JP7083395B2 - Sensor element mounting structure, movement amount detection device and its manufacturing method - Google Patents

Sensor element mounting structure, movement amount detection device and its manufacturing method Download PDF

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JP7083395B2
JP7083395B2 JP2020541000A JP2020541000A JP7083395B2 JP 7083395 B2 JP7083395 B2 JP 7083395B2 JP 2020541000 A JP2020541000 A JP 2020541000A JP 2020541000 A JP2020541000 A JP 2020541000A JP 7083395 B2 JP7083395 B2 JP 7083395B2
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優 熊谷
紀彦 信太
博之 戸張
久直 高原
博幸 河原
隆博 馬籠
命 福井
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/244—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing characteristics of pulses or pulse trains; generating pulses or pulse trains
    • G01D5/245—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing characteristics of pulses or pulse trains; generating pulses or pulse trains using a variable number of pulses in a train
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/07—Hall effect devices
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Description

本発明は、センサ素子の取付構造、当該取付構造を利用した移動量検出装置、及びその製造方法に関する。 The present invention relates to a mounting structure of a sensor element, a movement amount detection device using the mounting structure, and a method for manufacturing the same.

従来、位置や回転の検出を行うホールＩＣ等のセンサ素子を、検出対象に対して正確に位置決めするために、ホールＩＣの位置決め構造として、種々の提案がなされている。例えば、特許文献１においては、ホールＩＣを凹部に嵌挿させ、嵌挿されたホールＩＣの上面を押さえつける複数の傾斜突部を用いて、ホールＩＣを位置決め固定する保持装置が開示されている。当該保持装置は、さらに基板に装着されて検出対象に対して位置決めされる。 Conventionally, various proposals have been made as a positioning structure for a Hall IC in order to accurately position a sensor element such as a Hall IC that detects a position or rotation with respect to a detection target. For example, Patent Document 1 discloses a holding device for positioning and fixing a Hall IC by inserting a Hall IC into a recess and using a plurality of inclined protrusions for pressing the upper surface of the inserted Hall IC. The holding device is further mounted on the substrate and positioned with respect to the detection target.

また、特許文献２には、位置や回転の検出を行うホールＩＣを基板に取り付ける際に、金属製の位置決め治具にホールＩＣを装着し、位置決め治具を基板の所定位置に配置し、基板に対してホールＩＣのリード端子をハンダ付けする方法が開示されている。また、基板に対してホールＩＣをハンダ付けにより固定した後は、位置決め治具を取り外している。 Further, in Patent Document 2, when a hole IC for detecting position and rotation is attached to a substrate, the hole IC is attached to a metal positioning jig, and the positioning jig is arranged at a predetermined position on the substrate. A method of soldering a lead terminal of a hall IC is disclosed. Further, after fixing the Hall IC to the substrate by soldering, the positioning jig is removed.

実開昭５８－０７２８６１号公報Jikkai Sho 58-072861 特開２０１２－０７８１２３号公報Japanese Unexamined Patent Publication No. 2012-078123

特許文献１に開示された位置決め構造では、ホールＩＣが凹部に嵌挿されると共に、複数の傾斜突部によって上面が押さえつけられており、ホールＩＣに圧力がかかり、内部に応力が生じているため、ホールＩＣの検出精度に影響が出て、精度にばらつきが生じるおそれがある。また、ホールＩＣが固定された保持装置を基板に取り付ける際、その位置決めを正確に行わなければならず、位置決め作業の精度によって検出精度が左右されるという不都合がある。 In the positioning structure disclosed in Patent Document 1, the Hall IC is inserted into the recess and the upper surface is pressed by a plurality of inclined protrusions, so that pressure is applied to the Hall IC and stress is generated inside. The detection accuracy of the Hall IC may be affected and the accuracy may vary. Further, when the holding device to which the Hall IC is fixed is attached to the substrate, the positioning must be performed accurately, and there is a disadvantage that the detection accuracy depends on the accuracy of the positioning work.

また、特許文献２に記載の方法では、位置決め治具を利用してホールＩＣをハンダ付けする際には正しく位置決めがなされているが、位置決め治具を取り外した後、リード端子のスプリングバック等によってホールＩＣの位置が変動するおそれがある。従って、当該方法によって基板に固定されたホールＩＣを用いたセンサ装置は、検出精度にばらつきが生じるおそれがある。 Further, in the method described in Patent Document 2, when the Hall IC is soldered using the positioning jig, the positioning is correctly performed. However, after the positioning jig is removed, the lead terminal is springed back or the like. The position of the Hall IC may fluctuate. Therefore, the sensor device using the Hall IC fixed to the substrate by the method may have variations in detection accuracy.

本発明は、上記課題を解決するために、ホールＩＣ等のセンサ素子の精度に影響を与えることなく、検出対象に対してセンサ素子を正確に位置決めすることができるセンサ素子の取付構造、当該取付構造を有する移動量検出装置、及びその製造方法を提供することを目的とする。 In order to solve the above problems, the present invention provides a mounting structure for a sensor element capable of accurately positioning the sensor element with respect to a detection target without affecting the accuracy of the sensor element such as a Hall IC. It is an object of the present invention to provide a movement amount detection device having a structure and a method for manufacturing the same.

前記目的を達成するために、本発明のセンサ素子の取付構造は、検出対象に対して位置決めされるケースにセンサ素子を取り付ける構造であって、
前記センサ素子は、前記検出対象に対する配置方向を規定する基準面を有し、 前記ケースは、前記センサ素子を挿入して位置決めするための収納部を有し、
前記収納部は、前記基準面を前記検出対象に対して位置決めする基準壁部と、前記基準壁部に対向し、前記センサ素子の挿入方向に向けて前記基準壁部に対して狭まるように傾斜するテーパ部を備え、
前記基準壁部と前記テーパ部との間隔は、前記基準面に垂直な前記センサ素子の厚さ寸法よりも長い部分と短い部分を有しており、
前記センサ素子は、前記収納部に挿入され、前記テーパ部に当接して前記基準面が前記基準壁部に接触した状態で取り付けられることを特徴とする。In order to achieve the above object, the mounting structure of the sensor element of the present invention is a structure in which the sensor element is mounted in a case positioned with respect to the detection target.
The sensor element has a reference plane that defines an arrangement direction with respect to the detection target, and the case has a storage portion for inserting and positioning the sensor element.
The storage portion faces the reference wall portion that positions the reference surface with respect to the detection target, and is inclined so as to be narrowed with respect to the reference wall portion in the insertion direction of the sensor element. Equipped with a tapered part to
The distance between the reference wall portion and the tapered portion has a portion longer and a portion shorter than the thickness dimension of the sensor element perpendicular to the reference plane.
The sensor element is inserted into the accommodating portion and is attached in a state where the reference surface is in contact with the reference wall portion in contact with the tapered portion.

