JP7076937B2 - 半導体素子 - Google Patents
半導体素子 Download PDFInfo
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- JP7076937B2 JP7076937B2 JP2016096255A JP2016096255A JP7076937B2 JP 7076937 B2 JP7076937 B2 JP 7076937B2 JP 2016096255 A JP2016096255 A JP 2016096255A JP 2016096255 A JP2016096255 A JP 2016096255A JP 7076937 B2 JP7076937 B2 JP 7076937B2
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- 239000004065 semiconductor Substances 0.000 title claims description 187
- 239000004020 conductor Substances 0.000 claims description 81
- 230000005684 electric field Effects 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 230000005641 tunneling Effects 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 154
- 239000000758 substrate Substances 0.000 description 29
- 230000005855 radiation Effects 0.000 description 21
- 230000010355 oscillation Effects 0.000 description 20
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 18
- 230000003071 parasitic effect Effects 0.000 description 13
- 230000004888 barrier function Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 6
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 6
- 239000012212 insulator Substances 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 4
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 229910000673 Indium arsenide Inorganic materials 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
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- 239000012535 impurity Substances 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910017115 AlSb Inorganic materials 0.000 description 1
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- RCRBCNZJGBTYDI-UHFFFAOYSA-L dilithium;terephthalate Chemical compound [Li+].[Li+].[O-]C(=O)C1=CC=C(C([O-])=O)C=C1 RCRBCNZJGBTYDI-UHFFFAOYSA-L 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
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- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
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- 229920005989 resin Polymers 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
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- 239000010409 thin film Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
- 230000010356 wave oscillation Effects 0.000 description 1
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- H03B7/06—Generation of oscillations using active element having a negative resistance between two of its electrodes with frequency-determining element comprising lumped inductance and capacitance active element being semiconductor device
