JP7071714B2 - Electron beam sterilization method - Google Patents

Electron beam sterilization method Download PDF

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JP7071714B2
JP7071714B2 JP2019021998A JP2019021998A JP7071714B2 JP 7071714 B2 JP7071714 B2 JP 7071714B2 JP 2019021998 A JP2019021998 A JP 2019021998A JP 2019021998 A JP2019021998 A JP 2019021998A JP 7071714 B2 JP7071714 B2 JP 7071714B2
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秀作 野田
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JFE Engineering Corp
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本発明は、食品、医療用品等に電子線を照射して殺菌・滅菌するための電子線殺菌方法に関する。 The present invention relates to an electron beam sterilization method for sterilizing and sterilizing foods, medical supplies and the like by irradiating them with an electron beam.

ガンマ線、X線、電子線といった放射線を食品や医療用品等に照射することにより、食品や医療用品等を殺菌・滅菌処理することが行われている。
上記の放射線は透過力を有しているために対象となる食品や医療用品等の被照射対象物を包装してから殺菌処理することができる。このため、一般に、放射線の照射を受ける被照射対象物は段ボール箱やコンテナ等の容器に収容された出荷状態で放射線殺菌される。
By irradiating foods and medical supplies with radiation such as gamma rays, X-rays, and electron beams, foods and medical supplies are sterilized and sterilized.
Since the above-mentioned radiation has a penetrating power, it can be sterilized after packaging an object to be irradiated such as a target food or medical supplies. Therefore, in general, an object to be irradiated to be irradiated is sterilized by radiation in a shipping state housed in a container such as a cardboard box or a container.

特許文献1には、食品を包装材内に収容して包装材を介して食品に放射線を照射する殺菌方法が記載されており、放射線を照射しても臭気が発生しにくい放射線照射用包装材についての開示がある。 Patent Document 1 describes a sterilization method in which food is housed in a packaging material and the food is irradiated with radiation through the packaging material, and the packaging material for irradiation is less likely to generate odor even when irradiated with radiation. There is a disclosure about.

また、特許文献2には、食品を収容する容器に電子線を照射することにより容器を滅菌する方法であって、照射線量の割合が大きい容器の部分に電子線を部分的に遮蔽する遮蔽手段を設けて前記遮蔽手段の上から前記電子線を照射することにより容器に略均一な線量を照射する方法が開示されている。 Further, Patent Document 2 is a method of sterilizing a container by irradiating a container containing food with an electron beam, which is a shielding means for partially shielding the electron beam from a portion of the container having a large irradiation dose ratio. Disclosed is a method of irradiating a container with a substantially uniform dose by irradiating the electron beam from above the shielding means.

特許文献3には、放射線照射方向の断層像を撮影し被照射物の密度分布を取得する断層撮影手段と、前記密度分布に基づいて前記被照射物中での照射放射線の線量分布の変動を所定の基準幅以下に抑制するように照射条件を定める照射条件決定手段とを有し、放射線照射手段を制御して前記照射条件に応じた放射線照射を実施するようにした放射線照射装置が開示されている。 Patent Document 3 describes a tomography means for photographing a tomographic image in the irradiation direction to acquire the density distribution of the irradiated object, and a variation in the dose distribution of the irradiated radiation in the irradiated object based on the density distribution. Disclosed is an irradiation device having an irradiation condition determining means for determining irradiation conditions so as to suppress the irradiation to a predetermined reference width or less, and controlling the irradiation means to perform irradiation according to the irradiation conditions. ing.

特開2010-159398号公報JP-A-2010-159398 特開平8-151021号公報Japanese Unexamined Patent Publication No. 8-151021 特開2000-167029号公報Japanese Unexamined Patent Publication No. 2000-167029

放射線照射を行う際には、一般に照射線量及び照射時間を調整して要求される吸収線量を被照射物に付与する必要がある。被照射物の物質密度が均一でない場合、被照射物内の吸収線量が不均一となり、均一な殺菌・滅菌の効果が得られない。
この問題は、ガンマ線やX線と比較して、透過率が低い電子線照射の場合に顕著となる。照射のばらつきが大きくなると、被照射物について指定されている最大線量を超過したり、最小線量を下回ったりする。最大線量を超えて付与すると放射線による劣化が生じ、最小線量を下回ると期待した殺菌・滅菌の効果が得られない。
また、電子線は物質透過性を有しているがその透過力が弱く、透過距離は短い。このため厚みのある被照射物に一方向から電子線を照射すると、被照射物内の吸収線量が不均一になる。
上記特許文献3に記載の方法は、装置が大がかりとなり簡便な方法ではない。
When irradiating, it is generally necessary to adjust the irradiation dose and irradiation time to apply the required absorbed dose to the irradiated object. If the substance density of the irradiated object is not uniform, the absorbed dose in the irradiated object becomes non-uniform, and a uniform sterilization / sterilization effect cannot be obtained.
This problem becomes remarkable in the case of electron beam irradiation having a lower transmittance than gamma rays and X-rays. When the irradiation variation becomes large, the maximum dose specified for the irradiated object may be exceeded or the minimum dose may be exceeded. If the dose exceeds the maximum dose, deterioration due to radiation will occur, and the expected sterilization / sterilization effect below the minimum dose cannot be obtained.
Further, although the electron beam has substance permeability, its penetrating power is weak and the penetrating distance is short. Therefore, when a thick object to be irradiated is irradiated with an electron beam from one direction, the absorbed dose in the object to be irradiated becomes non-uniform.
The method described in Patent Document 3 is not a simple method because the apparatus becomes large-scale.