本発明のセンサ素子の取付構造によれば、センサ素子の基準面が、検出対象に対して位置決めされるケースの基準壁部に接触した状態で位置決めされる。このとき、センサ素子は、ケースの収納部に設けられたテーパ部によって案内されることにより、ケースの基準壁部に基準面が接触する。従って、従来の特許文献１のように、センサ素子に応力を生じさせることがないので、センサ素子の検出精度に影響を与えることなく、正確に基準壁部に位置決めして取り付けることができる。 According to the mounting structure of the sensor element of the present invention, the reference surface of the sensor element is positioned in contact with the reference wall portion of the case positioned with respect to the detection target. At this time, the sensor element is guided by the tapered portion provided in the housing portion of the case, so that the reference surface comes into contact with the reference wall portion of the case. Therefore, unlike the conventional Patent Document 1, stress is not generated in the sensor element, so that the sensor element can be accurately positioned and attached to the reference wall portion without affecting the detection accuracy of the sensor element.

また、本発明のセンサ素子の取付構造において、前記収納部は、前記センサ素子の幅方向の両側に、前記センサ素子を挿入方向に案内するガイド壁が設けられていることが好ましい。当該構成によれば、センサ素子の基準面に対する方向、即ちセンサ素子の厚さ方向に対する方向のみならず、センサ素子の幅方向の位置決めも行うことができる。このため、ケースに対するセンサ素子の位置決めがさらに正確なものとなる。 Further, in the mounting structure of the sensor element of the present invention, it is preferable that the storage portion is provided with guide walls on both sides of the sensor element in the width direction to guide the sensor element in the insertion direction. According to this configuration, not only the direction with respect to the reference plane of the sensor element, that is, the direction with respect to the thickness direction of the sensor element, but also the positioning in the width direction of the sensor element can be performed. Therefore, the positioning of the sensor element with respect to the case becomes more accurate.

また、本発明のセンサ素子の取付構造において、前記センサ素子は、検出信号を外部に出力するリード端子を有しており、前記リード端子は、前記センサ素子が前記収納部に取り付けられた際に、前記基準壁部側に向けて屈曲されていることが好ましい。当該構成によれば、リード端子が基準壁部側に向けて屈曲されているので、リード端子の重みでセンサ素子の基準面がケースの基準壁部側に押し付けられるため、センサ素子の位置決めがさらに正確なものとなる。 Further, in the mounting structure of the sensor element of the present invention, the sensor element has a lead terminal that outputs a detection signal to the outside, and the lead terminal is used when the sensor element is mounted in the housing portion. , It is preferable that it is bent toward the reference wall portion side. According to this configuration, since the lead terminal is bent toward the reference wall portion side, the reference surface of the sensor element is pressed against the reference wall portion side of the case by the weight of the lead terminal, so that the positioning of the sensor element is further performed. It will be accurate.

また、本発明のセンサ素子の取付構造において、前記ケースは、前記センサ素子が前記収納部に取り付けられた際に、前記リード端子を案内するガイド突部を備えていることが好ましい。このように、リード端子がガイド突部に案内されることにより、センサ素子は、ケースの収納部に位置決めされた状態で保持される。 Further, in the mounting structure of the sensor element of the present invention, it is preferable that the case is provided with a guide protrusion for guiding the lead terminal when the sensor element is mounted on the housing portion. By guiding the lead terminal to the guide protrusion in this way, the sensor element is held in a state of being positioned in the housing portion of the case.

本発明の移動量検出装置は、検出対象の移動量を検出する移動量検出装置であって、
前記検出対象に対して位置決めされるケースと、
前記ケースに取り付けられ、検出信号を外部に出力するリード端子を備えたセンサ素子と、
前記ケースに取り付けられ、前記リード端子が接続される基板と、
前記基板に接続され、前記ケースから突出して外部との接続が可能な外部接続端子とを備え、
前記センサ素子は、前記検出対象に対する配置方向を規定する基準面を有し、
前記ケースは、前記センサ素子を挿入して位置決めするための収納部を有し、
前記収納部は、前記基準面を前記検出対象に対して位置決めする基準壁部と、前記基準壁部に対向し、前記センサ素子の挿入方向に向けて前記基準壁部に対して狭まるように傾斜するテーパ部を備え、
前記基準壁部と前記テーパ部との間隔は、前記基準面に垂直な前記センサ素子の厚さ寸法よりも長い部分と短い部分を有しており、
前記センサ素子は、前記収納部に挿入され、前記テーパ部に当接して前記基準面が前記基準壁部に接触した状態で取り付けられ、前記リード端子が前記基板に接続されていることを特徴とする。The movement amount detection device of the present invention is a movement amount detection device that detects the movement amount of the detection target.
A case positioned with respect to the detection target and a case
A sensor element attached to the case and equipped with a lead terminal that outputs a detection signal to the outside,
A board attached to the case and to which the lead terminal is connected,
It is provided with an external connection terminal that is connected to the board and can be connected to the outside by protruding from the case.
The sensor element has a reference plane that defines an arrangement direction with respect to the detection target.
The case has a housing for inserting and positioning the sensor element.
The storage portion faces the reference wall portion that positions the reference surface with respect to the detection target, and is inclined so as to be narrowed with respect to the reference wall portion in the insertion direction of the sensor element. Equipped with a tapered part to
The distance between the reference wall portion and the tapered portion has a portion longer and a portion shorter than the thickness dimension of the sensor element perpendicular to the reference plane.
The sensor element is inserted into the storage portion, is attached in a state where the reference surface is in contact with the reference wall portion in contact with the tapered portion, and the lead terminal is connected to the substrate. do.

本発明の移動量検出装置によれば、ケースの収納部に設けられた基準壁部とテーパ部とにより、基準面を有するセンサ素子がケースに対して正確に取り付けられるため、検出対象とセンサ素子との間の距離を常に正確なものとすることができる。 According to the movement amount detecting device of the present invention, the sensor element having the reference surface is accurately attached to the case by the reference wall portion and the tapered portion provided in the housing portion of the case, so that the detection target and the sensor element The distance between and can always be accurate.

