JP7092320B2 - Multilayer ceramic electronic components and their manufacturing methods - Google Patents

Description

The present invention relates to a laminated ceramic electronic component and a method for manufacturing the same, and more specifically, to a highly reliable laminated ceramic electronic component and a method for manufacturing the same.

Generally, electronic components using a ceramic material such as a capacitor, an inductor, a piezoelectric element, a varistor or a thermister include a ceramic body made of the ceramic material, an internal electrode formed inside the ceramic body, and the above internal electrode. It is provided with an external electrode installed on the surface of the ceramic body so as to be connected to.

Among the laminated ceramic electronic components, the laminated ceramic capacitor includes a plurality of laminated dielectric layers, an internal electrode arranged to face each other with a single dielectric layer interposed therebetween, and an external electrode electrically connected to the internal electrode. including.

Multilayer ceramic capacitors are widely used as parts of mobile communication devices such as computers, PDAs, and mobile phones because of their small size, high capacity guaranteed, and easy mounting.

In recent years, along with the high performance and lightness, thinness, shortness and miniaturization of the electric and electronic equipment industries, there is a demand for miniaturization, high performance and low cost of electronic parts.

In particular, as CPU speeds, equipment miniaturization and weight reduction, digitization, and high functionality progress, monolithic ceramic capacitors are also becoming smaller, thinner, higher capacity, and lower impedance in the high frequency range. Research and development to realize the characteristics are being actively carried out.

On the other hand, in order to match the sintering shrinkage behavior between the plurality of dielectric layers and the internal electrodes, ceramic powder is added as an additive in the internal electrode forming paste.

The ceramic additive may escape to the dielectric layer during the firing process, inducing abnormal particle growth at the interface between the dielectric layer and the internal electrode.

Therefore, the thickness of the dielectric layer may increase, which may lead to a decrease in the capacitance of the laminated ceramic capacitor and may act as a cause of a decrease in the connectability of the internal electrodes.

On the other hand, since it is necessary to minimize the contact between the metal particles in order to suppress the sintering of the internal electrode, fine barium titanate powder is added as an additive in the internal electrode paste. As the content increases, the contact between the metal particles can be hindered, so that the sintering start temperature can be increased. However, when the content exceeds a predetermined content, the metal filling rate decreases, and after sintering, the ceramic additive having a predetermined ratio or more escapes to the dielectric layer and the ceramic content increases, so that the electrode connectability decreases.

Therefore, there is a need for a method of maximally suppressing metal sintering, increasing the metal filling rate, improving electrode connectability, and reducing the electrode thickness.

Japanese Unexamined Patent Publication No. 2004-07994

The present invention relates to a laminated ceramic electronic component and a method for manufacturing the same, and more specifically, to a highly reliable laminated ceramic electronic component and a method for manufacturing the same.

One embodiment of the present invention includes a ceramic body including an internal electrode in which a ceramic additive is arranged, and an external electrode formed on the outside of the ceramic body and electrically connected to the internal electrode. The densities of the ceramic additives disposed inside the internal electrodes provide laminated ceramic electronic components that differ from each other in the central region and the upper and lower interface of the internal electrodes.

In another embodiment of the present invention, a step of providing a ceramic green sheet, a step of forming an internal electrode pattern with a conductive paste containing a conductive metal and a ceramic additive, and a step of forming the internal electrode pattern are ceramic greens. The conductive paste comprises a step of laminating sheets to form a ceramic laminate and a step of firing the ceramic laminate to form a ceramic body including a dielectric layer and an internal electrode, and the conductive paste is added with ceramic. The internal electrode pattern is composed of first and second conductive pastes having different agent contents, and the internal electrode pattern has an electrode shrinkage suppressing layer having a high ceramic additive content and an increase in filling rate having a low ceramic additive content. Provided is a method for manufacturing a laminated ceramic electronic component including a layer.

According to one embodiment of the present invention, the internal electrodes are double or triple printed or more, and at least one layer is increased in content of the ceramic additive to maximize the shrinkage of the electrodes, and the remaining layers are. By minimizing the content of the ceramic additive and increasing the metal filling rate, it is possible to form an internal electrode having excellent electrode connectivity and a thin thickness after sintering.

Further, by mixing a layer having a high content of the ceramic additive and a layer having a low content of the ceramic additive at a predetermined ratio and applying them in multiple layers, the electrode connectability does not deteriorate, so that the capacity is high, electrode aggregation does not occur, and the withstand voltage. It is possible to realize a laminated ceramic electronic component having excellent characteristics.