従来は、厚みのある被照射物については上下面など向かい合う二面に対して電子線を照射することにより、被照射物内の吸収線量を均一化している。
しかしながら、図10に示すように容器2内において被照射物のかさ密度が高い領域Bがある場合、このかさ密度が高い領域Bに十分な吸収線量を付与しようとすると、かさ密度が低い領域Aには許容される最大線量を超過して電子線が付与され、好ましくない。
また、容器2内に電子線の照射を避けたい領域Cがある場合、上下面など向かい合う二面に対して電子線を照射する方法では、この領域Cへの電子線の照射を減じることは難しい。
Conventionally, for a thick irradiated object, the absorbed dose in the irradiated object is made uniform by irradiating the two facing surfaces such as the upper and lower surfaces with an electron beam.
However, as shown in FIG. 10, when there is a region B having a high bulk density of the irradiated object in the container 2, when a sufficient absorbed dose is applied to the region B having a high bulk density, the region A having a low bulk density A. Is given an electron beam in excess of the maximum allowable dose, which is not preferable.
Further, when there is a region C in the container 2 in which the irradiation of the electron beam is desired to be avoided, it is difficult to reduce the irradiation of the electron beam to the region C by the method of irradiating the two facing surfaces such as the upper and lower surfaces with the electron beam. ..

本発明は、被照射物内の吸収線量を均一化する電子線殺菌方法を提供することを目的とする。 An object of the present invention is to provide an electron beam sterilization method for equalizing the absorbed dose in an irradiated object.

上記課題を解決するための本発明は、以下に記載する通りの電子線殺菌方法である。
電子線を被照射物に照射して殺菌又は滅菌を行う電子線殺菌方法であって、
電子線を被照射物に対して少なくとも二方向から照射するようにし、
電子線を遮蔽する遮蔽材を配置した領域SAと、前記遮蔽材を配置しない領域SBとを有する照射線量調整板を電子線照射装置の電子線取出窓と前記被照射物との間に配置し、
前記照射線量調整板を介して電子線を被照射物に照射することを特徴とする、電子線殺菌方法。
The present invention for solving the above problems is an electron beam sterilization method as described below.
It is an electron beam sterilization method that sterilizes or sterilizes an object to be irradiated with an electron beam.
The electron beam should be applied to the object to be irradiated from at least two directions.
An irradiation dose adjusting plate having an area SA in which a shielding material for shielding an electron beam is arranged and an area SB in which the shielding material is not arranged is arranged between the electron beam extraction window of the electron beam irradiator and the irradiated object. ,
An electron beam sterilization method comprising irradiating an object to be irradiated with an electron beam through the irradiation dose adjusting plate.

本発明の電子線殺菌方法を採用することにより、被照射物内の吸収線量を均一化することができる。 By adopting the electron beam sterilization method of the present invention, the absorbed dose in the irradiated object can be made uniform.

本発明の電子線殺菌方法における被照射物の一例を示す図である。It is a figure which shows an example of the irradiated object in the electron beam sterilization method of this invention. 図1に示した被照射物を電子線で殺菌する方法の一例を示す図である。It is a figure which shows an example of the method of sterilizing the irradiated object shown in FIG. 1 with an electron beam. 本発明における照射線量調整板の1つの実施形態を示す図である。It is a figure which shows one Embodiment of the irradiation dose adjustment plate in this invention. 本発明における照射線量調整板の他の実施形態を示す図である。It is a figure which shows the other embodiment of the irradiation dose adjustment plate in this invention. 本発明における照射線量調整板の他の実施形態を示す図である。It is a figure which shows the other embodiment of the irradiation dose adjustment plate in this invention. 本発明における照射線量調整板の他の実施形態を示す図である。It is a figure which shows the other embodiment of the irradiation dose adjustment plate in this invention. 本発明の殺菌方法の1つの実施形態を示す図である。図7Aは電子線照射装置の正面図であり、図7Bは電子線照射装置の側面図である。It is a figure which shows one embodiment of the sterilization method of this invention. FIG. 7A is a front view of the electron beam irradiating device, and FIG. 7B is a side view of the electron beam irradiating device. 本発明の殺菌方法の他の実施形態を示す図である。It is a figure which shows the other embodiment of the sterilization method of this invention. 図8に示した実施形態における照射線量調整板支持搬送手段の動作の一例を示す図である。It is a figure which shows an example of the operation of the irradiation dose adjustment plate support transport means in the embodiment shown in FIG. 従来の電子線照射方法を示す図である。It is a figure which shows the conventional electron beam irradiation method.

