JP7092069B2 - Manufacturing method of resin parts and resin parts - Google Patents

Description

The present invention relates to a method for manufacturing a resin component provided with an IC chip capable of wireless communication, and a resin component.

An IC (Integrated Circuit) tag capable of reading and writing data in a non-contact manner using radio waves in the UHF band, for example, by wireless communication is known as a conventional technique. The IC tag is also referred to as an RFID (Radio Frequency Identification) tag. By attaching such an IC tag to various products, it is possible to read the identification information for each product, and it can be used for product distribution, life and maintenance history management, or production control of equipment incorporating the product. It is done.

Japanese Unexamined Patent Publication No. 2018-136746

However, in the conventional technique as described above, since the resin for embedding the IC chip is injection-molded, there is a problem that it is not always suitable for low-volume, high-mix production. Further, it has been difficult to manufacture a resin component having a design in which the antenna and the resin surface are flat while the antenna of the IC tag is exposed on the surface.

One aspect of the present invention realizes a method for manufacturing a resin component equipped with an IC tag, which can be used for low-volume, high-mix production, and further, a resin equipped with an IC tag, which can increase the degree of freedom in the form of an antenna. The purpose is to realize a manufacturing method for parts.

The present invention adopts the following configuration in order to solve the above-mentioned problems.

The method (1) for manufacturing a resin component according to one aspect of the present invention is an IC chip that stores identification data of the resin component or a product to which the resin component is mounted by a 3D printer on an intermediate forming body of the resin component. It is provided with a step of embedding the resin in a resin and a step of embedding an antenna for wireless communication of the IC chip in the resin by a 3D printer on the intermediate forming body of the resin component.

According to the above configuration, it is possible to realize a method for manufacturing a resin part equipped with an IC tag, which can be used for low-volume, high-mix production. Moreover, since the IC tag is embedded in the resin component itself, it is possible to use the IC tag for production control of products using the resin component. Therefore, it is possible to improve the traceability of products produced by using the resin parts. In addition, it is possible to realize a method of manufacturing a resin component equipped with an IC tag that can increase the degree of freedom in the form of the antenna.

The method for manufacturing a resin component according to one aspect (2) of the present invention is the step of placing the IC chip on the intermediate forming body of the resin component in the method (1) for manufacturing the resin component according to the one aspect. A step of forming the antenna on at least a part of the IC chip, a step of placing the IC chip, a step of embedding the IC chip in a resin, and a step of forming the antenna. A step of embedding the antenna in a resin and a step of embedding the antenna in a resin may be provided in this order.

According to the above configuration, it is possible to realize a method for manufacturing a resin part equipped with an IC tag, which can be used for low-volume, high-mix production. Moreover, since the IC tag is embedded in the resin component itself, it is possible to use the IC tag for production control of products using the resin component. Therefore, it is possible to improve the traceability of products produced by using the resin parts. In addition, it is possible to realize a method of manufacturing a resin component equipped with an IC tag that can increase the degree of freedom in the form of the antenna.

In the method for manufacturing a resin component according to the one side surface (2), the step of embedding the antenna in the resin includes a configuration in which the upper surface of the antenna is finished so as to form a continuous surface with the surface of the surrounding resin. You may.

According to the above configuration, it is possible to manufacture a resin part having excellent design. Further, since there is no step between the antenna and the resin, it is possible to manufacture a resin component in which dirt does not accumulate on the step and the performance of the antenna is not deteriorated by the dirt.

In the method for manufacturing a resin component according to the one side surface (2), even if the step of embedding the IC chip in the resin is provided so that at least a part of the upper surface of the IC chip is exposed. good.

According to the above configuration, the IC chip and the antenna can be reliably and directly connected to each other.

In the method for manufacturing a resin component according to the one side surface (2), the step of embedding the IC chip in the resin may have a configuration executed so that the upper surface of the IC chip is also covered with the resin.

According to the above configuration, it is possible to manufacture a resin component equipped with an IC tag in which an IC chip and an antenna are electromagnetically coupled.

In the method for manufacturing a resin component according to the one side surface (2), the step of embedding the antenna in the resin may be provided so that the upper surface of the antenna is also covered with the resin.

According to the above configuration, it is possible to manufacture a resin component in which the antenna of the IC tag is protected. Further, according to the above configuration, it is possible to manufacture a miniaturized, higher performance IC tag antenna.