It is a schematic perspective view which shows the laminated ceramic capacitor which concerns on one Embodiment of this invention. FIG. 3 is a schematic cross-sectional view showing a monolithic ceramic capacitor taken along the I-I'line of FIG. It is an enlarged view of the S region of FIG. 2 which concerns on 1st Embodiment of this invention. It is an enlarged view of the S region of FIG. 2 which concerns on 2nd Embodiment of this invention. It is an enlarged view of the S region of FIG. 2 which concerns on 3rd Embodiment of this invention. It is a schematic diagram of the internal electrode pattern applied on the ceramic green sheet during the manufacturing process of the laminated ceramic capacitor which concerns on 1st to 3rd Embodiment of this invention. It is a schematic diagram of the internal electrode pattern applied on the ceramic green sheet during the manufacturing process of the laminated ceramic capacitor which concerns on 1st to 3rd Embodiment of this invention. It is a schematic diagram of the internal electrode pattern applied on the ceramic green sheet during the manufacturing process of the laminated ceramic capacitor which concerns on 1st to 3rd Embodiment of this invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, embodiments of the invention can be transformed into various other embodiments, and the scope of the invention is not limited to the embodiments described below. Also, embodiments of the invention are provided to more fully explain the invention to those with average knowledge in the art. Therefore, the shape and size of the elements in the drawings may be exaggerated for a clearer explanation.

One embodiment of the present invention relates to a ceramic electronic component, and the electronic component using a ceramic material includes a capacitor, an inductor, a piezoelectric element, a varistor, a thermistor, and the like. In the following, a multilayer ceramic capacitor will be described as an example of ceramic electronic components.

FIG. 1 is a schematic perspective view showing a multilayer ceramic capacitor according to an embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view showing a monolithic ceramic capacitor taken along the I-I'line of FIG.

Referring to FIGS. 1 and 2, the laminated ceramic capacitor according to the embodiment of the present invention has a ceramic body 110, internal electrodes 121 and 122 formed inside the ceramic body, and outside the ceramic body 110. External electrodes 131, 132 and the formed can be included.

In one embodiment of the present invention, the "length direction" of the monolithic ceramic capacitor is defined in the "L" direction of FIG. 1, the "width direction" is defined in the "W" direction, and the "thickness direction" is defined in the "T" direction. be able to. The above-mentioned "thickness direction" can be used as the same concept as the direction in which the dielectric layers are stacked, that is, the "stacking direction".

The shape of the ceramic body 110 is not particularly limited, but according to one embodiment of the present invention, it can have a hexahedron shape.

The ceramic body 110 can be formed by laminating a plurality of dielectric layers 111.

The plurality of dielectric layers 111 constituting the ceramic body 110 may be in a sintered state, and may be integrated so that the boundaries between adjacent dielectric layers cannot be confirmed.

The dielectric layer 111 can be formed by sintering a ceramic green sheet containing ceramic powder.

The ceramic powder is not particularly limited as long as it is generally used in the art.

Although not limited to this, for example, BaTiO ₃ ceramic powder may be contained.

The BaTiO ₃ ceramic powder is not limited to this, and for example, Ca, Zr and the like are partially dissolved in BaTiO ₃ (Ba _1-x Ca _x ) TiO ₃ and Ba (Ti _1-y ). Ca _y ) O ₃ , (Ba _1-x Ca _x ) (Ti _{1-y Zry} ) O ₃ or Ba (Ti _{1-y Zry} ) O ₃ and the like.

Further, the ceramic green sheet may contain a transition metal, a rare earth element, Mg, Al and the like together with the ceramic powder.

The thickness of the monodielectric layer 111 can be appropriately changed according to the capacitance design of the laminated ceramic capacitor.

Although not limited to this, for example, the thickness of the dielectric layer 111 formed between two adjacent internal electrodes after sintering may be 0.6 μm or less.

In one embodiment of the invention, the thickness of the dielectric layer 111 can mean an average thickness.

As shown in FIG. 2, the average thickness of the dielectric layer 111 can be measured by scanning an image of a cross section of the ceramic body 110 in the length direction with a scanning electron microscope (SEM).

For example, as shown in FIG. 2, the length and thickness direction LT cross section cut at the center of the width W direction of the ceramic body 110 was extracted from an image scanned by a scanning electron microscope (SEM). The thickness of any dielectric layer can be measured at 30 points at equal intervals in the length direction, and the average value can be measured.

