JP7097446B2 - Partition panels, partition walls and room structures - Google Patents

Description

The present invention relates to a partition panel, a partition wall and a room structure.

Conventionally, in a building, a fire prevention section is provided for each predetermined area (area section) or at the boundary of rooms for different purposes (different purpose section) such as the boundary between a warehouse and a cargo handling room, and an internal fire spreads in the event of a fire. Is being prevented. Of the walls that make up a building, the partition walls that make up a fireproof partition wall are required to have a fire resistance of one hour according to the Building Standards Act.

By the way, due to the recent expansion of distribution demand, freezing and refrigerating warehouses are becoming larger, but since these buildings are also subject to fire protection compartments, it is necessary to partition them with partition walls. However, in addition to having both fire resistance and heat insulation, the partition wall needs to be long in order to be continuous from the fire resistant floor to the fire resistant roof, which also increases the selection of materials. It was difficult. Therefore, conventionally, a room that becomes a freezing and refrigerating warehouse has been constructed by once partitioning with a partition wall such as lightweight cellular concrete having fire resistance and then using heat insulating panels such as metal sandwich panels on both sides of the wall.

However, in this case, since the air conditioning temperature is different between the heat insulating panel and the partition wall serving as the fire protection section, dew condensation is likely to occur on the surface of the heat insulating panel, and these spaces are narrow and difficult to clean. There is a problem that mold and insects are easily damaged. Therefore, in order to suppress such harm, there has been a demand for a partition wall that has both fire resistance and high heat insulating properties and can be used for a long time.

Conventionally, as a building panel, a core material made of rock wool is sandwiched between metal plates and bonded (see, for example, Patent Document 1). However, although building panels made of rock wool as a core material have high fire resistance, their heat insulating performance is insufficient as a partition wall of a freezing and refrigerating warehouse.

In order to use a partition wall made of rock wool as a core material as a freezing and refrigerating warehouse, not only is the wall thickness extremely thick due to the heat insulating properties of rock wool, but also rock wool has high permeability of water vapor and gas. It has even greater hygroscopicity and water absorption. Therefore, internal dew condensation is likely to occur, and water vapor and water once entered inside the wall move freely inside the wall, causing great damage and making repair difficult.

Further, Patent Document 2 proposes a refractory panel in which a core material made of a phenol resin foam to which an inorganic material is added is sandwiched between a front surface material and a back surface material made of a metal material. However, the fire resistance of the refractory panel is still insufficient for use as a partition wall, and it is structurally difficult to use it as a long partition wall.

Therefore, Patent Document 3 proposes a heat-insulating refractory sandwich panel in which an organic heat-insulating board layer and an inorganic board layer are laminated and bonded between a front surface material and a back surface material made of a metal material.

Japanese Patent No. 3657692 Japanese Patent No. 3306439 Japanese Unexamined Patent Publication No. 2007-132102

However, even with the heat-insulating fire-resistant sandwich panel described in Patent Document 3, the fire resistance as a partition wall is still insufficient, and the above-mentioned one-hour fire resistance cannot be satisfied.

Therefore, an object of the present invention is to provide a partition panel having both high fire resistance and heat insulating properties, and further to provide a partition wall and a room structure using the same.

The present invention that solves the above problems is as follows.

[1] A front surface material and a back surface material made of a metal material,
It has a plurality of organic heat insulating board layers arranged between the front surface material and the back surface material, and an inorganic board layer sandwiched between the plurality of organic heat insulating board layers.
The surface material of the plurality of organic heat insulating board layers adjacent to the surface material and the surface material of the plurality of organic heat insulating board layers adjacent to the back surface material and the back surface material of the plurality of organic heat insulating board layers are respectively. A partition panel characterized by being bonded with an organic adhesive.

[2] The partition panel according to the above [1], wherein the inorganic board layer is made of lightweight cellular concrete.

[3] The partition panel according to the above [1] or [2], wherein the inorganic board layer has a nonflammable reinforcing material.

[4] The item according to any one of [1] to [3], wherein the inorganic board layer adjacent to the inorganic board layer among the plurality of organic heat insulating board layers is mechanically fixed. Partition panel.

[5] The inorganic board layer is composed of a plurality of inorganic boards adjacent to each other in the in-plane direction, and the edge surfaces of the plurality of inorganic boards are bonded to each other by a fireproof adhesive. [1] -The partition panel according to any one of [4].

[6] The inorganic board layer is composed of a plurality of inorganic boards adjacent to each other in the in-plane direction, and a heat-expandable sheet material is loaded between the edge surfaces of the plurality of inorganic boards. The partition panel according to any one of 1] to [4].

[7] The inorganic board layer is composed of a plurality of inorganic boards adjacent to each other in the in-plane direction, and the plurality of inorganic boards are connected to the connecting metal fittings in an out-of-plane direction, an in-plane direction, or an out-of-plane direction and a surface. The partition panel according to any one of [1] to [6] above, which is fixed to each other with respect to inward movement.

[8] The partition panel according to any one of [1] to [7], wherein the number of the plurality of organic heat insulating board layers is two.

[9] The partition panel according to any one of [1] to [8] above, wherein the resin constituting each of the organic heat insulating board layers is made of a thermosetting resin.

[10] A vertical partition wall that is laid between the floors of a building and fixed at the upper and lower ends.
A partition wall according to any one of the above [1] to [9], wherein the partition panels according to any one of the above items [1] to [9] are arranged adjacent to each other in the width direction.

[11] The partition wall according to the above [10], wherein the joints between the plurality of partition panels are filled with a heat-expandable sheet material.

[12] The partition panel adjacent to each other, according to the above [10] or [11], wherein the widthwise end portion of the front surface material and the widthwise end portion of the back surface material are overlapped and connected to each other. Partition wall.

[13] The upper and lower ends of the partition panel are restrained in the out-of-plane direction of the partition panel by the mounting material fixed to the frame of the building, and the fastening material is further fixed to the inorganic material through the holes of the mounting material. The partition wall according to any one of [10] to [12], which is fixed by fastening to the front surface material and the back surface material so as not to penetrate the board layer.

[14] The interior of a building composed of a roof, a floor and an outer wall is partitioned by the partition wall according to any one of the above [10] to [13], and further, a highly heat insulating property is provided at an intermediate position of the partition wall. By connecting the ceiling material, at least one of the partition walls has a room partitioned by the partition wall, the ceiling material and the wall material, and the floor material, and the room has a highly heat insulating floor material and a wall. A room structure characterized by being partitioned by a material, the partition wall, and the ceiling material.

According to the present invention, it is possible to provide a partition panel having both high fire resistance and heat insulating properties, and further to provide a partition wall and a room structure using the same.

It is the whole view of the example of the partition panel by this invention. It is a figure which shows a part of the cross-sectional view in the width direction of an example of a partition panel by this invention. It is a figure which shows the organic insulation board layer composed of a plurality of boards. It is a figure explaining a preferable method of adhering adjacent organic insulation board layers. It is a figure which shows the inorganic board layer composed of a plurality of boards. It is a figure which shows the preferable arrangement relation of the horizontal joint of the organic heat insulating board layer, and the horizontal joint of the inorganic board layer. It is a figure explaining the method of mechanically fixing an organic heat insulating board layer and an inorganic board layer using an anchor material when the organic heat insulating board layer has a two-layer structure. It is a figure explaining the method of mechanically fixing an organic heat insulating board layer and an inorganic board layer using a screw when the organic heat insulating board layer has a two-layer structure. It is a figure explaining the method of mechanically fixing an organic heat insulating board layer and an inorganic board layer with a screw when the organic heat insulating board layer has a one-layer structure. It is an overall view of a suitable example of a partition wall according to the present invention. It is a vertical sectional view of the partition wall shown in FIG. 4A. It is an overall view of the cross-sectional view in the width direction of the partition wall by this invention. It is an enlarged view of the joint portion between panels in the cross-sectional view in the width direction of a partition wall by this invention. It is a figure which shows an example of the joint structure between panels. It is a figure which shows another example of the joint structure between panels. It is a figure which shows still another example of the joint structure between panels. It is a figure which shows an example of the room structure by this invention. It is a figure which shows an example of the conventional room structure. It is an enlarged view of the connection part between a partition wall and a heat insulating material by this invention. 9A is an enlarged view of a connection portion with a heat insulating material for a partition wall in which the organic heat insulating board layer and the inorganic board layer of the partition wall of FIG. 9A are replaced. It is a figure explaining the behavior of the partition wall by this invention during a fire resistance test. It is a figure which shows the relationship between the time in a refractory test, and the temperature in a furnace of a partition wall (the heating temperature during the heating time). It is a figure which shows the relationship between the time in a fire resistance test, and the back surface temperature of a partition wall.

