JP7128646B2 - Shape measuring device - Google Patents

Description

The present invention relates to a shape measuring device.

A shape measuring apparatus capable of changing and expanding the depth measurement range in the height direction by moving the stage on which the object to be measured is placed in the height direction (Z direction) and measuring the surface shape of the object to be measured. known (for example, Patent Document 1).

In order to secure a sufficient depth measurement range in the Z direction, it is necessary to make the stage movement stroke in the Z direction sufficiently long. A stage linear motion drive mechanism for realizing a sufficiently long movement stroke requires a structure that is long in the linear motion direction corresponding to the movement stroke. There are problems such as a decrease in the user's convenience due to the high position of , and an increase in the influence of vibrations from the floor surface.

Therefore, a configuration is conceivable in which this drive mechanism is housed in the base housing that supports the stage. However, in this case, since the base housing has a structure that supports the stage in a cantilever manner, measurement errors occur due to pitching and yawing of the stage, which has the problem of affecting measurement accuracy.

JP 2014-092490 A

The present invention has been made in view of such conventional problems. One object of the present invention is to provide a shape measuring apparatus with improved measurement accuracy.

Means for solving the problem and effects of the invention

In order to achieve the above objects, according to a shape measuring apparatus according to a first aspect of the present invention, there is provided a stage on which an object to be measured is placed, and light is irradiated to the object to be measured placed on the stage. a light-projecting part, a light-receiving part having a predetermined imaging field of view, receiving the light emitted from the light-projecting part and reflected from the object to be measured, and outputting light-receiving data; and light-receiving data received by the light-receiving part. a shape measurement processing unit that measures the surface shape of the object to be measured, a base housing that is connected to the stage, and a stage support that extends forward from the base housing and supports the stage. an optical axis direction driving unit that is housed in the base housing and moves the stage support unit together with the stage along the optical axis direction of the light receiving unit; and light that extends the optical axis below the stage. A sensor moving part that moves together with the stage support part on an axis extension line or on a straight line that is within an imaging field of the light receiving part and parallel to the extension line; and a position of the sensor moving part supported by the base housing. and a scale portion for detecting a relative position between the stage and the light receiving portion in the optical axis direction of the light receiving portion by moving the sensor moving portion along the scale portion. can be configured to detect any distance. With the above configuration, the relative position of the stage is measured by moving the sensor moving section along the optical axis, so that highly accurate position measurement with little error is possible.

Further , according to the shape measuring apparatus according to the second aspect of the present invention, in addition to the above configuration , an upper head that accommodates the light projecting section and the light receiving section, and a base section that is installed on the floor and wherein the base housing connects the base portion and the upper head.

Further , according to the shape measuring apparatus according to the third aspect of the present invention, in addition to any one of the configurations described above, the stage supporting portion has a stage side hole formed in the bottom surface thereof into which the scale portion can enter. be able to.

Furthermore, according to the shape measuring apparatus according to the fourth aspect of the present invention, in addition to any one of the above configurations, the sensor moving section and the scale section can constitute a unit-like scale unit. .

Furthermore, according to the shape measuring apparatus according to the fifth aspect of the present invention, in addition to any one of the configurations described above, the sensor moving section connects the connecting section connected to the stage support by magnetic force. be able to.

Furthermore, according to the shape measuring apparatus according to the sixth aspect of the present invention, in addition to any one of the above configurations, one of the connecting portions between the sensor moving portion and the stage support is a spherical body, The other can be configured as a flat plate material.

Furthermore, according to the shape measuring apparatus according to the seventh aspect of the present invention, in addition to any one of the above configurations, the stage supporter side includes the spherical body as a magnetic material, and the sensor moving section includes the The plate material can be made of a permanent magnet.

Furthermore, according to the shape measuring apparatus according to the eighth aspect of the present invention, in addition to any one of the configurations described above, at the connecting portion between the sensor moving portion and the stage support, the upper surface of the plate member is resistant to A corrosive plate member is arranged, and the spherical body can be magnetically connected to the upper surface of the plate member.

Furthermore, according to the shape measuring apparatus according to the ninth aspect of the present invention, in addition to any one of the above configurations, the sensor moving section is connected to the stage side, and the scale section is fixed to the base housing side. can do.

Furthermore, according to the shape measuring apparatus according to the tenth aspect of the present invention, there is provided a stage on which an object to be measured is placed; and a light receiving unit that receives the light emitted from the light projecting unit and reflected from the object to be measured and outputs received light data, and based on the received light data received by the light receiving unit, a shape measurement processing unit for measuring the surface shape of an object; a base housing connected to the stage; a stage support unit extending forward from the base housing for supporting the stage; an optical axis direction driving unit that is accommodated in a body and moves the stage supporting unit together with the stage along the optical axis direction of the light receiving unit; a scale portion that moves together with the stage support portion within the imaging field of the light receiving portion and on a straight line parallel to the extension line; and a sensor that is supported by the base housing and moves for detecting the position of the sensor moving portion. , wherein the sensor moving unit is moved along the scale unit to detect the relative distance between the stage and the light receiving unit in the optical axis direction of the light receiving unit. can be configured as

Furthermore, according to the shape measuring apparatus according to the eleventh aspect of the present invention, in addition to any one of the configurations described above, when the sensor moving section is moved along the scale section, the sensor moving section moves along the scale section. By counting the number of times the marks indicating positions provided at intervals are read, the encoder can detect the moving distance.

Furthermore, according to the shape measuring apparatus according to the twelfth aspect of the present invention, in addition to any one of the configurations described above, the shape measurement processing unit may measure the distance between the stage detected by the sensor moving unit and the light receiving unit. It can be configured to measure the height of the measurement object based on the relative distance. With the above configuration, when measuring the height of the object to be measured, the height of the stage is also measured, so there is no need to consider the error in the amount of movement of the stage, and high-precision height measurement is realized. .

1 is a block diagram showing a measuring microscope apparatus according to Embodiment 1 of the present invention; FIG. FIG. 5 is a block diagram showing a measuring microscope apparatus according to Embodiment 2 of the present invention; FIG. 10 is a block diagram showing a measuring microscope apparatus according to Embodiment 3 of the present invention; FIG. 2 is a block diagram showing the configuration of imaging means in FIG. 1; FIG. 5 is an image diagram showing an example of a GUI of a measuring microscope apparatus operation program; It is a schematic diagram which shows the optical system of telecentric double-sided projection. It is a schematic diagram which shows the relationship between right-and-left projection and a measurement range. FIG. 5 is a side view showing a state in which the upper head and the lower head are connected; 4 is a schematic diagram showing the internal configuration of the lower head; FIG. FIG. 10A is a schematic diagram showing a configuration in which the Z stage is arranged below the stage and the scale part is spaced apart, and FIG. 10B shows a configuration in which the scale unit is arranged below the stage and the Z stage is arranged on the back side. It is a schematic diagram. It is a perspective view of a scale unit. FIG. 12 is a rear perspective view of the scale unit of FIG. 11; FIG. 13A is a schematic cross-sectional view showing the occurrence of deviation due to rolling in the case of surface bonding, and FIG. 13B is a schematic cross-sectional view showing the occurrence of deviation due to rolling in the case of point bonding. FIG. 14A is a schematic cross-sectional view showing the occurrence of errors due to yawing and pitching in the case of surface bonding, and FIG. 14B is a schematic cross-sectional view showing the occurrence of errors due to yawing and pitching in the case of point bonding. FIG. 15A is a schematic cross-sectional view showing running due to rust, FIG. 15B showing ups and downs due to non-uniform plating, and FIG. 15C showing sandwiching of a plate member. 16A is a schematic cross-sectional view showing a state in which the stage of the shape measuring apparatus according to the embodiment is in a raised position, and FIG. 16B is a schematic cross-sectional view showing a state in which it is in a lowered position. FIG. 17A is a schematic cross-sectional view showing a state in which the stage of the shape measuring apparatus according to the conventional example is in an elevated position, and FIG. 17B is a schematic sectional view showing a state in which it is in a lowered position. 4 is a schematic cross-sectional view showing a connecting portion of the scale unit; FIG. 19A is a cross-sectional view of the cross roller guide taken along line A-A' of FIG. 19B, and FIGS. 19B to 19D are schematic diagrams showing how the cross roller guide is inserted into the scale unit. 20A is a cross-sectional view of the scale unit of FIG. 20B taken along line A-A', and FIGS. 20B to 20D are schematic diagrams showing how the encoder section slides on the scale section. 4 is a flow chart showing a procedure for shape measurement; 4 is a flow chart showing a procedure for acquiring a texture image; 4 is a flow chart showing a procedure for setting measurement. 24A is a schematic diagram showing the measurement range at height A, FIG. 24B at height B, and FIG. 24C at height C. FIG. Figures 24A-24C are optical images obtained at each height in Figures 24A, 24B and 24C, and Figures 24D-24F are fringes obtained at each height in Figures 24A, 24B and 24C. 3A and 3B are image diagrams respectively showing images; FIG. 26A shows the measurement results obtained at height A in FIG. 24A, FIG. 26B at height B in FIG. 24B, and FIG. 26C at height C in FIG. 24C, and FIG. 26D is a schematic diagram showing how these are connected. be. FIG. 27A is an image diagram of a synthesized image in which the data within the depth search range is hidden, and FIG. 27B is an image diagram of the synthesized image in which the data within the depth search range is displayed. FIG. 28A is an image diagram of a composite image in which data within the depth search range of another measurement object is hidden, and FIG. 28B is an image diagram of a composite image in which data within the depth search range is displayed. FIG. 10 is an image diagram showing a state in which a fringe image can be confirmed at a height position of the measurement object outside the measurable height range and within the depth search range. FIG. 11 is an image diagram showing a state in which a fringe image can be confirmed at a height position outside the measurable height range and within the depth search range for another measurement object. 7 is a graph showing the relationship between image roughness and pitch at the time of connection. FIG. 10 is a schematic diagram illustrating a depth search range for automatically determining a connected measurement range; FIG. 4 is a schematic diagram showing how acquired pixels are accumulated; FIG. 4 is a schematic diagram showing transition of accumulated images; 4 is a flow chart showing a procedure for automatic depth expansion; FIG. 11 is a schematic diagram illustrating automatic depth extension according to the second embodiment; FIG. 10 is an image diagram showing a user interface screen in full-auto mode of the shape measurement program; FIG. 10 is an image diagram showing an example of selecting a measurement mode; FIG. 10 is an image diagram showing an example of performing depth extension mode selection; FIG. 10 is an image diagram showing an example of selecting a measurement direction; FIG. 10 is an image diagram showing an example of setting measurement brightness; 4 is a flow chart showing a procedure for manual depth extension; 43A is an optical image A displaying the measurement target, FIG. 43B is an optical image B at a higher focus position than FIG. 43A, FIG. 43C is an optical image C at a higher focus position than FIG. 43B, and FIG. Height image D, FIG. 43E is the height image E of FIG. 43B, FIG. 43F is the height image F of FIG. 43C, and FIG. , respectively. FIG. 10 is an image diagram showing a setting example of a partial area; FIG. 45 is an image diagram showing an optical image of the object to be measured in FIG. 44; 46A is an image diagram of a height image generated from the measurement object of FIG. 45 in the normal measurement mode, and FIG. 46B is an image diagram of a height image generated in the reflection/betrayal light elimination mode. 47A is an image diagram of a striped image of a certain object to be measured, FIG. 47B is the luminance profile of the metal portion of the object to be measured in FIG. 47A, FIG. 47C is the luminance profile of the hole portion, and FIG. 47D is the luminance profile of the white resin portion. be. 4 is a flow chart showing a procedure of automatic image XY connection processing; 49A to 49C are image diagrams showing how map images are created in a spiral shape. 50A to 50C are image diagrams showing a method of manually designating connected regions. FIG. 10 is an image diagram showing a method of automatically setting a connected area; FIG. 10 is a flow chart showing a procedure for starting measurement after connecting regions are determined in a map image; FIG. 4 is a flow chart showing a procedure for setting a connecting region while analyzing three-dimensional shape data during measurement; 10 is a flow chart showing a procedure for automatically adjusting partial area measurement settings to generate synthetic 3D shape data; FIG. 4 is a side view showing a state in which a plurality of partial areas are set on the measurement object; FIG. 56 is a table showing partial area measurement settings for each divided measurement area in FIG. 55;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the embodiment shown below is an example of a shape measuring device for embodying the technical idea of the present invention, and the present invention does not specify the shape measuring device as follows. In addition, this specification does not specify the members shown in the claims as the members of the embodiment. Unless otherwise specified, the dimensions, materials, shapes, relative arrangements, etc. of components described in the embodiments are not intended to limit the scope of the present invention, but are merely explanations. Just an example. Note that the sizes and positional relationships of members shown in each drawing may be exaggerated for clarity of explanation. Furthermore, in the following description, the same names and symbols indicate the same or homogeneous members, and detailed description thereof will be omitted as appropriate. Furthermore, each of the elements constituting the present invention may be configured with the same member so that a single member may serve as a plurality of elements, or conversely, the function of one member may be performed by a plurality of members. It can also be realized by sharing.

In this specification, a "texture image" is an observed image having texture information, typically an optical image. On the other hand, the "height image" is also called a distance image or the like, and is used to mean an image containing height information. For example, an image in which height information is converted into luminance, chromaticity, or the like and displayed as a two-dimensional image, or an image in which height information is used as Z-coordinate information and displayed in a three-dimensional shape can be used. The height image also includes a three-dimensional composite image in which a texture image is pasted as texture information to such a height image. Further, in this specification, the display form of the height image is not limited to two-dimensional display, and includes three-dimensional display. For example, it includes a two-dimensional image obtained by converting the height information of the height image into brightness or the like and a three-dimensional display of the height information as Z-coordinate information.

Furthermore, in this specification, the "attitude" of placing the measurement object on the stage means the rotation angle of the measurement object. Note that if the object to be measured has a point-symmetrical shape in plan view, such as a cone, the same result can be obtained regardless of the rotation angle, so there is no need to specify the orientation.
[Embodiment 1]

FIG. 1 shows a block diagram showing the configuration of a shape measuring apparatus according to Embodiment 1 of the present invention. The shape measuring apparatus 500 includes an imaging means 100, a control means 200, a light source section 300, a display section 400 and an operation device 450, as shown in FIG. This configuration is an example, and each member and the functional blocks included in each member can be appropriately integrated or divided. For example, the control means may include the light source section. Also, the control means may be divided into a controller and a general-purpose computer.
(Imaging means 100)

The imaging means 100 includes a light projecting section 110 , a light receiving section 120 , a measurement control section 150 , a stage 140 , an optical axis direction driving section 146 and a stage plane direction driving section 148 . The light projecting unit 110 is a member for irradiating the measurement object WK placed on the stage 140 with pattern light. The light receiving unit 120 receives the pattern light emitted from the light projecting unit 110 and reflected by the measurement object WK, and outputs received light data. The measurement control unit 150 is a member for driving the light projection by the light projection unit 110 and the light reception by the light reception unit 120 and for outputting light reception data of the light reception unit 120 . This imaging means measures the shape of the measurement object WK based on the pattern projection method.
[Embodiment 2]

In the example of FIG. 1, a pattern projection system for projecting measurement light for obtaining a height image and an illumination projection system for projecting illumination light for capturing a texture image are provided separately. explained. However, the present invention is not limited to the configuration in which the light projection systems are provided individually, and the light projection systems may be shared. Such an example is shown in the block diagram of FIG. 2 as a second embodiment. In the shape measuring apparatus 500B shown in this figure, the same members as in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted.

A shape measuring apparatus 500B according to the second embodiment does not include an illumination light output section and an observation illumination light source, unlike the shape measuring apparatus 500 of FIG. In this shape measuring device 500B, the light projecting section 110 also serves as illumination light irradiation. For example, by lighting all the patterns when the light projecting unit 110 projects the pattern, it is possible to use it as a planar light source and irradiate the same light as the illumination light. With this configuration, since the illumination light output section can be omitted, there is an advantage that the configuration of the shape measuring apparatus can be simplified.

On the other hand, the stage 140 is a member for placing the object WK to be measured. The optical axis direction driving section 146 is a member for adjusting the focal position of the light receiving section 120 by relatively moving the stage 140 with respect to the light receiving section 120 in the optical axis direction. In this example, the optical axis direction driving section 146 functions as a focus adjusting section that drives the stage 140 side to adjust the focal length. The optical axis direction driving section 146 includes a stage driving section for electrically driving the stage 140 and a stage operating section for manually operating the stage 140 . These details will be described later.

Further, the stage plane direction driving section 148 is a member for relatively moving the stage 140 in the stage plane direction orthogonal to the optical axis direction of the light receiving section 120 . A stage plane direction driving unit 148 is a driving unit that drives the stage 140 in a horizontal plane, and can adjust the visual field range. In the example of driving the stage 140 side, the stage planar direction driving section 148 corresponds to the XY stage 141 , while the optical axis direction driving section 146 corresponds to the Z stage 142 .
[Embodiment 3]

However, in the present invention, the optical axis direction driving section 146 is not limited to movement on the stage 140 side, and the light projecting section 110 and light receiving section 120 sides may be moved. Such an example is shown in the block diagram of FIG. 3 as a shape measuring apparatus according to the third embodiment. In the shape measuring apparatus 500C shown in this figure as well, members similar to those in FIG.

In the shape measuring apparatus 500C according to the third embodiment, the height of the stage 140 side is fixed in the imaging means 100C, while the optical axis direction driving section 146C moves the light projecting section 110 and the light receiving section 120 side. The optical axis direction driving section 146C includes an imaging system operation section 144C for manually operating an imaging system such as the light projecting section 110 and the light receiving section 120, and an imaging system driving section 145C for electrically driving the imaging system. ing. Even with this configuration, the focal position can be similarly adjusted. Further, by keeping the height of the stage 140 constant, the height at which the object WK to be measured can be placed on the stage 140 can be kept constant. . Note that both the stage side and the light projecting section and light receiving section side may be made movable. Thus, in this specification, the focal position can be adjusted in the depth direction even when one or both of the stage side, the light projecting section and the light receiving section side are moved. Therefore, in this specification, the term "moving the stage relative to the light-receiving part in the optical axis direction" refers to a mode of moving the stage side, a mode of moving the light-projecting part and the light-receiving part, and a mode of moving both sides. It shall include the aspect to let
(Control means 200)

The control means 200 includes a three-dimensional shape data generation unit 212, a three-dimensional image synthesis unit 213, a determination processing unit 214, a depth extension processing unit 215, a synthesis processing unit 216, an automatic measurement setting adjustment unit 217, and a three-dimensional shape. It includes a data linking unit 219 , a storage unit 240 and a setting unit 250 .
(Measurement setting automatic adjustment unit 217)

The measurement setting automatic adjustment unit 217 automatically sets the measurement settings for each partial region based on at least one of the three-dimensional shape data of each partial region and the received light data acquired in each partial region when the three-dimensional shape data is generated. It is a member for adjusting The measurement setting automatic adjustment unit 217 automatically adjusts the partial area measurement setting for each partial area, and changes the measurement setting for each partial area as necessary. When the measurement settings for each partial area are changed in this way, the 3D shape data generation unit regenerates the 3D shape data according to the measurement settings for the partial area. That is, according to the measurement setting of each partial region after adjustment, the light projecting unit projects pattern light, the light receiving unit receives the adjusted light reception data, and based on this, the three-dimensional shape data generation unit generates the adjusted three-dimensional shape data. Generate. Further, the three-dimensional shape data connecting unit 219 connects the adjusted three-dimensional shape data to generate connected adjustment three-dimensional shape data. This makes it possible to generate three-dimensional shape data with measurement settings for each partial region that have been changed to optimum conditions based on the received light data and three-dimensional shape data that have been once acquired, and perform more accurate measurement.
(Three-dimensional shape data linking unit 219)

The three-dimensional shape data linking unit 219 connects the three-dimensional shape data of each partial region regenerated by the three-dimensional shape data generation processing according to the measurement settings of each partial region adjusted by the measurement setting adjustment unit, and corresponds to the connected region. It is a member for generating connected three-dimensional shape data.
(Solid shape data generator 212)

The three-dimensional shape data generation unit 212 determines the shape of the object to be measured based on the received light data output from the light receiving unit in accordance with the measurement settings set by the measurement setting unit 255 in each partial region set by the connection region setting unit 256. It is a member that generates three-dimensional shape data indicating the shape by a pattern projection method. In the example of FIG. 1 and the like, the three-dimensional shape data generating unit 212 is projected by the light projecting unit 110 while sequentially shifting the phase, and the light receiving unit 120 receives the light reflected from the surface of the measurement object WK a plurality of times, Phase data that varies depending on the surface shape of the measurement object WK is acquired based on the plurality of output received light data, and the measurement object existing within the stage plane orthogonal to the optical axis of the light receiving unit 120 is acquired based on the phase data. Three-dimensional shape data is acquired by measuring the shape of the object WK by the pattern projection method. This stage plane is specified planarly, for example, on the XY plane. Further, it is preferable to acquire the three-dimensional shape data for each pixel. Note that the three-dimensional shape data referred to here means data from which height information can be measured. For example, the three-dimensional shape data includes a height image in which each pixel representing the measurement object indicates the three-dimensional coordinates of the measurement object. That is, the three-dimensional shape data does not necessarily have height information directly. Data obtained by measuring height information indicating the three-dimensional coordinates (for example, XYZ coordinates) of the object to be measured is also included in the three-dimensional shape data.