本発明は下記(1)の電子線殺菌方法に関するものであるが、他の実施形態として下記(2)~(7)の実施形態を含むのでこれらについても以下説明する。
(1)電子線を被照射物に照射して殺菌又は滅菌を行う電子線殺菌方法であって、
電子線を被照射物に対して少なくとも二方向から照射するようにし、
電子線を遮蔽する遮蔽材を配置した領域SAと、前記遮蔽材を配置しない領域SBとを有する照射線量調整板を電子線照射装置の電子線取出窓と前記被照射物との間に配置し、
前記照射線量調整板を介して電子線を被照射物に照射する、電子線殺菌方法。
(2)前記被照射物に対して、二方向から電子線を照射するようにした、上記(1)に記載の電子線殺菌方法。
(3)前記照射線量調整板が、金属板から前記領域SBに対応する領域の金属材料を除去して、残部の金属材料によって前記領域SAを形成した照射線量調整板である、上記(1)または(2)に記載の電子線殺菌方法。
(4)前記照射線量調整板が、前記遮蔽材として複数の金属板を使用し、前記複数の金属板を配置した領域を前記領域SAとし、前記金属板を配置しない領域を前記領域SBとした照射線量調整板である、上記(1)または(2)に記載の電子線殺菌方法。
(5)前記照射線量調整板が、前記遮蔽材として複数個の金属タイルを使用し、前記複数の金属タイルを配置した領域を前記領域SAとし、前記金属タイルを配置しない領域を前記領域SBとした照射線量調整板である、上記(1)または(2)に記載の電子線殺菌方法。
(6)前記照射線量調整板が、前記遮蔽材としての複数の金属球と、前記金属球を通過させない網目を有する篩とからなり、前記複数の金属球を前記篩の網目に配置した領域を前記領域SAとし、前記金属球を配置しない領域を前記領域SBとした照射線量調整板である上記(1)又は(2)に記載の電子線殺菌方法。
(7)前記照射線量調整板が前記被照射物又は前記被照射物を収容した容器の電子線が照射される面上に載置される、上記(1)~(6)のいずれか1項に記載の電子線殺菌方法。
(8)前記電子線照射装置の電子線取出窓と前記被照射物との間で前記照射線量調整板を支持し、前記被照射物の搬送速度と同じ速度で前記照射線量調整板を搬送する照射線量調整板支持搬送手段を用いる、上記(1)~(6)のいずれか1項に記載の電子線殺菌方法。
(9)電子線を前記被照射物に照射する前に、前記被照射物にX線照射することによってイメージングし、得られた情報に基づいて前記照射線量調整板における前記遮蔽材の配置を決定する、上記(1)~(8)のいずれか1項に記載の電子線殺菌方法。
The present invention relates to the following electron beam sterilization method (1), but other embodiments include the following embodiments (2) to (7), which will also be described below.
(1) An electron beam sterilization method in which an object to be irradiated is irradiated with an electron beam to sterilize or sterilize the object.
The electron beam should be applied to the object to be irradiated from at least two directions.
An irradiation dose adjusting plate having an area SA in which a shielding material for shielding an electron beam is arranged and an area SB in which the shielding material is not arranged is arranged between the electron beam extraction window of the electron beam irradiator and the irradiated object. ,
An electron beam sterilization method in which an electron beam is irradiated to an irradiated object through the irradiation dose adjusting plate.
(2) The electron beam sterilization method according to (1) above, wherein the irradiated object is irradiated with an electron beam from two directions.
(3) The irradiation dose adjusting plate is an irradiation dose adjusting plate in which the metal material in the region corresponding to the region SB is removed from the metal plate and the region SA is formed by the remaining metal material. Alternatively, the electron beam sterilization method according to (2).
(4) The irradiation dose adjusting plate uses a plurality of metal plates as the shielding material, the region in which the plurality of metal plates are arranged is designated as the region SA, and the region in which the metal plates are not arranged is designated as the region SB. The electron beam sterilization method according to (1) or (2) above, which is an irradiation dose adjusting plate.
(5) The irradiation dose adjusting plate uses a plurality of metal tiles as the shielding material, the region in which the plurality of metal tiles are arranged is referred to as the region SA, and the region in which the metal tiles are not arranged is referred to as the region SB. The electron beam sterilization method according to (1) or (2) above, which is an irradiation dose adjusting plate.
(6) The irradiation dose adjusting plate comprises a plurality of metal spheres as the shielding material and a sieve having a mesh that does not allow the metal spheres to pass through, and a region in which the plurality of metal spheres are arranged in the mesh of the sieve is formed. The electron beam sterilization method according to (1) or (2) above, which is an irradiation dose adjusting plate in which the region SA is defined as the region SA and the region in which the metal sphere is not arranged is defined as the region SB.
(7) Any one of (1) to (6) above, wherein the irradiation dose adjusting plate is placed on the surface to be irradiated with the electron beam of the irradiated object or the container containing the irradiated object. The electron beam sterilization method described in.
(8) The irradiation dose adjusting plate is supported between the electron beam extraction window of the electron beam irradiator and the irradiated object, and the irradiation dose adjusting plate is transported at the same speed as the transport speed of the irradiated object. The electron beam sterilization method according to any one of (1) to (6) above, which uses an irradiation dose adjusting plate support transport means.
(9) Before irradiating the irradiated object with an electron beam, imaging is performed by irradiating the irradiated object with X-rays, and the arrangement of the shielding material on the irradiation dose adjusting plate is determined based on the obtained information. The electron beam sterilization method according to any one of (1) to (8) above.