(Partition panel)
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1A shows an overall view of an example of a partition panel according to the present invention, and FIG. 1B shows a part of a cross-sectional view in the width direction. The partition panel 1 shown in FIG. 1A includes a front surface material 11 and a back surface material 12 made of a metal material, and two organic heat insulating board layers 13 and 14 arranged between the front surface material 11 and the back surface material 12. It has an inorganic board layer 15 sandwiched between the two organic heat insulating board layers 13 and 14. Here, one 13 of the two organic heat insulating board layers and the front surface material 11 and the other 14 of the two organic heat insulating board layers and the back surface material 12 are adhered to each other by an organic adhesive. The resin constituting each of the two organic heat insulating board layers 13 and 14 is characterized by being made of a thermosetting resin.

In the present embodiment, as shown in FIG. 1B, the peripheral portions of the front surface material 11 and the back surface material 12 are bent toward the organic heat insulating board layers 13 and 14. The bent portions (first bent portions) 11a and 12a are configured to engage with the recesses 13a and 14a provided on the peripheral edges of the organic heat insulating board layers 13 and 14. An adhesive layer 16 (17) composed of an organic adhesive is formed between the front surface material 11 (back surface material 12) and the organic heat insulating board layer 13 (14), which is one of the organic adhesives. The portion enters between the first bent portion 11a (12a) and the organic heat insulating board layers 13 and 14, and improves the integrity of the front surface material 11 (back surface material 12) and the organic heat insulating board layer 13 (14). ..

-Front and back materials-
The front surface material 11 and the back surface material 12 are configured to be peeled off from the organic heat insulating board layers 13 and 14 when heated, and to be greatly expanded and deformed to the heated side. The front surface material 11 and the back surface material 12 are made of a metal material, and those obtained by forming the metal material into a predetermined cross-sectional shape by press molding, extrusion molding, roll molding or the like can be used. Examples of metal materials include hot-dip 55% aluminum-galvanized steel sheets, hot-dip galvanized steel sheets, and hot-dip 55% aluminum-galvanized steel sheets (painting: polyester-based resin, acrylic-based resin, silicon-based resin, amino-alkide-based resin). , Vinyl chloride resin, Fluorine resin, Epoxy resin, Urethane resin), Painted hot-dip galvanized steel sheet (Paint: polyester resin, acrylic resin, silicon resin, amino-alkyd resin, vinyl chloride resin, Fluorine-based resin, epoxy-based resin, urethane-based resin), painted stainless steel plate (painting: polyester-based resin, acrylic-based resin, silicon-based resin, amino-alkyd-based resin, vinyl chloride-based resin, fluorine-based resin, epoxy-based resin, Urethane-based resin), vinyl chloride resin film-clad / metal plate, high weather-resistant rolled steel (painting: epoxy-based resin, urethane-based resin), double-sided polyester resin-based coating / hot-dip aluminum-plated steel plate, ferrite-based stainless steel plate, double-sided acrylic resin A system coating / galvanized iron plate or the like can be used. The coating of the metal plate is generally applied not only to the surface but also to the surface to be adhered to the organic heat insulating board. In this case, the adhesiveness of the adhesive at room temperature and the initial stage of heating are applied. It is preferable to select a resin from the viewpoint of flammability and use a polyester resin, a urethane resin, an acrylic resin, or the like.

The dimensions of the front surface material 11 and the back surface material 12 can be appropriately set according to the design, and for example, the length can be 0.6 to 12 m and the width can be 300 to 1000 mm. The thickness of the front surface material 11 and the back surface material 12 can be 0.3 to 1.6 mm in terms of strength, weight, and economy, but more preferably 0.4 to 1.0 mm. be.

-Organic insulation board layer-
The organic heat insulating board layers 13 and 14 are layers for giving heat insulating properties to the partition wall, and the organic heat insulating board layers 13 and 14 are formed by thickening the inorganic board layer 15 so that the temperature of the organic heat insulating board layer 14 on the back surface side is increased. The material is not limited as long as it does not rise and has higher heat resistance. As the resin constituting such an organic heat insulating board layer, a polyimide foam, a PET resin foam, or the like can be used. However, when the inorganic board layer 15 is made as thin as possible to reduce the weight, the organic heat insulating board layer 13 is considered from the viewpoint of the covering effect of the inorganic board layer 15 on the heating side and the heat resistance of the organic heat insulating board layer 14 on the non-heating side. , 14 preferably uses an organic heat insulating board layer in which the constituent resin is a thermosetting resin. As a result, when the front surface material 11 (back surface material 12) is heated, the front surface material 11 (back surface material 12) and the organic heat insulating board layer 13 (14) are peeled off, and then the organic heat insulating board layer 13 (14) is separated. It can be retained on the surface of the inorganic board layer 15.

In addition, in FIGS. 1A and 1B, the organic heat insulating board layer is composed of two sheets, and the inorganic board layer 15 is sandwiched between them, but the organic heat insulating board layer can be composed of three or more sheets. .. For example, the organic heat insulating board layer is composed of four sheets, and the inorganic board layer 15 can be sandwiched between the second and third sheets.

--Thermosetting resin ---
As the thermosetting resin, a polyurethane resin, an isocyanate resin, a phenol resin, or the like can be used. Among them, since it has high flame retardancy, it is preferable to use a phenol resin as a thermosetting resin, and it is still more preferable to select a resin having expandability when it is heated and carbonized.

As the organic heat insulating board layers 13 and 14, a thermosetting resin, a curing agent, a foaming agent and the like are mixed together, foamed and cured, and the obtained resin foam formed into a board can be used. Further, the organic heat insulating board layers 13 and 14 may be used having face materials on the front and back surfaces in terms of molding convenience and adhesiveness to the front surface material 11 (back surface material 12) and the inorganic board layer 15. good.

The organic heat insulating board layers 13 and 14 having such a resin foam and a face material cause a mixture of a thermosetting resin, a curing agent, a foaming agent, etc. mixed on the face material to be discharged onto the face material traveling at a constant speed. After that, it can be formed into a board shape between the conveyors in the curing furnace.
Further, the organic heat insulating board layers 13 and 14 may be configured by a method in which the front surface material 11, the back surface material 12, and the inorganic board layer 15 are installed in advance with a gap at a predetermined interval, and then the organic resin material is injected into the gap. .. In this case, if the organic resin material is appropriately selected, the adhesive can also be used due to its self-adhesive force.

As the face material, polyester non-woven fabric, polypropylene non-woven fabric, aluminum foil, nonflammable processed paper, and a combination of these materials can be used. When the organic heat insulating board layers 13 and 14 are adhered to the inorganic board layer 15 via the face material, the organic heat insulating board layers 13 and 14 are prevented from falling off from the surface of the inorganic board layer 15 for a long time during the fire resistance test. That is essential. Therefore, it is most advantageous to use a nonflammable face material or a heat-resistant adhesive in terms of fire resistance, but since both of them are expensive, even if an organic face material is used as long as the fire resistance is not impaired. good. It is also important to take measures against adhesive peeling and the like that occur when water vapor generated from the inorganic board layer 15 is accumulated between the face material and the inorganic board layer 15 during the fire resistance test, and a face material having moisture permeability is used. It is also preferable. From these points, polyester non-woven fabric is preferable among organic facing materials because it has a total performance of price, heat resistance, and moisture permeability.