The three-dimensional shape data generator 212 can also generate a height image. Therefore, the 3D shape data generation unit 212 can include a 3D shape data generation unit 212b that generates a height image, and a shape measurement processing unit 212c that performs measurement on the height image. In this way, the three-dimensional shape data generation unit 212 may be configured to generate a height image in which each pixel representing the object to be measured, included in the three-dimensional shape data, represents the three-dimensional coordinates of the object to be measured.
(Determination processing unit 214)

Based on the three-dimensional shape data acquired by the three-dimensional shape data acquisition unit 212, the determination processing unit 214 determines whether or not there is an unmeasured region having no height information within the depth measurement range. It is a member for judging according to conditions. In the pattern projection method, even if the contrast of the striped pattern is low, it is possible to acquire three-dimensional shape data as long as the contrast is such that adjacent bright and dark portions can be distinguished. Therefore, the depth measurement range is a certain distance in the optical axis direction of the light receiving unit 120 that can acquire height information without relatively moving the stage 140 with respect to the light receiving unit 120, the light projecting unit 110, or both. indicates a range with a width of . More specifically, the depth measurement range has a certain range above and below the optical axis direction with respect to the position where the fringe pattern projected onto the measurement object WK by the light projecting section 110 is imaged with the highest contrast. Here, the certain range is a range in which at least the striped pattern projected from the light projecting unit 110 by the light receiving unit 120 can be imaged, and there are a plurality of light projecting units 110 projecting pattern light from different directions. The case may be defined based on the range in which the fringe patterns projected from all the light projecting units 110 are imaged. Further, the unmeasured area refers to data from which height information cannot be obtained, among the three-dimensional shape data. For example, there are pixels in which the fringe pattern of the fringe projection is not reflected and a region composed of a plurality of pixels. Further, the predetermined determination conditions include the contrast of the striped image included in the three-dimensional shape data and whether or not the luminance has reached a predetermined value.

In other words, if there is a pixel with a luminance value sufficient to determine that a pattern is projected among the pixels for which the final three-dimensional shape data has not been obtained, the object to be measured exists. Based on this, we try to acquire 3D shape data by changing the depth measurement range.

The determination processing unit 214 determines whether a striped pattern is obtained to the extent that height measurement is possible based on such a determination condition. It can be determined whether a region of measurement exists.

The determination processing unit 214 also accumulates acquired pixels whose height information is measurable within the depth measurement range, and determines whether or not there are unmeasured pixels based on the accumulated image obtained by accumulating the acquired pixels. can be configured to determine

Further, the determination processing unit 214 may be configured to determine whether or not any portion within the depth measurement range has solid shape data, and determine whether or not there are unmeasured pixels. In this way, if there is a pixel whose height can be measured within the depth measurement range, the depth may be automatically expanded. That is, if even one point can be measured within the depth measurement range, it can be controlled to expand.
(Depth extension processing unit 215)

The depth extension processing unit 215 controls the optical axis direction driving unit 146 to change the focal position of the light receiving unit 120 when it is determined by the unmeasured determination processing by the determination processing unit 214 that there is an unmeasured area. It is a member for
(Setting unit 250)

The setting unit 250 includes a position specifying unit 251, an end condition setting unit 252, a depth range setting unit 253, a depth extension mode selection unit 254, a measurement setting unit 255, a connected area setting unit 256, and a measurement mode selection unit. 257.
(Position designation unit 251)

The position specifying section 251 is a member for specifying the XY position on the image of the measurement object WK displayed on the display section 400 .
(Termination condition setting unit 252)

The termination condition setting unit 252 is a member for setting a predetermined termination condition for terminating the focal position changing process of controlling the optical axis direction driving unit 146 to change the focal position of the light receiving unit 120 .

Here, the predetermined termination condition by the determination processing unit 214 includes a physical limit of the movement range, for example, a state where the stage 140 reaches a position where it cannot move any further. In addition to the state in which measurement is not possible in the first place, a state in which a fringe image cannot be obtained even though measurement has not been performed can be given as a predetermined termination condition.

It is preferable that the depth extension processing unit 215 operates the optical axis direction driving unit 146 in the direction in which the distance between the light receiving unit 120 and the stage 140 increases. This can prevent the measurement object WK placed on the stage 140 from coming into contact with the light receiving section 120 . In this case, since the light receiving unit 120 and the stage 140 move in only one direction, the entire measurement object WK cannot be measured unless the initial position of the stage is appropriately set. While moving the stage 140 in the direction of the optical axis of the light receiving unit 120, the user can measure the lowest position of the measurement object WK to be measured (the position away from the light receiving unit 120). is set as the initial position of the stage 140 at a position where the highest position of (the position closest to the light receiving section 120) does not collide with the light receiving section 120. FIG. This operation can be performed by the user confirming the three-dimensional shape data displayed on the display unit 400 or visually confirming the actual distance between the stage 140 and the light receiving unit 120 .

On the other hand, when the depth extension processing unit 215 allows the operation of the optical axis direction driving unit 146 also in the direction in which the distance between the light receiving unit 120 and the stage 140 is shortened, the measurement object WK on the stage 140 is a camera or the like. It is preferable to provide a mechanism for preventing contact with the For example, a rough height of the highest portion of the object WK to be measured is obtained in advance, and the depth extension processing unit At 215, the movement of the optical axis direction driving section 146 is restricted. If the stage is permitted to move in both the direction in which the distance between the light receiving unit 120 and the stage 140 is shortened and the direction in which the distance is lengthened, the stage 140 is first moved in one direction from the initial position of the stage 140 . If the termination condition by the determination processing unit 214 is not satisfied, the stage 140 is moved in the other direction and reciprocating motion is performed until the termination condition is satisfied.

The depth range setting unit 253 is a member for setting a range in which the focal position of the light receiving unit 120 is changed by controlling the optical axis direction driving unit 146 .

The depth extension mode selection unit 254 switches between performing focus position change processing of controlling the optical axis direction driving unit 146 to change the focus position of the light receiving unit 120 within a predetermined range or automatically extending the focus position. is a member of
(Measurement setting unit 255)

The measurement setting section 255 is a member for setting a connection region. The connected area is divided into a plurality of partial areas. Each partial area corresponds to a field of view or a slightly smaller area measurable by the profilometer. In this way, by dividing into a plurality of partial areas, moving the stage to each partial area by the planar direction driving unit, and connecting the three-dimensional shape data generated by each in the XY plane direction, there are restrictions on the hardware specifications. It becomes possible to obtain a wide-area image with an expanded field of view.
(Connection area setting unit 256)

The connection area setting unit 256 is a member that sets a connection area composed of a plurality of partial areas as an area in which the relative position of the stage in the plane direction is moved by the plane direction driving unit.
(Measurement mode selector 257)

The measurement mode selection unit 257 selects a normal mode, a fine mode for performing finer measurement than the normal mode, and a light reception data as measurement modes when the three-dimensional shape data generation unit generates the three-dimensional shape data of the object to be measured. It is a member for selecting one of the halation removal modes for removing halation from.
(Synthesis processing unit 216)

The synthesis processing unit 216 keeps the solid shape data generation unit 212 from acquiring solid shape data until it is determined by the unmeasured determination processing by the determination processing unit 214 that there is no unmeasured region, or until a predetermined end condition is satisfied. processing, unmeasured determination processing by the determination processing unit 214, and focal position change processing by the depth extension processing unit 215 are automatically repeated to generate a composite height image by synthesizing a plurality of height images. be.

With such a shape measuring apparatus, it becomes possible to extend the measurement range in the depth direction in each field of view.
(How to obtain height information)

In this embodiment, a pattern projection method based on the principle of triangulation is used as a method for acquiring height information. This method is based on the triangulation method with a wide depth measurement range, and repeats measurements by physically or optically moving the object to be measured or the position of the shape measuring device. By synthesizing the obtained measurement results, it is possible to expand the total height in the depth direction by the amount of movement in the depth measurement range that can be achieved by one measurement. As a result, it is possible to measure a wider range at high speed than with the triangulation method. As a result, a shape measuring device and a shape measuring method capable of measuring a wider field of view with high resolution are realized.
(XY image linking function)

The synthesis processing unit 216 can also connect, on the XY plane, a plurality of height images with different XY coordinates captured by moving the stage 140 in the XY direction. In the case of such XY connection, the stage 140 is horizontally moved by the stage plane direction driving section 148 to horizontally connect images captured in different visual field ranges. For example, the texture images representing different parts, which are picked up in multiple times by the texture image acquiring unit 218, are connected by the XY connecting unit, and the connected image is used as a large texture image as a reference target image or an inspection target image. can also In particular, a shape measuring device capable of capturing high-magnification optical images may not be able to fully demonstrate its capabilities with low-magnification texture images. , high-precision image inspection can be realized. Alternatively, since a high-magnification image has a narrow field of view, a connected image with an enlarged field of view can be obtained by connecting images captured in different fields of view. Also, the image linking function, here the XY linking function, can be performed not only on texture images, but also on height images, synthesized height images, or synthesized images obtained by synthesizing texture images and height images. When connecting a plurality of three-dimensional shape data acquired by moving the stage 140 in the XY directions, depth extension processing is automatically performed by the depth extension processing unit 215 at each XY position, and the generated plurality of three-dimensional shape data are linked together. This makes it possible to easily measure the entire measurement object WK even if the measurement object WK has large undulations in the XY directions and in the height direction. Further, if the measurement object WK has different undulations in the height direction at each XY position, the presence or absence of depth expansion processing by the depth expansion processing unit 215 or the number of times of depth expansion processing is different at each XY position. For example, at XY positions where the measurement target is relatively flat and the entire measurement depth falls within the measurement depth range in a single measurement, three-dimensional shape data is generated without performing depth extension processing. At XY positions that require expansion processing, depth expansion processing is performed multiple times to generate three-dimensional shape data, and these three-dimensional shape data can be linked together in the XY directions.

The storage unit 240 is a member for storing various data and setting values, and a semiconductor storage element or the like can be used. Here, the storage unit 240 includes a height image storage unit 241 for storing height images, a texture image storage unit 242 for storing texture images, and measurement settings for each partial region adjusted by the measurement setting automatic adjustment unit 217. A measurement setting storage unit 243 for storing is provided.

The display unit 400 is a member for displaying an acquired image or the like. For example, LCD, organic EL, CRT, etc. can be used.

The operation device 450 is a member for receiving user input and the like, and can use input devices such as a mouse, keyboard, and console. Further, by using a touch panel for the display unit 400, the display unit and the operation device can be used together.
(Block Diagram)

A configuration example of the imaging means 100 of the shape measuring apparatus 500 of FIG. 1 is shown in the block diagram of FIG. The imaging means 100 includes a light projecting section 110 , a light receiving section 120 , an illumination light output section 130 , a stage 140 and a measurement control section 150 . The light projecting section 110 includes a measurement light source 111 , a pattern generating section 112 and a plurality of lenses 113 , 114 and 115 . The light receiving unit 120 includes a camera 121 and multiple lenses 122 and 123 . A measurement object WK is placed on the stage 140 .
(Light Projector 110)

Light projecting section 110 is arranged obliquely above stage 140 . The imaging unit 100 may include a plurality of light projecting units 110 . In the example of FIG. 4 , the imaging means 100 includes two light projecting sections 110 . Here, a first light projecting section 110A (right side in FIG. 4) capable of irradiating pattern light onto the measurement object WK from a first direction, and a second direction different from the first direction to the measurement object WK. A second light projecting section 110B (left side in FIG. 4) capable of irradiating pattern light to WK is arranged respectively. The first light projecting portion 110A and the second light projecting portion 110B are arranged symmetrically with the optical axis of the light receiving portion 120 interposed therebetween. Three or more light-projecting units may be provided, or only one light-projecting unit may be provided, or a common light-projecting unit may be used and the light-projecting unit and the stage may be moved relative to each other to project light in different directions. Lighting is also possible. Furthermore, in the example of FIG. 4, the irradiation angle of the illumination light with respect to the vertical direction projected by the light projecting unit 110 is fixed, but this can be made variable.

The light receiving unit 120 in FIG. 4 receives the first pattern light emitted from the first light projecting unit 110A and reflected from the measurement object WK, and outputs first light reception data. On the other hand, the light receiving section 120 receives the second pattern light emitted from the second light projecting section 110B and reflected from the measurement object WK, and outputs second light reception data. The received light data output by the light receiving unit 120 is, for example, a fringe image based on the fringe projection method.

The three-dimensional shape data acquisition unit 212 that receives the received light data also generates a first height image of the measurement object WK based on the first received light data received by the light receiving unit 120 . On the other hand, the three-dimensional shape data acquisition section 212 generates a second height image of the measurement object WK based on the second received light data received by the light receiving section 120 .
(Depth measurement range)

Here, the first pattern light and the second pattern light can be emitted from the first light projecting unit 110A and the second light projecting unit 110B, respectively, within the stage plane where the imaging field of the light receiving unit 120 on the stage 140 is located. Let the common height range be the depth measurement range. The synthesizing unit 216 synthesizes the first height image and the second height image having the three-dimensional shape data within the depth measurement range to generate a synthesized height image.
(Depth search range)

On the other hand, in the stage plane of the light receiving unit 120 on the stage 140, there is an area where the first pattern light or the second pattern light can be irradiated only from either the first light projecting unit 110A or the second light projecting unit 110B. The height range including is set as the depth search range. The determination processing unit 214 can use whether or not the surface region of the measurement object WK exists within this depth search range as a determination condition.
(Measurement light source 111)

The measurement light source 111 of each of the first light projection section 110A and the second light projection section 110B is, for example, a halogen lamp that emits white light. The measurement light source 111 may be another light source such as a white LED (light emitting diode) that emits white light. Light emitted from the measurement light source 111 (hereinafter referred to as “measurement light”) is appropriately condensed by the lens 113 and then enters the pattern generator 112 .

The pattern generator 112 is, for example, a DMD (digital micromirror device). The pattern generator 112 may be an LCD (Liquid Crystal Display), an LCOS (Liquid Crystal on Silicon), or a mask. The measurement light that has entered the pattern generator 112 is converted into a preset pattern and a preset intensity (brightness) and emitted. The measurement light emitted by the pattern generation unit 112 is converted by a plurality of lenses 114 and 115 into light having a diameter larger than the observable/measurable field of view of the light receiving unit 120. is irradiated to

Note that the arrangement of FIG. 4 is an example, and the arrangement of the optical system members can be changed as appropriate. For example, the pattern generator 112 may be arranged on the exit surface side of the lens 115 .
(Light receiving unit 120)

The light receiving section 120 is arranged above the stage 140 . The measurement light reflected above the stage 140 by the measurement object WK is collected and imaged by a plurality of lenses 122 and 123 of the light receiving unit 120 and then received by the camera 121 .
(Camera 121)

The camera 121 is, for example, a CCD (charge-coupled device) camera including an imaging element 121a and a lens. The imaging device 121a is, for example, a monochrome CCD (charge-coupled device). The imaging device 121a may be another imaging device such as a CMOS (Complementary Metal Oxide Semiconductor) image sensor. Color image sensors require each pixel to correspond to red, green, and blue light reception, so the measurement resolution is lower than that of monochrome image sensors, and a color filter must be provided for each pixel. Decreased sensitivity. Therefore, in the present embodiment, a monochrome CCD is used as an imaging device, and a color image is acquired by irradiating illumination light output unit 130 (to be described later) with illumination corresponding to each of RGB in a time division manner. . With such a configuration, it is possible to obtain a color image of the measurement object without lowering the measurement accuracy.

However, it goes without saying that a color image sensor may be used as the image sensor 121a. In this case, although the measurement accuracy and sensitivity are degraded, there is no need to time-divisionally irradiate illumination corresponding to RGB from the illumination light output unit 130, and a color image can be acquired simply by irradiating white light. The optical system can be configured simply. Each pixel of the imaging device 121 a outputs an analog electrical signal (hereinafter referred to as a “light receiving signal”) corresponding to the amount of received light to the measurement control section 150 .
(Measurement control unit 150)

The measurement control unit 150 is equipped with an A/D converter (analog/digital converter) and a FIFO (First In First Out) memory. The received light signal output from the camera 121 is sampled at a constant sampling period and converted into a digital signal by the A/D converter of the measurement control section 150 under the control of the light source section 300 . Digital signals output from the A/D converter are sequentially stored in a FIFO memory. The digital signals stored in the FIFO memory are sequentially transferred to the control means 200 as pixel data.
(Control means 200)

As shown in FIG. 1, the control means 200 includes a CPU (Central Processing Unit) 210, a ROM 220 (Read Only Memory), a working memory 230, a storage section 240 and a setting section 250. FIG. A computer such as a PC (personal computer) or a workstation can be used as the control means 200 . Alternatively, a dedicated controller may be prepared. Alternatively, the control means 200 may be constructed by combining a general-purpose computer and a dedicated controller. In this example, the control means 200 is configured by a computer in which a shape measurement program is installed.

The setting unit 250 is operated by the operation device 450 . Operation device 450 includes a keyboard and pointing device. A mouse, a joystick, or the like is used as the pointing device. Also, the operation device 450 can be integrated with the display unit 400 . For example, by using a touch panel for the display unit 400, the display unit can have the function of an operation unit.

A system program is stored in the ROM 220 . The working memory consists of RAM (random access memory) and is used for processing various data. The storage unit 240 is composed of a hard disk or the like. The storage unit 240 stores an image processing program and a shape measurement program. Also, the storage unit 240 is used to store various data such as pixel data provided from the measurement control unit 150 .