The 30 points at equal intervals can be measured at the capacitance forming portion which means the region where the internal electrodes 121 and 122 overlap.

Further, if the measurement of such an average value is extended to 10 or more dielectric layers and the average value is measured, the average thickness of the dielectric layers can be further generalized.

Internal electrodes 121 and 122 can be arranged inside the ceramic body 110.

The internal electrodes 121 and 122 are formed on a ceramic green sheet and laminated, and can be formed inside the ceramic body 110 by sintering with a monodielectric layer interposed therebetween.

The internal electrodes can be a pair of a first internal electrode 121 and a second internal electrode 122 having different polarities from each other, and can be arranged so as to face each other along the stacking direction of the dielectric layer.

As shown in FIG. 2, the ends of the first and second internal electrodes 121 and 122 can be alternately exposed on one surface in the length direction of the ceramic body 110.

Further, although not shown, according to one embodiment of the present invention, the first and second internal electrodes may have a lead portion and may be exposed to the same surface of the ceramic body via the lead portion. Alternatively, the first and second internal electrodes may have a lead portion and may be exposed to one or more surfaces of the ceramic body via the lead portion.

The thickness of the one internal electrodes 121 and 122 is not particularly limited, but may be, for example, 0.5 μm or less.

Alternatively, the thickness of one internal electrode 121, 122 may be 0.1 to 0.5 μm. Alternatively, the thickness of one internal electrode 121, 122 may be 0.3 to 0.5 μm.

According to one embodiment of the present invention, the dielectric layer on which the internal electrodes are formed can be laminated with 200 or more layers. More specific matters regarding this will be described later.

According to one embodiment of the present invention, external electrodes 131 and 132 can be formed on the outside of the ceramic body 110, and the external electrodes 131 and 132 are electrically connected to the internal electrodes 121 and 122. be able to.

More specifically, the first external electrode 131 electrically connected to the first internal electrode 121 exposed on one surface of the ceramic body 110, and the second internal electrode 122 exposed on the other surface of the ceramic body 110 and electricity. It can be composed of a second external electrode connected to the surface.

Further, although not shown, a plurality of external electrodes may be formed in order to be connected to the first and second internal electrodes exposed on the ceramic body.

The external electrodes 131 and 132 can be formed of a conductive paste containing a metal powder.

The metal powder contained in the conductive paste is not particularly limited, and for example, Ni, Cu, or an alloy thereof may be used.

The thicknesses of the external electrodes 131 and 132 can be appropriately determined depending on the intended use, but may be, for example, about 10 to 50 μm.

Ceramic additives are arranged inside the internal electrodes 121 and 122 according to the embodiment of the present invention, and the density of the ceramic additives 11 arranged inside the internal electrodes 121 and 122 is the internal electrodes 121 and 122. In the central region and the upper and lower interface, they are different from each other.

A method for adjusting the densities of the ceramic additives 11 arranged inside the internal electrodes 121 and 122 so as to be different from each other in the central region and the upper and lower boundary surfaces in the internal electrodes 121 and 122 is to use the internal electrodes 121 and 122. It can be realized by adjusting the content of the ceramic additive 11 in the composition of the conductive paste to be formed and applying the internal electrodes in double or triple or more multiple times as described later.

More details on this will be described later.

Generally, a ceramic powder is added as an additive in the paste for forming an internal electrode in order to match the sintering shrinkage behavior of the plurality of dielectric layers and the internal electrode.

The ceramic additive may escape to the dielectric layer during the firing process and induce abnormal particle growth at the interface between the dielectric layer and the internal electrode.

Therefore, the thickness of the dielectric layer may increase, which may lead to a decrease in the capacitance of the laminated ceramic capacitor and may act as a cause of a decrease in the connectability of the internal electrodes.

On the other hand, since it is necessary to minimize the contact between the metal particles in order to suppress the sintering of the internal electrode, fine barium titanate powder is added as an additive in the internal electrode paste. As the content increases, the contact between the metal particles may be hindered, and the sintering start temperature may be increased.

However, when the content exceeds a predetermined content, the metal filling rate decreases, and after sintering, a predetermined ratio or more of the ceramic additive escapes to the dielectric layer, and the ceramic content increases, so that the electrode connectivity decreases. ..

That is, when the metal sintering is suppressed to the maximum and the metal filling rate is increased, the electrode connectability can be improved and the electrode thickness can be reduced.