The dimensions of the organic heat insulating board layers 13 and 14 can be appropriately set according to the design of the partition panel 1. As shown in FIG. 2A, the organic heat insulating board layers 13 and 14 can be configured by arranging a plurality of organic heat insulating boards 13b (14b) side by side in the length direction, and the portion exceeding the length of the panel 1 is cut. The length can be adjusted. Further, the organic heat insulating board layers 13 and 14 can be configured by arranging a plurality of organic heat insulating boards 13b (14b) side by side in the width direction, and the portion exceeding the width of the panel 1 can be cut to match the width. .. As described above, the organic heat insulating board layers 13 and 14 can be composed of a plurality of organic heat insulating boards 13b (14b) adjacent to each other in the in-plane direction.

The edges of these adjacent organic heat insulating boards 13b (14b) may be adhered to each other, but even if they are omitted, the fire resistance does not deteriorate even if a resin having a property of expanding during carbonization is used, and the panel can be used as a panel. It may be determined according to the bending strength, shear strength and manufacturing convenience of the material. Further, a gap may be provided between the edges of the adjacent organic heat insulating boards 13b (14b). In this case, when the organic heat insulating board 13b (14b) and the front surface material 11 (back surface material 12) are adhered to each other by using the organic adhesive, when the front surface material 11 and the back surface material 12 are pressed, the organic adhesive is released. It enters the gap and the adjacent organic heat insulating boards 13b (14) are firmly fixed, and the strength performance of the panel 1 can be improved. When the organic heat insulating board 13b (14b) is thin, it is possible to obtain strength that is not significantly different from that of applying an adhesive to the entire surface of the fore edge and adhering the adhesive.

When the organic heat insulating board 13b (14b) is composed of the above-mentioned resin foam and the face material and the spaces between the edges of the adjacent organic heat insulating boards 13b (14b) are adhered, an adhesive is applied to the edges to insulate the organic. The boards 13b (14b) are pressed against each other. At that time, since the resin foam portion has elasticity, it is compressed, whereas the face material does not have elasticity, so that the face material near the edge surface becomes surplus and the adhesion of the edge surface deteriorates. As a result, the adhesiveness between the organic heat insulating boards 13b (14b) is lowered.

Therefore, as shown in FIG. 2B, it is preferable to remove the corners near the edge surface of the organic heat insulating board 13b (14b). As a result, the face material 13c near the edge surface is removed, so that when the adjacent organic heat insulating boards 13b (14b) are pressed against each other, the face material 13c near the edge surface does not become excessive, and the edge surfaces are further separated from each other. It is possible to improve the adhesion of the fore-edge surface by forming a pooled portion of the adhesive that is excessively collected below the fore-edge surface when pressed. In this way, the adhesive strength between the organic heat insulating boards 13b (14b) can be improved. The cross-sectional range for removing the corners is appropriately set in consideration of the amount of adhesive applied, the viscosity, the pressure for pressing the edge surface, etc., but generally, a 1/4 circle having a radius of 1 mm to 5 mm or 1 This may be done for a triangular portion having a side of 1 mm to 5 mm. Further, although it is generally provided over the entire length in the length direction, it is also preferable to remove a large portion such as the end of the side where the adhesive tends to accumulate.

As described above, since the resin foam 13d has elasticity, pressing the organic heat insulating boards 13b (14b) against each other absorbs the flatness of the edge surface itself and the dimensional error due to the removal of the corners. be able to.

Further, in terms of heat insulating properties, strength, and economy, the thicknesses of the organic heat insulating board layers 13 and 14 are 20 to 150 mm, more preferably 30 to 100 mm, and the density is 20 to 80, more preferably 25 to 50 kg / m ³ . And.

-Organic adhesive-
In the present invention, it is important that the front surface material 11 (back surface material 12) and the organic heat insulating board layer 13 (14) are adhered with an organic adhesive. As a result, when the front surface material 11 (back surface material 12) is heated, the organic adhesive burns at about 250 to 400 ° C. and the adhesiveness is lost, and the front surface material 11 (back surface material 12) and the organic heat insulating board are lost. The layer 13 (14) can be satisfactorily peeled off. As a result, the organic heat insulating board layers 13 and 14, the inorganic board layer 15 and the back surface material 12 do not follow the deformation of the front surface material 11, and large deformations, cracks, and peeling between and inside the materials occur. It can be prevented from occurring, the integrity and flatness of these materials can be maintained, and fire resistance can be exhibited.

The organic adhesive is not particularly limited as long as the front surface material 11 (back surface material 12) burns at the initial stage of heating and loses its function as an adhesive. Examples of such organic adhesives include urethane resin-based (main component: urethane resin, solvent: esters, ketones), epoxy resin-based (main component: (main agent) epoxy resin, (hardener) modified polyamine, modified polythiol, etc. Solvents: esters, ketones, alcohols), vinyl acetate resin-based (main components: vinyl acetate resin, solvents: alcohols, esters, ketones), modified silicon-based ones can be used. Above all, it is preferable to use a urethane resin-based adhesive or an epoxy resin-based adhesive as the organic adhesive because it is suitable for use at low temperatures.

-Inorganic board layer-
The inorganic board layer 15 is an important layer for exhibiting fire resistance as a panel, and can be made of lightweight cellular concrete, gypsum board, caucal board, or the like. Above all, the inorganic board layer 15 is preferably made of lightweight cellular concrete. As the lightweight aerated concrete, a concrete having a specific gravity of about 0.5, which is cured at high temperature and high pressure and reinforced with a reinforced mat or a metal lath (steel wire mesh) whose inside is reinforced with a special rust preventive treatment, is preferable. However, heat insulation and light weight are further excellent and preferable. Further, in the lightweight cellular concrete, a metal lath or a reinforcing bar mat can be easily arranged inside due to the characteristics of the manufacturing method.

When the inorganic board layer 15 is composed of gypsum board or caucal board, these materials have a large amount of water of crystallization and have been frequently used for fireproof applications. However, after the water of crystallization is released, a large amount of warpage and cracks occur. Since it is generated, it is necessary to increase the thickness or load a nonflammable reinforcing material inside. Since it is difficult to load a reinforcing material inside with the current molding method, it is necessary to use a method such as stacking a plurality of sheets and sandwiching them between them. An organic adhesive can be used to bond the plaster board and the caical board, but if an inorganic adhesive using water glass or colloidal silica as a binder and an oxide such as alumina as a filler is used, the heating time It is preferable because the adhesiveness can be maintained for a long time during or after heating.

Further, as the nonflammable reinforcing material, a glass fiber net, a metal lath or the like can be used.

The dimensions of the inorganic board layer 15 can be appropriately set according to the design of the partition panel 1. As shown in FIG. 2C, the inorganic board layer 15 can be configured by arranging a plurality of inorganic boards 15a side by side in the length direction, and the portion exceeding the length of the panel 1 can be cut to match the length. can. Further, the inorganic board layer 15 can be configured by arranging a plurality of inorganic boards 15a in the width direction, and the portion exceeding the width of the panel 1 can be cut to match the width. As described above, the inorganic board layer 15 can be composed of a plurality of inorganic boards 15a adjacent to each other in the in-plane direction.

The plurality of inorganic boards 15a constituting the inorganic board layer 15 shown in FIG. 2C are arranged so that the vertical joints are displaced, but the vertical joints may be arranged so as to be aligned in a straight line.

When the inorganic board layer 15 is composed of a plurality of inorganic boards 15a, the edge surfaces of the plurality of inorganic boards 15a are bonded to each other with a fireproof adhesive, or a heat-expandable sheet is formed between the edge surfaces of the plurality of inorganic boards 15a. Materials can be loaded, or a plurality of inorganic boards 15a can be fixed to each other for out-of-plane, in-plane, or out-of-plane and in-plane movements by connecting fittings, or these means can be used together. preferable.

As a fire-resistant adhesive, the main component is sodium silicate, and inorganic components such as silica, kaolin, talc, and clay minerals are added, and organic additives such as styrene / butadiene copolymer are added. Those with improved sex can be used. In addition, a cement-based material to which a binder is appropriately added can also be used.