CPU 210 generates image data based on the pixel data provided from measurement control section 150 . Further, the CPU 210 performs various processes on the generated image data using the working memory 230 and causes the display unit 400 to display an image based on the image data. Furthermore, the CPU 210 gives a driving pulse to the stage driving section 145, which will be described later. Furthermore, this CPU realizes the functions of a three-dimensional shape data generation unit 212, a determination processing unit 214, a composition processing unit 216, a three-dimensional image composition unit 213, and a depth extension processing unit 215, which will be described later.
(Display unit 400)

The display unit 400 is a member for displaying the measurement image acquired by the imaging unit 100 and the captured observation image. The display unit 400 is configured by, for example, an LCD panel or an organic EL (electroluminescence) panel.
(Stage 140)

The stage 140 is a member for placing the measurement object WK on its upper surface. As shown in FIG. 1, the stage 140 includes a stage operating section 144 for manually moving the stage 140 by the user, and a stage driving section 145 for electrically moving the stage 140 .

In FIG. 4, two directions orthogonal to each other in a plane (hereinafter referred to as a “mounting surface”) on the stage 140 on which the measurement object WK is mounted are defined as the X direction and the Y direction, respectively. , Y. A direction orthogonal to the mounting surface of the stage 140 is defined as a Z direction and indicated by an arrow Z. As shown in FIG. A direction of rotation about an axis parallel to the Z direction is defined as a θ direction and indicated by an arrow θ. Note that the rotation axis of the θ stage does not need to be parallel to the optical axis parallel to the Z direction, and may be tilted at 45° with respect to the optical axis, for example.

Stage 140 includes an XY stage 141 , a Z stage 142 and a θ stage 143 . The XY stage 141 has an X-direction moving mechanism and a Y-direction moving mechanism as a stage plane direction driving unit. The Z stage 142 has a Z direction movement mechanism. The θ stage 143 has a θ direction rotation mechanism. A stage 140 is composed of the XY stage 141 , the Z stage 142 and the θ stage 143 . Further, the stage 140 further includes a fixing member (clamp) that fixes the measurement object WK to the mounting surface. The stage 140 may further include a tilt stage having a rotatable mechanism around an axis parallel to the mounting surface.

A stepping motor is used for each of the X-direction movement mechanism, Y-direction movement mechanism, Z-direction movement mechanism, and θ-direction rotation mechanism of the stage 140 . The X-direction movement mechanism, Y-direction movement mechanism, Z-direction movement mechanism, and θ-direction rotation mechanism of the stage 140 are driven by the stage operation section 144 or the stage drive section 145 shown in FIG.

By manually operating the stage operation unit 144, the user moves the mounting surface of the stage 140 relative to the light receiving unit 120 in the X direction, Y direction, or Z direction, or rotates it in the θ direction. be able to. The stage drive unit 145 supplies current to the stepping motor of the stage 140 based on the drive pulse given from the control unit 200, thereby moving the stage 140 relative to the light receiving unit 120 in the X direction, Y direction, or Z direction. It can be moved or rotated in the θ direction.

Here, as shown in FIG. 4, the center axes of the left and right light projecting units 110 and the center axes of the light receiving units 120 are arranged so that they intersect each other on the focal plane where the focus of the stage 140 is best. 110 and the relative positional relationship of the stage 140 are defined. In addition, since the center of the rotation axis in the θ direction coincides with the central axis of the light receiving unit 120, when the stage 140 rotates in the θ direction, the measurement object WK does not move out of the field of view, It is designed to rotate within the field of view. Also, these XYθ and tilt movement mechanisms are supported with respect to the Z-direction movement mechanism. That is, even when the stage is rotated in the θ direction or tilted, the center axis of the light receiving unit 120 and the movement axis in the Z direction do not deviate from each other. With such a stage mechanism, it is possible to move the stage 140 in the Z direction to pick up and synthesize a plurality of images at different focal positions even when the position and orientation of the object WK to be measured are changed. Become. In this embodiment, an electric stage that can be driven by a stepping motor has been described as an example, but a manual stage that can only be moved manually may be used.
(Light source unit 300)

The light source unit 300 includes a control board 310 and an observation illumination light source 320 . A CPU is mounted on the control board 310 . The CPU of the control board 310 controls the light projecting section 110 , the light receiving section 120 and the measurement control section 150 based on commands from the CPU 210 of the control means 200 . Note that this configuration is an example, and other configurations may be used. For example, the measurement control unit 150 controls the light projecting unit 110 and the light receiving unit 120, or the control unit 200 controls the light projecting unit 110 and the light receiving unit 120, and the control board may be omitted. Alternatively, the light source section 300 may be provided with a power supply circuit for driving the imaging means 100 .
(Observation illumination light source 320)

The observation illumination light source 320 includes, for example, three-color LEDs that emit red, green, and blue light. By controlling the luminance of the light emitted from each LED, light of any color can be generated from the illumination light source 320 for observation. Light emitted from the observation illumination light source 320 (hereinafter referred to as “illumination light”) is output from the illumination light output section 130 of the imaging means 100 through a light guide member (light guide).

The illumination light output from the illumination light output unit 130 switches between red light, green light, and blue light in a time division manner to irradiate the measurement object WK. Accordingly, observation images captured with these RGB lights can be combined to obtain a color observation image, which can be displayed on the display unit 400 .

When displaying a color observation image in this manner, if the switching frequency for switching the color of the illumination light is matched with the frame rate for updating the display content (rewriting the screen) on the display unit 400, the frame rate is low. In some cases (for example, about several Hz), flickering becomes noticeable. In particular, conspicuous color switching between RGB primary colors may cause discomfort to the user. Therefore, such a problem can be avoided by setting the switching frequency for switching the illumination light of RGB to a high speed (for example, several hundred Hz) that cannot be recognized by the user. Switching of the color of the illumination light is performed by the illumination light output unit 130 or the like. In addition, the timing of actually imaging the measurement object WK by the imaging means 100 while switching the RGB of the illumination light at high speed is the timing of updating the display content of the display unit 400 . That is, it is not necessary to completely match the timing of capturing the observation image and the timing of switching the illumination light. It can be handled by linking so that it becomes a multiple of the cycle. With this method, the timing of switching the illumination light can be sped up, and discomfort given to the user can be reduced without increasing the frame rate that can be processed by the imaging device 121a.

In the example of FIG. 1 , the observation illumination light source 320 is externally attached to the imaging means 100 and arranged in the light source section 300 . By doing so, it is possible to avoid a situation in which the heat generated by the observation illumination light source 320 affects the optical system of the imaging means 100 . However, it is also possible to provide the observation illumination light source on the imaging means side by using an observation illumination light source that generates a small amount of heat, or by providing a corresponding heat dissipation mechanism on the imaging means side. In this case, it is possible to integrate the illumination light output unit and the observation illumination light source, such as by incorporating the observation illumination light source into the illumination light output unit. The member can be made unnecessary, and the configuration can be simplified. Similarly, with respect to the light projecting section, the light source for light projection can be incorporated in the imaging means or externally attached to the light source section side.

Illumination light output section 130 in FIG. 4 has an annular shape and is arranged above stage 140 so as to surround light receiving section 120 . As a result, the illumination light output unit 130 irradiates the measurement object WK with the illumination light so as not to generate a shadow. Further, the illumination light output unit 130 may be an annular ring illumination, coaxial epi-illumination, lateral spot illumination, transmitted illumination, or a combination thereof. Alternatively, the illumination light output unit may be omitted by irradiating uniform light from the light projecting unit 110 as illumination light. For example, by enabling the projection of a white pattern image using a two-dimensional array as the light projection unit 110, the light projection unit 110 can also be used as an illumination light output unit. As described above, when the white pattern image projection of the two-dimensional array of the light projecting unit 110 is used as the illumination light source for observation, the light transmitted or reflected by the two-dimensional array is projected onto the measurement object WK through the diffusion plate. , the pixel grid of the two-dimensional array may be prevented from being reflected on the measurement object WK.
(Example of GUI)

The shape measuring device has an operation program installed in the PC, which is the control means 200, for operating the shape measuring device 500. FIG. The display unit 400 displays a GUI (Graphical User Interface) for operating the shape measurement program. An example of such a GUI screen is shown in FIG. In this example, in the display unit 400, the first measurement image S1 of the measurement object WK irradiated with the first measurement light from the first light projection unit 110A and the second measurement light projected from the second light projection unit 110B are shown. The second measurement image S2 of the measured object WK thus obtained can be displayed side by side. In this example, an image display area 410 provided on the left side of the display section 400 has a first display area 416 on the right side and a second display area 417 on the left side. By using such two-screen display, it is possible to confirm the state of the measurement image obtained by each measurement light, particularly the shaded area, while comparing them. It should be noted that the example of dividing the image display area is not limited to such a configuration in which the image display regions are arranged horizontally, and any configuration such as arranging them vertically or configuring them as separate screens can be used as appropriate.

Further, the operation program of the shape measuring apparatus is provided with image switching means capable of switching the image being displayed between the observation image and the measurement image. In this example, when the "observation image" button 427 is pressed as the image switching means, an observation image captured using the illumination light source for observation is displayed in the image display area 410, and when the "measurement image" button 428 is pressed, A measurement image obtained by using the measurement light projecting means is displayed in the image display area 410 . The user operates the operation area 420 provided in the GUI with the operation device 450 of the control means 200 of FIG. The brightness of the measurement light emitted from 110B or the corresponding camera exposure time can be changed. Here, the parameter for changing the brightness of the measurement light is the exposure time of the camera. In addition, imaging conditions for observation images are set as necessary. In the upper part of the image display area 410 in FIG. 5, observation image imaging condition setting means 490 for setting imaging conditions for such an observation image is provided. The observation image capturing condition setting means 490 includes settings such as shutter speed switching for capturing an observation image, imaging magnification, focus adjustment, and the like. In the example shown in FIG. 5, the brightness of the imaging means is selected from "auto" or "manual". When "manual" is selected, the brightness of the imaging means is adjusted with the camera brightness adjustment slider.

As described above, in the image display area 410, images of the measurement object WK can be displayed side by side when each of the first light projecting section 110A and the second light projecting section 110B irradiates the measurement light. Therefore, while viewing the image of the measurement object WK displayed in the image display area 410, the user can move the brightness adjustment sliders 444 and 446 to the positions of the first light projecting section 110A and the second light projecting section 110A. The brightness of the measurement light emitted from each of the units 110B or the camera exposure time corresponding to each light projecting unit 110 can be appropriately adjusted.

Appropriate brightness of the measurement light emitted from the first light projecting unit 110A and the second light projecting unit 110B and appropriate brightness of the illumination light emitted from the illumination light output unit 130, or a camera corresponding to each illumination There may be a correlation with exposure time. In this case, the brightness of the measurement light emitted from each of the first light projecting unit 110A and the second light projecting unit 110B or the camera exposure time corresponding to each light projecting unit 110 is determined by the illumination light output unit 130. It may be automatically adjusted based on the brightness of the illumination light or the camera exposure time corresponding to the illumination light.

Alternatively, the measurement light emitted from each of the first light projection unit 110A and the second light projection unit 110B is based on the brightness of the illumination light emitted from the illumination light output unit 130 or the camera exposure time corresponding to the illumination light. The display unit 400 may display an adjustment guide for optimizing the brightness or the camera exposure time corresponding to each light projecting unit 110 . In this case, the user moves the brightness adjustment sliders 444 and 446 based on the adjustment guide to adjust the brightness of the measurement light emitted from each of the first light projection section 110A and the second light projection section 110B. Alternatively, the camera exposure time corresponding to each light projection unit 110 can be appropriately adjusted.

If the light irradiation direction is different, the light reflection direction is also different, so the brightness of the resulting image differs depending on the light irradiation direction even for the same part. In other words, the brightness of the measurement light suitable for measurement and the exposure time of the imaging element differ depending on the irradiation direction. In this embodiment, the brightness of each image captured by irradiating light from a plurality of first light projecting units 110A and second light projecting units 110B can be individually adjusted, so that the brightness of each image can be adjusted appropriately for each irradiation direction. It is possible to set the brightness of the measurement light or the exposure time. Further, since the image being adjusted in brightness is displayed while being updated in the image display area 410, the brightness can be adjusted while checking the image after adjustment. At this time, in the image displayed in the image display area 410, by displaying in an identifiable manner a portion that is too bright and has blown out highlights or a portion that has been It is also possible to display in a more comprehensible manner whether or not is properly adjusted.
(Telecentric double-side projection optical system)

Here, FIG. 6 shows a schematic diagram of an optical system for telecentric double-sided projection. As shown in this figure, as a light projecting optical system constituting the light projecting unit 120 for projecting light onto the measurement object WK placed on the stage 140, a first light projecting unit 110A is used as the light projecting optical system. A light optical system and a left projection optical system composed of the second light projection section 110B are respectively arranged. By providing the left and right light projecting optical systems in this way, it is possible to reduce the area where the pattern light shadows and cannot be measured.

On the other hand, the light-receiving optical system that constitutes the light-receiving device 120 includes a low-magnification imaging device 120A and a high-magnification imaging device 120B. Above the central prism 124, a bifurcated bilateral telecentric light receiving lens 125 is provided. Further, on the right side of the prism 124, a high-magnification imaging element 120B is arranged. As shown in FIG. 6, the projection optical system illuminates a wider area than the field of view.

The light-receiving optical system is composed of a light-receiving lens and a camera unit. The light-receiving lens is a fixed-magnification telecentric optical system in which priority is given to accuracy, but a zoom lens may be used to cover a wide range of magnifications. The shape measuring apparatus employs a bifurcated fixed-focus bilateral telecentric optical system, and has two cameras, a low-magnification camera and a high-magnification camera. As a result, it is possible to change the magnification by electrical switching instead of mechanical switching as in the case of a zoom lens, and it is possible to realize stable measurement performance without deviation of measurement accuracy due to mechanical positioning accuracy.

The measurement range by left and right both-side projection will be described based on the schematic diagram of FIG. 7 . In order to minimize the shadow area (unmeasurable area), the shape measuring device is configured to allow pattern projection from left and right symmetrical directions with the light receiving lens in between. ing.

A bifurcated bifurcated telecentric light receiving lens 125 is adopted as the light receiving lens, and a distortion-free image viewed from directly above can be acquired without magnification change due to the height of the measurement object WK. When combined with the configuration of , the effect of simplifying the measurement setting that the light projecting and receiving angle is constant anywhere in the field of view is exhibited. As shown in FIG. 7, the bifurcating both-side telecentric light-receiving lens 125 has a coaxial field of view at two magnifications, and has the advantage of eliminating the need for field adjustment even when the magnification is switched.

The left and right projection lenses 116 irradiate the measurement object WK with two-dimensional pattern light as parallel light beams from left and right equal projection angles. The advantage of irradiating the object with two-dimensional pattern light from the left and right across the light receiving lens is not only the effect of minimizing the shadow described above, but also the synthesis of the left and right measurement results (for example, averaging). , and the error occurring in each of the left and right can be reduced.

As shown in the schematic diagram of FIG. 7, the width of the measurement field of view (in the XY direction) is determined by the width of the light flux of the receiving lens (thin line (low magnification) or thick line (high The range of height measurement using a set of pattern projections is determined by the relationship between light projection and light reception. A depth measurement range is defined as a common area of the received light flux and the projected light fluxes from the left and right sides, like the area framed by the dotted line in FIG. That is, the common area of the left and right floodlights indicated by the dotted frame indicates the range of measurable heights. By determining the depth measurement range in this way, regardless of where the measurement is taken within the depth measurement range, the way the light strikes from the left and right is uniform. The effect of stabilizing measurement can be achieved over the entire depth measurement range.
(Lower head 102)

Stage 140 is coupled to base housing 149 . The base housing 149 and the stage 140 are unitized as the lower head 102 . This lower head 102 is connected to the upper head 101 . FIG. 8 shows a side view of the shape measuring apparatus 100 in which the upper head 101 and the lower head 102 are connected, and FIG. 9 shows the configuration of the lower head 102 . The upper head 101 accommodates a light projecting section 110 and a light receiving section 120 . The lower head 102 also includes an XY stage 141, a Z stage 142, a scale unit 160, a stage driving section 145, a base housing 149, and a base section 151 installed on the floor. A stage 140 is composed of an XY stage 141 and a Z stage 142 . The base housing 149 connects the base portion 151 and the upper head 101 . Note that this configuration is an example, and for example, the upper head and the lower head 102 may be integrated.

The lower head 102 is electrically connected to the measurement control section 150 (upper head 101 side) of the imaging means 100 through the stage driving section 145 . It is also mechanically fastened by mechanical positioning in the base housing 149 and positioning bolts. An XY stage 141 is held via a stage support portion 152 from a Z stage 142 built in a base housing 149 . By detecting the height of the XY stage 141 with the scale unit 160 for height detection, it is possible to accurately recognize the stage surface height at the time of measurement.
(Scale unit 160)

The scale unit 160 has a sensor moving section 161 and a scale section 162 . As shown in FIG. 9, the sensor moving section 161 is connected to the back side of the stage support section 152 and moves together with the stage support section 152 . On the other hand, the scale section 162 is fixed to the base housing 149 and detects the position of the sensor moving section 161 . By moving the sensor moving portion 161 along the scale portion 162 in this manner, the relative distance between the stage 140 and the light receiving portion 120 in the optical axis direction of the light receiving portion 120 is detected. In this configuration, the sliding surface on which the sensor moving section 161 slides along the scale section 162 serves as the measurement axis for measuring the height of the stage 140, that is, the working distance. As shown in FIG. 9, by aligning the extension line of the optical axis with the measurement axis, measurement with less error is realized.
(Relationship between optical axis extension line and measurement axis)

In the configuration for measuring the elevation height of the stage 140, if the optical axis extension line and the measurement axis are separated from each other as shown in FIG. 10A, measurement errors are likely to occur. Assuming that the distance between the optical axis extension line and the measurement axis is a, and the measurement axis is inclined at an angle θ with respect to the optical axis extension line, the measurement error is Δ=a·tan θ. On the other hand, as shown in FIG. 10B, by forming the optical axis extension line and the measurement axis on the same plane, the error can be reduced to an almost negligible level according to Abbe's principle.

Even if the optical axis extension line and the measurement axis are not perfectly aligned, the effect of reducing the error can be obtained by reducing the distance between the optical axis extension line and the measurement axis. In the present invention, as shown in FIG. 10B, by arranging the measurement axis at least within the imaging field, errors caused by the inclination of the measurement axis with respect to the extension of the optical axis can be reduced. In the present specification, arranging the sensor moving part near the optical axis extension line means that the sensor moving part is arranged at least within a projection plane in which the imaging field of view is projected onto the stage.

It is preferable that the sensor moving section 161 is configured by an encoder section. Marks (for example, concave portions) are provided at equal intervals on the distance measurement surface of the scale portion 162 on which the sensor moving portion 161 moves, and the number of these marks is counted by the encoder portion, so that the accurate movement distance can be calculated. becomes.
(Scale unit 160)

In the shape measuring apparatus according to this embodiment, the sensor moving section 161 and the scale section 162 constitute a unit-shaped scale unit 160 . Examples of such scale units 160 are shown in FIGS. 9-12. The scale unit 160 includes a scale section 162 and an encoder section as a sensor moving section 161 . The encoder section is slidably supported so as to slide relative to the scale section 162 . A joint surface between the encoder portion and the scale portion 162 is used as a distance measurement surface.

