JP7077728B2 - Manufacturing method of assembly jigs and semiconductor devices - Google Patents

Description

The present invention relates to a method for manufacturing an assembly jig and a semiconductor device.

The semiconductor device includes, for example, a semiconductor element such as an IGBT (Insulted Gate Bipolar Transistor) and a power MOSFET (Metal Oxide Semiconductor Field Effect Transistor). Such a semiconductor device is used, for example, as a power conversion device.

The semiconductor device includes a ceramic circuit board having an insulating plate and a conductive pattern formed on the front surface of the insulating plate, and a semiconductor element and a connection terminal which is a lead frame are arranged on the conductive pattern. In such a semiconductor device, a signal applied from the connection terminal is input to the semiconductor element via a conductive pattern.

In a semiconductor device, a jig used for positioning a semiconductor element or the like is arranged on a ceramic circuit board, and the semiconductor element is arranged at a predetermined position on the ceramic circuit board. Then, the two connection terminals are arranged with the plate sandwiched so that the joints of the connection terminals are respectively located on the electrodes of such a semiconductor element.

Japanese Unexamined Patent Publication No. 2017-037892

When arranging the two connection terminals on the electrodes of the semiconductor element of the ceramic circuit board as described above, the joints of the connection terminals are arranged on the electrodes of the semiconductor element via solder. However, after such an arrangement, if the solder is melted by heating in order to join the connection terminals to the semiconductor element, it is difficult to control the solder thickness by the weight of the connection terminals. That is, it is difficult to control the position of the connection terminal in the direction perpendicular to the front surface of the ceramic circuit board, which causes misalignment of the connection terminal.

The present invention has been made in view of these points, and an object of the present invention is to provide a method for manufacturing an assembly jig and a semiconductor device that improves the accuracy of vertical alignment of connection terminals with respect to a substrate. do.

According to one aspect of the present invention, a substrate in which a semiconductor element is arranged in a conductive pattern, a joint portion bonded to the semiconductor element or the conductive pattern, a connecting portion connected to the joint portion, and the connecting portion. A vertical holding that is arranged on the back surface of the wiring plate and supports the wiring plate from the back surface with respect to a semiconductor device including a connection terminal having a wiring plate connected to and provided at a distance from the joint portion. The holding jig has a holding jig having a portion and a terminal fixing jig having a vertical holding portion and a vertical holding plate that is arranged on the front surface of the wiring plate and sandwiches the wiring plate. Further has a horizontal holding portion connected to the vertical holding portion and having a surface perpendicular to the vertical holding portion, and the terminal fixing jig is connected to the vertical holding plate and has a surface perpendicular to the vertical holding plate. Provided is an assembly jig that has and further has a horizontal holding plate that holds the horizontal holding portion and the connecting portion .

Further, the holding jig is provided at a distance from the vertical holding portion, and further has a supported plate having a horizontal surface on the vertical holding portion.

Further, a first support member is formed in which the connection terminal, the holding jig and a part of the terminal fixing jig are inserted, and is arranged on the back surface of the supported plate of the holding jig. Further provided with a guide jig having a terminal guide portion connected to the first support member and surrounded along at least a part of a peripheral edge portion of a joint region to which the joint portion of the connection terminal is joined.

Further, it further has an element fixing jig which is arranged on the substrate and has a second opening formed along a part of a peripheral edge portion of an arrangement region in which the semiconductor element is arranged.

Further, the element fixing jig is arranged on the back surface of the first support member of the guide jig, has a second support member that supports the guide jig from the back surface, and the terminal guide portion has the second opening. It is arranged adjacent to the joint region via a portion.

Further, the holding jig has a rod shape in which the tip end portion of the back surface of the supported plate is in contact with the substrate and a predetermined distance is maintained between the back surface of the supported plate and the front surface of the substrate. Has legs.

Further, with respect to a semiconductor device having the connection terminals arranged in two rows and having the pair of connection terminals having the connecting portions facing each other, the terminal fixing jig includes the vertical holding plate and the vertical holding plate. It has the horizontal holding plate which is connected to the vicinity of the center of the vertical holding plate and has a surface perpendicular to the vertical holding plate, and the vertical holding plate and the horizontal holding plate form a T-shaped cross section. The tools are arranged in two rows corresponding to the connection terminals, and are connected to the horizontal holding portions facing each other and extend from the horizontal holding portions toward the horizontal holding portions in the other row. It has the vertical holding portion, and a plurality of the connection terminals are arranged around the horizontal holding plate, and the vertical holding portion is sandwiched between the vertical holding portions and the vertical holding plates facing each other. The wiring plate of the connection terminal is sandwiched orthogonally to the sandwiching direction of the vertical sandwiching plate.

Further, according to one aspect of the present invention, the substrate in which the semiconductor element is arranged in the conductive pattern, the joint portion bonded to the semiconductor element or the conductive pattern, the connecting portion connected to the joint portion, and the above. A preparatory step of preparing a connection terminal having a wiring board connected to the connection portion and provided at a distance from the joint portion, and a vertical support for the connection terminal from the back surface of the wiring board. The vertical holding portion and the wiring board are arranged on the front surface of the wiring board with respect to the first attachment step of attaching the holding jig having the holding portion and the connection terminal to which the holding jig is attached. The second mounting step of mounting the terminal fixing jig having the vertical holding plate for holding the board, and the holding jig so that the joint portion is arranged on the semiconductor element or the conductive pattern with respect to the substrate. Provided is a method for manufacturing a semiconductor device having a connection terminal arranging step for arranging.

Further, in the first mounting step, the cross section U formed by the horizontal holding portion further possessed by the holding jig and having a surface connected to the vertical holding portion and having a surface perpendicular to the vertical holding portion and the vertical holding portion. The wiring plate is arranged in the character portion, and in the second mounting step, the horizontal holding plate further possessed by the terminal fixing jig, which is connected to the vertical holding plate and has a surface perpendicular to the vertical holding plate, is described. Arranged on the outer surface of the connecting portion, the horizontal holding portion and the horizontal holding plate hold the connecting portion orthogonally to the holding direction of the vertical holding plate.

Further, before the connection terminal arrangement step, a joining region in which the first support member having the first opening formed and the first support member are connected to the substrate and the joint portion of the connection terminal is joined. A guide jig having a terminal guide portion surrounding at least a part of the peripheral portion thereof is installed, and the holding jig is provided at a distance from the vertical holding portion and is horizontal to the vertical holding portion. Further having a supported plate having various surfaces, the holding jig is arranged on the guide jig in the connection terminal arrangement step, and the connection terminal and the holding jig are formed in the first opening. A part of the terminal fixing jig is inserted, the back surface of the supported plate is supported by the first support member, and the joint portion is aligned with the joint region by the terminal guide portion.

Further, in the preparatory step, an element fixing jig having a second opening formed along a part of the peripheral edge of the arrangement region in which the semiconductor element is arranged is arranged on the substrate. The semiconductor element is arranged in the arrangement region in the second opening.

Further, before the connection terminal arrangement step, the guide jig is arranged on the element fixing jig, and the terminal guide portion is arranged in the joint region via the second opening.

Further, the holding jig has a rod-shaped leg on the back surface of the supported plate, and in the connection terminal arranging step, the holding jig is arranged with respect to the substrate to form the leg. The tip portion is in contact with the front surface of the substrate, and a predetermined distance is maintained between the back surface of the supported plate and the front surface of the substrate.

According to the disclosed technique, the accuracy of vertical alignment of the connection terminal with respect to the substrate can be improved.

