JP7071050B2 - Electronic component mounting system and electronic component mounting method - Google Patents

Electronic component mounting system and electronic component mounting method Download PDF

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JP7071050B2
JP7071050B2 JP2016235980A JP2016235980A JP7071050B2 JP 7071050 B2 JP7071050 B2 JP 7071050B2 JP 2016235980 A JP2016235980 A JP 2016235980A JP 2016235980 A JP2016235980 A JP 2016235980A JP 7071050 B2 JP7071050 B2 JP 7071050B2
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coating
substrate
electronic component
component mounting
coating agent
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JP2018093081A (en
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秀典 太田
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ハンファ精密機械株式会社
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817—Monitoring of soldering processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering

Description

本発明は、基板に電子部品を実装して実装基板を製造する電子部品実装システム及び電子部品実装方法に関する。 The present invention relates to an electronic component mounting system and an electronic component mounting method for manufacturing a mounting board by mounting electronic components on a substrate.

かかる電子部品実装システム（電子部品実装方法）として、基板に形成された電子部品接合用の電極に塗布剤を塗布する塗布装置（塗布工程）と、塗布剤が塗布された基板に電子部品を搭載する電子部品搭載装置（電子部品搭載工程）とを含むものが知られている。 As such an electronic component mounting system (electronic component mounting method), a coating device (coating process) for applying a coating agent to an electrode for joining electronic components formed on a substrate and an electronic component are mounted on the substrate to which the coating agent is applied. It is known to include an electronic component mounting device (electronic component mounting process).

ところで、塗布装置は連続的に動作させていると、装置自体や塗布剤に経時的な変化が生じ、結果として塗布剤の塗布状態（塗布位置や塗布面積など）にも継時的な変化が生じることになる。この継時的な変化を考慮しないで塗布装置を使い続けると、塗布剤の塗布品質が悪化してしまう。 By the way, when the coating device is continuously operated, the device itself and the coating agent change with time, and as a result, the coating state of the coating agent (coating position, coating area, etc.) also changes over time. Will occur. If the coating device is continued to be used without considering this change over time, the coating quality of the coating agent will deteriorate.

本発明が解決しようとする課題は、塗布剤の塗布状態（塗布品質）を良好に維持できる電子部品実装システム及び電子部品実装方法を提供することにある。
An object to be solved by the present invention is to provide an electronic component mounting system and an electronic component mounting method capable of maintaining a good coating state (coating quality) of a coating agent.

本発明の一観点によれば、次の電子部品実装システムが提供される。
基板に形成された電子部品接合用の電極に塗布剤を塗布する塗布装置と、前記塗布剤が塗布された基板に電子部品を搭載する電子部品搭載装置と、電子部品搭載後の基板を加熱して電子部品を基板に半田接合するリフロー装置と、前記塗布装置の動作を制御する制御手段とを備える電子部品実装システムにおいて、
前記塗布剤は、半田フラックス及び熱硬化性樹脂を含み、
前記塗布装置は、前記半田フラックス及び熱硬化性樹脂を含んでいる塗布剤を吐出する塗布ノズルを備える塗布ヘッドを有し、この塗布ノズルをＸＹ方向に自在に移動させることで、基板の電極上に前記塗布剤を塗布し、
前記制御手段は、電子部品実装システム内で前記塗布装置の下流に設置した基板検査装置、又は前記電子部品搭載装置が備える基板検査手段が測定した基板ごとの塗布剤の塗布状態を統計的に処理して継時的な変化量を算出し、この変化量を低減するように前記塗布装置をフィードバック制御し、
前記基板検査装置又は前記基板検査手段は、前記塗布状態として基板ごとに塗布剤の塗布位置を測定し、
前記制御手段は、前記塗布位置を統計的に処理して継時的な変化量を算出し、
さらに前記制御手段は、前記フィードバック制御において前記塗布ノズルのＸＹ方向の位置を制御することを特徴とする電子部品実装システム。
According to one aspect of the present invention, the following electronic component mounting system is provided.
A coating device that applies a coating agent to an electrode for joining electronic components formed on a substrate, an electronic component mounting device that mounts an electronic component on a substrate coated with the coating agent, and a substrate after mounting the electronic component are heated. In an electronic component mounting system including a reflow device for soldering electronic components to a substrate and a control means for controlling the operation of the coating device.
The coating agent contains a solder flux and a thermosetting resin, and contains.
The coating device has a coating head provided with a coating nozzle for discharging a coating agent containing the solder flux and a thermosetting resin, and by freely moving the coating nozzle in the XY direction, the coating device is placed on an electrode of a substrate. Apply the coating agent to
The control means statistically processes the coating state of each substrate measured by the substrate inspection device installed downstream of the coating device in the electronic component mounting system or the substrate inspection means provided in the electronic component mounting device. Then, the amount of change over time is calculated, and the coating device is feedback-controlled so as to reduce this amount of change.
The substrate inspection device or the substrate inspection means measures the coating position of the coating agent for each substrate in the coating state, and then measures the coating position.
The control means statistically processes the coating position to calculate the amount of change over time.
Further, the control means is an electronic component mounting system characterized in that the position of the coating nozzle in the XY direction is controlled in the feedback control.