The sensor moving part 161 of the scale unit 160 is arranged at a position substantially aligned with the optical axis of the light receiving optical system of the upper head 101 . Detecting the height of the XY stage 141 on the extension line of the optical axis of the light receiving unit 120, that is, directly under the line of sight in this manner has the advantage of minimizing the error between the actual height and the detected height. However, as described above, it is not necessary to strictly align the distance measuring surface of the sensor moving section 161 with the optical axis extension line of the light receiving section 120, and it is sufficient if it can be arranged in the vicinity of the optical axis extension line.

A tilt sensor capable of detecting the tilt of the stage 140 may be provided inside the XY stage 141 . Furthermore, in detecting the Z stage height, it is also possible to use the measurement result of this tilt sensor.

As shown in FIGS. 8 and 9, the stage driving section 145 is arranged on the base housing 149 side with respect to the scale unit 160 . As a result, a stage configuration is realized that operates over a long stroke in the Z direction while maintaining the rigidity of the high-load XY stage 141 . Normally, a stage that maintains high rigidity uses a cross roller guide or linear guide, but from the viewpoint of maintaining moment rigidity, it is important to provide a sufficient width at the base of the movable part. Since the required guide length is the sum of the width and the stroke length, the Z stage guide is generally longer than the movable portion of the lightweight scale portion. Therefore, in this embodiment, by independently arranging the distance measuring surface and the optical axis direction driving unit 146, it is possible to design a low-floor housing with a long stroke. There is an advantage that a stable measuring instrument can be realized.

In this embodiment, an example in which the scale unit 160 is arranged on the side of the base housing 149 is shown. You may arrange it. In particular, when the light receiving section side is driven instead of the stage side, it is preferable to arrange the scale unit so as to measure the amount of movement of the driven light receiving section side.

On the other hand, a disadvantage of arranging the sensor moving section 161 and the optical axis direction driving section 146 independently is that the unidirectional guide is configured in duplicate. By arranging independent linear motion guides in two places separated by a distance, there may be disadvantages such as crosstalk between straightness and deterioration of straightness. Therefore, in the shape measuring apparatus according to the present embodiment, in view of these points, as shown in FIGS. It realizes a robust configuration that is avoided.
(Connecting part)

As shown in FIG. 9, magnets are used to connect the sliding scale portion 162 . The magnetic surfaces are fastened by a spherical body 163 on one side and a flat plate material 164 on the other side. Here, the spherical body 163 is made of a magnetic material, and the plate member 164 is made of a permanent magnet. The spherical body 103 is held by a holding portion 167 , and the holding portion 167 is fixed to the stage support portion 152 . Furthermore, a plate member 165 having a smooth surface is interposed.
(Point contact adsorption of spherical body 163)

13A and 13B show the state of point contact of the spherical body 163. FIG. In these figures, FIG. 13A shows the state of contact between surfaces, and FIG. 13B shows the state of contact between a surface and a sphere. In the fastening between the magnetic force surfaces, the magnets are centered in the central portion where the lines of magnetic force are concentrated. Therefore, as shown in FIG. 13A, when the planes are in contact with each other, stress is applied to the movable portion as the stage 140 rolls (shifts in the XY directions). When the stage 140 shifts to the right as indicated by the arrow on the upper right in the figure, the cross-hatched magnet attracted to the stage 140 is pulled downward, and as a result stress is applied to the members indicated by diagonal lines. .

On the other hand, the shape measuring apparatus according to this embodiment shown in FIG. FIG. 13B shows an enlarged schematic diagram of the contact portion between the spherical surface of the spherical body 163 and the flat surface of the plate member 164 . By utilizing the point contact adsorption of the spherical body 163 in this way, the spherical surface of the spherical body 163 slides as the stage 140 rolls, so that measurement can be performed with reduced stress in the XY directions.

Also, in the case of surface contact, as shown in FIG. 14A, an error occurs due to the pitching and yawing of the stage 140 . Assuming that the suspension side diameter is d in FIG. 14A, an error of d/2×sin θ occurs when the axis is tilted by an angle θ. On the other hand, in the case of ball contact, as shown in FIG. 14B, the magnet floats and absorbs, so the error due to the float can be suppressed to a relatively small cos θ.
(Pinching of plate member 165)

Generally, the surface of a magnet is plated for the purpose of rust prevention. However, when the spherical surface of the plated spherical body 163 slides, the plating 166 may peel off due to friction and rust may occur. As a result, as shown in FIG. 15A, the spherical body 163 rides on the rust and floats. Moreover, as shown in FIG. 15B, the thickness of the plating 166 varies. Therefore, the spherical surface of the spherical body 163 slightly moves up and down due to the non-uniformity of the surface of the plating 166 . Thus, the plating process affects the measurement accuracy. Therefore, in this embodiment, as shown in FIG. 15C, by sandwiching a smooth and highly stable plate member 165 between the magnet of the plate member 164 and the spherical body 163, the influence on the measurement can be reduced. .
(hook member 168)

Further, in the case of a magnetic attraction structure, it is assumed that the sensor moving portion 161 will fall due to separation of the attraction portion due to impact or the like. In particular, in a configuration in which the drop stroke after separation is relatively long and the clearance to the scale portion is narrow, there is a possibility that the impact caused by the drop of the sensor moving portion 161 will damage the glass scale portion. Therefore, in this embodiment, as shown in the cross-sectional view of FIG. 18, a hook member 168 is provided to prevent the sensor moving portion 161 from falling. As shown in this figure, the holding portion 167 that holds the spherical body 103 has a stepped portion 167b on its upper surface, and the hook member 168 has an engaging piece 168b that is engaged with the upper surface of this stepped portion 167b. is doing. Furthermore, the hook member 168 is fixed to the sensor moving portion 161 . In the illustrated example, the lower portion of the hook member 168 is fixed to the bottom surface of the magnetic plate member 164 . In this hook member 168, when the locking piece 168b is locked to the stepped portion 167b, the spherical body 103 is separated from the upper surface of the plate member 165 on the upper surface of the plate member 164 as shown in FIG. Then, in a state in which the spherical body 103 is attracted to the plate-like member 165, the locked state of the locking piece 168b with the stepped portion 167b is released. As a result, even when the attraction between the spherical body 103 and the plate member 165 is released, the locking piece 168b locks the stepped portion 167b, thereby preventing the sensor moving portion 161 from falling. When the spherical body 103 is lowered by the descent of the stage 140 , the spherical body 103 is again attracted to the magnetic plate member 164 via the plate member 165 . In this way, the hook member 168 prevents the sensor moving portion 161 from dropping, and even if the suction portion separates, the point contact portion can be self-restored by the suction force greater than its own weight.

The scale unit 160 is thinned as a whole. In addition, as shown in FIGS. 11 and 12, the cross section of the scale portion 162 is U-shaped so that the encoder portion overlaps the scale portion 162 when viewed from the side. As a result, the distance measuring surface on which the scale portion 162 and the encoder portion slide can be easily aligned with the optical axis of the light receiving portion 120 .
(Stage-side hole 140b, base-side hole 151b)

Furthermore, this scale unit 160 is configured to be embedded in the bottom side of the stage 140 as shown in the cross-sectional views of FIGS. 16A and 16B. In general, when the distance measuring surface and the optical axis are arranged to coincide with each other, as shown in FIGS. It becomes large. On the other hand, in the present embodiment, a space is formed on the bottom side of the stage 140 and the stage support portion 152 that supports it, and depending on the height of the stage 140, the scale unit 160 may partially overlap the inside of the stage 140. As a result, it is possible to reduce the size and lower the floor of the housing of the shape measuring apparatus. In the example of FIGS. 16A and 16B, a stage side hole portion 140b into which the scale portion 162 can partially enter is formed on the bottom side of the stage support portion 152. As shown in FIG. As a result, it is possible to prevent the upper end of the scale portion 162 from interfering with the stage support portion 152 and the like at the position where the stage 140 is lowered. In addition, on the side of the base portion 151, a base side hole portion 151b into which the sensor moving portion 161 can at least partially enter is formed. As a result, it is possible to prevent the sensor moving section 161 from interfering with the base section 151 at the position where the stage 140 is lowered. The scale unit 160 is configured to slip into the stage support portion 152 that supports the bottom surface of the XY stage 141 . This provides the advantage of being able to lower the floor of the entire housing while maximizing the stroke amount in the Z direction.
(Scale cover 147)

Further, as shown in FIG. 8, the periphery of the scale unit 160 is covered with a scale cover 147 . As a result, the space under the stage 140 that ascends and descends is prevented from being exposed, so that foreign matter can be prevented from entering and the user's contact can be prevented. becomes possible. As shown in FIGS. 16A and 16B, the scale cover 147 is also configured to slip into the base portion 151, contributing to lowering the floor of the housing while maximizing the stroke.
(cross roller guide)

A cross roller guide is generally used for a high-precision encoder portion such as a scale unit in order to reduce the error of the portion to be slid. Examples of scale units X using such cross roller guides are shown in FIGS. 19A to 19D. The scale unit X shown in these figures has a structure in which the sensor moving portion 161X sliding along the scale portion 162X is sandwiched between two guides. Each requires high-precision processing. Furthermore, adjustments such as pressurization adjustment are also required. In addition, since the member connecting the two guides thermally expands (for example, the area surrounded by the dashed line in FIG. 19A), various performances such as pitching, yawing, and rolling change due to temperature changes. In addition, since the cross roller guide requires a certain length of the contact portion for the purpose of maintaining rigidity, the device configuration tends to be longer than the actual movable area. That is, as shown in FIG. 19B, since the guides on the movable side and the fixed side have the same length, the movable side protrudes from the fixed side when moved upward and downward as shown in FIGS. 19C to 19D. , it is necessary to secure an area in consideration of the amount of protrusion, and there is a problem that the length becomes large. In this way, a shape measuring device equipped with a high-precision encoder is larger than the measuring range, and the cost and manufacturing period increase, and various inspections and adjustments are required depending on the installation environment. There were disadvantages.
(Direct acting mechanism 170)

On the other hand, in the shape measuring apparatus according to the present embodiment, the slide mechanism of the scale unit 160 includes a linear guide 171 and a shaft instead of such a cross roller guide as shown in FIGS. A linear motion mechanism 170 combined with a magnet sub-guide 174 is employed. FIG. 20A shows a cross-sectional view of the scale unit 160 of FIG. 20B taken along line A-A'. As shown in this figure, the scale unit 160 includes a main linear guide 171 (left side in the figure) and a sub-guide 174 (right side in the figure) as shown in the sectional view of FIG. 20A. The linear guide 171 is composed of a cylindrical shaft 172 and a ring portion 173 sliding around it. As a result, the rotation direction is not restricted and there is no intervening member, so the advantage of being less susceptible to thermal expansion can be obtained.

On one sub-guide 174 side, as shown on the right side in FIG. 20A, magnets 175 attract and restrict only the rotational direction. Further, the hole portion 176 into which the sub-guide 174 is inserted is formed to be larger than the outer diameter of the shaft that constitutes the sub-guide 174, so as to absorb the forming accuracy tolerance of the sub-guide 174. As shown in FIG.

Also, in the scale unit 160X using the cross roller guide 169 shown in FIGS. 19C and 19D, since the guides on the movable side and the fixed side have the same dimensions, the fixed side region protrudes during movement. In contrast, the scale unit 160 shown in FIGS. 20B to 20D can reduce the size of the movable part that fixes the sensor moving part 161, so it can be miniaturized without popping out during movement. is obtained.

Furthermore, in this configuration, as shown in FIGS. 20A to 20D, by using a high-precision linear guide 171 as a reference and a sub-guide 174 that mainly restricts rolling, the length of the contact portion on the linear guide 171 side can be adjusted. can be reduced to achieve compactness. In addition, by ensuring accuracy on the main linear guide 171 side, processing becomes easy. Furthermore, adjustment during assembly can be eliminated, and errors due to thermal expansion can be reduced by simplifying the system.

In the above example, the configuration in which the sensor moving section 161 is connected to the stage 140 side and the scale section 162 is fixed to the base housing 149 side has been described. However, the present invention is not limited to this configuration, and similar effects can be obtained with a configuration in which, for example, the scale section is connected to the stage side and the sensor moving section is fixed to the base housing side. In this case, the sensor moving portion fixed to the base housing side moves relative to the scale portion.
(XY stage 141)

The XY stage 141 has a tilt sensor and a stage driving section 145 (microcomputer/FPGA/motor driver) inside. Also, the XY stage 141 is electrically connected to the stage drive section 145 inside the base housing 149 through the stage support section 152 . The XY stage 141 can also be detachable by configuring the electrical connection between the stage support section 152 and the XY stage 141 with a connector, and it is possible to switch to a different visual field adjustment stage such as a tilt/rotation stage.
(Flow of measurement by fringe projection method)

Next, based on FIG. 4, the outline of the operation flow for measuring the shape will be described. It should be noted that all the description here is for the "one-shot measurement" in which the Z stage 142 is fixed in the height direction.

First, the user places the measurement target WK to be measured on the stage 140, and adjusts the focus, visual field position, brightness, etc. by the illumination condition adjustment section while viewing the optical image displayed on the display section 400. A ring illumination is used as the illumination light output unit 130 here. However, the illumination light output unit 130 is not limited to ring illumination, and may emit uniform illumination from, for example, the light projection unit 110 that constitutes the illumination unit of the light projection system.

Next, the illumination light is switched from the ring illumination to the light projection unit 110 to adjust the brightness of the light projection system illumination light. Since the illumination light from the light projecting unit 110 strikes obliquely, a shadow is generated due to the shape of the measurement object WK. Further, depending on the surface condition of the object WK to be measured, it may be possible to obtain a better appearance by slightly tilting the illumination light. In order to tilt the illumination light, for example, a tilt stage capable of tilting the stage 140 is used, or a tilting mechanism is provided in the light projecting section 110 . In addition, in order to suppress the shadow of the illumination light and the influence of the surface condition, the position and orientation of the measuring object WK are readjusted as necessary.

When the measurement object WK is moved in such an adjustment process in the light projecting unit 110, the ring illumination is switched again to check how the measurement object WK looks with the ring illumination light, and readjust the brightness of the screen. Note that this operation can be omitted if unnecessary.

When the posture, position, focus, and illumination conditions for measurement of the object WK to be measured are determined, the control means 200 transmits a command to start measurement to the measurement control section 150 . The control means 200 is composed of a computer in which the shape measuring program is installed as described above. Upon receiving this command, the measurement unit synchronously controls the pattern generation unit in the light projecting unit 110 and the imaging means 100, and acquires a plurality of images of the measurement object WK with the imaging means 100 while projecting a plurality of patterns. , the control board 310 performs appropriate processing, and then transmits the data to the control means 200 .
(Generation of height image)

The image data received by the control means 200 is appropriately image-processed and analyzed by the measurement algorithm in the shape measurement program to generate three-dimensional shape data. Specifically, a height image having height information is generated by the three-dimensional shape data generation unit 212b.
(Generation of texture image)

On the other hand, the object WK to be measured is irradiated with illumination light, and the imaging means 100 acquires a texture image, which is an image representing the surface state of the object WK to be measured. For example, the object WK to be measured is illuminated with ring illumination, or the light projection unit 110 emits a light projection pattern (all white) in which all pixels are turned on, thereby forming an optical image with uniform illumination light. Take an image and use it as a texture image.

Moreover, the texture image may be taken not only in one sheet but also in a plurality of sheets. At this time, an HDR image or a depth composite image can be generated by synthesizing a plurality of texture images. A HDR (high dynamic range) image is an image generated by capturing a plurality of texture images while changing the exposure time of the camera and then synthesizing the texture images with a high dynamic range (HDR). In addition, when the height difference of the measurement target portion of the measurement object WK exceeds the depth of field, the depth composite image is obtained by extracting only the focused portion from the observation images individually captured in different height directions. This is an image synthesized by
(Generation of synthetic image)

The obtained texture image is also transferred to the control means 200 . The control means 200 combines the texture image and the height image to generate a composite image. For example, a texture image is mapped to a height image, which is three-dimensional shape data, using a shape measurement program, and synthesized image data is generated by a three-dimensional image synthesizing unit. A synthesized image is displayed on the display unit 400 . In this state, desired measurement and analysis can be performed on the synthesized image.
(Shape measurement method)

A procedure for generating the composite image described above and performing shape measurement will be described with reference to the flowchart of FIG. 21 . First, in step S 2101 , the object WK to be measured is placed on the stage 140 .

Next, in step S2102, the ring illumination is used to adjust the position, orientation, focus, and brightness of the object WK to be measured.

Next, in step S2103, the system is switched to the projection system, and the brightness of the illumination of the projection system and the position and orientation of the measurement object WK are adjusted.

Next, in step S2104, switching is made to the ring illumination again, and then to the projection system, and the visibility is confirmed.

Next, in step S2105, it is confirmed whether or not there is a problem with the appearance. If there is a problem, the process returns to step S2102 and the above processing is repeated. On the other hand, if there is no problem, the process proceeds to step S2106, and the measurement start button is pressed.

Next, in step S2107, a stripe pattern is projected from the light projecting system and scanned, and in synchronization with this, a plurality of stripe images of the object WK to be measured are acquired by the camera. Here, this step may be repeated a constant number of times for left/right projection, HDR, and other performance improvements. For example, the influence of halation can be reduced by projecting the pattern light multiple times while changing the exposure time.

Next, in step S2108, the ring illumination is turned on, and a texture surface image of the measurement object WK is obtained.

Next, in step S2109, the striped image set is processed with a measurement algorithm to generate three-dimensional shape data.

Next, in step S2110, the texture image is mapped onto the solid shape data.

Next, in step S2111, the result is displayed. Then, in step S2112, it is determined whether or not the data of the target portion has been correctly acquired. On the other hand, if it has been acquired, the process advances to step S2113 to execute various measurements and analyzes using measurement software or the like.

As described above, shape measurement can be performed by generating a synthesized image using the shape measuring device. Note that the order of steps S2101 and S2102 in FIG. 21 may be changed. In that case, first, the orientation, position, and focus of the measurement object WK are adjusted in the measurement setting (step S2102), and the orientation, position, and focus of the measurement object WK are not changed in the texture image acquisition (step S2101). , so that only the brightness of the ring lighting and the selection of the texture type are performed.
(Procedure to acquire texture image)

Next, a procedure for obtaining a texture image will be described with reference to the flowchart of FIG. This procedure corresponds to detailed description of the process of step S2102 in FIG. First, in step S2201, switching to ring illumination is performed.

Next, in step S2202, the brightness of the ring illumination is adjusted. Then, in step S2203, it is determined whether or not the brightness is appropriate, and if not, the process returns to step S2202 to repeat the process. On the other hand, if the brightness is appropriate, the process advances to step S2204 to move the Z stage 142 and adjust the focal position of the measurement object WK. Further, in step S2205, it is determined whether or not the focal position is correct, and if not, the process returns to step S2204 to repeat the process. On the other hand, if the focal position is correct, the process advances to step S2206 to move the XY.[theta].tilt stage to align the position and orientation of the measurement object WK. Note that the order of these steps S2202 to S2206 may be changed as appropriate.

Next, in step S2207, it is determined whether the part to be viewed is within the field of view. If not, the process returns to step S2206 to repeat the process. On the other hand, if it fits, the magnification is changed to adjust the size in step S2208.

Next, in step S2209, it is determined whether or not the magnification is appropriate, and if not, the process returns to step S2208 to repeat the process. On the other hand, if the magnification is appropriate, the flow advances to step S2210 to determine whether or not to select the type of texture image. If not, the process advances to step S2211 to select a normal image, and terminates this process.