In particular, in recent years, with high-capacity thin-layered multilayer ceramic capacitors, it is possible to achieve the target capacity when the thickness of the internal electrodes is thin and the electrode connectivity is excellent, but the electrode connectivity is reduced. As the thickness of the internal electrode increases, it is not possible to realize a thin layer of the internal electrode.

Further, when the electrode connectability is deteriorated, problems such as a decrease in capacitance due to a decrease in the overlapping area of the electrodes and a decrease in withstand voltage characteristics due to electrode aggregation occur.

However, according to one embodiment of the present invention, the ceramic additive 11 is arranged inside the internal electrodes 121 and 122, and the density of the ceramic additive 11 arranged inside the internal electrodes 121 and 122 is the density of the internal electrode. The above problems can be solved by adjusting 121 and 122 so that the central region and the upper and lower boundary surfaces are different from each other.

That is, according to one embodiment of the present invention, the internal electrodes are printed in double or triple layers or more, and at least one layer is increased in the content of the ceramic additive to suppress the shrinkage of the electrodes to the maximum, and the rest. By minimizing the content of the ceramic additive and increasing the metal filling rate, the layer can form an internal electrode having excellent electrode connectivity and a thin thickness after sintering.

By applying the internal electrode as described above, the densities of the ceramic additives arranged inside the internal electrode after firing become different from each other in the central region and the upper and lower boundary surfaces in the internal electrode. , It is possible to form an internal electrode having excellent electrode connectivity and a thin thickness.

Further, by mixing a layer having a high content of the ceramic additive 11 and a layer having a low content in a predetermined ratio and applying them in multiple layers, the electrode connectability does not decrease, so that the capacity is high, electrode aggregation does not occur, and resistance to the electrode is increased. It is possible to realize a laminated ceramic electronic component having excellent voltage characteristics.

FIG. 3 is an enlarged view of an S region of FIG. 2 according to the first embodiment of the present invention.

Referring to FIG. 3, the density of the ceramic additive 11 is higher in the central region of the internal electrodes 121 and 122 than in the upper and lower boundary surfaces.

The method of adjusting the density of the ceramic additive 11 so that the central region of the internal electrodes 121 and 122 is higher than the upper and lower boundary surfaces minimizes the content of the ceramic additive and increases the metal filling rate. It can be done by arranging a layer having a high content of the ceramic additive and suppressing the shrinkage of the electrode to the maximum between the layers.

That is, a layer that minimizes the content of the ceramic additive and increases the metal filling rate is applied on the ceramic green sheet, and the content of the ceramic additive is high on the upper portion to suppress the shrinkage of the electrode to the maximum. This can be done by applying a layer and then applying a layer on top of it that minimizes the content of the ceramic additive and increases the metal filling factor.

When the internal electrode is fired by performing the coating step as described above, the density of the ceramic additive 11 is higher in the central region of the internal electrodes 121 and 122 than the upper and lower boundary surfaces.

FIG. 4 is an enlarged view of the S region of FIG. 2 according to the second embodiment of the present invention.

Referring to FIG. 4, the density of the ceramic additive 11 is higher in the internal electrodes 121 and 122 at the upper boundary surface than at the central region and the lower boundary surface.

The method of adjusting the density of the ceramic additive 11 so that the upper boundary surface of the internal electrodes 121 and 122 is higher than the central region and the lower boundary surface is a method of minimizing the content of the ceramic additive to the metal. This can be done by applying at least two or more layers that increase the filling rate, and then arranging a layer having a high content of the ceramic additive and suppressing the shrinkage of the electrode to the maximum.

That is, a layer that minimizes the content of the ceramic additive and increases the metal filling rate is applied on the ceramic green sheet, and a layer that minimizes the content of the ceramic additive and increases the metal filling rate is applied above the layer. After coating, a layer having a high content of the ceramic additive and suppressing the shrinkage of the electrode to the maximum can be applied to the upper portion thereof.

When the internal electrode is fired by performing the coating step as described above, the density of the ceramic additive 11 is higher in the internal electrodes 121 and 122 at the upper boundary surface than at the central region and the lower boundary surface.

FIG. 5 is an enlarged view of the S region of FIG. 2 according to the third embodiment of the present invention.

Referring to FIG. 5, the density of the ceramic additive 11 is higher in the inner electrodes 121 and 122 at the lower boundary surface than at the central region and the upper boundary surface.