Further, as a heat-expandable sheet material, expansion starts at about 150 to 200 ° C., expands to about 5 to 15 times at 300 ° C., expands to about 10 to 30 times at 600 ° C., and even at a heating temperature of about 900 ° C. A sheet formed into a sheet containing about half or more of an inorganic material that does not disappear can be processed to a predetermined size and used. As for the composition, for example, expanded graphite as an expansion material was added to an inorganic filler such as boric acid forming an expansion layer, and an additive such as mineral oil and carbon black and a binder such as butyl rubber were added to form a sheet. Things can be used. When boric acid is used as the inorganic filler, aluminum oxide is added in a weight ratio of 0.45 or more and 1.5 or less to boric acid, and the total content of the silicic acid compound, magnesium salt and calcium salt is adjusted. By setting the weight ratio to less than 10% with respect to boric acid, the shape-retaining ability of the heat-expandable sheet material after expansion can be enhanced, which is preferable.

When the inorganic board layer 15 is arranged between the two organic heat insulating board layers 13 and 14, as shown in FIG. 2D, the horizontal joints in the organic heat insulating board layers 13 and 14 and the horizontal joints in the inorganic board layer 15 are formed. It is preferable that they are displaced in the length direction. Thereby, the strength of the partition panel 1 can be improved. This deviation is preferably about 1 to 3 times the thickness of the organic heat insulating board layers 13 and 14. Further, it is preferable to provide the same degree of deviation from the viewpoint of fire resistance and heat insulation.

For the adhesion between the inorganic board layer 15 and the organic heat insulating board layers 13 and 14, it is important to select a material so that the carbonized organic heat insulating board does not fall off as much as possible during the fire resistance test. By using the inorganic adhesive, the fire resistance is improved, but it takes time and effort to manufacture the panel 1. When an organic adhesive is used, sufficient adhesive strength is maintained at least at 100 ° C, considering that the surface temperature of the heated side of the inorganic board stays at 100 ° C for a long time while the water of crystallization of the inorganic board layer 15 evaporates during the fire resistance test. Furthermore, it is necessary to select a material that does not cause a decrease in adhesive strength due to the ejected water vapor. As a material having such properties, it is preferable to use urethane resin, epoxy resin or the like. Further, it is preferable to use the same adhesive as the front surface material 11 (back surface material 12) and the organic heat insulating board layer 13 (14) because the manufacturing efficiency is excellent.

The amount of the adhesive applied is preferably 100 to 500 g / m ² per layer, and the type and surface flatness of the base material of each adhesive layer, the pressure and time of the press after application, and the partition panel. Determined according to the target performance.

When a large bending load is required for the partition panel 1, it is necessary for each adhesive layer to be firmly adhered until the base material is broken, and the amount of the adhesive applied is the front surface material 11 ( back surface material ). The distance between the organic heat insulating board layer 13 (14) and the organic heat insulating board layer 13 (14) is preferably 100 to 300 g / m ² , and the space between the organic heat insulating board layers 13 and 14 is preferably 100 to 300 g / m ² . ) And the inorganic board layer 15, preferably 200 to 500 g / m ² .

If the amount of coating between the front surface material 11 (back surface material 12) and the organic heat insulating board layer 13 (14) is too large, 100 to 500 g / m in consideration of the time until peeling when heated in the event of a fire. ² is preferable. It is preferable that the adhesive spreads evenly over the entire layer by pressing, and the amount of adhesive applied and the press pressure are determined according to the viscosity of the adhesive, the flatness of the material to be adhered, and the ease of spreading of the adhesive. do. If the coating amount is too large between the organic heat insulating board layers 13 (14) and between the organic heat insulating board layer 13 (14) and the inorganic board layer 15, the viewpoint of preventing the adhesive from squeezing out from the layers during pressing (appearance). From 100 to 500 g / m ² is preferable.

When the inorganic board layer 15 and the organic heat insulating board layers 13 and 14 are adhered to each other using an adhesive, the primer may be applied to the surface of the inorganic board layer 15 in advance before the adhesive is applied. preferable. Thereby, the primer can be impregnated into the inorganic board layer 15 to improve the adhesive strength between the inorganic board layer 15 and the organic heat insulating board layers 13 and 14.

By applying the primer, not only can the same adhesive strength be obtained even if the amount of the adhesive applied is reduced by that amount, but also the trouble of cleaning the dust and the like on the surface of the inorganic board layer 15 can be saved, and the inorganic board can be applied. It is possible to reduce the influence of the water content of the layer 15 and to reduce the variation in the adhesive strength. Furthermore, it is possible to reduce the entire material cost related to bonding.

Heat resistance can be improved by using a thermosetting resin such as an epoxy-based, urethane-based, or phenol-based primer as the primer. On the other hand, although the acrylic primer is thermoplastic, it has relatively good heat resistance and is particularly excellent in terms of workability and price. Therefore, it may be used in consideration of these performances comprehensively.

Further, when the thickness of the inorganic board layer 15 is relatively small, if the inorganic board layer 15 and the organic heat insulating board layers 13 and 14 are adhered to each other by using an adhesive as described above, when the inorganic board layer 15 is placed in a high temperature environment due to a fire or the like. Adhesion may not be maintained. In such a case, if the organic heat insulating board layer 14 on the non-heated side and the inorganic board layer 15 are mechanically fixed, even after the adhesion between the organic heat insulating board layer 14 on the non-heated side and the inorganic board layer 15 is broken. , The fire resistance can be maintained without the inorganic board layer 15 falling off immediately. In the above description, the organic heat insulating board layer 13 is the heating side, but when a fire occurs on the opposite side of the partition wall, the heating side is the non-heating side, so that the organic heat insulating board layer 13 and the inorganic board layer 15 are used. Also needs to be mechanically fixed.

Specifically, the organic heat insulating board layers 13 and 14 and the inorganic board layer 15 can be mechanically fixed by using an anchor material A as shown in FIG. 3A, a screw V as shown in FIG. 3B, or the like. As a result, the organic fire resistance on the non-heated side can be maintained when placed in a high temperature environment.

As the anchor material A, a tip expansion type anchor or a tip expansion type nail can be used. These are for fixing the inorganic board layer 15 to the organic heat insulating board layer 13 (14). Inorganic board layers 15 are stacked, and their own weight is transmitted to the lower stage, and finally to the floor slab via the lower joint material. For safety, it is more preferable that the weight of each of the inorganic board layers 15 can be borne by each anchor material A. In order to secure the pull-out strength, the area of the cross section of the head of the anchor material A orthogonal to the axial direction is important, but in order to support its own weight acting in the vertical direction, the axial cross section of the anchor material A is important. The area of contact with the organic insulation board layer 13 (14) is important. In that case, it is preferable to use a shaft portion having a diameter of about 5 to 8φ.

Further, in the case of the screw V, it may be considered in the same manner as the anchor material A, but if the portion arranged on the organic heat insulating board layer 13 (14) is left in a linear shape without providing a screw, the vertical direction is obtained. The contact state for the load bearing is more preferable. Further, it is preferable that the shape of the head of the screw V is not only an area orthogonal to the axial direction but also a flat head or a pan shape to increase the cross-sectional area in the axial direction.

Further, when the organic heat insulating board layer 13 (14) having a face material such as a non-woven fabric on the surface is used, if the screw V is attached with the face material left as much as possible, the head is depressed in the pulling direction. It is preferable because it improves not only the strength but also the proof stress in the vertical direction.

As shown in FIGS. 3A and 3B, when the organic heat insulating board layer 13 (14) has a two-layer structure, that is, the organic heat insulating board layer 13 (14) is used in two layers on one side of the inorganic board layer 15. In this case, it is preferable to use a pan shape in which the back side shape of the head is flat on the back surface side of the organic heat insulating board layer 13 (14) on the inorganic board layer 15 side.

On the other hand, as shown in FIG. 3C, when the organic heat insulating board layer 13 (14) has a one-layer structure, that is, when only one organic heat insulating board layer 13 (14) is used on one side of the inorganic board layer 15. It is necessary to slightly sink the entire head so as not to come into contact with the back surface material 12, but in that case, it is more preferable that the screw V is submerged together with the face material as a flat head. In FIG. 3C, the heat-expandable sheet material 21 is filled between the edge surfaces of the inorganic board layer 15.