On the other hand, if the type of texture image is to be selected, the flow advances to step S2212 to determine whether or not focus stacking is to be performed. On the other hand, if not, jump directly to step S2214.

Next, in step S2214, it is determined whether HDR is to be performed. If HDR is to be performed, the process advances to step S2215 to set HDR. On the other hand, if not, jump directly to step S2216.

Next, in step S2216, it is determined whether or not to check the texture image, and if so, the process advances to step S2217 to display a preview of the texture image. On the other hand, if not performed, this processing is terminated.

Next, in step S2218, it is determined whether or not the user is satisfied with the result of the texture image previewed. On the other hand, if satisfied, this process ends. A texture image can be obtained in the manner described above.
(Procedure for setting measurement settings)

The measurement settings for generating the three-dimensional shape data include the pattern light projection settings of the light projection section, the light reception settings and imaging conditions of the light reception section, the lighting conditions of the illumination section, and the like. These measurement settings are set by the measurement setting unit 255 shown in FIG. 1 and the like. Here, the procedure for setting the measurement settings will be described with reference to the flowchart of FIG. This procedure corresponds to detailed description of the process of step S2103 in FIG.

First, in step S2301, the system is switched to the measurement projection system (the left projection system in FIG. 4). Next, in step S2302, the brightness is temporarily adjusted.

Then, in step S2303, it is determined whether or not the measurement point is illuminated, and if not, in step S2304, the θ/tilt stage is moved to adjust the position and orientation of the object WK to be measured. On the other hand, if the measurement point is illuminated, the process jumps directly to step S2306.

Next, in step S2305, it is determined whether or not illumination has been applied, and the process returns to step S2304 to repeat the process. On the other hand, if there is illumination, it is determined in step S2306 whether or not the brightness of the measurement location is appropriate. If not, the brightness is adjusted in step S2307. On the other hand, if it is illuminated, the process jumps directly to step S2309.

Next, in step S2308, it is determined whether the brightness is correct, and if not, the process returns to step S2307 to repeat the process. On the other hand, if the brightness is correct, it is determined in step S2309 whether the measurement location is in focus. If not, in step S2310, the stage 140 is moved to focus on the measurement location. On the other hand, if the brightness matches, the process jumps to step S2312.

Next, in step S2311, it is determined whether or not the subject is in focus, and if not, the process returns to step S2310 to repeat the process. On the other hand, if the subject is in focus, the flow advances to step S2312 to make comprehensive judgment. Here, it is determined whether or not the brightness, orientation, and focus of the measurement point are appropriate. If not, in step S2313, inappropriate parameters are confirmed, and the appropriate procedure is returned to. The return destination is one of step S2304, step S2307, and step S2310 depending on the parameter that is not appropriate.

On the other hand, if it is determined to be appropriate in the comprehensive judgment, the flow advances to step S2314 to switch to the measurement projection system (the right projection system in FIG. 4). Next, in step S2315, the brightness is adjusted, and in step S2316, it is determined whether or not the brightness matches. If not, the process returns to step S2315 to repeat the process. On the other hand, if the brightness is correct, this process ends.

In these procedures, the order of position adjustment, posture adjustment, focus adjustment, and brightness adjustment can be changed as appropriate.

In this way the measurement settings can be set. The measurement setting can be automatically performed by the user from the measurement setting unit 255, or can be automatically performed by the shape measuring apparatus.
(Measuring range expansion function in the depth direction)

In this embodiment, a pattern projection method based on a triangulation method is adopted as the non-contact measurement method. This method is based on the triangulation method, which allows a wide range of depth measurement at one time. By doing so, it becomes possible to expand the depth measurement range that can be achieved by one measurement by the amount of movement. As a result, it is possible to measure a wider range at high speed than the triangulation method, and to realize a shape measuring device and a shape measuring method capable of measuring a wider field of view with high resolution. Then, it becomes possible to expand the measurement range in the depth direction in each field of view.

As shown in FIGS. 8 and 9, the shape measuring apparatus according to the first embodiment can measure the surface shape of an object to be measured in a non-contact manner. Height information at each pixel within the field of view of the light-receiving optical system can be obtained by measurement. The shape measuring apparatus also has a stage 140 that is relatively movable with respect to the measuring unit, and has a common axis for the stage height reading axis and the observation optical axis.

This shape measuring apparatus has a bifurcated light-receiving optical system capable of observing at two magnifications inside one upper head 101 . As a result, it is possible to perform measurement by switching the magnification in the coaxial field of view. The two magnifications of low magnification and high magnification have the same optical axis. The pattern projection optical axis is tilted in a symmetrical direction about the intersection of this optical axis and the best focus plane (focusing plane) of the light receiving optical system. From this pattern projection optical axis direction, each pattern is projected, a plurality of images are captured and analyzed by the light receiving optical system, and height information is calculated.
(range of measurement)

As for the focal plane and the measurement range of the shape measuring apparatus, as shown in FIG. 7, the upper head 101 has a photographing field of view in the direction of looking down from directly above. The object to be measured on the XYZ stage arranged below the upper head 101 is measured from directly above. The user can place the object to be measured on the top surface of the XYZ stage, move the XY stage 141 to adjust the field of view, and move the Z stage 142 to adjust the focus. Alternatively, by moving the light receiving optical system side, the relative distance (working distance) between the object to be measured and the light receiving optical system can be changed to adjust the focus. The term "focus" as used herein means focusing of the light receiving optical system. In this shape measuring apparatus, as shown in FIG. 7, the depth measurement range in the height direction has a symmetrical width with respect to the focal plane in the vertical direction. However, symmetry is not essential.

The XYZ stage is arranged in a direction in which the Z stage 142 substantially coincides with the light receiving optical axis. As a result, the height of the object to be measured in the optical axis direction (or the relative positional relationship between the upper head 101 and the object to be measured in the optical axis direction) can be changed only by moving the Z stage 142 . A scale unit 160 capable of detecting the movement distance of the Z stage 142 is arranged inside the Z stage 142 . The scale unit 160 is arranged directly below the field of view of the upper head 101 as shown in FIGS. By arranging the scale unit 160 directly under the field of view in this way, it is possible to detect the positional relationship between the depth measurement range and the measurement object with a minimum error. In general, if the position of the sensor that performs detection, ie, the measurement axis, is offset from the measurement position of the object to be measured with respect to the coordinate point to be detected, a measurement error may occur based on Abbe's principle. This situation occurs when the measurement axis is arranged parallel to the position to be measured, as shown in FIG. 10A. On the other hand, according to Abbe's principle, such measurement errors can be minimized when the measurement axis and the measurement position of the object to be measured are on the extension of the same plane. That is, as shown in FIG. 10B, the position to be measured and the measurement axis are arranged in series.
(depth extension)

In order to extend the depth measurement range in the height direction, the relative distance between the stage 140 and the light receiving section 120 is moved in the optical axis direction by the optical axis direction driving section 146 . The light-receiving unit 120 has a predetermined depth of focus, and can capture pattern images only within a certain range of heights (depth measurement range) determined by the depth of focus. Therefore, by shifting the depth measurement range with the optical axis direction driving section 146, the measurable depth measurement range can be expanded. That is, height images generated in the same field of view (within the stage plane orthogonal to the optical axis direction of the light receiving unit 120) are connected in the height direction for each pixel of the corresponding XY coordinates, thereby limiting the depth measurement range. It becomes possible to obtain synthetic height images of greater heights.

Such a depth extension function requires connecting height images generated within the same field of view, that is, within the XY plane. Also, it is necessary to connect height images generated under the same conditions. Specifically, when pattern light is projected from left and right light projecting units 110 as shown in FIG. to generate a composite height image. Also, in the case of height images generated by one-side projection using either one of the light projection units 110, the height images of the one-side projection are similarly connected. At this time, height images of right-side projection are connected to each other in the case of right-side projection, and height images of left-side projection are connected to each other in the case of left-side projection.

In the example of FIG. 7, etc., the depth measurement range can be expanded by performing multiple measurements while moving the Z stage, and combining the measurement results based on the height of each Z stage that performed the measurements. . Such one-time measurement with a fixed Z stage height is called "one-shot measurement", and measurement combining the results of measurements at a plurality of Z stage heights is called "depth extension measurement".

Here, the concept of extending the depth measurement range in the height direction will be described with reference to FIGS. 24A to 24C. FIGS. 24A to 24C show the depth measurement ranges defined by the left projection range and the right projection range at heights A, B, and C, respectively, in the form of broken-line frames.

When measuring a measurement object WK2 having a structure higher than the depth measurement range HIA (the range indicated by the dotted frame in FIG. 24A) of the shape measuring apparatus, the Z stage 142 is moved in the height direction (height A→B→ By doing C), it is possible to fit each surface of the measurement object WK2 within the depth measurement range. (Bold lines in FIGS. 24A to 24C)

Optical images observed at this time are shown in FIGS. 24A to 24C, and fringe images acquired by the fringe projection method are shown in FIGS. 24D to 24F, respectively. In FIGS. 24A-24C, in-focus regions are schematically indicated by hatching.

In FIGS. 24A and 24D, the lowest plane of the object to be measured is in focus at height A, and the shape of the lowest part of the object to be measured can be measured. Also, as shown in FIGS. 24B and 24E, at height B where the Z stage 142 is slightly lowered, at height A, the area outside the depth measurement range (where the fringes are largely blurred on the fringe image, the red dotted line area) It is possible to measure the shape of an area that is focused and within a certain width around this plane. Further, at height C where the Z stage 142 is lowered, the shape (red dotted line) existing at the highest point of the object to be measured is focused, as shown in FIGS. It becomes possible to measure the shape of the area where the

At these three heights, the height of the Z stage 142 is detected by the scale unit 160, and it is possible to obtain stage height coordinates for each shot. The scale unit 160 outputs a scale value indicating the relative distance between the stage 140 and the light receiving section 120 in the optical axis direction.

Here, a procedure for linking measurement results for each one shot obtained by three measurements will be described with reference to the schematic diagrams of FIGS. 26A to 26D. As shown in FIGS. 26A to 26D, measurement data of a certain height range (dotted line frame in FIG. 26A, dashed line frame in FIG. 26B, and dashed line frame in FIG. 26C) is obtained by measurement for each shot. At this time, the relative movement amount of the stage 140 or the absolute stage height is detected during measurement. By offsetting the detected coordinates as the value of the origin of the measurement data, the relative relationship of each shot is defined. By summing these results, concatenated measurement data that extends the normal one-shot depth measurement range can be obtained.

In this way, the scale unit 160 stores the scale value when each height image is acquired, and at the time of synthesis, the pixel values of each height image are offset based on the scale value and synthesized. Specifically, the synthesis processing unit 216 stores the scale value of the scale unit 160 when each height image was generated, and when synthesizing the height images, the pixel value of each height image is stored. are offset and synthesized based on the scale value.

As described above, one-shot measurement, which can be measured by one imaging by fringe projection, is repeatedly performed and connected in the height direction, so that measurement extended in the depth direction becomes possible. Note that when connecting the one-shot depth measurement ranges, they do not necessarily have to be continuous, and discrete one-shot measurements spaced apart in the depth direction may be used. For example, when the user manually extends the depth, it is sufficient to acquire the three-dimensional shape data only for the area required for measurement, and there may be cases where all the information in the height direction of the object to be measured is not required.
(mask area)

In addition, even in the case of automatic extension in the depth direction, the user can also set a desired depth extension range. For example, the depth extension processing unit 215 includes a depth range setting unit 253 for controlling the optical axis direction driving unit 146 to set the range in which the focus position of the light receiving unit 120 is changed. A mask area may be set as an unnecessary range for expansion. Depth extension measurements thus include not only continuous concatenations of one-shot measurements, but also spaced concatenations.

As described above, by detecting the height of the Z stage 142 together with the measurement of the object to be measured, it becomes unnecessary to consider the error of the actual movement amount with respect to the Z stage movement amount. Assuming that the height of the Z stage is not detected, in this case, the origin of each one-shot is specified based on the movement pulse (movement instruction amount) of the Z stage. It becomes a connection measurement error as it is. In addition, depending on the configuration of the shape measuring apparatus, as shown in FIG. 10A, an error based on Abbe's principle may also occur due to the deviation between the movement drive shaft and the actual measurement object loading position. On the other hand, as shown in FIG. 10B, by detecting the height of the Z stage and bringing the measurement axis for detecting the height of the stage 140 closer to the optical axis, the error is reduced and the height can be obtained with high accuracy. Detection is achieved. In addition, this makes it possible to improve the accuracy when synthesizing in the height direction.

When measuring by extending the stage 140 in the depth direction, it is required to accurately detect the amount of movement in which the positions of the object to be measured and the light receiving unit 120 are physically or optically moved. In order to accurately detect the amount of movement, it is desirable that the field of view of the measuring instrument and the detection position of the linear movement match according to Abbe's principle. On the other hand, when detecting movement of a stage with a long stroke, the detection mechanism also tends to be long. Therefore, when arranging the sensor directly under the stage, a longer sensor unit must be arranged according to the movement stroke, and there is a situation in which the total length of the entire housing has to be increased.

Furthermore, the direct-acting mechanism itself generally requires a longer structure than the sensor moving portion. This is because the width of the base housing is added to the amount of movement in order to increase the rigidity of the moving stage. In addition, an increase in dimension due to the overhang of the guide cannot be avoided. As a result, the height of the entire stage increases, and the top surface of the stage becomes higher than the installation bottom surface, which reduces user convenience and tends to increase the amplitude of the measurement target due to vibration. Disadvantages increase. In view of such circumstances, in the present embodiment, the scale unit 160 for detecting the height of the stage 140 is arranged directly under the field of view to increase the degree of freedom in arranging the stage drive shafts.

The examples shown in FIGS. 26A to 26D show the case where the measurement object WK2 has a relatively simple step. Depending on the object to be measured, it is possible to fit the entire height direction of the object to be measured in the measurement area with two levels of Z stage heights (for example, height A in FIG. 24A and height B in FIG. 24B). Synthesis of height information common to a plurality of one-shot data at each height will be described.
(Synthesis logic of common height information)

As a method of synthesizing common height information, there is a method of calculating a weighted average, or a method of adopting only one of them due to the reliability of the height information. When each piece of height information indicates approximately the same height, it is considered that the height information obtained at a position closer to the focal plane has less error. For this reason, calculation is performed by a weighted average according to the distance from the in-focus plane.

On the other hand, if the respective height information are significantly different, there is a high possibility that one of the height information is noise due to the influence of multiple reflections of light inside the object to be measured. Therefore, in this case, the degree of reliability for determining which height to adopt is obtained from the degree of blurring of the image or the contrast of luminance with or without illumination, and the one with the higher degree of reliability is adopted.
(unreliable data)

Of the data included in the height image, highly reliable pixels are displayed on the display unit 400 or used for measurement. On the other hand, data with low reliability is not displayed on the display unit 400 and is not used for measurement or the like because it is feared that the data may contain errors.

On the other hand, even data with low reliability can be used to determine whether or not 3D shape data exists at the time of depth extension. Whether or not to acquire a height image by expanding in the depth direction is sufficient if it is possible to determine whether or not the object to be measured continues to exist in the height direction, and high accuracy is not required. Therefore, in the present embodiment, even low-reliability data that is not used for normal measurement or construction of height images can be used to determine whether depth expansion is necessary.

As an example, FIGS. 27A and 27B show height images generated in a depth measurement range up to a certain height for a certain object to be measured due to restrictions in the specifications of the shape measuring apparatus. In FIG. 27A, pixels with low reliability within the depth measurement range are not displayed. Thus, when displaying a height image on the display unit 400, it is common to display pixels with high reliability and not display pixels with low reliability. On the other hand, FIG. 27B shows an example in which pixels with low reliability are also displayed in the height image of FIG. 27A. In this figure, the pixels on the upper end surface of the cylinder indicated by the area enclosed by the dashed line are not suitable for use as data for dimensional measurement of the object to be measured due to their poor accuracy. It can be inferred that they must exist continuously above the end face. Therefore, when depth extension measurement is performed, a height image in a wider range can be generated by further setting the depth measurement range upward. Similarly, height images of measurement objects of other shapes are shown in FIGS. 28A and 28B. In this drawing, FIG. 28A shows a height image in which pixels with low reliability are hidden, and FIG. 28B shows a height image in which pixels with low reliability are also displayed. Similarly, by using the area enclosed by the dashed line in FIG. It is possible to determine from
(pixels at the edge of the 3D shape data)

In this way, it is possible to determine whether or not to perform depth extension measurement based on the stereoscopic shape data positioned at the edge of the height image. Note that the present invention is not limited to the method of making determinations based on the pixels at the ends of the three-dimensional shape data, but may also make determinations based on data in the middle of the depth measurement range when depth extension measurement is performed. For example, determination is made based on whether or not a pixel at a position a predetermined distance away from the edge has solid shape data, or if any pixel in the depth measurement range has solid shape data, depth extension measurement can also be configured to run For example, among the pixels for which the final 3D shape data has not been obtained, if any of the pixels has a brightness value that allows it to be determined that the pattern is projected, the unmeasured pixel The determination processing unit may determine that there is a depth extension measurement. In this case, in order to avoid noise and erroneous detection, it is preferable to set a threshold such that the number, area, and volume of pixels having three-dimensional shape data are above a certain level.
(Display mode switching section)

As described above, in the shape measurement program according to the present embodiment, even pixels with low reliability can be displayed on the display unit 400 . For example, the display mode switching unit can switch between a normal display mode in which pixel data with low reliability is not displayed and a visualization mode in which pixel data with low reliability is also displayed. In the examples of FIGS. 27 and 28 described above, FIGS. 27A and 28A show the normal display mode, and FIGS. 27B and 28B show the visualization mode, respectively.
(Determination of necessity of depth extension measurement based on solid shape data)

In the above example, an example of determining the necessity of depth extension measurement based on pixel data forming a height image, ie, data obtained by calculating height information, has been described. However, the present invention does not limit the determination of the necessity of depth extension measurement to the height image, and is configured to perform these necessity determinations based on the original data and raw data before calculating the height information. may Such an example will be described with reference to FIGS. 29 and 30. FIG. FIG. 29 shows an example of a fringe image obtained by projecting a fringe pattern onto the object to be measured. In this figure, the region enclosed by the dashed line is outside the depth measurement range, so the contrast of the fringe pattern is low. However, since the stripe pattern is projected even outside such a depth measurement range, it can be used to determine the necessity of depth extension measurement, although the accuracy is lower than that of other stripe patterns. That is, in the example of FIG. 29, since it can be understood that the measurement object has a shape at a position higher than the depth measurement range (in this case, it protrudes in a cylindrical shape), depth extension measurement can be performed in this direction. is valid can be determined by the fringe pattern outside the depth measurement range.