The method for manufacturing a resin component according to one aspect (3) of the present invention includes a step of forming the antenna on an intermediate formed body of the resin component in the method (1) for manufacturing a resin component according to the one aspect. A step of mounting the IC chip on a part of the antenna is further provided, a step of forming the antenna, a step of embedding the antenna in a resin, and a step of mounting the IC chip. , The step of embedding the IC chip in the resin and the step of embedding the IC chip in the resin may be provided in this order.

According to the above configuration, it is possible to realize a method for manufacturing a resin part equipped with an IC tag, which can be used for low-volume, high-mix production. Moreover, since the IC tag is embedded in the resin component itself, it is possible to use the IC tag for production control of products using the resin component. Therefore, it is possible to improve the traceability of products produced by using the resin parts. In addition, it is possible to realize a method of manufacturing a resin component equipped with an IC tag that can increase the degree of freedom in the form of the antenna.

In the method for manufacturing a resin component according to the one side surface (3), the step of embedding the antenna in the resin may have a configuration executed so that at least a part of the upper surface of the antenna is exposed.

According to the above configuration, the IC chip and the antenna can be reliably and directly connected to each other.

In the method for manufacturing a resin component according to the one side surface (3), the step of embedding the antenna in the resin may be provided so that the upper surface of the antenna is also covered with the resin.

According to the above configuration, it is possible to manufacture a resin component equipped with an IC tag in which an IC chip and an antenna are electromagnetically coupled.

The resin component according to one aspect of the present invention is for wireless communication between the IC chip embedded in the resin and the IC chip formed on at least a part of the IC chip and embedded in the resin. The upper surface of the antenna is configured to form a continuous surface with the surface of the surrounding resin.

According to the above configuration, it is possible to realize a resin component equipped with an IC tag having excellent design. Further, since there is no step between the antenna and the resin, it is possible to realize a resin component in which dirt does not accumulate on the step and the performance of the antenna is not deteriorated by the dirt. Further, according to the above configuration, it is possible to reduce the risk of damaging the antenna or the IC chip due to the article being caught on the step.

According to the method for manufacturing a resin part according to one aspect of the present invention, it is possible to realize a method for manufacturing a resin part equipped with an IC tag, which can be used for small-lot, high-mix production. In addition, it is possible to improve the traceability of products produced by using the resin parts. Further, it is possible to realize a method of manufacturing a resin component equipped with an IC tag that can increase the degree of freedom in the form of the antenna.

According to the resin component according to one aspect of the present invention, it is possible to realize a resin component having excellent design.

It is a figure which shows the manufacturing method of the resin part which concerns on Embodiment 1 and 2 of this invention. (A) to (d) show each step common to Embodiments 1 and 2. (E) and (f) show the steps of the first and second embodiments, respectively. It is a figure which shows the resin part manufactured by the manufacturing method of the resin part of this invention. (A) shows embodiment 1, (b) shows a modification of embodiment 1, and (c) shows a resin component according to embodiment 2. (A) is a figure which uses the material jetting method, (b) is a figure which shows the 3D printer which uses the material extrusion deposition method. It is a figure which shows the manufacturing method of the resin part which concerns on Embodiments 3 and 4 of this invention. (A) to (d) show each step common to Embodiments 3 and 4. (E) and (f) show the steps of the third and fourth embodiments, respectively. It is a figure which shows the manufacturing method of the resin part which concerns on Embodiment 5 of this invention. (A) to (e) indicate each step. It is a figure which shows the manufacturing method of the resin part which concerns on Embodiment 6 of this invention. (A) to (e) indicate each step. (A) shows a specific example of a product using a resin component according to the seventh embodiment of the present invention, and (b) shows a specific example of the resin component according to the seventh embodiment of the present invention.

[Embodiment 1]
Hereinafter, an embodiment according to one aspect of the present invention (hereinafter, also referred to as “the present embodiment”) will be described.

§1 Application example In the method for manufacturing a resin part according to the present embodiment, the identification data (ID information) of the resin part or the product to which the resin part is mounted is stored by a 3D printer on the intermediate forming body of the resin part. A step of embedding the IC chip in the resin and a step of embedding an antenna for the IC chip to wirelessly communicate with the resin on the intermediate forming body of the resin component by a 3D printer are provided. Then, the IC tag is configured by the IC chip and the antenna.