まず、本発明の実施形態で使用することができる電子線照射装置の概要を図7A及び図7Bに基づいて説明する。
図7Aは電子線照射装置30の正面図であり、図7Bは電子線照射装置30の側面図である。
電子線照射装置30は、被照射物1を収容した容器2に電子線Eを照射する装置本体11と、装置本体11の下方に配置された被照射物1を収容した容器2を搬送する搬送装置12とを含む。
装置本体11は、電子を発生する電子銃13と、電子銃13で発生した電子を下方に加速する加速管14と、加速管14からの電子線を水平面内で走査する電磁石15と、電磁石15で走査された電子線Eを下方に出射するスキャンホーン16とを備えている。スキャンホーン16の下部には、電子線Eを下方に取り出すための電子線取出窓17が設けられる。
First, an outline of the electron beam irradiation device that can be used in the embodiment of the present invention will be described with reference to FIGS. 7A and 7B.
FIG. 7A is a front view of the electron beam irradiating device 30, and FIG. 7B is a side view of the electron beam irradiating device 30.
The electron beam irradiating device 30 transports the device main body 11 that irradiates the container 2 containing the irradiated object 1 with the electron beam E, and the container 2 containing the irradiated object 1 arranged below the device main body 11. Includes device 12.
The apparatus main body 11 includes an electron gun 13 that generates electrons, an accelerating tube 14 that accelerates the electrons generated by the electron gun 13 downward, an electromagnet 15 that scans an electron beam from the accelerating tube 14 in a horizontal plane, and an electromagnet 15. It is provided with a scan horn 16 that emits the electron beam E scanned in 1 downward. At the lower part of the scan horn 16, an electron beam extraction window 17 for taking out the electron beam E downward is provided.

上記の電子線照射装置30を使用する場合、被照射物1の吸収線量を調整することが可能なパラメータは3つあり、そのパラメータは、被照射物1を搬送する搬送装置12のコンベアの移動速度、電子線のエネルギー及び電流値である。
しかしながら、これらのパラメータを調整するだけでは、被照射物の物質密度が均一でない場合には被照射物内の吸収線量が不均一となり、均一な殺菌・滅菌の効果が得られない。
When the above-mentioned electron beam irradiation device 30 is used, there are three parameters that can adjust the absorbed dose of the irradiated object 1, and the parameters are the movement of the conveyor of the transport device 12 that conveys the irradiated object 1. Velocity, electron beam energy and current values.
However, if these parameters are only adjusted, the absorbed dose in the irradiated object becomes non-uniform when the substance density of the irradiated object is not uniform, and a uniform sterilization / sterilization effect cannot be obtained.

本実施形態においては、予め被照射物1のイメージングを実施して、被照射物1を構成する材料のかさ密度(充填度)に関する情報を取得する。イメージングは、被照射物1をX線でスキャンし、透過したX線の透過量から、被照射物1内のかさ密度の分布を把握する。そして、かさ密度が小さい領域に対しては電子線を少なく照射して低線量を付与し、かさ密度が大きい領域に対してはより多くの電子線を照射して、高線量を付与するようにする。
イメージングは、容器2内の被照射物1の形状、配置に応じて二次元イメージングを行っても良いし、三次元イメージングを行ってもよい。
なお、被照射物1の材料、容器2内での被照射物1の配置が分かっている場合にはイメージングを行う必要はない。
また、以下では、容器2内における、被照射物1のかさ密度が大きく高線量を付与する必要がある領域を重点照射領域Bといい、かさ密度が小さく低線量を付与する必要がある領域を非重点照射領域Aということがある。
In the present embodiment, the image of the irradiated object 1 is performed in advance to acquire information on the bulk density (filling degree) of the material constituting the irradiated object 1. In the imaging, the irradiated object 1 is scanned with X-rays, and the distribution of the bulk density in the irradiated object 1 is grasped from the transmitted amount of the transmitted X-rays. Then, a low dose is given by irradiating a region with a low bulk density with a small amount of electron beam, and a higher dose is given by irradiating a region with a high bulk density with a larger amount of electron beam. do.
As the imaging, two-dimensional imaging may be performed or three-dimensional imaging may be performed depending on the shape and arrangement of the irradiated object 1 in the container 2.
If the material of the irradiated object 1 and the arrangement of the irradiated object 1 in the container 2 are known, it is not necessary to perform imaging.
Further, in the following, the region in the container 2 in which the bulk density of the irradiated object 1 is large and a high dose needs to be applied is referred to as a priority irradiation region B, and the region in the container 2 where the bulk density is small and a low dose needs to be applied is referred to. It may be referred to as a non-focused irradiation area A.