In the method of adjusting the density of the ceramic additive 11 so that the lower boundary surface of the internal electrodes 121 and 122 is higher than the central region and the upper boundary surface, the content of the ceramic additive is high and the electrode shrinks. This can be done by applying at least two or more layers on the upper portion thereof, which minimizes the content of the ceramic additive and increases the metal filling rate.

That is, a layer having a high content of the ceramic additive and suppressing the shrinkage of the electrode is applied on the ceramic green sheet, and the content of the ceramic additive is minimized and the metal filling rate is increased on the upper portion thereof. This can be done by applying a layer and then applying a layer on top of it that minimizes the content of the ceramic additive and increases the metal filling factor.

When the internal electrode is fired by performing the coating step as described above, the density of the ceramic additive 11 is higher in the inner electrodes 121 and 122 at the lower boundary surface than at the central region and the upper boundary surface.

According to one embodiment of the present invention, the ratio of the thickness of the other region to the thickness of the dense region of the ceramic additive 11 can satisfy 0.5 to 2.0.

When the ratio of the thickness of the other region to the thickness of the region where the density of the ceramic additive 11 is high is 2.0 or less, the electrode shrinkage can be suppressed, and when it exceeds 2.0, the electrode shrinkage occurs. The restraining force is weakened and the electrode connectivity is reduced, which reduces the capacitance. In addition, electrode aggregation will occur, and the withstand voltage characteristics will deteriorate.

When the ratio of the thickness of the other region to the thickness of the region where the density of the ceramic additive 11 is high is formed to be 0.5 or more, the effect of reducing the electrode thickness can be obtained by increasing the filling rate. .. In this case, since the ratio of the electrode shrinkage suppressing layer is high, the electrode connectability does not decrease, so that the capacitance does not decrease and the electrode aggregation does not occur, so that the withstand voltage characteristics can be satisfied.

According to one embodiment of the present invention, the densities of the ceramic additives 11 arranged inside the internal electrodes 121 and 122 are adjusted so as to be different from each other in the central region and the upper and lower boundary surfaces in the internal electrodes 121 and 122. Thereby, the connectivity of the internal electrodes can be 90% or more.

According to one embodiment of the present invention, the connectivity of the internal electrode is the ratio of the length of the portion where the internal electrode is actually formed to the total length of the internal electrode (the length of the portion where the internal electrode is actually formed / the inside). It can be defined by the total length of the electrode).

The total length of the internal electrode and the length of the portion where the internal electrode is actually formed can be measured by using an optical image obtained by scanning a cross section of the laminated ceramic capacitor as described above.

More specifically, in an image obtained by scanning a cross section in the length direction cut at the central portion in the width direction of the ceramic body, the ratio of the length of the portion where the internal electrode is actually formed to the total length of the internal electrode is measured. Can be done.

In one embodiment of the present invention, the total length of the internal electrode can mean the length including the gap formed between the internal electrodes in one internal electrode, and the portion where the internal electrode is actually formed. The length of can mean a length other than the gap formed between the internal electrodes in one internal electrode. As described above, the gap means pores penetrating the internal electrode, and does not include pores formed only on a part of the surface of the internal electrode or inside the internal electrode.

According to one embodiment of the present invention, the actual length of the internal electrode can be measured by subtracting the length of the gap (gap) from the total length of the internal electrode.

According to one embodiment of the present invention, the thickness of one internal electrode 121, 122 may be 0.5 μm or less.

Alternatively, the thickness of one internal electrode 121, 122 may be 0.1 to 0.5 μm. Alternatively, the thickness of one internal electrode 121, 122 may be 0.3 to 0.5 μm.

6a to 6c are schematic views of an internal electrode pattern applied on a ceramic green sheet during the manufacturing process of the laminated ceramic capacitor according to the first to third embodiments of the present invention.

According to another embodiment of the present invention, a step of providing a ceramic green sheet, a step of forming an internal electrode pattern with a conductive paste containing a conductive metal and a ceramic additive, and a step of forming the internal electrode pattern of the ceramic. The conductive paste comprises a step of laminating green sheets to form a ceramic laminate and a step of firing the ceramic laminate to form a ceramic body including a dielectric layer and an internal electrode. The internal electrode pattern is composed of first and second conductive pastes having different contents of ceramic additives, and the internal electrode pattern has an electrode shrinkage suppressing layer having a high content of ceramic additives and a low content of ceramic additives. Provided is a method for manufacturing a laminated ceramic electronic component including a filling rate increasing layer.