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- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1028—Coupling to elements in the cavity, e.g. coupling to waveguides adjacent the active region, e.g. forward coupled [DFC] structures
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- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/3401—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers having no PN junction, e.g. unipolar lasers, intersubband lasers, quantum cascade lasers
- H01S5/3402—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers having no PN junction, e.g. unipolar lasers, intersubband lasers, quantum cascade lasers intersubband lasers, e.g. transitions within the conduction or valence bands
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- H03B7/12—Generation of oscillations using active element having a negative resistance between two of its electrodes with frequency-determining element comprising distributed inductance and capacitance
- H03B7/14—Generation of oscillations using active element having a negative resistance between two of its electrodes with frequency-determining element comprising distributed inductance and capacitance active element being semiconductor device
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Description
前記領域は、以下の式を満たすことを特徴とする。
tanθ=2h/(d2-d1 )
45°<θ<135°
d 1 :前記領域の前記第2の電極側の面の幅
d 2 :前記領域の前記第3の電極側の面の幅
h:前記領域の厚さ
本実施形態に係る半導体素子100(以下、「素子100」と呼ぶ)について、図1を用いて説明する。素子100は、周波数(共振周波数)fTHzのテラヘルツ波を発振又は検出する素子である。図1(a)は素子100の外観を示す斜視図であり、図1(b)はそのA-A断面図、図1(c)は半導体層と領域とを説明する図である。なお、以降の説明では、素子100を発振器として用いた例について説明する。
Re[YRTD]+Re[YANT]≦0 (1)
Im[YRTD]+Im[YANT]=0 (2)
本実施形態では、第1の実施形態の素子100の変形例として、複数の半導体素子について図3及び図4を参照して説明する。なお、本実施形態のそれぞれの半導体素子は、テラヘルツ波を発生する発振器又はテラヘルツ波を検出する検出器として用いることができる。
本実施例に係るテラヘルツ波を発振する素子100の構成について、図1を用いて説明する。素子100は、発振周波数fTHz=0.45THzを発振させる素子である。本実施例で用いたRTD101は、例えば、InP基板108上のInGaAs/InAlAs、InGaAs/AlAsによる多重量子井戸構造とn-InGaAsによる電気的接点層を伴って構成される。
本実施例では、半導体素子800(以下、「素子800」と呼ぶ)について、図5、図6を参照して説明する。素子800は、テラヘルツ波を発振する発振器である。図5は、素子800の構成を説明する図である。図6(a)は図5におけるVIA-VIA断面図、図6(b)は図5におけるVIB-VIB断面図、図6(c)は図5のVIC-VIC断面図について説明する図である。
素子800は、発振周波数fTHz=0.45THzを発振させる素子である。共振器814は、パッチ導体である第3の電極803(以下、「パッチ導体803」と呼ぶ)、接地導体である第1の電極804a(以下、「接地導体804a」と呼ぶ)及び誘電体層805と、RTD801を含む半導体層802とを有する。共振器814は、一辺が200μmの正方形のパッチ導体803と接地導体804aとの間に、約10μm厚のBCBからなる誘電体層805が挟まれたパッチアンテナの構造を有する。以降の説明では、共振器814を、パッチアンテナ814と呼ぶ。
・GaAs基板上に形成したGaAs/AlGaAs/及びGaAs/AlAs、InGaAs/GaAs/AlAs
・InP基板上に形成したInGaAs/AlGaAsSb
・InAs基板上に形成したInAs/AlAsSb及びInAs/AlSb
・Si基板上に形成したSiGe/SiGe
103 第3の電極
104 第1の電極
105 誘電体層
106 領域
107 第2の電極
130 導体
Claims (20)
- テラヘルツ波を発生又は検出する半導体素子であって、
共鳴トンネルダイオードを有する半導体層と、
前記半導体層と接続されている第1の電極と、
前記半導体層に対して前記第1の電極が配置されている側の反対側に配置されており、前記半導体層と電気的に接続されている第2の電極と、
前記第2の電極と電気的に接続されている第3の電極と、