次いで、本実施形態においては非重点照射領域Aに対応する領域に遮蔽材を配置した照射線量調整板20を電子線照射装置30と被照射物1を収容する容器2との間に配置して、この照射線量調整板20を介して被照射物1に電子線照射を行う。
照射線量調整板20は被照射物1の非重点照射領域に対応する照射線量調整板の領域(「領域SA」という)に電子線を遮蔽する遮蔽材を配置する。これにより、照射線量調整板20における、被照射物1の重点照射領域Bに対応する照射線量調整板の領域(「領域SB」という)が形成される。
電子線Eの遮蔽材としては、アルミ板等の金属板やプラスチック板を用いることができる。
遮蔽材の材質や構造を選択・調整することにより電子線の一部を透過させることも、電子線を完全に遮断することも可能である。
Next, in the present embodiment, the irradiation dose adjusting plate 20 in which the shielding material is arranged in the region corresponding to the non-priority irradiation region A is arranged between the electron beam irradiation device 30 and the container 2 accommodating the irradiated object 1. The irradiated object 1 is irradiated with an electron beam through the irradiation dose adjusting plate 20.
The irradiation dose adjusting plate 20 arranges a shielding material that shields the electron beam in the region of the irradiation dose adjusting plate (referred to as “region SA”) corresponding to the non-priority irradiation region of the irradiated object 1. As a result, the region (referred to as “region SB”) of the irradiation dose adjusting plate corresponding to the focused irradiation region B of the irradiated object 1 in the irradiation dose adjusting plate 20 is formed.
As the shielding material for the electron beam E, a metal plate such as an aluminum plate or a plastic plate can be used.
By selecting and adjusting the material and structure of the shielding material, it is possible to allow a part of the electron beam to pass through or to completely block the electron beam.

以下、本発明の電子線殺菌方法の実施形態を図1及び図2に基づいて説明する。
図1において容器2内に収容された被照射物は非重点照射領域Aと重点照射領域Bとを有している。重点照射領域Bは予め行ったイメージング処理により決定される。
図2は、容器2の面Faに対して電子線Eを照射し、また、容器2の面Fbに対して電子線Eを照射する様子を示した図である。
なお、二方向からの電子線Eは容器2に同時に照射する必要は無く、まず、一方向から電子線Eを容器2の面Faに照射した後、容器を90度回転させて容器2の面Fbを電子線によって照射すればよい。
また、重点照射領域Bに高線量が吸収され、非重点照射領域Aに低線量が吸収されるようにするため、本実施形態では、図2に示すように、容器2の面Faに電子線Eが照射される際には、面Faの上に照射線量調整板20を配置し、容器2の面Fbに電子線Eが照射される際には面Fbの上に照射線量調整板20を配置する。
Hereinafter, embodiments of the electron beam sterilization method of the present invention will be described with reference to FIGS. 1 and 2.
In FIG. 1, the irradiated object housed in the container 2 has a non-focused irradiation region A and a focused irradiation region B. The focused irradiation region B is determined by an imaging process performed in advance.
FIG. 2 is a diagram showing a state in which the surface Fa of the container 2 is irradiated with the electron beam E, and the surface Fb of the container 2 is irradiated with the electron beam E.
It is not necessary to irradiate the container 2 with the electron beam E from two directions at the same time. First, the electron beam E is irradiated to the surface Fa of the container 2 from one direction, and then the container is rotated 90 degrees to rotate the surface of the container 2. Fb may be irradiated with an electron beam.
Further, in order to ensure that the high dose is absorbed in the focused irradiation region B and the low dose is absorbed in the non-focused irradiation region A, in the present embodiment, as shown in FIG. 2, an electron beam is formed on the surface Fa of the container 2. When E is irradiated, the irradiation dose adjusting plate 20 is arranged on the surface Fa, and when the surface Fb of the container 2 is irradiated with the electron beam E, the irradiation dose adjusting plate 20 is placed on the surface Fb. Deploy.