Hereinafter, a method for manufacturing a multilayer ceramic capacitor according to another embodiment of the present invention will be described.

According to one embodiment of the present invention, a plurality of ceramic green sheets can be provided. The ceramic green sheet can be produced by mixing ceramic powder, a binder, a solvent and the like to produce a slurry, and the slurry can be produced into a sheet having a thickness of several μm by a doctor blade method. The ceramic green sheet can be subsequently sintered to form the monodielectric layer 111 as shown in FIG.

Next, the conductive paste for internal electrodes can be applied onto the ceramic green sheet to form an internal electrode pattern. The internal electrode pattern can be formed by a screen printing method or a gravure printing method.

Referring to FIGS. 6a to 6c, the conductive paste is composed of first and second conductive pastes having different ceramic additive contents, and the internal electrode pattern has a large ceramic additive content. It includes an electrode shrinkage suppressing layer L1 and a filling rate increasing layer L2 having a low content of ceramic additives.

The thickness of the electrode shrinkage suppressing layer L1 and the filling rate increasing layer L2 may be larger than the diameter of the two or more conductive metal particles, but is not necessarily limited to this.

The ratio of the thickness of the filling rate increasing layer L2 to the thickness of the electrode shrinkage suppressing layer L1 can satisfy 0.5 to 2.0.

Referring to FIG. 6a, a filling rate increasing layer L2 for minimizing the content of the ceramic additive 11 and increasing the filling rate of the metal 21 is coated on the ceramic green sheet 10, and the ceramic additive 11 is contained in the upper portion thereof. An electrode shrinkage suppression layer L1 that has a high amount and suppresses the shrinkage of the electrode to the maximum is applied, and then the filling rate is increased by minimizing the content of the ceramic additive 11 and increasing the filling rate of the metal 21 on the upper portion thereof. The layer L2 can be applied to form an internal electrode pattern.

When the internal electrode is fired by performing the coating step as described above, the density of the ceramic additive 11 is such that the central region of the internal electrodes 121 and 122 is higher than the upper and lower boundary surfaces.

Referring to FIG. 6b, a filling factor increasing layer L2 for minimizing the content of the ceramic additive 11 and increasing the filling rate of the metal 21 is applied on the ceramic green sheet 10, and the content of the ceramic additive 11 is applied on the upper portion thereof. The internal electrode pattern can be formed by applying the electrode shrinkage suppressing layer L1 which is high in temperature and suppresses the shrinkage of the electrode to the maximum.

When the internal electrode is fired by performing the coating step as described above, the density of the ceramic additive 11 is higher in the internal electrodes 121 and 122 at the upper boundary surface than at the central region and the lower boundary surface.

At this time, after at least two or more layers of the filling rate increasing layer L2 for minimizing the content of the ceramic additive 11 and increasing the filling rate of the metal are applied, the content of the ceramic additive is high on the upper portion thereof and the electrode shrinks. It is also possible to apply the electrode shrinkage suppressing layer L1 that suppresses the above.

Referring to FIG. 6c, the electrode shrinkage suppressing layer L1 having a high content of the ceramic additive 11 and suppressing the shrinkage of the electrode to the maximum is applied on the ceramic green sheet 10, and the content of the ceramic additive is applied on the upper portion thereof. An internal electrode pattern can be formed by applying the filling rate increasing layer L2 that minimizes and increases the filling rate of the metal.

At this time, after the electrode shrinkage suppressing layer L1 having a high content of the ceramic additive 11 and suppressing the shrinkage of the electrode to the maximum is applied, the content of the ceramic additive 11 is minimized and the metal 21 is filled on the upper portion thereof. It is also possible to apply at least two or more layers of the filling rate increasing layer L2 that increase the rate.

When the internal electrode is fired by performing the coating step as described above, the density of the ceramic additive 11 is higher in the inner electrodes 121 and 122 at the lower boundary surface than at the central region and the upper boundary surface.

Next, the ceramic green sheet on which the internal electrode pattern is formed can be laminated and pressed from the stacking direction to be crimped. This makes it possible to manufacture a ceramic laminate on which an internal electrode pattern is formed.

Next, the ceramic laminate can be cut into chips by cutting each region corresponding to one capacitor.

At this time, one end of the internal electrode pattern can be cut so as to be alternately exposed via the side surface.

Next, the ceramic main body can be manufactured by firing the chipped laminate.

As described above, the firing step can be performed in a reducing atmosphere.

