of immersing a metal member in a solution using an organic solvent such as alcohol, isopropyl alcohol, ethyl alcohol, acetone, toluene, ethyl cellosolve, dimethylformaldehyde, tetrahydrofuran, methyl ethyl ketone, benzene, ethyl acetate ether, etc.: Having a functional group A method of coating or spraying a chemical substance on the surface of a metal member; a method of laminating a film made of a chemical substance having a functional group on the surface of the metal member;
For example, surface roughening and functional group addition can be performed simultaneously by performing wet etching treatment, chemical conversion treatment, anodizing treatment, or the like using a liquid containing a chemical substance having a functional group.
In addition, when a functional group is further added to the surface of the fine uneven structure 11 in the metal member (C), the functional group increases the chemical bond with the photocurable layer (B) at the bonding surface, and the photocurable It is considered that the adhesion with the layer (B) and the bonding strength with the resin member (A) are further improved.

4. Metal-Resin Bonded Body A metal-resin bonded body 20 according to the present embodiment is obtained by curing the photocurable layer (B) in the article 10 according to the present embodiment, and is the translucent portion of the resin member (A). At least a portion and at least a portion of the fine relief structure 11 portion of the metal member (C) are bonded via the cured body (B') of the photocurable layer (B).

The method for manufacturing the metal-resin joined body 20 according to the present embodiment preferably includes the following steps (i) and (ii).
(i) Step of preparing the article 10 according to the present embodiment (ii) Step of curing the photocurable layer (B) by irradiating the article 10 according to the present embodiment with light Hereinafter, a specific description will be given.

First, the article 10 according to the present embodiment is obtained by, for example, applying a photocurable layer (B) on a metal member (C) having a fine uneven structure 11 on at least a part of the surface, and then applying the photocurable layer (B ) can be obtained by arranging the resin member (A) on.

Here, as a method of providing the photocurable layer (B) on the metal member (C) having the fine uneven structure 11 on at least a part of the surface, for example, a photocurable adhesive is applied on the metal member (C). Examples thereof include a method of coating or spraying, and a method of attaching a film-like photocurable adhesive onto the metal member (C).

Further, as a method of disposing the resin member (A) on the photocurable layer (B), for example, a method of disposing a pre-molded resin member (A) on the photocurable layer (B), , a resin composition in a molten or solution state for forming the resin member (A) is applied onto the photocurable layer (B), and then the resin member (A) is formed by solidifying the resin composition. The method of forming on a photocurable layer (B), etc. are mentioned. When only a specific part of the resin member (A) is to be joined to the metal member (C), a method of disposing the preformed resin member (A) on the photocurable layer (B) is desirable.

The photocurable layer is then cured by irradiating the prepared article 10 with light. As a result, at least a portion of the translucent portion of the resin member (A) and at least a portion of the fine uneven structure 11 portion of the metal member (C) are combined into a cured product (B') of the photocurable layer (B). ) to obtain the metal-resin bonded body 20 according to the present embodiment.

Any known method may be used for curing the photocurable layer (B) by light irradiation.
When a UV curable adhesive is used as the photocurable adhesive, the light may be, for example, UV light with a wavelength of 10 to 400 nm, preferably UV light with a wavelength of 100 to 400 nm, more preferably 315 to 400 nm. UVA light of 400 nm wavelength can be used.
UV light can be provided by any known lamp having suitable voltage, suitable intensity and suitable wavelength, curing with UV light can be for any suitable time, UV lamp and photocurable layer (B) may be any suitable distance. Those skilled in the art can appropriately determine these curing conditions.

5. Applications of Metal-Resin Bonded Body and Cold Plate The metal-resin bonded body 20 according to the present embodiment has high productivity and a high degree of freedom in shape control, and thus can be used in various applications.
Furthermore, since the metal-resin joined body 20 according to the present embodiment exhibits high heat resistance, mechanical properties, friction resistance, slidability, airtightness, and watertightness, it can be suitably used for applications according to these properties. be done.

For example, structural parts for vehicles, vehicle-mounted goods, housings for electronic devices, housings for home appliances, structural parts, machine parts, various automobile parts, electronic device parts, furniture, household goods such as kitchen utensils , medical equipment, building material parts, other structural parts and exterior parts.