It is a perspective view of the front side of a semiconductor device. It is a perspective view of the side part of a semiconductor device. It is a figure for demonstrating the connection terminal included in a semiconductor device. It is a figure for demonstrating the terminal fixing jig of the holding jig which constitutes the assembly jig used in the manufacturing of the semiconductor device of 1st Embodiment. It is a figure for demonstrating the holding jig which constitutes the assembly jig used in the manufacturing of the semiconductor device of 1st Embodiment. It is a figure (the 1) for demonstrating the attachment to the connection terminal of the holding jig and the terminal fixing jig constituting the assembly jig used in the manufacturing method of the semiconductor device of 1st Embodiment. FIG. 2 is a diagram (No. 2) for explaining attachment of a holding jig and a terminal fixing jig constituting an assembly jig used in the method for manufacturing a semiconductor device according to the first embodiment to connection terminals. It is a figure for demonstrating the guide jig which constitutes the assembly jig used in the manufacturing of the semiconductor device of 1st Embodiment. It is a figure for demonstrating the element fixing jig which constitutes the assembly jig used in the manufacturing of the semiconductor apparatus of 1st Embodiment. It is a figure (the 1) for demonstrating the manufacturing method of the semiconductor device of 1st Embodiment. It is a figure (the 2) for demonstrating the manufacturing method of the semiconductor device of 1st Embodiment. It is a figure (the 3) for demonstrating the manufacturing method of the semiconductor device of 1st Embodiment. It is a figure (the 4) for demonstrating the manufacturing method of the semiconductor device of 1st Embodiment. It is a figure (the 1) for demonstrating the manufacturing method of the semiconductor device of 2nd Embodiment. It is a figure (the 2) for demonstrating the manufacturing method of the semiconductor device of 2nd Embodiment.

Hereinafter, embodiments will be described with reference to the drawings.

[First Embodiment]
First, the semiconductor device will be described with reference to FIGS. 1 and 2. FIG. 1 is a perspective view of the front side of the semiconductor device, and FIG. 2 is a perspective view of the side portion of the semiconductor device. Note that FIG. 2 shows a case where the semiconductor device 10 of FIG. 1 is viewed from the right side.

The semiconductor device 10 electrically connects the ceramic element 12a to 12d bonded to the front surface of the ceramic circuit board 11 and the ceramic circuit board 11, the terminal blocks 14a, 14b, 14c, and the electrodes of the semiconductor element 12a to 12d. It includes a pair of connection terminals 15 and 16.

The ceramic circuit board 11 has an insulating plate 11a, a conductive pattern 11b1, 11b2, 11b3 formed on the front surface of the insulating plate 11a, and a metal plate 11c formed on the back surface of the insulating plate 11a. In the following, when the conductive patterns 11b1, 11b2, 11b3 are not particularly distinguished, they are referred to as the conductive pattern 11b.

The insulating plate 11a is made of ceramics having high thermal conductivity, such as aluminum oxide, aluminum nitride, and silicon nitride, which have excellent thermal conductivity. The thickness of the insulating plate 11a is preferably 0.2 mm or more and 1.5 mm or less, and more preferably 0.25 mm or more and 1.0 mm or less.

The conductive pattern 11b is made of a material having excellent conductivity. Such a material is made of, for example, copper, aluminum, or an alloy containing at least one of these. The thickness of the conductive pattern 11b is preferably 0.1 mm or more and 2.0 mm or less, and more preferably 0.125 mm or more and 1.2 mm or less. Further, the conductive pattern 11b can be plated with a material having excellent corrosion resistance. Such materials include, for example, aluminum, nickel, titanium, chromium, molybdenum, tantalum, niobium, tungsten, vanadium, bismuth, zirconium, hafnium, gold, silver, platinum, palladium, or alloys containing at least one of these. Is. The number, arrangement position, and shape of such a conductive pattern 11b are examples, and the number, arrangement position, and shape can be appropriately determined by design, not limited to this case.

The metal plate 11c is made of a metal such as copper, aluminum, iron, silver, or an alloy containing at least one of these, which has excellent thermal conductivity. The thickness of the metal plate 11c is preferably 0.1 mm or more and 2.0 mm or less, and more preferably 0.125 mm or more and 1.2 mm or less.

As the ceramic circuit board 11 having such a configuration, for example, a DCB (Direct Copper Bonding) substrate or an AMB (Active Metal Blazed) substrate can be used. The ceramic circuit board 11 can conduct heat generated by the semiconductor elements 12a to 12d, which will be described later, to the lower side of the ceramic circuit board 11 via the conductive pattern 11b, the insulating plate 11a, and the metal plate 11c. The insulating plate 11a has a rectangular shape, for example, in a plan view. Further, the metal plate 11c has a rectangular shape having a smaller area than the insulating plate 11a in a plan view. Therefore, the ceramic circuit board 11 has a rectangular shape, for example.

Further, the number, arrangement position, and shape of the ceramic circuit boards 11 shown in FIGS. 1 and 2 are examples, and the number, arrangement position, and shape can be appropriately determined by design, not limited to this case.

The semiconductor devices 12a to 12d include switching elements such as IGBTs and power MOSFETs, which are made of silicon or silicon carbide. Such semiconductor elements 12a to 12d are provided with, for example, a drain electrode (or collector electrode) on the back surface, and a gate electrode and a source electrode (or emitter electrode) on the front surfaces 12a1 to 12d1, respectively. Further, the semiconductor elements 12a to 12d include diodes such as SBD (Schottky Barrier Diode) and FWD (Free Wheeling Diode), if necessary. Such semiconductor elements 12a to 12d are provided with a cathode electrode on the back surface and an anode electrode on the front surface, respectively. The number (4 pieces) and arrangement (2 rows) of the semiconductor elements 12a to 12d on the ceramic circuit board 11 shown in FIGS. 1 and 2 is an example, and the number is not limited to this case, and the number may be appropriately designed. Can be determined.

Such semiconductor elements 12a to 12d are bonded to the conductive pattern 11b via solder (not shown). Further, on such a conductive pattern 11b, in addition to the semiconductor elements 12a to 12d, electronic parts such as thermistors and capacitors, bonding wires, wiring plates such as lead frames and connection terminals are appropriately arranged as needed. can do.

The terminal blocks 14a, 14b, 14c are joined to the conductive patterns 11b1, 11b2, 11b3 via solder (not shown). Such terminal blocks 14a, 14b, 14c are made of a material having excellent conductivity. Such a material is made of, for example, copper, aluminum, or an alloy containing at least one of these. The terminal blocks 14a, 14b, 14c can also be plated with a material having excellent corrosion resistance. Such materials include, for example, aluminum, nickel, titanium, chromium, molybdenum, tantalum, niobium, tungsten, vanadium, bismuth, zirconium, hafnium, gold, silver, platinum, palladium, or alloys containing at least one of these. Is.

Next, the connection terminals included in the semiconductor device 10 will be described with reference to FIG. FIG. 3 is a diagram for explaining connection terminals included in the semiconductor device. 3 (A) is a back view of the pair of connection terminals 15 and 16, and FIG. 3 (B) is an arrow view in FIG. 3 (A).

The connection terminal 15 has joint portions 15b and 15c, a connection portion 15e, a wiring plate 15a, and a connection portion 15d. The joint portions 15b and 15c, the connecting portion 15e, the wiring plate 15a, and the connecting portion 15d may be integrally connected in this order.