Further, especially when only one organic heat insulating board layer 13 (14) is used and the screw head is submerged for construction, the screw head and the back surface material 12 are adhered to each other by an adhesive. The vertical displacement and rotation of the head are less likely to occur, and the proof stress in the vertical direction is improved. In this case, it is preferable that the screw head is subducted by about 1 to 5 mm because the adhesive is easily spread when the back surface material 12 and the organic heat insulating board layer 14 are bonded to each other with an adhesive. However, the organic heat insulating board layer 14 is deformed by the press pressure due to the press when the back surface material 12 and the organic heat insulating board layer 14 are bonded to each other. It is preferable to decide.

Further, when the screw head is excessively sunk, it is advisable to fill the portion where the screw head is sunk with an adhesive in advance before adhering the back surface material 12 to the organic heat insulating board layer 14. Further, in the unlikely event that the adhesive between the back surface material 12 and the screw head is peeled off, it is preferable to make the screw head a gentle curved surface or to provide a large groove in order to act as a shear resistance. Further, it is also effective to make the surface of the screw head rougher than the back surface material 12 because the adhesive remains on the screw head side and acts as a shear resistance.

On the other hand, when the front surface material 11 and the back surface material 12 are thin, the screw head and the front surface material and the back surface material are not intentionally adhered in order to prevent the front surface material 11 and the back surface material 12 from being distorted due to the fine behavior of the screw head. It may be designed as such.

In order to improve the proof stress in the vertical direction without excessively increasing the head depression strength in the pull-out direction, it is important to increase the diameter of the screw head without making it excessively large.

Considering these, it is preferable to use a pan head screw having a shaft diameter of 4 to 7φ, a head diameter of 9 to 15φ, and a head thickness of about 4 to 9 mm. In the case of a flat head, the shaft portion is used. It is preferable to use one having a diameter of 4 to 6φ, a head diameter of 9 to 15φ, and a flat head angle of about 30 to 60 °. Further, the anchor material A and the screw V are struck from both the front surface material 11 side and the back surface material 12, but it is preferable to strike them at a distance of 1.5 times or more the thickness of the inorganic board layer so that they do not interfere with each other. It is more preferable to hit them twice or more apart. It should be noted that the use of the screw V is preferable when it is desired to reduce the interval between hitting the anchor material A and the screw V without causing damage due to the impact on the inorganic board layer 15 at the time of placing.

Here, the means for the partition wall composed of the partition panel 1 (see the partition wall 2 according to the present invention shown in FIGS. 4A and 4B) to pass the fire resistance test by heating for 1 hour and following for 3 hours. explain. When the partition wall 2 is heated from the surface material 11 side, the surface material 11 is greatly deformed at the initial stage of heating, and the organic heat insulating board layer 13 on the heating side is carbonized during the heating time of 1 hour and then disappears. After that, it is necessary that the three layers of the inorganic board layer 15, the organic heat insulating board layer 14 on the non-heated side, and the back surface material 12 prevent the penetration of flame and heat without breaking the positional relationship until the end.

In the three layers, first, the upper anchor material 24b and the lower anchor material 25b are used to combine the upper mounting material 24c and the lower mounting material 25c (hereinafter, the upper mounting material 24c and the lower mounting material 25c) with the skeleton of the floor slabs 22, 23 and the like. (Sometimes referred to simply as "mounting material") is fixed, and the partition panel 1 is restrained in the out-of-plane direction by the upper mounting material 24c and the lower mounting material 25c. The upper fastener 24a and the lower fastener 25c may be combined with the upper fastener 24a and the lower fastener 25a (hereinafter, the upper fastener 24a and the lower fastener 25a) and may be simply referred to as "fastening material". ) Are used to fasten to the back surface material 12. Next, the organic heat insulating board layer 14 on the non-heated side is fixed to the back surface material 12 with an organic adhesive. Finally, the inorganic board layer 15 is fixed to the organic heat insulating board layer 14 by using an organic adhesive and mechanical fixing means.

Stainless steel plates and hot-dip zinc-plated steel plates are used for the upper mounting material 24c and the lower mounting material 25c, and they are designed in consideration of the assumed seismic force and deformation due to heat in the event of a fire. The lower mounting material 25c has a thickness of 2 to 6 mm and a vertical direction of 40 to 100 mm and a horizontal direction of about 30 to 60 mm, and a lower mounting material 25c having a thickness of 2 to 6 mm and a vertical direction of 40 to 100 mm and a horizontal direction of about 30 to 60 mm. Often used. The lengths of the upper mounting material 24c and the lower mounting material 25c are designed according to the construction method, but one side of the construction is about 1.8 to 5.4 m, and the other side is 0.1. It is convenient to use a material with a length of about 0.9 m because it is possible to build a long one first and then hold it down with a short one so that it will not fall over.

The upper mounting material 24c and the lower mounting material 25c include a through hole for constructing an anchor material and a through hole for constructing a fastener material. By providing through holes for fastening material construction in the upper mounting material 24c and the lower mounting material 25c in advance, it becomes possible to use tapping screws for thin steel plates to fix the front surface material 11 and the back surface material 12. These have a diameter of 4 to 5φ, a length of 15 to 30 mm, a thread height of 0.4 to 1.0, and a screw pitch of about 0.5 to 1.0. It is preferable because it has excellent shearing force, pull-out resistance, and deformation ability until breaking.

In order for the three layers to stand on their own in the event of a fire, the weights of the organic heat insulating board layer 14 and the inorganic board layer 15 fixed to the back surface material 12 and the back surface material 12 with only the upper fastener 24a on the non-heated side are vertically oriented. Support. Normally, the wall material is sandwiched by the mounting material from both sides and does not fall down, but in the event of a fire, the organic heat insulating board layer 13 on the heating side of the cross section of the wall material disappears and is greatly deformed. Therefore, due to the shearing force according to the weight of the organic heat insulating board layer 14 and the inorganic board layer 15 fixed to the back surface material 12 and the back surface material 12 via the back surface material 12 to the upper fastener 24a on the non-heated side, and heat. Since the pulling force is generated according to the eccentricity generated by the deformation, it is necessary to fully consider these when designing.

Since the three layers are greatly curved out of the plane at the end of the 3-hour follow-up test, they must be designed in consideration of the influence of the bending. Further, when the upper fastener 24a is displaced and rotated in the vertical direction, the fastener is arranged in the back surface material 12 and the organic heat insulating board layer 14 in the structure of the present invention.

The inorganic board layer 15 is liable to crack even with a small local load, but is not affected by the displacement and rotation of the upper fastener 24a, and does not impair the function as a fire stop material. On the other hand, since the organic heat insulating board layer 14 is made of a soft material, defects and drops that impair fire resistance such that heat is easily transferred to the back surface material 12 due to the influence of displacement and rotation of the upper fastener 24a, etc. Does not occur.

In order for the upper fastener 24a to support the weight of the three layers, the hole of the upper mounting material 24c through which the upper fastener 24a penetrates must not have a large play in the vertical direction, and may be a round hole or a major axis. It is preferable that the hole has a long hole of about 10 to 20 mm. The through hole of the lower fastener 25a provided in the lower mounting material 25c may be a round hole, but the major axis should be about 20 to 40 mm in order to absorb the displacement generated in the wall material due to the weight in the vertical direction. Is preferable.

As described above, in FIGS. 3A and 3B, two organic heat insulating board layers 13 and 14 are arranged on both sides of the inorganic board layer 15, respectively, and the organic heat insulating board layer 13 adjacent to the inorganic board layer 15 is provided. It is mechanically fixed to the inorganic board layer 15. In this case, there is no problem because the heads of the anchor material A and the screw V are buried in the adjacent organic heat insulating board layer 13.

On the other hand, as shown in FIG. 3C, when one organic heat insulating board layer 13 is arranged on both sides of the inorganic board layer 15 and the organic heat insulating board layers 13 and 14 are fixed to the inorganic board layer 15, an anchor is used. The heads of the materials A and V come into contact with the front surface material 11 and the back surface material 12 made of a metal material. Therefore, it is preferable to provide recesses for accommodating the heads of the anchor material A and the screw V on the surfaces of the organic heat insulating board layers 13 and 14 on the front surface material 11 and the back surface material 12.

However, if the shape of the head of the anchor material A or the screw V is made relatively thin and the back surface side of the head is easily buried in the organic heat insulating board layers 13 and 14, the recess is provided in advance. No need.