By embedding the IC chip in the resin, it means that at least a part of the side surface of the IC chip is embedded in the resin. Embedding the IC chip in the resin may include both a state in which the upper surface of the IC chip is not embedded in the resin and a state in which the upper surface is also embedded in the resin. The same applies to embedding the antenna in resin.

By providing each of the above steps, the method for manufacturing a resin part according to the present embodiment can realize a method for manufacturing a resin part with an IC tag attached, which can be used for low-volume, high-mix production. In addition, the degree of freedom in the form of the antenna is such that it is possible to manufacture resin parts with a design in which the antenna surface and the resin surface are composed of a series of flat surfaces while the antenna is exposed on the surface, which was difficult with conventional techniques. It is possible to realize a method of manufacturing a resin part equipped with an IC tag that can enhance the above.

§2 Configuration Example With reference to FIG. 1, a specific example of the manufacturing method of the resin component 100 in the first embodiment will be described. FIG. 1 In each view, the left side is a top view and the right side is a sectional view taken along the line AA in the top view. (A) to (e) of FIG. 1 are schematic views sequentially showing an example of a manufacturing process of the resin component 100 of the first embodiment.

As shown in FIG. 1A, first, the intermediate forming body 111 of the resin component 100 is prepared. The intermediate forming body 111 is a member in the middle of forming the final form of the resin component 100. The intermediate forming body 111 has a form in which the resin member lacks a part from the final form of the resin component 100. The method for forming the intermediate forming body 111 is not particularly limited, but it is preferable to form the intermediate forming body 111 with a 3D printer. This is because it can be used for small-lot, high-mix production.

Next, as shown in FIG. 1 (b), the IC chip 10 is positioned and placed on the upper surface of the intermediate forming body 111. The IC chip 10 constitutes an IC tag together with an antenna. The IC chip 10 can store the identification data of the resin component 100 or the product to which the resin component 100 is mounted. Here, the above refers to the direction on which the resin layer is further formed on the intermediate forming body 111 by the 3D printer in the later step.

Next, as shown in FIG. 1 (c), the IC chip 10 is embedded in the resin. The side surface of the IC chip 10 is buried in the resin, and the upper surface is exposed. This step is performed by forming a resin layer with a 3D printer. The resin constituting the resin layer formed in this step preferably has the same composition as that of the intermediate forming body 111. This is because the IC chip 10 is not stressed due to the difference in the coefficient of thermal expansion after it is completed as the resin component 100. The resin portion 112 has a form in which a resin layer is formed on the intermediate forming body 111.

Next, as shown in FIG. 1 (d), an antenna comprising a metal on the upper surface of a part of the IC chip 10 and the upper surface of a part of the resin in which the IC chip 10 is embedded (the upper surface of the resin portion 112). 20 is formed. The antenna 20 is composed of a single antenna element or a plurality of antenna elements 21. The antenna element 21 is connected to a bump provided on the upper surface of the IC chip 10 as needed.

In the first embodiment, the antenna 20 is a dipole antenna shown in FIG. 1, and a gap 22 is formed between the antenna elements 21 in the region including the IC chip 10.

This step is preferably performed on a metal 3D printer. This is because the degree of freedom in the shape that can be molded is high, a special mask or the like is not required, and it is possible to cope with low-volume, high-mix production. Further, it is not necessary to keep the resin surface on which the antenna 20 is formed flat, and the antenna 20 can be freely formed into an arbitrary three-dimensional shape.

However, other known methods applied to the formation of the antenna of the IC tag, for example, a method using a thin metal plate, a method of forming a metal thin film and patterning by etching, or a screen printing method may be used.

The fact that the antenna 20 contains metal includes the fact that the antenna 20 is configured to have a structure in which fine particles of metal are in contact with each other. It also includes the fact that it is composed of a structure in which fine metal particles are joined. A resin that serves as a binder in these structures may be contained. When the antenna 20 is formed from the conductive ink or the conductive paste, the microstructure inside the antenna 20 can have such a form.

Next, as shown in FIG. 1 (e), the antenna 20 is embedded in the resin. The side surface of the antenna 20 is buried in the resin, and the upper surface is exposed. This step is performed by forming a resin layer with a 3D printer. The resin constituting the resin layer formed in this step preferably has the same composition as that of the intermediate forming body 111. This is because the IC chip 10 and the antenna 20 are not stressed due to the difference in the coefficient of thermal expansion after being completed as the resin component 100. The resin portion 113 has a form in which a resin layer is further formed on the intermediate forming body 111.