The joint portions 15b and 15c have a main surface parallel to the front surface of the ceramic circuit board 11. The joint portions 15b and 15c may be extended in the short side direction of the ceramic circuit board 11. The bonded portions 15b and 15c may be bonded to the electrodes of the semiconductor elements 12b and 12a (see FIG. 1). However, not limited to this case, the joining portions 15b and 15c may be joined to the conductive pattern 11b of the ceramic circuit board 11.

The connecting portion 15e separates the wiring plate 15a from the joining portions 15b and 15c in the direction perpendicular to the front surface of the ceramic circuit board 11. As shown in FIG. 3B, the ceramic circuit board 11 may have a main surface perpendicular to the front surface (joint portion 15b joined to). Further, the connecting portion 15e integrally connects the joining portions 15b and 15c and the wiring plate 15a. For example, the connecting portion 15e extends upward (in the direction away from the front surface of the ceramic circuit board 11) from the ends of the joining portions 15b and 15c, and is connected to the end portion of the wiring board 15a.

The wiring board 15a has a main surface parallel to the front surface of the ceramic circuit board 11, and integrally connects the connecting portion 15e and the connecting portion 15d. For example, the wiring board 15a has a rectangular shape extending in parallel with the long side of the ceramic circuit board 11, and a part of the long side is connected to the connecting portion 15e and the short side is connected to the connecting portion 15d. Further, the wiring board 15a may straddle the semiconductor elements 12c and 12d arranged in parallel with the long side of the ceramic circuit board 11 (see FIG. 1). The cross section of the wiring board 15a and the connecting portion 15e may have a U-shaped cross section.

The connection portion 15d has a main surface parallel to the front surface of the ceramic circuit board 11, and is integrally connected to the end portion of the wiring board 15a. For example, the connection portion 15d has a rectangular shape extending in parallel with the short side of the ceramic circuit board 11, and a part of the long side is connected to the wiring board 15a.

In such a connection terminal 15, the joint portions 15b and 15c are joined to the main electrodes of the semiconductor elements 12d and 12c via solders 13d and 13c, respectively. Further, the joining portions 15b and 15c may be joined to the conductive pattern 11b of the ceramic circuit board 11 via solder. Further, in the connection terminal 15, the connection portion 15d is joined to the terminal block 14a via solder (not shown).

The connection terminal 16 also has a joint portion 16b, 16c, a connection portion 16e, a wiring plate 16a, and a connection portion 16d. The joint portions 16b and 16c, the connecting portion 16e, the wiring plate 16a, and the connecting portion 16d may be integrally connected in this order.

The joints 16b and 16c have a main surface parallel to the front surface of the ceramic circuit board 11. The joint portions 16b and 16c may be extended in the short side direction of the ceramic circuit board 11. The bonded portions 16b and 16c may be bonded to the electrodes of the semiconductor elements 12b and 12a (see FIG. 1). However, not limited to this case, the joining portions 16b and 16c may be joined to the conductive pattern 11b of the ceramic circuit board 11.

The connecting portion 16e separates the wiring plate 16a from the joining portions 16b and 16c in a direction perpendicular to the front surface of the ceramic circuit board 11. As shown in FIG. 3B, the ceramic circuit board 11 may have a main surface perpendicular to the front surface (joint portion 16c joined to). Further, the connecting portion 16e integrally connects the joining portions 16b and 16c and the wiring plate 16a. For example, the connecting portion 16e extends upward (in the direction away from the front surface of the ceramic circuit board 11) from the ends of the joining portions 16b and 16c and is connected to the end portion of the wiring board 16a.

The wiring board 16a has a main surface parallel to the front surface of the ceramic circuit board 11, and integrally connects the connecting portion 16e and the connecting portion 16d. For example, the wiring board 16a has a rectangular shape extending in parallel with the long side of the ceramic circuit board 11, and a part of the long side is connected to the connecting portion 16e and the short side is connected to the connecting portion 16d. Further, the wiring board 16a may straddle the semiconductor elements 12c and 12d arranged in parallel with the long side of the ceramic circuit board 11 (see FIG. 1). The cross section of the wiring board 16a and the connecting portion 16e may have a U-shaped cross section.

The connection portion 16d has a main surface parallel to the front surface of the ceramic circuit board 11, and is integrally connected to the end portion of the wiring plate 16a. For example, the connection portion 16d has a rectangular shape extending in parallel with the short side of the ceramic circuit board 11, and a part of the long side is connected to the wiring board 16a.

In such a connection terminal 16, the connecting portion 16e is adjacent to the connecting portion 15e of the connecting terminal 15, and the joining portions 16b and 16c are joined to the main electrodes of the semiconductor elements 12b and 12a via the solders 13b and 13a. Further, the bonding portions 16b and 16c may be bonded to the conductive pattern 11b of the ceramic circuit board 11 via solder. Further, in the connection terminal 16, the connection portion 16d is joined to the terminal block 14b via solder (not shown).

Such connection terminals 15 and 16 are made of aluminum, iron, silver, copper, or an alloy containing at least one of these, which has excellent conductivity. Further, the connection terminals 15 and 16 have, for example, aluminum, nickel, titanium, chromium, molybdenum, tantalum, niobium, tungsten, vanadium, bismuth, zirconium, hafnium, gold, silver, platinum, palladium, in order to improve corrosion resistance. Alternatively, an alloy or the like containing at least one of these may be plated.

Further, the solders 13a to 13d (and other solders (not shown) used in such a semiconductor device 10 are, for example, an alloy made of tin-silver-copper, an alloy made of tin-zinc-bismuth, and tin. -It is composed of lead-free solder whose main component is at least one of an alloy composed of copper and an alloy composed of tin-silver-indium-bismuth. In addition, additives such as nickel, germanium, cobalt or silicon may be included.

Further, in such a semiconductor device 10, the thickness of the solder between the conductive pattern 11b and the semiconductor elements 12a to 12d is preferably 10 μm or more and 400 μm or less. The thickness of the solders 13a to 13d between the semiconductor elements 12a to 12d and the joints 15b, 15c, 16b, 16c of the connection terminals 15 and 16 is preferably 100 μm or more and 800 μm or less. When the conductive pattern 11b and the joint portions 15b, 15c, 16b, 16c of the connection terminals 15 and 16 are joined, the solder thickness is preferably 100 μm or more and 800 μm or less. Controlling the solder thickness within the above range is preferable from the viewpoints of conductivity, heat dissipation and stress relaxation.

A heat sink (not shown) can be provided on the back surface of the semiconductor device 10 (the back surface of the metal plate 11c of the ceramic circuit board 11) via solder. The heat dissipation plate has excellent thermal conductivity, for example, aluminum, iron, silver, copper, or an alloy composed of at least one of these, a composite material composed of aluminum and silicon carbide, and a composite material composed of magnesium and silicon carbide. It is made of wood. Also, to improve corrosion resistance, for example, aluminum, nickel, titanium, chromium, molybdenum, tantalum, niobium, tungsten, vanadium, bismuth, zirconium, hafnium, gold, silver, platinum, palladium, or at least one of these. The surface may be plated with an alloy or the like.