Furthermore, when performing depth extension measurement, it is also possible to determine whether to extend upward or extend downward based on such three-dimensional shape data. For example, in the example of the measurement object shown in FIG. 30, there are portions outside the depth measurement range on the upper and lower sides of the drawing. Of these, the upper region surrounded by the thick dashed line has higher luminance than the lower region surrounded by the thin dashed line. In general, for data outside the depth measurement range, the side closer to the camera or illumination tends to be brighter, and the side farther from it tends to be darker. Therefore, based on the brightness and contrast of the projected pattern, it is possible to determine whether the data outside the depth measurement range exists outside the higher side or the lower side of the height range. Therefore, it is possible to estimate in which direction the depth extension measurement should be performed to acquire the height image of this portion.
(moving pitch)

When connecting the height images continuously, the position to which the Z stage 142 is moved is determined so that a gap in the height direction does not occur when connecting the height images. should be no higher than the height of In order to connect the heights smoothly when synthesizing, it is desirable that the depth measurement ranges are slightly shorter than the height so that the depth measurement ranges partially overlap, as shown in FIG. 26D. However, if the overlap area is too large, the total number of sheets required for concatenation will increase, resulting in a trade-off with the measurement time. Therefore, it is preferable to overlap the depth measurement range by about 1% to 33%, more preferably 5% to 25%, and even more preferably 10% to 20%.
(Movement pitch of texture image)

When generating a composite image, the movement pitch for moving the Z stage in the depth direction to capture a plurality of height images may be the same as the movement pitch for capturing texture images, but it is not necessary to match. You can also set them independently. Especially for the height image, even if the pattern image such as the striped image is not necessarily in focus, the height information can be measured if the contrast difference or the like can be confirmed. On the other hand, texture images are greatly affected if they are out of focus. Therefore, it is preferable to make the movement pitch of the texture image finer than the movement pitch of the height image, in other words, to increase the number of texture images. By performing focus stacking of multiple texture images captured at fine movement pitches, a clear focus stacking image in which almost the entirety is in focus can be obtained. By mapping this depth composite image on a composite height image obtained by combining height images, it is possible to acquire three-dimensional shape data having clear texture information and deep height information.

On the other hand, in order to capture multiple height images, each time the stage is moved in the depth direction, a texture image is also captured. You may make it map to the synthetic|combination height image obtained by synthesize|combining. In this case, although the sharpness of the focus stacking image is reduced, there is no need to move the stage to obtain the focus stacking image other than the stage movement for capturing the height image, so there is an advantage in that processing does not take much time.

Here, the graph of FIG. 31 shows the relationship between the roughness (relative value) of the image at the time of connection and the movement pitch. In FIG. 31, the horizontal axis indicates the movement pitch with respect to the height of the depth measurement range, and the vertical axis indicates the surface roughness when the planes are obliquely connected. As shown in this figure, it can be seen that the roughness increases as the movement pitch increases.

In the above example, the movement pitch for moving the Z stage is set to a fixed amount, but the present invention is not limited to this configuration, and can be set to an arbitrary amount of movement designated by the user, for example.
(Connected area of height image)

When connecting a plurality of height images in this way, there is a problem of how to handle areas where the height images overlap in the height direction. That is, it is necessary to decide which of the two height images to be connected should be used in the composite height image as the height information of the overlapping portion. For this reason, the synthesizing unit 216 predetermines how to handle overlapping portions. For example, when connecting the height image HIA obtained in FIG. 26A with the height image HIB obtained in FIG. 26B, in the synthesized height image CHI in FIG. and below overlap in the overlap region OL1. Similarly, when the height image HIB is connected to the image HIC, the upper portion of the height image HIB and the lower portion of the height image HIC overlap in the overlap region OL1. In such a case, the synthesis processing unit 216 processes the overlap region based on the reliability index.
(reliability index)

Here, the reliability index means how close the height information of the pixels in the stage plane corresponding to each height image is to the true value, that is, the true height, in the overlapping area where the depth measurement ranges overlap. It is an index that shows When the height information is the pixel value of the pixels forming the height image, it can be said to be an index indicating the reliability of the pixel value.

In this way, when connecting a plurality of height images in the depth direction, by using a reliability index instead of using a simple averaging method, a synthetic height that increases the reliability of height information in overlapping areas can be obtained. image can be obtained.

As a specific reliability index, the closer distance from the focal position of the light receiving unit 120 is adopted. When creating a height image using the pattern projection method, a pattern image (for example, a stripe image) can be obtained even if the focal position is not the same, and height information can be calculated. Therefore, the accuracy of height information tends to be high. Therefore, using the focal length as a reliability index, it can be determined that the closer the distance between the focus position when the height image is generated and the target pixel is, the higher the reliability of the obtained height information is.

Alternatively, contrast with surrounding pixels may be used as a reliability index. Specifically, the contrast between the corresponding pixel in the pattern image from which the height image is generated and the pixels located around the pixel is used as the reliability index of the pixel in the height image. The higher the contrast with the surrounding pixels, the clearer the boundary of the pattern light becomes and the more accurately the height information can be calculated. Alternatively, the brightness value or the like of the original pattern image may be used as the reliability index.

Based on the reliability index obtained in this way, the pixels with the higher reliability index can be adopted as the pixels of the synthetic height image.

In the case of a pixel for which height information is not obtained in the first place, the pixel for which height information is obtained is used as invalid. If the height information is not obtained for both pixels, the height information is invalid (null) in the composite height image as well. For example, in an area where the depth measurement range overlaps, for the pixel values of the corresponding XY coordinates of the height images, if the pixels of one height image are valid and the pixels of the other height image are invalid, the valid pixels pixel values are used. As a result, when connecting a plurality of height images in the depth direction, it is possible to obtain a synthesized height image in which missing pixels are interpolated for height information in overlapping regions.

On the other hand, it is possible not only to adopt the one with the higher reliability index and discard the one with the lower reliability index, but also to perform weighting. For example, it is expected that more accurate height information can be obtained by weighting such that pixel values with higher reliability indexes are weighted higher and pixel values with lower reliability indexes are weighted lower.

Alternatively, the height information of the synthesized height image may be calculated based on weighted averaging using the reliability index.
(difference)

It is also possible to extract pixels having a difference of a predetermined value or more from two partially overlapping height images. Specifically, in a region where the depth measurement ranges overlap, the composition processing unit 216 can extract pixels as the difference, and among them, a pixel value with a high reliability index can be adopted. In this case, the synthesis processing unit 216 may be provided with differential pixel extracting means for extracting pixels having a difference of a predetermined value or more between the height images.

Furthermore, when synthesizing height images whose depth measurement ranges partially overlap, the conditions for selecting or calculating height information can be changed according to the amount of difference in data. For example, when the data difference is greater than or equal to a predetermined value, the pixel with the higher reliability index is adopted, and when the difference is less than or equal to the predetermined value, the height of the synthetic height image is calculated based on weighted averaging using the reliability index. information may be calculated.
(Setting the scope of consolidated measurement)

When performing joint measurements as described above, there are several possible ways to determine the depth measurement range. For example, (1) A method in which the user inputs the upper and lower limit coordinates of the Z stage and measures and connects the range including the upper and lower limits at a constant movement pitch; (2) How many steps in the vertical direction from the current Z stage height? A method of allowing the user to decide whether to acquire, and performing and connecting multiple steps of measurement at a fixed movement pitch can be considered.

However, all such depth measurement range determination methods require a procedure for determining the depth measurement range as preprocessing for measurement. This procedure not only requires time and effort, but also requires setting each time a different height range is specified for a plurality of fields of view, which complicates the operation. Therefore, in the present embodiment, it is possible to automatically determine the range of connection measurement.
(Setting the depth measurement range)

In order to automatically determine the joint depth measurement range, the depth search range is defined in the first embodiment. First, in the shape measuring apparatus shown in FIG. 32, projected light beams are projected toward the measurement object WK as parallel light beams from symmetrical angles of the light receiving optical system. Here, the depth measurement range is the range in which the shape measuring device can measure with guaranteed accuracy. In the depth measurement range, by averaging or synthesizing the measurement results of the light emitted from the left and right, the stability and accuracy of the measurement can be expected. defined as

On the other hand, in each of the light beams independently irradiated from the left and right, the projection light beams are irradiated in a height range wider than the depth measurement range set with high accuracy. Therefore, a union area of the left and right projected light beams that falls within the field of view is defined as a depth search range. This makes it possible to acquire approximate height information on the shape of the measurement object outside the depth measurement range, even if it cannot be used for measurement.
(combination of triangulation method)

In the shape measuring apparatus according to this embodiment, the spatial code method and the multi-slit method, or the spatial code method and the sine wave phase shift method are combined to perform measurement with higher accuracy. However, in areas beyond the depth measurement range, the projected fringe pattern becomes blurred due to the depth of field of the optical system, making it impossible to measure the depth with sufficient resolution and accuracy. On the other hand, the fringe pattern responsible for the relatively low-resolution measurement of the spatial code method, as shown in FIG. Even in the region exceeding , it often retains a rough striped shape. In FIG. 29, the fringe pattern irradiated on the cylindrical top surface is located in the depth search range, so the fringes are blurred, but the rough fringe shape is maintained. By using this characteristic, it is possible to obtain rough height information within the depth search range and outside the depth measurement range.

In this example, the spatial code method and the multi-slit method, or the spatial code method and the sinusoidal phase shift method were combined for measurement. By projecting with a phase shift for each, it is possible to obtain the same effect as combined measurement with the spatial code method. For example, a first pattern with a coarse period is projected and phase-shifted to perform low-resolution measurement of the measurement object WK, and then a second pattern with a short period is projected and phase-shifted to measure the measurement object WK. By performing high-resolution measurements and combining them, highly accurate measurements with absolute values are possible. In this case, the results of low-resolution measurement can be handled in the same manner as the measurement results of the spatial code method.
(Depth extension mode selection unit 254)

As described above, the shape measuring apparatus according to the present embodiment has a one-shot measurement function that performs one-time measurement with the Z stage height fixed, and a depth extension measurement function that combines the results of measurements at a plurality of Z stage heights. It has Here, as the depth extension measurement function, either an automatic depth extension function that performs depth extension automatically or a manual depth extension measurement function that manually performs depth extension can be performed. Alternatively, these may be switchable. The depth extension mode selector 254 is used to switch the depth extension measurement function between automatic and manual.
(Example 1: Automatic depth expansion based on accumulated images)

Here, automatic depth extension according to the first embodiment will be described. From rough height information within the depth search range and outside the depth measurement range, the Z stage position for measuring those heights within the depth measurement range is determined, and by moving to that position and performing measurement, automatically Extends the range of joint measurements. Here, as shown in FIG. 33, among the pixels forming the field of view, the pixels (measurement pixels) for which the three-dimensional shape data are acquired are accumulated. In the example of FIG. 33, in the image IG1 captured in the depth measurement range HT1, although the height can be obtained in the rectangular surrounding area, the height cannot be obtained in the central elliptical area. The image has pixels with missing information. Then, when the depth measurement range is changed from HT1 to HT2 and the image IG2 is captured, the height is obtained in some of the pixels whose height was not measured in the image IG1. Similarly, when an image IG3 is captured in the depth measurement range HT3 and an image IG4 is captured in the depth measurement range HT4, the height is obtained from the missing pixels. In this way, the pixels for which the height is obtained for each depth measurement range are accumulated as shown in FIGS. 34A to 34D. For example, FIG. 34A shows the image IG1, and FIG. 34B shows the image IG1, which is an accumulated image obtained by accumulating pixels from which height information was obtained in the image IG2. As a result, compared to the image IG1 in FIG. 34, it can be seen that the number of unmeasured pixels lacking height information is reduced. Furthermore, FIG. 34C shows an accumulated image obtained by accumulating pixels from which height information was obtained in the image IG3, and the area of unmeasured pixels is further reduced than in FIG. 34B. Then, in FIG. 34D, the pixels obtained in the image IG4 are accumulated to obtain the height information from the pixels in all areas. In this way, the presence or absence of unmeasured pixels (unmeasured pixels) is determined based on the cumulative image obtained by accumulating acquired pixels, and if unmeasured pixels exist, acquisition of 3D shape data is automatically continued. . Then, the pixels forming the field of view are sequentially filled with measurement pixels, and the process ends when there are no more unmeasured pixels.
(three-dimensional shape data)

Here, the three-dimensional shape data is data for measuring the shape of the object to be measured by the pattern projection method, and does not necessarily include height information. That is, even if the height information is unmeasured data, if the height information includes data capable of calculating the height information, it is called three-dimensional shape data.
(Procedure for automatic depth extension)

A procedure for such automatic connection is shown in FIG. First, in step S3501, measurement is performed. Next, in step S3502, it is determined whether or not there is an area having a corresponding height within the depth search range. It is moved to a Z stage position where the area with the image is measurable. At this time, the already measured Z stage position is excluded. Also, if there are a plurality of candidate Z stage positions, it is moved to the closest position. Then, the process returns to step S3501 to repeat processing such as measurement. On the other hand, if it is determined in step S3502 that there is no region within the depth search range, the process advances to step S3504 to end the measurement.

In this way, height information within the depth search range and outside the depth measurement range is stored at each position of the Z stage 142 . As a result, even if the Z stage positions to be moved exist on both the upper and lower sides, they can be expanded in both the upper and lower directions. Also, by not moving to the Z stage position that has been measured once, it is possible to avoid the situation where the measurement becomes an infinite loop.

Such a procedure allows joint measurements covering all heights of the object to be measured. Moreover, since the measurement ends when the movement of the Z stage 142 is no longer necessary, the total time for the joint measurement is always the shortest.

Also, the upper limit height of the Z stage 142 can be set for automatic depth expansion. The upper limit height of the Z stage 142 is the maximum value of the Z stage position during automatic depth expansion, which is specified by the shape measuring device. may be automatically set by adding a margin of , or the user may be allowed to adjust the specified value or the automatically set value, or may be allowed to specify an arbitrary value. This makes it possible to avoid a situation in which the Z stage rises too much during automatic depth expansion, causing the object to be measured on the stage to collide with the lens.
(Modified example of optical system)

In the shape measuring apparatus according to the first embodiment described above, the light receiving unit 120 constituting the imaging unit is a monocular camera, and two light projecting units 110 are provided above the object to be measured to project light from left and right directions. Although the configuration has been described, the present invention is not limited to the configuration of the optical system, and other optical systems may be employed. For example, a monocular camera can be used as the light receiving unit, and the light projecting unit can project light from only one direction. Alternatively, a compound eye camera may be used as the light receiving unit instead of the monocular camera, and light may be projected from one direction.
(Modified example of measurement principle)

Further, in the shape measuring apparatus according to the first embodiment described above, the triangulation method of Gray code and multi-slit projection is used as the measurement principle for measuring the three-dimensional shape of the object to be measured. The measurement principle for measuring the three-dimensional shape of is not limited to this, and other methods can be used as appropriate. For example, a triangulation distance measurement method using sine wave projection, a triangulation distance measurement method using random pattern projection, and a triangulation distance measurement method using line light projection and scanning can be used.
(Modified example of moving mechanism for measuring object)

Furthermore, the shape measuring apparatus according to the first embodiment described above employs a configuration that directly moves the Z stage 142 as a mechanism for moving the Z stage 142. However, the present invention limits the mechanism for moving the object to be measured to this. However, other configurations can be used as appropriate. For example, a moving stage having six degrees of freedom of translation and rotation about each of the X, Y, and Z axes may be used, or automatic manual movement may be used.
(Modified example of working distance adjustment mechanism for measurement object)

Furthermore, the shape measuring apparatus according to the first embodiment described above employs a configuration in which the Z stage 142 is moved to adjust the working distance between the measurement object and the light receiving unit 120. The mechanism is not limited to this, and other configurations can be used as appropriate. For example, the light receiving section side may be moved.
(Example 2: Automatic depth expansion based on edge of single-height image)

In the above example, the procedure of automatic depth expansion for determining the necessity of depth expansion based on an accumulated image obtained by accumulating acquired pixels has been described. However, the present invention does not necessarily require accumulating past pixels during depth expansion and automatic concatenation in the height direction of the image. For example, it is also possible to determine whether depth expansion is necessary from a single height image. Such an example will be described below as a second embodiment. Here, as shown in FIG. 36, a height image is acquired within a certain depth measurement range. Then, it is determined whether or not the one obtained height image has three-dimensional shape data at the end of the depth measurement range, that is, at either the upper limit or the lower limit of the depth measurement range. For example, if the height image has three-dimensional shape data at one end, it is highly likely that the object to be measured extends outside the depth measurement range, and the depth measurement range is changed to perform height measurement. conduct. Then, even in the changed depth measurement range, it is similarly determined whether or not there is 3D shape data at the end, and if there is 3D shape data similarly, the depth measurement range is further changed and the process is continued. On the other hand, if there is no three-dimensional shape data at the end, processing in this direction is terminated, and it is determined whether or not there is three-dimensional shape data at the other end, and similar processing is performed. Then, if there is no three-dimensional shape data at both ends, the process ends. The above is just an example. For example, when solid shape data exists at both ends, the depth measurement range is expanded to one end and then expanded to the other end. good too. However, in this method, after extending the Z stage in the direction of one end, it returns to its original position and extends in the direction of the other end, which may increase the amount of movement of the Z stage. Therefore, as described above, it is preferable to once continue expansion in one of the vertical directions and then expand in the other direction.
(Example 3: Automatic depth expansion based on within a single height image)

Furthermore, the present invention is not limited to the method of determining whether or not to expand the depth measurement range based on whether or not the three-dimensional shape data exists at the end of the single height image described above. If there are pixels for which data can be measured, the depth measurement range may be extended. That is, in a height image acquired in a certain depth measurement range, if there is a pixel for which three-dimensional shape data can be measured in any one of the depth measurement ranges, it is estimated that the measurement object exists, and Continue depth expansion in the direction. With this method, determination can be made simply by including the three-dimensional shape data in the height image, so there is an advantage in that determination processing can be performed easily.
(Shape measurement program with automatic depth extension measurement function)

37 to 41 show examples of user interface screens of the shape measurement program for the automatic depth extension measurement function. The shape measurement program shown in these figures also has an image display area 410 and an operation area 420 . The image display area 410 is an area for displaying a texture image and a height image of the object to be measured. The operation area 420 is an area in which the user mainly instructs various operations, explains the operation contents, and guides the user. In the screens of FIG. 37 and the like, an image display area 410 is arranged on most of the screen from the left side, and an operation area 420 is arranged on the right side. Furthermore, above the image display area 410, an imaging setting area for performing magnification display, focus adjustment, etc. for the image displayed in the image display area 410 is provided as one form of an imaging setting unit for setting imaging conditions. 510 are arranged. Note that these arrangements are merely examples, and the arrangement and size of each member can be changed as appropriate.
(Observation mode switching unit)

Observation based on height images and observation based on texture images can be performed from the shape measurement program. Observation switching is performed from the observation mode switching unit. In the example of FIG. 37, a "3D measurement" tab 531 and an "image observation" tab 532 are provided in the operation area 420 as one form of the observation mode switching unit. Switching is possible. When the “3D measurement” tab 531 is selected, generation of a height image and observation such as measurement based on the generated height image are possible. On the other hand, when the "image observation" tab 532 is selected, observation such as measurement based on the texture image becomes possible.
(Full auto observation mode)

Here, in order to execute the automatic depth extension measurement function with the shape measurement program, the "Full Auto" button 533 is pressed from the screen of FIG. This selects the full-auto observation mode, that is, the automatic depth extension measurement mode. In the full-auto observation mode, extension in the depth direction is automatically performed, and a synthesized height image of the object to be measured displayed in the image display area 410 is obtained.
(manual observation mode)

On the other hand, in order to execute the manual depth extension measurement function with the shape measurement program, the "manual" button 535 is pressed from the screen of FIG. This selects the manual observation mode and enables manual expansion in the depth direction. An example of manual observation mode is shown in FIG. In the manual observation screen 540 shown in this example, the operation area 420 includes a "Z measurement range" designation field 541, a "measurement mode" selection field 542, a "measurement direction" designation field 543, a "measurement brightness" setting field 544, a "texture A photographing” selection field 545 is provided.
("Z measurement range" designation field 541)

The “Z measurement range” designation field 541 constitutes one form of the depth extension mode selection section 254 that selects the depth extension measurement mode. In this example, as shown in FIG. 38, the user can select any one of "automatic", "measurement", and "manual" from a drop box in the "Z measurement range" designation field 541. FIG. When "automatic" is selected from among these, an automatic depth extension mode in which depth extension measurement is automatically performed is entered. If "manual" is selected, a manual depth extension mode is entered in which the user manually performs depth extension measurement. On the other hand, when "measurement" is selected, measurement of a predetermined depth range is performed. In other words, without expanding the depth range, the height image is generated within a predetermined height range measurable by the shape measuring device. This corresponds to the above-described one-shot measurement function that performs one-time measurement with a fixed Z-stage height.