More specifically, the following parts are designed so that metal supports parts where resin alone is not strong enough. For vehicles, instrument panels, console boxes, door knobs, door trims, shift levers, pedals, glove boxes, bumpers, bonnets, fenders, trunks, doors, roofs, pillars, seats, steering wheels, ECU boxes, electrical parts , engine peripheral parts, drive system/gear peripheral parts, intake/exhaust system parts, cooling system parts, etc. Examples of building materials and furniture include glass window frames, handrails, curtain rails, chests of drawers, drawers, closets, bookshelves, desks, and chairs. Further, precision electronic parts include connectors, relays, gears, and the like. In addition, transport containers include transport containers, suitcases, trunks, and the like.

In addition, by combining the high thermal conductivity of the metal member (C) and the adiabatic property of the resin member (A), it can be used for parts used in equipment designed for optimal heat management, such as various home appliances. can be done. Specifically, household appliances such as refrigerators, washing machines, vacuum cleaners, microwave ovens, air conditioners, lighting equipment, electric water heaters, televisions, clocks, ventilation fans, projectors, speakers, etc., personal computers, mobile phones, smartphones, digital cameras, tablets type PCs, portable music players, portable game machines, battery chargers, electronic information devices such as batteries, and the like.

Other uses include toys, sports equipment, shoes, sandals, bags, tableware such as forks, knives, spoons, and plates, stationery such as ballpoint pens, mechanical pencils, files, and binders, frying pans, pots, kettles, spatula, Ladles, ladle, whisk, cooking utensils such as tongs, parts for lithium ion secondary batteries, robots and the like.

The use of the metal-resin joined body 20 according to this embodiment is not particularly limited, but due to its strong adhesion performance, it can be preferably used as a hollow article for the purpose of preventing leakage of contents. Examples of such hollow articles include heat exchangers, and more specifically, cold plates having coolant flow paths therein.
In addition, the metal-resin bonded body 20 according to the present embodiment can be suitably used as a container or an electronic device housing in which a part of the metal portion is replaced with resin for the purpose of weight reduction. When a resin is used, it is possible to obtain a container or an electronic device housing with excellent visibility and appearance.

The cold plate 30 according to this embodiment will be described below.
An example of the structure of the cold plate 30 according to this embodiment is schematically shown in FIG. 1, but the cold plate 30 according to this embodiment is not limited to this shape.
The cold plate 30 according to this embodiment includes, for example, a metal plate and a resin case provided on the metal plate. The resin case is provided on the metal plate so as to form a space (hollow portion 13) through which a coolant can flow, and at least a portion of the resin case is translucent. In the case of the cold plate 30 using the metal-resin bonded body 20 according to the present embodiment, as shown in FIG. 1, the metal plate corresponds to the metal member (C), and the resin case corresponds to the resin member (A). corresponds to Further, in FIG. 1, the hollow portion 13 corresponds to a space through which the refrigerant can flow.

As the metal plate, at least one selected from an aluminum plate, an aluminum alloy plate, a copper plate and a copper alloy plate is preferable from the viewpoint of excellent thermal conductivity, and a copper plate and a copper alloy plate are particularly preferable.

The applications of the metal-resin joined body 20 according to the present embodiment have been described above, but these are only examples of applications, and the metal-resin joined body 20 can be used for various applications other than those described above.

6. Cooling Device FIG. 2 is an external view schematically showing an example of the structure of a cooling device 100 according to an embodiment of the present invention.
A cooling device 100 according to this embodiment includes a cold plate 30 according to this embodiment. Therefore, the refrigerant does not leak over a long period of time and is highly reliable.

The cooling device 100 according to the present embodiment further includes a heating element, the heating element is thermally connected to the cold plate 30, and the cooling medium Re flows inside the cold plate 30 (for example, the hollow portion 13 in FIG. 1). Alternatively, it preferably has a cyclic structure. In addition, it is preferable to have a structure in which the cooling medium Re circulates in the line 103 by the driving force of the pump and the heat generator is cooled by the cold plate 30 . By doing so, the heating element can be effectively cooled.
Although one cold plate 30 may be provided in the cooling device 100, it is preferable to connect a plurality of cold plates. Also, as shown in FIG. 2, the cooling unit 101 can be formed by connecting a plurality of cold plates 30 with manifolds 105 and tubes 107 . This makes it possible to cool the heating element more effectively.
The manifold 105 is a member for dividing the refrigerant. Although the manifold 105 is not particularly limited, for example, a copper manifold can be used.
The tube 107 is a tube through which the coolant Re from the manifold 105 passes. Although the tube 107 is not particularly limited, for example, a resin tube can be used.