Furthermore, it is also possible to improve heat dissipation by joining a cooler (not shown) to the back side of this heat sink via solder or silver wax, or by mechanically attaching it via thermal paste or the like. Is. The cooler in this case is made of, for example, aluminum, iron, silver, copper, or an alloy composed of at least one of these, which has excellent thermal conductivity. Further, as the cooler, fins, a heat sink composed of a plurality of fins, a water-cooled cooling device, or the like can be applied. Further, the heat sink may be integrally configured with such a cooler. In that case, it is composed of aluminum, iron, silver, copper, or at least one of these, which has excellent thermal conductivity. And to improve corrosion resistance, for example, aluminum, nickel, titanium, chromium, molybdenum, tantalum, niobium, tungsten, vanadium, bismuth, zirconium, hafnium, gold, silver, platinum, palladium, or at least one of these. The surface may be plated with an alloy or the like. Further, instead of the heat sink, the cooler may be joined to the back surface of the ceramic circuit board 11 via solder.

Further, the semiconductor device 10 is housed in a case (not shown). Such a case has a frame shape provided with an opening for accommodating the semiconductor device 10. The semiconductor device 10 housed in the case is surrounded by the periphery thereof, and the lower portion thereof is supported by a heat sink. Further, in such a case, for example, a connection terminal electrically connected to the terminal blocks 14a, 14b, 14c of the semiconductor device 10 is integrally formed. It should be noted that such a case is made of a thermoplastic resin. Examples of such a resin include polyphenylene sulfide (PPS), polybutylene terephthalate (PBT) resin, polybutylene succinate (PBS) resin, polyamide (PA) resin, acrylonitrile butadiene styrene (ABS) resin and the like.

Then, the semiconductor device 10 in the case is sealed in the opening of the case by the sealing resin. Such a sealing resin is composed of, for example, a thermosetting resin such as an epoxy resin, a phenol resin, and a maleimide resin, and a filler contained in the thermosetting resin. Further, the sealing member may be made of gel.

The assembly jig includes an element fixing jig, a guide jig, and a holding jig. Further, the holding jig is used together with the terminal fixing jig. It should be noted that such an assembly jig is made of a material that can withstand the heating temperature during the soldering process. Such materials include, for example, carbon, machinable ceramics, stainless steel with high heat resistance, and the like.

First, the holding jig 50 and the terminal fixing jig 40 used together with the holding jig 50 will be described. First, the terminal fixing jig 40 will be described with reference to FIG. FIG. 4 is a diagram for explaining a terminal fixing jig of a holding jig constituting an assembly jig used in manufacturing the semiconductor device of the first embodiment. 4A shows a perspective view of the front side of the terminal fixing jig 40, and FIG. 4B shows a perspective view of the back side of the terminal fixing jig 40.

The terminal fixing jig 40 has vertical holding plates 42, 44 parallel to the front surface of the ceramic circuit board 11, and horizontal holding plates 41, 43 which are also perpendicular to the front surface. The terminal fixing jig 40 extends in a direction away from, for example, the vertical holding plates 42, 44, the horizontal holding plates 43 extending from the connection points of the vertical holding plates 42, 44 toward the ceramic circuit board 11, and the ceramic circuit board 11. It has a horizontal holding plate 41. In this case, the terminal fixing jig 40 has a cross-sectional cross shape. Further, the terminal fixing jig 40 includes, for example, a horizontal holding plate 43 extending from substantially the center of the plate-shaped portion including the vertical holding plates 42, 44 and the vertical holding plates 42, 44 toward the ceramic circuit board 11. Have. In this case, a T-shaped cross section is configured. Further, the terminal fixing jig 40 has, for example, a vertical holding plate 42 and a horizontal holding plate 43 connected to the end of the vertical holding plate 42 and extending from the vertical holding plate 42 toward the ceramic circuit board 11. However, an L-shaped cross section may be configured. Further, for example, columnar protrusions 42a1 and 44a1 are formed at substantially the center of the front surface of the vertical holding plates 42 and 44. The convex portions 42a2, 42a3, 44a2, 44a3 are formed in contact with the horizontal holding plate 41 on the front surface of the vertical holding plates 42, 44. Further, for example, columnar protrusions 42b1 and 44b1 are also formed in the substantially central portion of the back surface of the vertical holding plates 42 and 44. The convex portions 42b2, 42b3, 44b2, 44b3 are formed in contact with the horizontal holding plate 43 on the back surface of the vertical holding plates 42, 44.

Next, the holding jig 50 will be described with reference to FIG. FIG. 5 is a diagram for explaining a holding jig constituting an assembly jig used in manufacturing the semiconductor device according to the first embodiment. 5A shows a plan view of the holding jig 50, and FIG. 5B shows a perspective view of the back surface 51a7 and 51b7 of the holding jig 50, respectively.

The holding jig 50 has a supported plate 51a, a vertical holding portion 52a integrally formed on the back surface 51a7 of the supported plate 51a, and a horizontal holding portion 53a having a surface perpendicular to the vertical holding portion 52a. There is. Further, the holding jig 50 has a supported plate 51b, a vertical holding portion 52b integrally formed on the back surface 51b7 of the supported plate 51b, and a horizontal holding portion 53b having a surface perpendicular to the vertical holding portion 52b. is doing.

The back surfaces 51a7, 51b7 of the supported plates 51a, 51b are parallel to the front surface of the ceramic circuit board 11. Further, the supported plates 51a and 51b are formed with slit portions 51a1, 51b1 and engaging portions 51a2, 51a3, 51b2, 51b3 on opposite sides.

The vertical holding portions 52a and 52b and the horizontal holding portions 53a and 53b are formed so as to face the back surfaces 51a7 and 51b7 of the supported plates 51a and 51b in parallel, respectively. The horizontal holding portions 53a and 53b have, for example, a main surface perpendicular to the back surfaces 51a7 and 51b7 of the supported plates 51a and 51b, and the vertical holding portions 52a and 52b have, for example, the back surfaces of the supported plates 51a and 51b. It has a main surface parallel to 51a7 and 51b7. The vertical holding portions 52a and 52b and the horizontal holding portions 53a and 53b have an L-shaped cross section. The main surface of the supported plates 51a and 51b parallel to the back surfaces 51a7 and 51b7 is parallel to the front surface of the ceramic circuit board 11. The vertical holding portions 52a, 52b and the horizontal holding portions 53a, 53b have a U-shaped surface having three straight sides in a cross section between the vertical holding portions 52a, 52b and the back surfaces 51a7, 51b7 of the supported plates 51a, 51b. 52b1 is configured respectively.

Here, the relationship between the holding jig 50 and the terminal fixing jig 40 will be described with reference to FIGS. 6 and 7. 6 and 7 are diagrams for explaining attachment of the holding jig and the terminal fixing jig constituting the assembly jig used in the method for manufacturing the semiconductor device of the first embodiment to the connection terminals. .. 6 (A) is a plan view after mounting, and FIG. 6 (B) is a cross-sectional view of the alternate long and short dash line XX in FIG. 6 (A). FIG. 7 shows a perspective view of the back surface side with respect to FIG.

A wiring plate 15a and a vertical holding plate 42 are arranged together on the U-shaped cross section 52a1 of the holding jig 50. Similarly, the wiring plate 16a and the vertical holding plate 44 are arranged together on the U-shaped cross section 52b1 of the holding jig 50 (FIG. 6B). In this way, the wiring plates 15a and 16a of the connection terminal 15 are perpendicular to the horizontal plane (the surface parallel to the front surface of the ceramic circuit board 11) of the vertical holding portions 52a and 52b of the holding jig 50 and the terminal fixing jig 40. It is sandwiched by the holding plate 42 in the vertical direction (direction perpendicular to the front surface of the ceramic circuit board 11). By doing so, the wiring plate 15a (and thus the joint portion 15c) of the connection terminal 15 can be held parallel to the front surface of the ceramic circuit board 11. Here, the wiring plates 15a, 16a and the vertical holding plates 42, 44 may be fitted together with the U-shaped cross sections 52a1, 52b1. Further, there may be a gap between the vertical holding plates 42, 44 and the supported plates 51a, 51b. This is because even if there is a gap, it can be pressed down by the load of the terminal fixing jig 40. Here, an example of installing two connection terminals 15 and 16 is shown. However, not only two but one may be used. In that case, the same effect can be obtained.