また、本発明の移動量検出装置において、前記検出対象は円弧状の外周面を有する磁性体であり、前記ケースは、前記外周面に沿って延設された円弧状の側壁部を有し、前記収納部は前記側壁部に沿って３箇所に設けられ、それぞれの前記収納部に前記センサ素子が取り付けられていることが好ましい。当該構成によれば、円弧状の外周面を有する磁性体に対して、正確に位置決めされて取り付けられた３個のセンサ素子によって、検出対象の移動量を正確に検出することができる。 Further, in the movement amount detecting device of the present invention, the detection target is a magnetic material having an arc-shaped outer peripheral surface, and the case has an arc-shaped side wall portion extending along the outer peripheral surface. It is preferable that the storage portions are provided at three locations along the side wall portions, and the sensor element is attached to each of the storage portions. According to this configuration, the movement amount of the detection target can be accurately detected by the three sensor elements that are accurately positioned and attached to the magnetic material having the arc-shaped outer peripheral surface.

本発明の移動量検出装置の製造方法は、検出対象の移動量を検出する移動量検出装置の製造方法であって、
前記移動量検出装置は、
前記検出対象に対して位置決めされるケースと、
前記ケースに取り付けられ、検出信号を外部に出力するリード端子を備えたセンサ素子と、
前記ケースに取り付けられ、前記リード端子が接続される基板と、
前記基板に接続され、前記ケースから突出して外部との接続が可能な外部接続端子とを備え、
前記センサ素子は、前記検出対象に対する配置方向を規定する基準面を有し、
前記ケースは、前記センサ素子を挿入して位置決めするための収納部を有し、
前記収納部は、前記基準面を前記検出対象に対して位置決めする基準壁部と、前記基準壁部に対向し、前記センサ素子の挿入方向に向けて前記基準壁部に対して狭まるように傾斜するテーパ部を備え、
前記基準壁部と前記テーパ部との間隔は、前記基準面に垂直な前記センサ素子の厚さ寸法よりも長い部分と短い部分を有するものであり、
前記ケースの前記収納部に前記センサ素子を挿入し、前記センサ素子の先端部を前記テーパ部に当接させて前記基準面と前記基準壁部とを接触した状態で取り付け、
前記ケースに前記外部接続端子を位置決めし、
前記基板を前記ケースに装着し、前記基板に前記リード端子及び前記外部接続端子をハンダ付けしてなることを特徴とする。The method for manufacturing a movement amount detection device of the present invention is a method for manufacturing a movement amount detection device that detects the movement amount of a detection target.
The movement amount detection device is
A case positioned with respect to the detection target and a case
A sensor element attached to the case and equipped with a lead terminal that outputs a detection signal to the outside,
A board attached to the case and to which the lead terminal is connected,
It is provided with an external connection terminal that is connected to the board and can be connected to the outside by protruding from the case.
The sensor element has a reference plane that defines an arrangement direction with respect to the detection target.
The case has a housing for inserting and positioning the sensor element.
The storage portion faces the reference wall portion that positions the reference surface with respect to the detection target, and is inclined so as to be narrowed with respect to the reference wall portion in the insertion direction of the sensor element. Equipped with a tapered part to
The distance between the reference wall portion and the tapered portion has a portion longer and a portion shorter than the thickness dimension of the sensor element perpendicular to the reference plane.
The sensor element is inserted into the storage portion of the case, the tip portion of the sensor element is brought into contact with the tapered portion, and the reference surface and the reference wall portion are attached in contact with each other.
Position the external connection terminal on the case and
The substrate is mounted on the case, and the lead terminal and the external connection terminal are soldered to the substrate.

本発明の移動量検出装置の製造方法によれば、ケースの収納部に対してセンサ素子を正確に位置決めして取り付けた状態で基板とリード端子とをハンダ付けするので、ハンダ付け後のスプリングバック等によってセンサ素子の位置が変動することがない。 According to the manufacturing method of the movement amount detection device of the present invention, the substrate and the lead terminal are soldered in a state where the sensor element is accurately positioned and attached to the housing portion of the case, so that the springback after soldering is performed. The position of the sensor element does not change due to such factors.

また、本発明の移動量検出装置の製造方法において、前記基板は、前記リード端子及び前記外部接続端子が接触しない大きさの接続孔を有し、前記接続孔にランドが設けられており、前記ケースに前記基板を装着する際に、前記接続孔に前記リード端子と前記外部接続端子を挿入して前記ランドにハンダ付けすることが好ましい。 Further, in the method for manufacturing a movement amount detecting device of the present invention, the substrate has a connection hole having a size so that the lead terminal and the external connection terminal do not come into contact with each other, and the connection hole is provided with a land. When mounting the substrate on the case, it is preferable to insert the lead terminal and the external connection terminal into the connection hole and solder them to the land.

当該構成によれば、基板の接続孔がリード端子に接触しない大きさを有しているため、基板をケースに装着してハンダ付けする際に、正確に位置決めされて取り付けられたセンサ素子に影響を与えることなく装着することができる。 According to this configuration, since the connection hole of the board has a size that does not contact the lead terminal, it affects the sensor element that is accurately positioned and mounted when the board is mounted on the case and soldered. Can be installed without giving.

本発明によれば、ホールＩＣ等のセンサ素子の精度に影響を与えることなく、検出対象に対してセンサ素子を正確に位置決めすることができるセンサ素子の取付構造、当該取付構造を有する移動量検出装置、及びその製造方法を提供することができる。 According to the present invention, a mounting structure of a sensor element capable of accurately positioning the sensor element with respect to a detection target without affecting the accuracy of the sensor element such as a Hall IC, and a movement amount detection having the mounting structure. An apparatus and a method for manufacturing the apparatus can be provided.

本発明のセンサ素子の取付構造を採用した回転検出装置を示す説明図。Explanatory drawing which shows the rotation detection apparatus which adopted the mounting structure of the sensor element of this invention. （Ａ）はセンサ素子の形状、（Ｂ）はセンサ素子と収納部の形状を示す説明図。(A) is an explanatory diagram showing the shape of the sensor element, and (B) is an explanatory diagram showing the shape of the sensor element and the storage portion. 検出対象、センサ素子及び収納部の関係を示す説明的断面図。Explanatory cross-sectional view showing the relationship between the detection target, the sensor element, and the accommodating portion. 図１の回転検出装置のＡ－Ａ線断面図。FIG. 1A is a cross-sectional view taken along the line AA of the rotation detection device of FIG. センサ素子がケースの収納部に位置決めされて取り付けられている状態を示す説明図。Explanatory drawing which shows the state which the sensor element is positioned and attached to the storage part of a case.

次に、本発明の実施形態のセンサ素子の取付構造、当該取付構造を用いた移動量検出装置、及びその製造方法について、図１～図５を参照して説明する。図１に示すように、本実施形態では、移動量検出装置として回転検出装置１を例にして説明する。回転検出装置１は、リング状の磁性体である検出対象２の回転を検出するための装置である。 Next, the mounting structure of the sensor element according to the embodiment of the present invention, the movement amount detection device using the mounting structure, and the manufacturing method thereof will be described with reference to FIGS. 1 to 5. As shown in FIG. 1, in the present embodiment, the rotation detection device 1 will be described as an example of the movement amount detection device. The rotation detection device 1 is a device for detecting the rotation of the detection target 2, which is a ring-shaped magnetic material.