The cold plate 30 is provided with an inflow port and an outflow port for the coolant. 30 are connected by pipe parts or the like.
A known liquid refrigerant can be used as the refrigerant. For example, water or commercially available refrigerants such as Novec ^™ from 3M can be used.
When a transparent resin member is used as the resin member (A) constituting the cold plate 30 according to the present embodiment, it is preferable to use a colored liquid refrigerant.

The cooling device 100 according to the present embodiment may be used as a cooling device for any heat-generating body, but can be suitably used as a cooling device for electronic devices such as electronic components such as a CPU on a system board, for example.
Examples of reference forms are added below.
[1]
An article comprising a resin member (A) at least partially translucent, a photocurable layer (B), and a metal member (C) having a fine uneven structure on at least a portion of the surface,
At least a portion of the translucent portion of the resin member (A) and at least a portion of the fine uneven structure portion of the metal member (C) are in contact with each other through the photocurable layer (B). Goods.
[2]
In the article described in [1] above,
An article in which the metal member (C) includes at least one member selected from an aluminum member, an aluminum alloy member, a copper member and a copper alloy member.
[3]
In the article described in [1] or [2] above,
The resin member (A) is polyolefin resin, cyclic polyolefin resin, polyvinyl chloride, polyvinylidene chloride, polystyrene resin, AS resin, ABS resin, polyester resin, poly(meth)acrylic resin, polyvinyl alcohol, Polycarbonate resin, polyamide resin, polyimide resin, polyether resin, polyacetal resin, fluorine resin, polysulfone resin, polyphenylene sulfide resin, polyketone resin, phenol resin, melamine resin, urea resin, polyurethane resin, An article containing at least one selected from epoxy resins and unsaturated polyester resins.
[4]
In the article according to any one of [1] to [3] above,
An article in which the resin member (A) contains a transparent resin.
[5]
In the article according to any one of [1] to [4] above,
An article in which the photocurable layer (B) is composed of a photocurable adhesive.
[6]
In the article according to any one of [1] to [5] above,
An article in which the average pore diameter of the recesses in the fine uneven structure of the metal member (C) is 5 nm or more and 250 μm or less, and the average pore depth of the recesses is 5 nm or more and 250 μm or less.
[7]
A metal-resin bonded body obtained by curing the photocurable layer in the article according to any one of the above [1] to [6],
At least part of the translucent portion of the resin member (A), and the metal member
A metal-resin joined body in which at least part of the fine uneven structure portion of (C) is joined via the cured body of the photocurable layer (B).
[8]
In the metal-resin joined body according to [7] above,
A metal-resin bonded body having a hollow portion between the resin member (A) and the metal member (C).
[9]
A manufacturing method for manufacturing the metal-resin joined body according to the above [7] or [8],
A step of preparing the article according to any one of [1] to [6] above;
curing the photocurable layer by irradiating the article with light;
A method for producing a metal-resin joined body.
[10]
A cold plate comprising the metal-resin joined body according to [7] or [8] above.
[11]
In the cold plate described in [10] above,
The cold plate includes a metal plate and a resin case provided on the metal plate,
The resin case is provided on the metal plate so as to form a space through which a coolant can flow, and at least a portion thereof is translucent,
The metal plate is the metal member,
The cold plate, wherein the resin case is the resin member.
[12]
A cold plate comprising a metal plate and a resin case provided on the metal plate,
The resin case is provided on the metal plate so as to form a space through which a coolant can flow, and at least a portion of the cold plate is translucent.
[13]
In the cold plate described in [12] above,
A cold plate, wherein the metal plate includes at least one selected from an aluminum plate, an aluminum alloy plate, a copper plate and a copper alloy plate.
[14]
A cooling device comprising the cold plate according to any one of [10] to [13] above.
[15]
In the cooling device according to [14] above,
further comprising a heating element, said heating element being thermally connected to said cold plate;
A cooling device having a structure in which a coolant flows or circulates within the cold plate.

Hereinafter, the present embodiment will be described in detail with reference to examples and comparative examples. It should be noted that the present embodiment is not limited to the description of these examples.

(Analysis of fine uneven structure of metal member (C))
The average pore size and average pore depth of the fine relief structure of the metal member (C) were measured using a laser microscope (VK-X100 manufactured by KEYENCE). Specifically, the surface and the cross section of the surface of the metal member (C) are photographed, 50 arbitrary recesses are selected from the obtained photographs, and the average pore diameter of the recesses is calculated from the hole diameter and hole depth of the recesses. and average pore depth were calculated respectively.