The “measurement mode” selection field 542 is one aspect of the measurement mode selection unit 257 that selects the measurement mode. The measurement mode enables measurement according to the purpose of observation by adjusting the imaging conditions of the fringe image captured when generating the height image, and a plurality of measurement modes are prepared in advance. A user selects a desired measurement mode according to the purpose of observation. In the "measurement mode" selection field 542, one of a plurality of measurement modes is specified. Here, as shown in FIG. 39, any one of "auto", "standard", "reflection/betrayal light removal mode", and "high definition (roughness)" can be selected from the drop box.

When "auto" is selected, an auto measurement mode is selected in which an appropriate measurement mode is automatically selected from among a plurality of measurement modes.

Selecting "Standard" selects the standard measurement mode, which is the standard measurement mode.

When "removal of reflection/sneaking light" is selected, a reflection/sneaking light removal mode suitable for removing reflection of projected light and sneaking light is selected. This measurement mode is also called a fine measurement mode or the like, and is a measurement mode in which the projection pattern of measurement light is made finer than in the standard measurement mode, and indirect light components such as sneak light, multiple reflections, and diffuse reflections are eliminated. This measurement mode is highly effective when the object to be measured is a translucent object such as cloudy resin or an uneven metal object such as a screw. The time required for measurement is longer than standard measurement mode.

Selecting "high definition (roughness)" selects a high definition mode that generates a higher definition height image, such as measurement of the roughness of the surface of the object to be measured.

Also, other measurement modes may be added. For example, the halation removal measurement mode is a measurement mode in which the projection pattern is the same as the standard, but the dynamic range is expanded by changing the exposure time or the projection light amount of the measurement light. As a result, it is possible to obtain the effect of suppressing crushed blacks and blown-out highlights in an object with a large difference in brightness. For example, it is effective for an object in which black resin is embedded in a metal body. The time required for measurement is longer than standard measurement mode. Furthermore, the super fine measurement mode is a combination of the above-described reflection/betrayal light removal mode and halation removal measurement mode, and can improve the accuracy the most, but the time required for measurement becomes the longest accordingly.

In the “measurement direction” designation field 543, the light projecting section 110 is designated. Here, either or both of the first light projecting section 110A and the second light projecting section 110B shown in FIG. 4 can be selected. In the example shown in FIG. 40 , one of “left side only”, “right side only”, and “both sides” can be selected from a drop box provided in the “measurement direction” designation field 543 .

If "left side only" is selected, the first light projecting section 110A in FIG. 4 is selected and light is projected only from the left side. If "right side only" is selected, the second light projecting section 110B in FIG. 4 is selected and light is projected only from the right side. If "both" is selected, the first light projecting section 110A and the second light projecting section 110B in FIG. 4 are selected, and light is projected from both sides.

The “measured brightness” setting field 544 adjusts the brightness of the image displayed in the image display area 410 . The brightness of the texture image can be adjusted, for example, by adjusting the exposure time and shutter speed of the light receiving unit 120, which is the imaging unit. In the "measurement brightness" setting field 544, it is possible to switch between auto brightness adjustment for automatically adjusting the brightness of the texture image and manual brightness adjustment for manual adjustment with a radio button. For example, if "AUTO" is selected as shown in FIG. 41, the image currently displayed in the image display area 410 is automatically adjusted to an appropriate brightness. Selecting "manual" allows the user to manually adjust the brightness of the image. Here, a slider is used to adjust the brightness of the texture image. Also, the brightness of the image displayed in the image display area 410 is reflected in real time in the brightness after being adjusted in the “measured brightness” setting field 544 .
(Texture image selection means 460)

A texture image to be photographed is selected in the “texture photographing” selection field 545, which is one form of the texture image selection means 460. FIG. Here, "normal" and "HDR" can be selected with radio buttons. Selecting "Normal" sets the camera to take normal texture images. On the other hand, selecting "HDR" selects to capture an HDR image. Also, other texture images may be selectable. For example, a depth composite image may be selectable.
(Example 3: Manual depth extension)

In the above example, an example of automatically performing depth expansion and joint measurement has been described. However, the present invention is not limited to a configuration in which depth expansion is automatically performed, and this can also be performed manually. A procedure for manually performing depth extension using this manual depth extension function and generating a synthetic height image from a plurality of height images with different heights is based on the flowchart of FIG. 42 and FIGS. 43A to 43G. explain. First, in step S4201, an optical image of an object to be measured for which a composite height image is to be obtained is displayed. Here, the user is caused to place the object to be measured on the Z stage 142 , acquire an optical image, and display it on the display unit 400 . As an example, FIG. 43A shows an optical image A displaying a measurement object. At this time, the focus position may be adjusted by the user or automatically. Alternatively, the focal position may not be adjusted. As a method of automatically adjusting the focal position, for example, when a mouse is clicked at a desired position on the optical image, autofocusing is performed so that the designated position is brought into focus.

Next, in step S4202, the position where the height image is desired to be acquired is designated as the height designation position. Here, on the optical image displayed on the display unit 400, the user designates a height designation position where the height image is desired to be acquired using the operation unit. At this time, since the optical image is a two-dimensional image, the height designation position is designated on the XY plane. For example, when a desired position is clicked on the display unit 400, the Z coordinate position of this XY position is recorded as the height designation position. Also, autofocus may be automatically executed with the specified height position as a reference. As a result, the optical image at the specified height position can be displayed more clearly.

Next, in step S4203, a height image is generated at the specified height specified position. For example, the user presses a height image generation button on the user interface screen of the shape measurement program. As a result, the shape measuring device acquires height information (Z coordinates) at the designated height designation position (XY coordinates), and based on this height, generates a height image in a predetermined depth measurement range. As an example, FIG. 43D shows a height image D obtained at the height specified position specified on the optical image A of FIG. 43A. Note that the height image D does not necessarily have to be displayed on the display section, and may be hidden. The process can be performed in the background without requiring the user to be aware of the intermediate height image generation work. However, the height image D may be displayed for the user to confirm. Also, the generated height image D is temporarily stored for use in the process of generating a synthetic height image, which will be described later.

It should be noted that when the specification of the height specification position is received in step S4202, the generation of the height image in step S4203 may be automatically executed. As a result, it is possible to save labor for the operation on the user side. For example, autofocus is activated by single-clicking an arbitrary position on the optical image, and height image acquisition processing is executed by double-clicking. As a result, the user can adjust the focal position, designate the designated height position, and generate the height image with a small number of operations.

Next, in step S4204, it is determined whether or not another height designation position is to be designated. That is, it is determined whether or not a necessary number of height images have been obtained in order to synthesize height images generated at different heights. Here, the shape measuring apparatus accepts an instruction from the user to designate another height designation position or finish designation of the height designation position and proceed to generate a synthetic height image.

If the user wants to add a height image, that is, if he/she wants to further specify another height specification position, the process returns to step S4202 and another height specification position is specified. At this time, the height designation position is designated on the same image as the optical image in which the height designation position has already been designated. In other words, it does not change the field of view of the optical image. This is because it is necessary to acquire height images of different heights for the measurement target having the same posture in order to generate a synthetic height image. If it is desired to change the field of view of the optical image, the process returns to step S4201 to redo the display of the optical image.

Moreover, when specifying another height specification position, it is necessary to specify a different height on the optical image from the height of the already specified height specification position. Therefore, it is preferable to change the focal position of the optical image. At this time, the user may manually adjust the focal position, or the focal position may be adjusted automatically. For example, as described above, a method is available in which the user clicks on the desired location on the optical image and autofocus is performed at the specified location. As an example, FIG. 43B shows an example of an optical image B in which a position higher than the height designation position designated in FIG. 43A is designated as the height designation position for the same measurement object as in FIG. 43A. FIG. 43C shows an optical image C adjusted to a higher focus position than in FIG. 43B. Further, FIG. 43E shows the height image E generated at the height designation position designated in FIG. 43B, and FIG. 43F shows the height image F generated at the height designation position designated in FIG. 43C.

Thus, the user needs to acquire multiple height images in different height ranges so as to include the entire height range of the object to be measured. Preferably, among different heights of the object to be measured, it is preferable to sequentially designate the height designation positions from a low position to a high position or from a high position to a low position. In order to appropriately designate such a plurality of different height designation positions, for example, the height information of the designated height designation positions is displayed in the designated height designation position display column on the display unit 400, and the height designation is performed. The list of height information may be updated each time a position is added.

When an additional height designation position is designated in this way, the flow similarly advances to step S4203 to generate a height image at the designated height designation position and temporarily save it. Then, in step S4204, it is similarly determined whether additional height designation positions are required.

When the user determines that all necessary height images have been obtained in this manner, the process advances to step S4205 to instruct generation of a synthetic height image. Here, the shape measuring device synthesizes a plurality of obtained height images in the depth direction, and the synthesis processing unit 216 generates a synthesized height image having a wider depth range. As an example, FIG. 43G shows a synthesized height image G obtained by synthesizing the height image D of FIG. 43D, the height image E of FIG. 43E, and the height image F of FIG. 43F. In this way, a plurality of height images are combined to obtain a height image of a height range wider than the height range physically measurable by the shape measuring device.

Further, the procedure of manual depth expansion described above may be provided with a guidance function so as to guide the procedure to be performed by the shape measuring device to the user. For example, when manual depth extension is executed with a shape measurement program, the action to be performed can be displayed on the display unit to guide the user in the procedure to be performed. With this method, even a user who is not familiar with the operation of the shape measuring apparatus can easily generate a synthetic height image by presenting and guiding the operation to be performed.
(Automatic image XY connection function)

Further, according to the shape measuring apparatus according to the present embodiment, when connecting images in which three-dimensional shape data such as height images are connected in the XY directions, the measurement setting for generating each three-dimensional shape data is individually adjusted. Adjustment work can also be automated. For example, when connecting images in the XY plane, which is a plane orthogonal to the optical axis direction of the light receiving unit, an image captured at a low magnification as shown in FIG. Consider a case in which this wide-area image is divided into a plurality of partial areas, and height images, which are three-dimensional shape data generated in each partial area, are connected in the XY directions to generate a composite height image. In such image connection processing on the XY plane, it is necessary to set measurement settings for performing measurement when generating height images in order in each partial area. Here, if the measurement setting is made common to each partial area, it may not be possible to obtain a high-precision image. For example, if the object to be measured is partially made of a different material, the projected pattern light may be reflected multiple times on a glossy surface such as metal, or the pattern light may sink into the translucent resin part. Therefore, the correct height image may not be obtained by normal measurement. In this case, it is necessary to measure the height image with measurement settings suitable for multiple reflections and light penetration. time consuming. For this reason, if height images are generated with the same measurement settings for all partial areas, the total time required will be long. Similarly, if the object to be measured contains a large uneven area and a flat area, it is necessary to repeat imaging at different heights by driving the Z stage in the depth direction in areas with uneven height differences. At some point, repeating imaging at different heights in a flat area increases wasteful operations and takes time. It is also conceivable that the user manually sets appropriate measurement settings individually for such various partial regions, but there is a problem that this work is very time-consuming.

Furthermore, on the other hand, the 3D shape data after measurement for each partial region is displayed to the user, and if the user wishes to redo the shape measurement of the partial region, the measurement setting is changed and the measurement is carried out again. Once the measurement results are obtained, a method of replacing them with newly obtained three-dimensional shape data is also conceivable. However, even in this case, the user has to check the measurement results one by one and judge the necessity of re-measurement, which is troublesome. In addition, it may not be possible to easily determine how to change the measurement settings to obtain the desired measurement results, further complicating the work.

Therefore, in the present embodiment, by automating the measurement setting adjustment work when generating synthetic 3D shape data by XY-linking 3D shape data such as height images, a 3D shape with a wide field of view can be easily obtained. It is possible to obtain data. In other words, setting conditions can be individually and automatically adjusted for a plurality of partial regions, thereby reducing the user's burden. In particular, the partial area measurement settings are adjusted to appropriate conditions based on the received light data and the three-dimensional shape data once acquired, and, if necessary, the three-dimensional shape data are generated again with the adjusted measurement settings for each partial area. 3D shape data with higher quality or higher accuracy can be obtained. In addition, by saving the measurement settings for each partial area adjusted for each partial area, when inspecting the same measurement object, by reading this and using it as the measurement settings, the process of automatic adjustment of the measurement settings can be reduced. The process can be simplified by omitting it.
(Measurement setting automatic adjustment unit 217)

Such automatic adjustment of measurement settings is performed by the measurement setting automatic adjustment unit 217 shown in FIG. When connecting the XY images, the measurement setting automatic adjustment unit 217 automatically adjusts the partial area measurement settings, and also automatically adjusts the measurement settings set by the user in the measurement setting unit 255. Or conversely, the user may adjust the measurement settings automatically adjusted by the measurement setting automatic adjustment section 217 using the measurement setting section 255 . Also, in the automatic setting, the measurement setting set as the initial value on the shape measuring device side can be adjusted by the measurement setting automatic adjustment unit 217 to be the adjusted measurement setting. In this manner, the measurement setting automatic adjustment unit 217 may fully automatically adjust the measurement setting for generating the three-dimensional shape data such as the height image, or semi-automatically by combining the setting by the user. Note that the measurement setting unit 255 is a member for the user to manually set initial measurement settings. However, the measurement setting unit 255 may be a member for inputting initial setting values of measurement settings prepared in advance on the shape measuring apparatus side. The measurement settings for each partial area are partial area measurement settings specified by the user, initial set values prepared on the device side, and conditions automatically adjusted by the measurement setting automatic adjustment unit 217 .
(reflected light, lurking light removal mode)

Here, a measurement mode will be described in which measurement is performed with a measurement setting that removes reflected light or slipping light when they exist. For example, as shown in FIG. 45, when a measurement object having a translucent resin diffusion plate is measured with a general measurement setting, that is, pattern light is projected and a fringe image is generated. An example height image is shown in FIG. 46A. As shown in this figure, in the normal scan mode, the semi-transparent diffusion plate portion cannot be measured well due to the effect of lurking light, resulting in a state in which the height image data is missing. On the other hand, FIG. 46B shows an example of a height image measured with the measurement mode set to the reflection/penetrating light removal mode. As described above, in the reflection/sneaking light elimination mode, the indirect light component is reduced by making the projection pattern of the measurement light finer than usual. As a result of the measurement in the sneaking-in light removal mode, as shown in the figure, it can be seen that the semi-transparent diffusion plate portion can be measured in a considerable portion.

However, such a special measurement mode requires longer processing time than usual. For this reason, measuring in all partial areas or all XY positions in the lurking light elimination mode would result in a long measurement time. Therefore, the measurement time can be shortened by using this measurement mode only for areas where there is a large amount of lurking light and multiple reflected light. In the above example, the height image is once generated in the standard measurement mode, and the partial area measurement setting is reset by the measurement setting automatic adjustment unit 217 in the partial area where the missing area occurs as shown in FIG. 46A. Then, by regenerating the height image and replacing it, it is possible to obtain a height image with few missing portions as shown in FIG. 46B.

Similarly, for areas with large elevation differences of the object to be measured, the depth range is extended for measurement, while for areas with small elevation differences, measurement is performed with a limited depth range, thereby shortening the measurement time. Efficient measurement processing. For example, in the examples of FIGS. 46A and 46B, it takes time to measure the height range of the measurement object (the range indicated by the arrows in the figure) at all XY positions, but only the outer shell region of the measurement object ( While performing the depth extension measurement mode for the partial area located around the connected area in 44), the Z range extension is not performed for the other partial area (the partial area located inside the connected area in FIG. 44). , the measurement time can be shortened.
(Distinction between penetrating light and voids)

In the automatic selection of the measurement mode, the automatic measurement setting adjustment unit 217 determines whether the missing part of the height image is caused by lurking light or the shape itself is missing in the first place. Distinguish between things and things (such as voids and holes). In other words, if it is determined that the lurking light is the cause, re-measurement is performed with the partial area measurement setting changed, but if it is determined that it is a void, re-measurement is not performed. An example of such determination method will be described with reference to FIGS. 47A to 47D. In these figures, FIG. 47A is an image diagram of a striped image of a certain measurement object, FIG. 47B is the luminance profile of the metal portion of the measurement object in FIG. 47A, FIG. 47C is the luminance profile of the hole portion, and FIG. indicate the luminance profile of the white resin portion, respectively. Regarding the metal part shown in FIG. 47B, a clear peak appears in the luminance profile, and it is understood that the height information can be measured correctly. On the other hand, the hole portion in FIG. 47C and the white resin portion in FIG. 47D are both black on the striped image, and pattern light is not obtained. However, in the hole portion of FIG. 47C, the base portion of the brightness profile is almost zero, whereas in the resin portion of FIG. 47D, a constant displacement (brightness) is obtained in the base portion. In this way, in both FIG. 47C and FIG. 47D, almost no peak is obtained on the luminance profile, but depending on whether or not the luminance signal is obtained in the base portion, whether the shape does not exist or whether the luminance is due to the penetration of light. is not obtained can be distinguished by the measurement setting automatic adjustment unit 217 .
(Procedure of automatic image XY connection processing)

Here, the procedure of automatic image XY connection processing for generating synthetic three-dimensional shape data will be described with reference to the flowchart of FIG. First, in step S4801, the position of stage 140 is initialized. Here, the stage 140 is assumed to be an electric XY stage.

Next, in step S4802, the object to be measured is placed on the XY stage. In this state, an optical image is displayed on the display unit, the magnification is adjusted (step S4803), and the focus position is adjusted (step S4804). These procedures may be interchanged as appropriate.
(Create map image)

Next, in step S4805, a map image is created. A map image is a wide-area image having a field of view similar to that of the desired synthetic three-dimensional shape data. A method of spirally moving the XY stage, a method of automatically moving the field of view, or the like can be used to create the map image.
(Spiral map image creation method)

Here, a method for spirally moving the XY stage will be described with reference to FIGS. 49A to 49C. First, the user designates the initial position. Here, as shown in FIG. 49A, part of the object to be measured is displayed on the display unit. It is preferable to set the initial position near the center of the object to be measured. After the initial position is determined in this way, when the user instructs the start of spiral map image creation, the field of view is automatically moved around the initial position, and the optical images of the moved field of view are sequentially displayed. being photographed. For example, as shown in FIG. 49B, the field of view is moved downward from the initial position to acquire an optical image, and further moved to the left to capture an optical image. In this manner, the field of view is sequentially moved in a spiral manner, and an optical image is captured at each position. Here, the XY stage is moved by the stage plane direction driving section 148 so that the field of view is moved clockwise around the initial position. In this way, the field of view is gradually expanded and the map image is created. While looking at the display unit, the user gives an instruction to end the spiral map image creation process when the desired field of view of the object to be measured is obtained. For example, by pressing a stop button, the spiral map image creation process is terminated. Thus, a spiral map image is created.
(Specification of XY connecting area)

Next, in step S4806, an XY-connected area to be XY-connected is designated. Here, a method of specifying an automatic image XY connection area for automatically connecting images is selected. A manual specification method and an automatic specification method can be used for the XY-connected region. 50A to 50C show an example of a method for manually setting the XY connected area. In these methods, the start point and end point of the automatic XY connected area are set manually. For example, in the example of FIG. 50A, the start point and end point of the automatic XY connected area are set. Specifically, the positions of the start point (left end/upper end) and end point (right end/lower end) of the XY connected area are specified while checking the image displayed on the screen. Alternatively, as shown in FIG. 50B, it may be specified by "start point" and "length". In this example, the position of the start point (left end/top end) of the XY connected area is determined, and the vertical and horizontal lengths of the area are specified therefrom. Alternatively, as shown in FIG. 50C, "starting point" and "number of sheets" may be specified. In this example, the position of the start point (left end/top end) of the XY connected area is determined, and the number of images to be measured and connected vertically and horizontally from there is specified.