Further, the wiring plate 15a is pushed into the back side of the U-shaped cross section 52a1 by pressing the connecting portion 15e of the wiring board 15a on the U-shaped cross section 52a1 of the holding jig 50, and the U-shaped cross section is U-shaped. The end surface of the wiring board 15a is abutted against the vertical surface of the portion 52a1 (the surface perpendicular to the front surface of the ceramic circuit board 11). Similarly, the wiring plate 16a is pushed into the back side of the cross-section U-shaped portion 52b1 by pressing the connecting portion 16e of the wiring plate 16a on the cross-section U-shaped portion 52b1 of the holding jig 50. The end surface of the wiring board 16a is abutted against the vertical surface of the U-shaped portion 52b1 (the surface perpendicular to the front surface of the ceramic circuit board 11). In this way, the wiring plates 15a, 16a of the connection terminals 15 and 16 and the connecting portions 15e and 16e are formed on the vertical surfaces of the horizontal holding portions 53a and 53b of the holding jig 50 (the surfaces perpendicular to the front surface of the ceramic circuit board 11). And the horizontal holding plate 43 of the terminal fixing jig 40 are sandwiched in the horizontal direction (a surface parallel to the front surface of the ceramic circuit board 11). By doing so, the wiring plate 15a (and thus the joint portion 15c) of the connection terminal 15 can be accurately aligned with a predetermined horizontal position on the front surface of the ceramic circuit board 11. Here, an example of installing two connection terminals 15 and 16 is shown. However, not only two but one may be used. In that case, the same effect can be obtained.

Next, the guide jig 30 will be described with reference to FIG. FIG. 8 is a diagram for explaining a guide jig constituting an assembly jig used in manufacturing the semiconductor device according to the first embodiment. 8 (A) shows the front surface of the guide jig 30, and FIG. 8 (B) shows a perspective view of the back surface of the guide jig 30.

The guide jig 30 includes a flat plate-shaped support member 31 and terminal guide portions 33a, 33b, 33c, 33d. In such a guide jig 30, the terminal guide portions 33a, 33b, 33c, 33d are inserted into the opening 22 of the element fixing jig 20, which will be described later, and the back surface of the support member 31 is the outer peripheral edge of the opening 22 of the support member 21. It is supported by the portion and is arranged on the element fixing jig 20. The support member 31 is formed with an opening 32 opened on the front surface thereof. In the opening 32, when the guide jig 30 is arranged on the element fixing jig 20, the joint portions 16b, 16c, 15b, 15c of the connection terminals 16 and 15 are arranged on the electrodes of the semiconductor elements 12a to 12d. The arrangement areas 32a to 32d and the arrangement areas 32e and 32f in which the connection portions 16d and 15d of the connection terminals 16 and 15 are arranged (on the terminal blocks 14b and 14a) are included.

The terminal guide portion 33a surrounds at least a part of the peripheral portion of the joint region to which the joint portion 16c of the connection terminal 16 is joined. For example, the terminal guide portion 33a is arranged on the outer periphery (side portion of the arrangement region 32a) of the main electrode of the semiconductor element 12b when the guide jig 30 is arranged on the element fixing jig 20. It is formed in the opening 32 of the support member 31 via the hanging portions 33a1 and 33a2. Similarly, the terminal guide portions 33b, 33c, 33d are the openings of the support member 31 so as to be arranged on the outer periphery of the main electrodes of the semiconductor elements 12a, 12d, 12c (the side portions of the arrangement regions 32b, 32c, 32d). It is formed in the portion 32 via the hanging portions 33b1, 33b2, 33c1, 33c2, 33d1, 33d2. The heights of the hanging portions 33a1, 33a2, 33b1, 33b2, 33c1, 33c2, 33d1, 33d2 are the same and are set according to the heights of the connection terminals 15 and 16. Further, the openings 34a, 34b, 34c, 34d are configured by the terminal guide portions 33a, 33b, 33c, 33d and the hanging portions 33a1, 33a2, 33b1, 33b2, 33c1, 33c2, 33d1, 33d2.

Next, the element fixing jig 20 will be described with reference to FIG. FIG. 9 is a diagram for explaining an element fixing jig constituting an assembly jig used in manufacturing the semiconductor device according to the first embodiment. Note that FIG. 9A shows the front surface of the element fixing jig 20, and FIG. 9B shows the back surface of the element fixing jig 20.

The element fixing jig 20 is arranged on the ceramic circuit board 11. Such an element fixing jig 20 includes a flat plate-shaped support member 21. The support member 21 is formed with openings 22 and 23 opened on the front surface thereof. The opening 22 has an arrangement area 22a to 22d in which the semiconductor elements 12a to 12d are arranged and an arrangement area in which the terminal blocks 14b and 14a are arranged when the element fixing jig 20 is arranged on the ceramic circuit board 11. 22e and 22f are included. In the opening 23, the terminal block 14c is arranged when the element fixing jig 20 is arranged on the ceramic circuit board 11.

Next, with reference to FIGS. 6 and 7, and FIGS. 10 to 13, a method for manufacturing the semiconductor device 10 using an assembly jig including such an element fixing jig 20, a guide jig 30, and a holding jig 50 is used. I will explain.

10 to 13 are diagrams for explaining a method for manufacturing a semiconductor device according to the first embodiment. 10 (A), 10 (B), 11 (A), 11 (B), 12 and 13, show the manufacturing method of the semiconductor device 10 using the assembly jig in chronological order. Represents. Further, FIG. 12A shows a plan view of the semiconductor device 10 assembled by the assembly jig, and FIG. 12B shows a cross-sectional view of the alternate long and short dash line XX in FIG. 12A. ..

Before manufacturing the semiconductor device 10, a ceramic circuit board 11, semiconductor elements 12a to 12d, terminal blocks 14a, 14b, 14c, connection terminals 15, 16, solder plates (not shown), an assembly jig, and the like are prepared. I will do it.

First, as shown in FIG. 10A, the ceramic circuit board 11 is set in the arrangement region 81 of the predetermined carbon tray 80. The ceramic circuit board 11 is arranged with the conductive patterns 11b1, 11b2, 11b3 on the upper surface and the metal plate 11c on the lower surface so as to be in contact with the arrangement region 81 of the carbon tray 80. As a result, the ceramic circuit board 11 is fixed to the carbon tray 80, and the position shift of the ceramic circuit board 11 is prevented in the subsequent manufacturing process.

Next, as shown in FIG. 10B, the element fixing jig 20 is set on the ceramic circuit board 11. As a result, with respect to the ceramic circuit board 11, the arrangement regions 22a and 22b of the opening 22 correspond to the conductive pattern 11b1, and the arrangement regions 22c and 22d of the opening 22 correspond to the conduction pattern 11b3. The opening 23 corresponds to the conductive pattern 11b3. Further, the conductive pattern 11b2 corresponds to the arrangement region 22e of the opening 22, and the conductive pattern 11b1 corresponds to the arrangement region 22f of the opening 22.