回転検出装置１は、図１に示すように、合成樹脂製のケース３と、ケース３に設けられた３個のセンサ素子４と、センサ素子４のリード端子４２がハンダ付けされる基板５と、基板５にハンダ付けされてケース３の外部に突出する外部接続端子６とを備えている。外部接続端子６は、センサ素子４によって検出された信号を外部の機器に接続可能に設けられている。なお、回転検出装置１は、図示しない蓋部材によって内部のセンサ素子４や基板５等が保護されている。 As shown in FIG. 1, the rotation detection device 1 includes a case 3 made of synthetic resin, three sensor elements 4 provided in the case 3, and a substrate 5 to which the lead terminal 42 of the sensor element 4 is soldered. It is provided with an external connection terminal 6 that is soldered to the substrate 5 and projects to the outside of the case 3. The external connection terminal 6 is provided so that the signal detected by the sensor element 4 can be connected to an external device. In the rotation detection device 1, the internal sensor element 4, the substrate 5, and the like are protected by a lid member (not shown).

検出対象２は、例えば、電動スクーター等のモータに用いられるロータが一例として挙げられる。このようなモータは、回転数を検出して種々の制御を行っているが、回転数が正確に検出できないと、種々の制御を正確に行うことができない。検出対象２の回転数を正確に検出するためには、検出対象２に対して、センサ素子４が正確に位置決めされている必要がある。なお、検出対象２は円盤状や円柱状であってもかまわない。 As an example of the detection target 2, a rotor used for a motor such as an electric scooter can be mentioned. Such a motor detects the rotation speed and performs various controls, but if the rotation speed cannot be accurately detected, various controls cannot be performed accurately. In order to accurately detect the rotation speed of the detection target 2, the sensor element 4 needs to be accurately positioned with respect to the detection target 2. The detection target 2 may be disk-shaped or columnar.

本実施形態の回転検出装置１は、ケース３に検出対象２の外周面に沿って延設された円弧状の側壁部３１を備えており、この側壁部３１の内側の３箇所に収納部３２を設け、この収納部３２に３個のセンサ素子４を位置決めして取り付けている。 The rotation detection device 1 of the present embodiment is provided with an arcuate side wall portion 31 extending along the outer peripheral surface of the detection target 2 in the case 3, and storage portions 32 are provided at three locations inside the side wall portion 31. Is provided, and three sensor elements 4 are positioned and attached to the storage portion 32.

センサ素子４は、本実施形態ではホールＩＣであり、図２（Ａ）に示すように、素子本体４１と、素子本体４１から延びる３本のリード端子４２とを備えている。リード端子４２は、素子本体４１の内部に設けられた素子によって検出された検出信号を外部に出力するものである。 The sensor element 4 is a Hall IC in the present embodiment, and includes an element main body 41 and three lead terminals 42 extending from the element main body 41 as shown in FIG. 2A. The lead terminal 42 outputs a detection signal detected by an element provided inside the element main body 41 to the outside.

図２（Ａ）に示すように、素子本体４１のリード端子４２が延びている方向の面が基準面４３として規定されている。この基準面４３は、検出対象２の回転を正確に検出するために、検出対象２の外周面に対して正対するように設定された面である。即ち、この基準面４３を基準壁部３３に接触させたセンサ素子４の方向が、検出対象２に対するセンサ素子４の配置方向となる。 As shown in FIG. 2A, the surface in the direction in which the lead terminal 42 of the element main body 41 extends is defined as the reference surface 43. The reference surface 43 is a surface set to face the outer peripheral surface of the detection target 2 in order to accurately detect the rotation of the detection target 2. That is, the direction of the sensor element 4 in which the reference surface 43 is brought into contact with the reference wall portion 33 is the arrangement direction of the sensor element 4 with respect to the detection target 2.

図２（Ｂ）に示す収納部３２は、ケース３の側壁部３１側から見た状態を示している。収納部３２には、センサ素子４の基準面４３が接触する基準壁部３３が設けられている。本実施形態では、基準壁部３３は、単なる壁面ではなく、中央部に凹部３４が形成された２箇所の壁面で形成されている。 The storage portion 32 shown in FIG. 2B shows a state seen from the side wall portion 31 side of the case 3. The storage portion 32 is provided with a reference wall portion 33 with which the reference surface 43 of the sensor element 4 comes into contact. In the present embodiment, the reference wall portion 33 is not merely a wall surface, but is formed by two wall surfaces having recesses 34 formed in the central portion.

また、収納部３２は、センサ素子４の幅方向の両側に、センサ素子４を挿入方向Ｆに案内する一対のガイド壁３５が設けられている。この一対のガイド壁３５同士の間隔は、センサ素子４の素子本体４１の幅よりも若干広く形成されている。このため、センサ素子４が収納部３２に収納された際に、ガイド壁３５によって素子本体４１が圧迫されることがない。 Further, the accommodating portion 32 is provided with a pair of guide walls 35 for guiding the sensor element 4 in the insertion direction F on both sides of the sensor element 4 in the width direction. The distance between the pair of guide walls 35 is formed to be slightly wider than the width of the element main body 41 of the sensor element 4. Therefore, when the sensor element 4 is stored in the storage portion 32, the element main body 41 is not pressed by the guide wall 35.

また、図３に示すように、収納部３２には、基準面４３に対向し、図３においてセンサ素子４の挿入方向Ｆに向けて基準面４３に対して狭まるように傾斜するテーパ部３６を備えている。このテーパ部３６は、上方部分がセンサ素子４の厚さ寸法Ｔよりも長くなっており、下方部分はセンサ素子４の厚さ寸法Ｔよりも短くなっている。センサ素子４の厚さ寸法Ｔとは、素子本体４１の基準面４３に対して垂直な方向の厚さの寸法をいう。 Further, as shown in FIG. 3, the accommodating portion 32 is provided with a tapered portion 36 that faces the reference surface 43 and is inclined so as to be narrowed with respect to the reference surface 43 toward the insertion direction F of the sensor element 4 in FIG. I have. The upper portion of the tapered portion 36 is longer than the thickness dimension T of the sensor element 4, and the lower portion is shorter than the thickness dimension T of the sensor element 4. The thickness dimension T of the sensor element 4 means the dimension of the thickness in the direction perpendicular to the reference surface 43 of the element main body 41.