次に、上記照射線量調整板20について説明する。
この照射線量調整板20は、非重点照射領域Aの照射線量を低減するための電子線遮蔽材である金属板3を有している。この金属板3は被照射物の非重点照射領域Aに対応する容器2の表面の領域に配置され、これにより、重点照射領域Bに対応する容器の表面には金属板3が配置されない開口部10が形成される。
これにより、電子線遮蔽材によって遮蔽されない電子線Eが開口部10を通って重点照射領域Bに二方向から照射されるため、重点照射領域Bにある被照射物には多くの吸収線量が付与される。一方、非重点照射領域Aには金属板3を透過した低線量の電子線Eが照射される。
また、図2に示した高線量の電子線の照射を避けたい領域Cには、金属板3を透過した電子線と重点照射領域Bを通過した電子線とが二方向から照射されるので、その吸収線量は低くなる。また、図2に示した高線量の電子線の照射を避けたい領域Dには金属板3を透過した電子線を二方向から照射されるので、その吸収線量は更に低くなる。
Next, the irradiation dose adjusting plate 20 will be described.
The irradiation dose adjusting plate 20 has a metal plate 3 which is an electron beam shielding material for reducing the irradiation dose in the non-priority irradiation region A. The metal plate 3 is arranged in the area of the surface of the container 2 corresponding to the non-focused irradiation region A of the irradiated object, whereby the opening in which the metal plate 3 is not arranged on the surface of the container corresponding to the focused irradiation region B. 10 is formed.
As a result, the electron beam E that is not shielded by the electron beam shielding material is irradiated to the focused irradiation region B from two directions through the opening 10, so that a large absorbed dose is given to the irradiated object in the focused irradiation region B. Will be done. On the other hand, the non-focused irradiation region A is irradiated with a low-dose electron beam E transmitted through the metal plate 3.
Further, in the region C where irradiation of the high dose electron beam shown in FIG. 2 is desired to be avoided, the electron beam transmitted through the metal plate 3 and the electron beam passing through the priority irradiation region B are irradiated from two directions. Its absorbed dose is low. Further, since the region D in which the irradiation of the high-dose electron beam shown in FIG. 2 is desired to be avoided is irradiated with the electron beam transmitted through the metal plate 3 from two directions, the absorbed dose is further reduced.

次に、照射線量調整板20の実施形態について説明する。
図3Aは、容器2の中に被照射物1が収容された状態を示す図である。
図3Aにおける符号Aで示す部分が非重点照射領域であり、符号Bで示す部分が重点照射領域である。
図3Bは、照射線量調整板20を示す図である。この照射線量調整板20は、容器2内の非重点照射領域Aに対応する領域SAに複数の金属板3を配置し、容器2内の重点照射領域Bに対応する領域SBに開口が形成されるようにしたものである。
長さや幅の異なる複数の金属板を組み合わせることによって種々の形状の重点照射領域に対応する開口を形成することができる。
Next, an embodiment of the irradiation dose adjusting plate 20 will be described.
FIG. 3A is a diagram showing a state in which the irradiated object 1 is housed in the container 2.
The portion indicated by reference numeral A in FIG. 3A is the non-focused irradiation region, and the portion indicated by reference numeral B is the focused irradiation region.
FIG. 3B is a diagram showing an irradiation dose adjusting plate 20. In the irradiation dose adjusting plate 20, a plurality of metal plates 3 are arranged in the region SA corresponding to the non-focused irradiation region A in the container 2, and an opening is formed in the region SB corresponding to the focused irradiation region B in the container 2. It is made to be.
By combining a plurality of metal plates having different lengths and widths, it is possible to form openings corresponding to the focused irradiation regions having various shapes.

図4Aは、金属板5から容器2内の重点照射領域Bに対応する領域SBの金属材料を除去して開口部10を形成し、残部の金属材料によって前記領域SAを形成した照射線量調整板20を示す。
図4Bは、容器2内の重点照射領域Bが間隔をおいて複数個存在する場合に用いる照射線量調整板20を示し、重点照射領域Bに対応する照射線量調整板20の領域SBに開口部10が形成されている。
開口部10に対応する重点照射領域Bには高線量が付与され、開口部10以外の部分に対応する非重点照射領域Aには低線量が付与される。
金属板5から部分的に金属材料を除去する方法としては、型抜による方法、エッチングによる方法等を採用することができる。
FIG. 4A shows an irradiation dose adjusting plate in which the metal material of the region SB corresponding to the priority irradiation region B in the container 2 is removed from the metal plate 5 to form the opening 10, and the region SA is formed by the remaining metal material. 20 is shown.
FIG. 4B shows an irradiation dose adjusting plate 20 used when a plurality of focused irradiation regions B in the container 2 are present at intervals, and an opening is provided in the region SB of the irradiation dose adjusting plate 20 corresponding to the focused irradiation region B. 10 is formed.
A high dose is applied to the focused irradiation region B corresponding to the opening 10, and a low dose is applied to the non-focused irradiation region A corresponding to the portion other than the opening 10.
As a method for partially removing the metal material from the metal plate 5, a method by die cutting, a method by etching, or the like can be adopted.