Next, as shown in FIG. 11A, the semiconductor elements 12b and 12a are set in the arrangement regions 22a and 22b of the opening 22 of the conductive pattern 11b1 via plate solder (not shown). The semiconductor elements 12d and 12c are set in the arrangement regions 22c and 22d of the opening 22 of the conductive pattern 11b2 via plate solder (not shown). Further, the terminal blocks 14a and 14b are set in the arrangement regions 22f and 22e of the opening 22 of the conductive pattern 11b1 via plate solder (not shown). The terminal block 14c is set in the opening 23 of the conductive pattern 11b3 via plate solder (not shown).

Next, as shown in FIG. 11B, the guide jig 30 is set on the element fixing jig 20. At this time, the opening 22 of the element fixing jig 20 is formed in the opening 32 of the support member 31 of the guide jig 30 via the hanging portions 33a1, 33a2, 33b1, 33b2, 33c1, 33c2, 33d1, 33d2. Fit the existing terminal guide portions 33a, 33b, 33c, 33d. As a result, the terminal guide portions 33a, 33b, 33c, 33d come into contact with the arrangement regions 32a, 32b, 32c, 32d corresponding to the electrodes of the semiconductor elements 12b, 12a, 12d, 12c adjacent to each other.

Here, the set of the connection terminals 15 and 16 for the holding jig 50 will be described with reference to FIGS. 6 and 7. First, the wiring plate 15a of the connection terminal 15 is arranged on the U-shaped cross section 52a1 formed by the vertical holding portion 52a and the horizontal holding portion 53a of the holding jig 50. Similarly, the wiring plate 16a of the connection terminal 16 is arranged on the U-shaped cross section 52b1 formed by the vertical holding portion 52b and the horizontal holding portion 53b of the holding jig 50. Next, the connecting portions 15e and 16e are opposed to each other, and the horizontal holding plate 43 of the terminal fixing jig 40 is sandwiched between the connecting portions 15e and 16e and sandwiched by the connecting portions 15e and 16e. At this time, the vertical holding plate 42 of the terminal fixing jig 40 is arranged on the wiring plate 15a of the connection terminal 15 in the U-shaped cross section 52a1, and the vertical holding plate 44 is connected in the U-shaped cross section 52b1. It is arranged on the wiring plate 16a of the terminal 16.

At this time, as shown in FIG. 6A, the protrusion 42a1 of the terminal fixing jig 40 is fitted into the slit portion 51a1 and the engagement portions 51a2, 51a3 of the supported plate 51a, and the convex portions 42a2, 42a3. Are engaged with each other. Similarly, the protrusions 44a1 of the terminal fixing jig 40 are fitted to the slits 51b1 and the engagement portions 51b2, 51b3 of the supported plate 51b, and the protrusions 44a2, 44a3 are engaged with each other. In this way, as shown in FIGS. 6 and 7, the connection terminals 15 and 16 are held by the holding jig 50 by using the terminal fixing jig 40.

Next, the plate solder is set in the arrangement areas 32a, 32b, 32c, 32d, 32e, 32f of the opening 32 of the guide jig 30 shown in FIG. 11B. Then, the connection terminals 15 and 16 to which the holding jig 50 is attached together with the terminal fixing jig 40 are fitted into the opening 32 of the guide jig 30.

Then, as partially shown in FIG. 12, the joint portions 15b and 15c of the connection terminal 15 are arranged on the semiconductor elements 12d and 12c. Further, the connection portion 15d of the connection terminal 15 is arranged in the terminal block 14a. Similarly, the joint portions 16b and 16c of the connection terminal 16 are arranged on the semiconductor elements 12b and 12a. Further, the connection portion 16d of the connection terminal 16 is arranged in the terminal block 14b.

For example, at this time, the joint portions 15c and 16c of the connection terminals 15 and 16 are the terminal guide portions 33d and 33b of the guide jig 30, or the vertical holding portions 52a and 52b and the horizontal holding portions 53a and 53b of the holding jig 50. Is aligned with the above, and is reliably abutted on the main electrodes of the semiconductor elements 12c and 12a together with the plate solders 13c1 and 13a1.

Further, the back surfaces 51a7 and 51b7 of the supported plates 51a and 51b of the holding jig 50 are supported by the opening 32 of the support member 31 of the guide jig 30. Therefore, the height of the joint portions 15c and 16c of the connection terminals 15 and 16 with respect to the semiconductor elements 12c and 12a is maintained.

Although not shown here, the joint portions 15b and 16b of the connection terminals 15 and 16 are similarly appropriately used for the semiconductor elements 12d and 12b by the terminal guide portions 33c and 33a of the guide jig 30. Aligned, the height with respect to the semiconductor elements 12d, 12b is maintained.

Next, as shown in FIG. 13, the weight 70 is arranged at the center on the supported plates 51a and 51b of the holding jig 50 of the assembly jig 60. In this state, it is heated to melt the plate solder and solidify the melted solder. As a result, the joint portions 15b, 15c, 16b, 16c of the connection terminals 15 and 16 are fixed to the semiconductor elements 12d, 12c, 12b, 12a by the solders 13d, 13c, 13b, 13a. Further, the connection portions 15d and 16d of the connection terminals 15 and 16 are fixed to the terminal blocks 14a and 14b.

When the weight 70 is removed and the holding jig 50 (and the terminal fixing jig 40), the guide jig 30, and the element fixing jig 20 are removed, the semiconductor device 10 shown in FIGS. 1 and 2 is manufactured, and the semiconductor device is manufactured. 10 is taken out from the carbon tray 80.

From the above, the semiconductor device 10 shown in FIGS. 1 and 2 can be manufactured. After that, the semiconductor device 10 manufactured in this way is housed in the opening of the case, a heat sink is attached to the back surface of the semiconductor device 10, and the external connection terminal integrally molded in the case and the terminal of the semiconductor device 10 The blocks 14a, 14b, 14c are electrically connected to each other. A semiconductor module is configured by sealing the opening with a sealing resin.

The assembly jig 60 has joint portions 15c, 15b, in which the semiconductor elements 12a to 12d are bonded to the ceramic circuit boards 11 in which the semiconductor elements 12a to 12d are arranged in the conductive patterns 11b1 to 11b3, and the semiconductor elements 12a to 12d or the conductive patterns 11b1 to 11b3. Wiring provided at intervals from the connecting portions 15c, 15b, 16c, 16b connected to the connecting portions 15e, 16e connected to the 16c, 16b and the joining portions 15c, 15b, 16c, 16b and the connecting portions 15e, 16e. The connection terminals 15 and 16 having the plates 15a and 16a are provided. Such an assembly jig 60 is arranged on the back surface of the wiring boards 15a, 16a, and has a holding jig 50 having vertical holding portions 52a, 52b that support the wiring boards 15a, 16a from the back surface, and the wiring boards 15a, 16a. It has a terminal fixing jig 40 which is arranged on a front surface and has vertical holding plates 42 and 44 for holding vertical holding portions 52a and 52b and wiring plates 15a and 16a.

That is, the semiconductor elements of the joints 16c, 16b, 15c, 15b of the connection terminals 16, 15 held by the vertical holding portions 52b, 52a formed on the back surfaces 51b7, 51a7 of the supported plates 51b, 51a of the holding jig 50. The height with respect to 12a to 12d is maintained.