Further, if the sinking strength of the organic heat insulating boards 13 and 14 of the heads of the anchor material A and the screw V is designed to be smaller than the fixing strength to the inorganic board layer 15, when the tensile force acts on the anchor material and the screw V, Also, it is possible to prevent the inorganic board 15 from being damaged, which is more preferable from the viewpoint of fire resistance.

(Partition wall)
Next, the partition wall according to the present invention will be described. FIG. 4A shows an overall view of a suitable example of a partition wall according to the present invention. Further, FIG. 4B shows a vertical sectional view of the partition wall shown in FIG. 4A. The partition wall 2 shown in this figure is a vertical partition wall that is bridged between the floors of the building, that is, the floor slabs 22 and 23, and is fixed at the upper and lower ends thereof. In addition to the floor slab, the partition wall 2 may be fixed to a ceiling or a fireproof coated steel beam arranged on the floor. In addition, in the case of applications where it is necessary to place a heat insulating material on the floor surface, after stacking the heat insulating material from the floor slab surface on both sides of the partition wall, concrete is poured on the heat insulating material to place the floor surface. Often finished as. In the partition wall 2, a plurality of partition panels 1 according to the present invention described above are arranged adjacent to each other in the width direction.

5A and 5B show a cross-sectional view in the width direction of the partition wall 2 according to the present invention, FIG. 5A is an overall view, and FIG. 5B is an enlarged view of a joint portion between panels. It is preferable that the heat-expandable sheet material 21 is filled between the edges of the plurality of panels 1. The heat-expandable sheet material 21 is not loaded to the full thickness of the panel 1, but as shown in FIG. 5B, the heat-expandable sheet material 21 has strength during and after heating, and is applied only to the portion of the remaining inorganic board layer 15. It is most efficient to load. Further, the heat-expandable sheet agent 21 does not necessarily have to be loaded in the entire thickness of the inorganic board layer 15, and is determined in consideration of the assumed gap between the inorganic board layers 15 and the expansion coefficient of the heat-expandable sheet material 21. It is preferable that the thickness is 1 to 3 mm and the width is about 15 to 50 mm. Further, a sealing material 28 is placed in the joints between the panels 1.

The lower portion of the partition wall 2 is fixed to the floor slab 23 by the lower fastener material 25a and the lower anchor material 25b via the lower mounting material 25c. Although not shown, the upper part of the partition wall 2 is also similarly fixed to the floor slab 22 by the upper fastener material 24a and the upper anchor material 24b via the upper mounting material 24c. Further, the joint between the partition wall 2 and the floor slab 22 is filled with the upper joint material 26, and the joint between the partition wall 2 and the floor slab 23 is filled with the lower joint material 27. ..

The upper anchor material 24b and the lower anchor material 25b are selected to withstand the inertial force of about 1 G acting at the time of an earthquake, which is the design load of the normal partition wall, but generally the diameter is about M8 to 10 and the embedded length. Arrange the required number of concrete anchor materials with a diameter of about 30 to 70 mm according to the load capacity that can be borne.

As the heat-expandable sheet material 21 to be filled in the joints between the plurality of panels 1, the same material as the heat-expandable sheet material used for the joints when a plurality of the inorganic board layers 15 are arranged can be used. ..

Further, the upper joint material 26 and the lower joint material 27 do not create a gap through which flame or heat penetrates when the wall material is displaced or rotated during a fire, and impairs the function of the wall material as a fire stop material. It is a material that does not cause chipping or dropping and further reduces thermal transmission in normal times. As the upper joint material 26 and the lower joint material 27, ceramic fibers, alkaline earth silicate blankets (biosoluble fibers) and the like can be used.

FIG. 6 shows an example of the joint structure between the panels 1. In the joint structure shown in FIG. 6A, the front surface material 11 (back surface material 12) is bent once along the side wall partitioning the recesses 13a (14a) of the organic heat insulating board layer 13 (14) to form the first bent portion. 11a and 12a are formed, and a sealing material 28 is filled between the adjacent first bent portions 11a.

The bottom surface of the sealing material 28 is adhered to the organic heat insulating board layer 13 (14), but if the surface of the recesses 13a (14a) where the resin layer to which the face material is not attached is exposed, the sealing material 28 can be used. It does not hinder free deformation.

Further, in the joint structure shown in FIG. 6B, the front surface material 11 (back surface material 12) is bent twice along the side wall and the bottom surface that partition the recesses 13a (14a) of the organic heat insulating board layer 13 (14). The first bent portions 11a and 12a and the second bent portions 11b and 12b are formed. By connecting the second bent portions 11b (12b) to each other, the infiltration of thermal heat from the joint portion of the partition panel 1 is alleviated in the event of a fire, and the heat generated by heating from the adjacent surface material 11a is directly emitted. It can be avoided and the fire resistance can be improved.

The second bent portion 11b (12b) does not need to be formed over the entire length of the panel 1, and is fixed to the first bent portions 11a and 12a at intervals of about 300 to 1500 mm by riveting or welding. It may be. The portions of the front surface material 11 (back surface material 12) that are laminated with each other are connected by screws V at intervals of about 300 to 1500 mm, and the sealing material 28 is filled between the adjacent first bent portions 11a. ..

By the above connection, the movement of the joint portion is reduced, and the life of the sealing can be extended. Further, since the outermost surface in the width direction is composed of the front surface material 11 or the back surface material 12 made of a metal material, damage to the edges of the organic heat insulating board layers 13 and 14 and the inorganic board layer 15 which are the core materials is prevented. can do. Further, when the wall is built as a partition wall, the entrance / exit of the front surface material 11 and the back surface material 12 made of a metal material can be easily adjusted.

A bond breaker 29 for preventing three-sided adhesion of the sealing material 28 is laid on the outside of the surface of the second bent portion 11b (12b). It is also possible to use a foamed resin backup material instead of the bond breaker 29, but these materials have the property of shrinking near 180 + atmospheric temperature, which is the specified value of the back surface temperature in the fire resistance test. It is necessary to be careful because it may cause the adhesion from the bottom side of the sealing on the opposite side of heating to be cut off and reduce the fire resistance.

FIG. 6C shows a preferred embodiment of the joint structure shown in FIG. 6B. In the partition wall shown in FIG. 6B, both the second bent portions 11b and 12b of one of the adjacent partition panels (in FIG. 6B, the left partition panel) are the organic heat insulating board layers 13 and 14. It is placed on the side.

On the other hand, in the joint structure shown in FIG. 6C, the second bent portion 11bi of the surface material 11 of 1a of the adjacent partition panels 1a and 1b is arranged on the organic heat insulating board layer 13 side. The second bent portion 11bo of the other adjacent partition panel 1b is arranged on the screw V side. Further, the second bent portion 12bo of the back surface material 12 of the partition panel 1a is arranged on the screw V side, and the second bent portion 12bi of the other partition panel 1b is arranged on the organic heat insulating board layer 14 side. There is.

With this configuration, even if there is an error between the distance between the second bent portions 11bi and 12bo of the adjacent partition panel 1a and the distance between the second bent portions 11bo and 12bo of the other partition panel 1b. It can be easily built on site. That is, when the next partition panel 1b is constructed following the partition panel 1a previously constructed at a predetermined position, the second bent portions 11bi and 11bo and 12bo and 12bi of the respective partition panels are set in the thickness direction. By pulling the width direction to a predetermined size in a slightly shifted state and then pushing it to a predetermined position in the thickness direction, the second bent portions can be easily installed without colliding with each other.

Further, in the joint structure shown in FIG. 6C, the position of the screw V is arranged closer to the first bent portion 11a (12a) side, and the second bent portion adjacent to the organic heat insulating board layers 13 and 14 is arranged. The length of 11bi (12bi) in the width direction is long. As a result, the edge space of the screw V screwed into the second bent portions 11bo, 11bi, 12bo and 12bi of the screw V can be increased, and the connection strength between the adjacent partition panels can be improved. In addition, due to various factors, it becomes easier to secure the necessary edge space for strength even when the joint width is wider than the design value at the construction site.