(Measurement of bonding strength of metal-resin bonded body)
A tensile tester "Model 1323 (manufactured by Aikoh Engineering Co., Ltd.)" was used, and a special jig was attached to the tensile tester. was measured. The bonding strength (tensile shear strength) (MPa) was obtained by dividing the breaking load (N) by the area of the metal/resin bonded portion.

(Reliability test)
An air pressure of 1 MPa was continuously applied to the hollow portion of the cold plate obtained in Examples and Comparative Examples, and the state of the metal/resin joint was observed 30 minutes after the application of air pressure. The reliability of the conjugate (cold plate) was evaluated.
○: No change in the joint ×: Air leakage from the joint

[Preparation Example 1 of surface-treated metal member]
The surface of the copper plate was etched by immersing the copper plate in a chemical solution (manufactured by MEC Co., Ltd., product name: Amalfa A-10201) for 5 minutes. Next, the surface-etched copper plate was washed with water, alkali washed (immersed in a 5% NaOH aqueous solution for 20 seconds), washed with water, and neutralized (immersed in a 5% H ₂ SO ₄ aqueous solution for 20 seconds). , and washed with water continuously to obtain a surface-treated metal member 1 .
The average pore size and the average pore depth of the fine relief structure of the obtained surface-treated metal member 1 were within the range of 5 nm or more and 250 μm or less, respectively.

[Preparation Example 2 of surface-treated metal member]
A surface-treated metal member 2 was obtained in the same manner as in Preparation Example 1 of the surface-treated metal member, except that an aluminum plate was used instead of the copper plate.
The average pore diameter and the average pore depth of the fine relief structure of the obtained surface-treated metal member 2 were within the range of 5 nm or more and 250 μm or less, respectively.

[Preparation Example 3 of surface-treated metal member]
The surface-treated metal member 1 was coated with a 0.1 mol/L aqueous solution of 2,4,6-trimercapto-1,3,5-triazine monosodium salt (manufactured by Sankyo Kasei Co., Ltd., product name: Santhiol N-1). for 5 minutes. Next, the obtained copper plate was immersed in a 0.05 mol/L aqueous solution of 3-aminopropyltriethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name: KBE903), which is a silane coupling agent. After that, the copper plate was dried at 100° C. for 30 minutes. Thus, a surface-treated metal member 3 was obtained.

[Preparation Example 4 of surface-treated metal member]
A surface-treated metal member 4 was obtained in the same manner as in Preparation Example 3 of the surface-treated metal member, except that the surface-treated metal member 2 was used instead of the surface-treated metal member 1 .

[Example 1]
A UV curable adhesive (manufactured by DYMAX, product name: 1405M-T-UR-SC) was applied onto the surface-treated metal member 1 to form a photocurable layer 1 having a thickness of 0.03 mm. Next, a resin member 1 made of a polycarbonate resin (manufactured by LOTTE Advanced Materials, product name: SC1100R) that had been molded in advance into a plate shape was placed on the photocurable layer 1 .
Then, using a UV irradiation device (Conveyor type, manufactured by Han KOOK Ultra VIOLET) and a UV lamp (mercury lamp, SAMIL UV HG-3000), wavelength: UV-A, ultraviolet intensity: 3600 mJ/cm ² (170 mW/cm ² ), the photocurable layer 1 is cured by irradiating the photocurable layer 1 with ultraviolet rays under the conditions of a conveyor speed of 11 mm/sec and a UV irradiation time of 90 seconds. The resin member 1 was joined to obtain a metal-resin joined body 1 . The joint strength of the obtained metal-resin joined body 1 was evaluated. Table 1 shows the results obtained.

Also, a UV-curable adhesive (manufactured by DYMAX, product name: 1405M-T-UR-SC) was applied onto the surface-treated metal member 1 to form a photocurable layer 1 having a thickness of 0.03 mm. Next, a resin case 1 made of a polycarbonate resin (manufactured by LOTTE Advanced Materials, product name: SC1100R) that had been molded into a case shape in advance was placed on the photocurable layer 1 .
Then, using a UV irradiation device (Conveyor type, manufactured by Han KOOK Ultra VIOLET) and a UV lamp (mercury lamp, SAMIL UV HG-3000), wavelength: UV-A, ultraviolet intensity: 3600 mJ/cm ² (170 mW/cm ² ), the photocurable layer 1 is cured by irradiating the photocurable layer 1 with ultraviolet rays under the conditions of a conveyor speed of 11 mm/sec and a UV irradiation time of 90 seconds. The resin case 1 was joined to obtain a cold plate 1 like the cold plate 200 shown in FIG. The reliability of the obtained cold plate 1 was evaluated. Table 1 shows the results obtained.