Further, the firing step can be performed by adjusting the heating rate, and is not limited to this, but the heating rate is 30 ° C./60s to 50 ° C./60s at 700 ° C. or lower. You may.

Next, the outer electrode can be formed so as to cover the side surface of the ceramic body and to be electrically connected to the internal electrode exposed on the side surface of the ceramic body. After that, a plating layer such as nickel or tin can be formed on the surface of the external electrode.

As a result, the connectivity of the internal electrodes can be excellent, and a high capacity can be realized.

According to one embodiment of the present invention, as shown in Table 1 below, the electrode connectivity, the effect of reducing the internal electrode thickness, and the capacity depending on the ratio of the thickness of the filling rate increasing layer L2 to the thickness of the electrode shrinkage suppressing layer L1. And the evaluation results of the withstand voltage characteristics were compared.

Referring to Table 1 above, in Sample 1 and Sample 2, the ratio of the thickness of the filling rate increasing layer L2 to the thickness of the electrode shrinkage suppressing layer L1 is less than 0.5, and the effect of reducing the electrode thickness is achieved. It turns out that there is no.

Further, in the sample 9 and the sample 10, when the ratio of the thickness of the filling rate increasing layer L2 to the thickness of the electrode shrinkage suppressing layer L1 exceeds 2.0, the electrode shrinkage suppressing force is deteriorated and the electrode connectability is improved. It can be seen that the volume decreases, the capacitance decreases, electrode aggregation occurs, and the withstand voltage characteristics decrease.

On the other hand, Samples 3 to 8 are cases where the numerical range of the present invention is satisfied, and the connectability of the internal electrodes is 90% or more, the effect of reducing the electrode thickness is excellent, and the high-capacity lamination having excellent withstand voltage characteristics. It can be seen that a ceramic capacitor can be realized.

Although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited to this, and various modifications and modifications are made within the scope of the technical idea of the present invention described in the claims. It is clear to those with ordinary knowledge in the art that this is possible.
According to the present application, the following items are also disclosed.
[Item 1]
A ceramic body containing an internal electrode with a ceramic additive placed inside,
Including an external electrode formed on the outside of the ceramic body and electrically connected to the internal electrode.
A laminated ceramic electronic component in which the densities of the ceramic additives arranged inside the internal electrodes differ from each other in the central region and the upper and lower boundary surfaces in the internal electrodes.
[Item 2]
Item 2. The laminated ceramic electronic component according to Item 1, wherein the density of the ceramic additive is higher in the central region of the internal electrode than the upper and lower boundary surfaces.
[Item 3]
The laminated ceramic electronic component according to item 1, wherein the density of the ceramic additive is higher in the upper boundary surface than in the central region and the lower boundary surface in the internal electrode.
[Item 4]
The laminated ceramic electronic component according to item 1, wherein the density of the ceramic additive is higher in the lower boundary surface than in the central region and the upper boundary surface in the internal electrode.
[Item 5]
The laminated ceramic electronic component according to any one of items 1 to 4, wherein the ratio of the thickness of the other region to the thickness of the region having a high density of the ceramic additive satisfies 0.5 to 2.0.
[Item 6]
The laminated ceramic electronic component according to any one of items 1 to 5, wherein the internal electrode has an internal electrode connectability of 90% or more, which is defined by the ratio of the length of the actual internal electrode to the total length.
[Item 7]
At the stage of installing the ceramic green sheet,
At the stage of forming an internal electrode pattern with a conductive paste containing a conductive metal and a ceramic additive,
At the stage of laminating the ceramic green sheets on which the above internal electrode pattern is formed to form a ceramic laminate,
Including the step of firing the ceramic laminate to form a ceramic body including a dielectric layer and internal electrodes.
The conductive paste is composed of first and second conductive pastes having different ceramic additive contents, and the internal electrode pattern has an electrode shrinkage suppressing layer having a large ceramic additive content and a ceramic additive. A method for manufacturing a laminated ceramic electronic component, including a layer with an increased filling rate having a low content of.
[Item 8]
The method for manufacturing a laminated ceramic electronic component according to item 7, wherein the thickness of the electrode shrinkage suppressing layer and the filling rate increasing layer is larger than the diameter of two or more conductive metal particles.
[Item 9]
The method for manufacturing a laminated ceramic electronic component according to item 7 or 8, wherein the ratio of the thickness of the filling rate increasing layer to the thickness of the electrode shrinkage suppressing layer satisfies 0.5 to 2.0.
[Item 10]
Items 7 to 9 in which the ceramic additive is arranged inside the internal electrode, and the densities of the ceramic additives arranged inside the internal electrode are different from each other in the central region and the upper and lower boundary surfaces in the internal electrode. The method for manufacturing a laminated ceramic electronic component according to any one of the above items.
[Item 11]
The method for manufacturing a laminated ceramic electronic component according to item 10, wherein the density of the ceramic additive is higher in the central region than the upper and lower boundary surfaces in the internal electrode.
[Item 12]
The method for manufacturing a laminated ceramic electronic component according to item 10, wherein the density of the ceramic additive is higher than that of the central region and the lower boundary surface in the internal electrode.
[Item 13]
The method for manufacturing a laminated ceramic electronic component according to item 10, wherein the density of the ceramic additive is higher in the lower boundary surface than in the central region and the upper boundary surface in the internal electrode.
[Item 14]
The production of a laminated ceramic electronic component according to any one of items 7 to 13, wherein the internal electrode has an internal electrode connectability of 90% or more, which is defined by the ratio of the length of the actual internal electrode to the total length. Method.