本発明の他の観点によれば、次の電子部品実装方法が提供される。
基板に形成された電子部品接合用の電極に塗布剤を塗布する塗布工程と、前記塗布剤が塗布された基板に電子部品を搭載する電子部品搭載工程と、電子部品搭載後の基板を加熱して電子部品を基板に半田接合するリフロー工程とを含む電子部品実装方法において、
前記塗布剤は、半田フラックス及び熱硬化性樹脂を含み、
前記塗布工程で使用する塗布装置は、前記半田フラックス及び熱硬化性樹脂を含んでいる塗布剤を吐出する塗布ノズルを備える塗布ヘッドを有し、この塗布ノズルをＸＹ方向に自在に移動させることで、基板の電極上に前記塗布剤を塗布し、
前記塗布工程後又は前記電子部品搭載工程内に、基板ごとに塗布剤の塗布状態を測定する検査工程を含み、
さらに、前記検査工程で得られた基板ごとの塗布剤の塗布状態を統計的に処理して継時的な変化量を算出し、この変化量を低減するように前記塗布工程をフィードバック制御する制御工程を含み、
前記検査工程では、前記塗布状態として基板ごとに塗布剤の塗布位置を測定し、
前記フィードバック制御では、前記塗布ノズルのＸＹ方向の位置を制御することを特徴とする電子部品実装方法。 According to another aspect of the present invention, the following electronic component mounting method is provided.
The coating process of applying a coating agent to the electrodes for joining electronic components formed on the substrate, the electronic component mounting process of mounting electronic components on the substrate coated with the coating agent , and the heating of the substrate after mounting the electronic components. In the electronic component mounting method including the reflow process of soldering the electronic component to the substrate .
The coating agent contains a solder flux and a thermosetting resin, and contains.
The coating device used in the coating step has a coating head provided with a coating nozzle for discharging a coating agent containing the solder flux and a thermosetting resin, and the coating nozzle is freely moved in the XY directions. , Apply the coating agent on the electrodes of the substrate,
After the coating process or in the electronic component mounting process, an inspection step of measuring the coating state of the coating agent for each substrate is included.
Further, a control that statistically processes the coating state of the coating agent for each substrate obtained in the inspection step to calculate the amount of change over time, and feedback-controls the coating process so as to reduce this amount of change. Including the process
In the inspection step, the coating position of the coating agent is measured for each substrate as the coating state.
The feedback control is an electronic component mounting method characterized in that the position of the coating nozzle in the XY direction is controlled.

なお、本発明において「基板ごと」とは、連続して処理される全ての基板ごとのほか、連続して処理される全ての基板からサンプリングする基板ごとという意味を含む。 In the present invention, "for each substrate" includes not only for all the substrates that are continuously processed, but also for each substrate that samples from all the substrates that are continuously processed.