さらに、収納部３２には、センサ素子４が収納部３２に収納された際に中央のリード端子４２を案内するガイド突部３７が設けられている。このガイド突部３７は、収納部３２に設けられた凹部３４の部分から上方に突出する一対の突部により形成されている。なお、本実施形態においては、リード端子４２とガイド突部３７とは嵌合しておらず、多少遊びがある状態で案内される。 Further, the storage unit 32 is provided with a guide protrusion 37 that guides the central lead terminal 42 when the sensor element 4 is stored in the storage unit 32. The guide protrusion 37 is formed by a pair of protrusions that project upward from the portion of the recess 34 provided in the storage portion 32. In this embodiment, the lead terminal 42 and the guide protrusion 37 are not fitted with each other, and the guide terminal 42 is guided with some play.

また、図１に示すように、ケース３の内部には基板５が取り付けられている。図１は、ケース３の３箇所の収納部３２に３個のセンサ素子４が取り付けられ、ケース３の後方に外部接続端子６が取り付けられた状態で、基板５がケース３に装着された状態を示している。 Further, as shown in FIG. 1, a substrate 5 is attached to the inside of the case 3. FIG. 1 shows a state in which three sensor elements 4 are attached to three storage portions 32 of the case 3, an external connection terminal 6 is attached to the rear of the case 3, and a substrate 5 is attached to the case 3. Is shown.

基板５には、リード端子４２及び外部接続端子６の先端部が挿通される接続孔５１が設けられ、接続孔５１の周囲にはランド５２が設けられている。なお、図１においては、リード端子４２及び外部接続端子６と基板５に設けられたランド５２はハンダ付けされていない。 The substrate 5 is provided with a connection hole 51 through which the tips of the lead terminal 42 and the external connection terminal 6 are inserted, and a land 52 is provided around the connection hole 51. In FIG. 1, the lead terminal 42, the external connection terminal 6, and the land 52 provided on the board 5 are not soldered.

外部接続端子６は、図４に示すように、先端部分（図４において左側）は基板５の接続孔５１に挿通されており、後方部分は端子用蓋部６１に装着されてケース３の外部に突出している。また、本実施形態において、外部接続端子６はハーネス線であり、前方部分が略Ｕ字状に屈曲されており、合成樹脂製の端子位置決め部材６２によって先端部分がケース３に位置決め固定され、他端部が外部に引き出されている。また、ケース３の底面には、外部接続端子６の屈曲部分に当接する爪部３８が形成されている。 As shown in FIG. 4, the external connection terminal 6 has a tip portion (left side in FIG. 4) inserted through a connection hole 51 of the substrate 5, and a rear portion mounted on a terminal lid portion 61 to the outside of the case 3. It stands out. Further, in the present embodiment, the external connection terminal 6 is a harness wire, the front portion is bent in a substantially U shape, the tip portion is positioned and fixed to the case 3 by the terminal positioning member 62 made of synthetic resin, and the like. The end is pulled out. Further, on the bottom surface of the case 3, a claw portion 38 that abuts on the bent portion of the external connection terminal 6 is formed.

このように、外部接続端子６は、端子位置決め部材６２とケース３の底面の爪部３８との間を通って端子用蓋部６１の側面に設けられた開口から外部に引き出されている。このため、ケース３の外部に突出している外部接続端子６に、外部から引っ張る力が加わった場合であっても、端子位置決め部材６２とケース３の底面の爪部３８との間に外部接続端子６が引っかかり引張り力を受け止める。そのため、外部接続端子６の先端部分への影響はほとんどなく、外部接続端子６と基板５とのハンダ付け部分には影響が及ばない。 As described above, the external connection terminal 6 passes between the terminal positioning member 62 and the claw portion 38 on the bottom surface of the case 3 and is pulled out from the opening provided on the side surface of the terminal lid portion 61. Therefore, even when a pulling force is applied to the external connection terminal 6 projecting to the outside of the case 3, the external connection terminal is between the terminal positioning member 62 and the claw portion 38 on the bottom surface of the case 3. 6 is caught and receives the tensile force. Therefore, there is almost no influence on the tip portion of the external connection terminal 6, and the soldering portion between the external connection terminal 6 and the substrate 5 is not affected.

次に、本実施形態の回転検出装置１の製造方法について説明する。まずは、ケース３を合成樹脂の射出成形等の製法により製造する。また、センサ素子４は、リード端子４２を屈曲させて図２（Ａ）及び（Ｂ）に示す形状に形成する。また、金属材料から外部接続端子６を形成する。また、基板５、端子位置決め部材６２、端子用蓋部６１等も同様に射出成形等の製法により製造する。 Next, a method of manufacturing the rotation detection device 1 of the present embodiment will be described. First, the case 3 is manufactured by a manufacturing method such as injection molding of synthetic resin. Further, the sensor element 4 is formed by bending the lead terminal 42 into the shapes shown in FIGS. 2A and 2B. Further, the external connection terminal 6 is formed from a metal material. Further, the substrate 5, the terminal positioning member 62, the terminal lid 61, and the like are also manufactured by a manufacturing method such as injection molding.

次に、ケース３の３箇所の収納部３２に、センサ素子４を装着する。このとき、図２（Ｂ）に示すように、センサ素子４の素子本体４１に形成された基準面４３を収納部３２の基準壁部３３に向けた姿勢とし、センサ素子４を挿入方向Ｆに沿って移動させる。センサ素子４は、収納部３２に設けられた一対のガイド壁３５によって案内されながら下方に移動する。 Next, the sensor element 4 is attached to the three storage portions 32 of the case 3. At this time, as shown in FIG. 2B, the reference surface 43 formed on the element main body 41 of the sensor element 4 is oriented toward the reference wall portion 33 of the storage portion 32, and the sensor element 4 is placed in the insertion direction F. Move along. The sensor element 4 moves downward while being guided by a pair of guide walls 35 provided in the storage portion 32.

ケース３の側壁部３１には、図３に示すようにテーパ部３６が設けられているため、収納部３２にセンサ素子４を挿入していくと、素子本体４１の先端部分がテーパ部３６に当接し、素子本体４１がこのテーパ部３６に案内されて図３の右側に移動する。そして、テーパ部３６と基準壁部３３との距離がセンサ素子４の素子本体４１の厚さと同じ長さの箇所までくると、センサ素子４は基準面４３がケース３の基準壁部３３に接触するようになる。このとき、センサ素子４の上下方向の位置決めも成される。 As shown in FIG. 3, the side wall portion 31 of the case 3 is provided with a tapered portion 36. Therefore, when the sensor element 4 is inserted into the accommodating portion 32, the tip portion of the element main body 41 becomes the tapered portion 36. The element main body 41 abuts and is guided by the tapered portion 36 to move to the right side of FIG. Then, when the distance between the tapered portion 36 and the reference wall portion 33 reaches a position having the same length as the thickness of the element main body 41 of the sensor element 4, the reference surface 43 of the sensor element 4 comes into contact with the reference wall portion 33 of the case 3. Will come to do. At this time, the sensor element 4 is also positioned in the vertical direction.