FIG. 51 shows a method for automatically setting the XY connected area. In this example, the shape measuring device uses image processing to determine the outer edge of the object to be measured as an edge area, and automatically determines an XY connected area so that this edge area is interpolated.
(Automatic setting method of XY connecting area)

As a method of automatically setting such an XY connected region, for example, a method of photographing a map image before measurement and determining the XY connected region and then starting measurement, or a method of starting measurement while analyzing three-dimensional shape data during measurement For example, a method of determining a connecting region can be used. These methods will be described based on the flow charts of FIGS. 52 and 53. FIG.

First, a method of starting measurement after determining the XY connected region in the map image will be described with reference to the flow chart of FIG. First, in step S5201, a texture image of the object to be measured is captured at the current position on the stage 140. FIG. Next, in step S5202, this texture image is converted into a binary image in which only the outline portion of the object to be measured is extracted. Then, the contours of the stage surface and the object to be measured are extracted. Next, in step S5203, it is determined from the binarized image which side of the object to be measured extends vertically and horizontally, and the XY stage is moved in that direction. Then, in step S5204, it is determined whether or not a texture image of the entire measurement object has been obtained, and if not obtained, steps S5201 to S7303 are repeated.

If the texture image of the entire object to be measured has been obtained, the flow advances to step S5205 to extract the edge portions of the object to be measured and the stage surface from the map image, and automatically set an XY connected area that accommodates them. Furthermore, in step S5206, the user confirms the set area before starting measurement, and sets an exclusion area if necessary. Finally, in step S5207, measurement is started within the XY connected area thus defined.

Next, a method for setting the XY connected region while analyzing the three-dimensional shape data during measurement will be described with reference to the flow chart of FIG. First, in step S5301, the measurement object is measured at the current position of the stage 140. FIG. A texture image is captured here. Next, in step S5302, the texture image is converted into a binary image in which only the contour portion of the object to be measured is extracted. Then, in step S5303, from this binarized image, it is determined in which plane, up, down, left, or right, the object to be measured extends, and the XY stage is moved in that direction. Furthermore, in step S5304, it is determined whether or not the texture image of the entire measurement object has been captured. If not, the process returns to step S5301 to repeat the above operations. In this way, a texture image of the entire measurement object is captured. In this example, the method of setting the XY connected region based on the texture image has been described, but the method is not limited to this, and it is also possible to determine the XY connected region by analyzing three-dimensional shape data such as a height image. .

In this way, the XY connected area is automatically set. Returning to the screen of FIG. 51, the optical image is displayed in the image display area with the magnification adjusted so that the entire view of the object to be measured is displayed. Also, a rectangular XY connected area to be image connected is shown superimposed on the object to be measured. Furthermore, the XY connected area is divided into a plurality of partial areas and displayed in a grid. In this example, an automatically calculated XY connected area is automatically divided into partial areas. Further, in this state, the user may change the settings as necessary while confirming the displayed measurement object, XY connected area, and partial area. In the example of FIG. 51, the vertical and horizontal sizes and the number of partial areas are displayed in the operation area corresponding to the partial areas displayed in the image display area, and the user can adjust these values. In addition, it is also possible to display the procedure to be performed by the user in the operation area and guide the user to the setting. In this example, the "measurement area setting" is "Adjust the position and size of the rectangle so that the range you want to measure fits within the frame. You can also set by specifying the size and number of sheets." Is displayed.

Also, a mask area may be set in which no measurement is performed. In the example of FIG. 51, as the mask area setting part, a check box for "set connection exclusion area" is provided in the display area. In addition, as an explanation of the mask area setting section, a text is displayed that reads, "A portion that does not need to be measured is set as an exclusion area."

In particular, it is not necessary to include the entire area of the object to be measured in the XY connected area. It suffices if the three-dimensional shape data can be acquired only for the portion of interest on the object to be measured. Therefore, it is possible to efficiently perform shape measurement by setting a partial area only in a necessary area or setting a mask area in an area where measurement is unnecessary.

Also, in this specification, for convenience of explanation, an example in which the XY connected region is divided into a plurality of partial regions has been described, but the division is not necessarily required. A specified configuration may be used. Thus, in this specification, a plurality of measurement target areas are collectively referred to as XY-connected areas, and a subset of the XY-connected areas is referred to as a partial area.

In a state in which the XY connected area is set in this way, the measurement setting for measuring the three-dimensional shape data is set. Here, as shown in FIG. 45, the depth extension measurement mode for determining the presence or absence and range of extension in the depth direction is selected by the depth extension mode selection unit 254, and the measurement mode is selected as shown in FIG. As shown in FIG. 47, the measurement direction by the light projection unit 110 is selected by the measurement direction designation unit, and furthermore, as shown in FIG. Set the brightness in the measurement brightness setting section.

With the measurement settings set in this way, the connection measurement is started in step S4808. Here, the user's depression of the "measurement" button is accepted. Then, in step S4809, measurement is performed to generate three-dimensional shape data, and a texture image is captured.

Next, in step S4810, it is determined whether or not there is an area within the depth search range, and if there is, the process advances to step S4811 to move the Z stage to a height position at which the area within the depth search range can be measured. At this time, height positions that have already been measured are excluded. If there are multiple height positions, move to the nearest height position. Then, the process returns to step S4809 to repeat the process.

On the other hand, if there is no area within the depth search range, the flow advances to step S4812 to determine whether or not all synthetic image data within the connected area has been generated. If not yet, that is, if there is an unmeasured partial area, the XY stage is moved to the partial area in step S4813, and the process returns to step S4809 to repeat the process.

When it is determined that all synthetic height image data within the connected region have been generated after the measurement of each partial area is completed, the generated synthetic height image is displayed in step S4814.

In this way, it is possible to generate a wide-area synthetic height image by XY-concatenating the synthetic height images.
(Automatic adjustment of partial area measurement settings)

On the other hand, when generating such a wide-area composite height image, it is also possible to automatically adjust partial area measurement settings for each partial area. A procedure for generating such a wide-area composite height image will be described with reference to the flowchart of FIG. First, in step S 5401 , an object to be measured is placed on the stage 140 . Next, in step S5402, a map image is created. Furthermore, in step S5403, a continuous area is set. The operations up to this point are the same as steps S4801 to S4806 in FIG. 49 described above, and detailed description thereof will be omitted.

Next, in step S5404, the XY stage is moved to a predetermined partial area. Here, the XY stage is moved to the partial area where the three-dimensional shape data is first generated by the planar direction driving section.

Next, in step S5405, measurement settings are made for this partial area. Here, the initial values of the measurement settings are set for the partial regions for which the three-dimensional shape data are to be generated first. These measurement settings can be set by designating initial setting values in advance on the side of the shape measuring device, by automatically analyzing the measurement setting automatic adjustment unit 217 from the optical image of the partial region, or by manually setting the measurement settings by the user. good.

Next, in step S5406, measurement is performed. Here, the three-dimensional shape data generation unit generates three-dimensional shape data, and the texture image acquisition unit 218 captures a texture image.

Next, in step S5407, the partial region measurement settings are automatically adjusted. Here, the measurement setting automatic adjustment unit 217 changes the partial area measurement setting to the measurement setting of the partial area as necessary. Then, in step S5408, it is determined whether or not it is necessary to perform measurement again with the measurement setting of the partial area. Note that it is not necessary to recapture the texture image. Here, the determination of the necessity of remeasurement is made, for example, when the measurement setting automatic adjustment unit 217 determines that the partial area measurement setting is appropriate and has not been changed, it is determined that remeasurement is not necessary.

After the measurement has been performed in this way, the process advances to step S5409 to determine whether or not there is an unmeasured partial area. Measurements are carried out in the same way.

When the measurement of all the partial regions is completed, the process advances to step S5410 to synthesize the obtained three-dimensional shape data to create synthetic three-dimensional shape data.

In this way, it is possible to automatically adjust the partial area measurement settings, perform remeasurement as necessary to reacquire 3D shape data, and finally obtain wide-field synthetic 3D shape data with high quality. .
(Editing of XY connection measurement setting)

Also, after the joint measurement is completed, the user can check the measurement result. For example, it is possible to visually confirm whether or not a desired result is obtained by displaying the obtained wide area composite height image on the display unit. Moreover, if necessary, it is possible to change the divided measurement setting in each partial area and repeat the measurement. At this time, the partial area measurement settings can be re-edited.

Also, a wide-area composite height image can be regenerated using height images obtained by re-measuring only a partial area.

Furthermore, by storing the measurement settings for each partial area in the measurement setting storage unit 243, the measurement settings can be reused when performing an examination. For example, when performing a non-defective product inspection to check the difference between the measurement object of the reference product and the measurement object of the reference product, each partial area from the measurement object of the reference product is required so that accurate results can be obtained in a short time during the operation of the inspection. The task of setting up the measurement settings for the measurement can take longer. This makes it possible to perform quick and highly accurate measurements during inspection operations.
(continuous measurement mode)

In this case, the three-dimensional shape data generator can switch between the normal measurement mode and the continuous measurement mode. The normal measurement mode is a measurement mode in which the measurement setting automatic adjustment unit 217 changes the partial region measurement settings for each partial region to generate three-dimensional shape data as described above. On the other hand, the continuous measurement mode is a measurement mode in which partial area measurement settings prestored in the measurement setting storage unit 243 are read for each partial area to generate three-dimensional shape data. In other words, in the continuous measurement mode, the partial area measurement settings are not automatically adjusted, and the saved partial area measurement settings are read and used, thereby shortening the processing time.

For example, let us consider the case of measuring an object having projections on its surface as shown in the side view of FIG. The protrusions have different colors, and a translucent resin portion is provided on part of the surface of the object to be measured. Consider an example in which partial areas A to D are set for such an object to be measured. In this case, partial area measurement settings for each partial area are set in advance and saved as shown in FIG. For example, since the color of the material is different between the partial area A and the partial area B, different exposure levels (exposure time and intensity of the measurement light) make it easier to express the contrast of each fringe pattern. In addition, in the partial area B, lurking light is generated, so the measurement mode is set to the reflection/clinging light elimination mode (fine mode). Furthermore, since the partial area D has a large difference in elevation, the Z measurement range is expanded so as to use the depth extension measurement mode. In this way, the measurement settings suitable for each partial area are set and saved in advance, and in the continuous measurement mode in which many measurement objects are inspected, the automatic adjustment of the measurement settings is omitted and the saved measurement settings are saved. is read out and used, it is possible to perform highly accurate measurement and inspection while shortening the processing time.
(Induction part)

In the continuous measurement mode, it is necessary to adjust the position and orientation of the object to be measured as seen from the imaging means to be the same as the reference orientation, which is the position and orientation when the saved partial area measurement settings are set. be. For this reason, a guiding section may be provided to prompt the user to place the measurement target in the same position and orientation as the reference orientation. The guidance unit outputs a guidance message on the display unit, for example, to the user to place the measurement object in the same position and orientation as the reference orientation when placing the measurement object on the stage 140 .
(Measurement target position/orientation detector)

In addition, a measurement object position/orientation detection unit that detects the position and orientation of the measurement object placed on the stage 140 may be provided. The position and orientation of the measurement object detected by the measurement object position and orientation detection unit may be adjusted by driving the plane direction driving unit based on the position and orientation of the measurement object.
(Positioning jig)

Alternatively, a positioning jig may be used to physically regulate the position and orientation of the object to be measured. Using the positioning jig, the position and orientation of the measurement object placed on the stage 140 match the position and orientation of the measurement object at the time of acquisition of the measurement settings for the partial region stored in the measurement setting storage unit 243. Let

INDUSTRIAL APPLICABILITY The shape measuring apparatus of the present invention can be suitably used for microscopes, measuring instruments, inspection apparatuses, and digitizers that utilize the principle of triangulation.

100, 100C... Imaging means 101... Upper head 102... Lower head 110... Light projecting part; 110A... First light projecting part; 123... Lens 116... Right and left projection lens 120... Light receiving unit 120A... Low-magnification imaging element; Output unit 140 Stage 140b Base hole 141 XY stage 142 Z stage 143 θ stage 144 Stage operating unit 144C Imaging system operating unit 145 Stage driving unit 145C Imaging system driving units 146, 146C ... optical axis direction driving section 147 ... scale cover 148 ... stage plane direction driving section 149 ... base housing 150 ... measurement control section 151 ... base section 151b ... base side hole section 152 ... stage support section 160, 160X ... scale unit 161, 161X... Sensor moving part 162, 162X... Scale part 163... Spherical body 164... Plate material 165... Plate member 166... Plating 167... Holding part; 167 b... Stepped part 168... Hook member; Reference Signs List 170 Linear motion mechanism 171 Linear guide 172 Shaft 173 Ring portion 174 Sub-guide 175 Magnet 176 Hole portion 200 Control means 210 CPU
212... Stereoscopic shape data generation unit 212b... Height image generation unit 212c... Shape measurement processing unit 213... Three-dimensional image synthesis unit 214... Judgment processing unit 215... Depth extension processing unit 216... Synthesis processing unit 217... Measurement setting automatic adjustment unit 218... Texture image acquisition unit 219... Three-dimensional shape data connection unit 220... ROM
230... Working memory 240... Storage unit 241... Height image storage unit 242... Texture image storage unit 243... Measurement setting storage unit 250... Setting unit 251... Position designation unit 252... End condition setting unit 253... Depth range setting unit 254 Depth extension mode selection unit 255 Measurement setting unit 256 Connection area setting unit 257 Measurement mode selection unit 300 Light source unit 310 Control board 320 Observation illumination light source 400 Display unit 410 Image display area 416 First Display area 417 Second display area 420 Operation area 427 Observation image button 428 Measurement image button 450 Operation device 490 Observation image imaging condition setting means 500, 500B, 500C Shape measuring device 510 Imaging Setting area 511 Camera adjustment field 512 Camera selection field 513 Magnification setting field 514 "Camera setting" button 515 Focus setting field 516 Focus adjustment field; 516b Focus position display field 517 "Autofocus" button 519 Maintenance setting column; 519b..."Measurement adjustment" button 531..."3D measurement" tab 532..."Image observation" tab 533..."Full auto" button 535..."Manual" button 540...Manual observation screen 541..."Z measurement range" Designation field 542 -- "Measurement mode" selection field 543 -- "Measurement direction" designation field 544 -- "Measurement brightness" setting field 545 -- "Texture photography" selection field WK, WK2 -- Measurement object S1 -- First measurement image; S2 ... Second measurement image CHI ... Synthetic height image HIA, HIB, HIC ... Height image OL1, OL2 ... Overlapping area HT1, HT2, HT3, HT4 ... Depth measurement range IG1, IG2, IG3, IG4 ... Image

Claims (12)

a stage on which the object to be measured is placed;
a light projecting unit that irradiates light onto an object to be measured placed on the stage;
a light-receiving unit having a predetermined imaging field of view, receiving the light emitted from the light-projecting unit and reflected from the object to be measured, and outputting received light data;
a shape measurement processing unit that measures the surface shape of the object to be measured based on the received light data received by the light receiving unit;
a base housing connected to the stage;
a stage support extending forward from the base housing for supporting the stage;
an optical axis direction driving unit that is housed in the base housing and moves the stage support unit together with the stage along the optical axis direction of the light receiving unit;
a sensor moving unit that moves together with the stage support unit on an optical axis extension line extending the optical axis downward from the stage, or on a straight line parallel to the extension line within the imaging field of the light receiving unit ;
a scale unit supported by the base housing for detecting the position of the sensor moving unit;
A shape measuring device comprising:
A shape measuring apparatus configured to detect a relative distance between the stage and the light receiving section in the optical axis direction of the light receiving section by moving the sensor moving section along the scale section. The shape measuring device according to claim 1 , further comprising:
an upper head housing the light projecting section and the light receiving section;
A base part installed on the floor surface,
The shape measuring device, wherein the base housing is configured to connect the base portion and the upper head. The shape measuring device according to claim 1 or 2 ,
A shape measuring apparatus in which the stage supporting portion has a stage-side hole formed in its bottom surface into which the scale portion can enter. The shape measuring device according to any one of claims 1 to 3 ,
A shape measuring device in which the sensor moving section and the scale section constitute a unit-like scale unit. The shape measuring device according to any one of claims 1 to 4 ,
A shape measuring apparatus in which a connecting portion connecting the sensor moving portion to the stage support is connected by magnetic force. The shape measuring device according to claim 5 ,
A shape measuring apparatus in which one connecting portion between the sensor moving portion and the stage support is a spherical body and the other is a flat plate. The shape measuring device according to claim 6 ,
The spherical body is a magnetic body on the stage support side,
A shape measuring device in which the sensor moving part is formed of the plate material made of a permanent magnet. The shape measuring device according to claim 7 ,
A corrosion-resistant plate member is arranged on an upper surface of the plate member at a connecting portion between the sensor moving portion and the stage support,
A shape measuring device in which the spherical body is magnetically connected to the upper surface of the plate member. The shape measuring device according to any one of claims 1 to 8 ,
The sensor moving unit is connected to the stage side,
A shape measuring device in which the scale portion is fixed to the base housing side. a stage on which the object to be measured is placed;
a light projecting unit that irradiates light onto an object to be measured placed on the stage;
a light-receiving unit having a predetermined imaging field of view, receiving the light emitted from the light-projecting unit and reflected from the object to be measured, and outputting received light data;
a shape measurement processing unit that measures the surface shape of the object to be measured based on the received light data received by the light receiving unit;
a base housing connected to the stage;
a stage support extending forward from the base housing for supporting the stage;
an optical axis direction driving unit that is housed in the base housing and moves the stage support unit together with the stage along the optical axis direction of the light receiving unit;
a scale portion that moves together with the stage support portion on an optical axis extension line extending the optical axis downward from the stage, or on a straight line parallel to the extension line within the imaging field of the light receiving portion;
a sensor moving unit supported by the base housing for detecting the position of the sensor moving unit;
A shape measuring device comprising:
A shape measuring apparatus configured to detect a relative distance between the stage and the light receiving section in the optical axis direction of the light receiving section by moving the sensor moving section along the scale section. The shape measuring device according to any one of claims 1 to 10 ,
The sensor moving part is an encoder that detects the movement distance by counting the number of times that marks indicating positions provided at equal intervals on the scale part are read when the sensor moving part is moved along the scale part. measuring device. The shape measuring device according to any one of claims 1 to 11 ,
A shape measuring apparatus according to claim 1, wherein the shape measurement processing unit measures the height of the object to be measured based on the relative distance between the stage and the light receiving unit detected by the sensor moving unit.

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