[Example 2]
A metal-resin bonded body 2 and a cold plate 2 were obtained in the same manner as in Example 1, except that the surface-treated metal member 2 was used instead of the surface-treated metal member 1 . Each evaluation was performed on the obtained metal-resin joined body 2 and cold plate 2 . Table 1 shows the results obtained.

[Example 3]
A metal-resin bonded body 3 and a cold plate 3 were obtained in the same manner as in Example 1, except that the surface-treated metal member 3 was used instead of the surface-treated metal member 1 . Each evaluation was performed on the obtained metal-resin joined body 3 and cold plate 3 . Table 1 shows the results obtained.

[Example 4]
A metal-resin bonded body 4 and a cold plate 4 were obtained in the same manner as in Example 1, except that the surface-treated metal member 4 was used instead of the surface-treated metal member 1 . Each evaluation was performed on the obtained metal-resin joined body 4 and cold plate 4 . Table 1 shows the results obtained.

[Comparative Example 1]
A metal-resin bonded body 5 and a cold plate 5 were obtained in the same manner as in Example 1, except that a copper plate that had not been etched was used instead of the surface-treated metal member 1 . Each evaluation was performed on the obtained metal-resin joined body 5 and cold plate 5 . Table 1 shows the results obtained.

[Comparative Example 2]
A metal-resin bonded body 6 and a cold plate 6 were obtained in the same manner as in Example 1, except that no photocurable layer was formed. Each evaluation was performed on the obtained metal-resin joined body 6 and cold plate 6 . Table 1 shows the results obtained.

A Resin member B Photocurable layer B′ Cured body of photocurable layer C Metal member Re Coolant 10 Article 11 Fine concave-convex structure 13 Hollow portion 20 Metal-resin joined body 30 Cold plate 100 Cooling device 101 Cooling part 103 Line 105 Manifold 107 tube

Claims (12)

An article capable of forming a cold plate,
An article comprising a resin member (A) at least partially translucent, a photocurable layer (B), and a metal member (C) having a fine uneven structure on at least a portion of the surface,
At least a portion of the translucent portion of the resin member (A) and at least a portion of the fine uneven structure of the metal member (C) are in contact with each other through the photocurable layer (B). the law of nature,
An article having a hollow portion between the resin member (A) and the metal member (C) . The article of claim 1,
An article in which the metal member (C) includes at least one selected from an aluminum member, an aluminum alloy member, a copper member and a copper alloy member. The article according to claim 1 or 2,
The article, wherein the resin member (A) having translucency at least in part thereof contains a transparent resin . In the article according to any one of claims 1 to 3,
An article in which the resin member (A) contains a polycarbonate-based resin . In the article according to any one of claims 1 to 4,
An article in which the photocurable layer (B) is composed of a photocurable adhesive. A metal-resin bonded body obtained by curing the photocurable layer (B) in the article according to any one of claims 1 to 5 ,
At least a portion of the translucent portion of the resin member (A) and at least a portion of the fine uneven structure of the metal member (C) pass through the cured body of the photocurable layer (B). Bonded metal-resin joint. A manufacturing method for manufacturing the metal-resin joined body according to claim 6 ,
providing an article according to any one of claims 1 to 5 ;
a step of curing the photocurable layer (B) by irradiating the article with light;
A method for producing a metal-resin joined body. A cold plate comprising the metal-resin joined body according to claim 6 . The cold plate of claim 8 ,
The cold plate includes a metal plate and a resin case provided on the metal plate,
The resin case is provided on the metal plate so as to form a space through which a coolant can flow, and at least a portion thereof is translucent,
The metal plate is the metal member (C) ,
The resin case is the resin member (A) ,
A cold plate in which the space through which the coolant can flow is the hollow portion . In the cold plate of claim 9 ,
The cold plate, wherein the metal plate includes at least one selected from an aluminum plate, an aluminum alloy plate, a copper plate and a copper alloy plate. A cooling device comprising a cold plate according to any one of claims 8-10 . 12. The cooling device of claim 11 , wherein
further comprising a heating element, said heating element being thermally connected to said cold plate;
A cooling device having a structure in which a coolant flows or circulates within the cold plate.

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