Here, around the antenna 20, the surface of the resin portion 113 is finished so as to form a flat continuous surface with the upper surface of the antenna 20.

The resin component 100 whose perspective view is shown in FIG. 2A is completed through the above steps.

Hereinafter, the molding of the resin by the 3D printer in the first embodiment will be described.

FIG. 3 is a diagram showing a resin molding method by a typical method of a 3D printer.

FIG. 3A is a diagram showing a 3D printer 5 using the material jetting method. In the 3D printer 5 of this method, the resin 52 ejected from the print head 51 is cured by the ultraviolet rays 53, and the resin layers are laminated. The model 54 is placed on the built-in platform 56. By gradually lowering the built platform 56 as the laminating progresses, a three-dimensional resin model 54 can be produced. On the built-in platform 56, the support material 55 for supporting the modeled object 54 is also modeled together with the modeled object 54. The support material 55 is finally removed from the model 54.

FIG. 3B is a diagram showing a 3D printer 6 using the material extrusion deposition method. In the 3D printer 6 of this method, the resin raw material supplied from the model material spool 61 is melted by heat and extruded from the nozzle head 63 to laminate the resin layer. The model 64 is mounted on the built-in platform 66. By gradually lowering the built platform 66 as the laminating progresses, a three-dimensionally shaped resin model 64 can be produced. As in the case of the material jetting method, the support material 65 for supporting the model 64 is also modeled together with the model 64 on the built platform 66. The resin raw material of the support material 65 is supplied from the model material spool 62.

The 3D printer used in the present invention is not limited to these types of 3D printers, and other methods such as a binder jetting method, a laser molding method, and a powder sintering laminated molding method may be used.

The step of forming at least the resin layer in the first embodiment is carried out by such a modeling method using a 3D printer.

§3 Modification example FIG. 2B is a diagram showing a resin component 102 having an appearance form different from that of the resin component 100, which can be produced by the manufacturing method of the first embodiment. Compared with the resin component 100, the resin component 102 has an extremely large area occupied by the antenna 30 on the component surface (outer surface). As a result, according to this modification, the antenna gain can be increased.

The antenna 30 is a notch antenna shown in FIG. 2B, and has a notch 33 in a part of the antenna 30 containing metal. The notch 33 is filled with resin. Also in this modification, the surface of the resin portion around the antenna 30 is finished so as to form a flat continuous surface with the upper surface of the antenna 30.

As shown in FIG. 2B, the present invention can also be applied to a configuration in which most of the surface (outer surface) of the resin component is covered with the antenna 30 containing metal.

§4 Effect According to the first embodiment, it is possible to realize a method for manufacturing a resin part with an IC tag, which is difficult to handle by an injection molding method that requires a mold, can be used for low-volume, high-mix production, and can be used. .. Moreover, since the IC tag is embedded in the resin component itself, it is possible to use the IC tag for production control of products using the resin component. Therefore, it is possible to improve the traceability of products produced by using the resin parts.

Further, it is possible to manufacture a resin component having a design in which the antenna surface and the resin surface are composed of a series of flat surfaces while the antenna is exposed on the surface, which is difficult with the prior art. Such a design with an exposed antenna is an unprecedented design and is excellent in design. Further, since there is no step between the antenna and the resin, dirt does not accumulate on the step, and the performance of the antenna is not deteriorated by the dirt. Alternatively, since there is no step between the antenna and the resin, it is possible to reduce the risk of damaging the antenna or the IC chip due to an article getting caught in the step. It is also possible to provide an external antenna that is electromagnetically coupled to the antenna outside the resin component to increase the antenna gain.

Further, according to the first embodiment, since the resin surface for forming the antenna on the resin surface is molded by the 3D printer, the degree of freedom in the form of the antenna can be increased.

In particular, if a metal 3D printer is used to form the antenna, an IC tag can be formed near the surface of the resin component regardless of the form of the resin component. For example, even if the surface of the resin component is a curved surface, it is possible to form an IC tag at such a location. Furthermore, an antenna having a complicated three-dimensional shape can be manufactured, and the degree of freedom in the form of the antenna can be further increased.