前記半導体層及び前記第2の電極の周囲で且つ前記第1の電極と前記第3の電極との間に配置されており、前記半導体層の厚さより厚い誘電体層と、を備え、
前記誘電体層は、前記第2の電極と前記第3の電極とを電気的に接続する導体を含む領域を有し、
前記領域は、前記導体が充填されている領域であり、
前記テラヘルツ波の共振方向である第1の方向において、前記領域の幅は前記第3の電極の幅よりも小さく、
前記第1の方向と直交する第2の方向において、前記領域の幅は前記第3の電極の幅よりも小さく、
前記第1の方向および前記第2の方向において、前記領域の幅は前記第2の電極の幅よりも大きい
ことを特徴とする半導体素子。 - テラヘルツ波を発生又は検出する半導体素子であって、
共鳴トンネルダイオードを有する半導体層と、
前記半導体層と接続されている第1の電極と、
前記半導体層に対して前記第1の電極が配置されている側の反対側に配置されており、前記半導体層と電気的に接続されている第2の電極と、
前記第2の電極と電気的に接続されている第3の電極と、
前記半導体層及び前記第2の電極の周囲で且つ前記第1の電極と前記第3の電極との間に配置されており、前記半導体層の厚さより厚い誘電体層と、を備え、
前記誘電体層は、前記第2の電極と前記第3の電極とを電気的に接続する導体を含む領域を有し、
前記テラヘルツ波の共振方向である第1の方向において、前記領域の幅は前記第3の電極の幅よりも小さく、
前記第1の方向と直交する第2の方向において、前記領域の幅は前記第3の電極の幅よりも小さく、
前記第1の方向および前記第2の方向において、前記領域の幅は前記第2の電極の幅よりも大きく、
前記領域は、以下の式を満たす
ことを特徴とする半導体素子。
tanθ=2h/(d2-d1 )
45°<θ<135°
d1:前記領域の前記第2の電極側の面の幅
d2:前記領域の前記第3の電極側の面の幅
h:前記領域の厚さ - 前記半導体層と、前記第1の電極と、前記第3の電極と、前記第2の電極と、前記誘電体層と、は、共振器を形成しており、
前記領域の最も長い幅は、前記共振器で共振するテラヘルツ波の前記誘電体層における実効波長λの1/10以下である
ことを特徴とする請求項1又は2に記載の半導体素子。 - 前記導体は、抵抗率が1×10-6Ω・m以下の材料を含む
ことを特徴とする請求項1乃至3のいずれか一項に記載の半導体素子。 - 前記導体は、抵抗率が1×10-6Ω・m以下の金属を含む
ことを特徴とする請求項1乃至4のいずれか一項に記載の半導体素子。 - 前記領域の前記第3の電極側の面の幅d2が、前記領域の前記第2の電極側の面の幅d1の20倍以下である
ことを特徴とする請求項1乃至5のいずれか一項に記載の半導体素子。 - 前記領域の前記第3の電極側の面の幅d2が、前記領域の前記第2の電極側の面の幅d1の10倍以下である
ことを特徴とする請求項1乃至5のいずれか一項に記載の半導体素子。 - 前記領域の前記第3の電極側の面の幅d2は、前記領域の前記第2の電極側の面の幅d1以上である
ことを特徴とする請求項6又は7に記載の半導体素子。 - 前記領域の厚さは、前記第3の電極の厚さより厚く、且つ共振するテラヘルツ波の前記誘電体層における実効波長λの1/10以下である
ことを特徴とする請求項1乃至8のいずれか一項に記載の半導体素子。 - 前記領域の厚さは、前記半導体層の厚さより厚い
ことを特徴とする請求項9のいずれか一項に記載の半導体素子。 - 前記誘電体層の厚さhは、前記半導体層の厚さより厚く、共振するテラヘルツ波の前記誘電体層における実効波長λの1/10以下である
ことを特徴とする請求項1乃至10のいずれか一項に記載の半導体素子。 - 前記半導体層と前記第2の電極とは、オーム性接続されている
ことを特徴とする請求項1乃至11のいずれか一項に記載の半導体素子。 - 前記半導体層に対して前記第1の電極が配置されている側に配置されており、前記半導体層と電気的に接続されている第4の電極を有し、
前記誘電体層は、前記第1の電極と前記第4の電極と電気的に接続する前記導体と異なる導体を含む第2の領域を有する
ことを特徴とする請求項1乃至12のいずれか一項に記載の半導体素子。 - 前記第2の領域は、以下の式を満たす
ことを特徴とする請求項13に記載の半導体素子。
tanθ=2h/(d4-d3 )
45°<θ<135°
d3:前記第2の領域の前記第4の電極側の面の幅
d4:前記第2の領域の前記第1の電極側の面の幅
h:前記第2の領域の厚さ - 前記半導体層と前記第4の電極とは、オーム性接続されている
ことを特徴とする請求項13又は14に記載の半導体素子。 - 前記半導体層は、共鳴トンネルダイオードを含む
ことを特徴とする請求項1乃至15のいずれか一項に記載の半導体素子。 - 前記半導体層と、前記第1の電極と、前記第3の電極と、前記第2の電極と、前記誘電体層と、は、共振器を形成しており、
前記共振器は、パッチアンテナを含む
ことを特徴とする請求項1乃至16のいずれか一項に記載の半導体素子。 - 前記半導体層にバイアス電圧を供給する電源と、
前記共振器と前記電源とを接続するバイアス回路と、を有し、
前記バイアス回路は、ストリップ線路と、前記ストリップ線路と前記共振器とを接続するためのプラグと、前記ストリップ線路と接続しており前記半導体層と並列に接続しているデカップリング容量及びシャント抵抗と、前記電源と接続しているコプレーナ線路と、前記ストリップ線路のインピーダンスと前記コプレーナ線路のインピーダンスとを変換する変換器と、を備える
ことを特徴とする請求項17に記載の半導体素子。 - 前記プラグは、前記共振器に定在するテラヘルツ波の電界の節に配置されている
ことを特徴とする請求項18に記載の半導体素子。 - 前記電界の節は、前記共振器に定在するテラヘルツ波の周波数における電界強度が、前記共振器に定在するテラヘルツ波の最大電界強度の1/e2(eは自然対数の底)以下となる位置である
ことを特徴とする請求項19に記載の半導体素子。
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