Further, in the joint structure shown in FIG. 6C, the heat-expandable sheet material 21 is arranged close to one of the adjacent partition panels 1a and 1b (1b in FIG. 6C). As a result, when the heat-expandable sheet material 21 is arranged between the partition panels 1a and 1b adjacent to each other, the width of the inorganic board layer 15 of one of the partition panels is shortened to provide a recess, and the recess is provided. Since it is sufficient to fill the heat-expandable sheet material 21, the workability can be greatly improved. As shown in FIG. 6C, there may be a gap (for example, about 1 mm in the width direction) between the inorganic board layer 15 and the heat-expandable sheet material 21.

As described above, since the partition wall 2 according to the present invention is fixed to the skeleton at the upper and lower ends thereof, when the front surface material 11 (back surface material 12) of the partition wall 2 is heated, the front surface material 11 (back surface material 12) is heated. ) Expands, the front surface material 11 (back surface material 12) and the organic heat insulating board layer 13 (14) can be peeled off, and the board layers 13, 14, 15 are not deformed and damaged, and the partition wall 2 Can maintain the fire resistance of. As described above, the partition wall 2 according to the present invention has both high fire resistance and heat insulating properties.

(Room structure)
Subsequently, the room structure according to the present invention will be described. FIG. 7 shows an example of a room structure according to the present invention. In the room structure 3 shown in this figure, the interior of the building composed of the roof 31, the floor 32, and the outer wall 33 is partitioned by the partition wall 2 according to the present invention described above, and is further elevated at an intermediate position of the partition wall 2. By connecting the heat insulating ceiling material 34a (35a), the partition wall 2, the ceiling material 34a (35a), the wall material 34c (35c), and the floor material 34b (35b) are connected to at least one of the partition walls 2. ) Has a room 34 (35) partitioned by. The room 34 (35) is partitioned by a floor material 34b (35b) and a wall material 34c (35c) having high heat insulating properties, and a partition wall 2 and a ceiling material 34a (35a). The room 34 (35) is, for example, a freezer / refrigerator.

Further, the roof 31, the floor 32, and the outer wall 33 of the building are made of, for example, concrete, lightweight aerated concrete, or the like. The upper part of the partition wall 2 is not the roof 31, but may be fixed to the floor on the upper floor or a fireproof coated steel frame or reinforced concrete beam depending on the building structure. Further, in FIG. 7 , the floor materials 34b and 35b are provided on the floor 32, but by arranging the heat insulating material on the lower side of the floor 32, the strength of the floor surface is improved and the luggage carrying vehicle or the like travels. Is convenient for you.

As shown in FIG. 8, in the room structure 30 of the conventional freezing and refrigerating warehouse, a partition wall 20 such as lightweight cellular concrete having fire resistance is used, and the room 36 (37) of the freezing and refrigerating warehouse has high heat insulation. It was partitioned by a sex ceiling material 36a (37a), a floor material 36b (37b) and a wall material 36c (37c). However, since the air-conditioning temperature is different between the wall material 36c (37c) and the partition wall 20 serving as the fireproof compartment, dew condensation is likely to occur on the surface of the heat insulating panel, and these spaces are narrow and difficult to clean. Therefore, there was a problem that mold and insects were easily damaged.

On the other hand, in the room structure 3 according to the present invention, the partition wall 2 having both high heat insulation and heat resistance constitutes a part of the wall of the room 34 (35). With this configuration, there is no gap between the wall material 34c (35c) and the partition wall 2 as in the conventional room structure 30. As a result, dew condensation is less likely to occur on the partition wall 2, and damage caused by mold and insects can be suppressed.

Further, as shown in FIG. 9A, which is an enlarged view of the connection portion between the partition wall 2 and the heat insulating materials 34a and 34b shown in FIG. 7, in the partition wall 2, the inorganic board layer 15 having a relatively high thermal conductivity is used as a partition. The organic heat insulating board layers 13 and 14, which are arranged in the center of the wall 2 (partition panel 1) and have a relatively low thermal conductivity, are arranged on the outside. Therefore, the amount of heat transmitted through the surface layer portion of the panel penetrating the inside and outside of the room 34 (35) is reduced, and a thermal bridge is unlikely to occur. On the other hand, when a partition wall in which the organic heat insulating board layers 13 and 14 and the inorganic board layer 15 are replaced as shown in FIG. 9B is used, the vicinity of the surface layer portion is composed of a material that easily conducts heat. Therefore, a thermal bridge larger than the structure of FIG. 9A is generated.

Hereinafter, examples of the present invention will be described, but the present invention is not limited to the examples.

(Invention Example 1)
The partition panel 1 according to the present invention was produced. First, two coated galvalume steel plates (registered trademark) as the front surface material 11 and the back surface material 12 (dimensions: 3200 mm × 890 mm, with bent portions having a width of 10 mm around each circumference, thickness: 0.4 mm), organic heat insulating board layers 13, 14 4 pieces of phenol foam board (Neomafoam (registered trademark) manufactured by Asahi Kasei Kenzai Co., Ltd., dimensions: 1820 mm x 900 mm, thickness 32.5 mm, density: 40 kg / m ³ ), and 3 lightweight cellular concrete as the inorganic board layer 15. Sheets (Power Board NEXT manufactured by Asahi Kasei Kenzai Co., Ltd., dimensions: 1820 mm x 606 mm, thickness: 36 mm, density 350 kg / m ³ ) were prepared respectively.

Next, the painted galvalume steel plate (registered trademark), phenol foam board, lightweight foam concrete, phenol foam board, and painted galvalume steel plate (registered trademark) are laminated in this order using a urethane adhesive (KU570 manufactured by Konishi Co., Ltd.). It was glued. The amount of adhesive applied is 150 to 200 g / m ² between the coated galvalume steel plate (registered trademark) and the phenol foam board, and 200 to 300 g / m ² between the lightweight aerated concrete and the phenol foam board, 1 t / m. It was cured overnight with a press of ^m2 . In this way, the partition panel 1 was obtained.

Four partition panels 1 obtained as described above are arranged adjacent to each other in the width direction, and the upper and lower portions of each panel 1 are the upper mounting material (L-65 × 40 × t = 3.2 mm) and the lower portion. It was fixed to the ceiling and floor with a mounting material (L-50 x 40 x t = 3.2 mm), respectively. Further, a heat-expandable sheet material (Fire Shut FST-A manufactured by CRK Co., Ltd., thickness 2 mm × width 30 mm) was loaded into the joint between the joints between the panels 1 and the joints between the lightweight cellular concretes in the panel 1. In this way, the partition wall 2 according to the present invention was bridged between the floors of the building.

<Fire resistance test>
With respect to Invention Example 1 prepared as described above, a partition wall fire resistance test for 1 hour was carried out in accordance with the method specified in the Building Standards Act. Hereinafter, the behavior of the partition wall 2 according to Invention Example 1 in the fire resistance test will be described.

First, as shown in FIG. 10A, when the surface material 11 of the partition wall (partition panel 1) is heated with a burner, as shown in FIG. 10B, immediately after the start of heating (about 5 minutes from the start). Therefore, the surface material 11 began to expand significantly toward the heating side. At that time, in the panel 1, since the surface material 11 and the organic heat insulating board layer 13 are adhered with the organic adhesive, the organic adhesive burns within a few minutes after the start of heating (about 300 to 400 ° C.). The surface material 11 and the organic heat insulating board layer 13 were peeled off, and the surface material 11 was deformed to the heating side.

When heating was continued, the organic heat insulating board layer 13 was carbonized in a state of being adhered to the inorganic board layer 15. At that time, since the surface material 11 swells to the heating side, the organic heat insulating board layer 13 freely expands in the thickness direction of the panel 1 at the time of carbonization, and as a result, a thick heat insulating layer is formed, and as a result, a thick heat insulating layer is formed. The heat entering the inorganic board layer 15 was effectively blocked. Then, within the heating time of 60 minutes, as shown in FIG. 10 (c), almost all of the organic heat insulating board layer 13 was carbonized.

Heating was stopped when 60 minutes had passed from the start of heating. Immediately after that, the oxygen concentration in the refractory furnace facing the panel 1 rapidly increased, and as shown in FIG. 10D, the carbonized organic heat insulating board layer 13 burned again for a certain period of time. In the panel 1 according to the present invention, when the organic heat insulating board layer 13 is carbonized, the surface material 11 is swelled, so that the surface of the organic heat insulating board layer 13 is not completely sealed and is carbonized in a low oxygen state. .. Therefore, the surface material 11 and the organic heat insulating board 13 did not peel off, and the amount of heat generated and the burning time during the re-flaming were smaller than in the case where the organic heat insulating board layer 13 was carbonized in an oxygen-free state.