本発明によれば、基板ごとに塗布剤の塗布状態を測定し、その測定結果を統計的に処理して継時的な変化量を算出し、この変化量を低減するように塗布装置（塗布工程）をフィードバック制御したり前記変化量が所定の基準を超えた場合に警告を発したりするので、塗布剤の塗布状態（塗布品質）を良好に維持できる According to the present invention, the coating state of the coating agent is measured for each substrate, the measurement result is statistically processed to calculate the amount of change over time, and the coating device (coating) is used to reduce this amount of change. Since the process) is feedback-controlled and a warning is issued when the amount of change exceeds a predetermined standard, the coating state (coating quality) of the coating agent can be maintained well.

本発明の一実施形態の電子部品実装システムを示すシステム構成図である。It is a system block diagram which shows the electronic component mounting system of one Embodiment of this invention.

図１は、本発明の一実施形態の電子部品実装システムを示すシステム構成図である。図１において電子部品実装システムは、塗布装置１、電子部品搭載装置２、基板検査装置３、リフロー装置４及び実装状態検査装置５の各装置を連結して成り、各装置を通信ネットワーク６によって接続し、全体を制御手段としての管理コンピュータ７によって制御する構成となっている。 FIG. 1 is a system configuration diagram showing an electronic component mounting system according to an embodiment of the present invention. In FIG. 1, the electronic component mounting system consists of connecting the coating device 1, the electronic component mounting device 2, the board inspection device 3, the reflow device 4, and the mounting state inspection device 5, and each device is connected by a communication network 6. However, the whole is controlled by the management computer 7 as a control means.

以下、各装置の機能を説明しつつ、図１の電子部品実装システムによる電子部品実装方法を説明する。 Hereinafter, the electronic component mounting method using the electronic component mounting system of FIG. 1 will be described while explaining the functions of each device.

塗布装置１は、基板に形成された電子部品接合用の電極に塗布剤を塗布する。本実施形態では塗布剤として、半田フラックス及び熱硬化性樹脂を含むものを使用する。また、本実施形態において塗布装置１は、塗布剤を吐出する塗布ノズルを備える塗布ヘッドを有し、この塗布ノズル（塗布ヘッド）をＸＹ方向に自在に移動させることで、基板の電極上に塗布剤を塗布する。 The coating device 1 applies a coating agent to the electrodes for joining electronic components formed on the substrate. In this embodiment, a coating agent containing a solder flux and a thermosetting resin is used. Further, in the present embodiment, the coating device 1 has a coating head provided with a coating nozzle for discharging the coating agent, and the coating nozzle (coating head) is freely moved in the XY direction to coat the electrode on the substrate. Apply the agent.

電子部品搭載装置２は、塗布剤が塗布された基板に電子部品を搭載する。具体的には本実施形態の電子部品搭載装置２は搭載ヘッドを備え、この搭載ヘッドによって電子部品の供給部から電子部品をピックアップし塗布剤が塗布された基板に搭載する。 The electronic component mounting device 2 mounts electronic components on a substrate coated with a coating agent. Specifically, the electronic component mounting device 2 of the present embodiment includes a mounting head, and the mounting head picks up the electronic component from the supply section of the electronic component and mounts the electronic component on the substrate coated with the coating agent.

基板検査装置３は、電子部品搭載後の基板ごとに塗布剤の塗布状態を測定する。本実施形態では、塗布剤の塗布状態として基板ごとに塗布剤の塗布位置、塗布面積及び塗布厚み（＝塗布量）のうち少なくとも一つを測定する。 The substrate inspection device 3 measures the coating state of the coating agent for each substrate after mounting the electronic components. In the present embodiment, at least one of the coating position, coating area, and coating thickness (= coating amount) of the coating agent is measured for each substrate as the coating state of the coating agent.