図5は、遮蔽材として金属タイル6を用いた例を示す。
複数の金属タイル6を用いて、この金属タイル6を非重点照射領域Aに対応する枠体4内の領域SAに配置することによって、領域SBに対応する位置に開口部10を形成したものである。
同形状又は異なる形状の金属タイル6を組み合わせることによって重点照射領域Bの形状に追従する開口部10を形成することができる。
FIG. 5 shows an example in which a metal tile 6 is used as a shielding material.
By using a plurality of metal tiles 6 and arranging the metal tiles 6 in the region SA in the frame 4 corresponding to the non-focused irradiation region A, the opening 10 is formed at the position corresponding to the region SB. be.
By combining metal tiles 6 having the same shape or different shapes, an opening 10 that follows the shape of the priority irradiation region B can be formed.

図6は、遮蔽材として金属球7を用いた例を示す。
この金属球7は金属球7を通過させない網目を有する篩8によって保持される。
複数の金属球7を篩の網目に配置して領域SAを形成し、金属球7を配置しない領域を領域SBとする。金属球7は形状が小さいものを使用することにより、重点照射領域の形状に追従する開口部10を形成することができる。また、金属球7は容易に取り外しができるため、照射線量調整板20の作製も容易となる。
FIG. 6 shows an example in which a metal ball 7 is used as a shielding material.
The metal balls 7 are held by a sieve 8 having a mesh that does not allow the metal balls 7 to pass through.
A plurality of metal balls 7 are arranged in a mesh of a sieve to form a region SA, and a region in which the metal balls 7 are not arranged is referred to as a region SB. By using a metal ball 7 having a small shape, it is possible to form an opening 10 that follows the shape of the focused irradiation region. Further, since the metal ball 7 can be easily removed, the irradiation dose adjusting plate 20 can be easily manufactured.

図7に、本発明の電子線殺菌方法の一実施形態を示す。
本実施形態では、容器2の電子線が照射される面上に照射線量調整板20が載置される。容器2の電子線が照射される面上に照射線量調整板20を載置することによって照射線量調整板20の領域SAに対応する非重点照射領域Aには低線量が照射され、領域SBに対応する重点照射領域Bには高線量が照射されて、殺菌・滅菌処理が行われる。
また、被照射物1が容器2に収容されていない場合であって。被照射物1の電子線が照射される面上に照射線量調整版20を載置できる場合には、被照射物1の電子線が照射される面上に照射線量調整板20を載置しても良い。
FIG. 7 shows an embodiment of the electron beam sterilization method of the present invention.
In the present embodiment, the irradiation dose adjusting plate 20 is placed on the surface of the container 2 to which the electron beam is irradiated. By placing the irradiation dose adjusting plate 20 on the surface of the container 2 irradiated with the electron beam, a low dose is applied to the non-priority irradiation region A corresponding to the region SA of the irradiation dose adjusting plate 20, and the region SB is irradiated with a low dose. The corresponding priority irradiation area B is irradiated with a high dose, and sterilization / sterilization treatment is performed.
Further, the case where the irradiated object 1 is not housed in the container 2. When the irradiation dose adjusting plate 20 can be placed on the surface irradiated with the electron beam of the irradiated object 1, the irradiation dose adjusting plate 20 is placed on the surface irradiated with the electron beam of the irradiated object 1. May be.

図8に本発明の電子線殺菌方法の他の実施形態を示す。
この実施形態では、照射線量調整板20を電子線照射装置30の電子線取出窓と容器2との間で照射線量調整板20を支持し、容器2の搬送速度と同じ速度で照射線量調整板20を搬送する照射線量調整板支持搬送手段21を用いる。
この、照射線量調整板支持搬送手段21は複数個の照射線量調整板20を間隔をおいて支持し、ループ経路に沿って照射線量調整板20を容器2の照射面に搬送し、容器2と同じ速度で移動させる。これにより、照射線量調整板20の領域SAを透過した低線量の電子線が被照射物の非重点照射領域Aに照射され、領域SBを通過した高線量の電子線が被照射物の重点照射領域Bに照射される。
FIG. 8 shows another embodiment of the electron beam sterilization method of the present invention.
In this embodiment, the irradiation dose adjusting plate 20 supports the irradiation dose adjusting plate 20 between the electron beam extraction window of the electron beam irradiation device 30 and the container 2, and the irradiation dose adjusting plate 20 is at the same speed as the transport speed of the container 2. The irradiation dose adjusting plate support transport means 21 for transporting 20 is used.
The irradiation dose adjusting plate supporting and transporting means 21 supports a plurality of irradiation dose adjusting plates 20 at intervals, transports the irradiation dose adjusting plate 20 to the irradiation surface of the container 2 along the loop path, and transfers the irradiation dose adjusting plate 20 to the irradiation surface of the container 2. Move at the same speed. As a result, the low-dose electron beam that has passed through the region SA of the irradiation dose adjusting plate 20 is irradiated to the non-focused irradiation region A of the irradiated object, and the high-dose electron beam that has passed through the region SB is the focused irradiation of the irradiated object. Area B is irradiated.