[Embodiment 2]
The second embodiment of the present invention will be described below. For convenience of explanation, the same reference numerals are given to the members having the same functions as the members described in the above-described embodiment, and the description thereof will not be repeated.

A specific example of the method for manufacturing the resin component 101 according to the second embodiment will be described with reference to FIG. (A) to (d) and (f) of FIG. 1 are schematic views sequentially showing an example of a manufacturing process of the resin component 101 of the present invention.

Each step up to the state shown in FIG. 1D is the same as that of the first embodiment.

Next, as shown in FIG. 1 (f), the antenna 20 is embedded in resin. The side surface and the upper surface of the antenna 20 are filled with resin. The antenna 20 is completely embedded in the resin. This step is performed by forming a resin layer with a 3D printer. The resin constituting the resin layer formed in this step preferably has the same composition as that of the intermediate forming body 111. This is because the IC chip 10 and the antenna 20 are not stressed due to the difference in the coefficient of thermal expansion after being completed as the resin component 100. The resin portion 114 has a form in which a resin layer is further formed on the intermediate forming body 111.

The resin component 101 whose perspective view is shown in FIG. 2C is completed through the above steps.

According to the second embodiment, the protective effect of the antenna 20 can be obtained by forming the resin layer on the antenna 20. Further, since the conductor is sandwiched between the resins in the antenna 20, the antenna size becomes smaller and it becomes possible to manufacture a high-performance antenna.

Further, the second embodiment also has the effect of the first embodiment being finished in such a form that the surface of the resin portion 113 forms a flat continuous surface with the upper surface of the antenna 20. The same effect as is played.

[Embodiment 3]
A method for manufacturing the resin component 400 according to the third embodiment will be described with reference to FIG. FIGS. 4A to 4E are schematic views sequentially showing an example of a manufacturing process of the resin component 400 of the present invention.

As shown in FIG. 4A, first, the intermediate forming body 411 of the resin component 400 is prepared. The intermediate forming body 411 is a member in the middle of forming the final form of the resin component 400. The intermediate forming body 411 has a form in which the resin member lacks a part from the final form of the resin component 400. The method for forming the intermediate forming body 411 is not particularly limited, but it is preferable to form the intermediate forming body 411 with a 3D printer. This is because it can be used for small-lot, high-mix production.

Next, as shown in FIG. 4B, the IC chip 10 is positioned and placed on the upper surface of the intermediate forming body 411. The IC chip 10 constitutes an IC tag together with an antenna. The IC chip 10 can store the identification data of the resin component 400 or the product to which the resin component 400 is mounted.

Next, as shown in FIG. 4C, the IC chip 10 is embedded in the resin. It is assumed that the side surface and the upper surface of the IC chip 10 are filled with resin. This step is performed by forming a resin layer with a 3D printer. The resin constituting the resin layer formed in this step preferably has the same composition as that of the intermediate forming body 411. This is because the IC chip 10 is not stressed due to the difference in the coefficient of thermal expansion after it is completed as the resin component 400. The resin portion 412 has a form in which a resin layer is formed on the intermediate forming body 411.

Next, as shown in FIG. 4D, an antenna 20 containing metal is formed on (upper) a part of the IC chip 10. The antenna 20 is also formed not on the IC chip 10 but also on the upper surface of a part of the resin (the upper surface of the resin portion 412) in which the IC chip 10 is embedded. The antenna 20 is composed of a single antenna element or a plurality of antenna elements 21. Although the IC chip 10 and the antenna 20 are not in direct contact with each other, they are electromagnetically coupled, and the antenna 20 serves as an antenna.

In the third embodiment, the antenna 20 is a dipole antenna shown in FIG. 4, and a gap 22 is formed between the antenna elements 21 in the region including the IC chip 10.

This step is preferably performed on a metal 3D printer. This is because the degree of freedom in the shape that can be molded is high, a special mask or the like is not required, and it is possible to cope with low-volume, high-mix production. Further, it is not necessary to keep the resin surface on which the antenna 20 is formed flat, and the antenna 20 can be freely formed into an arbitrary three-dimensional shape.

However, other known methods applied to the formation of the antenna of the IC tag, for example, a method using a thin metal plate, a method of forming a metal thin film and patterning by etching, or a screen printing method may be used.