Further, the assembly jig 60 is opposed to the front surface of the ceramic circuit board 11 with the terminal guide portions 33c, 33d, 33a, 33b arranged adjacent to the electrodes of the semiconductor elements 12a to 12d. Further, a guide jig 30 having a support member 31 formed with openings 32 provided at predetermined intervals from the terminal guide portions 33c, 33d, 33a, 33b is further provided. At this time, the holding jig 50 is arranged on the guide jig 30, and the back surfaces of the supported plates 51b and 51a are supported by the support member 31, and the joint portions 16c, 16b, 15c and 15b are supported by the terminal guide portions 33c. 33d, 33a, 33b are aligned with the electrodes, respectively.

That is, in the assembly jig 60, the terminal guide portions 33a, 33b, 33c, 33d of the guide jig 30 allow the joint portions 16c, 16b, 15c, 15b of the connection terminals 16 and 15 to become the main electrodes of the semiconductor elements 12a to 12d. It is aligned and securely placed.

Therefore, the connection terminals 16 and 15 can be appropriately aligned with respect to the semiconductor elements 12a to 12d while maintaining the height and fixed, and the thicknesses of the solders 13a to 13d can be made uniform. It will be possible to keep. Here, an example in which two connection terminals 15 and 16 are installed at the same time is shown. However, not only two but one may be used. In that case, the same effect can be obtained. Further, here, an example is shown in which the connection terminals 16 and 15 are joined to the semiconductor elements 12a to 12d. Not limited to this example, the connection terminals 16 and 15 may be joined to the conductive patterns 11b1 to 11b3. Further, the connection terminals 16 and 15 may be joined to the conductive blocks arranged on the conductive patterns 11b1 to 11b3. In that case, the same effect can be obtained.

[Second Embodiment]
In the second embodiment, another embodiment of the assembly jig used in the manufacture of the semiconductor device 10 of the first embodiment will be described with reference to FIGS. 14 and 15. In the second embodiment, the same components as those provided in the assembly jig 60 of the first embodiment are designated by the same reference numerals, and the description thereof will be omitted. 14 and 15 are diagrams for explaining a method for manufacturing a semiconductor device according to the second embodiment. 14 is a cross-sectional view of the alternate long and short dash line YY in FIG. Further, FIG. 15 corresponds to the plan view in FIG. 12 (A).

In the second embodiment, the insertion hole 21a is aligned with the support member 21 of the element fixing jig 20a and the support member 31 of the guide jig 30a when the guide jig 30a is attached to the element fixing jig 20a. , 31a are formed, respectively.

Further, as shown in FIG. 15, leg portions 51a4, 51a5, 51a6, 51b4, 51b5, 51b6 are formed on the supported plates 51a, 51b of the holding jig 50a. When the holding jig 50a is attached to the guide jig 30a, the legs 51a4, 51a5, 51a6, 51b4, 51b5, 51b6 have insertion holes for the support member 21 of the element fixing jig 20a and the support member 31 of the guide jig 30a. It is inserted into 21a and 31a and comes into contact with the conductive pattern 11b of the ceramic circuit board 11. At this time, the heights of the legs 51a4, 51a5, 51a6, 51b4, 51b5, 51b6 are the heights of the back surfaces 51a7, 51b7 of the supported plates 51a, 51b of the holding jig 50a, and the support member 31 of the guide jig 30a. There should be a space between the front surface and the front surface. Although only the insertion holes 21a and 31a are shown in FIG. 14, the support member 21 of the element fixing jig 20a and the support member 31 of the guide jig 30a correspond to the legs 51a5, 51a6, 51b5, 51b6. An insertion hole is formed in the same manner as the insertion holes 21a and 31a.

Further, the formation positions and numbers of the legs 51a4, 51a5, 51a6 and the legs 51b4, 51b5, 51b6 as shown in FIG. 15 are examples, and are not limited to this case. Further, the legs 51a4, 51a5, 51a6 and the legs 51b4, 51b5, 51b6 have a columnar shape, and the cross section thereof may be circular, square, or elliptical. The insertion holes 21a and 31a of the support member 21 of the element fixing jig 20a and the support member 31 of the guide jig 30a have a shape corresponding to the shapes of the legs 51a4 and 51b4.

By the way, in the first embodiment, for example, the thickness (length A) of the support member 21 of the element fixing jig 20 and the thickness of the support member 31 of the guide jig 30 shown in FIG. 12B. (Length B) and the tolerances for the lengths (length C) of the horizontal holding portions 53a and 53b of the holding jig 50 required ± 50 μm, ± 50 μm, and ± 50 μm, respectively. Therefore, the tolerance of the distance between the ceramic circuit board 11 and the joints 15b, 15c, 16b, 16c of the connection terminals 15 and 16 is the time when the element fixing jig 20, the guide jig 30, and the holding jig 50 are attached in order. The overall tolerance of the assembly jig 60 requires ± 150 μm.

On the other hand, in the second embodiment, the supported plates 51a, 51b of the holding jig 50a are guided by the legs 51a4, 51a5, 51a6, 51b4, 51b5, 51b6 formed on the supported plates 51a, 51b. It floats from the support member 31 of the jig 30a, and the legs 51a4, 51a5, 51a6, 51b4, 51b5, 51b6 come into direct contact with the ceramic circuit board 11. Therefore, the tolerance of the distance between the ceramic circuit board 11 and the joint portions 15b, 15c, 16b, 16c of the connection terminals 15 and 16 is the length (length C) of the horizontal holding portions 53a and 53b of the holding jig 50a and the length (length C). Only the tolerance ± 50 μm due to the length (length C') of the legs 51a4, 51a5, 51a6, 51b4, 51b5, 51b6 needs to be considered, and the tolerance can be reduced.

In order to reduce the tolerance between the element fixing jig 20a and the guide jig 30a in this way, the joint portions 15b, 15c, 16b, 16c of the connection terminals 15 and 16 are replaced with the semiconductor elements 12d, 12c, 12b and 12a. It is possible to accurately control the thickness of the solders 13d, 13c, 13b, 13a to be joined.

Further, since such an element fixing jig 20a and a guide jig 30a do not require high processing accuracy, the manufacturing cost of the element fixing jig 20a and the guide jig 30a can be reduced.

Further, also in the second embodiment, as in the first embodiment, the connection terminals 16 and 15 are appropriately aligned with respect to the semiconductor elements 12a to 12d while maintaining the height and being fixed. Also, it becomes possible to keep the thickness of the solders 13a to 13d uniform.

Further, the assembly jigs 60 and 60a of the first and second embodiments include a holding jig 50 (and a terminal fixing jig 40), a guide jig 30, and an element fixing jig 20 as an example. It is explained by listing in. Not limited to this case, the assembly jigs 60 and 60a may include at least the holding jig 50 (and the terminal fixing jig 40) with respect to the ceramic circuit board 11 to which the semiconductor elements 12a to 12d are fixed. It is also possible to use only the holding jig 50 (and the terminal fixing jig 40) and the guide jig 30. Further, in those cases, the legs of the second embodiment can be applied respectively.

In the first and second embodiments, an example in which two connection terminals 15 and 16 are installed at the same time is shown. However, not only two but one may be used. In that case, the same effect can be obtained. Further, here, an example is shown in which the connection terminals 15 and 16 are joined to the semiconductor elements 12a to 12d. Not limited to this example, the connection terminals 15 and 16 may be joined to the conductive patterns 11b1 to 11b3. Further, the connection terminals 15 and 16 may be joined to the conductive blocks arranged on the conductive patterns 11b1 to 11b3. In that case, the same effect can be obtained.