他の態様としては、図9に示すように、照射線量調整板支持搬送手段21を電子線照射装置30の電子線照射領域の入口aと出口bとの間で往復動させ、aの位置で照射線量調整板20を容器2の上面を覆うよう配置し、容器2がbの位置に達したら、照射線量調整板20をaの位置に戻すようにしてもよい。 As another embodiment, as shown in FIG. 9, the irradiation dose adjusting plate support / transport means 21 is reciprocated between the inlet a and the outlet b of the electron beam irradiation region of the electron beam irradiation device 30 at the position of a. The irradiation dose adjusting plate 20 may be arranged so as to cover the upper surface of the container 2, and when the container 2 reaches the position b, the irradiation dose adjusting plate 20 may be returned to the position a.

1 被照射物
2 容器
3、5 金属板
4 枠体
6 金属タイル
7 金属球
8 篩
10 開口部
11 電子線照射装置の装置本体
12 搬送装置
13 電子銃
14 加速管
15 電磁石
16 スキャンホーン
17 電子線取出窓
20 照射線量調整板
21 照射線量調整板支持搬送手段
30 電子線照射装置
E 電子線
A 非重点照射領域
B 重点照射領域
C、D 照射を避けたい領域
Fa、Fb 容器の面
SA 領域SA
SB 領域SB
1 Irradiated object 2 Container 3, 5 Metal plate 4 Frame 6 Metal tile 7 Metal ball 8 Sieve 10 Opening 11 Electron beam irradiation device device body 12 Conveyor device 13 Electron gun 14 Acceleration tube 15 Electromagnet 16 Scanhorn 17 Electron beam Extraction window 20 Irradiation dose adjustment plate 21 Irradiation dose adjustment plate Supporting and transporting means 30 Electron beam irradiation device E Electron beam A Non-focused irradiation area B Focused irradiation area C, D Areas where irradiation should be avoided Fa, Fb Container surface SA Area SA
SB area SB

Claims (5)

電子線を遮蔽する遮蔽材を配置した領域SAと、前記遮蔽材を配置しない領域SBとを有する照射線量調整板を電子線照射装置の電子線取出窓と前記被照射物との間に配置し、
前記照射線量調整板を介して電子線を被照射物に対して少なくとも二方向から照射して 前記被照射物の殺菌または滅菌を行う電子線殺菌方法であって、
前記照射線量調整板が、前記遮蔽材としての複数の金属球と、前記金属球を通過させない網目を有する篩とからなり、前記複数の金属球を前記篩の網目に配置した領域を前記領域SAとし、前記金属球を配置しない領域を前記領域SBとした照射線量調整板である、ことを特徴とする電子線殺菌方法。
An irradiation dose adjusting plate having an area SA in which a shielding material for shielding an electron beam is arranged and an area SB in which the shielding material is not arranged is arranged between the electron beam extraction window of the electron beam irradiator and the irradiated object. death,
An electron beam sterilization method for sterilizing or sterilizing an irradiated object by irradiating the irradiated object with an electron beam from at least two directions through the irradiation dose adjusting plate.
The irradiation dose adjusting plate is composed of a plurality of metal spheres as a shielding material and a sieve having a mesh that does not allow the metal spheres to pass through, and a region in which the plurality of metal spheres are arranged in the mesh of the sieve is defined as the region SA. An electron beam sterilization method comprising an irradiation dose adjusting plate in which a region in which the metal sphere is not arranged is defined as the region SB .
前記被照射物に対して、二方向から電子線を照射するようにした、請求項1に記載の電子線殺菌方法。 The electron beam sterilization method according to claim 1, wherein the irradiated object is irradiated with an electron beam from two directions. 前記照射線量調整板が前記被照射物又は前記被照射物を収容した容器の電子線が照射される面上に載置される、請求項1又は2に記載の電子線殺菌方法。 The electron beam sterilization method according to claim 1 or 2 , wherein the irradiation dose adjusting plate is placed on a surface to be irradiated with an electron beam of the irradiated object or a container containing the irradiated object. 電子線照射装置の電子線取出窓と前記被照射物との間で前記照射線量調整板を支持し、前記被照射物の搬送速度と同じ速度で前記照射線量調整板を搬送する照射線量調整板支持搬送手段を用いる、請求項1~のいずれか1項に記載の電子線殺菌方法。 An irradiation dose adjusting plate that supports the irradiation dose adjusting plate between the electron beam extraction window of the electron beam irradiating device and the irradiated object and conveys the irradiation dose adjusting plate at the same speed as the conveying speed of the irradiated object. The electron beam sterilization method according to any one of claims 1 to 3 , which uses a support transport means. 電子線を前記被照射物に照射する前に、前記被照射物にX線照射することによってイメージングし、得られた情報に基づいて前記照射線量調整板における前記遮蔽材の配置を決定する、請求項1~のいずれか1項に記載の電子線殺菌方法。 Before irradiating the irradiated object with an electron beam, imaging is performed by irradiating the irradiated object with X-rays, and the arrangement of the shielding material on the irradiation dose adjusting plate is determined based on the obtained information. Item 4. The electron beam sterilization method according to any one of Items 1 to 4 .
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