Next, as shown in FIG. 4 (e), the antenna 20 is embedded in the resin. The side surface of the antenna 20 is buried in the resin, and the upper surface is exposed. This step is performed by forming a resin layer with a 3D printer. The resin constituting the resin layer formed in this step preferably has the same composition as that of the intermediate forming body 411. This is because the IC chip 10 and the antenna 20 are not stressed due to the difference in the coefficient of thermal expansion after being completed as the resin component 400. The resin portion 413 has a form in which a resin layer is further formed on the intermediate forming body 411.

Here, around the antenna 20, the surface of the resin portion 413 is finished so as to form a flat continuous surface with the upper surface of the antenna 20.

Through the above steps, the resin component 400 is completed. The outer shape of the resin component 400 is the same as that shown in FIG. 2 (a).

The third embodiment also has the same effect as that of the first embodiment.

[Embodiment 4]
A method for manufacturing the resin component 401 according to the fourth embodiment will be described with reference to FIG. (A) to (d) and (f) of FIG. 4 are schematic views sequentially showing an example of a manufacturing process of the resin component 401 of the present invention.

Each step up to the state shown in FIG. 4D is the same as that of the third embodiment.

Next, as shown in FIG. 4 (f), the antenna 20 is embedded in the resin. The side surface and the upper surface of the antenna 20 are filled with resin. The antenna 20 is completely embedded in the resin. This step is performed by forming a resin layer with a 3D printer. The resin constituting the resin layer formed in this step preferably has the same composition as that of the intermediate forming body 411. This is because the IC chip 10 and the antenna 20 are not stressed due to the difference in the coefficient of thermal expansion after being completed as the resin component 400. The resin portion 414 has a form in which a resin layer is further formed on the intermediate forming body 111.

Through the above steps, the resin component 401 is completed. The outer shape of the resin component 401 is the same as that shown in FIG. 2 (c).

The same effect as that of the second embodiment is obtained by the fourth embodiment.

[Embodiment 5]
A method for manufacturing the resin component 500 according to the fifth embodiment will be described with reference to FIG. 5 (a) to 5 (e) are schematic views sequentially showing an example of a manufacturing process of the resin component 500 of the present invention.

As shown in FIG. 5A, first, the intermediate forming body 511 of the resin component 500 is prepared. The intermediate forming body 511 is a member in the middle of forming the final form of the resin component 500. The intermediate forming body 511 has a form in which the resin member is partially omitted from the final form of the resin component 500. The method for forming the intermediate forming body 511 is not particularly limited, but it is preferable to form the intermediate forming body 511 with a 3D printer. This is because it can be used for small-lot, high-mix production. In addition, the resin surface for forming the antenna can be molded into a free shape, and the degree of freedom in the form of the antenna can be increased.

Next, as shown in FIG. 5B, an antenna 20 containing metal is formed on the upper surface of the intermediate forming body 511. The antenna 20 is composed of a single antenna element or a plurality of antenna elements 21.

In the fifth embodiment, the antenna 20 is a dipole antenna shown in FIG. 5, and a gap 22 is formed between the antenna elements 21 in the region where the IC chip 10 is mounted.

This step is preferably performed on a metal 3D printer. This is because the degree of freedom in the shape that can be molded is high, a special mask or the like is not required, and it is possible to cope with low-volume, high-mix production. Further, it is not necessary to keep the resin surface on which the antenna 20 is formed flat, and the antenna 20 can be freely formed into an arbitrary three-dimensional shape.

However, other known methods applied to the formation of the antenna of the IC tag, for example, a method using a thin metal plate, a method of forming a metal thin film and patterning by etching, or a screen printing method may be used.

Next, as shown in FIG. 5 (c), the antenna 20 is embedded in the resin. The side surface of the antenna 20 is buried in the resin, and the upper surface is exposed. This step is performed by forming a resin layer with a 3D printer. The resin constituting the resin layer formed in this step preferably has the same composition as the intermediate forming body 511. This is because the antenna 20 is not stressed due to the difference in the coefficient of thermal expansion after it is completed as the resin component 500. The resin portion 512 has a form in which a resin layer is formed on the intermediate forming body 511.

Next, as shown in FIG. 5D, the IC chip 10 is positioned and placed on the upper surface of a part of the antenna 20. The IC chip 10 constitutes an IC tag together with an antenna. The IC chip 10 can store the identification data of the resin component 500 or the product to which the resin component 500 is mounted. The antenna element 21 is connected to a bump provided on the IC chip 10 as needed.