110 Ceramic body 111 Dielectric layer 121, 122 Internal electrode 131, 132 External electrode 11 Ceramic additive 21 Metal

Claims (9)

A ceramic body containing an internal electrode with a ceramic additive placed inside,
Includes an external electrode formed on the outside of the ceramic body and electrically coupled to the internal electrode.
In the internal electrode, the ceramic additive is arranged on the central region, the upper boundary surface, and the lower boundary surface, respectively.
The ceramic additives arranged inside the internal electrode have a combination having different densities for the central region, the upper boundary surface, and the lower boundary surface in the internal electrode.
The density of the ceramic additive is such that the central region of the internal electrode is higher than the upper and lower interface, the upper interface is higher than the central region and the lower interface, or the lower interface is the central region and the upper part. Multilayer ceramic electronic components higher than the interface. The laminated ceramic electronic component according to claim 1, wherein the ratio of the thickness of the other region to the thickness of the region where the density of the ceramic additive is high satisfies 0.5 to 2.0. The laminated ceramic electronic component according to claim 1 or 2, wherein the thickness of the internal electrode is in the range of 0.1 μm to 0.5 μm. The laminated ceramic electronic component according to any one of claims 1 to 3, wherein the internal electrode has an internal electrode connectivity of 90% or more, which is defined by the ratio of the length of the actual internal electrode to the length. .. At the stage of installing the ceramic green sheet,
At the stage of forming an internal electrode pattern with a conductive paste containing a conductive metal and a ceramic additive,
The stage of laminating the ceramic green sheets on which the internal electrode pattern is formed to form a ceramic laminate, and
Including the step of firing the ceramic laminate to form a ceramic body including a dielectric layer and internal electrodes.
The conductive paste is composed of first and second conductive pastes having different ceramic additive contents, and the internal electrode pattern has an electrode shrinkage suppressing layer having a large ceramic additive content and a ceramic additive. Including a filling rate increasing layer with a low content of
In the internal electrode, a ceramic additive is arranged inside, and in the internal electrode, the ceramic additive is arranged in the central region, the upper boundary surface, and the lower boundary surface, respectively, and the ceramic additive is arranged inside the internal electrode. There are combinations of ceramic additives having different densities for the central region, the upper boundary surface, and the lower boundary surface in the internal electrode.
The density of the ceramic additive is such that the central region of the internal electrode is higher than the upper and lower interface, the upper interface is higher than the central region and the lower interface, or the lower interface is the central region and the upper part. A method of manufacturing laminated ceramic electronic components that is higher than the interface. The method for manufacturing a laminated ceramic electronic component according to claim 5, wherein the ratio of the thickness of the filling rate increasing layer to the thickness of the electrode shrinkage suppressing layer satisfies 0.5 to 2.0. The method for manufacturing a laminated ceramic electronic component according to claim 5 or 6, wherein the thickness of the internal electrode is in the range of 0.1 μm to 0.5 μm. The method for manufacturing a laminated ceramic electronic component according to any one of claims 5 to 7, wherein the thickness of the electrode shrinkage suppressing layer and the filling rate increasing layer is larger than the diameter of two or more conductive metal particles. .. The laminated ceramic electronic component according to any one of claims 5 to 8, wherein the internal electrode has an internal electrode connectability of 90% or more, which is defined by the ratio of the length of the actual internal electrode to the length. Manufacturing method.

Images