なお、素子本体４１は先端部の基準壁部３３から離れた側のみでテーパ部３６に接触しているため、接触箇所を支点として基準壁部３３側へ回転するような力が働く。その結果、基準面４３と基準壁部３３とがより安定して面接触するため、位置決め精度がより安定する。 Since the element main body 41 is in contact with the tapered portion 36 only on the side of the tip portion away from the reference wall portion 33, a force that rotates toward the reference wall portion 33 with the contact portion as a fulcrum acts. As a result, the reference surface 43 and the reference wall portion 33 are in surface contact with each other more stably, so that the positioning accuracy is more stable.

このとき、３本のリード端子４２のうち、中央に配置されたリード端子４２が、ケース３の収納部３２に設けられたガイド突部３７によって案内される。即ち、リード端子４２は、収納部３２の基準壁部３３側に向けて配置されている。このように、リード端子４２が基準壁部３３側へ延設されているため、センサ素子４が基準壁部３３側へ回転するような力がより効果的に働く。 At this time, of the three lead terminals 42, the lead terminal 42 arranged in the center is guided by the guide protrusion 37 provided in the storage portion 32 of the case 3. That is, the lead terminal 42 is arranged toward the reference wall portion 33 side of the storage portion 32. In this way, since the lead terminal 42 extends toward the reference wall portion 33, a force that causes the sensor element 4 to rotate toward the reference wall portion 33 works more effectively.

センサ素子４が収納部３２に収納された状態を図５に示す。この状態では、センサ素子４の素子本体４１にある基準面４３が、ケース３の収納部３２に設けられた基準壁部３３に接触しており、素子本体４１の先端部はケース３に設けられたテーパ部３６に接触している（図３参照）。また、素子本体４１の幅方向の両側には、素子本体４１の幅よりも若干広い間隔を有するガイド壁３５が設けられている。 FIG. 5 shows a state in which the sensor element 4 is housed in the storage unit 32. In this state, the reference surface 43 on the element body 41 of the sensor element 4 is in contact with the reference wall portion 33 provided in the storage portion 32 of the case 3, and the tip end portion of the element body 41 is provided on the case 3. It is in contact with the tapered portion 36 (see FIG. 3). Further, guide walls 35 having a distance slightly wider than the width of the element main body 41 are provided on both sides of the element main body 41 in the width direction.

このように、本実施形態においては、センサ素子４がケース３の収納部３２に収納された際に、センサ素子４の素子本体４１には外部から力が加わっていないため、素子本体４１に変形や応力が発生しない。一方で、センサ素子４は、収納部３２のテーパ部３６、基準壁部３３、ガイド突部３７及びガイド壁３５によって正確に位置決めされて取り付けられた状態となる。 As described above, in the present embodiment, when the sensor element 4 is housed in the storage portion 32 of the case 3, the element body 41 of the sensor element 4 is deformed into the element body 41 because no external force is applied to the element body 41. And stress does not occur. On the other hand, the sensor element 4 is in a state of being accurately positioned and attached by the tapered portion 36 of the accommodating portion 32, the reference wall portion 33, the guide protrusion portion 37, and the guide wall 35.

この状態から、ケース３に、端子位置決め部材６２及び端子用蓋部６１が設けられた外部接続端子６を装着する。次に、ケース３に予め接続孔５１及びランド５２等が形成された基板５を装着する。基板５はケース３に設けられた位置決めピン及びガイドピンによって所定の位置に配置される。このとき、接続孔５１は、リード端子４２及び外部接続端子６が接触しない大きさに形成されているため、ケース３に基板５を装着しても、センサ素子４及び外部接続端子６には基板５は接触しないようにすることができる。 From this state, the external connection terminal 6 provided with the terminal positioning member 62 and the terminal lid portion 61 is mounted on the case 3. Next, the substrate 5 on which the connection hole 51, the land 52, and the like are formed in advance is mounted on the case 3. The substrate 5 is arranged at a predetermined position by a positioning pin and a guide pin provided in the case 3. At this time, since the connection hole 51 is formed in such a size that the lead terminal 42 and the external connection terminal 6 do not come into contact with each other, even if the substrate 5 is mounted on the case 3, the sensor element 4 and the external connection terminal 6 have a substrate. 5 can be prevented from touching.

次に、リード端子４２及び外部接続端子６と、基板５に設けられたランド５２とをハンダ付けする。このとき、リード端子４２は、素子本体４１が収納部３２に位置決めされて取り付けられた構造となっており、３本のリード端子４２のうちの中央のリード端子４２はガイド突部３７によって位置決めされているので、ハンダ付けを行う際も素子本体４１の位置が変動することはない。このようにハンダ付けされたリード端子４２は、図３に示すように、ハンダ５３によってランド５２に電気的に接続される。 Next, the lead terminal 42 and the external connection terminal 6 and the land 52 provided on the board 5 are soldered. At this time, the lead terminal 42 has a structure in which the element main body 41 is positioned and attached to the storage portion 32, and the central lead terminal 42 of the three lead terminals 42 is positioned by the guide protrusion 37. Therefore, the position of the element main body 41 does not change even when soldering. As shown in FIG. 3, the lead terminal 42 soldered in this way is electrically connected to the land 52 by the solder 53.

次に、ケース３に図示しない蓋部材、及びその他の部品を組み付けることにより、回転検出装置１が完成する。このように、本実施形態の回転検出装置１の製造方法では、ケース３の収納部３２にセンサ素子４を取り付けた状態で、基板５をケース３に装着し、ハンダ付けを行っている。当該製造方法により、ケース３に対して正確にセンサ素子４を組み付けることができるので、回転検出装置１の検出精度を安定したものとすることができる。 Next, the rotation detection device 1 is completed by assembling a lid member (not shown) and other parts to the case 3. As described above, in the manufacturing method of the rotation detection device 1 of the present embodiment, the substrate 5 is attached to the case 3 and soldered with the sensor element 4 attached to the storage portion 32 of the case 3. Since the sensor element 4 can be accurately assembled to the case 3 by the manufacturing method, the detection accuracy of the rotation detection device 1 can be stabilized.