管理コンピュータ７は、基板検査装置３が測定した基板ごとの塗布剤の塗布状態（本実施形態では塗布剤の塗布位置、塗布面積及び塗布厚み（＝塗布量）のうち少なくとも一つ）を統計的に処理して継時的な変化量を算出し、この変化量を低減するように塗布装置１をフィードバック制御する。本実施形態では、前記変化量を相殺するように、塗布装置１の塗布ノズルが塗布剤を吐出するＸＹ方向（水平方向）の位置について補正（フィードバック制御）する。また、塗布装置１の塗布ノズルのＺ方向（高さ方向）の位置、塗布装置１の動作速度（塗布ヘッドの移動速度）、塗布剤の塗布量（塗布ノズルからの塗布剤の吐出量）、あるいは塗布剤の温度（保存温度）について補正（フィードバック制御）することもできる。すなわち、フィードバック制御においては、塗布装置の位置（ＸＹＺ方向）、塗布装置の動作速度(塗布ヘッドの移動速度）、塗布剤の塗布量（吐出量）及び塗布剤の温度（保存温度）のうち少なくとも一つを制御することができる。 The management computer 7 statistically determines the coating state of the coating agent for each substrate measured by the substrate inspection device 3 (at least one of the coating position, coating area, and coating thickness (= coating amount) of the coating agent in this embodiment). The coating device 1 is feedback-controlled so as to calculate the amount of change over time and reduce the amount of change. In the present embodiment, the position in the XY direction (horizontal direction) in which the coating nozzle of the coating device 1 discharges the coating agent is corrected (feedback control) so as to cancel the change amount. Further, the position of the coating nozzle of the coating device 1 in the Z direction (height direction), the operating speed of the coating device 1 (moving speed of the coating head), the coating amount of the coating agent (the discharge amount of the coating agent from the coating nozzle), Alternatively, the temperature (storage temperature) of the coating agent can be corrected (feedback control). That is, in the feedback control, at least one of the position of the coating device (XYZ direction), the operating speed of the coating device (moving speed of the coating head), the coating amount of the coating agent (discharge amount), and the temperature of the coating agent (storage temperature). You can control one.

さらに、管理コンピュータ７は、前記変化量が所定の基準を超えた場合、例えば、前記変化量が予め定めた基準値を超えた場合、前記変化量が予め定めた基準値（前記基準値と同一又は異なる基準値）を超える場合が所定回数連続する場合、前記変化量が継時的に急激に増加する場合などに、警告信号などの警告を発するようにすることもできる。また、この警告信号には塗布状態の不具合情報（塗布剤の塗布位置、塗布面積及び塗布厚み（＝塗布量）のいずれが大きく変化しているかなど）と、この塗布状態の不具合情報から予想される塗布装置の不具合情報（塗布装置のいずれの部品に問題があるか、塗布剤が劣化しているかなど）を含めることもできる。これらの塗布状態や塗布装置の不具合情報に基づき、作業者は問題のある塗布装置の部品や塗布剤を交換するなどの対処を容易に実行でき、その問題が解消したら塗布作業を再開することができる。そして、管理コンピュータ７は、作業者が承認ボタンを押すなどの別途の承認があった場合、又は前記変化量が所定の基準を満たすようになった場合に、前述のように前記変化量を低減するためのフィードバック制御の実行を開始することができる。 Further, in the management computer 7, when the change amount exceeds a predetermined reference value, for example, when the change amount exceeds a predetermined reference value, the change amount exceeds a predetermined reference value (same as the reference value). Alternatively, a warning signal or the like may be issued when the number of cases exceeding (a different reference value) continues for a predetermined number of times, or when the amount of change suddenly increases over time. In addition, this warning signal is expected from the defect information of the coating state (whether the coating position, the coating area, or the coating thickness (= coating amount) of the coating agent has changed significantly) and the defect information of the coating state. It is also possible to include defect information of the coating device (which part of the coating device has a problem, whether the coating agent has deteriorated, etc.). Based on these coating conditions and defect information of the coating device, the operator can easily take measures such as replacing the problematic coating device parts and coating agent, and when the problem is resolved, the coating work can be resumed. can. Then, the management computer 7 reduces the change amount as described above when the worker presses the approval button or the like, or when the change amount meets a predetermined criterion. You can start executing feedback control to do so.