Next, as shown in FIG. 5 (e), the IC chip 10 and the antenna 20 are embedded in the resin. It is assumed that the side surface and the upper surface of the IC chip 10 are filled with resin. The IC chip 10 and the antenna 20 are completely embedded in the resin. This step is performed by forming a resin layer with a 3D printer. The resin constituting the resin layer formed in this step preferably has the same composition as the intermediate forming body 511. This is because the IC chip 10 and the antenna 20 are not stressed due to the difference in the coefficient of thermal expansion after being completed as the resin component 500. The resin portion 513 has a form in which a resin layer is further formed on the intermediate forming body 511.

Through the above steps, the resin component 500 is completed. The outer shape of the resin component 500 is the same as that shown in FIG. 2 (c).

The same effect as that of the second embodiment is obtained by the fifth embodiment.

[Embodiment 6]
A method for manufacturing the resin component 600 according to the sixth embodiment will be described with reference to FIG. 6 (a) to 6 (e) are schematic views sequentially showing an example of a manufacturing process of the resin component 600 of the present invention.

As shown in FIG. 6A, first, the intermediate forming body 611 of the resin component 600 is prepared. The intermediate forming body 611 is a member in the middle of forming the final form of the resin component 600. The intermediate forming body 611 has a form in which the resin member is partially omitted from the final form of the resin component 600. The method for forming the intermediate forming body 611 is not particularly limited, but it is preferable to form the intermediate forming body 611 with a 3D printer. This is because it can be used for small-lot, high-mix production. In addition, the resin surface for forming the antenna can be molded into a free shape, and the degree of freedom in the form of the antenna can be increased.

Next, as shown in FIG. 6B, an antenna 20 containing metal is formed on the upper surface of the intermediate forming body 611. The antenna 20 is composed of a single antenna element or a plurality of antenna elements 21.

In the sixth embodiment, the antenna 20 is a dipole antenna shown in FIG. 6, and a gap 22 is formed between the antenna elements 21 in the region where the IC chip 10 is mounted.

This step is preferably performed on a metal 3D printer. This is because the degree of freedom in the shape that can be molded is high, a special mask or the like is not required, and it is possible to cope with low-volume, high-mix production. Further, it is not necessary to keep the resin surface on which the antenna 20 is formed flat, and the antenna 20 can be freely formed into an arbitrary three-dimensional shape.

However, other known methods applied to the formation of the antenna of the IC tag, for example, a method using a thin metal plate, a method of forming a metal thin film and patterning by etching, or a screen printing method may be used.

Next, as shown in FIG. 6 (c), the antenna 20 is embedded in the resin. The side surface and the upper surface of the antenna 20 are filled with resin. This step is performed by forming a resin layer with a 3D printer. The resin constituting the resin layer formed in this step preferably has the same composition as that of the intermediate forming body 611. This is because the antenna 20 is not stressed due to the difference in the coefficient of thermal expansion after it is completed as the resin component 600. The resin portion 612 has a form in which a resin layer is formed on the intermediate forming body 611.

Next, as shown in FIG. 6D, the IC chip 10 is positioned and placed on (above) a part of the antenna 20. The IC chip 10 constitutes an IC tag together with an antenna. The IC chip 10 can store the identification data of the resin component 600 or the product to which the resin component 600 is mounted. Although the IC chip 10 and the antenna 20 are not in direct contact with each other, they are electromagnetically coupled, and the antenna 20 serves as an antenna.

Next, as shown in FIG. 6 (e), the IC chip 10 and the antenna 20 are embedded in the resin. It is assumed that the side surface and the upper surface of the IC chip 10 are filled with resin. The IC chip 10 and the antenna 20 are completely embedded in the resin. This step is performed by forming a resin layer with a 3D printer. The resin constituting the resin layer formed in this step preferably has the same composition as that of the intermediate forming body 611. This is because the IC chip 10 and the antenna 20 are not stressed due to the difference in the coefficient of thermal expansion after being completed as the resin component 600. The resin portion 613 has a form in which a resin layer is further formed on the intermediate forming body 611.

Through the above steps, the resin component 600 is completed. The outer shape of the resin component 600 is the same as that shown in FIG. 2 (c).

The sixth embodiment also has the same effect as that of the second embodiment.