また、ケース３の収納部３２にセンサ素子４が取り付けられた状態でハンダ付けが行われるので、ハンダ付け後にリード端子４２のスプリングバックが生じることがない。従って、センサ素子４は、ケース３に対して常に安定した形で取り付けられるため、常に安定した検出感度の回転検出装置１を提供することができる。 Further, since soldering is performed with the sensor element 4 attached to the storage portion 32 of the case 3, springback of the lead terminal 42 does not occur after soldering. Therefore, since the sensor element 4 is always attached to the case 3 in a stable form, it is possible to provide the rotation detection device 1 having a stable detection sensitivity.

なお、上記実施形態においては、本発明の移動量検出装置として、回転検出装置１を例にして説明したが、これに限らず、センサ素子４によって検出対象の直線的な移動量を検出する位置検出装置としてもよく、検出対象の接近等を検知する検出装置とすることもできる。 In the above embodiment, the rotation detection device 1 has been described as an example of the movement amount detection device of the present invention, but the present invention is not limited to this, and the position where the sensor element 4 detects the linear movement amount of the detection target. It may be a detection device, or it may be a detection device that detects the approach of a detection target or the like.

また、上記実施形態では、基準壁部３３は凹部３４を挟んだ２箇所の壁部で構成されているが、これに限らず、単なる１つの平面として形成してもよい。また、ケース３の側壁部３１が円弧状に形成されているが、厳密な円弧状ではなく、多角形形状に形成されていてもよい。また、上記実施形態では、基準壁部３３が側壁部３１に対面する形で形成されているが、これに限らず、基準壁部３３を側壁部３１側に設け、テーパ部３６を上記実施形態の基準壁部３３が形成されている側に設けてもよい。 Further, in the above embodiment, the reference wall portion 33 is composed of two wall portions sandwiching the recess 34, but the present invention is not limited to this, and the reference wall portion 33 may be formed as a mere flat surface. Further, although the side wall portion 31 of the case 3 is formed in an arc shape, it may be formed in a polygonal shape instead of a strict arc shape. Further, in the above embodiment, the reference wall portion 33 is formed so as to face the side wall portion 31, but the present invention is not limited to this, and the reference wall portion 33 is provided on the side wall portion 31 side and the tapered portion 36 is provided in the above embodiment. May be provided on the side where the reference wall portion 33 of the above is formed.

また、上記実施形態では、センサ素子４としてホールＩＣを例にして説明したが、これ握らず、ＭＲ素子（磁気抵抗センサ）等の素子としてもよい。また、センサ素子４の数は３個に限らず、任意の個数とすることができる。 Further, in the above embodiment, the Hall IC has been described as an example of the sensor element 4, but the Hall IC may be used as an element such as an MR element (magnetic resistance sensor) without grasping the Hall IC. Further, the number of the sensor elements 4 is not limited to three, and may be any number.

１…回転検出装置
２…検出対象
３…ケース
４…センサ素子
５…基板
６…外部接続端子
３１…側壁部
３２…収納部
３３…基準壁部
３４…凹部
３５…ガイド壁
３６…テーパ部
３７…ガイド突部
３８…爪部
４１…素子本体
４２…リード端子
４３…基準面
５１…接続孔
５２…ランド
５３…ハンダ
６１…端子用蓋部
６２…端子位置決め部材1 ... Rotation detection device 2 ... Detection target 3 ... Case 4 ... Sensor element 5 ... Board 6 ... External connection terminal 31 ... Side wall part 32 ... Storage part 33 ... Reference wall part 34 ... Recessed portion 35 ... Guide wall 36 ... Tapered part 37 ... Guide protrusion 38 ... Claw part 41 ... Element body 42 ... Lead terminal 43 ... Reference surface 51 ... Connection hole 52 ... Land 53 ... Solder 61 ... Terminal lid 62 ... Terminal positioning member

Claims (9)