リフロー装置４は電子部品搭載後の基板を加熱して、電子部品を基板に接合する。ここで本実施形態では前述のとおり、塗布剤として半田フラックス及び熱硬化性樹脂を含むものを使用しているので、リフロー装置４による基板の加熱（リフロー工程）により、半田フラックスが溶融して電子部品が基板に対して半田接合されるとともに、熱硬化性樹脂が硬化して電子部品が基板に対して強固に固定（補強）される。 The reflow device 4 heats the substrate after mounting the electronic components and joins the electronic components to the substrate. Here, in the present embodiment, as described above, since the coating agent containing the solder flux and the heat-curable resin is used, the solder flux is melted by the heating of the substrate (reflow step) by the reflow device 4, and the electrons are used. The components are solder-bonded to the substrate, and the thermosetting resin is cured to firmly fix (reinforce) the electronic components to the substrate.

最後に、実装状態検査装置５は、リフロー工程後の基板上における電子部品の実装状態を検査する。以上により実装基板が製造される。 Finally, the mounting state inspection device 5 inspects the mounting state of the electronic components on the substrate after the reflow process. As described above, the mounting board is manufactured.

なお、以上の実施形態では基板検査装置３を電子部品搭載装置２とリフロー装置４との間に設置したが、基板検査装置３は塗布装置１と電子部品搭載装置２との間に設置することもできる。また、電子部品搭載装置２は一般的に基板を検査可能な基板検査手段を備えるので、この基板検査手段によって基板ごとに塗布剤の塗布状態を測定するようにすることもできる。この場合、基板検査装置３は省略可能であり、制御手段としての管理コンピュータ７は、電子部品搭載装置２内の基板検査手段が測定した基板ごとの塗布剤の塗布状態を統計的に処理して継時的な変化量を算出し、この変化量を低減するように塗布装置１をフィードバック制御したり前記変化量が所定の基準を超えた場合に警告を発したりする。 In the above embodiment, the board inspection device 3 is installed between the electronic component mounting device 2 and the reflow device 4, but the board inspection device 3 is installed between the coating device 1 and the electronic component mounting device 2. You can also. Further, since the electronic component mounting device 2 generally includes a substrate inspection means capable of inspecting a substrate, the substrate inspection means can be used to measure the coating state of the coating agent for each substrate. In this case, the substrate inspection device 3 can be omitted, and the management computer 7 as a control means statistically processes the coating state of the coating agent for each substrate measured by the substrate inspection means in the electronic component mounting device 2. The amount of change over time is calculated, and the coating device 1 is feedback-controlled so as to reduce the amount of change, or a warning is issued when the amount of change exceeds a predetermined reference.

１ 塗布装置
２ 電子部品搭載装置
３ 基板検査装置
４ リフロー装置
５ 実装状態検査装置
６ 通信ネットワーク
７ 管理コンピュータ（制御手段） 1 Coating device 2 Electronic component mounting device 3 Board inspection device 4 Reflow device 5 Mounting status inspection device 6 Communication network 7 Management computer (control means)

Claims (2)