Then, as shown in FIG. 10 (e), the carbonized organic heat insulating board layer 13 gradually fell off from the surface of the inorganic board layer 15. In the dropped portion, the surface of the exposed inorganic board layer 15 was directly affected by heat and dehydration proceeded, and as shown in FIG. 10 (f), cracks C were generated on the surface of the inorganic board layer 15.

Then, as shown in FIG. 10 (g), when the carbonized organic heat insulating board layer 13 fell off from the inorganic board layer 15, many cracks C were generated in the inorganic board layer 15 due to shrinkage and temperature decrease due to dehydration. As the number of dropped portions increased, many cracks were generated in the inorganic board layer 15. Subsequently, when the dropout and the occurrence of cracks subsided, the temperature of the inorganic board layer 15 decreased due to the decrease in the temperature inside the furnace, and the shrinkage due to the temperature change started. However, even in this state, the inorganic board layer 15 did not collapse and the fire resistance of the partition wall 2 could be ensured. Further, since the panel 1 of the first aspect of the present invention is loaded with the reinforcing material, the cracks are slightly widened, but the dimensional change of the panel as a whole is small, and it is possible to prevent the joints between the panels from widening. .. Therefore, neither the cracks in the inorganic board layer 15 nor the joints between the inorganic boards 15a in one panel and the joints between adjacent panels became large. As a result, the inorganic board 15a only needs to be partially carbonized, and the organic heat insulating board layer 14 on the non-heated side also has a partially carbonized portion P as shown in FIG. 10 (h). I was able to satisfy the fire resistance as a whole.

FIG. 11 is a diagram showing the relationship between the time in the fire resistance test and the temperature of the partition wall. FIG. 11A shows the heating temperature (inside the furnace temperature), FIG. 11B shows the back surface temperature, and the measurement results by 15 thermocouples are shown. Shows. From FIG. 11A, the heating temperature (in-furnace temperature) rises sharply immediately after the start of heating, rises to about 930 ° C. 1 hour after the start of heating, and when the heating is stopped, the temperature drops sharply and the heating is stopped. It can be seen that the temperature drops to about 180 ° C. after 3 hours.

On the other hand, from FIG. 11B, the back surface temperature gradually rises after the start of heating and does not reach 100 ° C. even one hour after the start of heating. However, after the heating is completed, the temperature rises for a certain period of time and rises to about 120 ° C. at the maximum. After that, it can be seen that the temperature gradually decreases and decreases to about 70 ° C. 3 hours after the heating is stopped. As described above, during the fire resistance test, the maximum value of the back surface temperature was maintained at 180 ° C. + atmospheric temperature (25 ° C.), and the average temperature was 140 ° C. + atmospheric temperature (25 ° C.).

According to the present invention, it is possible to provide a partition panel having both high fire resistance and heat resistance, and further to provide a partition wall and a room structure using the same.

1,1a, 1b Partition panel 2,20 Partition wall 3,30 Room structure 11 Surface material 11a, 12a First bent part 11b, 12b, 11bi, 11bo, 12bi, 12bo Second bent part 12 Back material 13,14 Organic Insulation board layer 13a, 14a Recess 13b, 14b Organic insulation board 13c, 14c Face material 13d, 14d Resin foam 15 Inorganic board layer 15a Inorganic board 16,17 Adhesive layer 21 Thermal expansion sheet material 22,23 Floor slab 24a Upper retaining Attachment 24b Upper anchor material 24c Upper attachment material 25a Lower fastener material 25b Lower anchor material 25c Lower attachment material 26 Upper joint material 27 Lower joint material 28 Sealing material 29 Bond breaker 31 Roof 32 Floor 33 Outer wall 34, 35, 36, 37 Rooms 34a, 35a, 36a, 37a Ceiling material 34b, 35b, 36b, 37b Floor material 34c, 35c, 36c, 37c Wall material A Anchor material C Crack h Anchor material slotted hole P Partial carbonized part V screw

Claims (17)

Front and back materials made of metal,
It has a plurality of organic heat insulating board layers arranged between the front surface material and the back surface material, and an inorganic board layer sandwiched between the plurality of organic heat insulating board layers.
The surface material of the plurality of organic heat insulating board layers adjacent to the surface material and the surface material of the plurality of organic heat insulating board layers adjacent to the back surface material and the back surface material of the plurality of organic heat insulating board layers are respectively. A partition panel characterized by being bonded with a urethane resin-based or epoxy resin-based organic adhesive. The partition panel according to claim 1, wherein the inorganic board layer is made of lightweight cellular concrete. The partition panel according to claim 1 or 2, which has a nonflammable reinforcing material inside the inorganic board layer. The partition panel according to any one of claims 1 to 3, wherein one of the plurality of organic heat insulating board layers adjacent to the inorganic board layer and the inorganic board layer are mechanically fixed. Any of claims 1 to 4 , wherein the inorganic board layer is composed of a plurality of inorganic boards adjacent to each other in the in-plane direction, and the edge surfaces of the plurality of inorganic boards are bonded to each other by a fireproof adhesive. The partition panel described in item 1. The inorganic board layer is composed of a plurality of inorganic boards adjacent to each other in the in-plane direction, and a heat-expandable sheet material is loaded between the edge surfaces of the plurality of inorganic boards, claim 1 to 4. The partition panel described in any one of the above. The inorganic board layer is composed of a plurality of inorganic boards adjacent to each other in the in-plane direction, and the plurality of inorganic boards are connected in an out-of-plane direction, an in-plane direction, or an out-of-plane direction and an in-plane direction by a connecting metal fitting. The partition panel according to any one of claims 1 to 6, which is fixed to each other with respect to movement. The partition panel according to any one of claims 1 to 7, wherein the number of the plurality of organic heat insulating board layers is two. The partition panel according to any one of claims 1 to 8, wherein the resin constituting each of the organic heat insulating board layers is made of a thermosetting resin. The partition panel according to any one of claims 1 to 9, wherein the thickness of the organic heat insulating board layer adjacent to the front surface material and the back surface material is 30 mm to 150 mm. The amount of the organic adhesive that adheres the front surface material to the organic heat insulating board layer and the back surface material to the organic heat insulating board layer is 100 to 300 g / m ² , and the organic heat insulating board layer and the non-organic heat insulating board layer are applied. The partition panel according to any one of claims 1 to 10, wherein the coating amount of the organic adhesive for adhering to the machine board layer is 200 to 500 g / m ² . The organic adhesive is burned at 250 to 400 ° C., and the surface material adhered by the organic adhesive and the organic heat insulating board layer are peeled off, according to any one of claims 1 to 11. The partition panel described. It is a vertical partition wall that is built between the floors of the building and fixed at the upper and lower ends.
A partition wall according to any one of claims 1 to 12, wherein the partition panels according to claim 1 to 12 are arranged adjacent to each other in the width direction. The partition wall according to claim 13, wherein the joints between the plurality of partition panels are filled with a heat-expandable sheet material. The partition wall according to claim 13 or 14, wherein the widthwise ends of the front surface material and the widthwise ends of the back surface material are overlapped and connected to each other for the partition panels adjacent to each other. The upper and lower ends of the partition panel are restrained in the out-of-plane direction of the partition panel by the mounting material fixed to the frame of the building, and the fastening material is further attached to the inorganic board layer through the holes of the mounting material. The partition wall according to any one of claims 13 to 15, which is fixed by fastening to the front surface material and the back surface material so as not to penetrate. The interior of a building composed of a roof, a floor and an outer wall is partitioned by the partition wall according to any one of claims 13 to 16, and a highly heat insulating ceiling material is connected to an intermediate position of the partition wall. Thereby, at least one of the partition walls has a room partitioned by the partition wall, the ceiling material, the wall material, and the floor material, and the room has the floor material and the wall material having high heat insulation and the partition wall. A room structure characterized by being separated from the ceiling material.

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