検出対象に対して位置決めされるケースにセンサ素子を取り付ける構造であって、
前記センサ素子は、前記検出対象に対する配置方向を規定する基準面を有する本体部と、前記本体部から延び検出信号を外部に出力するリード端子と、を有し、
前記ケースは、前記センサ素子を挿入して位置決めするための収納部を有し、
前記収納部は、前記基準面を前記検出対象に対して位置決めする基準壁部と、前記基準壁部に対向し、前記センサ素子の挿入方向に向けて前記基準壁部に対して狭まるように傾斜するテーパ部を備え、
前記基準壁部と前記テーパ部との間隔は、前記基準面に垂直な前記センサ素子の厚さ寸法よりも長い部分と短い部分を有しており、
前記センサ素子は、前記本体部の前記挿入方向の先端部が前記収納部に挿入され、前記先端部において前記テーパ部に当接し、前記基準面が前記基準壁部に接触した状態で取り付けられ、前記本体部の前記挿入方向の後端部から前記リード端子が延びることを特徴とするセンサ素子の取付構造。 The structure is such that the sensor element is attached to the case positioned with respect to the detection target.
The sensor element has a main body portion having a reference surface that defines an arrangement direction with respect to the detection target, and a lead terminal extending from the main body portion and outputting a detection signal to the outside .
The case has a housing for inserting and positioning the sensor element.
The storage portion faces the reference wall portion that positions the reference surface with respect to the detection target, and is inclined so as to be narrowed with respect to the reference wall portion in the insertion direction of the sensor element. Equipped with a tapered part to
The distance between the reference wall portion and the tapered portion has a portion longer and a portion shorter than the thickness dimension of the sensor element perpendicular to the reference plane.
The sensor element is attached in a state where the tip portion of the main body portion in the insertion direction is inserted into the storage portion, the tip portion abuts on the tapered portion, and the reference surface is in contact with the reference wall portion . A mounting structure for a sensor element, characterized in that the lead terminal extends from the rear end portion of the main body portion in the insertion direction . 前記ケースに取り付けられ、前記リード端子が接続される基板を有することを特徴とする請求項１に記載のセンサ素子の取付構造。 The mounting structure for a sensor element according to claim 1, wherein the sensor element is mounted on the case and has a substrate to which the lead terminal is connected. 前記収納部は、前記センサ素子の幅方向の両側に、前記センサ素子を挿入方向に案内するガイド壁が設けられていることを特徴とする請求項１または請求項２に記載のセンサ素子の取付構造。 The mounting of the sensor element according to claim 1 or 2 , wherein the accommodating portion is provided with guide walls for guiding the sensor element in the insertion direction on both sides of the sensor element in the width direction. structure. 前記リード端子は、前記センサ素子が前記収納部に取り付けられた際に、前記基準壁部側に向けて屈曲されていることを特徴とする請求項１から請求項３のいずれか１項に記載のセンサ素子の取付構造。 The one according to any one of claims 1 to 3 , wherein the lead terminal is bent toward the reference wall portion when the sensor element is attached to the storage portion. Mounting structure of the sensor element. 前記ケースは、前記センサ素子が前記収納部に取り付けられた際に、前記リード端子を案内するガイド突部を備えていることを特徴とする請求項１から請求項４のいずれか１項に記載のセンサ素子の取付構造。 The case according to any one of claims 1 to 4 , wherein the case includes a guide protrusion for guiding the lead terminal when the sensor element is attached to the storage portion. Mounting structure of the sensor element. 検出対象の移動量を検出する移動量検出装置であって、
前記検出対象に対して位置決めされるケースと、
前記ケースに取り付けられ、検出信号を外部に出力するリード端子を備えたセンサ素子と、
前記ケースに取り付けられ、前記リード端子が接続される基板と、
前記基板に接続され、前記ケースから突出して外部との接続が可能な外部接続端子とを備え、
前記センサ素子は、前記検出対象に対する配置方向を規定する基準面を有し、
前記ケースは、前記センサ素子を挿入して位置決めするための収納部を有し、
前記収納部は、前記基準面を前記検出対象に対して位置決めする基準壁部と、前記基準壁部に対向し、前記センサ素子の挿入方向に向けて前記基準壁部に対して狭まるように傾斜するテーパ部を備え、
前記基準壁部と前記テーパ部との間隔は、前記基準面に垂直な前記センサ素子の厚さ寸法よりも長い部分と短い部分を有しており、
前記センサ素子は、挿入方向の先端部が前記収納部に挿入され、前記挿入方向の先端部において前記テーパ部に当接し、前記基準面が前記基準壁部に接触した状態で取り付けられ、前記リード端子が前記基板に接続されていることを特徴とする移動量検出装置。 It is a movement amount detection device that detects the movement amount of the detection target.
A case positioned with respect to the detection target and a case
A sensor element attached to the case and equipped with a lead terminal that outputs a detection signal to the outside,
A board attached to the case and to which the lead terminal is connected,
It is provided with an external connection terminal that is connected to the board and can be connected to the outside by protruding from the case.
The sensor element has a reference plane that defines an arrangement direction with respect to the detection target.
The case has a housing for inserting and positioning the sensor element.
The storage portion faces the reference wall portion that positions the reference surface with respect to the detection target, and is inclined so as to be narrowed with respect to the reference wall portion in the insertion direction of the sensor element. Equipped with a tapered part to
The distance between the reference wall portion and the tapered portion has a portion longer and a portion shorter than the thickness dimension of the sensor element perpendicular to the reference plane.
The sensor element is attached in a state where the tip portion in the insertion direction is inserted into the storage portion, the tip portion in the insertion direction abuts on the tapered portion, and the reference surface is in contact with the reference wall portion. A movement amount detecting device characterized in that terminals are connected to the substrate. 前記検出対象は円弧状の外周面を有する磁性体であり、
前記ケースは、前記外周面に沿って延設された円弧状の側壁部を有し、
前記収納部は前記側壁部に沿って３箇所に設けられ、それぞれの前記収納部に前記センサ素子が取り付けられていることを特徴とする請求項６に記載の移動量検出装置。 The detection target is a magnetic material having an arcuate outer peripheral surface.
The case has an arcuate side wall extending along the outer peripheral surface.
The movement amount detecting device according to claim 6 , wherein the accommodating portions are provided at three locations along the side wall portions, and the sensor elements are attached to the accommodating portions. 検出対象の移動量を検出する移動量検出装置の製造方法であって、
前記移動量検出装置は、
前記検出対象に対して位置決めされるケースと、
前記ケースに取り付けられ、検出信号を外部に出力するリード端子を備えたセンサ素子と、
前記ケースに取り付けられ、前記リード端子が接続される基板と、
前記基板に接続され、前記ケースから突出して外部との接続が可能な外部接続端子とを備え、
前記センサ素子は、前記検出対象に対する配置方向を規定する基準面を有し、
前記ケースは、前記センサ素子を挿入して位置決めするための収納部を有し、
前記収納部は、前記基準面を前記検出対象に対して位置決めする基準壁部と、前記基準壁部に対向し、前記センサ素子の挿入方向に向けて前記基準壁部に対して狭まるように傾斜するテーパ部を備え、
前記基準壁部と前記テーパ部との間隔は、前記基準面に垂直な前記センサ素子の厚さ寸法よりも長い部分と短い部分を有するものであり、
前記ケースの前記収納部に前記センサ素子を挿入し、前記センサ素子の挿入方向側の先端部を前記テーパ部に当接させて、前記センサ素子を前記テーパ部で案内し、前記基準面と前記基準壁部とを接触した状態で取り付け、
前記ケースに前記外部接続端子を位置決めし、
前記基板を前記ケースに装着し、前記基板に前記リード端子及び前記外部接続端子をハンダ付けしてなることを特徴とする移動量検出装置の製造方法。 It is a manufacturing method of a movement amount detection device that detects a movement amount of a detection target.
The movement amount detection device is
A case positioned with respect to the detection target and a case
A sensor element attached to the case and equipped with a lead terminal that outputs a detection signal to the outside,
A board attached to the case and to which the lead terminal is connected,
It is provided with an external connection terminal that is connected to the board and can be connected to the outside by protruding from the case.
The sensor element has a reference plane that defines an arrangement direction with respect to the detection target.
The case has a housing for inserting and positioning the sensor element.
The storage portion faces the reference wall portion that positions the reference surface with respect to the detection target, and is inclined so as to be narrowed with respect to the reference wall portion in the insertion direction of the sensor element. Equipped with a tapered part to
The distance between the reference wall portion and the tapered portion has a portion longer and a portion shorter than the thickness dimension of the sensor element perpendicular to the reference plane.
The sensor element is inserted into the storage portion of the case, the tip portion of the sensor element on the insertion direction side is brought into contact with the tapered portion, the sensor element is guided by the tapered portion, and the reference surface and the reference surface are described. Attached in contact with the reference wall,
Position the external connection terminal on the case and
A method for manufacturing a movement amount detecting device, which comprises mounting the substrate on the case and soldering the lead terminal and the external connection terminal to the substrate. 前記基板は、前記リード端子及び前記外部接続端子が接触しない大きさの接続孔を有し、前記接続孔にランドが設けられており、
前記ケースに前記基板を装着する際に、前記接続孔に前記リード端子と前記外部接続端子を挿入して前記ランドにハンダ付けすることを特徴とする請求項８に記載の移動量検出装置の製造方法。 The substrate has a connection hole having a size so that the lead terminal and the external connection terminal do not come into contact with each other, and a land is provided in the connection hole.
The manufacture of the movement amount detecting device according to claim 8 , wherein when the substrate is mounted on the case, the lead terminal and the external connection terminal are inserted into the connection hole and soldered to the land. Method.
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