基板に形成された電子部品接合用の電極に塗布剤を塗布する塗布装置と、前記塗布剤が塗布された基板に電子部品を搭載する電子部品搭載装置と、電子部品搭載後の基板を加熱して電子部品を基板に半田接合するリフロー装置と、前記塗布装置の動作を制御する制御手段とを備える電子部品実装システムにおいて、
前記塗布剤は、半田フラックス及び熱硬化性樹脂を含み、
前記塗布装置は、前記半田フラックス及び熱硬化性樹脂を含んでいる塗布剤を吐出する塗布ノズルを備える塗布ヘッドを有し、この塗布ノズルをＸＹ方向に自在に移動させることで、基板の電極上に前記塗布剤を塗布し、
前記制御手段は、電子部品実装システム内で前記塗布装置の下流に設置した基板検査装置、又は前記電子部品搭載装置が備える基板検査手段が測定した基板ごとの塗布剤の塗布状態を統計的に処理して継時的な変化量を算出し、この変化量を低減するように前記塗布装置をフィードバック制御し、
前記基板検査装置又は前記基板検査手段は、前記塗布状態として基板ごとに塗布剤の塗布位置を測定し、
前記制御手段は、前記塗布位置を統計的に処理して継時的な変化量を算出し、
さらに前記制御手段は、前記フィードバック制御において前記塗布ノズルのＸＹ方向の位置を制御することを特徴とする電子部品実装システム。 A coating device that applies a coating agent to an electrode for joining electronic components formed on a substrate, an electronic component mounting device that mounts an electronic component on a substrate coated with the coating agent, and a substrate after mounting the electronic component are heated. In an electronic component mounting system including a reflow device for soldering electronic components to a substrate and a control means for controlling the operation of the coating device.
The coating agent contains a solder flux and a thermosetting resin, and contains.
The coating device has a coating head provided with a coating nozzle for discharging a coating agent containing the solder flux and a thermosetting resin, and by freely moving the coating nozzle in the XY direction, the coating device is placed on an electrode of a substrate. Apply the coating agent to
The control means statistically processes the coating state of each substrate measured by the substrate inspection device installed downstream of the coating device in the electronic component mounting system or the substrate inspection means provided in the electronic component mounting device. Then, the amount of change over time is calculated, and the coating device is feedback-controlled so as to reduce this amount of change.
The substrate inspection device or the substrate inspection means measures the coating position of the coating agent for each substrate in the coating state, and then measures the coating position.
The control means statistically processes the coating position to calculate the amount of change over time.
Further, the control means is an electronic component mounting system characterized in that the position of the coating nozzle in the XY direction is controlled in the feedback control. 基板に形成された電子部品接合用の電極に塗布剤を塗布する塗布工程と、前記塗布剤が塗布された基板に電子部品を搭載する電子部品搭載工程と、電子部品搭載後の基板を加熱して電子部品を基板に半田接合するリフロー工程とを含む電子部品実装方法において、
前記塗布剤は、半田フラックス及び熱硬化性樹脂を含み、
前記塗布工程で使用する塗布装置は、前記半田フラックス及び熱硬化性樹脂を含んでいる塗布剤を吐出する塗布ノズルを備える塗布ヘッドを有し、この塗布ノズルをＸＹ方向に自在に移動させることで、基板の電極上に前記塗布剤を塗布し、
前記塗布工程後又は前記電子部品搭載工程内に、基板ごとに塗布剤の塗布状態を測定する検査工程を含み、
さらに、前記検査工程で得られた基板ごとの塗布剤の塗布状態を統計的に処理して継時的な変化量を算出し、この変化量を低減するように前記塗布工程をフィードバック制御する制御工程を含み、
前記検査工程では、前記塗布状態として基板ごとに塗布剤の塗布位置を測定し、
前記フィードバック制御では、前記塗布ノズルのＸＹ方向の位置を制御することを特徴とする電子部品実装方法。
The coating process of applying a coating agent to the electrodes for joining electronic components formed on the substrate, the electronic component mounting process of mounting electronic components on the substrate coated with the coating agent , and the heating of the substrate after mounting the electronic components. In the electronic component mounting method including the reflow process of soldering the electronic component to the substrate .
The coating agent contains a solder flux and a thermosetting resin, and contains.
The coating device used in the coating step has a coating head provided with a coating nozzle for discharging a coating agent containing the solder flux and a thermosetting resin, and the coating nozzle is freely moved in the XY directions. , Apply the coating agent on the electrodes of the substrate,
After the coating process or in the electronic component mounting process, an inspection step of measuring the coating state of the coating agent for each substrate is included.
Further, a control that statistically processes the coating state of the coating agent for each substrate obtained in the inspection step to calculate the amount of change over time, and feedback-controls the coating process so as to reduce this amount of change. Including the process
In the inspection step, the coating position of the coating agent is measured for each substrate as the coating state.
The feedback control is an electronic component mounting method characterized in that the position of the coating nozzle in the XY direction is controlled.
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