[Embodiment 7]
In the seventh embodiment, a resin part manufactured by the method for manufacturing a resin part of the present invention or a specific example of a product using the resin part is shown.

FIG. 7A is a drive unit 7 which is a specific example of a product using the resin parts manufactured by the method for manufacturing the resin parts of the present invention. The drive unit 7 includes a motor unit 71 and a speed change mechanism unit 72. The housing of the speed change mechanism portion 72 is made of resin, and is manufactured by the method for manufacturing resin parts of the present invention. In FIG. 7A, the IC tag is embedded at the position indicated by, for example, X.

FIG. 7B is a resin gear 8 which is a specific example of a resin part manufactured by the method for manufacturing a resin part of the present invention. In FIG. 7B, the IC tag is embedded at the position indicated by, for example, X.

[Embodiment 8]
The eighth embodiment is an example in which the antenna in each of the above embodiments is built in the IC chip. The IC chip itself has a built-in antenna function, and the antenna forming step in each of the above embodiments is omitted.

According to the eighth embodiment, it is possible to realize a method for manufacturing a resin part having an IC tag, which is difficult to handle by an injection molding method that requires a mold, and can be used for small-lot, high-mix production. Moreover, since the IC tag is embedded in the resin component itself, it is possible to use the IC tag for production control of products using the resin component. Therefore, it is possible to improve the traceability of products produced by using the resin parts.

In each of the above-described embodiments, a dipole antenna is exemplified as the antenna. However, the application of the present invention is not limited to these, and other types of antennas such as notch antennas, slot antennas, patch antennas, and the like may be embedded or formed.

The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and the embodiments obtained by appropriately combining the technical means disclosed in the different embodiments. Is also included in the technical scope of the present invention.

100, 101, 102, 400, 401, 500, 600 Resin parts 111, 411, 511, 611 Intermediate forming bodies 112, 113, 114, 421, 413, 414, 512, 513, 612, 613 Resin part 10 IC chip 20 , 30 Antenna 21 Antenna element 22 Gap 33 Notch 5, 6 3D printer 51 Printhead 52 Resin 53 Ultraviolet ray 54, 64 Modeled object 55, 65 Support material 56, 66 Built platform 61, 62 Model material spool 63 Nozzle head 7 Drive unit 71 Motor part 72 Speed change mechanism part 8 Resin gear

Claims (6)

It is a manufacturing method of resin parts.
A step of embedding an IC chip that stores identification data of the resin component or a product to which the resin component is mounted in the resin by a 3D printer on the intermediate forming body of the resin component.
A step of embedding an antenna for wireless communication of the IC chip in the resin by a 3D printer on the intermediate forming body of the resin component.
The step of placing the IC chip on the intermediate forming body of the resin component and
A step of forming the antenna on at least a part of the IC chip is provided .
The process of placing the IC chip and
The process of embedding the IC chip in resin and
The process of forming the antenna and
The process of embedding the antenna in resin and
In this order,
The step of embedding the antenna in resin is a method for manufacturing a resin component, in which the upper surface of the antenna is finished so as to form a continuous surface with the surface of the surrounding resin . The method for manufacturing a resin component according to claim 1 , wherein the step of embedding the IC chip in a resin is performed so that at least a part of the upper surface of the IC chip is exposed. The method for manufacturing a resin component according to claim 1 , wherein the step of embedding the IC chip in the resin is performed so that the upper surface of the IC chip is also covered with the resin. The IC chip embedded in the resin and
It is provided with an antenna for wireless communication of the IC chip, which is formed on at least a part of the IC chip and embedded in a resin.
The upper surface of the antenna forms a continuous surface with the surface of the surrounding resin.
The antenna is a resin component having two antenna elements and having a gap formed between the two antenna elements . The IC chip embedded in the resin and
It is provided with an antenna for wireless communication of the IC chip, which is formed on at least a part of the IC chip and embedded in a resin.
The upper surface of the antenna forms a continuous surface with the surface of the surrounding resin.
The antenna is a resin component connected to a bump provided on the upper surface of the IC chip. The IC chip embedded in the resin and
It is provided with an antenna for wireless communication of the IC chip, which is formed on at least a part of the IC chip and embedded in a resin.
The upper surface of the antenna forms a continuous surface with the surface of the surrounding resin.
The antenna is a resin component that is a dipole antenna, a notch antenna, a slot antenna, or a patch antenna.

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