10 Semiconductor device 11 Ceramic circuit board 11a Insulation plate 11b, 11b1, 11b2, 11b3 Conductive pattern 11c Metal plate 12a, 12b, 12c, 12d Semiconductor element 12a1, 12b1, 12c1, 12d1 Front surface 13a, 13b, 13c, 13d Solder 14a, 14b, 14c Terminal block 15, 16 Connection terminal 15a, 16a Wiring board 15b, 15c, 16b, 16c Joint part 15d, 16d Connection part 15e, 16e Connection part 20 Element fixing jig 21 Support member 22, 23, 32, 34a, 34b, 34c, 34d Openings 22a, 22b, 22c, 22d, 22e, 22f, 32a, 32b, 32c, 32d, 32e, 32f Arrangement area 30 Guide jig 31 Support member 33a, 33b, 33c, 33d Terminal guide Part 33a1, 33a2, 33b1, 33b2, 33c1, 33c2, 33d1, 33d2 Hanging 40 terminal fixing jig 41,43 Horizontal holding plate 42,44 Vertical holding plate 42a1,42b1,44a1,44b1 Projection part 42a2, 42a3, 42b2 42b3, 44a2, 44a3, 44b2, 44b3 Convex part 50 Holding jig 51a, 51b Supported plate 51a1, 51b1 Slit part 51a2, 51a3, 51b2, 51b3 Engaging part 51a7, 51b7 Back surface 52a, 52b Vertical holding part 52a1, 52b1 Cross section U-shaped part 53a, 53b Horizontal holding part

Claims (13)

A substrate in which semiconductor elements are arranged in a conductive pattern,
A connection having a joint portion bonded to the semiconductor element or the conductive pattern, a connecting portion connected to the joint portion, and a wiring board connected to the connecting portion and provided at a distance from the joint portion. For semiconductor devices equipped with terminals
A holding jig arranged on the back surface of the wiring board and having a vertical holding portion for supporting the wiring board from the back surface.
A terminal fixing jig that is arranged on the front surface of the wiring board and has a vertical holding portion and a vertical holding plate that holds the wiring board.
Have,
The holding jig further has a horizontal holding portion that is connected to the vertical holding portion and has a surface perpendicular to the vertical holding portion.
The terminal fixing jig is connected to the vertical holding plate and has a surface perpendicular to the vertical holding plate, and further has a horizontal holding plate that holds the horizontal holding portion and the connecting portion.
Assembly jig. The holding jig is provided at a distance from the vertical holding portion, and further has a supported plate having a horizontal surface on the vertical holding portion.
The assembly jig according to claim 1 . A first support member having a first opening into which the connection terminal, the holding jig and a part of the terminal fixing jig are inserted, and arranged on the back surface of the supported plate of the holding jig, and Further provided with a guide jig having a terminal guide portion connected to the first support member and surrounding along at least a part of a peripheral edge portion of a joint region to which the joint portion of the connection terminal is joined.
The assembly jig according to claim 2 . An element fixing jig which is arranged on the substrate and has a second opening formed along a part of the peripheral edge of the arrangement region where the semiconductor element is arranged.
The assembly jig according to claim 3 , further comprising. The element fixing jig is arranged on the back surface of the first support member of the guide jig, has a second support member that supports the guide jig from the back surface, and the terminal guide portion has the second opening. Placed adjacent to the junction region via
The assembly jig according to claim 4 . The holding jig has rod-shaped legs in which the tip end portion of the back surface of the supported plate is in contact with the substrate and a predetermined distance is maintained between the back surface of the supported plate and the front surface of the substrate. Have a part,
The assembly jig according to any one of claims 2 to 5 . For a semiconductor device having the connection terminals arranged in two rows and having the pair of connection terminals having the connection portions facing each other.
The terminal fixing jig has the vertical holding plate and the horizontal holding plate connected to the vicinity of the center of the vertical holding plate and having a surface perpendicular to the vertical holding plate, and the vertical holding plate and the horizontal holding plate. It has a T-shaped cross section with a holding plate.
The holding jigs are arranged in two rows corresponding to the connection terminals, and are connected to the horizontal holding portions facing each other and the horizontal holding portions, and are directed from the horizontal holding portions to the horizontal holding portions in the other row. With the vertical holding portion to be stretched
A plurality of the connection terminals are arranged around the horizontal holding plate, and the horizontal holding portions are held so as to be opposed to each other.
The vertical holding portion and the vertical holding plate hold the wiring board of the connection terminal orthogonally to the holding direction of the vertical holding plate.
The assembly jig according to any one of claims 1 to 5 . A substrate in which a semiconductor element is arranged in a conductive pattern, a joint portion bonded to the semiconductor element or the conductive pattern, a connecting portion connected to the joint portion, and a distance from the joint portion connected to the connecting portion. The preparatory step of preparing a connection terminal having a wiring board provided with an opening, and
The first attachment step of attaching a holding jig having a vertical holding portion for supporting the wiring board from the back surface of the wiring board to the connection terminal.
A terminal fixing jig that is arranged on the front surface of the wiring board and has a vertical holding plate that sandwiches the vertical holding portion and the wiring board is attached to the connection terminal to which the holding jig is attached. 2 Installation process and
A connection terminal arranging step of arranging the holding jig so that the joint portion is arranged on the semiconductor element or the conductive pattern with respect to the substrate.
A method for manufacturing a semiconductor device having. In the first mounting step, the U-shaped cross section formed by the horizontal holding portion further possessed by the holding jig and having a surface connected to the vertical holding portion and having a surface perpendicular to the vertical holding portion and the vertical holding portion. Place the wiring board in
In the second mounting step, the horizontal holding plate further possessed by the terminal fixing jig, which is connected to the vertical holding plate and has a surface perpendicular to the vertical holding plate, is arranged on the outer surface of the connecting portion to be horizontal. The holding portion and the horizontal holding plate hold the connecting portion orthogonally to the holding direction of the vertical holding plate.
The method for manufacturing a semiconductor device according to claim 8 . Prior to the connection terminal arrangement step, the peripheral edge of the joint region where the first support member having the first opening formed and the first support member are connected to the substrate and the joint portion of the connection terminal is joined. Install a guide jig with a terminal guide section that surrounds at least part of the section.
The holding jig is provided at a distance from the vertical holding portion, and further has a supported plate having a horizontal surface on the vertical holding portion.
In the connection terminal arrangement step, the holding jig is arranged on the guide jig, and the connection terminal, the holding jig, and a part of the terminal fixing jig are inserted into the first opening. The back surface of the supported plate is supported by the first support member, and the joint portion is aligned with the joint region by the terminal guide portion.
The method for manufacturing a semiconductor device according to claim 8 or 9 . In the preparatory step, an element fixing jig having a second opening formed along a part of a peripheral edge of an arrangement region in which the semiconductor element is arranged is arranged on the substrate, and the second The semiconductor element is arranged in the arrangement region in the opening.
The method for manufacturing a semiconductor device according to claim 10 . Prior to the connection terminal arrangement step, the guide jig is arranged on the element fixing jig, and the terminal guide portion is arranged in the joint region via the second opening.
The method for manufacturing a semiconductor device according to claim 11 . The holding jig has a rod-shaped leg on the back surface of the supported plate, and has a rod-shaped leg.
In the connection terminal arrangement step, the holding jig is arranged with respect to the substrate, the tip of the leg is in contact with the front surface of the substrate, and the back surface of the supported plate and the substrate are brought into contact with each other. Maintain a predetermined distance from the front surface,
The method for manufacturing a semiconductor device according to any one of claims 10 to 12 .

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